Transparent ultrasonic wave probe module and optical device with the same

Abstract

To provide an optical device capable of improving SNR by using a transparent ultrasonic sensor that makes coaxialization with an ultrasonic route and an optical path and of downsizing a machine.SOLUTION: A transparent ultrasonic wave probe module provided inside a housing of an optical device includes: a lens which is provided on one side inside the housing, made of a transparent material, and is arranged so that one surface is exposed outside the housing; a first matching layer which is provided on the other surface of the lens and is made of a transparent material; a piezoelectric element layer which is provided on the first matching layer and includes a plurality of transparent piezoelectric elements mutually converting an electric signal and a machine signal; a first electrode layer and a second electrode layer which are made of transparent materials, are provided on one surface and the other surface of the piezoelectric element layer, respectively, and transmit electric signals; a circuit board which is coupled to the first electrode layer and the second electrode layer, is made of a bendable material, and transmits / receives the electric signal to / from the piezoelectric element; and a block layer provided on the second electrode layer, is mde of a transparent material and removes ultrasonic noise.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a transparent ultrasonic probe module and an optical device including the same. [Background technology]

[0002] An ultrasonic sensor (or ultrasonic transducer) is a sensor that uses the characteristics of piezoelectric material to convert electrical energy into acoustic energy, transmits this energy to a target object, and converts the reflected acoustic energy back into an electrical signal, enabling it to measure the physical distance to an object and capture an image of the object.

[0003] Optical and ultrasound-based imaging techniques are steadily being used in medical diagnosis due to their advantages of being safer and more accessible than MRI, X-ray, and CT, and of being able to check images in real time.

[0004] In response to this, research has been conducted on combining an ultrasound imaging system with an optical imaging system, combining an ultrasound imaging system with an optical coherence tomography imaging system, combining an ultrasound imaging system with a fluorescent imaging system, and the like.

[0005] 1 is a diagram showing a state where an object is scanned through a conventional opaque ultrasonic sensor and an optical device. A conventional ultrasonic sensor 20 is used in an opaque state, so when the ultrasonic sensor 20 and an optical device 30 are used together, as shown in FIG. 1, the optical device 30 cannot pass through the opaque ultrasonic sensor 20, and is therefore inserted off-axis of the ultrasonic sensor.

[0006] Such off-axis placements have drawbacks for capturing images for a variety of reasons, including poor system alignment, increased complexity, large system size, low signal-to-noise ratio (SNR), and limited viewing angle.

[0007] In addition, the optical scan data and the ultrasound scan data did not match, making it difficult to make an accurate diagnosis.

[0008] 1, for example, of a first substance 501, a second substance 502, a third substance 503, and a fourth substance 504 present inside a specimen 500, the ultrasonic beam 21 detects the first substance 501 and a part of the fourth substance 504. However, there is a problem that the optical beam 31 does not detect the first substance 501 located vertically below the ultrasonic sensor 20.

[0009] In the case of optical devices that use conventional opaque ultrasonic sensors and optical instruments to scan objects, the light source cannot pass through the ultrasonic sensor. Therefore, auxiliary elements such as prisms and silicone oil must be unavoidably placed to separate the optical path and the ultrasonic signal path. This also creates a problem of the system becoming very large in size.

[0010] Meanwhile, in order to solve the problem of the opaque ultrasonic sensor, Patent Document 1 also perforates a part of the cross section of the opaque ultrasonic sensor to form an optical path, so that the optical path and the ultrasonic path are positioned on the same axis. However, even in this case, since light can only pass through a part of the cross section of the ultrasonic sensor, the problem of the optical impermeability of the ultrasonic sensor could not be sufficiently solved.

[0011] Meanwhile, transparent ultrasonic sensors have been developed to solve the problems of imaging with opaque ultrasonic sensors in recent years, but some transparent ultrasonic sensors still have limitations in obtaining high SNR and high-resolution photoacoustic images due to low transparency, low sensitivity, or wide focusing.

[0012] The present inventor has previously presented a single crystal transparent ultrasonic sensor structure based on lithium niobate (LNO) and a manufacturing method thereof in Patent Document 2 ("Transparent ultrasonic sensor and manufacturing method thereof") and, based on this, has previously presented an optical composite imaging system related to a single element type transparent ultrasonic sensor in Patent Document 3 ("Ultrasonic optical composite imaging system based on transparent ultrasonic sensor") and the like.

[0013] However, since the ultrasonic sensor structure is composed of a single element, there is a limit to the amount of data that can be processed per element per time. As a result, there is an increasing need for an optical device that can increase the amount of data, improve image quality, and provide a wider viewing angle while maintaining the advantages of a transparent ultrasonic sensor that can process in real time by adopting a transparent ultrasonic sensor with a multi-element structure. [Prior art documents] [Patent documents]

[0014] [Patent Document 1] U.S. Patent No. 8,784,321 [Patent Document 2] Korean Patent Publication No. 10-2021-0034466 [Patent Document 3] Korean Patent Publication No. 10-2022-0029003 Summary of the Invention [Problem to be solved by the invention]

[0015] An object of the present invention is to provide an optical device that uses a transparent ultrasonic sensor that enables coaxialization of an ultrasonic path and an optical path, thereby improving the SNR and enabling the device to be miniaturized.

[0016] It is another object of the present invention to provide an optical device with an ultrasonic sensor that has high transparency and sensitivity.

[0017] It is still another object of the present invention to provide an optical device that employs multiple piezoelectric elements to improve image quality and provide a wide viewing angle.

[0018] The object of the present invention is not limited to the object mentioned above, and other object not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present invention pertains from the following description. [Means for solving the problem]

[0019] According to one aspect of the present invention, there is provided a transparent ultrasonic probe module provided inside a housing of an optical device, the transparent ultrasonic probe module including: a lens provided on one side of the inside of the housing, made of a transparent material, and arranged so that one side is exposed to the outside of the housing; a first matching layer provided on the other side of the lens, made of a transparent material; a piezoelectric element layer provided on the first matching layer, the piezoelectric element layer including a plurality of transparent piezoelectric elements capable of converting electrical signals into mechanical signals and vice versa; a first electrode layer and a second electrode layer formed of a transparent material and provided on one side and the other side of the piezoelectric element layer, respectively, for transmitting electrical signals; a circuit board connected to the first electrode layer and the second electrode layer, made of a bendable material, and capable of transmitting and receiving electrical signals to and from the piezoelectric elements; and a block layer provided on the second electrode layer, made of a transparent material, and for removing ultrasonic noise.

[0020] In this case, a second matching layer made of a transparent material may be further provided between the first matching layer and the lens.

[0021] In this case, the circuit board may be made of a transparent material.

[0022] In this case, the circuit board may be composed of a ground fpcb and a signal fpcb.

[0023] In this case, the ground substrate may be connected to the first electrode layer between the first electrode layer and the first matching layer, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the blocking layer.

[0024] In this case, the circuit board may be composed of a gold foil plate that serves as a grounding function and a signal board (signal fpcb).

[0025] In this case, the gold foil plate may be connected to the first electrode layer between the first electrode layer and the first matching layer, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the blocking layer.

[0026] In this case, the block layer is formed to have a surface larger than the piezoelectric element layer and the second electrode layer, and the signal substrate is disposed on a portion of the upper surface of the block layer protruding from the piezoelectric element layer and the second electrode layer, and is connected to the second electrode layer via a conductive material.

[0027] In this case, the plurality of piezoelectric elements constituting the piezoelectric element layer can be arranged in a line.

[0028] In this case, the plurality of piezoelectric elements are arranged in a line, but may be arranged in an arch shape that protrudes upward.

[0029] In this case, the plurality of piezoelectric elements may be arranged in a line in a U-shape that is concave upward.

[0030] In this case, the plurality of piezoelectric elements constituting the piezoelectric element layer can be arranged in a horizontal and vertical grid pattern.

[0031] In this case, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a circular shape.

[0032] In this case, the plurality of piezoelectric elements may be formed in ring shapes having different diameters and arranged in a concentric circle shape.

[0033] In this case, the plurality of piezoelectric elements may be arranged in a hemispherical shape having a certain curvature.

[0034] In this case, the matching layer and the blocking layer may be formed of one or more materials selected from the group consisting of plastic, silicon, glass, and epoxy, or may be formed of a composite material in which powder having a diameter of several nanometers to several hundred micrometers is mixed into the above materials.

[0035] In this case, the lens may have any one of a concave lens, a convex lens, and a flat lens.

[0036] According to another aspect of the present invention, there is provided an optical ultrasonic optical device, comprising: a housing; the transparent ultrasonic probe module described above provided on one side of the inside of the housing; and an optical device provided on the other side of the inside of the housing, disposed at the other end of the transparent ultrasonic probe module, and disposed coaxially with the transparent ultrasonic probe module along the longitudinal direction of the housing.

[0037] In this case, the photoacoustic optical device may further include an optical lens provided inside the housing and disposed between the optical instrument and the transparent ultrasonic probe module.

[0038] In this case, the optical device may be a camera.

[0039] In this case, the optical device may be a light source. Effect of the Invention

[0040] With the above-mentioned configuration, the optical device according to one embodiment of the present invention can improve the signal-to-noise ratio (SNR) and reduce the size of the device by adopting a configuration in which the transparent ultrasonic probe module is arranged coaxially with the optical device.

[0041] Furthermore, the optical device according to another aspect of the present invention can provide an ultrasonic probe module with high transparency by using a transparent material such as lithium niobate.

[0042] In addition, the optical device according to another aspect of the present invention can improve image quality and provide a wide viewing angle by applying a multiple piezoelectric element.

[0043] In addition, in the optical device according to still another aspect of the present invention, the arrangement of the multiple piezoelectric elements can be diversified to provide an optical device suited to a purpose.

[0044] It should be understood that the effects of the present invention are not limited to the effects described above, but include all effects that can be inferred from the configuration of the invention described in the detailed description of the present invention or the claims. [Brief description of the drawings]

[0045] [Figure 1] FIG. 1 is a schematic diagram of scanning a specimen using a conventional opaque ultrasound probe and optics. [Diagram 2] 1A and 1B are diagrams showing photoacoustic tomographic images and ultrasonic tomographic images that can be obtained when an ultrasonic probe and an optical device are arranged coaxially and non-coaxially. [Diagram 3] 1 is a perspective view showing an optical device according to an embodiment of the present invention; [Figure 4] 1 is a cross-sectional view showing a cross section of an optical device according to an embodiment of the present invention. [Diagram 5] 1 is a schematic diagram illustrating a state in which an optical device according to an embodiment of the present invention scans an object. [Figure 6] 1 is a diagram showing an ultrasonic probe module provided in an optical device according to a first embodiment of the present invention. [Figure 7] 7 is a cross-sectional view of the ultrasonic probe module shown in FIG. 6 as viewed from II' direction, and an enlarged view of a portion of the cross-sectional view. [Figure 8]7 is a cross-sectional view of the ultrasonic probe module shown in FIG. 6 as viewed in the II-II' direction, and an enlarged view of a portion of the cross-sectional view. [Figure 9] 11 is a diagram showing an ultrasonic probe module of an optical device according to a second embodiment of the present invention. FIG. [Figure 10] 10 is a cross-sectional view of the second embodiment of the ultrasonic probe module shown in FIG. 9 taken along line III-III' and an enlarged view of a portion of the cross-sectional view. [Figure 11] 10 is a diagram showing a cross section of a second embodiment of the ultrasonic probe module shown in FIG. 9 as viewed from a direction IV-IV' and an enlarged view of a part of the cross section. [Figure 12] 11 is a cross-sectional view of an ultrasonic probe module of an optical device according to a third embodiment of the present invention, taken from the same direction as in FIG. 10, and an enlarged view of a portion of the cross-sectional view. [Figure 13] 11 is a diagram showing an ultrasonic probe module of an optical device according to a first modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. FIG. [Figure 14] 13 is a diagram showing an ultrasonic probe module of an optical device according to a second modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. FIG. [Figure 15] 13 is a diagram showing an ultrasonic probe module of an optical device according to a third modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. FIG. [Figure 16] 13 is a diagram showing an ultrasonic probe module of an optical device according to a fourth modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. FIG. [Figure 17] 13 is a diagram showing an ultrasonic probe module of an optical device according to a fifth modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] Hereinafter, with reference to the accompanying drawings, an embodiment of the present invention will be described in detail so that a person having ordinary skill in the art to which the present invention belongs can easily carry out the embodiment. The present invention can be implemented in various different forms and is not limited to the embodiments described in the present specification. In order to clearly explain the present invention in the drawings, parts that are not related to the description are omitted, and the same reference numerals are used for the same or similar components throughout the specification.

[0047] The words and terms used in this specification and the claims are not limited to their ordinary or dictionary meanings, but should be interpreted as meanings and concepts that are consistent with the technical idea of ​​the present invention according to the principle that the inventor can define the terms and concepts in order to best describe his / her invention.

[0048] In this specification, terms such as "comprise" or "have" are intended to describe the presence of features, numbers, steps, operations, components, parts, or combinations thereof set forth in the specification, and should be understood as not precluding the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0049] A component being "in front of," "behind," "above," or "below" another component means, unless there are special circumstances, not only being disposed "in front of," "behind," "above," or "below" the other component in direct contact therewith, but also including the case where another component is disposed between them. Furthermore, a component being "connected" to another component means, unless there are special circumstances, not only being connected directly to each other, but also being connected indirectly to each other.

[0050] An optical device according to an embodiment of the present invention is an optical device for scanning a diagnostic target in a state in which a transparent ultrasonic probe module and an optical instrument are coaxially arranged.

[0051] FIG. 1 is a schematic diagram of a state where a specimen is scanned using a conventional opaque ultrasound probe and an optical device. FIG. 2 is a diagram showing photoacoustic scan data and ultrasound scan data that can be obtained when an ultrasound probe and an optical device are arranged coaxially and non-coaxially. FIG. 3 is a perspective view showing an optical device according to an embodiment of the present invention. FIG. 4 is a cross-sectional view showing a cross section of an optical device according to an embodiment of the present invention. FIG. 5 is a schematic diagram showing a state where an optical device according to an embodiment of the present invention scans a specimen. The specimen 500 here may be any object that can be inspected with an optical ultrasound probe. For example, the specimen 500 may be a human body tissue or a living tissue of another living organism.

[0052] Hereinafter, an optical device 100 according to an embodiment of the present invention will be described first, and then the structures of an ultrasonic probe module 200 and an optical instrument 300 that constitute the optical device 100 will be described.

[0053] 5 shows a transparent ultrasound probe module and optical equipment according to an embodiment of the present invention, and a specimen 500. The specimen 500 shown in FIG. 5 is shown such that the depth of the specimen 500 faces the negative direction of the z-axis when viewed from FIG. 5, and the outer surface of the specimen faces the positive direction of the z-axis when viewed from FIG. 5.

[0054] 3 to 5, in the optical device 100 according to the embodiment of the present invention, an ultrasonic probe module 200 and an optical device 300 can be coaxially coupled inside a housing 400.

[0055] The housing 400 may be formed in a curved shape with a side bend along its height so that it can be easily gripped by a user during use.

[0056] In addition, an opening may be formed on one side of the housing 400 so that beams emitted from the ultrasound probe module 200 and the optical device 300 disposed therein can escape to the outside.

[0057] The optical device 100 according to an embodiment of the present invention may be provided as a wireless device as shown in FIG. 3, but is not limited thereto and may also be provided as a wired device.

[0058] If the optical device 100 is provided as a wireless device, the other side of the housing 400 may be formed to be sealed; alternatively, if the optical device 100 is provided as a wired device, an opening for connecting a cable and a separate support portion for stably supporting the cable may be formed.

[0059] Also, referring to FIG. 4, a coupling holder 420 may be provided inside the housing 400 to allow the optical device 300 to be stably fixed inside the housing in a state where the optical device 300 is coupled with the ultrasonic profile module 200 .

[0060] The coupling holder 420 may be configured as a part of the housing body 410 and may be formed to encase the optical device 300, and may protrude beyond the optical device 300 on one side to support the other side of the ultrasonic probe module 200.

[0061] The ultrasonic probe module 200 may be disposed on one side of the inside of the housing 400, and one side of the ultrasonic probe module 200 may be exposed to the outside through an opening provided on one side of the housing 400.

[0062] A lens 210 may be located on one side of the ultrasound probe module 200 that can be exposed to the outside.

[0063] As shown in FIG. 3 , one side of the lens 210 of the ultrasonic probe module 200 may be exposed to the outside through an opening in the housing 400, and the lens 210 and the remaining portion of the ultrasonic probe module 200 may be formed to be located inside the housing 400.

[0064] 4, the optical device 300 may be disposed on the other side of the ultrasonic probe module 200. In this case, in order to coaxially couple the ultrasonic probe module 200 and the optical device 300, the ultrasonic probe module 200 may be formed of a transparent material that does not obstruct the optical path.

[0065] In this case, the optical device 300 may be provided as a camera for capturing light entering the housing 400 from the outside, or as a light source for emitting light from the inside of the housing 400 to the outside.

[0066] However, the optical device 300 is not limited thereto, and may be provided as a device having both a camera function and a light source function, or may be formed in a form in which a plurality of devices are combined.

[0067] Although not shown in the figure, an optical system for setting an optical path according to a purpose may be disposed between the ultrasonic probe module 200 and the optical device 300 .

[0068] In this case, the optical system may include not only a convex lens or a concave lens capable of changing the traveling path of light, but also a cylindrical lens, a ball lens, a beam shaper, a beam diffuser, and the like.

[0069] With the above-mentioned configuration, according to one embodiment of the present invention, the ultrasonic probe module 200 and the optical device 300 are coaxially arranged in the housing 400, so that the ultrasonic beam 201 irradiated to the specimen 500 for scanning by the ultrasonic probe module 200 and the optical beam 301 irradiated to the specimen 500 for scanning by the optical device 300 travel in a straight line in the same direction, unlike FIG. 1 .

[0070] As a result, unlike in FIG. 1 where the images formed by the ultrasonic beam 21 and the optical beam 31 irradiated from the conventional ultrasonic sensor 20 and the optical device 30 reach different positions on the outer surface of the specimen 500, when using the optical device 100 of one embodiment of the present invention, the image formed by the ultrasonic beam 201 and the image formed by the optical beam 301 can reach the same position on the outer surface of the specimen 500.

[0071] As a result, when using the conventional optical device 100, the optical beam 31 cannot reach the area where the ultrasonic beam 21 reaches within a certain depth L1 from the outer surface of the specimen 500, whereas when using the optical device according to one embodiment of the present invention, as shown in FIG. 5, both ultrasound image information and optical image information can be obtained along the entire area L3 in the depth direction of the specimen 500.

[0072] It also overcomes the problem of having a low signal-to-noise ratio in conventional devices as the ultrasound beam 21 and the optical beam 31 travel different paths.

[0073] This effect can also be confirmed in the photoacoustic scan data (Figure 2(a)) and ultrasonic scan data (Figure 2(b)) obtained when the ultrasonic probe and optical equipment are arranged coaxially, as in the optical device of one embodiment of the present invention.

[0074] Fig. 2(a) shows photoacoustic scan data acquired with the ultrasound probe and the optical device arranged coaxially, Fig. 2(b) shows ultrasound scan data acquired with the ultrasound probe and the optical device arranged coaxially, Fig. 2(c) shows photoacoustic scan data acquired with the ultrasound probe and the optical device arranged non-coaxially, and Fig. 2(d) shows ultrasound scan data acquired with the ultrasound probe and the optical device arranged non-coaxially.

[0075] Comparing Figures 2(a) and (c), it can be seen that data at shallow depths is missing in Figure 2(c), which is scan data acquired when the ultrasound probe and optical device were non-coaxially arranged.

[0076] In addition, in the scan data shown in Figure 2(c), it can be seen that a lot of noise occurred in the deep areas.

[0077] As described above, when the ultrasonic probe and the optical device are coaxially coupled, the photoacoustic scan data (Figure 2(a)) and the ultrasonic scan data (Figure 2(b)) match, whereas when the ultrasonic probe and the optical device are non-coaxially coupled, a problem occurs in which the photoacoustic scan data (Figure 2(c)) and the ultrasonic scan data (Figure 2(d)) do not match.

[0078] The structure of the ultrasonic probe module 200 provided in the optical device 100 according to the present invention will be described below with reference to different drawings.

[0079] Fig. 6 is a diagram showing an ultrasonic probe module provided in an optical device according to a first embodiment of the present invention. Fig. 7 is a diagram showing a cross section of the ultrasonic probe module shown in Fig. 6 as seen from the II-II' direction and an enlarged view of a part of the cross section. Fig. 8 is a diagram showing a cross section of the ultrasonic probe module shown in Fig. 6 as seen from the II-II' direction and an enlarged view of a part of the cross section.

[0080] 3 and 6, an ultrasound probe module 200 that can be installed in an optical device according to an embodiment of the present invention is located on one side of a housing 400 where an opening is formed, and a lens 210 is provided on one side of the ultrasound probe module 200, and one surface of the lens 210 is exposed to the outside through the opening of the housing 400.

[0081] In this case, the lens 210 may be formed to have any one of a concave lens, a convex lens, and a flat lens according to the purpose.

[0082] The lens 210 of the ultrasound probe module 200 according to an embodiment of the present invention may be made of a silicon material, or may be made of a water-based gel, plastic, or epoxy resin.

[0083] A matching layer 220 may be disposed on the other side of the lens of the ultrasound probe module 200 according to one embodiment of the present invention, and a piezoelectric element layer 230 formed of one or more piezoelectric elements may be disposed on the other side of the matching layer 220.

[0084] The matching layer 220 is intended to reduce the difference in acoustic impedance between the medium to which the ultrasonic signal generated from the piezoelectric elements constituting the piezoelectric element layer 230 is to be irradiated, that is, the specimen 500 .

[0085] That is, when an ultrasonic signal is generated due to the operation of a piezoelectric element, in order to transmit an ultrasonic signal efficiently in water, biological tissue, or other medium other than air, the acoustic impedance of the medium must be adjusted to the maximum extent possible in order to minimize the loss of ultrasonic energy.

[0086] The matching layer 220 in this example may be of a focused type, comprising an acoustic lens that allows for focusing of the light and ultrasound signals.

[0087] In this case, due to the focusing function of the matching layer 220, the ultrasonic signal reflected by the specimen 500 and incident on the transparent ultrasonic probe module 200 can be accurately focused on the desired position of the piezoelectric element.

[0088] Therefore, due to the focusing function of the matching layer 220, the focus of the ultrasound image acquired by the ultrasound signal output from the piezoelectric element layer 230 can be adjusted, and a clear ultrasound image can be acquired.

[0089] As a result, the clarity of the image acquired by the operation of the transparent ultrasound probe module 200 is improved, and a clear image of a desired part of the subject 500 irradiated with an ultrasound signal can be acquired.

[0090] In addition, when the matching layer 220 uses an acoustic lens, the surface curvature is constant and the surface transparency is improved, thereby reducing the amount of loss of the ultrasonic signal when transmitting and receiving the ultrasonic signal irradiated to the specimen 500 or reflected from the specimen 500.

[0091] If necessary, an additional transmission film or blocking film may be formed on the matching layer 220 to transmit or block only signals in a desired wavelength band.

[0092] In the case of the matching layer 220 according to an embodiment of the present invention, it may be formed of two layers, a first matching layer 222 and a second matching layer 224, to achieve the above-mentioned purpose.

[0093] The acoustic lens provided in the matching layer 220 may be made of a material that takes into consideration the acoustic impedance so that ultrasonic waves are transmitted with high efficiency, that is, so that reflection does not occur between layers.

[0094] For example, the matching layer 220 may be made of transparent plastic, silicon, glass, or epoxy resin, or may be made of a composite material containing powder having a diameter of several nanometers to several hundred micrometers.

[0095] A piezoelectric layer 230 provided on the other side of the matching layer 220 may be formed of one or more piezoelectric elements.

[0096] Piezoelectric elements can exhibit the piezoelectric effect, which causes polarization and generates electricity when a mechanical force is applied to the element, and the inverse piezoelectric effect, which causes mechanical movements of contraction and relaxation when a voltage is applied to the element.

[0097] The ultrasonic probe module 200 according to an embodiment of the present invention can transmit ultrasonic waves to the specimen 500 using the piezoelectric effect and the inverse piezoelectric effect, receive ultrasonic waves reflected from the specimen 500, and generate an electrical signal.

[0098] The number of piezoelectric elements constituting the piezoelectric element layer 230 may vary depending on the size of the ultrasonic probe module 200. For example, the piezoelectric element layer 230 may be composed of 64 piezoelectric elements or 1024 piezoelectric elements.

[0099] In this case, the plurality of piezoelectric elements may be produced through a process of mechanically cutting a relatively large piezoelectric element using a dicing saw, laser cutting, or the like.

[0100] In this case, the piezoelectric element may be formed of lithium niobate (LNO), and may contain transparent piezoelectric materials that exhibit piezoelectric properties, such as PMN-PT, PVDF, and PVDF-TrFE, in addition to LNO.

[0101] 7 and 8, an electrode layer 260 for transmitting an electrical signal may be formed on one side and the other side of the piezoelectric element layer 230.

[0102] The electrode layer 260 may be composed of a first electrode layer 261 arranged between one side of the piezoelectric element layer 230 and the other side of the first matching layer 222, and a second electrode layer 262 arranged between the other side of the piezoelectric element layer 230 and the block layer 240.

[0103] The first electrode layer 261 and the second electrode layer 262 may be formed by deposition on the upper and lower surfaces of each piezoelectric element constituting the piezoelectric element layer 230. The first electrode layer 261 and the second electrode layer 262 may be insulated to prevent electrical shorts between them.

[0104] The first electrode layer 261 and the second electrode layer 262 may be formed of a transparent material, similar to other components of the ultrasonic probe module 200 according to an embodiment of the present invention.

[0105] More specifically, the first electrode layer 261 and the second electrode layer 262 may be formed of a transparent and conductive material such as silver nanowires (AgNW), copper nanowires (CuNW), gold nanowires (AuNW), indium-tin-oxide (ITO), carbon nanotubes, graphene, or the like.

[0106] Moreover, the first electrode layer 261 and the second electrode layer 262 can be formed to a thickness of, for example, less than 100 nm.

[0107] Meanwhile, referring to FIGS. 6 to 8, a block layer 240 may be disposed on the other surface of the second electrode layer 262 of the ultrasound probe module 200 according to an embodiment of the present invention.

[0108] The block layer 240 may play a role of damping to eliminate ultrasonic noise generated in the ultrasonic probe module 200 according to an embodiment of the present invention.

[0109] The ultrasonic beam 201 generated by the piezoelectric element layer 230 travels in the forward direction of the optical device 100 where the specimen 500 is located, but also travels in the opposite direction, backward.

[0110] At this time, unlike the ultrasonic beam 201 traveling forward, the ultrasonic beam traveling backward may act as noise when the ultrasonic probe module 200 scans the specimen 500 .

[0111] In addition, when the ultrasonic beam 201 that has traveled forward of the optical device 100 is reflected by the specimen 500 and returns to the ultrasonic probe module 200, it may be reflected again through the matching layer 220 and the piezoelectric element layer 230. This may cause unwanted signal interference.

[0112] The blocking layer 240 can prevent such unwanted signal interference and serve to attenuate ultrasonic signals traveling to the other side of the piezoelectric element layer 230 , that is, the rear of the optical device 100 .

[0113] At this time, since the optical beam must be able to pass through the other side of the blocking layer 240, the blocking layer 240 may also be made of a transparent material.

[0114] More specifically, the blocking layer 240 may be made of plastic, silicon, glass, or epoxy resin, and may also be made of a composite material in which powder having a diameter of several nanometers to several hundred micrometers is mixed into the above materials to improve damping performance.

[0115] 6 to 8, circuit boards 251 and 252 may be connected to a first electrode layer 261 and a second electrode layer 262 of an ultrasonic probe module 200 according to an embodiment of the present invention, respectively.

[0116] Since the circuit board must fit into the narrow space within the housing 400 of the optical device 100, it may generally be made of a thin and flexible flexible printed circuit board.

[0117] In the case of the ultrasound probe module 200 according to an embodiment of the present invention, the circuit board may be composed of a ground fpcb 251 which serves as a ground and a signal fpcb 252 which serves as a signal transmission.

[0118] The signal board 252 may have lines and pads corresponding to each piezoelectric element for signal exchange with each piezoelectric element, and each line and pad may be configured to have a one-to-one correspondence with each piezoelectric element.

[0119] In this case, the ground substrate 251 may be connected to one side of the first electrode layer 261, and the connecting portion may be located between the first electrode layer 261 and the first matching layer 222, and the signal substrate 252 may be connected to the other side of the second electrode layer 262, and the connecting portion may be located between the second electrode layer 262 and the block layer 240.

[0120] The ground substrate 251 and the signal substrate 252 may also be formed from an opaque material.

[0121] If the ground substrate 251 and the signal substrate 252 are made of an opaque material, the portion corresponding to the center of the piezoelectric element layer 230 through which the ultrasonic beam 201 or the optical beam 301 passes may be formed so that the ground substrate 251 and the signal substrate 252 are left open and the ground substrate 251 and the signal substrate 252 are attached to the ends of the piezoelectric element layer 230.

[0122] When the ground substrate 251 and the signal substrate 252 are made of a transparent material, they can be formed without opening the portion corresponding to the center of the piezoelectric element layer 230 .

[0123] At this time, referring to Figures 7 and 8, the portion where the ground substrate 251 and the first electrode layer 261 are connected and the portion where the signal substrate 252 and the second electrode layer 262 are connected may be formed with the gold foil 255 of the circuit substrate exposed.

[0124] The remaining portions of the ground substrate 251 and the signal substrate 252, excluding the portion where the ground substrate 251 and the first electrode layer 261 are connected and the portion where the signal substrate 252 and the second electrode layer 262 are connected, may be formed entirely insulated, except for the connection portions with the connector portions of the optical device 100 that are connected to the respective circuit substrates.

[0125] At this time, the ground substrate 251 and the signal substrate 252 may be formed to a thickness of less than 50 μm, and the gold foil 255 may be formed to a thickness of less than 100 nm.

[0126] The above-described laminated structure can be applied to each of the piezoelectric elements constituting each piezoelectric element layer 230. Referring to Figures 6 and 8, when multiple piezoelectric elements are arranged in a row, the laminated structure with each piezoelectric element can be arranged at a predetermined interval as shown in the figures.

[0127] Fig. 9 is a diagram showing an ultrasonic probe module of an optical device according to a second embodiment of the present invention. Fig. 10 is a diagram showing a cross section of a second embodiment of the ultrasonic probe module shown in Fig. 9 as seen from the III-III' direction and an enlarged view of a part of the cross section. Fig. 11 is a diagram showing a cross section of a second example of the ultrasonic probe module shown in Fig. 9 as seen from the IV-IV' direction and an enlarged view of a part of the cross section. In the following, when describing other embodiments of the present invention, detailed descriptions of the same configurations as those of the previously described embodiments will be omitted, and various embodiments of the present invention will be described focusing on configurations that are distinguished from those of the previously described embodiments.

[0128] Referring to the ultrasonic probe module 200 according to the second embodiment of the present invention shown in FIGS. 9 to 11, the matching layer 220, the piezoelectric element layer 230, and the block layer 240 are sequentially arranged from the lens 210 to the other side, which is the same as the ultrasonic probe module 200 according to the first embodiment shown in FIGS. 6 to 8.

[0129] However, unlike the ultrasonic probe module 200 shown in FIGS. 6 to 8, in the case of the modified examples of the ultrasonic probe module 200 shown in FIGS. 9 to 11, the circuit board can be configured only by the signal board 252 without a ground board.

[0130] At this time, referring to FIG. 10, in a modified example of the ultrasound probe module 200 according to an embodiment of the present invention, a ground gold foil 253 may be provided instead of the ground substrate made of gold foil.

[0131] The ground gold foil 253 may have one end connected to the first electrode layer 261 and the other end connected to the signal board 252 .

[0132] At this time, referring to FIG. 10, in order to prevent short circuits between the ground gold foil 253 and other components, an insulating member 254 may be provided in the piezoelectric element layer 230, the second electrode layer 262, and the space between the gold foil 255 of the signal substrate 252 and the ground gold foil 253.

[0133] In the ultrasonic probe module 200 according to an embodiment of the present invention, an adhesive material such as epoxy may be applied to the circuit board or gold foil, and then the circuit board or gold foil may be bonded to the piezoelectric element layer 230 by applying pressure.

[0134] At this time, the adhesive layer formed by the adhesive member used for adhesion is formed to the same thickness as the circuit board or gold foil to be adhered.

[0135] At this time, since the adhesive member may affect the ultrasonic scan data detected by the ultrasonic probe module 200, the thinner the adhesive layer is formed, the less noise and distortion can be obtained in the ultrasonic scan data.

[0136] Unlike a circuit board which can be formed to a thickness of 50 μm, the gold foil can be formed to a thickness of less than 100 nm. Therefore, when a modified configuration such as the ultrasonic probe module 200 shown in FIGS. 9 to 11 is adopted, it is possible to form a thinner adhesive layer compared to the configuration of the ultrasonic probe module 200 shown in FIGS. 6 to 8.

[0137] Therefore, when the structure according to this modified example is adopted, there is an advantage that more accurate ultrasound scan data can be obtained.

[0138] FIG. 12 is a cross-sectional view of an ultrasonic probe module of an optical device according to a third embodiment of the present invention, seen from the same direction as in FIG. 10, and an enlarged view of a part of the cross-sectional view.

[0139] 12, in the third embodiment, the block layer 240 disposed on the other side of the piezoelectric element layer 230 may be formed to have a width greater than the piezoelectric element layer 230, the matching layer 220, and the lens 210. In the third embodiment, as shown in FIG.

[0140] As a result, unlike the ultrasonic probe module 200 shown in Figures 6 to 11, the signal substrate 252 does not interfere between the piezoelectric element layer 230 and the block layer 240, and the piezoelectric element layer 230 and the signal substrate 252 can be connected at the side of the piezoelectric element layer 230.

[0141] In this case, for electrical connection between the piezoelectric element layer 230 and the signal substrate 252 , a gold foil 255 protruding from the signal substrate 252 may be disposed between the piezoelectric element layer 230 and the block layer 240 .

[0142] In this case, unlike the signal substrate which can be formed to a thickness of 50 μm, the gold foil can be formed to a thickness of less than 100 nm, so this modified example can minimize the effect of the signal substrate 252 on the transmission and reception of ultrasound due to interference between the piezoelectric element layer 230 and the block layer 240.

[0143] In addition, in the case of this modified example, as in the case of the ultrasonic probe module 200 shown in FIGS. 9 to 11, the ground substrate is replaced with the ground gold foil 253, so that it is possible to form the adhesive layer even thinner than in the case of the ultrasonic probe module 200 shown in FIGS. 6 to 8.

[0144] The above-described laminated structure of the ultrasonic probe module 200 can be similarly applied to additional modified examples in which the arrangement of the piezoelectric elements constituting the piezoelectric element layer 230 is changed.

[0145] Fig. 13 is a diagram showing an ultrasonic probe module of an optical device according to a first modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. Fig. 14 is a diagram showing an ultrasonic probe module of an optical device according to a second modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. Fig. 15 is a diagram showing an ultrasonic probe module of an optical device according to a third modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. Fig. 16 is a diagram showing an ultrasonic probe module of an optical device according to a fourth modified example of the arrangement of piezoelectric elements of the optical device according to the present invention. Fig. 17 is a diagram showing an ultrasonic probe module of an optical device according to a fifth modified example of the arrangement of piezoelectric elements of the optical device according to the present invention.

[0146] Referring to FIG. 13, the piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a convex shape.

[0147] If the piezoelectric layer 230 is formed convexly, then this allows the lens 210, matching layer 220, and blocking layer 240 to also be formed convexly.

[0148] In this case, there is an advantage that the ultrasonic probe module 200 can irradiate a wider area.

[0149] In this way, even if the shapes of the piezoelectric element layer 230, the lens 210, the matching layer 220, and the block layer 240 of the ultrasonic probe module 200 are formed to be convex, the stacking order and transparency of the ultrasonic probe module 200 and the positional relationship with the optical device 300 in the housing 400 can be formed to be the same as when the arrangement of the piezoelectric element layer 230 described above is not deformed.

[0150] Therefore, as shown in FIG. 13, in the first modified example of the piezoelectric element layer 230 of the ultrasonic probe module 200 according to an embodiment of the present invention, light can also travel from the optical device 300 inside the housing to the outside of the housing through the ultrasonic probe module 200.

[0151] Referring to FIG. 14, the piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a concave shape.

[0152] If the piezoelectric layer 230 is formed concave, then the lens 210, matching layer 220, and blocking layer 240 may also be formed concave.

[0153] In this case, there is an advantage that the ultrasonic probe module 200 can irradiate a relatively small area in a concentrated manner.

[0154] In this way, even when the shapes of the piezoelectric element layer 230, the lens 210, the matching layer 220, and the block layer 240 of the ultrasonic probe module 200 are formed to be convex, as in the case of Figure 13, the stacking order and transparency of the ultrasonic probe module 200 and the positional relationship with the optical device 300 in the housing 400 can be formed to be the same as when the arrangement of the piezoelectric element layer 230 described above is not deformed.

[0155] Therefore, as shown in FIG. 14, in the case of the second modified example of the piezoelectric element layer 230 of the ultrasonic probe module 200 according to an embodiment of the present invention, light can also travel from the optical device 300 within the housing through the ultrasonic probe module 200 to the outside of the housing.

[0156] In this manner, the third to fifth modified examples in which the arrangement of the piezoelectric element layer 230 shown in Figures 15 to 17 is modified also allow light to travel from the optical device 300 inside the housing through the ultrasonic probe module 200 to the outside of the housing.

[0157] Referring to FIG. 15, the piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a shape forming a two-dimensional plane (2D Matrix) of vertical and horizontal directions.

[0158] In this case, the stacked structure of the ultrasonic probe modules 200 arranged in one direction as described above can be arranged in two dimensions, vertically and horizontally.

[0159] In this case, there is an advantage that the ultrasound probe module 200 can more easily obtain a 3D image.

[0160] Referring to FIG. 16, the piezoelectric elements constituting the piezoelectric element layer 230 may be formed in ring shapes with different radii and arranged in a concentric annular shape.

[0161] In this case, the lens 210, the matching layer 220, and the blocking layer 240 may also be formed in a ring shape in accordance with the respective piezoelectric elements formed in a ring shape.

[0162] Referring to FIG. 17, the piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a hemisphere.

[0163] In this case, the stacked structure of the ultrasonic probe modules 200 arranged in one direction as described above may have the piezoelectric elements arranged along the array.

[0164] In this case, the ultrasonic probe module 200 has an advantage over the modification shown in FIG. 14 in that it can irradiate a narrower spot more strongly and intensively.

[0165] By adopting the above-described structure, the optical device 100 according to one embodiment of the present invention can improve the signal-to-noise ratio and reduce the size of the device, unlike conventional optical devices in which the ultrasound probe and the optical device are non-coaxially coupled.

[0166] Furthermore, the optical device 100 according to an embodiment of the present invention can obtain ultrasound image information and optical image information that match each other along the entire region L3 in the depth direction of the subject 500.

[0167] This makes it possible to simultaneously obtain images containing a variety of information, thereby improving the accuracy of lesion diagnosis.

[0168] At the same time, the optical device 100 according to an embodiment of the present invention can utilize characteristics such as light absorption and light scattering to target specific tissues through fluorescent labeling to generate image information, or perform a wider range of tasks such as measuring oxygen saturation using the degree of light absorption.

[0169] In addition, the optical device 100 according to an embodiment of the present invention can improve image quality and provide a wide viewing angle by applying a multiple piezoelectric element.

[0170] In addition, the optical device 100 according to another aspect of the present invention can provide an optical device according to a purpose by diversifying the arrangement of the multiple piezoelectric elements.

[0171] Although one embodiment of the present invention has been described above, the concept of the present invention is not limited to the embodiment presented in this specification, and a person skilled in the art who understands the concept of the present invention can easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same concept, which also fall within the scope of the concept of the present invention. [Explanation of symbols]

[0172] 20 Conventional ultrasonic sensor 21 Ultrasonic beam 30 Conventional Optical Instruments 31 Optical Beam 100 Optical equipment 200 Transparent Ultrasound Probe Module 201 Ultrasonic Beam 210 Lens 220 Matching layer 222 1st matching layer 224 Second matching layer 230 Piezoelectric element layer 240 Block Layer 251 Ground board 252 Signal Board 261 1st electrode layer 262 2nd electrode layer 300 Optical equipment 301 Optical Beam 400 Housing 500 samples

Claims

1. A transparent ultrasonic probe module provided within a housing of an optical device, a lens provided on one side of the inside of the housing, the lens being made of a transparent material and disposed such that one surface is exposed to the outside of the housing; a first matching layer provided on the other surface of the lens and made of a transparent material; a piezoelectric element layer provided on the first matching layer and including a plurality of transparent piezoelectric elements capable of converting electrical signals into mechanical signals and vice versa; a first electrode layer and a second electrode layer formed of a transparent material and provided on one surface and the other surface of the piezoelectric element layer, respectively, for transmitting an electrical signal; a circuit board connected to the first electrode layer and the second electrode layer and made of a flexible material, the circuit board being capable of transmitting and receiving electrical signals to and from the piezoelectric element; a blocking layer provided on the second electrode layer, the blocking layer being made of a transparent material, for eliminating ultrasonic noise.

2. The transparent ultrasonic probe module according to claim 1 , further comprising a second matching layer formed of a transparent material between the first matching layer and the lens.

3. The transparent ultrasonic probe module according to claim 1 , wherein the circuit board is made of a transparent material.

4. The transparent ultrasonic probe module according to claim 1 , wherein the circuit board is composed of a ground board (FPCB) and a signal board (FPCB).

5. the ground substrate is coupled to the first electrode layer between the first electrode layer and the first matching layer; The transparent ultrasonic probe module according to claim 4 , wherein the signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

6. The transparent ultrasonic probe module according to claim 1 , wherein the circuit board is composed of a gold foil plate having a grounding function and a signal board (signal FPCB).

7. The gold foil plate is connected to the first electrode layer between the first electrode layer and the first contact; The transparent ultrasonic probe module according to claim 6 , wherein the signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

8. the block layer is formed to have a surface larger than the piezoelectric element layer and the second electrode layer; 8. The transparent ultrasonic probe module according to claim 7, wherein the signal substrate is disposed on a portion of the upper surface of the block layer that protrudes from the piezoelectric element layer and the second electrode layer, and is connected to the second electrode layer via a conductive material.

9. The transparent ultrasonic probe module according to claim 1 , wherein the piezoelectric elements constituting the piezoelectric element layer are arranged in a row.

10. The transparent ultrasonic probe module according to claim 9 , wherein the piezoelectric elements are arranged in a line in an arch shape that rises upwardly in a convex manner.

11. The transparent ultrasonic probe module according to claim 9 , wherein the piezoelectric elements are arranged in a line in a U-shape that is concave upward.

12. The transparent ultrasonic probe module according to claim 1 , wherein the piezoelectric elements constituting the piezoelectric element layer are arranged in a horizontal and vertical grid pattern.

13. The transparent ultrasonic probe module according to claim 1 , wherein the piezoelectric elements constituting the piezoelectric element layer are arranged in a circular shape.

14. The transparent ultrasonic probe module according to claim 13, wherein the plurality of piezoelectric elements are formed in ring shapes having different diameters and are arranged in a concentric circle shape.

15. The transparent ultrasonic probe module according to claim 13 , wherein the plurality of piezoelectric elements are arranged in a hemispherical shape having a constant curvature.

16. The transparent ultrasonic probe module according to claim 1, wherein the matching layer and the blocking layer are formed of one or more materials selected from the group consisting of plastic, silicon, glass, and epoxy, or a composite in which powder having a diameter of several nanometers to several hundred micrometers is mixed into the materials.

17. The transparent ultrasonic probe module according to claim 1 , wherein the lens has any one of a concave lens, a convex lens, and a flat lens shape.

18. Housing and The transparent ultrasonic probe module according to claim 1 , which is provided on one side of the inside of the housing; an optical instrument provided on the other side of the inside of the housing and arranged coaxially with the transparent ultrasonic probe module along the longitudinal direction of the housing.

19. A housing is provided inside the housing, The photoacoustic optical device of claim 18, further comprising an optical lens disposed between the optical instrument and the transparent ultrasonic probe module.

20. The photoacoustic optical device according to claim 18 , wherein the optical instrument is a camera.

21. The photoacoustic optical device according to claim 18 , wherein the optical instrument is a light source that irradiates light.

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