Gas processing module, gas processing method, and gas-phase organic compound processing method

Abstract

To provide a gas processing module having processing effect which is good for gas phase organic compounds in a mixed gas, and to provide a gas processing method.SOLUTION: A gas processing module 900 comprises a chamber 100, a gas introduction unit 210, a light source 300, a photocatalyst 400, a liquid introduction unit 510, a gas discharge unit 220, and a liquid discharge unit. The gas introduction unit communicates with the inside of the chamber and supplies a to-be-processed gas to the chamber. The to-be-processed gas includes gas phase organic compounds. The light source is provided in the chamber and provides a first light beam. The photocatalyst is provided in the chamber, and at least a portion of the gas-phase organic compounds of the to-be-processed gas which comes into contact with the photocatalyst generates an organic compound product under the action of the photocatalyst when receiving radiation of the first light beam. The liquid introduction unit communicates with the inside of the chamber, provides a solvent, and causes the solvent to come into contact with a surface of the photocatalyst. The organic compound product can be dissolved into the solvent.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to a gas treatment module, a gas treatment method, and a gas-phase organic compound treatment method, and more particularly, to a gas treatment module, a gas treatment method, and a gas-phase organic compound treatment method that are applied to remove airborne molecular contaminants (AMC) containing volatile organic compounds (VOCs) in processes related to the semiconductor industry. [Background technology]

[0002] In industrial manufacturing, such as the semiconductor manufacturing industry, cleanrooms are widely used to produce and manufacture products in a clean, contaminant-free, isolated environment to further improve product yields.

[0003] In order to meet the environmental requirements of the clean room, a fan and a filtering device are usually installed at the gas inlet of the clean room, and the gas flow is driven through the fan to pass through the filter of the filtering device before entering the clean room, thereby filtering out dust and various organic and inorganic contaminants.

[0004] Airborne molecular pollutants such as benzene, acetone, isopropanol, ethyl acetate, dimethyl sulfoxide, ethanolamine, propylene glycol methyl ether, and propylene glycol methyl ether acetate. One of the common methods for removing volatile organic compounds (VOCs) from pollutants (AMC) is the adsorption with activated carbon materials. Activated carbon materials have good physical adsorption effects for alkanes, alkenes, ethers, and benzene compounds among VOCs due to their pores, but they are less effective at physically adsorbing alcohols, ketones, acids, and esters among VOCs. Therefore, a method using photocatalytic reaction treatment has been proposed. However, in the case of photocatalytic reaction treatment in the prior art, the products accumulate on the surface of the photocatalyst, which reduces the reaction rate and makes the overall efficacy less than the requirements. Summary of the Invention

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a gas treatment module that has good treatment effect on gas phase organic compounds in a gas mixture.

[0006] Another object of the present invention is to provide a gas treatment method having good treatment effect on gas-phase organic compounds in a mixed gas.

[0007] Another object of the present invention is to provide a method for treating gaseous organic compounds, which has good treatment effect on the gaseous organic compounds.

[0008] The gas treatment module of the present invention includes a chamber, a gas introduction unit, a light source, a photocatalyst, a liquid introduction unit, a gas exhaust unit, and a liquid exhaust unit. The gas introduction unit is in communication with the interior of the chamber and can supply a gas to be treated into the chamber, the gas to be treated including a gas-phase organic compound. The light source is provided in the chamber and can provide a first light beam. The photocatalyst is provided in the chamber, and when irradiated with the first light beam, at least a portion of the gas-phase organic compound of the gas to be treated that comes into contact with the photocatalyst can generate an organic compound product through the action of the photocatalyst. The liquid introduction unit is in communication with the inside of the chamber and can provide a solvent to contact the surface of the photocatalyst, and the organic compound product can be dissolved in the solvent, in which the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. The gas discharge unit is in communication with the inside of the chamber and can discharge the treated gas that has been separated from the photocatalyst and contacted with the photocatalyst. The liquid discharge unit is in communication with the inside of the chamber and can discharge the solvent containing the organic compound product that has been separated from the photocatalyst.

[0009] In an embodiment of the invention, the light source includes a continuously provided ultraviolet light as the first light beam.

[0010] In an embodiment of the present invention, the gas treatment module further comprises a filtration unit through which the gas to be treated can pass.

[0011] In an embodiment of the present invention, the photocatalyst is disposed on one side of the filtration unit, and the light source and the liquid introduction unit are disposed outside the filtration unit and facing the photocatalyst.

[0012] In an embodiment of the present invention, a plurality of gas treatment modules may be provided, connected in series.

[0013] In an embodiment of the invention, the treated gas can be passed through a solvent to cause at least a portion of the gas phase organic compounds to form liquid phase organic compounds, which can be photocatalytically activated to produce organic compound products.

[0014] In an embodiment of the invention, the liquid introduction unit supplies the solvent batchwise.

[0015] In an embodiment of the invention, the liquid introduction unit supplies the solvent in a continuous manner.

[0016] In the present embodiment, the flow rate of the solvent over the surface of the photocatalyst is 75.6 L / min m 2 That's all.

[0017] In an embodiment of the present invention, the flow rate of the gas phase organic compound over the surface of the photocatalyst is less than 0.7 m / s.

[0018] In an embodiment of the present invention, the liquid introduction unit sprays the solvent onto the surface of the photocatalyst by showering.

[0019] In an embodiment of the present invention, in the liquid introduction unit, the solvent flows over the surface of the photocatalyst by reciprocal immersion.

[0020] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0021] In an embodiment of the present invention, the gas phase organic compounds do not include one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

[0022] The gas processing method of the present invention includes the steps of (S1000) providing a gas to be processed that contains gas-phase organic compounds, (S2000) contacting the gas to be processed with a surface of a photocatalyst to generate organic compound products from at least a portion of the gas-phase organic compounds through the action of the photocatalyst, (S3000) providing a solvent, and (S4000) contacting the solvent with the photocatalyst to generate organic compounds. The method includes a step of dissolving the compound product in a solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent; and (S5000) a step of separating the treated gas that has come into contact with the photocatalyst and the solvent containing the organic compound product from the photocatalyst.

[0023] In an embodiment of the present invention, step S2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so that the gas-phase organic compounds react with each other to produce organic compound products.

[0024] In an embodiment of the invention, step S2000 includes reacting the gas-phase organic compound with the photocatalyst multiple times to generate an organic compound product.

[0025] In an embodiment of the present invention, the gas treatment method further includes a step (S3200) of passing the treated gas through a solvent to cause at least a portion of the gas-phase organic compounds to form liquid-phase organic compounds, and a step (S3400) of causing the liquid-phase organic compounds to generate organic compound products through the action of a photocatalyst.

[0026] In an embodiment of the invention, step S3400 includes photocatalyzing the liquid-phase organic compound multiple times to produce an organic compound product.

[0027] In an embodiment of the invention, step S3000 includes supplying the solvent batchwise.

[0028] In an embodiment of the invention, step S3000 includes supplying the solvent in a continuous manner.

[0029] In the present embodiment, the flow rate of the solvent over the surface of the photocatalyst is 75.6 L / min m 2 That's all.

[0030] In an embodiment of the present invention, the flow rate of the gas phase organic compound over the surface of the photocatalyst is less than 0.7 m / s.

[0031] In an embodiment of the present invention, step S3000 includes spraying the solvent onto the surface of the photocatalyst by a shower.

[0032] In an embodiment of the present invention, step S3000 includes flowing the solvent over the surface of the photocatalyst by reciprocal immersion.

[0033] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0034] In an embodiment of the present invention, the gas phase organic compounds do not include one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

[0035] The gas-phase organic compound processing method of the present invention includes the steps of (A1000) providing a gas-phase organic compound, (A2000) causing the gas-phase organic compound to generate an organic compound product by the action of a photocatalyst, (A3000) providing a solvent, (A4000) contacting the solvent with a surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent, and (A5000) separating the solvent containing the organic compound product from the photocatalyst.

[0036] In an embodiment of the present invention, step A2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so that the gas-phase organic compounds react to produce organic compound products.

[0037] In an embodiment of the invention, step A2000 includes photocatalyzing the gas-phase organic compound multiple times to produce the organic compound product.

[0038] In an embodiment of the present invention, the method for treating a gas phase organic compound further includes the steps of (A3200) passing the gas phase organic compound through a solvent to cause at least a portion of the gas phase organic compound to form a liquid phase organic compound, and (A3400) generating an organic compound product from the liquid phase organic compound through the action of a photocatalyst.

[0039] In an embodiment of the invention, Step A3400 includes photocatalyzing the liquid phase organic compound multiple times to produce an organic compound product.

[0040] In an embodiment of the present invention, Step A1000 includes providing a gas phase organic compound together with a solvent.

[0041] In an embodiment of the present invention, Step A3000 includes supplying the solvent batchwise.

[0042] In an embodiment of the invention, Step A3000 includes supplying the solvent in a continuous manner.

[0043] In the present embodiment, the flow rate of the solvent over the surface of the photocatalyst is 75.6 L / min m 2 That's all.

[0044] In an embodiment of the present invention, the flow rate of the gas phase organic compound over the surface of the photocatalyst is less than 0.7 m / s.

[0045] In an embodiment of the present invention, step A3000 includes spraying the solvent onto the surface of the photocatalyst by a shower.

[0046] In an embodiment of the present invention, step A3000 includes flowing the solvent over the surface of the photocatalyst by reciprocal immersion.

[0047] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0048] In an embodiment of the present invention, the gas phase organic compounds do not include one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds. [Brief description of the drawings]

[0049] [Figure 1A] 1 is a schematic diagram of an embodiment of a gas processing module of the present invention.

[0050] [Figure 1B] FIG. 1B is a schematic cross-sectional view of AA′ in FIG. 1A.

[0051] [Figure 1C] 4 is a schematic diagram of an embodiment in which a liquid introduction unit in a gas treatment module of the present invention is provided with spray holes; FIG.

[0052] [Figure 2A] FIG. 1 is a schematic diagram showing the effect of acetone removal with and without water washing.

[0053] [Figure 2B] FIG. 1 is a schematic diagram showing the removal effect of isopropanol, acetone, and toluene with water washing.

[0054] [Figure 3A] FIG. 2 is a schematic diagram showing the results of acetone removal without water washing, with circulating water washing, and with continuous water washing. [Figure 3B] FIG. 2 is a schematic diagram showing the results of acetone removal without water washing, with circulating water washing, and with continuous water washing.

[0055] [Figure 3C] FIG. 13 is a schematic diagram of the results of acetone removal by successively rinsing the photocatalyst with water at different flow rates.

[0056] [Figure 4] FIG. 2 is a schematic diagram showing a flow of an embodiment of a gas processing method according to the present invention.

[0057] [Diagram 5] FIG. 2 is a schematic diagram showing a flow of a gas processing method according to another embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram showing a flow of a gas processing method according to another embodiment of the present invention.

[0058] [Figure 7] FIG. 2 is a schematic diagram of a flow of an embodiment of a method for treating a gas phase organic compound according to the present invention.

[0059] [Figure 8]FIG. 2 is a schematic diagram of a flow of a different embodiment of the method for treating a gas phase organic compound of the present invention. [Figure 9] FIG. 2 is a schematic diagram of a flow of a different embodiment of the method for treating a gas phase organic compound of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0060] In the following, the embodiment of the connection assembly disclosed in the present invention will be described by means of certain specific examples and drawings, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. However, the contents disclosed below are not intended to limit the protection scope of the present invention, and those skilled in the art can realize the present invention in other different embodiments based on different perspectives and applications without departing from the concept of the present invention. In the accompanying drawings, the thickness of layers, films, panels, regions, etc. are enlarged for clarity. In the entire specification, the same reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region, or substrate is described as being "on" another element or "connected" to another element, the element may be directly on or connected to another element, or intermediate elements may be present. Conversely, when an element is described as being "directly on" another element or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" may refer to a physical and / or electrical connection. It should be noted that in the case of "electrical connection" or "coupling", there may be other elements between the two elements.

[0061] It should be understood that, although terms such as "first", "second", and "third" are used in the present text to describe various elements, members, regions, layers, and / or portions, these elements, members, regions, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, member, region, layer, or portion from another element, member, region, layer, or portion. Thus, a "first element", "member", "region", "layer", or "portion" described below can be referred to as a second element, member, region, layer, or portion without departing from the teachings of the present text.

[0062] Additionally, the relative terms "lower" or "bottom" and "upper" or "top" may be used in the text to describe the relationship of one element to another element, as shown in the figures. It should be understood that the relative terms are intended to include different orientations of the device other than the orientation shown in the figures. For example, if the device in a figure is flipped over, an element that is shown to be on the "lower" side of the other element would then be oriented on the "upper" side of the other element. Thus, the exemplary term "lower" can encompass an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, If the device in the figures is inverted, elements designated as being "below" or "below" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "belower" can encompass an orientation of "upper" and "lower."

[0063] As used herein, "about," "approximately," or "substantially" includes a stated value and an average value that is within an acceptable deviation range of the specified value as determined by one of ordinary skill in the art, taking into account the measurements being described and the specific number of errors associated with the measurements (i.e., limitations of the measurement system). For example, "about" can indicate within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. It should be noted that "about," "approximately," or "substantially" as used herein may select a relatively acceptable deviation range or standard deviation for optical properties, etching properties, or other properties, without applying a single standard deviation to all properties.

[0064] As shown in FIG. 1A, the gas treatment module 900 of the present invention includes a chamber 100, a gas introduction unit 210, a light source 300, a photocatalyst 400, a liquid introduction unit 510, a gas exhaust unit 220, and a liquid exhaust unit 520. In one embodiment, the chamber 100 is made of stainless steel, but in another embodiment, the chamber 100 may be made of other alloys, metals, metal oxides, or non-metallic materials, such as polymers and glass. The gas introduction unit 210 communicates with the inside of the chamber 100 and can supply the gas to be treated to the chamber 100. Specifically, in one embodiment, the gas introduction unit 210 may be an opening on one side of the chamber 100 or a connection port connected to an external line, and the gas to be treated may be transported by a device such as a pump or a fan and passed through the gas introduction unit 210 to be supplied to the chamber 100.

[0065] The gas to be treated includes gas-phase organic compounds. The gas-phase organic compounds include volatile organic compounds (VOCs). In one embodiment, the gas-phase organic compounds include one or more compounds selected from isopropanol, acetone, and toluene. In another embodiment, the gas-phase organic compounds do not include one or more compounds selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds, for example to avoid possible degradation of efficacy.

[0066] As shown in the embodiment of FIG. 1A, the light source 300 is provided in the chamber 100 and can provide a first light beam continuously or intermittently. The photocatalyst 400 is provided in the chamber 100. When the photocatalyst 400 is irradiated with the first light beam, at least a part of the gas-phase organic compounds in the gas to be treated that come into contact with the photocatalyst 400 can generate organic compound products through the action of the photocatalyst 400. More specifically, in one embodiment, the light source 300 may be a lamp that can emit ultraviolet light having a wavelength of less than 400 nm, and the reaction module 900 further includes a filtering unit 410 through which the gas to be treated can pass, and the photocatalyst 400 is titanium dioxide (TiO2) located at a location where the light beam can be directly or indirectly irradiated, such as one side of the filtering unit 410, which is a honeycomb ceramic filter. The gas-phase organic compound is acetone, and when passing through the filtering unit 410, the reaction of, for example, the following formulas (1) and (2) can occur through the action of the photocatalyst 400. In other words, in this example, the organic compound product is formic acid (HCOOH). CH3COCH3→HCOOH+CH3CHO……Formula (1) CH3CHO→2HCOOH……Formula (2) However, in different embodiments, the light source 300 may be a light-emitting device that emits the first light beam at other wavelengths, the photocatalyst 400 is not limited to titanium dioxide, and the organic compound product may be acetic acid, etc.

[0067] FIG. 1B is a schematic cross-sectional view of the cross section AA′ in FIG. 1A. The liquid introduction unit 510 communicates with the inside of the chamber 100 and can provide a solvent to contact the surface of the photocatalyst 400. The organic compound product can be dissolved in a solvent, for example, water, and the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. Specifically, in one embodiment, the liquid introduction unit 510 can be a line penetrating from the outside of the chamber 100, and the solvent can enter the chamber 100 by transportation by a device such as a pump or by gravity to contact the surface of the photocatalyst 400. A spray hole 511 toward the photocatalyst 400 can be further provided at one end of the line in the chamber 100, so that the solvent can be sprayed on the surface of the photocatalyst 400 by showering. In a different embodiment, the one end of the line in the chamber 100 can be simply flowing into the chamber 100, flowing out of the chamber 100, and flowing over the surface of the photocatalyst 400 by reciprocating immersion, without facing the photocatalyst 400. The liquid introduction unit 510 may supply the solvent in a batch or continuous manner, ie, the solvent may flow over the surface of the photocatalyst 400 intermittently or continuously.

[0068] As shown in the embodiment of FIG. 1B, the gas discharge unit 220 communicates with the inside of the chamber 100 and can discharge the gas to be treated that has been separated from the photocatalyst 400 and contacted with the photocatalyst. Specifically, in one embodiment, the gas discharge unit 220 can be an opening on one side of the chamber 100 or a connection port connected to an external line, and the gas to be treated can be transported by a device such as a pump or a fan and discharged from the chamber 100 through the gas discharge unit 220. The liquid discharge unit 520 communicates with the inside of the chamber 100 and can discharge the solvent containing the organic compound product that has been separated from the photocatalyst 400. Specifically, in one embodiment, the liquid discharge unit 520 can be a line penetrating from the outside of the chamber 100, and the solvent can be transported by a device such as a pump or can be separated from the chamber 100 by gravity.

[0069] Furthermore, in one embodiment, acetone, which is the gas-phase organic compound described above, can generate formic acid, which is an organic compound product, by the action of the photocatalyst 400, and at least a portion of the formic acid can adhere to the surface of the photocatalyst 400. In general, formic acid undergoes the reaction of the following formula (3): 2HCOOH+O2→2CO2+2H2O...Formula (3) It can be decomposed into carbon dioxide and water. However, this reaction is slow and can be considered as a rate-determining step (RDS). The surface of the photocatalyst 400 cannot continue to react with acetone, which is a gas-phase organic compound, due to the attachment of formic acid, so the reaction rate is greatly reduced. In contrast, in the present invention, a solvent is provided to contact the surface of the photocatalyst 400, and the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the gas-phase organic compound (acetone) in the solvent (water), or the volatility of the organic compound product (formic acid) in the solvent (water) is lower than the volatility of the gas-phase organic compound (acetone) in the solvent (water), so that the formic acid attached to the surface of the photocatalyst 400 can be quickly removed by water, and the photocatalyst 400 can continue to react with acetone, greatly improving the reaction rate. Preferably, the gas-phase organic compound, such as acetone, is in contact with the photocatalyst for a longer time than it takes to react with the photocatalyst to produce an organic compound product, such as formic acid, but shorter than the time it takes to completely react to produce final reactants, such as carbon dioxide and water. From a different perspective, the present invention seeks to significantly improve the reaction rate by utilizing the difference in solubility or volatility of the gas-phase organic compound and the organic compound product in the solvent, and by substantially rinsing the surface of the photocatalyst 400 with the solvent to remove the organic compound product attached to the surface of the photocatalyst 400, thereby allowing the photocatalyst 400 to continuously react with the gas-phase organic compound under irradiation with ultraviolet light, rather than accelerating the complete reaction of the gas-phase organic compound.

[0070] In another embodiment, the gas to be treated passes through a solvent to form at least a part of the gas-phase organic compounds into liquid-phase organic compounds, and the liquid-phase organic compounds can be generated by the action of photocatalysis. From a different perspective, the gas to be treated entering the chamber can be washed with water to dissolve at least a part of the gas-phase organic compounds therein into water to form liquid-phase organic compounds, and then similarly generate organic compound products by the action of photocatalysis, which can be removed from the surface of the photocatalyst by water.

[0071] 1A to 1C, the shape, size, arrangement, relative angle, and the like of each element in gas processing module 900 can be adjusted as necessary. Meanwhile, a plurality of gas processing modules 900 may be provided and connected in series to improve the processing effect and / or processing amount of gas phase organic compounds.

[0072] Example 1 of gas treatment module: A substrate having a length of 150 mm, a width of 150 mm, a thickness of 50 mm, and a pore diameter of 4 mm, and made of a material such as cordierite, mullite, aluminum titanate, silicon carbide, zirconium oxide, or silicon nitride, was used, and a photocatalyst of titanium dioxide was provided on the surface of the substrate. The photocatalyst was irradiated with a lamp emitting ultraviolet light with a wavelength slightly shorter than 400 nm at a taper angle of 30° and a lamp interval of 150 mm, and the interval between the spray heads was 50 mm. The flow rate of the gas to be treated was 0.4 m 3 / min, no water washing and flow rate of 75.6 L / min m 2 The results of continuously running water through the photocatalyst are shown in Table 1 and Figure 2A below, which reveal that the average amount and average removal efficiency of acetone after continuous water washing are significantly better than those without water washing, which proves that the gas treatment module of the present invention has a favorable removal effect on gas-phase organic compounds in mixed gases. [Table 1]

[0073] In the gas processing module according to the first embodiment, the flow rate of the gas to be processed is 0.4 m 3 / min, flow rate 75.6 L / min m 2 The removal results for isopropanol, acetone, and toluene when water was continuously flowed through the photocatalyst are shown in FIG. 2B, which reveals that the gas treatment module of the present invention has good removal effects for all three of the above.

[0074] In the gas processing module according to the first embodiment, the flow rate of the gas to be processed is 0.4 m 3 / min, no water rinse, circulating water rinse, continuous water rinse (flow rate 75.6 L / min m 2 The removal results for acetone in the case of continuous rinsing of the photocatalyst by showering with 100 ml of water are shown in Figures 3A and 3B, which reveal that continuous water washing has a favorable effect.

[0075] In the gas processing module according to the first embodiment, the flow rate of the gas to be processed is 0.4 m 3 / min, with flow rates of 4.27, 50.7, and 75.6 L / min m, respectively. 2 The removal results for acetone when the photocatalyst was continuously rinsed with water at 75.6 L / min m are shown in Table 2 and Figure 3C below. 2 It was found to have a favorable effect. [Table 2]

[0076] In the gas treatment module of Example 1 described above, the flow velocities of the gas to be treated were 2.5, 1.5, and 0.7 m / s, respectively, and the flow rate was 75.6 L / min m 2 The removal results for acetone when water was continuously flowed through the photocatalyst are shown in Table 3 below, and it was found to have a favorable effect at 0.7 m / s. [Table 3]

[0077] As shown in the schematic flow diagram of an embodiment of FIG. 4, the gas processing method of the present invention includes, for example, the following steps.

[0078] In step S1000, a gas to be treated is provided that includes a gas phase organic compound. In one embodiment, this step includes providing the gas to be treated with a solvent. More specifically, the gas phase organic compound includes a volatile organic compound (VOC). In one embodiment, the gas phase organic compound includes one or more selected from isopropanol, acetone, and toluene. In another embodiment, the gas phase organic compound does not include one or more selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds, for example to avoid possible degradation of efficacy.

[0079] In step S2000, the gas to be treated is brought into contact with a surface of the photocatalyst, and at least a portion of the gas-phase organic compounds are reacted with the photocatalyst to generate organic compound products. More specifically, in one embodiment, the gas to be treated is brought into contact with a surface of the photocatalyst 400 as shown in FIG. 1A, and at least a portion of the gas-phase organic compounds are reacted with the photocatalyst 400 to generate organic compound products. In another embodiment, this step further includes continuously providing ultraviolet light to irradiate the photocatalyst, so that the gas-phase organic compounds are reacted with the photocatalyst to generate organic compound products. In another embodiment, this step further includes reacting the gas-phase organic compounds with the photocatalyst multiple times to generate organic compound products.

[0080] In step S3000, a solvent is provided to contact the photocatalyst so that the organic compound product is dissolved in the solvent. The solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. More specifically, in one embodiment, as shown in FIG. 1A, the solvent is contacted with the photocatalyst 400 so that the organic compound product is dissolved in the solvent. This step may involve supplying the solvent in a batch or continuous manner, i.e., flowing the solvent intermittently or continuously over the surface of the photocatalyst 400. The flow rate of the solvent over the surface of the photocatalyst is preferably 75.6 L / min m 2 The flow rate of the gas-phase organic compound over the surface of the photocatalyst is preferably 0.7 m / s or less. This step may include spraying the solvent over the surface of the photocatalyst by showering or flowing over the surface of the photocatalyst by reciprocal immersion.

[0081] In step S4000, the gas to be treated that has been in contact with the photocatalyst and the solvent containing the organic compound product are separated from the photocatalyst. More specifically, in one embodiment, as shown in FIG. 1B, the gas to be treated that has been in contact with the photocatalyst 400 and the solvent containing the organic compound product are separated from the photocatalyst 400. Furthermore, a gas-phase organic compound, such as acetone, should be in contact with the photocatalyst for a longer period of time than it takes to react with the photocatalyst to produce an organic compound product, such as formic acid, but shorter than the time it takes to completely react into the final reactants, such as carbon dioxide and water.

[0082] In the conventional technology of decomposing gas-phase organic compounds using photocatalysts, the surface of the photocatalyst cannot continue to react with the gas-phase organic compounds due to the adhesion of the organic compound products, so the reaction rate is greatly reduced. In contrast, in the present invention, a solvent is provided to contact the surface of the photocatalyst, and the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the gas-phase organic compound (acetone) in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent, so that the organic compound product attached to the surface of the photocatalyst can be quickly removed by the solvent, and the photocatalyst can continue to react with the gas-phase organic compounds, thereby greatly improving the reaction rate. From a different perspective, the present invention seeks to utilize the difference in solubility or volatility of the gas-phase organic compounds and the organic compound products in the solvent, rather than accelerating the complete reaction of the gas-phase organic compounds, and to substantially rinse the surface of the photocatalyst with the solvent to remove the organic compound products attached to the surface of the photocatalyst, so that the photocatalyst can continue to react with the gas-phase organic compounds, thereby greatly improving the reaction rate.

[0083] As shown in the schematic flow diagram of an embodiment in Fig. 5, the gas processing method of the present invention further includes a step S1200 of passing the gas to be processed through a filtration unit. More specifically, as shown in Fig. 1B, the gas to be processed is passed through a filtration unit 410.

[0084] As shown in the schematic diagram of the flow of the embodiment in FIG. 6, the gas processing method of the present invention further includes step S1500 of passing the gas to be processed through a solvent to form at least a part of the gas-phase organic compounds into liquid-phase organic compounds, and step S2500 of generating organic compound products from the liquid-phase organic compounds through the action of a photocatalyst. From a different angle, the gas to be processed that has entered the chamber can be washed with water to dissolve at least a part of the gas-phase organic compounds therein in water to form liquid-phase organic compounds, and then similarly generate organic compound products through the action of a photocatalyst, which can be removed from the surface of the photocatalyst by water. Step S2500 includes generating organic compound products from the liquid-phase organic compounds through the action of a photocatalyst multiple times.

[0085] In the above gas processing method, the gas to be processed may contain one or more gas phase organic compounds, i.e., one or more gas phase organic compounds may be processed simultaneously. In one embodiment, the same concept can be applied to the processing of gas phase organic compounds alone and mixtures thereof.

[0086] As shown in the schematic flow diagram of an embodiment of FIG. 7, the method for treating a gas phase organic compound of the present invention includes, for example, the following steps.

[0087] In step A1000, a gas phase organic compound is provided. In one embodiment, this step The method includes providing a gas phase organic compound with a solvent. More specifically, the gas phase organic compound includes a volatile organic compound (VOC). In one embodiment, the gas phase organic compound includes one or more compounds selected from isopropanol, acetone, and toluene. In another embodiment, the gas phase organic compound does not include one or more compounds selected from polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds, e.g., to avoid possible degradation of efficacy.

[0088] In step A2000, the gas-phase organic compound is photocatalyzed to produce the organic compound product. In one embodiment, this step includes providing UV light continuously to irradiate the photocatalyst such that the gas-phase organic compound is photocatalyzed to produce the organic compound product. In another embodiment, this step includes photocatalyzing the gas-phase organic compound multiple times to produce the organic compound product.

[0089] In step A3000, a solvent is provided to contact the surface of the photocatalyst, and the organic compound product is dissolved in the solvent. The solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent. Step A3000 includes supplying the solvent in a batch or continuous manner. The flow rate of the solvent over the surface of the photocatalyst is preferably 75.6 L / min m 2 That is all. The flow rate of the gas phase organic compound over the surface of the photocatalyst is preferably 0.7 m / s or less. In one embodiment, this step includes spraying the solvent over the surface of the photocatalyst by showering. In another embodiment, this step includes flowing the solvent over the surface of the photocatalyst by reciprocal immersion.

[0090] In step A4000, the solvent containing the organic compound product is separated from the photocatalyst.

[0091] As shown in the flow diagram of an embodiment in FIG. 8, the method for treating gaseous organic compounds of the present invention further includes step A1200 of passing the gaseous organic compounds through a filtration unit.

[0092] As shown in the schematic diagram of the embodiment flow in Figure 9, the gas phase organic compound processing method of the present invention further includes step A1500 of passing the gas phase organic compound through a solvent to cause at least a portion of the gas phase organic compound to form a liquid phase organic compound, and step A2500 of causing the liquid phase organic compound to generate an organic compound product through the action of a photocatalyst. Step A2500 includes causing the liquid phase organic compound to generate an organic compound product through the action of a photocatalyst multiple times.

[0093] Although the above description and drawings have disclosed the preferred embodiment of the present invention, it should be understood that various additions, numerous modifications and substitutions can be made to the preferred embodiment of the present invention without departing from the spirit and scope of the principles of the present invention as defined by the appended claims. Those skilled in the art will appreciate that the present invention can be used in many modifications of form, structure, arrangement, proportion, material, element, and assembly. Therefore, the embodiments disclosed herein are to be considered as illustrative of the present invention, not as limiting the present invention. The scope of the present invention is to be limited by the appended claims, including their legal equivalents, and is not limited by the preceding description. [Explanation of symbols]

[0094] 100: Chamber 210: Gas introduction unit 220: Gas exhaust unit 300: Light source 400: Photocatalyst 410: Filtration unit 510: Liquid introduction unit 511: Spray hole 520: Liquid discharge unit 900: Processing module

Claims

1. A chamber; a gas introduction unit communicating with the inside of the chamber and capable of supplying a gas to be treated to the chamber, the gas containing a gas-phase organic compound; a light source disposed in the chamber and capable of providing a first light beam; a photocatalyst provided in the chamber, the photocatalyst being capable of generating an organic compound product by the action of the photocatalyst from at least a portion of the gas phase organic compounds in the treated gas that come into contact with the photocatalyst when irradiated with the first light beam; a liquid introduction unit communicating with the interior of the chamber and capable of providing a solvent to contact the surface of the photocatalyst, the organic compound product being soluble in the solvent, the solubility of the organic compound product in the solvent being higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent being lower than the volatility of the gas-phase organic compound in the solvent; a gas exhaust unit communicating with the inside of the chamber and capable of exhausting the gas to be treated that has been in contact with the photocatalyst and separated from the photocatalyst; a liquid discharge unit communicating with the interior of the chamber and capable of discharging the solvent containing the organic compound product separated from the photocatalyst. Gas handling module.

2. The gas treatment module of claim 1 , wherein the light source comprises a continuously provided ultraviolet light as the first light beam.

3. The gas treatment module of claim 1 , further comprising a filtration unit through which the gas to be treated can pass.

4. The gas treatment module of claim 3 , wherein the photocatalyst is provided on one side of the filtration unit, and the light source and the liquid introduction unit are provided on the outside of the filtration unit and face the photocatalyst.

5. 10. The gas treatment module of claim 1, wherein there are a plurality of the gas treatment modules and the gas treatment module may be provided in series connection.

6. The gas to be treated can pass through the solvent to cause at least a portion of the gas phase organic compounds to form liquid phase organic compounds; The liquid-phase organic compound can generate the organic compound product by the action of the photocatalyst. The gas treatment module of claim 1 .

7. The gas treatment module of claim 1 , wherein the liquid introduction unit supplies the solvent batchwise.

8. The gas treatment module of claim 1 , wherein the liquid introduction unit supplies the solvent in a continuous manner.

9. The flow rate of the solvent on the surface of the photocatalyst is 75.6 L / min m ２ The gas processing module of claim 8 .

10. The flow rate of the gas-phase organic compound on the surface of the photocatalyst is 0.7 m / s or less.

2. The gas treatment module of claim 1.

11. The gas treatment module of claim 1 , wherein the liquid introduction unit sprays the solvent onto the surface of the photocatalyst by a shower.

12. The gas treatment module of claim 1 , wherein the liquid introduction unit causes the solvent to flow over the surface of the photocatalyst by reciprocal immersion.

13. 10. The gas treatment module of claim 1, wherein the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

14. 2. The gas processing module of claim 1, wherein the gas phase organic compound does not include one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

15. (S1000) Providing a gas to be treated containing a gas phase organic compound; (S2000) contacting the gas to be treated with a surface of a photocatalyst to generate an organic compound product from at least a portion of the gas-phase organic compound by the action of the photocatalyst; (S3000) Providing a solvent; (S4000) A step of contacting the solvent with the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent; (S5000) Separating the gas to be treated that has come into contact with the photocatalyst and the solvent containing the organic compound product from the photocatalyst. Gas treatment methods.

16. 16. The method of claim 15, wherein step S2000 comprises continuously providing ultraviolet light to irradiate the photocatalyst so that the gas-phase organic compounds react with the photocatalyst to produce the organic compound product.

17. (S1200) The method further includes a step of passing the gas to be treated through a filtration unit. The gas processing method according to claim 15.

18. 16. The gas processing method of claim 15, wherein step S2000 includes causing the gas phase organic compound to be reacted with the photocatalyst multiple times to produce the organic compound product.

19. (S3200) Passing the gas to be treated through the solvent to cause at least a portion of the gas phase organic compounds to form liquid phase organic compounds; (S3400) The liquid phase organic compound is caused to generate the organic compound product by the action of the photocatalyst. The gas processing method according to claim 15.

20. 20. The gas processing method of claim 19, wherein step S3400 includes reacting the liquid phase organic compound with the photocatalyst multiple times to produce the organic compound product.

21. 16. The gas processing method of claim 15, wherein step S3000 comprises supplying the solvent batchwise.

22. 16. The gas processing method of claim 15, wherein step S3000 comprises supplying the solvent in a continuous manner.

23. The flow rate of the solvent on the surface of the photocatalyst is 75.6 L / min m ２ The gas processing method according to claim 22 .

24. 16. The gas processing method according to claim 15, wherein the flow rate of the gas-phase organic compound flowing over the surface of the photocatalyst is 0.7 m / s or less.

25. The gas processing method of claim 15, wherein the step S3000 includes spraying the solvent onto the surface of the photocatalyst by a shower.

26. 16. The gas processing method of claim 15, wherein the step S3000 includes flowing the solvent over the surface of the photocatalyst by reciprocal immersion.

27. 16. The gas processing method according to claim 15, wherein the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

28. 16. The gas processing method according to claim 15, wherein the gas-phase organic compound does not contain one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

29. (A1000) Providing a gas phase organic compound; (A2000) A step of generating an organic compound product from the gas phase organic compound by the action of a photocatalyst; (A3000) Providing a solvent; (A4000) A step of contacting the solvent with a surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent; (A5000) Separating the solvent containing the organic compound product from the photocatalyst. A method for treating gas phase organic compounds.

30. 30. The method of claim 29, wherein step A2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so that the gas phase organic compound reacts to produce the organic compound product.

31. 30. The method of claim 29, wherein step A2000 includes reacting the gas phase organic compound with the photocatalyst multiple times to produce the organic compound product.

32. (A3200) Passing the gas phase organic compound through the solvent to cause at least a portion of the gas phase organic compound to form a liquid phase organic compound; (A3400) The liquid phase organic compound is further provided with a step of generating the organic compound product by the action of the photocatalyst.

30. The method of claim 29 for treating a gas phase organic compound.

33. 33. The gas processing method of claim 32, wherein Step A3400 includes reacting the liquid phase organic compound with the photocatalyst multiple times to produce the organic compound product.

34. 30. The method of claim 29, wherein step A1000 includes providing the gas phase organic compound with the solvent.

35. 30. The method of claim 29, wherein step A3000 includes supplying the solvent batchwise.

36. 30. The method of claim 29, wherein said step A3000 includes supplying said solvent in a continuous manner.

37. The flow rate of the solvent on the surface of the photocatalyst is 75.6 L / min m ２ The method for treating a gas phase organic compound according to claim 36, wherein

38. 30. The method for treating a gas phase organic compound according to claim 29, wherein the flow rate of the gas phase organic compound flowing over the surface of the photocatalyst is 0.7 m / s or less.

39. 30. The method of claim 29, wherein step A3000 includes spraying the solvent onto the surface of the photocatalyst by a shower.

40. 30. The method of claim 29, wherein step A3000 includes flowing the solvent over the surface of the photocatalyst by reciprocal immersion.

41. 30. The method of claim 29, wherein the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

42. 30. The method for treating a gas phase organic compound according to claim 29, wherein the gas phase organic compound does not contain one or more compounds selected from the group consisting of polyhalogen compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

Images