Radiation imaging device

Abstract

To provide a radiation imaging device which can achieve both improvement in reliability and reduction in dimension in a plan view.SOLUTION: A radiation imaging device 1 comprises: a sensor panel 30; a control board 50; a flexible board 41 for connecting the sensor panel 30 and a reverse side 50b of the control board 50 by way of a side of the control board 50 when seen from a Z-axis direction; circuit boards 81, 82 on which a power supply circuit 83 and an interface circuit 84 are mounted, respectively; a first housing 10 having a bottom wall 12; a second housing 70 provided at a position facing the reverse side 50b across the bottom wall 12 and accommodating the circuit boards 81, 82; and connecting members 91-93 for electrically connecting the control board 50 and the circuit board 81. Communicating holes 12a-12c provided in the bottom wall 12 are provided so as not overlap a section 41a of the flexible board 41 from an edge 41b on the outside to an edge 41c connected to the control board 50, when seen from the Z-axis direction.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a radiation imaging apparatus. [Background technology]

[0002] There is known a radiation imaging device (X-ray image imaging device) including a sensor panel (X-ray detection sensor), a flexible board (flexible wiring board) connected to the sensor panel, a first housing (first housing) that houses the sensor panel, a control board (signal processing circuit board) and a circuit board (power supply circuit board) arranged to be aligned with the sensor panel in a planar direction, and a second housing (second housing) that houses the control board and the circuit board (see, for example, Patent Document 1). In the radiation imaging device as described above, the sensor panel in the first housing and the control board and the circuit board in the second housing may be connected to each other via a connection member (cable) that passes through a communication hole provided in a wall of the first housing for transmitting and receiving electric signals, etc. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-281753 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned radiation imaging device, the circuit board may be equipped with an interface circuit that outputs a signal from the control board to the outside in addition to the power supply circuit. In this case, noise generated from the power supply circuit and the interface circuit may propagate to the flexible board through a communication hole provided in the wall of the first housing, and as a result, the noise may be superimposed on the electric signal flowing through the flexible board. This may cause deterioration in the image quality of the radiation image obtained by the radiation imaging device, and may reduce the reliability of the radiation imaging device. In addition, in the above-mentioned configuration of the radiation imaging device, the control board and the circuit board are arranged to be aligned with the sensor panel in the planar direction, so that the dimensions of the radiation imaging device in planar view become large.

[0005] An object of one aspect of the present disclosure is to provide a radiation imaging apparatus capable of achieving both improved reliability and reduced dimensions in a plan view. [Means for solving the problem]

[0006] The present disclosure includes radiation imaging devices according to [1] to

[12] .

[0007] [1] A sensor panel for detecting radiation; a control board having a main surface facing the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite to the main surface, the control board controlling reading of signals from the sensor panel; a flexible substrate arranged to connect the sensor panel and the rear surface of the control substrate via a side of the control substrate when viewed from the first direction; a circuit board on which a power supply circuit for supplying power to the control board and an interface circuit for outputting a signal from the control board to the outside are mounted; a first housing that houses the sensor panel, the control board, and the flexible board and has a wall portion that faces the back surface of the control board; a second housing that is provided at a position facing the back surface of the control board across the wall portion and that houses the circuit board; at least one connection member electrically connecting the control board and the circuit board; Equipped with the wall portion is provided with at least one communication hole that communicates between an interior of the first housing and an interior of the second housing; the at least one connection member is connected to the control board and the circuit board via the at least one communication hole; A radiation imaging device, wherein when viewed from the first direction, the at least one communication hole is arranged so as not to overlap with a portion of the flexible substrate from the end farthest from the control substrate to the end connected to the control substrate in a second direction perpendicular to the first direction.

[0008] In the above-mentioned configuration [1], the main surface of the control board faces the sensor panel, and the second housing that houses the circuit board faces the back surface of the control board across the wall of the first housing. That is, the control board and the circuit board on which the power supply circuit and the interface circuit are mounted are arranged to be aligned along the first direction with respect to the sensor panel. This allows the dimensions in a planar view to be reduced compared to the case where the control board and the circuit board are arranged to be aligned along a direction (second direction) perpendicular to the first direction with respect to the sensor panel. Furthermore, in the above-mentioned configuration [1], the communication hole provided in the wall is provided so as not to overlap with the portion of the flexible board from the end farthest from the control board in the second direction to the end connected to the control board. This allows the noise generated from the power supply circuit and the interface circuit to be suppressed from propagating to the flexible board through the communication hole. As a result, deterioration of the image quality of the radiation image caused by the noise is suppressed, and the reliability of the radiation imaging device can be improved. Therefore, according to the above-mentioned configuration [1], it is possible to achieve both improvement in reliability and reduction in the dimensions in a planar view.

[0009] [2] The radiation imaging device of [1], wherein the at least one communication hole is arranged so as not to overlap the entire flexible substrate when viewed from the first direction.

[0010] According to the above-mentioned configuration [2], it is possible to more effectively prevent noise generated from the power supply circuit and the interface circuit from propagating to the flexible substrate through the communication hole, thereby further improving the reliability of the radiation imaging device.

[0011] [3] the at least one connecting member has a plurality of connecting members; The radiation imaging device according to [1] or [2], wherein the at least one communication hole has a plurality of communication holes provided corresponding to the plurality of connection members, respectively.

[0012] According to the configuration [3] above, it is possible to increase the amount of signal transmission between the control board and the circuit board while suppressing the propagation of noise generated from the power supply circuit and the interface circuit to the flexible board through the multiple communication holes.

[0013] [4] The control board is equipped with a first FPGA; The radiation imaging device according to any one of [1] to [3], wherein the at least one communication hole is provided so as not to overlap the first FPGA when viewed from the first direction.

[0014] According to the configuration of [4] above, it is possible to prevent noise generated from the power supply circuit and the interface circuit from propagating to the first FPGA through the communication hole, thereby improving the reliability of the first FPGA and, as a result, preventing malfunction of the first FPGA due to the noise.

[0015] [5] the at least one connecting member has a plurality of connecting members; The plurality of connection members include a first connection member disposed on a first side with respect to the first FPGA when viewed from the first direction; A radiation imaging device according to [4], further comprising: a second connection member arranged on a second side of the first FPGA that is different from the first side.

[0016] According to the configuration [5] above, the wiring length between the first FPGA and the first connecting member, and the wiring length between the first FPGA and the second connecting member can be made approximately the same, so that the timing of signal transmission and reception between the first FPGA and the first connecting member, and the timing of signal transmission and reception between the first FPGA and the second connecting member can be made approximately the same.

[0017] [6] The radiation imaging device according to [5], wherein the plurality of connection members are arranged asymmetrically about the first FPGA when viewed from the first direction.

[0018] According to the configuration [6] above, when the control board and the circuit board are connected to each other by the multiple connection members, the orientations of the control board and the circuit board can be easily identified based on the arrangement of the multiple connection members, thereby improving the efficiency of the work of connecting the control board and the circuit board via the multiple connection members.

[0019] [7] A second FPGA is mounted on the circuit board; The radiation imaging device according to any one of [4] to [6], wherein at least a portion of the second FPGA is arranged to overlap with the first FPGA when viewed from the first direction.

[0020] According to the configuration of [7] above, the connection member that connects the control board and the circuit board to each other along the first direction can be connected to the rear surface of the control board near the first FPGA, and to the circuit board near the second FPGA. This makes it possible to shorten the wiring length between the first FPGA and the second FPGA, thereby suppressing the occurrence of delays or distortions in the waveform of the transmission signal between the first FPGA and the second FPGA.

[0021] [8] The radiation imaging device according to any one of [1] to [7], wherein the at least one communication hole is disposed outside a region that linearly connects the flexible substrate and the power supply circuit.

[0022] According to the configuration [8] above, it is possible to more effectively prevent noise generated from the power supply circuit from propagating to the flexible substrate through the communication hole, thereby further improving the reliability of the radiation imaging device.

[0023] [9] Further comprising a connector provided on the circuit board and connected to an external device; the second housing has an opening for exposing the connector to the outside of the second housing; The radiation imaging device according to any one of [1] to [8], wherein the connector is located inside an outer edge of the first housing when viewed from the first direction.

[0024] According to the configuration of [9] above, the radiation imaging device (circuit board) can be connected to an external device via the connector exposed to the outside through the opening of the second housing. Furthermore, since the connector is located inside the outer edge of the first housing when viewed from the first direction, it is possible to suppress an increase in the dimensions of the radiation imaging device in a plan view while adopting the configuration in which the connector is exposed from the second housing as described above.

[0025]

[10] The second housing has a side surface portion extending in the first direction and having the opening portion provided therein, The radiation imaging device according to [9], wherein the side portion is located inside an outer edge of the first housing when viewed from the first direction.

[0026] According to the configuration of

[10] above, since the side surface portion having the opening is located inside the outer edge of the first housing when viewed from the first direction, it is possible to suppress an increase in the size of the radiation imaging device in a plan view while adopting a configuration in which the connector is exposed from the side surface portion, and as a result, it becomes easier to handle the cable connected to the connector.

[0027]

[11] The radiation imaging device of any of [1] to

[10] , wherein the circuit board is fixed to the first housing so that a ground electrode provided on the circuit board is electrically connected to the first housing.

[0028] According to the above configuration

[11] , when the first housing is set to the ground potential, the circuit board can be easily connected to GND.

[0029]

[12] The radiation imaging device according to any one of [1] to

[11] , wherein the circuit board is arranged so as not to overlap with the flexible board when viewed from the first direction.

[0030] According to the configuration of

[12] above, it is possible to more effectively prevent noise generated from the power supply circuit and the interface circuit from propagating to the flexible substrate, thereby further improving the reliability of the radiation imaging device. Effect of the Invention

[0031] An object of one aspect of the present disclosure is to provide a radiation imaging apparatus capable of achieving both improved reliability and reduced dimensions in a plan view. [Brief description of the drawings]

[0032] [Figure 1] 1 is a perspective view of a radiation imaging apparatus according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the radiation imaging apparatus. [Diagram 3] FIG. 2 is an exploded perspective view of the radiation imaging apparatus. [Figure 4] 4 is a cross-sectional view of the radiation imaging device taken along line IV-IV in FIG. [Diagram 5] 2 is a cross-sectional view of the radiation imaging device taken along line VV in FIG. 1. [Figure 6] 6 is a cross-sectional view of the radiation imaging device taken along line VI-VI in FIG. 4. [Figure 7] FIG. 11 is a cross-sectional view of a radiation imaging apparatus according to a second embodiment. [Figure 8] FIG. 11 is a cross-sectional view of a radiation imaging apparatus according to a second embodiment. [Figure 9] 8 is a cross-sectional view of the radiation imaging device taken along line IX-IX in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or equivalent elements will be designated by the same reference numerals, and duplicated descriptions will be omitted. In addition, in the drawings, some features of the embodiment are exaggerated to make them easier to understand. For this reason, the dimensional ratios of each part in the drawings may differ from the actual dimensional ratios.

[0034] [First embodiment] The configuration of a radiation imaging device 1 according to the first embodiment will be described with reference to Figs. 1 to 5. The radiation imaging device 1 is a large area flat panel sensor (X-ray imaging device) used in, for example, a medical X-ray imaging system. As shown in Fig. 1, the radiation imaging device 1 includes a first housing 10 having a substantially rectangular parallelepiped shape, and a second housing 70 having a substantially rectangular parallelepiped shape fixed to the first housing 10. As shown in Figs. 2 and 3, the first housing 10 and the second housing 70 house the respective members constituting the radiation imaging device 1.

[0035] The first housing 10 is a hollow container having a substantially rectangular parallelepiped shape. As shown in FIG. 3 to FIG. 5, the first housing 10 has a top wall 11, a bottom wall 12 (wall portion), a side wall 13, and a plurality of supports 14. The top wall 11 and the bottom wall 12 are both formed in a rectangular plate shape and are arranged to face each other at a distance. In this specification, the direction in which the top wall 11 and the bottom wall 12 face each other (the direction perpendicular to the sensor panel 30 described later) is referred to as the Z-axis direction (first direction). The direction perpendicular to the Z-axis direction (in this embodiment, the short-side direction of the radiation imaging device 1 when viewed from the Z-axis direction) is referred to as the X-axis direction (second direction), and the direction perpendicular to the Z-axis direction and the X-axis direction (in this embodiment, the long-side direction of the radiation imaging device 1 when viewed from the Z-axis direction) is referred to as the Y-axis direction (second direction). The radiation imaging device 1 is arranged so that radiation to be detected (in this embodiment, X-rays) is incident on the top wall 11 along the Z-axis direction. The radiation passes through the top wall 11 and enters a sensor panel 30, which will be described later, and is detected by the radiation imaging device 1.

[0036] The top wall 11 is a rectangular plate member. The top wall 11 is formed of, for example, a material that transmits radiation (for example, carbon fiber, etc.). The top wall 11 guides radiation incident along the Z-axis direction to the inside of the first housing 10. The top wall 11 is located on the side where the radiation is incident. As shown in FIG. 2, a plurality of (32 in this embodiment) through holes 11a are provided in a portion along the outer edge of the top wall 11.

[0037] The bottom wall 12 is a rectangular plate member. The bottom wall 12 is formed of, for example, a material that blocks radiation. The bottom wall 12 is also formed of a material that blocks noise (for example, radiation noise) generated from a power supply circuit 83 and an interface circuit 84 described later. For example, the bottom wall 12 is formed of a metal material having electrical conductivity (for example, iron, aluminum, stainless steel, etc.). In this embodiment, the bottom wall 12 is formed of aluminum. The bottom wall 12 is located on the opposite side to the side where radiation is incident. As shown in Figs. 3 to 5, a plurality of communication holes 12a, 12b, 12c (at least one communication hole) are provided in the approximate center of the bottom wall 12 when viewed from the Z-axis direction. The communication holes 12a to 12c are holes that penetrate the bottom wall 12 in the Z-axis direction so as to communicate the inside of the first housing 10 with the inside of the second housing 70. In this embodiment, the communication holes 12a to 12c are formed in an approximately rectangular shape when viewed from the Z-axis direction. The communication holes 12a, 12b are provided so as to face each other at a distance in the X-axis direction. The communication hole 12c is located between the communication holes 12a, 12b in the X-axis direction. The communication hole 12c is located away from the communication holes 12a, 12b to one side in the Y-axis direction (the lower side in FIG. 3). The communication holes 12a, 12b, 12c are provided corresponding to the connection members 91, 92, 93, respectively, which will be described later. That is, in this embodiment, the connection members 91, 92, 93 pass through the communication holes 12a, 12b, 12c, respectively, independently.

[0038] The bottom wall 12 is provided with a plurality of (four in this embodiment) through holes 12d, a plurality of (twelve in this embodiment) through holes 12e, and a plurality of (ten in this embodiment) screw holes 12f. The through holes 12d are provided at the corners (four corners) of the bottom wall 12. The screw holes 12f are provided so as to surround all of the communication holes 12a to 12c in a rectangular shape.

[0039] The side wall 13 extends along the XZ plane and the YZ plane, and is formed in a rectangular ring shape so as to connect the outer edge of the top wall 11 and the outer edge of the bottom wall 12. The side wall 13 is formed of, for example, a metal material (e.g., iron, aluminum, stainless steel, etc.) that shields radiation. In this embodiment, the side wall 13 is formed of aluminum. The side wall 13 is provided with a plurality of screw holes (not shown) at positions corresponding to the through holes 11a of the top wall 11. The shank of a screw (not shown) is inserted into the through hole 11a and screwed into the screw hole of the side wall 13, thereby fixing the top wall 11 and the side wall 13 to each other.

[0040] The plurality of (11 in this embodiment) support pillars 14 are members for fixing a circuit board 81 and the bottom wall 12, which will be described later, to each other. The support pillars 14 are formed of, for example, a metal material (for example, iron, aluminum, stainless steel, brass, etc.). In this embodiment, the support pillars 14 are formed of brass. One end of the support pillars 14 is fixed to the bottom wall 12. Specifically, a thread is formed in one end of the support pillars 14, and the end is screwed into a screw hole 12g (see FIG. 4) provided in the bottom wall 12. The support pillars 14 are fixed to the bottom wall 12 inside the area surrounded by the screw hole 12f. The support pillars 14 are provided with a screw hole 14a into which a shaft portion of a screw S5, which will be described later, is screwed.

[0041] As shown in Figures 2, 4 and 5, the radiation imaging device 1 has a support member 20, a sensor panel 30, a plurality of (30 in this embodiment) flexible circuit boards 40, a control board 50, and a plurality of (three in this embodiment) radiation shielding boards 60 housed within a first housing 10.

[0042] The support member 20 is a member for supporting (fixing) the sensor panel 30, the control board 50, the radiation shielding board 60, etc., to the first housing 10. In this embodiment, the support member 20 has a base board 21, a plurality of (four in this embodiment) supports 22, a plurality of (sixteen in this embodiment) supports 23, and a plurality of (twelve in this embodiment) supports 24. The supports 22 are fixed to the corners (four corners) of the base board 21 with screws or the like. The supports 23, 24 are formed on the rear surface 21b of the base board 21.

[0043] The base substrate 21 has a support surface 21a that supports the sensor panel 30, and a back surface 21b opposite to the support surface 21a. The base substrate 21 is made of a metal such as iron, aluminum, stainless steel, a tungsten alloy, or copper tungsten. In the present embodiment, as an example, the base substrate 21 is made of relatively lightweight aluminum. The support surface 21a is a surface facing the top wall 11, and the back surface 21b is a surface facing the bottom wall 12. The support surface 21a supports the sensor substrate 31 of the sensor panel 30.

[0044] A recess 21c is provided on the rear surface 21b of the base substrate 21 for arranging a plurality of (three in this embodiment) radiation shielding substrates 60. Each radiation shielding substrate 60 is formed of a radiation shielding material such as lead (hard lead). In this embodiment, rectangular plate-shaped radiation shielding substrates 60 extending in the X-axis direction are provided at the center and both side edges of the recess 21c in the Y-axis direction. The radiation shielding substrates 60 are arranged so as to be spaced apart from each other in the Y-axis direction. Each radiation shielding substrate 60 is arranged in the recess 21c and is adhesively fixed to the bottom surface of the recess 21c via an adhesive member such as double-sided tape.

[0045] The base substrate 21 is fixed to the first housing 10 via a support 22 (see FIG. 2). Specifically, a screw hole 22a is provided in the support 22. The shaft portion of a screw S1 (see FIG. 3) is inserted into the through hole 12d of the bottom wall 12 and screwed into the screw hole 22a of the support 22, thereby fixing the base substrate 21 and the first housing 10 to each other. Furthermore, the base substrate 21 is fixed to the first housing 10 via a support 24. Specifically, the support 24 penetrates the control board 50, and a screw hole 24a is provided at the tip of the support 24. The shaft portion of a screw S2 (see FIG. 3) is inserted into the through hole 12e of the bottom wall 12 and screwed into the screw hole 24a of the support 24, thereby fixing the base substrate 21 and the first housing 10 to each other. As a result, the base substrate 21 is stably supported by the first housing 10.

[0046] The control board 50 is fixed to the rear surface 21b of the base board 21 via a support 23 (see FIG. 5). Specifically, a screw hole is provided at the tip of the support 23. Then, the shaft of a screw S3 (see FIG. 2) is inserted into a through hole provided in the control board 50 and screwed into the screw hole of the support 23, thereby fixing the base board 21 and the control board 50 to each other.

[0047] The sensor panel 30 has a sensor substrate 31 formed in a rectangular plate shape and a scintillator 32. The sensor substrate 31 has a first surface 31a on which a light receiving section (not shown) is formed, and a second surface 31b opposite to the first surface 31a. The first surface 31a faces the top wall 11, and the second surface 31b faces the bottom wall 12. The scintillator 32 is disposed on the light receiving section (first surface 31a). The scintillator 32 is formed by evaporating a scintillator material mainly composed of CsI on the light receiving section. The scintillator 32 converts radiation incident through the top wall 11 into light. Specifically, the scintillator 32 outputs scintillation light of an intensity according to the incident intensity of radiation to the light receiving section.

[0048] The sensor substrate 31 is, for example, a transparent glass substrate. The second surface 31b of the sensor substrate 31 is fixed to the support surface 21a of the base substrate 21, thereby fixing the sensor substrate 31 to the base substrate 21. The second surface 31b is fixed to the support surface 21a via an adhesive member such as a double-sided tape. A plurality of electrode pads (not shown) are formed on the outer edge of one side (left side in FIG. 5) in the X-axis direction of the first surface 31a. A plurality of electrode pads (not shown) are also formed on the outer edge of each of one side (left side in FIG. 4) and the other side (right side in FIG. 4) in the Y-axis direction of the first surface 31a. Each electrode pad is electrically connected to a pixel formed in the light receiving section via wiring or the like. A corresponding flexible circuit board 40 is connected to each electrode pad.

[0049] The flexible circuit board 40 is a circuit member electrically connected to the electrode pads formed on the first surface 31a of the sensor board 31. The flexible circuit board 40 has a flexible substrate 41 that can be deformed, such as by bending, and an IC chip 42 mounted on the flexible substrate 41.

[0050] 4 and 5, the flexible substrate 41 is disposed so as to connect the first surface 31a of the sensor substrate 31 (sensor panel 30) to the back surface 50b of the control substrate 50 via the sides of the sensor panel 30, the support member 20, and the control substrate 50 when viewed from the Z-axis direction. That is, the flexible substrate 41 is curved so as not to interfere with the sensor panel 30, the support member 20, and the control substrate 50. The flexible substrate 41 has a structure in which a circuit pattern made of a conductor foil (e.g., copper, etc.) is formed on a thin-film insulator (e.g., polyimide, etc.). The IC chip 42 is a readout circuit (ROIC: Readout IC) that executes processing for reading out a signal from the sensor panel 30.

[0051] The control board 50 is a circuit board that controls the reading of signals from the sensor panel 30. The control board 50 is disposed at a position facing the back surface 21b of the base board 21. The control board 50 has a main surface 50a and a back surface 50b opposite to the main surface 50a. The main surface 50a faces the sensor panel 30 with the support member 20 and the radiation shielding board 60 sandwiched between them along the Z-axis direction. The back surface 50b faces the bottom wall 12 of the first housing 10. As shown in FIG. 2, in this embodiment, connection ports (connectors) for the flexible boards 41 are provided along three sides of the C-shape excluding one side among the outer edge portion (four sides) of the back surface 50b of the control board 50. Specifically, six flexible boards 41 are connected at approximately equal intervals to the outer edge portion of the back surface 50b on one side (the right side in FIG. 2) in the X-axis direction. Twelve flexible boards 41 are connected at approximately equal intervals to the outer edge portion of the back surface 50b on one side (the upper side in FIG. 2) in the Y-axis direction. Twelve flexible substrates 41 are connected at approximately equal intervals to the outer edge of the back surface 50b on the other side in the Y-axis direction (the lower side in FIG. 2). Light received by the light receiving portion of the sensor substrate 31 is converted into an electrical signal, and the electrical signal is transmitted to the control substrate 50 via the flexible substrates 41.

[0052] The radiation imaging device 1 has a first FPGA 51 mounted on the back surface 50b of the control substrate 50. The first FPGA 51 is a device (FPGA: Field Programmable Gate Array) that integrates gates that allow a user to program the configuration of a logic circuit. The first FPGA 51 has a function of controlling the radiation imaging device 1. As shown in FIG. 6, the first FPGA 51 is mounted at approximately the center of the back surface 50b when viewed from the Z-axis direction. The first FPGA 51 is electrically connected to each flexible substrate 41 by wiring. By mounting the first FPGA 51 at approximately the center of the back surface 50b, the wiring lengths between the first FPGA 51 and each flexible substrate 41 (i.e., connectors provided on the back surface 50b of the control substrate 50 corresponding to each flexible substrate 41) can be made closer to each other. This allows the timing of signal transmission between the first FPGA 51 and each flexible substrate 41 to be made closer to each other. From the viewpoint of bringing the timing of signal transmission closer together, the position at which the first FPGA 51 is mounted on the back surface 50b and the position at which the flexible substrate 41 is connected to the back surface 50b (i.e., the position of the connector) may be adjusted so that the wiring lengths between the first FPGA 51 and each flexible substrate 41 are the same.

[0053] Next, the second housing 70 and each member housed in the second housing 70 will be described with reference to FIGS.

[0054] The second housing 70 is a hollow container having a substantially rectangular parallelepiped shape. The second housing 70 has a bottom wall 71, a side portion 72, and a flange portion 73. The second housing 70 is provided at a position facing the rear surface 50b of the control board 50 across the bottom wall 12 of the first housing 10. The bottom wall 71, the side portion 72, and the flange portion 73 are formed of, for example, the same metal material (e.g., iron, aluminum, stainless steel, etc.) as the bottom wall 12. In this embodiment, the bottom wall 71, the side portion 72, and the flange portion 73 are formed of aluminum. The bottom wall 71 is a rectangular plate member. The bottom wall 71 is provided at a position facing the bottom wall 12 of the first housing 10 via a member accommodated in the second housing 70.

[0055] The side portion 72 is connected to the outer edge of the bottom wall 71 and is formed in a rectangular ring shape. The side portion 72 extends along the XZ plane and the YZ plane. That is, the side portion 72 extends along the Z-axis direction. The surface of the side portion 72 on one side in the X-axis direction (the right side in FIG. 3) is provided with openings 72a, 72b, and 72c aligned along the Y-axis direction. The opening 72a is a hole that exposes a part of an interface circuit 84 (for example, a part of an RJ-45 connector) to the outside of the second housing 70, which will be described later. The opening 72b is a hole that exposes a connector 88 to the outside of the second housing 70, which will be described later. The opening 72c is a hole that exposes a connector 89 to the outside of the second housing 70, which will be described later. The openings 72a, 72b, and 72c may be cutouts.

[0056] The flange portion 73 extends from the edge of the side surface portion 72 toward the outside of the side surface portion 72 and is formed in a rectangular ring shape. The flange portion 73 extends along the XY plane. The flange portion 73 is provided with a plurality of through holes 73a (10 in this embodiment).

[0057] The shaft of the screw S4 (see FIG. 1) is inserted into the through hole 73a and screwed into the screw hole 12f provided in the bottom wall 12, thereby fixing the second housing 70 and the first housing 10 to each other. The second housing 70 is fixed to the bottom wall 12 of the first housing 10 so as to cover the support 14 of the first housing 10 and the communication holes 12a, 12b, and 12c provided in the bottom wall 12. In the X-axis direction, the length of the second housing 70 is shorter than the length of the first housing 10. Also, in the Y-axis direction, the length of the second housing 70 is shorter than the length of the first housing 10. That is, when viewed from the Z-axis direction, the dimension of the second housing 70 is smaller than the dimension of the first housing 10, and the second housing 70 (side surface portion 72) is located inside the outer edge of the first housing 10 when viewed from the Z-axis direction.

[0058] As shown in Figures 3 to 5, the radiation imaging device 1 has circuit boards 81, 82, a power supply circuit 83, an interface circuit 84, a second FPGA 85, multiple (in this embodiment, four) support pillars 86, multiple connectors 87 (in this embodiment, two) that electrically connect the circuit boards 81, 82 to each other, and connectors 88, 89 that are connected to the outside, all contained within the second housing 70.

[0059] The circuit board 81 is formed in a rectangular plate shape. A power supply circuit 83 is mounted on the circuit board 81. The circuit board 81 has a first surface 81a and a second surface 81b opposite to the first surface 81a. The circuit board 81 is accommodated in the second housing 70 so that the first surface 81a faces the bottom wall 12 of the first housing 10 (i.e., the second surface 81b faces the bottom wall 71 of the second housing 70). A plurality of (11 in this embodiment) through holes 81c are provided in a portion along the outer edge of the circuit board 81 and in a central portion of the circuit board 81. The shaft portion of the screw S5 (see FIG. 4) is inserted into the through hole 81c and screwed into the screw hole 14a (see FIG. 3) provided at the tip of the support 14, thereby fixing the circuit board 81 and the first housing 10 to each other. As a result, the support posts 14 are in contact with the ground electrode G provided on the first surface 81a of the circuit board 81. For example, the ground electrode G is formed around each through hole 81c, and when the circuit board 81 is fixed to the support posts 14, the tips of the support posts 14 come into contact with the ground electrodes G. In other words, the circuit board 81 is fixed to the first housing 10 such that the ground electrodes G provided on the circuit board 81 are electrically connected to the first housing 10.

[0060] The circuit board 82 is formed in a rectangular plate shape. An interface circuit 84 is mounted on the circuit board 82. The circuit board 82 has a first surface 82a and a second surface 82b opposite to the first surface 82a. The circuit board 82 is accommodated in the second housing 70 such that the first surface 82a faces the bottom wall 71 of the second housing 70 across the circuit board 81. In the X-axis direction, the length of the circuit board 82 is shorter than the length of the circuit board 81. In addition, in the Y-axis direction, the length of the circuit board 82 is shorter than the length of the circuit board 81. That is, when viewed from the Z-axis direction, the size of the circuit board 82 is smaller than the size of the circuit board 81. The first surface 82a faces the first surface 81a of the circuit board 81, and the second surface 82b faces the bottom wall 12 of the first housing 10. The circuit board 82 is fixed to the circuit board 81 via a plurality of support posts 86 (in this embodiment, four support posts provided at the four corners of the first surface 82a) provided on the first surface 82a. The support posts 86 are made of a metal material (e.g., iron, aluminum, stainless steel, brass, etc.). In this embodiment, the support posts 86 are made of brass.

[0061] Next, a method of fixing the circuit board 81 and the circuit board 82 to each other will be specifically described. A through hole (not shown) is provided in the circuit board 82, and a shaft portion of a screw (not shown) is inserted into the through hole from the second surface 82b side. Then, the screw is screwed into the support 86, thereby fixing the support 86 to the circuit board 82. Furthermore, a plurality of (four in this embodiment) through holes 81e are provided in the circuit board 81, and a shaft portion of a screw (not shown) is inserted into the through hole 81e from the second surface 81b side. Then, the screw is screwed into the support 86, thereby fixing the support 86 to the circuit board 81. In this way, the circuit board 81 and the circuit board 82 are fixed to each other. At this time, a tip of at least one support 86 comes into contact with an electrode (not shown) formed around at least one corresponding through hole 81e. The electrode is electrically connected to a ground electrode G in the circuit board 81, which is electrically connected to the first housing 10. As a result, the circuit board 82 is electrically connected to the first housing 10 via the circuit board 81 .

[0062] The power supply circuit 83 is a circuit for supplying power to the control board 50. The power supply circuit 83 includes elements such as a DC / DC converter and an inductor coil. The DC / DC converter is a device that converts a direct current voltage to a direct current voltage by switching control. The inductor coil is a passive element that can store energy in a magnetic field formed by a flowing current. The power supply circuit 83 configured in this manner can be a source of noise. The power supply circuit 83 is provided on most of the second surface 81b of the circuit board 81 except for the outer edge portion.

[0063] The interface circuit 84 is a circuit for outputting a signal (e.g., an electrical signal corresponding to radiation detected by the sensor panel 30) from the control board 50 to an external PC device (e.g., a device for displaying a radiation image, etc.). The interface circuit 84 includes, for example, a device (Ethernet (registered trademark) PHY) for implementing a physical layer in a network protocol, an RJ (Registered Jack)-45 connector which is an Ethernet (registered trademark) connector, and the like. The interface circuit 84 configured in this manner can be a source of noise. The interface circuit 84 is provided at one corner (the lower right corner in FIG. 3) of the first surface 82a of the circuit board 82. When the circuit board 82 is fixed to the circuit board 81, a part of the interface circuit 84 (e.g., a part of the RJ-45 connector) is located in a notch 81d provided in the circuit board 81. That is, when the circuit boards 81 and 82 are fixed to each other, the interface circuit 84 is arranged at the position where the notch 81d is provided, so that the interface circuit 84 does not interfere with the circuit board 81. A part of the interface circuit 84 (for example, a part of the RJ-45 connector) is exposed to the outside of the second housing 70 through an opening 72a provided in the side surface portion 72 of the second housing 70.

[0064] 4 and 5, the circuit boards 81, 82, the power supply circuit 83, and the interface circuit 84 overlap with the central portion of the back surface 50b of the control board 50 when viewed from the Z-axis direction, but do not overlap with the outer edge portion of the back surface 50b of the control board 50. Due to this arrangement, the circuit boards 81, 82, the power supply circuit 83, and the interface circuit 84 do not overlap with the flexible board 41 connected to the outer edge portion of the back surface 50b of the control board 50 when viewed from the Z-axis direction.

[0065] The second FPGA 85 is a device (FPGA: Field Programmable Gate Array) that integrates gates that allow a user to program the configuration of a logic circuit. The second FPGA 85 has a function of controlling an interface that complies with Gigabit Ethernet (GigE: Gigabit Ethernet (registered trademark)). As shown in FIG. 4, the second FPGA 85 is mounted on the second surface 82b of the circuit board 82. The second FPGA 85 is provided so as not to overlap any of the communication holes 12a to 12c provided in the bottom wall 12 of the first housing 10 when viewed from the Z-axis direction. This prevents noise from the second FPGA 85 from propagating to the control board 50 side through the communication holes 12a to 12c even if the second FPGA 85 becomes a noise source. In this embodiment, the second FPGA 85 is disposed at a position that does not overlap the first FPGA 51 when viewed from the Z-axis direction.

[0066] The connector 87 is connected to the first surface 81a of the circuit board 81 and the first surface 82a of the circuit board 82. Signals are transmitted and received between the circuit boards 81 and 82 via the connector 87.

[0067] The connectors 88 and 89 are provided at an end of a first surface 81a of the circuit board 81 on one side in the X-axis direction (the left side in FIG. 5). The connector 88 is exposed to the outside of the second housing 70 through an opening 72b provided in the side surface portion 72 of the second housing 70. The connector 89 is exposed to the outside of the second housing 70 through an opening 72c provided in the side surface portion 72 of the second housing 70. The connectors 88 and 89 are located inside the outer edge of the first housing 10 when viewed from the Z-axis direction.

[0068] The radiation imaging device 1 has connection members 91, 92, and 93 for electrically connecting the control board 50 and the circuit boards 81 and 82. The connection members 91 to 93 will be described in detail with reference to FIGS. 4 to 6. The connection member 91 (first connection member) has a pair of connection members 91A and 91B. The connection members 91A and 91B are BtoB connectors (board-to-board connectors composed of a plurality of pins) that can be connected to each other along the Z-axis direction. The connection member 92 (second connection member) has a pair of connection members 92A and 92B. The connection members 92A and 92B are BtoB connectors that can be connected to each other along the Z-axis direction. The connection member 93 has a pair of connection members 93A and 93B. The connection members 93A and 93B are BtoB connectors that can be connected to each other along the Z-axis direction.

[0069] The connection members 91A, 92A, and 93A are connected to an approximately central portion of the rear surface 50b of the control board 50. The connection member 91A is disposed on a first side (one side in the X-axis direction (left side in FIG. 6) in this embodiment) with respect to the first FPGA 51 when viewed from the Z-axis direction. The connection member 92A is disposed on a second side (the other side in the X-axis direction (right side in FIG. 6) in this embodiment) different from the first side with respect to the first FPGA 51 when viewed from the Z-axis direction. In this embodiment, as an example, the connection members 91A and 92A sandwich the first FPGA 51 in the X-axis direction. Specifically, the connection members 91A and 92A sandwich half of the lower side (lower side in FIG. 6) of the first FPGA 51 in the X-axis direction. In this embodiment, the distances between the first FPGA 51 and the connection members 91A and 92A in a plan view are substantially the same, so that the wiring length between the first FPGA 51 and the connection member 91A and the wiring length between the first FPGA 51 and the connection member 92A are substantially the same. The connection member 93A is located between the connection members 91A and 92A in the X-axis direction. The connection member 93A is spaced from the connection members 91A and 92A to one side (the lower side in FIG. 6) in the Y-axis direction. The connection members 91A to 93A are arranged in a C-shape surrounding the first FPGA 51 when viewed from the Z-axis direction. That is, the connection members 91A to 93A are arranged asymmetrically with respect to a point around the first FPGA 51 when viewed from the Z-axis direction.

[0070] The connection members 91B, 92B, and 93B are connected to the first surface 81a of the circuit board 81. The connection members 91B, 92B, and 93B are disposed at positions corresponding to the connection members 91A, 92A, and 93A, respectively. In this embodiment, the connection members 91B to 93B are disposed in a C-shape so as to overlap the connection members 91A to 93A, respectively, when viewed from the Z-axis direction.

[0071] Next, the roles of the connection members 91 to 93 will be described. Image data and UART (Universal Asynchronous Receiver Transmitter) signals are transmitted and received between the control board 50 and the second FPGA 85 via the connection members 91 and 92. A signal for controlling an LED for displaying a status state is transmitted from the control board 50 to the circuit board 81 via the connection member 93. I / O signals are transmitted and received between the first FPGA 51 and an external device via the connection member 93 and the connector 89. A signal for controlling the power supply circuit 83 is transmitted from the control board 50 to the power supply circuit 83 via the connection member 93.

[0072] Next, the positional relationship between the communication holes 12a to 12c and each member in the radiation imaging device 1 will be described. In FIG. 6, the communication holes 12a to 12c are illustrated in a schematic manner. As shown in FIG. 6, the communication holes 12a to 12c are provided so as not to overlap a portion 41a of the flexible substrate 41 from an end 41b (i.e., a folded end of the flexible substrate 41) farthest from the control substrate 50 in the X-axis direction or Y-axis direction (second direction) perpendicular to the Z-axis direction to an end 41c connected to the control substrate 50 (a connector provided on the back surface 50b). As shown in FIG. 4 and FIG. 5, the flexible substrate 41 extends from the first surface 31a of the sensor substrate 31 toward the side wall 13 of the first housing 10, curves midway, and extends toward the back surface 50b of the control substrate 50. By bending the flexible substrate 41 in this way, a folded end 41b of the flexible substrate 41 is formed on the side of the control substrate 50 as shown in FIG. 6. In other words, the end 41b of one flexible substrate 41 is the end of the flexible substrate 41 that is farthest from the side surface of the control substrate 50 that the flexible substrate 41 faces in a direction perpendicular to the side surface. The portion 41a of the flexible substrate 41 is a portion that extends from the end 41b to a connection portion (connector) on the back surface 50b of the control substrate 50. In other words, the portion 41a is a portion that can be seen when the flexible substrate 41 is viewed from the bottom wall 12 side along the Z-axis direction. In this embodiment, the communication holes 12a to 12c are provided so as not to overlap the entire flexible substrates 41 when viewed from the Z-axis direction.

[0073] As shown in Figs. 4 and 5, the communication holes 12a to 12c are located outside the region R that linearly connects the flexible substrate 41 and the power supply circuit 83. The region R that linearly connects the flexible substrate 41 and the power supply circuit 83 is a set of lines that connect any point on the flexible substrate 41 and any point on the power supply circuit 83. Figs. 4 and 5 show the outer edge of the cross section of the region R. As described above, since the communication holes 12a to 12c are located outside the region R, even if noise generated from the power supply circuit 83 propagates radially, the noise traveling toward the flexible substrate 41 is blocked by the bottom wall 12 of the first housing 10, so that the influence of the noise on the flexible substrate 41 can be further suppressed. Furthermore, in this embodiment, the communication holes 12a to 12c are also located outside the region (not shown) that linearly connects the flexible substrate 41 and the interface circuit 84. The region is a set of straight lines connecting any point on the flexible substrate 41 and any point on the interface circuit 84. As a result, even if noise generated from the interface circuit 84 propagates radially, the noise traveling toward the flexible substrate 41 is shielded by the bottom wall 12 of the first housing 10, so that the influence of the noise on the flexible substrate 41 can be suppressed. In addition, from the viewpoint of more effectively suppressing the influence of noise caused by the circuit elements (power supply circuit 83, interface circuit 84, etc.) included in the above-mentioned circuit substrate 81, the communication holes 12a to 12c may be located outside the region connecting the flexible substrate 41 and the circuit substrate 82 in a straight line. Similarly, the communication holes 12a to 12c may be located outside the region connecting the flexible substrate 41 and the circuit substrate 82 in a straight line.

[0074] [Effects] In the radiation imaging device 1 described above, the main surface 50a of the control board 50 faces the sensor panel 30, and the second housing 70 housing the circuit boards 81 and 82 faces the back surface 50b of the control board 50 across the bottom wall 12 of the first housing 10. That is, the control board 50, the circuit board 81 on which the power supply circuit 83 is mounted, and the circuit board 82 on which the interface circuit 84 is mounted are arranged to be aligned along the Z-axis direction with respect to the sensor panel 30. This makes it possible to reduce the size in a plan view (i.e., the area occupied by the radiation imaging device 1 when viewed from the Z-axis direction) compared to a case in which the control board 50 and the circuit boards 81 and 82 are arranged to be aligned along a direction perpendicular to the Z-axis direction with respect to the sensor panel 30 (for example, the X-axis direction or the Y-axis direction). Furthermore, the communication holes 12a to 12c provided in the bottom wall 12 are provided so as not to overlap the portion 41a of the flexible board 41 when viewed from the Z-axis direction. This makes it possible to suppress the noise generated from the power supply circuit 83 and the interface circuit 84 from propagating through the communication holes 12a-12c to the flexible substrate 41. As a result, deterioration in image quality of the radiographic image caused by the noise is suppressed, thereby improving the reliability of the radiographic imaging device 1. Therefore, with the above-described configuration, it is possible to simultaneously improve the reliability of the radiographic imaging device 1 and reduce the dimensions of the radiographic imaging device 1 in a planar view.

[0075] Furthermore, in this embodiment, the communication holes 12a to 12c are provided so as not to overlap with the entire flexible substrates 41 when viewed from the Z-axis direction. That is, the communication holes 12a to 12c are provided so as not to overlap not only the portion 41a directly facing the bottom wall 12 in the Z-axis direction, but also the portion 41d located on the opposite side of the portion 41a with respect to the end portion 41b (i.e., the portion from the end portion 41b to the connection portion of the first surface 31a of the sensor substrate 31). Here, not only the bottom wall 12 but also each member supported by the support member 20 is interposed between the portion 41d and the circuit substrates 81 and 82. For this reason, if the connection portion between portion 41d and sensor board 31 (first surface 31a) is provided to be located more inward than the connection portion between portion 41a and control board 50 (rear surface 50b), even if communication holes 12a-12c are provided so as not to overlap portion 41a in the Z-axis direction but to overlap portion 41d, it is considered that the degree to which radiation noise from circuit elements mounted on circuit boards 81, 82 affects portion 41d is low. On the other hand, in the case where communication holes 12a-12c are provided so as to overlap portion 41d as described above, it cannot be said that the noise does not affect portion 41d at all. Therefore, according to the above-mentioned configuration in which the communication holes 12a to 12c are provided so as not to overlap the entire flexible substrate 41 (i.e., both the portion 41a and the portion 41d), it is possible to more effectively prevent noise generated from the power supply circuit 83 and the interface circuit 84 from propagating to the flexible substrate 41 (the portion 41a and the portion 41d) through the communication holes 12a to 12c. As a result, the reliability of the radiation imaging device 1 can be further improved.

[0076] Moreover, the radiation imaging device 1 has connection members 91-93, and the communication holes 12a-12c are provided corresponding to the connection members 91-93, respectively. According to the above configuration, it is possible to increase the amount of signal transmission between the control board 50 and the circuit boards 81, 82, while suppressing the propagation of noise generated from the power supply circuit 83 and the interface circuit 84 to the flexible board 41 via the communication holes 12a-12c.

[0077] Further, the first FPGA 51 is mounted on the control board 50, and the communication holes 12a to 12c are provided so as not to overlap with the first FPGA 51 when viewed from the Z-axis direction. With the above configuration, it is possible to prevent noise generated from the power supply circuit 83 and the interface circuit 84 from propagating to the first FPGA 51 through the communication holes 12a to 12c. This makes it possible to improve the reliability of the first FPGA 51, and as a result, it is possible to prevent malfunction of the first FPGA 51 caused by the noise.

[0078] Moreover, when viewed from the Z-axis direction, the connection member 91 (connection member 91A) is disposed on a first side with respect to the first FPGA 51, and the connection member 92 (connection member 92A) is disposed on a second side with respect to the first FPGA 51, which is different from the first side. In the present embodiment, as an example, the connection member 91 and the connection member 92 are disposed to face each other with the first FPGA 51 in between. According to the above configuration, the wiring length between the first FPGA 51 and the connection member 91 (connection member 91A) and the wiring length between the first FPGA 51 and the connection member 92 (connection member 92A) can be made substantially the same, so that the timing of signal transmission and reception between the first FPGA 51 and the connection member 91 (connection member 91A) and the timing of signal transmission and reception between the first FPGA 51 and the connection member 92 (connection member 92A) can be made substantially the same.

[0079] Moreover, the connection members 91-93 (connection members 91A-93A) are arranged asymmetrically about the first FPGA 51 when viewed from the Z-axis direction. According to the above configuration, when the control board 50 and the circuit board 81 are connected to each other by the connection members 91-93, the orientations of the control board 50 and the circuit board 81 can be easily identified based on the arrangement of the connection members 91-93. Therefore, the efficiency of the work of connecting the control board 50 and the circuit board 81 via the connection members 91-93 can be improved.

[0080] Furthermore, the communication holes 12a to 12c are located outside the region R that linearly connects the flexible substrate 41 and the power supply circuit 83. With the above configuration, it is possible to more effectively prevent noise generated from the power supply circuit 83 from propagating to the flexible substrate 41 via the communication holes 12a to 12c. As a result, it is possible to further improve the reliability of the radiation imaging device 1.

[0081] The radiation imaging device 1 also includes connectors 88, 89 provided on the circuit board 81. The second housing 70 has a side surface portion 72 that extends in the Z-axis direction and has openings 72b, 72c for exposing the connectors 88, 89 to the outside of the second housing 70. The side surface portion 72 is located inside the outer edge of the first housing 10 when viewed from the Z-axis direction. According to the above configuration, the radiation imaging device 1 (circuit board 81) can be connected to an external device via the connectors 88, 89 exposed to the outside through the openings 72b, 72c of the side surface portion 72 of the second housing 70. Furthermore, since the side surface portion 72 is located inside the outer edge of the first housing 10 when viewed from the Z-axis direction, it is possible to suppress an increase in the dimensions of the radiation imaging device 1 in a plan view while adopting a configuration in which the connectors 88, 89 are exposed from the side surface portion 72 as described above. Furthermore, by providing the connection ports (openings) of the connectors 88, 89 on the side surface portion 72 of the second housing 70 instead of on the bottom wall 71, it is possible to prevent the overall device from becoming large in length along the Z-axis direction.

[0082] Further advantages of the above-mentioned configuration in which the connectors 88, 89 are exposed from the side surface portion 72 of the second housing 70 will be specifically described. The radiation imaging device 1 is mounted on, for example, a dental CT (Computed Tomography). When the CT is used to capture an image of the patient's chin, if the dimensions of the radiation imaging device 1 in a plan view become large, the radiation imaging device 1 may come into contact with the patient's shoulder. Conventionally, for example, the connectors 88, 89 are exposed from the side wall 13 of the first housing 10, and therefore it is necessary to devise a way of routing the cables so that the dimensions of the entire device, including the cables connected to the connectors 88, 89, in a plan view do not become large. In contrast, in the radiation imaging device 1, it is easy to arrange the cables in a space outside the side surface portion 72 and inside the outer edge (side wall 13) of the first housing 10 so that the cables do not protrude outside the outer edge of the first housing 10 (or so that the amount of protrusion is small even if the cables protrude). In other words, according to the radiation imaging device 1, while adopting a configuration in which the connectors 88, 89 are exposed from the side portion 72, it is possible to suppress an increase in the dimensions of the radiation imaging device 1 in a planar view, and by utilizing the above-mentioned space, it is possible to facilitate the handling of cables.

[0083] In the radiation imaging device 1, the openings 72b, 72c are provided in the side surface portion 72, but the positions at which the openings 72b, 72c are provided are not limited to the side surface portion 72. In other words, the openings 72b, 72c may be provided in the second housing 70. For example, the openings 72b, 72c may be provided in the bottom wall 71. Even in this case, it is possible to adopt a configuration in which the connectors 88, 89 are exposed from the second housing 70, while suppressing an increase in the dimensions of the radiation imaging device 1 in a plan view.

[0084] Moreover, the circuit board 81 is fixed to the first housing 10 (the support pillars 14) so ​​that the ground electrode G provided on the circuit board 81 is electrically connected to the first housing 10 (the support pillars 14). According to the above configuration, when the first housing 10 is set to the ground potential, the circuit board 81 can be easily connected to GND. Furthermore, by fixing the circuit board 81 to the first housing 10 via the support pillars 14, the positional relationship between the control board 50 housed in the first housing 10 and the circuit board 81 housed in the second housing 70 can be stabilized.

[0085] Moreover, the circuit boards 81 and 82 are arranged so as not to overlap with the flexible board 41 when viewed from the Z-axis direction. By arranging the circuit boards 81 and 82, which include circuit elements that are noise sources, so as not to overlap with the flexible board 41 in the Z-axis direction in this manner, it is possible to more effectively prevent noise caused by the circuit boards 81 and 82 from propagating to the flexible board 41. As a result, it is possible to further improve the reliability of the radiation imaging device 1.

[0086] [Second embodiment] The configuration of a radiation imaging device 1A according to the second embodiment will be described with reference to Figures 7, 8, and 9. The radiation imaging device 1A differs from the radiation imaging device 1 in that it does not have a circuit board 82 (i.e., the number of circuit boards is one), that the second FPGA 85 overlaps with the first FPGA 51 when viewed from the Z-axis direction, and that it does not have a connecting member 93 (i.e., the number of connecting members is two). The following mainly describes the parts of the configuration of the radiation imaging device 1A that differ from the radiation imaging device 1.

[0087] The radiation imaging device 1A has a plurality of (seven in this embodiment) flexible substrates 41 (flexible circuit boards 40). In this embodiment, the seven flexible substrates 41 are connected at approximately equal intervals to the outer edge of one side (upper side in FIG. 9) in the Y-axis direction of the rear surface 50b of the control substrate 50.

[0088] The power supply circuit 83 and the interface circuit 84 are provided on the second surface 81b of the circuit board 81. The second FPGA 85 is provided on the first surface 81a of the circuit board 81. That is, in this embodiment, the power supply circuit 83, the interface circuit 84, and the second FPGA 85 are provided on one circuit board 81. In this embodiment, at least a portion of the second FPGA 85 (in this embodiment, substantially the entirety) is disposed so as to overlap with the first FPGA 51 when viewed from the Z-axis direction.

[0089] The connection members 91B and 92B are connected to the first surface 81a of the circuit board 81. The connection members 91B and 92B are disposed at positions corresponding to the connection members 91A and 92A, respectively. The connection members 91B and 92B sandwich the second FPGA 85 in the Y-axis direction. In this embodiment, the connection members 91B and 92B are disposed so as to overlap the connection members 91A and 92A, respectively, when viewed from the Z-axis direction.

[0090] In the radiation imaging device 1A, image data and UART signals are transmitted and received between the control board 50 and the second FPGA 85 via the connection member 91. A signal for controlling an LED for displaying a status state is transmitted from the control board 50 to the circuit board 81 via the connection member 92. An I / O signal is transmitted and received between the first FPGA 51 and an external device via the connection member 92 and the connector 89. A signal for controlling the power supply circuit 83 is transmitted from the control board 50 to the power supply circuit 83 via the connection member 92.

[0091] Next, the positional relationship between the communication holes 12a, 12b and each member in the radiation imaging device 1A will be described. In Fig. 9, the communication holes 12a, 12b are illustrated in a schematic manner. As in the first embodiment, the communication holes 12a, 12b are provided so as not to overlap with the portion 41a of each flexible substrate 41 when viewed from the Z-axis direction. In this embodiment, as in the first embodiment, the communication holes 12a, 12b are provided so as not to overlap with the entirety of each flexible substrate 41 when viewed from the Z-axis direction.

[0092] In the radiation imaging apparatus 1A described above, the configuration common to the radiation imaging apparatus 1 according to the first embodiment also achieves the same effects as those of the radiation imaging apparatus 1 according to the first embodiment.

[0093] Moreover, in the radiation imaging device 1A, at least a portion of the second FPGA 85 overlaps with the first FPGA 51 when viewed from the Z-axis direction. According to the above configuration, the connection members 91, 92 that connect the control board 50 and the circuit board 81 to each other along the Z-axis direction can be connected to the rear surface 50b of the control board 50 near the first FPGA 51 and connected to the circuit board 81 near the second FPGA 85. This makes it possible to shorten the wiring length between the first FPGA 51 and the second FPGA 85, thereby suppressing the occurrence of delay or distortion of the transmission signal waveform between the first FPGA 51 and the second FPGA 85.

[0094] [Variations] The present disclosure is not limited to the above-mentioned embodiments. The materials and shapes of the above-mentioned components are not limited to the above-mentioned materials and shapes, and various materials and shapes can be adopted. In addition, some of the components included in the above-mentioned embodiments may be omitted or modified as appropriate. For example, some characteristic components included in the above-mentioned embodiments and some effects exerted by each component have been described, but the radiation imaging device according to the present disclosure does not necessarily need to be configured to exert all the effects described in the above-mentioned embodiments, and may be configured to exert only some of the effects described in the above-mentioned embodiments. In the latter case, the radiation imaging device only needs to have a configuration essential for exerting at least the part of the effect, and the configuration that is not essential for exerting the part of the effect may be omitted or modified as appropriate. Note that, when focusing on one effect, the configuration essential for exerting the one effect should be reasonably understood based on technical common sense and the description of this specification, based on the standard of a person skilled in the art. Below, some specific modified examples of the radiation imaging device of the present disclosure are illustrated.

[0095] In each of the above-described embodiments, the flexible substrate 41 extends from the first surface 31a of the sensor substrate 31 toward the side wall 13 of the first housing 10, curves midway, and extends toward the rear surface 50b of the control substrate 50, but the flexible substrate 41 is not limited to the above-described form. For example, the flexible substrate 41 may extend in a substantially straight line.

[0096] In the second embodiment, the connection members 91A and 92A sandwich the first FPGA 51 in the Y-axis direction, but the arrangement of the connection members 91A and 92A is not limited to the above. For example, the connection member 91A may be arranged on one side (the left side in FIG. 9) of the first FPGA 51 in the X-axis direction, and the connection member 92A may be arranged on one side (the lower side in FIG. 9) of the first FPGA 51 in the Y-axis direction. That is, the connection members 91A and 92A may be arranged in an L-shape when viewed from the Z-axis direction. Even in this case, the wiring length between the first FPGA 51 and the connection member 91 (connection member 91A) and the wiring length between the first FPGA 51 and the connection member 92 (connection member 92A) can be made substantially the same.

[0097] In the first embodiment, the control board 50 and the circuit board 81 are connected by the connection members 91 to 93, and in the second embodiment, the control board 50 and the circuit board 81 are connected by the connection members 91 and 92. However, the number of connection members connecting the control board 50 and the circuit board 81 may be one or four or more. The number of communication holes provided in the bottom wall 12 may be determined according to the number of connection members, and may be one or four or more. In addition, each of the connection members 91 to 93 is a separate type connector formed in a column shape extending along the Z-axis direction, but each of the connection members 91 to 93 may be an integrated type connection member. In this case, each of the connection members 91 to 93 may be formed by, for example, a flexible substrate. In addition, in each of the above embodiments, the connection members and the communication holes have a one-to-one relationship, but a configuration may be such that multiple connection members pass through one communication hole.

[0098] In each of the above-described embodiments, the flange portion 73 is provided on the edge of the side surface portion 72 of the second housing 70, and an opening is formed by the edge of the side surface portion 72, but the second housing 70 may be a box-shaped member with the opening closed. That is, the second housing 70 may have a wall portion provided at a position opposite the bottom wall 71 to close the opening. In such a case, it is sufficient that the wall portion has communication holes communicating with the communication holes 12a to 12c provided in the bottom wall 12 of the first housing 10, for example.

[0099] The first housing 10 or the second housing 70 may be provided with a sheet for shielding electromagnetic waves (noise). For example, an electromagnetic wave shielding sheet may be provided on both or either of the inner and outer surfaces of the bottom wall 12 of the first housing 10. In addition, when the second housing 70 has the above-mentioned wall portion (the wall portion facing the bottom wall 12), an electromagnetic wave shielding sheet may be provided on both or either of the inner and outer surfaces of the wall portion of the second housing 70. By providing a sheet having an electromagnetic wave shielding effect on the wall portion of the first housing 10 or the second housing 70 arranged between the control board 50 and the circuit board 81 as described above, the influence of noise on the flexible board 41 can be suppressed more effectively. [Explanation of symbols]

[0100] 1, 1A...radiation imaging device, 10...first housing, 12...bottom wall (wall portion), 12a to 12c...communicating hole (at least one communicating hole), 30...sensor panel, 41...flexible substrate, 41a...portion, 41b, 41c...end portion, 50...control substrate, 50a...main surface, 50b...rear surface, 51...first FPGA, 70...second housing, 72...side portion, 72b, 72c...opening, 81, 82...circuit board, 83...power supply circuit, 84...interface circuit, 85...second FPGA, 88, 89...connector, 91...connecting member (first connecting member), 92...connecting member (second connecting member), 93...connecting member, 91A, 91B, 92A, 92B, 93A, 93B...connecting members, G...ground electrode, R...area.

Claims

1. A sensor panel for detecting radiation; a control board having a main surface facing the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite to the main surface, the control board controlling reading of signals from the sensor panel; a flexible substrate disposed to connect the sensor panel and the rear surface of the control substrate via a side of the control substrate when viewed from the first direction; a circuit board on which a power supply circuit for supplying power to the control board and an interface circuit for outputting a signal from the control board to the outside are mounted; a first housing that houses the sensor panel, the control board, and the flexible board and has a wall portion that faces the back surface of the control board; a second housing that is provided at a position facing the rear surface of the control board across the wall portion and that houses the circuit board; at least one connection member electrically connecting the control board and the circuit board; Equipped with the wall portion is provided with at least one communication hole that communicates between an interior of the first housing and an interior of the second housing; the at least one connection member is connected to the control board and the circuit board via the at least one communication hole; A radiation imaging device, wherein when viewed from the first direction, the at least one communication hole is arranged so as not to overlap with a portion of the flexible substrate from the end farthest from the control substrate in a second direction perpendicular to the first direction to the end connected to the control substrate.

2. The at least one communication hole is provided so as not to overlap the entire flexible substrate when viewed from the first direction. The radiation imaging apparatus according to claim 1 .

3. The at least one connecting member includes a plurality of connecting members, The at least one communication hole includes a plurality of communication holes provided corresponding to the plurality of connection members, respectively.

3. The radiation imaging apparatus according to claim 1.

4. a first FPGA is mounted on the control board; the at least one communication hole is provided so as not to overlap the first FPGA when viewed from the first direction; 3. The radiation imaging apparatus according to claim 1.

5. The at least one connecting member includes a plurality of connecting members, The plurality of connection members include a first connection member disposed on a first side with respect to the first FPGA when viewed from the first direction; a second connection member disposed on a second side different from the first side with respect to the first FPGA; The radiation imaging apparatus according to claim 4 .

6. the plurality of connection members are arranged asymmetrically about the first FPGA when viewed from the first direction; The radiation imaging apparatus according to claim 5 .

7. a second FPGA is mounted on the circuit board; At least a portion of the second FPGA is arranged to overlap the first FPGA when viewed from the first direction. The radiation imaging apparatus according to claim 4 .

8. the at least one communication hole is disposed outside a region that linearly connects the flexible substrate and the power supply circuit; 3. The radiation imaging apparatus according to claim 1.

9. A connector is provided on the circuit board and connected to an external device. the second housing has an opening for exposing the connector to the outside of the second housing; The connector is located inside an outer edge of the first housing when viewed from the first direction.

3. The radiation imaging apparatus according to claim 1.

10. the second housing extends in the first direction and has a side surface in which the opening is provided, The side surface portion is located inside an outer edge of the first housing when viewed from the first direction. The radiation imaging apparatus according to claim 9 .

11. the circuit board is fixed to the first housing such that a ground electrode provided on the circuit board is electrically connected to the first housing; 3. The radiation imaging apparatus according to claim 1.

12. The circuit board is disposed so as not to overlap the flexible board when viewed from the first direction.

3. The radiation imaging apparatus according to claim 1.

Images