Cleaning agent composition and water dilution type cleaning agent

Abstract

To provide a novel cleaning agent composition that exhibits excellent cleanability, is less corroded by articles containing metals such as aluminum, and is capable of removing a copper oxide film.SOLUTION: There is provided a cleaning agent composition including: 3-amino-4-octanol (A); at least one type of organic phosphorus compound (B) selected from the group consisting of acidic phosphate esters (B1), organic phosphonic acids (B2), and salts thereof; and optionally, water (C).SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a cleaning agent composition and a water-dilutable cleaning agent. [Background technology]

[0002] Conventionally, halogenated hydrocarbon solvents such as trichloroethylene, perchloroethylene, methylene chloride, fluorocarbons, etc. have been used to clean various electronic components and individual alloy components. However, the use of these solvents is currently restricted due to their toxicity to the human body and environmental problems such as air pollution and soil pollution, and as a result, alternative non-halogen cleaners such as hydrocarbon cleaners, glycol cleaners, and benzyl alcohol cleaners have been proposed (see Patent Documents 1 and 2).

[0003] Glycol-based cleaning agents are cleaning agents whose main components are various glycol compounds (glycol, glycol ether), and are considered to be excellent at removing flux, ion residue, oil attached to metal, etc. In addition, they generally have no or very high flash points and are non-hazardous, so they are also excellent in that they do not require explosion-proof cleaning equipment. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-046198 [Patent Document 2] JP 2009-190089 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the inventors have found that even when cleaning is performed using the above-mentioned conventional cleaning agents, the cleaning performance is sometimes insufficient. Furthermore, when cleaning an article containing a highly corrosive metal such as aluminum with the conventional cleaning agents, the cleaning agent may corrode the article, causing corrosion of the metal part such as aluminum.

[0006] Furthermore, when electronic components are soldered to the copper electrode surface of a circuit board, if an oxide film (copper oxide film) is formed on the copper surface due to heat, this can cause poor wire bonding and poor adhesion of the sealing resin in the subsequent soldering and cleaning processes. Therefore, it is necessary to remove the copper oxide film, but it has been difficult to sufficiently remove this copper oxide film using known cleaning agents.

[0007] An object of the present invention is to provide a novel cleaning composition which has excellent cleaning properties, inhibits corrosion of articles containing metals such as aluminum, and is capable of removing copper oxide films. [Means for solving the problem]

[0008] As a result of intensive research by the present inventors to achieve the above object, they have found that the above object can be achieved by a cleaning composition containing 3-amino-4-octanol, a specific organophosphorus compound, and water as necessary. The present inventors have also found that the above object can be achieved by a cleaning agent obtained by diluting the cleaning composition with water (water-diluted cleaning agent). That is, the present invention relates to the following cleaning composition and water-diluted cleaning agent.

[0009] 1. 3-amino-4-octanol (A), At least one organic phosphorus compound (B) selected from the group consisting of acidic phosphoric acid esters (B1), organic phosphonic acids (B2) and salts thereof, and A cleaning composition which, if necessary, contains water (C).

[0010] 2. The cleaning composition according to item 1, further comprising an organic solvent (D).

[0011] 3. The cleaning composition according to item 1 or 2, which is for removing flux residue.

[0012] 4. A cleaning agent composition comprising the cleaning composition according to item 1 or 2 above and water, 3. A water-dilutable cleaning agent comprising 100 to 1,500 parts by mass of water based on 100 parts by mass of the cleaning composition according to item 1 or 2.

[0013] 5. The water-diluted cleaning agent according to item 4, which is for removing flux residue. Effect of the Invention

[0014] The cleaning composition and water-diluted cleaning agent of the present invention have excellent cleaning properties, particularly excellent cleaning properties for various industrial stains such as flux, ion residues, and oil attached to metals. In addition, the cleaning solution composition and water-diluted cleaning agent are suitable for cleaning articles containing highly corrosive metals such as aluminum, since the corrosion of such metals is suppressed. Furthermore, the cleaning composition and water-diluted cleaning agent can sufficiently remove copper oxide films formed on copper electrode surfaces of circuit boards, etc. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Throughout this specification, the range of the values ​​of each physical property, content, etc. may be set appropriately (for example, by selecting from the values ​​described in each item below). Specifically, when the example of the value α is A3, A2, A1 (A3>A2>A1), the range of the value α may be, for example, A3 or less, A2 or less, less than A3, less than A2, A1 or more, A2 or more, greater than A1, greater than A2, A1 to A2 (A1 or more and A2 or less), A1 to A3, A2 to A3, A1 or more and less than A3, A1 or more and less than A2, A2 or more and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, and the like. In this specification, the word "to" is used to mean that the values ​​described before and after it are included as the lower limit and upper limit. Below, the components and manufacturing method of the present invention will be described in detail.

[0016] [Cleaning agent composition] The cleaning composition of the present invention is a composition containing 3-amino-4-octanol (A) (hereinafter referred to as component (A)) and a specific organophosphorus compound (B) (hereinafter referred to as component (B)).

[0017] <3-amino-4-octanol (A)> As component (A), any known 3-amino-4-octanol can be used without any particular restrictions. Conventionally known cleaning agents have difficulty in sufficiently removing copper oxide films formed on copper electrode surfaces of circuit boards, etc. However, the present inventors have conducted extensive research and found that the use of 3-amino-4-octanol in a cleaning agent composition and a water-diluted cleaning agent described below can sufficiently remove copper oxide films while exhibiting excellent cleaning properties.

[0018] The content of the (A) component in the above-mentioned cleaning composition is not particularly limited. For example, the content of the (A) component in the above-mentioned cleaning composition is 55 mass%, 50 mass%, 45 mass%, 40 mass%, 35 mass%, 30 mass%, 25 mass%, 20 mass%, 19 mass%, 18 mass%, 17 mass%, 16 mass%, 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, 2 mass%, 1 mass%, etc., based on 100 mass% of the cleaning composition.

[0019] The content of the (A) component in the above-mentioned cleaning composition is preferably 1% by mass or more relative to 100% by mass of the cleaning composition, from the viewpoint of exhibiting excellent cleaning properties in the cleaning composition and being able to sufficiently remove copper oxide film. The content of the (A) component in the above-mentioned cleaning composition is preferably 55% by mass or less, more preferably 35% by mass or less, and even more preferably 30% by mass or less, relative to 100% by mass of the cleaning composition, from the viewpoint of exhibiting excellent cleaning properties in the cleaning composition, inhibiting corrosion of metals such as aluminum, and being able to sufficiently remove copper oxide film. The content of the (A) component in the above-mentioned cleaning composition is preferably about 1 to 55% by mass, more preferably about 1 to 35% by mass, and even more preferably about 1 to 30% by mass, relative to 100% by mass of the cleaning composition, from the viewpoint of exhibiting excellent cleaning properties in the cleaning composition, inhibiting corrosion of metals such as aluminum, and being able to sufficiently remove copper oxide film.

[0020] <Organophosphorus compounds (B)> The component (B) is not particularly limited as long as it is at least one selected from the group consisting of acidic phosphoric acid ester (B1) (hereinafter referred to as component (B1)), organic phosphonic acid (B2) (hereinafter referred to as component (B2)) and salts thereof, and various known components can be used. The component (B) may be used alone or in combination of two or more.

[0021] Although conventionally known cleaning agents have excellent cleaning properties, they may cause corrosion of metal parts such as aluminum. However, as a result of extensive studies by the present inventors, they have found that by using component (B) in the above cleaning agent composition and the water-diluted cleaning agent described below, corrosion of metals such as aluminum can be suppressed while exhibiting excellent cleaning properties.

[0022] (Acid phosphate ester (B1)) The component (B1) is not particularly limited as long as it is an acidic phosphate ester, and various known ones can be used. The component (B1) may be used alone or in combination of two or more. The acidic phosphate ester means a phosphate ester having at least one hydroxyl group (-OH) bonded to the phosphorus atom in the phosphate group.

[0023] The component (B1) may, for example, be a compound represented by the following general formula (1).

[0024] [ka]

[0025] (In formula (1), R 1 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, and n represents an integer of 0 to 20. X represents a hydroxyl group or a group represented by the general formula (2): R 2 O-(CH2CH2O) m -(In formula (2), R 2 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, and m represents an integer of 0 to 20.

[0026] In the above general formulas (1) and (2), R 1 and R 2 In terms of inhibiting corrosion of metals such as aluminum, the number of carbon atoms in R is preferably 5 or more, more preferably 6 or more, even more preferably 8 or more, and still more preferably 10 or more. 1 and R 2 In terms of exhibiting excellent cleaning properties, the number of carbon atoms in R is preferably 21 or less, more preferably 18 or less, even more preferably 16 or less, still more preferably 14 or less, and even more preferably 13 or less. 1 and R 2 The number of carbon atoms is preferably 5 to 21, more preferably 6 to 18, even more preferably 8 to 18, and even more preferably 10 to 18, from the viewpoints of suppressing corrosion of metals such as aluminum while exerting excellent cleaning properties.

[0027] In the above general formulas (1) and (2), R 1 and R 2From the viewpoint of suppressing corrosion of metals such as aluminum while exhibiting excellent cleaning properties, a linear or branched chain alkyl group having 1 to 24 carbon atoms is preferable, a linear or branched chain alkyl group having 5 to 21 carbon atoms is more preferable, a linear or branched chain alkyl group having 6 to 18 carbon atoms is even more preferable, a linear or branched chain alkyl group having 8 to 18 carbon atoms is still more preferable, and a linear or branched chain alkyl group having 10 to 18 carbon atoms is particularly preferable.

[0028] In the above general formulas (1) and (2), n and m are preferably 0 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoint of exhibiting excellent cleaning properties. In the above general formulas (1) and (2), n and m are preferably 16 or less, more preferably 14 or less, even more preferably 12 or less, and even more preferably 10 or less, from the viewpoint of exhibiting excellent cleaning properties. In the above general formulas (1) and (2), n and m are preferably 0 to 16, more preferably 0 to 14, even more preferably 3 to 14, even more preferably 4 to 12, and even more preferably 4 to 10, from the viewpoint of exhibiting excellent cleaning properties.

[0029] The salt of component (B1) is not particularly limited, and various known salts can be used. Examples of the salt of component (B1) include metal salts of component (B1), such as sodium salts and potassium salts of component (B1), ammonium salts of component (B1), and alkanolamine salts of component (B1).

[0030] (Organophosphonic acid (B2)) The component (B2) is not particularly limited as long as it is an organic phosphonic acid, and various known compounds can be used. The component (B2) may be used alone or in combination of two or more.

[0031] Examples of the component (B2) include a compound represented by the following general formula (3), alkylene diphosphonic acid, alkylaminophosphonic acid, hydroxyalkylphosphonic acid, 3-phosphonopropionic acid, LO-phosphoserine, and 2-phosphonobutane-1,2,4-tricarboxylic acid.

[0032] [ka]

[0033] (In formula (3), R 3 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms)

[0034] In the above general formula (3), R 3 In terms of inhibiting corrosion of metals such as aluminum, the number of carbon atoms in R is preferably 5 or more, more preferably 6 or more, and even more preferably 8 or more. 3 In terms of exhibiting excellent cleaning properties, the number of carbon atoms in R is preferably 21 or less, more preferably 18 or less, even more preferably 16 or less, and still more preferably 14 or less. 3 The number of carbon atoms is preferably 5 to 21, more preferably 6 to 18, and even more preferably 8 to 14, from the viewpoints of suppressing corrosion of metals such as aluminum while exerting excellent cleaning properties.

[0035] In the above general formula (3), R 3 From the viewpoint of suppressing corrosion of metals such as aluminum while exhibiting excellent cleaning properties, a linear or branched alkyl group or a phenyl group having 5 to 21 carbon atoms is preferable, a linear or branched alkyl group or a phenyl group having 6 to 18 carbon atoms is more preferable, and a linear or branched alkyl group or a phenyl group having 8 to 14 carbon atoms is even more preferable.

[0036] Examples of the alkylene diphosphonic acid include methylene diphosphonic acid, 1,2-ethylene diphosphonic acid, 1,3-propylene diphosphonic acid, 1,4-butylene diphosphonic acid, 1,5-pentylene diphosphonic acid, and 1,6-hexylene diphosphonic acid.

[0037] Examples of the alkylaminophosphonic acid include N,N,N',N'-tetrakis(phosphonomethyl)ethylenediamine, aminotrimethylenephosphonic acid, diethylenetriaminepentamethylenephosphonic acid, and alendronic acid.

[0038] The hydroxyalkylphosphonic acid may, for example, be hydroxyethanediphosphonic acid.

[0039] The component (B2) is preferably a compound represented by general formula (3) above, from the viewpoints of exhibiting excellent detergency in the detergent composition and inhibiting corrosion of metals such as aluminum, and from the same viewpoints, is more preferably at least one selected from the group consisting of hexylphosphonic acid, octylphosphonic acid, and decylphosphonic acid.

[0040] The salt of component (B2) is not particularly limited, and various known salts can be used. Examples of the salt of component (B2) include metal salts of component (B2), such as sodium salts and potassium salts of component (B2), ammonium salts of component (B2), and alkanolamine salts of component (B2).

[0041] If an organic sulfonic acid compound such as a sulfonic acid surfactant (e.g., alkylbenzenesulfonic acid, its salt, or its ester) used in a conventional cleaning agent is used instead of component (B), the cleaning agent composition tends to have insufficient cleaning properties because it is unable to inhibit corrosion of metals such as aluminum.

[0042] The content of the (B) component in the above-mentioned cleaning composition is not particularly limited. For example, the content of the (B) component in the above-mentioned cleaning composition is 75 mass%, 70 mass%, 65 mass%, 60 mass%, 55 mass%, 50 mass%, 45 mass%, 40 mass%, 35 mass%, 30 mass%, 25 mass%, 20 mass%, 19 mass%, 18 mass%, 17 mass%, 16 mass%, 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, etc., based on 100 mass% of the cleaning composition.

[0043] The content of the (B) component in the above-mentioned cleaning composition is preferably 3% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 16% by mass or more, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition and inhibit corrosion of metals such as aluminum. The content of the (B) component in the above-mentioned cleaning composition is preferably 75% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition and inhibit corrosion of metals such as aluminum. The content of the (B) component in the above-mentioned cleaning composition is preferably about 3 to 75% by mass, more preferably about 3 to 50% by mass, even more preferably about 10 to 50% by mass, and particularly preferably about 16 to 50% by mass, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition and inhibit corrosion of metals such as aluminum.

[0044] The acid group (H + ) and the molar ratio of the amino group (NH2) of component (A) (H + / NH2) is not particularly limited. The molar ratio is, for example, 0.99, 0.98, 0.97, 0.96, 0.95, 0.93, 0.92, 0.91, 0.90, 0.89, 0.88, 0.87, 0.86, 0.85, 0.84, 0.83, 0.82, 0.81, 0.80, 0.79, 0.78, 0.77, 0.76, 0.75, 0.74, 0.73, 0.72, 0.71, 0.70, 0.69, 0.68, 0.67, 0.66, 0.65, 0.64, 0.63, 0.62, 0.61, 0.60, 0.59, 0.58, 0.57, 0.56, 0.55, 0.54, 0.53, 0.52, 0.51, 0.50, 0.49, 0.48, 0.47, 0.46, 0.45, 0.44, 0.43, 0.42, 0.41, 0.40, 0.35, 0.30, 0.25, 0.20, 0.19, 0.18, 0.17, 0.16, 0.15, 0.14, 0.13, 0.12, 0.11, 0.10, etc. +From the viewpoint of inhibiting corrosion of metals such as aluminum, the ratio of the concentration of the solvent to the concentration of the solvent is preferably from 0.10 to 0.99, and more preferably from 0.25 to 0.75.

[0045] In this specification, the molar ratio (H + / NH2) is the molar ratio (H + / NH2) = [Content (mass%) of component (A) × first acid value (mgKOH / g) of component (A)] / [Content (mass%) of component (B) × total amine value (mgKOH / g) of component (B)]. The first acid value of component (A) is measured according to the potentiometric titration method of JIS K0070:1992, and the acid value (mgKOH / g) is calculated from the first equivalent point in the obtained titration curve. The total amine value (mgKOH / g) of component (B) is a value measured in accordance with JIS K7237.

[0046] (Water(C)) The cleaning composition may contain water (C) (hereinafter, referred to as component (C)) as an optional component. By containing component (C), the cleaning composition has no flash point and is classified as a non-hazardous material under the Fire Service Act, making it easier to handle.

[0047] The component (C) is not particularly limited as long as it is water, and examples thereof include ultrapure water, pure water, ion-exchanged water, purified water, etc. The component (C) may be used alone or in combination of two or more kinds.

[0048] The content of the (C) component in the cleaning composition is not particularly limited. For example, the content of the (C) component in the cleaning composition is 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, 2 mass%, 1 mass%, 0 mass%, etc., based on 100 mass% of the cleaning composition.

[0049] The content of the (C) component in the above-mentioned cleaning composition is preferably 0% by mass or more, more preferably 1% by mass or more, and even more preferably 5% by mass or more, relative to 100% by mass of the cleaning composition, from the viewpoint of excellent handleability in the cleaning composition. The content of the (C) component in the above-mentioned cleaning composition is preferably 15% by mass or less, more preferably 10% by mass or less, relative to 100% by mass of the cleaning composition, from the viewpoint of excellent handleability in the cleaning composition and excellent cleaning properties in the cleaning composition. The content of the (C) component in the above-mentioned cleaning composition is preferably about 0 to 15% by mass, more preferably about 0 to 10% by mass, and even more preferably about 5 to 10% by mass, relative to 100% by mass of the cleaning composition, from the viewpoint of excellent handleability in the cleaning composition and excellent cleaning properties in the cleaning composition.

[0050] (Other ingredients) The above-mentioned cleaning composition may contain any components other than the components (A) to (C) (hereinafter referred to as other components) as long as the effects of the present invention can be obtained. Examples of the other components include an organic solvent (D) (hereinafter referred to as component (D)), additives, etc.

[0051] (Organic Solvent (D)) The component (D) is not particularly limited as long as it is an organic solvent, and various known organic solvents can be used. The component (D) may be used alone or in combination of two or more kinds.

[0052] The (D) component is preferably a non-halogen-based solvent because it has low toxicity to the human body and is environmentally friendly. Examples of such non-halogen-based solvents include glycol ether (D1) (hereinafter referred to as (D1) component), hydrocarbon solvents, alcohol solvents, ketone solvents, ether solvents, ester solvents, and nitrogen-containing compound solvents. The above organic solvents may be used alone or in combination of two or more.

[0053] (Glycol Ether (D1)) The component (D1) is not particularly limited as long as it is a glycol ether, and various known glycol ethers can be used. The component (D1) may be used alone or in combination of two or more.

[0054] Examples of the component (D1) include aliphatic glycol ethers, aromatic glycol ethers, etc. There are no particular limitations on the aliphatic glycol ethers and aromatic glycol ethers, and various known ones can be used.

[0055] From the viewpoint of providing excellent cleaning properties to the detergent composition, the component (D1) is preferably a compound represented by the following general formula (4).

[0056] [ka]

[0057] (In formula (4), R 4 represents an alkyl group having 1 to 6 carbon atoms, a phenyl group, or a benzyl group, and R 5 represents a methyl group or a hydrogen atom, and X 1 represents an alkyl group having 1 to 4 carbon atoms or a hydrogen atom, and a represents an integer of 1 to 4.

[0058] Examples of the compound represented by the above general formula (4) include ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, dipropylene glycol monoalkyl ether, tripropylene glycol monoalkyl ether, ethylene glycol dialkyl ether, diethylene glycol dialkyl ether, triethylene glycol dialkyl ether, propylene glycol dialkyl ether, dipropylene glycol dialkyl ether, tripropylene glycol dialkyl ether, ethylene glycol monophenyl ether, propylene glycol monophenyl ether, ethylene glycol diphenyl ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, ethylene glycol dibenzyl ether, and diethylene glycol monobenzyl ether.

[0059] Examples of the ethylene glycol monoalkyl ether include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol monoisobutyl ether, ethylene glycol mono-t-butyl ether, ethylene glycol mono-n-pentyl ether, and ethylene glycol mono-n-hexyl ether.

[0060] Examples of the diethylene glycol monoalkyl ether include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol monoisopropyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol monoisobutyl ether, diethylene glycol mono-t-butyl ether, diethylene glycol mono-n-pentyl ether, and diethylene glycol mono-n-hexyl ether.

[0061] Examples of the triethylene glycol monoalkyl ether include triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol mono-n-propyl ether, triethylene glycol monoisopropyl ether, triethylene glycol mono-n-butyl ether, triethylene glycol monoisobutyl ether, triethylene glycol mono-t-butyl ether, triethylene glycol mono-n-pentyl ether, and triethylene glycol mono-n-hexyl ether.

[0062] Examples of the propylene glycol monoalkyl ether include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol monoisopropyl ether, propylene glycol mono-n-butyl ether, propylene glycol monoisobutyl ether, propylene glycol mono-t-butyl ether, propylene glycol mono-n-pentyl ether, and propylene glycol mono-n-hexyl ether.

[0063] Examples of the dipropylene glycol monoalkyl ether include dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol monoisopropyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monoisobutyl ether, dipropylene glycol mono-t-butyl ether, dipropylene glycol mono-n-pentyl ether, and dipropylene glycol mono-n-hexyl ether.

[0064] Examples of the tripropylene glycol monoalkyl ether include tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol mono-n-propyl ether, tripropylene glycol monoisopropyl ether, tripropylene glycol mono-n-butyl ether, tripropylene glycol monoisobutyl ether, tripropylene glycol mono-t-butyl ether, tripropylene glycol mono-n-pentyl ether, and tripropylene glycol mono-n-hexyl ether.

[0065] Examples of the ethylene glycol dialkyl ether include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol di-n-butyl ether, ethylene glycol diisobutyl ether, ethylene glycol di-t-butyl ether, ethylene glycol ethyl methyl ether, ethylene glycol methyl propyl ether, ethylene glycol methyl n-propyl ether, ethylene glycol methyl isopropyl ether, ethylene glycol methyl butyl ether, ethylene glycol methyl isobutyl ether, ethylene glycol methyl t-butyl ether, ethylene glycol methyl n-pentyl ether, ethylene glycol methyl n-hexyl ether, ethylene glycol ethyl propyl ether, ethylene glycol ethyl n-propyl ether, and ethylene glycol ethyl isopropyl ether.

[0066] Examples of the diethylene glycol dialkyl ether include diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-butyl ether, diethylene glycol diisobutyl ether, diethylene glycol di-t-butyl ether, diethylene glycol ethyl methyl ether, diethylene glycol methyl propyl ether, diethylene glycol methyl n-propyl ether, diethylene glycol methyl isopropyl ether, diethylene glycol methyl butyl ether, diethylene glycol methyl isobutyl ether, diethylene glycol methyl t-butyl ether, diethylene glycol ethyl propyl ether, diethylene glycol ethyl n-propyl ether, and diethylene glycol ethyl isopropyl ether.

[0067] Examples of the triethylene glycol dialkyl ether include triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol di-n-butyl ether, triethylene glycol diisobutyl ether, triethylene glycol di-t-butyl ether, triethylene glycol ethyl methyl ether, triethylene glycol methyl propyl ether, triethylene glycol methyl n-propyl ether, triethylene glycol methyl isopropyl ether, triethylene glycol methyl butyl ether, triethylene glycol methyl isobutyl ether, triethylene glycol methyl t-butyl ether, triethylene glycol methyl n-pentyl ether, triethylene glycol ethyl propyl ether, triethylene glycol ethyl n-propyl ether, triethylene glycol ethyl isopropyl ether, triethylene glycol ethyl butyl ether, triethylene glycol ethyl isobutyl ether, triethylene glycol ethyl t-butyl ether, and triethylene glycol ethyl n-pentyl ether.

[0068] Examples of the propylene glycol dialkyl ether include propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol di-n-propyl ether, propylene glycol diisopropyl ether, propylene glycol di-n-butyl ether, propylene glycol diisobutyl ether, propylene glycol di-t-butyl ether, propylene glycol ethyl methyl ether, propylene glycol methyl propyl ether, propylene glycol methyl n-propyl ether, propylene glycol methyl isopropyl ether, propylene glycol methyl butyl ether, propylene glycol methyl isobutyl ether, propylene glycol methyl t-butyl ether, propylene glycol ethyl propyl ether, propylene glycol ethyl n-propyl ether, propylene glycol ethyl isopropyl ether, propylene glycol ethyl butyl ether, propylene glycol ethyl isobutyl ether, and propylene glycol ethyl t-butyl ether.

[0069] Examples of the dipropylene glycol dialkyl ether include dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol di-n-propyl ether, dipropylene glycol diisopropyl ether, dipropylene glycol di-n-butyl ether, dipropylene glycol diisobutyl ether, dipropylene glycol di-t-butyl ether, dipropylene glycol ethyl methyl ether, dipropylene glycol methyl propyl ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol methyl isopropyl ether, dipropylene glycol methyl butyl ether, dipropylene glycol methyl isobutyl ether, dipropylene glycol methyl t-butyl ether, dipropylene glycol ethyl propyl ether, dipropylene glycol ethyl n-propyl ether, dipropylene glycol ethyl isopropyl ether, dipropylene glycol ethyl butyl ether, dipropylene glycol ethyl isobutyl ether, and dipropylene glycol ethyl t-butyl ether.

[0070] Examples of the tripropylene glycol dialkyl ether include tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol di-n-propyl ether, tripropylene glycol diisopropyl ether, tripropylene glycol di-n-butyl ether, tripropylene glycol diisobutyl ether, tripropylene glycol di-t-butyl ether, tripropylene glycol ethyl methyl ether, tripropylene glycol methyl propyl ether, tripropylene glycol methyl n-propyl ether, tripropylene glycol methyl isopropyl ether, tripropylene glycol methyl butyl ether, tripropylene glycol methyl isobutyl ether, tripropylene glycol methyl t-butyl ether, tripropylene glycol ethyl propyl ether, tripropylene glycol ethyl n-propyl ether, tripropylene glycol ethyl isopropyl ether, tripropylene glycol ethyl butyl ether, tripropylene glycol ethyl isobutyl ether, and tripropylene glycol ethyl t-butyl ether.

[0071] The component (D1) is particularly preferably ethylene glycol monoisopropyl ether, ethylene glycol mono t-butyl ether, ethylene glycol mono n-hexyl ether, ethylene glycol mono 2-ethylhexyl ether, ethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monoisopropyl ether, diethylene glycol mono n-butyl ether, diethylene glycol monoisobutyl ether, diethylene glycol mono n-hexyl ether, diethylene glycol mono 2-ethylhexyl ether, diethylene glycol monophenyl ether, diethylene glycol monobenzyl ether, triethylene glycol mono n-butyl ether, propylene glycol mono n-propyl ether, propylene glycol At least one selected from the group consisting of glycol mono n-butyl ether, propylene glycol monophenyl ether, dipropylene glycol mono n-propyl ether, dipropylene glycol mono n-butyl ether, tripropylene glycol mono n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-butyl ether and dipropylene glycol dimethyl ether is preferred, and from the same viewpoint, at least one selected from the group consisting of diethylene glycol mono n-hexyl ether, diethylene glycol mono n-butyl ether, dipropylene glycol mono n-butyl ether and diethylene glycol di-n-butyl ether is more preferred.

[0072] (Hydrocarbon solvents) Examples of the hydrocarbon solvent include n-pentane, n-hexane, n-heptane, n-octane, n-nonane, n-decane, cyclopentane, methylcyclopentane, dodecylbenzene, diisopropylbenzene, tetraamylbenzene, dodecane, hexadecane, tetradecane, tetradecene, decalin, dimethyldecalin, diisopropylcyclohexane, butylcyclohexane, dodecylcyclohexane, dicyclohexylmethane, paramenthane, pinane, myrcene, menthane, 1-decene, limonene, isononane, isodecane, isoundecane, isododecane, 2,2,4,6,6-pentamethylheptane, and terpinene.

[0073] (Alcohol-based solvent) Examples of the alcohol solvent include methanol, ethanol, propanol, isopropanol, n-butanol, n-pentanol, n-hexanol, n-heptanol, 2-octanol, 2-methyl-1-butanol, 3-methyl-2-butanol, 4-methyl-2-pentanol, cyclohexanol, 2-ethylbutanol, 3,5-dimethyl-1-hexyn-3-ol, 3-heptanol, 2-heptanol, 2-ethylhexanol, tetrahydrofurfuryl alcohol, furfuryl alcohol, and benzyl alcohol.

[0074] (Ketone solvent) Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, di-n-propyl ketone, diisopropyl ketone, diisobutyl ketone, ethyl-n-butyl ketone, methyl hexyl ketone, methyl-n-amyl ketone, cyclohexanone, methyl cyclohexanone, and methyl-n-hexyl ketone.

[0075] (Ether solvent) The ether solvent is an ether solvent other than the above-mentioned component (D1), and examples thereof include diethyl ether, diisopropyl ether, ethyl-t-butyl ether, dibutyl ether, ethyl isoamyl ether, diisoamyl ether, vinyl methyl ether, vinyl ethyl ether, amyl xylyl ether, hexyl ether, and tetrahydrofuran.

[0076] (Ester solvent) Examples of the ester-based solvents include ethyl acetate, methyl acetate, coconut fatty acid methyl ester, isopropyl myristate, 2-ethylhexyl stearate, methyl laurate, methyl oleate, isobutyl oleate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methoxy-3-methylbutyl acetate, propylene glycol diacetate, ethylene glycol monobutyl ether acetate, butyl lactate, methyl acetoacetate, ethyl acetoacetate, diethyl oxalate, and octanoate.

[0077] (Nitrogen-containing compound solvent) Examples of the nitrogen-containing compound solvent include 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, 1,3-dipropyl-2-imidazolidinone, N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylformamide.

[0078] The component (D) is more preferably at least one selected from the group consisting of the component (D1) and benzyl alcohol, from the viewpoint that the cleaning properties in the detergent composition are particularly good, and from the same viewpoint, it is more preferably at least one selected from the group consisting of diethylene glycol mono-n-hexyl ether, diethylene glycol mono-n-butyl ether, dipropylene glycol mono-n-butyl ether, diethylene glycol di-n-butyl ether, and benzyl alcohol.

[0079] The content of the (D) component in the above-mentioned cleaning composition is not particularly limited. For example, the content of the (D) component in the above-mentioned cleaning composition is 95 mass%, 90 mass%, 85 mass%, 80 mass%, 75 mass%, 70 mass%, 65 mass%, 60 mass%, 55 mass%, 50 mass%, 45 mass%, 40 mass%, 35 mass%, 30 mass%, 25 mass%, 20 mass%, 19 mass%, 18 mass%, 17 mass%, 16 mass%, 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, 2 mass%, 1 mass%, 0 mass%, etc., based on 100 mass% of the cleaning composition.

[0080] The content of the (D) component in the above-mentioned cleaning composition is preferably 0% by mass or more, more preferably 30% by mass or more, and even more preferably 50% by mass or more, based on 100% by mass of the cleaning composition, in order to provide excellent cleaning properties in the cleaning composition. The content of the (D) component in the above-mentioned cleaning composition is preferably 95% by mass or less, based on 100% by mass of the cleaning composition, in order to provide excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films. The content of the (D) component in the above-mentioned cleaning composition is preferably about 0 to 95% by mass, more preferably about 30 to 95% by mass, and even more preferably about 50 to 95% by mass, based on 100% by mass of the cleaning composition, in order to provide excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films.

[0081] The content of the (D1) component in the above-mentioned cleaning composition is not particularly limited. For example, the content of the (D1) component in the above-mentioned cleaning composition is 95 mass%, 90 mass%, 85 mass%, 80 mass%, 75 mass%, 70 mass%, 65 mass%, 60 mass%, 55 mass%, 50 mass%, 45 mass%, 40 mass%, 35 mass%, 30 mass%, 25 mass%, 20 mass%, 19 mass%, 18 mass%, 17 mass%, 16 mass%, 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, 2 mass%, 1 mass%, 0 mass%, etc., based on 100 mass% of the cleaning composition.

[0082] The content of the (D1) component in the above-mentioned cleaning composition is preferably 0% by mass or more, more preferably 30% by mass or more, and even more preferably 50% by mass or more, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition. The content of the (D1) component in the above-mentioned cleaning composition is preferably 95% by mass or less, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films. The content of the (D1) component in the above-mentioned cleaning composition is preferably about 0 to 95% by mass, more preferably about 30 to 95% by mass, and even more preferably about 50 to 95% by mass, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films.

[0083] The content of benzyl alcohol in the above-mentioned cleaning composition is not particularly limited. For example, the content of benzyl alcohol in the above-mentioned cleaning composition is 95 mass%, 90 mass%, 85 mass%, 80 mass%, 75 mass%, 70 mass%, 65 mass%, 60 mass%, 55 mass%, 50 mass%, 45 mass%, 40 mass%, 35 mass%, 30 mass%, 25 mass%, 20 mass%, 19 mass%, 18 mass%, 17 mass%, 16 mass%, 15 mass%, 14 mass%, 13 mass%, 12 mass%, 11 mass%, 10 mass%, 9 mass%, 8 mass%, 7 mass%, 6 mass%, 5 mass%, 4 mass%, 3 mass%, 2 mass%, 1 mass%, 0 mass%, etc., based on 100 mass% of the cleaning composition.

[0084] The content of benzyl alcohol in the above cleaning composition is preferably 0% by mass or more, more preferably 30% by mass or more, and even more preferably 50% by mass or more, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition. The content of benzyl alcohol in the above cleaning composition is preferably 95% by mass or less, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films. The content of benzyl alcohol in the above cleaning composition is preferably about 0 to 95% by mass, more preferably about 30 to 95% by mass, and even more preferably about 50 to 95% by mass, based on 100% by mass of the cleaning composition, in order to exhibit excellent cleaning properties in the cleaning composition, inhibit corrosion of metals such as aluminum, and sufficiently remove copper oxide films.

[0085] When the component (D1) and benzyl alcohol are used in combination in the component (D), the mass ratio of the component (D1) to benzyl alcohol is not particularly limited, but is preferably about 20-80:80-20 from the standpoint of cleaning properties.

[0086] Specific examples of the additives include rust inhibitors, surfactants, antifoaming agents, antioxidants, chelating agents, organic acids, amine compounds, and organic phosphorus compounds other than component (B). The additives may be used alone or in combination of two or more.

[0087] The surfactant is not particularly limited, and various known surfactants can be used. Examples of the surfactant include nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants. The surfactants may be used alone or in combination of two or more.

[0088] The nonionic surfactant may be, for example, a compound represented by the general formula (5): 6 -O-(CH2-CH2-O)eH (wherein, R 6 represents an alkyl group having 8 to 20 carbon atoms, and e represents an integer of 0 to 20.) as well as ethylene oxide adducts of fatty acid amides, sorbitan fatty acid esters, sucrose fatty acid esters, fatty acid alkanolamides, and their corresponding polyoxypropylene surfactants and polyoxyalkyleneamine surfactants.

[0089] Examples of the anionic surfactant include sulfate ester-based anionic surfactants (sulfate ester salts of higher alcohols, alkyl sulfate ester salts, polyoxyethylene alkyl sulfate ester salts, etc.), sulfonate-based anionic surfactants (alkyl sulfonate salts, alkylbenzene sulfonate salts, etc.), and the like.

[0090] Examples of the cationic surfactant include alkylated ammonium salts and quaternary ammonium salts.

[0091] Examples of the amphoteric surfactant include amino acid type and betaine type amphoteric surfactants.

[0092] The content of the surfactant is not particularly limited, but from the viewpoints that the cleaning composition exhibits excellent cleaning properties and can sufficiently remove copper oxide film, the content is preferably 0 to 15 mass%, and more preferably 1 to 10 mass%, relative to 100 mass% of the cleaning composition.

[0093] The chelating agent is not particularly limited as long as it is a metal chelating agent capable of coordinating to a metal ion, and various known ones can be used. Examples of the chelating agent include carboxylic acid chelating agents, amino acid chelating agents, phosphoric acid chelating agents, aminocarboxylic acid chelating agents, and hydroxycarboxylic acid chelating agents. These chelating agents may be salts such as sodium salts, potassium salts, and ammonium salts, or may be hydrolyzable ester derivatives. The chelating agents may be used alone or in combination of two or more.

[0094] Examples of the carboxylic acid chelating agent include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, itaconic acid, acetylsalicylic acid, phthalic acid, trimellitic acid, and cyclopentanetetracarboxylic acid.

[0095] Examples of the amino acid chelating agent include glycine, alanine, lysine, arginine, asparagine, and tyrosine.

[0096] Examples of the phosphoric acid-based chelating agent include orthophosphoric acid, pyrophosphoric acid, triphosphoric acid, and polyphosphoric acid.

[0097] Examples of the aminocarboxylic acid chelating agent include ethylenediaminetetraacetic acid (EDTA), cyclohexanediaminetetraacetic acid (CDTA), nitrilotriacetic acid (NTA), diethylenetriaminepentaacetic acid (DTPA), iminodiacetic acid (IDA), N-(2-hydroxyethyl)iminodiacetic acid (HIMDA), and hydroxyethylethylenediaminetriacetic acid (HEDTA).

[0098] Examples of the hydroxycarboxylic acid chelating agent include malic acid, citric acid, isocitric acid, glycolic acid, gluconic acid, salicylic acid, tartaric acid, and lactic acid.

[0099] The amine compound is not particularly limited, and various known compounds can be used. Examples of the amine compound include aliphatic amines and alkanolamines. These amine compounds may be salts. The amine compounds may be used alone or in combination of two or more. The amine compounds do not include the component (B).

[0100] Examples of the aliphatic amine include primary aliphatic amines such as octylamine, decylamine, dodecylamine, tetradecylamine, hexadecylamine, and 2-ethylhexylamine; tertiary diamines such as N,N,N',N'-tetramethylpentamethylenediamine, N,N,N',N'-tetraethylpentamethylenediamine, N,N,N',N'-tetraisopropylpentamethylenediamine, N,N,N',N'-tetra-n-propylpentamethylenediamine, N,N,N',N'-tetramethylhexamethylenediamine, N,N,N',N'-tetraethylhexamethylenediamine, N,N,N',N'-tetraisopropylhexamethylenediamine, and N,N,N',N'-tetra-n-propylhexamethylenediamine; and bis(2-dimethylaminoethyl) ) ether, bis(2-diethylaminoethyl) ether, bis(2-diisopropylaminoethyl) ether, bis(2-di-n-propylaminoethyl) ether and other diaminoalkyl ethers; and triamines such as 1,1,7,7-tetramethyldiethylenetriamine, 1,1,7,7-tetraethyldiethylenetriamine, 1,1,7,7-tetraisopropyldiethylenetriamine, 1,1,7,7-tetra-n-propyldiethylenetriamine, N,N,N',N'',N''-pentamethyldiethylenetriamine, 4-methyl-1,1,7,7-tetraethyldiethylenetriamine, 4-methyl-1,1,7,7-tetraisopropyldiethylenetriamine, 4-methyl-1,1,7,7-tetra-n-propyldiethylenetriamine and other triamines.

[0101] Examples of the alkanolamine include N-methylmethanolamine, N-ethylmethanolamine, Nn-propylmethanolamine, Nn-butylmethanolamine, N-methylethanolamine, N-ethylethanolamine, Nn-propylethanolamine, N-isopropylethanolamine, Nn-butylethanolamine, N-methylpropanolamine, N-ethylpropanolamine, Nn-propylpropanolamine, N-isopropylpropanolamine, Nn-butylpropanolamine, N-methylbutanolamine, N-ethylbutanolamine, Nn-propylbutanolamine, N-isopropylbutanolamine, Nn-butylbutanolamine, and N,N-dimethylethanolamine. Examples of the ethanolamine include N,N-diethylethanolamine, N,N-di-n-propylethanolamine, N,N-di-n-butylethanolamine, N,N-dimethylpropanolamine, N,N-dimethylisopropanolamine, N,N-dimethylbutanolamine, diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, Nn-butyldiethanolamine, Nt-butyldiethanolamine, N-cyclohexyldiethanolamine, triethanolamine, diisopropanolamine, triisopropanolamine, N-(β-aminoethyl)ethanolamine, N-(β-aminoethyl)isopropanolamine, and N,N-dibutylpropanolamine.

[0102] The above-mentioned organic phosphorus compound is not particularly limited as long as it is other than the component (B), and various known compounds can be used. The above-mentioned organic phosphorus compound includes, for example, a phosphoric acid ester other than the component (B), a phosphorous acid ester, etc. These organic phosphorus compounds may be salts. The above-mentioned organic phosphorus compounds may be used alone or in combination of two or more kinds.

[0103] Examples of the phosphate ester include trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, trihexyl phosphate, trioctyl phosphate, tridecyl phosphate, triundecyl phosphate, tridodecyl phosphate, tritridecyl phosphate, tristearyl phosphate, trioleyl phosphate, and triphenyl phosphate.

[0104] Examples of the phosphite ester include monomethyl phosphite, dimethyl phosphite, trimethyl phosphite, monoethyl phosphite, diethyl phosphite, triethyl phosphite, monopropyl phosphite, dipropyl phosphite, tripropyl phosphite, monobutyl phosphite, dibutyl phosphite, tributyl phosphite, monohexyl phosphite, dihexyl phosphite, trihexyl phosphite, monooctyl phosphite, dioctyl phosphite, trioctyl phosphite, monodecyl phosphite, didecyl phosphite, tridecyl phosphite, monoundecyl phosphite, diundecyl phosphite, triundecyl phosphite, monododecyl phosphite, didodecyl phosphite, tridodecyl phosphite, monotridecyl phosphite, ditridecyl phosphite, tritridecyl phosphite, monostearyl phosphite, distearyl phosphite, tristearyl phosphite, monooleyl phosphite, dioleyl phosphite, trioleyl phosphite, monophenyl phosphite, diphenyl phosphite, and triphenyl phosphite.

[0105] In addition, it is not preferable to add an oxidizing agent to the above-mentioned cleaning composition, since it accelerates the corrosion of metals. Examples of such oxidizing agents include hydrogen peroxide, other peroxy compounds such as salts and acids containing anions of peroxomonosulfuric acid, perboric acid, perchloric acid, periodic acid, persulfuric acid, permanganic acid, and peracetic acid, and amine-N-oxides.

[0106] Further examples of oxidizing agents include FeCl3, FeF3, Fe(NO3)3, Sr(NO3)2, CoF3, MnF3, ozone (2KHSO 5. KHSO 4.K7SO4), iodic acid, vanadium(V) oxide, vanadium(IV, V) oxide, ammonium vanadate, polyatomic salts of ammonium (e.g., ammonium peroxomonosulfate, ammonium chlorite (NH4ClO2), ammonium chlorate (NH4ClO3), ammonium iodate (NH4IO3), ammonium nitrate (NH4NO3), ammonium perborate (NH4BO3), ammonium perchlorate (NH4ClO4), ammonium periodate (NH4IO4), ammonium persulfate ((NH4)2S2O8), ammonium hypochlorite (NH4ClO)), ammonium tungstate ((NH4 10H2(W2O7)), polyatotnic salts of sodium (e.g., sodium persulfate (Na2S2O8), sodium hypochlorite (NaClO), sodium perborate), polyatomic salts of potassium (e.g., potassium iodate (KIO3), potassium permanganate (KMnO4), potassium persulfate, nitric acid (HNO3), potassium persulfate (K2S2O8), potassium hypochlorite (KClO)), polyatomic salts of tetramethylammonium (e.g., tetramethylammonium chlorite ((N(CH3)4)ClO2), tetramethylammonium chlorate ((N(CH3)4)ClO3), tetramethylammonium iodate ((N(CH3)4)IO3), tetramethylammonium perborate ((N(CH3)4)BO3), tetramethylammonium perchlorate ((N(CH3)4)ClO4), tetramethylammonium periodate ((N(CH3)4)IO4), tetramethylammonium persulfate ((N(CH3)4)S2O8)), polyatomic salts of tetrabutylammonium (e.g., tetrabutylammonium peroxomonosulfate), peroxotnonosulfuric acid acid), ferric nitrate (Fe(NO3)3), urea hydrogen peroxide ((CO(NH2)2)H2O2), peracetic acid (CH3(CO)OOH), 1,4-benzoquinone, toluquinone, dimethyl-1,4-benzoquinone, chloranil, alloxan, N-methylmorpholine N-oxide, trimethylamine N-oxide, and combinations thereof. Other examples of oxidizing agents include perbromic acid, telluric acid, trifluoroperacetic acid, m-chloroperbenzoic acid, t-butyl hydroperoxide, dibenzoyl peroxide, potassium peroxysulfate (e.g., Oxone® DuPont), methyl ethyl ketone peroxide, acetone peroxide, ethyl hydroperoxide, and cumene hydroperoxide.

[0107] In the above-mentioned cleaning composition, the method for mixing the components (A) to (C) and other components is not particularly limited, and a general liquid mixing method can be used. A specific mixing method includes a stirring method.

[0108] [Water-diluted cleaning agent] The water-diluted cleaning agent of the present invention is a composition containing the above cleaning agent composition and water. In other words, the water-diluted cleaning agent is a cleaning agent obtained by diluting the above cleaning agent composition with water.

[0109] The content of water in the water-diluted cleaning agent is not particularly limited. The content of water in the water-diluted cleaning agent is, for example, 1500 parts by mass, 1400 parts by mass, 1300 parts by mass, 1200 parts by mass, 1100 parts by mass, 1000 parts by mass, 900 parts by mass, 800 parts by mass, 700 parts by mass, 600 parts by mass, 500 parts by mass, 400 parts by mass, 300 parts by mass, 200 parts by mass, 100 parts by mass, etc., relative to 100 parts by mass of the cleaning agent composition. The content of water in the water-diluted cleaning agent is preferably about 200 to 1200 parts by mass, more preferably about 400 to 900 parts by mass, relative to 100 parts by mass of the cleaning agent composition, from the viewpoint of reducing the cost and environmental load of the water-diluted cleaning agent and obtaining sufficient cleaning properties.

[0110] The above water-dilution type cleaning agents are classified into three types based on the suspension state of the cleaning agent after dilution with water: homogeneous, heated cloudy, and completely cloudy. The homogeneous type is a cleaning agent that is transparent in appearance at 1 to 90°C, the heated cloudy type is a cleaning agent that is transparent in appearance at temperatures lower than the cloud point and becomes cloudy with oil droplets dispersed in water at temperatures equal to or higher than the cloud point, and the completely cloudy type is a cleaning agent that becomes cloudy with oil droplets dispersed in water at 1 to 90°C.

[0111] Among the above water-diluted cleaning agents, the completely cloudy or heated cloudy water-diluted cleaning agents become cloudy during cleaning, and generally have a high ability to remove oil-soluble and water-soluble dirt and sufficient cleaning properties compared to homogeneous systems, and the completely cloudy water-diluted cleaning agent has higher cleaning properties than the heated cloudy system. On the other hand, the homogeneous water-diluted cleaning agent has better water rinsing properties in the water rinsing step compared to the completely cloudy or heated cloudy systems, and also has a uniform appearance, making it easy to control the concentration of the cleaning agent components using optical instruments such as a refractometer. And the heated cloudy water-diluted cleaning agent has better water rinsing properties and easier concentration control compared to the completely cloudy systems.

[0112] In the above water-diluted cleaning agent, if the alkyl group in component (B1) has a large number of carbon atoms, or if the alkylene oxide chain in component (B1) is short or does not have an alkylene oxide chain, the suspension state of the water-diluted cleaning agent tends to become completely cloudy or cloudy when heated. On the other hand, if the alkyl group in component (B1) has a small number of carbon atoms, or if the alkylene oxide chain in component (B1) is long, the appearance of the water-diluted cleaning agent tends to become uniform.

[0113] In the above water-diluted cleaning agent, when the solubility of component (D) in water at 20°C is 10% by mass or less, the suspension state of the water-diluted cleaning agent tends to become completely cloudy or cloudy when heated, and the cleaning ability of the water-diluted cleaning agent tends to be high. On the other hand, when the solubility of component (D) in water at 20°C is more than 10% by mass, the appearance of the water-diluted cleaning agent tends to be uniform.

[0114] In the water-diluted cleaning agent, the method for mixing the cleaning composition and water is not particularly limited, and a general liquid mixing method can be used. Specific examples of the mixing method include stirring.

[0115] In the above water-diluted cleaning agent, the pH at 25° C. is preferably about 5.0 to 11.0, and more preferably about 6.5 to 10.0, in order to inhibit corrosion of metals such as aluminum.

[0116] The above cleaning compositions and the above water-diluted cleaning agents can be classified according to the objects to be cleaned, and include, for example, cleaning agents for flux residue, cleaning agents for soldering flux, cleaning agents for solder paste, cleaning agents for industrial oil, etc. Examples of objects to be cleaned that have such objects to be cleaned include electronic materials, etc.

[0117] Examples of the electronic materials include glass processed products such as photomasks, optical lenses, vacuum discharge tubes, touch panels, and glass for display devices; metal processed products such as metal masks, pallets, printed circuit boards, flexible wiring boards, ceramic wiring boards, semiconductor elements, semiconductor packages, magnetic media, power modules, camera modules, lead frames, magnetic disks, and heat sinks; resin processed products such as glass epoxy boards, polyimide boards, paper phenol boards, and plastic molded parts; wafers such as silicon (Si), sapphire (Al2O3), silicon carbide (SiC), diamond (C), gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAs), and indium phosphide (InP), and products cut (slicing, dicing, etc.), ground (back grinding, blasting, etc.), chamfered (beveling, barreling, etc.), and polished (lapping, polishing, buffing, etc.), as well as jigs, carriers, magazines, etc. used when processing, mounting, welding, cleaning, and transporting these articles.

[0118] [Cleaning target] The objects to be cleaned with the cleaning composition and the water-diluted cleaning agent are not particularly limited, and examples thereof include soldering flux, solder paste, flux residue, industrial oil, cutting chips, etc. Among these, one selected from the group consisting of soldering flux, solder paste, and flux residue is suitable as the object to be cleaned with the cleaning composition and the water-diluted cleaning agent.

[0119] In this specification, "soldering flux" refers to a composition used to remove oxide films on the surfaces of solder and base materials (metal electrodes, etc.) and facilitate bonding between the two. In general, it contains a base resin, an activator, and an organic solvent, and may contain a thixotropic agent, an antioxidant, and other additives as necessary. Soldering fluxes are classified into solder paste fluxes and non-solder paste fluxes such as wire solder fluxes, post fluxes, and pre fluxes, depending on their composition.

[0120] Examples of the base resin include rosin-based base resins and non-rosin-based base resins. Examples of the rosin-based base resin include natural rosin, rosin derivatives, and refined products thereof. Examples of natural rosin include gum rosin, tall oil rosin, and wood rosin. Examples of the rosin derivative include hydrogenated and disproportionated products of natural rosin; Examples of the polymerized rosin include polymerized rosin, unsaturated acid-modified rosin, rosin ester, and hydrogenated unsaturated acid-modified rosin. The polymerized rosin, unsaturated acid-modified rosin, and rosin ester can be produced using the natural rosin, or a hydrogenated or disproportionated product of the natural rosin. Examples of the polyhydric alcohol constituting the rosin ester include glycerin and pentaerythritol. Examples of the unsaturated acid constituting the unsaturated acid-modified rosin include acrylic acid, fumaric acid, and maleic acid. Examples of the non-rosin-based base resin include epoxy resin, acrylic resin, polyimide resin, nylon resin, polyacrylonitrile resin, vinyl chloride resin, vinyl acetate resin, polyolefin resin, fluorine-based resin, ABS resin, isoprene rubber, styrene butadiene rubber (SBR), butadiene rubber (BR), chloroprene rubber, nylon rubber, nylon-based elastomer, and polyester-based elastomer.

[0121] Examples of the activator include succinic acid, adipic acid, azelaic acid, glutaric acid, sebacic acid, dodecanoic diacid, dimer acid, fumaric acid, maleic acid, itaconic acid, trans-2,3-dibromo-1,4-butenediol, cis-2,3-dibromo-1,4-butenediol, 3-bromopropionic acid, 2-bromovaleric acid, 5-bromo-n-valeric acid, 2-bromoisovaleric acid, ethylamine bromate, diethylamine bromate, diethylamine hydrochloride, and methylamine bromate.

[0122] Examples of the organic solvent include ethanol, n-propanol, isopropanol, isobutanol, butyl carbitol, hexyl carbitol, isopropyl acetate, ethyl propionate, butyl benzoate, diethyl adipate, n-hexane, dodecane, and tetradecene.

[0123] Examples of the thixotropic agent include castor oil, hydrogenated castor oil, beeswax, carnauba wax, stearic acid amide, and 12-hydroxystearic acid ethylenebisamide.

[0124] Examples of the antioxidant include pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, 2,6-di-t-butyl-p-cresol, triphenyl phosphite, triethyl phosphite, trilauryl trithiophosphite, and tris(tridecyl)phosphite.

[0125] Examples of the other additives include antifungal agents, matting agents, thickening inhibitors, surfactants, and the like.

[0126] In this specification, the term "solder paste" refers to a mixture of soldering flux and solder powder. Examples of solder powder include Sn-Ag, Sn-Cu, Sn-Sb, and Sn-Zn lead-free solder powders, as well as lead-containing solder powders containing lead as a constituent. These solder metals may be doped with one or more of Ag, Al, Au, Bi, Co, Cu, Fe, Ga, Ge, In, Ni, P, Pt, Sb, and Zn. The solder paste is supplied onto an electrode through a metal mask by screen printing, and after an electronic component is placed thereon, soldering is performed under heating.

[0127] Examples of the article to which the soldering flux or solder paste is attached include a metal mask for screen printing, a squeegee, a nozzle for a dispensing method, a syringe, and a jig for fixing a substrate.

[0128] The flux residue is a residue that is generated after electronic components, etc. are bonded to electrodes using solder paste, wire solder, soldering flux, pre-flux, post-flux, etc. Flux residue corrodes the solder metal and base material and reduces the insulation resistance of the board, so it is necessary to remove it by cleaning.

[0129] Examples of the articles to which the flux residue is attached include printed circuit boards, ceramic wiring boards, semiconductor element mounting boards, wafers, TAB tapes, lead frames, power modules, camera modules, etc. In addition, the corresponding items may have electronic components such as ICs, capacitors, resistors, diodes, transistors, coils, and CSPs soldered thereto, BGAs, PGAs, LGAs, etc. formed thereon, or may have been subjected to pretreatment such as solder leveling.

[0130] Examples of the industrial oil include processing oil, cutting oil, mineral oil, machine oil grease, lubricating oil, rust-preventive oil, wax, pitch, paraffin, oils and fats, grease, etc. These are used in fields such as machining and metal processing to reduce friction between materials and tools to prevent seizure, to reduce the force required for processing to facilitate forming, and to prevent rust and corrosion of products.

[0131] Examples of articles to which the above-mentioned industrial oils have adhered include molded parts such as bolts, nuts, ferrules, and washers, automobile parts such as engine pistons, industrial machinery parts such as gears, shafts, sprockets, and chains, HDD parts, and electronic parts such as lead frames.

[0132] Other objects to be cleaned include, for example, printed circuit boards, ceramic wiring boards, semiconductor element mounting boards, cover glasses, and chips generated during dicing of wafers and the like.

[0133] [Cleaning method] The method for cleaning the object to be cleaned with the cleaning agent composition or the water-diluted cleaning agent is not particularly limited, and various known methods can be applied. Specifically, for example, there is a cleaning method including a cleaning step, a water rinsing step, and a drying step.

[0134] The cleaning step is a step of contacting an object to be cleaned with the cleaning composition or the water-diluted cleaning agent to remove the object to be cleaned. The water rinsing step is a step of contacting an object to be cleaned with rinsing water to remove the cleaning composition or the water-diluted cleaning agent adhering to the object to be cleaned. The drying step is a step of removing the rinsing water adhering to the object to be cleaned.

[0135] The means for contacting the object to be cleaned with the above-mentioned cleaning composition or rinsing water is not particularly limited, and various known methods can be adopted. For example, a method of spraying the cleaning composition or rinsing water onto the object to be cleaned using a spray device (see JP 2007-096127 A), a method of immersing the object to be cleaned in the cleaning composition and cleaning it ultrasonically, a method of using a direct-pass cleaning device (registered trademark "Direct Pass", manufactured by Arakawa Chemical Industries, Ltd., Patent No. 2621800, etc.), etc. can be mentioned.

[0136] The means for contacting the object to be cleaned with the water-diluted cleaning agent or rinsing water is not particularly limited, and various known methods can be used, such as an immersion stirring method, a submerged shower method, an air shower method, and an ultrasonic cleaning method.

[0137] The water rinsing step may be repeated several times. For example, the cleaning agent composition or the water-diluted cleaning agent attached to the surface of the cleaning object can be effectively removed by performing a pre-rinsing process and then a finish rinsing process on the cleaning object.

[0138] The pre-rinsing treatment can be carried out by a conventional pre-rinsing treatment method using pure water, etc. The finish rinsing treatment can be carried out according to a conventionally known method, for example, a method in which the pre-rinsed product is treated with pure water, etc. can be mentioned. EXAMPLES

[0139] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. In the examples, "%" and "parts" mean "% by mass" and "parts by mass" unless otherwise specified.

[0140] [Preparation of cleaning composition and water-dilutable cleaning agent] Example 1 53 parts of 3-amino-4-octanol and a phosphate ester of polyoxyethylene alkyl ether (in the general formula (1), R 1 is an alkyl group having 6 to 10 carbon atoms, n is 4, and X is a hydroxyl group or a group represented by general formula (2), in which R 2 A cleaning composition was prepared by mixing 47 parts of a carboxylic acid dilution agent (wherein m is an alkyl group having 6 to 10 carbon atoms and m is 4). Further, 400 parts of water were added to 100 parts of the obtained cleaning composition to prepare a water-diluted cleaning agent X (concentration of the cleaning agent composition: 20% by mass). Further, 900 parts of water were added to 100 parts of the obtained cleaning composition to prepare a water-diluted cleaning agent Y (concentration of the cleaning agent composition: 10% by mass).

[0141] Examples 2 to 24 and Comparative Examples 1 to 14 The cleaning composition of Example 1 was prepared in the same manner as in Example 1, except that the components of the cleaning composition were changed to those shown in Tables 1 and 2. The values ​​in Tables 1 and 2 are all given in parts by mass.

[0142] [Table 1]

[0143] [Table 2]

[0144] The abbreviations of the components in Tables 1 and 2 and the solubility of component (D) in water are as shown in Table 3.

[0145] [Table 3]

[0146] R in Table 3 1 , n and X are R in general formula (1). 1 , n and X. R in Table 3 1 C6, C10, C12, C13, and C18 in R 1 For example, C6 means that the alkyl group has 6 carbon atoms.

[0147] In addition, since B1 to B4 in Table 3 are mixtures of monoesters and diesters, X in B1 to B4 represents a hydroxyl group or a group represented by general formula (2). 2 and m is R in general formula (2). 2 and m. R in Table 3 2 C6, C10, C12, C13, and C18 in R 2 For example, C6 means that the alkyl group has 6 carbon atoms.

[0148] The cleaning properties, appearance, corrosion inhibition properties and copper oxide film removability of the cleaning compositions and water-diluted cleaning agents X and Y obtained in Examples 1 to 24 and Comparative Examples 1 to 14 were evaluated, and the pH of the water-diluted cleaning agents X and Y was measured. The results are shown in Tables 4 to 9.

[0149] [Table 4]

[0150] [Table 5]

[0151] [Table 6]

[0152] [Table 7]

[0153] [Table 8]

[0154] [Table 9]

[0155] <Appearance evaluation> The cleaning compositions and water-diluted cleaning agents X and Y obtained in Examples 1 to 24 and Comparative Examples 1 to 14 were placed in 50 mL glass containers and left to stand in water baths at 20° C., 40° C. and 60° C. for 1 hour, and the uniformity at 20° C., 40° C. and 60° C. was visually confirmed. In Tables 4 to 9, "uniform" means that the appearance is transparent and the cleaning composition and the water-diluted cleaning agent are in a completely compatible state, while "heterogeneous" means that the appearance is cloudy or separated into two layers, an aqueous layer and an oil layer, and the cleaning composition and the water-diluted cleaning agent are phase-separated.

[0156] <Evaluation of cleaning ability> (Preparation of test pieces for cleaning test) A commercially available lead-free, halogen-free solder paste (product name "Eco Solder Paste M705-S70G-HF Type 4", manufactured by Senju Metal Industry Co., Ltd.) was printed on the copper pattern of a glass epoxy copper-clad laminate (50 × 50 × thickness 1.0 mm) using a metal mask, and then reflowed with the following profile to produce a test board with flux attached.

[0157] (Reflow profile of test board) Atmosphere: Air Heating rate: 1℃ / sec Peak temperature: 240℃, 10 seconds

[0158] (Detergency test of cleaning agent composition and water-diluted cleaning agent) Using the above test substrate, a cleaning property test was performed by an immersion ultrasonic method under the following cleaning and water rinsing conditions. The test substrate was brought into contact with the cleaning composition obtained in Examples 1 to 24 and Comparative Examples 1 to 14, and the water-diluted cleaning agent X and Y, and was irradiated with ultrasonic waves for 3 minutes, 5 minutes, 10 minutes, or 20 minutes to perform cleaning. Next, the test substrate was immersed in ion-exchanged water with a liquid temperature of 25°C, and was irradiated with ultrasonic waves for 5 minutes to perform pre-rinsing. Furthermore, the test substrate was immersed in ion-exchanged water with a liquid temperature of 25°C, and was irradiated with ultrasonic waves for 5 minutes to perform finish rinsing. Thereafter, the test substrate was air-blowed for 1 minute to remove moisture and dried. The surface of the test substrate after drying was visually judged based on the following criteria to evaluate cleaning property. ⊚: When the cleaning time was 3 minutes, the flux was successfully removed. ◯+: When the cleaning time was 3 minutes, flux remained, but when the cleaning time was 5 minutes, the flux was successfully removed. ◯: When the cleaning time was 5 minutes, flux remained, but when the cleaning time was 10 minutes, the flux was successfully removed. Δ: When the cleaning time was 10 minutes, a small amount of flux remained, but when the cleaning time was 20 minutes, the flux was successfully removed. ×: When the cleaning time was 20 minutes, flux remained.

[0159] (Conditions for cleaning using the immersion ultrasonic method and rinsing with water) Ultrasonic frequency: 40kHz Ultrasonic output: 100W Ultrasonic tank internal dimensions: 240mm x 140mm Watt Density: 0.30W / cm 2

[0160] <Evaluation of corrosion inhibition> The aluminum test panels (Japan Test Panel, A1050P) were brought into contact with the cleaning liquid compositions, water-dilutable cleaners X and Y obtained in Examples 1 to 24 and Comparative Examples 1 to 14 at a liquid temperature of 60°C under immersion stirring conditions for 10 minutes. Subsequently, the test substrates were brought into contact with ion-exchanged water at a liquid temperature of 25°C for 10 minutes for pre-rinsing. Further, final rinsing was performed with running ion-exchanged water for 1 minute. Visual inspection was carried out on the corrosion of the aluminum test panels after drying based on the following criteria. ○: No discoloration or appearance change on the aluminum test panel. ×: There is discoloration or appearance change on the aluminum test panel.

[0161] <Evaluation of Copper Oxide Film Removal Property> (Preparation of Test Substrate for Copper Oxide Film Removal Property Evaluation) A test substrate with a copper oxide film was prepared by heating a phosphor-deoxidized copper plate (C1220P, 50 mm × 50 mm × thickness 0.3 mm) in a circulating air dryer at 170°C for 10 minutes.

[0162] (Copper Oxide Film Removal Test) Using the above test substrates, a copper oxide film removal test by immersion stirring was carried out. The test substrates for copper oxide film removal property evaluation were brought into contact with the cleaning agent compositions, water-dilutable cleaners X and Y obtained in Examples 1 to 24 and Comparative Examples 1 to 14 at a liquid temperature of 60°C for 10 minutes for cleaning. Subsequently, the test substrates were brought into contact with ion-exchanged water at a liquid temperature of 25°C for 10 minutes for pre-rinsing. Further, final rinsing was performed with running ion-exchanged water for 1 minute. Then, the test substrates were air-blown for 1 minute to remove moisture and dried. The surface of the dried test substrates was visually inspected based on the following criteria to evaluate the copper oxide film removal property. ○: The copper oxide film could be removed. ×: The copper oxide film remained.

[0163] <pH Measurement> Using a pH meter (manufactured by HORIBA, Ltd., product name "D-54"), an electrode was immersed in the water-diluted cleaning agents X and Y obtained in Examples 1 to 24 and Comparative Examples 1 to 14 at a liquid temperature of 25°C, and the water-diluted cleaning agents X and Y were measured after stirring with a magnetic stirrer for 1 minute.

Claims

1. 3-amino-4-octanol (A), At least one organic phosphorus compound (B) selected from the group consisting of acidic phosphoric acid esters (B1), organic phosphonic acids (B2) and salts thereof, and A cleaning composition which optionally contains water (C).

2. The cleaning composition according to claim 1 , further comprising an organic solvent (D).

3. The cleaning composition according to claim 1 or 2, which is for removing flux residue.

4. A cleaning agent composition comprising the cleaning agent composition according to claim 1 or 2 and water, A water-diluted cleaning agent comprising 100 to 1,500 parts by mass of water per 100 parts by mass of the cleaning composition according to claim 1 or 2.

5. The water-diluted cleaning agent according to claim 4, which is for removing flux residue.

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