Testing device

Abstract

To speed up reception and transmission of signals between a tested device and a semiconductor testing device.SOLUTION: A testing device 1 comprises: a driver 22 electrically connected to a tested object 2 and providing a test signal to the tested object 2; a comparator 24 electrically connected to the tested object 2 and comparing a response signal from the tested object 2 with a prescribed threshold; a test signal provision part 12 providing the test signal to the driver 22; and a tested signal reception part 14 receiving output from the comparator 24. The driver 22 is arranged closer to the tested object 2 than the test signal provision part 12, and the comparator 24 is arranged closer to the tested object 2 than the tested signal reception part 14. A bandwidth of communication between the driver 22 and the test signal provision part 12 is larger than a bandwidth of communication between the driver 22 and the tested object 2. A bandwidth of communication between the comparator 24 and the tested signal reception part 14 is larger than a bandwidth of communication between the comparator 24 and the tested object 2.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to transmission and reception of signals between a device under test and a semiconductor test apparatus. [Background technology]

[0002] The device under test and the semiconductor test equipment are connected by a transmission line that transmits electrical signals. In particular, when transmitting and receiving high-speed signals between the device under test and the semiconductor test equipment, the transmission line needs to be designed to have a wide transmission band.

[0003] It should be noted that there are known techniques for performing optical transmission between a semiconductor test apparatus and a device under test (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-181251 A [Patent Document 2] JP 2009-128358 A [Patent Document 3] JP 2008-116420 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned conventional technologies, the high-speed signal connection path between the device under test and the semiconductor test equipment uses electrical signal transmission such as transmission lines on a printed circuit board, connectors, and cables. In general, due to the mechanical structure of the semiconductor test equipment, the physical length of the transmission line is often several tens of centimeters to 1 meter or more, and the band is limited by the transmission line, making it difficult to transmit and receive high-speed signals.

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to increase the speed of signal transmission and reception between a device under test and a semiconductor test apparatus. [Means for solving the problem]

[0007] A first testing apparatus according to the present invention comprises a driver electrically connected to an object under test and supplying a test signal to the object under test, and a test signal supplying unit supplying the test signal to the driver, wherein the driver is positioned closer to the object under test than the test signal supplying unit, and the bandwidth of communication between the driver and the test signal supplying unit is configured to be wider than the bandwidth of communication between the driver and the object under test.

[0008] According to a first testing apparatus of the present invention, a driver is electrically connected to an object to be tested and applies a test signal to the object to be tested. A test signal applying unit applies the test signal to the driver. The driver is disposed closer to the object to be tested than the test signal applying unit. A bandwidth of communication between the driver and the test signal applying unit is wider than a bandwidth of communication between the driver and the object to be tested.

[0009] In the first test apparatus according to the present invention, the driver and the test signal providing section may perform optical transmission.

[0010] In the first test apparatus according to the present invention, the driver and the test signal providing section may be connected via an optical transmission line.

[0011] In the first test apparatus according to the present invention, the driver and the test signal providing section may perform wireless communication.

[0012] In addition, the first testing apparatus according to the present invention may include a switch for switching whether the device under test and the driver are connected or not, and the switch may be arranged closer to the device under test than the test signal applying section.

[0013] In the first test apparatus according to the present invention, the switch may connect the device under test to a DC measurement unit for performing a DC test on the device under test.

[0014] In addition, the first test apparatus of the present invention may include a receiver that receives an output signal from the subject under test and performs output based on the output signal, and the driver may be positioned closer to the subject under test than the receiver, and the bandwidth of communication between the receiver and the subject under test may be wider than the bandwidth of communication between the driver and the subject under test.

[0015] In the first test apparatus according to the present invention, the device under test and the driver may be arranged on the same board.

[0016] In the first test apparatus according to the present invention, the device under test and the driver may be arranged on different boards.

[0017] In the first test apparatus according to the present invention, the board on which the device under test is arranged may be arranged above the board on which the driver is arranged.

[0018] A second test apparatus according to the present invention comprises a receiver electrically connected to a subject under test, receiving an output signal from the subject under test, and producing an output based on the output signal, and a test signal receiving section that receives the output of the receiver, wherein the receiver is positioned closer to the subject under test than the test signal receiving section, and the bandwidth of communication between the receiver and the test signal receiving section is configured to be wider than the bandwidth of communication between the receiver and the subject under test.

[0019] According to a second test apparatus of the present invention, a receiver is electrically connected to an object to be tested, receives an output signal from the object to be tested, and performs output based on the output signal. A signal receiving unit to be tested receives the output of the receiver. The receiver is disposed closer to the object to be tested than the signal receiving unit to be tested. A bandwidth of communication between the receiver and the signal receiving unit to be tested is wider than a bandwidth of communication between the receiver and the object to be tested.

[0020] In the second test apparatus according to the present invention, the receiver and the signal receiving section under test may perform optical transmission.

[0021] In the second test apparatus according to the present invention, the receiver and the signal receiving section under test may be connected via an optical transmission line.

[0022] In the second test apparatus according to the present invention, the receiver and the signal receiving section under test may perform wireless communication.

[0023] In addition, the second test apparatus of the present invention may include a switch for switching whether the test subject and the receiver are connected or not, and the switch may be arranged closer to the test subject than the response signal receiving unit.

[0024] In the second test apparatus according to the present invention, the switch may connect the device under test to a DC measurement unit for performing a DC test on the device under test.

[0025] In addition, the second test apparatus of the present invention may include a driver that supplies a test signal to the subject under test, and the receiver may be positioned closer to the subject under test than the driver, so that the bandwidth of communication between the driver and the subject under test is wider than the bandwidth of communication between the receiver and the subject under test.

[0026] In the second test apparatus according to the present invention, the device under test and the receiver may be arranged on the same board.

[0027] In the second test apparatus according to the present invention, the device under test and the receiver may be arranged on different boards.

[0028] In the second test apparatus according to the present invention, the board on which the device under test is arranged may be arranged above the board on which the receiver is arranged.

[0029] A third testing apparatus according to the present invention comprises a driver electrically connected to an object under test and providing a test signal to the object under test, a receiver electrically connected to the object under test and receiving an output signal from the object under test and performing an output based on the output signal, a test signal providing section providing the test signal to the driver, and a test signal receiving section receiving the output of the receiver, wherein the driver is positioned closer to the object under test than the test signal providing section, and the receiver is positioned closer to the object under test than the test signal receiving section, the bandwidth of communication between the driver and the test signal providing section is wider than the bandwidth of communication between the driver and the object under test, and the bandwidth of communication between the receiver and the test signal receiving section is wider than the bandwidth of communication between the receiver and the object under test.

[0030] According to a third testing apparatus of the present invention, a driver is electrically connected to an object under test and provides a test signal to the object under test. A receiver is electrically connected to the object under test and receives an output signal from the object under test and performs output based on the output signal. A test signal providing section provides the test signal to the driver. A signal receiving section receives the output of the receiver. The driver is disposed closer to the object under test than the test signal providing section. The receiver is disposed closer to the object under test than the signal receiving section. The bandwidth of communication between the driver and the test signal providing section is wider than the bandwidth of communication between the driver and the object under test. The bandwidth of communication between the receiver and the signal receiving section is wider than the bandwidth of communication between the receiver and the object under test.

[0031] The third test apparatus according to the present invention may further include a switch for connecting the driver or the receiver to the device under test.

[0032] In addition, in the first and third test apparatuses of the present invention, the test signal applying section may have a pattern generator that generates a pattern of the test signal, and a timing generator that generates an output timing of the test signal.

[0033] In addition, in the second and third test apparatuses of the present invention, the signal receiving section under test may have an expected value pattern generating section which generates an expected value pattern, an expected value comparison timing generating section which outputs a timing signal which provides the timing for comparing the expected value patterns, and an expected value comparing section which compares the output signal from the receiver with the expected value pattern. [Brief description of the drawings]

[0034] [Figure 1] 1 is a functional block diagram showing a configuration of a test device 1 according to an embodiment of the present invention. [Diagram 2] 1 is a functional block diagram showing a configuration of a test device 1 according to a first modified example of an embodiment of the present invention. [Diagram 3] FIG. 11 is a functional block diagram showing a configuration of a test device 1 according to a second modified example of the embodiment of the present invention. [Figure 4] 2 is a functional block diagram showing a configuration of a test signal applying section 12. FIG. [Diagram 5] FIG. 13 is a functional block diagram showing a configuration of a test device 1 according to a fifth modified example of the embodiment of the present invention. [Figure 6] FIG. 13 is a diagram showing an example of a connection mode of a socket board 6 and a satellite board 7 in a test apparatus 1 according to a fifth modified example of the embodiment of the present invention. [Figure 7] 13 is a functional block diagram showing a configuration of a test apparatus 1 (wherein a DC measurement unit 8 and a device under test 2 are connected) according to a fourth modified example of the embodiment of the present invention. FIG. [Figure 8] 13 is a functional block diagram showing a configuration of a test apparatus 1 (wherein a driver 22 and a comparator 24 are connected to a device under test 2) according to a fourth modified example of the embodiment of the present invention. [Figure 9] 2 is a functional block diagram showing a configuration of a signal receiving section 14 under test. FIG. [Figure 10] 11 is a functional block diagram showing a configuration of a test apparatus 1 (wherein a driver 22 and a device under test 2 are connected) according to a third modified example of the embodiment of the present invention. FIG. [Figure 11] 11 is a functional block diagram showing a configuration of a test apparatus 1 (wherein a comparator 24 and a device under test 2 are connected) according to a third modified example of the embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0036] 1 is a functional block diagram showing a configuration of a test apparatus 1 according to an embodiment of the present invention. The test apparatus 1 according to the embodiment of the present invention includes a test head 10, a driver 22, a comparator 24, an optical transmission path 30, an O / E conversion element 42, and an E / O conversion element 44.

[0037] The test apparatus 1 is connected to a device under test (DUT) 2. The test head 10 includes a test signal providing section 12, a signal receiving section 14, an E / O conversion element 13, and an O / E conversion element 15. The device under test 2, a driver (Dr: Driver) 22, a comparator (Cp: Comparator) 24, an O / E conversion element 42, and an E / O conversion element 44 are arranged on a socket board 6. The driver 22 and the comparator 24 are collectively referred to as pin electronics 20. It is preferable to implement the driver 22, the comparator 24, the O / E conversion element 42, and the E / O conversion element 44 using a SiP (System in Package), but it is also possible to implement them using a SoC (System on Chip) using a Si photonics process.

[0038] The driver 22 is electrically connected to the object under test 2 and provides a test signal to the object under test 2. The comparator 24 is electrically connected to the object under test 2 and receives an output signal from the object under test 2 (i.e., a signal that the object under test 2 outputs to the semiconductor test device) and compares it with a predetermined threshold. The driver 22 can also provide a binary signal of 0 or 1, or a multi-value signal of three or more values, 0, 1, 2, ..., as a test signal. The comparator 24 receives the output signal of two values ​​of 0 or 1, or a multi-value signal of three or more values, 0, 1, 2, ..., and compares it with a predetermined multi-value threshold.

[0039] The test signal providing unit 12 provides a test signal to the driver 22 via the E / O conversion element 13, the optical transmission line 30, and the O / E conversion element 42. That is, when the test signal providing unit 12 outputs a test signal (an electrical signal), the E / O conversion element 13 converts the test signal from an electrical signal to an optical signal. Next, the output of the E / O conversion element 13 is provided to the O / E conversion element 42 via the optical transmission line 30. Then, the O / E conversion element 42 converts the test signal from an optical signal to an electrical signal, and provides it to the driver 22.

[0040] The signal receiving unit 14 under test receives the output of the comparator 24 via the E / O converting element 44, the optical transmission line 30, and the O / E converting element 15. That is, the output of the comparator 24 (which is an electrical signal) is converted into an optical signal by the E / O converting element 44. Next, the output of the E / O converting element 44 is provided to the O / E converting element 15 via the optical transmission line 30. Then, the output of the comparator 24 is converted from an optical signal into an electrical signal by the O / E converting element 15, and provided to the signal receiving unit 14 under test.

[0041] The driver 22 is arranged closer to the subject 2 under test than the test signal applying section 12. The comparator 24 is arranged closer to the subject 2 under test than the signal receiving section 14.

[0042] As an example, the distance between the object under test 2 and the pin electronics 20 is about 1 cm, and the optical transmission path 30 is, for example, an optical fiber having a length of about 1 m or more, but these distances and lengths are not limited to the above values.

[0043] The bandwidth of communication between the driver 22 and the test signal providing unit 12 is wider than the bandwidth of communication between the driver 22 and the object under test 2. That is, the driver 22 and the test signal providing unit 12 are connected by the optical transmission path 30 via the E / O conversion element 13 and the O / E conversion element 42. The driver 22 and the test signal providing unit 12 perform optical transmission by the optical transmission path 30 via the E / O conversion element 13 and the O / E conversion element 42. The bandwidth of the optical transmission by the optical transmission path 30 is the bandwidth of communication between the driver 22 and the test signal providing unit 12, and is wider than the bandwidth of communication (by electrical connection) between the driver 22 and the object under test 2. Note that the test signal providing unit 12 and the E / O conversion element 13 are very close to each other, and the driver 22 and the O / E conversion element 42 are also very close to each other, so the presence of the E / O conversion element 13 and the O / E conversion element 42 does not limit the bandwidth of communication between the driver 22 and the test signal providing unit 12.

[0044] It is also possible to configure the driver 22 and the test signal providing unit 12 to perform wireless communication. In this case, the E / O conversion element 13, the O / E conversion element 42, and the optical transmission path 30 are not required. However, this is premised on the fact that the bandwidth of communication between the driver 22 and the test signal providing unit 12 is wider than the bandwidth of communication between the driver 22 and the device under test 2.

[0045] The bandwidth of communication between the comparator 24 and the signal receiving unit 14 under test is wider than the bandwidth of communication between the comparator 24 and the subject under test 2. That is, the comparator 24 and the signal receiving unit 14 under test are connected by the optical transmission path 30 via the E / O conversion element 44 and the O / E conversion element 15. The comparator 24 and the signal receiving unit 14 under test perform optical transmission by the optical transmission path 30 via the E / O conversion element 44 and the O / E conversion element 15. The bandwidth of the optical transmission by the optical transmission path 30 is the bandwidth of communication between the comparator 24 and the signal receiving unit 14 under test, and is wider than the bandwidth of communication (by electrical connection) between the comparator 24 and the subject under test 2. Furthermore, since the test signal receiving section 14 and the O / E conversion element 15 are located very close to each other, and the comparator 24 and the E / O conversion element 44 are also located very close to each other, the presence of the E / O conversion element 44 and the O / E conversion element 15 does not limit the bandwidth of communication between the comparator 24 and the test signal receiving section 14.

[0046] It is also possible to configure the comparator 24 and the signal receiving unit 14 to communicate wirelessly. In this case, the E / O conversion element 44, the O / E conversion element 15, and the optical transmission path 30 are not required. However, this is premised on the fact that the bandwidth of communication between the comparator 24 and the signal receiving unit 14 is wider than the bandwidth of communication between the comparator 24 and the object 2 under test.

[0047] 4 is a functional block diagram showing the configuration of the test signal applying section 12. The test signal applying section 12 includes a pattern generator 122, a timing generator 124, and a pulse output section 126.

[0048] The pattern generator 122 generates a test signal pattern. The test signal pattern is, for example, a sequence of binary data of 0 or 1, such as 01001... (a sequence of data of ternary or more values ​​is also possible).

[0049] The timing generator 124 generates the output timing of the test signal (for example, the output start time and period of the test signal).

[0050] The pulse output section 126 outputs a pulse corresponding to the outputs of the pattern generator 122 and the timing generator 124 as a test signal.

[0051] 9 is a functional block diagram showing a configuration of the signal receiving section 14. The signal receiving section 14 includes an expected value pattern generating section 142, an expected value comparison timing generating section 144, and an expected value comparing section 146.

[0052] The expected value pattern generating section 142 generates an expected value pattern used by the expected value comparing section 146 .

[0053] The expected value comparison timing generating section 144 outputs a timing signal that provides the timing for comparing the expected value patterns. Furthermore, the expected value comparison timing generating section 144 latches the output signal from the comparator 24 that is provided to the signal receiving section 14 under test via the E / O converting element 44, the optical transmission line 30, and the O / E converting element 15.

[0054] The expected value comparison section 146 compares the logical value of the output signal from the comparator 24, which is provided to the signal receiving section 14 under test via the E / O conversion element 44, the optical transmission path 30 and the O / E conversion element 15, with the expected value pattern, and outputs the comparison result.

[0055] In addition, the subject 2 is often intentionally placed in high and low temperature environments during testing. Therefore, if the test signal applying section 12 and the signal receiving section 14 (particularly the timing generator 124) are placed near the subject 2, the test signal applying section 12 and the signal receiving section 14 will be affected by the high and low temperatures and will not be able to maintain the desired accuracy.

[0056] Furthermore, since the test signal applying section 12 and the test signal receiving section 14 have a large circuit scale and require a large amount of power, it is difficult to secure space for arranging them near the device under test 2 due to the power supply and cooling structures.

[0057] Next, the operation of the embodiment of the present invention will be described.

[0058] First, when the test signal providing unit 12 outputs a test signal (which is an electrical signal), the test signal is converted from an electrical signal to an optical signal by the E / O conversion element 13. Next, the output of the E / O conversion element 13 is transmitted via an optical transmission path 30 with a wide communication band, and is provided to the O / E conversion element 42. Then, the O / E conversion element 42 converts the test signal from an optical signal to an electrical signal, and provides it to the driver 22.

[0059] Then, a test signal is provided from the driver 22 to the device under test 2. At the same time, a signal under test is output from the device under test 2 and provided to the comparator 24. The comparator 24 first receives the signal under test and outputs it to a signal under test receiving section which performs a logical judgment of the signal under test. The comparator 24 compares the signal under test with a predetermined threshold (level threshold) and outputs a result with a logic according to the comparison result.

[0060] The output (electrical signal) of the comparator 24 is converted to an optical signal by the E / O conversion element 44. Next, the output of the E / O conversion element 44 is provided to the O / E conversion element 15 via the optical transmission path 30 with a wide communication band. Then, the O / E conversion element 15 converts the output of the comparator 24 from an optical signal to an electrical signal, and provides it to the signal receiving unit 14 under test.

[0061] The test signal receiving section 14 receives the output of the comparator 24, compares it with the pattern of the test signal, and performs a test (for example, a function test) on the device under test 2.

[0062] According to the test apparatus 1 according to the embodiment of the present invention, the speed of transmitting and receiving signals between the device under test 2 and the test apparatus 1 can be increased.

[0063] That is, since the pin electronics 20 is located close to the device under test 2, signals can be transmitted and received between the pin electronics 20 and the device under test 2 at high speed.

[0064] However, as described above, it is difficult to place the test signal applying section 12 and the signal receiving section 14 under test close to the device under test 2, so they have to be placed far away. However, by connecting the test signal applying section 12 and the signal receiving section 14 under test to the pin electronics 20 via an optical transmission path 30 with a wide communication bandwidth for optical transmission, signals can be sent and received at high speed.

[0065] Furthermore, since the pin electronics 20 are located close to the device under test 2, the power used for waveform equalization that compensates for the transmission line distortion of the high-speed electrical signal can be significantly reduced, and the power consumption of the entire test apparatus 1 can be reduced.

[0066] Furthermore, by using the optical transmission path 30, the transmission distance of the electrical transmission (transmission of the signal between the pin electronics 20 and the device under test 2) can be shortened, thereby suppressing inter-symbol interference caused by waveform distortion that occurs in the electrical transmission path.

[0067] Instead of comparator 24, a circuit that compares the output signal from the object under test 2 with a predetermined threshold value (for example, a circuit that performs comparison operations using a differential amplifier, an operational amplifier, a logic gate, a photocoupler or a relay) (hereinafter referred to as a "comparison circuit") may be used.

[0068] Also, a repeater that receives a signal, linearly amplifies it, and repeats it may be used instead of the comparator 24. However, the output of this repeater is compared with a predetermined threshold value before being provided to the expected value comparison section 146, and the result is provided to the expected value comparison section 146.

[0069] Furthermore, comparator 24 and the comparison circuit and repeater used in place of comparator 24 can all be considered receivers that receive an output signal from device under test 2 and perform output based on that output signal.

[0070] The following modifications are possible to the embodiment of the present invention.

[0071] First Variation The first modified example corresponds to a case where the response signal outputted from the device under test 2 is an optical signal.

[0072] FIG. 2 is a functional block diagram showing a configuration of a test device 1 according to a first modified example of the embodiment of the present invention.

[0073] The comparator 24 is disposed within the test head 10. As a result, the driver 22 is disposed closer to the device under test 2 than the comparator 24. The comparator 24 receives the output of the O / E conversion element 15, and the output of the comparator 24 is provided to the signal receiving unit 14 under test.

[0074] In addition, the bandwidth of communication between the comparator 24 and the subject under test 2 is wider than the bandwidth of communication between the driver 22 and the subject under test 2. That is, the comparator 24 and the subject under test 2 are connected by an optical transmission path 30. The bandwidth of the optical transmission by this optical transmission path 30 is the bandwidth of communication between the comparator 24 and the subject under test 2, and is wider than the bandwidth of communication (by electrical connection) between the driver 22 and the subject under test 2.

[0075] Second Variation The second modified example corresponds to a case where the test signal given to the device under test 2 is an optical signal.

[0076] FIG. 3 is a functional block diagram showing a configuration of a test device 1 according to a second modified example of the embodiment of the present invention.

[0077] The driver 22 is disposed within the test head 10. As a result, the comparator 24 is disposed closer to the device under test 2 than the driver 22. The driver 22 receives the output of the test signal providing unit 12, and the output of the driver 22 is provided to the E / O conversion element 13.

[0078] In addition, the bandwidth of communication between the driver 22 and the subject under test 2 is wider than the bandwidth of communication between the comparator 24 and the subject under test 2. That is, the driver 22 and the subject under test 2 are connected by an optical transmission path 30. The bandwidth of optical transmission by this optical transmission path 30 is the bandwidth of communication between the driver 22 and the subject under test 2, and is wider than the bandwidth of communication (by electrical connection) between the comparator 24 and the subject under test 2.

[0079] Third Modification In the third modified example, when the pin electronics 20 has both a driver and a comparator function, the connection between the pin electronics 20 and the device under test 2 is shared for input and output.

[0080] Fig. 10 is a functional block diagram showing the configuration of a test device 1 (wherein driver 22 is connected to device under test 2) according to a third modified example of the embodiment of the present invention. Fig. 11 is a functional block diagram showing the configuration of a test device 1 (wherein comparator 24 is connected to device under test 2) according to a third modified example of the embodiment of the present invention.

[0081] The pin electronics 20 further has a switch that switches between connecting the driver 22 to the object under test 2 (e.g., an input / output pin of the object under test 2) (see FIG. 10) or connecting the comparator 24 to the object under test 2 (e.g., an input / output pin of the object under test 2) (see FIG. 11).

[0082] Fourth Modification In the fourth modification, the test device 1 further includes a switch 50 .

[0083] Fig. 7 is a functional block diagram showing a configuration of a test device 1 (wherein a DC measurement unit 8 is connected to a device under test 2) according to a fourth modified embodiment of the present invention. Fig. 8 is a functional block diagram showing a configuration of a test device 1 (wherein a driver 22 and a comparator 24 are connected to a device under test 2) according to a fourth modified embodiment of the present invention.

[0084] Switch 50 switches between connecting DC measurement unit 8 to device under test 2 (see FIG. 7) or connecting driver 22 and comparator 24 to device under test 2 (see FIG. 8). However, DC measurement unit 8 is a circuit for DC testing.

[0085] Fifth Modification In the fifth modification, the test device 1 further includes a satellite board 7 .

[0086] 5 is a functional block diagram showing a configuration of a test device 1 according to a fifth modified example of the embodiment of the present invention. In the test device 1 according to the fifth modified example, the driver 22, the comparator 24, the O / E conversion element 42, and the E / O conversion element 44 are mounted on a satellite board 7 that is different from the socket board 6. The satellite board 7 is connected to the socket board 6 at an extremely short distance. Thus, in the fifth modified example, the satellite board 7 on which the driver 22 and the comparator 24 are arranged is different from the socket board 6 on which the device under test 2 is arranged. This is different from the embodiment of the present invention in which the driver 22, the comparator 24, and the device under test 2 are all arranged on the same socket board 6.

[0087] 6 is a diagram showing an example of a connection mode of the socket board 6 and the satellite board 7 in the test apparatus 1 according to the fifth modified example of the embodiment of the present invention. The connector 6c of the socket board 6 and the connector 7c of the satellite board 7 are directly connected. The satellite board 7 is disposed below the socket board 6. The E / O conversion element 44 has an optical transmission connector 44op (connected to the optical transmission path 30). Thus, in the fifth modified example, the socket board 6 on which the device under test 2 is disposed is disposed above the satellite board 7 on which the driver 22 and the comparator 24 are disposed. [Explanation of symbols]

[0088] 1 Test equipment 2. Device Under Test (DUT) 6 Socket Board 10 Test Head 12 Test signal application section 13 E / O conversion element 14. Signal receiving section under test 15 O / E conversion element 20 pin electronics 22 Driver 24 Comparator (Cp) 30 Optical Transmission Line 42 O / E conversion element 44 E / O conversion element 50 Switch

Claims

1. a driver electrically connected to the device under test for providing a test signal to the device under test; a test signal applying unit for applying the test signal to the driver; Equipped with the driver is disposed closer to the device under test than the test signal applying unit, a bandwidth of communication between the driver and the test signal applying unit is wider than a bandwidth of communication between the driver and the device under test; Test equipment.

2. 2. The test device according to claim 1, The driver and the test signal providing unit perform optical transmission. Test equipment.

3. 3. The test device according to claim 2, the driver and the test signal providing unit are connected via an optical transmission line; Test equipment.

4. 2. The test device according to claim 1, The driver and the test signal applying unit perform wireless communication. Test equipment.

5. 2. The test device according to claim 1, a switch for switching whether the device under test and the driver are connected or not; the switch is disposed closer to the device under test than the test signal applying unit; Test equipment.

6. 6. The test device according to claim 5, The test apparatus, wherein the switch connects the device under test to a DC measurement unit for performing a DC test on the device under test.

7. 2. The test device according to claim 1, a receiver that receives an output signal from the device under test and produces an output based on the output signal; the driver is disposed closer to the device under test than the receiver; a bandwidth of communication between the receiver and the subject under test being greater than a bandwidth of communication between the driver and the subject under test; Test equipment.

8. 2. The test device according to claim 1, The device under test and the driver are arranged on the same board. Test equipment.

9. 2. The test device according to claim 1, The device under test and the driver are arranged on separate boards. Test equipment.

10. 10. The test device according to claim 9, the board on which the device under test is arranged is arranged above the board on which the driver is arranged; Test equipment.

11. a receiver electrically connected to the device under test to receive an output signal from the device under test and to provide an output based on the output signal; a signal receiving unit for receiving an output of the receiver; Equipped with the receiver is disposed closer to the device under test than the signal receiving unit under test, a bandwidth of communication between the receiver and the test signal receiving unit is wider than a bandwidth of communication between the receiver and the test subject; Test equipment.

12. 12. The test device according to claim 11, The receiver and the test signal receiving unit perform optical transmission. Test equipment.

13. 13. A test device according to claim 12, the receiver and the test signal receiving unit are connected via an optical transmission line; Test equipment.

14. 12. The test device according to claim 11, The receiver and the test signal receiving unit perform wireless communication. Test equipment.

15. 12. The test device according to claim 11, a switch for switching whether the device under test and the receiver are connected or not; the switch is disposed closer to the device under test than the response signal receiving unit; Test equipment.

16. 16. A test device according to claim 15, The test apparatus, wherein the switch connects the device under test to a DC measurement unit for performing a DC test on the device under test.

17. 12. The test device according to claim 11, a driver for applying a test signal to the device under test; the receiver is disposed closer to the device under test than the driver; a bandwidth of communication between the driver and the device under test that is greater than a bandwidth of communication between the receiver and the device under test; Test equipment.

18. 12. The test device according to claim 11, The device under test and the receiver are arranged on the same substrate. Test equipment.

19. 12. The test device according to claim 11, The device under test and the receiver are arranged on separate substrates. Test equipment.

20. 20. The test device of claim 18, a board on which the test object is arranged is disposed above a board on which the receiver is arranged; Test equipment.

21. a driver electrically connected to the device under test for providing a test signal to the device under test; a receiver electrically connected to the device under test, for receiving an output signal from the device under test and for providing an output based on the output signal; a test signal applying unit for applying the test signal to the driver; a signal receiving unit for receiving an output of the receiver; Equipped with the driver is disposed closer to the device under test than the test signal applying unit, the receiver is disposed closer to the device under test than the signal receiving unit under test, a bandwidth of communication between the driver and the test signal applying unit is wider than a bandwidth of communication between the driver and the device under test; a bandwidth of communication between the receiver and the test signal receiving unit is wider than a bandwidth of communication between the receiver and the test subject; Test equipment.

22. 22. A test device according to claim 21, comprising: A test apparatus comprising a switch for connecting the driver or the receiver to the device under test.

23. 23. A test device according to any one of claims 1 to 10, 21 and 22, comprising: The test signal providing unit, a pattern generator for generating a pattern of the test signal; a timing generator for generating an output timing of the test signal; A test device having the following:

24. 23. A test device according to any one of claims 11 to 22, comprising: The signal receiving unit under test, an expected value pattern generating unit that generates an expected value pattern; an expected value comparison timing generating section that outputs a timing signal that provides a timing for comparing the expected value patterns; an expected value comparison unit that compares an output signal from the receiver with the expected value pattern; A test device having the following:

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