Composition containing amide compound

Abstract

To provide a composition which has high dissolving power to water, various organic substances and inorganic substances, has no harmfulness such as irritation and toxicity, and is easily used in various industrial applications as a solvent for a chemical reaction and resin synthesis, a solvent for analysis, a solvent for dissolving a resin, a coating material and ink, a diluent for dilution, a dispersion agent for dispersion, a cleaning agent for cleaning a manufacturing facility, a metal component and an electronic component, a release agent for releasing a resist and a resin, a liquid crystal orientation treatment agent for orientation treatment of a liquid crystal molecule, and a non-aqueous electrolyte for manufacturing a battery, and various preparations and products containing the same.SOLUTION: A composition contains a compound (A) having an N-substituted and / or N,N-disubstituted amide group, and a neutralized salt (B) of an acidic compound and a basic compound.

Description

[Technical field]

[0001] The present invention relates to a composition containing an amide compound and uses thereof. [Background technology]

[0002] Amide compounds, as amide solvents, dissolve water as well as various organic and inorganic substances well, have high boiling points and flash points, and are thermally and chemically stable, and in particular, those that are liquid at room temperature are widely used industrially as amide solvents, such as reaction and purification solvents, cleaning agents, resist strippers, etc. Traditionally, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), and dimethylacetamide (DMAC) have been representatively known as amide solvents, but these compounds have become problematic in terms of their harmfulness to the human body, such as their skin irritation, carcinogenicity (mutagenicity), and reproductive toxicity (teratogenicity), which may be present or may be suspected.

[0003] In order to solve the problem of low safety of amide-based solvents such as NMP and DMF, attention has been paid to N-butyl-2-pyrrolidone (NBP) and 3-methoxy-N,N-dimethylpropanamide (KJCMPA (registered trademark)) as amide-based solvents that are highly safe without skin irritation, mutagenicity, teratogenicity, etc., and have high dissolving power for various organic compounds and synthetic resins. Patent Documents 1 and 2 disclose the use of NBP and KJCMPA as a substitute for NMP as a solvent for synthesizing polyimide precursors, polyimide resins, etc. However, although these patent documents confirmed that NBP and KJCMPA have the same dissolving power as the conventional solvent NMP, they did not solve various problems that are likely to occur with amide-based solvents including conventional NMP, such as the molecular weight of the polyimide precursor being difficult to extend, the solution stability of the polyimide precursor being low (prone to become cloudy), the tendency to whiten during polyimide film formation, and the tendency to generate surface unevenness.

[0004] Although polyurethane is a plastic material, it is soft like rubber and has excellent tensile strength (tensile strength), abrasion resistance, elasticity, and oil resistance, and is used in a variety of industrial products, from everyday items such as the soles of sports shoes and clothing, to industrial materials such as soundproofing materials, heat-insulating materials, and adhesives, and automotive materials such as bumpers and headrests. Polyurethane can be synthesized in various ways depending on its structure and use, but since the urethane reaction is accompanied by an exothermic reaction, many thermoplastic polyurethanes are stably synthesized by solution polymerization. In particular, in order to increase the molecular weight, DMF and the like are often used as polar solvents in which the polyurethane produced can be uniformly dissolved. However, as mentioned above, safety issues caused by DMF remain a concern.

[0005] As described above, there is a demand for a composition which contains an amide compound having excellent dissolving power and high safety and which can be easily used for various industrial applications such as synthesis, dissolution, dilution, etc. of various resins, dispersion of pigments, and stripping of resist resins. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special Publication No. 2017-517582 [Patent Document 2] Special Publication No. 2015-511935 Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention aims to provide a composition which has high dissolving power for water, various organic substances, and inorganic substances, is free from harmful properties such as irritation and toxicity, can be stored and used industrially and stably for a long period of time, and can be easily used for various industrial applications such as a solvent for chemical reactions and resin synthesis, a solvent for analysis, a solvent for dissolving resins, paints, inks, etc., a diluent for dilution, a dispersant for dispersion, a detergent for cleaning manufacturing equipment, metal parts, electronic parts, etc., a stripping agent for stripping resists, resins, metals, etc., a liquid crystal alignment treatment agent for aligning liquid crystal molecules, a nonaqueous electrolyte for battery production, etc., and various preparations and products containing the same. [Means for solving the problem]

[0008] Means for Solving the Problems The present inventors have conducted intensive research to solve the above problems, and as a result have found a composition containing compound (A) containing compound (A) having an N-substituted and / or N,N-disubstituted amide group, and a neutral salt (B) of an acidic compound and a basic compound, thereby completing the present invention.

[0009] That is, the present invention is based on the following configuration. (1) A composition comprising (A) a compound having an N-substituted and / or N,N-disubstituted amide group, and (B) a neutral salt of an acidic compound and a basic compound. (2) The composition according to (1) above, further comprising an acidic compound that forms a neutralized salt (B), and having an acid value of 0.1 to 40 mgKOH / g. (3) The composition according to (1) or (2), wherein compound (A) is an N-substituted and / or N,N-disubstituted propanamide represented by the following general formula [1]: [ka] (In the formula, R5 and R6 each independently represent a linear or branched, saturated or unsaturated alkyl group, hydroxyalkyl group, aminoalkyl group, or alkyl ether group having 1 to 18 carbon atoms, or an alicyclic hydrocarbon or aromatic hydrocarbon having 6 to 18 carbon atoms; R1 to R4 each independently represent a hydrogen atom, a methyl group, or a hydroxyl group. In addition, R5 and R6 each independently represent a hydrogen atom (except when both are hydrogen atoms), or include those which form a saturated 5- to 7-membered ring (including those having an oxygen atom) together with the nitrogen atom carrying them; Y represents a hydrogen atom, a hydroxyl group, an amine group, a linear or branched, a saturated or unsaturated alkyl group, an alicyclic hydrocarbon having 6 to 18 carbon atoms, an aromatic hydrocarbon, an alkoxy group or an amino group represented by the general formula [2] or [3] (wherein R7 is a linear or branched alkyl group or alkenyl group having 1 to 6 carbon atoms, R8 and R9 each independently represent a hydrogen atom or a linear or branched alkyl group, alkyl ether group, alicyclic hydrocarbon, or aromatic hydrocarbon having 1 to 18 carbon atoms (excluding the case where R8 and R9 are both hydrogen atoms). R8 and R9 may also form a saturated 5- to 7-membered ring (including one having an oxygen atom) together with the nitrogen atom carrying them). [ka] [ka] (4) The composition according to any one of (1) to (5), wherein the compound (A) is a β-alkoxy-N-substituted propanamide and / or a β-alkoxy-N,N-disubstituted propanamide represented by the general formula [4]. [ka] (In the formula, R 10 is a linear or branched alkyl group having 1 to 18 carbon atoms; R 11 and R 12 each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms (except when both are hydrogen atoms), R 13 represents a hydrogen atom or a methyl group. (5) The composition according to any one of (1) to (4), wherein the acidic compound is an inorganic and / or organic acid, and the basic compound is an inorganic and / or organic base. (6) The composition according to any one of (1) to (5) above, further comprising a compound (C) having one or more groups selected from an ether group, an ester group, a hydroxyl group, a urea group, an aryl group, and a sulfinyl group. (7) A solvent containing the composition according to any one of (1) to (6) above, which is used for dissolving resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials. (8) A diluent containing the composition according to any one of (1) to (6) above, which is used for diluting resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials. (9) A dispersant containing the composition according to any one of (1) to (6) above, which is used for dispersing resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, conductive materials, and carbon materials. (10) A solvent containing the composition according to any one of (1) to (6) above, which is used in a chemical reaction. (11) A solvent containing the composition according to any one of (1) to (6) above, which is used for analysis by HPLC (liquid chromatography) and / or GPC (gel permeation chromatography). (12) A cleaning agent containing the composition according to any one of (1) to (6) above, which is used for cleaning production equipment, production tools, industrial products, industrial parts, plastic molded products, metal parts, electronic parts, recording device filters, three-dimensional objects, inkjet nozzles, and liquid flow paths of ink cartridges. (13) A release agent containing the composition according to any one of (1) to (6) above, which is used for removing an organic coating layer on a surface of a plastic molded product, a support material for a three-dimensional rough object, a resist on a thin metal film, a UV resin, a urethane resin, or an epoxy resin. (14) A liquid crystal alignment treatment agent containing the composition according to any one of (1) to (6) above, which is used for aligning liquid crystal molecules. (15) A non-aqueous electrolyte solution containing the composition according to any one of (1) to (6) above, which is used in the manufacture of a secondary battery. Effect of the Invention

[0010] The composition of the present invention can be stored and used industrially and stably for a long time, has excellent dissolving power for water and various organic and inorganic substances, is highly safe, and can be easily used for various industrial applications. The composition is characterized by containing a compound (A) having an N-substituted and / or N,N-disubstituted amide group (hereinafter also referred to as amide compound (A)) and a neutral salt (B) of an acidic compound and a basic compound (hereinafter also referred to as neutral salt (B)) as essential components. Compound (A) has excellent dissolving power for organic substances including synthetic resins, excellent dissolving power or dispersing power for inorganic substances, and is highly safe, so that the composition obtained by containing it has high dissolving power and high safety, and can be used as various solvents, diluents, dispersants, cleaning agents, stripping agents, liquid crystal alignment treatment agents, and non-aqueous electrolytes. Neutralized salt (B) does not have harmful effects such as irritation or toxicity like compound (A), can be easily dissolved or dispersed in compound (A), and has the effect of improving the stability of A. The composition obtained by containing it can be stably stored for a long time and can be suitably used for the above-mentioned various industrial applications for a long time. Since the amide group of compound (A) has an electron-donating nitrogen atom, it exhibits basicity, and the strength of its basicity changes depending on the type and number of substituents (N-substitution or N,N-disubstitution) bonded to the nitrogen atom. When used as a solvent for chemical reactions or resin synthesis, it may accelerate or decelerate the reaction, or cause a side reaction. When such an amide compound (A) coexists with neutralized salt (B), the action caused by the basicity of the amide group is suppressed, and the stability of the composition is improved, allowing it to be stored for a long time and to be used for a long time in various industrial applications. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The present invention will now be described in detail. One embodiment of the present invention is a composition (F) containing a compound (A) having an N-substituted and / or N,N-disubstituted amide group and a neutralized salt (B) of an acidic compound and a basic compound. The content of the compound (A) is preferably 25 to 99.999% by mass based on the total content of the composition (F). The content of A is more preferably 50 to 99.99% by mass, and particularly preferably 70 to 99.8% by mass. It is preferable that the composition (F) contains 25% by mass or more of A, since it has sufficient dissolving power for various organic substances, synthetic resins, paints, inks, etc. When A is contained in an amount of 99.999% by mass or less, it is possible to contain 0.001% by mass or more of the neutralized salt (B), which is an essential component of the composition, and it is preferable that B improves the stability of the composition (F), and the storage stability, transparency, and molecular weight of the resins synthesized in F can be improved.

[0012] Compound (A) is preferably a compound having an N-substituted and / or N,N-disubstituted amide group with a molecular weight of 100 or more. If the molecular weight is 100 or more, both the safety and dissolving power of A are improved. Examples of compound (A) include N-alkyl (preferably having 4 or more carbon atoms)-2-pyrrolidones such as N-butyl-2-pyrrolidone and N-hexyl-2-pyrrolidone, N-alkyl (having 1 or more carbon atoms) alkane (preferably having 4 or more carbon atoms) amides such as N-ethylhexanamide and N-butylbutanamide, and N,N-dialkyl (having 1 or more carbon atoms) amides such as N,N-dimethylpropanamide, N,N-dimethylisobutanamide, N,N-dimethylbutanamide, N,N-diethylbutanamide and N,N-dimethyloctanamide. Top) Alkane (preferably having 3 or more carbon atoms) amides, alkoxy (having 1 or more carbon atoms)-N-alkyl (having 1 or more carbon atoms) alkane (having 3 or more carbon atoms) amides such as 3-ethoxy-N-methylpropanamide and 4-hexyloxy-N-ethylbutanamide, alkoxy (having 1 or more carbon atoms)-N-hydroxyalkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amides such as stearoxy-N-hydroxyethylpropanamide, alkoxy (having 1 or more carbon atoms)-N-hydroxyalkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amides such as isooctyloxy-N-dimethylaminopropylpropanamide, etc. Alkoxy (having 1 or more carbon atoms)-N-dialkyl (having 1 or more carbon atoms) aminoalkyl (having 1 or more carbon atoms) alkane (preferably having 2 or more carbon atoms) amide, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, 3-lauroxy-N,N-dimethylpropanamide, 4-ethoxy-N,N-dimethylbutanamide, 3-phenyloxy-N-ethyl-N-methylpropanamide, 3-cyclohexyloxy-N-methyl-N-oleylpropanamide, and other alkoxy (having 1 or more carbon atoms) -N,N-dialkyl (carbon number 1 or more) alkane (carbon number 3 or more is preferred) amide, alkanoyl (carbon number 1 or more) morpholine such as 4-formylmorpholine, 4-acetylmorpholine, 4-propionylmorpholine, 4-butanoylmorpholine, 4-hexanoylmorpholine, 4-octanoylmorpholine, etc., alkoxy (carbon number 1 or more) alkanoyl (carbon number 2 or more is preferred) morpholine such as 4-methoxyethanoylmorpholine, 4-(3-methoxypropinoyl)morpholine, etc., 3-dimethylamino-N,Examples of the compound (A) include dialkyl (having one or more carbon atoms) amino-N,N-dialkyl (having one or more carbon atoms) propanamides such as N-dimethylpropanamide and 3-diethylamino-N,N-diethylpropanamide, and N,N-dialkyl (having two or more carbon atoms) acetamides such as N,N-diethylacetamide, N,N-dipropylacetamide, N,N-diisopropylacetamide, N,N-dibutylacetamide, N,N-diisobutylacetamide, and N,N-dihexylacetamide. These compounds (A) may be used alone or in combination of two or more.

[0013] It is preferable that the compound (A) is an N-substituted and / or N,N-disubstituted propanamide represented by the general formula [1], since it is easy to obtain inexpensive industrial products. (In the formula, R1 to R9 and Y are all the same as defined above.) [ka]

[0014] The compound (A) represented by the general formula [1] is preferably an N-alkyl (carbon number 1 or more) alkane (carbon number 2 or more) amide, N,N-dialkyl (carbon number 1 or more) alkane (carbon number 2 or more) amide, alkoxy (carbon number 1 or more)-N-alkyl ((carbon number 1 or more) alkane (carbon number 2 or more) amide, alkoxy (carbon number 1 or more)-N,N-dialkyl ((carbon number 1 or more) alkane (carbon number 2 or more) amide, dialkyl (carbon number 1 or more) amino-N,N-dialkyl (carbon number 1 or more) propanamide, etc., in which Y is a hydrogen atom, a linear or branched, saturated or unsaturated alkyl group having 1 to 18 carbon atoms, an alkoxy group, or an amino group. These compounds (A) may be used alone or in combination of two or more kinds.

[0015] Compound (A) is preferably β-alkoxy-N-substituted propanamide and / or β-alkoxy-N,N-disubstituted propanamide as shown in general formula [4]. Such compounds have both an ether group and an amide group in the molecule, and have higher dissolving power while maintaining high safety. R in general formula [4] 10 is a linear or branched alkyl group having 1 to 18 carbon atoms; R 11 and R 12 each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms (except when both are hydrogen atoms), R 13 represents a hydrogen atom or a methyl group. 10 ~R 13 By arbitrarily combining the functional groups shown in the following formula, β-alkoxy-N-substituted propanamides and / or β-alkoxy-N,N-disubstituted propanamides having various structures can be produced. Specific examples include β-methoxy-N-methylpropanamide (R 10 and R 11 is a methyl group, R 12 and R 13 is a hydrogen atom), β-methoxy-N,N-dimethylpropanamide (R 10~ R 12 is a methyl group, R 13 is a hydrogen atom), β-butoxy-N,N-dimethylpropanamide (R 10 is a butyl group, R 11 and R 12 is a methyl group, R 13 is a hydrogen atom), β-lauroxy-N,N-dimethylpropanamide (R 10 is a lauryl group, R 11 and R 12 is a methyl group, R 13 is a hydrogen atom), β-stearoxy-N-ethylpropanamide (R 10 is a stearyl group, R 11 and R 13 is a hydrogen atom, R 12 is an ethyl group), etc. These compounds may be used alone or in combination of two or more. [ka]

[0016] In addition, the β-alkoxy-N-substituted propanamide and / or β-alkoxy-N,N-disubstituted propanamide can easily adjust the hydrophilicity, hydrophobicity or amphiphilicity and the polarity of the compound (A) by combining substituents having different carbon numbers. Furthermore, β-methoxy-N,N-dimethylpropanamide and β-butoxy-N,N-dimethylpropanamide are particularly preferred because they have the ability to dissolve everything from highly polar water to low polarity resin synthesis raw materials and poorly soluble synthetic resins such as polyamides and fluororesins, and are generally handled as industrial products.

[0017] The neutralized salt (B) is a salt obtained by neutralizing an acidic compound and a basic compound. The acidic compound is an inorganic or organic acid, and examples of the inorganic acid include hydrochloric acid, nitric acid, sulfuric acid, carbonic acid, phosphoric acid, polyphosphoric acid, and examples of the organic acid include formic acid, acetic acid, propionic acid, and lactic acid. The basic compound is an inorganic or organic base, and examples of the inorganic base include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide, and examples of the organic base include a compound having one or more amino groups selected from a primary amino group, a secondary amino group, and a tertiary amino group in the molecule, and ammonia, and the like. Furthermore, the obtained neutralized salt has high stability and solubility in the compound (A), and when the obtained composition (F) is used as a solvent for chemical reactions, resin synthesis, analysis solvent, or diluent, the basic compound is preferably a tertiary amine compound having one or more tertiary amino groups in the molecule from the viewpoint of low reactivity with reaction raw materials, etc.

[0018] The substituent of the tertiary amino group of the tertiary amine compound is not particularly limited, and may be aliphatic or aromatic, may be linear or cyclic, and may or may not have an unsaturated group, ether group, ester group, amide group, imide group, carbonyl group, etc. as a functional group. Examples of such tertiary amine compounds include tertiary aliphatic amines such as trialkyl (having 1 or more carbon atoms, which may be the same or different) amines, dialkyl (having 1 or more carbon atoms, which may be the same or different) cyclohexylamines, and tricyclohexylamines, tertiary aromatic amines such as dialkyl (having 1 or more carbon atoms, which may be the same or different) anilines, dialkyl (having 1 or more carbon atoms, which may be the same or different) 2,4,6-trimethylanilines, N-methyldiphenylamines, and triphenylamines, and tertiary aliphatic amines having aromatic substituents such as N,N-dimethylbenzylamine and N-methyldibenzylamine. These tertiary amine compounds for forming neutralized salts may be used alone or in combination of two or more kinds.

[0019] It is more preferable that the tertiary amine compound further has one or more functional groups selected from an ether group, an ester group, and an amide group in the molecule. By having these functional groups, the neutralized salt (B) formed from the tertiary amine compound has higher solubility in the compound (A), and higher effects can be obtained in terms of the stability of the composition (F) containing A and B, the storage stability and transparency of the resin synthesized in F, the transparency or dispersibility of the product obtained by using F as a diluent or dispersant, the cleanability and peelability when F is used as a cleaner or peeling agent, and the quality of the liquid crystal alignment film obtained by treatment with F and the secondary battery manufactured by using F.

[0020] The tertiary amine compound having an ether group in the molecule is not particularly limited, and may have one or more ether groups in any of the substituents of the tertiary amino group. These ether groups may be formed in a chain structure or in a ring structure. Examples include (methoxyethyl)diethylamine, (dimethoxymethane)dimethylamine, (ethoxyethyl)dibutylamine, (methoxyhexyl)di(2-ethylhexyl)amine, (methoxyethyl)diphenylamine, di(methoxyethyl)cyclohexylamine, and tri(butoxymethyl)amine. These may be used alone or in combination of two or more.

[0021] The tertiary amine compound having an ester group in the molecule is not particularly limited, and may have one or more ester groups in any of the substituents of the tertiary amino group. These ester groups may be formed in a chain structure or a ring structure. Examples include methyl 3-methoxypropionate, methyl 3-dimethylaminopropionate, butyl 3-dimethylaminopropionate, methyl 3-dibutylaminopropionate, butyl 3-dibutylaminopropionate, ethyl 4-diethylaminobutyrate, butyl 4-ethylhexylaminoacetate, isopropyl 3-morpholinopropionate, and ethyl 12-methylbenzylaminolaurate. These compounds may be used alone or in combination of two or more.

[0022] The tertiary amine compound having an amide group in the molecule is not particularly limited, except for the compound having an N-substituted and / or N,N-disubstituted amide group contained in the compound (A), and may have one or more amide groups in any of the substituents of the tertiary amino group. In addition, these amide groups may be formed in a chain structure or a ring structure. For example, 3-dimethylamino-N,N-dimethylpropionic acid amide, 3-dimethylamino-N,N-dibutylpropionic acid amide, 3-dibutylamino-N,N-dimethylpropionic acid amide, 3-dibutylamino-N,N-dibutylpropionic acid amide, 4-diethylamino-N,N-dimethylbutyric acid amide, 4-ethylhexylamino-N,N-diethylacetic acid amide, 3-morpholinopropionic acid morpholide, 12-methylbenzylamino-N,N-dimethyllauric acid amide, N-(3-dimethylaminopropyl)-lauric acid amide, N-(3-dimethylaminopropyl)-stearic acid amide, etc. may be mentioned. These compounds may be used alone or in combination of two or more.

[0023] The tertiary amine compound having an ether group in the molecule, the tertiary amine compound having an ester group in the molecule, and the tertiary amine compound having an amide group in the molecule may be used alone or in combination of two or more kinds selected from the group consisting of them.

[0024] The neutralized salt (B) can be obtained by neutralizing any combination of the above-mentioned various acidic compounds and basic compounds. B can have one or more of normal salts, acidic salts, and basic salts.

[0025] The solubility of the neutralized salt (B) in the compound (A) at room temperature is preferably 0.001 g or more, more preferably 0.01 g or more, and even more preferably 0.05 g or more. The room temperature in the present invention is a temperature range of 10° C. to 40° C. The solubility of the neutralized salt (B) in the compound (A) is g (mass) of (B) that can be dissolved in 100 g (mass) of (A).

[0026] In the composition (F) of this embodiment, the content of the neutralization salt (B) is 0.001 to 10% by mass relative to the entirety of F. If the composition contains 0.001% by mass or more of B, the stability of the composition (F) and the storage stability and transparency of the resins synthesized in F can be ensured. On the other hand, if the content of the neutralization salt (B) exceeds 10% by mass relative to the entirety of the composition (F), B becomes difficult to dissolve in A, the viscosity of the entire composition of F increases, the storage stability and transparency of the resins synthesized in F decrease, and the handleability of F as a diluent, dispersant, cleaner, stripper, etc. may decrease, which is not preferable. From these viewpoints, the content of the neutralization salt (B) is preferably 0.01 to 8% by mass relative to the entirety of F, and more preferably 0.05 to 6% by mass.

[0027] As one embodiment of the present invention, the composition (F) may further contain a compound (C) having one or more groups selected from an ether group, an ester group, a hydroxyl group, a urea group, an aryl group, and a sulfinyl group. Examples of the compound (C) include compounds containing an ether group such as dibutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, ethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, 1,4-dioxane, 2-methyltetrahydrofuran, cyclopentyl methyl ether, 4-methyltetrahydropyran, and 1,3-dioxolane; lactone solvents such as β-propiolactone, γ-butyrolactone, α-acetyl-γ-butyrolactone, γ-valerolactone, δ-valerolactone, and ε-caprolactone; compounds containing an ester group such as butyl acetate, ethyl benzoate, 2-ethoxyethyl acetate, 2-butoxyethyl acetate, ethyl acetoacetate, isoamyl acetate, n-pentyl acetate, and ethyl propionate; compounds containing a hydroxyl group such as linear, branched, and cyclic alkanols having 1 to 18 carbon atoms and alkanediols having 2 to 12 carbon atoms; 1,3-dimethylurea, 1,3- Examples of the compound include compounds having a urea group such as diethyl urea, 1,3-diphenyl urea, 1,3-dicyclohexyl urea, tetramethyl urea, tetraethyl urea, 2-imidazolidinone, propylene urea, 1,3-dimethyl-2-imidazolidinone, and N,N-dimethyl propylene urea; compounds having an aryl group such as xylene, solvent naphtha, toluene, ethylbenzene, tetralin, nitrobenzene, and acetophenone; compounds having a sulfinyl group such as dimethyl sulfoxide and methyl ethyl sulfoxide; compounds having an ether group and an ester group such as diethylene glycol monoethyl ether acetate and diethylene glycol monobutyl ether acetate; and compounds having an ether group and a hydroxyl group such as dialkylene glycols having 2 to 4 carbon atoms, dialkylene glycol monoalkyl ethers, trialkylene glycols, trialkylene glycol monoalkyl ethers, polyalkylene glycols, and polyalkylene glycol monoalkyl ethers.These compounds (C) may be used alone or in combination of two or more kinds, and are preferably compounds having one or more groups selected from an ether group, an ester group, and a hydroxyl group.

[0028] The content of compound (C) is 74.999% by mass or less, preferably 50% by mass or less, more preferably 30% by mass or less, based on the total amount of composition (F). When compound (C) is contained in an amount of 74.999% by mass or less, composition (F) can contain 25% by mass or more of compound (A) and 0.001% by mass or more of neutralized salt (B), which are essential components of composition (F), and the above-mentioned effects of A and B can be achieved, which is preferable.

[0029] As one embodiment of the present invention, the composition (F) may further contain an acidic compound (D) that forms a neutralized salt (B). By containing the acidic compound (D), the acid value of the composition (F) is preferably 0.1 to 40 mgKOH / g, more preferably 0.2 to 10 mgKOH / g, and particularly preferably 0.2 to 5 mgKOH / g. By containing the acidic compound (D), even if the compound (A) has a structure that exhibits strong basicity depending on the type and number of the substituents, the long-term stability of the obtained composition (F) and the long-term storage stability and transparency of the resin synthesized in F can be ensured.

[0030] The acidic compound (D) is an inorganic or organic acid. Examples of the inorganic acid include hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, etc., and examples of the organic acid include monovalent acids such as formic acid, acetic acid, propionic acid, butyric acid, lactic acid, etc., and examples of the polyvalent acids include oxalic acid, malonic acid, succinic acid, adipic acid, maleic acid, fumaric acid, malic acid, phthalic acid, isophthalic acid, terephthalic acid, tricarballylic acid, citric acid, etc., and these acidic compounds may be used alone or in combination of two or more.

[0031] The composition (F) of the present invention has excellent dissolving power, wettability, permeability, swelling, peelability, and dispersibility for various compounds, resins, etc., and can be suitably used as a solvent, diluent, or dispersant used in various materials and fields, a solvent used in chemical reactions, a solvent used as a mobile phase in chromatographic analysis, a solvent used as an extractant, a solvent used in the production and dissolution of various resins, a cleaning agent used in various chemical industries such as metal surfaces, equipment, and resin parts, a peeling agent used for various resin coatings and resists, nail cosmetics, or three-dimensional objects, a liquid crystal alignment treatment agent used in the alignment treatment of liquid crystal molecules, a non-aqueous electrolyte used in the production of secondary batteries, etc. The composition of the present invention can also be used by adding various additives such as evaporation control agents, thickeners, surfactants, surface conditioners, antioxidants, and heat stabilizers.

[0032] The amount of the composition (F) of the present invention required varies depending on the application and method of use, but is preferably 5% by mass or more, more preferably 10% by mass or more, and most preferably 20% by mass or more. For example, when used as a solvent for dissolving resins, paints, inks, etc., the content of composition (F) in the resulting solution (product) is 10 to 99% by mass; when used as a diluent, the content of composition (F) in the resulting diluted solution (product) is 20 to 95% by mass; when used as a dispersant, the content of composition (F) in the resulting diluted solution (product) is 30 to 99.9% by mass; when used as a solvent for chemical reactions or resin synthesis, the content of composition (F) in the resulting reaction solution (before reaction) is 10 to 85% by mass; when used as an analytical solvent, the content of composition (F) in the resulting solution (analytical When used as a cleaning agent, the content of composition (F) in the resulting cleaning liquid (product) is 5 to 100 mass%; when used as a stripping agent, the content of composition (F) in the resulting cleaning liquid (product) is 5 to 100 mass%; when used as a liquid crystal alignment treatment agent, the content of composition (F) in the resulting treatment liquid (before treatment) is 10 to 90 mass%; when used as a non-aqueous electrolyte for manufacturing secondary batteries, the content of composition (F) in the resulting non-aqueous electrolyte (product) is preferably 15 to 100 mass%.

[0033] The composition (F) of the present invention can be suitably used as a solvent for dissolving resins, paints, inks, adhesives, medicines, agricultural chemicals, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials. The composition (F) has high solubility in poorly soluble resins such as urethane resins, polyester resins, epoxy resins, polyamide resins, polyimide resins, polyamideimide resins, acrylic resins, and fluororesins, and has good affinity and adhesion to non-polar substances such as metals and plastics, so it can be used as a solvent for urethane paints and acrylic paints, and can be used as a solvent for urethane adhesives, epoxy adhesives, and fluorine-based epoxy adhesives used to bond plastic materials and metal materials, plastic materials, or metal materials. In addition, the composition (F) can be used as a water-soluble organic solvent in aqueous inks for inkjet recording or a polar solvent in non-aqueous inks to reduce the ink viscosity and improve the ejection stability of the ink, and can be suitably used as a solvent for various inks.

[0034] The composition (F) of the present invention may be used as a solvent for resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials without any particular limitations, and may be handled in the same manner as a general-purpose organic solvent. In addition, a deterioration inhibitor may be appropriately selected and blended depending on the environmental temperature, humidity, and light illuminance during dissolution, storage, and use. For example, in order to handle operations under harsh conditions such as heat and pressure bonding of adhesive inks and long-term storage of paints and inks, it is preferable to contain a heat stabilizer, a light stabilizer, an antioxidant, a preservative, and a dehydrating and drying agent, and when used as a solvent for clear or white inks and paints, it is more preferable to further contain a coloring inhibitor and an ultraviolet absorber. The content of these additives varies depending on the type and the working environment and operating conditions such as the temperature and humidity of use, but is preferably 0.0005 to 10 mass%, more preferably 0.001 to 5 mass%, and most preferably 0.05 to 2 mass%. These additives may be used alone or in combination of two or more types.

[0035] The composition (F) of the present invention has excellent solubility for both low molecular weight organic compounds and high molecular weight polymers, and can dissolve general-purpose polymers such as acrylic polymers, polyesters, polyurethanes, and polyethers, as well as engineering plastics and super engineering plastics such as polyimide precursors, polyamides, fluorine-containing polymers, and polyethersulfones. F is preferably used as a mobile phase solvent for liquid chromatography (HPLC) and gel permeation chromatography (GPC). In both the HPLC method and the GPC method, a solution in which an analyte is dissolved is introduced into a column packed with a packing material, and the affinity with the packing material differs depending on the molecular weight, polarity, etc., and the substance is separated and the molecular weight and molecular weight distribution are measured based on the difference in elution time due to differences in molecular weight and structure. Before the measurement, the solvent sealed in the column is replaced with the solvent used as the mobile phase for analysis, and after the analysis, either solvent is sealed and stored. Composition (F) contains compound (A) and neutralization salt (B), and therefore has long-term storage stability as an encapsulating solvent, and can maintain stability as an analytical solvent from room temperature to high temperatures (135-145°C) and ultra-high temperatures (up to 250°C), and can be suitably used as an encapsulating solvent for columns and as an analytical solvent for HPLC and GPC. In addition, by using composition (F) of this name, it is possible to omit solvent replacement before and after analysis, which is preferable. EXAMPLES

[0036] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. In the following, "parts", "%" and " / " are all based on mass unless otherwise specified.

[0037] The materials used in the examples and comparative examples are as follows. (A) Compounds Having N-Substituted and / or N,N-Disubstituted Amido Groups (Also Referred to as Compound (A)) A-1: N-butyl-2-pyrrolidone A-2: 3-Methoxy-N,N-dimethylpropanamide (manufactured by KJ Chemicals, registered trademarks "Kohshylvent" and "KJCMPA") A-3: 3-butoxy-N,N-dimethylpropanamide (KJ Chemicals, registered trademark "Kohshylvent") A-4: 3-Lauroxy-N,N-dimethylpropanamide A-5: 3-Methoxy-N,N-diethylpropanamide A-6: 3-ethoxy-N-phenylpropanamide A-7: 3-Methoxy-N-cyclohexylpropanamide A-8: 4-Acetylmorpholine A-9: N-formylmorpholine A-10: N,N-diethylbutanamide A-11: N-propanoylmorpholine A-12: 4-(3-methoxypropionyl)morpholine A-13: N,N-diisopropylacetamide A-14: 3-isopropoxy-N,N-dimethylpropanamide A-15: N,N-dimethylpropanamide (B) Neutralized salt (also referred to as neutralized salt (B)) B-1: Tributylamine hydrochloride B-2: (Methoxyethyl)diphenylamine citrate B-3: Triethylenediamine acetate B-4: N,N-Dimethyldimethoxymethanamine hydrochloride B-5: 3-N,N-dimethylpropionamide propionate B-6: 3-Dimethylaminopropionic acid methyl sulfate B-7: 3-Dimethylamino-N,N-dimethylpropionic acid amide hydrochloride B-8: 3-Dibutylamino-N,N-dimethylpropionic acid amide acetate B-9: 3-Dimethylaminopropionic acid methyl phosphate B-10: 3-Dibutylaminopropionate butyl lactate B-11: 3-Morpholinopropionic acid morpholide sulfate (C) A compound having one or more groups selected from an ether group, an ester group, a hydroxyl group, a urea group, an aryl group, and a sulfinyl group (also referred to as compound (C)) C-1: 1,3-Dimethyl-2-imidazolidinone C-2: γ-butyrolactone C-3: γ-valerolactone C-4: Dimethyl sulfoxide C-5: Dipropylene glycol dimethyl ether C-6: Xylene C-7: 4-Methyltetrahydropyran C-8: Cyclopentyl methyl ether (D) Acidic Compound (also referred to as acidic compound (D)) D-1: Sulfuric acid D-2: Hydrogen chloride-cyclopentyl methyl ether solution (2 mol / L) D-3: Acetic acid D-4: Phosphate D-5: Lactic acid

[0038] Example 1 (Synthesis and Evaluation of Polyimide Precursor Solution) In a 500mL beaker, 50g of A-1 as compound (A), 0.001g of B-1 and 0.001g of B-2 as neutral salts (B), 29.998g of C-1 and 20g of C-2 as compounds (C) were added, and the mixture was stirred for 30 minutes at room temperature (20-30°C) using a magnetic stirrer to obtain F-1 as composition (F) as a colorless, transparent liquid. The acid value of F-1 was measured by the following method, and the results are shown in Table 1. In a 1000mL four-neck flask equipped with a stirring rod, a thermometer, a dropping funnel, and a nitrogen gas inlet tube, 350g of F-1 and 25.0g (125mmol) of 4,4'-diaminodiphenyl ether (ODA) as a diamine compound were added, and the mixture was stirred at room temperature for 30 minutes while passing nitrogen gas through it, and a colorless and transparent solution was obtained. The temperature of the solution was raised to 80°C, and 37.8g (128mmol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) was slowly added as an acid dianhydride while maintaining the temperature at 80°C. After stirring for another hour at 80°C, the mixture was cooled to room temperature, and 5g of composition F-1 prepared separately for F was added so that the solid content concentration was 15% by mass, and a colorless and transparent viscous polyimide precursor solution (varnish) was obtained. The transparency and coloration of the obtained varnish were visually observed, and the viscosity was measured and the number average molecular weight analysis of the polyimide precursor was performed by the following method, and the results are shown in Table 1. The resulting varnish was stored at 40° C. for 30 days, after which its viscosity was measured and the rate of change in viscosity over time was calculated using the following formula. The viscosity after storage and the rate of change in viscosity over time are shown in Table 1. Viscosity change rate over time (%) = (viscosity after 30 days - initial viscosity) / initial viscosity x 100%

[0039] (Acid value measurement) The acid value is expressed in mg of potassium hydroxide required to neutralize the acidic components contained in 1 g of the composition, and was measured using an automatic potentiometric titrator in accordance with JIS K0070-1992.

[0040] (viscosity measurement) The viscosity of the varnish was measured at 25° C. using a cone-plate viscometer (RE550 type viscometer, manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K5600-2-3.

[0041] (Number average molecular weight (Mn) analysis) Using Hitachi's high performance liquid chromatography L6000 and Hitachi's data analyzer ATT-8, Gelpack GL-S300MDT-5 (2 columns) were used as columns, and a solvent in which phosphoric acid (0.06M) and lithium bromide (0.06M) were dissolved in a mixture of DMF / THF = 1 / 1 (L / L) was used as the mobile phase. Measurements were performed under conditions of a sample concentration of 0.2% and a flow rate of 1.0 ml / min, and the number average molecular weight was calculated using a calibration curve using a polystyrene standard sample.

[0042] Preparation and evaluation of polyimide films The obtained polyimide precursor solution (varnish) was applied to a glass substrate and heated under a nitrogen stream at 120°C for 10 minutes, 250°C for 10 minutes, and 350°C for 30 minutes using a hot air dryer. The laminate of the polyimide film and the glass substrate was immersed in water for 10 minutes, the polyimide film was peeled off from the glass substrate, and dried at 80°C for 10 minutes using a hot air dryer to obtain a colorless, transparent polyimide film with a film thickness of about 10 μm. The appearance, light transmittance, strength, elongation, and linear thermal expansion coefficient of the obtained polyimide film were evaluated by the following methods, and the results are shown in Table 1.

[0043] (Appearance of polyimide film) The obtained polyimide film was visually observed to check for the occurrence of defects such as bubbling and cracking, and was evaluated according to the following criteria. ⊚: Light yellow, transparent, no bubbles or cracks. ◯: Pale yellow to yellow, transparent, with slight bubbles or cracks. △: Yellow or translucent with several bubbles or cracks. ×: Yellow to brown or opaque, with numerous bubbles or cracks.

[0044] (transparency) The obtained polyimide film was left to stand overnight under conditions of a temperature of 23°C and a relative humidity of 50%, and then the light transmittance was measured using a haze meter (manufactured by Nippon Denshoku Industries Co., Ltd., NDH-2000) in accordance with JIS K7105, and was evaluated according to the following criteria. ⊚: Light transmittance is 90% or more. ◯: Light transmittance is 85% or more and less than 90%. △: Light transmittance is 80% or more and less than 85%. ×: The light transmittance is less than 80%.

[0045] (Tensile test) The obtained polyimide film was cut into test pieces 100 mm long and 10 mm wide, and left to stand for 24 hours under conditions of 23°C temperature and 50% relative humidity. After that, a test was performed using a tensile tester (ORIENTEC, Tensilon RTA-100) with a check gap of 50 mm, a tensile speed of 50 mm / min, and n=5, and the tensile strength and tensile elongation were evaluated according to the following criteria. (Tensile strength) ◎: Tensile strength is 200 MPa or more. ◯: The tensile strength is 150 MPa or more and less than 200 MPa. △: The tensile strength is 100 MPa or more and less than 150 MPa. ×: The tensile strength is less than 100 MPa. (Tensile elongation) ◎: Tensile elongation is 90% or more. ◯: The tensile elongation is 60% or more and less than 90%. ×: The tensile elongation is less than 60%.

[0046] (coefficient of linear thermal expansion) The obtained polyimide film was cut into test pieces with a length of 20 mm and a width of 2 mm, and left to stand overnight under conditions of 23°C and 50% relative humidity, after which measurements were performed under a nitrogen stream using a thermomechanical analyzer (SII NanoTechnology, EXSTAR6000). The measurement method was to increase the temperature from room temperature to 220°C at a rate of 5°C / min, then decrease the temperature from 220°C to room temperature, and then increase the temperature a second time at a rate of 5°C / min to measure the average linear expansion coefficient from 50°C to 200°C. The lower the average linear expansion coefficient, the higher the heat resistance and dimensional stability, and the evaluation was performed according to the following criteria. ⊚: The average linear expansion coefficient is less than 8 ppm / °C. ◯: The average linear expansion coefficient is 8 ppm / °C or more and less than 9 ppm / °C. △: The average linear expansion coefficient is 9 ppm / °C or more and less than 10 ppm / °C. ×: The average linear expansion coefficient is 10 ppm / ° C. or more.

[0047] Preparation and evaluation of liquid crystal alignment films Composition F-1 was further added to the obtained polyimide precursor solution to obtain a liquid crystal alignment agent having a solid content concentration of 3% by mass. The obtained liquid crystal alignment agent was filtered through a filter with a pore size of 1.0 μm, and applied by spin coating onto the ITO surface of a 40 mm×30 mm glass substrate with an ITO electrode (length: 40 mm, width: 30 mm, thickness: 1.1 mm), and then heated at 80° C. for 100 seconds on a hot plate and at 250° C. for 30 minutes in a heat circulation type clean oven to obtain an ITO substrate with a liquid crystal alignment film having a film thickness of 100 nm. Two ITO substrates with a liquid crystal alignment film were prepared, and a bead spacer with a diameter of 4 μm (manufactured by JGC Catalysts and Chemicals, Shinshikyu, SW-D1) was applied to the liquid crystal alignment film surface of one substrate, and the periphery was coated with a sealant (manufactured by Mitsui Chemicals, XN-1500T). The other substrate was attached to the previous substrate with the side on which the liquid crystal alignment film was formed facing inward, and the sealant was then cured to prepare an empty cell. Negative liquid crystal MLC-3023 (a product name manufactured by Merck) was injected into this empty cell by the reduced pressure injection method to prepare a liquid crystal cell. A direct current voltage of 15 V was applied to the obtained liquid crystal cell, and a UV-LED lamp (365 nm, 500 mW / cm) was used as the light source. 2 ) for 30 seconds to obtain a vertically aligned liquid crystal display element. The obtained liquid crystal display element was observed under a polarizing microscope to check whether the liquid crystal was vertically aligned, and was evaluated according to the following criteria. ◯: No defects due to liquid crystal flow or bright spots due to alignment defects were observed. △: A few bright spots due to defects caused by liquid crystal flow or alignment defects are observed. ×: Bright spots due to defects caused by liquid crystal flow or alignment defects are observed.

[0048] Examples 2 to 14 and Comparative Examples 1 to 6 In Examples 2 to 14, a polyimide precursor solution (varnish) with a solid content concentration of 15% by mass was synthesized in the same manner as in Example 1, except that the diamine component, acid dianhydride component, compositions (F-2) to (F-14) and other components listed in Tables 1 and 2 were used, and further, a polyimide film and a liquid crystal alignment film were prepared in the same manner as in Example 1. The obtained varnish, film, and liquid crystal alignment film were evaluated in the same manner as in Example 1, and the results are shown in Tables 1 and 2. In Comparative Examples 1 to 6, the diamine component, acid dianhydride component, comparative compositions (H-1) to (H-6) and other components listed in Table 3 were used to synthesize a polyimide precursor solution (varnish), prepare a polyimide film, and prepare a liquid crystal alignment film in the same manner as in Example 1. The obtained varnish, film, and liquid crystal alignment film were evaluated in the same manner as in Example 1, and the results are shown in Table 3.

[0049] [Table 1]

[0050] [Table 2]

[0051] [Table 3]

[0052] As can be seen from the results shown in Tables 1 to 3, the composition (F) of the present invention contains the compound (A) and the neutralization salt (B), and thus a polyimide precursor varnish with high transparency and low viscosity can be produced, and furthermore, the polyimide film obtained using these varnishes has high transparency, high light transmittance, low colorability, and is excellent in strength, elongation, heat resistance, and dimensional stability. The effect of the present invention is due to the synergistic effect of the excellent dissolving power of the compound (A) and the stability improving effect of the neutralization salt (B), and is not obtained by using only the compound (A) or a combination of the neutralization salt (B) and other compounds.

[0053] Furthermore, the polyimide precursor solution (varnish) synthesized using the composition (F) of the present invention as a solvent exhibits excellent stability. This effect is presumably due to the excellent dissolving power of the amide compound (A), the improvement in the stability of the compound (A) by the neutralization salt (B), and the suppression of ionic repulsion and association of the polyimide precursor polyamic acid (polyamic acid). Similarly, it can be seen that the composition (F) is suitably used as a good dissolving solvent, chemical reaction solvent, resin synthesis solvent, and diluent for resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, cellulose derivatives, and organosilicon polymers.

[0054] A polyimide film produced using composition (F) as a solvent exhibits excellent physical properties and can be suitably used as a surface protective film or interlayer insulating film for semiconductor elements, an insulating layer or spacer layer for organic EL elements, a planarizing film for thin-film transistor substrates, an insulating film for organic transistors, a substrate for light-receiving devices such as flexible printed circuit boards, substrates for flexible devices, substrates for liquid crystal displays, substrates for organic EL displays, substrates for electronic paper, and substrates for thin-film solar cells, as well as a binder for electrodes in lithium ion secondary batteries, an adhesive for semiconductors, and the like.

[0055] In addition, it was confirmed that composition (F) has excellent solubility for polyimide precursors such as polyamic acid, which are the main components of liquid crystal alignment agents, and soluble polyimides, and that a polyimide precursor solution synthesized or diluted in F has excellent stability, and therefore can be suitably used for the production of liquid crystal alignment agents. In particular, due to the need for lighter and thinner mobile applications such as smartphones and mobile phones, a liquid crystal alignment agent containing composition (F) is indispensable in the production of liquid crystal alignment films with high mechanical strength, high film hardness, and good electrical properties. Composition (F) can dissolve polyimide precursors and soluble polyimides uniformly and at a high concentration, and at the same time, in the film formation process in which the obtained liquid crystal alignment agent is applied to a substrate, dried, and baked to produce a coating film, the film thickness can be precisely controlled, and a liquid crystal alignment film with excellent electrical properties such as dielectric constant and conductivity can be obtained.

[0056] Example 15 (Synthesis and evaluation of urethane prepolymer solution) A 1000mL four-neck flask equipped with a stirring rod, a thermometer, a dropping funnel, and a nitrogen gas inlet tube was charged with 107.4g of F-15 (prepared in the same manner as above, as shown in Table 4) as a composition, 104.5g (0.6mol) of tolylene diisocyanate (Mitsui Chemicals Fine Co., Ltd., Cosmonate T100) (TDI) as a diisocyanate compound, and 325.0g (0.5mol) of polytetramethylene glycol (Mitsubishi Chemical Co., Ltd., PTMG650) (PTMG) and 0.05g of dibutyltin dilaurate as a catalyst. The mixture was heated to 60°C while passing nitrogen gas through it, and then stirred for 4 hours to obtain a pale yellow, transparent, isocyanate-terminated urethane prepolymer solution with a solid content concentration of 80% by mass. The viscosity of the obtained urethane prepolymer solution and the number average molecular weight analysis of the urethane prepolymer were performed by the following method, and the results are shown in Table 4. The obtained urethane prepolymer solution was filtered through a 100 mesh nylon mesh, the residue was measured, and the gel fraction was calculated using the following formula. After storing at 40°C for 30 days, the viscosity was measured to evaluate the stability. Gel fraction (%) = (residue weight (g)) / (diisocyanate weight (g) + diol weight (g)) x 100%

[0057] (viscosity measurement) The viscosity of the urethane prepolymer solution was measured at 25° C. using a cone-plate viscometer (RE550 type viscometer, manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K5600-2-3.

[0058] (number average molecular weight) Using Hitachi's high performance liquid chromatography L6000 and Hitachi's data analyzer ATT-8, Gelpack GL-S300MDT-5 (2 columns) were used as columns, and THF was used as the mobile phase. Measurements were performed under conditions of a sample concentration of 0.2% and a flow rate of 1.0 ml / min, and the number average molecular weight was calculated using a calibration curve using a polystyrene standard sample.

[0059] (stability) After storing the urethane prepolymer solution at 40° C. for 30 days, the viscosity was measured and the stability was evaluated based on the rate of change in viscosity over time calculated using the formula below, according to the following criteria. Viscosity change rate over time (%) = (viscosity after 30 days - initial viscosity) / initial viscosity x 100% ◎: Viscosity change rate is less than 2%. ◯: The viscosity change rate is 2% or more and less than 5%. ×: The viscosity change rate is 5% or more.

[0060] Preparation and evaluation of polyurethane films To the obtained urethane prepolymer solution (88.9 g), 11.1 g of polypropylene glycol, triol type (NOF Corporation, number average molecular weight 1000, Uniol TG-1000R) was added, and after stirring for 5 minutes at 25 ° C, the mixture was applied to a thickness of 100 μm on the release surface of a 75 μm thick heavy release PET film (Toyobo Co., Ltd., polyester film E7001), and the urethane was cured and dried for 30 minutes at 130 ° C under a nitrogen stream using a hot air dryer, and then the coating film was peeled off from the heavy release PET film to obtain a polyurethane film. The appearance and 100% modulus of the obtained polyurethane film were evaluated by the following method, and the results are shown in Table 4.

[0061] (Appearance of polyurethane film) The obtained polyurethane film was visually observed to check for the occurrence of defects such as bubbling and cracking, and was evaluated according to the following criteria. ◎: Colorless and transparent, with no gel-like matter or precipitates. ○: Light yellow and transparent, with no gel-like matter or precipitates. Δ: Yellow or translucent with slight gel-like matter or precipitates. ×: Yellow to brown or opaque, with a large amount of gel-like matter or precipitates.

[0062] (tack resistant) The obtained polyurethane film was left to stand for 24 hours under conditions of 23°C and 50% relative humidity, and then a 100μm thick PET film ("Cosmoshine A-4100", Toyobo) was placed on top of the coating so that the easy-adhesion treated surface was in contact with the polyurethane film, and a standard weight of 1kg was placed on top of it and left to stand for 3 days in a 40°C atmosphere. After that, the film was cut to a width of 10mm and a length of 50mm, and then the PET film was peeled off in a 90° direction at a speed of 50mm / min using a tensile tester (ORIENTEC, Tensilon RTA-100) under conditions of 23°C and 50% relative humidity, and the adhesive strength was measured and evaluated according to the following criteria. ◯: The adhesive strength is less than 0.1 MPa and there is no tack. △: Adhesive strength is less than 0.5 MPa and 0.1 MPa or more, and there is slight tack. ×: The adhesive strength is 0.5 MPa or more, and there is tack.

[0063] (100% modulus) The obtained polyurethane film was cut into test pieces 100 mm long and 10 mm wide, and left to stand for 24 hours under conditions of 23°C temperature and 50% relative humidity, after which a test was performed using a tensile tester (ORIENTEC, Tensilon RTA-100) with a check gap of 50 mm, a tensile speed of 50 mm / min, and n=5, to measure the stress at the point when the test piece was 100% elongated (100% modulus). Test pieces with a 100% modulus of less than 5 MPa had excellent flexibility, and were evaluated according to the following criteria. ◯: 100% modulus is less than 5 MPa. △: 100% modulus is 5 MPa or more and less than 10 MPa. ×: 100% modulus is 10 MPa or more.

[0064] (Preparation of polyurethane coating) The obtained urethane prepolymer solution was mixed with polypropylene glycol and a triol type, and then coated onto a 10 cm x 10 cm x 2 mm aluminum substrate to a thickness of 100 μm. A urethane conversion reaction and drying were carried out for 30 minutes at 130°C under a nitrogen stream using a hot air dryer, producing a urethane coating film.

[0065] (Adhesion of polyurethane coating) The obtained polyurethane coating was cut to prepare test pieces 100 mm long and 10 mm wide, and left to stand for 24 hours under conditions of 23°C temperature and 50% relative humidity. After that, a 180° peel test was performed using a tensile testing machine (ORIENTEC, Tensilon RTA-100) at a tensile speed of 100 mm / min, n=5, and the peel strength was evaluated according to the following criteria. ◎: Peel strength is 20N / 10mm or more, and cohesive failure occurs. ○: Peel strength is 20 N / 10 mm or more, and interfacial peeling occurs. △: Peel strength is 10 N / 10 mm or more and less than 20 N / 10 mm, and interfacial peeling occurs. ×: Peel strength is less than 10 N / 10 mm, and interfacial peeling occurs.

[0066] (Removability of polyurethane coating) The obtained polyurethane coating film was cut into 10 mm widths to form a grid of 100 squares. Composition (F-14) was used as a release agent, and the aluminum substrate was immersed in the release agent at 40°C for 60 minutes, and then water (25°C) was poured over it to remove the polyurethane coating film together with the release agent from the surface of the substrate. If the urethane coating film remained, the immersion in the release agent and the water pouring over it were repeated to remove it, and the release property of composition (F-14) was evaluated according to the following criteria based on the number of times until 100 squares of the urethane coating film were peeled off. ◎: Immersed in stripping agent once. ○: Immersion in stripping agent twice. △: The sample was immersed in the stripping agent 3 to 5 times. ×: The sample was immersed in the stripping agent six or more times.

[0067] (Cleaning evaluation) The resulting polyurethane coating was immersed in xylene together with the aluminum substrate at 60°C for 120 minutes, and then the urethane coating was peeled off with a metal spatula. The residue of the urethane coating remaining on the aluminum substrate was then wiped off five times with a cloth soaked in the detergent using composition (F-14) as a detergent, and the state of the residue of the urethane coating was visually confirmed, and the cleaning ability of composition (F-14) was evaluated according to the following criteria. ◯: No residue was observed after peeling off the urethane coating. △: A small amount of residue was observed after peeling off the urethane coating film. ×: A large amount of residue was observed after peeling off the urethane coating film.

[0068] Examples 16 to 18 and Comparative Examples 7 to 9 In Examples 16 to 18, the same procedure as in Example 15 was used except that the diisocyanate, diol, and compositions (F-16) to (F-18) shown in Table 4 were used, and a urethane prepolymer solution having a solid content concentration shown in Table 4 was synthesized. Further, a polyurethane film and a polyurethane coating were prepared according to the composition shown in Table 4 in the same manner as in Example 15, and evaluations were performed in the same manner as in Example 15, and the results are shown in Table 4. In Comparative Examples 7 to 9, the diisocyanate, diol, and comparative compositions (H-7) to (H-9) shown in Table 4 were used to synthesize a urethane prepolymer solution having a solid content concentration shown in Table 4 in the same manner as in Example 14, and a polyurethane film and a polyurethane coating were prepared according to the composition shown in Table 4 in the same manner as in Example 14, and evaluations were performed, and the results are shown in Table 4.

[0069] [Table 4]

[0070] As can be seen from the results shown in Table 4, the composition (F) of the present invention contains the compound (A) and the neutralizing salt (B), so that the urethane reaction can be well controlled, and a urethane prepolymer solution with high transparency, low viscosity, low gel fraction, and excellent stability can be obtained, and a uniform and transparent polyurethane film and polyurethane coating film can be obtained from the urethane prepolymer solution. This effect is due to the synergistic effect of the excellent dissolving power of the compound (A) and the improved stability of the neutralizing salt (B). When the compound (A) was used alone, the gelation of the urethane prepolymer was observed, or when the neutralizing salt (B) and other compound (C) were used alone, the viscosity increased, the gel fraction increased, and other problems occurred. Furthermore, when a polyurethane film or polyurethane coating film was produced, defects due to gelation or precipitation were easily generated, and a coating film with satisfactory strength and elongation could not be obtained.

[0071] The urethane prepolymer produced using composition (F) as a solvent has a low gel fraction and excellent stability, so that molded products such as good polyurethane films and polyurethane coatings can be obtained. In addition, since the urethane prepolymer has a low viscosity and good operability, it can be mixed uniformly and quickly with high molecular weight polyols, polyamines, etc., and when it is urethane-converted by heating, molded products (products) with excellent physical properties can be produced. In addition, when composition (F) is used as a release agent or cleaning agent, the polyurethane coating film produced has good peelability and the residue on the substrate can be completely removed, so that it shows good peelability as a release agent and good cleaning ability as a cleaning agent. This effect is considered to be due to the excellent dissolving power of compound (A) and the neutralizing salt (B) breaking the hydrogen bonds in the polyurethane film or polyurethane coating, and also making it easier for composition (F) to penetrate into the interface between the polyurethane film or polyurethane coating and the substrate. Similarly, composition (F) can be suitably used as a dissolving solvent, a reaction solvent, a resin synthesis solvent, a diluent for dilution, a dispersant for dispersion, a stripping agent for peeling, a cleaning agent for cleaning, and can be suitably used for dissolving, diluting, dispersing, peeling, cleaning, etc. of sealing materials for construction and civil engineering, adhesives such as elastic adhesives for construction, packing tapes and surface protective films, various pressure-sensitive adhesives represented by optical adhesives, paints, elastomers, waterproof coating materials, flooring materials, plasticizers, soft polyurethane foams, semi-rigid polyurethane foams, rigid polyurethane foams, artificial leather, etc.

[0072] Example 19 (Preparation and Evaluation of Etching Solution) An etching solution was prepared by adding 100 g of composition (F-19) to 100 g of an aqueous solution of 0.079 M iodine and 0.60 M potassium iodide. Next, a 22×26 mm gold-deposited glass (gold film thickness 30 nm, manufactured by Kenis Co., Ltd.) was covered with a 25 μm dry film resist. Then, a line / space (L / S)=36 μm / 24 μm glass mask was used for exposure, and the unexposed portion was removed by development processing to prepare an etching resist pattern of L / S=36 μm / 24 μm. Then, the glass was immersed in the etching solution at a liquid temperature of 30° C. for the time shown in Table 5 for etching. After etching, the glass was immersed in a 3 mass% sodium hydroxide aqueous solution at 50° C. for 60 seconds to remove the etching resist, and then the gold-deposited glass was washed with ultrapure water and dried with nitrogen gas. The surface smoothing ability and side etching amount of the gold-deposited glass were observed using a scanning electron microscope (SEM) (manufactured by Hitachi High-Technologies Corporation, SU8200 series), and the etching property was evaluated according to the following criteria. The results are shown in Table 5. (Surface smoothing ability) ◎: The SEM image shows a smooth surface. ◯: A slightly rough surface is observed in a very small part of the SEM image. △: The entire surface of the SEM image is observed to be somewhat rough. ×: A rough surface is observed in the SEM image. (Side etching properties) ◎: Side etching amount is less than 200 nm. ◯: The amount of side etching is 200 nm or more and less than 400 nm. △: Side etching amount is 400 nm or more and less than 600 nm. ×: Side etching amount is 600 nm or more.

[0073] [Table 5]

[0074] Examples 20 to 22 and Comparative Examples 10 and 11 In Examples 20 to 22, compositions (F-20) to (F-22) shown in Table 5 were used, and in Example 22, the gold-deposited glass was changed to a copper-clad laminate board (copper foil 35 μm, manufactured by Sanhayato Co., Ltd.), except that etching was performed in the same manner as in Example 19, and the etchability was evaluated. The results are shown in Table 5. In Comparative Examples 10 and 11, compositions (H-10) and (H-11) shown in Table 5 were used, and in Comparative Example 11, the gold-deposited glass was changed to a copper-clad laminate board (copper foil 35 μm, manufactured by Sanhayato Co., Ltd.), except that etching was performed in the same manner as in Example 19, and the etchability was evaluated. The results are shown in Table 5.

[0075] The metal etching solution using composition (F) as an organic solvent has excellent wettability and good smoothing ability because it contains the highly hydrophilic amide compound (A), and also has excellent salt stability due to the neutralization salt (B), which allows the iodine salt to exist stably and suppresses the volatilization effect of iodine, and as a result of combining this with the high hydrophilicity and high dissolving power of A, the effect of suppressing the amount of side etching was high. Similarly, composition (F) can be suitably used as an etching agent (stripper) for various metals for etching integrated circuits and printed circuit boards.

[0076] Example 23 (Evaluation as a dispersant for cellulose nanofibers) 50 g of cellulose nanofiber dispersion (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., Leocrysta I-2SX) was dried in a 105°C air blower, and then 199 g of composition (F-23) was added and stirred for 60 minutes using a TK homomixer (6,000 rpm) to obtain an organic solvent dispersion of cellulose nanofiber (CNF dispersion, solid content 0.5% by mass). The mixture was then stored at 40°C for one week, and the dispersion state was observed. The dispersion stability was evaluated according to the following criteria, and the results are shown in Table 6. A: A uniformly dispersed state was maintained. △: A small amount of aggregates were observed. ×: Aggregates and precipitates were observed.

[0077] Examples 24 to 26 and Comparative Examples 12 and 13 In Examples 24 to 26, CNF dispersions having the concentrations shown in Table 6 were prepared in the same manner as in Example 23, except that compositions (F-24) to (F-26) shown in Table 5 were used, and the dispersion stability of the obtained dispersions was evaluated, and the results are shown in Table 6. In Comparative Examples 12 and 13, CNF dispersions having the concentrations shown in Table 6 were prepared in the same manner as in Example 23, and then the dispersion stability was evaluated, and the results are shown in Table 6.

[0078] [Table 6]

[0079] Example 27 (Evaluation as a pigment dispersant) 180 g of composition (F-27) was placed in a 500 mL beaker, and 20 g of hydrophilic silica fine particles (specific surface area by BET method: 175 to 225 m2 / g, product name: Aerosil 200, manufactured by Nippon Aerosil Co., Ltd.) was added little by little while stirring at 300 rpm using a homomixer to obtain a mixed liquid. Next, the rotation speed of the homomixer was increased to 1500 rpm, and stirring was continued at 1500 rpm for 60 minutes to produce a silica dispersion.

[0080] Example 28 In a 500 mL beaker, 100 g of alumina (Showa Denko K.K., AL-160SG-4) was added to 1 g of a commercially available dispersant (Toagosei Co., Ltd., T-AX ammonium salt) and 29 g of ion-exchanged water, and the mixture was stirred at 4,000 rpm for 5 minutes using a homomixer to wet-grind the alumina. Next, 70 g of composition (F-28) was added, and the mixture was stirred at 500 rpm for 5 minutes using a homomixer to produce an alumina dispersion with a pigment concentration of 50% by mass.

[0081] (viscosity measurement) The viscosity of the silica dispersion was measured at 25° C. using a cone-plate viscometer (Toki Sangyo Co., Ltd., RE550 type viscometer) in accordance with JIS K5600-2-3, and the results are shown in Table 7.

[0082] (dispersion stability) The silica dispersion was stored at 40° C. for 7 days, and then the viscosity was measured. The dispersion stability was evaluated based on the rate of change in viscosity over time calculated by the formula below, according to the following criteria. The results are shown in Table 7. Viscosity change rate over time (%) = (viscosity after 7 days - initial viscosity) / initial viscosity x 100% ◯: Viscosity change rate is less than 5%. △: The viscosity change rate is 5% or more and less than 10%. ×: The viscosity change rate is 10% or more.

[0083] Examples 29 and 30 and Comparative Examples 14 to 16 In Example 29, the composition (F-29) described in Table 7 was used, but the same procedure as in Example 27 was followed. In Example 30, the composition (F-30) described in Table 7 was used, but the same procedure as in Example 28 was followed. Dispersions of silica, alumina, etc. described in Table 7 were prepared, and the viscosity and dispersion stability of the obtained dispersions were evaluated in the same manner as in Example 27. The results are shown in Table 7. In Comparative Examples 14 and 15, and Comparative Example 16, the same procedure as in Example 28, were followed to prepare silica or alumina dispersions, and the viscosity and dispersion stability of the obtained dispersions were evaluated. The results are shown in Table 7.

[0084] [Table 7]

[0085] As can be seen from the results shown in Tables 6 and 7, when the composition (F) containing the compound (A) and the neutralizing salt (B) was used as a dispersant, good dispersibility was shown. In addition to the excellent dispersibility of the compound (A), the strong hydrogen bonds formed between cellulose nanofibers and between fine particles such as silica and alumina were partially cut by the compound (A) and the neutralizing salt (B), so that the dispersion liquid dispersed in the composition (F) had good and stable dispersibility compared to the composition containing only the compound (A) or the composition containing the neutralizing salt (B) added to the compound (C). Such dispersion characteristics can be exhibited not only in cellulose nanofiber dispersions and pigment dispersions such as silica fine particles, but also in synthetic resins, paints, inks, adhesives, medicines, pesticides, fragrances, pigments, dyes, organosilicon polymers, conductive materials, and carbon materials such as carbon nanomaterials, and the composition (F) can be suitably used as a dispersant for dispersing these materials.

[0086] Example 31 (Evaluation as a mobile phase for GPC measurement) Using the composition (F-31) as the mobile phase, a high performance liquid chromatograph L6000 manufactured by Hitachi and a data analyzer ATT-8 manufactured by Hitachi were used, and Gelpack GL-S300MDT-5 (2 columns) were used as columns to perform molecular weight analysis of polyamide 66 (Amilan CM3001N manufactured by Toray Industries, Inc.). Polyamide 66 was dissolved in the composition (F-31) to prepare a measurement sample with a concentration of 0.01 wt%, and the column temperature was set to 40°C. The molecular weight was measured at a flow rate of 1.0 ml / min using F-31 as the mobile phase, and the number average molecular weight was calculated using a calibration curve using a polystyrene standard sample. In addition, the performance evaluation as a solvent for molecular weight analysis was performed according to the following criteria, and the results are shown in Table 8. ○: Detection is possible using a detector (differential refractive index or ultraviolet absorption), and no increase in column pressure is observed. △: Detection was possible with the detector, but an increase in column pressure was observed. ×: Detection by the detector was not possible, and measurement was not possible.

[0087] Examples 32 to 34 and Comparative Examples 17 to 20 In Examples 32 to 34, compositions (F-32) to (F-34) were used as the mobile phase, and in Comparative Examples 17 to 20, compositions (H-17) to (H-20) were used as the mobile phase. Using the same apparatus and method as in Example 31, molecular weight analysis was performed on polyvinylidene fluoride (Solef 1008, manufactured by Nippon Solvay K.K.), polyamideimide (TPS TI-5013, manufactured by Toray Industries, Inc.), and the polyimide precursor polymer synthesized in Example 1 shown in Table 8, and performance evaluation as a solvent for molecular weight analysis was also performed. The results are shown in Table 8.

[0088] [Table 8]

[0089] As can be seen from the results shown in Table 8, when the composition (F) containing the compound (A) and the neutralizing salt (B) was used as a mobile phase for chromatography, it showed good solubility and stability. In addition to the excellent dispersibility of the compound (A), the neutralizing salt (B) ensured the long-term storage stability and heat resistance (thermal stability) of A, and compared with a composition containing only A or compound (C) and B, the use of the composition (F) enabled stable and accurate molecular weight analysis of synthetic resins that are difficult to dissolve and analyze. In addition, when the neutralizing salt (B) is used but the compound (A) is not used, it is difficult to measure the poorly soluble resin, and when the neutralizing salt (B) is used but the compound (A) is not used, the molecular weight could be measured stably but the molecular weight could not be measured stably if the neutralizing salt (B) is used. The composition (F) can be suitably used as a solvent for measurements and analyses that require dissolution as a prerequisite, such as viscosity measurements, dynamic viscoelasticity measurements, absolute molecular weight measurements using a MALS detector, and NMR measurements.

[0090] Example 35 (Evaluation as a non-aqueous electrolyte) Preparation of non-aqueous electrolyte An electrolyte, lithium bis(fluorosulfonyl)imide (LiSFI), was dissolved in the composition (F-35) shown in Table 9 to a concentration of 1 mol / L to prepare a nonaqueous electrolyte solution.

[0091] Preparation of electrode sheets 90g of lithium cobalt oxide as a positive electrode active material, 5g of acetylene black as a conductive assistant, and 5g of polyvinylidene fluoride (KYNAR761, manufactured by Arkema) as a binder were added to 20g of composition (F-35) and mixed uniformly to prepare a paste-like positive electrode active material composition. This paste-like positive electrode active material composition was applied to one side of an aluminum foil (positive electrode current collector: thickness 20 μm) and dried to obtain a positive electrode sheet. Next, 90g of artificial graphite as a negative electrode active material and 10g of polyvinylidene fluoride (KYNAR761, manufactured by Arkema) as a binder were added to 20g of composition (F-35) and mixed uniformly to prepare a paste-like negative electrode active material composition. This paste-like negative electrode active material composition was applied to one side of a copper foil (negative electrode current collector: thickness 20 μm) and dried to obtain a negative electrode sheet.

[0092] (Charge / discharge test) The obtained positive electrode sheet, negative electrode sheet and polyethylene separator were punched into a circle, and one positive electrode sheet and one negative electrode sheet were laminated facing each other using an aluminum HS cell, one separator was sandwiched between them, and the inside was filled with the obtained nonaqueous electrolyte, and then the screws were tightened to prepare an experimental battery. Using the prepared lithium battery, discharge capacity and cycle tests were performed under conditions of a charge / discharge rate of 0.2C (constant current mode) and 3.5 to 4.2V using a charge / discharge tester (LCDL-3, manufactured by Keiki Center Co., Ltd.). Note that the cycle test was performed with a charge / discharge rest period of 10 minutes during each charge / discharge. The discharge capacity and cycle property of the battery were evaluated according to the following criteria, and the results are shown in Table 9. (discharge capacity) ◎: Discharge capacity at first cycle is 120mAh / g or more ○: Discharge capacity at the first cycle is 110mAh / g or more △: Discharge capacity at the first cycle is 100mAh / g or more and less than 110mAh / g ×: Discharge capacity at the first cycle is less than 100mAh / g (Cycle test) ◎: Discharge capacity after 10 cycles of charge / discharge testing is 90% or more of the first cycle ○: Discharge capacity after 10 cycles of charge / discharge testing is 85% to 90% of that of the first cycle △: Discharge capacity after 10 cycles of charge / discharge testing is 80% to 85% of that of the first cycle ×: Discharge capacity after 10 cycles of charge / discharge test is less than 80% of the first cycle

[0093] Examples 36 to 38 and Comparative Examples 21 to 23 In Examples 36 to 38, compositions (F-32) to (F-34) were used, and in Comparative Examples 21 to 23, compositions (H-21) to (H-23) were used. A nonaqueous electrolyte was prepared in the same manner as in Example 35, and a positive electrode sheet and a negative electrode sheet were produced. Then, a battery was produced, and the discharge capacity and cycle property were evaluated according to the following criteria. The results are shown in Table 9.

[0094] [Table 9]

[0095] As can be seen from the results shown in Table 9, good battery characteristics were obtained when the composition (F) containing the compound (A) and the neutralizing salt (B) was used as a non-aqueous electrolyte and as a solution for a battery electrode sheet. That is, the composition had a high discharge capacity and the decrease in discharge capacity after the cycle test was very small. On the other hand, the comparative examples using the composition containing only A or compound (C) and B added thereto were unsatisfactory in discharge capacity and / or had poor cycle performance. [Industrial Applicability]

[0096] As described above, the composition of the present invention is not harmful, is highly safe and stable, and is suitable for long-term storage and long-term use as a solvent, diluent, dispersant, etc., and various formulations and products can be provided by containing it. Specifically, the present invention relates to a solvent used for dissolving a resin, coating material, ink, adhesive, medicine, agricultural chemical, fragrance, pigment, dye, cellulose derivative, organosilicon polymer, and conductive material containing the composition of the present invention; a diluent used for diluting a resin, coating material, ink, adhesive, medicine, agricultural chemical, fragrance, pigment, dye, cellulose derivative, organosilicon polymer, and conductive material containing the composition of the present invention; a dispersant used for dispersing a resin, coating material, ink, adhesive, medicine, agricultural chemical, fragrance, pigment, dye, cellulose derivative, organosilicon polymer, conductive material, and carbon material containing the composition of the present invention; a solvent used in a chemical reaction containing the composition of the present invention; a solvent used in HPLC (liquid chromatography) and / or GPC (gel permeation chromatography) analysis containing the composition of the present invention; a diluent, extractant, cleaner, stripper, remover, degreaser, penetrant, absorbent, dispersant, and solvent used as a lithographic printing plate correcting agent containing the composition of the present invention; and a polyimide resin, polyamide resin, polyester resin, polystyrene containing the composition of the present invention. Resins, polyacrylonitrile resins, polyvinyl chloride resins, polyvinylpyrrolidone resins, polyvinyl acetate resins, polycarbonate resins, polyethersulfone resins, polysulfone resins, polyether resins, polyurethane resins, polyesterimide resins, epoxy resins, poly(amide-imide) resins, polyvinylidene fluoride resins, solvents used in the production and / or dissolution of manufacturing equipment, manufacturing tools, industrial products, industrial parts, plastic molded products, metal parts, electronic parts, recording device filters, three-dimensional objects, inkjet nozzles and ink cartridges containing the composition of the present invention, cleaning agents used for cleaning liquid flow paths, organic coating layers on the surfaces of plastic molded products containing the composition of the present invention, support materials for three-dimensional rough objects, resists on metal thin films, UV resins, urethane resins, and release agents used for peeling epoxy resins, liquid crystal alignment treatment agents used in the alignment treatment of liquid crystal molecules containing the composition of the present invention, nonaqueous electrolytes used in the production of secondary batteries containing the composition of the present invention, and the like.

Claims

1. A composition comprising a compound (A) having an N-substituted and / or N,N-disubstituted amide group with a molecular weight of 100 or more, and a neutralized salt (B) of an acidic compound and a basic compound, wherein the content of the neutralized salt (B) relative to the whole composition is 0.001 to 10% by mass.

2. The composition according to claim 1, wherein compound (A) is an N-substituted and / or N,N-disubstituted propaneamide represented by the following general formula [1]. 【Chemistry 1】 (In the formula, R ５ and R ６ each independently represent a linear or branched saturated or unsaturated alkyl group, hydroxyalkyl group, aminoalkyl group, alkyl ether group having 1 to 18 carbon atoms, or each independently represent an alicyclic hydrocarbon or aromatic hydrocarbon having 6 to 18 carbon atoms. R １ to R ４ each independently represent a hydrogen atom, methyl group or hydroxyl group. Also, R ５ and R ６ each independently represent a hydrogen atom (except when they are both hydrogen atoms), or together with the nitrogen atom carrying them, form a saturated 5- to 7-membered ring (including those having an oxygen atom). Y represents a hydrogen atom, hydroxylamine group, linear or branched saturated or unsaturated alkyl group having 1 to 18 carbon atoms, alicyclic hydrocarbon having 6 to 18 carbon atoms, aromatic hydrocarbon, alkoxy group or amino group represented by general formula [2] or [3] (where R ７ is a linear or branched alkyl group or alkenyl group having 1 to 6 carbon atoms, and R ８ and R ９ each independently represent a hydrogen atom or a linear or branched alkyl group, alkyl ether group, alicyclic hydrocarbon, aromatic hydrocarbon having 1 to 18 carbon atoms (however, excluding the case where R ８ and R ９ are both hydrogen atoms). Also, R ８ and R ９ may together with the nitrogen atom carrying them form a saturated 5- to 7-membered ring (including those having an oxygen atom).) 【Chemistry 2】 【Transformation 3】

3. The composition according to claim 1, wherein compound (A) is one or more compounds selected from N-alkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amide, alkoxy (having 1 or more carbon atoms)-N-alkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amide, alkoxy (having 1 or more carbon atoms)-N,N-dialkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amide, alkoxy (having 1 or more carbon atoms)-N,N-dialkyl (having 1 or more carbon atoms) aminoalkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amide, and alkoxy (having 1 or more carbon atoms)-N-hydroxyalkyl (having 1 or more carbon atoms) alkane (having 2 or more carbon atoms) amide.

4. The composition according to claim 1, further comprising a compound (C) having one or more groups selected from an ether group, an ester group, a hydroxyl group, a urea group, an aryl group, and a sulfinyl group.

5. The compound (C) according to claim 4 is dibutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, ethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, 1,4-dioxane, 2-methyltetrahydrofuran, cyclopentyl methyl ether, 4-methyltetrahydropyran, 1,3-dioxolane, β-propiolactone, γ-butyrolactone, α-acetyl-γ-butyrolactone, γ-valerolactone, δ-valerolactone, ε-caprolactone, butyl acetate, ethyl benzoate, 2-ethoxyethyl acetate, 2-butoxyethyl acetate, ethyl acetoacetate, isoamyl acetate, n-pentyl acetate, ethyl propionate, linear, branched, or cyclic alkanols having 1 to 18 carbon atoms, alkanediols having 2 to 12 carbon atoms, 1,3-di A composition comprising one or more compounds selected from methylurea, 1,3-diethylurea, 1,3-diphenylurea, 1,3-dicyclohexylurea, tetramethylurea, tetraethylurea, 2-imidazolidinone, propyleneurea, 1,3-dimethyl-2-imidazolidinone, N,N-dimethylpropyleneurea, xylene, solvent naphtha, toluene, ethylbenzene, tetralin, nitrobenzene, acetophenone, dimethyl sulfoxide, methyl ethyl sulfoxide, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, C2-C4 dialkylene glycol, dialkylene glycol monoalkyl ether, trialkylene glycol, trialkylene glycol monoalkyl ether, polyalkylene glycol, and polyalkylene glycol monoalkyl ether.

6. A solvent containing the composition described in any one of claims 1 to 5, which is used for dissolving, diluting or dispersing resins, polyimide precursors, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, polymer resins, organosilicon polymers, carbon materials and conductive materials; for the synthesis of acrylic resins, polystyrene resins, polyacrylonitrile resins, polyvinyl chloride resins, polyvinylpyrrolidone resins, polyvinyl acetate resins, polyvinylidene fluoride resins, polyester resins, polyesterimide resins, polyamide resins, polycarbonate resins, polyether resins, polyethersulfone resins, polysulfone resins, fluororesins, polyurethane resins, epoxy resins, polyimide resins and polyamideimide resins; for analysis by HPLC (liquid chromatography) and GPC (gel permeation chromatography); and for chemical reactions.

7. A solvent containing the composition described in any one of claims 1 to 5, which is used for cleaning liquid channels of manufacturing equipment, manufacturing tools, industrial products, industrial parts, plastic molded products, metal parts, electronic components, recording device filters, three-dimensional molded products, inkjet nozzles and ink cartridges, organic coating layers on the surface of plastic molded products, support materials for three-dimensional rough molded products, resists on metal thin films, UV resins, urethane resins and epoxy resins, and for aligning liquid crystal molecules.

8. An electrolyte containing the composition described in any one of claims 1 to 5, which is a non-aqueous electrolyte used in the manufacture of a secondary battery.

9. A resin precursor solution containing the composition according to any one of claims 1 to 5.

10. A polyimide film obtained by heating a resin precursor solution containing the composition according to any one of claims 1 to 5, which is used as a surface protective film or interlayer insulating film for semiconductor devices, an insulating layer or spacer layer for organic EL devices, a planarization film for thin-film transistor substrates, an insulating film for organic transistors, a flexible printed circuit board, a substrate for liquid crystal displays, a substrate for organic EL displays, a substrate for electronic paper, a substrate for thin-film solar cells, a binder for electrodes of lithium-ion secondary batteries, and an adhesive for semiconductors.

11. A urethane prepolymer containing the composition according to any one of claims 1 to 5.

12. A polyurethane obtained by curing a urethane prepolymer containing the composition described in any one of Claims 1 to 5, which is used in building sealants, civil engineering sealants, building elastic adhesives, gum tape, surface protective films, optical adhesives, paints, elastomers, waterproof coating materials, flooring materials, plasticizers, flexible polyurethane foam, semi-rigid polyurethane foam, rigid polyurethane foam, and artificial leather.

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