Semiconductor device

Abstract

To suppress bending of a lid due to heat generation by a semiconductor device.SOLUTION: A semiconductor device comprises: a case (6) for housing a semiconductor chip (1); a sealing material (9) injected in the case (6); and a lid (10) fitted into an opening of the case (6). The lid (10) includes a first lid member (11) and a second lid member (12) which partially overlap each other. In a portion overlapping the second lid member (12), the first lid member (11) has a first cutout (11a) and a first protrusion (11b). In a portion overlapping the first lid member (11), the second lid member (12) has a second cutout (12a) and a second protrusion (12b). The first lid member (11) and the second lid member (12) are assembled to each other in such a manner that: the second protrusion (12b) is inserted in the first cutout (11a); and the first protrusion (11b) is inserted in the second cutout (12a).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a technology for encapsulating a semiconductor device. [Background technology]

[0002] For example, a known sealing structure for a semiconductor device for power control has a structure in which a sealing material is injected into a case that contains a semiconductor chip, wires, etc., and a lid is fitted into the opening of the case (for example, Patent Document 1 listed below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-175351 Summary of the Invention [Problem to be solved by the invention]

[0004] In a semiconductor device having the above-described structure, the lid expands due to heat generated during operation, and pressure is applied to the lid from the inner wall of the case, causing the lid to bend and, in some cases, to break.

[0005] The present disclosure has been made to solve the above problems, and has an object to suppress bending of the lid caused by heat generation in a semiconductor device. [Means for solving the problem]

[0006] The semiconductor device disclosed herein comprises a case for housing a semiconductor chip, a sealing material injected into the case, and a lid fitted into an opening of the case, the lid including a first lid member and a second lid member which are partially overlapped, the first lid member having a first cutout portion and a first convex portion at a portion overlapping with the second lid member, the second lid member having a second cutout portion and a second convex portion at a portion overlapping with the first lid member, and the first lid member and the second lid member are assembled such that the second convex portion is inserted into the first cutout portion and the first convex portion is inserted into the second cutout portion. Effect of the Invention

[0007] According to the semiconductor device according to the present disclosure, bending of the lid caused by heat generation in the semiconductor device is suppressed. [Brief description of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing a configuration of a semiconductor device according to a first embodiment. [Diagram 2] 2 is a top view of a lid of the semiconductor device according to the first embodiment. FIG. [Diagram 3] 3 is a side view of a first lid member of the lid of the semiconductor device in accordance with the first embodiment. FIG. [Figure 4] 4 is a side view of a second lid member of the lid of the semiconductor device in accordance with the first embodiment. FIG. [Diagram 5] FIG. 11 is a cross-sectional view showing a configuration of a semiconductor device according to a second embodiment. [Figure 6] 13 is a side view of a lid of the semiconductor device according to the third embodiment. FIG. [Figure 7] 13 is a side view of a lid of a semiconductor device according to a fourth embodiment. FIG. [Figure 8] FIG. 13 is a side view of a lid of a semiconductor device according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <Embodiment 1> Fig. 1 is a cross-sectional view showing the configuration of a semiconductor device according to embodiment 1. As shown in Fig. 1, the semiconductor device according to embodiment 1 has an insulating substrate 13 composed of an insulating layer 5 provided on a metal plate 4 and a circuit pattern 3 provided on the insulating layer 5. A semiconductor chip 1 is mounted on the insulating substrate 13 via a bonding member 2 such as solder. The metal plate 4 and the circuit pattern 3 are made of, for example, copper.

[0010] A case 6 is bonded to the outer edge of the insulating layer 5. An external connection terminal 7 is provided on the case 6, and the semiconductor chip 1 and the circuit pattern 3 are connected to the external connection terminal 7 via a wire 8.

[0011] A sealing material 9 made of a thermosetting resin is poured into the case 6 to protect the semiconductor chip 1 and wires 8 housed in the case. A lid 10 made of a thermosetting resin is fitted into the opening of the case 6.

[0012] The lid 10 is composed of a partially overlapping first lid member 11 and a second lid member 12. Figure 2 shows a top view of the lid 10, and Figures 3 and 4 show side views of the first lid member 11 and the second lid member 12, respectively.

[0013] As shown in Figures 1 and 2, the first lid member 11 and the second lid member 12 are partially overlapped. As shown in Figure 3, the first lid member 11 has a first cutout portion 11a and a first protrusion portion 11b in a portion overlapping with the second lid member 12. As shown in Figure 4, the second lid member 12 has a second cutout portion 12a and a second protrusion portion 12b in a portion overlapping with the first lid member 11. The first lid member 11 and the second lid member 12 are combined such that the second protrusion portion 12b is inserted into the first cutout portion 11a and the first protrusion portion 11b is inserted into the second cutout portion 12a, and the lid 10 is formed by the first lid member 11 and the second lid member 12 that are complementarily combined in this way.

[0014] In this embodiment, the height of the first protrusion 11b and the height of the second protrusion 12b are set to be the same. Therefore, when the first cover member 11 and the second cover member 12 are combined, the first cutout portion 11a and the second protrusion 12b come into contact with each other, and the second cutout portion 12a and the first protrusion 11b come into contact with each other. Therefore, the first cover member 11 and the second cover member 12 can be firmly joined together.

[0015] According to the semiconductor device of the first embodiment, lid 10 is composed of first lid member 11 and second lid member 12, so that the stress received from the inner wall of case 6 when lid 10 expands due to heat generated during operation is mitigated. This makes it possible to suppress bending of lid 10 and prevent damage to lid 10, which contributes to improving the reliability of the semiconductor device.

[0016] In the present embodiment, the first cover member 11 and the second cover member 12 are made of the same shape as shown in Figures 3 and 4. By making the first cover member 11 and the second cover member 12 of the same shape, an increase in the actual number of parts is suppressed.

[0017] The configuration inside the case 6 shown in FIG. 1 is merely an example, and any configuration may be used. There is no restriction on the type or material of the semiconductor chip 1. For example, in the case of a semiconductor device for power control, the semiconductor chip 1 may be a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), an RC-IGBR (Reverse Conductive IGBT), an SBD (Schottky Barrier Diode), a PN junction diode, or the like. The semiconductor material of the semiconductor chip 1 may be silicon, or may be a wide band gap semiconductor such as SiC or GaN. A semiconductor device including a semiconductor chip 1 made of a wide band gap semiconductor can operate at high temperatures, and therefore the above-mentioned effects can be expected.

[0018] <Embodiment 2> Fig. 5 is a cross-sectional view showing the configuration of a semiconductor device according to embodiment 2. The configuration of the semiconductor device according to embodiment 2 differs from that of embodiment 1 (Fig. 1) in that sealing material 9 is integrated with first and second lid members 11 and 12.

[0019] 5 is realized by mounting lid 10 (first lid member 11 and second lid member 12) on sealing material 9 before hardening sealing material 9, and hardening sealing material 9 and lid 10 together. Therefore, the semiconductor device according to the second embodiment can contribute to improving manufacturing efficiency.

[0020] <Embodiment 3> 6 is a side view showing the configuration of the lid 10 in the semiconductor device according to the third embodiment. As shown in FIG. 6, the first lid member 11 of the lid 10 has a first return portion 11c protruding from an upper portion of the first protrusion 11b toward the first notch portion 11a. Similarly, the second lid member 12 of the lid 10 has a second return portion 12c protruding from an upper portion of the second protrusion 12b toward the second notch portion 12a. The first lid member 11 and the second lid member 12 are combined such that the first return portion 11c and the second return portion 12c engage with each other to form the lid 10.

[0021] According to the semiconductor device of embodiment 3, first lid member 11 and second lid member 12 can be fixed to each other more firmly than in embodiment 1, which has the advantage that first lid member 11 and second lid member 12 are less likely to come off.

[0022] <Fourth embodiment> Fig. 7 is a side view showing the configuration of lid 10 in a semiconductor device according to embodiment 4. The configuration of lid 10 of the semiconductor device according to embodiment 4 is the same as that of embodiment 3 (Fig. 6), except that at least one of the tips of first turned-up portion 11c and second turned-up portion 12c is made acute-angled. In Fig. 7, the tips of both first turned-up portion 11c and second turned-up portion 12c are made acute-angled.

[0023] In the semiconductor device according to the fourth embodiment, the first return portion 11c and the second return portion 12c can be more easily engaged with each other than in the third embodiment.

[0024] <Embodiment 5> FIG. 8 is a side view showing the configuration of the lid 10 in the semiconductor device according to the fifth embodiment. As shown in FIG. 8, the first lid member 11 of the lid 10 has a first step 11d on the first cutout 11a side of the first protrusion 11b. Similarly, the second lid member 12 of the lid 10 has a second step 12d on the second cutout 12a side of the second protrusion 12b. The first step 11d is lower than the first protrusion 11b, and the second step 12d is lower than the second protrusion 12b. The heights of the first step 11d and the second step 12d are set so that the first step 11d and the second step 12d come into contact with each other when the first lid member 11 and the second lid member 12 are combined to form the lid 10.

[0025] It is preferable that the difference in height between the first cutout 11a and the first step 11d is equal to the difference in height between the second step 12d and the second protrusion 12b, and that the difference in height between the second cutout 12a and the second step 12d is equal to the difference in height between the first step 11d and the first protrusion 11b. If this condition is met, when the first cover member 11 and the second cover member 12 are combined, the first step 11d and the second step 12d come into contact with each other, the first cutout 11a and the second protrusion 12b come into contact with each other, and the second cutout 12a and the first protrusion 11b come into contact with each other. In this embodiment, the height of the first convex portion 11b and the height of the second convex portion 12b are the same, the height of the first step portion 11d is set to half the height of the first convex portion 11b, and the height of the second step portion 12d is set to half the height of the second convex portion 12b, and therefore the above condition is satisfied.

[0026] Furthermore, by making the width of the first step portion 11d and the width of the second step portion 12d equal, the side surface of the first protrusion 11b can be in contact with the side surface of the second step portion 12d, and the side surface of the second protrusion 12b can be in contact with the side surface of the first step portion 11d.

[0027] According to the semiconductor device of embodiment 5, the area of ​​contact between first lid member 11 and second lid member 12 when first lid member 11 and second lid member 12 are combined can be increased, thereby enabling a stronger bond.

[0028] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

[0029] <Additional Notes> Various aspects of the present disclosure are summarized below as appendices.

[0030] (Appendix 1) A case for housing a semiconductor chip; A sealant injected into the case; A lid fitted into the opening of the case; Equipped with the lid includes a first lid member and a second lid member that are partially overlapping; the first lid member has a first cutout portion and a first protrusion at a portion where the first lid member overlaps with the second lid member, the second lid member has a second cutout portion and a second protrusion portion in a portion where the second lid member overlaps with the first lid member, The first cover member and the second cover member are assembled such that the second protrusion is inserted into the first cutout portion, and the first protrusion is inserted into the second cutout portion. Semiconductor device.

[0031] (Appendix 2) The sealing material is integrated with the first lid member and the second lid member. 2. The semiconductor device according to claim 1.

[0032] (Appendix 3) the first cover member has a first return portion protruding from the first protrusion toward the first cutout portion, the second cover member has a second return portion protruding from the second protrusion toward the second cutout portion, The first barb and the second barb are engaged with each other. 3. The semiconductor device according to claim 1 or 2.

[0033] (Appendix 4) At least one tip of the first return portion and the second return portion has an acute angle shape. 4. The semiconductor device according to claim 3.

[0034] (Appendix 5) the first cover member has a first step portion on the first cutout portion side of the first protrusion, the second cover member has a second step portion on a side of the second protrusion facing the second notch portion, The first step portion and the second step portion are in contact with each other. 3. The semiconductor device according to claim 1 or 2.

[0035] (Appendix 6) The first cover member and the second cover member are members of the same shape. 6. The semiconductor device according to claim 1, [Explanation of symbols]

[0036] REFERENCE SIGNS LIST 1 semiconductor chip, 2 bonding member, 3 circuit pattern, 4 metal plate, 5 insulating layer, 6 case, 7 external connection terminal, 8 wire, 9 sealing material, 10 lid, 11 first lid member, 11a first cutout portion, 11b first convex portion, 11c first return portion, 11d first step portion, 12 second lid member, 12a second cutout portion, 12b second convex portion, 12c second return portion, 12d second step portion, 13 insulating substrate.

Claims

1. A case for housing a semiconductor chip; A sealant injected into the case; A lid fitted into the opening of the case; Equipped with the lid includes a first lid member and a second lid member that are partially overlapping; the first cover member has a first cutout portion and a first protrusion portion in a portion where the first cover member overlaps with the second cover member, the second cover member has a second cutout portion and a second protrusion portion at a portion where the second cover member overlaps with the first cover member, The first cover member and the second cover member are assembled such that the second protrusion is inserted into the first cutout portion and the first protrusion is inserted into the second cutout portion. Semiconductor device.

2. The sealing material is integrated with the first lid member and the second lid member. The semiconductor device according to claim 1 .

3. the first cover member has a first return portion protruding from the first protrusion toward the first cutout portion, the second cover member has a second return portion protruding from the second protrusion toward the second cutout portion, The first barb and the second barb are engaged with each other.

3. The semiconductor device according to claim 1 or 2.

4. At least one of the first and second return portions has an acute-angled tip. The semiconductor device according to claim 3 .

5. the first cover member has a first step portion on a side of the first protrusion facing the first notch portion, the second cover member has a second step portion on a side of the second protrusion facing the second notch portion, The first step portion and the second step portion are in contact with each other.

3. The semiconductor device according to claim 1 or 2.

6. The first cover member and the second cover member are members having the same shape.

3. The semiconductor device according to claim 1 or 2.

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