Cooling module

Abstract

To improve cooling performance of an electronic device.SOLUTION: A cooling module includes: a substrate; a heat radiation member which is fixed to the substrate with a gap formed between the heat radiation member and the substrate; a guide member that is disposed at a substrate side surface of the heat radiation member and that allows an electronic device to be inserted between the guide member and the substrate; a fixing mechanism that fixes the guide member to the heat radiation member so that the guide member is movable in a direction in which the substrate and the guide member face each other; and a compressively deformable heat conductive member that is disposed between the heat radiation member and the guide member and overlaps with an opening provided in the guide member in a plan view.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cooling module. [Background technology]

[0002] A cooling module that allows insertion and removal of an electronic device is known in which a heat transfer plate thermally connected to a heat dissipation member is pressed against the electronic device when the electronic device is inserted (e.g., Patent Documents 1-2). It is also known to provide an elastic heat conductive member between the heat dissipation member and the electronic device (e.g., Patent Documents 3-5). Another known configuration is to press the heat dissipation member against the electronic device by a compression spring (e.g., Patent Document 6). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-195633 A [Patent Document 2] JP 2011-159704 A [Patent Document 3] JP 2001-326492 A [Patent Document 4] US Patent Application Publication No. 2021 / 0105914 [Patent Document 5] US Patent Application Publication No. 2021 / 0029855 [Patent Document 6] JP 2005-57070 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a cooling module into which an electronic device can be inserted and removed, it is desirable to reduce the thermal resistance between the electronic device and a heat dissipation member and improve the cooling performance of the electronic device.

[0005] One aspect of the present invention aims to improve the cooling performance of an electronic device. [Means for solving the problem]

[0006] In one aspect, a cooling module includes a substrate, a heat dissipation member fixed to the substrate with a gap therebetween, a guide member arranged on the substrate side of the heat dissipation member and through which an electronic device is inserted between the substrate and the guide member, a fixing mechanism fixing the guide member to the heat dissipation member so as to be movable in the direction in which the substrate and the guide member face each other, and a compressible and deformable heat conductive member arranged between the heat dissipation member and the guide member and overlapping an opening provided in the guide member in a planar view. Effect of the Invention

[0007] One aspect is that it can improve the cooling of electronic devices. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of a cooling module according to a first embodiment. [Diagram 2] FIG. 2 is a plan view of the guide member in the first embodiment as viewed from the -Z direction. [Diagram 3] 3(a) to 3(c) are cross-sectional views showing a process in which an electronic device is inserted into the cooling module according to the first embodiment. [Figure 4] 4(a) to 4(c) are cross-sectional views showing a process in which an electronic device is removed from the cooling module according to the first embodiment. [Diagram 5] FIG. 5 is a cross-sectional view of a cooling module according to a modified example of the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view of a cooling module according to a second embodiment. [Figure 7] 7(a) to 7(c) are cross-sectional views showing a process in which an electronic device is inserted into the cooling module according to the second embodiment. [Figure 8]FIG. 8(a) is a cross-sectional view of a cooling module according to a third embodiment, and FIG. 8(b) is a plan view of a heat conductive member in the third embodiment as viewed from the +Z direction. [Figure 9] 9(a) to 9(c) are cross-sectional views showing a process in which an electronic device is inserted into the cooling module according to the third embodiment. [Figure 10] 10(a) to 10(c) are plan views of the heat conducting member in the modified example of the third embodiment as viewed from the +Z direction. [Figure 11] FIG. 11(a) is a cross-sectional view of a cooling module according to a fourth embodiment, and FIG. 11(b) is a plan view of a heat conductive member in the fourth embodiment as viewed from the -Z direction. [Figure 12] 12(a) to 12(c) are cross-sectional views showing a process in which an electronic device is inserted into the cooling module according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present invention will be described with reference to the drawings. EXAMPLES

[0010] Fig. 1 is a cross-sectional view of a cooling module according to Example 1. As shown in Fig. 1, a cooling module 100 according to Example 1 includes a substrate 10, a heat dissipation member 20, a guide member 30, a fixing mechanism 40, a heat conduction member 50, and a fixing mechanism 60. The direction in which an electronic device 70 is inserted into or removed from the cooling module 100 is the X direction, the direction perpendicular to the X direction in the planar direction of the substrate 10 is the Y direction, and the direction in which the substrate 10 and the guide member 30 face each other with a gap 11 between them is the Z direction.

[0011] The upper surface of the substrate 10 is flat. The substrate 10 may be made of an insulating material, a semiconductor material, or a metal material, as long as the material has an appropriate strength.

[0012] The heat dissipation member 20 includes a refrigerant flow path 21 through which a refrigerant 23 such as a cooling liquid flows, and a plate-shaped portion 22 having the refrigerant flow path 21 therein. The refrigerant flow path 21 and the plate-shaped portion 22 are integrated to enable heat transfer. The plate-shaped portion 22 is formed of a material with good thermal conductivity such as copper. The heat dissipation member 20 is disposed above the substrate 10 with a gap 11 between the heat dissipation member 20 and the substrate 10. The refrigerant flow path 21 is provided at least in a range that overlaps with the heat conduction member 50 in a plan view of the heat dissipation member 20.

[0013] The heat dissipation member 20 is fixed to the substrate 10 by a fixing mechanism 60. The fixing mechanism 60 has a support portion 61, a screw 62, and a fixing plate 63. Although two fixing mechanisms 60 are illustrated in FIG. 1, the fixing mechanisms 60 are arranged, for example, at the four corners of the substrate 10. The support portion 61 extends from the plate-shaped portion 22 of the heat dissipation member 20 toward the substrate 10 and is arranged between the plate-shaped portion 22 and the substrate 10, thereby supporting the heat dissipation member 20 on the substrate 10. The support portion 61 may be formed as a fixed member with the heat dissipation member 20, or may be formed of a separate member. The plate-shaped portion 22, the support portion 61, and the substrate 10 of the heat dissipation member 20 are formed with a through hole 64 penetrating in the Z direction. The fixing plate 63 is superimposed on the surface of the substrate 10 opposite to the heat dissipation member 20. The fixing plate 63 is formed with a screw hole 65 at a position aligned with the through hole 64. The screw 62 is inserted from the heat dissipation member 20 side of the through hole 64 toward the screw hole 65. The tip of the screw 62 is screwed into the screw hole 65, whereby the heat dissipation member 20 is fixed to the substrate 10.

[0014] The guide member 30 is disposed on a surface 24 of the heat dissipation member 20 on the substrate 10 side. The guide member 30 is a highly rigid member formed of a metal material such as copper or iron. The guide member 30 has a larger Young's modulus than the heat conduction member 50. For example, the Young's modulus of the guide member 30 is 100 times or more, and may be 200 times or more, the Young's modulus of the heat conduction member 50. The guide member 30 may have a smaller Young's modulus than the electronic device 70, for example. The guide member 30 is disposed above the substrate 10, and has a gap 11 between the guide member 30 and the substrate 10. The electronic device 70 is inserted between the substrate 10 and the guide member 30. The electronic device 70 is, for example, a transceiver module. The guide member 30 may be formed of an insulating material or a semiconductor material.

[0015] The guide member 30 has a main body 31 and a protrusion 32 protruding from the main body 31 toward the substrate 10. The main body 31 is formed in a plate shape and disposed facing the heat dissipation member 20. The main body 31 is fixed to the heat dissipation member 20 by a fixing mechanism 40. A top surface 33 of the protrusion 32 is formed flat and is provided with an opening 34. At least one of the side surfaces of the protrusion 32, which is the side where the electronic device 70 is inserted, forms a tapered inclined surface 35 such that the thickness of the guide member 30 increases toward the opening 34.

[0016] The guide member 30 has a recess 36 on the surface facing the heat dissipation member 20. The recess 36 is provided in a range overlapping with the protrusion 32. The recess 36 is connected to the opening 34 at its bottom. The recess 36 is larger than the opening 34 in a plan view.

[0017] The fixing mechanism 40 fixes the guide member 30 to the heat dissipation member 20 so that the guide member 30 is movable in the Z direction relative to the heat dissipation member 20. The fixing mechanism 40 has a screw 41 and a compression spring 42 provided around the screw 41 between the heat dissipation member 20 and the guide member 30. For example, the screw 41 is inserted into a gap in the center of the compression spring 42. The screw 41 is a fixing member that fixes the guide member 30 to the heat dissipation member 20, and the compression spring 42 is a biasing member that is provided between the guide member 30 and the heat dissipation member 20 and biases the guide member 30 toward the substrate 10.

[0018] The guide member 30 has a through hole 37 into which a screw 41 is inserted. The heat dissipation member 20 has a screw hole 25 formed at a position that aligns with the through hole 37. The screw 41 is inserted into the through hole 37 from the substrate 10 side toward the screw hole 25. The tip of the screw 41 is then screwed into the screw hole 25, thereby fixing the guide member 30 to the heat dissipation member 20. A compression spring 42 is provided between the heat dissipation member 20 and the guide member 30, allowing the guide member 30 to move in the Z direction relative to the heat dissipation member 20.

[0019] The heat conducting member 50 is, for example, a member having elasticity, and is a thermal interface material (TIM). The heat conducting member 50 is, for example, boron nitride (BN), aluminum nitride (AlN), or aluminum oxide (Al 2 O 3 ) or the like is added to the heat conductive filler, for example rubber added with the heat conductive filler. The heat conductive member 50 has a thickness of, for example, about 1 mm to 2 mm. The heat conductive member 50 is disposed between the heat dissipation member 20 and the guide member 30. The heat conductive member 50 is disposed between the heat dissipation member 20 and the guide member 30 by being provided in the recess 36 of the guide member 30. In a state in which the electronic device 70 is not inserted between the substrate 10 and the guide member 30, the heat conductive member 50 may be in contact with the heat dissipation member 20 or may be separated from the heat dissipation member 20.

[0020] The heat conduction member 50 is provided so as to overlap the opening 34 in a plan view. The heat conduction member 50 is exposed to the gap 11 through the opening 34. The heat conduction member 50 does not need to protrude into the opening 34 when the electronic device 70 is not inserted between the substrate 10 and the guide member 30. The guide member 30 is movable in the Z direction relative to the heat dissipation member 20, for example, within a range in which the heat conduction member 50 elastically deforms in the Z direction. The heat conduction member 50 is provided in a range that overlaps with the refrigerant flow path 21 in a plan view of the heat dissipation member 20.

[0021] 2 is a plan view of the guide member in the first embodiment as viewed from the -Z direction. As shown in FIG. 2, the guide member 30 is fixed to the heat dissipation member 20 by screws 41 provided at the four corners. The opening 34 provided in the top surface 33 of the convex portion 32 of the guide member 30 has, for example, a rectangular shape in a plan view. The heat conduction member 50 has a shape larger than the opening 34 in a plan view, is provided so as to overlap the opening 34, and is exposed from the opening 34. Note that the opening 34 is not limited to being rectangular in a plan view, and may have other shapes such as a circular shape, an elliptical shape, or an oval shape.

[0022] 1, the electronic device 70 has a flat plate shape and can be inserted into and removed from the gap 11 in the X direction. When the electronic device 70 is inserted into the gap 11 from the X direction, the thermally conductive member 50 comes into contact with the electronic device 70 through the opening 34, as described in detail below.

[0023] [Plug-in and remove electronic devices] 3(a) to 3(c) are cross-sectional views showing the process of inserting an electronic device into the cooling module according to the first embodiment. In order to clarify the drawings, only the periphery of the guide member 30 is shown in Fig. 3(a) to 3(c) (the same applies to similar drawings below). As shown in Fig. 3(a), before the electronic device 70 is inserted between the substrate 10 and the guide member 30, the heat conductive member 50 does not protrude into the opening 34 but is exposed to the gap 11 through the opening 34.

[0024] As shown in FIG. 3B, when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the electronic device 70 comes into contact with the inclined surface 35 of the protruding portion 32 of the guide member 30 and pushes the guide member 30 up in the +Z direction as indicated by the black arrow. At this time, the compression spring 42 is pressed between the heat dissipation member 20 and the guide member 30 and contracts. As the electronic device 70 pushes the guide member 30 up in the +Z direction, the heat conduction member 50 is pushed by the guide member 30 and undergoes compressive deformation (e.g., elastic compression) between the heat dissipation member 20 and the guide member 30. As the heat conduction member 50 is pushed by the guide member 30, a part of the heat conduction member 50 enters the opening 34. As the electronic device 70 comes into contact with the inclined surface 35 of the protruding portion 32 of the guide member 30, a force in the -X direction is applied to the guide member 30 by the electronic device 70. However, since the guide member 30 is fixed to the heat dissipation member 20 by the fixing mechanism 40, the guide member 30 is restrained from moving in the -X direction relative to the heat dissipation member 20 even if a force in the -X direction is applied thereto.

[0025] 3(c), when the electronic device 70 is further inserted and reaches the top surface 33 of the protrusion 32 of the guide member 30, the elastically compressed heat conduction member 50 comes into contact with the electronic device 70 at the opening 34. Since the heat conduction member 50 is elastically compressed, the electronic device 70 is pressed by the heat conduction member 50. Therefore, the heat conduction member 50 comes into contact with the electronic device 70 while pressing it.

[0026] 4(a) to 4(c) are cross-sectional views showing the process of removing the electronic device from the cooling module according to the first embodiment. As shown in Fig. 4(a), in a state where the electronic device 70 is inserted between the substrate 10 and the guide member 30, the heat conductive member 50 is in contact with the electronic device 70 while being pressed against the electronic device 70. In addition, the compression spring 42 is compressed by being pressed by the guide member 30 between the heat dissipation member 20 and the guide member 30.

[0027] 4(b), as the electronic device 70 is removed from between the substrate 10 and the guide member 30, the guide member 30 moves down in the -Z direction as indicated by the black arrow while the inclined surface 35 of the protrusion 32 abuts against the electronic device 70. The guide member 30 moves down in the -Z direction due to its own weight, and also moves down in the -Z direction due to the repulsive force of the compression spring 42. Since the electronic device 70 is removed while abutting against the top surface 33 of the protrusion 32 of the guide member 30, a force in the +X direction is applied to the guide member 30 due to the frictional force between the electronic device 70. However, since the guide member 30 is fixed to the heat dissipation member 20 by the fixing mechanism 40, the guide member 30 is prevented from moving in the +X direction relative to the heat dissipation member 20 even when a force in the +X direction is applied.

[0028] 4(c), when the electronic device 70 is removed from between the substrate 10 and the guide member 30, the guide member 30 returns to its initial position. This releases the heat conductive member 50 from elastic compression and exposes it to the gap 11 through the opening 34 without protruding into the opening 34. Note that, although the above description shows an example in which the compressive deformation of the heat conductive member 50 due to the insertion and removal of the electronic device 70 is elastic deformation, it may also be plastic deformation.

[0029] As described above, according to the first embodiment, as shown in FIG. 1, the heat dissipation member 20 is fixed to the substrate 10 with a gap 11 between the substrate 10 and the guide member 30. The guide member 30 is disposed on the surface 24 of the heat dissipation member 20 on the substrate 10 side, and the electronic device 70 is inserted between the substrate 10 and the guide member 30. The fixing mechanism 40 fixes the guide member 30 to the heat dissipation member 20 so that the guide member 30 is movable in the Z direction. The compressible heat conduction member 50 is disposed between the heat dissipation member 20 and the guide member 30, and overlaps with the opening 34 provided in the guide member 30 in a plan view. With this configuration, when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the heat conduction member 50 comes into contact with the electronic device 70 at the opening 34 of the guide member 30. As a result, the electronic device 70 is thermally connected to the heat dissipation member 20 via the heat conduction member 50. Therefore, the thermal resistance is reduced compared to the case where the electronic device is thermally connected to the heat dissipation member via a heat transfer member and a heat conductive member, as in Patent Document 1, for example. That is, the thermal resistance of the heat transfer member is eliminated, and the thermal resistance of the electronic device and the heat transfer member is replaced by the thermal resistance of the electronic device and the heat conductive member, so that the thermal resistance is reduced. Thus, the cooling performance of the electronic device 70 can be improved. In addition, the guide member 30 is fixed to the heat dissipation member 20 by the fixing mechanism 40. Therefore, the guide member 30 and the heat conductive member 50 arranged between the guide member 30 and the heat dissipation member 20 can be suppressed from moving and deforming unintentionally when the electronic device 70 is inserted or removed.

[0030] Moreover, in the first embodiment, the guide member 30 has a convex portion 32 that protrudes toward the substrate 10. The side surface of the convex portion 32 on the side where the electronic device 70 is inserted is an inclined surface 35. The opening 34 provided in the guide member 30 is provided on the top surface 33 of the convex portion 32. As a result, when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the guide member 30 is pushed by the electronic device 70 and is likely to move in the +Z direction. As a result, the thermally conductive member 50 is likely to come into contact with the electronic device 70 through the opening 34 of the guide member 30.

[0031] Moreover, in the first embodiment, the guide member 30 has a recess 36 connected to the opening 34 on the surface facing the heat dissipation member 20. The heat conduction member 50 is provided in the recess 36 and overlaps the opening 34. This makes it possible to effectively prevent the heat conduction member 50 from moving or deforming unintentionally when the electronic device 70 is inserted or removed.

[0032] 3(a) to 4(c), the guide member 30 is pushed up toward the heat dissipation member 20 by the electronic device 70 inserted between the substrate 10 and the guide member 30 coming into contact with the guide member 30. The heat conduction member 50 is compressed and deformed by the guide member 30 being pushed up toward the heat dissipation member 20. This makes it easier for the heat conduction member 50 to come into contact with the electronic device 70 through the opening 34 of the guide member 30.

[0033] In the first embodiment, the fixing mechanism 40 includes a screw 41 (fixing member) that fixes the guide member 30 to the heat dissipation member 20, and a compression spring 42 (urging member) that urges the guide member 30 toward the board 10. As a result, as shown in Figures 4(a) to 4(c), when the electronic device 70 is removed from between the board 10 and the guide member 30, the guide member 30 is urged by the compression spring 42 and is likely to return to the state before the electronic device 70 was inserted.

[0034] In the first embodiment, the heat conductive member 50 is rubber to which a heat conductive filler is added. This makes it easier for a part of the heat conductive member 50 to enter the opening 34 of the guide member 30 when the heat conductive member 50 is pressed by the guide member 30. This makes it easier for the heat conductive member 50 to come into contact with the electronic device 70 through the opening 34 of the guide member 30.

[0035] In the first embodiment, it is sufficient that the heat conductive member 50 overlaps the opening 34 over the maximum dimension in the X direction. This allows the insertion of the electronic device 70 to be unimpeded. Furthermore, it is possible to prevent the position of the heat conductive member 50 from shifting due to the insertion or removal of the electronic device 70. Therefore, it is not necessary for the entire surface of the opening 34 to overlap with the heat conductive member 50, and there may be a gap in the Y direction.

[0036] [Variations] Fig. 5 is a cross-sectional view of a cooling module according to a modified example of Example 1. As shown in Fig. 5, a cooling module 110 according to a modified example of Example 1 includes a heat dissipation member 20a having a plate-shaped portion 26 and a plurality of heat dissipation fins 27, instead of the heat dissipation member 20. The heat dissipation fins 27 extend from the plate-shaped portion 26 in the +Z direction. The other configurations are the same as those of Example 1, and therefore will not be described. EXAMPLES

[0037] Fig. 6 is a cross-sectional view of a cooling module according to a second embodiment. As shown in Fig. 6, a cooling module 200 according to the second embodiment is provided with a coating film 52 covering a heat conductive member 50. The coating film 52 is provided, for example, completely covering the heat conductive member 50. The coating film 52 is, for example, a polyethylene terephthalate (PET) film, a polytetrafluoroethylene (PTFE) film, or a metal film such as stainless steel. The thickness of the coating film 52 is, for example, about 10 µm to 50 µm. The other configurations are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0038] [Plug-in and remove electronic devices] 7(a) to 7(c) are cross-sectional views showing a process in which an electronic device is inserted into the cooling module according to the second embodiment. As shown in Fig. 7(a), before the electronic device 70 is inserted between the substrate 10 and the guide member 30, the heat conductive member 50 and the coating film 52 do not protrude into the opening 34. Since the coating film 52 is provided to cover the heat conductive member 50, the coating film 52 is exposed to the gap 11 through the opening 34.

[0039] 7(b), when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the electronic device 70 comes into contact with the inclined surface 35 of the protrusion 32 of the guide member 30, and pushes the guide member 30 up in the +Z direction, as in the first embodiment. As the electronic device 70 pushes the guide member 30 up in the +Z direction, the heat conductive member 50 is pushed by the guide member 30 and is, for example, elastically compressed between the heat dissipation member 20 and the guide member 30. The thickness of the coating film 52 remains almost unchanged. As the heat conductive member 50 and the coating film 52 are pushed by the guide member 30, a portion of them enters the opening 34.

[0040] 7(c), when the electronic device 70 is further inserted and reaches the top surface 33 of the protrusion 32 of the guide member 30, the coating film 52 is exposed from the opening 34 of the guide member 30 by the elastically compressed heat conductive member 50. As a result, the heat conductive member 50 comes into contact with the electronic device 70 via the coating film 52. Since the heat conductive member 50 is elastically compressed, the electronic device 70 is pressed by the heat conductive member 50. Therefore, the heat conductive member 50 comes into contact with the electronic device 70 while pressing it via the coating film 52.

[0041] The process of removing the electronic device 70 from the cooling module 200 of Example 2 is similar to the removal of the electronic device 70 shown in Figures 4(a) to 4(c), but follows the reverse process of Figures 7(a) to 7(c), so a description thereof will be omitted.

[0042] According to the second embodiment, the heat conduction member 50 is covered with the coating film 52. If the heat conduction member 50 is not covered with the coating film 52, the heat conduction member 50 may be deformed in the X and Y directions in addition to the Z direction when the heat conduction member 50 is pressed by the guide member 30. However, since the heat conduction member 50 is covered with the coating film 52, the heat conduction member 50 can be prevented from being deformed in the X and Y directions. Therefore, when the heat conduction member 50 is pressed by the guide member 30, a part of the heat conduction member 50 and the coating film 52 is likely to enter the opening 34.

[0043] In the second embodiment, the heat conductive member 50 is rubber to which a heat conductive filler is added. In this case, when the electronic device 70 is inserted or removed, the heat conductive member 50 may be wrinkled due to contact between the electronic device 70 and the heat conductive member 50. By using a polyethylene terephthalate film, a polytetrafluoroethylene film, or a stainless steel film as the coating film 52 covering the heat conductive member 50, the sliding property between the electronic device 70 and the coating film 52 is improved, and friction is reduced. Therefore, the heat conductive member 50 and the coating film 52 can be prevented from being wrinkled. EXAMPLES

[0044] Fig. 8(a) is a cross-sectional view of a cooling module according to the third embodiment, and Fig. 8(b) is a plan view of the heat conduction member in the third embodiment as viewed from the +Z direction. As shown in Figs. 8(a) and 8(b), the cooling module 300 according to the third embodiment is provided with a coating film 52 covering the heat conduction member 50, similar to the second embodiment. The difference from the second embodiment is that the coating film 52 has an opening 54 on the surface of the heat conduction member 50 facing the heat dissipation member 20. The opening 54 has, for example, a circular shape in a plan view. The other configurations are the same as those of the first embodiment, and therefore will not be described.

[0045] [Plug-in and remove electronic devices] 9(a) to 9(c) are cross-sectional views showing a process in which an electronic device is inserted into a cooling module according to a third embodiment. As shown in FIG. 9(a), before an electronic device 70 is inserted between a substrate 10 and a guide member 30, the heat conductive member 50 and the coating film 52 do not protrude into the opening 34 of the guide member 30. Since the coating film 52 is provided to cover the heat conductive member 50, the coating film 52 is exposed to the gap 11 through the opening 34 of the guide member 30. In addition, the coating film 52 is present between the heat conductive member 50 and the heat dissipation member 20.

[0046] 9(b), when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the electronic device 70 comes into contact with the inclined surface 35 of the convex portion 32 of the guide member 30 and pushes the guide member 30 up in the +Z direction, as in the first embodiment. As the electronic device 70 pushes the guide member 30 up in the +Z direction, the heat conductive member 50 is pushed by the guide member 30 and is, for example, elastically compressed between the heat dissipation member 20 and the guide member 30. The thickness of the coating film 52 remains almost unchanged. As the heat conductive member 50 and the coating film 52 are pushed by the guide member 30, a portion of them enters the opening 34 of the guide member 30. In addition, since the opening 54 is provided in the coating film 52, the heat conductive member 50 enters the opening 54.

[0047] 9(c), when the electronic device 70 is further inserted and reaches the top surface 33 of the protrusion 32 of the guide member 30, the coating film 52 is exposed from the opening 34 of the guide member 30 by the elastically compressed heat conduction member 50. As a result, the heat conduction member 50 comes into contact with the electronic device 70 via the coating film 52. Since the heat conduction member 50 is elastically compressed, the electronic device 70 is pressed by the heat conduction member 50. Therefore, the heat conduction member 50 comes into contact with the electronic device 70 in a state of pressing against it via the coating film 52. In addition, the heat conduction member 50 is exposed from the opening 54 of the coating film 52, and comes into contact with the heat dissipation member 20 at the opening 54.

[0048] The process of removing the electronic device 70 from the cooling module 300 of Example 3 is similar to the removal of the electronic device 70 shown in Figures 4(a) to 4(c), and follows the reverse process of Figures 9(a) to 9(c), so a description thereof will be omitted.

[0049] [Variations] 10(a) to 10(c) are plan views of the heat conductive member in a modified example of Example 3, as viewed from the +Z direction. The opening 54 provided in the coating film 52 may be rectangular in plan view as shown in FIG. 10(a), elliptical in plan view as shown in FIG. 10(b), or oval in plan view as shown in FIG. 10(c). In this manner, the opening 54 may have various shapes. Furthermore, the number of openings 54 is not limited to one, and multiple openings 54 may be provided.

[0050] According to the third embodiment, since the coating film 52 that covers the heat conduction member 50 is provided, the heat conduction member 50 is prevented from being deformed in the X and Y directions, as in the second embodiment. Therefore, the heat conduction member 50 and a part of the coating film 52 are easily inserted into the opening 34 of the guide member 30. The opening 54 is provided at a portion of the coating film 52 that is located on the surface of the heat conduction member 50 on the heat dissipation member 20 side. Therefore, as shown in Figs. 9(a) to 9(c), when the electronic device 70 is inserted, the heat conduction member 50 comes into contact with the heat dissipation member 20 at the opening 54. Therefore, the cooling performance of the electronic device 70 can be improved compared to the second embodiment.

[0051] The size of the opening 54 provided in the coating film 52 is preferably 20% or more, more preferably 30% or more, and even more preferably 40% or more of the area of ​​the face of the heat conduction member 50 facing the heat dissipation member 20, in terms of contacting the heat conduction member 50 with the heat dissipation member 20. On the other hand, if the opening 54 is too large, the effect of suppressing deformation of the heat conduction member 50 in the X and Y directions is weakened. Therefore, the size of the opening 54 is preferably 70% or less, more preferably 60% or less, and even more preferably 50% or less of the area of ​​the face of the heat conduction member 50 facing the heat dissipation member 20. EXAMPLES

[0052] Fig. 11(a) is a cross-sectional view of a cooling module according to the fourth embodiment, and Fig. 11(b) is a plan view of the heat conductive member in the fourth embodiment as viewed from the -Z direction. As shown in Figs. 11(a) and 11(b), the cooling module 400 according to the fourth embodiment is provided with a coating film 52 covering the heat conductive member 50, similar to the second embodiment. The difference from the second embodiment is that the coating film 52 has an opening 56 on the surface of the heat conductive member 50 facing the substrate 10. The opening 56 has, for example, a circular shape in a plan view. The other configurations are the same as those of the first embodiment, and therefore will not be described.

[0053] [Plug-in and remove electronic devices] 12(a) to 12(c) are cross-sectional views showing a process in which an electronic device is inserted into a cooling module according to a fourth embodiment. As shown in FIG. 12(a), before an electronic device 70 is inserted between a substrate 10 and a guide member 30, the heat conductive member 50 and the coating film 52 do not protrude into the opening 34 of the guide member 30. The heat conductive member 50 is exposed to the gap 11 through the opening 56 of the coating film 52 and the opening 34 of the guide member 30, and the coating film 52 is exposed to the gap 11 through the opening 34 of the guide member 30. The coating film 52 exists between the heat conductive member 50 and the heat dissipation member 20.

[0054] 12(b), when the electronic device 70 is inserted between the substrate 10 and the guide member 30, the electronic device 70 comes into contact with the inclined surface 35 of the protrusion 32 of the guide member 30 and pushes the guide member 30 up in the +Z direction, as in the first embodiment. As the electronic device 70 pushes the guide member 30 up in the +Z direction, the heat conductive member 50 is pushed by the guide member 30 and is, for example, elastically compressed between the heat dissipation member 20 and the guide member 30. As the heat conductive member 50 and the coating film 52 are pushed by the guide member 30, a part of them enters the opening 34 of the guide member 30. Since the coating film 52 has an opening 56, the heat conductive member 50 also enters the opening 56. The thickness of the coating film 52 remains almost unchanged.

[0055] 12( c), when the electronic device 70 is further inserted and reaches the top surface 33 of the protrusion 32 of the guide member 30, the coating film 52 is exposed from the opening 34 of the guide member 30 by the elastically compressed heat conduction member 50. The heat conduction member 50 is also exposed from the opening 56 of the coating film 52. As a result, the coating film 52 comes into contact with the electronic device 70, and the heat conduction member 50 comes into contact with the electronic device 70 at the opening 56 of the coating film 52. Since the heat conduction member 50 is elastically compressed, the electronic device 70 is pressed by the heat conduction member 50.

[0056] The process of removing the electronic device 70 from the cooling module 400 of Example 4 is similar to the removal of the electronic device 70 shown in Figures 4(a) to 4(c), and follows the reverse process of Figures 12(a) to 12(c), so a description thereof will be omitted.

[0057] Note that opening 56 provided in coating film 52 is not limited to being circular in plan view, similar to opening 54 provided in coating film 52 in Example 3, and may be rectangular, elliptical, oval, or other shapes. Also, opening 56 is not limited to being provided in a single number, and may be provided in a plurality of numbers.

[0058] According to the fourth embodiment, since the coating film 52 that covers the heat conduction member 50 is provided, the heat conduction member 50 is prevented from being deformed in the X and Y directions, as in the second embodiment. Therefore, the heat conduction member 50 and a part of the coating film 52 are easily inserted into the opening 34 of the guide member 30. An opening 56 is provided in a portion of the coating film 52 that is located on the surface of the heat conduction member 50 on the substrate 10 side. Therefore, as shown in Figs. 12(a) to 12(c), when the electronic device 70 is inserted, the heat conduction member 50 comes into contact with the electronic device 70 at the opening 56. Therefore, compared to the second embodiment, the cooling performance for the electronic device 70 can be improved.

[0059] The size of the opening 56 provided in the coating film 52 is preferably 20% or more, more preferably 30% or more, and even more preferably 40% or more of the area of ​​the face of the heat conductive member 50 facing the substrate 10 in terms of contacting the heat conductive member 50 with the electronic device 70. On the other hand, if the opening 56 is too large, the effect of suppressing deformation of the heat conductive member 50 in the X and Y directions is weakened. Therefore, the size of the opening 56 is preferably 70% or less, more preferably 60% or less, and even more preferably 50% or less of the area of ​​the face of the heat conductive member 50 facing the substrate 10.

[0060] In addition, in the fourth embodiment, in addition to having an opening 56 on the surface of the thermal conductive member 50 facing the substrate 10, the coating film 52 may also have an opening 54 on the surface of the thermal conductive member 50 facing the heat dissipation member 20, as in the third embodiment.

[0061] In the second to fourth embodiments, like the modified example of the first embodiment, the heat dissipation member 20 may be replaced with a heat dissipation member 20a.

[0062] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist of the present invention described in the claims.

[0063] In addition, the following supplementary notes are provided in relation to the above description. (Additional Note 1) A cooling module comprising: a substrate; a heat dissipation member fixed to the substrate with a gap therebetween; a guide member arranged on a surface of the heat dissipation member facing the substrate and through which an electronic device is inserted between the guide member and the substrate; a fixing mechanism fixing the guide member to the heat dissipation member so as to be movable in a direction in which the substrate and the guide member face each other; and a compressible and deformable heat conductive member arranged between the heat dissipation member and the guide member and overlapping an opening provided in the guide member in a planar view. (Appendix 2) The cooling module described in Appendix 1, wherein the guide member has a convex portion protruding toward the substrate, the convex portion has an inclined side surface on the side where the electronic device is inserted, and the opening is provided in the top surface of the convex portion. (Supplementary Note 3) The cooling module described in Supplementary Note 2, wherein the guide member has a recess connected to the opening on the surface facing the heat dissipation member, and the heat conduction member is provided in the recess and overlaps the opening in a planar view. (Appendix 4) A cooling module as described in Appendix 1 or 2, wherein the guide member is pushed up toward the heat dissipation member when the electronic device inserted between the board and the guide member abuts against it, and the thermal conduction member is compressed and deformed when the guide member is pushed up toward the heat dissipation member. (Appendix 5) The cooling module described in Appendix 1 or 2, wherein the fixing mechanism comprises a fixing member that fixes the guide member to the heat dissipation member, and a biasing member that is provided between the guide member and the heat dissipation member and biases the guide member toward the substrate. (Supplementary Note 6) The cooling module according to Supplementary Note 1 or 2, wherein the heat conductive member is rubber having a heat conductive filler added thereto. (Appendix 7) The cooling module according to appendix 1 or 2, further comprising a coating film covering the heat conductive member. (Supplementary Note 8) The cooling module according to Supplementary Note 7, wherein the coating film has an opening on a surface of the thermal conduction member facing the heat dissipation member. (Supplementary Note 9) The cooling module according to Supplementary Note 7, wherein the coating film has an opening on a surface of the thermal conductive member facing the substrate. (Appendix 10) The cooling module described in Appendix 7, wherein the thermally conductive member is rubber having a thermally conductive filler added thereto, and the coating film is a polyethylene terephthalate film, a polytetrafluoroethylene film, or a stainless steel film. (Supplementary Note 11) The cooling module according to Supplementary Note 1 or 2, wherein the heat dissipation member has a refrigerant flow path through which a refrigerant flows. (Supplementary Note 12) The cooling module according to Supplementary Note 1 or 2, wherein the heat dissipation member has a plurality of heat dissipation fins. [Explanation of symbols]

[0064] 10...substrate, 11...gap, 20, 20a...heat dissipation member, 21...coolant flow path, 22...plate-shaped portion, 23...coolant, 24...surface, 25...screw hole, 26...plate-shaped portion, 27...heat dissipation fin, 30...guide member, 31...main body portion, 32...projection portion, 33...top surface, 34...opening, 35...inclined surface, 36...recess, 37...through hole, 40...fixing mechanism, 41...screw, 42...compression spring, 50...heat conduction member, 52...coating film, 54...opening, 56...opening, 60...fixing mechanism, 61...support portion, 62...screw, 63...fixing plate, 64...through hole, 65...screw hole, 70...electronic device, 100, 110, 200, 300, 400...cooling module

Claims

1. A substrate; a heat dissipation member fixed to the substrate with a gap therebetween; a guide member disposed on a surface of the heat dissipation member facing the substrate, the guide member being adapted to receive an electronic device between the heat dissipation member and the substrate; a fixing mechanism that fixes the guide member to the heat dissipation member so as to be movable in a direction in which the substrate and the guide member face each other; a compressible and deformable heat conduction member that is disposed between the heat dissipation member and the guide member and overlaps an opening provided in the guide member in a plan view.

2. the guide member has a protrusion protruding toward the substrate, the protrusion has an inclined side surface on the side into which the electronic device is inserted, The cooling module according to claim 1 , wherein the opening is provided in a top surface of the protrusion.

3. the guide member has a recess connected to the opening on a surface facing the heat dissipation member, The cooling module according to claim 2 , wherein the heat conductive member is provided in the recess and overlaps with the opening in a plan view.

4. the guide member is pushed up toward the heat dissipation member by contact with the electronic device inserted between the board and the guide member, The cooling module according to claim 1 , wherein the heat conducting member is compressed and deformed by the guide member being pushed up toward the heat dissipating member.

5. 3. The cooling module according to claim 1, wherein the fixing mechanism comprises a fixing member that fixes the guide member to the heat dissipation member, and a biasing member that is provided between the guide member and the heat dissipation member and biases the guide member toward the substrate.

6. 3. The cooling module according to claim 1, wherein the heat conductive member is rubber having a heat conductive filler added thereto.

7. The cooling module according to claim 1 , further comprising a coating film covering the heat conducting member.

8. The cooling module according to claim 7 , wherein the coating film has an opening on a surface of the thermally conductive member facing the heat dissipating member.

9. The cooling module according to claim 7 , wherein the covering film has an opening on a surface of the heat conducting member facing the substrate.

10. the thermally conductive member is a rubber having a thermally conductive filler added thereto; The cooling module of claim 7 , wherein the covering film is a polyethylene terephthalate film, a polytetrafluoroethylene film, or a stainless steel film.

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