Optical apparatus

Abstract

To provide a compact optical apparatus.SOLUTION: An optical apparatus (101) includes: a first substrate (500) which has a main flat surface perpendicular to an optical axis; and second substrates (600, 700) which each have a main flat surface parallel to the optical axis. The first substrate and the second substrate are joined to each other. The first substrate has: a first mounting surface (520); and a second mounting surface (521) on an opposite side of the first mounting surface. The second substrate has an end facing the first mounting surface of the first substrate. The end has: junctions (601, 701, 702) joined to the first mounting surface; and cutouts (602, 703) forming space between the end and the first mounting surface.SELECTED DRAWING: Figure 6(a)

Description

[Technical field]

[0001] The present invention relates to optical instruments. [Background technology]

[0002] As functions such as autofocus and vibration isolation in optical devices such as interchangeable lenses improve, the scale of the control circuits mounted on the board inside the optical device increases, resulting in a larger board area. Patent Document 1 discloses an electric board mounting structure including at least one hard board substantially perpendicular to the optical axis, at least one hard board substantially parallel to the optical axis, and a board-to-board connector that connects both hard boards. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-172863 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the structure disclosed in Patent Document 1, the electric boards cannot be arranged with good spatial efficiency, making it difficult to reduce the size of the optical device.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a compact optical device. [Means for solving the problem]

[0006] An optical device as one aspect of the present invention has a first substrate having a main plane perpendicular to an optical axis, and a second substrate having a main plane parallel to the optical axis, the first substrate and the second substrate being bonded to each other, the first substrate having a first mounting surface and a second mounting surface opposite the first mounting surface, the second substrate having an end portion facing the first mounting surface of the first substrate, the end portion having a joint portion bonded to the first mounting surface and a cutout portion forming a space between the first mounting surface and the second substrate.

[0007] Other objects and features of the present invention will be described in the following embodiments. Effect of the Invention

[0008] According to the present invention, a small-sized optical device can be provided. [Brief description of the drawings]

[0009] [Figure 1] 1 is an external view of an imaging system according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a block diagram of an imaging system according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a cross-sectional view (renormalized state) of the imaging system according to the present embodiment. [Figure 4] FIG. 2 is a cross-sectional view (extended state) of the imaging system according to the present embodiment. [Diagram 5] 3 is a perspective view showing a state in which a first substrate is bonded to a second substrate and a third substrate is bonded to a third substrate in the embodiment. FIG. [Figure 6(a)] FIG. 2 is an exploded perspective view of a first substrate, a second substrate, and a third substrate in the embodiment. [Figure 6(b)] 4 is a diagram showing a state in which a first substrate and a second substrate are bonded together in the present embodiment. FIG. [Figure 6(c)] 4 is a diagram showing a state in which a first substrate and a third substrate are bonded together in the present embodiment. FIG. [Figure 6(d)] 4A and 4B are diagrams illustrating wiring in a state in which the first substrate and the third substrate are joined together in the present embodiment. [Figure 7] 3A to 3C are diagrams illustrating a state in which a first substrate is bonded to a second substrate and a third substrate is bonded to each other in the present embodiment. [Figure 8] 2A and 2B are a rear view and a cross-sectional view of the interchangeable lens in the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In each drawing, the same components are given the same reference numerals, and duplicated explanations will be omitted. In this embodiment, an interchangeable lens (lens device) will be described as an example of an optical device, but this embodiment is not limited to this, and can be applied to other optical devices such as a lens-integrated camera.

[0011] 1(a) and (b) are external views of an imaging system (camera system) 100 in this embodiment, with Fig. 1(a) being a perspective view seen from the front side and Fig. 1(b) being a perspective view seen from the back side. The imaging system 100 is configured with a camera body (digital camera, imaging device) 1 and an interchangeable lens (lens device, optical equipment) 101 that is detachable from the camera body 1.

[0012] As shown in Fig. 1(a), the optical axis direction in which the optical axis of the imaging optical system housed in the interchangeable lens 101 extends is defined as the X-axis direction, and two directions that are perpendicular to the optical axis and perpendicular to each other are defined as the Z-axis direction (horizontal direction) and the Y-axis direction (vertical direction). Hereinafter, the Z-axis direction and the Y-axis direction are collectively referred to as the Z / Y-axis direction. In addition, the rotation direction around the Z axis is defined as the pitch direction, and the rotation direction around the Y axis is defined as the yaw direction. The pitch direction and yaw direction (pitch / yaw direction) are the rotation directions around two axes, the Z axis and the Y axis, which are perpendicular to each other.

[0013] A grip section 2 is provided on the left side of the camera body 1 as viewed from the front (the subject side) (the right side as viewed from the rear) for the user to hold the camera body 1 with his / her hand. A power supply operation section 3 is also provided on the top surface of the camera body 1. When the user turns on the power supply operation section 3 while the camera body 1 is in the power-off state, the camera body 1 is turned on and image capture is possible. When the user turns off the power supply operation section 3 while the camera body 1 is in the power-on state, the camera body 1 is turned off.

[0014] A mode dial 4, a release button 5, and an accessory shoe 6 are provided on the top surface of the camera body 1. The user can switch between imaging modes by rotating the mode dial 4. The imaging modes include a manual still image imaging mode in which the user can arbitrarily set imaging conditions such as shutter speed and aperture value, an auto still image imaging mode in which an appropriate exposure amount is automatically obtained, and a video imaging mode for capturing videos. In addition, the user can instruct imaging preparation operations such as autofocus and auto exposure control by half-pressing the release button 5, and can instruct imaging by fully pressing the button. Accessories such as an external flash and an external viewfinder (EVF), not shown, are detachably attached to the accessory shoe 6. In addition, an imaging element that photoelectrically converts (captures) a subject image formed by an imaging optical system in the interchangeable lens 101 is provided in the camera body 1.

[0015] The interchangeable lens 101 is mechanically and electrically connected to the camera mount 7 provided on the camera body 1 via a lens mount (mount unit) 102. As described above, the interchangeable lens 101 houses an imaging optical system that forms an image of a subject by focusing light from the subject. The outer periphery of the interchangeable lens 101 is provided with a zoom ring 103 that can be rotated around an optical axis by a user's operation. The outer periphery of the zoom ring 103 is provided with a knurled shape to prevent the user's hand from slipping when operating it. When the zoom ring 103 is rotated by the user, the zoom group that constitutes the imaging optical system moves to a predetermined optical position corresponding to the angle of the zoom ring 103. This allows the user to take a picture at a desired angle of view.

[0016] As shown in FIG. 1(b), a rear operation unit 8 and a display unit 9 are provided on the rear of the camera body 1. The rear operation unit 8 includes a plurality of buttons and dials to which various functions are assigned. When the power of the camera body 1 is on and a still image or video imaging mode is set, a through image of a subject image captured by an imaging element is displayed on the display unit 9. The display unit 9 also displays imaging parameters indicating imaging conditions such as shutter speed and aperture value (F value), and the user can change the setting values ​​of the imaging parameters by operating the rear operation unit 8 while viewing the display. The rear operation unit 8 includes a playback button for instructing playback of a recorded captured image, and the captured image is played back and displayed on the display unit 9 by the user operating the playback button.

[0017] 2 is a block diagram showing the electrical and optical configuration of the imaging system 100. The camera body 1 has a power supply unit 10 that supplies power to the camera body 1 and the interchangeable lens 101, the power operation unit 3 described above, a mode dial 4, a release button 5, and an operation unit 11 that includes a rear operation unit 8 and a touch panel function of the display unit 9. The camera body 1 and the interchangeable lens 101 as a whole system are controlled by a camera control unit 12 provided in the camera body 1 and a lens control unit 104 provided in the interchangeable lens 101 in cooperation with each other.

[0018] The camera control unit 12 reads out and executes a computer program stored in the storage unit 13. In so doing, the camera control unit 12 communicates various control signals, data, and the like with the lens control unit 104 via a communication terminal of an electrical contact 105 provided on a lens mount 102 connectable to the camera body 1. The electrical contact 105 includes a power terminal that supplies power from the power supply unit 10 described above to the interchangeable lens 101.

[0019] The imaging optical system of the interchangeable lens 101 includes a zoom group 110 that is connected to the zoom operation ring 103 and moves in the optical axis direction to change the angle of view, and an anti-vibration group 115 that includes a shift lens as an anti-vibration element that reduces image blur. The anti-vibration group 115 performs an anti-vibration operation to reduce image blur by moving (shifting) the shift lens in the Z / Y axis direction perpendicular to the optical axis O. The imaging optical system also includes an aperture group (aperture diaphragm) 201 that performs a light amount adjustment operation, and a focus group 112 that is a moving lens group including a focus lens that moves in the optical axis direction to adjust the focus. The interchangeable lens 101 also includes an anti-vibration driver 402 that drives the anti-vibration group 115 to shift the shift lens, an aperture driver 202 that drives the aperture group 201, and a focus driver 302 that drives the focus group 112 to move the focus lens.

[0020] The camera body 1 has a shutter unit 14, a shutter drive section 15, an image sensor 16, an image processing section 17, and the camera control section 12 described above. The shutter unit 14 controls the amount of light collected by the image sensor 16 through the image sensor 16 and exposed to the light. The image sensor 16 has a CMOS (Complementary Metal-Oxide-Semiconductor) sensor or the like, and performs photoelectric conversion on the subject image (optical image) formed by the image sensor 16, and outputs an image signal. The image processing section 17 performs various image processes on the image signal, and then generates an image signal. The display section 9 displays the image signal (through image) output from the image processing section 17, displays the image sensor parameters described above, or reproduces and displays the captured image recorded in the memory section 13 or a recording medium (not shown).

[0021] The camera control unit 12 controls the driving of the aperture group 201 and the shutter unit 14 via the aperture drive unit 202 and the shutter drive unit 15 in accordance with the setting values ​​of the aperture value and the shutter speed received from the operation unit 11. The camera control unit 12 also controls the driving of the focus group 112 in accordance with an image capture preparation operation (half-press operation) on the operation unit 11 (release button 5).

[0022] For example, when an autofocus operation is instructed, the focus detection unit 18 determines the focus state of the subject image formed by the image sensor 16 based on the image signal generated by the image processing unit 17, generates a focus signal, and transmits it to the camera control unit 12. At the same time, the focus driving unit 302 detects the current position of the focus group 112, and transmits the signal to the camera control unit 12 via the lens control unit 104. The camera control unit 12 compares the focus state of the subject image with the current position of the focus group 112, calculates the focus driving amount from the amount of deviation, and transmits it to the lens control unit 104. Then, the lens control unit 104 drives and controls the focus group 112 to a target position via the focus driving unit 302, and corrects the focus deviation of the subject image.

[0023] Furthermore, when an automatic exposure control operation is instructed, the camera control unit 12 receives a luminance signal generated by the image processing unit 17 and performs a photometric calculation. Based on the result of the photometric calculation, the camera control unit 12 controls the driving of the aperture group 201 in response to an image capture instruction operation (full press operation) on the operation unit 11 (release button 5). At the same time, the camera control unit 12 controls the driving of the shutter unit 14 via the shutter driving unit 15, and performs an exposure process by the image sensor 16.

[0024] The camera body 1 has a pitch shake detection unit 19 and a yaw shake detection unit 20 as shake detection means capable of detecting image shake such as a user's hand shake. The pitch shake detection unit 19 and the yaw shake detection unit 20 respectively use an angular velocity sensor (vibration gyro) and an angular acceleration sensor to detect image shake in the pitch direction (rotation direction around the Z axis) and the yaw direction (rotation direction around the Y axis) and output a shake signal. The camera control unit 12 calculates the shift position of the vibration isolation group 115 (shift lens) in the Y axis direction using the shake signal from the pitch shake detection unit 19. Similarly, the camera control unit 12 calculates the shift position of the vibration isolation group 115 in the Z axis direction using the shake signal from the yaw shake detection unit 20. Then, the camera control unit 12 controls the drive of the vibration isolation group 115 to a target position according to the calculated shift position in the pitch / yaw direction, and performs a vibration isolation operation to reduce image shake during exposure or during through image display.

[0025] The interchangeable lens 101 has a zoom ring 103 for changing the angle of view of the imaging optical system, and a zoom detection unit 106 for detecting the angle of the zoom ring 103. The zoom detection unit 106 detects the angle of the zoom ring 103 operated by the user as an absolute value, and is configured using, for example, a resistive linear potentiometer. Information on the angle of view detected by the zoom detection unit 106 is transmitted to the lens control unit 104, and is reflected in various controls by the camera control unit 12 described above. Meanwhile, part of the various pieces of information are recorded in the storage unit 13 or a recording medium together with the captured image.

[0026] Next, the positional relationship of the components of the imaging system 100 will be described with reference to Fig. 3 and Fig. 4. Fig. 3 and Fig. 4 are cross-sectional views of the imaging system 100 on the XY plane including the optical axis O, with Fig. 3 showing the zoom retracted state of the interchangeable lens 101 and Fig. 4 showing the zoom extended state.

[0027] This embodiment employs a seven-group configuration as an example of an imaging optical system. Each zoom group that has moved to a predetermined optical position according to the angle of view forms an image of light from a subject on the imaging surface of the imaging element 16. At this time, the focus group 112 functions as a second zoom group, and the vibration reduction group 115 functions as a fifth zoom group. The imaging optical system also has a first zoom group 111, an aperture group 201, a third zoom group 113, a fourth zoom group 114, a sixth zoom group 116, and a seventh fixed group 117.

[0028] The zoom group 110 of the imaging optical system has an object side zoom group 110a and an imaging surface side zoom group 110b. The object side zoom group 110a includes a first zoom group 111. The imaging surface side zoom group 110b includes a focus group (second zoom group) 112, a third zoom group 113, a fourth zoom group 114, a vibration reduction group (fifth zoom group) 115, a sixth zoom group 116, and an aperture group 201, which are connected to one another.

[0029] Note that this embodiment does not limit the configuration of the lens groups, and for example, the vibration isolation group 115 may function as a third zoom group. Also, some of the lens groups may not be movable but may be fixed.

[0030] The rectilinear guide barrel 107 is fixed to a fixed barrel 109, and is a fixed part that is fixed to the lens mount 102 via the fixed barrel 109. Bayonet claws (not shown) are arranged at equal intervals on the outer circumferential surface of the rectilinear guide barrel 107. Meanwhile, a circumferential groove (not shown) is provided on the inner circumferential surface of the cam barrel 108. Furthermore, the cam barrel 108 is connected to the zoom operation ring 103. When the zoom operation ring 103 is rotated, the cam barrel 108 rotates about the optical axis O due to the engagement between the bayonet claws and the circumferential groove.

[0031] The linear guide barrel 107 is formed with linear guide grooves that restrict the movement of each zoom group in the rotation direction and guide the linear movement in the optical axis direction. The cam barrel 108 is formed with cam grooves that correspond to the object side zoom group 110a and the image plane side zoom group 110b and have trajectories at different angles in the rotation direction. On the other hand, the object side zoom group 110a and the image plane side zoom group 110b are each provided with a cam follower, and each cam follower engages with the corresponding linear guide groove and cam groove. When the user rotates the zoom operation ring 103, the cam barrel 108 rotates, and the cam follower moves the object side zoom group 110a and the image plane side zoom group 110b forward and backward in the optical axis direction along their respective trajectories by engaging with the linear guide groove and the cam groove.

[0032] 5 is a perspective view showing a state in which the first substrate 500, the second substrate 600, and the third substrate 700 are bonded to each other. The first substrate 500 is a substrate having a main plane that is approximately perpendicular to the optical axis O. The first substrate 500 is a main substrate for controlling the vibration isolation driving unit 402, the aperture driving unit 202, the focus driving unit 302, and the like of the interchangeable lens 101. The first substrate 500 is equipped with a microcomputer equipped with basic control functions, driving ICs for various actuators, a connector for connecting to another substrate in the interchangeable lens 101, and the like.

[0033] Connector (second electric element) 503 is one of a plurality of connectors arranged on first substrate 500, and serves as a connection portion with a flexible printed circuit board (not shown). The flexible printed circuit board connected to connector 503 is connected to lens mount 102 shown in FIG. 4, which connects to camera body 1.

[0034] The connector (second electric element) 504 is one of a plurality of connectors arranged on the first substrate 500, and serves as a connector for connecting to a flexible printed circuit board (not shown). The flexible printed circuit board connected to the connector 504 is connected to the focus driving unit 302 shown in FIG. 2, and has a wiring for transmitting a driving signal 730 for focus driving and a wiring for transmitting a detection signal 740 for focus position detection. The driving signal 730 is a noise source, and the detection signal 740 may be erroneously detected due to the influence of the driving signal 730, which is a noise source. Therefore, it is preferable to arrange the wiring for the driving signal 730 and the wiring for the detection signal 740 so as not to run parallel to each other. A detailed explanation of the wiring will be given later.

[0035] The outer shape of first substrate 500 is defined by first substrate inner diameter 506, which is the inner diameter of first substrate 500, and first substrate outer diameter 507, which is the outer diameter (maximum outer diameter) of first substrate 500. First substrate inner diameter 506 and first substrate outer diameter 507 have the same center corresponding to the optical axis O of a lens, which is an optical element, and first substrate 500 has an arc shape.

[0036] The second substrate 600 is a substrate having a main plane substantially parallel to the optical axis O. The second substrate 600 is a substrate bonded perpendicularly to the first substrate 500, and is a substrate that assists the function of the first substrate 500. Details of the second substrate 600 will be described later.

[0037] Electric element (first electric element) 610 is an IC for vibration prevention driving that controls vibration prevention driving unit 402 shown in Fig. 2. Electric element (first electric element) 620 is a capacitor associated with electric element 610, which performs noise removal to prevent malfunction of the IC, and stores electric charge to supply a stable voltage current to the IC.

[0038] The third substrate 700 is a substrate having a main plane that is approximately parallel to the optical axis O. The third substrate 700 is a substrate that is bonded perpendicularly to the first substrate 500, and is a substrate that assists the function of the first substrate 500. Details of the third substrate 700 will be described later.

[0039] The electric element 710 is a focus driving IC that controls the focus driving unit 302 shown in Fig. 2. The electric element 720 is a capacitor associated with the electric element 710, which performs noise removal to prevent malfunction of the IC, and stores electric charge to supply a stable voltage current to the IC.

[0040] The first substrate 500 and the second substrate 600, and the first substrate 500 and the third substrate 700 are electrically connected by soldering. In the soldering, the space required for mounting the connector can be reduced compared to the connection via a connector. Therefore, the optical device can be made smaller. In addition, compared to the connection via a connector, the soldering can directly connect the substrates, so that the contact resistance associated with the connection can be reduced. As a result, it is possible to suppress the voltage drop. However, this embodiment is not limited to this, and the first substrate 500 and the second substrate 600, and the first substrate 500 and the third substrate 700 may be joined to each other by a conductive adhesive.

[0041] Fig. 6(a) is an exploded perspective view of the first substrate 500, the second substrate 600, and the third substrate 700. Fig. 6(b) is a view of the first substrate 500 and the second substrate 600 bonded to each other, as viewed from the electric element mounting surface of the second substrate 600 (as viewed from a direction perpendicular to the optical axis O). Fig. 6(c) is a view of the first substrate 500 and the third substrate 700 bonded to each other, as viewed from the electric element mounting surface of the third substrate 700 (as viewed from a direction perpendicular to the optical axis O). Fig. 6(d) is a diagram showing wiring when the first substrate 500 and the third substrate 700 are bonded to each other.

[0042] A plurality of electric elements are arranged on each of a first mounting surface 520 and a second mounting surface 521 of the first substrate 500. In this embodiment, the first mounting surface 520 is the surface on the imaging element side, and the second mounting surface 521 is the reverse surface of the first mounting surface 520 and the surface on the subject side.

[0043] The second substrate 600 has at least one joint 601 and a notch 602 on one side (an end portion facing the first mounting surface 520 of the first substrate 500) that is joined to the first mounting surface 520 of the first substrate 500. That is, the end portion facing the first mounting surface 520 of the first substrate 500 has the joint 601 that is joined to the first mounting surface 520 and the notch 602 that forms a space between the first mounting surface 520 and the first mounting surface 520. The first substrate 500 and the second substrate 600 are joined to each other by solder at the joint 601 where the insulating layer is opened and the conductor is exposed. As shown in FIG. 5, the joint 601 is disposed on both sides of the second substrate 600, the same side as the electric element 610 and the back side (not shown). The joint 601 may be reinforced with a material other than solder, such as an adhesive.

[0044] The cutout portion 602 of the second substrate 600 faces the multiple electric elements 530 and the connector 503 as the second electric element mounted on the first substrate 500, and has a shape surrounding at least a part of the electric element 530 while avoiding the electric element 530 on the first mounting surface 520. A gap (space) is formed so that the cutout portion 602, the multiple electric elements 530, and the connector 503 do not come into contact with each other, and the gap may be of a uniform size relative to the shapes of the multiple electric elements 530 and the connector 503, or may be of different sizes.

[0045] The cutout portion 602 may be provided on a side other than the side joined to the first mounting surface 520 of the first substrate 500. In this case, the cutout portion 602 preferably has a shape that avoids surrounding lens barrel components and the like. The cutout portion 602 may be formed to face not only an electric element, a connector, or a lens barrel component, but also wiring on a substrate, a flexible substrate (flexible printed circuit board), lead wires, and the like.

[0046] The third substrate 700 has a joint (first joint region) 701 and a joint (second joint region) 702, and at least one notch 703, on one side (end) to be joined to the first mounting surface 520 of the first substrate 500. The first substrate 500 and the third substrate 700 are joined to each other by solder at a plurality of joints 701, 702 where the insulating layer is opened and the conductor is exposed. As shown in FIG. 5, the joints 701 are arranged on both sides of the third substrate 700, the same side as the electric element 710 and the back side (not shown). The plurality of joints 701, 702 may be reinforced with a material other than solder, such as an adhesive. In this embodiment, two (two) joints 701, 702 are shown as joints of the third substrate 700 to the first substrate 500, but three (three) or more joints may be provided on the front and back of the third substrate 700 or at different positions. By providing two or more joints, the degree of freedom in the position of the wiring connecting first substrate 500 and third substrate 700 is increased, and the degree of freedom in the wiring within the substrate is improved.

[0047] The cutout portion 703 of the third substrate 700 is shaped to surround the connector 504 mounted on the first substrate 500. That is, the connector 504 is disposed on the first substrate 500 at a position facing the cutout portion 703 of the third substrate 700. The joint portions 701 and 702 are disposed on opposite sides of the connector 504 in a direction perpendicular to the insertion / removal direction of the flexible printed circuit board. A gap (space) is formed between the cutout portion 602 and the connector 504 so that they do not come into contact with each other. The cutout portion 703 may be provided on a side other than the side that is joined to the first mounting surface 520 of the first substrate 500.

[0048] The third substrate 700 is disposed above the connector 504, and the joints 701 and 702 are disposed on both sides of the connector 504. More specifically, in a direction substantially perpendicular to the insertion / removal direction (optical axis direction) of the flexible printed circuit board, the joints 701 and 702 are disposed close to the connector 504 and on opposite sides of the connector 504. In general, a drive signal 730 of the flexible printed circuit board (not shown) becomes a noise source, so that after being connected to the connector 504, it is preferable to connect it to the electric element 710 at a short distance. A control signal 750 is wired from the electric element 710 and connected to the lens control unit 104.

[0049] 6(d), the drive signal 730 and the detection signal 740 of a flexible printed circuit board (not shown) are wired (transmitted) to the first substrate 500 via the connector 504. Then, the drive signal 730 is wired (transmitted) to the third substrate 700 and connected to the electric element 710.

[0050] In general, the drive signal 730 needs to be wired short. For this reason, the electric element 710 is disposed on the second mounting surface 521, which is the surface opposite to the first mounting surface 520 on which the connector 504 is mounted. Therefore, since the drive signal 730 is wired from the surface layer of the first substrate 500 through the inner layers to the surface layer on the opposite side, it is necessary to avoid parallel running of the detection signal 740 with respect to the drive signal 730 in each layer, which reduces the degree of freedom of wiring.

[0051] On the other hand, in this embodiment, the drive signal 730 is routed (transmitted) only to the first mounting surface 520 of the first substrate 500, and is further routed (transmitted) to the third substrate 700. Therefore, in the region near the connector 504, wiring to the inner layer of the first substrate 500 is not required. As a result, it is no longer necessary to take care of parallel running of signals against noise in the inner layer of the first substrate 500, improving the degree of freedom of wiring and enabling space saving of wiring on the substrate.

[0052] FIG. 7 is a view of the first mounting surface 520 of the first substrate 500 (viewed in the optical axis direction) showing the state in which the first substrate 500, the second substrate 600, and the third substrate 700 of this embodiment are bonded to each other.

[0053] Conventionally, electrical elements 530, connectors, etc. mounted on the first substrate 500 could not be arranged so as to overlap each other when viewed from the optical axis direction within each mounting surface of the first substrate 500 due to the bonding between the electrical elements and the substrate.

[0054] On the other hand, according to this embodiment, the second substrate 600 and the third substrate 700 can be arranged so as to overlap the electric element 530, the connector 503, the connector 504, etc. of the first substrate 500 when viewed from the optical axis direction in areas other than the joints 601, 701, 702. This enables high-density mounting in which other electric elements are arranged on a mounting surface perpendicular to the electric element 530 on the first substrate 500. As a result, by arranging the second substrate 600 or the third substrate 700 in the space above the component arrangement space, it can be efficiently arranged in the space inside the lens barrel of the interchangeable lens 101.

[0055] Fig. 8(a) is a rear view of the interchangeable lens 101 equipped with each substrate of this embodiment. Fig. 8(b) is a cross-sectional view taken along line AA of Fig. 8(a). Fig. 8(a) is a view showing the interchangeable lens 101 from the imaging surface side, illustrating the arrangement of the lens mount 102. Fig. 8(b) illustrates the arrangement of the first substrate 500 and the third substrate 700 of the interchangeable lens 101.

[0056] The lens mount 102 is fixed to an exterior ring 120, which is an exterior part of the interchangeable lens 101, with screws 130. The first substrate 500 is disposed directly below the lens mount 102, taking into consideration the connection with the camera body 1. In this configuration, the third substrate 700 is disposed between the first mounting surface 520 of the first substrate 500 and the lens mount 102.

[0057] The mount surface F is a surface that abuts against the camera mount 7 and is perpendicular to the optical axis O. In the interchangeable lens 101, the imaging optical system is formed in the optical path area A. As an example, there is an area that is not used as an optical path in the portion close to the optical axis side from the mount surface F. In the conventional configuration, when arranging the electric element 530 and the connector, etc., they were made large to avoid interference with the internal lens barrel. On the other hand, according to this embodiment, the shape of the lens barrel components and the board arrangement are arranged with good space efficiency. Therefore, in the configuration of this embodiment, a board arrangement that effectively utilizes the space between the lens mount 102 and the first board 500 can be realized.

[0058] In this embodiment, at least one of the second substrate 600 and the third substrate 700 is mounted on the first substrate 500. This allows for high density mounting without excessively reducing the component arrangement space of the first substrate 500, and allows for efficient arrangement in the space above the component arrangement space and in the space inside the lens barrel. In addition, by wiring (transmitting) the drive signal 730 to the third substrate 700, the wiring area of ​​the first substrate 500 can be reduced while avoiding parallel running with the detection signal 740, thereby reducing the influence of noise.

[0059] In this embodiment, the first substrate 500 is described as having an arc shape, but the first substrate 500 may have an irregular shape such as a rectangle or a part of the first substrate inner diameter 506 or the first substrate outer diameter 507 being a straight line. When the first substrate 500 is rectangular, the first substrate 500 may be disposed on the fixed barrel 109 or the like, instead of directly below the lens mount 102.

[0060] The disclosure of each embodiment includes the following configurations. (Configuration 1) A first substrate having a main plane perpendicular to an optical axis; a second substrate having a main plane parallel to the optical axis; the first substrate and the second substrate are bonded to each other; the first substrate has a first mounting surface and a second mounting surface opposite the first mounting surface; the second substrate has an end portion facing the first mounting surface of the first substrate, An optical device characterized in that the end portion has a joint portion that is joined to the first mounting surface and a notch portion that forms a space between the end portion and the first mounting surface. (Configuration 2) 2. The optical device according to configuration 1, wherein a first electrical element is disposed on the second substrate. (Configuration 3) 3. The optical device according to configuration 1 or 2, wherein a second electric element is disposed on the first substrate at a position facing the cutout portion of the second substrate. (Configuration 4) The optical device described in configuration 3, characterized in that at least a portion of the second electrical element is disposed in the space formed by the cutout portion so that the second electrical element does not contact the second substrate. (Configuration 5) An optical device described in any one of configurations 1 to 4, characterized in that when viewed from the optical axis direction, at least a portion of the second substrate overlaps with a second electrical element mounted on the first substrate. (Configuration 6) 6. The optical device according to configuration 4 or 5, wherein the second electrical element is a connector for connection to a flexible printed circuit board. (Configuration 7) The optical device described in configuration 6, characterized in that the joint portion has a first joint region and a second joint region arranged on opposite sides of the second electrical element in a direction perpendicular to the insertion / removal direction of the flexible printed circuit board. (Configuration 8) 8. The optical device according to any one of configurations 1 to 7, wherein the first substrate and the second substrate are joined to each other by solder. (Configuration 9) 8. The optical device according to any one of configurations 1 to 7, wherein the first substrate and the second substrate are bonded to each other with a conductive adhesive. (Configuration 10) The imaging device further includes a mount portion connectable to the imaging device, 10. The optical device of any one of configurations 1 to 9, wherein the joint portion of the second substrate is disposed between the first mounting surface of the first substrate and the mount portion. (Configuration 11) 11. The optical device according to any one of configurations 1 to 10, wherein the optical device is a lens device. (Configuration 12) 11. The optical device according to any one of configurations 1 to 10, wherein the optical device is an imaging device.

[0061] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0062] For example, a configuration in which only the second substrate 600 or the third substrate 700 is joined to the first substrate 500, or a configuration in which three or more substrates are joined to the first substrate 500 may be used. Furthermore, the second substrate 600 and the third substrate 700 may be joined to the second mounting surface 521 of the first substrate 500. Furthermore, the second substrate 600 and the third substrate 700 are interchangeable, and at least one of the two substrates may be referred to as the second substrate. [Explanation of symbols]

[0063] 101 Interchangeable lenses (optical equipment) 500 First board 520 First mounting surface 521 Second mounting surface 600 Second board 601, 701, 702 joints 602, 703 Notch 700 Third board (second board)

Claims

1. A first substrate having a main plane perpendicular to an optical axis; a second substrate having a main plane parallel to the optical axis; the first substrate and the second substrate are bonded to each other; the first substrate has a first mounting surface and a second mounting surface opposite the first mounting surface; the second substrate has an end portion facing the first mounting surface of the first substrate, An optical device characterized in that the end portion has a joint portion that is joined to the first mounting surface and a notch portion that forms a space between the end portion and the first mounting surface.

2. The optical device according to claim 1 , further comprising a first electric element disposed on the second substrate.

3. 2. The optical device according to claim 1, wherein a second electric element is disposed on the first substrate at a position opposite to the notch of the second substrate.

4. 4. The optical device according to claim 3, wherein at least a portion of the second electrical element is disposed in the space formed by the cutout portion so that the second electrical element does not come into contact with the second substrate.

5. 2. The optical device according to claim 1, wherein at least a portion of the second substrate overlaps with a second electric element mounted on the first substrate when viewed from the optical axis direction.

6. 5. The optical device according to claim 4, wherein the second electrical element is a connector for connection to a flexible printed circuit board.

7. The optical device according to claim 6, characterized in that the joint portion has a first joint region and a second joint region arranged on opposite sides of the second electrical element in a direction perpendicular to the insertion / removal direction of the flexible printed circuit board.

8. 2. The optical device according to claim 1, wherein the first substrate and the second substrate are joined to each other by soldering.

9. 2. The optical device according to claim 1, wherein the first substrate and the second substrate are bonded to each other with a conductive adhesive.

10. The imaging device further includes a mount portion connectable to the imaging device, 2 . The optical device according to claim 1 , wherein the joint portion of the second substrate is disposed between the first mounting surface of the first substrate and the mount portion.

11. 11. The optical device according to claim 1, wherein the optical device is a lens device.

12. 11. The optical device according to claim 1, wherein the optical device is an imaging device.

Images