Method for manufacturing transparent member and lid member

Abstract

To prevent damage to transparent members caused by through holes formed by machining.SOLUTION: A method for manufacturing a transparent member comprises: a step S1 of forming a plurality of through holes 18 in a transparent substrate MG by machining; a step S2 of polishing the main surface MGa of the transparent substrate MG; and a step S3 of etching the plurality of through holes 18.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a transparent member and a lid member. [Background technology]

[0002] For example, Patent Document 1 discloses an airtight package including a substrate on which a light-emitting element (LED element) is mounted, and a transparent lid member fixed to the base so as to cover the light-emitting element.

[0003] The substrate of the package is rectangular in plan view. The lid member (transparent body) of the package has a plate-shaped frame (brim) and a dome-shaped protrusion (convex lid) protruding from the frame. The frame is rectangular in plan view so as to correspond to the shape of the substrate (see paragraphs 0014, 0019, and Figures 1 and 2 of the same document).

[0004] A method for efficiently manufacturing a lid member is, for example, to divide a large transparent substrate into a plurality of individual pieces and use each of the divided pieces as a lid member. For example, Patent Document 2 discloses a method for manufacturing a transparent member, which includes a first step of forming a plurality of through holes in the transparent substrate and a second step of dividing the transparent substrate along imaginary lines connecting the centers of the plurality of through holes to obtain transparent members (see claim 1 in the same document).

[0005] Specifically, the first step includes a step of providing modified areas by irradiating laser light to positions of the transparent substrate where through holes are to be formed, and a step of forming through holes by etching the positions of the transparent substrate provided with the modified areas where through holes are to be formed (see claim 3 in the same document).The through holes have a polygonal planar shape, and the second step divides the transparent substrate along imaginary lines connecting the vertices of the polygons in the multiple through holes (see claim 2 in the same document). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2021 / 251102 [Patent Document 2] International Publication No. 2023 / 095734 Summary of the Invention [Problem to be solved by the invention]

[0007] As a method for forming a through hole in a transparent substrate, in addition to the irradiation of laser light as in the first step described above, the transparent substrate may be machined. In this case, chipping or microcracks may occur in the through hole due to the machining, and these defects may cause damage to the transparent substrate or the cover member.

[0008] The present invention has been made in view of the above circumstances, and has as its technical object to prevent damage to a transparent member caused by through holes formed by machining. [Means for solving the problem]

[0009] (1) The method for manufacturing a transparent member according to the present invention is intended to solve the above-mentioned problems, and is characterized by comprising the steps of forming a plurality of through holes in a transparent substrate by mechanical processing, polishing a main surface of the transparent substrate, and etching the plurality of through holes.

[0010] According to this configuration, by performing the polishing process and the etching process on the transparent substrate having a plurality of through holes, chipping and microcracks formed in the through holes by mechanical processing can be reliably removed, thereby preventing damage to the transparent substrate caused by the through holes.

[0011] (2) In the method for manufacturing a transparent member described in (1) above, after the step of etching the plurality of through holes, a step of dividing the transparent substrate along imaginary lines connecting the plurality of through holes may be provided.

[0012] According to this configuration, by dividing the transparent substrate along the imaginary line, a plurality of transparent members can be efficiently manufactured.

[0013] (3) In the method for producing a transparent member described in (1) or (2) above, after the step of etching the plurality of through holes, a step of hot forming the main surface of the transparent substrate so that a portion of the main surface becomes convex may be included.

[0014] According to this configuration, by forming a part of the transparent substrate into a convex shape, a space for accommodating the light emitting element of the package can be formed.

[0015] (4) In the method for producing a transparent member according to any one of (1) to (3) above, the mechanical processing may include a blasting process.

[0016] (5) In the method for manufacturing a transparent member described in any one of (1) to (4) above, the through hole may be configured in a polygonal shape when viewed in a plane, the through hole may have a plurality of corners, and the corners of the through hole may be configured in a curved shape when viewed in a plane.

[0017] According to this configuration, by forming the corners of the through hole in a curved shape, it is possible to prevent the transparent substrate from being damaged by these corners.

[0018] (6) In the method for producing a transparent member according to any one of (1) to (5) above, the size of the through holes may not be substantially changed in the step of etching the plurality of through holes. With this configuration, the transparent member can be produced with high accuracy.

[0019] (7) In the method for manufacturing a transparent member described in any one of (1) to (6) above, a step of forming a film on the main surface of the transparent substrate may be provided after the step of forming the plurality of through holes and before the step of dividing the transparent substrate.

[0020] According to this configuration, by forming a film on the main surface of the transparent substrate before the step of dividing the transparent substrate, a transparent member having a film can be efficiently manufactured.

[0021] (8) In the method for producing a transparent member according to any one of (2) to (7) above, the step of dividing the transparent substrate may include a dicing process.

[0022] (9) The present invention is intended to solve the above-mentioned problems, and provides a transparent glass lid member for use in a package including a light-emitting element, the lid member comprising a plate-shaped frame portion and a protrusion protruding from the frame portion, the frame portion comprising a first main surface, a second main surface located opposite the first main surface, and a side surface connecting the first main surface and the second main surface, the frame portion having a plurality of corners and a plurality of sides in a planar view, the side surface at the plurality of corners being an etched surface, and the side surface at at least one of the plurality of sides being a dicing surface. Effect of the Invention

[0023] According to the present invention, damage to the transparent member caused by the through-hole formed by machining can be prevented. [Brief description of the drawings]

[0024] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6] FIG. [Figure 7] FIG. 2 is a plan view of a mother glass plate used to manufacture the lid member. [Figure 8] 10 is a flowchart showing a method for manufacturing the cover member. [Figure 9]FIG. [Figure 10] FIG. 2 is a plan view of a mother glass plate in which a through hole is formed. [Figure 11] FIG. 2 is a plan view of a through hole formed in a mother glass plate. [Figure 12] FIG. [Figure 13] 10A to 10C are cross-sectional views showing an etching step. [Figure 14] FIG. [Figure 15] FIG. [Figure 16] FIG. 4 is a plan view showing the mother glass plate after a molding process. [Figure 17] 4A to 4C are cross-sectional views showing a film forming process. [Figure 18] FIG. [Figure 19] FIG. 11 is a plan view showing the cover member after a cutting process. [Figure 20] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Figures 1 to 20 show an embodiment of a package with a transparent lid member according to the present invention and a manufacturing method thereof. The present invention is not limited to lid members and can also be applied to the manufacture of other transparent members.

[0026] As shown in Figures 1 and 2, the package 1 includes a base 2, a light-emitting element 3 supported by the base 2, a lid member 4 covering the base 2 and the light-emitting element 3, and a sealing portion 5 hermetically joining the base 2 and the lid member 4.

[0027] 3 and 4 show the base 2 before the lid member 4 is bonded. The base 2 is configured in a quadrangular shape in a plan view. The base 2 has a first main surface 2a supporting the light emitting element 3, a second main surface 2b located opposite to the first main surface 2a, and a metal layer 6 formed on the first main surface 2a.

[0028] The base 2 also has a plurality of linear sides 2c and a plurality of corners 2d. The corners 2d are chamfered. As a result, the corners 2d have flat chamfered surfaces 2d1. The shape of the chamfered surface 2d1 is not limited to that of this embodiment, and may be a curved surface or other shapes.

[0029] Examples of materials for the base 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, glass, and alloys such as Fe-Ni-Co alloy, Cu-W alloy, and Kovar (registered trademark).

[0030] 4, the metal layer 6 has a frame shape surrounding the light-emitting element 3. The metal layer 6 is formed in a rectangular shape, but is not limited to this shape. The metal layer 6 may be formed in a circular shape so as to surround the light-emitting element 3, for example.

[0031] The metal layer 6 includes three layers, which are an underlayer, an intermediate layer, and a surface layer, in that order from the first main surface 2a side. Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, Pt, etc. Examples of metals used for the intermediate layer include Ni, Pt, Pd, etc. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, Pt, etc. The metal used for the metal layer 6 may be a single metal or an alloy.

[0032] Examples of a method for forming the metal layer 6 on the first main surface 2a of the substrate 2 include film formation methods such as sputtering, vacuum deposition, ion-assisted or ion-plating vacuum deposition, and CVD.

[0033] The light-emitting element 3 is fixed to the first main surface 2a of the base 2. In this embodiment, the package 1 using an ultraviolet irradiating LED as the light-emitting element 3 is exemplified, but the light-emitting element 3 according to the present invention is not limited to this embodiment, and an infrared LED or a visible light LED can also be used.

[0034] 5 and 6 show the lid member 4 before being bonded to the base body 2. The glass used for the lid member 4 is preferably non-alkali glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass. Non-alkali glass, borosilicate glass, or aluminosilicate glass can achieve both high transmittance and high processability during molding. Quartz glass can have a significantly high transmittance in the ultraviolet range while maintaining processability during molding. Crystallized glass can achieve both high transmittance and high breaking strength.

[0035] When the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, the glass composition preferably contains, in mass%, SiO2: 50-75%, Al2O3: 1-25%, B2O3: 1-30%, Li2O+Na2O+K2O: 0-20%, and MgO+CaO+SrO+BaO: 0-20%. If the glass composition is within the above composition range, it corresponds to these glass systems. In the present invention, "Li2O+Na2O+K2O" is the total amount of Li2O, Na2O, and K2O, and "MgO+CaO+SrO+BaO" is the total amount of MgO, CaO, SrO, and BaO.

[0036] In the case of crystallized glass, the glass composition preferably contains, by mass%, SiO2: 60-80%, Al2O3: 3-30%, Li2O+Na2O+K2O: 1-20%, MgO+CaO+SrO+BaO: 5-20%, and is a low-thermal expansion crystallized glass in which β-quartz solid solution or β-spodumene precipitates as crystals from inside the glass. Here, low thermal expansion means that the thermal expansion coefficient is −10×10 in the temperature range of 30 to 300° C. -7 ~20×10 -7 / ℃.

[0037] 2 and 5, the lid member 4 includes a plate-shaped frame 7, a dome-shaped protruding portion 8 protruding from the frame 7, and a connecting portion 9 connecting the frame 7 and the protruding portion 8. The lid member 4 may also include a first antireflection film 10a and a second antireflection film 10b.

[0038] The frame 7 has, for example, a certain thickness, but is not limited to this embodiment. The thickness of the frame 7 is, for example, 0.2 mm or more and 2 mm or less. The frame 7 has a first main surface 7a, a second main surface 7b located on the opposite side of the first main surface 7a, and a side surface 7c connecting the first main surface 7a and the second main surface 7b.

[0039] As shown in FIG. 6, the frame 7 is configured in a quadrangular shape, but is not limited to this shape. The frame 7 has a plurality of linear side portions 7d and a plurality of corner portions 7e. The length of the side portions 7d is, for example, 2.5 mm or more and 100 mm or less. The corner portions 7e are chamfered. As a result, the corner portions 7e have flat chamfered surfaces 7e1. The shape of the chamfered surface 7e1 is not limited to this embodiment, and may be a curved surface or other shapes. The chamfered surface 7e1 is formed as a part of the side surface 7c from the first main surface 7a to the second main surface 7b.

[0040] The protrusion 8 is for forming a storage space for the light-emitting element 3 together with the first main surface 2a of the base 2. As shown in Fig. 5 and Fig. 6, the protrusion 8 is formed at the center position of the frame 7, but is not limited to this embodiment. The protrusion 8 has an inner surface 8a configured as a concave curved surface, an outer surface 8b configured as a convex curved surface, and an opening 8c formed on the inner surface 8a side.

[0041] Moreover, the protruding portion 8 includes a base portion 11, a middle portion 12, and a top portion 13. The base portion 11 is integrally formed with the connecting portion 9. The middle portion 12 is located between the base portion 11 and the top portion 13. The inner surface 8a and the outer surface 8b of the protruding portion 8 are formed as continuous curved surfaces from the base portion 11 to the top portion 13.

[0042] The opening 8c of the protrusion 8 is for inserting the light emitting element 3 provided on the base 2 into the inside of the protrusion 8 when the cover member 4 is fixed to the base 2. As shown in Fig. 6, the opening 8c of the protrusion 8 is configured in a circular shape, but is not limited to this shape.

[0043] 2 and 5, the connecting portion 9 has a curved shape in order to connect the base 11 and the frame portion 7. The connecting portion 9 has a first curved surface 9a that connects the first main surface 7a of the frame portion 7 and the inner surface 8a of the protruding portion 8, and a second curved surface 9b that connects the outer surface 8b of the protruding portion 8 and the second main surface 7b of the frame portion 7.

[0044] The first antireflection film 10a is formed on the inner surface 8a of the protrusion 8 and the first main surface 7a of the frame 7. The first antireflection film 10a preferably has a multilayer structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film alternately.

[0045] In the first antireflection film 10a, a portion 10a1 (hereinafter referred to as the "antireflection portion") formed on the inner surface 8a of the protrusion 8 is configured so that its thickness gradually decreases from the top 13 to the base 11 of the protrusion 8. That is, the antireflection portion 10a1 is thickest at the portion formed at the top 13 and thinnest at the portion formed at the base 11.

[0046] In the first antireflection film 10a, a portion 10a2 (hereinafter referred to as a "buffer portion") formed on the first main surface 7a of the frame portion 7 has a constant film thickness. The buffer portion 10a2 has a function of preventing reflection of ultraviolet rays, as well as a function of relieving stress acting on the frame portion 7 when the cover member 4 is bonded to the base 2.

[0047] The second antireflection film 10b is formed on the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7. The second antireflection film 10b preferably has a multilayer structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film alternately.

[0048] In the second antireflection film 10b, a portion 10b1 (hereinafter referred to as the "antireflection portion") formed on the outer surface 8b of the protrusion 8 is configured so that its thickness gradually decreases from the top 13 toward the base 11. That is, the antireflection portion 10b1 is thickest at the portion formed at the top 13 and thinnest at the portion formed at the base 11.

[0049] 2, 5, and 6, the buffer section 10a2 of the first antireflection film 10a includes a metal layer 14 and a bonding section 15. The Young's modulus of the buffer section 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, even more preferably 150 GPa or less, and particularly preferably 100 GPa or less. By specifying the upper limit in this manner, the buffering properties of the buffer section 10a2 can be improved, and the effect of alleviating stress caused by the difference in thermal expansion coefficient between the bonding section 15 and the cover member 4 (frame section 7) can be obtained.

[0050] As shown in Figs. 5 and 6, the metal layer 14 is formed so as to overlap the buffer section 10a2. The metal layer 14 is formed on the surface of the buffer section 10a2 opposite to the surface of the buffer section 10a2 that contacts the first main surface 7a of the frame section 7. As shown in Fig. 6, the metal layer 14 has a rectangular frame shape so as to correspond to the shape of the metal layer 6 of the base body 2. The shape of the metal layer 14 is not limited to this embodiment. The metal layer 14 may have various frame shapes such as a circular shape. The metal layer 14 includes three layers, which are, in order from the buffer section 10a2 side, a base layer, an intermediate layer, and a surface layer.

[0051] Examples of metals used in the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. When Cr is used in the underlayer, the Young's modulus of the underlayer is preferably 279 GPa or less. Examples of metals used in the intermediate layer include Ni, Pt, and Pd. Examples of metals used in the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used in the metal layer 14 may be a single metal or an alloy.

[0052] 5 and 6, the joint 15 is configured in a layered form so as to overlap the metal layer 14. As shown in Fig. 5, the joint 15 contacts a portion of the metal layer 14 opposite to a portion in contact with the buffer section 10a2. As shown in Fig. 6, the joint 15 has a rectangular frame shape so as to correspond to the shapes of the buffer section 10a2 and the metal layer 14. The shape of the joint 15 is not limited to this embodiment, and may be a circle or various other frame shapes.

[0053] The joint 15 is made of a metal-based joint material. As the metal-based joint material, a solder material or a brazing material that is commercially available can be used. Examples of the metal-based joint material include an Au-Sn alloy, a Pb-Sn alloy, an Au-Ge alloy, and an Sn-Ni alloy. By making the width of the joint 15 narrower than the width of the buffer portion 10a2, the influence of stress due to the difference in thermal expansion coefficient between the joint 15 and the cover member 4 can be reduced.

[0054] The sealing portion 5 is formed by integrally bonding the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at a bonding portion 15 .

[0055] Next, a description will be given of a method for manufacturing the package 1. This method includes a preparation step of preparing the base body 2 and the lid member 4, and a joining step of joining the base body 2 and the lid member 4 together.

[0056] In the preparation step, after the metal layer 6 is formed on the first main surface 2a of the base 2, the light emitting element 3 is mounted on this first main surface 2a.

[0057] In the preparation step, a plurality of lid members 4 are manufactured from a large mother glass plate, which is a transparent substrate. Hereinafter, a method for manufacturing the lid members 4 will be described with reference to Figs. 7 to 19. As shown in Fig. 7, the mother glass plate MG is configured to have a rectangular shape, but is not limited to this shape. In Fig. 7, the lid members 4 that can be manufactured from the mother glass plate MG are indicated by imaginary lines CL. In this example, nine lid members 4 can be manufactured from the mother glass plate MG, but the number of lid members 4 manufactured from the mother glass plate MG is not limited to this embodiment.

[0058] As shown in FIG. 8, the method for manufacturing the cover member 4 includes a drilling step S1, a polishing step S2, an etching step S3, a molding step S4, a film forming step S5, and a cutting step S6.

[0059] The drilling step S1 is a step of forming a plurality of through holes in the mother glass plate MG by machining. In this embodiment, the machining is exemplified by sandblasting, but is not limited thereto, and the mother glass plate MG may be processed by various processes such as drilling. As shown in FIG. 9, the mother glass plate MG has a first main surface MGa corresponding to the inner surface 8a of the protruding portion 8 of the cover member 4 and the first main surface 7a of the frame portion 7, and a second main surface MGb corresponding to the outer surface 8b of the protruding portion 8 and the second main surface 7b of the frame portion 7.

[0060] As shown in Fig. 9, in the drilling step S1, a mask member 16 is fixed to a first main surface MGa of the mother glass plate MG. The mask member 16 has openings 16a having a shape corresponding to the through holes to be formed in the mother glass plate MG. In the drilling step S1, compressed air containing sand is sprayed from above the mask member 16 toward the mother glass plate MG by a blasting device 17, as shown by the arrows in Fig. 9. As a result, through holes 18 having a shape corresponding to the shape of the openings 16a of the mask member 16 are formed in the mother glass plate MG.

[0061] As shown in Fig. 10, the through holes 18 formed in the mother glass plate MG are formed in portions corresponding to the corners 7e of the frame portion 7 of the cover member 4. The through holes 18 are configured to have a quadrangular shape in a plan view, but are not limited to this shape. The through holes 18 may have various shapes, such as a polygonal shape other than a quadrangle, a circular shape, an elliptical shape, or the like. The interval (pitch) between the multiple through holes 18 is, for example, 2.5 mm or more and 100 mm or less.

[0062] As shown in FIG. 11, the through hole 18 has a plurality of linear side portions 19 and a plurality of corner portions 20. The side portions 19 are formed so as to be inclined at a predetermined angle with respect to the side portion 7d of the frame portion 7 of the cover member 4. The length of the side portions 19 is, for example, 0.3 mm or more and 10 mm or less. The corner portions 20 are chamfered. As a result, the corner portions 20 are configured to have a curved shape (for example, an arc shape) in a plan view. Specifically, the corner portions 20 have a curved chamfered surface. The radius of curvature of the chamfered surface is preferably 0.3 mm or more and 5 mm or less, and more preferably 0.5 mm or more and 3 mm or less.

[0063] At the end of the drilling step S1, chipping occurs at the edge of the through hole 18, and microcracks occur on the inner surface of the through hole 18.

[0064] 12, the polishing step S2 is a step of polishing each of the main surfaces MGa, MGb of the mother glass plate MG by a polishing device 21. The polishing device 21 includes a rotating table (polishing table) 22, a polishing pad 23 provided on the rotating table 22, and a pressing member 24 that presses the mother glass plate MG against the polishing pad 23.

[0065] 12, in the polishing step S2, the first main surface MGa of the mother glass plate MGa is brought into contact with the polishing pad 23, and the mother glass plate MG is pressed from the second main surface MGb side by the pressing member 24. In this state, the turntable 22 is rotated while supplying slurry to the polishing pad 23, thereby polishing the first main surface MGa of the mother glass plate MG. When this polishing is completed, the second main surface MGb of the mother glass plate MG is also polished in the same manner. This makes it possible to remove chipping formed in the through holes 18 in the boring step S1.

[0066] As shown in FIG. 13, in the etching step S3, the mother glass plate MG is immersed in an etching tank 26 containing an etching solution 25. This allows the entire surface of the mother glass plate MG and the inner surfaces of the through holes 18 to be etched. This allows the microcracks formed on the inner surfaces of the through holes 18 in the drilling step S1 to be removed. Alternatively, in the etching step S3, instead of immersing the mother glass plate MG, the etching solution 25 may be poured into the through holes 18 of the mother glass plate MG to etch the inner surfaces of the through holes 18. This allows the microcracks formed on the inner surfaces of the through holes 18 in the drilling step S1 to be removed.

[0067] In this etching step S3, it is preferable that the etching process is performed so as not to substantially change the size of the through-hole 18. Here, "substantially not changing the size of the through-hole 18" means that the maximum dimension of the through-hole 18 (e.g., the distance between a pair of opposing sides 19) does not change by 50 μm or more.

[0068] The forming step S4 is a step of heat forming the main surfaces MGa and MGb of the mother glass plate MG so that parts of the main surfaces MGa and MGb of the mother glass plate MG are formed into a convex shape. The convex parts formed on the mother glass plate MG correspond to the protrusions 8 of the lid member 4.

[0069] 14 and 15 show a forming device used in the forming step S4. The forming device 27 includes a support table 28 for supporting the mother glass plate MG, a plurality of heating sources 29 for thermally deforming a part of the mother glass plate MG in order to form the protrusion 8 of the lid member 4, and an external force generating device 30 for applying an external force to the part of the mother glass plate MG.

[0070] The support base 28 has a plurality of fixing portions 31 for fixing the mother glass plate MG, and a plurality of spaces 32 for allowing thermal deformation of a portion of the mother glass plate MG. In addition, the support base 28 has a plurality of openings 28a surrounded by the fixing portions 31, and a plurality of suction portions 28b for sucking a portion of the mother glass plate MG. Examples of materials constituting the support base 28 include metals and ceramics.

[0071] The fixing part 31 of the support base 28 has a support surface 31a that supports the mother glass plate MG and a suction part 31b that sucks the mother glass plate MG. The support surface 31a is configured as a flat surface facing upward. The suction part 31b of the fixing part 31 is formed so as to be exposed on a part of the support surface 31a. The suction part 31b is connected to the external force generating device 30.

[0072] The space 32 of the support base 28 is formed inside a recess having a bottom. The space 32 of the support base 28 is configured so that the entire protrusion 8 of the lid member 4 is molded in a non-contact state.

[0073] The opening 28a of the support base 28 has a circular opening edge in a plan view, but is not limited thereto, and may have an opening edge of a polygonal shape such as a triangular shape or a rectangular shape, an elliptical shape, or the like. The suction portion 28b of the support base 28 is formed at the bottom of the recess of the support base 28, and communicates with the space portion 32. The suction portion 28b is connected to the external force generating device 30 together with the suction portion 31b of the fixing portion 31. That is, the external force generating device 30 can perform suction by the suction portion 28b and suction by the suction portion 31b of the fixing portion 31 using a common suction device.

[0074] Without being limited to the above configuration, in order to form the shape of the lid member 4 with high precision, a lower support jig for supporting the mother glass plate MG may be provided in the space 32. The lower support jig is made of metal or ceramics. As described above, it is preferable to form the entire protrusion 8 of the lid member 4 in a non-contact state, but by improving the quality of the surface of the lower support jig that comes into contact with the mother glass plate MG (reducing the surface roughness and surface waviness), the lid member 4 can be formed with high precision even when the lower support jig is used.

[0075] As shown in FIG. 14, the heating source 29 is disposed above the support table 28. In this embodiment, each heating source 29 is a burner that ejects a flame FL toward the mother glass sheet MG. By using a burner, the mother glass sheet MG can be softened relatively quickly. The heating method of the heating source 29 may be, for example, resistance heating, laser heating, or heating using superheated steam. Here, superheated steam means high-temperature steam obtained by further heating saturated steam generated by boiling water. The heating source 29 may also be configured by combining heating sources of different heating methods.

[0076] As the external force generating device 30, for example, a suction device (exhaust device) can be used. The suction device exhausts gas present in the space 32 of the support stand 28 to create a negative pressure in the space 32 of the support stand 28. This causes a part of the mother glass sheet MG to be sucked into the space 32 of the support stand 28, thereby facilitating thermal deformation of a part of the mother glass sheet MG. As the suction device, for example, a pump using a Venturi mechanism is suitable.

[0077] As shown in Fig. 14, in the forming step S4, the mother glass plate MG is placed on the fixing portion 31 of the support base 28 with the external force generating device 30 stopped. As a result, the second main surface MGb of the mother glass plate MG comes into contact with the support surface 31a of the fixing portion 31. Next, the external force generating device 30 is started, and the mother glass plate MG is fixed to the fixing portion 31. In this forming step S4, suction by the suction portion 28b of the support base 28 and suction by the suction portion 31b of the fixing portion 31 can be performed simultaneously. In this case, the suction direction D1 of the mother glass plate MG by the suction portion 28b and the suction direction D2 of the mother glass plate MG by the suction portion 31b of the fixing portion 31 can be the same direction.

[0078] Thereafter, the mother glass plate MG is heated from above the support stand 28 by the heating source 29. As shown in Figs. 15 and 16, a part of the mother glass plate MG is thermally deformed by suction by the suction unit 28b, and a plurality of protrusions 8 are formed. A portion corresponding to the frame 7 of the cover member 4 is formed around the protrusion 8. As a result, a plurality of portions corresponding to the cover members 4 are formed on the mother glass plate MG. In addition, in the forming step S4, it is preferable to heat the portion corresponding to the frame 7 in order to suppress warping of this portion. Note that when the mother glass plate MG is heated from above the support stand 28 by the heating source 29, if there are microcracks on the inner surface of the through hole 18, an external force is applied to the periphery of the through hole 18, and the cracks may progress around the periphery of the through hole 18, causing damage to the mother glass plate MG. In the present invention, since the microcracks formed on the inner surface of the through-hole 18 are removed, even when the mother glass plate MG is heated from above the support base 28 by the heat source 29, the cracks do not grow around the through-hole 18. This makes it possible to reduce breakage of the mother glass plate MG.

[0079] The film formation process S5 includes a first film formation process of forming anti-reflection films 10a, 10b on the main surfaces MGa, MGb of the mother glass plate MG, and a second film formation process of forming a metal layer 14 on the portion corresponding to the frame portion 7 of the cover member 4 after the first film formation process.

[0080] 17 shows a film forming apparatus used in the film forming step S5. In this embodiment, a sputtering apparatus such as a magnetron sputtering apparatus is exemplified as the film forming apparatus, but the present invention is not limited to this configuration, and a film forming apparatus that performs other physical vapor deposition methods such as vacuum deposition may be used.

[0081] As shown in FIG. 17, a film forming apparatus 33 includes a vacuum chamber 34, and targets 35a and 35b for scattering particles that become film forming materials for the anti-reflection films 10a and 10b.

[0082] The targets 35a and 35b are accommodated inside the vacuum chamber 34. The internal space of the vacuum chamber 34 is set to a predetermined vacuum level by a vacuum pump. An inert gas such as argon gas may be supplied into the vacuum chamber 34.

[0083] The targets 35a, 35b include a first target 35a for forming a first antireflection coating 10a on a first main surface MGa of the mother glass plate MG, and a second target 35b for forming a second antireflection coating 10b on a second main surface MGb of the mother glass plate MG.

[0084] The first target 35a and the second target 35b include a plurality of targets for forming the first film (SiO 2 ) and the second film (HfO 2 ) of the first antireflection coating 10a and the second antireflection coating 10b.

[0085] 17, in the first film formation step, the mother glass plate MG is accommodated in a vacuum chamber 34. Then, particles scattered from a first target 35a are caused to adhere to a first main surface MGa of the mother glass plate MG, thereby forming a first antireflection film 10a. Similarly, particles scattered from a second target 35b are caused to adhere to a second main surface MGb of the mother glass plate MG, thereby forming a second antireflection film 10b.

[0086] In the second film formation step, after the first film formation step, a metal layer 14 is formed so as to overlap the first antireflection film 10a. Specifically, a mask member for forming the metal layer 14 is fixed to the first main surface MGa of the mother glass plate MG. The mask member has an opening corresponding to a predetermined position (a position where the metal layer 14 is to be formed) of a portion of the mother glass plate MG that corresponds to the frame portion 7.

[0087] Furthermore, a target for forming the metal layer 14 is placed in the vacuum chamber 34, and particles scattered from the target are caused to adhere to the first main surface MGa of the mother glass plate MG through the openings in the mask member. As a result, a frame-shaped metal layer 14 having a constant thickness is formed at a predetermined position on the mother glass plate MG.

[0088] Thereafter, the bonding portion 15 is formed so as to overlap the metal layer 14. The bonding portion 15 is formed by a process (coating process) in which, for example, a paste-like metal-based bonding material is coated so as to overlap the metal layer 14. Specific examples of the coating process include a printing method using a mask (screen printing method), a coating method using a dispenser, and the like.

[0089] The bonding portion 15 may be formed by, for example, arranging a molded body of a metal-based bonding material preliminarily formed into a predetermined frame shape so as to overlap the metal layer 14 .

[0090] Once the metallic bonding material for the bonding portion 15 is applied to the first main surface MGa of the mother glass plate MG, a heat treatment process is carried out to fix the metallic bonding material to the metal layer 14. The heat treatment process includes a heating process and a cooling process.

[0091] In the heating step, the mother glass plate MG is heated using a heating device such as a reflow furnace to melt the metal-based bonding material. The heating step may be performed, for example, in a furnace filled with nitrogen. In the heating step, the mother glass plate MG is heated to a temperature of 300° C. or higher.

[0092] In the cooling step, the metal-based bonding material melted on the first main surface MGa of the mother glass plate MG is cooled and solidified. The cooling step is preferably performed by slow cooling at a cooling rate of 50° C. / min. In the cooling step, stress is generated in the mother glass plate MG due to the difference in thermal expansion coefficient between the mother glass plate MG and the bonding portion 15, but the first antireflection film 10a can relieve this stress.

[0093] Furthermore, since chipping around the through holes 18 and microcracks on the inner surfaces of the through holes 18 are removed from the mother glass plate MG by the polishing step S2 and the etching step S3, the mother glass plate MG will not break even if the above-mentioned stress acts on it.

[0094] The cutting step S6 is a step of dividing the mother glass plate MG to form a plurality of lid members 4. In this embodiment, an example is shown in which a dicing process is performed on the mother glass plate MG in the cutting step S6. The cutting step S6 is not limited to this embodiment, and the mother glass plate MG may be cut by scribe breaking or laser irradiation.

[0095] 18, in the cutting step S6, the mother glass plate MG is cut by a dicing blade 36 along imaginary cutting lines CL set on the mother glass plate MG. Note that, as shown in FIG. 16, the cutting lines CL are set in straight lines so as to connect the plurality of through holes 18 together. Specifically, the cutting lines CL are set so as to pass through corners 20 of the respective through holes 18.

[0096] 19, a plurality of lid members 4 are formed from the mother glass plate MG in the cutting step S6. By cutting the mother glass plate MG along the planned cutting lines CL as described above, the sides 19 of the through holes 18 are configured as corners 7e of the frames 7 of the lid members 4.

[0097] In the cover member 4 manufactured as described above, the side surface 7c at the side portion 7d of the frame portion 7 becomes a dicing surface, and the chamfered surface 7e1 at the corner portion 7e of the frame portion 7 becomes an etching surface. The surface roughness (arithmetic mean roughness) Ra of the dicing surface is 1 μm or more and 100 μm or less. The surface roughness (arithmetic mean roughness) Ra of the etching surface is 0.5 nm or more and 100 nm or less.

[0098] 20 , in the bonding step, the lid member 4 manufactured through the preparation step is laid on the base body 2. Specifically, the first main surface 7a of the frame portion 7 of the lid member 4 is placed opposite to the base body 2, and the bonding portion 15 is brought into contact with the metal layer 6 formed on the first main surface 2a of the base body 2.

[0099] Thereafter, the metal layer 6 and the bonding portion 15 are heated in a pressure-welded state (heating step), whereby the metallic bonding material of the bonding portion 15 is brought into a molten state.

[0100] Thereafter, the molten metal-based bonding material is cooled and solidified (cooling step). In the cooling step, stress is generated in the frame 7 due to the difference in thermal expansion coefficient between the base 2 and the frame 7 of the lid member 4. In this case, the buffer portion 10a2 of the first antireflection film 10a deforms so as to relieve this stress. This makes it possible to prevent damage to the frame 7. Furthermore, in the lid member 4, chipping and microcracks related to the through-holes 18 are removed from the mother glass plate MG in the polishing step S2 and the etching step S3. Therefore, even if the above-mentioned stress acts on the lid member 4, the corners 7e of the lid member 4 will not be damaged.

[0101] When the cooling step is completed, the sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at the joint 15. In this manner, the package 1 that maintains airtightness is completed.

[0102] According to the present embodiment described above, by performing the polishing step S2 and the etching step S3 on the mother glass plate MG having the plurality of through holes 18 formed therein, it is possible to reliably remove chipping and microcracks formed in the through holes 18 by mechanical processing (blasting treatment). This makes it possible to prevent damage to the mother glass plate MG and the lid member 4 caused by the through holes 18.

[0103] The present invention is not limited to the configuration of the above embodiment, nor is it limited to the above-mentioned effects and advantages. Various modifications of the present invention are possible without departing from the spirit and scope of the present invention.

[0104] In the above embodiment, the lid member 4 and the mother glass plate MG on which the first antireflection film 10a and the second antireflection film 10b are formed are shown, but the present invention is not limited to this configuration. The lid member 4 and the mother glass plate MG according to the present invention may have only the first antireflection film 10a or only the second antireflection film 10b. In addition, the antireflection films 10a and 10b may be omitted.

[0105] In the above embodiment, the cover member 4 has one protruding portion 8, but this is not limiting, and the cover member 4 may have a plurality of protruding portions 8. [Explanation of symbols]

[0106] 1 package 3 Light emitting element 4 Cover member 7 Frame 7a First main surface of frame 7b Second main surface of frame 7c Side of frame 7d. Edge of frame 7e Corner of frame 8 Protrusion 18 Through hole 20 Corner of through hole CL Cutting line (imaginary line) MG mother glass plate (transparent substrate) First main surface of MGa mother glass plate Second main surface of MGb mother glass plate S1 Drilling process S2 Polishing process S3 Etching process S4 Molding process S5 Film formation process S6 cutting process

Claims

1. forming a plurality of through holes in a transparent substrate by machining; polishing a main surface of the transparent substrate; Etching the plurality of through holes; A method for manufacturing a transparent member, comprising:

2. The method for manufacturing a transparent member according to claim 1 , further comprising the step of dividing the transparent substrate along imaginary lines connecting the plurality of through holes, after the step of etching the plurality of through holes.

3. 3 . The method for producing a transparent member according to claim 1 , further comprising, after the step of etching the plurality of through holes, a step of hot forming the main surface of the transparent substrate so that a portion of the main surface becomes convex. 4 .

4. The method for manufacturing a transparent member according to claim 1 or 2, wherein the mechanical processing includes a blasting process.

5. The through hole is configured to have a polygonal shape in a plan view, The through hole has a plurality of corners, The method for manufacturing a transparent member according to claim 1 , wherein the corners of the through hole are curved in a plan view.

6. The method for manufacturing a transparent member according to claim 1 , wherein in the step of etching the plurality of through holes, the sizes of the through holes do not substantially change.

7. 3. The method for manufacturing a transparent member according to claim 2, further comprising the step of forming a film on the main surface of the transparent substrate after the step of forming the plurality of through holes and before the step of dividing the transparent substrate.

8. The method for manufacturing a transparent member according to claim 2 , wherein the step of dividing the transparent substrate includes a dicing process.

9. A transparent glass lid member used for a package including a light emitting element, The device includes a plate-shaped frame portion and a protruding portion protruding from the frame portion, The frame portion includes a first main surface, a second main surface located opposite to the first main surface, and a side surface connecting the first main surface and the second main surface, The frame portion has a plurality of corner portions and a plurality of side portions in a plan view, the side surfaces at the plurality of corner portions are etched surfaces, A lid member, characterized in that the side surface of at least one of the plurality of side portions is a dicing surface.

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