Electronic component and apparatus

Abstract

To provide a technique advantageous for preventing damage to an electronic component.SOLUTION: An electronic component includes: a substrate; an electronic device that comprises a first principal surface having an area facing the substrate and a second principal surface on the opposite side of the first principal surface; a support member that is arranged between the electronic device and the substrate; a conductive wire that connects a first terminal arranged on the second principal surface and a second terminal arranged on a third principal surface on which the electronic device is mounted, to each other; and a resin member that is arranged to cover the conductive wire. The support member comprises a fourth principal surface that faces the first principal surface, a fifth principal surface on the opposite side of the fourth principal surface, and a side surface that connects the fourth principal surface and the fifth principal surface to each other. The resin member covers at least part of the side surface. The support member comprises a chamfered part that is a portion between the side surface and at least one of the fourth principal surface and the fifth principal surface and is chamfered.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to electronic components and devices. [Background technology]

[0002] Patent Document 1 shows an electronic component in which a detector, in which a semiconductor layer having a detection region and a support part supporting the semiconductor layer are stacked, is housed in a package base. The semiconductor layer is electrically connected to an internal terminal of the base via a bonding wire. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-087640 A Summary of the Invention [Problem to be solved by the invention]

[0004] In order to protect the bonding wires connecting the semiconductor layer and the base, the bonding wires may be sealed with a resin. If there is a gap or other discontinuous portion between the semiconductor layer and the support on the side of the detector, the resin may not penetrate the discontinuous portion of the side of the detector when sealing the bonding wires with the resin, and air bubbles may be generated in the resin. If air bubbles exist in the resin, the air bubbles may expand and cause damage to the electronic components when the outside of the electronic components is depressurized more than the inside of the air bubbles in the environment in which the electronic components are placed.

[0005] An object of the present invention is to provide a technique that is advantageous in suppressing damage to electronic components. [Means for solving the problem]

[0006] In view of the above problems, an electronic component according to an embodiment of the present invention is an electronic component including a base, an electronic device having a first main surface having an area facing the base and a second main surface opposite the first main surface, a support member arranged between the electronic device and the base, a conductive wire connecting a first terminal arranged on the second main surface and a second terminal arranged on a third main surface of the base on which the electronic device is mounted, and a resin member arranged to cover the conductive wire, wherein the support member has a fourth main surface facing the first main surface, a fifth main surface opposite the fourth main surface, and a side surface connecting the fourth main surface and the fifth main surface, the resin member covers at least a part of the side surface, and the support member has a chamfered portion where at least one of the fourth main surface and the fifth main surface is chamfered between the side surface and the side surface. Effect of the Invention

[0007] According to the present invention, it is possible to provide a technique that is advantageous in suppressing damage to electronic components. [Brief description of the drawings]

[0008] [Figure 1] 1A and 1B are a plan view and a cross-sectional view showing a configuration example of an electronic component according to an embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view showing a configuration of a support member for the electronic component in FIG. 1; [Diagram 3] 3 is a cross-sectional view showing a modified example of the support member in FIG. 2. [Figure 4] 1A and 1B are a plan view and a cross-sectional view showing a configuration example of an electronic component of a comparative example. [Diagram 5] FIG. 11 is a cross-sectional view showing a configuration of a support member for an electronic component according to a comparative example. [Figure 6] 3 is a cross-sectional view showing a modified example of the support member in FIG. 2. [Figure 7] FIG. 7 is an enlarged view of the support member of FIG. 6. [Figure 8] FIG. 1 is a diagram showing a configuration example of a device in which an electronic component according to an embodiment of the present invention is incorporated. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] An electronic component according to an embodiment of the present disclosure will be described with reference to Figs. 1(a) and 1(b) to 7. Figs. 1(a) and 1(b) are schematic diagrams showing a configuration example of an electronic component 100 according to the present embodiment. Fig. 1(a) is a plan view showing a configuration example of the electronic component 100. Fig. 1(b) is a cross-sectional view taken along line Aa in Fig. 1(a). Figs. 2 and 3 are cross-sectional views showing an enlarged right-hand portion of the cross-sectional view shown in Fig. 1(b). Each of the drawings shows an X direction, a Y direction, and a Z direction. Hereinafter, the X direction and the Y direction may be referred to as the planar direction of the electronic component 100, and the Z direction may be referred to as the thickness direction of the electronic component 100. The X direction (Y direction) and the Z direction are, for example, directions that perpendicularly intersect each other.

[0011] The electronic component 100 includes a base 30, an electronic device 10 having a main surface 102 having an area facing the base 30 and a main surface 101 opposite to the main surface 102, and a support member 20 arranged between the electronic device 10 and the base 30. The base 30 can form a package that houses the electronic device 10. The support member 20 supports the electronic device 10 between the electronic device 10 and the base 30. The electronic component 100 further includes a conductive wire 11 that connects a terminal 111 arranged on the main surface 101 of the electronic device 10 to a terminal 311 arranged on the main surface 301 of the base 30 on which the electronic device 10 is mounted, and a resin member 50 arranged to cover the conductive wire 11. The size of a typical electronic device 10 and electronic component 100 in the Z direction is smaller than the size in the X direction and Y direction, and the electronic device 10 and electronic component 100 are generally flat.

[0012] The electronic device 10 is formed on a semiconductor substrate such as silicon or germanium. Here, the semiconductor substrate on which the electronic device 10 is formed may be single crystal or polycrystalline. The electronic device 10 also includes an insulating layer, a wiring layer, a protective layer, and the like formed on the semiconductor substrate.

[0013] The main surface 101 of the electronic device 10 includes a detection region 1 in which pixels are arranged, and a peripheral region 2 arranged outside the detection region 1. For example, if the electronic component 100 is a radiation detector, the detection region 1 has pixels that detect radiation arranged therein, and the peripheral region 2 has circuits for operating the detection region 1 arranged therein. Typically, the detection region 1 is located in the center of the main surface 101 of the electronic device 10, and the peripheral region 2 is located on the periphery thereof. The main surface 101 of the electronic device 10 can be a surface onto which radiation is incident.

[0014] The radiation detected by the electronic device 10 may be electromagnetic waves or particle beams. The electromagnetic waves may be light beams such as infrared rays, visible light, and ultraviolet rays, radio waves such as microwaves, or ionizing radiation such as X-rays and gamma rays. Examples of particle beams include alpha rays, beta rays, electron beams, neutron beams, proton beams, heavy ion beams, and meson beams. The structure of the radiation detector of the electronic device 10, for example, the thickness of a semiconductor layer (semiconductor substrate) that converts radiation into an electrical signal, may be appropriately set according to the transmission characteristics and absorption characteristics of the radiation to be detected. An example in which the electronic component 100 is a radiation detector will be described below.

[0015] The detection region 1 is an area provided with pixels (detection elements) that convert electric charges generated by the incidence of radiation into output signals. The detection region 1 may have a structure in which a plurality of pixels, including detection elements and switch elements for signal readout, are arranged in a matrix in order to form an image based on radiation. Each of the plurality of pixels may include a photodiode as a detection element, similar to a CMOS image sensor or a CCD image sensor. As the photodiode, a PN diode or a PIN diode using silicon may be used. Also, as the photodiode, a compound semiconductor such as cadmium telluride (CdTe) or cadmium zinc telluride (CdZnTe) may be used. Also, the photon counting principle may be used, and a device such as a Single Photon Avaranche Diode (SPAD) may be used.

[0016] Considering the balance between preventing crosstalk between pixels and ensuring mechanical strength, the thickness of the electronic device 10 (detection region 1) may be 10 μm or more and 100 μm or less. The thickness of the electronic device 10 (detection region 1) may further be 25 μm or more and 75 μm or less. Typically, the thickness of the electronic device 10 (detection region 1) is set to 50 μm.

[0017] The peripheral region 2 is provided with peripheral circuits such as a driving circuit, a control circuit, a signal processing circuit, and an output circuit, as well as input terminals and output terminals. The driving circuit is a circuit that scans and drives each pixel in the detection region 1. The control circuit is a circuit that controls the driving timing of the driving circuit, the signal processing circuit, and the like. The control circuit may include a timing generator, etc. The signal processing circuit processes a signal read from the detection region 1. The signal processing circuit may include an amplifier circuit and an AD conversion circuit. The output circuit converts a signal obtained by the signal processing circuit into a predetermined format and outputs it. The output circuit may include a differential transmission circuit, etc. The input terminal is a terminal to which a power supply or a control signal is input from the outside, and the output terminal is a terminal to which a signal is output to the outside. As shown in FIG. 2 and FIG. 3, a plurality of terminals 111 are provided as input terminals and output terminals in the peripheral region 2 of the main surface 101 of the electronic device 10. The terminal 111 has a configuration that allows electrical connection with a terminal 311 arranged on the main surface 301 of the base 30 described later.

[0018] The support member 20 has a main surface 201 facing the main surface 102 of the electronic device 10, a main surface 202 opposite to the main surface 201, and a side surface 204 connecting the main surface 201 and the main surface 202. In an orthogonal projection onto the main surface 102 of the electronic device 10, the support member 20 has an opening in a portion overlapping the detection region 1. Meanwhile, in the electronic device 10, a part of the peripheral region 2 of the main surface 102 faces the support member 20. Similarly, in an orthogonal projection onto the main surface 102 of the electronic device 10, the base 30 has an opening in a portion overlapping the detection region 1. Meanwhile, in the electronic device 10, a part of the peripheral region 2 of the main surface 102 faces the base 30 via the support member 20.

[0019] As shown in FIG. 2 and FIG. 3, a bonding member 40A is disposed in an area where the main surface 102 of the electronic device 10 and the main surface 201 of the support member 20 face each other, and bonds the electronic device 10 and the support member 20. A bonding member 40B is disposed in an area where the main surface 202 of the support member 20 and the main surface 301 of the base 30 face each other, and bonds the support member 20 and the base 30. For example, an adhesive may be used as the bonding members 40A and 40B. For example, a die attach film (DAF) or a double-sided tape may be used as the bonding members 40A and 40B. The bonding members 40A and 40B may be the same material, or may be different materials. In an area where the main surface 102 of the electronic device 10 and the main surface 201 of the support member 20 face each other, the entire surfaces facing each other may not be bonded by the bonding member 40A. Similarly, in the region where main surface 202 of support member 20 and main surface 301 of base 30 face each other, the entire facing surface does not have to be bonded by bonding member 40B. In each region, as long as there is sufficient strength to bond electronic device 10 and support member 20, and support member 20 and base 30 as electronic component 100, it is sufficient that at least a portion of the regions is bonded.

[0020] The support member 20 is disposed between the electronic device 10 and the base 30, and plays a role in ensuring the mechanical strength of the electronic device 10. Although details will be described later, in general, the base 30 can be formed using a material different from that of the electronic device 10. As described above, when the thin electronic device 10, such as 10 μm or more and 100 μm or less, is directly bonded to the base 30 having an opening as shown in FIG. 1(b), the electronic device 10 may be damaged by stress caused by the difference in linear expansion coefficient. Therefore, the material of the support member 20 may be a semiconductor, an insulator, or a conductor, but it is necessary to have sufficient rigidity to support the electronic device 10. For example, in order to reduce the stress between the electronic device 10 and the support member 20, the support member 20 may be made of the same material as the semiconductor substrate on which the electronic device 10 is formed. For example, when the electronic device 10 is formed on a silicon substrate, the support member 20 may be silicon. Also, for example, when the electronic device 10 is formed on a germanium substrate, the support member 20 may be germanium.

[0021] The thickness of the support member 20 may be 100 μm or more to ensure mechanical strength, and may further be 300 μm or more. For example, when silicon is used for the support member 20, the thickness of the support member 20 may be set to 700 μm or more and 800 μm or less, which is the standard thickness of an 8-inch wafer or a 12-inch wafer that is generally used as a silicon substrate. The support member 20 can be easily manufactured by cutting the support member 20 from a standard wafer. In this way, the thickness of the support member 20 may be 100 μm or more and 800 μm or less. In addition, in the electronic component 100, the thickness of the electronic device 10 may be thinner than the thickness of the support member 20. However, this is not limited to this, and the electronic device 10 and the support member 20 may be formed using different materials. When a material different from that of the electronic device 10 is used for the support member 20, it is possible to use the support member 20 cut to an appropriate size as long as it can support the electronic device 10.

[0022] The base 30 is a board on which electric circuits that achieve various functions are mounted, and can also be considered a package on which the electronic device 10 is mounted via the support member 20. Specific functions include supplying control signals and power to the electronic device 10, processing signals output from the electronic device 10, storing signals, transmitting signals to an external computer or network, etc.

[0023] The base 30 can be formed by die molding, cutting, lamination of plate materials, etc. The base 30 may be an insulator for electrical connection with the support member 20. Furthermore, from the viewpoint of mechanical strength, the base 30 may be a rigid substrate such as a glass epoxy substrate, a composite substrate, a glass composite substrate, a bakelite substrate, or a ceramic substrate. For example, a ceramic substrate or a glass epoxy substrate is used as the base 30. When the base 30 is a ceramic substrate, it may be a ceramic laminate. As the ceramic material, silicon carbide, aluminum nitride, sapphire, alumina, silicon nitride, cermet, yttria, mullite, forsterite, cordierite, zirconia, steatite, etc. may be used.

[0024] The base 30 includes a conductive layer 313 between a main surface 301 on which the electronic device 10 is mounted and a main surface 302 opposite to the main surface 301. The conductive layer 313 may be composed of a plurality of layers as shown in FIG. 2 and FIG. 3. The conductive layers 313 of different layers are connected to each other by a conductive member 312. Here, among the conductive layers 313, the conductive layer 313 provided on the main surface 301 of the base 30, which is electrically connected to the terminal 111 provided on the main surface 101 of the electronic device 10 via the conductive wire 11, is called a terminal 311. Among the conductive layers 313, the conductive layer 313 provided on the main surface 301 or the main surface 302 of the base 30 for connecting the electronic component 100 to the outside is called a terminal 314. For example, the terminal 311 and the corresponding terminal 314 can be electrically connected to each other via the conductive layer 313 or the conductive member 312. Terminals 314 for electrical connection to an external circuit may be arranged on both main surfaces 301 and 302 of base 30, or may be arranged only on main surface 301 of base 30, or may be arranged only on main surface 302.

[0025] A resin member 50 is disposed around the conductive wire 11 so as to completely cover the conductive wire 11. In order to cover the conductive wire 11, the resin member 50 is also formed on a part of each of the electronic device 10, the bonding members 40A and 40B, the support member 20, and the base 30. For example, as shown in FIG. 2 and FIG. 3, the resin member 50 continuously covers from the terminal 111 of the electronic device 10 through the side surface 204 of the support member 20 to the terminal 311 of the base 30. That is, the resin member 50 covers the side surface 204 of the support member 20. As shown in FIG. 1(b), the resin member 50 may be disposed so as to surround the outer edge of the support member 20 in the orthogonal projection onto the main surface 102 of the electronic device 10. On the other hand, if the resin member 50 is present in the detection region 1 of the electronic device 10, an image obtained in the detection region may be affected. Therefore, the resin member 50 may be formed so as to be contained within the peripheral region 2. 2 and 3, resin member 50 is formed so as not to cover terminals 314 for connecting electronic component 100 to the outside.

[0026] Examples of materials for the resin member 50 include epoxy resin, acrylic resin, silicone resin, and vinyl resin. An appropriate resin may be selected as the resin member 50 in consideration of the filling property and fluidity of the resin, and twisting of the conductive wires 11. If necessary, a dam material (not shown) may be provided on the main surface 101 of the electronic device 10 to suppress the resin member 50 from flowing into the detection region 1.

[0027] Next, the shape of the support member 20 will be described in more detail with reference to FIG. 2 and FIG. 3 showing the configuration of the electronic component 100 of the present embodiment, and FIG. 4(a), 4(b), 5(a), and 5(b) showing the configuration of the electronic component 100' of the comparative example. In the configuration shown in FIG. 2, the support member 20 includes a chamfered portion 203 where the main surface 201 and the side surface 204 are chamfered. In addition, in the configuration shown in FIG. 3, the support member 20 is chamfered both between the main surface 201 and the side surface 204 and between the main surface 202 and the side surface 204, and the chamfered portion 203 is disposed on both sides. Although not shown in FIG. 2 and FIG. 3, the support member 20 may be chamfered between the main surface 202 and the side surface 204, and may not be chamfered between the main surface 201 and the side surface 204. In other words, the support member 20 may have a chamfered portion 203 formed by chamfering at least one of the main surface 201 and the main surface 202 and the side surface 204. In an orthogonal projection onto the main surface 102 of the electronic device 10, the chamfered portion 203 may be disposed so as to surround the outer edge of the support member 20, as shown in FIG.

[0028] 4(a) and 4(b) are schematic diagrams showing a configuration example of an electronic component 100' of a comparative example. FIG. 4(a) is a plan view showing a configuration example of the electronic component 100. FIG. 4(b) is a cross-sectional view taken along line Aa in FIG. 4(a). FIGS. 5(a) and 5(b) are cross-sectional views enlarging a right-hand portion of the cross-sectional view shown in FIG. 4(b). The electronic component 100' of the comparative example is different from the electronic component 100 of the present embodiment shown in FIGS. 2 and 3 in the shape of the support member 20. Specifically, the electronic component 100' is different from the electronic component 100 of the present embodiment in that the main surface 201 and the side surface 204 and the main surface 202 and the side surface 204 are not chamfered.

[0029] FIG. 5(a) shows a case where the outer edge of the support member 20 is disposed outside the outer edge of the electronic device 10 due to the influence of the outer shape tolerance and mounting accuracy, and FIG. 5(b) shows a case where the outer edge of the support member 20 is disposed inside the outer edge of the electronic device 10. In the configuration shown in FIG. 5(a), when the resin member 50 is formed, there is a possibility that a void (air bubble) 60 that is not covered by the resin member 50 is formed on the main surface 201 of the support member 20 that exists outside the outer edge of the electronic device 10. In addition, there is a possibility that the outer edge of the support member 20 is disposed outside the outer edge of the bonding member 40B that is disposed between the main surface 202 of the support member 20 and the main surface 301 of the base 30. In that case, there is a possibility that a void (air bubble) 60 that is not covered by the resin member 50 is formed on the lower side of the main surface 202 of the support member 20 that exists outside the outer edge of the bonding member 40B. Even in the configuration shown in FIG. 5(b), there is a possibility that voids (air bubbles) 60 that are not covered by the resin member 50 are formed on the lower side of the main surface 102 of the electronic device 10 that exists outside the outer edge of the support member 20. The lower side of the support member 20 (the side of the base 30) is the same as the example shown in FIG. 5(a). In other words, if discontinuous parts such as steps or gaps are formed between the electronic device 10 and the support member 20 or between the support member 20 and the base 30, the resin may not penetrate the discontinuous parts, and voids (air bubbles) 60 may be formed in the resin. Here, discontinuous parts are parts that are not continuously flat. The voids (air bubbles) 60 are likely to be formed in areas that are at right angles or close to right angles, such as steps between members.

[0030] In contrast, as shown in Figs. 2 and 3, the electronic component 100 of this embodiment is provided with a chamfered portion 203 between the main surfaces 201, 202 and the side surface 204 of the support member 20. This makes it difficult to form a right-angled or nearly right-angled region in the step region between the members. As a result, it is possible to suppress the generation of voids (air bubbles) 60 in the resin member 50. The gap between the main surface 202 of the support member 20 and the base body 30 is a gap that can be generated by the bonding member 40B, and is a narrow space, so the chamfered portion 203 widens the entrance of the space. This makes it easier for the resin member 50 to penetrate, which is more effective in suppressing the generation of voids (air bubbles) 60.

[0031] 2, the chamfered portion 203 may be formed only between the main surface 201 and the side surface 204 of the support member 20. Also, taking into consideration the gap between the main surface 202 of the support member 20 and the base 30, the chamfered portion 203 may be formed only between the main surface 202 and the side surface 204 of the support member 20. However, as shown in FIG 3, arranging the chamfered portion 203 both between the main surface 201 and the side surface 204 of the support member 20 and between the main surface 202 and the side surface 204 can be more effective because it makes it possible to suppress voids (air bubbles) 60 on both sides.

[0032] Furthermore, in an orthogonal projection onto the main surface 102 of the electronic device 10, the chamfered portion 203 may be disposed outside the outer edge of the electronic device 10. By disposing the chamfered portion 203 outside the outer edge of the electronic device 10, no gap is formed between the electronic device 10 and the support member 20 due to the chamfered portion 203. Therefore, when the resin member 50 is formed, it is possible to suppress the generation of voids (air bubbles) 60 between the electronic device 10 and the support member 20.

[0033] In this way, when the resin member 50 is formed, the generation of voids (air bubbles) 60 in the resin member 50 is suppressed. When the electronic component 100 is used, for example, when the electronic component 100 is used under a vacuum, the voids (air bubbles) 60 may expand. The expansion of the voids (air bubbles) 60 may lead to damage to the electronic component 100, such as damage to the thin electronic device 10, peeling of the bonding members 40A and 40B, displacement of the electronic device 10 or the support member 20 due to peeling of the bonding members 40A and 40B, breakage of the conductive wires 11, and damage to the base 30. By suppressing the generation of the voids (air bubbles) 60 when the resin member 50 is formed, it is possible to suppress damage to the electronic component 100 and improve the reliability of the electronic component 100.

[0034] Although there is no particular limitation on the size of the chamfered portion 203, in an orthogonal projection onto the main surface 102 of the electronic device 10, the terminal 111 of the electronic device 10 may be disposed inside the chamfered portion 203. If a space caused by the chamfered portion 203 exists inside the terminal 111, a load or ultrasonic wave may not be normally transmitted in the process of connecting the conductive wire 11 to the terminal 111, and the connection reliability of the conductive wire 11 may be deteriorated. For this reason, the chamfered portion 203 is not disposed below the terminal 111 of the electronic device 10, and the main surface 201 of the support member 20 is disposed below the terminal 111 of the electronic device 10.

[0035] Furthermore, when chamfered portions 203 are formed both between the main surface 201 and the side surface 204 of the support member 20 and between the main surface 202 and the side surface 204, the side surface 204 is made to remain unchamfered. If the side surface 204 is not provided, the outer edge of the support member 20 becomes sharp, which may cause chipping of the support member 20 when the support member 20 is gripped, for example, when the electronic device 10 and the support member 20 are joined together.

[0036] The shape of the chamfered portion 203 may be, for example, a C-chamfer. Also, for example, the shape of the chamfered portion 203 may be a chamfer with an acute or obtuse angle other than a C-chamfer. However, if the angle is extremely acute or obtuse (for example, 10 degrees or less or 80 degrees or more with respect to the side surface 204 of the support member 20), a shape close to a right angle will be generated as in the above-mentioned comparative example, making it difficult to obtain the above-mentioned effects. Therefore, the chamfered portion 203 may have a surface with an angle of 10 degrees or more and 80 degrees or less with respect to the side surface 204 of the support member 20. Furthermore, the chamfered portion 203 may have a surface with an angle of 30 degrees or more and 60 degrees or less with respect to the side surface 204 of the support member 20.

[0037] The chamfered portion 203 may be formed by physical processing such as polishing or cutting. The chamfered portion 203 may be formed by processing using chemicals such as etching. When etching using chemicals is performed, the effect of suppressing the generation of voids (air bubbles) 60 can be easily obtained by using chemicals and process conditions that make the surface of the chamfered portion 203 smooth after processing.

[0038] In this manner, chamfered portion 203 is disposed between main surfaces 201, 202 and side surface 204 of support member 20. This suppresses the generation of voids (air bubbles) 60 in resin member 50 when resin member 50 is formed. This suppresses damage to electronic component 100 caused by voids (air bubbles) 60 in resin member 50. As a result, it is possible to improve the reliability of electronic component 100.

[0039] FIG. 6 is a diagram showing a modified example of the support member 20 shown in FIG. 2 and FIG. 3. In the configuration shown in FIG. 2 and FIG. 3, the shape of the chamfered portion 203 is planar. However, the shape of the chamfered portion 203 is not limited thereto. The shape of the chamfered portion 203 may be an R-chamfered shape as shown in FIG. 6. As shown in FIG. 6, both the portion between the main surface 201 and the side surface 204 of the support member 20 and the portion between the main surface 202 and the side surface 204 may be chamfered in an R-chamfered shape. In addition, for example, the portion between one of the main surface 201 and the main surface 202 of the support member 20 and the side surface 204 may be chamfered in an R-chamfered shape. In addition, the R-chamfered shape and the above-mentioned planar chamfered shape may be combined.

[0040] FIG. 7 is a cross-sectional view enlarging the vicinity of the bonding region between the electronic device 10 and the support member 20. By making the shape of the chamfered portion 203 an R-surface, the angle gradually changes from the main surface 201 to the side surface 204 of the support member 20 compared to C-chamfering. Therefore, when the bonding member 40A is disposed from the main surface 201 to a part of the chamfered portion 203, the thickness of the portion of the bonding member 40A that covers the chamfered portion 203 gradually increases. When the thickness of the bonding member 40A changes suddenly, a gap may occur between the bonding member 40A and the main surface 102 of the electronic device 10 or between the bonding member 40A and the support member 20. When a gap occurs between the bonding member 40A and the main surface 102 of the electronic device 10 or between the bonding member 40A and the support member 20, it may cause a void (air bubble) 60 when the resin member 50 is formed. On the other hand, as shown in FIG. 7, the thickness of the portion of the bonding member 40A that covers the chamfered portion 203 gradually increases, which suppresses the occurrence of gaps between the bonding member 40A and the main surface 102 of the electronic device 10 and between the bonding member 40A and the support member 20. That is, the reliability (adhesion) of the bond between the main surface 102 of the electronic device 10 and the main surface 201 of the support member 20 can be improved. In addition, the occurrence of voids (air bubbles) 60 when forming the resin member 50 is suppressed. As a result, damage to the electronic component 100 caused by voids (air bubbles) 60 in the resin member 50 is suppressed, and the reliability of the electronic component 100 can be improved.

[0041] Hereinafter, the equipment 1000 including the electronic component 100 shown in FIG. 8 will be described in detail. The electronic device 10 is accommodated in a package 80 and mounted on the equipment 1000. In the configuration shown in FIG. 8, the electronic device 10 is a device that detects radiation. The electronic component 100 can include a package 80 including a base 30 to which the electronic device 10 is fixed, and a lid 70 made of glass or the like that faces the electronic device 10. As described above, the package 80 can include a bonding member such as a conductive wire 11 or a bump that connects a terminal 311 provided on the base 30 and a terminal 111 such as a pad electrode provided on the electronic device 10.

[0042] The apparatus 1000 may include at least one of an optical device 1040, a control device 1050, a processing device 1060, a display device 1070, a storage device 1080, and a mechanical device 1090. The optical device 1040 is, for example, a lens, a shutter, or a mirror. The control device 1050 controls the electronic device 10. The control device 1050 is, for example, a semiconductor device such as an ASIC.

[0043] The processing device 1060 processes a signal output from the electronic device 10. The processing device 1060 is a semiconductor device such as a CPU or ASIC for configuring an AFE (analog front end) or a DFE (digital front end). The display device 1070 is an EL display device or a liquid crystal display device that displays information (images) obtained by the electronic device 10. The storage device 1080 is a magnetic device or a semiconductor device that stores information (images) obtained by the electronic device 10. The storage device 1080 is a volatile memory such as an SRAM or a DRAM, or a non-volatile memory such as a flash memory or a hard disk drive.

[0044] The mechanical device 1090 has a moving part or a propulsion part such as a motor or an engine. In the equipment 1000, the signal output from the electronic device 10 is displayed on the display device 1070, or transmitted to the outside by a communication device (not shown) included in the equipment 1000. For this purpose, the equipment 1000 may further include a storage device 1080 and a processing device 1060 in addition to the storage circuit and arithmetic circuit included in the electronic device 10. The mechanical device 1090 may be controlled based on the signal output from the electronic device 10.

[0045] The device 1000 is also suitable for electronic devices such as information terminals (e.g., smartphones and wearable terminals) and cameras (e.g., interchangeable lens cameras, compact cameras, video cameras, and surveillance cameras) having a photographing function. The mechanical device 1090 in the camera can drive components of the optical device 1040 for zooming, focusing, and shutter operation. Alternatively, the mechanical device 1090 in the camera can move the electronic device 10 for vibration isolation operation.

[0046] The device 1000 may be a transport device such as a vehicle, a ship, or an aircraft. The mechanical device 1090 in the transport device may be used as a moving device. The device 1000 as a transport device is suitable for transporting the electronic device 10 or for assisting and / or automating driving (piloting) by using a photographing function. The processing device 1060 for assisting and / or automating driving (piloting) can perform processing for operating the mechanical device 1090 as a moving device based on information obtained by the electronic device 10. Alternatively, the device 1000 may be a medical device such as an endoscope, a measuring device such as a distance measuring sensor, an analytical device such as an electron microscope, an office machine such as a copier, or an industrial device such as a robot.

[0047] The disclosure herein includes the following electronic components and devices:

[0048] (Item 1) An electronic component including: a base; an electronic device having a first main surface having an area facing the base and a second main surface opposite to the first main surface; a support member disposed between the electronic device and the base; a conductive wire connecting a first terminal disposed on the second main surface and a second terminal disposed on a third main surface of the base on which the electronic device is mounted; and a resin member disposed so as to cover the conductive wire, the support member includes a fourth main surface facing the first main surface, a fifth main surface opposite the fourth main surface, and a side surface connecting the fourth main surface and the fifth main surface; The resin member covers at least a portion of the side surface, The electronic component, wherein the support member has a chamfered portion between at least one of the fourth main surface and the fifth main surface and the side surface.

[0049] (Item 2) 2. The electronic component of item 1, wherein the support member is chamfered both between the fourth main surface and the side surface and between the fifth main surface and the side surface.

[0050] (Item 3) 3. The electronic component according to item 1 or 2, wherein in an orthogonal projection onto the first main surface, the first terminal is disposed on the inner side of the chamfered portion.

[0051] (Item 4) 4. The electronic component according to any one of claims 1 to 3, wherein in an orthogonal projection onto the first main surface, the chamfered portion is disposed outside an outer edge of the electronic device.

[0052] (Item 5) 5. The electronic component according to any one of claims 1 to 4, wherein the chamfered portion has a surface that forms an angle of 30° or more and 60° or less with respect to the side surface.

[0053] (Item 6) 5. The electronic component according to any one of claims 1 to 4, wherein the chamfered portion has a rounded chamfered shape.

[0054] (Item 7) 7. The electronic component according to any one of claims 1 to 6, wherein, in an orthogonal projection onto the first main surface, the chamfered portion is arranged to surround an outer edge of the support member.

[0055] (Item 8) the second principal surface includes a detection region in which pixels are arranged, and a peripheral region arranged outside the detection region, 8. The electronic component according to claim 1, wherein, in an orthogonal projection onto the first main surface, the support member has an opening in a portion that overlaps the detection area.

[0056] (Item 9) 9. The electronic component according to item 8, wherein, in an orthogonal projection onto the first principal surface, the base has an opening in a portion that overlaps the detection region.

[0057] (Item 10) the electronic device is formed on a semiconductor substrate; 10. The electronic component according to any one of claims 1 to 9, wherein the support member is made of the same material as the semiconductor substrate.

[0058] (Item 11) 11. The electronic component according to any one of items 1 to 10, wherein the thickness of the electronic device is smaller than the thickness of the support member.

[0059] (Item 12) 12. The electronic component according to any one of items 1 to 11, wherein the thickness of the electronic device is 10 μm or more and 100 μm or less.

[0060] (Item 13) 13. The electronic component according to any one of items 1 to 12, wherein the support member has a thickness of 100 μm or more and 800 μm or less.

[0061] (Item 14) 14. The electronic component according to any one of claims 1 to 13, wherein the resin member continuously covers an area extending from the first terminal through the side surface to the second terminal.

[0062] (Item 15) 15. The electronic component according to any one of claims 1 to 14, wherein in an orthogonal projection onto the first main surface, the resin member is arranged so as to surround an outer edge of the support member.

[0063] (Item 16) a third terminal for connecting the electronic component to an external device is disposed on the third main surface; 16. The electronic component according to any one of items 1 to 15, wherein the resin member does not cover the third terminal.

[0064] (Item 17) An electronic component according to any one of items 1 to 16, A processing device that processes a signal output from the electronic component; An apparatus comprising:

[0065] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0066] 10: electronic device, 11: conductive wire, 20: support member, 30: base, 50: resin member, 100: electronic component, 101, 102, 201, 202, 301: main surface, 111, 311: terminal, 203: chamfered portion, 204: side surface

Claims

1. An electronic component including: a base; an electronic device having a first main surface having an area facing the base and a second main surface opposite to the first main surface; a support member disposed between the electronic device and the base; a conductive wire connecting a first terminal disposed on the second main surface and a second terminal disposed on a third main surface of the base on which the electronic device is mounted; and a resin member disposed so as to cover the conductive wire, the support member includes a fourth main surface facing the first main surface, a fifth main surface opposite the fourth main surface, and a side surface connecting the fourth main surface and the fifth main surface; The resin member covers at least a portion of the side surface, The electronic component, wherein the support member has a chamfered portion between at least one of the fourth main surface and the fifth main surface and the side surface.

2. The electronic component according to claim 1 , wherein the support member is chamfered both between the fourth main surface and the side surface and between the fifth main surface and the side surface.

3. The electronic component according to claim 1 , wherein the first terminal is disposed on an inner side of the chamfered portion in an orthogonal projection onto the first main surface.

4. The electronic component according to claim 1 , wherein, in an orthogonal projection onto the first main surface, the chamfered portion is disposed outside an outer edge of the electronic device.

5. 2. The electronic component according to claim 1, wherein the chamfered portion has a surface that forms an angle of 30 degrees or more and 60 degrees or less with respect to the side surface.

6. The electronic component according to claim 1 , wherein the chamfered portion has a rounded chamfer shape.

7. The electronic component according to claim 1 , wherein the chamfered portion is disposed so as to surround an outer edge of the support member in an orthogonal projection onto the first main surface.

8. the second principal surface includes a detection region in which pixels are arranged, and a peripheral region arranged outside the detection region, The electronic component according to claim 1 , wherein the support member has an opening in a portion that overlaps the detection area in an orthogonal projection onto the first main surface.

9. 9. The electronic component according to claim 8, wherein the base has an opening in a portion that overlaps the detection region in an orthogonal projection onto the first main surface.

10. the electronic device is formed on a semiconductor substrate; 2. The electronic component according to claim 1, wherein the supporting member is made of the same material as the semiconductor substrate.

11. The electronic component according to claim 1 , wherein the thickness of the electronic device is smaller than the thickness of the support member.

12. 2. The electronic component according to claim 1, wherein the electronic device has a thickness of 10 μm or more and 100 μm or less.

13. 2. The electronic component according to claim 1, wherein the support member has a thickness of 100 μm or more and 800 μm or less.

14. The electronic component according to claim 1 , wherein the resin member covers the first terminal, the side surface, and the second terminal.

15. The electronic component according to claim 1 , wherein the resin member is disposed so as to surround an outer edge of the support member in an orthogonal projection onto the first main surface.

16. a third terminal for connecting the electronic component to an external device is disposed on the third main surface; The electronic component according to claim 1 , wherein the resin member does not cover the third terminal.

17. An electronic component according to any one of claims 1 to 16; A processing device that processes a signal output from the electronic component; An apparatus comprising:

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