Power conversion device

Abstract

To provide a power conversion device that can efficiently cool both a semiconductor element and a printed wiring board and can improve reliability.SOLUTION: A power conversion device 1 comprises: a semiconductor package 10 that has a semiconductor element 11 built therein; a printed wiring board 20 that has a wiring layer 21 built therein which is connected to the semiconductor package 10, and has a pair of surfaces facing each other; a first heat radiation member 31 that is brought into contact with a heat radiation surface of the semiconductor package 10 with a first heat conduction member 51 therebetween; and a second heat radiation member 32 that is brought into contact with, of the pair of surfaces of the printed wiring board 20, a surface formed on the same side as the heat radiation surface of the semiconductor package 10, with a second heat conduction member 52 therebetween. The first heat radiation member 31 and the second heat radiation member 32 are attached relatively displaceable to each other. The first heat conduction member 51 and the second heat conduction member 52 are arranged to partially overlap each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a power conversion device. [Background technology]

[0002] Power conversion devices that convert DC power and AC power mutually by the switching operation of semiconductor elements have high conversion efficiency and are therefore widely used in consumer, automotive, railway, substation equipment, etc. In these power conversion devices, the semiconductor elements generate heat due to their switching operation, and the printed wiring board on which the semiconductor elements and various components are mounted and on which a wiring layer is formed also generates heat due to a large current flowing through the wiring layer. Therefore, it is necessary to cool both the semiconductor elements and the printed wiring board, and a cooling structure that can achieve this is required.

[0003] A cooling structure capable of cooling both semiconductor elements and printed wiring boards has been proposed, for example, as described in Patent Document 1. Patent Document 1 describes a cooling structure for a power conversion device that includes a printed board on which multiple circuit bodies having semiconductor elements are mounted, and in which AC wiring and DC wiring connecting the multiple circuit bodies on the printed board are in contact with heat dissipation protrusions formed in a cooling water channel via an insulating sheet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2023-7184 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the cooling structure described in Patent Document 1, the portion of the cooling water channel that contacts the circuit body and the portion of the heat dissipation protrusion that contacts the printed circuit board having AC wiring and DC wiring inside are integrally formed as one cooling water channel. Therefore, in order to obtain high heat dissipation by closely contacting the cooling water channel with the circuit body and the printed circuit board while ensuring the necessary insulation distance between them, it is necessary to accurately match the shape of the cooling water channel with the distance between the surface of the circuit body and the surface of the printed circuit board.

[0006] However, the shape of the cooling water channel and the distance between the surface of the circuit body and the surface of the printed circuit board vary according to their respective tolerances during the manufacturing process. Therefore, it is difficult to match them exactly, and a certain degree of error occurs. Depending on the size of this error, the cooling water channel may not be able to be closely attached to the circuit body and the printed circuit board, resulting in a decrease in cooling performance. Furthermore, if an attempt is made to forcibly attach them to each other, excess stress may be generated in the circuit body, insulating plate, and printed circuit board, which may cause breakage or cracks.

[0007] The present invention has been made in consideration of the above-mentioned problems, and a main object of the present invention is to realize a power conversion device that can efficiently cool both a semiconductor element and a printed wiring board while improving reliability. [Means for solving the problem]

[0008] The power conversion device according to the present invention comprises a semiconductor package incorporating a semiconductor element, a printed wiring board incorporating a wiring layer connected to the semiconductor package and having a pair of opposing surfaces, a first heat dissipation member abutted against the heat dissipation surface of the semiconductor package via a first heat conductive member, and a second heat dissipation member abutted against the surface of the pair of surfaces of the printed wiring board that is formed on the same side as the heat dissipation surface of the semiconductor package via a second heat conductive member, wherein the first heat dissipation member and the second heat dissipation member are respectively attached in a state in which they are displaceable relative to each other, and the first heat conductive member and the second heat conductive member are arranged so as to partially overlap each other. Effect of the Invention

[0009] According to the present invention, it is possible to realize a power conversion device capable of efficiently cooling both a semiconductor element and a printed wiring board while improving reliability. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing a cross-sectional structure of a power conversion device according to a first embodiment of the present invention. [Diagram 2] FIG. 4 is a diagram showing a cross-sectional structure of a power conversion device according to a second embodiment of the present invention. [Diagram 3] FIG. 11 is a diagram showing a cross-sectional structure of a power conversion device according to a third embodiment of the present invention. [Figure 4] FIG. 11 is a diagram showing a cross-sectional structure of a power conversion device according to a fourth embodiment of the present invention. [Diagram 5] FIG. 11 is a diagram showing a cross-sectional structure of a power conversion device according to a fifth embodiment of the present invention. [Figure 6] FIG. 13 is a diagram showing a cross-sectional structure of a power conversion device according to a sixth embodiment of the present invention. [Figure 7] 4 is a cross-sectional view showing a first structural example of a first thermal conductive member. FIG. [Figure 8] 6 is a cross-sectional view showing a second structural example of the first thermal conductive member. FIG. [Figure 9] 11 is a cross-sectional view showing a third structural example of the first thermal conductive member. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and appropriate omissions and simplifications have been made for clarity of explanation. The present invention can be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

[0012] In order to facilitate understanding of the invention, the position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc. Therefore, the present invention is not necessarily limited to the position, size, shape, range, etc. disclosed in the drawings.

[0013] (First embodiment) Fig. 1 is a diagram showing a cross-sectional structure of a power converter according to a first embodiment of the present invention. The power converter 1 shown in Fig. 1 includes a plurality of semiconductor packages 10, a printed wiring board 20 having a plurality of holes on which the plurality of semiconductor packages 10 are mounted by fitting the semiconductor packages 10 into the respective holes, a first heat dissipation member 31 attached to a heat dissipation surface (the surface on the lower side in the figure) of each semiconductor package 10, a second heat dissipation member 32 attached to the printed wiring board 20, and a water channel cover 40 forming a water channel.

[0014] The semiconductor package 10 is configured by integrally molding a semiconductor element 11, a first conductor portion 12, and a second conductor portion 13 with resin. The semiconductor element 11 built into the semiconductor package 10 is configured using, for example, an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), and converts DC power into AC power by performing a switching operation in response to a gate signal input from a gate drive circuit (not shown). The semiconductor element 11 has electrodes on both sides, and the electrodes are joined to the first conductor portion 12 and the second conductor portion 13, respectively, via joining members 14, 15 such as solder, thereby electrically connecting the semiconductor element 11 to the first conductor portion 12 and the second conductor portion 13.

[0015] The printed wiring board 20 incorporates a plurality of wiring layers 21, and is joined to the first conductor portion 12 and the second conductor portion 13 via a joining member 22. In this way, each wiring layer 21 is electrically connected to the first conductor portion 12 or the second conductor portion 13.

[0016] The first heat dissipation member 31 is attached in contact with the heat dissipation surface of the semiconductor package 10 via the first heat conductive member 51. The first heat dissipation member 31 has heat dissipation fins on the surface opposite to the heat dissipation surface of the semiconductor package 10, and the heat dissipation fins are arranged in the water channel formed by the water channel cover 40, so that the first heat dissipation member 31 is cooled by the cooling water flowing in the water channel. As a result, heat generated by the switching operation of the semiconductor element 11 is dissipated to the cooling water via the first heat dissipation member 31. Note that the first heat dissipation member 31 is preferably made of a material having high thermal conductivity and water resistance, such as aluminum or copper.

[0017] The first thermally conductive member 51 is disposed between the semiconductor package 10 and the first heat dissipation member 31 in order to improve the insulation and heat dissipation properties between them. The first thermally conductive member 51 has a laminated structure made up of a plurality of layers.

[0018] The second heat dissipation member 32 is attached to the printed wiring board 20 in contact with one of a pair of surfaces that is formed on the same side as the heat dissipation surface of the semiconductor package 10 (the lower surface in the figure) via the second heat conductive member 52. The second heat dissipation member 32 forms part of the water channel together with the water channel cover 40, and is cooled by the cooling water flowing in the water channel while preventing leakage of the cooling water flowing in the water channel. As a result, heat generated by a current flowing in the wiring layer 21 in the printed wiring board 20 is dissipated to the cooling water via the second heat dissipation member 32.

[0019] The second thermally conductive member 52 is disposed between the printed wiring board 20 and the second heat dissipation member 32 in order to improve the heat dissipation between them. The second thermally conductive member 52 is formed using, for example, a heat dissipation sheet or the like.

[0020] 1, first heat conductive member 51 and second heat conductive member 52 are arranged to partially overlap each other. This ensures an insulation distance between printed wiring board 20 and first heat dissipation member 31, and improves the insulation of printed wiring board 20 against cooling water flowing around first heat dissipation member 31.

[0021] 1, the first heat dissipation member 31 and the second heat dissipation member 32 are arranged so as to partially overlap each other, and a seal member 33 is arranged in the overlapping portion. That is, the overlapping portions of the first heat dissipation member 31 and the second heat dissipation member 32 are in contact with each other via the seal member 33. The seal member 33 is made of a flexible and deformable member, such as a waterproof adhesive or a resin O-ring. This prevents the cooling water from leaking from between the first heat dissipation member 31 and the second heat dissipation member 32, and allows the first heat dissipation member 31 and the second heat dissipation member 32 to be displaced relative to each other, that is, the seal member 33 can absorb errors in the relative positional relationship between the first heat dissipation member 31 and the second heat dissipation member 32 by deformation of the seal member 33.

[0022] In addition, the first heat dissipation member 31 and the second heat dissipation member 32 may be arranged side by side with a gap between them so that they do not overlap each other, and a deformable seal member 33 may be sandwiched in the gap. Even in this case, the seal member 33 can prevent the cooling water from leaking from between the first heat dissipation member 31 and the second heat dissipation member 32, and the first heat dissipation member 31 and the second heat dissipation member 32 can be displaced relative to each other by the deformation of the seal member 33, thereby realizing a structure that can absorb errors in the relative positional relationship between them. In addition, as long as the first heat dissipation member 31 and the second heat dissipation member 32 are displaceable relative to each other, the first heat dissipation member 31 and the second heat dissipation member 32 can be attached to the heat dissipation surface of the semiconductor package 10 and the surface of the printed wiring board 20 by any method, respectively, to configure the power conversion device 1 having the structure shown in FIG. 1.

[0023] According to the first embodiment of the present invention described above, the power conversion device 1 includes a semiconductor package 10 incorporating a semiconductor element 11, a printed wiring board 20 incorporating a wiring layer 21 connected to the semiconductor package 10 and having a pair of surfaces facing each other, a first heat dissipation member 31 abutting against the heat dissipation surface of the semiconductor package 10 via a first heat conductive member 51, and a second heat dissipation member 32 abutting against the surface of the pair of surfaces of the printed wiring board 20 formed on the same side as the heat dissipation surface of the semiconductor package 10 via a second heat conductive member 52. The first heat dissipation member 31 and the second heat dissipation member 32 are attached in a state in which they can be displaced relative to each other, and the first heat conductive member 51 and the second heat conductive member 52 are arranged to partially overlap each other. As a result, even if there is an error in the distance between the heat dissipation surface of the semiconductor package 10 and the surface of the printed wiring board 20, the first heat dissipation member 31 and the second heat dissipation member 32 can be cooled by cooling water while ensuring the insulation of the printed wiring board 20 with the first heat dissipation member 31 and the second heat dissipation member 32 in close contact with them. Therefore, it is possible to realize a power conversion device 1 that can efficiently cool both the semiconductor element 11 and the printed wiring board 20. In addition, the second heat conductive member 52 functions as a support member for the first heat conductive member 51, which reduces deformation of the first heat dissipation member 31 and the first heat conductive member 51 and prevents cracking of the first heat conductive member 51.

[0024] Furthermore, according to the first embodiment of the present invention described above, the first heat dissipation member 31 and the second heat dissipation member 32 are disposed so as to partially overlap each other, and these portions abut against each other via the deformable sealing member 33. This makes it possible to easily realize a structure in which the first heat dissipation member 31 and the second heat dissipation member 32 are attached in abutment against the heat dissipation surface of the semiconductor package 10 and the printed wiring board 20, respectively, in a state in which they are relatively displaceable.

[0025] Second embodiment Fig. 2 is a diagram showing a cross-sectional structure of a power converter according to a second embodiment of the present invention. In this embodiment, an example in which the shape of the second heat dissipation member 32 is different from that of the power converter 1 of Fig. 1 described in the first embodiment will be described.

[0026] In this embodiment, the portion of the second heat dissipation member 32 that contacts the printed wiring board 20 via the second thermally conductive member 52 (the portion surrounded by the dotted line 32a in FIG. 2) protrudes toward the printed wiring board 20 further than the first heat dissipation member 31. As a result, the second heat dissipation member 32 is disposed closer to the printed wiring board 20 side than in the first embodiment, and as a result, the heat dissipation property of the printed wiring board 20 by the second heat dissipation member 32 is further improved.

[0027] According to the second embodiment of the present invention described above, the portion of second heat dissipation member 32 that contacts printed wiring board 20 via second thermally conductive member 52 protrudes toward the printed wiring board further than first heat dissipation member 31. This makes it possible to further improve the heat dissipation performance of printed wiring board 20.

[0028] (Third embodiment) Fig. 3 is a diagram showing a cross-sectional structure of a power converter according to a third embodiment of the present invention. In this embodiment, an example is described in which the structure of the overlapping portion between the first heat dissipation member 31 and the second heat dissipation member 32 is different from that of the power converter 1 of Fig. 1 described in the first embodiment. Note that Fig. 3 shows only the cross-sectional structure around one semiconductor package 10, and the other portions are omitted.

[0029] In this embodiment, the second heat dissipation member 32 partially overlaps with the first heat dissipation member 31 at a position closer to the printed wiring board 20 than the first heat dissipation member 31. In this overlapping portion, a seal member 33 is disposed between the first heat dissipation member 31 and the second heat dissipation member 32. This allows a structure in which the second heat dissipation member 32 and the water channel cover 40 fixed thereto are supported by the first heat dissipation member 31.

[0030] In this embodiment, a through hole 23 penetrating the multiple wiring layers 21 is provided in a portion of the printed wiring board 20 where the second heat dissipation member 32 is in contact with via the second thermally conductive member 52. In the through hole 23, a plating film is formed between each of the wiring layers 21, and the wiring layers 21 are electrically connected to each other by this plating film. This allows the heat of each of the wiring layers 21 to be dissipated from the through hole 23, thereby further improving the cooling efficiency of the printed wiring board 20.

[0031] (Fourth embodiment) Fig. 4 is a diagram showing a cross-sectional structure of a power converter according to a fourth embodiment of the present invention. In this embodiment, an example will be described in which a through hole 23 is formed in a printed wiring board 20 of the power converter 1 of Fig. 1 described in the first embodiment, as in the third embodiment. Note that Fig. 4 also shows only the cross-sectional structure around one semiconductor package 10, as in Fig. 3, and other portions are omitted.

[0032] In the present embodiment, similarly to the third embodiment, a through hole 23 penetrating the multiple wiring layers 21 is provided in a portion of the printed wiring board 20 where the second heat dissipation member 32 is in contact via the second thermally conductive member 52. This allows the heat of each wiring layer 21 to be dissipated from the through hole 23, thereby further improving the cooling efficiency of the printed wiring board 20.

[0033] Fifth embodiment Fig. 5 is a diagram showing a cross-sectional structure of a power converter according to a fifth embodiment of the present invention. In this embodiment, an example is described in which the printed wiring board 20 and the second heat dissipation member 32 are fixed by a fixing member 24 in the power converter 1 described in the fourth embodiment. Note that, in Fig. 5, as in Figs. 3 and 4, only the cross-sectional structure around one semiconductor package 10 is shown, and other portions are omitted.

[0034] In this embodiment, the printed wiring board 20 is fixed to the second heat dissipation member 32 via the second heat conductive member 52 by the fixing member 24 arranged adjacent to the through hole 23. The fixing member 24 is, for example, a screw, and is screwed into a screw hole formed in the second heat dissipation member 32 with the printed wiring board 20 and the second heat conductive member 52 sandwiched between the head of the fixing member 24 and the second heat dissipation member 32. As a result, the printed wiring board 20 is fixed to the second heat dissipation member 32 via the second heat conductive member 52, and the thickness of the second heat conductive member 52 can be adjusted by the tightening condition of the fixing member 24. Therefore, the printed wiring board 20 and the second heat dissipation member 32 can be more reliably brought into close contact with each other, and the heat of the wiring layer 21 near the through hole 23 can be transferred to the second heat dissipation member 32 via the fixing member 24 and dissipated from the second heat dissipation member 32. As a result, the heat dissipation property of the printed wiring board 20 can be further improved.

[0035] Sixth embodiment Fig. 6 is a diagram showing a cross-sectional structure of a power conversion device according to a sixth embodiment of the present invention. In this embodiment, an example will be described in which a capacitor 60 is connected to a printed wiring board 20 in the power conversion device 1 described in the fifth embodiment. Note that Fig. 6 shows only one semiconductor package 10 and the cross-sectional structure around the capacitor 60, and other parts are omitted.

[0036] In this embodiment, the printed wiring board 20 has another through hole 25 in addition to the aforementioned through hole 23 formed in the portion where the second heat dissipation member 32 is in contact. A terminal extending from the capacitor 60 is inserted into this through hole 25, so that the capacitor 60 is electrically connected to the printed wiring board 20. The capacitor 60 is provided in the power conversion device 1 in order to smooth the DC power input to the semiconductor element 11, for example.

[0037] The printed wiring board 20 has a wiring layer 21 at a position adjacent to the through hole 25, which is a connection point with the capacitor 60. This wiring layer 21 includes, for example, a positive wiring and a negative wiring that are connected to the positive side and the negative side of the capacitor 60, respectively. In this way, the inductance of the positive wiring and the negative wiring can be reduced while improving the heat dissipation properties thereof.

[0038] Next, the following first to third structural examples will be described with respect to the structure of first thermal conductive member 51 in each of the first to sixth embodiments described above.

[0039] (1st structure example) Fig. 7 is a cross-sectional view showing a first structural example of the first thermally conductive member 51. Fig. 7 shows an example of the cross-sectional structure of the first thermally conductive member 51 disposed between one semiconductor package 10 and the first heat dissipation member 31 in the power converter 1 described in each of the first to sixth embodiments.

[0040] In the first structural example, the first heat conducting member 51 has a structure in which a first layer 51a, a second layer 51b, and a third layer 51c are laminated in this order from the semiconductor package 10 side to the first heat dissipation member 31 side. The first layer 51a is formed using a thermal interface material (TIM) having flexibility and insulation, such as heat dissipation grease or gap filler. The second layer 51b is formed using an insulating ceramic plate or the like, for example, to improve the insulation between the semiconductor package 10 and the first heat dissipation member 31. The third layer 51c is formed using a TIM like the first layer 51a, but this may or may not have insulation. As a material having no insulation, for example, brazing material, solder, liquid metal, carbon sheet, etc. can be used for the third layer 51c.

[0041] In each of the first to sixth embodiments, by using the first thermal conduction member 51 of the first structural example, it is possible to improve the heat dissipation performance of the semiconductor element 11 built into the semiconductor package 10 while ensuring insulation between the semiconductor package 10 and the first heat dissipation member 31.

[0042] (Second structure example) Fig. 8 is a cross-sectional view showing a second structural example of the first thermally conductive member 51. Like Fig. 7, Fig. 8 also shows an example of the cross-sectional structure of the first thermally conductive member 51 disposed between one semiconductor package 10 and the first heat dissipation member 31 in the power converter 1 described in each of the first to sixth embodiments.

[0043] In the second structural example, the first thermal conductive member 51 has a laminated structure similar to that of the first structural example described in FIG. 7, except that the area of ​​the first layer 51a is smaller than the area of ​​the third layer 51c.

[0044] In each of the first to sixth embodiments, by using the first thermally conductive member 51 of the second structural example, it is possible to improve the heat dissipation of the semiconductor element 11 built into the semiconductor package 10 while ensuring insulation between the semiconductor package 10 and the first heat dissipation member 31, as in the first structural example. In addition, compared to the first structural example, the amount of TIM used in the first layer 51a can be reduced, thereby reducing costs and improving reliability.

[0045] (Third structure example) Fig. 9 is a cross-sectional view showing a third structural example of the first thermally conductive member 51. Like Fig. 7 and Fig. 8, Fig. 9 also shows an example of the cross-sectional structure of the first thermally conductive member 51 disposed between one semiconductor package 10 and the first heat dissipation member 31 in the power converter 1 described in each of the first to sixth embodiments.

[0046] In the third structural example, the first thermal conductive member 51 has only the first layer 51a and the second layer 51b, and does not have the third layer 51c. That is, in the third structural example, the first layer 51a is joined to the heat dissipation surface of the semiconductor package 10, and the second layer 51b is joined to the first heat dissipation member 31.

[0047] In each of the first to sixth embodiments, by using the first thermal conductive member 51 of the third structural example, the third layer 51c can be eliminated compared to the first and second structural examples, thereby achieving cost reduction and improved heat dissipation.

[0048] The present invention is not limited to the above-described embodiments, and various modifications are included. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and are not necessarily limited to those having all of the configurations described. In addition, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. In addition, it is possible to add, delete, or replace a part of the configuration of each embodiment with another configuration.

[0049] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0050] 1: power conversion device, 10: semiconductor package, 11: semiconductor element, 12: first conductor portion, 13: second conductor portion, 20: printed wiring board, 21: wiring layer, 23: through hole, 24: fixing member, 31: first heat dissipation member, 32: second heat dissipation member, 33: sealing member, 40: water channel cover, 51: first heat conduction member, 52: second heat conduction member

Claims

1. A semiconductor package having a semiconductor element built therein; a printed wiring board incorporating a wiring layer connected to the semiconductor package and having a pair of surfaces opposed to each other; a first heat dissipation member that is in contact with a heat dissipation surface of the semiconductor package via a first thermal conductive member; a second heat dissipation member that is in contact with one of the pair of surfaces of the printed wiring board that is formed on the same side as the heat dissipation surface of the semiconductor package via a second heat conductive member; the first heat dissipation member and the second heat dissipation member are attached in a state in which they can be displaced relative to each other, The first heat conducting member and the second heat conducting member are disposed so as to partially overlap each other. Power conversion equipment.

2. 2. The power conversion device according to claim 1, The first heat dissipation member and the second heat dissipation member are arranged so as to partially overlap each other, and the portions of the first heat dissipation member and the second heat dissipation member are in contact with each other via a deformable member. Power conversion equipment.

3. 2. The power conversion device according to claim 1, a portion of the second heat dissipation member that contacts the printed wiring board via the second thermal conductive member protrudes toward the printed wiring board more than the first heat dissipation member; Power conversion equipment.

4. 3. The power conversion device according to claim 2, the second heat dissipation member partially overlaps with the first heat dissipation member at a position closer to the printed wiring board than the first heat dissipation member; Power conversion equipment.

5. 2. The power conversion device according to claim 1, the printed wiring board has a through hole formed at a position where the printed wiring board abuts against the second heat dissipation member via the second heat conductive member; Power conversion equipment.

6. 6. The power conversion device according to claim 5, the printed wiring board is fixed to the second heat dissipation member via the second thermal conductive member by a fixing member disposed adjacent to the through hole; Power conversion equipment.

7. 2. The power conversion device according to claim 1, a capacitor connected to the printed wiring board; the printed wiring board has the wiring layer at a position adjacent to a connection point with the capacitor; Power conversion equipment.

8. 2. The power conversion device according to claim 1, The first heat dissipation member is formed by laminating a first layer made of a thermal interface material (TIM), a second layer made of an insulator, and a third layer made of the TIM. Power conversion equipment.

9. 9. The power conversion device according to claim 8, the first heat dissipation member is disposed such that the first layer is in contact with the heat dissipation surface of the semiconductor package and the third layer is in contact with the first thermal conduction member; The area of ​​the first layer is smaller than the area of ​​the third layer. Power conversion equipment.

10. 2. The power conversion device according to claim 1, The first heat dissipation member is formed by laminating a first layer made of a thermal interface material (TIM) and a second layer made of an insulator. Power conversion equipment.

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