Adhesive tape for circuit connection, adhesive reel, and method for manufacturing circuit connection structure

Abstract

To provide an adhesive tape for circuit connection capable of reducing the width of an adhesive film while sufficiently restraining deterioration in the efficiency of a circuit connection work, an adhesive reel having a reel body of the adhesive tape, and a method for manufacturing a circuit connection structure using the adhesive reel.SOLUTION: The adhesive film includes a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, the first adhesive layer is formed of a photocured product of a photo- and thermosetting composition containing conductive particles, and the second adhesive layer is formed of a thermosetting composition. When the width of the surface Sx of the adhesive film on the substrate side is represented by WX, and the width of the surface Sy of the substrate on the adhesive film side is represented by WY, the relationship WX<Wy is satisfied, both ends of the surface Sx in the width direction are located inside both ends of the surface Sy in the width direction, and are spaced apart from each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an adhesive tape for circuit connection, an adhesive reel, and a method for manufacturing a circuit connection structure. [Background technology]

[0002] Conventionally, various adhesive materials have been used to connect circuits. For example, adhesive films having anisotropic conductivity, in which conductive particles are dispersed in the adhesive, are used as adhesive materials for connecting a liquid crystal display and a tape carrier package (TCP), connecting a flexible printed circuit board (FPC) and a TCP, or connecting an FPC and a printed wiring board.

[0003] Usually, the adhesive film is formed on a substrate such as a polyethylene terephthalate (PET) film and cut into a strip (or tape) having a width suitable for the application, and is used in the form of an adhesive tape for circuit connection. The adhesive tape for circuit connection is also supplied as a wound body (reel body) wound around a core (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2003-34468 A Summary of the Invention [Problem to be solved by the invention]

[0005] When connecting a circuit, a process is performed in which the adhesive film side of the adhesive tape pulled out from the reel is attached to a panel or flexible substrate. At this time, the adhesive tape is pressed from the substrate side by a heated temporary pressure-bonding tool, but the adhesive components may seep out from the side of the adhesive film and contaminate the temporary pressure-bonding tool. Such contamination can cause foreign matter to get in and the transfer position of the adhesive film to shift, so a cushioning material is used to prevent contamination of the temporary pressure-bonding tool.

[0006] In the field of precision electronic devices, the density of circuits is increasing, and the electrode width and electrode spacing are becoming extremely narrow. There is a demand for narrowing the width of the adhesive film used in such circuit connections. However, if the width of the adhesive tape is narrowed, the adhesive component of the adhesive film is likely to seep out when pressure is applied with a temporary pressure bonding tool. This increases the frequency of replacing contaminated cushioning material, reducing the work efficiency of circuit connections.

[0007] Therefore, an object of the present invention is to provide an adhesive tape for circuit connection that can reduce the width of the adhesive film while sufficiently suppressing a decrease in the work efficiency of circuit connection, an adhesive reel equipped with the reel body, and a method for manufacturing a circuit connection structure using the adhesive reel. [Means for solving the problem]

[0008] The present invention provides the following inventions [1] to [8].

[0009] [1] A strip-shaped substrate and a strip-shaped adhesive film provided on one side of the substrate along the length direction of the substrate, the adhesive film including a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, the first adhesive layer being formed from a photocured product of a photo- and thermosetting composition containing conductive particles, the second adhesive layer being formed from a thermosetting composition, and a surface S of the adhesive film facing the substrate x Width of W X , the adhesive film side of the substrate S y Width of WY When W X <W y The relationship is satisfied, and the surface S x Both ends of the width direction of the surface S y and the two ends are spaced apart from each other. [2] W X W for Y Ratio of [W Y / W X ] is 1.06 to 34.5. [3] The adhesive tape for circuit connection according to [1] or [2] above, wherein the first adhesive layer is located on the substrate side. [4] The adhesive tape for circuit connection according to [1] or [2] above, wherein the second adhesive layer is located on the substrate side. [5] An adhesive reel comprising: a core; and the adhesive tape for circuit connection according to any one of [1] to [4] above wound around the core. [6] The adhesive reel according to [5] above, further comprising a pair of side plates disposed opposite both ends of the core so as to face each other. [7] The adhesive reel according to [5] or [6] above, wherein the adhesive tape for circuit connection is wound around the core so that the substrate faces the core and the adhesive film faces outward. [8] A method for producing a circuit connection structure, comprising a step of interposing the adhesive film in the adhesive tape unwound from an adhesive reel described in any one of [5] to [7] above between a first circuit member having a first electrode and a second circuit member having a second electrode, and thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other, the step including a step of laminating the adhesive tape, with a base material, to the first circuit member such that the adhesive film is in contact with the first circuit member, and a step of peeling off the base material of the adhesive tape attached to the first circuit member. Effect of the Invention

[0010] According to the above-mentioned adhesive tape for circuit connection [1], it is possible to reduce the width of the adhesive film while sufficiently suppressing the decrease in efficiency of circuit connection. The following actions are considered to be the reasons why such an effect is achieved. First, the surface S of the substrate y Both ends of the adhesive film are x By being located on the outside of both ends, even if the adhesive component seeps out from the end face of the adhesive film due to the pressure of the temporary pressure bonding tool, the adhesive component can be prevented from flowing around to the side opposite the adhesive film side of the substrate. In addition, since the adhesive film has a specific first adhesive layer and a specific second adhesive layer, it is easy to achieve both application properties and connection characteristics, making it difficult for the adhesive component to seep out during lamination. It is believed that these factors can highly suppress contamination of the temporary pressure bonding tool and the cushioning material.

[0011] According to the present invention, it is possible to provide an adhesive tape for circuit connection that can reduce the width of the adhesive film while sufficiently suppressing a decrease in the work efficiency of circuit connection, an adhesive reel equipped with the reel body of the adhesive tape, and a method for manufacturing a circuit connection structure using the adhesive reel.

[0012] As a means for adjusting the width of the adhesive film, there is a half-cut process in which, before the adhesive tape is attached to a panel or a flexible substrate, a jig such as a blade is used to make a cut only in the adhesive film without cutting the substrate of the adhesive tape. If such a process is performed during circuit connection, transfer defects are likely to occur when half-cut defects occur due to the influence of the mechanical difference of the half-cut device or the composition of the adhesive film, and the work efficiency of circuit connection decreases. In contrast, according to the adhesive tape for circuit connection of the present invention, since the width of the adhesive film is narrower than the substrate, the pressure of the half-cut blade applied to the adhesive film can be made larger, making it easier to make a sufficient cut without cutting the substrate, and therefore the occurrence of half-cut defects can be suppressed in the half-cut process described above.

[0013] In order to prevent the wound body from collapsing during storage or use, an adhesive reel is used in which a reel body is accommodated between the side plates of a reel member having a pair of side plates at both ends of a core. When connecting a circuit, the adhesive tape for circuit connection is used while being pulled out from the reel body, so a load is continuously applied to the adhesive tape for a long time. Such a load causes adhesive components to seep out from the end face of the adhesive film, and the adhesive components adhere to the side plates of the adhesive reel, which causes blocking. In particular, when the width of the tape is narrowed, the load applied to the adhesive tape becomes large, and the resin components of the adhesive film are more likely to seep out from the end face of the reel body, making the above-mentioned blocking more likely to occur.

[0014] The adhesive tape for circuit connection of the present invention, having the above-mentioned configuration, can prevent adhesive components from seeping out from the end faces of the adhesive film when wound around a core to form a reel body, from adhering to the side plates that hold the reel body, thereby sufficiently preventing blocking even when the width of the adhesive film is reduced.

[0015] Therefore, the adhesive reel of [6] above can suppress contamination of the temporary bonding tool and the cushioning material, and can also have sufficient blocking resistance, which allows the width of the adhesive film to be made smaller while still ensuring sufficient efficiency in circuit connection work. [Brief description of the drawings]

[0016] [Figure 1] 1A to 1C are schematic cross-sectional views showing one embodiment and another embodiment of an adhesive tape for circuit connection. [Diagram 2] 2 is a schematic cross-sectional view of the adhesive tape for circuit connection shown in FIG. 1(a). [Diagram 3] 2 is a schematic cross-sectional view of the adhesive tape for circuit connection shown in FIG. 1(b). [Figure 4] FIG. 2 is a perspective view of one embodiment of an adhesive reel. [Diagram 5] 5 is a cross-sectional view showing a schematic internal structure of the adhesive reel shown in FIG. 4. [Figure 6] 5 is a cross-sectional view showing a schematic structure in a cross section taken along line II in FIG. 4. [Figure 7] 3A to 3C are schematic cross-sectional views showing steps of a method for producing a circuit connection structure using the tape shown in FIG. 2. [Figure 8] FIG. 8 is a schematic cross-sectional view showing a step subsequent to that shown in FIG. [Figure 9] 9 is a schematic cross-sectional view showing a circuit connection structure obtained through the steps of FIG. 8. [Figure 10] 4A to 4C are schematic cross-sectional views showing steps of a method for producing a circuit connection structure using the tape shown in FIG. [Figure 11] 11 is a schematic cross-sectional view showing a circuit connection structure obtained through the steps of FIG. 10. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] In this specification, the numerical range indicated by "~" indicates a range including the numerical values ​​described before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described in stages in this specification, the upper limit or lower limit of a certain stage of the numerical range may be replaced with the upper limit or lower limit of the numerical range of another stage. In the numerical ranges described in this specification, the upper limit or lower limit of the numerical range may be replaced with a value shown in the examples. In addition, the upper limit and lower limit values ​​described individually can be arbitrarily combined. In this specification, "(meth)acrylate" means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as "(meth)acryloyl". In addition, "(poly)" means both the case with and without the prefix "poly". In addition, "A or B" may include either A or B, or may include both. In addition, the materials exemplified below may be used alone or in combination of two or more types, unless otherwise specified. When a plurality of substances corresponding to each component are present in the composition, the content of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified.

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings where necessary. However, the present invention is not limited to the following embodiments.

[0019] <Adhesive tape for circuit connection> The adhesive tape for circuit connection of this embodiment comprises a band-shaped substrate and a band-shaped adhesive film provided on one side of the substrate along the longitudinal direction of the substrate, the adhesive film including a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, the first adhesive layer being formed from a photocured product of a photo- and thermosetting composition containing conductive particles, the second adhesive layer being formed from a thermosetting composition, and the substrate-side surface S of the adhesive film being a x Width of W X , the adhesive film side of the substrate S y Width of W Y When W X <W y The relationship is satisfied, and the surface S x Both ends of the width direction of the surface S y The two ends are located inside each other in the width direction, and the ends are spaced apart from each other.

[0020] The adhesive tape for circuit connection of this embodiment is W X W for Y Ratio of [W Y / W X From the viewpoints of suppressing contamination of the temporary pressure bonding tool and the cushioning material and suppressing blocking resistance and collapse of the reel body, it may be 1.06 to 34.5, and from the viewpoint of increasing the density of the circuits, it may be 1.76 to 35.34, 2.26 to 28.66, or 3.50 to 22.00.

[0021] The total width of the exposed surface on the main surface of the substrate on the adhesive film side [W Y -W X ] may be 0.6 to 10.0 mm, 1.0 to 8.0 mm, or 2.0 to 6.0 mm. Y -W XWhen the value of [R] is within the above range, contamination of the temporary pressure bonding tool or the cushioning material and the occurrence of blocking can be easily suppressed, and the width of the adhesive film can be made smaller.

[0022] The exposed surfaces on the main surface of the substrate facing the adhesive film are located outside the pair of side surfaces of the adhesive film, and the widths of the two exposed surfaces may be the same or different. x One end in the width direction (the end on the substrate side on one side of the adhesive film) and surface S y The distance W between one end of the width direction (the end of the adhesive film on one side of the substrate) Z1 and surface S x The other end in the width direction (the end on the substrate side on the other side of the adhesive film) and the surface S y Distance W between the other end in the width direction (the end of the adhesive film on the other side of the substrate) Z2 may be the same or different.

[0023] W Z1 and W Z2 If the same, they are 1.38 to 17.67W. X , 1.63~14.33W X , or 2.25~11.00W X It may be. W Z1 and W Z2 If different, the smaller one is 1.38~17.67W X , 1.63~14.33W X , or 2.25~11.00W X may be also possible.

[0024] Adhesive film substrate side surface S x Width W X The width can be appropriately set depending on the application, and may be, for example, 0.3 to 10.0 mm, 0.3 to 2.5 mm, or 0.3 to 1.5 mm. X may be 0.3 to 0.8 mm, 0.4 to 0.6 mm, or 0.4 to 0.5 mm.

[0025] Adhesive film side of the substrate S y Width W Y The width can be appropriately set depending on the application, and may be, for example, 0.9 to 20 mm, 0.6 to 15.0 mm, 0.8 to 7.5 mm, or 0.9 to 6.5 mm. Y may be 0.6 to 6.2 mm, 0.6 to 6.0 mm, or 0.6 to 5.8 mm.

[0026] The side surface of the adhesive film may be perpendicular to the main surface of the adhesive film or may be at a specific angle to the main surface of the adhesive film, but may also be perpendicular to the main surface of the adhesive film.

[0027] The side surface of the substrate may be perpendicular to the main surface of the substrate or may form a predetermined angle therewith, but may also be perpendicular to the main surface of the substrate.

[0028] The thickness of the adhesive film may be, for example, 5 to 100 μm, 8 to 40 μm, or 10 to 30 μm.

[0029] The thickness of the substrate may be, for example, 25 to 100 μm, 38 to 75 μm, or 38 to 50 μm.

[0030] The length of the adhesive tape for circuit connection may be, for example, 1 to 1000 m, 10 to 1000 m, 30 to 500 m, 50 to 300 m, or 100 to 200 m.

[0031] Fig. 1 is a schematic cross-sectional view showing one embodiment and another embodiment of the circuit connection adhesive tape of the present embodiment. The view shown in Fig. 1 is a cross-section in a plane perpendicular to the length direction of the tape. Fig. 2 is a schematic cross-sectional view of the circuit connection adhesive tape shown in Fig. 1(a), showing the configuration of the part where the adhesive film and the substrate are laminated. Fig. 3 is a schematic cross-sectional view of the circuit connection adhesive tape shown in Fig. 1(b), showing the configuration of the part where the adhesive film and the substrate are laminated.

[0032] An adhesive tape 50 for circuit connection (hereinafter also simply referred to as "adhesive tape 50") shown in Fig. 1(a) comprises a peelable strip-shaped substrate 10 and a strip-shaped adhesive film 20 provided on the substrate 10. The adhesive film 20 has a multilayer structure including, from the substrate side, a first adhesive layer 22 and a second adhesive layer 24 in this order.

[0033] In the adhesive tape 50, the side SS of the substrate 10 11 ,SS 12 is perpendicular to the main surface of the substrate, and the side surface SS of the adhesive film 20 21 ,SS 22 is perpendicular to the main surface of the adhesive film. 20 Both ends of the width direction of EP 21 ,EP 22 The adhesive film side surface S of the substrate 10 10 Width direction both ends EP 11 ,EP 12 and both ends are spaced apart from each other.

[0034] The adhesive tape 50 is formed on the substrate side surface S of the adhesive film 20. 20 Width W2 (EP shown in FIG. 1(a) 21 and EP 22 (distance from the adhesive film) and the surface S of the substrate 10 on the adhesive film side 10 Width W1 (EP 11 and EP 12 The distance between the Y and W X The above conditions may be satisfied.

[0035] In addition, the surface S exposed on the main surface of the base material 10 on the adhesive film 20 side a1 ,S a2 The total width of (W a1 +W a2 ) (i.e., W1-W2) is the above-mentioned [W Y -W X ] may be satisfied.

[0036] In the adhesive tape 50, the surface S20 One end in the width direction (one side SS of the adhesive film 20) 21 (End of the substrate side at EP 21 and surface S 10 One end in the width direction (one side surface SS of the substrate 10) 11 (Adhesive film side edge) EP 11 Distance from W a1 and surface S 20 The other end in the width direction (the other side SS of the adhesive film 20) 22 (End of the substrate side at EP 22 and surface S 10 The other end in the width direction (the other side surface SS of the substrate 10) 12 (adhesive film side edge) EP 12 Distance from W a2 may be the same or different. a1 and W a2 is the above-mentioned W Z1 and W Z2 The above conditions may be satisfied.

[0037] The circuit connection adhesive tape 50 can be combined with a manufacturing method in which, for example, an adhesive film is first attached to a flexible substrate. In this case, by attaching the side of the adhesive film opposite to the side where the conductive particles are unevenly distributed to the flexible substrate, it becomes easy to attach the adhesive film only to the circuit portion to be connected to the liquid crystal display side. In addition, since the adhesive tape 50 has blocking resistance and the width of the adhesive film can be reduced, it is possible to suppress the occurrence of back transfer, in which the adhesive film is transferred to the back surface of the substrate when the adhesive tape is pulled out from the reel body.

[0038] 1(b) includes a strip-shaped substrate 10 that can be peeled off, and a strip-shaped adhesive film 30 that is provided on the substrate 10. The adhesive film 30 has a multilayer structure that includes a first adhesive layer 32 and a second adhesive layer 34 in this order from the side opposite the substrate.

[0039] In the adhesive tape 52, the side SS of the substrate 10 11 ,SS 12 is perpendicular to the main surface of the substrate, and the side surface SS of the adhesive film 30 31 ,SS 32 is perpendicular to the main surface of the adhesive film. 30 Width direction both ends EP 31 ,EP 32 The adhesive film side surface S of the substrate 10 10 Width direction both ends EP 11 ,EP 12 and both ends are spaced apart.

[0040] The adhesive tape 52 is attached to the substrate side surface S of the adhesive film 30. 30 Width W3 (EP shown in FIG. 1(b) 31 and EP 32 (distance from the adhesive film) and the surface S of the substrate 10 on the adhesive film side 10 Width W1 (EP shown in FIG. 1(b) 11 and EP 12 The distance between the Y and W X The above conditions may be satisfied.

[0041] In addition, the surface S exposed on the main surface of the base material 10 on the adhesive film 30 side b1 ,S b2 The total width of (W b1 +W b2 ) (i.e., W1-W3) is the above-mentioned [W Y -W X ] may be satisfied.

[0042] In the adhesive tape 52, the surface S 30 One end in the width direction (one side SS of the adhesive film 30) 31 (End of the substrate side at EP 31 and surface S 10 One end in the width direction (one side surface SS of the substrate 10) 11 (adhesive film side edge) EP 11 Distance from W b1 and surface S 30The other end in the width direction (the other side SS of the adhesive film 30) 32 (End of the substrate side at EP 32 and surface S 10 The other end in the width direction (the other side surface SS of the substrate 10) 12 (adhesive film side edge) EP 12 Distance from W b2 may be the same or different. b1 and W b2 is the above-mentioned W Z1 and W Z2 The above conditions may be satisfied.

[0043] (base material) The substrate 10 may be, for example, a substrate (e.g., a film) made of polyolefins such as oriented polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyethylene and polypropylene, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, or the like. The substrate may contain any filler. The surface of the substrate may be subjected to a release treatment, plasma treatment, or the like. The substrate may be peeled off after the adhesive film is transferred to the circuit member.

[0044] (First adhesive layer) The first adhesive layers 22, 32 may be formed from a cured product (photocured product) of a photo- and thermosetting composition. The photo- and thermosetting composition may contain (A) a polymerizable compound (hereinafter also referred to as "(A) component"), (B) a photopolymerization initiator (hereinafter also referred to as "(B) component"), (C) a thermal polymerization initiator (hereinafter also referred to as "(C) component"), and (D) conductive particles (hereinafter also referred to as "(D) component").

[0045] The first adhesive layer 22, 32 is obtained, for example, by irradiating a layer made of a photo- and thermosetting composition with light energy to polymerize the component (A) and cure (photocure) the photo- and thermosetting composition. That is, the first adhesive layer 22, 32 may be composed of, for example, conductive particles 4 and an adhesive component 5 obtained by curing the components of the photo- and thermosetting composition other than the conductive particles. The adhesive component may include, for example, a polymer of the component (A) and a component (C).

[0046] [Component (A): Polymerizable compound] The component (A) is, for example, a compound that is polymerized by a radical, cation, or anion generated by a photopolymerization initiator upon irradiation with light (e.g., ultraviolet light). The component (A) may be any of a monomer, oligomer, and polymer. As the component (A), one type of compound may be used alone, or multiple types of compounds may be used in combination.

[0047] The (A) component has at least one polymerizable group. From the viewpoint of further improving the effect of reducing the connection resistance and achieving better connection reliability, the polymerizable group may be a radically polymerizable group that reacts with a radical. That is, the (A) component may be a radically polymerizable compound. Examples of the radically polymerizable group include a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, a (meth)acryloyl group, and a maleimide group.

[0048] The number of polymerizable groups in the (A) component may be 2 or more from the viewpoint of easily obtaining the physical properties and crosslink density necessary for reducing the connection resistance after polymerization, and may be 10 or less from the viewpoint of suppressing the cure shrinkage during polymerization. Suppressing the cure shrinkage during polymerization is preferable in that a uniform and stable film (first adhesive layer) is obtained after light irradiation. In this embodiment, in order to balance the crosslink density and the cure shrinkage, a polymerizable compound having the number of polymerizable groups within the above range may be used, and then a polymerizable compound having the number of polymerizable groups outside the above range may be additionally used.

[0049] Specific examples of the component (A) include (meth)acrylate compounds, maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadimide derivatives, natural rubber, isoprene rubber, butyl rubber, nitrile rubber, butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, and carboxylated nitrile rubber.

[0050] Examples of (meth)acrylate compounds include epoxy (meth)acrylate, (poly)urethane (meth)acrylate, methyl (meth)acrylate, polyether (meth)acrylate, polyester (meth)acrylate, polybutadiene (meth)acrylate, silicone acrylate, ethyl (meth)acrylate, 2-cyanoethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-hexyl (meth)acrylate, and 2-methylethyl (meth)acrylate. Acrylate, 2-hydroxyethyl (meth)acrylate, isopropyl (meth)acrylate, hydroxypropyl (meth)acrylate, isobutyl (meth)acrylate, isobornyl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, n-lauryl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-(meth)acryloyloxyethyl phosphate, N,N-dimethyl dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, polyethylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, neo Pentyl glycol di(meth)acrylate, pentaerythritol (meth)acrylate, dipentaerythritol hexa(meth)acrylate, isocyanuric acid modified bifunctional (meth)acrylate, isocyanuric acid modified trifunctional (meth)acrylate, tricyclodecanyl acrylate, dimethylol-tricyclodecane diacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane, 2,Examples include 2-di(meth)acryloyloxydiethyl phosphate and 2-(meth)acryloyloxyethyl acid phosphate.

[0051] Examples of the maleimide compound include 1-methyl-2,4-bismaleimidebenzene, N,N'-m-phenylene bismaleimide, N,N'-p-phenylene bismaleimide, N,N'-m-toluylene bismaleimide, N,N'-4,4-biphenylene bismaleimide, N,N'-4,4-(3,3'-dimethyl-biphenylene) bismaleimide, N,N'-4,4-(3,3'-dimethyldiphenylmethane) bismaleimide, N,N'-4,4-(3,3'-diethyldiphenylmethane) bismaleimide, N,N'-4,4-diphenylmethane bismaleimide, and N,N'-4,4-diphenylpropane. Examples of such maleimide include pan bismaleimide, N,N'-4,4-diphenyl ether bismaleimide, N,N'-3,3-diphenyl sulfone bismaleimide, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-s-butyl-4-8(4-maleimidophenoxy)phenyl)propane, 1,1-bis(4-(4-maleimidophenoxy)phenyl)decane, 4,4'-cyclohexylidene-bis(1-(4maleimidophenoxy)-2-cyclohexyl)benzene, and 2,2'-bis(4-(4-maleimidophenoxy)phenyl)hexafluoropropane.

[0052] Examples of the vinyl ether compound include diethylene glycol divinyl ether, dipropylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, and trimethylolpropane trivinyl ether.

[0053] Examples of the allyl compound include 1,3-diallyl phthalate, 1,2-diallyl phthalate, and triallyl isocyanurate.

[0054] From the viewpoint of achieving an excellent balance between the curing reaction rate and the physical properties after curing, the component (A) may contain a (meth)acrylate compound.

[0055] The (A) component may contain a (poly)urethane (meth)acrylate compound from the viewpoint of achieving both cohesive force for reducing connection resistance and elongation for improving adhesive force, and from the viewpoint of obtaining better transferability and better trapping ability of conductive particles onto electrodes in the configuration of the adhesive tape 50, and from the viewpoint of obtaining better transferability and better adhesive properties in the configuration of the adhesive tape 52. The content of the (poly)urethane (meth)acrylate compound may be, for example, 30 mass% or more, 50 mass% or more, or 70 mass% or more, and may be 96 mass% or less, 93 mass% or less, or 90 mass% or less, or may be 30 to 96 mass%, 50 to 93 mass%, or 70 to 90 mass%, based on the total mass of the (A) component, from the viewpoint of obtaining better transferability and better trapping ability of conductive particles onto electrodes in the configuration of the adhesive tape 50, and from the viewpoint of obtaining better transferability and better adhesive properties in the configuration of the adhesive tape 52.

[0056] The (A) component may contain a (meth)acrylate compound having a high Tg skeleton such as a tricyclodecane skeleton from the viewpoint of improving the cohesive force and further reducing the connection resistance, and from the viewpoint of obtaining better transferability and better trapping ability of the conductive particles onto the electrode in the configuration of the adhesive tape 50, and from the viewpoint of obtaining better transferability in the configuration of the adhesive tape 52. The content of the (meth)acrylate compound having a high Tg skeleton may be, for example, 3 mass% or more, 6 mass% or more, or 9 mass% or more, based on the total mass of the (A) component, from the viewpoint of further improving the cohesive force and further reducing the connection resistance, and from the viewpoint of obtaining better transferability and better trapping ability of the conductive particles onto the electrode in the configuration of the adhesive tape 50, and from the viewpoint of obtaining better transferability in the configuration of the adhesive tape 52.

[0057] From the viewpoint of achieving a balance between crosslink density and cure shrinkage, further reducing connection resistance, and improving connection reliability, as well as from the viewpoint of obtaining better transferability and better capture of conductive particles onto electrodes in the configuration of adhesive tape 50, and from the viewpoint of obtaining better transferability in the configuration of adhesive tape 52, component (A) may contain a compound (e.g., polyurethane (meth)acrylate) in which a polymerizable group such as a vinyl group, an allyl group, or a (meth)acryloyl group has been introduced at the end or side chain of a thermoplastic resin such as an acrylic resin, a phenoxy resin, or a polyurethane resin.

[0058] The weight average molecular weight of the compound having a polymerizable group introduced into the end or side chain of the thermoplastic resin may be, for example, 3000 or more, 5000 or more, or 10,000 or more, from the viewpoint of excellent balance between crosslink density and cure shrinkage. The weight average molecular weight of the compound having a polymerizable group introduced into the end or side chain of the thermoplastic resin may be, for example, 1,000,000 or less, 500,000 or less, or 250,000 or less, from the viewpoint of excellent compatibility with other components (for example, component (E)). The weight average molecular weight in this specification refers to a value measured by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene.

[0059] The content of the compound having a radical polymerizable group introduced at the end or side chain of the thermoplastic resin may be, for example, 30 mass % or more, 50 mass % or more, or 70 mass % or more, and may be 96 mass % or less, 93 mass % or less, or 90 mass % or less, or may be 30 to 96 mass %, 50 to 93 mass %, or 70 to 90 mass %, based on the total mass of component (A), from the viewpoints of further reducing the connection resistance and further improving the connection reliability, and of obtaining better blocking resistance in the configuration of adhesive tape 50, and of obtaining better transferability in the configuration of adhesive tape 52.

[0060] The component (A) may contain a (meth)acrylate compound (a (meth)acrylate compound having a phosphate ester structure) represented by the following formula (1). In this case, the adhesive strength to the surface of an inorganic material (metal, etc.) is improved, making it suitable for bonding electrodes (for example, circuit electrodes). [ka] In formula (1), n ​​represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.

[0061] The (meth)acrylate compound represented by formula (1) can be obtained, for example, by reacting phosphoric anhydride with 2-hydroxyethyl (meth)acrylate. Specific examples of the (meth)acrylate compound represented by formula (1) include mono(2-(meth)acryloyloxyethyl) acid phosphate, di(2-(meth)acryloyloxyethyl) acid phosphate, etc.

[0062] From the viewpoint of further improving the adhesive force to the surface of an inorganic material (such as a metal) and further improving the adhesive strength between electrodes (for example, between circuit electrodes), the content of the (meth)acrylate compound represented by formula (1) may be, for example, 0.1 mass % or more, 0.5 mass % or more, or 1 mass % or more, and may be 20 mass % or less, 10 mass % or less, or 5 mass % or less, or may be 0.1 to 20 mass %, 0.5 to 10 mass %, or 1 to 5 mass %, based on the total mass of the component (A).

[0063] The content of the (A) component may be, for example, 5% by mass or more, 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of easily obtaining a crosslink density necessary for further reducing the connection resistance and further improving the connection reliability, and from the viewpoint of further suppressing the flow of the conductive particles. The content of the (A) component may be, for example, 90% by mass or less, 80% by mass or less, 70% by mass or less, or 60% by mass or less based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of suppressing cure shrinkage during polymerization, and further obtaining better transferability and better capture of the conductive particles onto the electrode in the configuration of the adhesive tape 50, and from the viewpoint of obtaining better transferability in the configuration of the adhesive tape 52. From these viewpoints, the content of the (A) component may be, for example, 5 to 90 mass%, 10 to 80 mass%, 20 to 70 mass%, 30 to 60 mass%, or 40 to 60 mass%, based on the total amount of components other than the conductive particles in the photo- and thermosetting composition.

[0064] [Component (B): Photopolymerization initiator] The component (B) is a photopolymerization initiator (photoradical polymerization initiator, photocationic polymerization initiator, or photoanionic polymerization initiator) that generates radicals, cations, or anions upon irradiation with light having a wavelength in the range of 150 to 750 nm, preferably light having a wavelength in the range of 254 to 405 nm, and more preferably light having a wavelength of 365 nm (e.g., ultraviolet light). The component (B) may be a photoradical polymerization initiator from the viewpoint of easier curing at low temperature in a short time. As the component (B), one type of compound may be used alone, or multiple types of compounds may be used in combination.

[0065] Photoradical polymerization initiators are decomposed by light to generate free radicals. In other words, photoradical polymerization initiators are compounds that generate radicals by applying light energy from the outside. Examples of photoradical polymerization initiators include photopolymerization initiators having an oxime ester structure, a bisimidazole structure, an acridine structure, an α-aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyl dimethyl ketal structure, an α-hydroxyalkylphenone structure, and the like.

[0066] As component (B), a photopolymerization initiator having a structure represented by the following formula (I) may be used from the viewpoints of suppressing the flow of conductive particles, obtaining better blocking resistance in the configuration of adhesive tape 50, and further improving the effect of suppressing peeling after transfer in the configuration of adhesive tape 52. The photopolymerization initiator may have a plurality of structures represented by the above formula (I). [ka]

[0067] The structure represented by the above formula (I) may be an oxime ester structure, a bisimidazole structure, or an acridine structure. That is, the photo- and thermosetting composition may contain a photopolymerization initiator having at least one structure selected from the group consisting of an oxime ester structure, a bisimidazole structure, and an acridine structure as the structure represented by the above formula (I). Among these, when a photopolymerization initiator having an oxime ester structure is used, there is a tendency that the effect of suppressing the flow of the conductive particles, the blocking resistance in the configuration of the adhesive tape 50, and the effect of suppressing peeling after transfer in the configuration of the adhesive tape 52 are further improved.

[0068] Among compounds having an oxime ester structure, when a compound having a structure represented by the following formula (VI) is used, the above effect tends to be more pronounced. [ka] In formula (VI), R 11 , R 12 and R 13 each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an organic group containing an aromatic hydrocarbon group.

[0069] Specific examples of compounds having an oxime ester structure include 1-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-o-benzoyloxime, 1,3-diphenylpropanetrione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(o-benzoyl)oxime, 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime), and the like.

[0070] Examples of compounds having a bisimidazole structure include 2,4,5-triarylimidazole dimers such as 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(m-methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-phenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4-di(p-methoxyphenyl)-5-phenylimidazole dimer, and 2-(2,4-dimethoxyphenyl)-4,5-diphenylimidazole dimer.

[0071] Examples of compounds having an acridine structure include 9-phenylacridine and 1,7-bis(9,9'-acridinyl)heptane.

[0072] The content of the photopolymerization initiator having the structure represented by the above formula (I) may be, for example, 0.1 mass% or more, 0.3 mass% or more, 0.45 mass% or more, 0.55 mass% or more, or 0.85 mass% or more based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of further improving the flow suppression effect of the conductive particles. The content of the photopolymerization initiator having the structure represented by the above formula (I) may be, for example, 1.2 mass% or less, 0.9 mass% or less, or 0.6 mass% or less based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of further improving the blocking resistance in the configuration of the adhesive tape 50, and from the viewpoint of further improving the effect of suppressing peeling after transfer in the configuration of the adhesive tape 52. From these viewpoints, the content of the photopolymerization initiator having the structure represented by the above formula (I) may be, for example, 0.1 to 1.2 mass%, 0.3 to 1.2 mass%, 0.45 to 0.9 mass%, or 0.45 to 0.6 mass% based on the total amount of components other than the conductive particles in the photo- and thermosetting composition.

[0073] The content of the (B) component (total content of photopolymerization initiators) may be, for example, 0.3 mass% or more, 0.45 mass% or more, 0.55 mass% or more, or 0.85 mass% or more based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of further improving the effect of suppressing the flow of the conductive particles. The content of the (B) component may be, for example, 1.2 mass% or less, 0.9 mass% or less, or 0.6 mass% or less based on the total amount of components other than the conductive particles in the photo- and thermosetting composition, from the viewpoint of further improving the blocking resistance in the configuration of the adhesive tape 50, and from the viewpoint of further improving the effect of suppressing peeling after transfer in the configuration of the adhesive tape 52. From these viewpoints, the content of the (B) component may be, for example, 0.3 to 1.2 mass%, 0.45 to 0.9 mass%, or 0.45 to 0.6 mass%, based on the total amount of components other than the conductive particles in the photo- and thermosetting composition.

[0074] [Component (C): Thermal polymerization initiator] The component (C) may be a thermal polymerization initiator that generates radicals, cations, or anions by heat (thermal radical polymerization initiator, thermal cationic polymerization initiator, or thermal anionic polymerization initiator). From the viewpoint of further improving the effect of reducing connection resistance and achieving better connection reliability, the component (C) may be a thermal radical polymerization initiator. As the component (C), one type of compound may be used alone, or multiple types of compounds may be used in combination.

[0075] The thermal radical polymerization initiator decomposes by heat to generate free radicals. That is, the thermal radical polymerization initiator is a compound that generates radicals by applying thermal energy from the outside. The thermal radical polymerization initiator can be arbitrarily selected from conventionally known organic peroxides and azo compounds. The thermal radical polymerization initiator may be an organic peroxide from the viewpoint of further improving the effect of suppressing the flow of the conductive particles and the effect of suppressing peeling after transfer, and may be an organic peroxide having a one-minute half-life temperature of 90 to 175°C and a weight average molecular weight of 180 to 1000 from the viewpoint of improving stability, reactivity and compatibility. When the one-minute half-life temperature of the organic peroxide is within the above range, the storage stability tends to be further excellent, and sufficiently high radical polymerizability can be obtained, so that curing can be performed in a short time.

[0076] Specific examples of component (C) include 1,1,3,3-tetramethylbutyl peroxyneodecanoate, di(4-t-butylcyclohexyl) peroxydicarbonate, di(2-ethylhexyl) peroxydicarbonate, cumyl peroxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxyneodecanoate, and t-butyl peroxypi. Valate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneoheptanoate, t-amylperoxy-2-ethylhexanoate, di-t-butylperoxyhexahydroterephthalate, t-amylperoxy-3,5,5 -Trimethylhexanoate, 3-hydroxy-1,1-dimethylbutyl peroxyneodecanoate, t-amyl peroxyneodecanoate, di(3-methylbenzoyl) peroxide, dibenzoyl peroxide, di(4-methylbenzoyl) peroxide, t-hexylperoxyisopropyl monocarbonate, t-butylperoxymaleate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5 -Dimethyl-2,5-di(3-methylbenzoylperoxy)hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butyl peroxybenzoate, dibutyl peroxytrimethyladipate, t-amyl peroxy normal octoate, t-amyl peroxy isononanoate, t-amyl peroxybenzoate, and other organic peroxides;Examples of azo compounds include 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis(1-acetoxy-1-phenylethane), 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 4,4'-azobis(4-cyanovaleric acid), and 1,1'-azobis(1-cyclohexanecarbonitrile).

[0077] The content of the (C) component may be, for example, 0.1% by mass or more, 0.5% by mass or more, or 1% by mass or more based on the total amount of the adhesive components (components other than the conductive particles in the cured product of the photo- and thermosetting composition) from the viewpoint of excellent fast curing properties, and further improvement in the effect of suppressing the flow of the conductive particles and the effect of suppressing peeling after transfer. From the viewpoint of pot life, the content of the (C) component may be, for example, 20% by mass or less, 10% by mass or less, or 5% by mass or less based on the total amount of the adhesive components (components other than the conductive particles in the cured product of the photo- and thermosetting composition). The content of the (C) component based on the total amount of the components other than the conductive particles in the photo- and thermosetting composition may be the same as the above range, and the content of the (C) component based on the total amount of the components other than the conductive particles in the first adhesive layer may also be the same as the above range.

[0078] [(D) Component: Conductive particles] The component (D) is not particularly limited as long as it is a particle having electrical conductivity, and may be a metal particle composed of a metal such as Au, Ag, Ni, Cu, or solder, or a conductive carbon particle composed of conductive carbon. The component (D) may be a coated conductive particle having a core containing non-conductive glass, ceramic, plastic (polystyrene, etc.), and a coating layer containing the above metal or conductive carbon and coating the core. Among these, when using metal particles formed of a heat-fusible metal, or coated conductive particles having a core containing a plastic and a coating layer containing a metal or conductive carbon and coating the core, it becomes easy to deform the cured product of the photo- and thermosetting composition by heating or pressure. Therefore, when electrically connecting electrodes to each other, the contact area between the electrodes and the component (D) can be increased, and the electrical conductivity between the electrodes can be further improved.

[0079] The (D) component may be an insulating coated conductive particle comprising the above-mentioned metal particle, conductive carbon particle, or coated conductive particle, and an insulating layer containing an insulating material such as resin and coating the surface of the particle. When the (D) component is an insulating coated conductive particle, even if the content of the (D) component is high, the particle surface is coated with resin, so that the occurrence of a short circuit due to contact between the (D) components can be suppressed, and the insulation between adjacent electrode circuits can also be improved. The (D) component is used as one type of the above-mentioned various conductive particles alone or in combination of two or more types.

[0080] The maximum particle size of component (D) must be smaller than the minimum interval between the electrodes (the shortest distance between adjacent electrodes). From the viewpoint of excellent dispersibility and electrical conductivity, the maximum particle size of component (D) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more. From the viewpoint of excellent dispersibility and conductivity, the maximum particle size of the (D) component may be 50 μm or less, 30 μm or less, or 20 μm or less. From these viewpoints, the maximum particle size of the (D) component may be 1.0 to 50 μm, 2.0 to 30 μm, or 2.5 to 20 μm. In this specification, the particle size of 300 arbitrary conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is defined as the maximum particle size of the (D) component. Note that, when the (D) component is not spherical, such as having protrusions, the particle size of the (D) component is defined as the diameter of a circle circumscribing the conductive particle in the SEM image.

[0081] From the viewpoint of excellent dispersibility and conductivity, the average particle size of the (D) component may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more. From the viewpoint of excellent dispersibility and conductivity, the average particle size of the (D) component may be 50 μm or less, 30 μm or less, or 20 μm or less. From these viewpoints, the average particle size of the (D) component may be 1.0 to 50 μm, 2.0 to 30 μm, or 2.5 to 20 μm. In this specification, the particle size of 300 arbitrary conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the particle sizes obtained is defined as the average particle size.

[0082] The component (D) may be uniformly dispersed in the first adhesive layers 22 and 32. The particle density of the component (D) in the first adhesive layers 22 and 32 is set to 100 pcs / mm from the viewpoint of easily obtaining a stable connection resistance. 2 It may be more than 1000pcs / mm 2 More than 2000pcs / mm 2 The particle density of the component (D) in the first adhesive layers 22 and 32 may be 100,000 pcs / mm 2 may be less than 50000pcs / mm 2 It may be less than 10000pcs / mm 2 It may be the following:

[0083] The content of the (D) component may be, for example, 5% by mass or more, 15% by mass or more, or 20% by mass or more based on the total mass of the photo- and thermosetting composition, from the viewpoint of further improving the electrical conductivity. The content of the (D) component may be, for example, 50% by mass or less, 40% by mass or less, or 30% by mass or less based on the total mass of the photo- and thermosetting composition, from the viewpoint of easily suppressing short circuits. From these viewpoints, the content of the (D) component may be, for example, 5 to 50% by mass, 10 to 40% by mass, or 20 to 30% by mass, based on the total mass of the photo- and thermosetting composition. The content of the (D) component based on the total mass of the cured product of the photo- and thermosetting composition may be the same as the above range, and the content of the (D) component based on the total mass of the first adhesive layer may also be the same as the above range.

[0084] The content of the (D) component may be 0.1 volume % or more, 1 volume % or more, or 5 volume % or more based on the total volume of the cured product of the photo- and thermosetting composition, from the viewpoint of further improving the electrical conductivity. The content of the (D) component may be 50 volume % or less, 30 volume % or less, or 20 volume % or less based on the total volume of the cured product of the photo- and thermosetting composition, from the viewpoint of easily suppressing short circuits. The content of the (D) component based on the total volume of the photo- and thermosetting composition may be the same as the above range, and the content of the (D) component based on the total volume of the first adhesive layer may also be the same as the above range.

[0085] [Other ingredients] The photo- and thermosetting compositions may further contain other components in addition to the components described above. Examples of the other components include a thermoplastic resin, a coupling agent, a filler, a thiol compound, etc. These components may be contained in the first adhesive layers 22, 32.

[0086] Examples of the thermoplastic resin include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, and acrylic rubber. When the photo- and thermosetting composition contains a thermoplastic resin, the first adhesive layer can be easily formed. When the photo- and thermosetting composition contains a thermoplastic resin, the stress of the first adhesive layer generated during the curing of the photo- and thermosetting composition can be alleviated. When the thermoplastic resin has a functional group such as a hydroxyl group, the adhesiveness of the first adhesive layer is likely to be improved. From this viewpoint, a phenoxy resin may be used as the thermoplastic resin. The content of the thermoplastic resin may be, for example, 5% by mass or more, 80% by mass or less, or 5 to 80% by mass based on the total amount of components other than the conductive particles in the photo- and thermosetting composition.

[0087] Examples of the coupling agent include silane coupling agents having organic functional groups such as (meth)acryloyl groups, mercapto groups, amino groups, imidazole groups, and epoxy groups, silane compounds such as tetraalkoxysilanes, tetraalkoxytitanate derivatives, and polydialkyltitanate derivatives. When the photo- and thermosetting composition contains a coupling agent, the adhesiveness can be further improved. The content of the coupling agent may be, for example, 0.1% by mass or more and 20% by mass or less based on the total amount of components other than the conductive particles in the photo- and thermosetting composition. In this specification, silane coupling agents having polymerizable groups such as (meth)acryloyl groups are not included in the polymerizable compounds.

[0088] The filler may, for example, be a non-conductive filler (eg, non-conductive particles). When the photo- and thermosetting composition contains a filler, further improvement in connection reliability can be expected. The filler may be either an inorganic filler or an organic filler. Examples of the inorganic filler include inorganic fine particles such as metal oxide fine particles, such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and nitride fine particles. Examples of the organic filler include organic fine particles, such as silicone fine particles, methacrylate-butadiene-styrene fine particles, acrylic-silicone fine particles, polyamide fine particles, and polyimide fine particles. These fine particles may have a uniform structure or a core-shell structure. The maximum diameter of the filler may be less than the minimum particle diameter of the conductive particles 4. The content of the filler may be, for example, 1% by volume or more, 30% by volume or less, or 1 to 30% by volume, based on the total volume of the photo- and thermosetting composition.

[0089] The photo- and thermosetting composition may contain other additives such as softeners, accelerators, deterioration inhibitors, colorants, flame retardants, and thixotropic agents. The content of these additives may be, for example, 0.1 to 10 mass % based on the total amount of components other than the conductive particles in the photo- and thermosetting composition. These additives may be contained in the first adhesive layer 22, 32.

[0090] The thickness d1 of the first adhesive layer 22, 32 may be 0.1 times or more, 0.2 times or more, or 0.3 times or more of the average particle size of the conductive particles 4 from the viewpoint of making the conductive particles 4 more easily captured between the opposing electrodes and further reducing the connection resistance. The thickness d1 of the first adhesive layer 22, 32 may be 0.8 times or less, or 0.7 times or less of the average particle size of the conductive particles 4 from the viewpoint of making the conductive particles more easily crushed when sandwiched between the opposing electrodes during thermocompression bonding and further reducing the connection resistance. From these viewpoints, the thickness d1 of the first adhesive layer 2 may be 0.1 to 0.8 times, 0.2 to 0.8 times, or 0.3 to 0.7 times the average particle size of the conductive particles 4. The thickness d1 of the first adhesive layer 22, 32 refers to the thickness of the first adhesive layer located in the space between the adjacent conductive particles 4, 4.

[0091] When the thickness d1 of the first adhesive layer 22,32 and the average particle size of the conductive particles 4 satisfy the above-mentioned relationship, for example, as shown in FIG. 2 and FIG. 3, a part of the conductive particles 4 in the first adhesive layer 22,32 may protrude from the first adhesive layer 22,32 to the second adhesive layer 24,34. In this case, the boundary S between the first adhesive layer 22,32 and the second adhesive layer 24,34 is located in the space between the adjacent conductive particles 4,4. By the existence of the boundary S on the conductive particles along the surface of the conductive particles, the conductive particles 4 in the first adhesive layer 22,32 may satisfy the above-mentioned relationship without protruding from the first adhesive layer 22,32 to the second adhesive layer 24,34. The conductive particles 4 are not exposed on the surface of the first adhesive layer 22,32 opposite to the second adhesive layer 24,34, and the opposite surface may be a flat surface.

[0092] The relationship between the thickness d1 of the first adhesive layers 22, 32 and the maximum particle size of the conductive particles 4 may be the same as above. For example, the thickness d1 of the first adhesive layers 22, 32 may be 0.1 to 0.8 times, 0.2 to 0.8 times, or 0.3 to 0.7 times the maximum particle size of the conductive particles 4.

[0093] The thickness d1 of the first adhesive layer 22, 32 may be appropriately set according to the height of the electrodes of the circuit members to be bonded. The thickness d1 of the first adhesive layer 22, 32 may be, for example, 0.5 μm or more and 20 μm or less. In addition, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 22, 32 (for example, protruding toward the second adhesive layer 24, 34 side), the distance from the surface of the first adhesive layer 22, 32 opposite to the second adhesive layer 24, 34 side to the boundary S between the first adhesive layer 22, 32 and the second adhesive layer 24, 34 located in the space between the adjacent conductive particles 4, 4 (the distance indicated by d1 in FIG. 2 and FIG. 3) is the thickness of the first adhesive layer 22, 32, and the exposed part of the conductive particles 4 is not included in the thickness of the first adhesive layer 2. The length of the exposed portion of the conductive particles 4 may be, for example, 0.1 μm or more and 20 μm or less, or may be 0.1 to 20 μm.

[0094] The thickness of the adhesive layer can be measured by the following method. First, the adhesive film is sandwiched between two pieces of glass (thickness: about 1 mm). Next, a resin composition consisting of 100 g of bisphenol A type epoxy resin (product name: JER811, manufactured by Mitsubishi Chemical Corporation) and 10 g of a hardener (product name: Epomount hardener, manufactured by Refine Tech Co., Ltd.) is cast. Then, the cross section is polished using a polishing machine, and the thickness of each adhesive layer is measured using a scanning electron microscope (SEM, product name: SE-8020, manufactured by Hitachi High-Tech Science Corporation).

[0095] (Second adhesive layer) The second adhesive layer 24, 34 may be formed of, for example, a thermosetting composition containing (a) a polymerizable compound (hereinafter also referred to as component (a)) and (b) a thermal polymerization initiator (hereinafter also referred to as component (b)). The thermosetting composition constituting the second adhesive layer 24, 34 is a thermosetting composition that can flow when the circuit is connected, and is, for example, an uncured thermosetting composition.

[0096] [Component (a): Polymerizable compound] The component (a) is, for example, a compound that is polymerized by radicals, cations, or anions generated by a thermal polymerization initiator by heat. The compounds exemplified as the component (A) can be used as the component (a). From the viewpoints of facilitating connection at low temperature in a short time, further improving the effect of reducing connection resistance, and providing superior connection reliability, the component (a) may be a radically polymerizable compound having a radically polymerizable group that reacts with a radical. Examples of the radically polymerizable compound and combinations thereof are the same as those of the component (A).

[0097] Component (a) may be any of a monomer, oligomer, or polymer. As component (a), one type of compound may be used alone, or multiple types of compounds may be used in combination. Component (a) may be the same as or different from component (A).

[0098] The content of the (a) component may be, for example, 10% by mass or more, 20% by mass or more, or 30% by mass or more based on the total mass of the thermosetting composition, from the viewpoint of easily obtaining a crosslink density necessary for reducing the connection resistance and improving the connection reliability. The content of the (a) component may be, for example, 90% by mass or less, 80% by mass or less, or 70% by mass or less based on the total mass of the thermosetting composition, from the viewpoint of suppressing the curing shrinkage during polymerization and obtaining good reliability. From these viewpoints, the content of the (a) component may be, for example, 10 to 90% by mass, 20 to 80% by mass, or 30 to 70% by mass based on the total mass of the thermosetting composition.

[0099] [Component (b): Thermal polymerization initiator] As the component (b), the same thermal polymerization initiator as the component (C) can be used. As the component (b), one type of compound may be used alone, or multiple types of compounds may be used in combination. From the viewpoint of further improving the effect of reducing the connection resistance and achieving better connection reliability, the component (b) may be a thermal radical polymerization initiator. Examples of the thermal radical polymerization initiator in the component (b) are the same as those in the component (C).

[0100] From the viewpoint of further improving the effect of reducing the connection resistance and achieving better connection reliability, the content of the (b) component may be, for example, 0.1 mass% or more, 0.5 mass% or more, or 1 mass% or more, based on the total mass of the thermosetting composition. From the viewpoint of pot life, the content of the (b) component may be, for example, 30 mass% or less, 20 mass% or less, or 10 mass% or less, based on the total mass of the thermosetting composition. From these viewpoints, the content of the (b) component may be, for example, 0.1 to 30 mass%, 0.5 to 20 mass%, or 1 to 10 mass%, based on the total mass of the thermosetting composition.

[0101] [Other ingredients] The thermosetting composition may further contain other components in addition to the components (a) and (b). Examples of the other components include a thermoplastic resin, a coupling agent, a filler, a softener, an accelerator, an anti-degradation agent, a colorant, a flame retardant, a thixotropic agent, etc. Details of the other components are the same as those of the other components in the first adhesive layer.

[0102] The second adhesive layer 24, 34 (thermosetting composition) may not contain a photopolymerization initiator and conductive particles 4. The content of the photopolymerization initiator in the second adhesive layer 24, 34 may be, for example, 1 mass % or less or 0 mass % based on the total mass of the second adhesive layer. The content of the conductive particles 4 in the second adhesive layer 24, 34 may be, for example, 1 mass % or less or 0 mass % based on the total mass of the second adhesive layer.

[0103] The thickness d2 of the second adhesive layer 24,34 may be appropriately set according to the height of the electrodes of the circuit member to be bonded. The thickness d2 of the second adhesive layer 24,34 may be 5 μm or more, 200 μm or less, or 5 to 200 μm, from the viewpoint of being able to sufficiently fill the space between the electrodes to seal the electrodes and obtain better connection reliability. In addition, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 22,32 (for example, protruding toward the second adhesive layer 24,34), the distance (distance indicated by d2 in FIG. 2 and FIG. 3) from the surface of the second adhesive layer 24,34 opposite to the first adhesive layer 22,32 side to the boundary S between the first adhesive layer 22,32 and the second adhesive layer 24,34 located in the space between the adjacent conductive particles 4,4 is the thickness of the second adhesive layer 24,34.

[0104] The ratio of the thickness d1 of the first adhesive layer 22, 32 to the thickness d2 of the second adhesive layer 24, 34 (thickness d1 of the first adhesive layer 22, 32 / thickness d2 of the second adhesive layer 24, 34) may be 1 or more, 100 or less, or may be 1 to 100, from the viewpoint of being able to sufficiently fill the space between the electrodes and seal the electrodes, thereby obtaining better reliability.

[0105] The thickness of the adhesive films 20, 30 (the sum of the thicknesses of all layers constituting the adhesive films 20, 30. In FIG. 2, the sum of the thickness d1 of the first adhesive layer 22 and the thickness d2 of the second adhesive layer 24. In FIG. 3, the sum of the thickness d1 of the first adhesive layer 32 and the thickness d2 of the second adhesive layer 34) may be, for example, 5 μm or more, 200 μm or less, or may be 5 to 200 μm.

[0106] In the adhesive film 20, 30, the conductive particles 4 are dispersed in the first adhesive layer 22, 32. Therefore, the adhesive film 20, 30 is an anisotropic conductive adhesive film having anisotropic conductivity. The adhesive film 20, 30 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and is used to electrically connect the first electrode and the second electrode to each other by thermocompression bonding the first circuit member and the second circuit member.

[0107] The adhesive films 20 and 30 can suppress the flow of conductive particles that occurs during the manufacture of the circuit connection structure. The adhesive films 20 and 30 can also suppress peeling at the interface between the circuit member and the adhesive films 20 and 30 due to insufficient transferability. The adhesive films 20 and 30 also tend to suppress peeling at the interface between the circuit member and the circuit connecting member that occurs when the circuit connection structure is used in a high-temperature, high-humidity environment.

[0108] The adhesive film may be composed of two layers, the first adhesive layer and the second adhesive layer as described above, or may be composed of three or more layers including a layer other than the first adhesive layer and the second adhesive layer (e.g., a third adhesive layer). The third adhesive layer may be a layer having a composition similar to the composition described above for the first adhesive layer or the second adhesive layer, and may be a layer having a thickness similar to the thickness described above for the first adhesive layer or the second adhesive layer.

[0109] Furthermore, although the adhesive film is an anisotropic conductive adhesive film having anisotropic conductivity, the adhesive film may be a conductive adhesive film not having anisotropic conductivity.

[0110] [Method of manufacturing adhesive tape for circuit connection] The circuit connection adhesive tape of this embodiment can be manufactured, for example, by preparing an original roll of adhesive film with a substrate, and then forming a half cut in which only the adhesive film is cut without cutting the substrate, and a slit in which the substrate and adhesive film are cut into strips (tape-like) at a predetermined width. The width of the adhesive film can be adjusted by shifting the positions of the half cut section and the slit section. For cutting, for example, a slitting device described in JP-A-2003-285293 can be used. The unnecessary part of the adhesive film between the half cut section and the slit section can be removed using an adhesive tape or the like.

[0111] A method for producing a raw sheet of a substrate-attached adhesive film includes, for example, a preparation step (first preparation step) of preparing a laminate in which the above-mentioned first adhesive layer is formed on a substrate, and a lamination step of laminating the above-mentioned second adhesive layer on the first adhesive layer. This production method may further include a preparation step (second preparation step) of preparing a second adhesive layer. The order of carrying out the first preparation step and the second preparation step is not limited.

[0112] In the first preparation step, for example, a laminate of the substrate and the first adhesive layer is prepared by forming a first adhesive layer on the substrate. Specifically, for example, the (A) component, the (B) component, the (C) component, and the (D) component, as well as other components added as necessary, are added to a solvent (organic solvent), and dissolved or dispersed by stirring, mixing, kneading, etc. to prepare a varnish composition (varnish-like curable composition). Thereafter, the varnish composition is applied to the substrate that has been subjected to a release treatment using a knife coater, roll coater, applicator, comma coater, die coater, etc., and the solvent is volatilized by heating to form a layer composed of a photo- and thermosetting composition on the substrate. Next, the layer composed of the photo- and thermosetting composition is irradiated with light to cure (photo-cur) the photo- and thermosetting composition, and a first adhesive layer is formed on the substrate (curing step). This results in a laminate of the substrate and the first adhesive layer.

[0113] The solvent used in preparing the varnish composition may be a solvent that has the property of dissolving or dispersing each component uniformly. Examples of such solvents include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, and butyl acetate. These solvents can be used alone or in combination of two or more. The stirring and mixing and kneading in preparing the varnish composition can be performed using, for example, a stirrer, a grinding machine, a three-roll mill, a ball mill, a bead mill, or a homodisper.

[0114] As the substrate, the same one as the substrate 10 described above can be used.

[0115] The heating conditions for volatilizing the solvent from the varnish composition applied to the substrate may be conditions that allow the solvent to volatilize sufficiently, for example, at 40° C. or higher and 120° C. or lower for 0.1 minutes or longer and 10 minutes or shorter.

[0116] A part of the solvent may remain in the layer made of the photo- and thermosetting composition without being removed. The content of the solvent in such a layer may be, for example, 10% by mass or less based on the total mass of the layer.

[0117] For the light irradiation in the curing step, light having a wavelength in the range of 150 to 750 nm (e.g., ultraviolet light) may be used. The light irradiation can be carried out using, for example, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like. The amount of light irradiation is not particularly limited, and for example, the integrated light amount of light having a wavelength of 365 nm is 100 mJ / cm. 2 or more, and 2 or more, and 2 The amount of light irradiation may be, for example, 10,000 mJ / cm2 in terms of the integrated light amount of light with a wavelength of 365 nm. 2 may be less than 5000 mJ / cm 2 or less than 3000 mJ / cm 2 It may be the following:

[0118] In the second preparation step, a second adhesive layer is prepared by forming a second adhesive layer on a substrate to obtain a second adhesive film in the same manner as in the first preparation step, except that the (a) and (b) components, as well as other components added as necessary, are used and light irradiation is not performed.

[0119] A part of the solvent may remain in the second adhesive layer without being removed. The content of the solvent in the second adhesive layer may be, for example, 10 mass % or less based on the total mass of the second adhesive layer.

[0120] In the lamination process, the first adhesive layer and the second adhesive layer may be laminated by bonding the first adhesive film and the second adhesive film together, or the second adhesive layer may be laminated onto the first adhesive layer by applying a second varnish composition onto the first adhesive layer and volatilizing the solvent.

[0121] Examples of the method for bonding the adhesive layers together include hot pressing, roll lamination, vacuum lamination, etc. Lamination may be performed under temperature conditions of, for example, 0 to 80°C.

[0122] [Adhesive reel] The adhesive reel of the present embodiment includes a core, a pair of side plates provided at both ends of the core so as to face each other, and the adhesive tape of the present embodiment wound around the core. The adhesive tape may be wound around the core so that the adhesive film faces the core and the substrate faces outward, or the adhesive tape may be wound around the core so that the substrate faces the core and the adhesive film faces outward.

[0123] Fig. 4 is a perspective view showing one embodiment of an adhesive reel. Fig. 5 is a cross-sectional view showing a schematic internal structure of the adhesive reel shown in Fig. 4. Fig. 6 is a cross-sectional view showing a schematic structure in a cross section taken along line II in Fig. 4. The adhesive reel 100 shown in Figs. 4 to 6 includes a cylindrical core 101, a pair of side plates 102 provided on both axial end faces of the core 101 so as to face each other, and an adhesive tape wound around the core 101. The adhesive tape has the configuration shown in Figs. 1(a) and 2.

[0124] As shown in Fig. 5, an adhesive tape is wound on the outer surface F1 of the winding core 101 to form a wound body. As shown in Figs. 4 to 6, the adhesive tape is wound around the winding core 101 so that the adhesive film 20 faces the winding core 101 and the substrate 10 faces outward, but it may also be wound around the winding core 101 so that the substrate 10 faces the winding core 101 and the adhesive film 30 faces outward.

[0125] 4 and 5, adhesive reel 100 has shaft hole 110a into which the rotating shaft of a crimping device (not shown) is inserted, and this shaft hole 110a is provided with notch portion 110b that fits with a protrusion provided on the rotating shaft. However, a configuration other than notch portion 110b may be used as long as it is possible to prevent free rotation when adhesive reel 100 is attached to the rotating shaft of the crimping device. A plastic molded product or the like can be used as the reel part including core 101 and side plate 102.

[0126] In this embodiment, the side plate may have a rib structure on the inner surface F2 adjacent to the adhesive tape, which protrudes from the surface F2 and extends radially from the edge of the shaft hole 110a. By providing the rib structure, even if the adhesive seeps out from the end surface of the adhesive tape, the area where the adhesive adheres to the side plate 102 can be further reduced. This makes it possible to further suppress blocking.

[0127] The length of the adhesive tape may be 1 to 1000 m, 30 to 500 m, 50 to 300 m, or 100 to 200 m.

[0128] To produce the adhesive reel 100, for example, the adhesive tape of the present embodiment is wound around a core of a reel component to produce the adhesive reel 100. At this time, in the present embodiment, the adhesive tape 50 can be wound around the core 101 so that the adhesive film 20 faces the core 101 side and the substrate 10 faces outward.

[0129] In addition, when the adhesive tape is wound around the core 101 so that the substrate faces the core 101 and the adhesive film faces outward, the adhesive film is exposed on the outer periphery of the adhesive tape roll, and in order to prevent this portion from being contaminated by dust or the like, the following measures may be taken as necessary. For example, the adhesive film on the substrate at the last portion (end of winding) of the adhesive tape can be removed in advance to provide a blank portion, which can then be wound around the roll to prevent the adhesive film from being exposed. Alternatively, instead of providing a blank portion on the substrate, another tape (which can be the same as the substrate) may be prepared, connected to the end of the substrate, and wound around the roll. In addition to the above, contamination from the external environment can be suppressed by storing the adhesive reel in a bag.

[0130] The adhesive tape may have a lead mark, such as a pressure-sensitive adhesive tape, of a different hue from the substrate or the adhesive film. The adhesive tape may also have an end mark, such as a pressure-sensitive adhesive tape, of a different hue from the substrate or the adhesive film.

[0131] In the adhesive reel, the reel of adhesive tape may be in contact with the side plate.

[0132] [Method of manufacturing circuit connection structure] The method for manufacturing the circuit connection structure of this embodiment includes the steps of interposing an adhesive film in the adhesive tape drawn out from the adhesive reel of this embodiment between a first circuit member having a first electrode (circuit electrode) and a second circuit member having a second electrode (circuit electrode), and thermocompressing the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.

[0133] The method of the present embodiment may include, for example, a preparation step of preparing the adhesive reel of the present embodiment described above; a laminating step of laminating the adhesive tape unwound from the adhesive reel to the first circuit member in a state in which the adhesive tape has a substrate and the adhesive film is in contact with the first circuit member; a peeling step of peeling the substrate from the adhesive tape attached to the first circuit member; a heating and pressurizing step of placing a second circuit member on the first circuit member laminated with an adhesive film such that the first electrode and the second electrode face each other, and pressing the first circuit member and the second circuit member in a direction in which the first electrode and the second electrode face each other while heating the adhesive film; The method of the present embodiment will be described in detail below with reference to the drawings.

[0134] Fig. 7 is a schematic cross-sectional view showing the steps of a method for producing a circuit connection structure using the tape shown in Fig. 2. Fig. 8 is a schematic cross-sectional view showing the steps subsequent to those in Fig. 7, and Fig. 9 is a schematic cross-sectional view showing the circuit connection structure obtained through the steps in Fig. 8. Fig. 10 is a schematic cross-sectional view showing the steps of a method for producing a circuit connection structure using the tape shown in Fig. 3. Fig. 11 is a schematic cross-sectional view showing the circuit connection structure obtained through the steps in Fig. 10.

[0135] (preparation process) In this process, a pre-fabricated adhesive reel may be prepared, a pre-fabricated adhesive tape may be prepared and an adhesive reel may be manufactured using the winding method described above, a pre-fabricated roll of adhesive film with substrate may be prepared and an adhesive tape and adhesive reel may be manufactured using the method described above, or a roll of adhesive film with substrate, adhesive tape and adhesive reel may be manufactured using the method described above.

[0136] (Lamination process) In this step, for example, as shown in Fig. 7, a first circuit board 11 and a first circuit member 13 having a first electrode 12 formed on a main surface 11a of the first circuit board 11 are prepared, and the adhesive tape can be laminated onto the first circuit member 13 such that the second adhesive layer 24 side of the adhesive film 20 faces the surface of the first circuit member 13 on which the first electrode 12 is provided. If the adhesive tape has a substrate provided on the second adhesive layer 24, the second adhesive layer 24 can be laminated onto the first circuit member 13 after or while peeling off the substrate so that the second adhesive layer 24 is in close contact with the first circuit member 13.

[0137] 3 is used, a first circuit board 41 and a first circuit member 43 having a first electrode 42 formed on a main surface 41a of the first circuit board 41 are prepared, and the adhesive tape can be laminated onto the first circuit member 43 so that the first adhesive layer 32 side of the adhesive film 30 faces the surface of the first circuit member 43 on which the first electrode 42 is provided (see FIG. 10(a)). When the adhesive tape has a substrate provided on the first adhesive layer 32, the first adhesive layer 32 can be laminated onto the first circuit member 43 after or while peeling off the substrate so that the first adhesive layer 32 is in close contact with the first circuit member 43.

[0138] The first circuit members 13, 43 may be a glass substrate or a plastic substrate on which electrodes are formed, a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor silicon IC chip, or the like. The first circuit boards 11, 41 may be formed of inorganic materials such as semiconductors, glass, and ceramics, organic materials such as polyimide and polycarbonate, and composite materials such as glass / epoxy. The first electrodes 12, 42 may be formed of gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium, indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), or the like. The first electrodes 12, 42 may be circuit electrodes or bump electrodes.

[0139] There is no particular limitation on the lamination method, but a roll laminator, a diaphragm laminator, a vacuum roll laminator, or a vacuum diaphragm laminator can be used. After the temporary lamination, the laminate may be pressed using a thermocompression device. At this time, a temporary pressing tool provided with a cushioning material can be used. In this case, by using the adhesive reel of this embodiment, the cushioning material is less likely to be contaminated.

[0140] The lamination conditions may be appropriately set depending on the type of laminator, substrate, first circuit member, etc. used. The temperature during lamination (compression temperature) may be, for example, 50 to 90° C. The pressure during lamination (compression pressure) may be, for example, 0.5 to 1.5 MPa. The lamination time (compression time) may be, for example, 0.5 to 1.5 seconds.

[0141] (Heat and pressure process) In this step, for example, as shown in Fig. 8, a second circuit board 14 and a second circuit member 16 having a second electrode 15 formed on a main surface 14a of the second circuit board 14 are prepared, and the second circuit member 16 is placed on the first circuit member 13 on which the adhesive film 20 is laminated so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit member 16 are pressed in the thickness direction while heating the first circuit member 13, the adhesive film 20, and the second circuit member 16, so that the first circuit member 13 and the second circuit member 16 can be thermocompression-bonded to each other. As a result, the first electrode 12 and the second electrode 15 are electrically connected to each other via the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are bonded to each other, thereby obtaining the circuit connection structure 1 shown in Fig. 9.

[0142] 3 is used, a second circuit member 46 having a second electrode 45 formed on a main surface 44a of a second circuit board 44 and the second circuit member 46 is prepared, and the second circuit member 46 is placed on the first circuit member 43 laminated with the adhesive film 30 so that the first electrode 42 and the second electrode 45 face each other. The first circuit member 43 and the second circuit member 46 are pressed in the thickness direction while the first circuit member 43, the adhesive film 30, and the second circuit member 46 are heated, whereby the first circuit member 43 and the second circuit member 46 can be thermocompressed together (see FIG. 10(b)). At this time, as shown by the arrows in FIG. 10(b), the second adhesive layer 34 is made of a flowable uncured thermosetting composition, so that it flows to fill the gaps between the second electrodes 45 and is cured by the above-mentioned heating. As a result, the first electrode 42 and the second electrode 45 are electrically connected to each other via the conductive particles 4, and the first circuit member 43 and the second circuit member 46 are bonded to each other, thereby obtaining the circuit connection structure 2 shown in Fig. 11. In this embodiment, since the first adhesive layer 41 is a pre-cured layer, the conductive particles 4 hardly flow during the thermocompression bonding, and the conductive particles are efficiently captured between the opposing electrodes, thereby reducing the connection resistance between the opposing electrodes 42 and 45. Therefore, a circuit connection structure with excellent connection reliability is obtained.

[0143] The circuit connection structures 1, 2 include circuit connection parts 17, 47 that are disposed between the first circuit members 13, 43 and the second circuit members 16, 46 and electrically connect the first electrodes 12, 42 and the second electrodes 15, 45 to each other. The circuit connection part 17 is made of a cured product of the adhesive film 20, and can have a first region 18 located on the second circuit member 16 side in the direction in which the first circuit member 13 and the second circuit member 16 face each other and made of a cured product of components other than the conductive particles 4 of the above-mentioned photo- and thermosetting composition, a second region 19 located on the first circuit member 13 side in the facing direction and made of a cured product of the above-mentioned thermosetting composition, and conductive particles 4 that are interposed at least between the first electrode 12 and the second electrode 15 and electrically connect the first electrode 12 and the second electrode 15 to each other. The circuit connection portion 47 may be made of a cured product of the adhesive film 30, and may have a first region 48 located on the first circuit member 43 side in the direction in which the first circuit member 43 and the second circuit member 46 face each other and made of a cured product of a component other than the conductive particles 4 of the light- and heat-curable composition, a second region 49 located on the second circuit member 46 side in the facing direction and made of a cured product of the thermosetting composition, and conductive particles 4 interposed between at least the first electrode 42 and the second electrode 45 to electrically connect the first electrode 42 and the second electrode 45 to each other. The circuit connection portion 17, 47 may not have two regions like the first region and the second region described above, and may be made of, for example, a cured product in which a cured product of a component other than the conductive particles 4 of the light- and heat-curable composition and a cured product of the thermosetting composition are mixed.

[0144] The second circuit members 14, 44 may be similar to the above-mentioned first circuit members 13, 43. At least one of the first electrodes 12, 42 and the second electrodes 15, 45 may be a bump electrode.

[0145] A known thermocompression bonding device can be used as the heating means. The heating temperature may be equal to or higher than the temperature at which the polymerization active species is generated in the curing agent and the polymerization of the polymerization monomer is initiated. The heating temperature may be, for example, 80°C to 200°C, 150°C to 200°C, or 100°C to 180°C. The heating time may be, for example, 0.1 seconds to 30 seconds, 1 second to 20 seconds, or 4 to 7 seconds.

[0146] As the pressing means, a known thermocompression device can be used. The pressure and time of pressing can be appropriately set. EXAMPLES

[0147] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0148] <Synthesis of polyurethane acrylate (UA1)> Into a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser having a calcium chloride drying tube, and a nitrogen gas inlet tube, 2500 parts by mass (2.50 mol) of poly(1,6-hexanediol carbonate) (trade name: Duranol T5652, manufactured by Asahi Kasei Chemicals Corporation, number average molecular weight 1000) and 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Sigma-Aldrich Co.) were uniformly dropped over 3 hours. Next, after sufficient nitrogen gas was introduced into the reaction vessel, the inside of the reaction vessel was heated to 70 to 75°C to cause a reaction. Next, 0.53 parts by mass (4.3 mmol) of hydroquinone monomethyl ether (Sigma-Aldrich) and 5.53 parts by mass (8.8 mmol) of dibutyltin dilaurate (Sigma-Aldrich) were added to the reaction vessel, and then 238 parts by mass (2.05 mol) of 2-hydroxyethyl acrylate (Sigma-Aldrich) were added and reacted at 70°C for 6 hours under air atmosphere. This resulted in polyurethane acrylate (UA1). The weight-average molecular weight of polyurethane acrylate (UA1) was 15,000. The weight-average molecular weight was measured by gel permeation chromatography (GPC) using a calibration curve based on standard polystyrene under the following conditions. (Measurement conditions) Equipment: Tosoh Corporation GPC-8020 Detector: Tosoh RI-8020 Column: Gelpack GLA160S+GLA150S manufactured by Hitachi Chemical Co., Ltd. Sample concentration: 120mg / 3mL Solvent: Tetrahydrofuran Injection volume: 60μL Pressure: 2.94×10 6 Pa(30kgf / cm 2 ) Flow rate: 1.00mL / min

[0149] <Preparation of conductive particles> A layer of nickel was formed on the surface of the polystyrene particles to a thickness of 0.2 μm, thus obtaining conductive particles with an average particle size of 4 μm, a maximum particle size of 4.5 μm, and a specific gravity of 2.5.

[0150] <Method for preparing polyester urethane resin> 48 parts by mass of isophthalic acid and 37 parts by mass of neopentyl glycol were put into a stainless steel autoclave equipped with a stirrer, a thermometer, a condenser, a vacuum generator, and a nitrogen gas inlet tube, and 0.02 parts by mass of tetrabutoxy titanate as a catalyst was further put in. Then, the temperature was raised to 220°C under a nitrogen stream, and the mixture was stirred for 8 hours. Then, the pressure was reduced to atmospheric pressure (760 mmHg), and the mixture was cooled to room temperature. This caused a white precipitate to precipitate. Next, the white precipitate was taken out, washed with water, and then vacuum dried to obtain a polyester polyol. The obtained polyester polyol was thoroughly dried, and then dissolved in MEK (methyl ethyl ketone), and put into a four-neck flask equipped with a stirrer, a dropping funnel, a reflux condenser, and a nitrogen gas inlet tube. Furthermore, dibutyltin dilaurate was added as a catalyst in an amount of 0.05 parts by mass per 100 parts by mass of polyester polyol, and 4,4'-diphenylmethane diisocyanate in an amount of 50 parts by mass per 100 parts by mass of polyester polyol was dissolved in MEK and added using a dropping funnel, and the mixture was stirred at 80°C for 4 hours to obtain the desired polyester urethane resin.

[0151] <Preparation of first varnish composition (varnish-like photo- and thermosetting composition)> The components shown below were mixed in the amounts (parts by mass) shown in Table 1 to prepare a first varnish composition 1-1.

[0152] (polymerizable compound) A1: Diacrylate having a tricyclodecane skeleton (product name: DCP-A, manufactured by Kyoeisha Chemical Co., Ltd.) A2: Polyurethane acrylate (UA1) synthesized as described above A3: 2-Methacryloyloxyethyl acid phosphate (product name: Light Ester P-2M, manufactured by Kyoeisha Chemical Co., Ltd.) (Photopolymerization initiator) B1: 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)] (trade name: Irgacure (registered trademark) OXE01, manufactured by BASF) (Thermal polymerization initiator) C1: Benzoyl peroxide (product name: Niper BMT-K40, manufactured by NOF Corporation) (Conductive particles) D1: Conductive particles prepared as described above (thermoplastic resin) E1: Polyester urethane resin synthesized as described above (Coupling Agent) F1: 3-methacryloxypropyltrimethoxysilane (product name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.) (filling material) G1: Silica fine particles (product name: R104, manufactured by Nippon Aerosil Co., Ltd., average particle size (primary particle size): 12 nm) (solvent) H1: Methyl ethyl ketone

[0153] [Table 1]

[0154] <Preparation of second varnish composition (varnish-like thermosetting composition)> The polymerizable compounds a1 to a3, thermal polymerization initiator b1, coupling agent f1, filler f1 and solvent h1 used were the same as the polymerizable compounds A1 to A3, thermal polymerization initiator C1, coupling agent F1, filler F1 and solvent H1 in the photo- and thermosetting composition, and the thermoplastic resin e1 used was the component shown below. These components were mixed in the amounts (parts by mass) shown in Table 2 to prepare a second varnish composition 2-1. (thermoplastic resin) e1: Polyester urethane resin synthesized as described above

[0155] [Table 2]

[0156] <Example 1> [Preparation of the first adhesive film] The first varnish composition 1-1 was applied onto a PET film having a thickness of 50 μm using a coating device. Then, hot air drying was performed at 70° C. for 3 minutes to form a layer of the photo- and thermosetting composition having a thickness (thickness after drying) of 4 μm on the PET film. The thickness here was measured using a contact thickness meter. Next, a metal halide lamp was used to irradiate the layer of the photo- and thermosetting composition with an integrated light amount of 1500 mJ / cm 2 . 2 The polymerizable compound was polymerized by irradiating the film with light so that the photo- and thermosetting composition was cured to form a first adhesive layer. The above operations resulted in a first adhesive film having a first adhesive layer (thickness of the region where the conductive particles are present: 4 μm) on the PET film. The conductive particle density at this time was approximately 7000 pcs / mm 2 It was found that the thickness of the first adhesive layer was smaller than the thickness (diameter) of the conductive particles. When the thickness of the layer is measured using a contact thickness meter, the thickness of the conductive particles is reflected, and the thickness of the region where the conductive particles are present is measured. Therefore, after producing a two-layer adhesive film in which the first adhesive layer and the second adhesive layer are laminated, the thickness of the first adhesive layer located in the space between the adjacent conductive particles was measured by the above-mentioned method.

[0157] [Preparation of the second adhesive film] The second varnish composition 2-1 was applied onto a PET film having a thickness of 50 μm using a coating device. Then, hot air drying was performed at 70° C. for 3 minutes to form a second adhesive layer (a layer made of a thermosetting composition) having a thickness of 8 μm on the PET film. Through the above operations, a second adhesive film having a second adhesive layer on the PET film was obtained.

[0158] [Preparation of adhesive tape rolls] The first adhesive film and the second adhesive film were arranged so that their adhesive layers faced each other, and were laminated with a roll laminator while being heated at 40°C together with the PET film substrate. This produced an adhesive film with a PET film, which had a two-layer structure in which the first adhesive layer and the second adhesive layer were laminated. Next, the PET film on the first adhesive layer side was peeled off to obtain the original adhesive tape.

[0159] [Preparation of adhesive tape and adhesive reel] The adhesive film of the adhesive tape obtained above was cut alternately in half at 1.5 mm intervals and 2 mm intervals from the first adhesive layer side by a roll-to-roll slitting machine. Next, the adhesive film and the substrate were cut at the center position of the half-cut section with 2 mm intervals. Next, the adhesive film between the half-cut section and the cut section was removed by an adhesive roll, and an adhesive tape was formed in which a strip-shaped adhesive film with a width of 1.5 mm was provided on a strip-shaped PET substrate with a width of 3.5 mm. That is, the widths W1, W3, and W4 shown in FIG. 1(b) were obtained. b1 and W b2 are W1 = 3.5 mm, W3 = 1.5 mm, W b1 = 1.0mm and W b2= 1.0 mm. The adhesive tape was then wound up to a length of 300 m onto a reel part (outer diameter of winding core: 66 mm, plastic molded product) to obtain an adhesive reel. At this time, the adhesive tape was wound up so that the adhesive film faced the winding core side (inside) and the PET substrate faced outward.

[0160] Example 2 The adhesive tape raw material obtained in the same manner as in Example 1 was half-cut at 1.5 mm intervals and 4 mm intervals alternately from the first adhesive layer side by a roll-to-roll slitting machine. Next, the adhesive film and the substrate were cut at the center position of the half-cut section with 4 mm intervals. Next, the adhesive film between the half-cut section and the cut section was removed by an adhesive roll, and an adhesive tape was formed in which a strip-shaped adhesive film with a width of 1.5 mm was provided on a strip-shaped PET substrate with a width of 5.5 mm. That is, the widths W1, W3, and W4 shown in FIG. 1(b) were obtained. b1 and W b2 are W1=5.5mm, W3=1.5mm, W b1 = 2.0mm and W b2 An adhesive tape having a thickness of 2.0 mm was then formed. Thereafter, an adhesive reel was obtained in the same manner as in Example 1.

[0161] Example 3 The adhesive film of the original adhesive tape obtained in the same manner as in Example 1 was half-cut alternately at 1.5 mm intervals and 6 mm intervals from the first adhesive layer side by a roll-to-roll slitting machine. Next, the adhesive film and the substrate were cut at the center position of the half-cut section with 6 mm intervals. Next, the adhesive film between the half-cut section and the cut section was removed by an adhesive roll, and an adhesive tape was formed in which a strip-shaped adhesive film with a width of 1.5 mm was provided on a strip-shaped PET substrate with a width of 7.5 mm. That is, the widths W1, W3, and W4 shown in FIG. 1(b) were obtained. b1 and W b2 are W1=7.5mm, W3=1.5mm, W b1 = 3.0mm and W b2An adhesive tape having a thickness of 3.0 mm was then formed. Thereafter, an adhesive reel was obtained in the same manner as in Example 1.

[0162] Comparative Example 1 The raw adhesive tape obtained in the same manner as in Example 1 was cut at 1.5 mm intervals by a roll-to-roll slitting machine to form an adhesive tape in which a 1.5 mm wide strip of adhesive film was provided on a 1.5 mm wide strip of PET substrate. Then, an adhesive reel was obtained in the same manner as in Example 1.

[0163] [Evaluation of the amount of contamination of cushioning material] The adhesive tape pulled out from the prepared adhesive reel was transferred to CrIZO coated glass (a 0.5 mm thick base glass coated with a metal layer of IZO (100 nm thick), 2nd layer Cr (50 nm thick), and 3rd layer AlNd (200 nm thick)) using a transfer device (LD-06, Ohashi Manufacturing Co., Ltd.) and a temporary pressure bonding tool equipped with a cushioning material (TC-20A, Shin-Etsu Chemical Co., Ltd.) at 70°C, 1 MPa, and 1 second. Thirty sets of transfers were performed without changing the position of the cushioning material.

[0164] The cushioning material after transfer was observed using a microscope (product name ECLIPSE L300, manufactured by Nikon Corporation) to count the number of foreign particles with a maximum length of 3 μm or more. If the number of foreign particles was less than 5, it was rated as "A", and if it was 5 or more, it was rated as "B".

[0165] [Evaluation of transferability] The adhesive tape pulled out from the prepared adhesive reel was transferred to CrIZO-coated glass (a 0.5 mm thick base glass coated with a metal layer of IZO (100 nm thick), Cr (50 nm thick) as the top layer, and AlNd (200 nm thick) as the second layer) using a transfer device (LD-06, Ohashi Manufacturing Co., Ltd.) and a temporary pressure bonding tool equipped with a cushioning material (TC-20A, Shin-Etsu Chemical Co., Ltd.) at 70°C, 1 MPa, and 1 second. Thirty sets were performed. When the area of ​​the adhesive film that was transferred without lifting off the CrIZO-coated glass was 80% or more, it was given an "A", and when it was less than 80%, it was given a "B". [Evaluation of adhesive reel blocking resistance] Thirty adhesive reels were prepared, and the blocking occurrence rate was determined by the following procedure to evaluate blocking resistance.

[0166] The adhesive reel was fixed in a vertical position, a 75g weight was hung from the tip of the adhesive tape, and the tape was left in a thermostatic chamber at 30°C (relative humidity 40-60%) for 6 hours. After that, a Tensilon (product name, manufactured by A&D Co., Ltd.) was used to pull out the adhesive tape from the adhesive reel at a speed of 1m / min to check for the occurrence of blocking. Cases where no blocking was observed were rated "A", and cases where blocking was observed were rated "B".

[0167] [Table 3] [Explanation of symbols]

[0168] 1,2...circuit connection structure, 4...conductive particles, 5...adhesive component, 10...substrate, 11,41...first circuit board 11, 12,42...first electrode (circuit electrode), 13,43...first circuit member, 14,44...second circuit board 11, 15,45...second electrode (circuit electrode), 16,46...second circuit member, 20,30...adhesive film, 22,32...first adhesive layer, 24,34...second adhesive layer, 50,52...adhesive tape, 100...adhesive reel, 101...winding core, 102...side panel.

Claims

1. The present invention comprises a strip-shaped substrate and a strip-shaped adhesive film provided on one surface of the substrate along the longitudinal direction of the substrate, the adhesive film includes a first adhesive layer and a second adhesive layer laminated to the first adhesive layer; the first adhesive layer is formed from a photocured product of a photo- and thermosetting composition containing conductive particles, and the second adhesive layer is formed from a thermosetting composition; The surface S of the adhesive film on the substrate side ｘ The width of W Ｘ , the adhesive film side surface S of the substrate ｙ The width of W Y When this is done, W Ｘ <W ｙ Fulfilling the relationship, The surface S ｘ Both ends in the width direction of the surface S ｙ and the two ends are spaced apart from each other.

2. The W Ｘ The above W Y The ratio [W Y / W Ｘ 2. The adhesive tape for circuit connection according to claim 1, wherein the molecular weight distribution (Mg / m2) of the adhesive tape is 1.06 to 34.

5.

3. The adhesive tape for circuit connection according to claim 1 , wherein the first adhesive layer is located on the substrate side.

4. The adhesive tape for circuit connection according to claim 1 , wherein the second adhesive layer is located on the substrate side.

5. A core; An adhesive reel comprising: the adhesive tape for circuit connection according to any one of claims 1 to 4 wound on the winding core.

6. The adhesive reel according to claim 5 , further comprising a pair of side plates provided opposite both ends of the core so as to face each other.

7. The adhesive reel according to claim 5 , wherein the circuit connecting adhesive tape is wound around the core such that the substrate faces the core and the adhesive film faces outward.

8. a step of interposing the adhesive film of the adhesive tape drawn out from the adhesive reel according to claim 5 between a first circuit member having a first electrode and a second circuit member having a second electrode, and thermocompressing the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other, The method for manufacturing a circuit connection structure, the steps including: laminating the adhesive tape, while holding the base material, to the first circuit member so that the adhesive film is in contact with the first circuit member; and peeling off the base material of the adhesive tape attached to the first circuit member.

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