Substrate processing system

Abstract

To improve an operating rate of a substrate processing system by reducing a replacement time of a consumable component in a vacuum processing chamber.SOLUTION: A substrate processing system includes an atmospheric pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, a plurality of mounting units, a first transfer mechanism, a second transfer mechanism, and a control unit. The plurality of mounting units are provided in the atmospheric pressure transfer chamber. Each of the plurality of storage units can be detachably attached to the plurality of mounting units. The control unit causes the first transfer mechanism and the second transfer mechanism to carry out in parallel the transfer of consumable components from the storage unit to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and the transfer of consumable components from the vacuum processing chamber via the vacuum transfer chamber and another one of the one or more load lock modules.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The following disclosure relates to a substrate processing system. [Background technology]

[0002] 2. Description of the Related Art There is known a plasma processing apparatus that performs plasma processing on a substrate placed on a mounting table provided inside a processing chamber. Such a plasma processing apparatus has consumable parts that gradually wear out as the plasma processing is repeatedly performed.

[0003] An example of a consumable part is a focus ring that is provided around the outer periphery of a substrate placed on a mounting table. The focus ring is exposed to plasma and is worn down, so it must be replaced periodically.

[0004] For example, Patent Document 1 proposes a focus ring replacement method in which the focus ring is carried in and out without opening the processing chamber to the atmosphere. Also, a technique for shortening the downtime of vacuum processing by checking the condition of the surface of the substrate mounting table and replacing the surface has been proposed (Patent Document 2). Also, a pod for replacing consumable parts has been proposed (Patent Document 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-10992 A [Patent Document 2] JP 2012-216614 A [Patent Document 3] JP 2017-98540 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure provides a technique capable of improving the operation rate of a substrate processing system by shortening the replacement time of consumable parts in a vacuum processing chamber. [Means for solving the problem]

[0007] A substrate processing system according to an embodiment of the present disclosure includes an atmospheric pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, a plurality of attachments, a first transfer mechanism, a second transfer mechanism, and a control unit. The atmospheric pressure transfer chamber transfers substrates and consumable parts in an atmospheric pressure atmosphere. In the vacuum processing chamber, a vacuum process is performed on the substrate. The one or more load lock modules are disposed between the atmospheric pressure transfer chamber and the vacuum processing chamber, and the transferred substrates and consumable parts pass through the one or more load lock modules. The vacuum transfer chamber is disposed between the vacuum processing chamber and the one or more load lock modules, and the substrates and consumable parts are transferred in a reduced pressure atmosphere. The plurality of attachments are provided in the atmospheric pressure transfer chamber, and have ports through which the substrates or consumable parts transferred between each of the plurality of storage units that accommodate the substrates or consumable parts and the atmospheric pressure transfer chamber can pass. Each of the plurality of storage units can be detachably attached to the plurality of attachments. The first transfer mechanism transfers the substrates and consumable parts between the one or more load lock modules and the vacuum processing chamber via the vacuum transfer chamber. The second transfer mechanism transfers the substrates and consumable parts between the multiple storage units and the one or more load lock modules via the atmospheric pressure transfer chamber. The control unit causes the first transfer mechanism and the second transfer mechanism to transfer the consumable parts from the storage units to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and to transfer the consumable parts from the vacuum processing chamber via the vacuum transfer chamber and another of the one or more load lock modules, in parallel. Effect of the Invention

[0008] According to the present disclosure, the operation rate of a substrate processing system can be improved by shortening the time required to replace consumable parts in a vacuum processing chamber. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic configuration diagram of a substrate processing system according to an embodiment of the present invention. [Diagram 2]FIG. 2 is a schematic configuration diagram of an example of a process module included in the substrate processing system according to an embodiment. [Diagram 3] FIG. 3 is a perspective view for explaining the configuration of the susceptor shown in FIG. [Figure 4] FIG. 4 is a diagram for explaining the flow of a transport process of a consumable part according to one embodiment. [Diagram 5] FIG. 5 is a flowchart showing an example of a flow of a replacement timing notification in the substrate processing system according to an embodiment. [Figure 6] FIG. 6 is a flowchart showing an example of a procedure for installing a FR FOUP in a substrate processing system according to an embodiment. [Figure 7] FIG. 7 is a flowchart showing an example of a flow of a removal process of an FR FOUP in the substrate processing system of one embodiment. [Figure 8A] FIG. 8A is a flowchart showing an example of a flow of an exchange reservation process in the substrate processing system according to one embodiment. [Figure 8B] FIG. 8B is a flowchart showing an example of the flow of an exchange reservation cancellation process in the substrate processing system according to an embodiment. [Figure 9] FIG. 9 is a flow chart showing an example of a flow of a replacement process in the substrate processing system according to an embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of the flow of an exchange path securing process in the substrate processing system according to one embodiment. [Figure 11] FIG. 11 is a diagram for explaining the exchange execution process in the substrate processing system of one embodiment. [Figure 12] FIG. 12 is a diagram for explaining the effect of reducing downtime when the focus ring is replaced in the substrate processing system of one embodiment. [Figure 13A] FIG. 13A is a view for explaining an operation of the second lifter pins when the focus ring is loaded in the substrate processing system according to an embodiment. [Figure 13B]FIG. 13B is a view for explaining an operation of the second lifter pins when the focus ring is unloaded in the substrate processing system according to an embodiment. [Figure 14A] FIG. 14A is a schematic top view showing an example of the configuration of a pick included in the substrate processing system of one embodiment. [Figure 14B] FIG. 14B is a schematic front view of the pick shown in FIG. 14A. [Figure 15A] FIG. 15A is a schematic top view showing a state in which a wafer is held on the pick shown in FIG. 14A. [Figure 15B] FIG. 15B is a schematic front view of the pick and the wafer shown in FIG. 15A as viewed from the horizontal direction. [Figure 16A] FIG. 16A is a schematic top view showing a state in which the focus ring is held on the pick shown in FIG. 14A. [Figure 16B] FIG. 16B is a schematic front view of the pick and focus ring shown in FIG. 16A as viewed from the horizontal direction. [Figure 17] FIG. 17 is a diagram for explaining an arrangement position of the third sensor in the substrate processing system of one embodiment. [Figure 18A] FIG. 18A is a schematic perspective view of a plate included in a gate valve of one embodiment. [Figure 18B] FIG. 18B is a schematic perspective view showing an enlarged portion of the gate valve of one embodiment. [Figure 18C] FIG. 18C is a schematic perspective view showing a state in which the opening of the gate valve of the embodiment is blocked. [Figure 19A] FIG. 19A is a diagram for explaining a positional relationship between a consumable part being transported and a sensor in one embodiment. [Figure 19B] FIG. 19B is a diagram showing an example of a detection signal in the example of FIG. 19A. [Figure 20A] FIG. 20A is a diagram for explaining the positional deviation of a consumable part during transportation. [Figure 20B] FIG. 20B is a diagram showing an example of a detection signal in the example of FIG. 20A. [Figure 21]FIG. 21 is a diagram showing the positional relationship between the consumable parts and the sensors when four sensors are arranged. [Figure 22] FIG. 22 is a diagram for explaining a method for calculating the positional deviation of the consumable part. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the disclosed embodiments will be described in detail with reference to the drawings. Note that the present embodiments are not limited to the above embodiments. In addition, the embodiments can be appropriately combined as long as the processing contents are not contradictory.

[0011] (Configuration Example of Substrate Processing System According to the Embodiment) In one embodiment, the substrate processing system transports used consumable parts from a vacuum processing chamber to a storage unit and transports unused consumable parts from the storage unit to the vacuum processing chamber. In one embodiment, the transport of the used consumable parts and the transport of the unused consumable parts are performed in parallel.

[0012] Here, the term "consumable parts" refers to parts that wear out and require replacement due to repeated plasma processing in a substrate processing system having multiple chambers (vacuum processing chambers) in which plasma processing is performed in a reduced pressure atmosphere. An example of a consumable part is a focus ring that is placed on a mounting table in a chamber. In addition to a focus ring, consumable parts include any part that can be carried into and out of a chamber by a device such as a robot arm. In the following description, an embodiment will be described using a focus ring as an example of a consumable part. In the following description, "vacuum" refers to a state of a space filled with gas at a pressure lower than atmospheric pressure. That is, in the following description, "vacuum" includes a reduced pressure state or a negative pressure state. In the following description, "normal pressure" refers to a pressure approximately equal to atmospheric pressure.

[0013] FIG. 1 is a schematic configuration diagram of a substrate processing system 1 according to an embodiment.

[0014] The substrate processing system 1 includes a plurality of process modules PM (PM1 to PM8), a vacuum transfer chamber 10, a plurality of load lock modules LLM (LLM1, LLM2), an atmospheric pressure transfer chamber 20, a plurality of load ports LP (LP1 to LP5), and a controller 30.

[0015] In the example of FIG. 1, eight process modules PM1 to PM8, two load lock modules LLM1 to LLM2, and five load ports LP1 to LP5 are shown. However, the numbers of process modules PM, load lock modules LLM, and load ports LP included in the substrate processing system 1 are not limited to those shown in the figure. Hereinafter, unless there is a need to distinguish between them, the eight process modules PM1 to PM8 are collectively referred to as process modules PM. Similarly, the two load lock modules LLM1 to LLM2 are collectively referred to as load lock modules LLM. Similarly, the five load ports LP1 to LP5 are collectively referred to as load ports LP. The substrate processing system 1 according to this embodiment includes at least two load lock modules LLM.

[0016] The process module PM processes a semiconductor substrate (hereinafter, referred to as a wafer W) to be processed in a reduced pressure atmosphere. The process module PM is an example of a vacuum processing chamber. The process module PM performs processes such as etching and film formation. The process module PM includes a mounting stage that supports the wafer W, and a focus ring FR that is arranged on the mounting stage to surround the wafer W. The process module PM also includes first lifter pins (see 172 in FIGS. 2 and 3, which will be described later) that are arranged in an area on the mounting stage where the wafer W is mounted and can be raised and lowered, and second lifter pins (see 182 in FIGS. 2 and 3, which will be described later) that are arranged in an area on the mounting stage where the focus ring FR is mounted and can be raised and lowered. The first lifter pins are raised to lift the wafer W from the mounting stage. The second lifter pins are raised to lift the focus ring FR from the mounting stage. A reduced pressure atmosphere is maintained inside the process module PM during processing of the wafer W.

[0017] Each process module PM is connected to the vacuum transfer chamber 10 via an openable and closable gate valve GV. The gate valve GV is closed while processing of a wafer W is being performed in the process module PM. The gate valve GV is opened when a processed wafer W is unloaded from the process module PM and when an unprocessed wafer W is loaded into the process module PM. The gate valve GV is also opened when a focus ring FR is loaded or unloaded from the process module PM. The process module PM is provided with a gas supply unit for supplying a predetermined gas and an exhaust unit capable of vacuum drawing. Details of the process module PM will be described later.

[0018] The vacuum transfer chamber 10 can maintain a reduced pressure atmosphere inside. The wafer W is transferred to each process module via the vacuum transfer chamber 10. In the example of FIG. 1, the vacuum transfer chamber 10 is substantially pentagonal in top view, and the process modules PM are arranged around the vacuum transfer chamber 10 along its four sides. The wafer W processed in the process module PM can be transferred via the vacuum transfer chamber 10 to the process module PM where the next process will be performed. After all processes are completed, the wafer W is transferred via the vacuum transfer chamber 10 to the load lock module LLM. The vacuum transfer chamber 10 is equipped with a gas supply unit (not shown) and an exhaust unit capable of vacuuming.

[0019] A first transfer mechanism for transferring the wafer W and the focus ring FR (hereinafter also referred to as the transfer object) is disposed in the vacuum transfer chamber 10. For example, a VTM (Vacuum Transfer Module) arm 15 shown in Fig. 1 is an example of the first transfer mechanism. This VTM arm 15 transfers the transfer object between the process modules PM1 to PM8 and the load lock modules LLM1 and LLM2.

[0020] The VTM arm 15 shown in FIG. 1 has a first arm 15a and a second arm 15b. The first arm 15a and the second arm 15b are attached to a base 15c. The base 15c can slide on guide rails 16a and 16b in the longitudinal direction of the vacuum transfer chamber 10. For example, the base 15c moves in the vacuum transfer chamber 10 by a motor driving a screw screwed into the guide rails 16a and 16b. The first arm 15a and the second arm 15b are fixed to the base 15c so as to be rotatable. In addition, a first pick 17a and a second pick 17b, each of which has a substantially U-shape, are rotatably connected to the tip of the first arm 15a and the tip of the second arm 15b.

[0021] VTM arm 15 includes a motor (not shown) for extending and retracting first arm 15a and second arm 15b, and a motor (not shown) for raising and lowering first arm 15a and second arm 15b.

[0022] The vacuum transfer chamber 10 also includes first sensors S1-S16 arranged in association with each process module PM. The first sensors S1-S16 are arranged in pairs, and each pair corresponds to one process module PM. The first sensors S1-S16 are sensors for detecting positional deviation of the wafer W and focus ring FR transferred to the corresponding process module PM. The transfer positions are corrected based on the detected positions. Position information of the wafer W and focus ring FR detected by the first sensors S1-S16 is transmitted to the controller 30. Since the first sensors S1-S16 each have the same configuration, the first sensors S1 and S2 arranged in front of the process module PM1 will be described as representative sensors.

[0023] The first sensors S1 and S2 are, for example, transmission type photoelectric sensors, and have a light-projecting unit and a light-receiving unit that are respectively arranged on the ceiling side and the floor side of the vacuum transfer chamber 10. The first sensors S1 and S2 are each arranged on a transfer path when the wafer W and the focus ring FR are transferred from the vacuum transfer chamber 10 to the process module PM1. For example, the first sensors S1 and S2 are arranged at a position where at least a part of the wafer W and the focus ring FR passes between the light-projecting unit and the light-receiving unit of the first sensors S1 and S2. When the VTM arm 15 holds the wafer W and transfers it to the process module PM1, the wafer W passes under the light-projecting units of the sensors S1 and S2. The light-projecting unit located above the wafer W emits light, and the light-receiving unit located below the wafer W receives the emitted light. While the wafer W passes under the light-projecting unit, the light-receiving unit stops receiving light. When the wafer W passes under the light-projecting unit, the light-receiving unit resumes receiving light. Therefore, it is possible to detect the positional deviation of the wafer W or the focus ring FR based on the length of the light reception stop period of the first sensors S1, S2. Based on the position information transmitted from the first sensors S1, S2, controller 30 corrects the position of the wafer W, i.e., the position of VTM arm 15, and transports the wafer W or focus ring FR to the process module PM1.

[0024] The vacuum transfer chamber 10 also includes second sensors S17-S18 arranged in association with each load lock module LLM. The second sensors S17-S18 are arranged on the transfer path between the load lock modules LLM1 and LLM2 and the vacuum transfer chamber 10. In the example of FIG. 1, one second sensor is arranged in front of one load lock module LLM. When the VTM arm 15 transfers the transfer object to the front of the load lock module LLM, the VTM arm 15 waits in front of the load lock module LLM until the second sensor S17 or S18 detects the transfer object. When the second sensor S17 (S18) cannot detect the transfer object, the VTM arm 15 rotates the tip of the first pick 17a (17b) during the transfer operation left and right in a horizontal plane in response to an instruction from the control device 30, and moves the transfer object to a position where the second sensor S17 (S18) can detect it. When the second sensor S17 (S18) detects the transported object, the VTM arm 15 resumes transport to the load lock module LLM, which is a predetermined destination.

[0025] The load lock module LLM includes a stage on which a transfer object is placed, and support pins for raising and lowering the wafer W and the focus ring FR. The configuration of the support pins may be the same as the configuration of the first lifter pins and the second lifter pins in the process module PM described later. The load lock module LLM includes an exhaust mechanism (not shown), such as a vacuum pump and a leak valve, and the inside of the load lock module LLM can be switched between an air atmosphere and a reduced pressure atmosphere. The load lock modules LLM are arranged side by side along one side of the vacuum transfer chamber 10 where the process module PM is not arranged. The load lock module LLM and the vacuum transfer chamber 10 are configured to be able to communicate with each other through a gate valve GV.

[0026] The VTM arm 15 holds an object lifted by support pins from a pedestal in the load lock module LLM and transports it to a mounting pedestal in the process module PM. The VTM arm 15 also holds a wafer W lifted by lifting first lifter pins (172, see FIG. 2) in the process module PM and transports it to the pedestal in the load lock module LLM. The VTM arm 15 also holds a focus ring FR lifted by lifting second lifter pins (182, see FIG. 2) in the process module PM and transports it to the pedestal in the load lock module LLM.

[0027] The load lock module LLM is connected to an atmospheric pressure transfer chamber 20 on the side opposite to the side connected to the vacuum transfer chamber 10. The load lock module LLM and the atmospheric pressure transfer chamber 20 are configured to be able to communicate with each other through a gate valve GV.

[0028] The atmospheric pressure transfer chamber 20 is maintained in an atmospheric pressure atmosphere. In the example of FIG. 1, the atmospheric pressure transfer chamber 20 has a substantially rectangular shape in top view. A plurality of load lock modules LLM are arranged in parallel on one long side of the atmospheric pressure transfer chamber 20. A plurality of load ports LP are arranged in parallel on the other long side of the atmospheric pressure transfer chamber 20. A second transfer mechanism for transferring a transfer object between the load lock module LLM and the load port LP is disposed in the atmospheric pressure transfer chamber 20. The LM (Loader Module) arm 25 shown in FIG. 1 is an example of the second transfer mechanism. The LM arm 25 has an arm 25a. The arm 25a is rotatably fixed on a base 25c. The base 25c is fixed near the load port LP3. A first pick 27a and a second pick 27b, each of which is substantially U-shaped, are rotatably connected to the tip of the arm 25a.

[0029] At least one of the first pick 27a and the second pick 27b has a mapping sensor MS (not shown) at its tip. For example, the mapping sensor MS is disposed at two ends of the approximately U-shape of each of the first pick 27a and the second pick 27b. When a FOUP (Front Opening Unified Pod) described later is connected to the load port LP, the cover of the FOUP opens, and the mapping sensor MS performs mapping. That is, the mapping sensor MS detects the wafer W or the focus ring FR in the FOUP and transmits the detection result to the controller 30. Note that the wafer W and the focus ring FR have different arrangement intervals and thicknesses when accommodated in the FOUP, and therefore the controller 30 switches the threshold value of the mapping sensor MS according to the type (detection target) of the FOUP described later.

[0030] Third sensors S20 to S27 are also disposed in the atmospheric pressure transfer chamber 20. The third sensors S20 to S27 detect the wafer W and focus ring FR being transferred. The third sensors S20 to S23 detect the transported object between the load lock module LLM and the atmospheric pressure transfer chamber 20. The third sensors S24 to 27 detect the transported object between the atmospheric pressure transfer chamber 20 and the load port LP. The third sensors S20 to S27 are provided on the transport path of the LM arm 25 between the door (described later) of the load port LP and the load lock module LLM. The third sensors S20 to S27 are arranged in pairs in front of the load lock modules LLM1, LLM2, and the load ports LP2 and LP4. The third sensors S20 to 27 may be transmission type photoelectric sensors similar to the first sensors S1 to S16. The third sensors S20 to 27 are configured to be able to detect both the wafer W and the focus ring FR.

[0031] During the transfer of the wafer W or the focus ring FR, a detection error may occur in the first sensors S1-16, the second sensors S17, 18, and the third sensors S20-S27. In such a case, there is a possibility of a malfunction, such as the transported object falling from the VTM arm 15 or the LM arm 25. For this reason, when a detection error occurs, the substrate processing system 1 suspends the process. However, when a detection error occurs, the substrate processing system 1 may not suspend the process immediately, and may move the tip of the pick of the VTM arm 15 or the LM arm 25 that is the subject of the detection error in the horizontal direction and perform re-detection. If a detection error occurs again as a result of the re-detection, the substrate processing system 1 suspends the process. If a transported object is detected as a result of the re-detection, the substrate processing system 1 continues the process.

[0032] In the example of Fig. 1, among the load ports LP1 to LP5, corresponding third sensors are arranged only on the load ports LP2 and LP4. In the example of Fig. 1, the third sensors are arranged only at positions corresponding to the load ports LP on which a FOUP for a focus ring FR can be installed. In another example, the third sensors may be arranged in correspondence with all the load ports LP.

[0033] The load port LP is formed so that a FOUP that houses a wafer W or a focus ring FR can be attached. The FOUP is a container that can house a wafer W or a focus ring FR. The FOUP has an openable and closable lid. When the FOUP is placed on the load port LP, the FOUP lid engages with the door of the load port LP. Then, the latch of the FOUP lid is released, and the FOUP lid can be opened. In this state, by opening the door of the load port LP, the FOUP lid moves together with the door to open the FOUP, and the inside of the FOUP communicates with the inside of the normal pressure transfer chamber 20 via the load port LP. The FOUP according to one embodiment includes a wafer FOUP that can house a wafer W and a focus ring (FR) FOUP that can house a focus ring FR. The wafer FOUP is an example of a first storage unit, and the FR FOUP is an example of a second storage unit.

[0034] The wafer FOUP has a shelf-like storage section corresponding to the number of wafers W to be stored. The FR FOUP is formed to be able to store, for example, the number of focus rings FR corresponding to the number of process modules PM included in the substrate processing system 1. For example, if there are eight process modules PM in which focus rings FR are arranged, the FR FOUP may be able to store eight unused focus rings FR and eight used focus rings FR. The upper eight storage sections can store unusable focus rings FR, and the lower eight storage sections can store used focus rings FR. The used focus rings FR are stored at the lower part in order to prevent particles adhering to the used focus rings FR from adhering to the unusable focus rings FR. The number of wafers W and focus rings FR that can be stored in the FOUP is an example, and a FOUP that can store any number of wafers W and focus rings FR can be configured.

[0035] The load port LP includes a first load port to which a wafer FOUP can be attached and a second load port to which a FR FOUP can be attached. In the example of FIG. 1, the load ports LP1, LP3, and LP5 are first load ports. The load ports LP2 and LP4 are second load ports. The first load port is an example of a first attachment portion, and the second load port is an example of a second attachment portion. The second load port in one embodiment can attach both a wafer FOUP and a FR FOUP. The FR FOUP may be attached only when the focus ring FR is replaced, or may be attached all the time. In another example, the number of second load ports may be single.

[0036] Each load port LP includes a reading unit (not shown) for reading the carrier ID (identifier) ​​of the FOUP. The carrier ID is an identifier for identifying the type of each FOUP. In order to distinguish between FR FOUPs and wafer FOUPs, a naming rule for the carrier ID can be set in advance in the substrate processing system 1. For example, a carrier ID starting with a predetermined character string may be recognized as the carrier ID of a FR FOUP, and a carrier ID starting with another predetermined character string may be recognized as the carrier ID of a wafer FOUP. For example, a carrier ID starting with "FR_" is set in the substrate processing system 1 as a FR FOUP, and a carrier ID starting with "W_" is set in the substrate processing system 1 as a wafer FOUP. The naming rule for the carrier ID may be set by default or by an operator. When a FOUP is placed on the load port LP and locked, the reading unit reads the carrier ID given to the FOUP. The substrate processing system 1 identifies whether each FOUP is a wafer FOUP or a FR FOUP based on the carrier ID. When the carrier ID is authenticated and the FOUP is connected to the load port LP, the FOUP lid is opened together with the load port door, and the wafer W or focus ring FR accommodated in the FOUP is detected by the mapping sensor MS of the LM arm 25.

[0037] An aligner AU is disposed on one short side of the normal pressure transfer chamber 20. The aligner AU has a rotating stage on which the wafer W is placed, and an optical sensor that optically detects the outer periphery of the wafer W. The aligner AU aligns the wafer W by detecting, for example, an orientation flat, a notch, or the like of the wafer W.

[0038] The process module PM, vacuum transfer chamber 10, VTM arm 15, load lock module LLM, atmospheric pressure transfer chamber 20, LM arm 25, load port LP, and aligner AU configured as described above are each connected to a controller 30 and controlled by the controller 30.

[0039] The control device 30 is an information processing device that controls each part of the substrate processing system 1. The specific configuration and functions of the control device 30 are not particularly limited. The control device 30 includes, for example, a storage unit 31, a processing unit 32, an input / output interface (IO I / F) 33, and a display unit 34. The storage unit 31 is, for example, any storage device such as a hard disk, an optical disk, or a semiconductor memory element. The processing unit 32 is, for example, a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The display unit 34 is, for example, a functional unit that displays information, such as a liquid crystal screen or a touch panel.

[0040] The processing unit 32 reads out and executes the programs and recipes stored in the storage unit 31, thereby controlling each unit of the substrate processing system 1 via the input / output interface 33. The processing unit 32 also identifies the type of FOUP connected to each load port LP based on the carrier ID read by a reading unit provided in the load port LP, and stores the type in the storage unit 31. The processing unit 32 also receives information on the wafer W and focus ring FR in the FOUP detected by the mapping sensor MS, and stores the information in the storage unit 31. The processing unit 32 also receives information on the content and progress of the process being executed in each process module PM from a sensor (not shown) or the like provided in each process module PM, and stores the information in the storage unit 31. The control device 30 also receives a notification of a detection error from the second sensor and the third sensor, and executes a process of redetection or cancellation of the process. The control device 30 also controls and executes each of the following processes: exchange timing notification process, FR FOUP installation process, FR FOUP removal process, exchange reservation process, exchange reservation cancellation process, and exchange process, which will be described later.

[0041] (Example of process module PM configuration) Fig. 2 is a schematic configuration diagram of an example of a process module PM included in the substrate processing system 1 according to an embodiment. The process module PM shown in Fig. 2 is a parallel plate type plasma processing apparatus.

[0042] The process module PM includes a processing chamber 102 having a cylindrical processing container made of aluminum whose surface has been anodized (alumite treated). The processing chamber 102 is grounded. A substantially cylindrical mounting table 110 for mounting a wafer W thereon is provided at the bottom of the processing chamber 102. The mounting table 110 includes a plate-shaped insulator 112 made of ceramic or the like, and a susceptor 114 that constitutes a lower electrode provided on the insulator 112.

[0043] The mounting table 110 includes a susceptor temperature adjustment unit 117 capable of adjusting the temperature of the susceptor 114 to a predetermined temperature. The susceptor temperature adjustment unit 117 is configured to circulate a temperature adjustment medium in a temperature adjustment medium chamber 118 provided in the susceptor 114, for example.

[0044] The susceptor 114 has a convex substrate mounting portion formed in the upper center thereof, the upper surface of which serves as a substrate mounting surface 115, and the upper surface of the lower portion around the substrate mounting portion serves as a focus ring mounting surface 116 on which a focus ring FR is mounted. As shown in FIG. 2, when an electrostatic chuck 120 is provided on the upper portion of the substrate mounting portion, the upper surface of the electrostatic chuck 120 serves as the substrate mounting surface 115. The electrostatic chuck 120 has an electrode 122 interposed between insulating materials. A DC voltage of, for example, 1.5 kV is applied to the electrostatic chuck 120 from a DC power source (not shown) connected to the electrode 122. This causes the wafer W to be electrostatically attracted to the electrostatic chuck 120. The substrate mounting portion is formed to have a diameter smaller than the diameter of the wafer W, so that the peripheral portion of the wafer W extends beyond the substrate mounting portion when the wafer W is mounted thereon.

[0045] A focus ring FR is disposed on the upper peripheral edge of the susceptor 114 so as to surround the wafer W placed on a substrate mounting surface 115 of the electrostatic chuck 120. The focus ring FR is placed on a focus ring mounting surface 116 of the susceptor 114.

[0046] The insulator 112, the susceptor 114, and the electrostatic chuck 120 are provided with gas passages for supplying a heat transfer medium (e.g., a backside gas such as He gas) to the backside of the wafer W placed on the substrate placement surface 115. Heat is transferred between the susceptor 114 and the wafer W via this heat transfer medium, and the wafer W is maintained at a predetermined temperature.

[0047] An upper electrode 130 is provided above the susceptor 114 so as to face the susceptor 114. A space formed between the upper electrode 130 and the susceptor 114 becomes a plasma generation space. The upper electrode 130 is supported on the upper part of the processing chamber 102 via an insulating shielding member 131.

[0048] The upper electrode 130 is mainly composed of an electrode plate 132 and an electrode support 134 that detachably supports the electrode plate 132. The electrode plate 132 is made of, for example, quartz, and the electrode support 134 is made of, for example, a conductive material such as aluminum whose surface has been anodized.

[0049] The electrode support 134 is provided with a process gas supply unit 140 for introducing a process gas from a process gas supply source 142 into the process chamber 102. The process gas supply source 142 is connected to a gas inlet 143 of the electrode support 134 via a gas supply pipe 144.

[0050] 2, a mass flow controller (MFC) 146 and an opening / closing valve 148 are provided in this order from the upstream side of the gas supply pipe 144. Note that a flow control system (FCS) may be provided instead of the MFC. A process gas for etching is supplied from a process gas supply source 142, for example, C 4 F 8 A gas such as a fluorocarbon gas (CxFy) is provided.

[0051] The processing gas supply source 142 is adapted to supply, for example, an etching gas for plasma etching. Although only one processing gas supply system including the gas supply pipe 144, the opening / closing valve 148, the mass flow controller 146, the processing gas supply source 142, etc. is shown in FIG. 2, the process module PM is provided with a plurality of processing gas supply systems. For example, CF 4 , O 2 , N 2 , CHF 3 The flow rates of the various process gases are controlled independently and supplied into the process chamber 102 .

[0052] The electrode support 134 is provided with, for example, a substantially cylindrical gas diffusion chamber 135, which can uniformly diffuse the processing gas introduced from the gas supply pipe 144. A large number of gas discharge holes 136 are formed in the bottom of the electrode support 134 and the electrode plate 132, for discharging the processing gas from the gas diffusion chamber 135 into the processing chamber 102. The processing gas diffused in the gas diffusion chamber 135 can be uniformly discharged from the large number of gas discharge holes 136 toward the plasma generation space. In this respect, the upper electrode 130 functions as a shower head for supplying the processing gas.

[0053] The upper electrode 130 includes an electrode support temperature regulator 137 capable of regulating the electrode support 134 to a predetermined temperature. The electrode support temperature regulator 137 is configured to circulate a temperature control medium in a temperature control medium chamber 138 provided in the electrode support 134, for example.

[0054] An exhaust pipe 104 is connected to the bottom of the processing chamber 102, and an exhaust unit 105 is connected to the exhaust pipe 104. The exhaust unit 105 is equipped with a vacuum pump such as a turbo molecular pump, and adjusts the interior of the processing chamber 102 to a predetermined reduced pressure atmosphere. A transfer port 106 for the wafer W is provided on the side wall of the processing chamber 102, and a gate valve 108 (corresponding to GV in FIG. 1) is provided at the transfer port 106. The gate valve 108 is opened when the wafer W is transferred in or out. Then, the wafer W is transferred in or out through the transfer port 106 by a transfer arm (not shown) or the like.

[0055] A first high frequency power supply 150 is connected to the upper electrode 130, and a first matching box 152 is inserted in the power supply line. The first high frequency power supply 150 is capable of outputting high frequency power for generating plasma having a frequency in the range of 50 to 150 MHz. By applying such high frequency power to the upper electrode 130, a high density plasma in a preferable dissociation state can be formed in the processing chamber 102, and plasma processing can be performed under lower pressure conditions. The frequency of the output power from the first high frequency power supply 150 is preferably 50 to 80 MHz, and is typically adjusted to 60 MHz or a frequency in the vicinity of the illustrated frequency.

[0056] A second high frequency power supply 160 is connected to the susceptor 114 as the lower electrode, and a second matching box 162 is inserted in the power supply line. This second high frequency power supply 160 is capable of outputting high frequency power for biasing having a frequency in the range of several hundreds of kHz to several tens of MHz. The frequency of the output power from the second high frequency power supply 160 is typically adjusted to 2 MHz, 13.56 MHz, or the like.

[0057] In addition, a high-pass filter (HPF) 164 is connected to the susceptor 114, which filters the high-frequency current flowing from the first high-frequency power supply 150 to the susceptor 114, and a low-pass filter (LPF) 154 is connected to the upper electrode 130, which filters the high-frequency current flowing from the second high-frequency power supply 160 to the upper electrode 130.

[0058] The process module PM is connected to a control device 30 of the substrate processing system 1. The control device 30 controls each part of the process module PM. An input / output interface 33 of the control device 30 includes a keyboard through which an operator inputs commands to manage the process module PM, a display that visualizes and displays the operating status of the process module PM, and the like.

[0059] The storage unit 31 also stores programs for implementing various processes executed in the process module PM under the control of the controller 30, and processing conditions (recipes) required to execute the programs. These processing conditions are a collection of multiple parameter values, such as control parameters and setting parameters for controlling each part of the process module PM. Each processing condition has parameter values, such as the flow rate ratio of the processing gas, the pressure inside the processing chamber, and high-frequency power. These programs and processing conditions may be stored in a hard disk or semiconductor memory, or may be set at a predetermined position in the storage unit 31 while being stored in a portable computer-readable storage medium, such as a CD-ROM or DVD.

[0060] The control device 30 reads out a desired program and processing conditions from the storage unit 31 based on instructions via the input / output interface 33, and controls each unit to execute a desired process in the process module PM. The processing conditions can be edited by operating the input / output interface 33. Alternatively, a separate control device may be provided for each process module PM, and the entire substrate processing system 1 may be controlled by communication between each control device and the host device.

[0061] (An example of a lifter pin and drive mechanism) 3, first lifter pins 172 are provided on susceptor 114 of process module PM so as to be movable up and down from substrate mounting surface 115, and second lifter pins 182 are provided so as to be movable up and down from focus ring mounting surface 116. FIG. 3 is a perspective view for explaining the configuration of susceptor 114 shown in FIG. 2. Specifically, as shown in FIG. 2, first lifter pins 172 are driven by a first driving mechanism 170 and can lift up wafer W from substrate mounting surface 115. Second lifter pins 182 are driven by a second driving mechanism 180 and can lift up focus ring FR from focus ring mounting surface 116.

[0062] The first driving mechanism 170 and the second driving mechanism 180 are motors such as a DC motor, a stepping motor, or a linear motor, a piezoelectric actuator, an air driving mechanism, etc. The first driving mechanism 170 and the second driving mechanism 180 each have a driving accuracy suitable for transporting the wafer W and the focus ring FR.

[0063] The insulator 112 supporting the susceptor 114 of the process module PM is formed in an annular shape, and the first lifter pins 172 extend vertically upward from below the susceptor 114 surrounded by the insulator 112, and are provided so as to be freely raised and lowered from the substrate mounting surface 115, which is the upper surface of the electrostatic chuck 120. Each of the first lifter pins 172 is inserted into a hole formed by penetrating the susceptor 114 and the electrostatic chuck 120, and rises and falls from the substrate mounting surface 115 as shown in FIG. 3 according to the drive control of the first drive mechanism 170. The first drive mechanism 170 may be connected to an annular base on which the first lifter pins 172 are arranged at equal intervals, and may drive the first lifter pins 172 via the base. The number of the first lifter pins 172 is not limited to three. The first lifter pins 172 may be positioned so as not to interfere with the VTM arm 15 when the wafer W is loaded and unloaded.

[0064] The second lifter pins 182 extend vertically upward from below the susceptor 114 and are provided so as to be freely raised and lowered from the focus ring mounting surface 116. Each second lifter pin 182 is inserted into a hole formed penetrating from below the susceptor 114 to the focus ring mounting surface 116, and rises and falls from the focus ring mounting surface 116 as shown in FIG. 3 according to the drive control of the second drive mechanism 180. The second drive mechanism 180 may be connected to an annular base on which the second lifter pins 182 are arranged at equal intervals, and may drive the second lifter pins 182 via the base. Alternatively, each of the multiple second drive mechanisms 180 may drive one second lifter pin 182. The number of second lifter pins 182 is not limited to three. The second lifter pins 182 may be positioned at any position as long as they do not interfere with the VTM arm 15 when the focus ring FR is loaded or unloaded. The base connected to such second drive mechanism 180 has a larger diameter than the base connected to first drive mechanism 170, and is disposed outside the base connected to first drive mechanism 170. This allows first drive mechanism 170 and second drive mechanism 180 to raise and lower first lifter pins 172 and second lifter pins 182 independently of each other without interfering with each other.

[0065] According to the first driving mechanism 170 configured in this manner, the first lifter pins 172 can be raised to lift the wafer W from the electrostatic chuck 120. Moreover, according to the second driving mechanism 180, the second lifter pins 182 can be raised to lift the focus ring FR from the focus ring mounting surface 116.

[0066] 2, the focus ring FR is formed as a single unit, but it may be divided into two or more parts. For example, the inner diameter side, which is more likely to wear out, may be separated from the outer diameter side to form a configuration consisting of two members. In this case, only the inner focus ring may be lifted up by second lifter pins 182 and replaced.

[0067] (Mode setting) The substrate processing system 1 of this embodiment having the above configuration can be set to the following modes. (1) Access mode of load port LP (2) Maintenance mode for each part (3) Processing mode of process module PM

[0068] (1) Access mode of load port LP The access mode is a mode for setting whether or not automatic placement of a FOUP on a load port LP is to be accepted. Two types of access mode are set: manual mode and auto mode. In the manual mode, the substrate processing system 1 places and removes a FOUP on the condition that an operator inputs instructions. In the auto mode, the substrate processing system 1 places and removes a FOUP without any instruction input from the operator.

[0069] For example, in manual mode, the substrate processing system 1 does not accept installation and removal of a FOUP by an overhead hoist transfer (OHT). On the other hand, the substrate processing system 1 accepts installation and removal of a FOUP by an automated guided vehicle (AGV) if an operator inputs instructions in manual mode. On the other hand, in auto mode, the substrate processing system 1 accepts installation and removal of a FOUP by an OHT without operator input.

[0070] The manual mode is selected when it is necessary to install and remove a FOUP under the supervision of an operator. In this embodiment, installation and removal of a FOUP for FR can be performed only when the manual mode is selected.

[0071] (2) Maintenance mode for each part The maintenance mode is set when normal processing (processing of product wafers W) of each part of the substrate processing system 1 is stopped to perform maintenance. The maintenance mode can be set collectively for a set of modules that operate in cooperation with each other. For example, the normal pressure transfer chamber 20 and all of the load ports LP1 to LP5 can be set collectively to either the normal processing mode or the maintenance mode.

[0072] When the normal processing mode is set, each part of the substrate processing system 1 automatically operates based on a preset processing flow, whereas when the maintenance mode is set, each part of the substrate processing system 1 operates based on an input from an operator.

[0073] (3) Processing mode of process module PM The processing mode of the process module PM is a mode that specifies the processing of the product wafer W, for example, the execution of a plasma processing. Two processing modes can be set: a production mode and a non-production mode. In the production mode, the substrate processing system 1 can perform plasma processing on the product wafer W in the process module PM. On the other hand, in the non-production mode, the substrate processing system 1 cannot perform plasma processing on the product wafer W in the process module PM. In the substrate processing system 1 of this embodiment, when a replacement process of a consumable part is performed, the process module PM in which the consumable part is arranged is shifted to the non-production mode. After the consumable part is replaced, the process module PM is shifted to the production mode and the plasma processing of the product wafer W is resumed.

[0074] (Example of a flow of a transport process according to an embodiment) Fig. 4 is a diagram for explaining the flow of a transport process of consumable parts according to one embodiment. In Fig. 4, the left side shows processes performed by an operator, and the right side shows processes performed by the substrate processing system 1 (controller 30). However, the processes shown in Fig. 4 as being performed by an operator may be configured to be automatically performed by each part of the substrate processing system 1 as appropriate.

[0075] First, the substrate processing system 1 executes a process of notifying the operator of the timing for replacing a consumable part (step S21, see FIG. 5). For example, the substrate processing system 1 determines whether or not it is time to replace the focus ring FR. If the substrate processing system 1 determines that it is time to replace the focus ring FR, it transmits a notification to the operator notifying that it is time to replace the focus ring FR (step S22). For example, the substrate processing system 1 displays information indicating the arrival of the replacement timing on the display unit 34 of the control device 30.

[0076] After checking the information, the operator checks whether or not a FR FOUP has already been installed on the load port LP of the substrate processing system 1. If a FR FOUP has not been installed, the operator executes a process to install a FR FOUP (step S23, see FIG. 6).

[0077] The substrate processing system 1 detects the installation of the FR FOUP by a sensor, a reader, etc., and stores the completion of installation of the FR FOUP in the storage unit 31 (step S24, see FIG. 5). When the FR FOUP is installed, the substrate processing system 1 notifies the operator that a replacement reservation for the focus ring FR is possible. For example, the substrate processing system 1 displays a screen for accepting a replacement reservation on the display unit 34.

[0078] The operator executes a predetermined input to the substrate processing system 1 to make a reservation for replacement of the focus ring FR (step S25). In response to the operator's input, the substrate processing system 1 stores in the storage unit 31 a message indicating that the reservation for replacement of the focus ring FR has been completed (step S26). The substrate processing system 1 also notifies the operator that the reservation for replacement of the focus ring FR is in progress (step S27). For example, the substrate processing system 1 displays a message indicating that the reservation for replacement is in progress on the display unit 34.

[0079] Furthermore, when the replacement reservation is made, the substrate processing system 1 clears (resets) a counter used for notifying the replacement timing (step S28). The counter may be cleared in response to an input from an operator (step S29), or may be automatically cleared by the substrate processing system 1 when the replacement reservation is made.

[0080] Furthermore, when a predetermined condition is satisfied, the substrate processing system 1 starts replacing the focus ring FR (step S30). When the substrate processing system 1 starts replacing the focus ring FR, the substrate processing system 1 notifies an operator that the replacement is in progress (step S31). For example, the substrate processing system 1 displays on the display unit 34 that the replacement is in progress.

[0081] Furthermore, when the replacement of the focus ring FR is completed (step S32), the substrate processing system 1 notifies the operator that the replacement is completed (step S33). For example, the substrate processing system 1 erases the display on the display unit 34 indicating that the replacement is in progress.

[0082] When there are no unused focus rings FR housed in the FR FOUP, the operator executes a removal process for the FR FOUP (step S34). The substrate processing system 1 detects that the removal process has been executed and ends the process (step S35). This is the flow of the consumable part transport process in the substrate processing system 1. Note that the process flow shown in FIG. 4 is only an example, and each step may be executed in an order different from that shown in FIG. 4, or other processes may be additionally executed.

[0083] (Example of display screen) The display unit 34 of the substrate processing system 1 configured as above displays the state of each process module PM on a screen. The display unit 34 displays, for example, a graphical user interface (GUI) screen. An operator can set the processing of each part and the replacement timing of consumable parts by performing an input operation while watching the GUI displayed by the display unit 34.

[0084] The display unit 34 displays, among the load ports LP1 to LP5, the load ports LP1, LP3, and LP5 capable of mounting a wafer FOUP and the load ports LP2 and LP4 capable of mounting both a wafer FOUP and a FR FOUP in a manner that allows them to be distinguished from one another.

[0085] The display unit 34 also displays, in a distinguishable manner, a load port LP to which a wafer FOUP is already connected and a load port LP to which a wafer FOUP is not yet connected.The display unit 34 also displays, in a distinguishable manner, a load port LP to which a FR FOUP is already connected and a load port LP to which a FR FOUP is not yet connected.

[0086] Display unit 34 also identifiably displays the number and positions of wafers W housed in the wafer FOUP connected to the load port LP. Display unit 34 also identifiably displays the number of processed wafers W and the number of unprocessed wafers W, among the wafers W housed in the wafer FOUP, respectively. Display unit 34 also identifiably displays the number of focus rings FR housed in the FR FOUP connected to the load port LP. Display unit 34 also identifiably displays the number of unused focus rings FR and the number of used focus rings FR, among the focus rings FR housed in the FR FOUP, respectively.

[0087] The display unit 34 also displays processing conditions such as various modes and recipes set in the process modules PM. The display unit 34 switches the display screen in response to an input from an operator. The operator can input an instruction to switch between an individual screen for each process module PM, an overall screen showing the overall state of the substrate processing system 1, and the like, and cause the display unit 34 to display such an individual screen.

[0088] (An example of the replacement timing notification process flow) Next, a detailed description will be given of each process shown in Fig. 4. First, the replacement timing notification process (step S21) will be described.

[0089] As described above, the substrate processing system 1 according to the embodiment determines whether or not it is time to replace the focus ring FR. When it is determined that the focus ring FR has reached the replacement time, the substrate processing system 1 notifies an operator that the focus ring FR has reached the replacement time.

[0090] Here, the substrate processing system 1 determines whether or not it is time to replace the focus ring FR based on a predetermined parameter. When the preset parameter reaches a threshold value, the substrate processing system 1 determines that it is time to replace the focus ring FR.

[0091] For example, in the substrate processing system 1, parameters for the determination and thresholds of the parameters are stored in advance in the storage unit 31 of the control device 30. The parameters are, for example, the number of plasma processes performed by the process module PM after the focus ring FR is replaced, the duration of the performed plasma processes (discharge time), the number of processed wafers W, the exposure time of the focus ring FR to plasma, and the like. For example, the parameter may be the number of plasma processes performed after the focus ring FR is replaced, and the threshold may be 4000 times. Different parameters and thresholds may be set for each of a plurality of types of consumable parts. In addition to replacement of consumable parts, parameters and thresholds may be set in association with other maintenance items such as cleaning and maintenance for preventing regreasing of parts. In addition, when a plurality of process modules PM include the same consumable parts, different parameters and thresholds may be set for each process module PM. The parameters and thresholds may be set in advance in the substrate processing system 1, or may be set and input by an operator. In addition, the substrate processing system 1 may be configured to display information corresponding to a notification received from an external device, for example, a host device, without determining the timing of performing maintenance within the substrate processing system 1.

[0092] FIG. 5 is a flow chart showing an example of a flow of replacement timing notification in the substrate processing system 1 of an embodiment. First, an operator inputs a parameter used for determining replacement timing and a threshold value of the parameter to the substrate processing system 1. The substrate processing system 1 sets the parameter and the threshold value according to the input (step S51). Then, the substrate processing system 1 counts the parameter, for example, the number of processed wafers W. The substrate processing system 1 judges whether the count value reaches the set threshold value (step S52). If it is judged that the threshold value has not been reached (step S52, No), the substrate processing system 1 repeats the judgment of step S52. On the other hand, if it is judged that the threshold value has been reached (step S52, Yes), the substrate processing system 1 transmits a notice that the replacement timing has arrived (step S53). For example, the substrate processing system 1 displays the replacement timing notice on the display unit 34. Then, the substrate processing system 1 judges whether or not an instruction to reset the counter has been given (step S54). If it is determined that there is no instruction to reset (step S54, No), the substrate processing system 1 repeats the determination of step S54. On the other hand, if it is determined that there is an instruction to reset (step S54, Yes), the substrate processing system 1 resets the counter (step S55). Then, the substrate processing system 1 returns to step S52 and repeats the process.

[0093] (An example of the FR FOUP installation process flow) Next, an example of the flow of the process for placing the FR FOUP (FIG. 4, steps S23 and S24) will be described. FIG 6 is a flowchart showing an example of the flow of placing the FR FOUP in the substrate processing system 1 of one embodiment.

[0094] As described above, the substrate processing system 1 of the embodiment distinguishably displays the load ports LP2 and LP4 capable of accommodating either a wafer FOUP or a FR FOUP, and the load ports LP1, LP3, and LP5 capable of accommodating a wafer FOUP. For example, the display unit 34 displays the load ports LP capable of accommodating a FR FOUP and the load ports LP capable of accommodating a wafer FOUP in different colors.

[0095] First, the operator designates a target load port (e.g., load port LP4) on which an FR FOUP is to be placed on the screen displayed by the display unit 34 of the substrate processing system 1. Then, the operator sets the access mode of the target load port LP4 to manual mode (step S701).

[0096] When the operator sets the load port LP4 to the manual mode, the substrate processing system 1 detects the set mode (step S702), and changes the access mode stored in the memory unit 31 in association with the load port LP4 to the manual mode.

[0097] Next, the operator operates, for example, an AGV to place the FR FOUP on the load port LP4, which is the target load port (step S703). Then, the operator inputs an instruction to the substrate processing system 1 to place the FR FOUP (step S704). The substrate processing system 1 detects the input of the instruction (step S705).

[0098] When the substrate processing system 1 detects the input of the instruction, it first holds the FR FOUP on the load port LP4 (step S706). When the FR FOUP is held on the load port LP4, the reading unit included in the load port LP4 reads the carrier ID of the FR FOUP. The carrier ID read by the reading unit is transmitted to the processing unit 32 of the control device 30, and the processing unit 32 determines whether the carrier ID is the carrier ID of the FR FOUP and authenticates the carrier ID (step S707). Since the load port LP4 is a load port for FR FOUPs, if the carrier ID is the carrier ID of a wafer FOUP, the processing unit 32 notifies the operator that installation is not possible. For example, the processing unit 32 causes the display unit 34 to display a notice that installation is not possible. On the other hand, if the read carrier ID is the carrier ID of a FR FOUP, the processing unit 32 authenticates the carrier ID. The authenticated carrier ID is stored in the storage unit 31 in association with the load port LP4. Furthermore, the processing unit 32 sets a threshold value for the mapping sensor MS according to the authenticated carrier ID.

[0099] When the carrier ID is authenticated, the substrate processing system 1 next connects the placed FR FOUP to the load port LP4 (step S708). When the connection of the FR FOUP is completed, the substrate processing system 1 opens the cover of the FR FOUP and the door of the load port LP4 to communicate the inside of the FR FOUP with the inside of the normal pressure transfer chamber 20 (step S709). When the cover of the FR FOUP is opened, the mapping sensor MS performs mapping of the focus rings FR in the FR FOUP (step S710). The mapping sensor MS detects the positions and number of the focus rings FR in the FR FOUP. At this time, the mapping sensor MS performs detection based on a calibration (reference value, threshold value for calibration) that is compatible with the size of the focus ring FR. The mapping sensor MS notifies the controller 30 of the detected positions and number of the focus rings FR. The controller 30 stores the notified positions and number of the focus rings FR in the storage unit 31. Then, the control device 30 updates the screen by displaying the positions and the number of the focus rings FR on the display unit 34 (step S711). This completes the FR FOUP installation process.

[0100] When a FR FOUP is installed, the display unit 34 updates the display screen according to each stage of installation. The display unit 34 displays, in different modes, a load port on which a FR FOUP has not been installed (first state) and a load port on which a FR FOUP has been connected but mapping of the focus ring FR has not been completed (second state). The display unit 34 also displays, in different modes, the load ports in the first and second states and a load port on which a FR FOUP has been connected and mapping of the focus ring FR has been completed (third state).

[0101] (An example of the process flow for removing a FR FOUP) Next, an example of a process flow (FIG. 4, steps S34 and S35) when removing the FR FOUP will be described. FIG 7 is a flowchart showing an example of a process flow for removing the FR FOUP in the substrate processing system 1 of one embodiment.

[0102] The operator first designates the target load port (for example, load port LP4) on the display screen, and then inputs an instruction to remove the FR FOUP (step S901).

[0103] The substrate processing system 1 receives an instruction from the operator (step S902). Upon receiving the instruction, the substrate processing system 1 first closes the lid of the target FR FOUP (step S903). Then, the substrate processing system 1 releases the connection between the FR FOUP and the load port LP4 (step S904). Furthermore, the substrate processing system 1 releases the lock of the FR FOUP (step S905). After releasing the lock, the substrate processing system 1 notifies the operator that removal of the FR FOUP is complete (step S906). For example, the substrate processing system 1 displays the completion of removal on the display unit 34. Upon receiving the notification from the substrate processing system 1, the operator operates the AGV to remove the FR FOUP from the load port LP4 and transport it (step S907). Upon completing the transport, the operator inputs a predetermined instruction to the substrate processing system 1 (step S908). When the substrate processing system 1 receives the instruction input from the operator, the substrate processing system 1 stores the completion of the removal of the FR FOUP in the storage unit 31 and updates the screen (step S909). This completes the removal of the FR FOUP.

[0104] The display unit 34 may display the load port LP during the FOUP removal process (fourth state) in a manner different from any of the first to third states described above.

[0105] (Modification 1 of FR FOUP installation process) In the above description, the reading unit of the load port LP reads the carrier ID of the FR FOUP, and the processing unit 32 performs authentication and stores the carrier ID in the storage unit 31. However, there are cases where a carrier ID is not assigned to each FOUP in advance. Therefore, the substrate processing system 1 may be configured so that the operator can input the carrier ID when placing the FOUP.

[0106] For example, the storage unit 31 stores information on a carrier ID input screen that accepts input from an operator in advance. When the process of FIG. 6 starts and the operator inputs an instruction to install a FOUP to the substrate processing system 1 (step S704), the substrate processing system 1 executes steps S705 to S706. After that, in step S707, the substrate processing system 1 displays a carrier ID input screen instead of reading a carrier ID. In the carrier ID input screen, the operator inputs information that identifies the target load port LP and the carrier ID of a FOUP that is being installed on the target load port LP. When a carrier ID is input to the carrier ID input screen, the processing unit 32 identifies whether the carrier ID is an ID of a FOUP for FR or an ID of a FOUP for wafers. The identification result is stored in the storage unit 31. In this way, during the process of FIG. 6, instead of step S707, the substrate processing system 1 displays a carrier ID input screen, accepts input of a carrier ID, and authenticates the carrier ID. The input of the carrier ID and the process after authentication are the same as those in the process of FIG. 6 (steps S708 and after).

[0107] If the substrate processing system 1 fails to read the carrier ID in step S707, the substrate processing system 1 may be configured to display a carrier ID input screen.

[0108] (Modification 2 of FR FOUP installation process) In the above description, the substrate processing system 1 is described as distinguishing between FR FOUPs and wafer FOUPs by carrier IDs. However, the present invention is not limited to this, and the substrate processing system 1 may be configured to distinguish between FR FOUPs and wafer FOUPs based on an input by an operator.

[0109] For example, similarly to the above-mentioned modified example 1, information on an input screen for accepting an input from an operator is stored in advance in the storage unit 31. When the process of FIG. 6 starts and the operator inputs an instruction to install a FOUP to the substrate processing system (step S704), the substrate processing system 1 executes steps S705 to S706. Thereafter, in step S707, the substrate processing system 1 displays an input screen instead of reading a carrier ID. The input screen of modified example 2 differs from that of modified example 1 in that it allows the operator to specify the type of FOUP. The operator inputs information on the input screen specifying whether the FOUP being installed on the load port is a wafer FOUP or an FR FOUP. For example, during the process of FIG. 6, instead of step S707, the substrate processing system 1 executes displaying an input screen for the type of FOUP and carrier ID and accepting the input contents. The subsequent process is similar to the process of FIG. 6 (step S708 and thereafter).

[0110] The input screen of the second modification may be configured to be displayed when the substrate processing system 1 fails to read the carrier ID. Also, the input screen of the second modification may be configured to be displayed when the information inputted into the carrier ID input screen of the first modification is invalid.

[0111] By configuring as described above, even if a FOUP without a carrier ID is placed in the system or if the operator makes an input error, the substrate processing system 1 can alert the operator and continue processing without delay.

[0112] (An example of the exchange reservation process flow) Next, an example of the flow of the replacement reservation process for the focus ring FR (FIG. 4, steps S25 to S27) will be described.

[0113] Here, the replacement reservation refers to a process of instructing the substrate processing system 1 to replace a consumable part such as the focus ring FR for which the replacement timing has arrived. In this embodiment, the substrate processing system 1 replaces the consumable part when the replacement reservation is made by an operator. However, the substrate processing system 1 may be configured to automatically start the replacement process when the replacement timing arrives. In this case, the replacement reservation process is omitted.

[0114] (Timing when exchange reservation processing can be performed) In this embodiment, the replacement reservation process is possible when the installation of the FR FOUP on the load port LP is complete. When the FR FOUP is not installed on the load port LP, the substrate processing system 1 cannot execute the replacement reservation process. Alternatively, when the operator attempts to execute the replacement reservation process, the substrate processing system 1 displays an error.

[0115] FIG. 8A is a flowchart showing an example of the flow of replacement reservation processing in the substrate processing system 1 of an embodiment. First, the operator inputs an instruction to the substrate processing system 1 to request the display of an replacement reservation screen (step S1301). The substrate processing system 1 displays the replacement reservation screen in response to the instruction input (step S1302). If the FR FOUP is not installed, the substrate processing system 1 displays an error and ends the processing. For example, the replacement reservation screen displays a list of consumables due for replacement, process modules PM in which the consumables are placed, and an input button for replacement reservation in association with each other. When the replacement reservation screen is displayed, the operator executes input of the replacement reservation on the replacement reservation screen (step S1303). For example, the operator presses a predetermined button on the screen. When the substrate processing system 1 accepts the operator's input, it displays a warning screen regarding the replacement reservation (warning display, step S1304). The warning screen notifies the timing of performing the replacement process, etc. When the operator executes a confirmation input on the warning screen (step S1305), the substrate processing system 1 executes the replacement reservation. That is, the substrate processing system 1 stores the replacement reservation in the storage unit 31 in association with the process module PM that is the target of the replacement reservation (step S1306). Then, the substrate processing system 1 displays a message "replacement reservation in progress" in association with the target process module PM on the display unit 34 (step S1307). This completes the replacement reservation process.

[0116] 8B is a flowchart showing an example of the flow of an exchange reservation cancellation process in the substrate processing system 1 according to an embodiment. Even after an exchange reservation has been executed, the substrate processing system 1 executes a process of canceling the exchange reservation in response to an input from an operator.

[0117] First, the operator inputs an instruction to display the replacement reservation cancellation screen to the substrate processing system 1 (step S1308). In response to the operator's input, the substrate processing system 1 displays the replacement reservation cancellation screen (step S1309). The replacement reservation cancellation screen displays the load port LP for which replacement is reserved. The replacement reservation cancellation screen also displays an input button for canceling the replacement reservation in association with the load port LP. For example, the replacement reservation cancellation screen displays the process module PM for which replacement is reserved, the consumable to be replaced, and a cancel button in association with each other. The operator executes an input for canceling the replacement reservation on the replacement reservation cancellation screen (step S1310). For example, the operator presses the cancel button on the replacement reservation cancellation screen. In response to the operator's input, the substrate processing system 1 erases the replacement reservation stored in association with the corresponding process module PM and consumable part from the storage unit 31 (step S1311). Then, the substrate processing system 1 erases the message "replacement reservation in progress" that is being displayed (step S1312). This completes the replacement reservation cancellation process.

[0118] (An example of the exchange process flow) Next, an example of the flow of the replacement process of the consumable parts (FIG. 4, steps S30 to S33) will be described. FIG 9 is a flow chart showing an example of the flow of the replacement process in the substrate processing system 1 of one embodiment.

[0119] When the replacement reservation is stored in the storage unit 31, the substrate processing system 1 first detects the state of the target process module PM. While the target process module PM is being processed, the substrate processing system 1 puts the replacement process on hold. When the target process module PM finishes processing and transitions to an idle state (step S1501), the substrate processing system 1 changes the mode of the target process module PM to a non-production mode (step S1502). Then, the substrate processing system 1 stores the change in mode of the target process module PM in the storage unit 31 (step S1503). The substrate processing system 1 changes the display of "reserved replacement" on the display unit 34 to "being replaced" (step S1504). The substrate processing system 1 executes a process for securing a replacement path (step S1505). The process for securing a replacement path will be described in detail later with reference to FIG. 10. Then, the substrate processing system 1 executes the replacement (step S1506). When performing the replacement in step S1506, the substrate processing system 1 transfers the used focus ring FR from the process module PM and the unused focus ring FR from the FR FOUP in parallel. When the replacement is completed, the substrate processing system 1 changes the mode of the target process module PM to the production mode (step S1507). Then, the substrate processing system 1 stores the mode change of the target process module PM in the storage unit 31 (step S1508). The substrate processing system 1 erases the display of "Replacing" that has been displayed on the display unit 34 (step S1509). This ends the replacement process.

[0120] (Processing to secure an exchange route) Before starting replacement of the focus ring FR, the substrate processing system 1 secures replacement paths in the vacuum transfer chamber 10, the load lock module LLM, and the atmospheric pressure transfer chamber 20 (step S1505 in FIG. 9). FIG. 10 is a flowchart showing a flow of a replacement path securing process in the substrate processing system 1 according to an embodiment.

[0121] First, the substrate processing system 1 determines whether or not a wafer W is present on the transfer path (step S1101). The transfer path refers to the inside of the vacuum transfer chamber 10, the load lock module LLM, and the normal pressure transfer chamber 20. When the substrate processing system 1 determines that a wafer W or a focus ring FR is not present on the transfer path (step S1101, No), the substrate processing system 1 determines whether or not a wafer W being processed is present in the process module PM (step S1102). When the substrate processing system 1 determines that a wafer W being processed is present (step S1102, Yes), the substrate processing system 1 interrupts the process so as to wait for the start of the next process when the process in the process module PM is completed (step S1103). For example, after the process is completed, the substrate processing system 1 makes the processed wafer W wait in the process module PM until the replacement process is completed. Then, the substrate processing system 1 performs replacement of the focus ring FR (step S1104). On the other hand, when it is determined that no wafer W is being processed (step S1102, No), the substrate processing system 1 replaces the focus ring FR (step S1104).

[0122] On the other hand, when it is determined that the wafer W is on the transfer path (step S1101, Yes), the substrate processing system 1 determines whether the wafer W is an unprocessed wafer (step S1105). When it is determined that the wafer W is an unprocessed wafer (step S1105, Yes), the substrate processing system 1 transfers the wafer W to a process module PM that performs processing (step S1106).

[0123] Returning to step S1105, if it is determined that the wafer is a processed wafer (step S1105, No), the substrate processing system 1 determines whether or not all processing for the wafer W has been completed (step S1107). If it is determined that all processing has been completed (step S1107, Yes), the substrate processing system 1 returns the wafer W to the wafer FOUP in which the wafer W was accommodated (step S1108). On the other hand, if it is determined that all processing has not been completed (step S1107, No), the substrate processing system 1 transports the wafer W to the process module PM that will be processed next (step S1109). Then, processing may be performed. After steps S1106, S1108, and S1109, the process proceeds to step S1104, and the substrate processing system 1 performs replacement.

[0124] In the example of FIG. 10, once the unprocessed wafer W is unloaded from the FOUP, it is transferred to the destination process module PM without being returned to the wafer FOUP (see step S1106). However, if returning the wafer W to the wafer FOUP improves processing efficiency, the unprocessed wafer W may be returned to the wafer FOUP. After the unprocessed wafer W is loaded into the process module PM and the gate valve GV is closed, processing of the wafer W may be performed in the process module PM during replacement of the focus ring FR. If processing of the wafer W is already being performed in the process module PM when the replacement path is secured, the processing may be continued during replacement of the focus ring FR. In other words, loading and unloading of the focus ring FR in and out of the vacuum processing chamber (process module PM) into and out of which the focus ring FR is loaded and the vacuum processing of the wafer W in a vacuum processing chamber other than the target of loading and unloading may be performed in parallel.

[0125] 10, the process may wait until the temperature of the susceptor 114 (lower electrode) reaches a predetermined temperature. During plasma processing of the wafer W, the inside of the process module PM becomes hot, so that the focus ring FR in the process module PM may be hot even if a transfer path is secured. If the focus ring FR is hot, it may come into contact with the electrostatic chuck 120 due to thermal expansion when the focus ring FR is lifted from the susceptor 114. If the focus ring FR is hot, it may be slippery when the VTM arm 15 and the LM arm 25 hold and transfer the focus ring FR. Therefore, before step S1104 in FIG. 10, it may be detected whether the temperature of the process module PM is a predetermined temperature (room temperature, for example, a temperature within a range of 20° C.±15° C.) and the process may wait until the temperature reaches the predetermined temperature.

[0126] (Exchange execution process) 11 is a diagram for explaining replacement in the substrate processing system 1 of an embodiment. After a path for replacing the focus ring FR is secured, the substrate processing system 1 then performs the replacement (step S1506 in FIG. 9). In the embodiment, during the replacement, the substrate processing system 1 transports a used focus ring FR and an unused focus ring FR in parallel. In the example of FIG. 11, the used focus ring FR arranged in the process module PM1 is replaced with an unused focus ring FR in a FOUP for FR arranged in the load port LP4.

[0127] In this case, the substrate processing system 1 first executes steps S1501 to S1505 in FIG. 9 to secure an exchange path. After confirming that the exchange path is secured, the substrate processing system 1 operates the VTM arm 15 to hold the focus ring FR in the process module PM. On the other hand, the substrate processing system 1 operates the LM arm 25 to hold the focus ring FR in the FR FOUP. Then, the substrate processing system 1 transfers the used focus ring FR by the VTM arm 15 (FIG. 11, (1)) and transfers the unused focus ring FR by the LM arm 25 (FIG. 11, (2)) in parallel. The used focus ring FR is transferred to the load lock module LLM2 (FIG. 11, (3)). The substrate processing system 1 opens the load lock module LLM2 to which the used focus ring FR has been transferred to the atmosphere. On the other hand, the unused focus ring FR is transferred to the load lock module LLM1 (FIG. 11, (4)). The substrate processing system 1 performs evacuation of the load lock module LLM1 to which the unused focus ring FR has been transferred. The substrate processing system 1 further causes the VTM arm 15 to hold the unused focus ring FR placed in the load lock module LLM1. On the other hand, the substrate processing system 1 causes the LM arm 25 to hold the used focus ring FR placed in the load lock module LLM2. Then, the substrate processing system 1 performs the transfer of the used focus ring FR by the LM arm 25 ( FIG. 11 , (5)) and the transfer of the unused focus ring FR by the VTM arm 15 ( FIG. 11 , (6)) in parallel. In this way, the unused focus ring FR is transferred into the process module PM1. Also, the used focus ring FR is transferred into the FR FOUP. During the replacement, normal transfer of product wafers W is not performed.

[0128] FIG. 12 is a diagram for explaining the effect of reducing downtime when the focus ring FR is replaced in the substrate processing system 1 of the embodiment.

[0129] FIG. 12 shows an example of the time required for transporting a used focus ring FR and an unused focus ring FR. It takes about 25 seconds for the LM arm 25 to grasp the focus ring FR accommodated in the FR FOUP. Then, it takes about 25 seconds for the LM arm to place the focus ring FR in the load lock module LLM. It takes about 10 seconds to close the gate valve of the load lock module LLM and perform vacuum pumping. Then, it takes about 25 seconds for the VTM arm 15 to grasp the focus ring FR from the load lock module LLM. It takes about 25 seconds to place the focus ring FR held by the VTM arm 15 in the process module PM. Then, it takes about 10 seconds to lower the second lifter pins 182 supporting the focus ring FR placed in the process module PM to place the focus ring FR in a fixed position and close the gate valve GV. It also takes about 20 seconds as a standby time for continuously operating the load lock module LLM. For this reason, it takes about 140 seconds to transport the focus ring FR from the FOUP to the process module PM.

[0130] On the other hand, the time required to transport a used focus ring FR from the process module PM to a FOUP is as follows. First, it takes about 25 seconds for the VTM arm 15 to grasp the focus ring FR in the process module PM. Then, it takes about 25 seconds for the VTM arm 15 to place the grasped focus ring FR in the load lock module LLM. Then, it takes about 10 seconds to release the reduced pressure atmosphere of the load lock module LLM in which the focus ring FR is placed to the atmosphere. After the load lock module LLM becomes an atmosphere, the gate valve on the normal pressure transfer chamber 20 side of the load lock module LLM is opened. Then, it takes about 25 seconds for the LM arm 25 to grasp the focus ring FR from the load lock module LLM. The LM arm 25 transports the grasped focus ring FR to the load port LP and places it in the FOUP. This process takes about 25 seconds. In addition, a waiting time of about 20 seconds is required for the load lock module LLM to operate continuously. Therefore, it takes about 130 seconds to collect the used focus ring FR.

[0131] If, in the above replacement process, the used focus ring FR is collected and then an unused focus ring FR is transported into the process module PM, the time required for the process is about 140 seconds + about 130 seconds = about 270 seconds. In contrast, if the collection of the used focus ring FR and the transportation of the unused focus ring FR are performed in parallel as in the present embodiment, the replacement process can be completed in about 140 seconds. Therefore, the substrate processing system 1 of the present embodiment can significantly reduce the downtime due to replacement of consumable parts.

[0132] In addition, since the reduced pressure state in the vacuum transfer chamber 10 is maintained during replacement, processing can be continued in the process modules PM other than the process module PM that is the target of replacement processing. For example, if the time required for one process to be performed in the process module PM is 140 seconds or more, the replacement of the consumable parts can be performed without stopping the processing in the process module PM that is not the target of replacement processing. In addition, if the time required for one process to be performed in the process module PM is less than 140 seconds, the processed wafer W is made to wait in the process module PM. This prevents contamination and the like caused by the simultaneous presence of the product wafer W and focus ring FR in the vacuum transfer chamber 10.

[0133] (Parameter settings for transport during exchange processing) The substrate processing system 1 according to the embodiment changes the control manner of the VTM arm 15, the LM arm 25, the first lifter pins 172, the second lifter pins 182, the support pins, etc. in accordance with the size and shape of the wafer W and the focus ring FR during transfer. For example, the substrate processing system 1 changes the following parameters. (1) Drive speed of VTM arm 15 and LM arm 25 (2) Drive speed of the second lifter pin 182 in the process module PM

[0134] (1) Drive speed of VTM arm 15 and LM arm 25 During normal processing of product wafers W, the VTM arm 15 and the LM arm 25 of the substrate processing system 1 are adjusted to be suitable for transporting the wafer W. In contrast, during replacement, the VTM arm 15 and the LM arm 25 are adjusted to be suitable for transporting the focus ring FR. For this reason, before starting replacement, the substrate processing system 1 switches the drive speeds of the VTM arm 15 and the LM arm 25.

[0135] For example, when the replacement starts (at the start of step S1506 in FIG. 9), the substrate processing system 1 switches the drive speed of the VTM arm 15 and the LM arm 25 to a speed different from the drive speed during normal processing of the product wafer W. For example, the substrate processing system 1 switches the drive speed of the VTM arm 15 and the LM arm to a speed lower than the drive speed during transport of the wafer W. This is because the focus ring FR has a small area that can be held by the ring shape, and is therefore more likely to be misaligned on the VTM arm 15 and the LM arm 25 than the wafer W. For example, the drive speed of the VTM arm 15 and the LM arm 25 that can be set in advance is set in the storage unit 31 of the substrate processing system 1. Then, the substrate processing system 1 is configured to switch the drive speed between during replacement processing and during normal transport of the product wafer W. The drive speed may be manually set by an operator.

[0136] (2) Drive speed of the second lifter pin in the process module PM Furthermore, the substrate processing system 1 sets the drive speed of the second lifter pins 182 in the process module PM to suit the focus ring FR. For example, the substrate processing system 1 learns and stores the drive speed of the second lifter pins 182 in advance by machine learning. Fig. 13A is a diagram for explaining the operation of the second lifter pins 182 when the focus ring FR is loaded in the substrate processing system 1 of one embodiment. Fig. 13B is a diagram for explaining the operation of the second lifter pins 182 when the focus ring FR is unloaded in the substrate processing system 1 of one embodiment.

[0137] Before performing each process, the substrate processing system 1 performs machine learning of the first and second lifter pins 172, 182 and the support pins. Then, the substrate processing system 1 sets and stores in the storage unit 31, for example, the maximum speed and minimum speed of the second lifter pins 182 in the process module PM and a pin-up delay when receiving the focus ring FR.

[0138] The operation of second lifter pins 182 when the focus ring FR is loaded will be described. Second lifter pins 182 are stored inside susceptor 114, and move up and down when the focus ring FR is loaded and unloaded. Here, the position of the upper surface of susceptor 114 is called a first height H1, and the position when the focus ring FR is transported by VTM arm 15 is called a second height H2.

[0139] In addition, in the distance from the first height H1 to the second height H2, the vicinity of the susceptor 114 is called range R1, and the vicinity of the transfer position is called range R2 (see FIG. 13A). Here, "vicinity" refers to a range within a predetermined distance in the vertical direction, for example, within a range of 0.5 mm. Here, the predetermined distance is a distance for adjusting an impact when the focus ring FR and the second lifter pins 182 or the focus ring FR and the VTM arm 15 come into contact with each other. For example, in the example of FIG. 13A, the range R1 refers to a range within a predetermined distance upward from the upper surface position of the susceptor 114. However, the range R1 may be a range within a predetermined distance both above and below the upper surface position of the susceptor 114 in the vertical direction. In addition, in the example of FIG. 13A, the range R2 refers to a range within a predetermined distance vertically downward from the transfer height H2 of the focus ring FR. However, the range R2 may be a range within a predetermined distance both above and below the second height H2 in the vertical direction. The range between the first height H1 and the second height H2, other than the ranges R1 and R2, is referred to as a range R3.

[0140] When loading / unloading is not performed, the second lifter pins 182 are housed in the susceptor 114, and their tops are located at the first height H1 or below H1. When loading the focus ring FR, the second lifter pins 182 are driven by the second drive mechanism 180 to protrude from the susceptor 114 and rise to a third height H3 below the second height H2 (see FIG. 13A). Next, the VTM arm 15 places the focus ring FR on a pick (17a or 17b), holds it at the second height H2, and loads it into the process module PM. When the focus ring FR placed on the VTM arm 15 reaches the susceptor 114, the second lifter pins 182 rise to the second height H2. At this time, the second lifter pins 182 wait for a predetermined time until the VTM arm 15 stops operating and the swing of the focus ring FR settles, and then start to rise. This waiting time is called a pin-up delay. Then, the second lifter pins 182 receive the focus ring FR at the second height H2. After receiving the focus ring FR, the second lifter pins 182 move down, and the focus ring FR is placed on the susceptor 114.

[0141] When the focus ring FR is loaded, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a speed lower than the ranges R1 and R3 in the range R2 during ascent, and switches to a speed lower than the ranges R2 and R3 in the range R1 during descent. This is to suppress the impact when the second lifter pins 182 come into contact with the focus ring FR, thereby preventing damage to the focus ring FR. In the example of FIG. 13A, the range R1 is set above the upper surface of the susceptor 114, but the range R1 may be set in both directions above and below the upper surface of the susceptor 114. The range R2 may also be set in both directions above and below the second height H2.

[0142] Next, with reference to FIG. 13B, the operation of second lifter pins 182 when unloading focus ring FR will be described. In FIG. 13B, a predetermined distance vertically downward from the upper surface (H1) of susceptor 114 is range R4, and a predetermined distance vertically upward from second height H2 is range R6. In addition, the portion of the range between second height H2 and fourth height H4 that is not included in range R6 is called range R5. The value of the predetermined distance and the setting of the range are the same as in the example of FIG. 13A above.

[0143] When the focus ring FR is unloaded, the second lifter pins 182 first rise to the first height H1. Then, when the tops of the second lifter pins 182 come into contact with the focus ring FR, the second lifter pins 182 rise to the fourth height H4 while supporting the focus ring FR. The fourth height H4 is vertically higher than the second height H2 to which the focus ring FR is transported. With the second lifter pins 182 holding the focus ring FR at the fourth height H4, the pick (17a or 17b) of the VTM arm 15 enters the process module PM and stops below the focus ring FR. At this time, the height of the pick of the VTM arm 15 is the second height H2. As in the loading, after waiting for a predetermined time until the swinging of the VTM arm 15 stops, the second lifter pins 182 descend and the focus ring FR supported on the second lifter pins 182 is received by the VTM arm 15. The VTM arm 15, while holding the focus ring FR, moves from inside the process module PM to the vacuum transfer chamber 10, and removes the focus ring FR.

[0144] When the focus ring FR is unloaded, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a speed slower than the ranges R5 and R6 in the range R4 during ascent, and switches the drive speed to a speed slower than the ranges R4 and R5 in the range R6 during descent. For example, the substrate processing system 1 sets the drive speed of the second lifter pins to a first speed in the range R4 during ascent, and to a second speed higher than the first speed in the ranges R5 and R6 and ranges other than the ranges R4, R5, and R6. Also, when the focus ring FR is descent, the drive speed is set to the first speed in the range R6, and to the second speed higher than the first speed in the ranges R4, R5 and ranges other than the ranges R4, R5, and R6.

[0145] That is, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a low first speed from immediately before the second lifter pins 182 come into contact with the focus ring FR until the second lifter pins 182 come into contact with the focus ring FR. The substrate processing system 1 also switches the drive speed to the low first speed from immediately before the focus ring FR supported by the second lifter pins 182 comes into contact with the susceptor 114 and the VTM arm 15 until the placement is completed. Within the range where the focus ring FR does not come into contact with other components, the substrate processing system 1 drives the second lifter pins 182 at a high second speed.

[0146] For this reason, the substrate processing system 1 sets and stores in advance by machine learning the first speed, second speed, and waiting time (pin-up delay) of the second lifter pins 182. For example, the substrate processing system 1 sets the first speed and second speed within the range of 1 to 15 mm / sec. Also, for example, the substrate processing system 1 sets the waiting time of the second lifter pins 182 within the range of 0.0 to 60.0 seconds.

[0147] In the substrate processing system 1, the drive speed of the support pins in the load lock module LLM can be set in the same manner as the second lifter pins 182. For example, the drive speed of the support pins can be set within the range of 1 to 1700 mm / sec.

[0148] (Fixing the transport route) In this embodiment, as described above, transport of a used focus ring FR and an unused focus ring FR are performed in parallel. For this reason, the substrate processing system 1 includes at least two load lock modules LLM. The substrate processing system 1 uses one load lock module (for example, LLM1) for transporting a used focus ring FR and uses the other load lock module (for example, LLM2) for transporting an unused focus ring FR.

[0149] In order to further improve the transfer accuracy, the picks of the VTM arm 15 and the LM arm 25 may be specified as a path for transferring the unused focus ring FR. The transfer accuracy refers to the accuracy and stability of the position of the focus ring FR during transfer. If the transfer accuracy is high, the positional deviation between the designed transfer path and the focus ring FR that is actually transferred is small, and if the transfer accuracy is low, the positional deviation between the designed transfer path and the focus ring FR that is actually transferred is large. Also, if the transfer accuracy is high, the positional variation of the focus ring FR for each transfer is small, and if the transfer accuracy is low, the positional variation of the focus ring FR for each transfer is large. For example, the substrate processing system 1 specifies the first pick 17a of the VTM arm 15 and the first pick 27a of the LM arm 25 as a transfer path for the unused focus ring FR. Also, the substrate processing system 1 specifies the load lock module LLM1 as a transfer path for the unused focus ring FR.

[0150] Moreover, the substrate processing system 1 specifies the second pick 17b of the VTM arm 15 and the second pick 27b of the used LM arm 25 as a transport path for the used focus ring FR. Moreover, the substrate processing system 1 specifies the load lock module LLM2 as a transport path for the used focus ring FR. The substrate processing system 1 stores the specified transport path in the storage unit 31.

[0151] For example, information specifying the first pick 17a of the VTM arm 15, the first pick 27a of the LM arm 25, and the load lock module LLM1 is stored in the storage unit 31 as a default value of a transport path for an unused focus ring FR. Also, information specifying the second pick 17b of the VTM arm 15, the second pick 27b of the LM arm, and the load lock module LLM2 is stored in the storage unit 31 as a default value of a transport path for a used focus ring FR. Then, at the time of replacement processing, the substrate processing system 1 determines the transport path based on the information stored in the storage unit 31.

[0152] By designating the transport path in this manner, the substrate processing system 1 can use a different path for each transport, and can suppress minute deviations in the transport accuracy of the focus ring FR. For example, even if positional deviations or the like occur between the first pick 17a and the second pick 17b of the VTM arm 15, a decrease in transport accuracy can be suppressed by transporting an unused focus ring FR along the same path. Note that since there is little need to precisely control the transport accuracy of a used focus ring FR, the pick to be used for transport is designated with priority for an unused focus ring FR. However, a transport path may also be designated for a used focus ring FR.

[0153] (Switching processing modes) 9, the substrate processing system 1 switches the target process module PM to the non-production mode, executes the replacement process, and switches to the production mode after the replacement process is completed. However, the present invention is not limited to this, and the substrate processing system 1 may be configured to switch to the production mode in response to an input from an operator, rather than automatically switching to the production mode after the replacement process.

[0154] For example, the operation mode after the replacement process is completed is set to the “non-production mode” by default and stored in the storage unit 31 so that the setting is not changed automatically. By setting in this manner, when maintenance work, such as a seasoning process, needs to be performed on the process module PM after the focus ring FR is replaced, it is possible to prevent the wafer W from being automatically loaded into the process module PM before the maintenance work.

[0155] (Exchange process canceled) After the substrate processing system 1 starts the replacement process, the replacement process may not be able to continue due to, for example, the focus ring FR falling from the VTM arm 15 or the LM arm 25. Thus, the substrate processing system 1 according to the present embodiment may be configured to detect such a state and stop the replacement process.

[0156] After the replacement process is started, if the first sensor S1 or the second sensor S2 of the substrate processing system 1 cannot detect the focus ring FR, it notifies the processing unit 32 of that fact. Upon receiving the notification, the processing unit 32 stops the operation of the drive system (VTM arm 15, LM arm 25, etc.). The processing unit 32 notifies the operator of the stop of operation. For example, the processing unit 32 displays the notification of the stop of operation on the display unit 34.

[0157] When the operator receives the notification of the operation stop, the operator switches the process module PM, the vacuum transfer chamber 10, the load lock module LLM, and the normal pressure transfer chamber 20 to the maintenance mode. Then, the operator stops the replacement process of the substrate processing system 1 by executing an instruction input from the display unit 34. At this time, the substrate processing system 1 maintains the operation mode of the target process module PM in the non-production mode (i.e., a processing mode in which the product wafer W cannot be processed). In addition, the focus ring FR during replacement is not automatically moved, but is left in the state at the time of the suspension. This is because it is unclear what state the focus ring FR is in, so that the operator can visually check it before recovery. After checking the situation, the operator takes steps such as opening the chamber of the process module PM and installing the focus ring FR. After recovery is completed, the operator switches each processing unit from the maintenance mode to the normal processing mode.

[0158] The replacement process may be stopped not only when an abnormality is detected by the substrate processing system 1, but also at the operator's discretion. For example, a screen for receiving an instruction to stop the replacement process is displayed on the display unit 34. The substrate processing system 1 is configured to stop the VTM arm 15 and the LM arm 25 in response to the instruction input by the operator. After the operation of the VTM arm 15 and the LM arm 25 has stopped, the operator performs the same process as when the operator receives the notification of the above-mentioned operation stop.

[0159] In addition, even if an operator switches the substrate processing system 1 to a maintenance mode and removes the FR FOUP or takes out the focus ring FR from the FR FOUP during a replacement reservation or replacement process, recovery can be achieved by following the same procedure as described above. Note that, as a default setting, the substrate processing system 1 is configured so that removal of the FR FOUP cannot be performed during replacement process.

[0160] (Lifter pin maintenance) The lifter pins (second lifter pins 182, support pins) for raising and lowering the focus ring FR provided in each part of the substrate processing system 1 do not normally operate until a replacement process is performed. For this reason, there is a possibility that the second lifter pins 182 and the support pins will become stuck to surrounding structures due to re-grease or the like. Thus, the substrate processing system 1 of the present embodiment may be configured to perform maintenance automatically on a regular basis.

[0161] For example, a counter for determining the timing of performing maintenance is provided similarly to the counter for notifying the replacement timing. For example, the timing of performing maintenance of the second lifter pins 182 is set in association with each process module PM. The number of times wafers W are processed can be used as a parameter for the timing of performing maintenance of the second lifter pins 182. For example, maintenance of the second lifter pins 182 is performed when the wafers W have been processed 1000 times.

[0162] The timing of performing maintenance may be set arbitrarily, or may be selected by an operator from preset parameters. For example, either the number of processes (number of processed wafers) or the RF discharge time may be selectable as a criterion for determining the timing of performing maintenance. The timing of performing maintenance of the support pins of the load lock module LLM may be set in a similar manner.

[0163] The timing for performing maintenance is, for example, when a preset parameter threshold is reached (e.g., after 1000 processes have been performed) and the processing of the most recent lot is completed. In the case of maintenance of the second lifter pins 182 or the support pins, the substrate processing system 1 raises and lowers the second lifter pins 182 or the support pins. If the timing of this maintenance operation overlaps with the timing of another process, the other operation is given priority, and this maintenance operation is performed after the other operation is completed.

[0164] (Communication with the host) In the above embodiment, the substrate processing system 1 may be configured to execute some of the processes independently, but the processes may be executed by other devices. For example, the control device 30 of the substrate processing system 1 may be configured as a device separate and independent from the other parts. The substrate processing system 1 may also be configured to be remotely controlled from other devices.

[0165] For example, a host (server) is provided separately from the substrate processing system 1. The plasma processing in each process module PM may be controlled by the host. In this case, an interruption occurs to the host's control of the process module PM due to the replacement process on the substrate processing system 1 side. For this reason, the substrate processing system 1 is configured to notify the host each time a mode change of the process module is executed to execute the replacement process. During the production mode, the host manages the control of the process module PM, and during the non-production mode, the host controls the process module PM to stop. In this case, the substrate processing system 1 is configured to notify the host of the mode change in steps S1503 and S1507 of FIG. 9.

[0166] (Example of pick shape for the transport mechanism) In the above embodiment, the first pick 17a and the second pick 17b provided on the VTM arm 15 and the first pick 27a and the second pick 27b provided on the LM arm 25 may be configured as follows. Hereinafter, the first pick 17a and the second pick 17b provided on the VTM arm 15 and the first pick 27a and the second pick 27b provided on the LM arm 25 are collectively referred to as pick 50. Pick 50 is an example of a holder that is provided at the tip of an arm provided in a transfer mechanism that transfers the wafer W and consumable parts, and holds the wafer W and consumable parts.

[0167] In the above embodiment, the VTM arm 15 and the LM arm 25 are configured to be capable of transporting both the wafer W and the consumable parts. Hereinafter, the configuration of the pick 50 when transporting a focus ring FR as a consumable part will be described as an example.

[0168] FIG. 14A is a schematic top view showing an example of the configuration of the pick 50 included in the substrate processing system 1 of the embodiment. FIG. 14B is a schematic front view of the pick 50 shown in FIG. 14A. The pick 50 has a base 51, a first branch 52 and a second branch 53 extending in different directions from two ends of the base 51. The base 51, the first branch 52 and the second branch 53 are formed so that when a triangle is drawn with the center of the wafer W as the center and in contact with the outer diameter of the wafer W, the three vertices of the triangle are located on the base 51, the first branch 52 and the second branch 53, respectively. The shape of the pick 50 is not limited to the bifurcated shape shown in FIG. 14A. The pick 50 may have three or more branches. However, the shape of the pick 50 is such that when the focus ring FR is placed on the pick 50, a gap is formed between the inner diameter of the focus ring FR and the pick 50 in a top view.

[0169] Pick 50 has a first surface 55 on the side that holds wafer W and focus ring FR. On first surface 55, a plurality of first holding portions 60a-60f for holding wafer W are formed. Hereinafter, when there is no need to distinguish between the plurality of first holding portions 60a-60f, they will be collectively referred to as first holding portion 60. At least one first holding portion 60 is formed on each of base portion 51, first branch portion 52, and second branch portion 53. Note that, although six first holding portions 60 are shown in FIG. 14A, the number of first holding portions 60 is not limited to six, and may be less than six or more than six. Moreover, the plurality of first holding portions 60 are arranged on a first circle C1 having a diameter smaller than the inner diameter of focus ring FR.

[0170] The multiple first holding portions 60 have an upper surface at a position of height h1 from the first surface 55. The shape of the upper surfaces of the multiple first holding portions 60 is not particularly limited. The upper surfaces of the multiple first holding portions 60 may be approximately parallel to the first surface 55, or may be hemispherical with a chamfered outer periphery.

[0171] Further, a plurality of second holding portions 70a to 70d for holding the focus ring FR are formed on the first surface 55. Hereinafter, when it is not necessary to distinguish between the plurality of second holding portions 70a to 70d, they will be collectively referred to as the second holding portion 70. As with the first holding portion 60, at least one second holding portion 70 is formed on each of the base portion 51, the first branch portion 52, and the second branch portion 53. Although four second holding portions 70 are shown in FIG. 14A, the number of the second holding portions is not limited to four and may be less than four or more than four. One end of the second holding portion 70 is disposed on a second circle C2 having a diameter larger than the outer diameter of the focus ring FR and substantially concentric with the first circle C1. The other end of the second holding portion 70 is disposed on a third circle C3 having a diameter larger than the inner diameter of the focus ring FR and smaller than the outer diameter. However, the other end of the second holding portion 70 may be disposed on a fourth circle C4 having a diameter smaller than the inner diameter of the focus ring FR.

[0172] The other end of the second holding part 70 is disposed closer to the center of the first circle C1 to the fourth circle C4 than the one end of the second holding part 70. The one end of the second holding part 70 has an upper surface at a height h2 from the first surface 55. The other end of the second holding part 70 has an upper surface at a height h3 from the first surface 55. The heights h1, h2, and h3 have at least a relationship of h1>h2>h3. As shown in FIG. 14B, the upper surface of the second holding part 70 is an inclined surface that gradually becomes lower from one end to the other end, that is, from the circumferential side of the first circle C1 to the fourth circle C4 toward the center side. The upper surface of the second holding part 70 is at a lower position than the upper surface of the first holding part 60 at any position.

[0173] Fig. 15A is a schematic top view showing a state in which the wafer W is held on the pick 50 shown in Fig. 14A. Fig. 15B is a schematic front view of the pick 50 and the wafer W shown in Fig. 15A as viewed from the horizontal direction. As shown in Fig. 15A, the pick 50 supports the wafer W by a plurality of first holding parts 60, and holds the wafer W in a state in which the first surface 55 and the wafer W are not in contact with each other. Also, as shown in Fig. 15B, when the wafer W is held on the pick 50, the upper surface of the second holding part 70, which is lower than the upper surface of the first holding part 60, does not contact the wafer W.

[0174] FIG. 16A is a schematic top view showing a state where the focus ring FR is held on the pick 50 shown in FIG. 14A. FIG. 16B is a schematic front view showing the pick 50 and the focus ring FR shown in FIG. 16A as viewed from the horizontal direction. As shown in FIG. 16A, the pick 50 supports the focus ring FR with a plurality of second holding parts 70, and holds the focus ring FR in a state where the first surface 55 and the focus ring FR are not in contact with each other. Also, as shown in FIG. 16B, the outer periphery of the focus ring FR is supported by abutting against the second holding parts 70 at the intermediate part of the inclined surface of the second holding parts 70. Since the focus ring FR is ring-shaped, when the focus ring FR is held on the pick 50, the first holding parts 60 are located in the hollow part at the center of the focus ring FR. Therefore, when the focus ring FR is held on the pick 50, the focus ring FR and the first holding parts 60 do not come into contact with each other.

[0175] In this way, by providing a first holding part 60 for holding the wafer W and a second holding part 70 for holding the focus ring FR on the pick 50, a single pick 50 can be used for transporting both the wafer W and the focus ring FR.

[0176] Furthermore, by making the position of the upper surface of the first holding part 60 higher than that of the second holding part 70, it is possible to prevent the wafer W from coming into contact with various parts of the pick 50 and becoming contaminated or damaged when the wafer W is transported. Furthermore, by making the upper surface of the second holding part 70 into an inclined surface that becomes lower from the outside toward the inside, it is possible to reduce the contact surface area between the focus ring FR and the pick 50. This makes it possible to prevent the focus ring FR from sticking to the pick 50 during transport. Furthermore, by preventing sticking, it is possible to prevent the focus ring FR from shifting position during transport or from jumping up when placed, etc.

[0177] The moving speed of the pick 50 is set to be slower when transferring the focus ring FR than when transferring the wafer W.

[0178] Furthermore, there is no particular limitation on the material of the first holding part 60 and the second holding part 70. The first holding part 60 and the second holding part 70 can be made of any material, such as rubber or ceramic. However, it is preferable to manufacture the second holding part 70 from a material that has a low coefficient of friction with the focus ring FR in order to prevent sticking, as described above.

[0179] Note that the specific shape of the second retaining part 70 is not limited to those shown in Figures 14A to 16B as long as at least a portion of the second retaining part 70 is disposed between the inner diameter and the outer diameter of the focus ring FR. For example, if the bottom surface of the focus ring FR is not flat, the positions of one end and the other end of the second retaining part 70 may be adjusted to match the shape of the focus ring FR.

[0180] The second holding portion 70 may be formed integrally with the base portion 51, the first branch portion 52, and the second branch portion 53 of the pick 50. The second holding portion 70 may be formed of the same material as the base portion 51, the first branch portion 52, and the second branch portion 53 of the pick 50. In addition to the above-mentioned ceramics, titanium, silicon carbide, etc. may be used.

[0181] 16A and 16B does not have a notch on the upper surface on the inner diameter side, unlike FIG 3. However, the shape of the focus ring FR transported by the pick 50 is not particularly limited, and the focus ring FR having the shape shown in FIG 3 can also be transported by the pick 50.

[0182] (Detection of misalignment during transportation) As described above, the substrate processing system 1 according to the embodiment includes the first sensors S1 to S16 for detecting misalignment of the wafer W and the focus ring FR transferred to the process module PM. The first sensors are arranged in pairs on the transfer path near the gate valve of each process module PM. The third sensors S20 to S27 in the normal pressure transfer chamber 20 also detect misalignment in the same manner. Next, a misalignment detection method that can be commonly applied to the first sensors S1 to S16 and the third sensors S20 to S27 will be described. In the following description, the third sensors S20 and S21 installed in front of the load lock module LLM1 and the third sensors S24 and S25 installed in front of the load port LP2 will be described as examples.

[0183] Fig. 17 is a diagram for explaining the arrangement position of the third sensor in the substrate processing system of one embodiment. Fig. 17 is a cross-sectional view of the normal pressure transfer chamber 20 of the substrate processing system 1 shown in Fig. 1, seen from the right side to the left side of the page.

[0184] In FIG. 17, on the left is a platform 201 provided for the load port LP2 on which a FOUP is placed. On the right side of the platform 201, a door 202 is provided for connecting the atmospheric pressure transfer chamber 20 to the inside of the FOUP. When the door 202 moves downward to move the FOUP lid, the inside of the FOUP communicates with the inside of the atmospheric pressure transfer chamber 20. On the side of the atmospheric pressure transfer chamber 20 facing the load port LP2, a gate valve GV connected to the load lock module LLM1 is provided (see FIGS. 18A to 18C). The gate valve GV is provided between the load lock module LLM and the atmospheric pressure transfer chamber 20. The gate valve GV includes a plate 220, a movable lid 230, and a movement mechanism 240.

[0185] Fig. 18A is a schematic perspective view of a plate 220 included in the gate valve GV of the embodiment. Fig. 18B is a schematic perspective view of an enlarged portion of the gate valve GV of the embodiment. Fig. 18C is a schematic perspective view showing a state in which the opening 221 of the gate valve GV of the embodiment is blocked.

[0186] The plate 220 is a plate-like member fixed in front of the load lock module LLM1. When the plate 220 shown in Fig. 18A is placed in front of the load lock module LLM1, it has a substantially rectangular shape having an upper side, a right side, a lower side, and a left side when viewed from the normal pressure transfer chamber 20 side. However, the shape of the plate 220 is not particularly limited. The plate 220 is formed with an opening 221, a pair of upper and lower first protrusions 222, and a pair of upper and lower second protrusions 223.

[0187] The opening 221 defines a space through which the wafer W and focus ring FR pass when they are transferred in and out between the load lock module LLM1 and the atmospheric pressure transfer chamber 20. In the example of FIG. 18A , the opening 221 is formed above the center of the plate 220. The opening 221 has a generally rectangular shape whose width is larger than the outer diameter of the focus ring FR. The size and shape of the opening 221 are not particularly limited as long as the wafer W and focus ring FR can be placed on the pick 50 and transferred in and out in the horizontal direction.

[0188] The first protrusion 222 protrudes from the plate 220 toward the normal pressure transfer chamber 20. The first protrusion 222 has an upper protrusion 222a and a lower protrusion 222b. The upper protrusion 222a is a plate-like member that protrudes horizontally along the upper side of the plate 220. The light-projecting unit 20p of the third sensor S20 is disposed on the upper protrusion 222a. The lower protrusion 222b is a plate-like member that protrudes horizontally along the lower side of the plate 220. The light-receiving unit 20r of the third sensor S20 is disposed on the lower protrusion 222b. The light-projecting unit 20p may be disposed on the lower protrusion 222b, and the light-receiving unit 20r may be disposed on the upper protrusion 222a.

[0189] The light-projecting portion 20p of the upper protrusion 222a emits light vertically downward. The light-receiving portion 20r of the lower protrusion 222b is disposed on an optical path OP1 of the light emitted from the light-projecting portion 20p. In the example of FIG. 18A, a line connecting the light-projecting portion 20p and the light-receiving portion 20r extends vertically and passes in front of the space defined by the opening 221.

[0190] The shape of the second protrusion 223 is similar to that of the first protrusion 222. The second protrusion 223 protrudes from the plate 220 toward the normal pressure transfer chamber 20. The second protrusion 223 has an upper protrusion 223a and a lower protrusion 223b. The upper protrusion 223a is a plate-like member that protrudes horizontally along the upper side of the plate 220. The light projecting unit 21p of the third sensor S21 is disposed on the upper protrusion 223a. The lower protrusion 223b is a plate-like member that protrudes horizontally along the lower side of the plate 220. The light receiving unit 21r of the third sensor S21 is disposed on the lower protrusion 223b.

[0191] The light-projecting portion 21p of the upper protrusion 223a emits light vertically downward. The light-receiving portion 21r of the lower protrusion 223b is disposed on an optical path OP2 of the emitted light. In the example of FIG. 18A, a line connecting the light-projecting portion 21p and the light-receiving portion 21r extends vertically and passes in front of the space defined by the opening 221.

[0192] The gate valve GV includes a connection portion 250 that connects each sensor to the control device 30 (see FIG. 18C). The connection portion 250 is, for example, a cable for transmitting a signal detected by a light receiving portion of each sensor to the control device 30.

[0193] A movable lid 230 is disposed on the atmospheric pressure transfer chamber 20 side of the plate 220 (see FIG. 18C). The movable lid 230 is connected to a moving mechanism 240, and moves up and down between the upper protrusions 222a, 223a and the lower protrusions 222b, 223b of the first protrusion 222 and the second protrusion 223 in response to power transmitted from the moving mechanism 240. When the movable lid 230 is located at the top of its movable range (see FIG. 18C), it covers the opening 221 and closes the gap between the load lock module LLM1 and the atmospheric pressure transfer chamber 20. When the movable lid 230 is located at the bottom of its movable range, it opens the opening 221 and connects the load lock module LLM1 and the atmospheric pressure transfer chamber 20. The thickness of the movable cover 230 is set so as not to interfere with the optical paths OP1, OP2 between the upper protrusions 222a, 223a and the lower protrusions 222b, 223b (see FIG. 17).

[0194] Returning to FIG. 17, the third sensors S24 and S25 arranged on the load port LP2 side will be described. The third sensors S24 and S25 each include a light-projecting unit 24p and 25p and a light-receiving unit 24r and 25r. As shown in FIG. 17, the light-projecting units 24p and 25p of the third sensors S24 and S25 are provided on the ceiling side of the normal pressure transfer chamber 20. The light-receiving units 24r and 25r of the third sensors S24 and S25 are provided on the floor side of the normal pressure transfer chamber 20. The wafer W and the focus ring FR transferred by the LM arm 25 pass through the optical path of the light emitted from the light-projecting units 24p and 25p and received by the light-receiving units 24r and 25r. As long as the wafer W and the focus ring FR can pass through the optical path, the arrangement positions of the third sensors S24 and S25 are not particularly limited.

[0195] Next, detection of positional deviation using the third sensor will be described. FIG. 19A is a diagram for explaining the positional relationship between the sensor and the consumable part being transported in one embodiment. FIG. 19A shows a state in which the focus ring FR is transported to the load lock module LLM1 along the direction of the arrow X. In FIG. 19A, the load port LP2 is located at the bottom of the paper, and the load lock module LLM1 is located at the top of the paper. When the focus ring FR is transported on the transport path, the center of the focus ring FR moves along a line L3 by design. The third sensor S20 is disposed so that the optical path OP1 is located on the line L2. Moreover, the third sensor S21 is disposed so that the optical path OP2 is located on the line L4. Moreover, the third sensors S20 and S21 are disposed on a line segment perpendicular to the moving direction of the focus ring FR. Note that the lines L2 and L4 are each a line segment parallel to the line L3 and disposed at an equal distance from the line L3.

[0196] At this time, when the focus ring FR is transported to the correct position, the detection signal detected by the third sensor S20 and the detection signal detected by the third sensor S21 have the same waveform. FIG. 19B is a diagram showing an example of the detection signal in the example of FIG. 19A. When the focus ring FR passes between the light-emitting parts 20p, 21p and the light-receiving parts 20r, 21r of the third sensors S20, S21, the light emitted from the light-emitting parts 20p, 21p is blocked by the focus ring FR. For example, the light-receiving parts 20r, 21r output a detection signal that is high when no light is received and low when light is received. In the case of FIG. 19A, each part of the focus ring FR passes through the third sensors S20 and S21 at the same time. Therefore, as shown in FIG. 19B, the detection signals output from the third sensors S20, S21 become high and low at the same time.

[0197] On the other hand, when the focus ring FR is misaligned, the detection signals output from the third sensors S20 and S21 have different waveforms. FIG. 20A is a diagram for explaining misalignment of consumable parts during transportation. In the example of FIG. 20A, the center of the focus ring FR is misaligned from the correct position (on the line L3) toward the line L2 side. When the focus ring FR is transported in the direction of the arrow X while remaining in the position of FIG. 20A, the outer periphery of the focus ring FR blocks the light emitted by the light projector 20p at the third sensor S20 before the third sensor S21. After that, after a period P1 (see FIG. 20B), the focus ring FR blocks the light emitted by the light projector 21p at the third sensor S21. When the focus ring FR further advances in the X direction, the light is blocked again at the third sensor S21, and then the light is also blocked at the third sensor S20. For this reason, the waveform of the detection signal obtained when the focus ring FR is transported with the center of the focus ring FR misaligned from the correct position becomes, for example, the waveform shown in FIG. 20B. The control device 30 detects the positional deviation of the focus ring FR based on the difference between the waveforms of the detection signals output from the third sensors S20 and S21. Therefore, the control device 30 can correct the positional deviation of the focus ring FR.

[0198] In the above example, two sensors are arranged above and below the opening 221 of the gate valve GV arranged in front of the load lock module LLM1. However, this is not limited to this, and three or more sensors may be arranged. For example, FIG. 21 is a diagram showing the positional relationship between the consumable parts and the sensors when four sensors are arranged. In the example of FIG. 21, sensors S20A and S21A are arranged in addition to the third sensors S20 and S21. Note that even when three or more sensors are arranged, each sensor has a light-emitting unit and a light-receiving unit arranged above and below the opening 221.

[0199] In correcting the positional deviation, either the outer diameter position or the inner diameter position of the focus ring FR detected by each sensor may be used, or both the outer diameter position and the inner diameter position may be used. However, from the viewpoint of accurately correcting the positional relationship between the wafer W and the focus ring FR, it is preferable to use the inner diameter position for the correction.

[0200] Also, the positional deviation can be corrected by, for example, calculating the position of the center of the focus ring FR as shown in FIG. 22 and moving the focus ring FR by the difference from the correct center position. FIG. 22 is a diagram for explaining a method for calculating the positional deviation of a consumable part. As shown in FIG. 22, based on the detection signal, a center line of a line segment that connects the inner diameter position of the focus ring FR on the line segment L2 is drawn. Also, a center line of a line segment that connects one of the intersection points of the line segment L2 and the inner diameter position and one of the intersection points of the line segment L4 and the inner diameter position is drawn. The intersection point of the two center lines is the center of the focus ring FR. Based on the distance between the center of the focus ring FR thus obtained and the line segment L3, the position of the focus ring FR is corrected.

[0201] When two sensors are arranged in front of opening 221, the spacing between the two sensors is wider than the width of a pick and shorter than the inner diameter of focus ring FR. When four sensors are arranged in front of opening 221, the spacing between the two outermost sensors is wider than the width of a pick and shorter than the inner diameter of focus ring FR. Since the first, second, and third sensors each correct positional deviation of not only focus ring FR but also wafer W, the spacing between the two outermost sensors is made shorter than the outer diameter of the wafer.

[0202] The first, second, and third sensors are used not only to detect and correct positional deviations of the wafer W and focus ring FR, but also to detect whether the pick is holding the wafer W or focus ring FR. For example, when the pick reaches in front of the load lock module LLM, if the tip of the pick is moved left and right and the third sensor detects an object, it can be determined that the wafer W or focus ring FR is placed on the pick. Also, when the pick reaches in front of the load port LP, the presence or absence of the wafer W or focus ring FR can be determined by a similar operation.

[0203] The third sensor placed in front of the load port LP is placed at a position that does not interfere with the opening and closing of the door 202 of the load port LP. Moreover, no structures other than the wafer W and focus ring FR are placed on the optical path connecting the light projecting part and the light receiving part of the third sensor. The same applies to the third sensor placed in front of the load lock module LLM.

[0204] (Other variations) In this embodiment, the execution of installation of the FR FOUP and the completion of removal require the input of instructions by the operator. However, the substrate processing system 1 may be configured so that the input of instructions by the operator is omitted.

[0205] In this embodiment, the type of FOUP that can be installed on each load port LP is fixed, but all load ports LP may be configured to be able to install either FR FOUPs or wafer FOUPs. In this case, a third sensor may be installed in front of all load ports LP. The types of the mapping sensor MS and the first to third sensors are not particularly limited, but a transmission type photoelectric sensor or the like may be used.

[0206] In addition, in this embodiment, the control device 30 is equipped with a display unit 34, but the screen generated by the control device 30 may be transmitted to another device via the input / output interface 33 and displayed on the other device.

[0207] <Effects of the embodiment> The substrate processing system according to the embodiment includes a normal pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, a plurality of attachments, a first transfer mechanism, a second transfer mechanism, and a control unit. The normal pressure transfer chamber transfers substrates and consumable parts in a normal pressure atmosphere. In the vacuum processing chamber, a vacuum process is performed on the substrate. The one or more load lock modules are disposed between the normal pressure transfer chamber and the vacuum processing chamber, and the transferred substrates and consumable parts pass through. The vacuum transfer chamber is disposed between the vacuum processing chamber and the one or more load lock modules, and the substrates and consumable parts are transferred in a reduced pressure atmosphere. The multiple attachments are provided in the normal pressure transfer chamber, and have ports through which the substrates or consumable parts transferred between each of the multiple storage units that accommodate the substrates or consumable parts and the normal pressure transfer chamber can pass. Each of the multiple storage units can be detachably attached to the multiple attachments. The first transfer mechanism transfers the substrates and consumable parts between the one or more load lock modules and the vacuum processing chamber via the vacuum transfer chamber. The second transfer mechanism transfers the substrate and the consumable parts between the multiple storage units and the one or more load lock modules via the atmospheric pressure transfer chamber. The control unit causes the first transfer mechanism and the second transfer mechanism to transfer the consumable parts from the storage unit to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and to transfer the consumable parts from the vacuum processing chamber via the vacuum transfer chamber and another one of the one or more load lock modules, in parallel. Therefore, the substrate processing system according to the embodiment can shorten the replacement time of the consumable parts in the vacuum processing chamber. Therefore, according to the embodiment, the operation rate of the substrate processing system can be improved. When a wafer is transferred via one load lock module, the transfer process must be put on hold while the load lock module is opened to the atmosphere and evacuated. The substrate processing system according to the above embodiment transfers the consumable parts via two load lock modules. Moreover, the substrate processing system according to the embodiment performs the replacement process when no wafer is present on the first transfer mechanism, the second transfer mechanism, and in the load lock module.Therefore, according to this embodiment, two load lock modules can be occupied for loading and unloading, respectively, and the time required for replacing consumable parts can be shortened.

[0208] In addition, in the substrate processing system according to the above embodiment, the multiple mounting parts include a first mounting part to which a first storage part for accommodating a substrate can be mounted, and a second mounting part to which a second storage part for accommodating a consumable part can be mounted. Therefore, in the substrate processing system according to the embodiment, the substrate storage part and the consumable part storage part can be similarly mounted in the normal pressure transfer chamber to perform replacement of the consumable parts.

[0209] In the substrate processing system according to the embodiment, the control unit causes the display unit to display the attachment states of the storage units in the attachment units, so that the substrate processing system according to the embodiment can allow the operator to easily check the attachment states of the storage units.

[0210] In the substrate processing system according to the embodiment, the control unit causes the display unit to distinguish between the first mounting unit and the second mounting unit among the multiple mounting units, so that the operator can easily confirm where the second storage unit for storing consumable parts should be mounted.

[0211] In addition, in the substrate processing system according to the above embodiment, the control unit accepts a reservation for replacing consumable parts arranged in the vacuum processing chamber. Then, when the control unit determines that there are no substrates or consumable parts being transferred in the vacuum transfer chamber, the one or more load lock modules, and the normal pressure transfer chamber, the control unit causes the first transfer mechanism and the second transfer mechanism to replace the consumable parts. Therefore, the substrate processing system according to the embodiment can replace the consumable parts without interfering with the processing of the substrate. Also, the substrate processing system can replace the consumable parts without worrying about contaminating or damaging the substrate.

[0212] In the substrate processing system according to the above embodiment, the control unit accepts a replacement reservation when the second storage unit is attached to the second attachment unit, and does not accept a replacement reservation when the second storage unit is not attached to the second attachment unit. Therefore, the substrate processing system according to the embodiment can prevent a replacement reservation from being accepted when the consumable part used for replacement is not prepared.

[0213] In the substrate processing system according to the embodiment, the control unit accepts attachment of the second storage unit to the second attachment unit only when a predetermined instruction is input. Therefore, the substrate processing system according to the embodiment can prevent the second storage unit for storing consumable parts from being installed without the operator's knowledge.

[0214] The substrate processing system according to the above embodiment further includes a sensor capable of detecting the substrate placed in the first storage unit and the consumable part placed in the second storage unit. The control unit changes the parameter of the sensor when a predetermined instruction is input. Thus, the substrate processing system can perform detection using parameters corresponding to the substrate and the consumable part.

[0215] In addition, in the substrate processing system according to the above embodiment, a holder for holding the substrate and the consumable parts is disposed at the tip of an arm of a transport mechanism (first transport mechanism and second transport mechanism) for transporting the substrate and the consumable parts. The holder includes a first surface, a plurality of first holding parts, and a plurality of second holding parts. The first surface faces the surfaces of the substrate and the consumable parts during transport. The plurality of first holding parts are formed on the first surface and hold the substrate. The plurality of second holding parts are formed on the first surface and disposed outside a first circle connecting the plurality of first holding parts and hold the consumable parts. The second holding part has an inclined surface that approaches the first surface from one end disposed on a second circle having a diameter larger than the outer diameter of the consumable parts toward the radially inner side of the second circle. Therefore, the second holding part can reduce the contact area with the consumable parts and prevent the consumable parts from sticking or jumping up. In addition, since the second holding part is disposed outside the first holding part, the ring-shaped consumable parts can be held by the second holding part without contacting the first holding part.

[0216] In the holder, the height of the first holder from the first surface is greater than the height of one end of the second holder from the first surface. Therefore, the first holder can hold the substrate without contacting the substrate with the second holder. Therefore, the holder according to the embodiment can prevent a substance adhering to the substrate from adhering to the holder.

[0217] In the above-mentioned holder, the other end of the second holder may be disposed on a third circle located between the inner diameter and the outer diameter of the consumable part. Also, the other end of the second holder may be disposed on a fourth circle having a diameter smaller than the inner diameter of the consumable part. Therefore, the second holder can be configured according to the shape of the consumable part to be transported.

[0218] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0219] 1. Substrate Processing System 10 Vacuum transfer chamber 15 VTM arm (first transfer mechanism) 17a 1st Pick 17b Second Pick 20. Normal pressure transfer chamber 25 LM Arm (Second Transfer Mechanism) 27a 1st Pick 27b Second Pick 30 Control device 31 Storage section 32 Processing section 33 Input / Output Interface 34 Display section 60 1st holding part 70 Second holding part 220 Plate 221 Aperture 222 First protrusion 223 Second protrusion 230 Movable lid 240 Moving mechanism LLM1,LLM2 Load Lock Module LP1~LP5 Load Port (Mounting Part) MS Mapping Sensor PM1~PM8 Process Modules (Vacuum Processing Rooms) S1~S16 First sensor S17~S18 Second sensor S20~S27 3rd sensor GV Gate Valve

Claims

[Claim 1] an atmospheric pressure transfer chamber in which the substrate and the consumable parts are transferred in an atmospheric pressure atmosphere; a plurality of mounting sections connected to the atmospheric pressure transfer chamber, to which a plurality of storage sections for accommodating the substrates or the consumable parts can be detachably attached; a first transport mechanism that transports the substrate and the consumable parts between each of the plurality of storage units and the atmospheric pressure transport chamber; a first sensor for detecting the consumable part in the storage section; a second sensor provided in the atmospheric pressure transfer chamber and different from the first sensor for detecting the consumable part in the atmospheric pressure transfer chamber; A control device; A substrate processing system comprising:

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