Electron gun device for vapor deposition

Abstract

To provide an electron gun device for vapor deposition that is suppressed in degradation in film deposition quality.SOLUTION: This electron gun device for vapor deposition includes: a device body provided with an electron beam source and installed laterally of a crucible that has an open top and in which an evaporation material to be vapor-deposited on a coating member is stored; and a pair of pole pieces guiding an electron beam emitted from the device body to a target area set in the crucible and including a base end part installed in the device body and a tip-end part disposed above the crucible and behind the target area as viewed from the device body; and a pair of reflected-electron deflection members extending in a direction separated from the device body from respective tip parts of the pair of pole pieces or a position in proximity to the tip parts to deflect a reflected-electron that is reflected from the target area in a predetermined direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an electron gun device for vapor deposition.

Background Art

[0002] There is known a vacuum vapor deposition apparatus that forms a film on a coating member such as a component constituting an optical device such as a substrate or a lens by attaching evaporation particles obtained by heating and evaporating an evaporation material placed in a vacuum chamber (see, for example, Patent Document 1 below).

[0003] Patent Document 1 below describes an electron gun device that is included in a vacuum vapor deposition apparatus and deflects an electron beam generated by an electron beam generation means with a deflection magnetic field generation means including a pole piece and makes the electron beam incident on an evaporation material in a crucible.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above-described vacuum vapor deposition apparatus is often used for forming thin films in the field of optical devices. With the recent improvement in performance of optical devices, it has been required to suppress light loss (for example, scattering and absorption) of optical thin films formed on optical devices. In this regard, in a vacuum vapor deposition apparatus, improvement in film formation accuracy of a thin film has been required. However, there is still room for improvement in existing vacuum vapor deposition apparatuses, particularly in electron gun devices for vapor deposition used in vacuum vapor deposition apparatuses, from the viewpoint of suppressing a decrease in film formation quality.

[0006] Based on the above points, an object of the present disclosure is to provide an electron gun device for vapor deposition that suppresses a decrease in film formation quality.

Means for Solving the Problems

[0007] In order to achieve the above object, an electron gun device for vapor deposition according to a first aspect of the present disclosure includes a device body having an electron beam source installed on a side of a crucible with an upper portion opened and an evaporation material to be vapor-deposited on a coating member accommodated therein, and guides an electron beam irradiated from the device body to a target region set in the crucible. The base end portion is installed on the device body, and the tip end portion is above the crucible and disposed behind the target region as viewed from the device body. A pair of pole pieces, and a pair of reflected electron deflection members extending in a direction away from the device body from each of the tip end portions of the pair of pole pieces or positions close to the tip end portions in order to deflect reflected electrons reflected from the target region in a predetermined direction.

[0008] In such an electron gun device for vapor deposition, by providing the reflected electron deflection member, the energy of the reflected electrons can be reduced, and a decrease in film formation quality caused by the reflected electrons irradiating the coating member can be suppressed.

[0009] An electron gun device for vapor deposition according to a second aspect of the present disclosure is the electron gun device for vapor deposition according to the first aspect of the present disclosure, wherein the pair of reflected electron deflection members extend to a position behind the position where the reflected electrons are reflected for the second time at the upper portion of the crucible as viewed from the device body.

[0010] In such an electron gun device for vapor deposition, the magnetic field generated by the reflected electron deflection member can be efficiently applied to the reflected electrons, and the irradiation of the reflected electrons to the coating member can be effectively suppressed.

[0011] An electron gun device for vapor deposition according to a third aspect of the present disclosure is the electron gun device for vapor deposition according to the first or second aspect of the present disclosure, wherein one or a plurality of magnetic field adjusting pieces extending in a direction approaching each other are provided on each of the opposing surfaces of the pair of reflected electron deflection members.

[0012] In such an electron gun device for vapor deposition, the magnetic field generated by the reflection electron deflection member can be locally strengthened, and the adjustment of the magnetic field around the reflection electron deflection member becomes easy.

[0013] The electron gun device for vapor deposition according to the fourth aspect of the present disclosure is the electron gun device for vapor deposition according to any one of the first to third aspects of the present disclosure, wherein the pair of reflection electron deflection members are in a direction away from the device main body from the respective tip portions of the pair of pole pieces or positions adjacent to the tip portions and in a direction away from or approaching the crucible.

[0014] In such an electron gun device for vapor deposition, the reflection electron deflection member can be extended along the traveling direction of the reflection electrons, and the magnetic field generated by the reflection electron deflection member can be efficiently applied to the reflection electrons. Thereby, the energy of the reflection electrons can be effectively suppressed.

[0015] The electron gun device for vapor deposition according to the fifth aspect of the present disclosure is the electron gun device for vapor deposition according to any one of the first to fourth aspects of the present disclosure, wherein the pair of pole pieces includes a detour portion extending in a direction away from the target region at least in a part between the base end portion and a position reaching above the crucible.

[0016] In such an electron gun device for vapor deposition, since the pole piece can be routed to a position away from the target region, adhesion of the evaporation material to the pole piece surface can be suppressed. Thereby, it is possible to suppress a decrease in the film formation quality caused by re-evaporation of the evaporation material attached to the pole piece.

[0017] The electron gun device for vapor deposition according to the sixth aspect of the present disclosure is the electron gun device for vapor deposition according to the fifth aspect of the present disclosure, wherein the detour portion extends in a direction intersecting a straight line connecting the device main body and the target region.

[0018] In such an electron gun device for vapor deposition, adhesion of the evaporation material to the pole piece can be more effectively suppressed.

[0019] In the electron gun device for vapor deposition according to the seventh aspect of the present disclosure, in the electron gun device for vapor deposition according to the fifth or sixth aspect of the present disclosure, the base end portion is located below the opening of the crucible, and the detour portion extends below the opening of the crucible.

[0020] In such an electron gun device for vapor deposition, the adhesion of the evaporation material to the pole piece can be more effectively suppressed.

[0021] The electron gun device for vapor deposition according to the eighth aspect of the present disclosure includes a device main body provided with an electron beam source, which is installed on the side of a crucible with an upper opening and containing an evaporation material to be vapor-deposited on a film member therein, and guides the electron beam irradiated from the device main body to a target area set in the crucible. The base end portion is installed on the device main body, the tip end portion is above the crucible and behind the target area as viewed from the device main body, and at least a part between the base end portion and the position reaching above the crucible includes a detour portion extending in a direction away from the target area, and a pair of pole pieces.

[0022] In such an electron gun device for vapor deposition, since the pole piece can be routed to a position away from the target area, the adhesion of the evaporation material to the surface of the pole piece can be suppressed. Thereby, it is possible to suppress a decrease in the film formation quality associated with the re-evaporation of the evaporation material adhering to the pole piece.

Effect of the Invention

[0023] According to the electron gun device for vapor deposition of the present disclosure, a decrease in film formation quality can be suppressed.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0025] Hereinafter, each embodiment for carrying out the present disclosure will be described with reference to the drawings. In the following, the range necessary for the description for achieving the object of the present disclosure is schematically shown, and mainly the range necessary for the description of the corresponding part of the present disclosure will be described, and the parts where the description is omitted are assumed to be based on known techniques. Also, the same or corresponding members in the drawings are denoted by the same or similar reference numerals, and duplicate descriptions are omitted. Further, when a plurality of the same or corresponding members are included in the drawings, some of them may be denoted by reference numerals for the sake of easy viewing of the drawings.

[0026] <First Embodiment> FIG. 1 is a schematic perspective view showing an example of an electron gun device for vapor deposition according to the first embodiment of the present disclosure. Also, FIG. 2 is a plan view of the electron gun device for vapor deposition shown in FIG. 1. Also, FIG. 3 is a side view of the electron gun device for vapor deposition shown in FIG. 1. In the following description, the direction indicated by arrow A shown in FIGS. 1 to 3 is temporarily defined as the left - right direction, the direction indicated by arrow B as the front - rear direction, and the direction indicated by arrow C as the height direction (or up - down direction).

[0027] The electron gun device 1 for vapor deposition according to the first embodiment of the present disclosure can be adopted as part of a vacuum vapor deposition device. This vacuum vapor deposition device may include, for example, a vacuum chamber (not shown) capable of substantially evacuating the interior, a substrate (not shown) as an example of a film member supported above the vacuum chamber, a crucible 3 (sometimes referred to as a "hearth" or "hearth liner") having the evaporation material 2 to be deposited on the above-described substrate accommodated therein, and the electron gun device 1 for vapor deposition. Note that the electron gun device 1 for vapor deposition of the present disclosure is also applicable to vapor deposition devices other than the vacuum vapor deposition device having the above-described configuration.

[0028] As shown in FIGS. 1 to 3, the electron gun device 1 for vapor deposition according to the present embodiment may be a device for irradiating the evaporation material 2 accommodated in the crucible 3 with an electron beam EB disposed adjacent to the crucible 3. Here, the term "adjacent" means that it only needs to be adjacent to the crucible 3, and it may be disposed laterally of the crucible 3 as shown in FIG. 1, or may include a structure in which at least a part thereof is disposed below the crucible 3.

[0029] As shown in FIG. 2, the crucible 3 exemplified in the present embodiment has an annular accommodation portion 3A with an open top. The accommodation portion 3A may accommodate an evaporation material 2 that is also annular and slightly smaller than the accommodation portion 3A. The crucible 3 may be connected to a rotation mechanism (not shown) to be rotatable in the horizontal direction in order to change the evaporation material 2 located in the target area TA. The rotation speed of the crucible 3 may be adjusted in consideration of the capacity and evaporation rate of the evaporation material 2.

[0030] In addition, in this embodiment, the crucible 3 having an annular accommodation portion 3A is exemplified, but the shape of the crucible 3 is not limited to this. For example, a single cup-shaped crucible having an opening substantially the same size as the target area TA may be employed, or a plurality of cup-shaped crucibles may be circularly arranged at predetermined intervals on a disk-shaped turntable, and a crucible that can be changed such that an electron beam is irradiated by rotating the turntable may be employed. Further, in the crucible 3, the opening portion excluding the target area TA may be covered by a cover member (not shown) in order to suppress unintentional heating due to the collision of reflected electrons RE or the like and external contamination.

[0031] For the evaporation material 2, a material to be deposited on the substrate may be appropriately employed. Specifically, for example, materials such as silicon oxide (SiO 2 ), titanium oxide (TiO 2 ), and zirconium oxide (ZrO 2 ) may be employed. By irradiating the portion of the annular evaporation material 2 located in the target area TA with the electron beam EB, the evaporation material 2 in that portion is heated, melted, and evaporated, and is deposited on the surface of the substrate installed above the target area TA.

[0032] The above-described electron gun apparatus 1 for deposition includes at least a device main body 10 at least a part of which is installed on the side of the crucible 3, an electron beam deflection means 20 for guiding the electron beam EB irradiated from the device main body 10 to the target area TA set in the crucible 3, and a pair of reflected electron deflection members 30L, 30R for deflecting the reflected electrons RE reflected from the target area TA in a predetermined direction.

[0033] The device main body 10 is a member installed on the side of the crucible 3 and capable of irradiating the electron beam EB. This device main body 10 may include a housing 11, an electron beam source 12 provided inside the housing 11, and a window portion 13 formed on the upper portion of the housing 11.

[0034] The electron beam source 12 may include, for example, a filament that emits thermoelectrons and an acceleration unit that accelerates the thermoelectrons to form an electron beam EB. Further, the housing 11 may house the electron beam source 12 therein, and may have a flat upper surface with a window portion 13 formed by through-holes in a part of the upper surface. Furthermore, a scan coil (not shown) for scanning the electron beam EB within the target region TA may be disposed around the window portion 13 within the housing 11. The electron beam EB generated by the electron beam source 12 including the above-described configuration is radiated outside the housing 11 through the window portion 13.

[0035] The electron beam deflection means 20 is means for deflecting the electron beam EB generated in the apparatus main body 10 and radiated outside the housing 11 and guiding it to the target region TA set in the crucible 3. The electron beam deflection means 20 deflects the electron beam EB in a predetermined direction using an electric field or a magnetic field. The electron beam deflection means 20 of the present embodiment includes at least a pair of pole pieces 21L and 21R that guide the electron beam EB to the target region TA by generating a magnetic field (magnetic field) around them, and a magnetic force source 22 for generating a magnetic field around the pair of pole pieces 21L and 21R.

[0036] The pair of pole pieces 21L and 21R can be formed of a strip-shaped member made of a ferromagnetic material and having a predetermined thickness. The pair of pole pieces 21L and 21R may be arranged so as to sandwich a straight line L that connects the apparatus main body 10, more specifically, the window portion 13 and the target region TA. More preferably, the pair of pole pieces 21L and 21R may be arranged at intervals from each other so as to have a shape symmetric with respect to the straight line L. Further, at least the base end portions 41L and 41R of the pair of pole pieces 21L and 21R are installed in the apparatus main body 10, and the tip end portions 42L and 42R are disposed above the crucible 3 and behind the target region TA as viewed from the apparatus main body 10. Note that the straight line L may substantially coincide with the traveling direction of the electron beam EB in the horizontal direction. In the present embodiment, a pair of pole pieces 21L and 21R having a shape symmetric with respect to the straight line L is exemplified, but the shapes of the pair of pole pieces 21L and 21R do not have to be symmetric, and each may have a different shape.

[0037] The base end portions 41L and 41R may be set at positions sandwiching the window portion 13 on the housing 11. Further, a magnetic force source 22 may be connected to the base end portions 41L and 41R. Furthermore, it is preferable that the base end portions 41L and 41R are positioned below the opening of the accommodation portion 3A of the crucible 3 so that they are not substantially exposed to the evaporated evaporation material 2.

[0038] The tip end portions 42L and 42R may be arranged to face each other with a predetermined interval in the backward direction in the front-rear direction of the target region TA. As shown in FIGS. 1 and 2, the shape of the tip end portions 42L and 42R is preferably such that at least a part of the opposing end faces approaches from the front to the rear in plan view so that the direction of the magnetic field formed by the tip end portions 42L and 42R is directed toward the target region TA.

[0039] Further, between the base end portions 41L and 41R and the tip end portions 42L and 42R of the pair of pole pieces 21L and 21R according to the present embodiment, there may be provided detour portions 43L and 43R extending in a direction away from the target region TA, and connecting portions 44L and 44R connecting between the detour portions 43L and 43R and the tip end portions 42L and 42R.

[0040] The detour portions 43L and 43R may be provided between the base end portions 41L and 41R and a position reaching above the crucible 3, in other words, a position overlapping the crucible 3 in plan view. As shown in FIGS. 1 and 2, one end of each of the detour portions 43L and 43R of the present embodiment is connected to the base end portions 41L and 41R, and extends away from each other along a direction intersecting the above-described straight line L, specifically, in the left-right direction, from the one end. Further, it is preferable that at least a part of the detour portions 43L and 43R extends below the opening of the accommodation portion 3A of the crucible 3. By including the above-described detour portions 43L and 43R in the pole pieces 21L and 22R, the pole pieces 21L and 22R can be routed to a position away from above the target region TA. The actions and effects of providing the detour portions 43L and 43R will be described in detail later.

[0041] The connecting portions 44L and 44R connect between the other ends of the detour portions 43L and 43R and the tip end portions 42L and 42R. In the present embodiment, the connecting portions 44L and 44R are formed in a substantially L shape in plan view so as to pass through a position relatively far from the target region TA.

[0042] The magnetic force source 22 can be constituted by a permanent magnet or an exciting coil (electromagnet). By connecting this magnetic force source 22 to the pole pieces 21L and 21R and other members in the housing 11, the pole pieces 21L and 21R etc. can be magnetized (excited).

[0043] The electron gun device 1 for vapor deposition according to the present embodiment is configured such that, due to the action of the electron beam deflection means 20 including the above-described configuration, the electron beam EB irradiated from the apparatus main body 10 is deflected by 180 to 270° in its traveling direction as shown in FIG. 3 and is irradiated onto the target region TA. The evaporation material 2 in the target region TA irradiated with this electron beam EB is heated and melted by the electron beam EB, evaporated, and deposited on the surface of the substrate as a film member previously installed above the target region TA to form a thin film.

[0044] Incidentally, in a vacuum vapor deposition apparatus including an existing electron gun device for vapor deposition, one of the factors that deteriorates the film formation quality of the film member is that the reflected electrons reflected by the evaporation material collide with the thin film (vapor deposition film) on the film member. Specifically, a part of the electron beam irradiated on the evaporation material that is not absorbed by the evaporation material and jumps out collides with the surface of the substrate as a film member installed above the evaporation material, and the thin film at the collided portion may be destroyed or deformed. The destruction or deformation is caused by the impact when the reflected electrons collide with the thin film or by the heat generated when the reflected electrons collide. In the present embodiment, in order to suppress the deterioration of the film formation quality due to the above-described reflected electrons, the pair of reflected electron deflection members 30L and 30R described above are employed.

[0045] The pair of reflected electron deflection members 30L and 30R are members for deflecting the reflected electrons reflected from the target area in a predetermined direction. As shown in FIGS. 1 to 3, the pair of reflected electron deflection members 30L and 30R extend in a direction away from the apparatus main body 10 from the respective tip portions 42L and 42R of the pair of pole pieces 21L and 21R, or positions close to the tip portions 42L and 42R. The pair of reflected electron deflection members 30L and 30R can be constituted by strip-shaped members having a predetermined thickness and made of a ferromagnetic material, similar to the pole pieces 21L and 21R. In the present embodiment, an example is shown in which the pair of reflected electron deflection members 30L and 30R are integrally formed with the pole pieces 21L and 21R, but the present invention is not limited thereto. For example, the pair of reflected electron deflection members 30L and 30R and the pole pieces 21L and 21R may be constituted by separate members and then connected.

[0046] When the pair of reflected electron deflection members 30L and 30R described above are integrally formed with the pair of pole pieces 21L and 21R, or are constituted by separate members and then connected, the pair of reflected electron deflection members 30L and 30R are magnetized by the magnetic force source 22 in the same manner as the pair of pole pieces 21L and 21R. Therefore, in the electron gun apparatus 1 for vapor deposition according to the present embodiment, it is not necessary to separately prepare a magnetic force source for magnetizing the pair of reflected electron deflection members 30L and 30R.

[0047] Also, the pair of reflected electron deflection members 30L and 30R in the present embodiment extend substantially in parallel with a predetermined interval therebetween. The aforementioned predetermined interval can be appropriately adjusted in consideration of, for example, the width in the left-right direction of the target area TA. In the present embodiment, an example is shown in which the pair of reflected electron deflection members 30L and 30R extend substantially in parallel with a predetermined interval therebetween, but the interval may become narrower or wider from the base end portion toward the tip end portion.

[0048] The magnetic fields generated by the pair of reflected electron deflection members 30L and 30R mainly act to deflect downward the reflected electrons RE that are reflected by the electron beam EB irradiated on the target region TA and fly upward. The reflected electrons RE deflected by the magnetic fields generated by the pair of reflected electron deflection members 30L and 30R, as shown in FIG. 3, after jumping upward from an arbitrary position P1 irradiated by the electron beam EB within the target region TA, proceed downward while approaching the upper surface of the crucible 3 along the gap between the pair of reflected electron deflection members 30L and 30R, and collide with an arbitrary position P2 on the crucible 3. The reflected electrons RE that collide with the upper surface of the crucible 3 at position P2 are partially absorbed by the upper surface of the crucible 3, and the other part jumps upward again as the reflected electrons RE. The reflected electrons RE that are reflected again proceed downward while approaching the upper surface of the crucible 3 along the gap between the pair of reflected electron deflection members 30L and 30R, and collide with another arbitrary position P3 on the upper surface of the crucible 3. Thereafter, the same operation can be repeated. In FIG. 3, for ease of understanding the trajectory of the reflected electrons RE, the irradiation position of the electron beam EB at a specific timing (also referred to as the position where it is reflected for the first time) P1 and the reflection positions of the related reflected electrons RE (also referred to as the positions where they are reflected for the second and third times) P2 and P3 are each illustrated as an arbitrary point, but each of the positions P1 to P3 can be displaced depending on the irradiation position and energy of the electron beam EB. Therefore, each of the positions P1 to P3 can be displaced particularly in the front-rear direction depending on various conditions.

[0049] According to the electron gun device 1 for vapor deposition according to the present embodiment, the energy of the electron beam colliding with the substrate surface decreases according to the number of reflections described above, and thus a decrease in film formation quality can be suppressed. In the present embodiment, the case where the reflected electrons RE are made to collide with the upper surface of the crucible 3 by the action of the magnetic field generated around the pair of reflected electron deflecting members 30L and 30R is illustrated. However, a cover member (not shown in the figure) may be provided in advance on the upper surface of the crucible 3, and the reflected electrons RE may be made to collide with the surface of the cover member. As the cover member, a plate-like member capable of covering the upper surface of the crucible 3 excluding the target region TA and the upper part of the high-temperature region HA around the target region TA can be employed. Further, it is preferable to employ a material for the cover member that can absorb the energy of the reflected electrons and the like. By adopting such a cover member, it is possible to suppress the reflected electrons RE from colliding with the evaporation material 2 in a portion where the reflected electrons RE are not located in the target region TA.

[0050] The length in the longitudinal direction of the pair of reflected electron deflecting members 30L and 30R is preferably extended at least to a position behind the position where the reflected electrons RE are reflected for the second time above the crucible 3 (position P2 in FIG. 3) as viewed from the apparatus main body 10. More preferably, as shown in FIG. 3, the length in the longitudinal direction of the pair of reflected electron deflecting members 30L and 30R is extended to a position behind the position where the reflected electrons RE are reflected for the third time above the crucible 3 (position P3 in FIG. 3) as viewed from the apparatus main body 10. By adjusting the pair of reflected electron deflecting members 30L and 30R to the lengths described above, the magnetic field by the pair of reflected electron deflecting members 30L and 30R can be efficiently applied to the reflected electrons RE. Therefore, the energy of the reflected electrons RE after passing through the region between the pair of reflected electron deflecting members 30L and 30R can be significantly reduced. Note that the position where the reflected electrons RE are reflected for the second time can be particularly displaced in the front-rear direction depending on the irradiation position and energy of the electron beam EB, and the energy of the reflected electrons RE themselves. Therefore, the "position where the reflection occurs for the second time" described above refers to the average position in the front-rear direction of the position where the reflected electrons RE jumping out in various environments are reflected for the second time on the upper surface of the crucible 3.

[0051] In the above-described embodiment, as an example, a case where a pair of reflection electron deflection members 30L and 30R are formed of strip-shaped ferromagnetic bodies that extend substantially parallel along the front-rear direction from the tip portions 42L and 42R of the pair of pole pieces 21L and 21R has been illustrated. However, the present disclosure is not limited thereto. Therefore, some modified examples of the pair of reflection electron deflection members will be exemplarily described below. Note that the modified examples shown below are the same as those of the first embodiment described above, except for the structure related to the pair of reflection electron deflection members. Therefore, the same reference numerals are given to the same structures as those in the above-described embodiment, and the description thereof is omitted, and the description will be centered on the different parts.

[0052] FIG. 4 and FIG. 5 are diagrams showing a modified example of the reflection electron deflection member of the electron gun apparatus for vapor deposition shown in FIG. 1. Note that FIG. 4(A), FIG. 4(B), and FIG. 5(A) are plan views, and FIG. 5(B) is a side view. In the above-described electron gun apparatus 1 for vapor deposition, a pair of reflection electron deflection members 30L and 30R extend from the tip portions 42L and 42R of the pair of pole pieces 21L and 21R described above. On the other hand, as shown in FIG. 4(A), the electron gun apparatus 1A for vapor deposition according to this modified example has a pair of reflection electron deflection members 31L and 31R that extend from positions close to the tip portions 42L and 42R of the pair of pole pieces 21L and 21R.

[0053] The pair of reflection electron deflection members 31L and 31R of the electron gun apparatus 1A for vapor deposition according to this modified example are formed so as to extend from positions relatively close to the tip portions 42L and 42R of the connecting portions 44L and 44R, rather than from the tip portions 42L and 42R of the pair of pole pieces 21L and 21R. In this pair of reflection electron deflection members 31L and 31R, as shown in FIG. 4(A), the gap between the pair of reflection electron deflection members 31L and 31R can be larger than the gap between the pair of reflection electron deflection members 30L and 30R described above. Therefore, the magnitude of the magnetic field generated by the pair of reflection electron deflection members 31L and 31R may be adjusted to such an extent that it does not hinder the deflection of the reflection electrons RE. Note that the position where the base end portions of the pair of reflection electron deflection members 31L and 31R are connected to the connecting portions 44L and 44R may be adjusted in consideration of the direction and magnitude of the magnetic field generated around the pair of reflection electron deflection members 31L and 31R.

[0054] In the above-described electron gun apparatus 1 for vapor deposition, a pair of reflection electron deflection members 30L and 30R that extend substantially parallel to each other are employed. In contrast, in the electron gun apparatus 1B for vapor deposition according to this modification, as shown in FIG. 4(B), a pair of reflection electron deflection members 32L and 32R that extend in a direction away from each other from the base end portion toward the tip end portion are employed.

[0055] The pair of reflection electron deflection members 32L and 32R of the electron gun apparatus 1B for vapor deposition of this modification extend from the tip end portions 42L and 42R of the pair of pole pieces 21L and 21R in a direction away from the apparatus main body 10 and inclined with respect to the straight line L. As a result, as shown in FIG. 4(B), the gap between the tip end portions of the pair of reflection electron deflection members 32L and 32R is larger than the gap between the base end portions. The angle formed between the pair of reflection electron deflection members 32L and 32R may be adjusted, for example, to -60° to 90°, more preferably -30° to 60°. When the angle formed between the pair of reflection electron deflection members 32L and 32R is negative (for example, -30°), the gap between the tip end portions is smaller than the gap between the base end portions, which is different from the shape shown in FIG. 4(B). Even in a pair of reflection electron deflection members 32L and 32R having such a configuration, the same effects as those described for the pair of reflection electron deflection members 30L and 30R above can be achieved. The above-described pair of reflection electron deflection members 32L and 32R extend from the tip end portions 42L and 42R of the pair of pole pieces 21L and 21R, but instead, they may extend from positions close to the tip end portions 42L and 42R of the pair of pole pieces 21L and 21R.

[0056] Furthermore, in the above-described electron gun apparatus 1 for vapor deposition, a strip-shaped ferromagnetic body is employed as the pair of reflection electron deflection members 30L and 30R. In contrast, the electron gun apparatus 1C for vapor deposition according to this modification includes a pair of reflection electron deflection members 33L and 33R provided with one or more protrusions (magnetic field adjusting pieces 34L and 34R) on the surfaces facing each other.

[0057] In the vapor deposition electron gun device 1C of this modification example, the pair of reflection electron deflection members 33L and 33R are substantially parallelly extended from positions relatively close to the tip portions 42L and 42R of the connecting portions 44L and 44R of the pair of pole pieces 21L and 21R, similar to the pair of reflection electron deflection members 30L and 30R described above. And on the opposing surfaces of each of this pair of reflection electron deflection members 33L and 33R, as shown in Fig. 5(A), one or a plurality of (two each in Fig. 5(A)) magnetic field adjusting pieces 34L and 34R extending in the direction approaching each other are provided. The magnetic field adjusting pieces 34L and 34R may be protrusions provided to adjust the direction and magnitude of the magnetic field generated around the pair of reflection electron deflection members 33L and 33R. The positions where the magnetic field adjusting pieces 34L and 34R are provided are not particularly limited, but it is preferable to arrange them in consideration of the action of deflecting the reflection electrons RE. For example, the magnetic field adjusting pieces 34L and 34R may be arranged so as to be at the position where the reflection electrons RE are reflected on the upper surface of the crucible 3 or behind that position.

[0058] Since the magnetic field adjusting pieces 34L and 34R can displace the magnitude and direction of the magnetic field generated around them, compared with those without the magnetic field adjusting pieces 34L and 34R, the adjustment of the generated magnetic field can be more easily realized. Also, in the pair of reflection electron deflection members 33L and 33R having such a configuration, the same effects as those described in the pair of reflection electron deflection members 30L and 30R above can be achieved.

[0059] Furthermore, in the vapor deposition electron gun device 1 described above, an example is given in which the pair of reflection electron deflection members 30L and 30R extend in the horizontal direction. In contrast, the vapor deposition electron gun device 1D according to this modification example includes a pair of reflection electron deflection members 35L and 35R extending in a direction away from the device body 10 from the base end portion toward the tip end portion, and also away from or approaching the crucible 3.

[0060] In the vapor deposition electron gun device 1D of this modification example, the pair of reflective electron deflection members 35L and 35R extend linearly obliquely upward with respect to the horizontal plane. As shown in FIG. 5(B), the inclination angle of the pair of reflective electron deflection members 35L and 35R with respect to the horizontal plane may be adjusted, for example, to -30° to 60°, more preferably 0° to 45°. Even in the pair of reflective electron deflection members 35L and 35R having such a configuration, the same effects as those described in the above-mentioned pair of reflective electron deflection members 30L and 30R can be achieved. Note that, although the pair of reflective electron deflection members 35L and 35R are exemplified as extending linearly, they do not necessarily have to be linear, and for example, a part thereof may be curved. Further, when the pair of reflective electron deflection members 35L and 35R extend in a direction approaching the crucible 3, an angle within a range where the crucible 3 and the pair of reflective electron deflection members 35L and 35R do not come into contact may be selected. Further, when the height positions of the pair of reflective electron deflection members 35L and 35R are close to the height position of the upper end of the crucible 3 and it is difficult to incline the pair of reflective electron deflection members 35L and 35R at a desired angle, the height of the bypass portions 43L and 43R may be adjusted to increase the height of the tips of the pair of pole pieces 21L and 21R.

[0061] As described above, according to the vapor deposition electron gun device according to the present embodiment and each modification example, with a relatively simple configuration in which a pair of reflective electron deflection members extend from a pair of pole pieces, the energy of the reflected electrons reflected from the target region and flying out can be reduced. Thereby, it is possible to suppress a decrease in the film formation quality of the film member due to the collision of the reflected electrons with the surface of the film member.

[0062] In addition to the above-described collision of reflected electrons with the thin film, there are other factors that deteriorate the film formation quality of the film member in a vacuum deposition apparatus including an existing electron gun apparatus for vapor deposition. Specifically, for example, contamination (contamination) of the thin film caused by the deposition of the evaporation material evaporated from the target region on members other than the film member can be cited. Such contamination of the thin film is likely to occur particularly when the pole piece is disposed above the target region. This is presumably due to the evaporation material evaporated from the crucible adhering and depositing on the pole piece, and the deposited evaporation material falling and re-evaporating in or near the crucible, or the deposited evaporation material being heated on the surface of the pole piece and re-evaporating. It has been found that the re-evaporated material can not only be a material different from the evaporation material in the crucible, but also the re-evaporated material itself is altered or the evaporation rate cannot be controlled, thus affecting the film formation quality.

[0063] In addition, the evaporation of the evaporation material can occur not only in the target region but also in a region (hereinafter referred to as the "high-temperature region") located around the target region and heated to a high temperature as the target region is heated. Therefore, the deterioration of the film formation quality caused by the above-described factors can be substantially avoided if the pole piece is not disposed above the target region and the high-temperature region. However, in order to deflect the electron beam in a desired direction without disposing the pole piece above the target region and the high-temperature region, it is necessary to accurately control the magnetic field around the electron beam, which is not easy. Therefore, the electron gun apparatus 1 for vapor deposition according to the present embodiment provides the above-described bypass portions 43L and 43R in the pair of pole pieces 21L and 21R in consideration of the above-described factors causing the deterioration of the film formation quality, thereby suppressing the adhesion and deposition of the evaporation material on the pole pieces 21L and 21R.

[0064] In the pair of pole pieces 21L and 21R in the present embodiment, in order to generate the most effective magnetic field around to stably irradiate the target area TA with the electron beam EB, their tip portions 42L and 42R are arranged at positions relatively close to the target area TA. On the other hand, in order to prevent the portions connecting the tip portions 42L and 42R and the base end portions 41L and 41R of the pole pieces 21L and 21R from being located above the target area TA and the high-temperature area HA as much as possible, detour portions 43L and 43R are adopted.

[0065] The detour portions 43L and 43R provided in the pair of pole pieces 21L and 21R of the present embodiment are provided between the base end portions 41L and 41R and the positions reaching above the crucible 3 as described above. Further, the detour portions 43L and 43R extend below the opening of the accommodation portion 3A of the crucible 3. Therefore, since the detour portions 43L and 43R are not located above the target area TA and the high-temperature area HA, the evaporation material 2 hardly adheres thereto. Also, the tips of the detour portions 43L and 43R are arranged away from the target area TA.

[0066] The connecting portions 44L and 44R connect the above-described detour portions 43L and 43R and the tip portions 42L and 42R. However, since the tips of the detour portions 43L and 43R are arranged at positions away from the target area TA, as shown in FIG. 2, it is possible to route around positions away from the target area TA and the high-temperature area HA. Thereby, adhesion of the evaporated evaporation material 2 to the connecting portions 44L and 44R can be suppressed.

[0067] As described above, according to the vapor deposition electron gun device 1 according to the present embodiment, by forming the detour portions 43L and 43R in a part of the pair of pole pieces 21L and 21R, the pair of pole pieces 21L and 21R can be arranged at positions away from the target area TA. Thereby, compared with the case where the pole piece is linearly extended from the base end portion to the upper part of the crucible 3 as in the prior art, adhesion of the evaporation material to the pole piece can be significantly reduced, and contamination of the thin film can be suppressed.

[0068] The pair of pole pieces of the present disclosure is not limited to those having a shape like the pair of pole pieces 21L and 21R described above. Therefore, some modified examples of the pole pieces included in the present disclosure will be described below. Note that the modified examples shown below are the same as those of the first embodiment described above, except for the structure related to the pair of pole pieces. Therefore, the same reference numerals are given to the same structures as those in the above-described embodiment, and the description thereof is omitted, and the following description will focus on the different parts.

[0069] FIG. 6 is a diagram showing a modified example of the pole piece of the electron gun apparatus for vapor deposition shown in FIG. 1. For example, in the electron gun apparatus 1E for vapor deposition according to this modified example, instead of the pair of pole pieces 21L and 21R described above, a pair of pole pieces 50L and 50R, a part of which is curved in an arc shape as shown in FIG. 6(A), can be adopted.

[0070] The pair of pole pieces 50L and 50R of the electron gun apparatus 1E for vapor deposition of this modified example can be constituted by strip-shaped members made of a ferromagnetic material and having a predetermined thickness, similarly to the above-described pole pieces 21L and 21R. As shown in FIG. 6(A), the pair of pole pieces 50L and 50R are arranged at intervals so as to have a symmetrical shape with respect to the straight line L. Further, the base end portions 51L and 51R of the pair of pole pieces 50L and 50R are installed on the apparatus main body 10, and the tip end portions 52L and 52R are disposed above the crucible 3 and behind the target region TA as viewed from the apparatus main body 10. In addition, detour portions 53L and 53R and connecting portions 54L and 54R are disposed between the base end portions 51L and 51R and the tip end portions 52L and 52R.

[0071] The base end portions 51L and 51R may be disposed at positions sandwiching the window portion 13 on the housing 11 and connected to the magnetic force source 22, similarly to the above-described base end portions 41L and 41R. Further, the tip end portions 52L and 52R may be disposed at a predetermined interval behind in the front-rear direction of the target region TA, similarly to the above-described tip end portions 42L and 42R.

[0072] As shown in Fig. 6(A), the detour portions 53L and 53R may be arc-shaped members having one end connected to the base end portions 51L and 51R and the tip reaching a position behind the target region TA, for example, the same front-rear direction position as the tip end portions 52L and 52R. The detour portions 53L and 53R extend in an arc shape along the outer edge of the crucible 3 outside the crucible 3, and extend mainly away from the target region TA in the left-right direction. Also, it is preferable that the vertical position of the detour portions 53L and 53R has at least a part extending below the opening of the accommodation portion 3A of the crucible 3. And the connecting portions 54L and 54R extend linearly along the left-right direction so as to connect the tips of the detour portions 53L and 53R and the tip end portions 52L and 52R.

[0073] Also in the vapor deposition electron gun device 1E of the above modification, by providing the detour portions 53L and 53R on the pair of pole pieces 50L and 50R, it is possible to adopt a structure in which most of the pair of pole pieces 50L and 50R are not disposed above the target region TA and the high temperature region HA. Thereby, compared with the case where the pole piece is linearly extended from the base end portion to the tip end portion as in the prior art, the adhesion of the evaporation material to the pole piece can be significantly reduced, and the contamination of the thin film can be suppressed.

[0074] In the above-described vapor deposition electron gun device 1, an example is shown in which the connecting portions 44L and 44R of the pair of pole pieces 21L and 21R are L-shaped in plan view. On the other hand, as shown in Fig. 6(B), the vapor deposition electron gun device 1F according to this modification employs a pair of pole pieces 60L and 60R including connecting portions bent at a plurality of locations.

[0075] The pair of pole pieces 60L and 60R of the electron gun device 1F for vapor deposition in this modification example are the same as the pair of pole pieces 21L and 21R described above, except for the structure of the connecting portions 64L and 64R. That is, the pair of pole pieces 60L and 60R can be composed of strip-shaped members made of a ferromagnetic material and having a predetermined thickness, and are arranged at intervals from each other so as to have a symmetrical shape with respect to the straight line L. Further, for the pair of pole pieces 60L and 60R, their base end portions 61L and 61R are installed on the device main body 10, and their tip end portions 62L and 62R are disposed above the crucible 3 and behind the target region TA as viewed from the device main body 10, and the detour portions 63L and 63R extend from the base end portions 61L and 61R in a direction away from the target region TA, specifically, along the left-right direction.

[0076] As shown in FIG. 6(B), the connecting portions 64L and 64R of the pair of pole pieces 60L and 60R have one end side extending along the front-rear direction and connected to the detour portions 63L and 63R, and the other end side extending along the left-right direction and connected to the tip end portions 62L and 62R, and extend in an oblique direction so as to cross the annular evaporation material 2 between the one end side and the other end side. Thereby, the pair of pole pieces 60L and 60R have a more compact shape than the pair of pole pieces 21L and 21R described above.

[0077] Also in the electron gun device 1F for vapor deposition of this modification example, by providing the detour portions 63L and 63R in the pair of pole pieces 60L and 60R, it is possible to adopt a structure in which most of the pair of pole pieces 60L and 60R are not disposed above the target region TA and the high-temperature region HA. As a result, compared with the case where the pole piece is linearly extended from the base end portion as in the prior art, the adhesion of the evaporation material to the pole piece can be significantly reduced, and the contamination of the thin film can be suppressed.

[0078] <Second Embodiment> In the above-described first embodiment, in addition to suppressing the deterioration of the film formation quality due to the collision of the reflected electrons RE with the film member, an example was shown in which the deterioration of the film formation quality caused by the evaporation material evaporated on the pair of pole pieces was also suppressed. However, the present disclosure is not limited to those capable of suppressing both of the above-described deteriorations of the film formation quality. Therefore, hereinafter, an electron gun device 5 for vapor deposition that can solve the problem caused by the evaporation material evaporated on the pair of pole pieces among the factors of the above-described deterioration of the film formation quality will be described.

[0079] FIG. 7 is a schematic perspective view showing an example of an electron gun device for vapor deposition according to a second embodiment of the present disclosure. Further, FIG. 8 is a plan view of the electron gun device for vapor deposition shown in FIG. 7. As shown in FIGS. 7 and 8, the electron gun device 5 for vapor deposition according to the present embodiment may have the same configuration as the electron gun device 1 for vapor deposition according to the above-described first embodiment, except that it does not have the reflection electron deflection members 30L and 30R. Therefore, for the specific structure of each part of the electron gun device 5 for vapor deposition, refer to the description of the structure of each part of the electron gun device 1 for vapor deposition as appropriate.

[0080] The electron gun device 5 for vapor deposition according to the present embodiment can be adopted as a part of the above-described vacuum vapor deposition device. Further, as shown in FIGS. 7 and 8, this electron gun device 5 for vapor deposition is disposed adjacent to the crucible 3 and irradiates the evaporation material 2 accommodated in the crucible 3 with an electron beam EB.

[0081] The above-described electron gun device 5 for vapor deposition includes at least a device main body 10 at least a part of which is installed on the side of the crucible 3, and an electron beam deflection means 20 for guiding the electron beam EB irradiated from the device main body 10 to a target area TA set in the crucible 3. Among these, the electron beam deflection means 20 includes at least a pair of pole pieces 21L and 21R that generate a magnetic field around them, and a magnetic force source 22.

[0082] And, for a pair of pole pieces 21L and 21R, the base end portions 41L and 41R are installed in the apparatus main body 10, the tip end portions 42L and 42R are located above the crucible 3 and behind the target area TA as viewed from the apparatus main body 10, and at least a part between the base end portions 41L and 41R and the position reaching above the crucible 3 includes detour portions 43L and 43R extending in a direction away from the target area TA.

[0083] Also in the electron gun apparatus 5 for vapor deposition according to the present embodiment, similar to the electron gun apparatus 1 for vapor deposition according to the first embodiment, since the pair of pole pieces 21L and 21R includes the detour portions 43L and 43R, the pair of pole pieces 21L and 21R can be arranged at positions separated from the target area TA and the high temperature area HA. Thereby, compared with the case where the pole piece is linearly extended from the base end portion as in the prior art, the adhesion of the evaporation material to the pole piece can be significantly reduced, and the contamination of the thin film can be suppressed.

[0084] Further, the specific shape of the pair of pole pieces 21L and 21R of the electron gun apparatus 5 for vapor deposition according to the present embodiment can be changed to the same shape as, for example, the pair of pole pieces 50L and 50R according to the above-described one modification example or the pair of pole pieces 60L and 60R according to other modification examples, but the shape of the pair of pole pieces of the electron gun apparatus 5 for vapor deposition according to the present embodiment is not limited to these.

[0085] FIG. 9 is a view showing a modification example of the pole piece of the electron gun apparatus for vapor deposition shown in FIG. 7. For example, as shown in FIG. 9, the electron gun apparatus 5A for vapor deposition according to the present modification example employs a pair of pole pieces 70L and 70R, a part of which is routed around the outer periphery of the crucible 3, instead of the pair of pole pieces 21L and 21R described above.

[0086] The pair of pole pieces 70L and 70R of the electron gun device 5A for vapor deposition in this modified example can be composed of strip-shaped members made of a ferromagnetic material with a predetermined thickness, similar to the pole pieces 21L and 21R described above. As shown in FIG. 9, this pair of pole pieces 70L and 70R are arranged at intervals with respect to each other so as to have a symmetrical shape with respect to the straight line L. Further, for the pair of pole pieces 70L and 70R, the base ends 71L and 71R are installed on the apparatus main body 10, and the tip ends 72L and 72R are disposed above the crucible 3 and behind the target region TA as viewed from the apparatus main body 10. In addition, bypass portions 73L and 73R and connecting portions 74L and 74R are disposed between the base ends 71L and 71R and the tip ends 72L and 72R.

[0087] The base ends 71L and 71R can be disposed at positions sandwiching the window portion 13 on the housing 11 and connected to the magnetic force source 22, similar to the base ends 41L and 41R described above. Further, the tip ends 72L and 72R can be disposed at a predetermined interval behind in the front-rear direction of the target region TA, similar to the tip ends 42L and 42R described above.

[0088] As shown in FIG. 9, one end of each of the bypass portions 73L and 73R is connected to the base ends 71L and 71R, and the tip end is routed to the rear of the crucible 3. The bypass portions 73L and 73R extend in a substantially U shape in plan view so as to partially surround the outside of the crucible 3. Further, it is preferable that at least a part of the vertical position of the bypass portions 73L and 73R extends below the opening of the accommodation portion 3A of the crucible 3.

[0089] The connecting portions 74L and 74R extend linearly along the front-rear direction so as to connect the tip ends of the bypass portions 73L and 73R and the tip ends 52L and 52R. As can be seen from FIG. 9, the connecting portions 74L and 74R according to this modified example can exhibit the same functions as the pair of reflection electron deflection members 30L and 30R described in the first embodiment.

[0090] Also in the electron gun device 5A for vapor deposition of the above-described modification, by providing the detour portions 73L and 73R in the pair of pole pieces 70L and 70R, it is possible to adopt a structure in which most of the pair of pole pieces 70L and 70R are not disposed above the target region TA and the high-temperature region HA. As a result, compared with the case where the pole piece is linearly extended from the base end portion as in the conventional case, the adhesion of the evaporation material to the pole piece can be significantly reduced, and the contamination of the thin film can be suppressed.

[0091] In each of the above-described embodiments, several modifications of the shape of the pole piece and the reflection electron deflection member are exemplified. However, the modifications are merely examples, and it is not intended that the shapes of the pole piece and the reflection electron deflection portion be limited to those shown in the modifications. Therefore, the shapes of the pole piece and the reflection electron deflection member can be changed to shapes other than those shown as modifications within a range in which the functions of the respective members can be maintained.

[0092] The present disclosure is not limited to the above-described embodiments, and various changes can be made and implemented without departing from the gist of the present disclosure. And all of them are included in the technical idea of the present disclosure.

Explanation of Reference Numerals

[0093] 1, 1A to 1F, 5, 5A Electron gun device for vapor deposition 2 Evaporation material 3 Crucible 10 Device main body 11 Housing 12 Electron beam source 13 Window portion 20 Electron beam deflection means 21L, 21R Pole pieces 22 Magnetic force source 30L, 30R Reflection electron deflection members 41L, 41R Base end portions 42L, 42R Tip end portions 43L, 43R Detour portions 44L, 44R Connection portions EB Electron beam RE Reflective electron TA Target area L Straight line

Claims

1. An apparatus main body provided with an electron beam source, which is installed on the side of a crucible with an upper part opened and an evaporation material to be deposited on a coating member accommodated inside; a pair of pole pieces that guide the electron beam irradiated from the apparatus main body to a target area set in the crucible, having a base end installed on the apparatus main body and a tip end located above the crucible and behind the target area as viewed from the apparatus main body; a pair of reflected electron deflection members extending in a direction away from the apparatus main body from each of the tip ends of the pair of pole pieces or positions close to the tip ends to deflect the reflected electrons reflected from the target area in a predetermined direction. The apparatus is an electron gun device for vapor deposition. Electron gun device for vapor deposition.

2. The pair of reflected electron deflection members extend to a position behind as viewed from the apparatus main body beyond the position where the reflected electrons are reflected for the second time at the upper part of the crucible. The electron gun device for vapor deposition according to Claim 1. The electron gun device for vapor deposition according to Claim 1.

3. One or a plurality of magnetic field adjusting pieces extending in a direction approaching each other are provided on each of the opposing surfaces of the pair of reflected electron deflection members. The electron gun device for vapor deposition according to Claim 1. The electron gun device for vapor deposition according to Claim 1.

4. The pair of reflected electron deflection members extend in a direction away from the apparatus main body from each of the tip ends of the pair of pole pieces or positions adjacent to the tip ends and in a direction away from or approaching the crucible. The electron gun device for vapor deposition according to Claim 1. The electron gun device for vapor deposition according to Claim 1.

5. The pair of pole pieces are provided with a detour portion extending in a direction away from the target area at least in part between the base end and the position reaching above the crucible. The electron gun device for vapor deposition according to Claim 1. The electron gun device for vapor deposition according to Claim 1.

6. The detour portion extends in a direction intersecting with a straight line connecting the apparatus main body and the target area. The electron gun device for vapor deposition according to Claim 5. The electron gun device for vapor deposition according to Claim 5.

7. The base end is located below the opening of the crucible, and the detour portion extends below the opening of the crucible. The electron gun device for vapor deposition according to Claim 5. The electron gun device for vapor deposition according to Claim 5.

8. An apparatus main body provided with an electron beam source, which is installed on the side of a crucible with an upper part opened and an evaporation material to be deposited on a coating member accommodated inside; It guides the electron beam irradiated from the device main body to the target area set in the crucible. The base end is installed in the device main body, the tip end is above the crucible and behind the target area as viewed from the device main body, and at least a part between the base end and the position reaching above the crucible is provided with a detour portion extending in a direction away from the target area, and a pair of pole pieces. Electron gun device for vapor deposition.

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