Display device

Abstract

To provide an electronic apparatus with high convenience and an electronic apparatus by which a user can easily read displayed information, and to reduce the motion required for the user to read information.SOLUTION: A housing of an electronic apparatus has a first portion located on the front of the housing, a second portion located on a side surface of the housing, a first band attachment portion, and a second band attachment portion. The second portion has a function of displaying an image. The first band attachment portion is located on a side surface located on an upper side when viewed from the front side of the housing. The second portion and the second band attachment portion are located on a side surface located on a lower side when viewed from the front side of the housing. The first portion has a function of displaying an image or has at least one of an hour hand, a minute hand, and a second hand.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One aspect of the present invention relates to an electronic device including a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a storage device, and a , electronic device, lighting device, input device, input / output device, driving method thereof, or manufacturing method thereof The law can be cited as one example. [Background technology]

[0003] Mobile information terminals such as smartphones and tablet terminals are being actively developed. In addition, such portable information terminals are required to be lightweight and small. There are.

[0004] In recent years, the development of wearable electronic devices has become more and more popular. Examples of wearable devices include wristwatch-type devices worn on the arm and glasses-type devices worn on the head. Examples include mirror-type devices and necklace-type devices worn around the neck. For example, wristwatch-type devices Instead of a dial, a watch has a small display, and displays various information other than the time. Such wearable devices can provide users with information about their health and the environment. It is also attracting attention for uses such as self-management of health status, and its practical application is progressing.

[0005] The representative display device is an organic EL (Electro Luminescence ) elements and light emitting diodes (LEDs) Light-emitting devices equipped with optical elements, liquid crystal display devices, electronic paper that displays using electrophoresis, etc. - etc.

[0006] Patent Document 1 discloses a flexible light-emitting device using an organic EL element. . [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2014-197522 A Summary of the Invention [Problem to be solved by the invention]

[0008] An object of one embodiment of the present invention is to provide a highly convenient electronic device. One of the objectives is to provide an electronic device that allows a user to easily read displayed information. Another object is to reduce the number of operations required by a user to read information.

[0009] Another embodiment of the present invention provides an electronic device that has high visibility regardless of external light. Another object of the present invention is to provide an electronic device with reduced power consumption. Or, it is possible to display both smooth moving images and still images that are easy on the eyes. It is an object of the present invention to provide an electronic device that can achieve the above object. One of the challenges we face is to: [Means for solving the problem]

[0010] One embodiment of the present invention is an electronic device having a housing. The housing includes a first portion, a second portion, and The first portion has a first band attachment portion and a second band attachment portion. The first portion is disposed on the front surface of the housing. The second part has a function of displaying an image. The first band attachment portion and the second band attachment portion are located on the side surfaces of the housing. The attachment portion is located on the side surface located on the upper side when viewed from the front side of the housing. The band attachment portion is located on a side surface that is located on the lower side when viewed from the front side of the housing.

[0011] Another embodiment of the present invention is an electronic device having a housing. The housing includes a first portion, a second portion, and a third portion. The first portion has a first band attachment portion and a second band attachment portion. The second part is located on the front side of the housing. The second part has a function of displaying an image. The first band attachment portion and the second band attachment portion are located on the side surfaces of the housing. The band attachment portion and the second band attachment portion are aligned along a first straight line that penetrates the side surface of the housing. The second portion is disposed at a position where the first straight line intersects with the side surface of the housing. Of the intersections, the point overlaps with a first point on the second band attachment portion side.

[0012] In the above, the second portion penetrates the side surface of the housing and is the first portion when viewed from the front side. A second line that intersects the line and overlaps with a second point that is one of the two intersection points with the side. In this case, it is preferable that the first point, the intersection point of the first straight line and the second straight line, and the second point It is preferable that the angle formed by these is equal to or greater than 45 degrees and equal to or less than 270 degrees.

[0013] The first portion may have at least one of an hour hand, a minute hand, and a second hand. preferable.

[0014] Alternatively, the first portion preferably has a function of displaying an image.

[0015] In addition, a display panel overlapping the first portion and a display panel overlapping the second portion are provided in the housing. It is preferred that the substrate has a channel.

[0016] The first portion and the second portion each have a function of displaying an image, and are seamlessly connected. In this case, the first portion and the second portion may overlap each other and may be curved. It is preferable to have a display panel.

[0017] A display panel provided across the first portion, the second portion, or the first portion and the second portion The devices include liquid crystal elements, organic EL elements, inorganic EL elements, LED elements, microcapsules, and electrophoretic moving element, electrowetting element, electrofluidic element, electroc It is preferable that the semiconductor device includes at least one element selected from the group consisting of a ROMIC element and a MEMS element.

[0018] Alternatively, the first portion, the second portion, or the first portion and the second portion may be provided. The display panel includes a first substrate, a second substrate, a first liquid crystal element, a first light emitting element, and a second The first liquid crystal element preferably has a first insulating layer and a second substrate. a first light emitting element disposed between the first substrate and the first insulating layer; The liquid crystal element has a function of reflecting light to the second substrate side, and the first light emitting element is It is preferable that the light emitting element has a function of emitting light to the side. Effect of the Invention

[0019] According to one aspect of the present invention, it is possible to provide an electronic device that is highly convenient. It is possible to provide an electronic device that makes it easy for a user to read the information displayed on the electronic device. This can reduce the number of actions required for the

[0020] Another embodiment of the present invention can provide an electronic device that has high visibility regardless of external light. Alternatively, it is possible to provide an electronic device with reduced power consumption. Alternatively, it is possible to display smooth moving images. It is possible to provide an electronic device capable of displaying both a still image and a picture that is easy on the eyes. It is possible to provide novel electronic devices. [Brief description of the drawings]

[0021] [Figure 1] 1A to 1C are diagrams illustrating electronic devices. [Diagram 2] 1A to 1C are diagrams illustrating electronic devices. [Diagram 3] 1A to 1C are diagrams illustrating electronic devices. [Figure 4] 1A to 1C are diagrams illustrating electronic devices. [Diagram 5] 1A to 1C are diagrams illustrating electronic devices. [Figure 6] 1A to 1C are diagrams illustrating electronic devices. [Figure 7] 1A to 1C are diagrams illustrating electronic devices. [Figure 8] FIG. 1 is a block diagram illustrating an electronic device. [Figure 9] FIG. 1 is a block diagram illustrating an example of a display device. [Figure 10] FIG. 2 is a diagram showing an example of a pixel unit. [Figure 11] FIG. 2 is a diagram showing an example of a pixel unit. [Figure 12] FIG. 2 is a diagram showing an example of a pixel unit. [Figure 13] 1A and 1B illustrate an example of a display device and an example of a pixel. [Figure 14] FIG. 1 is a circuit diagram illustrating an example of a pixel circuit of a display device. [Figure 15] 1A and 1B are a circuit diagram showing an example of a pixel circuit of a display device and a diagram showing an example of a pixel. [Figure 16] FIG. 1 is a perspective view showing an example of a display device. [Figure 17] FIG. 1 is a cross-sectional view showing an example of a display device. [Figure 18] FIG. 1 is a cross-sectional view showing an example of a display device. [Figure 19] FIG. 1 is a cross-sectional view showing an example of a display device. [Figure 20] FIG. 1 is a cross-sectional view illustrating an example of a transistor. [Figure 21] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display device. [Figure 22] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display device. [Diagram 23] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display device. [Figure 24] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the present invention can be realized by the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0023] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be used.

[0024] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by the following formula: The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0025] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0026] (Embodiment 1) In this embodiment, an electronic device according to one embodiment of the present invention will be described.

[0027] One embodiment of the present invention is an electronic device having a housing and a display portion located on a side surface of the housing. The case also comes with a band (belt or strap) for the user to wear. The wearable device has a pair of band attachment parts, which are parts to which the wearable device is attached. The present invention can be used as a wristwatch that can be attached to the user's arm. The device can be used as a portable information terminal device.

[0028] The front of the housing is provided with a display unit (first surface) capable of displaying a clock face or an image. When the display is provided on the front of the housing, the display is a touch panel. It is preferable that the ion exchange resin functions as a ion exchange resin.

[0029] In one embodiment of the present invention, a display unit (also called a second display unit) that displays an image along a side surface of a housing. By providing a display unit on the side of the housing, various information can be displayed on the display unit. This makes it possible to improve convenience for the user.

[0030] It is more preferable that the second display unit functions as a touch panel. The side of the housing can be used as an input device. By touching the side of the housing, the user can Able to operate electronic devices.

[0031] For example, if the device is a wristwatch-type device intended to be worn on the arm, two bands may be used. The mounting holes are located on the upper and lower sides when viewed from the front side. The two band attachment points are arranged in a straight line, facing each other. The band (first band) attached to the attachment part (first band attachment part) is wrapped around the arm. When the wristband is worn, it is located on the little finger side and is attached to the lower band attachment part (second band attachment part). The attached band (second band) is placed on the thumb side (the front side from the user's perspective) when wrapped around the arm. Located on the side.

[0032] In particular, the second display section is a portion of the side surface of the housing that is located on the second band attachment side. This part of the housing is preferably provided so that the user can see the display without intentionally viewing the display. For example, if you look at your arm while walking, it is a part that is easily visible. minutes, and while doing desk work (with arms resting on desk), This is the area that comes into view when you turn the phone down. By placing the second display in this area, When users want to obtain information from an electronic device, they turn their wrist to look at the front of the device. By simply shifting your field of vision, you can naturally access the information displayed on the second display without having to hold your hand up or down. Cut.

[0033] Furthermore, the second display unit is provided from the lower side surface of the housing to the left side surface or the right side surface. It is preferable that the second display unit is arranged to be connected to the lower side of the housing through the left side or the right side. In this way, the display area of ​​the second display unit can be increased. This makes it possible to provide more information to the user.

[0034] For example, assuming that the electronic device is worn on the left arm (preferably the left wrist), It is preferable that the second display section is provided from the lower side to the left side of the housing when viewed from the front side. When the electronic device is worn on the left arm, part of the left side of the housing is also exposed to the user's intended movement. It is a part that is easily visible without having to make any movement to look at it.

[0035] On the other hand, when the electronic device is assumed to be worn on the right arm, the bottom of the housing is It is preferable that the second display portion is provided extending from the side surface to the right side surface.

[0036] The second display unit is provided from the right side surface of the housing to the left side surface via the lower side surface. This allows for a universal design that can be worn on both the right and left arms. This can be realized.

[0037] In addition, on the left side or right side of the electronic device, on a portion where the second display unit is not provided For example, the watch may be worn on the left arm. In the case where it is assumed that the user will wear the device on the right arm, these will be provided on the right side of the housing. In some cases, these may be provided on the left side of the housing.

[0038] In addition, buttons, operation switches, crown, etc. are provided on the top side of the case, It is possible to realize a universal design that is intended to be worn on both the left and right arms.

[0039] The first display unit and the second display unit may be a liquid crystal element, an organic EL element, an LED element, a micro-cathode, or the like. Capsule, electrophoretic element, electrowetting element, electrofluidic element It is preferable that the light-emitting element includes one or more elements selected from the group consisting of an electrochromic element and a MEMS element. Examples of liquid crystal elements include transmissive liquid crystal elements, reflective liquid crystal elements, and semi-transmissive liquid crystal elements. In particular, reflective liquid crystal elements do not require a light source, so power consumption can be reduced. As the liquid crystal element, a nematic liquid crystal element, a cholesteric liquid crystal element, a ferroelectric liquid crystal element, etc. When a device using a liquid crystal material with memory properties is used, rewriting when displaying a still image is possible. Since the frequency can be reduced, power consumption can be reduced.

[0040] In particular, a display device in which a reflective element and a light-emitting element are mixed in the first display section is applied. In this way, when the brightness of the external light is bright, the consumption of the light by the reflective element is reduced. It is possible to display images with low power consumption, while at the same time, when the brightness of the external light is low, the light emitting element produces a vivid image. In addition, it is possible to simultaneously display images using reflective elements and light-emitting elements. As a result, power consumption is reduced and a vivid display can be achieved.

[0041] In addition, the second display unit may also be a display device in which the above-mentioned reflective element and light-emitting element are mixed. It is preferable to use

[0042] At least one of the first display section and the second display section includes the reflective element and the light-emitting element. By applying a display device that combines a child and a person with a computer, the user can easily see the display regardless of the brightness of the external light. It is possible to realize electronic devices that are simple to use.

[0043] Here, the first display section and the second display section are respectively configured with display elements having the same structure. The display device may be the same as the above, or a display device having a different configuration may be used. good.

[0044] For example, a first display unit is located on the front side of the housing, and a second display unit is located on the side of the housing. By applying a display device that combines reflective elements and light-emitting elements to each of these, low power consumption can be achieved. Thus, an electronic device with high power and high visibility can be realized.

[0045] For example, the first display unit located on the front side of the housing has both reflective and light-emitting elements. The display device is applied to realize low power consumption, and the second display is a display device having a light-emitting element. In this case, a display device may be applied to the side of the housing to provide a clear display. When the second display unit is used as a sub-display smaller than the first display unit, Since the area can be reduced, power consumption can be reduced.

[0046] The case may also have a windshield, bezel, crown, push buttons, lugs, etc. stomach.

[0047] Hereinafter, a more specific example of an electronic device according to one embodiment of the present invention will be described with reference to the drawings. do.

[0048] [Configuration example 1] 1(A) and (B) are perspective views of an electronic device 10 exemplified below. FIG. 1(B) shows the front (main surface), right side, and bottom (lower side) of the electronic device 10. The front, left side, and bottom of the device 10 are shown.

[0049] The electronic device 10 has a housing 11. The housing 11 includes a display unit 21, a display unit 22, a band attachment, and a display unit 23. The watch has a mounting portion 31, a band mounting portion 32, a crown 25, and a button 26. 1(A) and (B) are examples in which a band 41 and a band 42 are attached to an electronic device 10. This shows that.

[0050] The display unit 21 is located on the front side of the housing 11 and has the function of displaying information such as the time to the user. For example, the display unit 21 may be a clock face, or may display moving images or still images. A display device capable of displaying the image may be applied.

[0051] When a display device is applied to the display unit 21, even if a segment type display device is applied, This allows it to function as a digital clock.

[0052] In particular, the display unit 21 is an active matrix type or a passive matrix type display device. In particular, when a display device is applied to the display unit 21, It is preferable to apply a display device that functions as a panel.

[0053] When an analog clock face is provided on the display unit 21 located on the front side of the housing 11, The clock has at least one of the hour, minute, and second hands. It is preferable that the watch be of the quartz type, but it may be of the mechanical type. The battery can be shared between the display unit 21 and the electronic components (such as the display panel) in the housing. In addition, the mechanical system requires no power to operate, so the watch is battery-powered. Even if the battery level of the watch is low, it can still function as a clock. There are two types of meter: quartz type, which is powered by a battery, and one that is powered by the restoring force of a mainspring. A hybrid system that combines a mechanical system and a power source and can utilize two types of power may also be used.

[0054] The display unit 22 is provided on a part of the side surface of the housing 11 and has a function of displaying images. The display unit 22 may be a segment type display device, but may be an active matrix type. It is preferable to use a display device of the passive matrix type or passive matrix type. It is preferable to apply a display device that functions as a touch panel to the display device 2.

[0055] The band attachment portion 31 is located on the upper side of the housing 11, and the band attachment portion 32 is located on the upper side of the housing The band attachment portion 31 and the band attachment portion 32 are located on the lower side (bottom surface) of the camera 11. The display unit 21 is disposed in a position facing each other. The band attachment portion 31 and the band attachment portion 32 are shown as recesses provided in the housing 11. However, the form is not limited to this, and any mechanism capable of fixing the band 41 or the band 42 may be used. For example, the bands 41 and 42 may be connected to the housing 11 via spring bars. In the case of such a configuration, the band attachment portion 31 and the band attachment portion 32 are at least The structure may include a pair of bearings for mounting the bearings.

[0056] The housing 11 and the band 41, or the housing 11 and the band 42, are configured so as to be non-detachable. In addition, the band 41, the band 42, and the housing 11 may be integrated, and the boundaries between them may be unclear. In that case, at least the bendable portion may be configured as Band 41 or Band 42.

[0057] In this specification, when the electronic device 10 is viewed from the front side (the display unit 21 side), The side where 41 is provided is defined as the upper side, and the side where band 42 is provided is defined as the lower side.

[0058] The orientation of the image or dial shown on the display unit 21 is not limited to this, and may be tilted. For example, a display device may be applied to the display unit 21, and the electronic device 10 may be adjusted to display the image in response to changes in the orientation of the housing 11, such as the inclination of the housing 11. In the case where the display device has a function for detecting the orientation of the housing 11, the orientation of the image to be displayed can be adjusted according to the orientation of the housing 11. The timing may be changed.

[0059] The crown 25 and the button 26 function as one of the user interfaces. For example, the person may push, pull, turn, or move the crown 25 or button 26 up and down. Or, the user can perform an operation such as sliding the electronic device 10 forward or backward. In conjunction with such operations, the power can be turned on and off, applications can be started and switched, and In this embodiment, the case 11 has one crown 25. Although an example in which two buttons 26 are provided is shown, other switches or the like may also be provided.

[0060] Here, when the band 41 and the band 42 are wrapped around the user's arm, the band 41 is on the little finger side. and band 42 is located on the thumb side (the side closest to the user).

[0061] The display unit 22 is disposed on the side surface of the housing 11 on the band 42 side (i.e., the band attachment portion 32 side). ) in order for the user to see the front of the electronic device 10 (for example, the display unit 21). The user can change the display unit 2 simply by directing his or her gaze toward the electronic device 10 without having to turn his or her wrist to change the display unit 2. As a result, it is possible to realize extremely convenient electronic devices.

[0062] FIG. 2(A) is a schematic diagram of the electronic device 10 as viewed from the front side. 1 shows a case where the face of an analog clock is applied to the display unit 21.

[0063] The display unit 21 has an hour hand 51, a minute hand 52, a second hand 53, and an index 54. It is sufficient to have at least one of the hour hand 51, minute hand 52, and second hand 53. The deck 54 is not limited to the example shown in FIG. 2(A), and various designs can be applied. The display unit 21 also has a date display function (calendar), a moon phase display function, It may also have a power reserve display function.

[0064] FIG. 2B shows an example of an image that can be displayed when a display device is applied to the display unit 21. An example is shown.

[0065] In FIG. 2B, the display unit 21 displays date and time information 55, notification information 56, and a number of icons 57. In the notification information 56, for example, a message is received from the left. Images notifying the reception status of data communication signals, and images notifying the reception status of telephone communication signals The image shown here is not limited to the example shown here, and may display various information. The result can be displayed on the display unit 21.

[0066] FIG. 2C is a schematic diagram of the electronic device 10 as viewed from the display unit 22 side.

[0067] In FIG. 2C, the display unit 22 displays information indicating that a message has been received and the sender of the message. , and information notifying the radio wave reception status. Various information can be displayed on the display unit 22, without being limited to the above examples.

[0068] When still images are mainly displayed as images to be displayed on the display unit 21 and the display unit 22, The display device includes a display element having a memory function in the display unit 21 and the display unit 22. This is preferable because it allows reduction in power consumption.

[0069] Here, the display element having a memory function holds the display of a still image without rewriting. A display element with a memory function has a function of storing information when the power supply is stopped. The display element includes a display element that can maintain the display of a still image in a memory state. The memory includes display elements that maintain a still image when a constant voltage is applied. A display element having this property is a display element that can maintain the display of a still image without performing a refresh operation. The display element is also included.

[0070] A display element with memory properties can retain the display without refreshing or rewriting. The longer the period, the better. For example, it is 1 second or more, preferably 1 minute or more, and more preferably It is preferable that the concentration can be maintained for a period of at least one hour, more preferably at least one day and not more than one year. Here, the state in which the display is maintained is, for example, a state in which the display is maintained within a dynamic range of luminance. The change in luminance is 5% or less, preferably 3% or less, and more preferably 1% or less. In the case of a reflective display element, the above luminance can be replaced with the reflectance. That's good.

[0071] As display elements with memory properties, various bi-stable display technologies are used. A representative example of such a display element is electronic paper. Examples of electronic paper methods include the microcapsule method and electrophoresis (E PD: Electrophoretic Display) method, electronic powder fluid (registered trademark) ) type. Also, nematic liquid crystal, cholesteric liquid crystal, etc. It is also possible to use a display element using a bistable liquid crystal, such as a liquid crystal or a ferroelectric liquid crystal element.

[0072] In addition, electrowetting (EW) is a display element with a memory function. ectrowetting element, electrofluidic (EF) luidic element, electrochromic (EC) element child, MEMS (Micro Electro Mechanical Systems) MEMS elements that utilize optical interference and , MEMS elements using a shutter system, etc.

[0073] On the other hand, the display unit 21 and the display unit 22 may be configured as display elements of various types depending on the purpose of the electronic device 10. The child can be applied.

[0074] In addition, when smooth moving image display is required on the display unit 21 and the display unit 22, for example, For example, organic light emitting diode (OLED) LED (Light Emitting Diode) element, QLED ( Spontaneous light emission from quantum dot light emitting diodes The light-emitting element can be used as a display element. A transmissive liquid crystal element may also be used.

[0075] In particular, the display unit 21 and the display unit 22 each have a display element that utilizes reflected light and a light-emitting element. It is preferable to apply a display panel having a structure in which the following is provided between a pair of substrates: Reflective liquid crystal elements and transistors that drive them, and organic EL elements and transistors that drive them It is preferable to use a display panel having a transistor that operates. By using a liquid crystal display, when the outside light is bright, the display is made visible by using a reflective liquid crystal element. It has excellent light-emitting properties and consumes low power consumption. When the outside light is dark, the organic EL By using a liquid crystal display, a vivid display can be achieved. By using both OLED and LCD, it is possible to achieve both low power consumption and clear display. The realized display can be performed.

[0076] In addition, it is possible to set the display unit 21 or the display unit 22 not to display the information depending on the situation. Specifically, the pixels of the display unit 21 or the display unit 22 are driven. It is preferable that the display unit 21 and the display unit 22 are configured to be transparent. When a display device having a backlight such as a liquid crystal display device is used, the backlight It is preferable to configure the display unit 21 or the display unit 22 so that the display unit 21 or the display unit 22 is not driven. By temporarily hiding (deactivating) the display, power consumption can be reduced significantly.

[0077] It should be noted that the display units 21 and 22 are not limited to the above, and various displays can be made on the display units 21 and 22. For example, incoming emails, phone calls, and social networking services (SNS) Notifications, email and SNS subject, email and SNS sender name, message , date and time, time, audio and music information being played, volume, temperature, battery level, communication status, antenna It can display various information such as reception strength and download status of files, etc. In addition, the display unit 21 and the display unit 22 display icons associated with various applications. Displays icons, operation buttons, or sliders associated with various functions. For example, when playing voice or music, you may want to adjust the volume or fast forward. There are icons associated with functions such as rewinding, or when a phone call comes in. The function for answering or putting on hold and the operation of the electronic device 10 are disabled (also called a locked state). An icon or the like associated with a function for canceling the setting may be displayed.

[0078] In addition, the pixels of the display unit 21 and the display unit 22, the driving circuits, etc. are formed with an oxide film in the channel forming region. It is preferable to use a transistor that uses a semiconductor material and has an extremely low off-state current. A transistor using an oxide semiconductor that has a wider band gap than silicon has The low off-state current allows the charge stored in the capacitor connected in series with the transistor to be discharged for a long period of time. For example, by applying such a transistor to a pixel, Therefore, even if a display element having a memory effect is not used, the gradation of the displayed image can be maintained. As a result, power consumption is significantly reduced. This makes it possible to realize electronic devices that

[0079] [Configuration example 2] 3(A) and (B) are perspective views of an electronic device 10a exemplified below. The electronic device 10a shown in FIG. 1(B) is different from the electronic device 10 shown in FIG. 1(A), (B), etc. in that the shape of the display unit 22 is different. This differs from the configuration shown in FIG.

[0080] The display unit 22 is provided from the lower side to the left side of the housing 11. The display unit 22 is curved along a corner of the side surface of the housing 11. Images can be displayed without interruption from the bottom to the left side.

[0081] For example, assuming that the electronic device 10a is worn on the left arm, the lower surface of the housing 11 In addition, the left side of the housing 11 is also invisible to the user without the user's intentional action of looking at it. This allows the user to easily touch the front of the electronic device 10a (for example, the display unit 21). You can see the display by simply directing your gaze to the electronic device 10a without having to turn your wrist to look at it. The display 22 can be seen.

[0082] With this configuration, the area of ​​the display region of the display unit 22 can be increased, It is possible to display a lot of information to the user, which makes electronic devices more convenient. It can be achieved.

[0083] In addition, when it is assumed that the electronic device 10a is worn on the right arm, as shown in FIG. In other words, the configuration shown in FIG. 1 can be reversed from left to right. A display unit 22 is provided from the lower surface of the housing 11 to the right side surface thereof, and a crown 25 is provided on the left side surface of the housing 11. and button 26, etc. may be provided.

[0084] [Configuration example 3] 4(A) and (B) are perspective views of an electronic device 10b, which will be described below. The electronic device 10b shown in FIG. 3(B) is different from the electronic device 10 shown in FIG. 3(A), (B), etc. in that the shape of the housing 11 is different. The configuration differs from that shown in FIG.

[0085] The housing 11 has a circular shape when viewed from the front side. Similarly, the display unit 21 has a circular shape. It has a shape of a shape.

[0086] The housing 11 has a cylindrical shape on its side. The display unit 22 is curved along the side. The display unit 22 is curved uniformly from the lower side to the left side of the housing 11. The display unit 22 is disposed in a state in which the display unit 22 is in a vertical position from the lower side surface of the housing 11 to the left side surface. Images can be displayed without being cut off.

[0087] For example, assuming that the electronic device 10b is worn on the left arm, The area from the left side to the right side is easily visible without the user having to make an intentional move to look at it. This allows the user to see the front of the electronic device 10b (for example, the display unit 21). The user can turn the display unit 22 by simply directing his / her gaze toward the electronic device 10b without turning his / her wrist. can be seen.

[0088] With this configuration, the area of ​​the display region of the display unit 22 can be increased, It is possible to display a lot of information to the user, which makes electronic devices more convenient. It can be achieved.

[0089] In addition, when it is assumed that the electronic device 10b is worn on the right arm, as shown in Figs. In other words, the configuration shown in FIG. 1 can be reversed from left to right. A display unit 22 is provided from the lower surface of the housing 11 to the right side surface thereof, and a crown 25 is provided on the left side surface of the housing 11. and button 26, etc. may be provided.

[0090] [Configuration example 4] FIG. 5(A) is a perspective view of an electronic device 10c, which will be described below. The device 10c is different from the device 10 shown in FIG. 1(A) in that the display unit 21 and the display unit 22 are seamlessly connected. This differs from the configuration shown in (B) etc.

[0091] The display unit 21 and the display unit 22 are provided across the front and bottom surfaces of the housing 11. The display unit 21 and the display unit 22 are continuous without interruption from the front side to the lower side of the housing 11. The image can be displayed.

[0092] It is preferable that the display unit 21 and the display unit 22 are realized by one display device. For example, a display device that is partially or entirely flexible can be used.

[0093] For convenience, the boundary between the display unit 21 and the display unit 22 is indicated by a dotted line in FIG. When the front side of the housing is flat, the display unit of the electronic device 10c located on the front side is The flat portion is defined as the display portion 21, and the other portion including the curved portion is defined as the display portion 22. Alternatively, the part visible from the front side can be the display unit 21, and the part not visible from the front side can be the display unit 22. can also be defined as the display unit 22.

[0094] [Modifications] FIG. 5B shows a display unit 22a located on the lower side of the housing 11 and a display unit 22b located on the left side of the housing 11. In addition, the display unit 21, the display unit 22a, and the display unit 22b are shown. The display unit 21 and the display unit 22a, and the display unit 2 1 and display unit 22b, a continuous image can be displayed without interruption.

[0095] [Regarding the arrangement of the display unit 22] Next, a method for arranging the display unit 22 will be described.

[0096] FIG. 6(A1) is a schematic diagram of the electronic device 10 shown in FIG. 1(A) and the like, as viewed from the front side. FIG. 6(A2) shows an oblique view of the electronic device 10 as viewed from the left side and the bottom side. A perspective view is shown.

[0097] In FIG. 6(A1), the area in which the display unit 22 is provided is indicated by a dashed line. The display portion 22 is a part of the side surface of the housing, but for clarity, the thickness of the display portion 22 is not shown here. There are.

[0098] 6(A1) and (A2) show an imaginary straight line 15 penetrating the side surface of the housing 11. The straight line 15 is a straight line parallel to the surface of the display unit 21. If the surface is curved, the straight line 15 is a straight line perpendicular to the perpendicular line passing through the center of gravity of the display unit 21. .

[0099] The straight line 15 is a line symmetrical or plane symmetrical position between the band attachment portion 31 and the band It is a straight line perpendicular to the line of symmetry or plane of symmetry of the attachment part 32. 1 and band attachment portion 32 are provided along a straight line 15.

[0100] The band 41, the band 42, and the housing 11 are integrally molded, and the band attachment is clearly In the case where the band attachment portion 31 and the band attachment portion 32 are not present, The attachment portion 32 can be replaced with the band 41 or the band 42. The straight line 15 is a line of symmetry between the band 41 and the band 42 which are arranged at positions of line symmetry or plane symmetry. or a straight line perpendicular to the symmetry plane, and the bands 41 and 42 are aligned along the straight line 15. Each will be provided.

[0101] Since the straight line 15 penetrates the side surface of the housing 11, there are two gaps between the straight line 15 and the side surface of the housing 11. Of the two intersections, the upper intersection (the band attachment portion 31 side) is called intersection 1. 5a, and the intersection on the lower side (the band attachment portion 32 side) is designated as intersection 15b.

[0102] It is preferable that the display unit 22 is provided at a position that overlaps at least the intersection 15b. Point b is a point that is easily visible without the user making any intentional movement to look at it, so it is included here. By providing the display unit 22, the user can see the front of the electronic device 10 (for example, the display unit 21). The user can change the display unit 2 simply by directing his or her gaze toward the electronic device 10 without having to turn his or her wrist to change the display unit 2. You can see 2.

[0103] FIG. 6B shows the electronic device 10a exemplified in FIGS.

[0104] FIG. 6B shows a line 16 that intersects with the line 15. The line 16 intersects with the line 15. Similarly, a line that passes through the side surface of the housing 11 and has two intersections with the line 16 and the housing 11 is called an intersection point. Here, the line 16 is a straight line at the midpoint between the intersection points 15a and 15b. It is a straight line that intersects with line 15.

[0105] Of the two intersections, the intersection that overlaps with the display unit 22 is designated as 16a. When both of the intersections overlap with the display unit 22, the intersection farther than the intersection 15b is set as the intersection 16a. The closer intersection is designated as intersection 16b.

[0106] In FIG. 6B to FIG. 6E, the display portion 22 overlaps with the intersection 16a, and the intersection 16a is displayed. 2 shows the case where the sensor 20 is located at the end of the section 22.

[0107] Here, the angle between the lines 15 and 16 is θ. The angle θ is calculated by dividing the intersection point 15b and the line 15 by This is the angle between the intersection of line 16 and intersection point 16a.

[0108] The angle θ between the straight lines 15 and 16 is, for example, 30 degrees or more and 300 degrees or less, preferably 45 degrees or less. The angle θ is preferably 90 degrees or more and 270 degrees or less. The area of ​​the display region of the display unit 22 can be increased.

[0109] For example, FIG. 6C shows a case where the angle θ exceeds 180 degrees. The portion 22 is disposed across the lower side surface of the housing 11, passing through the left side surface and extending to a part of the upper side surface.

[0110] FIG. 6(D) shows the electronic device 10b illustrated in FIGS. 4(A) and 4(B).

[0111] In FIG. 6D, the display unit 22 is curved and disposed along the cylindrical side surface of the housing 11. FIG. 6D shows an example in which θ is less than 180 degrees. 2 is disposed from the lower side surface of the housing 11 to a part of the left side surface.

[0112] FIG. 6(E) shows an example in which the angle θ exceeds 180 degrees. The display unit 22 is disposed across the lower side surface of the housing 11, through the left side surface, and onto a part of the upper side surface.

[0113] The above is the explanation of the method for arranging the display unit 22.

[0114] [Example of internal configuration of electronic device] An example of an internal structure of an electronic device of one embodiment of the present invention will be described below.

[0115] FIG. 7A shows a schematic cross-sectional view of the electronic device 10. FIG. 7A shows the same as FIG. This corresponds to a cross section taken along the cutting line A1-A2 in the figure.

[0116] The electronic device 10 includes a display device 61, a display device 62, a battery 71, a printer, and a power supply 13 in a housing 11. The sensor includes a support substrate 72, a vibration module 74, and an antenna 75.

[0117] A plurality of ICs 73 are mounted on the printed circuit board 72. The display device 62 and the printed circuit board 72 are electrically connected by an FPC 63a. The plate 72 is electrically connected by an FPC 63b.

[0118] The electronic device 10 has a transparent member 6 on the front side of the housing 11 in an area overlapping the display device 61. The user can see the image displayed in the display area of ​​the display device 61 through the transparent member 64. The area of ​​the housing 11 where the light-transmitting member 64a is provided is shown in FIG. This corresponds to Part 21.

[0119] In addition, the electronic device 10 has a transparent member on the side surface of the housing 11 in an area overlapping the display device 62. The user can see the image displayed on the display device 62 through the light-transmitting member 64b. The area of ​​the housing 11 where the light-transmitting member 64b is provided corresponds to the display unit 22. Equivalent.

[0120] The light-transmitting members 64a and 64b are made of, for example, glass, crystal glass, Plastics and the like can be used.

[0121] FIG. 7B shows an example of a cross-sectional configuration of the electronic device 10c shown in FIG. 5A.

[0122] The electronic device 10c has a display device 61. The display device 61 is disposed on the front side of the housing 11. The display device 61 and the printed circuit board 72 are connected to each other by an FPC. 63.

[0123] The housing 11 also has a light-transmitting member 64. The light-transmitting member 64 is inserted from the front side of the housing 11. It is installed from the top to the side and part of it is curved.

[0124] The above is a description of an example of the internal configuration of the electronic device.

[0125] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0126] (Embodiment 2) [Example of hardware configuration of electronic devices] An example of the hardware configuration of the electronic device 10 will be described below.

[0127] FIG. 8 is a block diagram showing an example of the configuration of the electronic device 10. As shown in FIG.

[0128] In the drawings attached to this specification, the components are classified by function and are divided into independent blocks. Although the block diagram shows a block diagram, the actual components are completely separated by function. It is difficult to do so, and one component may be involved in multiple functions, or one function may involve multiple components. It may also be related to the element.

[0129] In addition, the configuration of the electronic device 10 illustrated in FIG. 8 is merely an example, and it is not necessary to include all of the components. The electronic device 10 only needs to include the necessary components among the components shown in FIG. Moreover, the device may have components other than those shown in FIG.

[0130] The electronic device 10 has a housing 11 .

[0131] The housing 11 includes a processor (CPU) 661, a touch panel 651, a touch panel 652, a memory A memory device 664, a display controller 671, a touch sensor controller 672, Battery controller 673, power receiving unit 674, battery module 675, sound controller controller 676, audio input unit 677, audio output unit 678, communication module 681, Tena 682, attitude detector 683, external interface 685, camera module 686 , a vibration module 687, a sensor module 688, etc.

[0132] Storage device 664, display controller 671, touch sensor controller 672 , battery controller 673, sound controller 676, communication module 681 , a posture detection unit 683, an external interface 685, a camera module 686, a vibration module The module 687, the sensor module 688, etc. are connected to the calculation unit 681 via the bus line 662. It is connected to 661.

[0133] The touch panel 651 corresponds to a display device constituting the display unit 21. Reference numeral 652 corresponds to a display device constituting the display unit 22.

[0134] The calculation unit 661 is, for example, a central processing unit (CPU). The calculation unit 661 can function as a memory device 664, for example. , a display controller 671, a touch sensor controller 672, a battery controller troller 673, sound controller 676, communication module 681, attitude detector 68 3. External interface 685, camera module 686, vibration module 687, The sensor module 688 and other components are controlled by the sensor module 689.

[0135] Signals are transmitted between the calculation unit 661 and each component via a bus line 662. The calculation unit 661 receives input from each component connected via a bus line 662. It has a function to process the signals to be output to each component, and a function to generate the signals to be output to each component. , each component connected to the bus line 662 can be controlled in an integrated manner.

[0136] In addition, the ICs of the calculation unit 661 and other components may have an oxide film in the channel formation region. It is also possible to use transistors that use nitride semiconductors and have extremely low off-state current. Since the off-state current of the transistor is extremely low, the transistor can be used as a memory element. It is used as a switch to hold the charge (data) that has flowed into the capacitance element that functions as a This allows the data retention period to be secured for a long period. By using the registers and cache memories, the arithmetic unit 661 operates only when necessary. In other cases, the information of the immediately preceding process is saved in the memory element, so that the normally-on This enables real-time computing, and the power consumption of the electronic device 10 can be reduced.

[0137] The arithmetic unit 661 interprets and executes instructions from various programs using a processor. It processes various data and controls programs. The data may be stored in a memory area of ​​the processor or may be stored in the storage device 664. It may be possible.

[0138] The calculation unit 661 includes a CPU and a DSP (Digital Signal Processor). processor), GPU (Graphics Processing Unit), etc. Other microprocessors may be used alone or in combination. The microprocessor is integrated into the FPGA (Field Programmable Gate A rray) and FPAA (Field Programmable Analog Arr Programmable Logic Devices (PLDs) such as The configuration may be realized by the above.

[0139] The calculation unit 661 may have a main memory. The main memory may include a RAM (Random Access Memory). ROM (Read-Only Access Memory) and other volatile memory. The configuration may include a non-volatile memory such as a serially integrated memory.

[0140] The RAM provided in the main memory is, for example, a dynamic random access memory (DRAM). A virtual dom access memory (VRAM) is used as the working space of the calculation unit 661. The memory space is allocated and used automatically. Operating systems, application programs, program modules, program data, etc. These data and programs are loaded into RAM for execution. The RAM and program modules are directly accessed and operated by the calculation unit 661.

[0141] On the other hand, ROM has a BIOS (Basic Input / Output) that does not require rewriting. It can store the ROM, such as the ROM (read-only memory) and firmware. Mask ROM and OTPROM (One Time Programmable Read Only) d Only Memory), EPROM (Erasable Programmable EPROM can be used. UV-EPROM (Ultra-Voltage Erasable Read-Only) is a type of EEPROM that allows data to be erased by exposure to ultraviolet light. iolet Erasable Programmable Read Only Me mory), EEPROM (Electrically Erasable Program ammunition read only memory, and flash memory. can be.

[0142] The storage device 664 may be, for example, a flash memory, an MRAM (Magnetore sistive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistive RAM), FeRAM ( A storage device that uses non-volatile memory elements such as Ferroelectric RAM. , or DRAM (Dynamic RAM) or SRAM (Static RAM), etc. A storage device using a volatile storage element such as a hard disk may also be used. Hard Disk Drive (HDD) and Solid State Drive (S You can also use a recording media drive such as SSD (solid state drive). stomach.

[0143] In addition, a removable HDD or S can be connected via the external interface 685. Storage devices such as SD cards, flash memory, Blu-ray discs, DVDs, and other recording media The media drive may be used as the storage device 664. A storage device that is not built into the electronic device 10 but is placed outside the electronic device 10 is referred to as a storage device 664. In that case, it may be connected via an external interface 685, or The communication module 681 may be configured to exchange data wirelessly.

[0144] The touch panel 651 and the touch panel 652 are each a display controller. The display controller 671 and the touch sensor controller 672 are connected to the display controller 671 and the touch sensor controller 672. The touch sensor controller 671 and the touch sensor controller 672 are connected via a bus line 662. The calculation unit 661 is connected to the

[0145] The display controller 671 receives an input from the arithmetic unit 661 via the bus line 662. In response to a drawing instruction, the touch panel 651 and the touch panel 652 are controlled. A predetermined image is displayed on the display surface.

[0146] The touch sensor controller 672 receives a request from the calculation unit 661 via the bus line 662. The touch sensors of the touch panel 651 and the touch panel 652 are controlled according to the request. In addition, the signal received by the touch sensor is output to the calculation unit 661 via the bus line 662. The function of calculating touch position information from the signal received by the touch sensor is called a touch sensor. The sensor controller 672 may have this value, or the calculation unit 661 may calculate it.

[0147] The touch panel 651 and the touch panel 652 are connected to a display controller 671. The touch panel 651 can display an image based on a signal supplied from the touch panel 651. The touch panel 652 operates based on a signal supplied from the touch sensor controller 672. It detects the approach or contact of a sensing object such as a finger or stylus and detects its position. The position information can be output to the touch sensor controller 672.

[0148] In addition, the touch panel 651, the touch panel 652, and the touch sensor controller 672 has a function of acquiring the distance in the height direction from the detection surface to the detected object. It is also preferable that the pressure sensor has a function of acquiring the magnitude of the pressure applied by the object to be detected on the detection surface. It is also preferable that the size of the surface of the object to be detected is obtained by the detection surface. It is preferable that

[0149] The touch panel 651 and the touch panel 652 are modules equipped with touch sensors. The display panel may be configured so that the display screen side of the display panel is overlapped with the display screen. The module having the sensor is at least partially flexible and is arranged along the display panel. The touch sensor is preferably bendable. They can be bonded with adhesives, etc. Also, a polarizing plate or a buffer material (separator) can be placed between them. The thickness of the module including the touch sensor may be equal to or less than the thickness of the display panel. is preferred.

[0150] The touch panel 651 and the touch panel 652 are a combination of a display panel and a touch sensor. For example, an on-cell type touch panel or an in-cell type touch panel may be used. It is preferable to use an on-cell type or in-cell type touch panel. In addition, the thickness and weight of the on-cell or in-cell touch panel can be reduced. This reduces the number of parts, thereby reducing costs.

[0151] The touch panels 651 and 652 have touch sensors that receive a test object such as a finger. Various sensors that detect the approach or contact of an intelligent object can be applied. For example, Capacitive type, resistive film type, surface acoustic wave type, infrared type, electromagnetic induction type, optical type, etc. In addition, a sensor using a photoelectric conversion element can be used. A pressure sensor using a pressure-sensitive element, etc. may be used. Two or more types may be provided, and two or more sensors of the same type may be provided.

[0152] For example, a capacitive touch sensor includes a pair of conductive layers. When the object to be detected touches, presses, or approaches the pair of conductive layers, Detection can be performed by utilizing the change in the capacitance between the pair of conductive layers. .

[0153] The capacitive touch panel includes a surface capacitive touch panel and a projected capacitive touch panel. Capacitive methods include self-capacitance and mutual capacitance, mainly depending on the driving method. The mutual capacitance method is preferable because it allows easy simultaneous multi-point detection.

[0154] In addition, instead of the touch panel 651 and the touch panel 652, A display panel having no function may also be applied.

[0155] A flexible touch panel 651, a touch panel 652, a display panel, a touch sensor The sensor may be, for example, a display element, a circuit for driving the display element, or a touch sensor. This can be achieved by using a flexible substrate as the substrate that supports the circuits, etc. By applying a flexible substrate to the touch panel 651 and the touch panel 652, the electronic device 10 This is preferable because it can reduce the weight.

[0156] A typical example of a material for the flexible substrate is an organic resin. In addition, glass, metal, alloy, semiconductor, etc. that is thin enough to have flexibility can be used. Or a composite material containing two or more of organic resin, glass, metal, alloy, semiconductor, etc. Laminated materials may be used.

[0157] The battery controller 673 manages the charging state of the battery module 675. The battery controller 673 can also control the battery module 675. The power receiving unit 674 receives power supplied from an external device. The battery controller 67 3 controls the operation of the power receiving unit 674 according to the charging state of the battery module 675. It is possible.

[0158] The battery module 675 may include, for example, one or more primary and / or secondary batteries. A secondary battery that can be used in the battery module 675 is, for example, a lithium ion secondary battery. Examples of battery modules include secondary batteries and lithium-ion polymer secondary batteries. In addition to these batteries, the 675 also has a protection circuit to prevent overcharging and over-discharging of the battery. may be provided.

[0159] When used indoors, an alternating current (AC) power source may be used as the external power source. In addition, when the electronic device 10 is used separately from an external power source, the charge and discharge capacity is large and the charge and discharge capacity is long. A battery module 675 is preferred that allows the use of the electronic device 10 over a period of time. When charging the battery module 675, a charger capable of supplying power to the electronic device 10 is used. In this case, a USB (Universal Serial Bus) connector may be used. Charging can be done by wired method using a power adapter or AC adapter, or by electric field coupling method or electromagnetic induction method. It can also be used as a wireless power supply system, such as the 3.1V system or the 3.2V system. good.

[0160] The battery controller 673 includes, for example, a battery management unit (BMU). The BMU may include a battery cell voltage and cell temperature data collection function, and a battery overcharge and overdischarge function. Monitoring of battery status, control of cell balancer, management of battery deterioration, remaining battery level (State Of Charge) It also performs functions such as calculating the state of charge (SOC) and controlling fault detection.

[0161] The battery controller 673 is connected to the power supply line ( The battery controls the transmission of power to each component via the battery (not shown). The controller 673 controls, for example, a multi-channel power converter, an inverter, a protection circuit, etc. The configuration may include the following.

[0162] The battery module 675 is overlapped with the touch panel 651 or the touch panel 652. In this case, the battery module 675 is installed. In the case where the housing 11 in which the battery is mounted is flexible and can be bent during use, At least a portion of the battery module 675 is also preferably flexible. As a secondary battery that can be applied to the battery module 675, for example, a lithium ion secondary battery and lithium ion polymer secondary batteries. To achieve this, it is advisable to use a laminated bag for the battery's outer container.

[0163] The film used for the laminated bag is a metal film (aluminum, stainless steel, nickel steel, plastic film made of organic materials, organic materials (organic resins, fibers, etc.) Hybrid material films containing inorganic materials (such as ceramics), carbon-containing inorganic films (carbon film, graphite film, etc.) or A laminated film made of multiple materials is used. Metal films are easy to emboss and have good adhesion. By forming concave or convex portions through embossing, the surface area of ​​the film exposed to the outside air increases. Therefore, it has excellent heat dissipation effect.

[0164] In particular, for laminated bags, metal film with concave and convex parts formed by embossing is used. When a laminated bag having the above structure is used, the strain caused by the stress applied to the laminated bag is reduced. As a result, the laminated bag does not break when the secondary battery is bent. This is preferable because it can effectively reduce problems such as the deterioration of the image.

[0165] In addition, it is preferable that the battery controller 673 has a low power consumption function. For example, as a power saving function, the electronic device 10 may detect that there is no input for a certain period of time, The clock frequency of the calculation unit 661 is lowered or the clock input is stopped, 61 itself, the auxiliary memory, and each component. In this way, the power supplied to the power supply will be reduced, and power consumption will be reduced. The function is performed by the battery controller 673 alone or in conjunction with the computing unit 661. It can be carried out.

[0166] The audio input unit 677 includes, for example, a microphone and an audio input connector. The audio input unit 678 includes, for example, a speaker and an audio output connector. The output units 678 are each connected to a sound controller 676 via a bus line 662. The audio data input to the audio input unit 677 is The signal is converted to a digital signal by the sound controller 676, and the sound controller 676 and the processor 678 perform the calculation. On the other hand, the sound controller 676 receives the following from the calculation unit 661: In response to the command, an analog audio signal that is audible to the user is generated and output to the audio output unit 678. The audio output unit 678 has an audio output connector that can be used with earphones, headphones, A sound output device such as a headset can be connected, and the device can output sound generated by the sound controller 676. The selected audio will be output.

[0167] The communication module 681 can perform communication via an antenna 682. To connect the electronic device 10 to a computer network in response to a command from the computing unit 661 and transmits the control signal to the computer network. The Internet and Intranets, which are the foundations of the World Wide Web (WWW) , Extranet, PAN (Personal Area Network), LAN (Local Area Network), CAN (Campus Area Network) work), MAN (Metropolitan Area Network), WAN (Wide Area Network), GAN (Global Area Network) The electronic device 10 can be connected to a computer network such as a In addition, when multiple communication methods are used, the antenna 682 can A plurality of such devices may be provided depending on the method.

[0168] The communication module 681 is provided with, for example, a high-frequency circuit (RF circuit) for transmitting and receiving RF signals. High-frequency circuits transmit electromagnetic and electrical signals in the frequency bands specified by the laws of each country. To convert between electromagnetic signals and wireless communications with other communications devices using those electromagnetic signals. The practical frequency band generally used is several tens of kHz to several tens of GHz. The high-frequency circuit connected to the antenna 682 has high-frequency components corresponding to a plurality of frequency bands. The high-frequency circuit section includes an amplifier, mixer, filter, DSP, RF The wireless communication protocol may include a transceiver. Or communication technology such as LTE (Long Term Evolution), GSM (G lobal System for Mobile Communication: Registration trademark), EDGE (Enhanced Data Rates for GSM Evo lution), CDMA2000 (Code Division Multiple Access 2000), W-CDMA (Wideband Code Divisi) on Multiple Access (registered trademark) or Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark), etc. E can be used to standardize communication specifications.

[0169] In addition, the communication module 681 has a function of connecting the electronic device 10 to a telephone line. In the case of making a call through a telephone line, the communication module 681 may In response to a command from the Sends a signal onto the telephone line.

[0170] The communication module 681 receives broadcast waves from an antenna 682 and transmits the signal to the touch panel. 651, and a tuner that generates a video signal to be output to the touch panel 652. For example, a tuner may include a demodulation circuit and an AD conversion circuit (analog-to-digital conversion circuit). The demodulation circuit can be configured to include a demodulation circuit and a decoder circuit. The AD conversion circuit demodulates the signal input from the The decoder circuit has the function of converting the digital signal into a digital signal. 671. It has functions.

[0171] The decoder may also have a splitting circuit and a plurality of processors. It has the function of dividing the input video data spatially and temporally and outputting it to each processor. The processors decode the input video data and output it to the display controller. In this way, the decoder generates a signal to be sent to the decoder 671. By applying a configuration that processes data in parallel, it is possible to digitalize video data with a large amount of information. In particular, it can display images with a resolution exceeding full HD. In this case, the decoder circuit for decoding the compressed data has an extremely high speed processing capability. It is preferable that the decoder circuit has a processor that can perform the above-mentioned operations. A configuration including multiple processors capable of parallel processing of 8 or more, and more preferably 16 or more. The decoder also detects the video signal included in the input signal and the It may also have a circuit for separating other signals (text information, program information, authentication information, etc.).

[0172] The broadcasting waves that can be received by the antenna 682 are terrestrial waves or satellite broadcasts. In addition, the broadcasting radio waves that can be received by the antenna 682 include analog There are various types of broadcasting, such as digital broadcasting, video and audio broadcasting, and audio-only broadcasting. For example, UHF band (approximately 300MHz to 3GHz) or VHF band (30MHz to 300M It is possible to receive broadcast radio waves transmitted in a specific frequency band of 100 Hz. For example, the transfer rate can be increased by using multiple data received in multiple frequency bands. This allows you to see more information than ever before, going beyond full HD. It is possible to display an image having a resolution on the touch panel 651 and the touch panel 652. For example, a video with a resolution of 4K2K, 8K4K, 16K8K or higher can be The image can be displayed.

[0173] The tuner is also transmitted via data transmission technology over a computer network. A signal to be transmitted to a display controller 671 is generated using the broadcast data. In this case, if the received signal is a digital signal, the tuner demodulates it. The circuit and the AD conversion circuit may not be included.

[0174] The attitude detection unit 683 has a function of detecting the inclination, attitude, etc. of the electronic device 10. The momentum detection unit 683 may include an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, a jack, etc. A combination of multiple sensors can also be used. good.

[0175] The external interface 685 may be, for example, one or more buttons provided on the housing 11. External ports to which input components such as switches (also called chassis switches) can be connected The external interface 685 is connected to the computer via the bus line 662. The switch is connected to a power supply ON / OFF section 661. buttons for adjusting the volume, and a button for taking pictures with the camera.

[0176] The external interface 685 has an external port, for example, a computer It can be configured to be connectable to an external device such as a printer via a cable. There are USB terminals, etc. Also, as an external port, LAN (Local Area Network) Network connection terminal, digital broadcast reception terminal, AC adapter connection terminal In addition to wired communication, infrared, visible light, ultraviolet light, etc. may be used. A transceiver for optical communication may be provided.

[0177] The camera module 686 is connected to the computing unit 661 via a bus line 662. For example, a switch provided on the housing is pressed, or the touch panel 651 and the touch panel You can take still images or videos by touching the 652. The laser module 686 may have a light source for photography. For example, a xenon lamp, etc. Lamps, light-emitting elements such as LEDs and organic ELs can be used. The touch panel 651 and the touch panel 652 may be used as the source. In that case, In addition to white light, various colors of light may be used for photography.

[0178] The vibration module 687 includes a vibration element that vibrates the electronic device 10 and a vibration control module that controls the vibration element. The vibration controller includes a vibration motor (eccentric motor), a resonance actuator, and a vibration sensor. Actuators, magnetostrictive elements, piezoelectric elements, etc., that convert electrical or magnetic signals into vibrations. Any element that can be used can be used.

[0179] The vibration module 687 controls the vibration frequency of the vibration element in response to a command from the calculation unit 661. By controlling the vibration, amplitude, duration, etc., the electronic device 10 can be vibrated in various vibration patterns. For example, vibrations and electronic functions linked to the operation of a switch on the housing can be Vibration linked to the start of the device 10, and vibration linked to video and audio played by a video playback application. vibrations linked to incoming e-mails; touch panel 651 and touch panel 6 52, vibrations linked to input actions, and other actions executed in various applications. The vibration module 687 can emit vibrations with various vibration patterns based on the received signal.

[0180] The sensor module 688 includes a sensor unit and a sensor controller. The controller supplies power to the sensor unit from a battery module 675 or the like. The sensor controller also receives input from the sensor unit, converts it into a control signal, and The sensor controller outputs the signal to the calculation unit 661 via the line 662. It may also be possible to perform error management for the unit, or to perform calibration processing for the sensor unit. The sensor controller is configured to include a plurality of controllers for controlling the sensor units. You may do so.

[0181] The sensor module 688 can detect, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, power, radiation Various sensors that have the function of measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays The configuration may include the following.

[0182] The above is a description of an example of the hardware configuration of the electronic device 10.

[0183] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0184] (Embodiment 3) An example of a display panel that can be used for a display portion or the like of an electronic device of one embodiment of the present invention will be described below. The display panel illustrated below is a panel that uses both a reflective liquid crystal element and a light-emitting element. and is capable of performing display in both a transmissive mode and a reflective mode.

[0185] FIG. 9 shows a block diagram of a display device 500. The display device 500 has a display unit 501. do.

[0186] The display unit 501 has a plurality of pixel units 530 arranged in a matrix. The unit 530 has a first pixel 531p and a second pixel 532p.

[0187] In FIG. 9, the first pixel 531p and the second pixel 532p are red (R) and green (G), respectively. 1 shows an example in which the display device has display elements corresponding to three colors: blue (B), green (G), and blue (B).

[0188] The display element of the first pixel 531p is a display element that utilizes reflection of external light. The first pixel 531p has a first display element 531R corresponding to red (R) and a second display element 531R corresponding to green (G ) corresponding to the first display element 531G, and blue (B) corresponding to the first display element 531B. Yes.

[0189] The display elements of the second pixels 532p are light-emitting elements. 2p is a second display element 532R corresponding to red (R), a second display element 532R corresponding to green (G), The first display element 532G corresponds to the color blue (B), and the second display element 532B corresponds to the color blue (B).

[0190] 10(A) to 10(C) are schematic diagrams showing configuration examples of the pixel unit 530.

[0191] The first pixel 531p includes a first display element 531R, a first display element 531G, and a first display element 531G. The first display element 531R reflects external light and displays red light Rr. Similarly, the first display element 531G and the first display element 531B each emit light toward the display surface side. The green light Gr or the blue light Br is emitted toward the display surface.

[0192] The second pixel 532p includes a second display element 532R, a second display element 532G, and a second display element 532R. The second display element 532R emits red light Rt to the display surface side. Similarly, the second display element 532G and the second display element 532B each emit green light Gt Alternatively, blue light Bt is emitted toward the display surface.

[0193] FIG. 10A shows a case where both the first pixel 531p and the second pixel 532p are driven. The pixel unit 530 corresponds to a display mode (third mode). , light Gr, light Br) and transmitted light (light Rt, light Gt, light Bt) are used to generate light 53 of a predetermined color. 5tr can be ejected onto the display surface.

[0194] FIG. 10B shows a display using reflected light by driving only the first pixel 531p. The pixel unit 530 corresponds to a mode (first mode) in which the pixel unit 530 displays a pixel image when, for example, there is sufficient external light. In the case where the second pixel 532p is strong against the light, the second pixel 532p is not driven and the light from the first pixel 531p is Using only (light Rr, light Gr, and light Br), light 535r can be emitted to the display surface side. This allows for extremely low power consumption drive.

[0195] FIG. 10C shows a case where only the second pixel 532p is driven to emit light (transmitted light). The pixel unit 530 corresponds to a mode (second mode) in which a display is performed using an external In cases where the light is extremely weak, the first pixel 531p is not driven and the second pixel 532p is driven. Using only the light (light Rt, light Gt, and light Bt) from This allows for a vivid display. It also brightens up the surroundings when the surroundings are dark. By lowering the intensity, it is possible to reduce the glare felt by the user and also reduce power consumption.

[0196] The colors and the number of the display elements of the first pixel 531p and the second pixel 532p are each limited. Not determined.

[0197] 11(A) to (C) and 12(A) to (C) show the configuration of the pixel unit 530. Here, an example is shown in which both the first pixel 531p and the second pixel 532p are driven. The diagram shows a schematic diagram corresponding to a mode (third mode) in which display is performed by A mode in which only the first pixel 531p or the second pixel 532p is driven (first mode) The display can also be performed in the first mode (first mode and second mode).

[0198] The second pixel 532p shown in FIGS. 11A, 11C, and 12B is a second display element 5 32R, the first display element 532G, and the second display element 532B, which exhibit white (W). The second display element 532W has a second display element 532W.

[0199] The second pixel 532p shown in FIG. 11B and FIG. 12C includes a second display element 532R, In addition to the second display element 532G and the second display element 532B, a second It has a display element 532Y.

[0200] The configurations shown in FIGS. 11(A) to 11(C) and 12(B) and 12(C) include a second display element 532W In addition, the display using the second pixel 532p is different from the display using the second pixel 532Y in the configuration without the second display element 532Y. It is possible to reduce power consumption in the modes (second mode and third mode).

[0201] The first pixel 531p shown in FIG. 11C includes a first display element 531R and a first display element 531G, the first display element 531 that exhibits white (W) in addition to the first display element 531B. Has W.

[0202] The configuration shown in FIG. 11C is different from the configuration shown in FIG. 10A in that the first pixel 531p It is possible to reduce power consumption in the display modes (first mode and third mode) in which the display is used. can.

[0203] The first pixel 531p shown in FIGS. 12A to 12C is a first display element 53 that exhibits white color. At this time, a display mode using only the first pixel 531p (first mode In the second pixel 532, a black and white display or a grayscale display can be performed. In the display modes using p (the second and third modes), color display is possible. can.

[0204] With this configuration, the aperture ratio of the first pixel 531p can be increased. Therefore, the reflectance of the first pixel 531p is improved, and a brighter display can be achieved.

[0205] The first mode is for displaying information that does not require color display, such as document information. Suitable for:

[0206] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0207] (Embodiment 4) In this embodiment, a more specific example of the display device exemplified in the second embodiment will be described with reference to FIG. This will be described with reference to the following.

[0208] FIG. 13A is a block diagram of a display device 400. The display device 400 includes a display unit 36. The display unit 362 has a plurality of display elements arranged in a matrix. It has pixels 410.

[0209] The display device 400 includes a plurality of wirings G1, a plurality of wirings G2, a plurality of wirings ANO, and a plurality of wirings CSCOM, a plurality of wirings S1, and a plurality of wirings S2. The line G2, the multiple wirings ANO, and the multiple wirings CSCOM are each in the direction indicated by the arrow R. The wirings S1 and S2 are electrically connected to the pixels 410 and the circuit GD arranged in the same direction. The wiring S2 is connected to a plurality of pixels 410 and a circuit SD arranged in the direction indicated by the arrow C. Make an electrical connection.

[0210] For simplicity, a configuration having one circuit GD and one circuit SD is shown here. A circuit GD and a circuit SD for driving the crystal element, and a circuit GD and a circuit SD for driving the light emitting element. may be provided separately.

[0211] The pixel 410 has a reflective liquid crystal element and a light emitting element.

[0212] 13B1 to 13B4 show examples of the structure of the electrode 311 of the pixel 410. 11 functions as a reflective electrode of the liquid crystal element. An opening 451 is provided.

[0213] 13(B1) and (B2) show a light emitting element 360 located in a region overlapping with the electrode 311. The light emitting element 360 is disposed so as to overlap with an opening 451 of the electrode 311. As a result, the light emitted by the light emitting element 360 is emitted to the display surface side through the opening 451. will be done.

[0214] In FIG. 13B1, adjacent pixels 410 in the direction indicated by the arrow R correspond to different colors. At this time, as shown in FIG. 13(B1), two adjacent In the pixel, the openings 451 are provided at different positions of the electrode 311 so as not to be arranged in a line. This allows the two light emitting elements 360 to be spaced apart, The phenomenon in which light emitted by the optical element 360 enters the colored layer of the adjacent pixel 410 (cluster In addition, the two adjacent light emitting elements 360 can be Since the light emitting element 360 can be arranged at a distance from the substrate, the EL layer of the light emitting element 360 can be formed by using a shadow mask or the like. Even in the case where the display is divided into two parts, a high-definition display device can be realized.

[0215] In FIG. 13B2, adjacent pixels 410 in the direction indicated by the arrow C correspond to different colors. Similarly, in FIG. 13(B2), two adjacent pixels in the direction indicated by the arrow C are In this embodiment, the openings 451 are provided at different positions of the electrode 311 so as not to be arranged in a line. It is preferable that

[0216] The smaller the ratio of the total area of ​​the openings 451 to the total area of ​​the non-openings, the more efficient the image display using the liquid crystal element. In addition, the total area of ​​the openings 451 relative to the total area of ​​the non-openings can be brightened. The larger the value of this ratio, the brighter the display using the light emitting element 360 can be.

[0217] The shape of the opening 451 may be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. The shape may also be thin stripes, slits, or a checkered pattern. The apertures 451 may be arranged close to adjacent pixels. The pixels are arranged close to the other pixels to be displayed, which helps to suppress crosstalk.

[0218] Also, as shown in FIG. 13(B3) and (B4), in the portion where the electrode 311 is not provided, The light emitting region of the light emitting element 360 may be located in the The light emitted from the reflective surface is emitted toward the display surface.

[0219] In FIG. 13B3, in two pixels 410 adjacent to each other in the direction indicated by the arrow R, In FIG. 13(B4), the children 360 are not arranged in a line. In the two pixels 410, the light emitting elements 360 are arranged in a row.

[0220] In the configuration of FIG. 13B3, the light-emitting elements 360 of two adjacent pixels 410 are connected to each other. Since the display can be spaced apart, it is possible to suppress crosstalk and achieve high resolution, as mentioned above. 13B4, the electrode 31 is disposed on the side of the light emitting element 360 parallel to the arrow C. Since the electrode 311 is not positioned, the light from the light emitting element 360 is prevented from being blocked by the electrode 311. Viewing angle characteristics can be achieved.

[0221] The circuit GD can be implemented using various sequential circuits such as a shift register. A transistor, a capacitor, or the like can be used for the circuit GD. The transistor can be formed in the same process as the transistor included in the pixel 410.

[0222] The circuit SD is electrically connected to the wiring S1. For example, an integrated circuit is used for the circuit SD. Specifically, the circuit SD can be implemented using an integrated circuit formed on a silicon substrate. There can be.

[0223] For example, the COG (Chip on Glass) method or the COF method is used to A circuit SD can be mounted on a pad electrically connected to the element 410. Specifically, An anisotropic conductive film can be used to mount integrated circuits on the pads.

[0224] FIG. 14 is an example of a circuit diagram of a pixel 410. In FIG. 14, two adjacent pixels 410 This shows that.

[0225] The pixel 410 includes a switch SW1, a capacitance element C1, a liquid crystal element 340, a switch SW2, and a transistor. The pixel 410 includes a transistor M, a capacitance element C2, and a light-emitting element 360. Wire G1, wire G2, wire ANO, wire CSCOM, wire S1, and wire S2 are electrically In FIG. 14, the wiring VCOM1 electrically connected to the liquid crystal element 340 is , and a wiring VCOM2 electrically connected to the light-emitting element 360 are shown.

[0226] FIG. 14 shows an example in which transistors are used for the switches SW1 and SW2. is doing.

[0227] The gate of the switch SW1 is connected to the wiring G1. One of the drains is connected to the wiring S1, and the other is connected to one electrode of the capacitance element C1, The other electrode of the capacitance element C1 is connected to the wiring CS The other electrode of the liquid crystal element 340 is connected to the wiring VCOM1. do.

[0228] The gate of the switch SW2 is connected to the wiring G2. One of the drains is connected to the wiring S2, and the other is connected to one electrode of the capacitance element C2, The other electrode of the capacitance element C2 is connected to the gate of the transistor M. The transistor M is connected to the source or drain of the transistor M and the wiring ANO. The other of the source and the drain is connected to one electrode of the light-emitting element 360. The other electrode of the terminal 360 is connected to the wiring VCOM2.

[0229] In FIG. 14, a transistor M has two gates that sandwich a semiconductor. These are connected to form This increases the current that the transistor M can pass. It is possible.

[0230] A signal for controlling the switch SW1 to a conductive state or a non-conductive state is applied to the wiring G1. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the alignment state of the liquid crystal of the liquid crystal element 340 can be applied. The OM can be given a predetermined electrical potential.

[0231] A signal for controlling the switch SW2 to a conductive state or a non-conductive state is applied to the wiring G2. A potential difference that causes the light emitting element 360 to emit light is generated between the wiring VCOM2 and the wiring ANO. A potential that controls the conduction state of the transistor M can be applied to the wiring S2. A signal can be provided to control the

[0232] In the pixel 410 shown in FIG. 14, when performing a display in a reflective mode, for example, the wiring G1 and the wiring The liquid crystal element 340 is driven by a signal applied to the line S1, and optical modulation is used to display the image. In addition, when displaying in a transmissive mode, the signal applied to the wiring G2 and the wiring S2 is The light emitting element 360 can be driven by a signal to emit light for display. When driving the wiring G1, the wiring G2, the wiring S1, and the wiring S2, It can be driven by a signal.

[0233] In FIG. 14, one pixel 410 includes one liquid crystal element 340 and one light emitting element 360. 15A shows an example in which one pixel 410 has one The liquid crystal element 340 and the four light-emitting elements 360 (light-emitting elements 360r, 360g, 360b, 15(A) shows an example having a pixel 410 having a pixel pitch of 60w. The pixel 410 shown in FIG. 15(A) has a pixel pitch of 60w. In this way, full color display is possible using a light-emitting element in one pixel.

[0234] In FIG. 15A, in addition to the example of FIG. 14, a line G3 and a line S3 are connected to a pixel 410. is.

[0235] In the example shown in FIG. 15A, for example, four light emitting elements 360 are provided with red (R), green (G), Light-emitting elements that emit green (G), blue (B), and white (W) colors can be used. A reflective liquid crystal element that exhibits white color can be used as the liquid crystal element 340. In the case of display in reflective mode, white color with high reflectance can be displayed. When display is performed in the transmissive mode, display with high color rendering can be achieved with low power consumption.

[0236] FIG. 15B shows a configuration example of a pixel 410 corresponding to FIG. 15A. The pixel 410 has the following configuration. A light emitting element 360w overlapping with an opening of the electrode 311 and a light emitting element 360b arranged around the electrode 311 The light emitting element 360 includes a light emitting element 360r, a light emitting element 360g, and a light emitting element 360b. It is preferable that the light emitting areas of the light emitting elements 360r, 360g, and 360b are approximately equal to each other. I wish.

[0237] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0238] (Embodiment 5) In this embodiment, a more specific example of the display device exemplified in the second and third embodiments is described. Such configuration examples will be described with reference to the drawings.

[0239] [Configuration example 1] 16 is a schematic perspective view of a display device 300. The display device 300 includes a substrate 351 and a substrate In FIG. 16, the substrate 361 is shown by a dashed line. .

[0240] The display device 300 includes a display unit 362, a circuit 364, wiring 365, and the like. In the example shown, an IC (integrated circuit) 373 and an FPC 372 are mounted on the display device 300. Therefore, the configuration shown in FIG. 16 is a display model having a display device 300, an IC, and an FPC. It can also be called Joule.

[0241] The circuit 364 can be, for example, a scanning line driver circuit.

[0242] The wiring 365 has a function of supplying signals and power to the display portion 362 and the circuit 364 . The signals and power are supplied from the outside via the FPC 372 or from the IC 373 via the wiring 365. is entered into

[0243] In Figure 16, the COG (Chip On Glass) method or the COF (Chip on In this example, an IC 373 is provided on a substrate 351 by a method such as a 3D film method. For example, an IC having a scanning line driver circuit or a signal line driver circuit can be applied to 373 . The display device 300 and the display module may be configured without an IC. The IC may be mounted on the FPC using the COF method or the like.

[0244] FIG. 16 shows an enlarged view of a part of the display unit 362. The display unit 362 has a plurality of displays. The electrodes 311b of the display element are arranged in a matrix. and functions as a reflective electrode for the liquid crystal element 180.

[0245] 16, the electrode 311b has an opening 451. The light emitting element 170 is located closer to the substrate 351 than the electrode 311b. The light is emitted to the substrate 361 side through the opening 451 of the electrode 311b. The area of ​​the light emitting region of the light emitting element 170 may be equal to the area of ​​the opening 451. If one of the area and the area of ​​the opening 451 is larger than the other, the margin for misalignment is In particular, the area of ​​the opening 451 is preferably larger than the area of ​​the light emitting region of the light emitting element 170. If the opening 451 is small, some of the light from the light emitting element 170 will However, the electrode 311b may block the light and prevent it from reaching the outside. By increasing the light emission amount, it is possible to prevent the light emitted by the light emitting element 170 from being wasted.

[0246] FIG. 17 shows a part of the area including the FPC 372 and the circuit 3 of the display device 300 shown in FIG. 64 and a part of the area including the display unit 362 are cut away. An example of a surface is shown below.

[0247] The display device 300 shown in FIG. 17 includes a transistor 201 between a substrate 351 and a substrate 361. , transistor 203, transistor 205, transistor 206, liquid crystal element 180, The optical element 170, the insulating layer 220, the colored layer 131, the colored layer 134, etc. are included. The edge layer 220 is bonded via an adhesive layer 141. The substrate 351 and the insulating layer 220 are bonded via an adhesive layer 141. It is attached via 142.

[0248] The substrate 361 is provided with a colored layer 131, a light-shielding layer 132, an insulating layer 121, and a liquid crystal element 180. An electrode 113 functioning as a common electrode, an alignment film 133b, an insulating layer 117, etc. are provided. The substrate 361 has a polarizing plate 135 on its outer surface. The insulating layer 121 acts as a planarizing layer. The insulating layer 121 can make the surface of the electrode 113 approximately flat. Therefore, the alignment state of the liquid crystal layer 112 can be made uniform. It functions as a spacer to maintain the gap. When the insulating layer 117 transmits visible light, In this case, the insulating layer 117 may be disposed so as to overlap the display region of the liquid crystal element 180 .

[0249] The liquid crystal element 180 is a reflective liquid crystal element. The liquid crystal element 180 includes an electrode 311a, a liquid crystal layer The electrode 311a is in contact with the substrate 351 side. Electrode 311b that reflects visible light is provided. Electrode 311b has an opening 451. The electrode 311a and the electrode 113 transmit visible light. An alignment film 133a is provided between the liquid crystal layer 112 and the electrode 113. It is provided.

[0250] In the liquid crystal element 180, the electrode 311b has a function of reflecting visible light, and the electrode 113 has a function of reflecting visible light. The light incident from the substrate 361 side is polarized by the polarizing plate 135. The light is then transmitted through the electrode 113 and the liquid crystal layer 112, and is reflected by the electrode 311b. 12 and the electrode 113 again and reaches the polarizing plate 135. The orientation of the liquid crystal is controlled by applying a voltage between the electrodes 113, thereby controlling the optical modulation of light. That is, the intensity of the light emitted through the polarizing plate 135 can be controlled. In addition, the colored layer 131 absorbs light outside a specific wavelength range, so that the light is not absorbed. The emitted light is, for example, red light.

[0251] As shown in FIG. 17, an electrode 311a that transmits visible light is provided in the opening 451. This is preferable because the area overlapping the opening 451 is similar to the other areas. Since the liquid crystal layer 112 is oriented in such a manner that the liquid crystal is not aligned properly at the boundary between these regions, the alignment of the liquid crystal is poor, resulting in an unintended This can prevent unwanted light from leaking out.

[0252] In the connection portion 207, the electrode 311b is connected to the transistor 20 via the conductive layer 221b. The transistor 206 is electrically connected to the conductive layer 222a of the liquid crystal element It has the function of controlling the drive of 180.

[0253] A connection portion 252 is provided in a portion of the area where the adhesive layer 141 is provided. In 52, a conductive layer obtained by processing the same conductive film as the electrode 311a and the electrode 113 are A part of the wiring is electrically connected by the connector 243. A signal or An electrical potential can be applied via connection 252 .

[0254] The connector 243 may be, for example, a conductive particle. For this purpose, it is possible to use particles of organic resin or silica coated with a metal material. It is preferable to use nickel or gold as the metal material because it is possible to reduce the contact resistance. Particles coated with layers of two or more metal materials, such as nickel coated with gold, are It is preferable to use a material that is elastically deformable or plastically deformable as the connector 243. In this case, the connectors 243, which are conductive particles, are preferably used as shown in FIG. In this way, the connector 243 and the electric This increases the contact area with the electrically conductive layer, reducing contact resistance and preventing connection failures. The occurrence of such defects can be suppressed.

[0255] The connector 243 is preferably disposed so as to be covered with the adhesive layer 141. For example, The connectors 243 may be dispersed in the adhesive layer 141 before curing.

[0256] The light emitting element 170 is a bottom emission type light emitting element. A laminated structure in which an electrode 191, an EL layer 192, and an electrode 193 are laminated in this order from the layer 220 side is formed. The electrode 191 is connected to the transistor 205 through an opening provided in the insulating layer 214. The transistor 205 is connected to a conductive layer 222b having a light-emitting element 170. The insulating layer 216 covers the end of the electrode 191. The electrode 193 The electrode 193 includes a material that reflects visible light, and the electrode 191 includes a material that transmits visible light. The light emitted by the light emitting element 170 is guided through the colored layer 134, the insulating layer 194, and the light emitting element 170. The light is emitted toward the substrate 361 side through the edge layer 220, the opening 451, the electrode 311a, and the like.

[0257] The liquid crystal element 180 and the light emitting element 170 can display various colors by changing the color of the colored layer depending on the pixel. The display device 300 uses the liquid crystal element 180 to display a color image. The display device 300 can perform color display using the light emitting element 170. can be done.

[0258] Transistor 201, transistor 203, transistor 205, and transistor 2 06 are both formed on the surface of the insulating layer 220 on the substrate 351 side. The resistor can be fabricated using the same process.

[0259] The transistor 203 is a transistor (switching The transistor 205 is a A transistor (also called a drive transistor) that controls the current flowing through the optical element 170. .

[0260] On the substrate 351 side of the insulating layer 220, an insulating layer 211, an insulating layer 212, an insulating layer 213, and an insulating The insulating layer 211 is provided with insulating layers such as a layer 214. A part of the insulating layer 211 is a gate electrode for each transistor. The insulating layer 212 serves as a gate insulating layer. The insulating layer 213 is provided to cover the transistor 205 and the like. The number of insulating layers covering the transistor is not limited, and a single layer It may be a single layer or two or more layers.

[0261] At least one of the insulating layers covering each transistor is made of a material that is resistant to the diffusion of impurities such as water and hydrogen. It is preferable to use a material having a low resistance to heat treatment. This allows the insulating layer to function as a barrier film. With this structure, it is possible to prevent impurities from diffusing into the transistor from the outside. This makes it possible to effectively suppress this, thereby achieving a highly reliable display device.

[0262] Transistor 201, transistor 203, transistor 205, and transistor 2 06 is a conductive layer 221a functioning as a gate, an insulating layer 210 functioning as a gate insulating layer 1. The conductive layer 222a and the conductive layer 222b functioning as a source and a drain, and The conductive layer 231 is formed by processing the same conductive film. The pattern is provided with a dummy pattern.

[0263] The transistors 201 and 205 are In addition to the structure of 206, a conductive layer 223 that functions as a gate is provided.

[0264] The transistor 201 and the transistor 205 each have two semiconductor layers in which a channel is formed. The transistor is sandwiched between two gates. The threshold voltage of the transistor can be controlled by connecting the two gates and applying the same signal to them. Such a transistor may be driven by supplying a It is possible to increase the field effect mobility compared to conventional transistors, and increase the on-current. As a result, a circuit capable of high speed operation can be fabricated. By using a transistor with a large on-current, Even if the number of wirings increases when the display device is made larger or has higher resolution, It is possible to reduce signal delay in the display and suppress display unevenness.

[0265] Alternatively, a potential for controlling the threshold voltage is applied to one of the two gates, and a drive voltage is applied to the other. By applying a potential for driving, the threshold voltage of the transistor can be controlled.

[0266] There is no limitation on the structure of the transistors included in the display device. The transistors included in the display portion 362 may have the same structure or different structures. The multiple transistors in the circuit 364 may all have the same structure. Similarly, the display unit 362 may have multiple structures. The transistors may all have the same structure, or two or more types of structures may be used in combination. It's okay to be there.

[0267] The conductive layer 223 is preferably made of a conductive material containing an oxide. When forming the conductive film, the film is formed in an atmosphere containing oxygen, so that the insulating layer 212 is free of oxygen. The ratio of oxygen gas in the deposition gas can be set to 90% or more and 100% or less. The oxygen supplied to the insulating layer 212 is preferably converted into oxygen by a subsequent heat treatment. 31, oxygen vacancies in the semiconductor layer 231 can be reduced.

[0268] In particular, it is preferable to use a low-resistance oxide semiconductor for the conductive layer 223. In this case, it is preferable to use an insulating film that releases hydrogen, such as a silicon nitride film, for the insulating layer 213. It is preferable that hydrogen is generated in the conductive layer 223 during the formation of the insulating layer 213 or by a heat treatment thereafter. Thus, the electrical resistance of the conductive layer 223 can be effectively reduced.

[0269] The colored layer 134 is provided in contact with the insulating layer 213. is covered in

[0270] A connection portion 204 is provided in the area where the substrate 351 and the substrate 361 do not overlap. In the portion 204, the wiring 365 is electrically connected to the FPC 372 via the connection layer 242. The connection part 204 has a similar structure to the connection part 207. The conductive layer obtained by processing the same conductive film as the electrode 311a is exposed. The portion 204 and the FPC 372 can be electrically connected via a connection layer 242 .

[0271] A linear polarizing plate may be used as the polarizing plate 135 disposed on the outer surface of the substrate 361. A polarizing plate can also be used. A circular polarizing plate is, for example, a linear polarizing plate and a 1 / 4 wavelength retardation plate. A laminate of plates can be used, which can suppress external light reflection. In addition, depending on the type of polarizing plate, the cell gap and orientation of the liquid crystal element used in the liquid crystal element 180 may be adjusted. By adjusting the driving voltage, etc., a desired contrast is realized.

[0272] Various optical members can be disposed on the outside of the substrate 361. , polarizing plates, retardation plates, light diffusion layers (diffusion films, etc.), anti-reflection layers, and light collecting films, etc. The outside of the substrate 361 is provided with an antistatic film to prevent dust from adhering, It is equipped with a water-repellent film that makes it difficult for adhesion to occur, and a hard coat film that prevents scratches from occurring during use. This is also fine.

[0273] The substrate 351 and the substrate 361 are made of glass, quartz, ceramic, sapphire, The substrate 351 and the substrate 361 may be made of a flexible material such as an organic resin. When used, the flexibility of the display device can be increased.

[0274] The liquid crystal element 180 may be, for example, a vertical alignment (VA) liquid crystal element. A liquid crystal element in which the vertical alignment mode is applied can be used. VA (Multi-Domain Vertical Alignment) mode, P VA(Patterned Vertical Alignment) mode, ASV( You can use modes such as Advanced Super View.

[0275] The liquid crystal element 180 can be a liquid crystal element to which various modes are applied. For example, in addition to VA mode, TN (Twisted Nematic) mode, IPS (In -Plane-Switching mode, FFS (Fringe Field Switching) mode itching) mode, ASM(Axially Symmetric aligne) d Micro-cell mode, OCB (Optically Compensated ed Birefringence mode, FLC (Ferroelectric L iquid Crystal mode, AFLC (AntiFerroelectric) Liquid crystal elements using the Liquid Crystal (LC) mode can be used. .

[0276] A liquid crystal element is an element that controls the transmission or non-transmission of light by the optical modulation action of liquid crystals. The optical modulation of liquid crystals is achieved by applying an electric field (horizontal electric field, vertical electric field or oblique electric field) to the liquid crystals. The liquid crystal used in the liquid crystal element is thermotropic. Pick liquid crystal, low molecular weight liquid crystal, polymer liquid crystal, polymer dispersed liquid crystal (PDLC) Dispersed Liquid Crystal, Ferroelectric Liquid Crystal, Antiferroelectric Liquid Crystal These liquid crystal materials can be used in a cholesteric phase, a smectic phase, etc., depending on the conditions. These phases include nematic, cubic, chiral nematic, and isotropic phases.

[0277] Either positive or negative liquid crystal may be used as the liquid crystal material. The optimum liquid crystal material can be used depending on the mode and design.

[0278] In order to control the alignment of the liquid crystal, an alignment film can be provided. In this case, a liquid crystal that exhibits a blue phase without using an alignment film may be used. When the temperature of the cholesteric liquid crystal is increased, the liquid crystal transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range, so it is necessary to improve the temperature range. In order to improve the color reproduction, a liquid crystal composition containing a chiral agent of several percent by weight or more is used. A liquid crystal composition containing a liquid crystal exhibiting a chiral phase and a chiral agent has a short response time and is optically isotropic. In addition, the liquid crystal composition containing the liquid crystal exhibiting the blue phase and the chiral agent does not require alignment treatment. The viewing angle dependency is small. In addition, since there is no need to provide an alignment film, rubbing treatment is also unnecessary. Therefore, electrostatic damage caused by the rubbing process can be prevented, and Therefore, defects and damages of the liquid crystal display device can be reduced.

[0279] When a reflective liquid crystal element is used, a polarizing plate 135 is provided on the display surface side. Separately, it is preferable to dispose a light diffusing plate on the display surface side, since this improves visibility.

[0280] A front light may be provided outside the polarizing plate 135. In particular, it is preferable to use an edge-light type front light. Using a front light with a 3000mA switching diode (3000mA) can reduce power consumption. Therefore, it is preferable.

[0281] The adhesive layer may be a light-curing adhesive such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various curing adhesives such as viscoelastic adhesives, anaerobic adhesives, etc. can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E VA (ethylene vinyl acetate) resin, etc. In particular, the moisture permeability of epoxy resin, etc. A material with low adhesion is preferable. Two-part mixed resin may also be used. It may be used.

[0282] The connection layer 242 is an anisotropic conductive film (ACF). Inductive Film), Anisotropic Conductive Paste (ACP) Conductive Paste) can be used.

[0283] The light emitting element 170 may be a top emission type, a bottom emission type, a dual emission type, or a The electrode on the light extraction side uses a conductive film that transmits visible light. It is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted.

[0284] The EL layer 192 has at least a light-emitting layer. The EL layer 192 has the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties A material having high electron injection properties or a bipolar material (a material having high electron transport properties and hole transport properties) The insulating layer may further include a layer containing a metal oxide (a metal oxide material).

[0285] The EL layer 192 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 192 may each be formed by deposition (vacuum deposition). It can be formed by methods such as the transfer method, printing method, inkjet method, coating method, etc. Cut.

[0286] The EL layer 192 may include inorganic compounds such as quantum dots. By using the compound in the light-emitting layer, it can function as a light-emitting material.

[0287] In addition, the combination of a color filter (colored layer) and a microcavity structure (optical adjustment layer) By applying the optical adjustment, light with high color purity can be extracted from the display device. The thickness of the layer is changed according to the color of each pixel.

[0288] In addition to the gates, sources and drains of transistors, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Examples of materials that can be used include metals such as stainless steel, or alloys that contain these materials as their main components. The membrane can be used as a single layer or as a laminate structure.

[0289] Examples of the conductive material having a light-transmitting property include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as indium zinc oxide, zinc oxide, zinc oxide doped with gallium, or Graphene can be used. Alternatively, gold, silver, platinum, magnesium, nickel, tin, etc. such as tin, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Metallic materials and alloy materials containing the metallic materials can be used. Alternatively, a metal material, an alloy material (or a combination thereof) may be used. In the case of using these nitrides, it is sufficient to make them thin enough to have light transmission. A laminated film of a material can be used as the conductive layer. For example, a silver-magnesium alloy and an insulator can be used. It is preferable to use a laminated film of di- um tin oxide or the like because the electrical conductivity can be increased. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive layers of the display element. The conductive layer may also be used as a pixel electrode or a common electrode.

[0290] Examples of insulating materials that can be used for each insulating layer include acrylic and epoxy. Resin, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide Examples of suitable insulating materials include inorganic insulating materials such as CrN.

[0291] Materials that can be used for the coloring layer include metal materials, resin materials, pigments, and dyes. Examples of such materials include resin materials.

[0292] [Configuration example 2] The display device 300A shown in FIG. The transistor 205 and the transistor 206 are not included, and the transistor 281 and the transistor 2 84, transistor 285, and transistor 286. is different.

[0293] In addition, in FIG. 18, the positions of the insulating layer 117 and the connection portion 207 are also different from those in FIG. The insulating layer 117 is disposed so as to overlap the edge of the colored layer 131. The insulating layer 117 is disposed so as to overlap the end of the light-shielding layer 132. As shown in FIG. 1, the insulating layer 117 is disposed in a portion that does not overlap the display area (a portion that overlaps the light-shielding layer 132). This may be done.

[0294] The display device has two transistors, such as transistor 284 and transistor 285. The transistors may be partially laminated. This reduces the area occupied by the pixel circuit. Since it is possible to reduce the size, the definition can be increased. The area can be increased, and the aperture ratio can be improved. The light emitting element 170 has a high aperture ratio. This allows the current density required to obtain the required brightness to be reduced, improving reliability.

[0295] The transistor 281, the transistor 284, and the transistor 286 are formed on the conductive layer 221. a, an insulating layer 211, a semiconductor layer 231, a conductive layer 222a, and a conductive layer 222b. The conductive layer 221a overlaps with the semiconductor layer 231 via the insulating layer 211. The conductive layer 222b is electrically connected to the semiconductor layer 231. The transistor 281 includes a conductive layer It has 223.

[0296] The transistor 285 includes a conductive layer 222b, an insulating layer 217, a semiconductor layer 261, and a conductive layer 22 3, the insulating layer 212, the insulating layer 213, the conductive layer 263a, and the conductive layer 263b. The layer 222b overlaps with the semiconductor layer 261 via the insulating layer 217. The conductive layer 263a and the conductive layer 263b overlap with the semiconductor layer 261 with the insulating layer 212 and the insulating layer 213 interposed therebetween. 63b is electrically connected to the semiconductor layer 261.

[0297] The conductive layer 221a functions as a gate. The insulating layer 211 functions as a gate insulating layer. The conductive layer 222a functions as either a source or a drain of the transistor 28. The conductive layer 222b included in the pixel 6 functions as the other of the source and the drain.

[0298] The conductive layer 222b shared by the transistors 284 and 285 is The portion that functions as the other of the source or drain of the transistor 284 and the portion of the transistor 285 The insulating layer 217, the insulating layer 212, and the insulating layer 213 have a portion that functions as a gate. One of the conductive layer 263a and the conductive layer 263b is a solenoid. The conductive layer 223 functions as a gate. do.

[0299] [Configuration example 3] FIG. 19A shows a cross-sectional view of a display unit of the display device 300B.

[0300] The display device 300B differs from the display device 300 in that it does not have a colored layer 131. The other configuration is similar to that of the display device 300, and therefore a detailed description thereof will be omitted.

[0301] The liquid crystal element 180 exhibits white color. Since the display device 300 does not have the colored layer 131, B can display in black and white or gray scale using liquid crystal element 180. .

[0302] [Configuration example 4] In the display device 300C shown in FIG. 19(B), the EL layer 192 is painted in a divided manner (light-emitting element 1 70) and does not have a colored layer 134. The other configurations are the same as those of the display device 300B. , detailed explanation will be omitted.

[0303] In the light-emitting element 170 to which the color-coded method is applied, at least one of the layers constituting the EL layer 192 All layers constituting the EL layer must be painted separately (typically the light-emitting layer). may be painted differently.

[0304] In one embodiment of the present invention, the structure of a transistor included in a display device is not particularly limited. For example, a planar type transistor or a staggered type transistor may be used. Alternatively, a transistor of an inverted staggered type may be used. Alternatively, the transistor may have a gate structure or a gate-type structure. A pole may be provided.

[0305] 20(A) to (E) show examples of transistor configurations.

[0306] The transistor 110a shown in FIG. 20A is a transistor with a top-gate structure. .

[0307] The transistor 110a includes a conductive layer 221, an insulating layer 211, a semiconductor layer 231, and an insulating layer 21 2, a conductive layer 222a and a conductive layer 222b. The semiconductor layer 231 is formed on the insulating layer 151. The conductive layer 221 overlaps with the semiconductor layer 231 with the insulating layer 211 interposed therebetween. The layer 222a and the conductive layer 222b are formed through the openings provided in the insulating layer 211 and the insulating layer 212. Thus, it is electrically connected to the semiconductor layer 231 .

[0308] The conductive layer 221 functions as a gate. The insulating layer 211 functions as a gate insulating layer. One of the conductive layer 222a and the conductive layer 222b functions as a source, and the other functions as a drain. It functions as an input.

[0309] The transistor 110a is a structure including a conductive layer 221 and a conductive layer 222a or a conductive layer 222b. Since it is easy to keep them at a reasonable distance, it is possible to reduce the parasitic capacitance between them. .

[0310] The transistor 110b illustrated in FIG. 20B has the following configuration in addition to the configuration of the transistor 110a: The conductive layer 223 and the insulating layer 218 are provided on the insulating layer 151. The insulating layer 218 is provided to cover the conductive layer 223 and the insulating layer 151. It is being done.

[0311] The conductive layer 223 functions as one of a pair of gates. It is possible to increase the current, control the threshold voltage, and so on.

[0312] 20(C) to (E) show examples of structures in which two transistors are stacked. The structures of the two transistors can be determined independently, as shown in Figs. The combination is not limited to E).

[0313] FIG. 20C shows a structure in which a transistor 110c and a transistor 110d are stacked. The transistor 110c has two gates. The transistor 110d has a bottom The transistor 110c may have one gate ( The transistor 110d may have two gates.

[0314] The transistor 110c includes a conductive layer 223, an insulating layer 218, a semiconductor layer 231, and a conductive layer 22 1, an insulating layer 211, a conductive layer 222a, and a conductive layer 222b. The conductive layer 223 is an insulating The conductive layer 223 is provided on the layer 151. The conductive layer 223 is connected to the semiconductor layer 231 via the insulating layer 218. The insulating layer 218 is provided to cover the conductive layer 223 and the insulating layer 151. The layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. 20B and the like. In this manner, the insulating layer 211 may be provided so as to cover the end portion of the semiconductor layer 231. The layer 222a and the conductive layer 222b are exposed to the semiconductor layer 222 through an opening provided in the insulating layer 212. 31.

[0315] The transistor 110d includes a conductive layer 222b, an insulating layer 213, a semiconductor layer 261, a conductive layer 2 The conductive layer 222b is a semiconductor layer 63a and a conductive layer 263b. The insulating layer 213 is provided to cover the conductive layer 222b. The conductive layer 263a and the conductive layer 263b are electrically connected to the semiconductor layer 261.

[0316] The conductive layer 221 and the conductive layer 223 each function as a gate of the transistor 110c. The insulating layer 218 and the insulating layer 211 function as a gate insulating layer of the transistor 110c. The conductive layer 222a functions as one of the source and drain of the transistor 110c. It works.

[0317] The conductive layer 222b functions as the other of the source and drain of the transistor 110c. The insulating layer 21 has a portion that functions as a gate of the transistor 110d and a portion that functions as a gate of the transistor 110d. The conductive layer 263a and the conductive layer 3 function as a gate insulating layer of the transistor 110d. One of the transistors 263b functions as the source of the transistor 110d, and the other functions as the source of the transistor 110c. It functions as the drain of the capacitor 110d.

[0318] The transistor 110c and the transistor 110d are applied to the pixel circuit of the light-emitting element 170. For example, the transistor 110c is preferably used as a selection transistor. The transistor 110d can be used as a drive transistor.

[0319] The conductive layer 263b is connected to the light-emitting element through an opening provided in the insulating layer 217 and the insulating layer 214. The pixel electrode 192 is electrically connected to an electrode 191 which functions as a pixel electrode.

[0320] FIG. 20D shows a configuration in which a transistor 110e and a transistor 110f are stacked. The transistor 110e has a bottom gate structure. The transistor 110f has two The transistor 110e may have two gates.

[0321] The transistor 110e includes a conductive layer 221, an insulating layer 211, a semiconductor layer 231, and a conductive layer 22 The conductive layer 221 is provided over the insulating layer 151. The conductive layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. The conductive layer 222a and the conductive layer 222b are provided to cover the insulating layer 151 and the conductive layer 222a. is electrically connected to the semiconductor layer 231.

[0322] The transistor 110f includes a conductive layer 222b, an insulating layer 212, a semiconductor layer 261, a conductive layer 2 23, an insulating layer 218, an insulating layer 213, a conductive layer 263a, and a conductive layer 263b. The conductive layer 222b has a region overlapping with the semiconductor layer 261 via the insulating layer 212. 12 is provided to cover the conductive layer 222b. The conductive layer 263a and the conductive layer 263b are The insulating layer 213 is electrically connected to the semiconductor layer 261 through an opening formed in the insulating layer 213. The layer 223 overlaps with the semiconductor layer 261 via the insulating layer 218. It is located where it overlaps with 23.

[0323] The conductive layer 221 functions as the gate of the transistor 110e. The conductive layer 222a functions as a gate insulating layer for the transistor 110e. It functions as either the source or drain of 0e.

[0324] The conductive layer 222b functions as the other of the source and drain of the transistor 110e. The conductive layer 22 has a portion that functions as a gate of the transistor 110f and a portion that functions as a gate of the transistor 110f. 3 functions as the gate of the transistor 110f. The insulating layer 212 and the insulating layer 218 are , which function as gate insulating layers of the transistor 110f. One of the conductive layers 263b functions as the source of the transistor 110f, and the other It functions as the drain of transistor 110f.

[0325] The conductive layer 263b is connected to the insulating layer 214 as a pixel electrode of the light-emitting element through an opening provided in the insulating layer 214. The electrode 191 functions as a filter.

[0326] FIG. 20E shows a configuration in which a transistor 110g and a transistor 110h are stacked. The transistor 110g has a top gate structure. The transistor 110h has two The transistor 110g may have two gates.

[0327] The transistor 110g includes a semiconductor layer 231, a conductive layer 221, an insulating layer 211, and a conductive layer 22 The semiconductor layer 231 is provided over the insulating layer 151. The conductive layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. The conductive layer 222a and the conductive layer 222b are provided so as to overlap the insulating layer 21. 2, the insulating layer 230 is electrically connected to the semiconductor layer 231 through an opening provided in the insulating layer 230.

[0328] The transistor 110h includes a conductive layer 222b, an insulating layer 213, a semiconductor layer 261, a conductive layer 2 23, insulating layer 218, insulating layer 217, conductive layer 263a, and conductive layer 263b. The conductive layer 222b has a region overlapping with the semiconductor layer 261 via the insulating layer 213. 13 is provided to cover the conductive layer 222b. The conductive layer 263a and the conductive layer 263b are The conductive layer 217 is electrically connected to the semiconductor layer 261 through an opening provided in the insulating layer 217. The conductive layer 223 overlaps with the semiconductor layer 261 via the insulating layer 218. It is located where it overlaps with 3.

[0329] The conductive layer 221 functions as the gate of the transistor 110g. The conductive layer 222a functions as a gate insulating layer for the transistor 110g. It serves as either the source or drain of 0g.

[0330] The conductive layer 222b functions as the other of the source and drain of the transistor 110g. The conductive layer 22 has a portion that functions as a gate of the transistor 110h and a portion that functions as a gate of the transistor 110h. 3 functions as the gate of the transistor 110h. The insulating layer 212 and the insulating layer 218 , which function as gate insulating layers of the transistor 110h. One of the conductive layers 263b functions as the source of the transistor 110h, and the other Functions as the drain for transistor 110h.

[0331] The conductive layer 263b is connected to the insulating layer 214 as a pixel electrode of the light-emitting element through an opening provided in the insulating layer 214. The electrode 191 functions as a filter.

[0332] [Example of manufacturing method] A method for manufacturing a display device according to this embodiment will be described in detail below with reference to FIGS. Explain concretely.

[0333] The thin films (insulating film, semiconductor film, conductive film, etc.) constituting the display device are formed by sputtering. , Chemical Vapor Deposition (CVD) method, Vacuum evaporation, Pulsed Laser Deposit (PLD) ion) method, Atomic Layer Deposition (ALD) The CVD method can be a plasma-enhanced chemical vapor deposition (PEC) method. VD:Plasma Enhanced Chemical Vapor Deposit The thermal CVD method may be a metal organic chemical vapor deposition (MOCVD) method. Metal Organic CVD (MOCVD) method may also be used.

[0334] The thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display device are formed by spin coating, dip coating, etc. , spray coating, inkjet, dispensing, screen printing, offset printing, Cutter knife, slit coat, roll coat, curtain coat, knife coat, etc. It can be formed by:

[0335] When processing the thin films that make up the display device, lithography methods and the like are used. Alternatively, the island-shaped thin film may be formed by a film formation method using a shielding mask. Alternatively, the thin film is processed by nanoimprinting, sandblasting, lift-off, etc. In the photolithography method, a resist mask is formed on the thin film to be processed. The thin film is processed by etching or the like, and the resist mask is removed. After forming a thin film, the thin film is exposed and developed to be processed into a desired shape. , there is.

[0336] When light is used in the lithography method, the light used for exposure is, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or a mixture of these Other examples include ultraviolet light, KrF laser light, and ArF laser light. Also, the exposure may be performed by a liquid immersion exposure technique. The light used is extreme ultraviolet (EUV) or X-ray. Also, instead of light used for exposure, an electron beam can be used. Extreme ultraviolet light, X-rays, or electron beams are preferred because they enable extremely fine processing. When exposure is performed by scanning a beam such as an electron beam, Masks are not required.

[0337] For etching thin films, there are dry etching, wet etching and sandblasting. Methods such as the above can be used.

[0338] An example of a method for manufacturing the display device 300 shown in FIG. In FIG. 24, a manufacturing method will be described with particular attention to a display portion 362 of the display device 300.

[0339] First, the colored layer 131 is formed on the substrate 361 (FIG. 21(A)). By forming it using a photosensitive material, it can be processed into an island shape using a photolithography method, etc. In the circuit 364 shown in FIG. 17, the light-shielding layer 132 is provided on the substrate 361. do.

[0340] Next, the insulating layer 121 is formed on the colored layer 131 and the light-shielding layer 132 .

[0341] The insulating layer 121 preferably functions as a planarizing layer. Resins such as olefin and epoxy can be suitably used.

[0342] An inorganic insulating film may be used as the insulating layer 121. For example, the insulating layer 121 may be a nitride insulating film. silicon oxide film, silicon oxynitride film, silicon oxide film, silicon nitride oxide film, aluminum oxide An inorganic insulating film such as a hafnium film or an aluminum nitride film can be used. tungsten oxide film, yttrium oxide film, zirconium oxide film, gallium oxide film, tantalum oxide film , magnesium oxide film, lanthanum oxide film, cerium oxide film, neodymium oxide film, etc. In addition, two or more of the above insulating films may be laminated.

[0343] Next, the electrode 113 is formed. The electrode 113 is formed by forming a conductive film and then removing a resist mask. The conductive film is then etched, and the resist mask is then removed. The electrode 113 is formed using a conductive material that transmits visible light.

[0344] Next, an insulating layer 117 is formed on the electrode 113. The insulating layer 117 is made of an organic insulating film. It is preferable that

[0345] Next, an alignment film 133b is formed on the electrode 113 and the insulating layer 117 (FIG. 21(A)). The alignment film 133b can be formed by forming a thin film of resin or the like and then performing a rubbing process. do.

[0346] In addition, independently of the process described with reference to FIG. 21(A), the process shown in FIG. 21(B) to FIG. ) are carried out.

[0347] First, a peeling layer 382 is formed on a fabrication substrate 381, and an insulating layer 383 is formed on the peeling layer 382. (Figure 21(B)).

[0348] In this step, when the fabrication substrate 381 is peeled off, the interface between the fabrication substrate 381 and the peeling layer 382 A material that causes separation at the interface between the release layer 382 and the insulating layer 383 or in the release layer 382 is used. In this embodiment, the case where separation occurs at the interface between the insulating layer 383 and the peeling layer 382 is selected. However, depending on the combination of materials used for the peeling layer 382 and the insulating layer 383, I can't.

[0349] The substrate 381 to be fabricated has a rigidity sufficient for easy transportation and is resistant to the temperatures involved in the fabrication process. The substrate 381 can be made of, for example, gallium. Glass, quartz, ceramic, sapphire, resin, semiconductor, metal or alloy, etc. Examples of glass include non-alkali glass, barium borosilicate glass, and aluminophore glass. Examples of the glass include silicate glass.

[0350] The release layer 382 can be formed using an organic or inorganic material.

[0351] Inorganic materials that can be used for the release layer 382 include tungsten, molybdenum, titanium, and the like. Tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium a metal containing an element selected from tungsten, palladium, osmium, iridium, and silicon; Examples of the crystals include an alloy containing the element, a compound containing the element, and the like. The structure may be amorphous, microcrystalline, or polycrystalline.

[0352] When an inorganic material is used, the thickness of the peeling layer 382 is preferably 1 nm or more and 1000 nm or less. The thickness is preferably 10 nm or more and 200 nm or less, and more preferably 10 nm or more and 100 nm or less.

[0353] When an inorganic material is used, the release layer 382 can be formed by, for example, a sputtering method, a CVD method, or an ALD method. The film can be formed by a deposition method or a vapor deposition method.

[0354] Examples of organic materials that can be used for the release layer 382 include acrylic resin and epoxy resin. Silicone resin, polyamide resin, polyimide amide resin, siloxane resin, benzocyclobutene resins, phenolic resins, etc.

[0355] When an organic material is used, the thickness of the release layer 382 is 0.01 μm or more and less than 10 μm. It is preferable that the thickness is 0.1 μm or more and 3 μm or less, and more preferable that the thickness is 0.5 μm or more. It is more preferable that the thickness of the peeling layer 382 is 1 μm or less. The cost of manufacturing can be reduced. However, the thickness of the peeling layer 382 is not limited to this. may be 10 μm or more, for example, 10 μm or more and 200 μm or less.

[0356] When an organic material is used, the peeling layer 382 can be formed by a method such as spin coating, dipping, or the like. Spray application, inkjet, dispensing, screen printing, offset printing, document printing Examples include tar knife, slit coat, roll coat, curtain coat, knife coat, etc. can be.

[0357] It is preferable to use an inorganic insulating film as the insulating layer 383. For example, a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an oxide An inorganic insulating film such as an aluminum film or an aluminum nitride film can be used. hafnium oxide film, yttrium oxide film, zirconium oxide film, gallium oxide film, titanium oxide film Ta film, magnesium oxide film, lanthanum oxide film, cerium oxide film, neodymium oxide film, etc. In addition, two or more of the above insulating films may be laminated.

[0358] For example, the peeling layer 382 may include a layer containing a high melting point metal material such as tungsten and a layer containing the metal material. A stacked structure of a layer containing an oxide of silicon nitride, silicon oxynitride, or the like is applied to the insulating layer 383. Alternatively, a laminated structure having a plurality of inorganic insulating films such as silicon oxide or silicon nitride may be used. When a high melting point metal material is used for the peeling layer 382, ​​the formation temperature of the layer formed later can be increased. This allows the concentration of impurities to be reduced, and a highly reliable display device can be realized. After peeling, a process of removing layers unnecessary for the display device (such as the peeling layer 382 and the insulating layer 383) is performed. Alternatively, the peeling layer 382 or the insulating layer 383 may not be removed, and the display device may be It may be a component of.

[0359] Next, an electrode 311a is formed on the insulating layer 383, and an electrode 311b is formed on the electrode 311a. (FIG. 21C). The electrode 311b has an opening 451 on the electrode 311a. The electrodes 11a and 311b are formed by forming a conductive film, and then forming a resist mask. The electrode can be formed by removing the resist mask after etching the conductive film. The electrode 311a is formed using a conductive material that transmits visible light. The conductive material is used to form the light emitting diode.

[0360] Next, the insulating layer 220 is formed (FIG. 21(D)). Then, the electrode 311 is formed on the insulating layer 220. Provide an opening reaching b.

[0361] The insulating layer 220 is formed so that impurities contained in the peeling layer 382 may cause a transistor or a display to be formed later. The peeling layer 382 can be used as a barrier layer to prevent diffusion of organic materials into the element. When the insulating layer 220 is used, the insulating layer 220 is removed from the peeling layer 382 when the peeling layer 382 is heated. It is preferable to prevent moisture from diffusing into transistors and display elements. Layer 220 preferably has high barrier properties.

[0362] The insulating layer 220 is made of an inorganic insulating film, a resin, or the like that can be used for the insulating layer 121. There can be.

[0363] Next, the transistor 205 and the transistor 206 are formed over the insulating layer 220.

[0364] The semiconductor material used for the transistor is not particularly limited, and may be, for example, an element or compound of Group 14. A semiconductor or an oxide semiconductor can be used for the semiconductor layer. semiconductors containing gallium arsenide, or oxide semiconductors containing indium, etc. Cut.

[0365] Here, the transistor 206 has an oxide semiconductor layer as the semiconductor layer 231. The transistor 205 is a transistor having a bottom gate structure. The structure is a transistor 206 with a conductive layer 223 and an insulating layer 212 added. It has a.

[0366] It is preferable to use an oxide semiconductor for the semiconductor layer of the transistor. By using semiconductor materials with a wide band gap and low carrier density, This can reduce the current in the off state.

[0367] Specifically, first, the conductive layer 221a and the conductive layer 221b are formed on the insulating layer 220. The conductive layers 221a and 221b are formed by forming a resist mask after forming a conductive film. The conductive film can be formed by removing the resist mask after etching the conductive film. Through the opening in the insulating layer 220, the conductive layer 221b and the electrode 311b are connected.

[0368] Subsequently, the insulating layer 211 is formed.

[0369] The insulating layer 211 may be, for example, a silicon nitride film, a silicon oxynitride film, or a silicon oxide film. Inorganic insulating films such as silicon oxide nitride film, aluminum oxide film, and aluminum nitride film Also, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, etc. film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film, cerium oxide film Alternatively, two or more of the above insulating films may be laminated. It's fine.

[0370] The higher the deposition temperature of an inorganic insulating film, the denser and more effective the barrier film becomes. The substrate temperature during the formation of the inorganic insulating film is preferably from room temperature (25° C.) to 350° C. is preferable, and 100° C. or more and 300° C. or less is more preferable.

[0371] Next, the semiconductor layer 231 is formed. In this embodiment, the semiconductor layer 231 is made of an oxide film. The oxide semiconductor layer is formed by depositing an oxide semiconductor film and then removing a resist mask. After etching the oxide semiconductor film, the resist mask is removed. It can be formed.

[0372] The substrate temperature during the formation of the oxide semiconductor film is preferably 350° C. or lower, and more preferably room temperature or higher and 200° C. or lower. A temperature between room temperature and 130° C. is more preferable, and a temperature between room temperature and 130° C. is even more preferable.

[0373] The oxide semiconductor film is formed using either one or both of an inert gas and an oxygen gas. Note that the flow rate ratio of oxygen (oxygen partial pressure) during the formation of the oxide semiconductor film can be set as follows: However, in order to obtain a transistor with high field effect mobility, The flow rate ratio of oxygen (oxygen partial pressure) during deposition of the compound semiconductor film is preferably 0% or more and 30% or less. The range is preferably 5% or more and 30% or less, and more preferably 7% or more and 15% or less.

[0374] The oxide semiconductor film preferably contains at least indium or zinc. It is preferred that the metal oxide contains sodium and zinc.

[0375] The oxide semiconductor preferably has an energy gap of 2 eV or more, and more preferably 2.5 eV or more. More preferably, it is equal to or higher than 3 eV, and even more preferably, it is equal to or higher than 3 eV. The off-state current of a transistor is reduced by using an oxide semiconductor with a wide energy gap. It is possible.

[0376] The oxide semiconductor film can be formed by a sputtering method. The PLD method, the PECVD method, the thermal CVD method, the ALD method, the vacuum deposition method, or the like may also be used.

[0377] Note that an example of an oxide semiconductor will be described in Embodiment 4.

[0378] Next, the conductive layer 222a and the conductive layer 222b are formed. 22b is a film formed by forming a conductive film, forming a resist mask, and etching the conductive film. The conductive layer 222a and the conductive layer 222b can be formed by removing the resist mask later. b are connected to the semiconductor layer 231. The conductive layer 222a is electrically connected to the conductive layer 221b. Thus, the electrode 311b and the conductive layer 222a can be electrically connected.

[0379] Note that when the conductive layers 222a and 222b are processed, the conductive layers 222a and 222b are covered with a resist mask. In some cases, a portion of the semiconductor layer 231 that is not exposed may be thinned by etching.

[0380] In this manner, the transistor 206 can be manufactured (FIG. 21D). In 206, a part of the conductive layer 221a functions as a gate, and a part of the insulating layer 211 functions as a gate. The conductive layer 222a and the conductive layer 222b function as source or It functions as either the drain or the

[0381] Next, an insulating layer 212 is formed to cover the transistor 206, and a conductive layer 22 is formed on the insulating layer 212. Form 3.

[0382] The insulating layer 212 can be formed by a method similar to that for the insulating layer 211 .

[0383] The conductive layer 223 of the transistor 205 is formed by forming a conductive film and then removing a resist mask. The conductive film is then etched, and the resist mask is then removed. do.

[0384] In this manner, the transistor 205 can be manufactured (FIG. 21D). In 205, a part of the conductive layer 221a and a part of the conductive layer 223 function as a gate, A part of the insulating layer 211 and a part of the insulating layer 212 function as a gate insulating layer, and the conductive layer 222 a and the conductive layer 222b each function as either a source or a drain. .

[0385] Next, the insulating layer 213 is formed (FIG. 21(D)). The insulating layer 213 has the same structure as the insulating layer 211. The above-mentioned method can be used to form the sintered body.

[0386] The insulating layer 212 may be a silicon oxide film or an oxynitride film formed in an atmosphere containing oxygen. It is preferable to use an oxide insulating film such as a silicon film. On the silicon nitride film, an insulating layer 213 is formed by diffusing and transmitting oxygen such as a silicon nitride film. It is preferable to stack an insulating film that is difficult to be damaged. In this way, it is possible to obtain an insulating film that easily releases a large amount of oxygen when heated. The oxide insulating film that releases oxygen and the insulating film that does not easily diffuse or penetrate oxygen are stacked together and then heat treatment is performed. By performing the above-mentioned process, oxygen can be supplied to the oxide semiconductor layer. The oxygen vacancies in the oxide semiconductor layer and the defects at the interface between the oxide semiconductor layer and the insulating layer 212 are repaired, and the defect level This makes it possible to realize a highly reliable display device.

[0387] Next, a colored layer 134 is formed on the insulating layer 213 (FIG. 21(D)). 14 is formed (FIG. 22(A)). The colored layer 134 overlaps the opening 451 of the electrode 311b. Arrange it as follows.

[0388] The colored layer 134 can be formed in the same manner as the colored layer 131. 4 is a layer having a surface on which a display element will be formed later, and therefore functions as a planarizing layer. The insulating layer 214 is preferably made of a resin or inorganic insulating material that can be used for the insulating layer 121. The velum can be used.

[0389] Next, the insulating layer 212, the insulating layer 213, and the insulating layer 214 are An opening is formed reaching the conductive layer 222b.

[0390] Next, the electrode 191 is formed (FIG. 22(A)). The electrode 191 is formed by forming a conductive film, A resist mask is formed, the conductive film is etched, and then the resist mask is removed. Here, the conductive layer 222b and the electrode 191 of the transistor 205 are The electrode 191 is formed using a conductive material that transmits visible light.

[0391] Next, an insulating layer 216 is formed to cover the end of the electrode 191 (FIG. 22(B)). The insulating layer 26 can be made of a resin or an inorganic insulating film that can be used for the insulating layer 121. 16 has an opening where it overlaps with the electrode 191 .

[0392] Next, the EL layer 192 and the electrode 193 are formed (FIG. 22(B)). A part of the electrode 193 functions as a common electrode for the light emitting element 170. The electrode 193 is a conductive material that reflects visible light. It is formed using a material.

[0393] The EL layer 192 can be formed by a method such as a vapor deposition method, a coating method, a printing method, or a discharging method. When making the EL layer 192 for each pixel, a shadow mask such as a metal mask is used. The EL layer 192 can be formed by a deposition method, an inkjet method, or the like. When the layers are not to be separately produced, a deposition method that does not use a metal mask can be used.

[0394] The EL layer 192 may be made of either a low molecular weight compound or a high molecular weight compound. It may contain an inorganic compound.

[0395] In each process performed after the formation of the EL layer 192, the temperature applied to the EL layer 192 is The electrode 193 is formed by deposition or sputtering. It can be achieved.

[0396] In this manner, the light emitting element 170 can be formed (FIG. 22(B)). The element 170 includes an electrode 191, a part of which functions as a pixel electrode, an EL layer 192, and a part of which functions as a common electrode. The light emitting element 170 has a structure in which an electrode 193 functioning as a light emitting element is laminated. It is fabricated so as to overlap with the color layer 134 and the opening 451 of the electrode 311b.

[0397] Here, an example of fabricating a bottom emission type light emitting element as the light emitting element 170 will be shown. However, one embodiment of the present invention is not limited to this.

[0398] The light-emitting elements are top emission type, bottom emission type, and dual emission type. The electrode on the light extraction side is made of a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0399] Next, an insulating layer 194 is formed to cover the electrode 193 (FIG. 22(B)). The light emitting element 170 is protected from impurities such as water. The optical element 170 is sealed by an insulating layer 194. After the electrodes 193 are formed, the optical element 170 is exposed to the atmosphere. It is preferable to form the insulating layer 194 without removing the insulating film.

[0400] The insulating layer 194 is formed of, for example, an inorganic insulating film that can be used for the insulating layer 121 described above. It is particularly preferable that the insulating layer 194 contains an inorganic insulating film having a high barrier property. In addition, an inorganic insulating film and an organic insulating film may be laminated.

[0401] The substrate temperature during the formation of the insulating layer 194 is set to a temperature equal to or lower than the heat resistance temperature of the EL layer 192. The insulating layer 194 can be formed by using an ALD method, a sputtering method, or the like. The ALD method and the sputtering method are preferable because they allow low-temperature film formation. This is preferable because the coverage of the insulating layer 194 is good.

[0402] Next, the substrate 351 is attached to the surface of the insulating layer 194 using the adhesive layer 142 (FIG. 2 2(C)).

[0403] The adhesive layer 142 may be a light-curing adhesive such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various curing adhesives such as adhesives, anaerobic adhesives, etc. can be used. It may be used.

[0404] The substrate 351 is made of, for example, polyethylene terephthalate (PET), polyethylene naphtha Polyester resins such as polyacrylonitrile resins, acrylic resins, Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, poly Ethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane Xanthane resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, polyurethane Resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, poly Tetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. The substrate 351 may be made of any of a variety of materials, including glass, quartz, resin, metal, alloy, and semiconductor. The substrate 351 may be made of glass, quartz, resin, or other suitable material having a sufficient thickness to provide flexibility. Various materials such as oils, metals, alloys, and semiconductors may also be used.

[0405] Next, the preparation substrate 381 is peeled off (FIG. 23(A)).

[0406] The separation surface is determined by the materials and forming methods of the insulating layer 383, the peeling layer 382, ​​and the fabrication substrate 381, etc. Depending on the position, it can be in various positions.

[0407] FIG. 23A shows an example in which separation occurs at the interface between a peeling layer 382 and an insulating layer 383. By this separation, the insulating layer 383 is exposed.

[0408] Before separation, a separation starting point may be formed in the release layer 382. For example, A part or the entire surface of the peeling layer 382 may be irradiated with laser light. or reduces the adhesion between the peeling layer 382 and the insulating layer 383 (or the formation substrate 381). It can be done.

[0409] For example, a pulling force is applied to the peeling layer 382 in the vertical direction to form the fabrication substrate 381. Specifically, a part of the upper surface of the substrate 351 is attracted and pulled upward. As a result, the preparation substrate 381 can be peeled off.

[0410] Between the peeling layer 382 and the insulating layer 383 (or the preparation substrate 381), Alternatively, a sharp tool may be inserted into the substrate 351 to form a separation starting point. The peeling layer 382 may be cut with a tool having a desired shape to form a starting point for separation.

[0411] Next, the insulating layer 383 is removed. For example, the insulating layer 383 is removed by using a dry etching method or the like. 3 can be removed, thereby exposing the electrode 311a (FIG. 23(B)).

[0412] Next, an alignment film 133a is formed on the exposed surface of the electrode 311a (FIG. 24(A)). The alignment film 133a can be formed by forming a thin film of resin or the like and then performing a rubbing process. Cut.

[0413] Then, the substrate 361 on which the process described with reference to FIG. 21(A) has been completed and the substrate 361 shown in FIG. The substrate 351 on which the process in step 2 has been completed is then bonded to the substrate 351 with the liquid crystal layer 112 sandwiched therebetween (FIG. 24(B) Although not shown in FIG. 24B, as shown in FIG. 17, the substrate 351 and the substrate 361 are The adhesive layer 141 is made of a material that can be used for the adhesive layer 142. Fees can be subsidized.

[0414] The liquid crystal element 180 shown in FIG. 24B includes an electrode 311a ( and electrode 311b), a liquid crystal layer 112, and an electrode 113, part of which functions as a common electrode, are laminated. The liquid crystal element 180 is fabricated so as to overlap with the colored layer 131.

[0415] In this manner, the display device 300 can be manufactured.

[0416] As described above, the display device of the present embodiment has two types of display elements and supports a plurality of display modes. Since the display can be switched between the two modes, it is highly visible and convenient regardless of the surrounding brightness. High.

[0417] In this specification, when a plurality of configuration examples are shown in one embodiment, the configuration examples can be appropriately combined.

[0418] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0419] (Embodiment 6) In this embodiment, a C This article explains the configuration of AC (Cloud-Aligned Composite)-OS. do.

[0420] CAC-OS is, for example, an oxide semiconductor in which the elements constituting the oxide semiconductor are 0.5 nm to 10 nm thick. A material having a size of 1 nm or more and 2 nm or less, or a size close to that range, is unevenly distributed. In the following, one or more metal elements are included in the oxide semiconductor. The region having the metal element is unevenly distributed and has a size of 0.5 nm to 10 nm, preferably 1 nm A mixture of particles with sizes between 1 m and 2 nm or close to that size is called a mosaic or patch. It is also called a state.

[0421] Note that the oxide semiconductor preferably contains at least indium. In addition to these, aluminum, gallium, iridium, and zinc are preferably included. tritium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, Germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium , tantalum, tungsten, magnesium, etc. It may be included.

[0422] For example, CAC-OS in In-Ga-Zn oxide (In- The Ga-Zn oxide may be specifically referred to as CAC-IGZO. (hereinafter referred to as InO X1 (X1 is a real number greater than 0.) or Indium Zinc Oxide (hereinafter, In X2 Zinc Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0. ) and gallium oxide (GaOX3 (X3 is a real number greater than 0) ), or gallium zinc oxide (Ga X4 Zinc Y4 O Z4 (X4, Y4, and Z1 and Z2 are real numbers greater than 0.) The material is separated into a mosaic pattern. The mosaic-like InO X1 , or In X2 Zinc Y2 O Z2 is uniformly distributed in the film. This is a configuration (hereinafter also referred to as a cloud-like configuration).

[0423] In other words, CAC-OS is X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 A composite oxide semiconductor having a structure in which a region in which In this specification, for example, the number of In atoms relative to the element M in the first region is The first region has a ratio of In to the element M that is greater than the atomic ratio of In to the element M in the second region. It is assumed that the concentration of In is higher than that of the second region.

[0424] IGZO is a common name and refers to a compound made of In, Ga, Zn, and O. A typical example is InGaO 3 (ZnO) m1 (m1 is a natural number), or In (1+x0) Ga (1-x0) O 3 (ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number) Examples of the crystalline compound include those represented by the following formula:

[0425] The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a structure in which multiple IGZO nanocrystals have a c-axis orientation and are aligned on the ab plane. In the case of ZnO, the crystal structure is non-oriented and connected.

[0426] On the other hand, CAC-OS refers to the material composition of an oxide semiconductor. In a material composition containing Ga, Zn, and O, some of the nanoparticles are mainly composed of Ga. The region where In is observed as a nanoparticle and the region where In is observed as a nanoparticle are mainly composed of In are shown in Fig. Therefore, in CAC-OS, The crystal structure is a secondary factor.

[0427] Note that CAC-OS does not include a laminated structure of two or more films with different compositions. For example, a structure consisting of two layers, one containing In as the main component and the other containing Ga as the main component, Not at all.

[0428] In addition, GaO X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 In some cases, it may be difficult to observe a clear boundary between the region in which the main component is the

[0429] Instead of gallium, aluminum, yttrium, copper, vanadium, and beryllium are used. Aluminum, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more selected species from the group consisting of uranium, uranium, etc. are included, CAC-OS will In one area, the metal element is observed as a nanoparticle, and in another area, In is observed as a nanoparticle. The nanoparticle-like regions are randomly distributed in a mosaic pattern. This refers to.

[0430] CAC-OS is formed by sputtering without intentionally heating the substrate. In addition, when the CAC-OS is formed by a sputtering method, the deposition gas The gas is selected from an inert gas (typically argon), oxygen gas, and nitrogen gas. One or more of these may be used. The lower the flow rate ratio of the gas, the more preferable. For example, the flow rate ratio of oxygen gas is preferably 0% or more and less than 30%. Or, it is preferable to set it to 0% or more and 10% or less.

[0431] CAC-OS is a method for measuring X-ray diffraction (XRD). When measured using the out-of-plane θ / 2θ scan, In other words, no clear peaks are observed in the measurement area from the X-ray diffraction. It can be seen that the orientation of the regions in the ab plane direction and the c axis direction is not observed.

[0432] In addition, CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam). In the electron beam diffraction pattern obtained by irradiating the sample, a ring-shaped region of high brightness and the corresponding Several bright spots are observed in the ring region. Therefore, the electron diffraction pattern indicates that the CAC-OS The crystal structure of nc (nano- It can be seen that the crystalline structure is

[0433] For example, in the CAC-OS of In-Ga-Zn oxide, the energy dispersive X Energy Dispersive X-ray spectroscopy (EDX) The EDX mapping obtained using scopy revealed that GaO X3 The area where is the main component And, In X2 Zinc Y2 O Z2 , or InO X1 The areas where the main component is It can be confirmed that the compound has a structure similar to that shown in FIG.

[0434] CAC-OS has a structure different from that of IGZO compounds in which metal elements are uniformly distributed. It has different properties from GZO compounds. That is, CAC-OS is GaO X3 The main components are and the region where In X2 Zinc Y2 O Z2 , or InO X1 The region where is the main component and the region where is The phase is gradually separated, and the regions each consisting of one element as a main component are arranged in a mosaic pattern.

[0435] Here, In X2 Zinc Y2 O Z2 , or InO X1 The area where GaO is the main component X 3 This region has a higher electrical conductivity than the region where In is the main component. X2 Zinc Y2 O Z2 , or InO X1 The carriers flow through the area where the main component is oxygen. Therefore, the conductivity of In is expressed as a semiconductor. X2 Zinc Y2 O Z2 , or InO X1 The region where the main component is a metal is distributed in a cloud-like shape in the oxide semiconductor, which results in a high electric field efficiency. As a result, a high mobility (μ) can be achieved.

[0436] On the other hand, GaO X3 The region where the main components are In X2 Zinc Y2 O Z2 , or InO X1 This region has higher insulating properties than the region where GaO is the main component. X3 etc. By distributing the region containing the main component in the oxide semiconductor, leakage current is suppressed and a good Switching operation can be achieved.

[0437] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation and , In X2 Zinc Y2 O Z2 , or InO X1 The conductivity caused by the This results in a high on-state current (I on ), and high field-effect mobility (μ) can be done.

[0438] In addition, semiconductor devices using CAC-OS have high reliability. It is ideal for a variety of semiconductor devices including displays.

[0439] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0440] 10 Electronic equipment 10a electronic equipment 10b Electronic equipment 10c electronic equipment 11. Cabinet 15 straight line 15a intersection 15b intersection 16 straight line 16a intersection 16b Intersection 21 Display section 22 Display section 22a Display section 22b Display section 25 Crown 26 Buttons 31 Band attachment part 32 Band attachment part 41 Bands 42 Bands 51 hour hand 52 minute hand 53 Second hand 54 Index 55 Date and time information 56 Notification Information 57 Icons 61 Display device 62 Display device 63 FPC 63a FPC 63b FPC 64 Materials 64a Parts 64b Parts 71 Battery 72 Printed Circuit Board 73 IC 74 Vibration Module 75 Antenna 110a transistor 110b transistor 110c transistor 110d transistor 110e transistor 110f transistor 110g transistor 110h Transistor 112 Liquid crystal layer 113 Electrode 117 Insulating Layer 121 Insulating layer 131 Colored layer 132 Light blocking layer 133a Alignment film 133b Alignment film 134 Colored layer 135 Polarizing Plate 141 Adhesive layer 142 Adhesive layer 151 Insulating layer 170 Light emitting element 180 Liquid crystal element 191 Electrode 192 EL layer 193 Electrode 194 Insulating Layer 201 Transistor 203 Transistor 204 Connection 205 Transistor 206 Transistor 207 Connection 211 Insulating layer 212 Insulating layer 213 Insulating Layer 214 Insulating layer 216 Insulating Layer 217 Insulating Layer 218 Insulating Layer 220 Insulating layer 221 Conductive Layer 221a Conductive layer 221b Conductive layer 222a conductive layer 222b Conductive layer 223 Conductive Layer 231 Semiconductor Layer 242 Connection Layer 243 Connectors 252 Connection 261 Semiconductor Layer 263a conductive layer 263b Conductive layer 281 Transistor 284 Transistors 285 Transistor 286 Transistors 300 display device 300A display device 300B display device 300C display unit 311 Electrode 311a electrode 311b electrode 340 Liquid crystal element 351 Substrate 360 Light emitting element 360b Light emitting element 360g Light emitting element 360r Light emitting element 360w light emitting element 361 Substrate 362 Display section 364 circuits 365 Wiring 372 FPC 373 IC 381 Fabricated Substrate 382 Peeling layer 383 Insulating Layer 400 display device 410 pixels 451 Aperture 500 display device 501 Display section 530 pixel units 531B Display element 531G Display element 531p pixels 531R Display element 531W display element 532B Display element 532G display element 532W display element 532p pixels 532R Display element 532Y display element 535r Light 535t light 535tr light 651 Touch Panel 652 Touch Panel 661 Arithmetic section 662 Bus Line 664 Storage device 671 Display Controller 672 Touch Sensor Controller 673 Battery Controller 674 Power receiving unit 675 Battery Module 676 Sound Controller 677 Audio Input Unit 678 Audio output section 681 Communication Module 682 Antenna 683 Attitude detection unit 685 External Interface 686 Camera Module 687 Vibration Module 688 Sensor Module

Claims

1. A first semiconductor layer; a first insulating layer having a region disposed above the first semiconductor layer; a first conductive layer having a region disposed above the first insulating layer; a second insulating layer having a region disposed above the first conductive layer; a second conductive layer having a region disposed above the second insulating layer; a third insulating layer having a region disposed above the second conductive layer; a second semiconductor layer having a region disposed above the third insulating layer; a fourth insulating layer having a region disposed above the second semiconductor layer; a third conductive layer having a region disposed above the fourth insulating layer; a fifth insulating layer having a region disposed above the third conductive layer; a fourth conductive layer having a region disposed above the fifth insulating layer; a sixth insulating layer having a region disposed above the fourth conductive layer; a fifth conductive layer having a region disposed above the sixth insulating layer; the first semiconductor layer has a channel formation region of a first transistor; the first insulating layer has a region that functions as a gate insulating layer of the first transistor; the first conductive layer has a region that functions as a gate electrode of the first transistor; the second conductive layer is electrically connected to a source or a drain of the first transistor and has a region that functions as a first gate electrode of a second transistor; the third insulating layer has a region that functions as a first gate insulating layer of the second transistor; the second semiconductor layer has a channel formation region of the second transistor; the second semiconductor layer includes an oxide semiconductor including indium; the fourth insulating layer has a region that functions as a second gate insulating layer of the second transistor; the third conductive layer has a region that functions as a second gate electrode of the second transistor, the third conductive layer is electrically connected to the second conductive layer; the fourth conductive layer is electrically connected to a source or a drain of the second transistor through a contact hole provided in the fifth insulating layer; the fifth conductive layer has a region that functions as a pixel electrode of a light-emitting element, the fifth conductive layer is electrically connected to the fourth conductive layer via a contact hole provided in the sixth insulating layer.

2. A first semiconductor layer; a first insulating layer having a region disposed above the first semiconductor layer; a first conductive layer having a region disposed above the first insulating layer; a second insulating layer having a region disposed above the first conductive layer; a second conductive layer having a region disposed above the second insulating layer; a third insulating layer having a region disposed above the second conductive layer; a second semiconductor layer having a region disposed above the third insulating layer; a fourth insulating layer having a region disposed above the second semiconductor layer; a third conductive layer having a region disposed above the fourth insulating layer; a fifth insulating layer having a region disposed above the third conductive layer; a fourth conductive layer having a region disposed above the fifth insulating layer; a sixth insulating layer having a region disposed above the fourth conductive layer; a fifth conductive layer having a region disposed above the sixth insulating layer; the first semiconductor layer has a channel formation region of a first transistor; the first insulating layer has a region that functions as a gate insulating layer of the first transistor; the first conductive layer has a region that functions as a gate electrode of the first transistor; the second conductive layer is electrically connected to a source or a drain of the first transistor and has a region that functions as a first gate electrode of the second transistor; the third insulating layer has a region that functions as a first gate insulating layer of the second transistor; the third insulating layer comprises silicon nitride; the second semiconductor layer has a channel formation region of the second transistor; the second semiconductor layer includes an oxide semiconductor including indium; the fourth insulating layer has a region that functions as a second gate insulating layer of the second transistor; the third conductive layer has a region that functions as a second gate electrode of the second transistor, the third conductive layer is electrically connected to the second conductive layer; the fourth conductive layer is electrically connected to a source or a drain of the second transistor through a contact hole provided in the fifth insulating layer; the fifth conductive layer has a region that functions as a pixel electrode of a light-emitting element, the fifth conductive layer is electrically connected to the fourth conductive layer via a contact hole provided in the sixth insulating layer.

3. A first semiconductor layer; a first insulating layer having a region disposed above the first semiconductor layer; a first conductive layer having a region disposed above the first insulating layer; a second insulating layer having a region disposed above the first conductive layer; a second conductive layer having a region disposed above the second insulating layer; a third insulating layer having a region disposed above the second conductive layer; a second semiconductor layer having a region disposed above the third insulating layer; a fourth insulating layer having a region disposed above the second semiconductor layer; a third conductive layer having a region disposed above the fourth insulating layer; a fifth insulating layer having a region disposed above the third conductive layer; a fourth conductive layer having a region disposed above the fifth insulating layer; a sixth insulating layer having a region disposed above the fourth conductive layer; a fifth conductive layer having a region disposed above the sixth insulating layer; the first semiconductor layer has a channel formation region of a first transistor; the first insulating layer has a region that functions as a gate insulating layer of the first transistor; the first conductive layer has a region that functions as a gate electrode of the first transistor; the second conductive layer is electrically connected to a source or a drain of the first transistor and has a region that functions as a first gate electrode of a second transistor; the third insulating layer has a region that functions as a first gate insulating layer of the second transistor; the third insulating layer comprises silicon nitride; the second semiconductor layer has a channel formation region of the second transistor; the second semiconductor layer includes an oxide semiconductor including indium; the fourth insulating layer has a region that functions as a second gate insulating layer of the second transistor; the third conductive layer has a region that functions as a second gate electrode of the second transistor, the third conductive layer is electrically connected to the second conductive layer; the fourth conductive layer is electrically connected to a source or a drain of the second transistor through a contact hole provided in the fifth insulating layer; the sixth insulating layer includes a resin; the fifth conductive layer has a region that functions as a pixel electrode of a light-emitting element, the fifth conductive layer is electrically connected to the fourth conductive layer via a contact hole provided in the sixth insulating layer.

4. A first semiconductor layer; a first insulating layer having a region disposed above the first semiconductor layer; a first conductive layer having a region disposed above the first insulating layer; a second insulating layer having a region disposed above the first conductive layer; a second conductive layer having a region disposed above the second insulating layer; a third insulating layer having a region disposed above the second conductive layer; a second semiconductor layer having a region disposed above the third insulating layer; a fourth insulating layer having a region disposed above the second semiconductor layer; a third conductive layer having a region disposed above the fourth insulating layer; a fifth insulating layer having a region disposed above the third conductive layer; a fourth conductive layer having a region disposed above the fifth insulating layer; a sixth insulating layer having a region disposed above the fourth conductive layer; a fifth conductive layer having a region disposed above the sixth insulating layer; the first semiconductor layer has a channel formation region of a first transistor; the first insulating layer has a region that functions as a gate insulating layer of the first transistor; the first conductive layer has a region that functions as a gate electrode of the first transistor; the second conductive layer is electrically connected to a source or a drain of the first transistor and has a region that functions as a first gate electrode of a second transistor; the third insulating layer has a region that functions as a first gate insulating layer of the second transistor; the third insulating layer comprises silicon nitride; the second semiconductor layer has a channel formation region of the second transistor; the second semiconductor layer includes an oxide semiconductor including indium; the fourth insulating layer has a region that functions as a second gate insulating layer of the second transistor; the third conductive layer has a region that functions as a second gate electrode of the second transistor, the third conductive layer is electrically connected to the second conductive layer; the fourth conductive layer is electrically connected to a source or a drain of the second transistor through a contact hole provided in the fifth insulating layer; the sixth insulating layer includes a resin; the fifth conductive layer has a region that functions as a pixel electrode of a light-emitting element, the fifth conductive layer comprises a conductive oxide; the fifth conductive layer is electrically connected to the fourth conductive layer via a contact hole provided in the sixth insulating layer.

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