Display device

Abstract

To provide a display device in which uniformity of thermal distribution of a light-emitting element substrate is improved.SOLUTION: A display device comprises: a light-emitting element substrate that has a front surface on which a light-emitting element is mounted, and a rear surface which is an opposite side of the front surface, and on which a driving element for driving the light-emitting element is mounted; a heat radiation member that has a first surface facing the rear surface and a second surface at the opposite side of the first surface; and a back chassis that has an internal surface facing the second surface. The light-emitting element substrate, the heat radiation member and the back chassis are installed by arranging the front surface, the first surface and an internal surface along a vertical direction. The heat radiation member comprises: an upper region that is in a certain range from an upper end of the heat radiation member in the first surface; and a lower region that is in a certain range from a lower end of the heat radiation member and is depressed in a direction toward the second surface compared to the upper region. In the upper region, the first surface contacts with the rear surface. In the lower region, the first surface is away from the rear surface. The second surface contacts with the internal surface.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a display device. [Background technology]

[0002] A typical display device using liquid crystal includes a display panel that includes liquid crystal and displays an image, and a light source substrate that irradiates light from the back of the display panel. In order to improve the contrast of the displayed image, a technology is used in which a plurality of light-emitting diodes (hereinafter referred to as LEDs) are mounted on the main surface of the light source substrate in a vertical and horizontal array, and the brightness of each of the plurality of LEDs is individually controlled to partially change the brightness of the light source substrate. For example, the brightness of the LEDs is increased in bright parts of an image, and decreased in dark parts. This type of control is generally called local dimming control. In order to realize local dimming control, a plurality of driving elements for controlling the plurality of LEDs are mounted on the light source substrate. As the resolution of the display panel increases, the number of the plurality of LEDs included in the light source substrate increases in order to perform local dimming control by dividing the image more finely. In addition, since the light transmittance of a high-resolution display panel generally decreases, it is required that each of the plurality of LEDs emits light at a higher brightness.

[0003] As described above, the amount of heat generated by the light source board increases due to an increase in the number of LEDs and an increase in brightness associated with the high definition of the display panel. In a high-temperature environment, the light-emitting element such as an LED may experience a decrease in light-emitting efficiency, or the deterioration of the members constituting the light-emitting element may accelerate, shortening the lifespan. In order to solve such problems, a display device provided with a structure for dissipating heat generated by the light source board has been proposed. For example, Patent Document 1 discloses a display device in which a heat-conducting member is provided over the entire surface between the light source board and the case, and the two are in close contact with each other. As a result, heat is transferred from almost the entire surface of the back surface of the light source board to the case, and the light source and the driver IC mounted on the light source board are efficiently dissipated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-111737 A Summary of the Invention [Problem to be solved by the invention]

[0005] According to Patent Document 1, the light source substrate is configured to transfer heat to the case from almost the entire rear surface of the light source substrate. However, in an actual display device, for example, there is an internal space between the display panel and the light source substrate, or between the light source substrate and the case, and the air in the internal space becomes hot due to the heat generated by the light source substrate. The hot air rises inside the display device.

[0006] A display device is generally installed with the display screen standing upright. Therefore, heat is concentrated at the top by the high-temperature air rising inside the display device. Since the heat dissipation efficiency from the rear surface of the light source substrate through the heat conductive member is substantially constant over the entire surface, the temperature gradient caused by the heat concentration at the top by the air cannot be eliminated, and the heat distribution on the main surface of the light source substrate becomes uneven. Therefore, the temperature of the portion of the light source substrate arranged at the top of the display device becomes higher than the temperature of the portion of the light source substrate arranged at the bottom. As a result, the light emission efficiency of the light-emitting element arranged at the top of the light source substrate is lower than that of the light-emitting element arranged at the bottom, and the top of the display screen becomes darker than the bottom. In addition, the life of the light-emitting element arranged at the top of the light source substrate becomes shorter than the life of the light-emitting element arranged at the bottom.

[0007] In view of the above problems, an object of the present disclosure is to provide a display device in which the uniformity of heat distribution on a light-emitting element substrate is improved. [Means for solving the problem]

[0008] A display device according to one embodiment of the present disclosure comprises a light-emitting element substrate having a front surface on which light-emitting elements are mounted and a rear surface opposite the front surface on which driving elements for driving the light-emitting elements are mounted; a heat dissipation member having a first surface facing the rear surface and a second surface opposite the first surface; and a back chassis having an inner surface facing the second surface, wherein the light-emitting element substrate, the heat dissipation member, and the back chassis are installed with the front surface, the first surface, and the inner surface aligned in the vertical direction, and the heat dissipation member includes, on the first surface, an upper region that is a certain range from the upper end of the heat dissipation member, and a lower region that is a certain range from the lower end of the heat dissipation member and is recessed in a direction toward the second surface more than the upper region, and in the upper region, the first surface is in contact with the rear surface, and in the lower region, the first surface is spaced from the rear surface, and the second surface is in contact with the inner surface. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram of a display device in accordance with the present disclosure; [Diagram 2] FIG. 1 is a schematic exploded view of a display device according to a first embodiment. [Diagram 3] 3 is a schematic diagram of the light-emitting element substrate shown in FIG. 2 as viewed from behind. [Figure 4] 4 is a cross-sectional view taken along line IV-IV of FIG. 1 according to the display device of the first embodiment. [Diagram 5] 4 is a cross-sectional view of a display device according to a modified example of the first embodiment, taken along the same line as the IV-IV cross section in FIG. [Figure 6] 4 is a cross-sectional view of the display device of embodiment 2, taken along the same line as the cross-section IV-IV in FIG. [Figure 7] FIG. 11 is a schematic exploded view of a display device according to a third embodiment. [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7 according to the display device of embodiment 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, in the drawings, the same or similar elements are given the same reference numerals, and duplicated explanations are omitted. In addition, the embodiments described below do not unduly limit the contents of the present disclosure described in the claims, and all of the configurations described in the embodiments are not necessarily essential as a solution to the present disclosure.

[0011] FIG. 1 is a schematic diagram of a display device 100 according to the present disclosure. The display device 100 according to the present disclosure includes a bezel 101 attached to the outer periphery. The lower left, upper right, upper left, lower right, upper, and lower sides of FIG. 1 are the front, rear, left, right, upper, and lower sides of the display device 100, respectively. In addition, a planar view is a viewpoint when the top, bottom, left, and right directions are planes. In FIG. 1, the front surface of the display device 100 is the main surface of the optical member 102, which is a surface that displays an image. In the present disclosure, for example, the surface that displays an image is rectangular, and is installed so that the long side is aligned in the left-right direction and the short side is aligned in the up-down direction.

[0012] <Embodiment 1> Fig. 2 is a schematic exploded view of the display device 100 according to the first embodiment of the present disclosure, which is an exploded view of the display device 100 in Fig. 1. The display device 100 has a structure in which a bezel 101, an optical member 102, a light-emitting element substrate 200, a heat dissipation member 300, a back chassis 400, a circuit board 104, and a back cover 103 are stacked in this order from the front. As shown in Fig. 2, in the display device 100, the rectangular frame-shaped bezel 101 and the box-shaped back cover 103 sandwich the optical member 102, the light-emitting element substrate 200, the heat dissipation member 300, the back chassis 400, and the circuit board 104, and hold them integrally in a stacked state.

[0013] <Optical components> The optical member 102 is disposed in front of the light-emitting element substrate 200. The optical member 102 is formed by laminating a plurality of layers having various functions for displaying an image. For example, if the display device 100 is a liquid crystal display device, the optical member 102 is formed by laminating functional layers such as an anti-reflection film, a protective film, a liquid crystal layer, and a color filter. In addition, if the display device 100 is a self-luminous display device that does not use liquid crystal, for example, in which a plurality of light-emitting elements 203 mounted on the light-emitting element substrate 200 described later include light-emitting elements of a plurality of colors, and the light-emitting element substrate 200 itself displays an image, the optical member 102 is formed by laminating functional layers such as an anti-reflection film and a protective film.

[0014] <Light emitting element substrate> The light emitting element substrate 200 is disposed behind the optical member 102. FIG. 3 is a schematic diagram of the light emitting element substrate 200 shown in FIG. 2, seen from the rear side. As shown in FIGS. 2 and 3, the light emitting element substrate 200 has a front surface 201 on which light emitting elements 203 are mounted, and a rear surface 202 opposite to the front surface 201 on which a driving element 204 for driving the light emitting element 203 is mounted. According to this configuration, the light emitting element 203 and the driving element 204 can be electrically connected by a wiring pattern provided on the light emitting element substrate 200. Therefore, it is possible to increase the number of divisions of the local dimming control with a simpler structure than a configuration in which the driving element is mounted on a circuit board separate from the light emitting element substrate and connected by flexible wiring, thereby realizing high contrast of a displayed image.

[0015] The light emitting element substrate 200 is installed with the front surface 201 aligned in the up-down direction. When the display device 100 displays an image, the light emitting elements 203 and the driving elements 204 become heat sources, and the temperature of the light emitting element substrate 200 rises.

[0016] For example, a plurality of light emitting elements 203 are arranged on the front surface 201 at predetermined intervals in the up, down, left and right directions. The light emitting elements 203 emit light forward. A plurality of driving elements 204 for driving the plurality of light emitting elements 203 are arranged on the rear surface 202 at predetermined intervals in the up, down, left and right directions. In the first embodiment, a configuration in which the light emitting elements 203 and the driving elements 204 are arranged in a one-to-one relationship with the light emitting element substrate 200 sandwiched therebetween is illustrated. Note that in the present disclosure, the number of light emitting elements 203 and the driving elements 204 does not need to be the same. For example, when one driving element 204 drives a plurality of light emitting elements 203, the number of driving elements 204 may be less than the number of light emitting elements 203.

[0017] In FIG. 2 and FIG. 3, for example, the light emitting element substrate 200 is divided into a first division substrate 210 in the upper stage and a second division substrate 220 in the lower stage in the vertical direction, and is arranged in two stages, one above the other. In addition, each of the first division substrate 210 and the second division substrate 220 is arranged in a row of four in the left-right direction. In the present disclosure, the light emitting element substrate 200 does not need to have the above-mentioned configuration, and for example, the entire light emitting element substrate 200 may be one substrate, may be a division substrate with three or more stages in the vertical direction, or may be a number of division substrates other than four arranged in a row in the left-right direction. In the front-rear direction, the front surfaces 201 of the multiple first division substrates 210 and the front surfaces 201 of the multiple second division substrates 220 are arranged so as to be located on approximately the same plane. Therefore, in the front-rear direction, the rear surfaces 202 of the multiple first division substrates 210 and the rear surfaces 202 of the multiple second division substrates 220 are also located on approximately the same plane.

[0018] <Heat dissipation materials> The heat dissipation member 300 is disposed behind the light emitting element substrate 200, and has a first surface 301 facing the rear surface 202, and a second surface 302 opposite to the first surface 301. The heat dissipation member 300 is installed with the first surface 301 aligned in the up-down direction. The heat dissipation member 300 is made of a metal having high thermal conductivity, such as aluminum or iron. Heat generated in the light emitting element substrate 200 is conducted to a back chassis 400, which will be described later, via the heat dissipation member 300.

[0019] 4 is a cross-sectional view of the display device 100 of the first embodiment taken along line IV-IV in FIG. 1. The heat dissipation member 300 includes an upper region 340 in a certain range from the upper end 303 of the heat dissipation member 300 and a lower region 350 in a certain range from the lower end 304 of the heat dissipation member 300 on the first surface 301. On the first surface 301, the lower region 350 is recessed in a direction toward the second surface 302 more than the upper region 340. On the upper region 340, the first surface 301 is in contact with the rear surface 202, and on the lower region 350, the first surface 301 is separated from the rear surface 202. In the first embodiment, the upper region 340 is a region from the upper end 303 to a middle position 360 in the vertical direction of the heat dissipation member 300, and the lower region 350 is a region from the middle position 360 to the lower end 304.

[0020] In the upper region 340, the heat dissipation member 300 is provided with an opening 330. The opening 330 is configured to receive the driving element 204 mounted on the rear surface 202, and is configured to allow the rear surface 202 of the light emitting element substrate 200, which is in contact with the first surface 301 of the upper region 340, to come into close contact with the first surface 301. Note that, although the first embodiment illustrates a case in which the opening 330 is a through hole penetrating the heat dissipation member 300, the opening 330 may be, for example, a recess having a depth greater than the height of the driving element 204 that can be placed in the front-rear direction.

[0021] <Rear chassis> The back chassis 400 is disposed behind the heat dissipation member 300, and has an inner surface 401 that faces the second surface 302. The back chassis 400 is installed with the inner surface 401 aligned in the up-down direction.

[0022] In the upper region 340, the second surface 302 and the inner surface 401 are spaced apart, and in the lower region 350, the second surface 302 is in contact with the inner surface 401. Therefore, in the lower region 350, heat can be directly conducted from the heat dissipation member 300 to the back chassis 400. The heat conducted to the back chassis 400 is dissipated into the air from the outer surface 402 opposite to the inner surface 401. That is, the back chassis 400 has a function of a heat sink together with the heat dissipation member 300. The back chassis 400 is made of a metal having high thermal conductivity, such as aluminum or iron. In addition, the back chassis 400 is also a body to which the light emitting element substrate 200, the heat dissipation member 300, etc. are attached, and is preferably made of a metal material having a higher strength than the heat dissipation member 300.

[0023] In the first embodiment, the heat dissipation member 300 is connected at an intermediate position 360 between the upper region 340 and the lower region 350, and is formed as a single member as a whole. Therefore, the heat dissipation member 300 is continuous from the upper end 303 to the lower end 304. As a result, the heat of the light emitting element substrate 200 at a position facing the upper region 340 is conducted from the upper region 340 via the intermediate position 360 to the lower region 350, and is conducted from the second surface 302 of the lower region 350 to the back chassis 400.

[0024] The air heated by the heat dissipation of the light emitting element substrate 200 facing the lower region 350 and reaching a high temperature rises, and the light emitting element substrate 200 facing the upper region 340 tends to be heated by heat transfer due to convection and reach a higher temperature. However, with the above-mentioned configuration, the light emitting element substrate 200 facing the upper region 340 can directly conduct heat to the back chassis 400 via the metal heat dissipation member 300, so that the heat dissipation efficiency is high, while the light emitting element substrate 200 facing the lower region 350 transfers heat to the air, which has a lower thermal conductivity than metal, so that the heat dissipation efficiency is relatively low. Therefore, the temperature difference between the light emitting element substrate 200 facing the upper region 340 and the light emitting element substrate 200 facing the lower region 350 becomes small, and the uniformity of the heat distribution is improved as a whole of the light emitting element substrate 200. As a result, the uniformity of the light emitting efficiency of the light emitting element 203 is improved throughout the light emitting element substrate 200, and the brightness of the upper part of the display screen can be suppressed from being locally reduced. Moreover, the life of the light emitting element 203 can be prevented from varying significantly depending on the location on the light emitting element substrate 200 .

[0025] In the first embodiment, the intermediate position 360 is located at a position that is approximately equidistant from the upper end 303 and the lower end 304, which are both ends of the heat dissipation member 300 in the vertical direction, but the heat dissipation member 300 of the present disclosure is not limited to the above-mentioned configuration. Depending on the configuration of the light-emitting element substrate 200, the heat distribution of the light-emitting element substrate 200 when the display device 100 displays an image, and the like, the intermediate position 360 may be located close to the upper end 303 or close to the lower end 304.

[0026] In addition, in the first embodiment, the light emitting element substrate 200 is divided into two stages, an upper stage first segment substrate 210 and a lower stage second segment substrate 220, and the first segment substrate 210 faces the upper region 340 and the second segment substrate 220 faces the lower region 350, but the present disclosure is not limited to the above-mentioned configuration. For example, in the vertical direction, the number of segment substrates facing the upper region 340 and the number of segment substrates facing the lower region 350 may be different, and the upper region 340 and the lower region 350 may be determined regardless of the division of the light emitting element substrate 200.

[0027] <Circuit board> The circuit board 104 is disposed opposite the outer surface 402 and is disposed between the back chassis 400 and the back cover 103. The circuit board 104 is a board on which various electric circuits for operating the display device 100 are formed. The various electric circuits include, for example, a power supply circuit for generating a DC voltage from an AC power supply, an inverter circuit for adjusting the magnitude of the DC voltage, and a signal processing circuit for processing a signal including data of an image to be displayed. FIG. 2 illustrates a case in which there is one circuit board 104. The display device 100 of the present disclosure has at least one circuit board 104, and may have, for example, a plurality of circuit boards 104 each having the above-mentioned various electric circuits. The circuit board 104 is fixed to the outer surface 402 of the back chassis 400 via, for example, a spacer (not shown) or the like. When the display device 100 displays an image, the circuit board 104 also becomes a heat source.

[0028] <Back cover> The back cover 103 is disposed behind the back chassis 400 with the circuit board 104 sandwiched therebetween. The back cover 103 is formed of, for example, a resin material such as plastic. Although not shown, the back cover 103 may be provided with a heat dissipation port for discharging air heated by heat generated by the outer surface 402 of the back chassis and the circuit board 104 to the outside of the display device 100.

[0029] <Modification of the first embodiment> Fig. 5 is a cross-sectional view of a display device 100 according to a modification of the first embodiment, taken at the same position as the cross section IV-IV in Fig. 1. The modification of the first embodiment differs from the first embodiment in the structure of a heat dissipation member 300.

[0030] 5, in the modification of the first embodiment, the heat dissipation member 300 includes two substrates, a first heat dissipation substrate 310 and a second heat dissipation substrate 320, and these two substrates as a whole constitute one heat dissipation member 300. That is, an upper end 313 of the first heat dissipation substrate 310 corresponds to an upper end 303 of the heat dissipation member 300, and a lower end 324 of the second heat dissipation substrate 320 corresponds to a lower end 304 of the heat dissipation member 300.

[0031] As shown in FIG. 5, the first heat dissipation substrate 310 constitutes the upper region 340 of the heat dissipation member 300, and the second heat dissipation substrate 320 constitutes the lower region 350. The first heat dissipation substrate 310 is provided with an opening 330 into which the driving element 204 mounted on the rear surface 202 is inserted. In this modified example, as in the first embodiment, the light emitting element substrate 200 is divided into two stages, an upper first division substrate 210 and a lower second division substrate 220, in the vertical direction, and the first division substrate 210 faces the upper region 340, and the second division substrate 220 faces the lower region 350. Therefore, the rear surface 202 of the first division substrate 210 contacts the first surface 311 of the first heat dissipation substrate 310, and the rear surface 202 of the second division substrate 220 is separated from the first surface 321 of the second heat dissipation substrate 320. Further, the second surface 312 of the first heat dissipation substrate 310 is spaced apart from the inner surface 401 , and the second surface 322 of the second heat dissipation substrate 320 is in contact with the inner surface 401 .

[0032] At an intermediate position 360 of the heat dissipation member 300, a lower end 314 of the second surface 312 of the first heat dissipation board 310 and an upper end 323 of the first surface 321 of the second heat dissipation board 320 overlap in the front-rear direction. In this manner, at the intermediate position 360, a part of the second surface 312 of the first heat dissipation board 310 and a part of the first surface 321 of the second heat dissipation board 320 are in direct contact with each other. Therefore, the heat conducted from the first division board 210 to the first heat dissipation board 310 is directly conducted from the first heat dissipation board 310 to the second heat dissipation board 320 at the intermediate position 360, and is conducted from the second heat dissipation board 320 to the back chassis 400.

[0033] In the upper region 340, the second surface 302 and the inner surface 401 are spaced apart, and in the lower region 350, the second surface 302 is in contact with the inner surface 401. Therefore, in the lower region 350, heat can be conducted directly from the heat dissipation member 300 to the back chassis 400.

[0034] In this modification, as in the first embodiment, the heat dissipation efficiency of the light emitting element substrate 200 facing the first heat dissipation substrate 310 is high, and the heat dissipation efficiency of the light emitting element substrate 200 facing the second heat dissipation substrate 320 is relatively low. Therefore, the temperature difference between the light emitting element substrate 200 facing the first heat dissipation substrate 310 and the light emitting element substrate 200 facing the second heat dissipation substrate 320 is reduced, and the uniformity of the heat distribution is improved as a whole of the light emitting element substrate 200. As a result, the uniformity of the light emitting efficiency of the light emitting element 203 is improved throughout the light emitting element substrate 200, and the brightness of the upper part of the display screen can be suppressed from being locally reduced. In addition, the life of the light emitting element 203 can be prevented from being significantly different depending on the location of the light emitting element substrate 200. Furthermore, since the heat dissipation member 300 is composed of two plates, the processing for forming the heat dissipation member 300 is simplified.

[0035] In this embodiment, similarly to the first embodiment, the position of the intermediate position 360, the configuration for dividing the light emitting element substrate 200, and the like can be arbitrarily changed. Therefore, for example, the size of the first heat dissipation substrate 310 and the size of the second heat dissipation substrate 320 in the vertical direction may be different.

[0036] <Embodiment 2> Fig. 6 is a cross-sectional view of the display device 100 of embodiment 2, taken at the same position as the cross section IV-IV in Fig. 1. Embodiment 2 differs from embodiment 1 in the configuration related to the heat dissipation member 300, but the configurations other than the heat dissipation member 300 are the same as those of embodiment 1.

[0037] 6, the heat dissipation member 300 of the second embodiment has a thickness in the upper region 340 that is greater than the thickness in the lower region 350 in the front-rear direction. As a result, the second surface 302 and the inner surface 401 are in contact with each other in the upper region 340. As a result, the heat of the light emitting element substrate 200 facing the upper region 340 can be directly conducted to the back chassis 400 in both the upper region 340 and the lower region 350. Therefore, compared to the first embodiment, the heat dissipation efficiency of the light emitting element substrate 200 facing the upper region 340 can be further improved.

[0038] For example, the amount of heat generated by the light emitting element substrate 200 is large, and the temperature of the air heated by the light emitting element substrate 200 at a position facing the lower region 350 becomes very high, and the configuration of the first embodiment may not eliminate the tendency that the temperature of the light emitting element substrate 200 at a position facing the upper region 340 becomes higher than that of the lower region 350. In the configuration of the second embodiment, by increasing the heat dissipation efficiency of the light emitting element substrate 200 at a position facing the upper region 340 more than that of the first embodiment, even when the amount of heat generated by the light emitting element substrate 200 is large, the temperature difference between the light emitting element substrate 200 at a position facing the upper region 340 and the light emitting element substrate 200 at a position facing the lower region 350 can be reduced, and the uniformity of the heat distribution in the light emitting element substrate 200 as a whole can be improved.

[0039] <Embodiment 3> Fig. 7 is a schematic exploded view of a display device 100 according to embodiment 3. Fig. 8 is a cross-sectional view taken along line VIII-VIII of Fig. 7 of the display device 100 of embodiment 3. Embodiment 3 differs from embodiment 1 in the configuration related to the heat dissipation member 300, but the configurations other than the heat dissipation member 300 are the same as those of embodiment 1.

[0040] 7 and 8, in a plan view, the second surface 302 of the heat dissipation member 300 is separated from the inner surface 401 of the back chassis 400 at a position overlapping with the circuit board 104. More specifically, in a plan view, the second surface 302 is provided with a separation portion 331 recessed toward the first surface 301 at a position overlapping with the circuit board 104, and the second surface 302 and the inner surface 401 are separated from each other at the separation portion 331.

[0041] When the display device 100 displays an image, the circuit board 104 also becomes a heat source. Depending on the amount of heat generated by the circuit board 104, the heat of the circuit board 104 is transferred by air convection to the outer surface 402 at a position facing the circuit board 104. The heat may be transferred to the inner surface 401 of the back chassis 400, and further transferred from the inner surface 401 to the second surface 302 of the light-emitting element substrate 200. Therefore, in a plan view, the temperature of the light-emitting element substrate 200 becomes locally high at a position overlapping with the circuit board 104, and the light-emitting efficiency of the light-emitting element 203 arranged at that position may decrease.

[0042] In the configuration of the third embodiment, the separation portion 331 is provided to prevent heat from being transmitted between the heat dissipation member 300 and the back chassis 400 at the position where the circuit board 104 overlaps. This makes it difficult for heat generated by the circuit board 104 to be transmitted to the light emitting element substrate 200, and it is possible to prevent the temperature of the light emitting element substrate 200 from being locally high at the position where the circuit board 104 overlaps. Furthermore, the heat of the light emitting element substrate 200 is directly conducted through a path where the second surface 302 is in contact with the inner surface 401 at the position where the circuit board 104 does not overlap. Therefore, the heat dissipation efficiency of the light emitting element substrate 200 is not significantly reduced, and the uniformity of the heat distribution of the light emitting element substrate 200 as a whole can be maintained.

[0043] In the third embodiment, the case where there is one circuit board 104 is illustrated, but if the display device 100 has a plurality of circuit boards 104, a plurality of separating portions 331 may be provided at positions overlapping the plurality of circuit boards 104 in a plan view. In addition, in Fig. 7, a configuration in which separating portion 331 is provided on second surface 302 of heat dissipation member 300 in lower region 350 is illustrated, but for example, in the second embodiment, if circuit board 104 is disposed at a position overlapping upper region 340 in a plan view, separating portion 331 can be provided on second surface 302 of heat dissipation member 300 in upper region 340.

[0044] <Mini LED> The present disclosure is particularly useful when the light emitting element 203 is a mini LED. A mini LED is an LED smaller in size than a conventional LED. For example, the size of a conventional LED is generally about 20 mm×30 mm to 40 mm×50 mm, whereas the size of a mini LED is about 0.1 mm×0.1 mm to 1 mm×1 mm. For a light emitting element substrate 200 of the same area, it is possible to mount more mini LEDs than conventional LEDs, and for example, the mounting density of mini LEDs is about 6 to 80 times higher than that of conventional LEDs. Therefore, the area between multiple mini LEDs is relatively small compared to conventional LEDs. For example, the interval between two adjacent conventional LEDs is about 50 mm to 90 mm, whereas the interval between two adjacent mini LEDs is about 10 mm to 20 mm. Therefore, when a mini LED is used as the light emitting element 203, local dimming control that divides an image more finely, suitable for a high-definition display device, can be performed. In this case, the multiple driving elements 204 mounted on the light emitting element substrate 200 are multiple driver ICs for driving the multiple mini LEDs.

[0045] The present disclosure is not limited to the configurations of the above-described embodiments and modified examples, and may be replaced with a configuration that is substantially the same as the configurations shown in the above-described embodiments and modified examples, a configuration that has the same action and effect, or a configuration that can achieve the same purpose. [Explanation of symbols]

[0046] 100:Display device 101: Bezel 102: Optical components 103: Back cover 104: Circuit board 200: Light emitting element substrate 201: Front 202: Rear 203: Light emitting element 204: Drive element 210: 1st section board 220: 2nd section board 300: Heat dissipation material 301: 1st page 302:Second side 303:Top edge 304: Bottom edge 310: First heat dissipation board 311: 1st page 312: 2nd side 313:Top edge 314: Bottom edge 320: Second heat dissipation board 321: 1st page 322:Second side 323:Top edge 324: Bottom edge 330:Aperture 331: Separation part 340: Upper area 350: Lower area 360: intermediate position 400: Back chassis 401:Inside 402: Exterior

Claims

1. A light-emitting element substrate having a front surface on which a light-emitting element is mounted and a rear surface opposite to the front surface on which a driving element for driving the light-emitting element is mounted; A heat radiating member having a first surface facing the rear surface and a second surface opposite to the first surface; A back chassis having an inner surface facing the second surface, and comprising: The light-emitting element substrate, the heat radiating member, and the back chassis are installed with the front surface, the first surface, and the inner surface aligned in the vertical direction; The heat radiating member includes, on the first surface, an upper region that is a certain range from the upper end of the heat radiating member, and a lower region that is a certain range from the lower end of the heat radiating member and is recessed in a direction toward the second surface relative to the upper region; In the upper region, the first surface is in contact with the rear surface; In the lower region, the first surface is spaced apart from the rear surface, and the second surface is in contact with the inner surface. A display device.

2. On the second surface of the heat radiating member, the upper region is recessed in a direction toward the first surface relative to the lower region; In the upper region, the second surface and the inner surface are spaced apart. The display device according to claim 1.

3. The heat radiating member includes a first heat radiating substrate constituting the upper region and a second heat radiating substrate constituting the lower region; The lower end of the second surface of the first heat radiating substrate and the upper end of the first surface of the second heat radiating substrate overlap in the front-rear direction. The display device according to claim 2.

4. In the upper region, the second surface and the inner surface are in contact. The display device according to claim 1.

5. The upper region is a region from the upper end to an intermediate position in the vertical direction of the heat radiating member; The lower region is a region from the intermediate position to the lower end. The display device according to claim 1.

6. The back chassis has an outer surface opposite to the inner surface; Having at least one circuit board installed opposite to the outer surface; In a plan view, at a position overlapping the circuit board, the second surface and the inner surface are spaced apart. The display device according to claim 1.

7. The light-emitting element substrate is divided into two divided substrates in the vertical direction; The heat radiating member is continuous from the upper end to the lower end. The display device according to any one of claims 1 to 6.

8. The light-emitting element is a plurality of mini light-emitting diodes. The display device according to claim 1, wherein the drive element is a plurality of driver ICs that drive the plurality of mini light-emitting diodes.

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