Electronic component mounting method, electronic component mounting program, and electronic component mounting device

Abstract

To provide an electronic component mounting method that enables measurement of a flow rate of air passing through a vacuum suction circuit, except for individual variability of the vacuum suction circuit for connecting a suction nozzle and a vacuum suction source together, an electronic component mounting program, and an electronic component mounting device.SOLUTION: In an electronic component mounting method for mounting an electronic component on a substrate, a flow rate of air sucked in from a suction nozzle and passing through a vacuum suction circuit is measured by a flow sensor arranged in a vacuum suction circuit for connecting a vacuum suction source and a nozzle holder fitted with the suction nozzle (ST3), and an obtained measured value is replaced with a corresponding value based on a reference value calculated from measured values of the flow rates of the air in the plurality of vacuum suction circuits provided in a mounted head (ST4).SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to an electronic component mounting method, an electronic component mounting program, and an electronic component mounting apparatus for vacuum-adsorbing electronic components by a plurality of suction nozzles mounted on a mounting head and mounting them on a substrate.

Background Art

[0002] An electronic component mounting apparatus mounts components on a substrate by vacuum-adsorbing the components using a plurality of suction nozzles mounted on a mounting head. The suction nozzles may become clogged during the repeated component mounting operation, resulting in a decrease in the suction force. The electronic component mounting apparatus described in Patent Document 1 includes a flow rate sensor in a vacuum suction circuit that connects the suction nozzles and a vacuum suction source. Then, the flow rate of air in a state where the suction nozzles are not sucking electronic components is measured for each suction nozzle using the flow rate sensor as a determination reference value, and a determination threshold value obtained by adding an offset amount to the determination reference value is calculated in advance for each suction nozzle. And it is disclosed that during the component mounting operation, the suction state of the electronic component is detected by comparing the air flow rate of the suction nozzle that has sucked the electronic component with the determination threshold value of the suction nozzle.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the prior art including Patent Document 1, although the individual differences of each suction nozzle can be eliminated to determine the suction state of the electronic component, the individual differences of each vacuum suction circuit due to the structure of the mounting head are not considered, and there is room for further improvement in order to improve the detection accuracy of the suction state of the electronic component.

[0005] Therefore, an object of the present invention is to provide an electronic component mounting method, an electronic component mounting program, and an electronic component mounting apparatus that can measure the flow rate of air passing through a vacuum suction circuit by excluding individual differences in the vacuum suction circuit connecting the suction nozzle and the vacuum suction source.

Means for Solving the Problems

[0006] The electronic component mounting method of the present invention is an electronic component mounting method in which an electronic component is picked up by vacuum suction by a plurality of suction nozzles mounted on a mounting head and the electronic component is mounted on a substrate. A flow rate measurement step of measuring the flow rate of air sucked from the suction nozzle mounted on the nozzle holder and passing through the vacuum suction circuit by a flow rate sensor disposed in the vacuum suction circuit connecting the nozzle holder on which the suction nozzle is mounted and the vacuum suction source; and a measurement value replacement step of replacing the measurement value obtained in the flow rate measurement step with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head.

[0007] The electronic component mounting program of the present invention is an electronic component mounting program for causing a computer to execute an electronic component mounting method in which an electronic component is picked up by vacuum suction by a plurality of suction nozzles mounted on a mounting head and the electronic component is mounted on a substrate. A flow rate measurement step of measuring the flow rate of air sucked from the suction nozzle mounted on the nozzle holder and passing through the vacuum suction circuit by a flow rate sensor disposed in the vacuum suction circuit connecting the nozzle holder on which the suction nozzle is mounted and the vacuum suction source; and a measurement value replacement step of replacing the measurement value obtained in the flow rate measurement step with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head.

[0008] The electronic component mounting apparatus of the present invention is an electronic component mounting apparatus that picks up an electronic component by vacuum suction using a plurality of suction nozzles attached to a mounting head and mounts the electronic component on a substrate, and includes a flow rate sensor disposed in a vacuum suction circuit that connects a nozzle holder to which the suction nozzle is attached and a vacuum suction source, and a flow rate measurement unit that measures the flow rate of air sucked from the suction nozzle attached to the nozzle holder and passing through the vacuum suction circuit by the flow rate sensor, and a measurement value replacement unit that replaces the measurement value obtained by the flow rate measurement unit with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head.

Effect of the Invention

[0009] According to the present invention, it is possible to measure the flow rate of air passing through the vacuum suction circuit while excluding the individual differences of the vacuum suction circuits that connect the suction nozzle and the vacuum suction source.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, etc. described below are illustrative for explanation purposes and can be appropriately changed according to the specifications of the electronic component mounting system, electronic component mounting apparatus, mounting head, and vacuum suction circuit. In the following, corresponding elements in all the drawings are denoted by the same reference numerals, and duplicate explanations are omitted. In FIG. 1 and in part of the description below, two axes orthogonal to each other in the horizontal plane are shown as the X-axis (left-right direction in FIG. 1) in the substrate conveyance direction and the Y-axis (up-down direction in FIG. 1) orthogonal to the substrate conveyance direction. In FIG. 2 and in part of the description below, the Z-axis (up-down direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane.

[0012] First, referring to FIG. 1, the configuration of the electronic component mounting system 1 will be described. The electronic component mounting system 1 includes an electronic component mounting apparatus 2 and has a function of mounting electronic components on a substrate to produce a mounted substrate. The electronic component mounting apparatus 2 is connected to a management computer 4 via a communication network 3. Note that the number of electronic component mounting apparatuses 2 included in the electronic component mounting system 1 is not limited to one, and two or more may be used. The management computer 4 has a function of calculating a reference value used when replacing the flow rate of air passing through the vacuum suction circuit provided in the mounting head with a converted value based on the data acquired by the electronic component mounting apparatus 2 in addition to the line management function.

[0013] Next, with reference to FIGS. 1 to 4, the configuration of the electronic component mounting apparatus 2 will be described. Note that FIG. 2 schematically shows a part of the electronic component mounting apparatus 2 in FIG. 1. In FIGS. 1 and 2, the electronic component mounting apparatus 2 has a function of performing a component mounting operation of mounting the electronic components supplied from the component supply unit on the substrate. In the center of the base 5, a substrate transfer mechanism 6 is arranged along the X-axis. The substrate transfer mechanism 6 carries in, positions, and holds the substrate P transferred from the upstream at the mounting operation position. Further, the substrate transfer mechanism 6 carries out the substrate P on which the component mounting operation has been completed downstream.

[0014] On both sides (in the front-rear direction of the Y-axis) of the substrate transfer mechanism 6, component supply units 7 are arranged. A plurality of tape feeders 8 are arranged along the X-axis in each component supply unit 7. Each tape feeder 8 of the component supply unit 7 supplies the electronic component D to the component supply position from which the electronic component D is taken out by the mounting head 11 described below by pitch-feeding the component tape 18 having pockets for storing the electronic component D in the direction from the outside of the component supply unit 7 toward the substrate transfer mechanism 6 (tape feed direction).

[0015] In FIGS. 1 and 2, on both end portions in the X-axis on the upper surface of the base 5, Y-axis tables 9 provided with linear drive mechanisms are arranged along the Y-axis. A beam 10 similarly provided with a linear drive mechanism is movably coupled to the Y-axis table 9 along the Y-axis. The beam 10 is arranged along the X-axis. A mounting head 11 is movably mounted on the beam 10 along the X-axis via a plate 10a.

[0016] In FIGS. 3 and 4, the mounting head 11 is detachable from the plate 10a. The mounting head 11 includes a plurality of component mounting portions 12. At the lower end portion of each component mounting portion 12, a nozzle holder 12a on which a suction nozzle 13 for vacuum-sucking and holding the electronic component D is mounted is provided. Each component mounting portion 12 includes a lifting motor 12b for lifting the nozzle holder 12a along the Z-axis, and a vacuum suction circuit 12c for supplying negative pressure to the suction nozzle 13 mounted on the nozzle holder 12a.

[0017] In FIG. 1, the Y-axis table 9 and the beam 10 constitute a head moving mechanism 14 that moves the mounting head 11 along the X-axis and the Y-axis. The head moving mechanism 14 and the mounting head 11 vacuum-adsorb and take out the electronic component D by the suction nozzle 13 mounted on the nozzle holder 12a of the component mounting section 12 from the tape feeder 8 disposed in the component supply section 7, and perform a mounting cycle of mounting it at the mounting position of the substrate P positioned by the substrate transfer mechanism 6. Thus, the electronic component mounting apparatus 2 picks up the electronic component D supplied from the component supply section 7 by the plurality of suction nozzles 13 mounted on the mounting head 11 by vacuum adsorption, and mounts the electronic component D on the substrate P.

[0018] In FIGS. 1 and 2, a component recognition camera 15 is disposed between the component supply section 7 and the substrate transfer mechanism 6. When the mounting head 11 that has taken out the electronic component D from the component supply section 7 moves above the component recognition camera 15, the component recognition camera 15 images the electronic component D held by the mounting head 11 and recognizes the holding posture of the electronic component D. A head camera 16 is attached to the plate 10a to which the mounting head 11 is attached. The head camera 16 moves integrally with the mounting head 11.

[0019] By the movement of the mounting head 11, the head camera 16 moves above the substrate P positioned by the substrate transfer mechanism 6, images a substrate mark (not shown) provided on the substrate P, and recognizes the position of the substrate P. In the operation of mounting the component on the substrate P by the mounting head 11, correction of the mounting position is performed in consideration of the recognition result of the electronic component D by the component recognition camera 15 and the recognition result of the substrate position by the head camera 16.

[0020] In FIG. 2, a carriage 17 having a plurality of tape feeders 8 mounted thereon in advance is set in the component supply section 7. The carriage 17 holds a reel 19 that stores the component tape 18 holding the electronic component D in a wound state. The component tape 18 pulled out from the reel 19 is pitch-fed to the component supply position by the tape feeder 8.

[0021] In FIG. 1, a touch panel 20 operated by an operator is installed at a position where the operator works in front of the electronic component mounting apparatus 2. The touch panel 20 displays various information on its display unit, and the operator inputs data and operates the electronic component mounting apparatus 2 using operation buttons and the like displayed on the display unit.

[0022] Next, referring to FIGS. 3(a) and 3(b), the configuration of the mounting head 11 will be described. The mounting head 11 includes a plurality of component mounting portions 12(N). In this example, the mounting head 11 includes eight component mounting portions 12(N) along the X-axis in two rows along the Y-axis. That is, the mounting head 11 includes 16 component mounting portions 12(1) to 12(16). Each component mounting portion 12(N) includes a lifting motor 12b and a vacuum suction circuit 12c. By driving the lifting motor 12b, each component mounting portion 12(N) raises and lowers the suction nozzle 13 mounted on the nozzle holder 12a. Further, the vacuum suction circuit 12c supplies negative pressure to the suction nozzle 13 mounted on the nozzle holder 12a.

[0023] Next, referring to FIG. 4, the configuration of the vacuum suction circuit 12c that performs vacuum suction from the suction nozzle 13 and the control system that controls the vacuum suction circuit 12c will be described. An output port of a vacuum valve 21 is connected to the nozzle holder 12a on which the suction nozzle 13 is mounted in the component mounting portion 12(N). A vacuum suction source 23 such as a vacuum pump installed outside the electronic component mounting apparatus 2 is connected to an input port of the vacuum valve 21 via a flow sensor 22. The vacuum valve 21 and the flow sensor 22 are controlled by a head control unit 24 provided in the mounting head 11.

[0024] When the head control unit 24 opens the vacuum valve 21 while the vacuum suction source 23 is being driven, the suction nozzle 13 mounted on the nozzle holder 12a is connected to the vacuum suction source 23, and vacuum suction is performed through the suction holes provided on the suction surface at the lower end of the suction nozzle 13. A filter 28 is built into the nozzle holder 12a, and foreign matter sucked in together with air during vacuum suction is collected by the filter 28 as the air sucked from the suction nozzle 13 passes through the filter 28.

[0025] In FIG. 4, in this vacuum suction operation, a flow rate sensor 22 provided between a vacuum valve 21 and a vacuum suction source 23 measures the flow rate of air sucked from a suction nozzle 13 attached to a nozzle holder 12a and passing through a vacuum suction circuit 12c. The measured value Q is sent to a flow rate measurement unit 25 provided in the mounting head 11 and stored in a head storage unit 26 provided in the mounting head 11.

[0026] The head control unit 24 includes a reference value calculation unit 24a and a measured value replacement unit 24b as internal processing units. The reference value calculation unit 24a calculates a reference value from the measured values Q (tip flow rate measured values) of the flow rates of air passing through a plurality of vacuum suction circuits 12c stored in the head storage unit 26, and stores it in the head storage unit 26. The measured value replacement unit 24b replaces the measured value Q of the flow rate of air sucked from the suction nozzle 13 and passing through the vacuum suction circuit 12c with a conversion value QE based on the reference value stored in the head storage unit 26. The conversion value QE is transmitted to a control device 30 (FIG. 5) of the electronic component mounting apparatus 2 via a communication unit 27 provided in the mounting head 11.

[0027] In this way, the mounting head 11 includes a flow rate sensor 22 disposed in a vacuum suction circuit 12c that connects a nozzle holder 12a to which the suction nozzle 13 is attached and a vacuum suction source 23, and the flow rate sensor 22 measures the flow rate of air sucked from the suction nozzle 13 attached to the nozzle holder 12a and passing through the vacuum suction circuit 12c. It also includes a flow rate measurement unit 25, and a measured value replacement unit 24b that replaces the measured value Q obtained by the flow rate measurement unit 25 with a conversion value QE based on a reference value calculated from the measured values Q (tip flow rate measured values) of the flow rates of air in a plurality of vacuum suction circuits 12c provided in the mounting head 11.

[0028] Next, referring to FIG. 5, the configuration of the control system of the electronic component mounting apparatus 2 will be described centering on the function of measuring the flow rate of air passing through the vacuum suction circuit 12c while excluding the individual differences of the plurality of vacuum suction circuits 12c provided in the mounting head 11. The electronic component mounting apparatus 2 includes a control device 30, a substrate transfer mechanism 6, a tape feeder 8, a mounting head 11, a head movement mechanism 14, a component recognition camera 15, a head camera 16, and a touch panel 20. The mounting head 11 includes a plurality of component mounting parts 12(N) each provided with a lifting motor 12b, a vacuum valve 21, and a flow rate sensor 22.

[0029] The control device 30 includes a control storage unit 31, a mounting control unit 32, and a mounting feasibility determination unit 33. The control storage unit 31 is a storage device, and stores mounting data 34, determination threshold data 35, and the like. In the mounting data 34, various information such as the type of the electronic component D to be mounted on the substrate P, the mounting position (XY coordinates) on the substrate P, and the type of the suction nozzle 13 for vacuum-sucking the electronic component D is stored for each substrate type of the mounting substrate.

[0030] In FIG. 5, based on the mounting data 34, the mounting control unit 32 raises and lowers the suction nozzle 13 attached to the component mounting part 12 of the mounting head 11 to pick up the electronic component D supplied by the tape feeder 8 of the component supply unit 7, and executes a component mounting operation of mounting it at the mounting position of the substrate P.

[0031] The mounting feasibility determination unit 33 acquires a converted value QE obtained by the measurement value replacement unit 24b replacing the measured value Q of the air flow rate in the vacuum suction circuit 12c of the component mounting part 12(N) that is vacuum-sucking the electronic component D measured by the flow rate measurement unit 25. Then, the mounting feasibility determination unit 33 compares the acquired converted value QE with the determination threshold value included in the determination threshold data 35, and determines the feasibility of mounting the electronic component D by the suction nozzle 13 attached to the nozzle holder 12a.

[0032] In FIG. 5, for each type of suction nozzle 13, a determination threshold value is stored in the determination threshold value data 35. When the obtained converted value QE is smaller than the determination threshold value corresponding to the type of suction nozzle 13 mounted on the nozzle holder 12a of the component mounting unit 12(N), the implementation feasibility determination unit 33 determines that implementation is possible; when it is larger, the unit determines that implementation is not possible. In this way, the implementation feasibility determination unit 33 determines the feasibility of mounting the electronic component D by the suction nozzle 13 mounted on the nozzle holder 12a by comparing the converted value QE obtained by the measurement value replacement unit 24b with the determination threshold value.

[0033] Next, an electronic component mounting method of picking up an electronic component D by vacuum suction with a plurality of suction nozzles 13 mounted on the mounting head 11 and mounting the electronic component D on a substrate P along the flowcharts of FIGS. 7 to 9 while referring to FIG. 6, and an electronic component mounting program for causing a computer to execute the electronic component mounting method will be described.

[0034] In FIG. 7, first, for each mounting head 11, a reference value acquisition step (ST1) is executed. In the reference value acquisition step (ST1), a reference value used for deriving a converted value QE used for determining whether it is possible to mount the electronic component D being vacuum-sucked by the suction nozzle 13 on the substrate P in the component mounting operation is acquired. The reference value acquisition step (ST1) is performed in the shipping test of the mounting head 11, inspection after maintenance, and the like.

[0035] In FIG. 8, the reference value acquisition step (ST1) is executed in a state where the suction nozzle 13 is removed from the nozzle holder 12a of the mounting head 11 and the flow rate of air sucked from the nozzle holder 12a by a variable orifice or the like (hereinafter referred to as "tip flow rate") can be freely changed. In the reference value acquisition step (ST1), first, the head control unit 24 resets a counter for specifying the component mounting unit 12(N) (N = 1) (ST11).

[0036] Next, the tip flow measurement process (ST12) of the component mounting unit 12(1) is executed. In the tip flow measurement process (ST12), with the tip flow set to a predetermined value, the head control unit 24 opens the vacuum valve 21, and the flow measurement unit 25 acquires the flow rate of the air passing through the vacuum suction circuit 12c measured by the flow sensor 22. Next, the flow measurement unit 25 associates the acquired measurement value Q with the information identifying the component mounting unit 12(1) and the information identifying the set tip flow rate, and stores it in the head storage unit 26 as the tip flow measurement value (ST13: tip flow rate storage process). For example, the flow measurement unit 25 acquires the digital signal output from the flow sensor 22 and stores it as the tip flow measurement value associated with the information identifying the component mounting unit 12(1) and the information identifying the set tip flow rate.

[0037] In FIG. 8, when the acquisition of the tip flow measurement value has not been completed for all the component mounting units 12(N) (No in ST14), the head control unit 24 increments the counter (N = N + 1) (ST15), and causes the next component mounting unit 12(2) to execute the tip flow measurement process (ST12) and the tip flow rate storage process (ST13).

[0038] Here, with reference to FIG. 6, an example of the tip flow measurement value stored in the head storage unit 26 will be described. FIG. 6 shows an example in which the tip flow measurement value 42 is measured while the tip flow rate 40 is decreased from 100% to 0% in 10% increments. The tip flow measurement value 42 is stored for each Pos number (Pos01 to Pos16) identifying the component mounting unit 12(N). For example, the tip flow measurement values 42 for the tip flow rates 40 of 80% and 70% in the component mounting unit 12(1) with the Pos number Pos01 (N = 1) are Q01c and Q01d, respectively.

[0039] In FIG. 8, when the tip flow measurement value 42 has been acquired for all the component mounting units 12(N) (Yes in ST14), the reference value calculation unit 24a calculates a reference value based on the tip flow measurement value 42 stored in the head storage unit 26 (ST16: reference value calculation process), and stores it in the head storage unit 26 (ST17: reference value storage process).

[0040] Here, referring to FIG. 6, an example of calculating the reference value by the reference value calculation unit 24a will be described. In the example of FIG. 6, the reference value calculation unit 24a calculates the average value of the tip flow measurement values 42 of all the component mounting parts 12(N) for each tip flow rate 40, and stores it as the reference value 41. For example, the reference value 41(QSc) when the tip flow rate 40 is 80% is the average value (Ave(Q01c, Q02c, ···, Q16c)) of the tip flow measurement values 42 when the tip flow rate 40 of all the component mounting parts 12(N) is 80%.

[0041] Thus, the tip flow measurement value 42 of the air flow rate in the vacuum suction circuit 12c when calculating the reference value 41 is the measured value Q of the air flow rate in the vacuum suction circuit 12c in a state where the amount of air flowing in from the nozzle holder 12a is restricted to a predetermined flow rate (tip flow rate 40). The reference value 41 is the average value calculated from the measured values Q (tip flow measurement values 42) of the air flow rates in the plurality of vacuum suction circuits 12c provided in the mounting head 11.

[0042] In the mounting head 11, the lengths, shapes, and pipe resistances of the vacuum suction circuits 12c are different for each component mounting part 12(N), and even if the tip flow rate 40 is the same, the tip flow measurement values 42 are different. However, by using the average value of the measured values Q (tip flow measurement values 42) of the vacuum suction circuits 12c of the plurality of component mounting parts 12(N) as the reference value 41, the individual differences of the vacuum suction circuits 12c can be excluded.

[0043] In FIG. 7, in the component mounting operation, the suction nozzles 13 specified by the mounting data 34 and the like are mounted on the nozzle holders 12a of each component mounting part 12(N) of the mounting head 11. In the component mounting operation, the mounting control unit 32 vacuum-sucks and picks up the electronic component D supplied from the tape feeder 8 with the suction nozzle 13 of the mounting head 11 (ST2: electronic component suction step).

[0044] Next, in the mounting head 11, the flow rate of the air sucked from the suction nozzle 13 mounted with the electronic component D and passing through the vacuum suction circuit 12c is measured by the flow rate sensor 22 disposed in the vacuum suction circuit 12c that connects the nozzle holder 12a to which the suction nozzle 13 is mounted and the vacuum suction source 23 (ST3: flow rate measurement step). In the flow rate measurement step (ST3), the flow rate measurement unit 25 acquires the flow rate (measurement value Q) of the air passing through the vacuum suction circuit 12c from the flow rate sensor 22 of the vacuum suction circuit 12c of the component mounting unit 12(N) to be measured.

[0045] In FIG. 7, next, the measurement value replacement unit 24b replaces the measurement value Q obtained in the flow rate measurement step (ST3) with a conversion value QE based on the reference value 41 stored in the head storage unit 26 (ST4: measurement value replacement step). The conversion value QE replaced by the measurement value replacement unit 24b is transmitted to the control device 30 via the communication unit 27.

[0046] In FIG. 9, in the measurement value replacement step (ST4), first, the measurement value replacement unit 24b acquires (refers to) the tip flow rate measurement value 42 of the component mounting unit 12(N) to be measured from the head storage unit 26 (ST21: tip flow rate measurement value reference step). Next, the measurement value replacement unit 24b estimates the range (flow rate range) of the tip flow rate 40 to which the measurement value Q belongs (ST22). Next, the measurement value replacement unit 24b acquires (refers to) the reference value 41 of the flow rate range from the head storage unit 26 (ST23: reference value reference step).

[0047] Next, the measurement value replacement unit 24b converts (calculates) the measurement value Q into a conversion value QE based on the tip flow rate measurement value 42 and the reference value 41 to be referred to (ST24: conversion value calculation step). Next, the measurement value replacement unit 24b causes the calculated conversion value QE to be transmitted to the control device 30 via the communication unit 27 (ST25: conversion value transmission step).

[0048] Here, with reference to FIG. 6, a specific example of the replacement of the measured value Q with the converted value QE by the measured value replacement unit 24b will be described. Here, an example will be described in which the measured value Q1 in the vacuum suction circuit 12c (the first vacuum suction circuit) of the component mounting section 12(1) with the Pos number Pos01 is replaced with the converted value QE1.

[0049] First, the measured value replacement unit 24b acquires the tip flow rate measurement value 42 at Pos01 where the measured value Q1 exists (ST21). Next, the measured value replacement unit 24b estimates the range (rectangle A) of the tip flow rate 40 of the tip flow rate measurement value 42 where the measured value Q1 exists (ST22). Here, an example will be described in which the measured value Q1 exists between the tip flow rate measurement value Q01c and the tip flow rate measurement value Q01d where the tip flow rate 40 is 80% and 70% among the tip flow rate measurement values 42 at Pos01 (Q01d < Q1 < Q01c).

[0050] In FIG. 6, next, the measured value replacement unit 24b acquires the reference value 41 (QSc) (the first reference value) corresponding to the upper limit tip flow rate 40 (80%) (the first value) where the measured value Q1 exists, and the reference value 41 (QSd) (the second reference value) corresponding to the lower limit tip flow rate 40 (70%) (the second value) (ST23). Then, the measured value replacement unit 24b calculates the converted value QE1 as a linear function based on the first value, the first reference value, the second value, and the second reference value (QE1 = ((QSc - QSd) / (Q01c - Q01d)) × (Q1 - Q01d) + QSd) (ST24).

[0051] In this way, when the measured value replacement unit 24b determines that the measured value Q1 of the air flow rate in the vacuum suction circuit 12c (the first vacuum suction circuit) of the first component mounting unit 12(1) in the flow rate measurement step (ST3) is between the first value (Q01c) corresponding to the first flow rate (80%) and the second value (Q01d) corresponding to the second flow rate (70%), the conversion value QE1 of the air flow rate in the first vacuum suction circuit is calculated based on the measured value Q1, the first value, the first reference value (QSc) corresponding to the first flow rate, the second value, and the second reference value (QSd) corresponding to the second flow rate. As a result, the individual differences of the vacuum suction circuit 12c connecting the suction nozzle 13 and the vacuum suction source 23 can be excluded, and the air flow rate passing through the vacuum suction circuit 12c can be measured.

[0052] In FIG. 7, in the mounting feasibility determination step (ST4), the mounting feasibility determination unit 33 compares the conversion value QE transmitted from the mounting head 11 with the determination threshold value included in the determination threshold value data 35 to determine the feasibility of mounting the electronic component D by the suction nozzle 13 mounted on the nozzle holder 12a (ST5: mounting feasibility determination step). When it is determined that mounting is not possible (No in ST5), the mounting feasibility determination unit 33 causes the touch panel 20 to display a warning indicating that the electronic component D held by the suction nozzle 13 cannot be mounted (ST6: warning step).

[0053] When it is determined that mounting is possible (Yes in ST5), the mounting control unit 32 mounts the electronic component D vacuum-sucked by the suction nozzle 13 of the mounting head 11 at the mounting position of the substrate P (ST7: electronic component mounting step). Then, until the mounting of all the electronic components D on the substrate P is completed (No in ST8), the electronic component suction step (ST2) to the electronic component mounting step (ST7) are repeatedly executed.

[0054] As described above, the electronic component mounting apparatus 2 of the present embodiment includes a flow rate sensor 22 disposed in a vacuum suction circuit 12c that connects a nozzle holder 12a to which a suction nozzle 13 is attached and a vacuum suction source 23, a flow rate measurement unit 25 that measures the flow rate of air sucked from the suction nozzle 13 attached to the nozzle holder 12a and passing through the vacuum suction circuit 12c by the flow rate sensor 22, and a measurement value replacement unit 24b that replaces the measured value Q obtained by the flow rate measurement unit 25 with a conversion value QE based on a reference value 41 calculated from the measured values Q (tip flow rate measurement values 42) of the air flow rates in the plurality of vacuum suction circuits 12c provided in the mounting head 11. Thereby, it is possible to measure the flow rate of air passing through the vacuum suction circuit 12c while excluding the individual differences of the vacuum suction circuits 12c.

[0055] In addition, although the above has been described with the configuration in which the reference value calculation unit 24a is provided in the mounting head 11, it is not limited to this configuration. For example, the reference value calculation unit 24a may be any of a configuration provided in the control device 30 of the electronic component mounting apparatus 2, a configuration provided in the management computer 4 connected to the electronic component mounting apparatus 2 via the communication network 3, and a configuration provided in the cloud on the Internet.

[0056] Also, although the above has described an example in which the reference value 41 and the tip flow rate measurement value 42 are stored in the head storage unit 26 in a table format and the measured value Q is converted into the conversion value QE by a linear function based on the reference value 41 and the tip flow rate measurement value 42, the method of converting the measured value Q into the conversion value QE is not limited to this method. For example, an approximation function with the measured value Q as an independent variable may be derived for each component mounting unit 12(N) from the reference value 41 and the tip flow rate measurement value 42 for each component mounting unit 12(N), and the measured value Q may be converted into the conversion value QE using this approximation function.

Industrial Applicability

[0057] The method for mounting electronic components, the program for mounting electronic components, and the apparatus for mounting electronic components according to the present invention have an effect that the individual differences of the vacuum suction circuits connecting the suction nozzles and the vacuum suction source can be excluded and the flow rate of the air passing through the vacuum suction circuits can be measured, and are useful in the field of mounting electronic components on a substrate.

Explanation of Signs

[0058] 2 Apparatus for mounting electronic components 11 Mounting head 12a Nozzle holder 12c Vacuum suction circuit 13 Suction nozzle 22 Flow rate sensor 23 Vacuum suction source D Electronic component P Substrate Q Measured value QE Conversion value

Claims

1. An electronic component mounting method for picking up an electronic component by vacuum suction with a plurality of suction nozzles mounted on a mounting head and mounting the electronic component on a substrate, comprising: a flow rate measurement step of measuring the flow rate of air sucked from a suction nozzle mounted on the nozzle holder and passing through the vacuum suction circuit by a flow rate sensor disposed in a vacuum suction circuit connecting the nozzle holder to which the suction nozzle is mounted and a vacuum suction source; a measurement value replacement step of replacing the measurement value obtained in the flow rate measurement step with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head.

2. The electronic component mounting method according to claim 1, wherein the reference value is an average value of measurement values of the flow rates of air in the plurality of vacuum suction circuits.

3. The electronic component mounting method according to claim 2, wherein the measurement value of the flow rate of air in the vacuum suction circuit when calculating the reference value is the measurement value of the flow rate of air in the vacuum suction circuit in a state where the amount of air flowing in from the nozzle holder is limited to a predetermined flow rate.

4. When the conversion value in the first vacuum suction circuit among the plurality of vacuum suction circuits is a value between a first value corresponding to a first flow rate and a second value corresponding to a second flow rate of the measurement value of the flow rate of air in the first vacuum suction circuit in the flow rate measurement step, The electronic component mounting method according to claim 1, which is calculated based on the measurement value, the first value, the first reference value corresponding to the first flow rate, the second value, and the second reference value corresponding to the second flow rate.

5. The electronic component mounting method according to claim 4, wherein the conversion value in the first vacuum suction circuit is calculated by a linear function based on the first value, the first reference value, the second value, and the second reference value.

6. The electronic component mounting method according to claim 1, further comprising a mounting feasibility determination step of determining the feasibility of mounting an electronic component by a suction nozzle mounted on the nozzle holder by comparing the conversion value obtained in the measurement value replacement step with a determination threshold value.

7. An electronic component mounting program for causing a computer to execute an electronic component mounting method for picking up an electronic component by vacuum suction with a plurality of suction nozzles mounted on a mounting head and mounting the electronic component on a substrate, comprising: A flow measurement step of measuring the flow rate of air sucked from a suction nozzle mounted on the nozzle holder and passing through the vacuum suction circuit by a flow sensor disposed in the vacuum suction circuit connecting the nozzle holder to which the suction nozzle is mounted and a vacuum suction source; A measurement value replacement step of replacing the measurement value obtained in the flow measurement step with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head, the electronic component mounting program including the above.

8. The electronic component mounting program according to claim 7, further including a mounting feasibility determination step of determining the feasibility of mounting an electronic component by the suction nozzle mounted on the nozzle holder by comparing the conversion value obtained in the measurement value replacement step with a determination threshold value.

9. An electronic component mounting apparatus that picks up an electronic component by vacuum suction with a plurality of suction nozzles mounted on a mounting head and mounts the electronic component on a substrate, A flow sensor disposed in a vacuum suction circuit connecting a nozzle holder to which a suction nozzle is mounted and a vacuum suction source; A flow measurement unit that measures the flow rate of air sucked from a suction nozzle mounted on the nozzle holder and passing through the vacuum suction circuit by the flow sensor; An electronic component mounting apparatus including a measurement value replacement unit that replaces the measurement value obtained by the flow measurement unit with a conversion value based on a reference value calculated from the measurement values of the flow rates of air in the plurality of vacuum suction circuits provided in the mounting head.

10. The electronic component mounting apparatus according to claim 9, wherein the flow sensor, the flow measurement unit, and the measurement value replacement unit are provided in the mounting head.

11. The electronic component mounting apparatus according to claim 9, further comprising a mounting feasibility determination unit that determines the feasibility of mounting an electronic component by the suction nozzle mounted on the nozzle holder by comparing the conversion value obtained by the measurement value replacement unit with a determination threshold value.

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