Antenna and transmitting / receiving module

Abstract

To provide an antenna that is provided inside a frame, and improves cooling performance without increasing the size of a liquid cooling structure having a coolant flow path.SOLUTION: An antenna 1 of the present disclosure includes a transmitting / receiving module 4 equipped with an electronic component 5 that generates high heat, a heat storage material 13 thermally connected to the electronic component 5, and a frame 2 thermally connected to the electronic component 5 and having a liquid cooling structure therein consisting of a flow path for a coolant 8. The heat storage material 13 is a latent heat storage material that absorbs heat when it changes phase from a solid state to a liquid state.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to an antenna and a transceiver module provided in the antenna.

Background Art

[0002] As a conventional antenna, Patent Document 1 discloses an antenna including a block on which a plurality of transceiver modules are mounted and a front plate having a plurality of refrigerant flow paths therein, each of the blocks having a heat spreader closely disposed on the back surface of the front plate. In the antenna of Patent Document 1, heat generated in the transceiver module is thermally transported to the refrigerant through the heat spreader and the front plate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described conventional antenna, in order to improve the cooling performance, the liquid cooling structure constituting the refrigerant flow path has to be enlarged.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide an antenna that improves the cooling performance without enlarging the liquid cooling structure.

Means for Solving the Problems

[0006] The antenna of the present disclosure includes a transceiver module on which electronic components are mounted, a heat storage material thermally connected to the electronic components, and a frame thermally connected to the electronic components and having a refrigerant flow path therein.

Effects of the Invention

[0007] The antenna of the present disclosure can improve the cooling performance without increasing the size of the liquid cooling structure.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals are given to the same components in the drawings, and their names and functions are also the same or similar. Therefore, detailed descriptions thereof may be omitted.

[0010] The phased array antenna may perform an operation of radiating high-power radio waves in a short time with respect to the normal transmission state (hereinafter referred to as "special mode"). At this time, the electronic components and the substrate, which are components of the phased array antenna, become hot.

[0011] The normal transmission state is, for example, the transmission state when monitoring a wide area. The special mode is, for example, the transmission state used when performing tracking after a target is detected by a radar device equipped with an antenna. In the special mode, for example, a transmission signal with a higher duty ratio than the normal transmission state is used. Also, the special mode is short compared to the normal transmission state and may be used repeatedly.

[0012] Here, generally, a phased array antenna has a liquid cooling structure with a refrigerant flow path inside to prevent the components from exceeding the rated temperature. However, in the above-mentioned special mode, to improve the cooling performance so that the components do not exceed the rated temperature, it is necessary to increase the refrigerant flow rate or expand the refrigerant flow path to enlarge the liquid cooling structure, or expand the heat transfer area between the components and the liquid cooling structure. As a result, it has become difficult to achieve both an improvement in the cooling performance of the antenna and miniaturization or weight reduction. The antenna of the present disclosure improves the cooling performance without enlarging the liquid cooling structure.

[0013] Embodiment 1. The configuration of the antenna 1 in Embodiment 1 will be described with reference to FIG. 1. FIG. 1 is a diagram showing the structure of the antenna 1. The antenna 1 includes a frame 2 having a refrigerant flow path inside and a block 3. A plurality of transceiver modules 4 are mounted on the block 3. The antenna 1 also includes a heat storage structure 10 shown in FIG. 2.

[0014] The antenna 1 also has an element power supply layer (not shown) having a plurality of antenna elements electrically connected to the plurality of transceiver modules 4 respectively. The element power supply layer is provided on the side of the frame 2 opposite to the side where the transceiver module 4 is attached. The transceiver module 4 transmits and receives radio waves through the antenna elements of the element power supply layer.

[0015] FIG. 2 is a longitudinal sectional view of the frame 2 and the transceiver module 4 in Embodiment 1. A liquid cooling structure containing a refrigerant 8 is formed inside the frame 2.

[0016] The transmission / reception module 4 has a shape with one end face standing upright, and the standing face is thermally connected to the frame 2. Electronic components 5 are attached to the transmission / reception module 4 via a substrate 6. Further, a heat spreader 7 may be attached to or integrally formed on the face of the substrate 6 that contacts the transmission / reception module 4.

[0017] The electronic components 5 generate heat during the operation of the antenna 1 and are components that generate high heat particularly in a special mode. The electronic components 5 are thermally connected to the frame 2, the transmission / reception module 4, the substrate 6, and the heat storage structure 10, and the substrate 6 also becomes high temperature with the heat generation of the electronic components 5.

[0018] The heat storage structure 10 is provided between the standing face of the transmission / reception module 4 and the electronic components 5. The heat storage structure 10 is thermally connected to each structure of the frame 2, the transmission / reception module 4, the electronic components 5, and the substrate 6. Also, as shown by the arrow A in FIG. 2, the heat generated by the electronic components 5 is transmitted to the substrate 6. The heat transmitted to the substrate 6 is transmitted to the refrigerant 8 and the heat storage structure 10 and dissipated into the air.

[0019] Note that the shape and size of the heat spreader 7 are not limited to those shown in FIG. 2. For example, the heat spreader 7 may have an L-shaped form and be provided so as to contact the face where the frame 2 and the transmission / reception module 4 contact and the substrate 6.

[0020] FIG. 3 is a view showing the dashed line part in FIG. 2. The heat storage structure 10 has a structure in which a reusable heat storage material 13 is sandwiched and held between a thin sheet metal 11a and a sheet metal 11b that faces the sheet metal 11a and is fixed via a packing 12. The sheet metal 11a is bent in accordance with the outer shape of the heat storage material 13 in the solid phase state. Also, the sheet metals 11a and 11b are fixed to the transmission / reception module 4 by screws 14. Through this structure, the heat storage material 13 is thermally connected to the electronic components 5.

[0021] The heat storage material 13 is made of, for example, a paraffin-based material. When it receives heat and reaches the phase transition temperature, it changes from a solid state to a liquid state and absorbs heat. Further, the heat storage material 13 has the characteristic of returning to the solid state again by radiating the absorbed heat to the outside. By being sandwiched between the sheet metals 11a and 11b and the packing 12, the heat storage material 13 can repeatedly expand and contract without leaking outside the heat storage structure 10.

[0022] Note that the shapes of the sheet metals 11a and 11b only need to be able to enclose the heat storage material 13 and are not limited to those described above. Also, although part of the heat may return to the transmission / reception module 4 when the heat storage material 13 returns to the solid phase, damage to the electronic component can be avoided by designing such that the phase change of the heat storage material 13 occurs below the specified temperature of the electronic component 5.

[0023] Subsequently, the operation of the antenna 1 will be described. When the electronic component 5 generates heat, the heat is transmitted to the substrate 6. The heat transmitted to the substrate 6 is transmitted to the refrigerant 8 and the heat storage structure 10 and radiated into the air. Here, when the antenna 1 operates in a special mode, the electronic component 5 temporarily generates a large amount of heat, and the amount of heat transmitted to the refrigerant 8 and the heat storage structure 10 increases. Then, when the heat storage material 13 of the heat storage structure 10 reaches the phase transition temperature, the heat storage material 13 changes from a solid state to a liquid state and absorbs heat while keeping the temperature of the electronic component 5 constant. When the antenna 1 finishes the special mode, the amount of heat generated from the electronic component 5 decreases, and the heat storage material 13 returns to the solid state.

[0024] FIG. 4 is a diagram showing an example of the heat dissipation path of the antenna 1. As shown in FIG. 4, for example, heat is radiated into the air from the block 3 toward the side opposite to the frame 2.

[0025] In this way, the antenna 1 including the transmission / reception module 4 on which the electronic component 5 is mounted, the heat storage material 13 thermally connected to the electronic component 5, and the frame 2 thermally connected to the electronic component 5 and having a liquid cooling structure formed by a flow path of the refrigerant 8 allows the heat generated by the electronic component 5 to be transferred to the heat storage material 13 and the refrigerant 8 and dissipated to the outside air. Since the heat in the heat transfer path between the electronic component 5 and the refrigerant 8 is absorbed by the heat storage material 13, the amount of heat that needs to be absorbed by the liquid cooling structure to prevent the electronic component 5 from exceeding the rated temperature can be reduced compared to the case where only the refrigerant 8 absorbs heat.

[0026] As described above, the frame 2 electrically connects the plurality of transmission / reception modules 4 and the element power supply layer and absorbs the heat of the plurality of transmission / reception modules 4 by the refrigerant 8. Therefore, conventionally, in order to cool the heat generation amount of the electronic component 5 attached to each transmission / reception module 4, it has been necessary to increase the flow rate of the refrigerant or expand the flow path of the refrigerant to enlarge the liquid cooling structure. On the other hand, since the antenna 1 can absorb heat by the heat storage material 13, the cooling performance is improved compared to an antenna having a liquid cooling structure of the same scale. That is, the antenna 1 has the effect of improving the cooling performance without enlarging the liquid cooling structure.

[0027] Furthermore, since the heat storage material 13 returns to the liquid phase state again by dissipating heat after changing from the solid phase state to the liquid phase state, repeated cooling becomes possible. That is, even when the electronic component 5 repeatedly enters a high heat generation state by repeating a special mode, the antenna 1 can cool the electronic component 5 so that it does not exceed the rated temperature. That is, even in the antenna 1 that repeatedly uses a special mode that operates for a short time with respect to the normal transmission state, it can operate without enlarging the liquid cooling structure.

[0028] Note that the heat storage structure 10 only needs to be thermally connected to the electronic component 5, and the mounting position is not limited to the one described above. FIG. 5 is a diagram showing the structure of a modification of the first embodiment. As shown in FIG. 5, the heat storage structure 10 may be attached to the side opposite to the electronic component 5 with respect to the transmission / reception module 4. Even in this case, as described above, the antenna 1 has the effect of improving the cooling performance without enlarging the liquid cooling structure.

[0029] Also, as shown in FIG. 1, on the side of the transmission / reception module 4 opposite to the frame 2, it is in contact with the outside air outside the antenna 1. Therefore, as shown in FIG. 5, when the heat storage structure 10 is attached to the transmission / reception module 4 on the side opposite to the electronic component 5, or when it is attached to the side opposite to the frame 2 with respect to the electronic component 5, the heat storage structure 10 and the outside air outside the antenna 1 come closer. As a result, in addition to radiating heat to the frame 2, heat can be efficiently radiated to the atmosphere through the path indicated by the arrow B in FIG. 5.

[0030] In addition to the configuration shown in FIG. 5, even when the heat storage structure 10 is on the same surface as the electronic component 5 in the transmission / reception module 4 and is attached to the side opposite to the frame 2 with respect to the electronic component 5, it can radiate heat to the atmosphere efficiently in the same manner as the configuration shown in FIG. 5.

[0031] In addition, in order to enable efficient heat radiation from the heat storage structure 10 to the outside air, the periphery of the substrate 6 may be configured considering convection. In this case, for example, a gap is provided between the substrate 6 and other components other than the transmission / reception module 4, and the gap is configured such that air can convect. As a result, the hot air near the heat storage material 13 convects, and the heat dissipation performance can be improved.

[0032] Embodiment 2. The antenna 1b in Embodiment 2 will be described. The antenna 1b includes a heat storage material 20 instead of the heat storage structure 10. Other structures are the same as those of the antenna 1.

[0033] FIG. 6 is a longitudinal sectional view of the frame 2 and the transmission / reception module 4 in Embodiment 1. In FIG. 6, the same reference numerals as those in FIG. 2 indicate the same or corresponding parts. As shown in FIG. 5, in the antenna 1b, a heat storage sheet 20 is attached to the electronic component 5.

[0034] FIG. 7 is a diagram showing the structure of the heat storage sheet 20. The heat storage sheet 20 has a compound structure in which the capsule-shaped heat storage material 22 is contained in the filler 21. The heat storage material 22 undergoes a phase change from a solid state to a liquid state, similar to the heat storage material 13. Further, even when the heat storage material 22 changes to the liquid state, the heat storage material 22 remains within the heat storage sheet 20 without leaking from the capsule.

[0035] Also, the heat storage sheet 20 may be brought into contact with other components and heat transfer may be performed by bringing the surface not in contact with the electronic component 5 into contact with other components. In this case, the other component is, for example, the cover which is the block 3 or the metal chassis. Thereby, the heat absorbed by the heat storage sheet 20 can be efficiently released to the outside air.

[0036] The heat storage sheet 20 may be brought into contact with the electronic component 5 via a heat dissipation sheet or heat dissipation grease.

[0037] Alternatively, the heat storage sheet 20 may be attached so as to contact the substrate 4 and the electronic component 5, that is, so as to cover the electronic component 5. In this case, the contact area between the heat storage sheet 20 and the electronic component 5 becomes larger than in the case shown in FIG. 6.

[0038] Next, the operation of the antenna 1b will be described. In FIG. 6, as shown by the arrow C, when the electronic component 5 generates heat, the heat is transmitted to the substrate 6. The heat transmitted to the substrate 6 is transmitted to the refrigerant 8 and released into the air. At the same time, as shown by the arrow D in FIG. 6, the heat generated by the electronic component 5 is transmitted to the heat storage sheet 20. The heat transmitted to the heat storage sheet 20 is released into the air.

[0039] Here, when the antenna 1b operates in a special mode, the electronic component 5 temporarily generates a large amount of heat, and the amount of heat transmitted to the refrigerant 8 and the heat storage sheet 20 increases. Thereafter, when the heat storage material 22 reaches the phase transition temperature, the heat storage material 22 changes from the solid state to the liquid state and absorbs heat while maintaining a constant temperature. When the antenna 1b finishes the special mode, the amount of heat generated from the electronic component 5 decreases, and the heat storage material 22 returns to the solid state.

[0040] Even in the case of the antenna 1b configured as described above, similar to the antenna 1, the heat generated in the electronic component 5 is transmitted to the heat storage material 22 and dissipated to the outside air. Therefore, compared with the case of absorbing heat only by the refrigerant 8, the amount of heat that should be absorbed by the liquid cooling structure can be reduced so that the electronic component 5 does not exceed the rated temperature.

[0041] Further, since the antenna 1b can absorb heat by the heat storage material 22, the cooling performance is improved compared with an antenna having a liquid cooling structure of the same scale. That is, the antenna 1b has the effect of improving the cooling performance without increasing the size of the liquid cooling structure.

[0042] In addition, the heat storage material 22 of the antenna 1b has a smaller and lighter structure compared with the case of using the sheet metal 11 as in the heat storage structure 10 of the first embodiment, and can improve the cooling performance.

[0043] In addition, in each of the above-described embodiments described in this specification, the relative arrangement relationship of each component may be described, but these are all examples in all aspects, and are not limited to those in which each embodiment is described. Therefore, an infinite number of variations that are not illustrated are assumed within the scope of each embodiment. For example, when any component is deformed, added, or omitted, and further, when at least one component in at least one embodiment is extracted and combined with the components of other embodiments. That is, it is possible to freely combine each embodiment, or to appropriately deform or omit each embodiment.

[0044] Also, as long as there is no contradiction, the components described as being provided with "one" in each of the above embodiments may be provided with "one or more". Further, each component is a conceptual unit, and includes a case where one component is composed of a plurality of structures, and a case where one component corresponds to a part of a certain structure.

[0045] Hereinafter, various aspects of the present disclosure will be collectively listed as appendices.

[0046] (Supplementary Note 1) A transceiver module mounted with electronic components, A latent heat storage material thermally connected to the electronic components, A frame thermally connected to the electronic components and having a liquid cooling structure formed by a refrigerant flow path inside, An antenna comprising the above. (Supplementary Note 2) The latent heat storage material is attached between the heat transfer path from the electronic components to the frame, The antenna according to Supplementary Note 1. (Supplementary Note 3) The latent heat storage material, Is sandwiched between a first sheet metal and a second sheet metal facing the first sheet metal and fixed via a packing, The antenna according to Supplementary Note 1 or 2. (Supplementary Note 4) The latent heat storage material is included in a heat storage sheet attached so as to contact the electronic components, The antenna according to Supplementary Note 1 or 2. (Supplementary Note 5) The latent heat storage material is included in a capsule and forms a compound structure, the transceiver module according to Supplementary Note 4. (Supplementary Note 6) Electronic components, The electronic components, and a latent heat storage material thermally connected to a frame having a liquid cooling structure formed by a refrigerant flow path inside, A transceiver module comprising the above.

Explanation of Reference Numerals

[0047] 1, 1b, Antenna, 2 Frame, 3 Block, 4 Transceiver module, 5 Electronic components, 6 Substrate, 7 Heat spreader, 8 Refrigerant, 10 Heat storage structure, 11a, 11b, Sheet metal, 12 Packing, 13 Heat storage material, 14 Screw, 20 Heat storage sheet, 21 Filler, 22 Heat storage material

Claims

1. A transmitting and receiving module on which electronic components are mounted, A latent heat storage material thermally connected to the electronic components, A frame that is thermally connected to the electronic components and has a liquid cooling structure formed by a refrigerant flow path inside, and an antenna comprising the same.

2. The latent heat storage material is attached between the heat transfer path from the electronic components to the frame, The antenna according to claim 1.

3. The latent heat storage material, is sandwiched between a first sheet metal and a second sheet metal facing the first sheet metal and fixed via a packing, The antenna according to claim 1.

4. The latent heat storage material is included in a heat storage sheet attached so as to be in contact with the electronic components, The antenna according to claim 1.

5. The latent heat storage material is included in a capsule shape to form a compound structure, the transmitting and receiving module according to claim 4.

6. Electronic components, A latent heat storage material thermally connected to the electronic components and a frame having a liquid cooling structure formed by a refrigerant flow path inside, and a transmitting and receiving module comprising the same.

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