Semiconductor module and method for manufacturing semiconductor module

Abstract

To provide a semiconductor module which is reduced in the size and the height.SOLUTION: A semiconductor module 1 includes a substrate 10 having a wiring part 12 formed on at least one surface thereof and a hole part 13 having an opening on at least one surface side, and at least one semiconductor packages 20 and 30 which are arranged on one surface side of the substrate 10, and have a body part 21 sealed with a resin and a plate-like lead part 22 extending outward from the side face of the body part 21, wherein in any one of at least the one semiconductor packages 20 and 30, a part of the body part 21 is inserted into the hole part 13, and the lead part 22 extends along the surface of the substrate 10, and the lower surface of the lead part 21 is joined to the wiring part 12.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a semiconductor module and a method for manufacturing the semiconductor module.

Background Art

[0002] Conventionally, a semiconductor module in which a plurality of semiconductor packages are mounted is known (see, for example, Patent Document 1). As semiconductor packages used in such semiconductor modules, there are an insertion-type semiconductor package having lead portions linearly extending outward from the side surface of the main body portion, and a surface-mount type semiconductor package in which the lead portions are bent in a Z shape or the like midway.

[0003] To mount (bond to a substrate) an insertion-type semiconductor package, for example, the lead portions extending linearly are dipped in molten solder and inserted into through holes provided in the substrate to bond to the substrate. On the other hand, to mount (bond to a substrate) a surface-mount type semiconductor package, for example, the lead portions are arranged on the wiring portion (electrode pads) of the substrate via cream solder or the like and reflowed to bond to the substrate.

[0004] In recent years, with the increase in the number of scenes where electronic components are mounted on both sides of the substrate, the surface-mount type that can be mounted on both sides of the substrate has become the mainstream. However, there is still a situation where insertion-type semiconductor packages are still used, and insertion-type semiconductor packages are often used.

[0005] As a semiconductor module using an insertion-type semiconductor package, for example, the following semiconductor modules are known (conventional first semiconductor module 900).

[0006] As shown in FIG. 8, a conventional first semiconductor module 900 includes a substrate 910 having a wiring portion 912 formed on one surface and through holes 914, two semiconductor packages 920 and 930 having resin-sealed main body portions 921 and 931 and lead portions 922 and 932 extending outward from the side surfaces of the main body portions 921 and 931, and another semiconductor package 940. The two semiconductor packages 920 and 930 are insertion-type semiconductor packages, and the other semiconductor package 940 is a surface-mount type semiconductor package.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] However, in the above prior art, since the lead portions of the insertion-type semiconductor packages are arranged perpendicular to the surface of the substrate, there is a problem that it is difficult to make the semiconductor module smaller and thinner.

[0009] In the technical field of semiconductor modules, there is a demand for smaller and thinner semiconductor modules. However, even when the lead portions of the insertion-type semiconductor packages are extended along the surface of the substrate instead of being perpendicular to the surface of the substrate, since the lead portions are bent and mounted horizontally (see FIG. 9), it is impossible to make the semiconductor module thinner than the thickness of the semiconductor package, and there is a problem that it is difficult to make the semiconductor module smaller and thinner.

[0010] In addition, when using a common heat sink fin for two semiconductor packages, in order to adjust the mounting height from the substrate to the same height, it is necessary to insert a spacer between the semiconductor package and the substrate (see FIGS. 9 to 12), or process the heat sink fin (see the heat sink fin 950a in FIGS. 10 to 12), which makes it even more difficult to achieve a smaller and lower-profile semiconductor module.

[0011] Therefore, the present invention has been made in view of the above circumstances, and an object thereof is to provide a smaller and lower-profile semiconductor module.

Means for Solving the Problems

[0012] The semiconductor module of the present invention includes a substrate having a wiring portion formed on at least one surface and a hole portion having an opening formed on at least the one surface side of the substrate, and at least one semiconductor package disposed on the one surface side of the substrate and resin-sealed, and having a plate-like lead portion extending outward from a side surface of the main body portion. In any one of the at least one semiconductor package, a part of the main body portion is inserted into the hole portion, the lead portion extends at a height position along the surface of the substrate, and a lower surface of the lead portion is joined to the wiring portion.

Effects of the Invention

[0013] According to the semiconductor module of the present invention, since it includes a substrate having a hole portion with an opening formed on at least one surface side, and in any one of the at least one semiconductor package, a part of the main body portion is inserted into the hole portion, the lead portion extends at a height position along the surface of the substrate, and the lower surface of the lead portion is joined to the wiring portion, it is possible to join the lower surface of the lead portion and the wiring without bending the lead portion of the insert-type semiconductor package.

[0014] Also, according to the semiconductor module of the present invention, in any one of at least one semiconductor package, since a part of the main body is inserted into the hole, the height can be made lower than the thickness of the semiconductor package, and a semiconductor module that is miniaturized and has a reduced height can be obtained.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

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Figure 8

Figure 9

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Figure 13

Embodiments for Carrying Out the Invention

[0016] Hereinafter, the semiconductor module and the method of manufacturing the semiconductor module of the present invention will be described based on the embodiments shown in the drawings. Note that the embodiments described below do not limit the invention according to the claims. Also, not all of the various elements and combinations thereof described in the embodiments are essential for the solution means of the present invention.

[0017] [Embodiment 1] 1. Configuration of Semiconductor Module 1 According to Embodiment 1 As shown in FIG. 1, the semiconductor module 1 according to Embodiment 1 includes a substrate 10, two semiconductor packages (a rectifying semiconductor package 20 and a control semiconductor package 30), another semiconductor package 40, and heat dissipation fins 50.

[0018] The substrate 10 has an insulating substrate 11, a wiring portion 12, and a hole portion 13. As the substrate 10, for example, a printed circuit board can be used, but a ceramic substrate or other appropriate wiring substrate can also be used.

[0019] The insulating substrate 11 is, for example, an insulating substrate made of a glass epoxy resin, but may also be an insulating substrate made of ceramic or other appropriate insulating substrates. The wiring portion 12 is a circuit, land, or electrode pad formed on one surface of the insulating substrate 11, for example, with copper foil. A solder resist is formed around the wiring portion 12. The hole portion 13 is a through hole having openings on both the one surface side and the other surface side of the insulating substrate 11, and has an opening corresponding to the convex portion 23 of the rectifying semiconductor package 20.

[0020] The semiconductor package 20 for rectification is disposed on one surface side of the substrate 10. As shown in FIGS. 1 and 2, the semiconductor package 20 for rectification is a so-called insertion type semiconductor package having a main body portion 21 and lead portions 22. The semiconductor package 20 for rectification is for, for example, full-wave rectifying the alternating current of a commercial power supply to make it pulsating current, and inside, for example, a bridge diode is configured.

[0021] The main body portion 21 has a convex portion 23 that appears to be substantially L-shaped when viewed from the side. This convex portion 23 is formed so as to protrude toward the substrate side with reference to the height position of the substrate facing surface 24 where the main body portion 21 faces the substrate (see FIGS. 1 and 2(a)). Here, when the substrate facing surface 24 shown in FIG. 1 comes into contact with the substrate 11, the substrate facing surface can also be referred to as the substrate contact surface. Further, on the side of the main body portion 21 opposite to the substrate side, a heat sink mounting surface 25 for mounting the heat sink 50 is formed. That is, in FIGS. 1 and 2(a), the main body portion 21 has the substrate facing surface 24 and the heat sink mounting surface 25 facing each other.

[0022] As shown in FIG. 1, the main body portion 21 is disposed on one surface side of the substrate 10 in a state where the substrate contact surface 24 is in contact with the substrate 10 and a convex portion 23 that is a part of the main body portion 21 is inserted into the hole portion 13. Therefore, no spacer is disposed between the main body portion 21 and the substrate 10. Note that the tip of the convex portion 23 may pass through the hole portion 13 and protrude to the opposite side of the substrate, or may remain in the hole portion 13.

[0023] The lead portion 22 is a plate-like member that extends outward from the side surface (the intermediate position of the side surface) of the main body portion 21. In Embodiment 1, four lead portions 22 extend at a predetermined interval (see FIG. 2(b)). As shown in FIG. 1, the lead portion 22 extends horizontally at a height position along the surface of the substrate 10 and is not bent. The lower surface of the lead portion 22 is joined to the wiring portion 12 via a conductive bonding material (for example, solder). Note that the substrate contact surface 24 and the lower surface of the lead portion are at the same height position, but even if they are at different height positions, the height positions can be made the same by adjusting the depth of the hole portion or the like.

[0024] The lead portion 22 protrudes from the main body portion 21 at a position separated by a predetermined height or more from the height position of the heat radiation fin mounting surface 25. This is because it is necessary to set the height position such that an insulation distance from the heat radiation fin 50 when the heat radiation fin 50 is disposed can be ensured.

[0025] As shown in FIG. 2(c), an inner lead 27, a semiconductor chip 28, and a connection member 29 are disposed in the main body portion 21 of the rectifying semiconductor package 20.

[0026] The inner lead 27 has a land on which the semiconductor chip 28 is mounted, and is bent in a crank shape therefrom and connected to the lead portion 22. The semiconductor chip 28 is disposed on the land of the inner lead 27. In the first embodiment, four diodes are disposed to form a bridge diode. The connection member 29 connects an electrode on the side of the semiconductor chip 28 opposite to the inner lead 27 side and the inner lead 27.

[0027] The inner lead 27 in the main body portion 21 is bent in a crank shape from the portion on which the semiconductor chip 28 is mounted and extends to the outside of the sealing resin to become the lead portion 22 (outer lead). Therefore, since it is necessary to cover the inner lead 27, particularly the portion bent in a crank shape, with a sufficient amount of sealing resin to insulate it from the outside, a convex portion 23 protruding from the main body portion 21 is formed. Accordingly, the lead portion 22 protrudes from the main body portion 21 at an intermediate position on the side surface of the main body portion 21 on the side where the convex portion 23 is formed.

[0028] As shown in FIG. 1, the control semiconductor package 30 is a so-called surface mount type semiconductor package having a main body portion 31 and a lead portion 32. The control semiconductor package 30 controls the drive of an electric motor such as an external motor.

[0029] The main body portion 31 is resin-sealed in a substantially rectangular parallelepiped shape. The lead portion 32 extends outward from the side surface of the main body portion 31 and is bent midway into a crank shape or a gull-wing shape. The tip portion of the lead portion 32 is disposed on the wiring portion 12 and is joined to the wiring portion 12 via a conductive bonding material (e.g., solder).

[0030] In the control semiconductor package 30, a heat sink mounting surface 35 for mounting the heat sink 50 is formed on the side opposite to the substrate side. The height position of the heat sink mounting surface 25 of the rectifying semiconductor package 20 and the height position of the heat sink mounting surface 35 of the control semiconductor package 30 are at the same height position. More specifically, the height from the height position of the substrate contact surface 24 (the lower surface of the lead portion 22) of the rectifying semiconductor package 20 to the height position of the heat sink mounting surface 25 is equal to the height from the height position of the lowermost surface of the lead portion 32 of the control semiconductor package 30 to the height position of the heat sink mounting surface 35.

[0031] The other semiconductor package 40 is a so-called surface-mount type semiconductor package and is disposed on the substrate 10. Note that electronic components such as capacitors are mounted on the substrate, and basically they are surface-mount type components.

[0032] The heat sink 50 is disposed across the rectifying semiconductor package 20 and the control semiconductor package 30. The heat sink 50 is a shared heat sink for the rectifying semiconductor package 20 and the control semiconductor package 30.

[0033] 2. Effects of the semiconductor module 1 according to Embodiment 1 According to the semiconductor module 1 according to Embodiment 1, a substrate 10 having a hole portion 13 with an opening formed on at least one surface side is provided. In any one of at least one semiconductor package, a part of the main body portion 21 is inserted into the hole portion 13, and the lead portion 22 extends horizontally at a height position along the surface of the substrate 10. Since the lower surface of the lead portion 22 is joined to the wiring portion 12, the lower surface of the lead portion 22 and the wiring portion 12 can be joined without bending the lead portion 22 of the insertion-type semiconductor package 20.

[0034] Also, according to the semiconductor module 1 according to Embodiment 1, in any one of at least one semiconductor package, a part of the main body portion 21 is inserted into the hole portion 13, so that the height can be made lower than the thickness of the semiconductor package 20, and a semiconductor module that is miniaturized and has a reduced height can be obtained.

[0035] Also, according to the semiconductor module 1 according to Embodiment 1, the main body portion 21 has a substrate facing surface 24 that contacts or faces the substrate 10, and a convex portion 23 that protrudes toward the substrate 10 with reference to the height position of the substrate facing surface 24. Since a part of the main body portion 21 is the convex portion 23, the convex portion 23 can be inserted into the hole portion 13, the lead portion 22 can be extended horizontally at a height position along the surface of the substrate 10, and the lower surface of the lead portion 22 can be joined to the wiring portion 12. Therefore, the lower surface of the lead portion 22 and the wiring portion 12 can be joined without bending the lead portion 22 of the insertion-type semiconductor package. Furthermore, although it is an insertion-type semiconductor package, it can be joined to the substrate 10 by reflowing like a surface-mount type semiconductor package, and it is not necessary to perform the surface-mount type semiconductor package and the insertion-type semiconductor package separately, and the working process becomes simple.

[0036] Also, according to the semiconductor module 1 according to Embodiment 1, even when a common heat sink fin 50 is used for two or more semiconductor packages, by adjusting the depth of the hole portion, a spacer can be inserted between the rectifying semiconductor package 20 and the substrate 10, or the heat sink fin can be processed without having to do so. The mounting height of the semiconductor package 20 from the substrate 10 can be made uniform. Therefore, it is possible to obtain a semiconductor module that is miniaturized and has a low profile.

[0037] By the way, in an insert type semiconductor package, lead portions extend from the side surface of the main body portion, and when mounted on a substrate in an upright state, the mounting height becomes high (see the semiconductor package 920 in FIG. 8. Conventional first semiconductor module 900). Also, in this case, a common heat sink fin cannot be placed on two semiconductor packages. Therefore, the mounting height is reduced by bending the lead portions into an L shape and arranging them horizontally (see the semiconductor package 930 in FIG. 9. See the conventional second semiconductor module 901).

[0038] However, since the rectifying semiconductor package 920 and the control semiconductor package 930 are greatly different in both role and components, they also differ in thickness and thus in mounting height. Therefore, in order to place a common heat sink fin 950, spacers 960 and 970 are inserted between the semiconductor packages 920 and 930 and the substrate 910 to adjust the mounting height and place the common heat sink fin 950 (see FIG. 9. Conventional second semiconductor module 901), or the heat sink fin is processed to compensate for the difference in mounting height by protruding a part of the heat sink fin (see the heat sink fin 950a in FIG. 10. See the conventional third semiconductor module 902).

[0039] This means that even when one of the two semiconductor packages (the control semiconductor package 930 in FIG. 11) is a surface-mounted semiconductor package and the other (the rectifying semiconductor package 920 in FIG. 11) is an insertion-type semiconductor package, adjustments such as inserting a spacer or processing a heat sink fin are required, and it is not possible to simply mount a common heat sink fin (see FIG. 11; see the conventional fourth semiconductor module 903).

[0040] On the other hand, if an attempt is made to bend the lead portion of the insertion-type semiconductor package to make it surface-mounted, the lead portion originally formed as an insertion-type semiconductor package is thick, difficult to bend, and not only does the mounting area increase, but there is also a problem that it is difficult to make a miniaturized semiconductor module.

[0041] In contrast, in the semiconductor module according to Embodiment 1, by setting the heat sink fin mounting surfaces of the two semiconductor packages to the same height, a common heat sink fin can be easily mounted on the two semiconductor packages without inserting a spacer or processing a heat sink fin. Specifically, in FIGS. 1 and 3, the heat sink fin mounting surfaces 25 of the control semiconductor packages 20, 20a and the heat sink fin mounting surfaces 35 of the rectifying semiconductor packages 30, 30a are at the same height with respect to the height position of the upper surface of the insulating substrate 11, so that a common heat sink fin 50 can be easily mounted.

[0042] Further, according to the semiconductor module according to Embodiment 1, since one of the plurality of semiconductor packages is the control semiconductor package 20 and the other of the plurality of semiconductor packages is the rectifying semiconductor package 30, the semiconductor packages of the core part of the semiconductor module can be miniaturized and made low-profile, and miniaturization and low-profile of the entire semiconductor module can be achieved.

[0043] [Embodiment 2] The semiconductor module 2 according to Embodiment 2 basically has the same configuration as the semiconductor module 1 according to Embodiment 1, but is different from the semiconductor module 1 according to Embodiment 1 in that the rectifying semiconductor package is a surface mount type and the control semiconductor package is an insertion type.

[0044] In Embodiment 2, as shown in FIG. 3, the rectifying semiconductor package 20a has a main body portion 21a and lead portions 22a. The main body portion 21a is resin-sealed in a substantially rectangular parallelepiped shape. The lead portions 22a extend outward from the side surface of the main body portion 21a and are bent in a crank shape or a gullwing shape midway. The tip portions of the lead portions 22a are disposed on the wiring portion 12 and joined with a conductive bonding material (e.g., solder).

[0045] As shown in FIGS. 3 and 4, the control semiconductor package 30a has a main body portion 31a and lead portions 32a.

[0046] The main body portion 31a is resin-sealed and has a U-shaped configuration that is open at the bottom when viewed from the side. A substrate contact surface 34 that faces and contacts the substrate 10 is formed near the center of the lower part of the main body portion 31a, and it has two convex portions 33a, 33a that protrude toward the substrate 10 side with reference to the height position of the substrate contact surface 34 at both ends. The convex portions 33a are inserted into the hole portions 13 of the substrate 10. A heat sink mounting surface 35 for mounting the heat sink 50 is formed on the side opposite to the substrate side.

[0047] The main body portion 31a is substantially rectangular when viewed in plan, and convex portions 33a are formed along two opposite sides. For example, four lead portions 32a each extend from the side portions of the side where the convex portions 33a are formed. For example, two through holes 36 for fixing the heat sink 50 are formed along a line passing through the center of the main body portion 31a.

[0048] The lead portion 32a is a plate-like member that extends outward from the side surface of the side where the convex portion 33a is formed in the main body portion 31a. In Embodiment 1, four lead portions extend from each of the two opposing sides. As shown in FIG. 3, when the convex portion 33a is inserted into the hole portion 13, the lead portion 32a is at the height position of the surface of the substrate 10 and extends horizontally at the height position along the surface of the substrate 10. The lower surface of the lead portion 32a is joined to the wiring portion 12 via a conductive bonding material (e.g., solder).

[0049] Thus, the semiconductor module 2 according to Embodiment 2 is different from the semiconductor module 1 according to Embodiment 1 in that the rectifying semiconductor package is a surface-mount type and the control semiconductor package is an insertion type. However, similar to the case of the semiconductor module 1 according to Embodiment 1, it includes a substrate 10 having a hole portion 13 with an opening formed on at least one surface side. In any one of at least one semiconductor package, a part of the main body portion 31a is inserted into the hole portion 13, the lead portion 32a extends horizontally at the height position along the surface of the substrate 10, and since the lower surface of the lead portion 32a is joined to the wiring portion 12, the lower surface of the lead portion 32a and the wiring portion 12 can be joined without bending the lead portion 32a of the insertion-type semiconductor package 30a.

[0050] Also, according to the semiconductor module 2 according to Embodiment 2, in any one of at least one semiconductor package, since a part of the main body portion 31a is inserted into the hole portion 13, the height can be made lower than the thickness of the semiconductor package 30a, and a semiconductor module that is miniaturized and has a lower height can be obtained.

[0051] Note that the semiconductor module 2 according to Embodiment 2 has the same configuration as the semiconductor module 1 according to Embodiment 1 except that the rectifying semiconductor package is a surface-mount type and the control semiconductor package is an insertion type. Therefore, it has the corresponding effects among the effects that the semiconductor module 1 according to Embodiment 1 has.

[0052] [Embodiment 3] The semiconductor module 3 according to Embodiment 3 basically has the same configuration as the semiconductor module 1 according to Embodiment 1, but is different from the semiconductor module 1 according to Embodiment 1 in that both the rectifying semiconductor package and the control semiconductor package are insertion-type semiconductor packages. That is, in Embodiment 3, as shown in FIG. 5, the rectifying semiconductor package is the insertion-type rectifying semiconductor package 20 used in Embodiment 1, and the control semiconductor package is the insertion-type control semiconductor package 30a used in Embodiment 2.

[0053] Thus, the semiconductor module 3 according to Embodiment 3 is different from the case of the semiconductor module 1 according to Embodiment 1 in that both the rectifying semiconductor package and the control semiconductor package are insertion-type semiconductor packages. However, similar to the case of the semiconductor module 1 according to Embodiment 1, it includes a substrate 10 having a hole portion 13 with an opening formed on at least one surface side. In any one of at least one semiconductor package, a part of the main body portions 21, 31a is inserted into the hole portion 13, and the lead portions 22, 32a extend horizontally at a height position along the surface of the substrate 10. Since the lower surfaces of the lead portions 22, 32a are joined to the wiring portion 12, the lower surfaces of the lead portions 22, 32a of the insertion-type semiconductor packages 20, 30a can be joined to the wiring portion 12 without bending the lead portions 22, 32a.

[0054] Further, according to the semiconductor module 3 according to Embodiment 3, in any one of at least one semiconductor package, a part of the main body portions 21, 31a is inserted into the hole portion 13. Therefore, the height can be made lower than the thickness of the semiconductor packages 20, 30a, and a semiconductor module can be made smaller and lower in height.

[0055] Note that the semiconductor module 3 according to Embodiment 3 has the same configuration as the semiconductor module 1 according to Embodiment 1 except that both the rectifying semiconductor package and the control semiconductor package are insertion-type semiconductor packages. Therefore, it has the corresponding effects among the effects that the semiconductor module 1 according to Embodiment 1 has.

[0056] [Embodiment 4] As shown in FIGS. 6 and 7, the semiconductor module 4 according to Embodiment 4 basically has the same configuration as the semiconductor module 1 according to Embodiment 1, but a part of the configuration of the main body portion 31b of the control semiconductor package is different in appearance from that of the semiconductor module 1 according to Embodiment 1. That is, in Embodiment 4, in the control semiconductor package 30b, a part of the shape of the main body portion 31b is not limited to a convex portion. In FIG. 6, the main body portion 31b has a rectangular parallelepiped shape that is resin-sealed, and a part of it is inserted into the hole portion 13.

[0057] A portion below the lower surface of the lead portion 32b in the main body portion 31b of the control semiconductor package 30b is inserted into the hole portion 13 of the substrate 10. In other words, the lower surface of the lead portion 32b of the control semiconductor package 30b is located at the same height position as the substrate facing surface (substrate contact surface) in the rectifying semiconductor package 20, and the entire portion below that height position is inserted into the hole portion 13. Therefore, it can also be said that the lower mold portion below the height position of the lower surface of the lead portion 32b in FIG. 6 corresponds to a part of the main body portion 31b.

[0058] Thus, although the semiconductor module 4 according to Embodiment 4 has a part of the configuration of the main body portion of the control semiconductor package in common with that of the semiconductor module 1 according to Embodiment 1, the difference is that its shape is not a convex portion. It includes a substrate 10 having a hole portion 13 formed with an opening on at least one side. A part of the main body portion 31b is inserted into the hole portion 13, the lead portion 32b extends horizontally at a height position along the surface of the substrate 10, and the lower surface of the lead portion 32b is joined to the wiring portion 12. Therefore, it includes a substrate 10 having a hole portion 13 formed with an opening on at least one side. In any one of at least one semiconductor package, a part of the main body portions 21, 31b is inserted into the hole portion 13, the lead portions 22, 32b extend horizontally at a height position along the surface of the substrate 10, and the lower surfaces of the lead portions 22, 32b are joined to the wiring portion 12. Thus, the lower surfaces of the lead portions 22, 32b of the insert-type semiconductor packages 20, 30b can be joined to the wiring portion 12 without bending the lead portions 22, 32b.

[0059] Also, according to the semiconductor module 4 according to Embodiment 4, in any one of at least one semiconductor package, since a part of the main body parts 21 and 31b is inserted into the hole part 13, it is possible to make the height lower than the thickness of the semiconductor packages 20 and 30b, and a semiconductor module that is miniaturized and has a lower height can be obtained.

[0060] Also, according to the semiconductor module 4 according to Embodiment 4, since the lower mold part is equivalent to a part of the main body part 31b compared to the height position of the lower surface of the lead part 32b, the structure in which the lower surface of the lead part 32b is connected to the wiring part 12 rather than the lead part 32b being inserted into the hole of the substrate 11 can provide a wider connection area, so that the connection resistance can be lowered, and the connection strength can also be increased, so that connection failure can be suppressed even for, for example, vibration.

[0061] Also, according to the semiconductor module 4 according to Embodiment 4, in any one of at least one semiconductor package, since a part of the main body part (the part below the lower surface of the lead part) is inserted into the hole part 13, it is possible to make the height lower than the thickness of the semiconductor package, and a semiconductor module that is miniaturized and has a lower height can be obtained.

[0062] Note that the semiconductor module 4 according to Embodiment 4 has a configuration similar to that of the semiconductor module 1 according to Embodiment 1 except for the configuration of a part of the main body part of the control semiconductor package, and thus has the corresponding effects among the effects that the semiconductor module 1 according to Embodiment 1 has.

[0063] [Embodiment 5] Next, a method for manufacturing a semiconductor module according to Embodiment 5 will be described with reference to FIG. 13. First, prepare a substrate 11 having a hole portion 13 with an opening on at least one side and a wiring portion 12, a first semiconductor package 20 having a plate-shaped first lead portion 22 extending outward from the side surface of the first main body portion 21, and a second semiconductor package 30 having a plate-shaped second lead portion 32 extending outward from the side surface of the second main body portion 31 and including a bent portion 37 that bends toward the substrate 11. Here, the first main body portion 21 and the second main body portion 31 may be encapsulated with resin. Also, in FIG. 13, the first semiconductor package 20 is an insertion type, and the second semiconductor package 30 is a surface mount type.

[0064] Next, insert a convex portion 23, which is a part of the first main body portion 21, into the hole portion 13, and join the lower surface of the first lead portion 22 to the wiring portion 12 on the substrate 11. Similarly, by joining the lower surface of the portion (tip portion) of the second lead portion 32 that extends along the direction parallel to the surface of the substrate 11 to the wiring portion 12 of the substrate 11, the first semiconductor package 20 is connected to the substrate 10, and the second semiconductor package 30 is connected to the substrate 10.

[0065] In the fifth embodiment, it is characterized in that the lower surface of the first lead portion 22 is joined to the wiring portion 12 on the substrate 11, and at the same time, the lower surface of the second lead portion 32 is joined to the wiring portion 12 on the substrate 11. As a specific manufacturing method, for example, the lower surfaces of the first lead portion 22 and the second lead portion 32 may be joined to the substrate 11 by a single reflow process.

[0066] With this manufacturing method, although the first semiconductor package 20 is of the insertion type, it can be joined to the substrate by a process such as reflow like the surface mount type second semiconductor package 30, so the working process can be made simple.

[0067] In the fifth embodiment, the first semiconductor package 20 and the second semiconductor package 30 are joined to the substrate. However, the above-described effects can also be obtained even when only the insert-type first semiconductor package 20 is joined to the substrate. That is, a preparation step of preparing a substrate having a hole portion having an opening on at least one surface side, and a connection step of connecting at least one first semiconductor package 20 having a resin-sealed main body portion and a plate-like lead portion extending outward from the side surface of the main body portion to the substrate. In the connection step, in any one of the at least one first semiconductor package, a part of the main body portion is inserted into the hole portion, and the lead portion is arranged so as to extend horizontally along the surface of the substrate, and the lower surface of the lead portion is joined to the substrate, whereby the first semiconductor package may be connected to the substrate. Also in this case, the first semiconductor package 20 has the effect that although it is of the insert type, it can be joined to the substrate by a process such as reflow like a surface-mount type semiconductor package.

[0068] Also, similar to the first embodiment, when one of the two semiconductor packages is a control semiconductor package and the other is a rectifying semiconductor package, the semiconductor package of the core part of the semiconductor module can be miniaturized and made low-profile, and miniaturization and low-profile of the entire semiconductor module can be realized.

[0069] As described above, the present invention has been described based on the above embodiments, but the present invention is not limited to the above embodiments. It can be implemented in various modes without departing from the gist thereof. For example, the following modifications are also possible.

[0070] (1) The positions, connections, numbers, etc. described in the above embodiments (including each modification example. The same shall apply hereinafter.) are examples, and can be changed within a range that does not impair the effects of the present invention.

[0071] (2) In the above-described Embodiment 4, a part of the main body of the control semiconductor package that is not a convex part was inserted into the hole, but the present invention is not limited to this. A part of the main body of the rectifying semiconductor package that is not a convex part may be inserted into the hole, or a part of the main bodies of both the control semiconductor package and the rectifying semiconductor package that is not a convex part may be inserted into the hole.

[0072] (3) In the above-described embodiments, a substrate in which the wiring part is formed only on one side was used, but the present invention is not limited to this. A substrate in which the wiring part is formed on one side and the other side may be used.

[0073] (4) In the above-described embodiments, the hole 13 is a through hole, but the present invention is not limited to this. The hole 13 may be a non-through hole (a hole having an opening on one side).

[0074] (5) In the above-described embodiments, the substrate facing surface was assumed to be the substrate contact surface in contact with the substrate, but the present invention is not limited to this. The substrate facing surface may not be in contact with the substrate.

[0075] (6) In the above-described embodiments, as the semiconductor package, three types, namely, a control semiconductor package, a rectifying semiconductor package, and another semiconductor package, were provided, but the present invention is not limited to this. It is not necessary to provide another semiconductor package, or it may be provided with only either the control semiconductor package or the rectifying semiconductor package. In other words, it may be provided with one semiconductor package or a plurality of semiconductor packages. Among the plurality of semiconductor packages, it is preferable that one semiconductor package is a control semiconductor package and the other semiconductor package among the plurality of semiconductor packages is a rectifying semiconductor package.

Description of Reference Numerals

[0076] 1. 2, 3, 4... semiconductor module, 10... substrate, 11... insulating substrate, 12... wiring portion, 13... hole portion, 20, 20a... rectifying semiconductor package, 21, 21a... main body portion, 22, 22a... lead portion, 23... convex portion, 24... substrate contact surface, 25... heat sink mounting surface, 26... through hole, 27... inner lead, 28... semiconductor chip, 29... connecting member, 30, 30a, 30b... control semiconductor package, 31, 31a, 31b... main body portion, 32, 32a, 32b... lead portion, 33a... convex portion, 34... substrate contact surface, 35... heat sink mounting surface, 36... through hole, 37... bent portion, 40... other semiconductor package, 50... heat sink

Claims

1. A substrate having a wiring portion formed on at least one surface and a hole portion having an opening on at least the one surface side, At least one semiconductor package disposed on the one surface side of the substrate, having a resin-sealed main body portion and a plate-like lead portion extending outward from a side surface of the main body portion, In any one of at least one of the semiconductor packages, A part of the main body portion is inserted into the hole portion, The lead portion extends along the surface of the substrate, A semiconductor module, wherein a lower surface of the lead portion is joined to the wiring portion.

2. The semiconductor package has a substrate facing surface that contacts or faces the substrate, and a convex portion that protrudes toward the substrate side with reference to a height position of the substrate facing surface, The semiconductor module according to claim 1, wherein a part of the main body portion is the convex portion.

3. As the semiconductor package, having a plurality of the semiconductor packages, At least two of the plurality of semiconductor packages each have a heat sink mounting surface for mounting a heat sink on a side opposite to the substrate side in the main body portion, and each of the heat sink mounting surfaces has the same height. The semiconductor module according to claim 1 or 2.

4. As the semiconductor package, having a plurality of the semiconductor packages, One of the plurality of semiconductor packages is a control semiconductor package, and the other semiconductor packages of the plurality of semiconductor packages are rectifying semiconductor packages. The semiconductor module according to claim 1 or 2.

5. A preparation step of preparing a substrate having a hole portion having an opening on at least one surface side, A connection step of connecting at least one semiconductor package having a resin-sealed main body portion and a plate-like lead portion extending outward from a side surface of the main body portion to the substrate, In the connection step, In any one of at least one of the semiconductor packages, A method of manufacturing a semiconductor module, wherein a part of the main body portion is inserted into the hole portion, and the lead portion is arranged to extend horizontally along the surface of the substrate, and the lower surface of the lead portion is joined to the substrate to connect the semiconductor package to the substrate.

6. Preparing a substrate having a hole portion with an opening on at least one side surface; A first step of connecting at least one first semiconductor package having a resin-sealed first main body portion and a plate-shaped first lead portion extending outward from a side surface of the first main body portion to the substrate; A second step of connecting at least one second semiconductor package having a resin-sealed second main body portion and a plate-shaped second lead portion extending outward from a side surface of the second main body portion and including a portion that bends so as to approach the substrate to the substrate, In the first step, In any one of at least one of the first semiconductor packages, Inserting a part of the first main body portion into the hole portion and arranging the first lead portion so as to extend along the surface of the substrate, and joining the lower surface of the first lead portion to the substrate, thereby connecting the first semiconductor package to the substrate; In the second step, Connecting the second semiconductor package to the substrate by joining the lower surface of the second lead portion to the substrate; A method for manufacturing a semiconductor module, characterized in that joining the lower surface of the first lead portion to the substrate in the first step and joining the lower surface of the second lead portion to the substrate in the second step are performed simultaneously.

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