Electronic device

Abstract

To provide an electronic device that can sense input by a pen.SOLUTION: A sensor layer includes a first sensing electrode that extends along a first direction, a second sensing electrode that extends along a second direction, and a first electrode that extends along the first direction. The first sensing electrode includes a plurality of first sub-electrodes and the first electrode includes a plurality of second sub-electrodes. The first sub-electrode includes a first pattern and a first bridge pattern electrically connected to the first pattern. The two adjacent first sub-electrodes are electrically connected to each other through a first connection line at one end. The two adjacent second sub-electrodes are electrically connected to each other through a second connection line at a second end part. The first connection line is electrically connected to a first pad and a third connection line is electrically connected to a second pad.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to an electronic device capable of sensing input by a pen.

Background Art

[0002] Multimedia electronic devices such as televisions, mobile phones, tablet PCs, notebook computers, navigation devices, game machines, etc. include a display device for displaying images. In addition to normal input methods such as buttons, keyboards, and mice, the electronic device may include a sensor layer (or input sensor) that can provide a touch-based input method that allows a user to easily and intuitively input information or commands conveniently. The sensor layer can sense the touch and input of the user. On the other hand, there is an increasing demand to use a pen for users who are accustomed to inputting information using a writing instrument or for fine touch input for specific application programs (for example, application programs for sketching or drawing).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide an electronic device capable of sensing input by a pen.

Means for Solving the Problems

[0005] An electronic device according to an embodiment of the present invention includes a substrate, a circuit layer disposed on the substrate and including transistors, a light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, and a sensor layer disposed on the light-emitting element layer. The sensor layer includes a plurality of first sensing electrodes extending along a first direction, a plurality of second sensing electrodes extending along a second direction intersecting the first direction, and a plurality of first electrodes extending along the first direction. Each of the plurality of first sensing electrodes includes a plurality of first sub-electrodes, each of the plurality of first electrodes includes a plurality of second sub-electrodes each having a first end and a second end, each of the plurality of first sub-electrodes includes a first pattern and a first bridge pattern electrically connected to the first pattern. Two adjacent first sub-electrodes among the plurality of first sub-electrodes are electrically connected to each other at one end via a first connection line. Two adjacent second sub-electrodes among the plurality of second sub-electrodes that overlap the two adjacent first sub-electrodes are connected to each other at the second end via a second connection line. Adjacent second connection lines different from the second connection line are electrically connected to each other via a third connection line. The first connection line is electrically connected to a first pad, and the third connection line may be electrically connected to a second pad.

[0006] Two adjacent first electrodes among the plurality of first electrodes may be electrically connected to each other at the second end via a first loop trace line.

[0007] The plurality of first electrodes may be electrically connected to each other at the first end via a second loop trace line.

[0008] A first end of the second loop trace line is connected to one third pad, a second end of the second loop trace line opposite to the first end is connected to another third pad. In a charging drive mode, the second pad is configured to receive a first signal, and one of the third pads may be configured to receive a second signal.

[0009] The second signal may have an inverted phase signal of the first signal.

[0010] A part of the plurality of second sensing electrodes may be electrically connected to some of the fourth pads at one end of the second sensing electrodes, and another part of the second sensing electrodes may be electrically connected to other fourth pads at the opposite end of the second sensing electrodes.

[0011] In the mutual capacitance detection mode, the first pad may be configured to receive a transmission signal, and the fourth pad may be configured to transmit a received signal.

[0012] An electronic device according to an embodiment of the present invention includes a substrate, a circuit layer disposed on the substrate and including transistors, a light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, and a sensor layer disposed on the light-emitting element layer. The sensor layer includes a first sensing electrode extending along a first direction and including a first pattern and a first bridge pattern electrically connected to the first pattern, a second sensing electrode extending along a second direction intersecting the first direction, a first electrode extending along the first direction, and a first dummy pattern insulated from the first sensing electrode. At least one of the first patterns includes a first portion, a second portion facing the first portion, and a third portion connected to one end of the first portion and one end of the second portion. The first dummy pattern is disposed between the first portion and the second portion. The first electrode overlaps the first dummy pattern and the first portion and the second portion of the at least one first pattern. The first electrode and the first bridge pattern are disposed in a first layer, and the first pattern, the second sensing electrode, and the first dummy pattern may be disposed in a second layer different from the second layer.

[0013] The first dummy pattern may be completely surrounded by an opening defined by the first portion, the second portion, and the third portion of the at least one first pattern.

[0014] The first dummy pattern includes a plurality of patterns, and the plurality of patterns can be completely surrounded by an opening defined by the first portion, the second portion, and the third portion of the at least one first pattern.

[0015] The plurality of patterns can be electrically floated and electrically separated from each other.

[0016] The first dummy pattern may include a plurality of mesh lines.

[0017] The first electrode may include a second pattern and a second bridge pattern that is electrically connected to the second pattern and disposed on the same layer as the first bridge pattern.

[0018] The sensor layer further includes a second electrode extending along the second direction, and the second electrode may include a second pattern and a second bridge pattern that intersects the first bridge pattern and is electrically connected to the second pattern.

[0019] The second bridge pattern includes mesh lines that intersect each other and define at least one open / closed opening therebetween, and mesh lines that intersect each other without defining an open / closed opening therebetween, and the first bridge pattern may intersect a part of the mesh lines of the second bridge pattern that do not define the open / closed opening.

[0020] An electronic device according to an embodiment of the present invention includes a substrate, a circuit layer disposed on the substrate and including transistors, a light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, and a sensor layer disposed on the light-emitting element layer. The sensor layer includes a first sensing electrode, a second sensing electrode intersecting the first sensing electrode, a first electrode overlapping the first sensing electrode, and a second electrode overlapping the second sensing electrode. The first sensing electrode includes a first pattern and a first bridge pattern electrically connected to the first pattern. The second electrode includes a second pattern and a second bridge pattern electrically connected to the second pattern. The first bridge pattern intersects the second bridge pattern. Each of the first bridge pattern and the second bridge pattern includes a first mesh line and a second mesh line intersecting the first mesh line. The second bridge pattern has at least one closed opening surrounded by the first mesh line and the second mesh line. The first bridge pattern has zero or more and fewer closed openings than the second bridge pattern. The first electrode and the first bridge pattern are located in a first layer. The first pattern, the second sensing electrode, and the second bridge pattern may be located in a second layer different from the first layer.

[0021] The first bridge pattern may not include a closed opening.

[0022] The second bridge pattern may include the first and second mesh lines that intersect each other and define at least one closed opening therebetween, and the first and second mesh lines that intersect each other and do not define a closed opening therebetween.

[0023] The first bridge pattern may intersect a part of the first and second mesh lines that do not define the closed opening of the second bridge pattern.

[0024] The first electrode may include a third pattern and a third bridge pattern electrically connected to the third pattern.

[0025] The third bridge pattern may include the first bridge portion and a second bridge portion facing the first bridge portion.

[0026] The first bridge pattern may be disposed between the first bridge portion and the second bridge portion.

[0027] The first bridge pattern and the third bridge pattern may be disposed on the same layer as each other.

[0028] An electronic device according to an embodiment of the present invention includes a substrate, a circuit layer disposed on the substrate and including transistors, a light-emitting element layer disposed on the circuit layer and including light-emitting elements electrically connected to the transistors, and a sensor layer disposed on the light-emitting element layer. The sensor layer includes a first sensing electrode including the first pattern and a first bridge pattern electrically connected to the first pattern, a second sensing electrode intersecting the first sensing electrode, a first electrode overlapping the first sensing electrode and including a second pattern and a second bridge pattern electrically connected to the second pattern, and a second electrode overlapping the second sensing electrode. The second bridge pattern includes the first bridge portion and a second bridge portion facing the first bridge portion. The first bridge pattern is disposed between the first bridge portion and the second bridge portion. The first electrode, the first bridge pattern, and the second bridge pattern are disposed in a first layer, and the first pattern and the second sensing electrode may be disposed on a second layer different from the first layer.

[0029] The second electrode may include a third pattern and a third bridge pattern electrically connected to the third pattern.

[0030] The first bridge pattern and the third bridge pattern may intersect each other.

[0031] Each of the first bridge pattern and the third bridge pattern may include a first mesh line and a second mesh line intersecting the first mesh line.

[0032] The third bridge pattern includes at least one closed opening surrounded by the first mesh line and the second mesh line, and the first bridge pattern may have a number of closed openings greater than or equal to 0 and less than that of the third bridge pattern.

[0033] The first bridge pattern and the third bridge pattern may be arranged on different layers from each other.

[0034] At least one first pattern of the first patterns includes a first portion, a second portion facing the first portion, and a third portion connected to one end of the first portion and one end of the second portion. The sensor layer is insulated from the at least one first pattern and may further include a first dummy pattern disposed between the first portion and the second portion.

Advantages of the Invention

[0035] According to the above aspect, an electronic device capable of sensing input not only by touch input but also by a pen using a sensor layer can be provided. Therefore, in an electronic device having such a configuration, a separate configuration (for example, a digitizer) for sensing a pen may not be added, so an increase in the thickness, weight, and a decrease in flexibility of the electronic device due to the addition of a digitizer may not occur.

[0036] Also, according to one aspect, an electronic device can be provided that adjusts the overlapping areas of the first electrode and the third electrode and the second electrode and the fourth electrode of the sensor layer, and the capacitance between the first electrode and the third electrode and the capacitance between the second electrode and the fourth electrode can be adjusted. Thus, in an electronic device having such a configuration, a sensor layer having an appropriate level of capacitance considering touch sensitivity and pen sensing sensitivity can be provided. As a result, an electronic device with improved pen sensitivity and touch sensitivity can be provided.

[0037] Also, according to one aspect, an electronic device can be provided in which the first electrode may include a plurality of divided electrodes connected in parallel. Thus, in an electronic device having such a configuration, if the number of divided electrodes included in the first electrode increases, the resistance of the first electrode can decrease. As a result, the sensing sensitivity of the sensor layer can be improved. Also, the shape of each of the divided electrodes can be in a form close to a rod shape. In this case, the ratio of the area available for pattern design in the total area of one sensing unit can increase. Thus, the degree of freedom in pattern design can be improved. Also, the path of the resistance path corresponding to the divided electrodes becomes shorter, and the resistance can be further reduced. In this case, it may be more advantageous to secure a frequency range (e.g., bandwidth) applicable to the signal provided to the sensor layer. Thus, the degree of freedom in frequency selection can be improved.

Brief Description of the Drawings

[0038]

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MODE FOR CARRYING OUT THE INVENTION

[0039] In this specification, when a certain component (or region, layer, part, etc.) is referred to as being "on", "coupled to", or "connected to" another component, it can be directly disposed, connected, or coupled on the other component, or a third component can be disposed between them.

[0040] The same reference numerals refer to the same components. Also, in the drawings, the thickness, ratio, and dimensions of the components are exaggerated for an effective explanation of the technical content. "And / or" includes all combinations of one or more defined by the related components.

[0041] Terms such as "first", "second", etc. are used to describe various components, but the components are not limited to these terms. These terms are only used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may also be named the first component. The singular form includes plural expressions unless the context clearly dictates otherwise.

[0042] Also, terms such as "below", "beneath", "above", "over" are used to describe the relative relationship of the components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0043] Terms such as "comprising" or "having" are used to specify that there are features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it should be understood that they do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof in advance.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by those skilled in the art to which the present invention pertains. Also, terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an overly ideal or formal sense unless explicitly defined here.

[0045] The terms "part" and "unit" mean software components or hardware components that perform specific functions. Hardware components include, for example, field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs). Software components refer to executable code and / or data used by executable code in an addressable storage medium. Thus, software components can be, for example, object-oriented software components, class components, and work components, and include processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, or variables.

[0046] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0047] FIG. 1A is a perspective view of an electronic device 1000 according to an embodiment of the present invention. FIG. 1B is a rear perspective view of the electronic device 1000 according to an embodiment of the present invention.

[0048] Referring to FIGS. 1A and 1B, the electronic device 1000 can be a device activated by an electrical signal. For example, the electronic device 1000 can display an image and sense an external input applied from the outside. The external input can be a user input. The user input can include various forms of external input such as a part of the user's body, a pen PN, light, heat, or pressure.

[0049] The electronic device 1000 can include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 can be separate panels separated from each other. The first display panel DP1 can be referred to as a main display panel, and the second display panel DP2 can be referred to as an auxiliary display panel or an external display panel.

[0050] The first display panel DP1 includes a first display portion DA1-F and a peripheral region NDA surrounding the first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The area of the second display panel DP2 may be smaller than the area of the first display panel DP1. Corresponding to the first display panel DP1 and the second display panel, the area of the first display portion DA1-F may be larger than the area of the second display portion DA2-F.

[0051] When the electronic device 1000 is not folded, the first display portion DA1-F may have a plane, for example, a parallel plane along a plane including the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 is along a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front (or upper surface) and the back (or lower surface) of the members constituting the electronic device 1000 may be defined based on the third direction DR3.

[0052] The first display panel DP1 or the first display portion DA1-F may include a foldable region FA that can be in a folded state or an unfolded state, and a plurality of non-foldable regions NFA1, NFA2 that are separated with the foldable region FA in between. The second display panel DP2 may overlap with one of the plurality of non-foldable regions NFA1, NFA2. For example, the second display panel DP2 may overlap with the first non-foldable region NFA1.

[0053] The display direction of a part of the first display panel DP1, for example, the first video IM1a displayed in the first non-foldable region NFA1, and the display direction of the second video IM2a displayed on the second display panel DP2 may be in exactly opposite directions. For example, the first video IM1a may be displayed in the third direction DR3, and the second video IM2a may be displayed in a fourth direction DR4 that is exactly opposite to the third direction DR3. Both the third direction DR3 and the fourth direction DR4 are directions that are generally orthogonal to the first and second directions DR1, DR2, that is, directions along the thickness direction of the electronic device 1000, with the third direction DR3 being on one side of the thickness direction and the fourth direction DR4 being on the other side of the thickness direction.

[0054] In one embodiment of the present invention, the folding region FA can be bent with reference to a folding axis extending in a direction along the long side of the electronic device 1000, for example, a direction parallel to the second direction DR2. In the state where the electronic device 1000 is folded, the folding region FA has a predetermined curvature and radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 face each other inwardly, and the first display portion DA1-F of the electronic device 1000 can be folded inwardly (inner-folding) so as not to be exposed to the outside.

[0055] In one embodiment of the present invention, the electronic device 1000 can also be folded outwardly (outer-folding) such that both the first non-folding region NFA1 and the second non-folding region NFA2 face outwardly and the first display portion DA1-F is exposed to the outside. In one embodiment of the present invention, the electronic device 1000 can be in any of an unfolded state, a state folded inwardly from the unfolded state, or a state folded outwardly, but is not limited thereto.

[0056] In FIG. 1A, an example is shown in which one folding region FA is defined (provided or included) in the electronic device 1000, but the present invention is not limited thereto. For example, a plurality of folding axes and corresponding folding regions are defined in the electronic device 1000, and the electronic device 1000 can be folded inwardly or outwardly in an unfolded state for each of the plurality of folding regions.

[0057] According to an embodiment of the present invention, at least one of the first display panel DP1 and the second display panel DP2 can sense an input by the pen PN without including a digitizer. Therefore, since a separate configuration (e.g., a digitizer) for sensing the pen PN is omitted, an increase in the thickness, weight, and a decrease in flexibility of the electronic device 1000 due to the addition of the digitizer may not occur. Thus, it can be designed to sense the pen PN not only for the first display panel DP1 but also for the second display panel DP2. Note that at least one of the first display panel DP1 and the second display panel DP2 can sense not only an input by the pen PN but also a touch input.

[0058] FIG. 2 is a perspective view of an electronic device 1000-1 according to an embodiment of the present invention. FIG. 3 is a perspective view of an electronic device 1000-2 according to an embodiment of the present invention.

[0059] In FIG. 2, an example is shown in which the electronic device 1000-1 is a mobile phone, and the electronic device 1000-1 may include a display panel DP. In FIG. 3, an example is shown in which the electronic device 1000-2 is a notebook computer, and the electronic device 1000-2 may include a display panel DP. FIG. 3 is a perspective view of the electronic device 1000-2, and the coordinate axes included in FIG. 3 are shown based on the display panel DP in the electronic device 1000-2.

[0060] In an embodiment of the present invention, the display panel DP can sense an input applied from the outside. The external input may be a user input. The user input may include various forms of external inputs such as a part of the user's body, the pen PN (see FIG. 1A), light, heat, or pressure.

[0061] According to an embodiment of the present invention, the display panel DP can sense an input by the pen PN without including a digitizer. Therefore, since the digitizer for sensing the pen PN is omitted, an increase in the thickness and weight of the electronic device 1000-1 or 1000-2 due to the addition of the digitizer can be suppressed.

[0062] FIG. 1A exemplarily shows a foldable type of electronic device 1000, and FIG. 2 exemplarily shows a rod-shaped non-foldable electronic device 1000-1. However, the present invention described below is not limited thereto. For example, the description described below can be applied to various electronic devices such as a rollable type of electronic device, a slidable type of electronic device, and a stretchable type of electronic device.

[0063] FIG. 4 is a schematic cross-sectional view of a display panel DP according to an embodiment of the present invention.

[0064] Referring to FIG. 4, the display panel DP may include a display layer 100 and a sensor layer 200.

[0065] The display layer 100 may be configured to substantially generate an image. The display layer 100 is a light-emitting display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and a sealing layer 140.

[0066] The base layer 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multilayer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, etc., but is not particularly limited thereto.

[0067] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, and signal lines, etc. The insulating layer, the semiconductor layer, and the same transmission are formed on the base layer 110 by methods such as coating and vapor deposition, and the insulating layer, the semiconductor layer, and the same transmission can be selectively patterned through a plurality of photolithography processes.

[0068] The light-emitting element layer 130 can be disposed above the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element. For example, the light-emitting element layer 130 may include an organic light-emitting substance, an inorganic light-emitting substance, an organic-inorganic light-emitting substance, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0069] The encapsulation layer 140 can be disposed above the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0070] The sensor layer 200 can be disposed on the display layer 100. The sensor layer 200 can sense an external input applied from the outside. The sensor layer 200 can be an integrated sensor continuously formed during the manufacturing process of the display layer 100, or the sensor layer 200 can be an external sensor attached to the display layer 100. The sensor layer 200 can be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for input coordinate sensing.

[0071] According to an embodiment of the present invention, the sensor layer 200 can sense both a passive input means such as a user's body and an input to an input device that generates a magnetic field having a predetermined resonance frequency. The input device can be referred to as a pen, an input pen, a magnetic pen, a stylus pen, or an electromagnetic resonance pen.

[0072] FIG. 5 is a diagram for explaining the operation of the electronic device 1000 according to an embodiment of the present invention.

[0073] Referring to FIG. 5, the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driving unit 100C, a sensor driving unit 200C, a main driving unit 1000C, and a power supply circuit 1000P.

[0074] The sensor layer 200 can sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be an input means that provides a change in the capacitance of the sensor layer 200, or can be an input means that can cause an induced current in the sensor layer 200. For example, the first input 2000 can be a passive type of input means such as a user's body. The second input 3000 can be an input by a pen PN or an input by an RFIC tag. For example, the pen PN can be a passive pen or an active pen.

[0075] In one embodiment of the present invention, the pen PN can be a device that generates a magnetic field of a predetermined resonance frequency. The pen PN can be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus pen, or an electromagnetic resonance type pen.

[0076] The pen PN can include an RLC resonance circuit, and the RLC resonance circuit can include an inductor L and a capacitor C. In one embodiment of the present invention, the RLC resonance circuit can be a variable resonance circuit that varies the resonance frequency. In this case, the inductor L can be a variable inductor and / or the capacitor C can be a variable capacitor, but is not particularly limited thereto.

[0077] The inductor L generates a current by a magnetic field formed in an electronic device 1000, for example, the sensor layer 200. However, it is not particularly limited thereto. For example, when the pen PN operates in an active type, the pen PN can generate a current even without being provided with an external magnetic field. The generated current is transmitted to the capacitor C. The capacitor C charges the current input from the inductor L and discharges the charged current to the inductor L. Next, the inductor L can emit a magnetic field of the resonance frequency. An induced current can flow through the sensor layer 200 due to the magnetic field emitted by the pen PN, and the induced current can be transmitted to the sensor driving unit 200C as a received signal (or a sensing signal, a signal).

[0078] The main drive unit 1000C can control the overall operation of the electronic device 1000. For example, the main drive unit 1000C can control the operations of the display drive unit 100C and the sensor drive unit 200C. The main drive unit 1000C includes at least one processor and may further include a graphics controller. The main drive unit 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0079] The display drive unit 100C can drive the electronic device 1000. The display drive unit 100C can receive video data and control signals from the main drive unit 1000C. The control signals may include various signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, and a data enable signal, etc.

[0080] The sensor drive unit 200C can drive the sensor layer 200. The sensor drive unit 200C can receive control signals from the main drive unit 1000C. The control signals may include a clock signal for the sensor drive unit 200C. Or, the control signals may further include a mode determination signal for determining the drive mode of the sensor layer 200 of the sensor drive unit 200C.

[0081] The sensor drive unit 200C is implemented by an integrated circuit (IC) and can be electrically connected to the sensor layer 200. For example, the sensor drive unit 200C can be directly mounted on a predetermined area of the display panel or mounted on a separate printed circuit board in a chip on film (COF) manner to be electrically connected to the sensor layer 200.

[0082] The sensor drive unit 200C and the sensor layer 200 can selectively operate in a first mode or a second mode. For example, the first mode may be a mode for sensing a touch input, for example, the first input 2000. The second mode may be a mode for sensing a pen PN, for example, the second input 3000. The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0083] The conversion between the first mode and the second mode can be performed in various ways. For example, the sensor driving unit 200C and the sensor layer 200 are driven in a time-division manner in the first mode and the second mode, and can sense the first input 2000 and the second input 3000. Alternatively, the conversion between the first mode and the second mode occurs by the user's selection or the user's specific action (or input), or one of the first mode and the second mode is activated or deactivated, or converted from one to the other by the activation or deactivation of a specific application. Alternatively, if the first input 2000 is sensed while the sensor driving unit 200C and the sensor layer 200 are operating alternately in the first mode and the second mode, it can be maintained in the first mode, or if the second input 3000 is sensed, it can be maintained in the second mode.

[0084] The sensor driving unit 200C can calculate the coordinate information of the input based on the signal received from the sensor layer 200, and provide a coordinate signal having the coordinate information to the main driving unit 1000C. The main driving unit 1000C can execute an operation corresponding to the user input based on the coordinate signal. For example, the main driving unit 1000C can operate the display driving unit 100C so that a new application image is displayed on the display layer 100.

[0085] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P can generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driving unit 100C, and the sensor driving unit 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate constant voltage, a first driving voltage (e.g., ELVSS voltage), a second driving voltage (e.g., ELVDD voltage), an initialization voltage, etc., but is not particularly limited to the above examples.

[0086] FIG. 6A is a cross-sectional view of a display panel DP (any display panel according to an embodiment of the present invention, such as the first display panel DP1 in FIG. 1A, the second display panel DP2 in FIG. 1B, and the display panel DP in FIGS. 2 and 3) according to an embodiment of the present invention.

[0087] Referring to FIG. 6A, at least one buffer layer BFL is formed on the upper surface of the base layer 110. The buffer layer BFL can improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL can be composed of multiple layers. Or, the buffer layer BFL may further include a barrier layer. The barrier layer BFL can include at least one of silicon nitride, silicon nitride, and silicon oxynitride. For example, the barrier layer BFL can include a structure in which silicon oxide and silicon nitride are alternately laminated.

[0088] The semiconductor patterns SC, AL, DR, SCL can be disposed on the buffer layer BFL. The semiconductor patterns SC, AL, DR, SCL can include polysilicon. However, not limited thereto, the semiconductor patterns SC, AL, DR, SCL may include amorphous silicon, low-temperature polycrystalline silicon, or an oxide semiconductor.

[0089] FIG. 6A only shows some of the semiconductor patterns SC, AL, DR, SCL, and semiconductor patterns may be further disposed in other regions. The semiconductor patterns SC, AL, DR, SCL can be arranged according to a specific rule across the pixels. The semiconductor patterns SC, AL, DR, SCL can have different electrical properties depending on dopability. The semiconductor patterns SC, AL, DR, SCL can include a first region SC, DR, SCL with high conductivity and a second region AL with low conductivity. The first region SC, DR, SCL can be doped with an N-type dopant or a P-type dopant. The P-type transistor includes a doping region doped with a P-type dopant, and the N-type transistor can include a doping region doped with an N-type dopant. The second region AL can be an undoped region or a region doped at a lower concentration compared to the first region SC, DR, SCL.

[0090] The conductivity of the first regions SC, DR, and SCL is greater than that of the second region AL and can substantially serve as electrodes or signal lines. The second region can substantially correspond to the active region AL (or channel) of the transistor 100PC. In other words, a part AL of the semiconductor patterns SC, AL, DR, and SCL can be the active region AL of the transistor 100PC, another part SC, DR can be the source region SC or drain region DR of the transistor 100PC, and another part SCL can be the connecting electrode or connecting signal line SCL.

[0091] Each pixel may have a synchronization circuit including a plurality of transistors, at least one capacitor, and at least one light-emitting element, but the synchronization circuit of the pixel can be deformed into various forms. FIG. 6A exemplarily shows one transistor 100PC and one light-emitting element 100PE included in the pixel.

[0092] The source region SC, active region AL, and drain region DR of the transistor 100PC can be composed of the semiconductor patterns SC, AL, DR, and SCL. The source region SC and the drain region DR can extend in opposite directions from the active region AL in cross-section. FIG. 6A shows a part of the connecting signal line SCL composed of the semiconductor patterns SC, AL, DR, and SCL. Although not shown separately, the connecting signal line SCL can be connected to the drain region DR of the transistor 100PC in plan view.

[0093] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may commonly overlap the pixels and cover the semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer or multilayer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but also the insulating layers of the circuit layer 120 described later may be inorganic layers and / or organic layers and may have a single-layer or multilayer structure. The inorganic layer may include, but is not limited to, at least one of the substances described above.

[0094] The gate GT of the transistor 100PC is disposed on the first insulating layer 10. The gate GT may be a part of a metal pattern. The gate GT overlaps the active region AL. In the process of doping or reducing the semiconductor patterns SC, AL, DR, and SCL, the gate GT may function as a mask.

[0095] The second insulating layer 20 is disposed on the first insulating layer 10 and may cover the gate GT. The second insulating layer 20 may commonly overlap the pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single-layer or multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon oxide layer.

[0096] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer or multilayer structure. For example, the third insulating layer 30 may have a multilayer structure including a silicon oxide layer and a silicon oxide layer.

[0097] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 that penetrates the first, second, and third insulating layers 10, 20, and 30.

[0098] The fourth insulating layer 40 can be disposed on the third insulating layer 30. The fourth insulating layer 40 can be a single-layer silicon oxide layer. The fifth insulating layer 50 can be disposed on the fourth insulating layer 40. The fifth insulating layer 50 can be an organic layer.

[0099] The second connection electrode CNE2 can be disposed on the fifth insulating layer 50. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a contact hole CNT-2 that penetrates the fourth insulating layer 40 and the fifth insulating layer 50.

[0100] The sixth insulating layer 60 is disposed on the fifth insulating layer 50 and can cover the second connection electrode CNE2. The sixth insulating layer 60 can be an organic layer.

[0101] The light-emitting element layer 130 can be disposed above the circuit layer 120. The light-emitting element layer 130 can include a light-emitting element 100PE. For example, the light-emitting element layer 130 can include an organic light-emitting substance, an inorganic light-emitting substance, an organic-inorganic light-emitting substance, quantum dots, quantum rods, micro LEDs, or nano LEDs. Hereinafter, the light-emitting element 100PE is taken as an example of an organic light-emitting element for description, but it is not particularly limited thereto.

[0102] The light-emitting element 100PE can include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0103] The first electrode AE can be disposed on the sixth insulating layer 60. The first electrode AE can be connected to the second connection electrode CNE2 through a contact hole CNT-3 that penetrates the sixth insulating layer 60.

[0104] The pixel defining film 70 is disposed on the sixth insulating layer 60 and can cover a part of the first electrode AE. An opening 70-OP can be defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a part of the first electrode AE.

[0105] The first display unit DA1-F (see FIG. 1A) may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. In the present embodiment, the light-emitting region PXA is defined to correspond to a partial region of the first electrode AE exposed by the opening 70-OP. In the cross-sectional example of FIG. 6A, the light-emitting element 100PE and the transistor 100PC are superimposed and arranged in the light-emitting region PXA. Further, the sensor layer 200 is located in the non-light-emitting region NPXA.

[0106] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed in a region corresponding to the opening 70-OP. Although FIG. 6A shows an example in which the light-emitting layer EL is disposed within the opening 70-OP, it is not particularly limited thereto. For example, the light-emitting layer EL may be extended to cover a side surface of the pixel defining film 70 that defines the opening 70-OP and a part of the upper surface of the pixel defining film 70.

[0107] In one embodiment of the present invention, the light-emitting layer EL may be separately formed for each pixel. When the light-emitting layer EL is separately formed for each pixel, each of the light-emitting layers EL may emit light of at least one color among blue, red, and green. However, it is not limited thereto, and the light-emitting layer EL may have an integral shape and be commonly included in a plurality of pixels. In this case, the light-emitting layer EL may provide blue light or white light.

[0108] The second electrode CE may be disposed on the light-emitting layer EL. The second electrode CE has an integral shape and may be commonly included in a plurality of pixels.

[0109] In one embodiment of the present invention, a hole control layer may be disposed between the first electrode AE and the light-emitting layer EL. The hole control layer may be commonly disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer includes a hole transport layer and may further include a hole injection layer. An electron transport layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer includes an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels using an open mask or an inkjet process.

[0110] The encapsulation layer 140 may be disposed above the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer that are sequentially stacked, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer protects the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but is not particularly limited thereto.

[0111] The sensor layer 200 may include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a cover insulating layer 205. The first conductive layer 202 may be referred to as the first layer, and the second conductive layer 204 may be referred to as the second layer.

[0112] The base layer 201 may be an inorganic layer including at least one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. Alternatively, the base layer 201 may be an organic layer including an epoxy resin, an acrylic resin, or an imide-based resin. The base layer 201 may have a single-layer structure or a multilayer structure stacked along the third direction DR3. In one embodiment of the present invention, the sensor layer 200 may not include the base layer 201.

[0113] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multilayer structure stacked along the third direction DR3.

[0114] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, and the like.

[0115] Each of the first conductive layer 202 and the second conductive layer 204 having a multilayer structure may include a metal layer. The metal layer may have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0116] In one embodiment of the present invention, the thickness of the first conductive layer 202 may be equal to or greater than the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of the components (e.g., electrodes, patterns, or bridge patterns) included in the first conductive layer 202 may be reduced. Alternatively, since the first conductive layer 202 is disposed below the second conductive layer 204, even if the thickness of the first conductive layer 202 is increased, the probability that the components included in the first conductive layer 202 are visually recognized due to external light reflection may be lower than that of the second conductive layer 204.

[0117] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0118] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0119] Previously, the sensor layer 200 was described by taking as an example that it includes the first conductive layer 202 and the second conductive layer 204, that is, two conductive layers, but it is not particularly limited thereto. For example, the sensor layer 200 may include three or more conductive layers.

[0120] FIG. 6B is a cross-sectional view of the sensor layer 200 according to an embodiment of the present invention.

[0121] Referring to FIGS. 6A and 6B, the second width 204wt of the second mesh line MS2 included in the second conductive layer 204 may be equal to or greater than the first width 202wt of the first mesh line MS1 included in the first conductive layer 202. When the user USR views the first mesh line MS1 and the second mesh line MS2 from the side, since the first mesh line MS1 has a smaller width than the second mesh line MS2, the probability that the first mesh line MS1 is visually recognized by the user USR can be reduced.

[0122] Each of the first mesh line MS1 and the second mesh line MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. Exemplarily, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum Al. However, this is an example and is not particularly limited thereto.

[0123] In one embodiment of the present invention, the first thickness TK1 of the second metal layer M2 of the first mesh line MS1 and the second thickness TK2 of the second metal layer M2 of the second mesh line MS2 may be substantially the same, but are not particularly limited thereto. For example, the first thickness TK1 may be thicker than the second thickness TK2. Or, the second thickness TK2 may be thicker than the first thickness TK1. In one embodiment of the present invention, each of the first thickness TK1 and the second thickness TK2 may be 1000 Å or more, and for example, may be 6000 Å.

[0124] FIG. 7 is a plan view of a sensor layer 200 according to an embodiment of the present invention.

[0125] Referring to FIG. 7, a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be defined in the sensor layer 200.

[0126] The sensor layer 200 may include a plurality of first electrodes 210 disposed in the sensing region 200A, a plurality of second electrodes 220, a plurality of third electrodes 230, and a plurality of fourth electrodes 240. The first electrode 210 may be referred to as a first sensing electrode, the second electrode 220 may be referred to as a second sensing electrode, the third electrode 230 may be referred to as a first electrode, and the fourth electrode 240 may be referred to as a second electrode.

[0127] The first electrode 210 may intersect the second electrode 220. Each of the first electrodes 210 may extend along a second direction DR2, and the first electrodes 210 may be arranged at intervals in a first direction DR1. Each of the second electrodes 220 may extend along the first direction DR1, and the second electrodes 220 may be arranged at intervals in the second direction DR2. A sensing unit SU (or a sensor, a sensing region, or a sensing node) of the sensor layer 200 may be a region where one first electrode 210 and one second electrode 220 intersect.

[0128] FIG. 7 exemplarily shows six first electrodes 210 and ten second electrodes 220, and sixty sensing units SU are exemplarily shown, but the numbers of the first electrodes 210 and the second electrodes 220 are not limited thereto.

[0129] Each of the third electrodes 230 extends along the second direction DR2, and the third electrodes 230 can be arranged spaced apart in the first direction DR1. One of the third electrodes 230 can at least partially overlap with one of the first electrodes 210. According to an embodiment of the present invention, by adjusting the overlapping area between one of the first electrodes 210 and one of the third electrodes 230, the capacitance (or coupling capacitance) between one of the first electrodes 210 and one of the third electrodes 230 can be adjusted. According to FIG. 14B described later, at least a part of the first electrode 210 and at least a part of the third electrode 230 overlap in a vertical relationship, and without being limited thereto, for example, the third electrode 230 is located below the first electrode 210 via an insulating layer. Alternatively, the first electrode 210 may be located below the third electrode 230 via an insulating layer.

[0130] In an embodiment of the present invention, at least a part of the third electrodes 230 can be connected in parallel to each other. For example, in FIG. 7, an example is shown in which two third electrodes 230 are connected in parallel to each other to form a first electrode group 230pc, and three first electrode groups 230pc can be arranged along the first direction DR1. However, the number of the third electrodes 230 constituting the first electrode group 230pc is not limited thereto. For example, one first electrode group 230pc may include only one third electrode 230, or may include three or more third electrodes 230.

[0131] As the number of the third electrodes 230 included in the first electrode group 230pc and connected in parallel to each other increases, the resistance of the first electrode group 230pc decreases, the power efficiency is improved, and the sensing intensity can be improved. Conversely, as the number of the third electrodes 230 included in the first electrode group 230pc decreases, the loop coil pattern formed using the first electrode group 230pc can be embodied in more diverse forms.

[0132] Each of the fourth electrodes 240 extends along the second direction DR2, and the fourth electrode 240 may extend along the first direction DR1. One fourth electrode 240 may at least partially overlap with one second electrode 220. According to an embodiment of the present invention, by adjusting the overlapping area between one second electrode 220 and one fourth electrode 240, the capacitance (or coupling capacitance) between one second electrode 220 and one fourth electrode 240 can be adjusted. According to FIG. 15B described later, at least a part of the fourth electrode 240 and at least a part of the second electrode 220 overlap in a vertical relationship, and are not limited thereto. For example, the fourth electrode 240 is located below the second electrode 220 via an insulating layer. Differently, the second electrode 220 may be located below the fourth electrode 240 via an insulating layer. Also, not limited thereto, for example, as shown in FIGS. 14B and 15B, the third electrode 230 and the fourth electrode 240 are arranged at the same height position on the base layer 201 and can correspond to the first conductive layer 202 in FIG. 6B. Also, the first electrode 220 and the second electrode 220 are arranged at the same height position on the intermediate insulating layer 203 and can correspond to the second conductive layer 204 in FIG. 6B. In a plan view, the region where the first electrode 210 and the third electrode 230 form a capacitance by the third electrode 230 facing the first electrode 210 via the intermediate insulating layer 203 and the region where the second electrode 220 and the fourth electrode 240 form a capacitance by the fourth electrode 240 facing the second electrode 220 via the intermediate insulating layer 203 can be arranged in different regions. However, if the capacitances formed by the first and third electrodes 210 and 230 and the capacitances formed by the second and fourth electrodes 220 and 240 are appropriately formed, the third electrode 230 and the fourth electrode 240 can be formed at different height positions, and similarly, the first electrode 220 and the second electrode 220 can be formed at different height positions. In addition, although an example of arranging the first to fourth electrodes 210 to 240 in one embodiment of the present invention is shown, which capacitance is to be formed can be changed according to the required sensing degree and the like. Any of the first to fourth electrodes 210 to 240 can be omitted, or additional electrodes can be formed. Note that the electrode serving as the sensing electrode is preferably formed above the electrode facing the sensing electrode.

[0133] In one embodiment of the present invention, at least a part of the fourth electrodes 240 can be electrically connected to each other to form one second electrode group 240pc. For example, in FIG. 7, five fourth electrodes 240 are connected to the same one trace line, for example, the fourth trace line 240t, to form one second electrode group 240pc as an example. Therefore, in FIG. 7, two second electrode groups 240pc are shown to be arranged along the second direction DR2. However, the number of the fourth electrodes 240 forming the second electrode group 240pc is not limited to this. For example, the number of the fourth electrodes 240 forming one second electrode group 240pc can be 10. In this case, the sensor layer 200 may include only one second electrode group 240pc.

[0134] The sensor layer 200 may further include a plurality of first trace lines 210t arranged in the peripheral region 200NA, a plurality of first pads PD1 connected to the first trace lines 210t in a one-to-one correspondence, a plurality of second trace lines 220t, and a plurality of second pads PD2 connected to the second trace lines 220t in a one-to-one correspondence. The first trace lines 210t can be electrically connected to the first electrodes 210 in a one-to-one correspondence, respectively. The second trace lines 220t can be electrically connected to the second electrodes 220 in a one-to-one correspondence, respectively.

[0135] The sensor layer 200 may further include a third trace line 230rt1 disposed in the peripheral region 200NA, a plurality of third pads PD3 connected to one end and the other end of the third trace line 230rt1, a fourth trace line 240t, a fourth pad PD4 connected in a one-to-one correspondence to the fourth trace line 240t, a fifth trace line 230rt2, and a fifth pad PD5 connected in a one-to-one correspondence to the fifth trace line 230rt2.

[0136] The third trace line 230rt1 may be electrically connected to the third electrode 230. In one embodiment of the present invention, the third trace line 230rt1 may be electrically connected to all of the third electrodes 230. The third trace line 230rt1 extends along the first direction DR1 and may include a first line portion 231t electrically connected to the third electrode 230, a second line portion 232t extending along the second direction DR2 from the first end of the first line portion 231t, and a third line portion 233t extending along the second direction DR2 from the second end of the first line portion 231t.

[0137] In one embodiment of the present invention, the resistance of the second line portion 232t and the resistance of the third line portion 233t may each be substantially the same as the resistance of one of the third electrodes 230. Therefore, the second line portion 232t and the third line portion 233t may serve as the third electrode 230, and an effect can be obtained such that the third electrode 230 is also disposed in the peripheral region 200NA. For example, any one of the second line portion 232t and the third line portion 233t and any one of the third electrodes 230 may form a coil. Therefore, the side located in the region adjacent to the peripheral region 200NA can also be sufficiently charged by a loop including the second line portion 232t or the third line portion 233t.

[0138] In one embodiment of the present invention, in order to adjust the resistance of the second line portion 232t and the resistance of the third line portion 233t, the width in the first direction DR1 of each of the second line portion 232t and the third line portion 233t can be adjusted. However, this is merely an example, and the first to third line portions 231t, 232t, 233t may have substantially the same width as each other.

[0139] The fifth trace line 230rt2 can be connected to each of the first electrode groups 230pc in a one-to-one correspondence. That is, the number of the fifth trace lines 230rt2 can correspond to the number of the first electrode groups 230pc. In FIG. 7, three fifth trace lines 230rt2 and three first electrode groups 230pc are exemplarily shown. The fifth trace line 230rt2 can be referred to as a first loop trace line, and the third trace line 230rt1 can be referred to as a second loop trace line.

[0140] In one embodiment of the present invention, the fifth trace line 230rt2 and the fifth pad PD5 may be omitted, and the charging drive mode for charging the pen may be omitted. In this case, the sensor layer 200 can sense an input by an active pen that can emit a magnetic field even when no magnetic field is provided from the sensor layer 200.

[0141] The fourth trace line 240t can be spaced apart with the sensing region 200A interposed therebetween. The fourth trace line 240t can be electrically connected to each of the second electrode groups 240pc in a one-to-one correspondence. In FIG. 7, an example is shown in which two second electrode groups 240pc are arranged. The fourth trace line 240t connected to one second electrode group 240pc and the fourth trace line 240t connected to another second electrode group 240pc can be spaced apart with the sensing region 200A interposed therebetween. However, it is not particularly limited thereto.

[0142] FIG. 8A is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present invention. FIG. 8B is an enlarged plan view of the AA' region shown in FIG. 8A. FIG. 9A is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present invention. FIG. 9B is an enlarged plan view of the BB' region shown in FIG. 9A.

[0143] In FIGS. 8A and 9A, the shape of the mesh structure is not shown, and the boundaries of the respective components are simply indicated by lines. That is, the lines shown in FIGS. 8A and 9A can be understood to correspond to cut lines obtained by cutting the mesh structures shown in FIGS. 8B and 9B, and the cut lines are shown as dotted lines in FIGS. 8B and 9B. In other words, FIGS. 8B and 9B are obtained by enlarging a part of FIGS. 8A and 9A so that the mesh structures of the respective electrodes and patterns can be visually recognized.

[0144] The shape of the sensing unit SU shown in FIGS. 7, 8A, 8B, 9A, and 9B is merely an example, and the present invention is not limited thereto. The shape of the sensing unit SU can be variously deformed.

[0145] Referring to FIGS. 7, 8A, 8B, 9A, and 9B, the first electrode 210 may include a plurality of first divided electrodes 210-dp spaced apart in the first direction DR1. Each of the first divided electrodes 210-dp may extend in the second direction DR2. The first divided electrode 210-dp may also be referred to as a first sub-electrode 210-dp.

[0146] The third electrode 230 may include a plurality of second divided electrodes 230-dp spaced apart in the first direction DR1. Each of the second divided electrodes 230-dp may extend along the second direction DR2. The second divided electrode 230-dp may also be referred to as a second sub-electrode 230-dp. Each of the second divided electrodes 230-dp may include an annular pattern and may have a form in which the patterns are connected to each other.

[0147] When viewed from the third direction DR3 (in plan view), the second divided electrode 230-dp can overlap with the first divided electrode 210-dp on a one-to-one basis. The term "overlap" also includes the meaning that at least a part of the first divided electrode 210-dp and at least a part of one second divided electrode 230-dp overlap.

[0148] In FIGS. 8A and 9A, an example is given where one sensing unit SU includes three first divided electrodes 210-dp and three second divided electrodes 230-dp, but it is not particularly limited to this. For example, the number of the first divided electrodes 210-dp and the number of the second divided electrodes 230-dp included in one sensing unit SU may each be one, two, or four or more. Each of the first divided electrode 210-dp and the second divided electrode 230-dp may correspond to a signal transmission path (path) or a resistance path through which a signal is transmitted.

[0149] Referring to both FIGS. 7 and 8A, one fifth trace line 230rt2 is electrically connected to one first electrode group 230pc. One first electrode group 230pc may include two third electrodes 230. In this case, one fifth trace line 230rt2 may be electrically connected to six second divided electrodes 230-dp. In this case, the degree of increase in the number of pads in the sensor layer 200 can be reduced.

[0150] When the first electrode 210 in one sensing unit SU has a single shape without being divided, compared to the case where the first electrode 210 in one sensing unit SU includes a plurality of first divided electrodes 210-dp, the plurality of first divided electrodes 210-dp can be arranged in a relatively uniform distribution within one sensing unit SU. In this case, signals can be provided or sensed evenly within one sensing unit SU.

[0151] Also, when the first electrode 210 in one sensing unit SU is divided to include a plurality of first divided electrodes 210-dp compared to the case where the first electrode 210 in one sensing unit SU is not divided, the number of first bridge patterns 212 in one sensing unit SU can increase. In FIGS. 9A and 9B, two first bridge patterns 212 are connected to the same two first patterns 211. That is, referring to FIG. 9B, one connected first pattern 211 branches, and at each branched tip, it is connected to one end of each of two separate first bridge patterns 212 (a pair of first bridge patterns 212). In FIG. 9A, an example is shown where nine pairs of first bridge patterns 212 are arranged. That is, according to FIGS. 9A and 9B, a total of 18 bridge patterns 212 are shown.

[0152] In particular, an increase in the number of first bridge patterns 212 arranged in the first direction DR1 that intersects the second direction DR2, which is the extension direction of the first electrode 210, can correspond to an increase in the signal path. Therefore, as the number of signal paths increases, the resistance of the first electrode 210 can decrease. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0153] Also, as shown in FIG. 9A, the shape of each of the first divided electrodes 210-dp is in a mode close to a rod shape extending in the second direction DR2. The closer it is to a rod shape like this, the shorter the resistance path can be compared to, for example, a meandering shape. Therefore, if the resistance path can be shortened and the number of resistance paths connected in parallel within one first electrode 210 is increased, the resistance of the first electrode 210 can be decreased. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0154] Also, the closer the shape of each of the first divided electrodes 210-dp is to a rod shape extending in the second direction DR2, the higher the ratio of the area available for pattern design within the overall area of one sensing unit SU can be. Therefore, the degree of freedom in pattern design can be improved.

[0155] According to an embodiment of the present invention, the degree of freedom in the pattern design of the sensing unit SU can be improved, and the resistance of the electrodes included in the sensing unit SU can be reduced. In this case, it may be more advantageous to secure a frequency range (for example, bandwidth) applicable to the signal provided to the sensor layer 200. Therefore, the degree of freedom in frequency selection can be improved.

[0156] Referring to FIGS. 8A and 9A, each of the first divided electrodes 210-dp may include a plurality of first patterns 211 and a plurality of first bridge patterns 212 electrically connected to the first patterns 211. FIG. 9A mainly shows the second conductive layer SU204 (corresponding to the second conductive layer 204 in FIGS. 6A and 6B) of the sensing unit SU (see FIG. 7). However, in FIG. 9A, in order to clearly show the alignment relationship, in addition to the second conductive layer SU204, the first bridge pattern 212, which is the first conductive layer SU202 (corresponding to the first conductive layer 202 in FIGS. 6A and 6B), is also shown together. Two adjacent first patterns 211 may be electrically connected to each other by two first bridge patterns 212 (a pair of first bridge patterns 212), but the number of the first bridge patterns 212 is not particularly limited thereto. The first pattern 211, which is the second conductive layer SU204, and the first bridge pattern 212, which is the first conductive layer SU202, may be electrically connected to each other through a contact hole 200cnt1 (see FIGS. 8B and 9B) defined in the intermediate insulating layer 203 (see FIG. 6A).

[0157] Referring to FIG. 9A, the second electrode 220 may include a plurality of first branch portions 220b1 extending along the first direction DR1 and a plurality of second branch portions 220b2 extending along a second direction DR2 intersecting the first direction DR1. The plurality of first branch portions 220b1 may be separated from each other in the second direction DR2, and the plurality of second branch portions 220b2 may be separated from each other in the first direction DR1. The first branch portion 220b1 and the second branch portion 220b2 may be connected to each other and have an integral shape.

[0158] Between two adjacent first patterns 211, a part of the first branch portion 220b1 and one of the second bridge patterns 242 described later may be arranged. The first bridge pattern 212 may intersect with a part of the first branch portion 220b1 and one of the second bridge patterns 242 in an insulated state.

[0159] Referring to FIGS. 8A and 9A, the fourth electrode 240 may include a plurality of third divided electrodes 240-dp separated in the second direction DR2. Each of the third divided electrodes 240-dp may extend along the first direction DR1. Each of the third divided electrodes 240-dp may include a plurality of second patterns 241 (FIG. 8A, etc.) and a plurality of second bridge patterns 242 (FIG. 9A, etc.) electrically connected to the second pattern 241. As shown in FIG. 8A, etc., each of the second patterns 241 may have an annular shape. The second pattern 241 and the second bridge pattern 242 may be electrically connected to each other through contact holes 200cnt2 (refer to FIGS. 8B and 9B) defined in the intermediate insulating layer 203 (refer to FIG. 6A). Two adjacent second patterns 241 may be separated with a second divided electrode 230-dp and two first bridge patterns 212 (a pair of first bridge patterns 212 facing each other as shown in FIG. 8B) interposed therebetween.

[0160] Referring to FIGS. 8A and 8B, the second divided electrode 230-dp, the first bridge pattern 212, and the second pattern 241 may be arranged on the same layer as each other and may include the same material as each other. For example, the second divided electrode 230-dp, the first bridge pattern 212, and the second pattern 241 may be included in the first conductive layer SU202.

[0161] Referring to FIGS. 9A and 9B, the first pattern 211, the first branch portion 220b1, the second branch portion 220b2, and the second bridge pattern 242 may be arranged on the same layer as each other and may include the same material as each other. For example, the first pattern 211, the first branch portion 220b1, the second branch portion 220b2, and the second bridge pattern 242 may be included in the second conductive layer SU204.

[0162] Referring to FIGS. 8A and 9A, in the second conductive layer SU204 within one sensing unit SU, the area occupied by the components included in the first electrode 210 and the second electrode 220 may be larger than the area occupied by the components included in the third electrode 230 and the fourth electrode 240. The change in capacitance due to the first input 2000 (see FIG. 4) may be greater when the distance is closer. Therefore, the components for sensing the first input 2000 (see FIG. 4) may be arranged in a larger area in a layer adjacent to the surface of the electronic device 1000 (see FIG. 1A). As a result, the touch performance may be improved.

[0163] Referring to FIGS. 8B and 9B, each of the second divided electrode 230-dp, the second pattern 241, the first pattern 211, the second electrode 220, and the second bridge pattern 242 may have a mesh structure. Each of the mesh structures may include a plurality of mesh lines. Each of the plurality of mesh lines has a shape extending in a predetermined direction and may be connected to each other. The shape may have various shapes such as a straight line, a line having a protrusion, a line having unevenness, etc. An opening at least partially surrounded by the mesh lines may be defined (provided or formed) in each of the mesh structures. The opening may overlap with the light emitting region PXA (see FIG. 6A), and the mesh lines may overlap with the non-light emitting region NPXA (see FIG. 6A). However, it is not particularly limited to this.

[0164] In FIGS. 8B and 9B, it is exemplarily shown that the mesh structure includes mesh lines extending along a first crossing direction CDR1 that intersects the first direction DR1 and the second direction DR2, and mesh lines extending along a second crossing direction CDR2 that intersects the first crossing direction CDR1. However, the extending direction of the mesh lines constituting the mesh structure is not particularly limited to the illustration in FIGS. 8B and 9B. For example, the mesh structure may include only mesh lines extending in the first direction DR1 and the second direction DR2, or may include mesh lines extending in the first direction DR1, the second direction DR2, and the first crossing direction CDR1 and the second crossing direction CDR2. That is, the mesh structure may be changed into various forms.

[0165] Referring to FIGS. 8A and 9A, in one embodiment of the present invention, a first opening 230op1 that overlaps a part of the first electrode 210 may be defined (provided or formed) in the third electrode 230. For example, a plurality of first openings 230op1 that overlap the first divided electrode 210-dp may be provided in each of the second divided electrodes 230-dp. The first capacitance (or the first coupling capacitance) formed between the first electrode 210 and the third electrode 230 can be adjusted by the size of the first opening 230op1.

[0166] A second opening 240op that overlaps a part of the second electrode 220 may be defined (provided or formed) in the fourth electrode 240. According to FIGS. 8A, 15B, etc., the second opening 240op is formed in the second pattern 241 of the fourth electrode 240. For example, a plurality of second openings 240op that overlap the fourth electrode 240 may be provided in each of the third divided electrodes 240-dp. The second capacitance (or the second coupling capacitance) formed between the second electrode 220 and the fourth electrode 240 can be adjusted by the size of the second opening 240op.

[0167] As the first and second capacitances increase, the amount of induced current transmitted from the third electrode 230 to the first electrode 210 can be increased, and the amount of induced current transmitted from the fourth electrode 240 to the second electrode 220 can be increased. Therefore, the pen sensing performance of the sensor layer 200 can be improved as the first and second capacitances increase. Also, during touch sensing, the first and second capacitances can act as a load. Therefore, the touch sensing performance can be improved as the first and second capacitances decrease.

[0168] According to the present invention, the overlapping areas of the first electrode 210 and the third electrode 230 and the overlapping areas of the second electrode 220 and the fourth electrode 240 can be easily adjusted. Therefore, the capacitance between the first electrode 210 and the third electrode 230 and the capacitance between the second electrode 220 and the fourth electrode 240 can be adjusted. As a result, a sensor layer 200 having an appropriate level of capacitance considering the touch sensitivity and the pen sensing sensitivity can be provided. As a result, an electronic device 1000 (see FIG. 1A) with improved pen sensitivity and touch sensitivity can be provided.

[0169] In one embodiment of the present invention, a first additional opening 230op2 may be further defined in the third electrode 230. For example, the first additional opening 230op2 may be provided between two first bridge patterns 212 (a pair of first bridge patterns 212).

[0170] In one embodiment of the present invention, the first conductive layer SU202 may include a first dummy pattern 202dm1, a second dummy pattern 202dm2, a third dummy pattern 202dm3, and a fourth dummy pattern 202dm4. Each of the first to fourth dummy patterns 202dm1, 202dm2, 202dm3, 202dm4 may be floating or electrically floating. Each of the first to fourth dummy patterns 202dm1, 202dm2, 202dm3, 202dm4 may be divided into a plurality of conductive patterns. For example, one fourth dummy pattern 202dm4 may include a plurality of floating dummy patterns separated or electrically separated from each other. For example, according to FIG. 8B, one fourth dummy pattern 202dm4 is formed in a form in which a plurality of floating dummy patterns are connected in a mesh shape, and the fourth dummy pattern 202dm4 constituted by the plurality of floating dummy patterns is not electrically connected to other wirings.

[0171] The first dummy pattern 202dm1 is surrounded by the first opening 230op1 and can be insulated from the third electrode 230. In one embodiment of the present invention, the first dummy pattern 202dm1 may completely overlap with the first electrode 210 in a plan view. That is, the entire area of the first dummy pattern 202dm1 may overlap with the first electrode 210, for example, the first pattern 211.

[0172] The second dummy pattern 202dm2 is surrounded by the second opening 240op and can be insulated from the fourth electrode 240. For example, the second dummy pattern 202dm2 may be surrounded by the annular second pattern 241. In one embodiment of the present invention, a part of the second dummy pattern 202dm2 may overlap with the second electrode 220, and another part of the second dummy pattern 202dm2 may not overlap with the second electrode 220.

[0173] The third dummy pattern 202dm3 is surrounded by the first additional opening 230op2 and can be insulated from the third electrode 230. The fourth dummy pattern 202dm4 may be surrounded by the second pattern 241 of two second divided electrodes 230-dp extending in the second direction DR2 and two third divided electrodes 240-dp adjacent in the first direction DR1. In the example of FIG. 8B, the fourth dummy pattern 202dm4 may be disposed in a region sandwiched by a pair of first bridge patterns 212.

[0174] In one embodiment of the present invention, the second conductive layer SU204 may further include a fifth dummy pattern 204dm1 (FIGS. 9A, 9B, 14B, etc.) and a sixth dummy pattern 204dm2 (FIG. 9A, etc.). Each of the fifth dummy pattern 204dm1 and the sixth dummy pattern 204dm2 may be floating or electrically floating. Each of the fifth dummy pattern 204dm1 and the sixth dummy pattern 204dm2 may be divided into a plurality of conductive patterns. For example, one fifth dummy pattern 204dm1 may include a plurality of floating dummy patterns that are electrically separated from each other. For example, according to FIG. 9B, one fifth dummy pattern 204dm1 is formed in a form in which a plurality of floating dummy patterns are connected in a mesh shape, and the fifth dummy pattern 204dm1 composed of the plurality of floating dummy patterns is not electrically connected to other wirings.

[0175] The fifth dummy pattern 204dm1 may be disposed adjacent to the first divided electrode 210-dp. A part of the fifth dummy pattern 204dm1 may overlap with the second divided electrode 230-dp, and another part of the fifth dummy pattern 204dm1 may overlap with the third dummy pattern 202dm3 (FIG. 8A).

[0176] The sixth dummy pattern 204dm2 may be completely surrounded by the second electrode 220. For example, the sixth dummy pattern 204dm2 may be disposed between two first branch portions 202b1 and two second branch portions 202b2. The sixth dummy pattern 204dm2 may overlap with another part of the second dummy pattern 202dm2, the second pattern 241, and the third dummy pattern 202dm3 (FIG. 8A).

[0177] According to an embodiment of the present invention, in each of the first conductive layer SU202 and the second conductive layer SU204, a dummy pattern may be provided in a space where the first to fourth electrodes 210, 220, 230, 240 are not arranged. Each of the dummy patterns may also have a mesh structure. Thus, since the mesh lines are entirely arranged within the sensing unit SU, the probability that a specific pattern is visually recognized due to external light reflection can be reduced. That is, an electronic device 1000 (see FIG. 1A) with improved visibility due to external light reflection may be provided.

[0178] Previously, FIGS. 8A to 9B exemplarily showed a structure in which each of the first to fourth electrodes 210, 220, 230, 240 is separately arranged in two conductive layers SU202, SU204, but it is not particularly limited thereto. For example, the first to fourth electrodes 210, 220, 230, 240 may be separately arranged in three conductive layers or four conductive layers.

[0179] In an embodiment of the present invention, the third electrode 230 to which a signal is applied in the charging drive mode may be included in a third conductive layer disposed under the first and second conductive layers SU202, SU204. For example, the third conductive layer may be disposed under the base layer 201. The third conductive layer may be disposed between the base layer 201 and the display layer 100, may be disposed under the display layer 100, or may be disposed within the display layer 100.

[0180] The first, second, and fourth electrodes 210, 220, 240 may be included in the first and second conductive layers SU202, SU204. For example, when the third electrode 230 is implemented with a separate conductive layer such as the third conductive layer, the shape of the third electrode 230 can be designed more freely. For example, the third electrode 230 may be provided in a form including a plurality of coils. Also, the third electrode 230 can be provided in a finer manner using the third conductive layer. For example, the third electrode 230 can be formed in a manner including a plurality of finer lines. In such a case, the sensing sensitivity of the pen can be improved. In another embodiment of the present invention, the third conductive layer may include the fourth electrode 240 instead of the third electrode 230.

[0181] FIG. 10A is a plan view showing a first conductive layer SU202a of a sensing unit SU (see FIG. 7) according to an embodiment of the present invention. FIG. 10B is an enlarged plan view of the XX' region shown in FIG. 10A. FIG. 11A is a plan view showing a second conductive layer SU204a of a sensing unit SU (see FIG. 7) according to an embodiment of the present invention. FIG. 11B is an enlarged plan view of the YY' region shown in FIG. 11A.

[0182] In FIGS. 10A and 11A, the shape of the mesh structure is not shown, and the boundaries of the respective components are simply indicated by lines. The lines shown in FIGS. 10A and 11A can be understood to correspond to cut lines that cut the mesh structures shown in FIGS. 10B and 11B, and the cut lines are shown as dotted lines in FIGS. 10B and 11B. In other words, FIGS. 10B and 11B are obtained by enlarging a part of FIGS. 10A and 11A so that the mesh structures of the respective electrodes and patterns can be visually recognized.

[0183] Referring to FIGS. 7, 10A, 10B, 11A, and 11B, the first electrode 210-x may include a plurality of first divided electrodes 210-dpx spaced apart in a first direction DR1. Each of the first divided electrodes 210-dpx may extend in a second direction DR2. The third electrode 230-x may include a plurality of second divided electrodes 230-dpx spaced apart in the first direction DR1. Each of the second divided electrodes 230-dpx may extend along the second direction DR2.

[0184] When viewed from a third direction DR3 (in a plan view), the second divided electrodes 230-dpx may correspond to and overlap the first divided electrodes 210-dpx one-to-one. The term "overlap" also includes the meaning that at least a part of at least one of the first divided electrodes 210-dpx overlaps with at least a part of one of the second divided electrodes 230-dpx.

[0185] According to an embodiment of the present invention, each of the first divided electrodes 210-dpx may include a plurality of first patterns 211x and a plurality of first bridge patterns 212x electrically connected to the first patterns 211x.

[0186] According to an embodiment of the present invention, each of the first patterns 211x has an annular shape, and a portion overlapping with each of the first patterns 211x of the second divided electrodes 230-dpx may be in a shape close to a rod. In this case, by adjusting the inner diameter size of each of the first patterns 211x or the width of each of the second divided electrodes 230-dpx, the overlapping area of the first electrode 210-x and the third electrode 230-x can be easily adjusted.

[0187] According to an embodiment of the present invention, the first divided electrode 210-dpx includes a first pattern 211x and a first bridge pattern 212x disposed on different layers from each other, and the first pattern 211x and the first bridge pattern 212x may be electrically connected via a contact. In this case, the resistance can be relatively increased compared to the case where the first pattern 211x and the first bridge pattern 212x are disposed on the same layer and provided integrally.

[0188] In an embodiment of the present invention, the resistance of a portion of the second divided electrode 230-dpx overlapping with the first pattern 211x may be lower than the resistance of the first pattern 211x. However, this is merely an example, and the resistance relationship may be adjusted by adjusting the line width of the annular shape of the first pattern 211x, the width of the space formed by the annular shape, or the line width of a portion of the second divided electrode 230-dpx.

[0189] The second divided electrode 230-dpx may extend in the second direction DR2 within the same layer. Therefore, an increase in resistance due to varying layers within the second divided electrode 230-dpx can be suppressed. That is, unlike the case of forming the second divided electrode 230-dpx by connecting wirings formed in a plurality of layers between the layers, an increase in resistance can be suppressed. The second divided electrode 230-dpx may be an electrode to which a signal is applied in a charging drive mode described later. Therefore, the lower the resistance of the second divided electrode 230-dpx, the stronger the current and magnetic field intensity for charging the resonance circuit of the pen PN (see FIG. 5) can be.

[0190] According to an embodiment of the present invention, since the portions where the second divided electrodes 230-dpx overlap with the first pattern 211x are rod-like, the second divided electrodes 230-dpx may have a relatively narrower shape than the first divided electrodes 210-dpx. In this case, the parasitic capacitance induced in each of the second divided electrodes 230-dpx can be reduced. Therefore, the performance of the sensor layer 200 can be improved.

[0191] Referring to FIG. 10B, the second divided electrode 230-dpx may include a first portion having a first width WT1x in a first direction DR1 and a second portion having a second width WT2x in the first direction DR1. The first width WT1x may be larger than the second width WT2x. For example, the first portion having the first width WT1x may be closer to the first bridge pattern 212x than the second portion having the second width WT2x.

[0192] On a plane, the first portion having the first width WT1x may overlap with the first pattern 211x to form a capacitance. Also, the second portion having the second width WT2x may overlap with a dummy pattern surrounded by the first pattern 211x. By adjusting the second width WT2x, the overlapping area between the first electrode 210-x and the third electrode 230-x can be easily adjusted.

[0193] An opening 230opx may be defined in the second divided electrode 230-dpx, and two first bridge patterns 212x (a pair of first bridge patterns 212x) may be arranged in the opening 230opx. When the first bridge pattern 212x is surrounded by the second divided electrode 230-dpx, the capacitance having a value that changes with temperature among the capacitances generated in the first electrode 210-x can be reduced. Therefore, the temperature characteristics of the sensor layer 200 can be improved.

[0194] The second electrode 220-x may include a plurality of first branch portions 220b1x extending along the first direction DR1, a plurality of second branch portions 220b2x extending along a second direction DR2 intersecting the first direction DR1, and a connecting portion 220b3x disposed between the first patterns 211x. The first branch portions 220b1x may be spaced apart in the second direction DR2, and the second branch portions 220b2x may be spaced apart in the first direction DR1. The first branch portions 220b1x, the second branch portions 220b2x, and the connecting portion 220b3x may be connected to each other and have an integrated shape.

[0195] The fourth electrode 240-x may include a plurality of third divided electrodes 240-dpx spaced apart in the second direction DR2. Each of the third divided electrodes 240-dpx may extend along the first direction DR1. Each of the third divided electrodes 240-dpx may include a plurality of second patterns 241x and a plurality of second bridge patterns 242x electrically connected to the second patterns 241x. Each of the second patterns 241x may have an annular shape. The second patterns 241x and the second bridge patterns 242x may be electrically connected to each other through contact holes defined in the intermediate insulating layer 203 (see FIG. 6A). Two adjacent second patterns 241x may be spaced apart with one second divided electrode 230-dpx and two first bridge patterns 212x (a pair of first bridge patterns 212x) therebetween.

[0196] In one embodiment of the present invention, referring to FIG. 11B, the third width WT3x of the first branch portion 220b1x in the second direction DR2 may be larger than the fourth width WT4x of the second branch portion 220b2x in the first direction DR1. For example, the first branch portion 220b1x may overlap with a dummy pattern surrounded by the second patterns 241x and the second patterns 241x. By adjusting the third width WT3x, the overlapping area between the second electrode 220-x and the fourth electrode 240-x can be easily adjusted. Alternatively, by adjusting the size of the inner diameter of the annular shape surrounded by each of the dummy patterns of the second patterns 241x, the overlapping area between the second electrode 220-x and the fourth electrode 240-x can be easily adjusted.

[0197] In one embodiment of the present invention, the third divided electrode 240-dpx includes a second pattern 241x and a second bridge pattern 242x that are disposed on different layers, and the second pattern 241x and the second bridge pattern 242x can be electrically connected via a contact. In this case, the resistance can be relatively increased compared to the case where the second pattern 241x and the second bridge pattern 242x are disposed on the same layer and provided integrally.

[0198] In one embodiment of the present invention, the third electrode 230-x corresponds to a configuration that transmits a signal during touch sensing and pen sensing, and the fourth electrode 240-x corresponds to a configuration that forms a capacitance with the third electrode 230-x during pen sensing. Therefore, it is more appropriate to reduce the resistance of the third electrode 230-x rather than reducing the resistance of the fourth electrode 240-x. Therefore, the third electrode 230-x can be implemented in the same single layer, and the fourth electrode 240-x can be implemented in two different layers.

[0199] Referring to FIGS. 10B and 11B, the second bridge pattern 242x may include only one line that extends in the first crossing direction CDR1 or the second crossing direction CDR2 in a partial section. In this case, the first bridge pattern 212x that overlaps the second bridge pattern 242x in the partial section can cross in an insulated state. In this case, the capacitance between the first bridge pattern 212x and the second bridge pattern 242x can be minimized. Specific explanations regarding this will be described with reference to FIGS. 12 and 13 below.

[0200] FIG. 12 is a plan view showing a partial configuration of a sensing unit according to an embodiment of the present invention.

[0201] Referring to FIG. 12, one second bridge pattern 242x and two first bridge patterns 212x that overlap with one second bridge pattern 242x are exemplarily shown. In FIG. 12, a difference in pattern width is shown to easily distinguish the first bridge pattern 212x from the second bridge pattern 242x. The pattern width of each of the first bridge patterns 212x may be smaller than the pattern width of the second bridge pattern 242x, or may be the same.

[0202] Each of the first bridge patterns 212x may include a first main line 212m1 extending along a first crossing direction CDR1 and a second main line 212m2 extending along a second crossing direction CDR2. For example, adjacent first bridge patterns 212x may be symmetric or substantially symmetric with respect to an imaginary axis extending in a second direction DR2 therebetween. One end of the first main line 212m1 and one end of the second main line 212m2 may cross each other. The first bridge pattern 212x may further include a plurality of first protrusion lines 212p1 that cross the first main line 212m1 and protrude from the first main line 212m1, and a plurality of second protrusion lines 212p2 that cross the second main line 212m2 and protrude from the second main line 212m2. Each of the first protrusion lines 212p1 may be spaced along the first crossing direction CDR1, and each of the second protrusion lines 212p2 may be spaced along the second crossing direction CDR2. In another embodiment of the present invention, the first protrusion lines 212p1 and the second protrusion lines 212p2 may be omitted.

[0203] The second bridge pattern 242x may include a first line 242m1 extending along a first crossing direction CDR1 and a second line 242m2 extending along a second crossing direction CDR2. According to an embodiment of the present invention, the second bridge pattern 242x includes a first portion B-CA1 where two or more first lines 242m1 and two or more second lines 242m2 intersect, and a second portion B-CA2 where one first line 242m1 and one or more second lines 242m2 intersect or one or more first lines 242m1 and one second line 242m2 intersect. The second portion B-CA2 may intersect with the first bridge pattern 212x respectively. That is, each of the second portions B-CA2 may intersect with a corresponding one of the first bridge patterns 212x.

[0204] In an embodiment of the present invention, each of the first portions B-CA1 includes at least two or more lines extending in the same direction, and each of the second portions B-CA2 includes only one line extending in the same direction. Therefore, the first minimum width WTB1 of the first portion B-CA1 may be larger than the minimum width WTB2 of the second portion B-CA2.

[0205] In the second portion B-CA2, the first bridge pattern 212x that overlaps with the second bridge pattern 242x may be insulated and intersected. In this case, the capacitance between the first bridge pattern 212x and the second bridge pattern 242x may be reduced. Also, the remaining portion of the second bridge pattern 242x that does not overlap with the first bridge pattern 212x is provided in a form where two or more first lines 242m1 and two or more second lines 242m2 intersect, so that the probability of the second bridge pattern 242x being visually recognized due to the difference in external light reflectance may be reduced.

[0206] FIG. 13 is a plan view showing a partial configuration of a sensing unit according to an embodiment of the present invention. In explaining FIG. 13, the reference numerals of the components described in FIG. 12 are also indicated, and the description thereof is omitted.

[0207] Referring to FIG. 13, one second bridge pattern 242xa and two first bridge patterns 212xa that overlap with the one second bridge pattern 242xa are exemplarily shown. In FIG. 13, a difference in pattern width is shown to easily distinguish the first bridge pattern 212xa from the second bridge pattern 242xa. The pattern width of each of the first bridge patterns 212xa may be smaller than the pattern width of the second bridge pattern 242xa, or may be the same.

[0208] According to an embodiment of the present invention, the second bridge pattern 242xa includes a first portion B-CA1a where two or more first lines 242m1 and two or more second lines 242m2 intersect, and a second portion B-CA2a where one first line 242m1 and one or more second lines 242m2 intersect or one or more first lines 242m1 and one second line 242m2 intersect. The second portion B-CA2a may intersect the first bridge pattern 212x.

[0209] When compared with the previous FIG. 12, the area of the second portion B-CA2a may be even wider. The second portion B-CA2a may be an area where the first bridge pattern 212xa can overlap. Therefore, the degree of freedom in the position design of the first bridge pattern 212xa can be improved. Also, since the second portion B-CA2a corresponds not only to the area where the first bridge pattern 212xa overlaps but also to the area adjacent to the overlapping area, the capacitance between the first bridge pattern 212xa and the second bridge pattern 242xa can be further reduced.

[0210] FIG. 14A is a plan view showing an enlarged part of one sensing unit according to an embodiment of the present invention. FIG. 14B is a cross-sectional view of a sensor layer according to an embodiment of the present invention taken along the line I-I' shown in FIG. 14A. For example, FIG. 14A shows an overlapping view of the CC' region in FIG. 8A and the CC' region in FIG. 9A.

[0211] Referring to FIGS. 14A and 14B, one first pattern 211 and a portion of the second split electrode 230-dp are shown. A first opening 230op1 may be defined in the second split electrode 230-dp.

[0212] When viewed from the third direction DR3 (in plan view), the magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 may be determined by the area of the first region OLA1 where the first pattern 211 and the second split electrode 230-dp overlap.

[0213] In one embodiment of the present invention, the sizes of the first maximum width 230op1-wt1 in the first direction DR1 and the second maximum width 230op2-wt2 in the second direction DR2 of the first opening 230op1 may be adjusted. The magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 may be changed by the size of the first opening 230op1.

[0214] FIG. 15A is a plan view showing an enlarged portion of one sensing unit according to an embodiment of the present invention. FIG. 15B is a cross-sectional view of a sensor layer according to an embodiment of the present invention taken along the line II-II' shown in FIG. 14A. For example, FIG. 15A shows a superposition of the DD' regions in FIGS. 8A and 9A.

[0215] Referring to FIGS. 15A and 15B, one second pattern 241 and a portion of the second electrode 220 are shown. A second opening 240op may be defined in the second pattern 241.

[0216] When viewed from the third direction DR3 (in plan view), the magnitude of the second coupling capacitance between the second electrode 220 and the fourth electrode 240 may be determined by the area of the second region OLA2 where the second pattern 241 and the second electrode 220 overlap.

[0217] In one embodiment of the present invention, the sizes of the first maximum width 240op1-wt1 in the first direction DR1 and the second maximum width 240op2-wt2 in the second direction DR2 of the second opening 240op can be adjusted. Depending on the size of the second opening 240op, the magnitude of the second coupling capacitance between the second electrode 220 and the fourth electrode 240 can be changed.

[0218] In FIGS. 14A and 15A, the shape defined by a closed curve in which the first opening 230op1 is completely surrounded by the second divided electrode 230-dp and the shape defined by a closed curve in which the second opening 240op1 is completely surrounded by the second pattern 241 have been described as examples, but it is not particularly limited thereto.

[0219] For example, if the areas of the first region OLA1 and the second region OLA2 can be adjusted, the shapes of the first opening 230op1 and the second opening 240op on the plane can be deformed into various shapes. For example, the shapes of the first opening 230op1 and the second opening 240op on the plane can be defined by an open curve with one side open. In this case, the side surface defining the first opening 230op1 can be connected to the edge of the second divided electrode 230-dp, and the side surface defining the second opening 240op can be connected to the edge of the second pattern 241.

[0220] FIG. 16A is a plan view showing an enlarged part of one sensing unit according to an embodiment of the present invention, similar to FIGS. 14A and the like. FIG. 16B is a cross-sectional view of a sensor layer according to an embodiment of the present invention taken along line III-III' shown in FIG. 16A.

[0221] Referring to FIGS. 16A and 16B, a part of one first pattern 211a and the second divided electrode 230-dpa is shown. Different from what was described with reference to FIGS. 14A and 14B above, in the embodiment described with reference to FIGS. 16A and 16B, a first opening 211aop can be defined in the first pattern 211a.

[0222] When viewed from the third direction DR3 (in plan view), the magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be determined by the area of the first region OLA1a where the first pattern 211a and the second divided electrode 230-dpa overlap.

[0223] In one embodiment of the present invention, the size of the first maximum width 230aop1-wt1 in the first direction DR1 and the second maximum width 211aop-wt2 in the second direction DR2 of the first opening 230op1a can be adjusted. The magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be changed by the size of the first opening 211aop.

[0224] The sensor layer 200 may further include a plurality of dummy patterns. For example, the plurality of dummy patterns may include a first dummy pattern 202dm1a and a second dummy pattern 204dm1a. The first dummy pattern 202dm1a is disposed in the same layer as the second divided electrode 230-dpa and may overlap a part of the first pattern 211a. The second dummy pattern 204dm1a is surrounded by the first opening 211aop and may be disposed on the same layer as the first pattern 211a.

[0225] FIG. 17A is a plan view showing an enlarged part of the second conductive layer of the sensor layer according to one embodiment of the present invention. FIG. 17B is a plan view showing an enlarged view of the EE' region shown in FIG. 17A.

[0226] Referring to FIGS. 7, 16A, 17A, and 17B, the first electrode 210a of one sensing unit SU may include a plurality of first divided electrodes 210-dpa. Each of the first divided electrodes 210-dpa may include a first pattern 211a. Three first patterns 211a included in one sensing unit SU are shown in FIG. 17A.

[0227] The second dummy pattern 204dm1a can be divided into a plurality of patterns. For example, the second dummy pattern 204dm1a surrounded by one first opening 211aop may include a plurality of floating patterns separated from each other or electrically separated. In FIG. 17A, an example is shown in which the second dummy pattern 204dm1a includes two floating patterns, but it is not particularly limited thereto.

[0228] In one embodiment of the present invention, the first patterns 211a included in one sensing unit SU may be electrically connected to each other. For example, the sensor layer 200 may further include a connection line 210-ct disposed in the peripheral region 200NA, and the first patterns 211a may be electrically connected to each other by the connection line 210-ct. Also, the first pattern 211a may be electrically connected to one first trace line 210t (FIG. 7). Thus, one end of the first divided electrode 210-dpa included in the first electrode 210a may be electrically connected to the connection line 210-ct, and the other end of the first divided electrode 210-dpa may be electrically connected to the first trace line 210t.

[0229] Each of the first patterns 211a may have a mesh structure. The first pattern 211a is disposed on the same layer as the connection line 210-ct and may include the same material. The first pattern 211a and the connection line 210-ct may have a shape integrally connected to each other.

[0230] FIG. 18A is a plan view showing an enlarged part of the first conductive layer of the sensor layer according to an embodiment of the present invention. FIG. 18B is a plan view showing an enlarged view of the FF' region shown in FIG. 18A. FIG. 19 is a plan view showing an enlarged part of the display sensor layer according to an embodiment of the present invention. For example, FIG. 19 shows a superposition of the GG' region of FIG. 17A and the GG' region of FIG. 19A.

[0231] Referring to FIGS. 7, 17A, 18A, 18B, and 19, the third electrode 230a of one sensing unit SU may include a plurality of second divided electrodes 230-dpa. The second divided electrodes 230-dpa may overlap one-to-one with the first divided electrodes 210-dpa. The third divided electrode 240-dpa may be electrically connected to the third trace line 230rt1 (FIG. 7).

[0232] In one embodiment of the present invention, the first line portion 231t (FIG. 7) of the third trace line 230rt1 may include a first layer line 231ta and a second layer line 231tb that is connected to the first layer line 231ta and is disposed in a layer different from the connection line 210-ct. The second layer line 231tb may overlap at least a part of the connection line 210-ct. The second layer line 231tb may overlap the connection line 210-ct and the first layer line 231ta. The second layer line 231tb may be electrically insulated from the connection line 210-ct and may be electrically connected to the first layer line 231ta.

[0233] FIG. 20 is a plan view showing an enlarged part of a display sensor layer according to an embodiment of the present invention.

[0234] Referring to FIG. 20, a part of the fourth electrode 240 and a part of the second electrode 220 are exemplarily shown. The second electrode 220 has a mesh structure, and the fourth electrode 240 may also have a mesh structure. The width of the mesh lines of the second electrode 220 may be larger than the width of the mesh lines of the fourth electrode 240.

[0235] In one embodiment of the present invention, the second electrode 220 may be electrically connected to the second trace line 220t. For example, the second electrode 220 and the second trace line 220t may contain the same material as each other and may be disposed on the same layer. The second electrode 220 and the second trace line 220t may have an integral shape connected to each other. For example, the second electrode 220 and the second trace line 220t may be included in the second conductive layer 204 (see FIG. 6A).

[0236] In one embodiment of the present invention, the fourth electrode 240 can be electrically connected to the fourth trace line 240t. For example, the fourth electrode 240 and the fourth trace line 240t can include the same material as each other and can be disposed on the same layer. The fourth electrode 240 and the fourth trace line 240t can have an integrated shape connected to each other. For example, the fourth electrode 240 and the fourth trace line 240t can be included in the first conductive layer 202 (see FIG. 6A).

[0237] FIG. 21 is a plan view showing an enlarged part of a display sensor layer according to an embodiment of the present invention.

[0238] Referring to FIG. 21, the first pattern 211a can be electrically connected to one first trace line 210t. Each of the first patterns 211a can have a mesh structure. The first pattern 211a is disposed on the same layer as the first trace line 210t and can include the same material. The first pattern 211a and the first trace line 210t can have a shape integrally connected to each other. For example, the first pattern 211a and the first trace line 210t can be included in the second conductive layer 204 (see FIG. 6A).

[0239] The second divided electrode 230-dpa can be electrically connected to one fifth trace line 230rt2. Each of the second divided electrodes 230-dpa can have a mesh structure. The second divided electrode 230-dpa and the fifth trace line 230rt2 are disposed on the same layer and can include the same material. The second divided electrode 230-dpa and the fifth trace line 230rt2 can have a shape integrally connected to each other. For example, the second divided electrode 230-dpa and the fifth trace line 230rt2 can be included in the first conductive layer 202 (see FIG. 6A).

[0240] In some embodiments, referring to FIGS. 7, 10A, 11A, and 17A, the sensor layer 200 may include a plurality of first sensing electrodes 210. Each of the first sensing electrodes 210 may include a plurality of first divided electrodes (e.g., the divided electrodes 210-dp or 210-dpx of one first electrode 210 or 210-x) extending in one direction or a first direction (e.g., the second direction DR2 in the drawing). The sensor layer 200 may include a plurality of second sensing electrodes (e.g., sensing electrodes 220 or 220-x) extending in another direction or a second direction (e.g., the first direction DR1 in the drawing) transverse to the one direction or the first direction. Each of the plurality of first divided electrodes (e.g., 210-dp or 210-dpx) may include at least two first patterns (e.g., first pattern 211 or 211x) and a first bridge pattern (e.g., first bridge pattern 212 or 212x) electrically connected to the first pattern. At least two adjacent first divided electrodes (e.g., 210-dp or 210-dpx) may be connected to each other at one end via a first connection line 210-cl (FIG. 7). The first connection line 210-cl may be electrically connected to a first trace line 210t (FIG. 7), and the first connection line 210-cl may be electrically connected to a first pad PD1.

[0241] The first connection line 210-cl and the connection line 210-ct (e.g., referring to FIG. 17A) may be spaced apart in the second direction DR2 with a plurality of first divided electrodes 210-dp or 210-dpx included in one first sensing electrode 210 or 210-x disposed therebetween. Thus, the first ends of the plurality of first divided electrodes 210-dp or 210-dpx included in one first sensing electrode 210 or 210-x may be connected to the first connection line 210-cl, and the second ends of the plurality of first divided electrodes 210-dp or 210-dpx may be connected to the connection line 210-ct. Thus, since one first sensing electrode 210 or 210-x includes a plurality of first divided electrodes 210-dp or 210-x that are electrically connected, two or more first bridge patterns 212 or 212x arranged in the first direction DR1 may be included within one first sensing electrode 210 or 210-x.

[0242] In some embodiments, the sensor layer 200 may further include a plurality of third electrodes 230. Each of the plurality of third electrodes 230 may include a plurality of second divided electrodes (e.g., the second divided electrodes 230-dp or 230-dpx of one third electrode 230 or 230-x) extending in one direction or the first direction (e.g., the second direction DR2 in the drawing). At least two adjacent second divided electrodes (e.g., 230-dp or 230-dpx) may overlap at least two adjacent first divided electrodes (e.g., 210-dp or 210-x) and may be connected to each other at one end via a second connection line 230-cl1 (FIG. 7). The second connection line 230-cl1 may be a part of a fifth trace line 230rt2 extending from one third electrode 230 or 230-x. The second connection line 230-cl1 and another adjacent second connection line 230-cl1a (e.g., another part of the fifth trace line 230rt2 extending from another third electrode 230 or 230-x) may be connected to each other via a third connection line 230-cl2 (e.g., a part of the fifth trace line 230rt2 connecting another part to the fifth pad PD5), and the third connection line 230-cl2 may be electrically connected to the second pad (e.g., the fifth pad PD5). In some embodiments, the second pad may be adjacent to the first pad, or the second pad (e.g., the fifth pad PD5) may be alternately arranged in a direction different from the first pad (e.g., the first pad PD1) or along the second direction DR2.

[0243] In some embodiments, at least one first pattern (e.g., 211x) may include a first portion 211x-p1, a second portion 211x-p2 opposing the first portion 211x-p1, and a third portion 211x-p3 connected to the ends of the first portion 211x-p1 and the ends of the second portion 211x-p2. For example, in some embodiments, at least one first pattern (e.g., 211x) may have a closed-loop shape with two third portions 211X-p3 connecting the ends of the first and second portions 211x-p1 and 211x-p2 to each other, and the first, second, and third portions 211x-p1, 211x-p2, 211x-p3 may define an opening 211aop therebetween. In some embodiments, the first dummy pattern (e.g., the second dummy pattern 204dm1a) may be located between the first and second portions 211x-p1, 211x-p2 of the first pattern and may be insulated from the first pattern 211x. That is, the first dummy pattern (e.g., the second dummy pattern 204dm1a) may be arranged to be surrounded by (e.g., surround its periphery) the first, second, and third portions 211-p1, 211x-p2, 211x-p3 of the first pattern 211x. Thus, the third electrode (e.g., 230-dp or 230-dpx) may overlap the second dummy pattern 204dm1a and the first and second portions 211x-p1, 211x-p2.

[0244] In some embodiments, the first electrode (e.g., 230-dpx) may further include at least two second patterns 230bp (see FIG. 10A) (e.g., rod-shaped portions) and a second bridge pattern 230cp (see FIG. 10A) (e.g., <or> shaped portion) electrically connected to the second pattern 230bp. As shown in FIG. 10A, the second bridge pattern 230cp may include a first bridge portion 230cp1 (e.g., one of the bracket-shaped portions) and a second bridge portion 230cp2 (e.g., the other of the bracket-shaped portions) facing the first bridge portion 230cp1. In some embodiments, the first bridge pattern 212x may be located between the first bridge portion 230cp1 and the second bridge portion 230cp2 of the first electrode (e.g., 230-dpx) and may be located on the same layer as the first electrode (e.g., 230-dpx) and the second bridge pattern (e.g., bracket <or> shaped portion).

[0245] In some embodiments, the sensor layer 200 may extend in another direction or a second direction (e.g., the first direction DR1 in the drawing) and may further include a second electrode (e.g., the third split electrode 240-dpx) that overlaps with a second sensing electrode (e.g., 220-x). In some embodiments, the second electrode (e.g., 240-x) may include at least two second patterns (e.g., the second pattern 241x) and a second bridge pattern (e.g., the second bridge pattern 24x) electrically connected to the second pattern. The second bridge pattern (e.g., 242x) may be located in the same layer as the first pattern (e.g., 211x) and the second sensing electrode (e.g., 220-x), and may intersect with a first bridge pattern (e.g., 212x) located in a layer different from the second bridge pattern. Each of the first and second bridge patterns (e.g., 212x and 242x) may include a first mesh line and a second mesh line that intersects the first mesh line. As shown in FIG. 11B, the second bridge pattern (e.g., 242x) may have at least one closed opening (e.g., a hole having a closed loop shape) surrounded by (e.g., centered around its periphery) the first and second mesh lines, and as shown in FIG. 10B, the first bridge pattern (e.g., 242x) may not have a closed opening. That is, in some embodiments, the first bridge pattern (e.g., 212x) may have a smaller number of closed openings than the second bridge pattern (e.g., 242x), where the number may be an integer greater than or equal to 0.

[0246] FIG. 22A is a plan view showing one sensing unit according to an embodiment of the present invention.

[0247] Referring to FIGS. 7 and 22A, one sensing unit SUa may include a first electrode 210-1, a second electrode 220-1, a third electrode 230-1, and a fourth electrode 240-1.

[0248] The first electrode 210-1 includes a first pattern 211-1 and a first bridge pattern 212-1, and the fourth electrode 240-1 may include a second pattern 241-1 and a second bridge pattern 242-1.

[0249] The first pattern 211-1, the second electrode 220-1, and the second bridge pattern 242-1 may be included in the second conductive layer 204 (see FIG. 6A), and the third electrode 230-1, the first bridge pattern 212-1, and the second pattern 241-1 may be disposed in the first conductive layer 202 (see FIG. 6A).

[0250] In one embodiment of the present invention, a first opening 210op-1 may be defined in any one of the first electrode 210-1 and the third electrode 230-1, and a second opening 220op-1 may be defined in any one of the second electrode 230-1 and the fourth electrode 240-1. In FIG. 22A, the case where the first opening 211op-1 is defined in the first electrode 210-1 and the second opening 220op-1 is defined in the second electrode 220-1 is taken as an example for explanation, but it is not particularly limited thereto.

[0251] According to one embodiment of the present invention, the area or shape of each of the first opening 211op-1 and the second opening 220op-1 can be adjusted to adjust the capacitance between the first electrode 210-1 and the third electrode 230-1 and the capacitance between the second electrode 220-1 and the fourth electrode 240-1. Therefore, an appropriate level of capacitance can be provided in consideration of the touch sensitivity and the pen sensing sensitivity.

[0252] In addition, the sensing unit SUa may further include a dummy pattern DMP. The dummy pattern DMP is floating or electrically floating and may be provided in an area where the first to fourth electrodes 210-1, 220-1, 230-1, 240-1 are not arranged. Since the dummy pattern DMP is arranged in the empty area, the probability that a specific pattern is visually recognized due to external light reflection can be reduced. That is, an electronic device 1000 (see FIG. 1A) with improved visibility due to external light reflection can be provided.

[0253] FIG. 22B is a plan view showing one sensing unit according to an embodiment of the present invention.

[0254] Referring to FIG. 22B, one sensing unit SUb may have a structure in which the sensing unit SUa described in FIG. 22A is repeatedly arranged. In FIG. 22B, a structure in which the structure described in FIG. 22A is repeatedly arranged in a 2×2 manner is shown as an example. However, it is not particularly limited thereto, and it may have a structure in which it is repeatedly arranged in a 3×3 manner.

[0255] The first electrode 210-2 included in one sensing unit SUb may include a plurality of first divided electrodes 210-dpb. The first divided electrodes 210-dpb may be electrically connected to each other to receive or provide the same signal. The second electrode 220-2 includes a plurality of second divided electrodes 220-dpa, the third electrode 230-2 includes a plurality of third divided electrodes 230-dpb, and the fourth electrode 240-2 may include a plurality of fourth divided electrodes 240-dpa.

[0256] Each of the first to fourth divided electrodes 210-dpb, 220-dpa, 230-dpb, and 240-dpa may correspond to a signal transmission path or a resistance path through which a signal is transmitted. Each of the first to fourth divided electrodes 210-dpb, 220-dpa, 230-dpb, and 240-dpa may be in a form close to a rod shape extending along a specific direction. In this case, the resistance path can be minimized. Therefore, if the path of the resistance path becomes shorter and the number of resistance paths connected in parallel increases, the resistance of each of the first to fourth divided electrodes 210-dpb, 220-dpa, 230-dpb, and 240-dpa can be reduced. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0257] FIG. 23 is a plan view showing one sensing unit SUc according to an embodiment of the present invention.

[0258] Referring to FIG. 23, one sensing unit SUc may include a first electrode 210-3, a second electrode 220-3, a third electrode 230-3, and a fourth electrode 240-3.

[0259] The first electrode 210-3 may include a plurality of first divided electrodes 210-dpc spaced apart in the first direction DR1. The second electrode 220-3 may include a plurality of second divided electrodes 220-dpb spaced apart in the second direction DR2. Each of the first divided electrodes 210-dpc may include a first sub-divided electrode 210dv1 and a second sub-divided electrode 210dv2 spaced apart in the first direction DR1. Each of the second divided electrodes 220-dpc may include a third sub-divided electrode 220dv1 and a fourth sub-divided electrode 220dv2 spaced apart in the second direction DR2.

[0260] The third electrode 230-3 may include a plurality of third divided electrodes 230-dpc spaced apart in the first direction DR1, and the fourth electrode 240-3 may include a plurality of fourth divided electrodes 240-dpb spaced apart in the second direction DR2.

[0261] The first divided electrode 210-dpc and the third divided electrode 230-dpc may be correspondingly adjacent to each other one by one, and the second divided electrode 220-dpb and the fourth divided electrode 240-dpb may be correspondingly adjacent to each other one by one. For example, one third divided electrode 230-dpc may be disposed between the first sub-divided electrode 210dv1 and the second sub-divided electrode 210dv2 of one first divided electrode 210-dpc. One fourth divided electrode 240-dpb may be disposed between the third sub-divided electrode 220dv1 and the fourth sub-divided electrode 220dv2 of one second divided electrode 220-dpb.

[0262] FIG. 24 is a plan view showing one sensing unit SUd according to an embodiment of the present invention.

[0263] Referring to FIG. 24, the sensing unit SUd may further include an auxiliary electrode 230axp as compared with the embodiment described in FIG. 23.

[0264] In one embodiment of the present invention, the auxiliary electrode 230axp may overlap with one of the plurality of third divided electrodes 230-dpc of the third electrode 230-3. That is, the auxiliary electrode 230axp may be electrically connected to one of the third divided electrodes 230-dpc. In this case, the overall resistance of the third electrode 230-3 may be reduced. However, this is only an example and is not particularly limited thereto.

[0265] In FIG. 24, the case where only one of the third divided electrodes 230-dpc overlaps with the auxiliary electrode 230axp is taken as an example for explanation, but it is not particularly limited thereto. For example, the sensing unit SUd may further include an auxiliary electrode that overlaps with a plurality of third divided electrodes 230-dpc, and each of the plurality of third divided electrodes 230-dpc may be electrically connected to the overlapping auxiliary electrode.

[0266] In another embodiment of the present invention, the sensing unit SUd may further include an auxiliary electrode, but the arrangement of the auxiliary electrode may be variously deformed. For example, the auxiliary electrode may overlap with the first electrode 210-3, and the first divided electrode 210-dpc may be electrically connected to the overlapping auxiliary electrode. Or, the auxiliary electrode may overlap with the second electrode 220-3, and the second divided electrode 220-dpc may be electrically connected to the overlapping auxiliary electrode. Or, the auxiliary electrode may overlap with the fourth electrode 240-3, and the fourth divided electrode 240-dpb may be electrically connected to the overlapping auxiliary electrode.

[0267] FIG. 25 is a plan view showing one sensing unit SUe according to an embodiment of the present invention.

[0268] Referring to FIG. 25, the sensing unit SUe may include a first electrode 210-4, a second electrode 220-4, a third electrode 230-4, and a fourth electrode 240-4.

[0269] The first electrode 210-4 includes a plurality of first divided electrodes 210-dpc1, 210-dpc2, 210-dpc3 spaced apart in the first direction DR1, and the second electrode 220-4 may include a plurality of second divided electrodes 220-dpb1, 220-dpb2, 220-dpb3 spaced apart in the second direction DR2.

[0270] In one embodiment of the present invention, one third electrode 230-4 may be adjacent to all of the first divided electrodes 210-dpc1, 210-dpc2, and 210-dpc3. For example, the third electrode 230-4 may include a first adjacent pattern 231a adjacent to one of the first divided electrodes 210-dpc1, 210-dpc2, and 210-dpc1, a second adjacent pattern 23ba adjacent to another one of the first divided electrodes 210-dpc1, 210-dpc2, and 210-dpc2, and a connection package 231c electrically connected to the first adjacent pattern 231a and the second adjacent pattern 231b.

[0271] In one embodiment of the present invention, one fourth electrode 240-4 may be adjacent to any one of the second divided electrodes 220-dpb1, 220-dpb2, and 220-dpb3. FIG. 25 shows an example in which the fourth electrode 240-4 is adjacent to the second divided electrode 220-dpb2. However, without being particularly limited thereto, the fourth electrode 240-4 may have a shape similar to that of the third electrode 230-4 and may be adjacent to all of the second divided electrodes 220-dpb1, 220-dpb2, and 220-dpb3.

[0272] In one embodiment of the present invention, each of the first electrode 210-4 and the second electrode 220-4 may have a plurality of resistance paths within one sensing unit SUe, and each of the third power supply 230-4 and the fourth electrode 240-4 may have a single resistance path.

[0273] FIG. 26 is a diagram showing the operation of a sensor driving unit 200C (see FIG. 5) according to one embodiment of the present invention.

[0274] Referring to FIGS. 5 and 26, the sensor driving unit 200C may be configured to be selectively driven in any one of a first operation mode DMD1, a second operation mode DMD2, and a third operation mode DMD3.

[0275] The first operation mode DMD1 can be called a touch and pen standby mode, the second operation mode DMD2 can be called a touch activation and pen standby mode, and the third operation mode DMD3 can be called a pen activation mode. The first operation mode DMD1 can be a mode that waits for the first input 2000 and the second input 3000. The second operation mode DMD2 can be a mode that senses the first input 2000 and waits for the second input 3000. The third operation mode DMD3 can be a mode that senses the second input 3000.

[0276] In one embodiment of the present invention, the sensor driving unit 200C can be driven first in the first operation mode DMD1. If the first input 2000 is sensed in the first operation mode DMD1, the sensor driving unit 200C can be switched (or changed) to the second operation mode DMD2. Or, if the second input 3000 is sensed in the first operation mode DMD1, the sensor driving unit 200C can be switched (or changed) to the third operation mode DMD3.

[0277] In one embodiment of the present invention, if the second input 3000 is sensed in the second operation mode DMD2, the sensor driving unit 200C can be switched to the third operation mode DMD3. If the first input 2000 is released (or not sensed) in the second operation mode DMD2, the sensor driving unit 200C can be switched to the first operation mode DMD1. If the second input 3000 is released (or not sensed) in the third operation mode DMD3, the sensor driving unit 200C can be switched (or changed) to the first operation mode DMD1.

[0278] FIG. 27 is a diagram showing the operation of the sensor driving unit 200C (see FIG. 5) according to one embodiment of the present invention.

[0279] Referring to FIGS. 5, 26, and 27, the operations in the first to third operation modes DMD1, DMD2, and DMD3 are exemplarily shown in the order of time t.

[0280] In the first operation mode DMD1, the sensor driving unit 200C can be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned and driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned and driven to detect the first input 2000. Although FIG. 27 exemplarily shows that the sensor driving unit 200C operates in the first mode MD1-d continuously after the second mode MD2-d, the order is not limited to this.

[0281] In the second operation mode DMD2, the sensor driving unit 200C can be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned and driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned and driven to detect the coordinates by the first input 2000.

[0282] In the third operation mode DMD3, the sensor driving unit 200C can be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned and driven to detect the coordinates by the second input 3000. In the third operation mode DMD3, the sensor driving unit 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not sensed).

[0283] Referring to both FIGS. 7, in the first mode MD1-d and the first mode MD1, both the third electrode 230 and the fourth electrode 240 (in the cases of FIGS. 6A, 6B, etc., the third and fourth electrodes 230, 240 correspond to the first conductive layer 202) can be grounded or an electrostatic voltage can be applied. Or, in the first mode MD1-d and the first mode MD1, both the third electrode 230 and the fourth electrode 240 may be floating (or electrically floating). Or, in the first mode MD1-d and the first mode MD1, signals having the same phase as the transmission signals provided to the first electrode 210 and the second electrode 220 (in the cases of FIGS. 6A, 6B, etc., the first and second electrodes 210, 220 correspond to the second conductive layer 204) can be applied to the third electrode 230 and the fourth electrode 240. In this case, inflow of touch noise through the third electrode 230 and the fourth electrode 240 can be prevented.

[0284] In the second mode MD2-d and the second mode MD2, one end of each of the third electrode 230 and the fourth electrode 240 (in the cases of FIGS. 6A, 6B, etc., the third and fourth electrodes 230, 240 correspond to the first conductive layer 202) can be floating. Also, in the second mode MD2-d and the second mode MD2, the other end of each of the third electrode 230 and the fourth electrode 240 can be grounded. Thus, compensation of the sensing signal can be maximized by the coupling between the first electrode 210 (in the cases of FIGS. 6A, 6B, etc., the first electrode 210 corresponds to the second conductive layer 204) and the third electrode 230 and the coupling between the second electrode 220 (in the cases of FIGS. 6A, 6B, etc., the second electrode 220 corresponds to the second conductive layer 204) and the fourth electrode 240.

[0285] FIG. 28 is a diagram showing an equivalent circuit diagram of four sensing units according to an embodiment of the present invention.

[0286] Referring to FIG. 28, the first to fourth sensing units SU11, SU12, SU21, and SU22 are exemplarily shown. The first sensing unit SU11 and the second sensing unit SU12 are adjacent to each other in the first direction DR1 and may commonly include the second electrode 220x and the fourth electrode 240x. The first sensing unit SU11 and the third sensing unit SU21 are adjacent to each other in the second direction DR2 and may commonly include the first electrode 210x and the third electrode 230x. Here, in the example of FIG. 28, each of the first to fourth electrodes 210x to 240x is formed at a different height position via an insulating layer. That is, the corresponding electrodes are opposed to each other via the insulating layer so as to form the first to fourth capacitances CM11 to CM41 and the first and second coupling capacitances Ccp1 and Ccp2. However, which capacitance is formed can be changed according to the required sensing degree or the like, and any of the first to fourth electrodes 210x to 240x can be omitted, or any electrodes can be variously formed, such as forming additional electrodes. Note that the electrode serving as the sensing electrode is preferably formed above the electrode opposed to the sensing electrode.

[0287] The third sensing unit SU21 and the fourth sensing unit SU22 are adjacent to each other in the first direction DR1 and may commonly include the second electrode 220y and the fourth electrode 240y. The second sensing unit SU12 and the fourth sensing unit SU22 are adjacent to each other in the second direction DR2 and may commonly include the first electrode 210y and the third electrode 230y.

[0288] The first to fourth capacitances (capacitance values) CM11, CM21, CM31, and CM41 may be formed in the first sensing unit SU11, the first to fourth capacitances CM12, CM22, CM32, and CM42 may be formed in the second sensing unit SU12, the first to fourth capacitances CM13, CM23, CM33, and CM43 may be formed in the third sensing unit SU21, and the first to fourth capacitances CM14, CM24, CM34, and CM44 may be formed in the fourth sensing unit SU22. Hereinafter, the first sensing unit SU11 will be described in detail.

[0289] The first to fourth capacitances CM11, CM21, CM31, and CM41 may have values that change with temperature. Therefore, the smaller the first to fourth capacitances CM11, CM21, CM31, and CM41 are, the better the temperature characteristics of the sensor layer 200 can be. An improvement in temperature characteristics means that the dielectric constant changes with temperature, and it can be understood that the probability of occurrence of ghost touch, which is recognized as a touch although it is not a touch, is reduced.

[0290] In one embodiment of the present invention, the first capacitance CM11 may be defined between the first electrode 210x and the second electrode 220x. The design range of the first capacitance CM11 may differ depending on the driving method of the sensor driving unit 200C (see FIG. 5). For example, the first capacitance CM11 may be several hundred fF (femto farad) in a state where no touch has occurred, and the change amount of the first capacitance CM11 may be several tens of fF when a touch occurs, but it is not particularly limited thereto.

[0291] In one embodiment of the present invention, the larger the change amount of the first capacitance CM11, the better. The minimum value of the change amount of the first capacitance CM11 may differ depending on the sensor driving unit 200C (see FIG. 5). For example, when a touch occurs, the minimum value of the change amount of the first capacitance CM11 may be 30 fF or more, or may be, for example, 34 fF. However, this is only an example, and the minimum value of the change amount of the first capacitance CM11 is not limited to the above example.

[0292] The second capacitance CM21, the third capacitance CM31, and the fourth capacitance CM41 are preferably as small as possible. For example, the second capacitance CM21, the third capacitance CM31, and the fourth capacitance CM41 may each be several hundred fF or less, or several tens of fF or less, but are not particularly limited thereto.

[0293] A first coupling capacitance Ccp1 (or referred to as a first capacitance) is defined between the first electrode 210x and the third electrode 230x, and a second coupling capacitance Ccp2 (or referred to as a second capacitance) may be defined between the second electrode 220x and the fourth electrode 240x. As the first coupling capacitance Ccp1 and the second coupling capacitance Ccp2 increase, the pen sensing performance of the sensor layer 200 (see FIG. 7) can be improved. Also, as the first coupling capacitance Ccp1 and the second coupling capacitance Ccp2 decrease, the touch sensing performance of the sensor layer 200 (see FIG. 7) can be improved. Therefore, the first coupling capacitance Ccp1 and the second coupling capacitance Ccp2 need to be set within an appropriate range.

[0294] According to an embodiment of the present invention, the overlapping areas of the first electrode 210x and the third electrode 230x and the overlapping areas of the second electrode 220x and the fourth electrode 240x are adjusted, so that the first coupling capacitance Ccp1 and the second coupling capacitance Ccp2 can be adjusted. For example, the first coupling capacitance Ccp1 can be 8 pF (picofarad) or more and 15 pF or less, and the second coupling capacitance Ccp2 can be 8 pF or more and 15 pF or less.

[0295] FIG. 29 is a diagram for explaining a first mode according to an embodiment of the present invention.

[0296] Referring to FIGS. 5, 27, and 29, the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 may include a mutual capacitance detection mode. FIG. 29 is a diagram for explaining the mutual capacitance detection mode in the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2.

[0297] In the mutual capacitance detection mode, the sensor driving unit 200C can sequentially provide the transmission signal TX to the first electrode 210, and detect the coordinates for the first input 2000 by using the received signal RX detected via the second electrode 220. For example, the sensor driving unit 200C can be configured to sense the change in the mutual capacitance between the first electrode 210 and the second electrode 220 and calculate the input coordinates. In the example of FIG. 29, a part of the first electrode 210 and a part of the second electrode 220 are formed at different height positions via an insulating layer, and a capacitance is formed by the first electrode 210, the second electrode 220, and the insulating layer. For example, the bridge portion of the first electrode 210 and the bridge portion of the second electrode 220 can be insulated and crossed with an insulating layer interposed therebetween. Also, a part of the third electrode 230 and a part of the fourth electrode 240 are positioned via an insulating layer, and a capacitance may be formed. The input coordinates may be detected by receiving the transmission signal TX provided to the first electrode 210 as the received signal RX via the second electrode 220. Note that the electrode serving as the sensing electrode is preferably formed above the electrode facing the sensing electrode.

[0298] FIG. 29 exemplarily shows that the transmission signal TX is provided to one first electrode 210 and the received signal RX is output from the second electrode 220. To clarify the signal representation, one first electrode 210 to which the transmission signal TX is provided in FIG. 29 is shown in bold. The sensor driving unit 200C can sense the change in capacitance between each of the first electrode 210 and the second electrode 220 and detect the input coordinates for the first input 2000.

[0299] In another embodiment of the present invention, at least one of the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 may further include a self-capacitance detection mode. The sensor driving unit 200C can be configured to output a driving signal to the first electrode 210 and the second electrode 220 in the self-capacitance detection mode, sense the change in capacitance of each of the first electrode 210 and the second electrode 220, and calculate the input coordinates.

[0300] FIG. 30A is a diagram showing an equivalent circuit diagram of four sensing units in a first mode according to an embodiment of the present invention. The equivalent circuit of FIG. 30A is the same as the equivalent circuit of FIG. 28.

[0301] Referring to FIGS. 29 and 30A, in the mutual capacitance detection mode, an example is shown in which a touch event TC has occurred in the fourth sensing unit SU22.

[0302] If a transmission signal TX is provided to the first electrode 210y, the sensor driving unit 200C receives received signals RX and RXS from the second electrodes 220x and 220y. The sensor driving unit 200C can sense a change in the capacitance between the first electrode 210y and the second electrode 220y, for example, the change in the first capacitance CM14, to detect the input coordinates for the touch event TC.

[0303] According to an embodiment of the present invention, in the mutual capacitance detection mode, the third electrodes 230x and 230y and the fourth electrodes 240x and 240y can all be grounded. In this case, even if the transmission signal TX provided to the first electrode 210y is transmitted to the third electrode 230x, it can escape to the ground without being transmitted to the other first electrode 210x via the third electrode 230x. That is, the parasitic component NSS that causes ghost touch can escape to the ground. Therefore, noise may not flow in via the third electrodes 230x and 230y and the fourth electrodes 240x and 240y.

[0304] Although FIG. 30A shows an example in which the third electrodes 230x and 230y and the fourth electrodes 240x and 240y are all grounded, it is not particularly limited thereto. For example, the third electrodes 230x and 230y may be grounded and the fourth electrodes 240x and 240y may be floated.

[0305] FIG. 30B is a diagram showing an equivalent circuit diagram of four sensing units in a first mode according to an embodiment of the present invention. The equivalent circuit of FIG. 30B is the same as the equivalent circuit of FIG. 28.

[0306] Referring to FIGS. 29 and 30B, in the mutual capacitance detection mode, an electrostatic voltage DCV can be applied to the third electrodes 230x, 230y and the fourth electrodes 240x, 240y. The electrostatic voltage DCV is a voltage having a predetermined level and can be a DC voltage.

[0307] According to an embodiment of the present invention, even if the transmission signal TX provided to the first electrode 210y is transmitted to the third electrode 230x, it is not transmitted to the other first electrodes 210x via the third electrode 230x, but can be transmitted to the node to which the electrostatic voltage DCV is provided. That is, the parasitic component NSS that causes ghost touch can escape to the node to which the electrostatic voltage DCV is provided.

[0308] FIG. 30B shows an example in which the electrostatic voltage DCV is provided to all of the third electrodes 230x, 230y and the fourth electrodes 240x, 240y, but is not particularly limited thereto. For example, the electrostatic voltage DCV may be provided to the third electrodes 230x, 230y, and the fourth electrodes 240x, 240y may be floated.

[0309] FIG. 31 is a diagram for explaining a second mode according to an embodiment of the present invention. FIG. 32A is a graph showing the waveform of a first signal according to an embodiment of the present invention. FIG. 32B is a graph showing the waveform of a second signal according to an embodiment of the present invention.

[0310] Referring to FIGS. 27, 32A, and 32B, the second mode MD2 may include a charge drive mode. The charge drive mode may include a search charge drive mode and a tracking charge drive mode.

[0311] The search charging drive mode can be the drive mode before sensing the position of the pen. Therefore, the first signal SG1 or the second signal SG2 can be provided to all the channels included in the sensor layer 200. That is, the entire area of the sensor layer 200 can be scanned in the search charging drive mode. When the pen PN is sensed in the search charging drive mode, then the sensor layer 200 can be driven for tracking charging. For example, in the tracking charging drive mode, the sensor drive unit 200C can sequentially output the first signal SG1 and the second signal SG2 to the area overlapping the point where the pen PN is sensed, rather than the entire sensor layer 200.

[0312] In the charging drive mode, the sensor drive unit 200C can apply the first signal SG1 to one of the third pad PD3 and the fifth pad PD5, and apply the second signal SG2 to the other one of the pads. The second signal SG2 can be an inverted-phase signal of the first signal SG1. For example, the first signal SG1 can be a sine wave signal.

[0313] Since the first signal SG1 and the second signal SG2 are applied to at least two pads, the current RFS can have a current path flowing from one pad to the other pad. Also, since the first signal SG1 and the second signal SG2 are sine wave signals having an inverse correlation with each other, the direction of the current RFS can change periodically. In other embodiments of the present invention, the first signal SG1 and the second signal SG2 may be rectangular wave signals having an inverse correlation with each other.

[0314] If the first signal SG1 and the second signal SG2 have an inverse correlation, the noise caused by the first signal SG1 in the display layer 100 (see FIG. 4) can be canceled out by the noise caused by the second signal SG2. Therefore, it is possible to suppress the occurrence of a flicker phenomenon in the display layer 100, and the display quality of the display layer 100 can be improved.

[0315] In another embodiment of the present invention, the first signal SG1 can be a sine wave signal. However, without being limited thereto, the first signal SG1 can be a rectangular wave signal. And the second signal SG2 can have a predetermined electrostatic voltage. For example, the second signal SG2 can be a ground voltage. That is, it can be considered that the pad to which the second signal SG2 is applied is grounded. In this case, a current RFS can flow from one pad to another pad. Also, even if another pad is grounded, since the first signal SG1 is a sine wave signal or a rectangular wave signal, the direction of the current RFS can change periodically.

[0316] Referring to FIG. 31, it shows that the second signal SG2 is provided to one third pad PD3 connected to one third trace line 230rt1, and the first signal SG1 is provided to one fifth pad PD5 connected to the third electrode 230. A current RFS can flow through the fifth pad PD5, the fifth trace line 230rt2 connected to the fifth pad PD5, the third electrode 230, a part of the third trace line 230rt1 connected to the third pad PD3, and the current path defined by the third pad PD3. The current path can have a coil shape. Therefore, in the charging drive mode of the second mode, the resonance circuit of the pen PN can be charged by the current path.

[0317] According to the present invention, the current path of the loop coil pattern can be implemented by the configuration included in the sensor layer 200. Therefore, the electronic device 1000 (see FIG. 1A) can charge the pen PN using the sensor layer 200. Therefore, since it is not necessary to separately add a configuration having a coil for charging the pen PN, an increase in the thickness, weight, and flexibility of the electronic device 1000 can be suppressed. Note that the current path formed by the loop coil pattern is not limited to the above-described manner as long as the pen PN can be charged.

[0318] In the charging drive mode, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be grounded, have an electrostatic voltage applied thereto, or be electrically floated. In particular, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be floated. In this case, no current RFS may flow through the first electrode 210, the second electrode 220, and the fourth electrode 240. Since the third electrode 230 is included in the current path for charging the pen PN in the charging drive mode described above, the other first, second, and fourth electrodes 210, 220, and 240 can be grounded, have an electrostatic voltage applied thereto, or be electrically floated. That is, electrodes other than the electrodes included in the path of the current path can be grounded, have an electrostatic voltage applied thereto, or be electrically floated.

[0319] FIG. 33A is a diagram for explaining a second mode according to an embodiment of the present invention. FIG. 33B is a diagram for explaining the second mode with reference to one sensing unit according to an embodiment of the present invention.

[0320] Referring to FIGS. 33A and 33B, the second mode may include a charging drive mode and a pen sensing drive mode. FIGS. 33A and 33B are diagrams for explaining the pen sensing drive mode. FIG. 33B shows one sensing unit SU in which first to fourth induced currents la, lb, lc, and ld generated by the pen PN flow.

[0321] In the pen sensing drive mode, the sensor drive unit 200C can receive a first received signal PRX1a from the first electrode 210x and a second received signal PRX2a from the second electrode 220x.

[0322] In one embodiment of the present invention, the routing directions of one electrode and the other electrode of the sensor layers 200 that overlap each other may be different from each other. For example, the routing direction of the first electrode 210x and the routing direction of the third electrode 230x may be different from each other. Also, the routing direction of the second electrode 220x and the routing direction of the fourth electrode 240x may be different from each other. For example, in FIG. 33B, the first electrode 210x and the first trace line 210t may be connected at the lower part of the sensing unit SU, and the third power supply 230x and the third trace line 210rt1 may be connected at the upper part of the sensing unit SU. The second electrode 220x and the second trace line 220t may be connected at the right side of the sensing unit SU, and the fourth electrode 240x and the fourth trace line 240t may be connected at the left side of the sensing unit SU.

[0323] The resonance circuit of the pen PN can emit a magnetic field at the resonance frequency while discharging the charged electric charge. A first induced current la may be generated in the first electrode 210x by the magnetic field provided from the pen PN, and a second induced current lb may be generated in the second electrode 220x. Also, a third induced current lc may be generated in the third electrode 230x, and a fourth induced current ld may be generated in the fourth electrode 240x.

[0324] A first coupling capacitance Ccp1 may be formed between the third electrode 330x and the first electrode 210x, and a second coupling capacitance Ccp2 may be formed between the fourth electrode 240x and the second electrode 220x. The third induced current lc may be transmitted to the first electrode 210x through the first coupling capacitance Ccp1, and the fourth induced current ld may be transmitted to the second electrode 220x through the second coupling capacitance Ccp2.

[0325] The sensor driving unit 200C may receive a first received signal PRX1a based on the first induced current la and the third induced current lc from the first electrode 210x, and may receive a second received signal PRX2a based on the second induced current lb and the fourth induced current ld from the second electrode 220x. The sensor driving unit 200C may detect the input coordinates of the pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0326] The sensor driving unit 200C can receive the first received signal PRX1a from the first electrode 210x and the second received signal PRX2a from the second electrode 220x. At this time, one ends of the third electrode 230x and the fourth electrode 240x can both be floated. Therefore, the compensation of the sensing signal can be maximized by the coupling between the first electrode 210x and the third electrode 230x and the coupling between the second electrode 220x and the fourth electrode 240x.

[0327] Also, the other ends of the third electrode 230x and the fourth electrode 240x can be grounded or floated. Therefore, the third induced current lc and the fourth induced current ld can be sufficiently transmitted to the first electrode 210x and the second electrode 220x by the coupling between the first electrode 210x and the third electrode 230x and the coupling between the second electrode 220x and the fourth electrode 240x.

[0328] Although the preferred embodiments of the present invention have been described so far with reference to the preferred embodiments, those skilled in the art or those having ordinary knowledge in the relevant technical field should understand that the present invention can be variously modified and changed without departing from the spirit and technical scope of the present invention described in the claims below. Therefore, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be determined by the claims.

Explanation of Reference Numerals

[0329] 1000: Electronic device 100: Display layer 200: Sensor layer 200C: Sensor driving unit 210: First electrode 220: Second electrode 230: Third electrode 240: Fourth electrode

Claims

1. A substrate, A circuit layer disposed on the substrate and including transistors, A light-emitting element layer disposed on the circuit layer and including light-emitting elements electrically connected to the transistors, A sensor layer disposed on the light-emitting element layer, and The sensor layer includes A plurality of first sensing electrodes extending along a first direction, A plurality of second sensing electrodes extending along a second direction intersecting the first direction, and A plurality of first electrodes extending along the first direction, Each of the plurality of first sensing electrodes includes a plurality of first sub-electrodes, Each of the plurality of first electrodes includes a plurality of second sub-electrodes each having a first end and a second end, Each of the plurality of first sub-electrodes includes a first pattern and a first bridge pattern electrically connected to the first pattern, Two adjacent first sub-electrodes among the plurality of first sub-electrodes are electrically connected to each other at one end via a first connection line, Two adjacent second sub-electrodes among the plurality of second sub-electrodes that overlap the two adjacent first sub-electrodes are connected to each other at the second end via a second connection line, Adjacent second connection lines different from the second connection line are electrically connected to each other via a third connection line, and The first connection line is electrically connected to a first pad, and the third connection line is electrically connected to a second pad. An electronic device.

2. The electronic device according to claim 1, wherein two adjacent first electrodes among the plurality of first electrodes are electrically connected to each other at the second end via a first loop trace line.

3. The electronic device according to claim 2, wherein the plurality of first electrodes are electrically connected to each other at the first end via a second loop trace line.

4. A first end of the second loop trace line is connected to one third pad, and a second end of the second loop trace line opposite to the first end is connected to another third pad, In a charging drive mode, the second pad is configured to receive a first signal, and one of the third pads is configured to receive a second signal. The electronic device according to claim 3.

5. The electronic device according to claim 4, wherein the second signal has an inverted phase signal of the first signal.

6. A part of the plurality of second sensing electrodes is electrically connected to some of the fourth pads at one end of the second sensing electrodes, and another part of the second sensing electrodes is electrically connected to other fourth pads at the opposite end of the second sensing electrodes. The electronic device according to claim 1.

7. In the mutual capacitance detection mode, the first pad is configured to receive a transmission signal, and the fourth pad is configured to transmit a received signal. The electronic device according to claim 6.

8. A substrate, A circuit layer disposed on the substrate and including transistors, A light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, A sensor layer disposed on the light-emitting element layer, including: The sensor layer includes: A first sensing electrode extending along a first direction and including a first pattern and a first bridge pattern electrically connected to the first pattern; A second sensing electrode extending along a second direction intersecting the first direction; A first electrode extending along the first direction; A first dummy pattern insulated from the first sensing electrode; At least one of the first patterns includes a first portion, a second portion facing the first portion, and a third portion connected to one end of the first portion and one end of the second portion; The first dummy pattern is disposed between the first portion and the second portion; The first electrode overlaps the first dummy pattern and the first portion and the second portion of the at least one first pattern; The first electrode and the first bridge pattern are disposed in a first layer; The electronic device, wherein the first pattern, the second sensing electrode, and the first dummy pattern are disposed in a second layer different from the first layer.

9. The electronic device according to claim 8, wherein the first dummy pattern is completely surrounded by an opening defined by the first portion, the second portion, and the third portion of the at least one first pattern.

10. The electronic device according to claim 8, wherein the first dummy pattern includes a plurality of patterns, and the plurality of patterns are completely surrounded by an opening defined by the first portion, the second portion, and the third portion of the at least one first pattern.

11. The electronic device according to claim 10, wherein the plurality of patterns are electrically floated and electrically separated from each other.

12. The electronic device according to claim 8, wherein the first dummy pattern includes a plurality of mesh lines.

13. The electronic device according to claim 8, wherein the first electrode includes a second pattern and a second bridge pattern that is electrically connected to the second pattern and disposed on the same layer as the first bridge pattern.

14. The sensor layer further includes a second electrode extending along the second direction, The electronic device according to claim 8, wherein the second electrode includes a second pattern and a second bridge pattern that intersects the first bridge pattern and is electrically connected to the second pattern.

15. The second bridge pattern includes mesh lines that intersect each other and define at least one opening and closing opening therebetween, and mesh lines that intersect each other without defining an opening and closing opening therebetween, The electronic device according to claim 14, wherein the first bridge pattern intersects a part of the mesh lines that do not define the opening and closing opening of the second bridge pattern.

16. A substrate, A circuit layer disposed on the substrate and including transistors, A light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, A sensor layer disposed on the light-emitting element layer, including, The sensor layer, A first sensing electrode, A second sensing electrode intersecting the first sensing electrode, A first electrode overlapping the first sensing electrode, A second electrode overlapping the second sensing electrode, including, The first sensing electrode includes a first pattern and a first bridge pattern electrically connected to the first pattern, The second electrode includes a second pattern and a second bridge pattern electrically connected to the second pattern, The first bridge pattern intersects the second bridge pattern, Each of the first bridge pattern and the second bridge pattern includes a first mesh line and a second mesh line intersecting the first mesh line, The second bridge pattern has at least one opening and closing opening surrounded by the first mesh line and the second mesh line, The first bridge pattern has zero or more and fewer opening and closing openings than the second bridge pattern, The first electrode and the first bridge pattern are located in a first layer, The electronic device in which the first pattern, the second sensing electrode, and the second bridge pattern are located in a second layer different from the first layer.

17. The electronic device according to claim 16, wherein the first bridge pattern does not include a closed opening.

18. The electronic device according to claim 16, wherein the second bridge pattern includes the first and second mesh lines that intersect each other and define at least one closed opening therebetween, and the first and second mesh lines that intersect each other and do not define a closed opening therebetween.

19. The electronic device according to claim 18, wherein the first bridge pattern intersects a part of the first and second mesh lines that do not define the closed opening of the second bridge pattern.

20. The electronic device according to claim 16, wherein the first electrode includes a third pattern and a third bridge pattern electrically connected to the third pattern.

21. The electronic device according to claim 20, wherein the third bridge pattern includes a first bridge portion and a second bridge portion facing the first bridge portion.

22. The electronic device according to claim 21, wherein the first bridge pattern is disposed between the first bridge portion and the second bridge portion.

23. The electronic device according to claim 22, wherein the first bridge pattern and the third bridge pattern are disposed on the same layer.

24. A substrate, A circuit layer disposed on the substrate and including transistors, A light-emitting element layer disposed on the circuit layer and including a light-emitting element electrically connected to the transistors, A sensor layer disposed on the light-emitting element layer, and The sensor layer includes A first sensing electrode including a first pattern and a first bridge pattern electrically connected to the first pattern, A second sensing electrode intersecting the first sensing electrode, A first electrode overlapping the first sensing electrode and including a second pattern and a second bridge pattern electrically connected to the second pattern, A second electrode overlapping the second sensing electrode, and The second bridge pattern includes a first bridge portion and a second bridge portion facing the first bridge portion, The first bridge pattern is disposed between the first bridge portion and the second bridge portion, The first electrode, the first bridge pattern, and the second bridge pattern are disposed in a first layer, The electronic device, wherein the first pattern and the second sensing electrode are disposed on a second layer different from the first layer.

25. The second electrode includes a third pattern and a third bridge pattern electrically connected to the third pattern. The electronic device according to claim 24.

26. The electronic device according to claim 25, wherein the first bridge pattern and the third bridge pattern intersect each other.

27. The electronic device according to claim 25, wherein each of the first bridge pattern and the third bridge pattern includes a first mesh line and a second mesh line intersecting the first mesh line.

28. The third bridge pattern includes at least one opening / closing opening surrounded by the first mesh line and the second mesh line. The electronic device according to claim 27, wherein the first bridge pattern has zero or more and fewer opening / closing openings than the third bridge pattern.

29. The electronic device according to claim 25, wherein the first bridge pattern and the third bridge pattern are disposed on different layers from each other.

30. At least one of the first patterns includes a first portion, a second portion facing the first portion, and a third portion connected to one end of the first portion and one end of the second portion. The electronic device according to claim 24, wherein the sensor layer is insulated from the at least one first pattern and further includes a first dummy pattern disposed between the first portion and the second portion.

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