Thermoelectric element and thermoelectric conversion module

Abstract

To improve the heat taking-in efficiency from a heat source and the heat dissipation efficiency to a cooling source.SOLUTION: A thermoelectric element (1a) includes a molding body (2) of a thermoelectric material including a first surface (3) and a second surface (4) that face each other, a first electrode (5) provided on the first surface (3) of the molding body (2), and a second electrode (6) provided on the second surface (4) of the molding body (2) and overlapping with at least a part of the first electrode (5) in a plan view seen from the first surface (3) side.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a thermoelectric element and a thermoelectric conversion module.

Background Art

[0002] In recent years, thermoelectric elements that can convert heat into electricity using a temperature difference and thermoelectric conversion modules including a plurality of the thermoelectric elements have attracted high attention due to environmental advantages and the like, and research and development have been actively carried out.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Documents 1 to 6 describe a thermoelectric conversion module including a plurality of thermoelectric elements. However, the thermoelectric conversion modules described in Patent Documents 1 to 6 do not use a thermoelectric element in which a first electrode and a second electrode are directly provided on a thermoelectric material. Therefore, it is necessary to use a first separate member (for example, a substrate) provided with the first electrode and a second separate member (for example, a substrate) provided with the second electrode. In such a case, since the thermoelectric material is in contact with the cold source via the first electrode and the first separate member and in contact with the heat source via the second electrode and the second separate member, there is a problem that the heat intake efficiency from the heat source and the heat dissipation efficiency to the cold source are lowered.

[0005] An aspect of the present disclosure aims to provide a thermoelectric element and a thermoelectric conversion module that can improve the heat intake efficiency from a heat source and the heat dissipation efficiency to a cold source.

Means for Solving the Problems

[0006] In order to solve the above problems, the thermoelectric element of the present disclosure a molded body of a thermoelectric material including a first surface and a second surface facing each other; a first electrode provided on the first surface of the molded body; a second electrode provided on the second surface of the molded body and overlapping at least a part of the first electrode in a plan view seen from the first surface side.

[0007] In order to solve the above problems, the thermoelectric conversion module of the present disclosure a plurality of the thermoelectric elements; a plurality of wiring-embedded partition walls; and each of the plurality of thermoelectric elements is electrically connected in series via wiring included in each of the plurality of wiring-embedded partition walls such that the first electrode faces the cold source side and the second electrode faces the heat source side.

Advantages of the Invention

[0008] According to one aspect of the present disclosure, a thermoelectric element and a thermoelectric conversion module can be provided that can improve the heat intake efficiency from a heat source and the heat dissipation efficiency to a cold source.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Mode for Carrying Out the Invention

[0010] Regarding the embodiments of the present disclosure, if described with reference to FIGS. 1 to 16, it is as follows. Hereinafter, for convenience of explanation, components having the same functions as those described in a specific embodiment may be given the same reference numerals, and the description thereof may be omitted.

[0011] 〔Embodiment 1〕 FIG. 1 is a perspective view showing a molded body 2 of a thermoelectric material included in the thermoelectric element 1 of Embodiment 1. FIG. 2 is a diagram for explaining a part of the manufacturing process of the thermoelectric element 1 of Embodiment 1. FIG. 3 is a diagram showing the hot pressing process and the singulation process corresponding to the molded body forming process S11 included in the manufacturing process of the thermoelectric element 1 of Embodiment 1. FIG. 4 is a diagram showing an example of each of the hot pressing process and the singulation process shown in FIG. 3. FIG. 5 is a diagram for explaining a schematic configuration of the thermoelectric element 1 of Embodiment 1 and its manufacturing process.

[0012] The molded body 2 of the thermoelectric material shown in FIG. 1 includes a first surface 3 and a second surface 4 facing each other. In the present embodiment, the case where the molded body 2 of the thermoelectric material has a rectangular parallelepiped shape will be described as an example. However, if it includes the first surface 3 and the second surface 4 facing each other and, in Embodiment 2, a side surface provided with, for example, an adhesive, which is a fixing member to be described later, its shape is not particularly limited.

[0013] As performance indicators of the thermoelectric material or the thermoelectric element 1, generally, the Seebeck coefficient S (S = ΔV / ΔT), and the power factor PF (PF = S 2 ×σ, unit: W / (K 2 cm)), and the dimensionless performance index ZT (ZT = PF×T / κ) using the power factor PF are often used. Here, σ is the electrical conductivity (unit: S / cm), T is the absolute temperature (unit: K), and κ is the thermal conductivity (unit: W / (Kcm)).

[0014] When a temperature difference ΔT is applied to a semiconductor or a conductor, a voltage (thermoelectric power) ΔV proportional to the temperature difference ΔT is generated. This phenomenon is called the Seebeck phenomenon, and the proportionality coefficient is called the Seebeck coefficient S (S = ΔV / ΔT). The Seebeck coefficient S is determined by the thermoelectric material constituting the molded body 2. Therefore, in the molded body 2 of the thermoelectric material shown in FIG. 1, when the second surface 4 contacts the heat source, the first surface 3 contacts the cold source, and a temperature difference ΔT is generated by the heat dissipation from the first surface 3, in terms of the shape surface, in order to obtain a higher voltage (thermoelectric power) ΔV, it is effective to increase the temperature difference ΔT by increasing the distance L between the first surface 3 and the second surface 4 and separating the heat source and the cold source. However, when the distance L between the first surface 3 and the second surface 4 is increased, there arises a problem that the resistance R of the molded body 2 of the thermoelectric material increases. The resistance R of the molded body 2 of the thermoelectric material is determined by R = ρ×L / A. Here, ρ is the specific resistance value, L (shown in FIG. 1) is the distance between the first surface 3 and the second surface 4, and A (shown in FIG. 1) is the area of the cross-section parallel to the first surface 3 and the second surface 4. When the resistance R of the molded body 2 of the thermoelectric material increases, there is a problem that the output power W (W = V 2 / R) of the thermoelectric element 1 becomes small. Therefore, in the present embodiment, considering the balance between the distance L and the resistance R between the first surface 3 and the second surface 4 in the molded body 2 of the thermoelectric material, the molded body 2 of the thermoelectric material shown in FIG. 1 is formed in a shape in which the distance L between the first surface 3 and the second surface 4 is increased and the area A of the cross-section parallel to the first surface 3 and the second surface 4 is also increased. It is not limited to this, and according to the manufacturing method of the thermoelectric element 1 described later, the shape of the molded body 2 of the thermoelectric material shown in FIG. 1 can be easily set.

[0015] The thermoelectric material constituting the molded body 2 is preferably selected from materials having a Seebeck coefficient S of 10 μV / K or more. If a material with a larger Seebeck coefficient S is selected, even with the same temperature difference ΔT, a larger voltage (thermoelectromotive force) ΔV can be generated. The resistance value of the molded body 2 of the thermoelectric material is preferably, for example, 0.1 Ω or more and 3000 Ω or less. The distance L between the first surface 3 and the second surface 4 of the molded body 2 of the thermoelectric material is preferably, for example, 500 μm or more and 20000 μm or less. The area A of the cross-sectional plane parallel to the first surface 3 and the second surface 4 of the molded body 2 of the thermoelectric material can be determined using R = ρ×L / A, where R is the resistance of the molded body 2 of the thermoelectric material and L is the distance between the first surface 3 and the second surface 4 of the molded body 2 of the thermoelectric material. As described above, by balancing the distance L and the resistance R between the first surface 3 and the second surface 4 in the molded body 2 of the thermoelectric material, a good voltage (thermoelectromotive force) ΔV and output power W can be obtained.

[0016] Each of the thermoelectric elements 1a, 1b, and 1 shown in FIG. 5 includes a molded body 2 of a thermoelectric material including a first surface 3 and a second surface 4 facing each other, a first electrode 5 provided on the first surface 3 of the molded body 2, and a second electrode 6 provided on the second surface 4 of the molded body 2 and overlapping at least a part of the first electrode 5 in a plan view seen from the first surface 3 side. In the thermoelectric element 1a shown in FIG. 5, the first electrode 5 is directly provided on the first surface 3 of the molded body 2 of the thermoelectric material, and the second electrode 6 is directly provided on the second surface 4 of the molded body 2 of the thermoelectric material. Therefore, according to the thermoelectric element 1a shown in FIG. 5, the molded body 2 of the thermoelectric material can be in contact with a cold source via the first electrode 5 and can be in contact with a heat source via the second electrode 6. Thus, the heat uptake efficiency from the heat source and the heat dissipation efficiency to the cold source can be improved, so that the temperature difference ΔT can be made larger and a larger voltage (thermoelectromotive force) ΔV can be generated.

[0017] In this embodiment, taking as an example the case where the first electrode 5 is provided on the entire first surface 3 of the molded body 2 and the second electrode 6 is provided on the entire second surface 4 of the molded body 2, like the thermoelectric element 1a, the thermoelectric element 1b, and the thermoelectric element 1 shown in FIG. 5. However, it is not limited thereto. In a plan view seen from the first surface 3 side, it is sufficient that the second electrode 6 is provided so as to overlap at least a part of the first electrode 5. In the case where the first electrode 5 is provided on the entire first surface 3 of the molded body 2 and the second electrode 6 is provided on the entire second surface 4 of the molded body 2, like the thermoelectric element 1a, the thermoelectric element 1b, and the thermoelectric element 1 shown in FIG. 5, a larger output power W can be obtained.

[0018] In this embodiment, like the thermoelectric element 1b and the thermoelectric element 1 shown in FIG. 5, in a plan view seen from the first surface 3 side, a first metal foil 7 electrically connected to the first electrode 5 is provided so as to overlap at least a part of the first electrode 5, and in a plan view seen from the second surface 4 side, a second metal foil 8 electrically connected to the second electrode 6 is provided so as to overlap at least a part of the second electrode 6. However, it is not limited thereto. The first metal foil 7 and the second metal foil 8 can be suitably used when assembling the thermoelectric conversion modules 10 and 20, as will be described in Embodiments 2 and 3 below. Each of the first electrode 5 and the second electrode 6 is not particularly limited as long as it is made of a metal material. For example, it can be made of a noble metal material, and preferably made of a metal material selected from gold (Au), platinum (Pt), and silver (Ag). In this case, the output power W can be improved by reducing the contact resistance and the Schottky barrier. For the adhesion between the first electrode 5 and the first metal foil 7 and the adhesion between the second electrode 6 and the second metal foil 8, for example, a conductive adhesive such as silver paste can be used, but it is not limited thereto.

[0019] In each of the thermoelectric elements 1b and 1 shown in Fig. 5, the first electrode 5 made of a metal material and the first metal foil 7 are directly provided on the first surface 3 of the molded body 2 of the thermoelectric material, and the second electrode 6 made of a metal material and the second metal foil 8 are directly provided on the second surface 4 of the molded body 2 of the thermoelectric material. Therefore, according to the thermoelectric elements 1b and 1 shown in Fig. 5, the molded body 2 of the thermoelectric material can be in contact with a cold source via the first electrode 5 made of a metal material and the first metal foil 7, and can be in contact with a heat source via the second electrode 6 made of a metal material and the second metal foil 8. Thus, the heat uptake efficiency from the heat source and the heat dissipation efficiency to the cold source can be improved, so that the temperature difference ΔT can be made larger and a larger voltage (thermoelectromotive force) ΔV can be generated. Each of the first metal foil 7 and the second metal foil 8 is not particularly limited as long as it is made of a metal material, but is preferably made of copper (Cu) that satisfies both high thermal conductivity and low resistivity, and may be made of a metal material having a thermal conductivity greater than or equal to that of copper (Cu) and a specific resistance value less than or equal to that of copper (Cu). In the thermoelectric elements 1a, 1b, and 1 shown in Fig. 5, the distance between the first electrode 5 and the second electrode 6 is preferably 500 μm or more and 20,000 μm or less.

[0020] In this embodiment, an organic thermoelectric material is used as the thermoelectric material constituting the molded body 2, but the present invention is not limited thereto, and an inorganic thermoelectric material may be used. As the organic thermoelectric material, for example, poly(3-methylthiophene), which is a P-type organic thermoelectric material, can be used.

[0021] As shown in Fig. 2, the manufacturing method of the thermoelectric elements 1, 1a, and 1b includes a molded body forming step S11 of forming a molded body 2 of a thermoelectric material including a first surface 3 and a second surface 4 facing each other, a first electrode forming step S12 of forming a first electrode 5 on the first surface 3 of the molded body 2, and a second electrode forming step S13 of forming a second electrode 6 on the second surface 4 that overlaps at least a part of the first electrode 3 in a plan view seen from the first surface 3 side.

[0022] The molded body forming step S11 shown in Fig. 2 may include, for example, as shown in Fig. 3, a hot pressing step S1 of hot pressing a powder of a thermoelectric material or a sheet containing the thermoelectric material to obtain a film 2g of the thermoelectric material, and a singulation step S2 of obtaining a molded body 2 of the thermoelectric material by cutting the film 2g of the thermoelectric material obtained by the hot pressing step S1 into individual pieces. Also, in the molded body forming step S11, a molded body of an organic thermoelectric material may be formed.

[0023] Further, the method for manufacturing the thermoelectric element 1·1b may include a step S14 of providing a first metal foil 7 electrically connected to the first electrode 5 and a second metal foil 8 electrically connected to the second electrode 6, as shown in Fig. 5. Furthermore, the method for manufacturing the thermoelectric element 1 may include a step S15 of bending the opposite ends of the first metal foil 7 and the second metal foil 8, respectively, as shown in Fig. 5.

[0024] As described above, in this embodiment, poly(3-methylthiophene) is used as the thermoelectric material constituting the molded body 2. First, 3-methylthiophene was electrochemically polymerized at 2 V using ammonium perchlorate as a supporting electrolyte and acetonitrile as a solvent, and then dried to obtain poly(3-methylthiophene) powder. Then, the poly(3-methylthiophene) powder was hot-pressed at 150 °C and 100 kPa to obtain a thermoelectric material film. Then, the thermoelectric material film was cut into pieces to obtain a molded body 2 of the thermoelectric material in the shape of a 2 mm square cube. The poly(3-methylthiophene) used has a three-dimensional network molecular structure, so it is a conductive polymer with almost no difference in conductivity depending on the molecular orientation direction. Then, on the first surface 3 of the cubic molded body 2 of the thermoelectric material, a 10-nm-thick gold (Au) film was formed as the first electrode 5 by sputtering. On the second surface 4 facing the first surface 3 of the cubic molded body 2 of the thermoelectric material, a 10-nm-thick gold (Au) film was formed as the second electrode 6 by sputtering. In this embodiment, the first electrode 5 and the second electrode 6 are formed by sputtering, but it is not limited thereto. For example, a metal nanoparticle paste may be applied to form them, or they may be formed using a vacuum film-forming method other than sputtering. Then, a 18-μm-thick copper foil is attached to each of the gold (Au) film of the first electrode 5 and the gold (Au) film of the second electrode 6, and the ends are bent to obtain the thermoelectric element 1.

[0025] FIG. 4 is an example in the case where a conductive polymer having a difference in conductivity depending on the molecular orientation direction is used as the thermoelectric material constituting the molded body 2. In the hot-pressing step S1 of hot-pressing the powder of the thermoelectric material or the sheet containing the thermoelectric material shown in FIG. 4 to obtain the thermoelectric material film 2g, a thick film laminate can be obtained by performing the step of obtaining the thermoelectric material film by hot-pressing a plurality of times. In the singulation step S2 of obtaining the molded body 2 of the thermoelectric material shown in FIG. 4, the direction that maximally exhibits the performance according to the molecular orientation of the conductive polymer may be selected to be the first surface 3 and the second surface 4.

[0026] Further, although not shown, as the compact forming step S11, a step of putting powder of a thermoelectric material into a mold having a predetermined shape and performing hot pressing, and a step of taking out the compact from the mold having the predetermined shape may be performed to obtain a compact 2 of the thermoelectric material.

[0027] 〔Embodiment 2〕 FIG. 6 is a diagram for explaining an electrical connection relationship between a plurality of thermoelectric elements 1 in a thermoelectric conversion module 10 of Embodiment 2 including a plurality of thermoelectric elements 1 of Embodiment 1. FIG. 7 is a top view showing a schematic configuration of the thermoelectric conversion module 10 of Embodiment 2. FIG. 8 is an exploded perspective view and a perspective view showing a schematic configuration of the thermoelectric conversion module 10 of Embodiment 2. FIG. 9 is an exploded perspective view and a perspective view showing an example of a first wiring-embedded partition wall 11 included in the thermoelectric conversion module 10 of Embodiment 2. FIG. 10 is an exploded perspective view and a perspective view showing an example of a second wiring-embedded partition wall 12 included in the thermoelectric conversion module 10 of Embodiment 2. FIG. 11 is a diagram showing a schematic configuration of a partition wall 14 made of a resin material included in the thermoelectric conversion module 10 of Embodiment 2. FIG. 12 is a diagram for explaining a manufacturing process of the thermoelectric conversion module 10 of Embodiment 2.

[0028] As shown in FIG. 6, the thermoelectric conversion module 10 can be configured by connecting N (N is a natural number of 2 or more) thermoelectric elements 1, for example, three thermoelectric elements 1 in series. The voltage of the thermoelectric conversion module 10 in which N thermoelectric elements 1 are connected in series is a voltage obtained by multiplying the voltage of the thermoelectric element 1 by N. Note that since FIG. 6 is a diagram for explaining an electrical connection relationship between a plurality of thermoelectric elements 1, the first electrode 5 and the second electrode 6 included in the thermoelectric element 1 are shown including wirings for electrically connecting the plurality of thermoelectric elements 1 to each other.

[0029] As shown in FIGS. 7 and 8, the thermoelectric conversion module 10 includes a plurality of thermoelectric elements 1 and a plurality of wiring-embedded partition walls. In the present embodiment, an example will be described in which the thermoelectric conversion module 10 includes nine thermoelectric elements 1(1,1) to 1(3,3), two first wiring-embedded partition walls 11, a second wiring-embedded partition wall 12, and a second wiring-embedded partition wall 13, but the present invention is not limited thereto. Each of the nine thermoelectric elements 1(1,1) to 1(3,3) is electrically connected in series via the first wirings L1 to L4 and the second wiring L5 included in each of the two first wiring-embedded partition walls 11, the second wiring-embedded partition wall 12, and the second wiring-embedded partition wall 13 such that the first electrode 5 faces the cold source side and the second electrode 6 faces the heat source side.

[0030] As shown in FIG. 8, in the thermoelectric conversion module 10, each of the nine thermoelectric elements 1(1,1) to 1(3,3) is fixed to at least a part of the two first wiring-embedded partition walls 11, the second wiring-embedded partition wall 12, and the second wiring-embedded partition wall 13 via the side surfaces other than the first surface 3 and the second surface 4 of the molded body 2. When fixing, for example, an adhesive can be used as the fixing member 19, and an epoxy adhesive can be used as the adhesive.

[0031] In this embodiment, as shown in FIGS. 7 and 8, in the thermoelectric conversion module 10, an example will be described in which nine thermoelectric elements 1(1,1) to 1(3,3) are arranged in a 3×3 matrix, but the present invention is not limited thereto. Two first wiring-embedded partition walls 11 are provided, the number of which is one less than the number of the columns, and are arranged between groups of thermoelectric elements belonging to two adjacent columns respectively. That is, one first wiring-embedded partition wall 11 is provided between the group of thermoelectric elements 1(1,1)·1(2,1)·1(3,1) belonging to the first column and the group of thermoelectric elements 1(1,2)·1(2,2)·1(3,2) belonging to the second column, and the other first wiring-embedded partition wall 11 is provided between the group of thermoelectric elements 1(1,2)·1(2,2)·1(3,2) belonging to the second column and the group of thermoelectric elements 1(1,3)·1(2,3)·1(3,3) belonging to the third column. The second wiring-embedded partition wall 12 is arranged from the side opposite to the first wiring-embedded partition wall 11 with respect to the group of thermoelectric elements 1(1,1)·1(2,1)·1(3,1) belonging to the first column, and the second wiring-embedded partition wall 13 is arranged from the side opposite to the first wiring-embedded partition wall 11 with respect to the group of thermoelectric elements 1(1,3)·1(2,3)·1(3,3) belonging to the last column, i.e., the third column.

[0032] FIG. 7 is a view of the thermoelectric conversion module 10 as seen from the upper surface side, that is, the side where the first electrode 5 and the first metal foil 7 are provided in the nine thermoelectric elements 1(1,1) to 1(3,3). The solid arrows in the figure indicate the direction of the current flowing through the upper surface side of the thermoelectric conversion module 10, and the dotted arrows in the figure indicate the direction of the current flowing through the lower surface side of the thermoelectric conversion module 10. Note that the symbol of a black circle in a circle means that the current flows from the lower surface side to the upper surface side of the thermoelectric conversion module 10, and the symbol of an X in a circle means that the current flows from the upper surface side to the lower surface side of the thermoelectric conversion module 10. Further, the arrows shown in the second wiring embedded partition wall 12 and the second wiring embedded partition wall 13 indicate the direction of the current flowing through the second wiring L5 included in each of the second wiring embedded partition wall 12 and the second wiring embedded partition wall 13. As shown in FIG. 7, in the thermoelectric conversion module 10, adjacent thermoelectric elements among the nine thermoelectric elements 1(1,1) to 1(3,3) are connected in series. Further, in the thermoelectric conversion module 10, since the current turns back at the end of the thermoelectric conversion module 10, the thermoelectric element groups belonging to the same column as the wiring embedded partition wall are alternately arranged.

[0033] As shown in FIG. 9, the first wiring-embedded partition wall 11 electrically connects one of the first electrode 5 and the second electrode 6 of the first thermoelectric element, which are two adjacent thermoelectric elements in the same row among the nine thermoelectric elements 1(1, 1) to 1(3, 3) arranged in a matrix, and the other of the first electrode 5 and the second electrode 6 of the second thermoelectric element. The first wiring-embedded partition wall 11 includes three electrically separated first wirings L1 to L3 corresponding to the number of rows of the matrix, a first insulating member 11a including a plurality of openings K1, K2, and K3 that sandwich the first wirings L1 to L3 and expose a part of each of the first wirings L1 to L3, and a second insulating member 11b including a plurality of openings K1', K2', and K3'. As shown in FIG. 9, the first wiring-embedded partition wall 11 is provided with cut portions G1 and G2 in consideration of the combination with the partition wall 14 made of a resin material shown in FIG. 11 described later. However, when the thermoelectric conversion module 10 does not include the partition wall 14 made of the resin material shown in FIG. 11, a first wiring-embedded partition wall 11' without the cut portions G1 and G2 may be used. In the present embodiment, as shown in FIG. 9, a case where the first wiring-embedded partition wall 11' without the cut portions G1 and G2 is manufactured first and then the cut portions G1 and G2 are formed to manufacture the first wiring-embedded partition wall 11 is taken as an example for explanation, but the present invention is not limited thereto. For example, after the cut portions G1 and G2 are formed in at least one of the first insulating member 11a and the second insulating member 11b, the first insulating member 11a and the second insulating member 11b may be bonded together so as to sandwich the first wirings L1 to L3.

[0034] As shown in FIG. 10, the second wiring-embedded partition wall 12 includes a second wiring L5 that electrically connects one of the first electrode 5 and the second electrode 6 of the third thermoelectric element 1(2,1), which are two adjacent thermoelectric elements in the same column in the first row among the nine thermoelectric elements 1(1,1) to 1(3,3) arranged in a matrix, and the other of the first electrode 5 and the second electrode 6 of the fourth thermoelectric element 1(3,1); a third insulating member 12b that sandwiches the second wiring L5 and includes openings K5' and K6' that expose a part of the second wiring L5; and a fourth insulating member 12a. Note that the second wiring-embedded partition wall 12 further includes a first wiring L4 for electrically connecting to the second electrode 6 of the thermoelectric element 1(1,1), and an opening K4' that exposes a part of the first wiring L4 may be formed in the third insulating member 12b, and an opening K4 that exposes a part of the first wiring L4 may be formed in the fourth insulating member 12a. In the case of the partition wall 14 made of a resin material shown in FIG. 11 described later, cut portions are not provided near both ends of the partition wall 14 made of a resin material (near the right end and the left end in FIG. 11). As shown in FIG. 8, in the present embodiment, the entire right end portion of the partition wall 14 made of a resin material in FIG. 8 is arranged to be in contact with the second wiring-embedded partition wall 13, and the entire left end portion of the partition wall 14 made of a resin material in FIG. 8 is arranged to be in contact with the second wiring-embedded partition wall 12'. Therefore, the case where the second wiring-embedded partition walls 12' and 13 without cut portions are used will be described as an example, but the present invention is not limited thereto. When cut portions are provided near both ends of the partition wall 14 made of a resin material (near the right end and the left end in FIG. 11), in consideration of the combination with the partition wall 14 made of a resin material, similar to the first wiring-embedded partition wall 11, as shown in FIG. 10, the second wiring-embedded partition wall 12 provided with cut portions G3 and G4 may be used.Also, when fabricating the second wiring-embedded partition wall 12 provided with the cut portions G3 and G4, as shown in FIG. 10, after first fabricating the second wiring-embedded partition wall 12' without the cut portions G3 and G4, the cut portions G3 and G4 may be formed to fabricate the second wiring-embedded partition wall 12. For example, after first forming the cut portions G3 and G4 in at least one of the fourth insulating member 12a and the third insulating member 12b, the fourth insulating member 12a and the third insulating member 12b may be bonded together so as to sandwich the first wiring L4 and the second wiring L5.

[0035] The second wiring-embedded partition wall 13 shown in FIG. 8 includes a second wiring L5 that electrically connects one of the first electrode 5 and the second electrode 6 of the third thermoelectric element 1(1, 3) and the other of the first electrode 5 and the second electrode 6 of the fourth thermoelectric element 1(2, 3), which are two adjacent thermoelectric elements in the same column in the third column, which is the last column, among the nine thermoelectric elements 1(1, 1) to 1(3, 3) arranged in a matrix; a third insulating member 12b that sandwiches the second wiring L5 and includes a plurality of openings for exposing a part of the second wiring L5; and a fourth insulating member 12a.

[0036] As shown in Fig. 9, the thickness of the portion where the first insulating member 11a of the first wiring-embedded partition wall 11, the first wirings L1 to L3, and the second insulating member 11b are laminated is preferably 0.002 mm or more and 1 mm or less. As shown in Fig. 10, the thickness of the portion where the third insulating member 12b of the second wiring-embedded partition walls 12 and 13, the second wiring L5, and the fourth insulating member 12a are laminated is preferably 0.002 mm or more and 1 mm or less. As described above, by reducing the thickness of the first wiring-embedded partition wall 11 and the thickness of the second wiring-embedded partition walls 12 and 13, when the thermoelectric conversion module 10 is cut so that a cut surface parallel to the first surface 3 and the second surface 4 is formed between the first surface 3 and the second surface 4 of each of the nine molded bodies 2 of the thermoelectric elements 1(1, 1) to 1(3, 3), the value of (the total area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 10) × 100% can be increased, and a thermoelectric conversion module 10 with higher thermoelectric conversion efficiency can be realized. Note that (the total area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 10) × 100% is preferably 80% or more and 99.96% or less.

[0037] As shown in FIG. 9, the openings K1 to K3, K1' to K3' that expose a part of each of the first wirings L1 to L3 of the first wiring-embedded partition wall 11 are the first openings formed at positions closer to the first electrode 5 than the second electrode 6, namely, openings K1, K2', K3, and the second openings formed at positions closer to the second electrode 6 than the first electrode 5, namely, openings K1', K2, K3'. With respect to the first wiring L1 of the first wiring-embedded partition wall 11, an opening K1 which is a first opening is formed in the first insulating member 11a, and an opening K1' which is a second opening is formed in the second insulating member 11b. With respect to the first wiring L2 of the first wiring-embedded partition wall 11, an opening K2 which is a second opening is formed in the first insulating member 11a, and an opening K2' which is a first opening is formed in the second insulating member 11b. With respect to the first wiring L3 of the first wiring-embedded partition wall 11, an opening K3 which is a first opening is formed in the first insulating member 11a, and an opening K3' which is a second opening is formed in the second insulating member 11b. And as shown in FIG. 9, in the first insulating member 11a, an opening K1 which is a first opening with respect to the first wiring L1 of the first wiring-embedded partition wall 11, an opening K2 which is a second opening with respect to the first wiring L2 of the first wiring-embedded partition wall 11, and an opening K3 which is a first opening with respect to the first wiring L3 of the first wiring-embedded partition wall 11 are respectively provided. Therefore, in the first insulating member 11a, the first openings and the second openings are alternately formed with respect to each of the first wirings L1 to L3 of the first wiring-embedded partition wall 11. Similarly, in the second insulating member 11b, an opening K1' which is a second opening with respect to the first wiring L1 of the first wiring-embedded partition wall 11, an opening K2' which is a first opening with respect to the first wiring L2 of the first wiring-embedded partition wall 11, and an opening K3' which is a second opening with respect to the first wiring L3 of the first wiring-embedded partition wall 11 are respectively provided. Therefore, in the second insulating member 11b, the first openings and the second openings are alternately formed with respect to each of the first wirings L1 to L3 of the first wiring-embedded partition wall 11.

[0038] As shown in FIG. 8, for each of the nine thermoelectric elements 1(1, 1) to 1(3, 3) included in the thermoelectric conversion module 10, a first metal foil 7 electrically connected to the first electrode 5 is provided so as to overlap at least a part of the first electrode 5 in a plan view seen from the side of the first surface 3, and a second metal foil 8 electrically connected to the second electrode 6 is provided so as to overlap at least a part of the second electrode 6 in a plan view seen from the side of the second surface 4. And a part of the first metal foil 7 is bent so as to face a first opening formed at a position closer to the first electrode 5 than the second electrode 6, and contacts a portion of the first wirings L1 to L3 exposed from the first wiring embedding partition wall 11 through the first opening. A part of the second metal foil 8 is bent so as to face a second opening formed at a position closer to the second electrode 6 than the first electrode 5, and contacts a portion of the first wirings L1 to L3 exposed from the first wiring embedding partition wall 11 through the second opening.

[0039] In each of the second wiring embedding partition wall 12 shown in FIG. 10 and the second wiring embedding partition wall 13 shown in FIG. 8, the plurality of openings exposing a part of the second wiring L5 are composed of an opening K5' which is a third opening formed at a position closer to the first electrode 5 than the second electrode 6, and an opening K6' which is a fourth opening formed at a position closer to the second electrode 6 than the first electrode 5. As shown in FIG. 10, in the third insulating member 12b, with respect to the second wiring L5 of the second wiring embedding partition walls 12 and 13, the opening K5' which is the third opening and the opening K6' which is the fourth opening are alternately formed. And as shown in FIG. 8, a part of the first metal foil 7 is bent so as to face a third opening formed at a position closer to the first electrode 5 than the second electrode 6, and contacts a portion of the second wiring L5 exposed from the second wiring embedding partition walls 12 and 13 through the third opening. A part of the second metal foil 8 is bent so as to face a fourth opening formed at a position closer to the second electrode 6 than the first electrode 5, and contacts a portion of the second wiring L5 exposed from the second wiring embedding partition walls 12 and 13 through the fourth opening.

[0040] As shown in FIGS. 8 and 11, the thermoelectric conversion module 10 may include two partition walls 14 made of a resin material, which are arranged between groups of thermoelectric elements belonging to two adjacent rows respectively, and the number of the partition walls is the number obtained by subtracting 1 from the number of rows of the matrix. As shown in FIG. 11, the partition wall 14 made of a resin material includes a plurality of cut portions G5 and G6. As shown in FIG. 8, the partition wall 14 made of a resin material is inserted into at least the first wiring embedded partition wall 11 by the plurality of cut portions G5 and G6 of the partition wall 14 made of a resin material. According to the thermoelectric conversion module 10 including the partition wall 14 made of a resin material, a more durable thermoelectric conversion module can be realized. On the other hand, when the thermoelectric conversion module 10 does not include the partition wall 14 made of a resin material, the flexibility of the thermoelectric conversion module can be improved, and for example, a thermoelectric conversion module that can be attached to a heat source having a curved surface shape can be realized.

[0041] Each of the first wirings L1 to L3 of the first wiring embedded partition wall 11 shown in FIG. 8 and each of the first wiring L4 and the second wiring L5 of the second wiring embedded partition walls 12 and 13 are preferably made of an N-type metal thermoelectric material. As described above, in the present embodiment, since a P-type organic thermoelectric material is used as the thermoelectric material constituting the molded body 2, in the thermoelectric conversion module 10, the molded bodies 2 made of the P-type organic thermoelectric material are connected to each other by the N-type metal thermoelectric material, so that a π-type thermoelectric conversion module can be realized. Note that nickel can be preferably used as the N-type metal thermoelectric material.

[0042] Incidentally, the thickness between the thermoelectric element groups belonging to each of two adjacent rows of the partition wall 14 made of a resin material is preferably 0.002 mm or more and 1 mm or less. As described above, by reducing the thickness of the partition wall 14 made of a resin material, when the thermoelectric conversion module 10 is cut so that a cut surface parallel to the first surface 3 and the second surface 4 is formed between the first surface 3 and the second surface 4 of each of the nine molded bodies 2 of the thermoelectric elements 1(1,1) to 1(3,3), the value of (the combined area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 10) × 100% can be increased, and a thermoelectric conversion module 10 with higher thermoelectric conversion efficiency can be realized. Incidentally, (the combined area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 10) × 100% is preferably 80% or more and 99.96% or less as described above.

[0043] Incidentally, the thermoelectric conversion module 10 may include at least one of a metal plate with heat dissipation fins formed thereon and a member made of a cooling material on the cold source side of the thermoelectric conversion module 10 (see FIG. 6). According to such a configuration, in each of the nine thermoelectric elements 1(1,1) to 1(3,3) included in the thermoelectric conversion module 10, the temperature difference ΔT can be made larger, and a larger voltage (thermoelectromotive force) ΔV can be generated. Therefore, a thermoelectric conversion module 10 with a larger output power W can be realized.

[0044] As shown in Fig. 12, the method for manufacturing a thermoelectric conversion module 10 includes a molded body 2 of a thermoelectric material including a first surface 3 and a second surface 4 facing each other, a first electrode 5 provided on the first surface 3 of the molded body 2, and a second electrode 6 provided on the second surface 4 of the molded body 2 and overlapping at least a part of the first electrode 5 in a plan view seen from the first surface 3 side. The method includes a step S21 of arranging a plurality of thermoelectric elements 1, a step S22 of arranging a first wiring embedding partition wall 11 including one or more first wirings L1 to L3 sandwiched between a plurality of thermoelectric elements 1 and including a plurality of openings K1 to K3 exposing a part of the first wirings L1 to L3 and a second insulating member 11b including a plurality of openings K1' to K3', and a step S23 of electrically connecting each of the plurality of thermoelectric elements 1 in series via the first wirings L1 to L3 included in each of the plurality of first wiring embedding partition walls 11.

[0045] In the step S23 of electrically connecting in series shown in Fig. 12, as shown in Fig. 8, each of the plurality of thermoelectric elements 1, in this embodiment, nine thermoelectric elements 1(1, 1) to 1(3, 3), is fixed to at least a part of the plurality of first wiring embedding partition walls 11 via side surfaces other than the first surface 3 and the second surface 4 of the molded body 2 such that the first electrode 5 faces the cold source side and the second electrode 6 faces the heat source side, and is electrically connected in series via the first wirings L1 to L3 included in each of the plurality of wiring embedding partition walls 11.

[0046] The method for manufacturing the thermoelectric conversion module 10 includes a step of manufacturing the first wiring embedding partition wall 11 before the step of arranging the first wiring embedding partition wall 11 shown in Fig. 12. In the case where the method for manufacturing the thermoelectric conversion module 10 includes a step of manufacturing the second wiring embedding partition walls 12 and 13, the method includes a step of manufacturing the second wiring embedding partition walls 12 and 13 before the step S22 of arranging the wiring embedding partition wall shown in Fig. 12.

[0047] In the process of manufacturing the first wiring-embedded partition wall 11, as shown in FIG. 9, on one of the first insulating member 11a and the second insulating member 11b, a metal material is formed by using any one of a vacuum deposition method, a printing method, and a coating method to form the first wirings L1 to L3, and then an organic material or an inorganic material is formed by using any one of a vacuum deposition method, a printing method, and a coating method to form the other of the first insulating member 11a and the second insulating member 11b. Further, in the process of manufacturing the first wiring-embedded partition wall 11, as shown in FIG. 9, a metal foil is provided on one of the first insulating member 11a and the second insulating member 11b to form the first wirings L1 to L3, and then an organic material or an inorganic material is formed by using any one of a vacuum deposition method, a printing method, and a coating method to form the other of the first insulating member 11a and the second insulating member 11b. Furthermore, the process of manufacturing the first wiring-embedded partition wall 11 includes a first step of forming one of the first insulating member 11a and the second insulating member 11b by forming an organic material or an inorganic material on a side surface other than the first surface 3 and the second surface 4 of each of the plurality of formed bodies 2 of the plurality of thermoelectric elements 1 arranged in the step S21 of arranging a plurality of thermoelectric elements 1, a second step of forming the first wirings L1 to L3 by forming a metal material on the one of the formed first insulating member 11a and the second insulating member 11b by using any one of a vacuum deposition method, a printing method, and a coating method, and a third step of forming the other of the first insulating member 11a and the second insulating member 11b by forming an organic material or an inorganic material by using any one of a vacuum deposition method, a printing method, and a coating method.

[0048] When the first insulating member 11a and the second insulating member 11b are organic materials, the first insulating member 11a and the second insulating member 11b can be formed by using, for example, polyethylene terephthalate, polyimide, polypropylene, polyethylene, polyurethane, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polystyrene, polyacetal, polycarbonate, epoxy resin, acrylic resin, fluororesin, acrylic resin, phenolic resin, but are not limited thereto.

[0049] When the first insulating member 11a and the second insulating member 11b are inorganic materials, the first insulating member 11a and the second insulating member 11b can be formed using, for example, metal oxides, metal nitrides, and metal carbides. Specifically, they can be formed using silicon oxide, titanium oxide, tantalum oxide, chromium oxide, aluminum oxide, zirconium oxide, magnesium oxide, aluminum nitride, silicon nitride, silicon carbide, etc., but are not limited thereto.

[0050] In addition, in order to make the thickness of the portion where the first insulating member 11a of the first wiring embedded partition wall 11, the first wirings L1 to L3, and the second insulating member 11b are laminated, for example, 0.002 mm, a first mask in which areas other than the positions corresponding to the openings K1 to K3 shown in FIG. 9 are openings is used to form a silicon oxide film with a thickness of 0.001 mm by vacuum deposition to form the first insulating member 11a. On the first insulating member 11a, a second mask in which the positions corresponding to the first wirings L1 to L3 shown in FIG. 9 are openings is used to form a Ni film with a thickness of 0.0003 mm by vacuum deposition. Then, a third mask in which areas other than the positions corresponding to the openings K1' to K3' shown in FIG. 9 are openings is used to form a silicon oxide film with a thickness of 0.0007 mm by vacuum deposition to form the second insulating member 11b. It is not limited to this, and the second insulating member 11b may be formed first, a Ni film may be formed on the second insulating member 11b, and then the first insulating member 11a may be formed.

[0051] Also, in order to make the thickness of the portion where the first insulating member 11a of the first wiring embedded partition wall 11, the first wirings L1 to L3, and the second insulating member 11b are laminated, for example, 1 mm, a photocurable acrylic resin is printed and cured by screen printing to form an insulating resin layer with a thickness of 0.5 mm to form the first insulating member 11a including the openings K1 to K3. On the first insulating member 11a, nickel paste is printed by screen printing to form a Ni film with a thickness of 0.2 mm in a predetermined shape. Then, a film-like polyethylene terephthalate with a thickness of 0.2 mm cut into a predetermined shape is pasted using an adhesive layer with a thickness of 0.1 mm to form the second insulating member 11b including the openings K1' to K3'.

[0052] Incidentally, the process of manufacturing the second wiring-embedded partition walls 12 and 13 is the same as the process of manufacturing the first wiring-embedded partition wall 11 described above.

[0053] In the present embodiment, polyethylene terephthalate with a thickness of 25 μm is used as each of the first insulating member 11a and the second insulating member 11b, and nickel foils with a thickness of 10 μm cut to predetermined dimensions are used as the first wirings L1 to L3. The nickel foils with a thickness of 10 μm cut to predetermined dimensions are sandwiched between two sheets of polyethylene terephthalate with a thickness of 25 μm, and after bonding them using a photocurable acrylic adhesive, they are cut to a predetermined size to fabricate the first wiring-embedded partition wall 11. The second wiring-embedded partition walls 12 and 13 are also fabricated in the same manner as the first wiring-embedded partition wall 11 described above.

[0054] When using a heat source or a cold source that is electrically conductive, such as a heat source or a cold source, for example, an iron pipe through which hot water or cold water flows inside, it is conceivable that the power generation efficiency decreases due to the conduction between the first metal foils 7 provided in the thermoelectric elements 1(1, 1) to 1(3, 3) of the thermoelectric conversion module 10 shown in FIG. 8. In order to avoid such a decrease in power generation efficiency, it is preferable to provide an insulating film (not shown) on the surface of the first metal foil 7, that is, the contact surface between the first metal foil 7 and the cold source, and it is preferable to provide an insulating film (not shown) on the surface of the second metal foil 8, that is, the contact surface between the second metal foil 8 and the heat source. The insulating film is preferably formed, for example, with a thickness of 10 nm or more and 10 μm or less in consideration of the heat absorption efficiency and the heat dissipation efficiency. For example, like the first insulating member 11a and the second insulating member 11b, it can be formed by using any of a vacuum deposition method, a printing method, and a coating method with an organic material or an inorganic material. When the first metal foil 7 and the second metal foil 8 are not provided, it is conceivable that the power generation efficiency decreases due to the conduction between the first electrodes 5 provided in the thermoelectric elements 1(1, 1) to 1(3, 3) or between the second electrodes 6. In order to avoid such a decrease in power generation efficiency, it is preferable to provide the above-described insulating film on the surface of the first electrode 5, that is, the contact surface between the first electrode 5 and the cold source, and it is preferable to provide the above-described insulating film on the surface of the second electrode 6, that is, the contact surface between the second electrode 6 and the heat source.

[0055] As shown in FIG. 8, the thermoelectric conversion module 10 includes nine thermoelectric elements 1(1,1) to 1(3,3) arranged in a 3-row and 3-column matrix, two first wiring-embedded partitions 11, one second wiring-embedded partition 12, one second wiring-embedded partition 13, and two partitions 14 made of a resin material. The nine thermoelectric elements 1(1,1) to 1(3,3) are adhered and fixed to any one of the first wiring-embedded partition 11, the second wiring-embedded partition 12, and the second wiring-embedded partition 13 via a fixing member 19, for example, an epoxy adhesive. The nine thermoelectric elements 1(1,1) to 1(3,3) electrically connected in series included in the thermoelectric conversion module 10 were arranged between a hot plate at 50°C and a hot plate at 30°C, and the thermoelectric characteristics were measured. The Seebeck coefficient S was 200 μV / K. Also, the electrical conductivity was 0.1 S / cm, and the power factor PF was 4.0×10 -10 W / (K 2 m) was obtained.

[0056] 〔Embodiment 3〕 FIG. 13 is a top view showing a schematic configuration of the thermoelectric conversion module 20 according to Embodiment 3. FIG. 14 is an exploded perspective view and a perspective view showing a schematic configuration of the thermoelectric conversion module 20 according to Embodiment 3. FIG. 15 is an exploded perspective view and a perspective view showing an example of the third wiring-embedded partition 22 included in the thermoelectric conversion module 20 according to Embodiment 3. FIG. 16 is an exploded perspective view and a perspective view showing an example of the fourth wiring-embedded partition 24 included in the thermoelectric conversion module 20 according to Embodiment 3.

[0057] As shown in FIGS. 13 and 14, the thermoelectric conversion module 20 includes a plurality of thermoelectric elements 1 and a plurality of wiring-embedded partitions. In the present embodiment, the case where the thermoelectric conversion module 20 includes nine thermoelectric elements 1(1,1) to 1(3,3), two first wiring-embedded partitions 21, a third wiring-embedded partition 22, a third wiring-embedded partition 23, and a fourth wiring-embedded partition 24 will be described as an example, but it is not limited thereto.

[0058] As shown in FIG. 14, in the thermoelectric conversion module 20, each of the nine thermoelectric elements 1(1,1) to 1(3,3) is fixed to at least a part of two first wiring embedded partitions 21, a third wiring embedded partition 22, and a third wiring embedded partition 23 via side surfaces other than the first surface 3 and the second surface 4 of the molded body 2.

[0059] In the present embodiment, as shown in FIGS. 13 and 14, in the thermoelectric conversion module 20, a case where nine thermoelectric elements 1(1,1) to 1(3,3) are arranged in a 3×3 matrix will be described as an example, but the present invention is not limited thereto. Two first wiring embedded partitions 21, which are the number obtained by subtracting 1 from the number of the columns, are provided and arranged between thermoelectric element groups belonging to two adjacent columns. That is, one first wiring embedded partition 21 is provided between the thermoelectric element group 1(1,1)·1(2,1)·1(3,1) belonging to the first column and the thermoelectric element group 1(1,2)·1(2,2)·1(3,2) belonging to the second column, and the other first wiring embedded partition 21 is provided between the thermoelectric element group 1(1,2)·1(2,2)·1(3,2) belonging to the second column and the thermoelectric element group 1(1,3)·1(2,3)·1(3,3) belonging to the third column. The third wiring embedded partition 22 is arranged on the side opposite to the first wiring embedded partition 21 with respect to the thermoelectric element group 1(1,1)·1(2,1)·1(3,1) belonging to the first column, and the second wiring embedded partition 23 is arranged on the side opposite to the first wiring embedded partition 21 with respect to the thermoelectric element group 1(1,3)·1(2,3)·1(3,3) belonging to the last column, which is the third column. Two fourth wiring embedded partitions 24, which are the number obtained by subtracting 1 from the number of the rows, are provided and arranged between thermoelectric element groups belonging to two adjacent rows.

[0060] FIG. 13 is a view of the thermoelectric conversion module 20 seen from the upper surface side, that is, the side where the first electrode 5 and the first metal foil 7 are provided in the nine thermoelectric elements 1(1,1) to 1(3,3). The solid arrows in the figure indicate the direction of the current flowing on the upper surface side of the thermoelectric conversion module 20, and the dotted arrows in the figure indicate the direction of the current flowing on the lower surface side of the thermoelectric conversion module 20. Note that the symbol of a black circle in a circle means that the current flows from the lower surface side to the upper surface side of the thermoelectric conversion module 20, and the symbol of an X in a circle means that the current flows from the upper surface side to the lower surface side of the thermoelectric conversion module 20. Further, the arrows shown in the third wiring embedded partition walls 22 and 23 and the fourth wiring embedded partition wall 24 indicate the direction of the current flowing through the third wirings L7 and L8 included in the third wiring embedded partition walls 22 and 23 and the direction of the current flowing through the fourth wiring L9 included in the fourth wiring embedded partition wall 24. As shown in FIG. 13, in the thermoelectric conversion module 20, the nine thermoelectric elements 1(1,1) to 1(3,3) are connected in series, and the current is folded back at the end of the thermoelectric conversion module 20 via the third wiring embedded partition walls 22 and 23 and the fourth wiring embedded partition wall 24. Therefore, the thermoelectric element groups belonging to the same column as either the first wiring embedded partition wall 21 or the third wiring embedded partition walls 22 and 23 are alternately arranged.

[0061] The first wiring-embedded partition wall 21 shown in FIGS. 13 and 14 can be manufactured in the same manner as the first wiring-embedded partition wall 11 shown in FIG. 9 described above in Embodiment 2. The first wiring-embedded partition wall 21 shown in FIG. 14 is different from the first wiring-embedded partition wall 11 shown in FIG. 9 in that, as shown in FIG. 13, the direction of the current in the second row is the same as the direction of the current in the first and third rows, while in FIG. 9, the direction of the current in the second row is opposite to the direction of the current in the first and third rows. Therefore, in the first wiring-embedded partition wall 21 shown in FIG. 14, it is different from the first wiring-embedded partition wall 11 shown in FIG. 9 in that the positions where the openings K1 to K3 and K1' to K3 are provided are the same for each of the first wirings L1 to L3. Therefore, in the case of the first wiring-embedded partition wall 21 shown in FIG. 14, in the first insulating member, a plurality of one of the first opening formed at a position closer to the first electrode 5 than the second electrode 6 and the second opening formed at a position closer to the second electrode 6 than the first electrode 5 are formed, and in the second insulating member, a plurality of the other of the first opening and the second opening are formed. For each of the nine thermoelectric elements 1(1, 1) to 1(3, 3) included in the thermoelectric conversion module 20, in a plan view seen from the first surface 3 side, a first metal foil 7 electrically connected to the first electrode 5 is provided so as to overlap at least a part of the first electrode 5, and in a plan view seen from the second surface 4 side, a second metal foil 8 electrically connected to the second electrode 6 is provided so as to overlap at least a part of the second electrode 6. A part of the first metal foil 7 is bent so as to face the first opening, and contacts a portion of the first wiring exposed from the first wiring-embedded partition wall 21 through the first opening. A part of the second metal foil 8 is bent so as to face the second opening, and contacts a portion of the first wiring exposed from the first wiring-embedded partition wall 21 through the second opening. On the other hand, in the case of the first wiring-embedded partition wall 11 shown in FIG. 9, in the first insulating member 11a, for each of the first wirings L1 to L3 of the first wiring-embedded partition wall 11, the openings K1 and K3 which are the first openings and the opening K2 which is the second opening are alternately formed, and in the second insulating member 11b, for each of the first wirings L1 to L3 of the first wiring-embedded partition wall 11, the opening K2' which is the first opening and the openings K1' and K3' which are the second openings are alternately formed.

[0062] Each of the third wiring-embedded partition wall 22 shown in FIG. 15 and the third wiring-embedded partition wall 23 shown in FIGS. 13 and 14 includes two electrically separated third wirings L7 and L8 that electrically connect one of the first electrodes 5 and the second electrodes 6 of the thermoelectric elements 1(1,1), 1(2,1), 1(3,1) in the first row or the other of the first electrodes 5 and the second electrodes 6 of the thermoelectric elements 1(1,3), 1(2,3), 1(3,3) in the third row to the fourth wiring L9 included in the fourth wiring-embedded partition wall 24, and a fifth insulating member 22a and a sixth insulating member 22b that sandwich the third wirings L7 and L8 and include a plurality of cut portions G7, G8, G7', G8' that expose a part of the third wirings L7 and L8. As shown in FIG. 15, a plurality of cut portions G7, G8, G7', G8' that expose a part of each of the third wirings L7 and L8 in the third wiring-embedded partition walls 22 and 23 are formed by overlapping the cut portions G7' and G8' that are the first cut portions formed in the fifth insulating member 22a and the cut portions G7 and G8 that are the second cut portions formed in the sixth insulating member 22b. The width orthogonal to the depth direction of the cut portions G7' and G8' that are the first cut portions may be formed wider than the width orthogonal to the depth direction of the cut portions G7 and G8 that are the second cut portions. In each of the plurality of cut portions G7, G8, G7', G8', the ends of the third wirings L7 and L8 are exposed, and a part of the fourth wiring L9 exposed from the fourth wiring-embedded partition wall 24 shown in FIG. 16 described later contacts the ends of the third wirings L7 and L8 exposed in each of the plurality of cut portions G7, G8, G7', G8' of the third wiring-embedded partition walls 22 and 23. As shown in FIG. 15, the third wiring-embedded partition wall 22 may include the first wiring L6. In the present embodiment, as shown in FIG. 15, an example will be described in which the fifth insulating member 22a and the sixth insulating member 22b are bonded together so as to sandwich the first wiring L6 and the third wirings L7 and L8 after the cut portions G7, G8, G7', G8' are formed first, but the present invention is not limited thereto. For example, after manufacturing a third wiring-embedded partition wall without the cut portions G7, G8, G7', G8', the cut portions G7, G8, G7', G8' may be formed.

[0063] As shown in Fig. 16, the fourth wiring-embedded partition wall 24 includes a fourth wiring L9 that electrically connects the third wirings L7 and L8 included in the third wiring-embedded partition wall 22 disposed for each of the thermoelectric element groups 1(1, 1), 1(2, 1), and 1(3, 1) belonging to the first row and the third wirings L7 and L8 included in the third wiring-embedded partition wall 23 disposed for each of the thermoelectric element groups 1(1, 3), 1(2, 3), and 1(3, 3) belonging to the third row, a seventh insulating member 24a and an eighth insulating member 24b that sandwich the fourth wiring L9 and include a plurality of cut portions G9 and G12 that expose a part of the fourth wiring L9. Note that the fourth wiring-embedded partition wall 24' shown in Fig. 16 is the fourth wiring-embedded partition wall in a state before forming the plurality of cut portions G9 to G12. In the present embodiment, as shown in Fig. 16, an example will be described in which the fourth wiring-embedded partition wall 24' without the cut portions G9 to G12 is manufactured first, and then the cut portions G9 to G12 are formed to manufacture the fourth wiring-embedded partition wall 24, but the present invention is not limited thereto. For example, after forming the cut portions G9 to G12 in at least one of the seventh insulating member 24a and the eighth insulating member 24b, the seventh insulating member 24a and the eighth insulating member 24b may be bonded together so as to sandwich the fourth wiring L9.

[0064] Each of the first wirings of the first wiring-embedded partition wall 21 shown in Figs. 13 and 14 and each of the third wirings L7 and L8 of the third wiring-embedded partition walls 22 and 23 shown in Figs. 13, 14, and 15 are preferably made of an N-type metal thermoelectric material. As described above, in the present embodiment, since a P-type organic thermoelectric material is used as the thermoelectric material constituting the molded body 2, in the thermoelectric conversion module 20, the molded bodies 2 made of the P-type organic thermoelectric material are connected to each other by the N-type metal thermoelectric material, so that a π-type thermoelectric conversion module can be realized. Note that nickel can be preferably used as the N-type metal thermoelectric material.

[0065] The thickness of the portion where the first insulating member, the first wiring, and the second insulating member of the first wiring embedded partition wall 21 shown in FIGS. 13 and 14 are laminated is preferably 0.002 mm or more and 1 mm or less. The thickness of the portion where the fifth insulating member, the third wiring, and the sixth insulating member of the third wiring embedded partition walls 22 and 23 shown in FIGS. 13, 14, and 15 are laminated is preferably 0.002 mm or more and 1 mm or less. The thickness of the portion where the seventh insulating member 24a, the fourth wiring L9, and the eighth insulating member 24b of the fourth wiring embedded partition wall 24 shown in FIG. 16 are laminated is preferably 0.002 mm or more and 1 mm or less. As described above, by reducing the thickness of the first wiring embedded partition wall 21, the thickness of the third wiring embedded partition walls 22 and 23, and the thickness of the fourth wiring embedded partition wall 24, when the thermoelectric conversion module 20 is cut so that a cut surface parallel to the first surface 3 and the second surface 4 is formed between the first surface 3 and the second surface 4 of each of the nine thermoelectric element molded bodies 1(1, 1) to 1(3, 3), the value of (the combined area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 20) × 100% can be increased, and a thermoelectric conversion module 20 with higher thermoelectric conversion efficiency can be realized. Note that (the combined area of the cut surfaces of each of the plurality of molded bodies 2 / the area of the cut surface of the thermoelectric conversion module 20) × 100% is preferably 80% or more and 99.96% or less.

[0066] When using a heat source or a cold source that has conductivity, such as a heat source or a cold source made of an iron pipe through which hot water or cold water flows inside, it is conceivable that the power generation efficiency will decrease due to the conduction between the first metal foils 7 provided on the thermoelectric elements 1(1, 1) to 1(3, 3) of the thermoelectric conversion module 20 shown in FIG. 14. In order to avoid such a decrease in power generation efficiency, it is preferable to provide an insulating film (not shown) on the surface of the first metal foil 7, that is, the contact surface between the first metal foil 7 and the cold source, and it is preferable to provide an insulating film (not shown) on the surface of the second metal foil 8, that is, the contact surface between the second metal foil 8 and the heat source. The insulating film is preferably formed, for example, with a thickness of 10 nm or more and 10 μm or less in consideration of the heat absorption efficiency and the heat dissipation efficiency. For example, like the first insulating member 11a and the second insulating member 11b, it can be formed by using any of a vacuum deposition method, a printing method, and a coating method with an organic material or an inorganic material. Also, when the first metal foil 7 and the second metal foil 8 are not provided, it is conceivable that the power generation efficiency will decrease due to the conduction between the first electrodes 5 provided on the thermoelectric elements 1(1, 1) to 1(3, 3) or between the second electrodes 6. In order to avoid such a decrease in power generation efficiency, it is preferable to provide the above-described insulating film on the surface of the first electrode 5, that is, the contact surface between the first electrode 5 and the cold source, and it is preferable to provide the above-described insulating film on the surface of the second electrode 6, that is, the contact surface between the second electrode 6 and the heat source.

[0067] As shown in FIG. 14, the thermoelectric conversion module 20 includes nine thermoelectric elements 1(1,1) to 1(3,3) arranged in a 3×3 matrix, two first wiring-embedded partitions 21, one third wiring-embedded partition 22, one third wiring-embedded partition 23, and two fourth wiring-embedded partitions 24. The nine thermoelectric elements 1(1,1) to 1(3,3) are adhered and fixed to any one of the first wiring-embedded partition 21, the third wiring-embedded partition 22, and the third wiring-embedded partition 23 via a fixing member 19, for example, an epoxy adhesive. Nine electrically serially connected thermoelectric elements 1(1,1) to 1(3,3) included in the thermoelectric conversion module 20 were arranged between a hot plate at 50°C and a hot plate at 30°C, and the thermoelectric characteristics were measured. The Seebeck coefficient S was 180 μV / K. Also, the electrical conductivity was 0.08 S / cm, and the power factor PF was 2.6×10 -10 W / (K 2 m).

[0068] 〔Summary〕 The thermoelectric element according to Embodiment 1 of the present disclosure includes a molded body of a thermoelectric material including a first surface and a second surface facing each other, a first electrode provided on the first surface of the molded body, and a second electrode provided on the second surface of the molded body and overlapping at least a part of the first electrode in a plan view seen from the first surface side.

[0069] The thermoelectric element according to Embodiment 2 of the present disclosure is the thermoelectric element according to Embodiment 1, and the first electrode may be provided on the entire first surface of the molded body, and the second electrode may be provided on the entire second surface of the molded body.

[0070] The thermoelectric element according to Embodiment 3 of the present disclosure is the thermoelectric element according to Embodiment 1 or 2, and a first metal foil electrically connected to the first electrode is provided so as to overlap at least a part of the first electrode in a plan view seen from the first surface side, and a second metal foil electrically connected to the second electrode may be provided so as to overlap at least a part of the second electrode in a plan view seen from the second surface side.

[0071] The thermoelectric element according to Embodiment 4 of the present disclosure is the thermoelectric element according to Embodiment 3, and each of the first metal foil and the second metal foil may be made of a metal material having a thermal conductivity equal to or higher than that of copper and a specific resistance value equal to or lower than that of copper.

[0072] The thermoelectric element according to Embodiment 5 of the present disclosure is the thermoelectric element according to any one of Embodiments 1 to 4, the first electrode is made of a metal material selected from gold, platinum, and silver, and the second electrode may be made of a metal material selected from gold, platinum, and silver.

[0073] The thermoelectric element according to Embodiment 6 of the present disclosure is the thermoelectric element according to any one of Embodiments 1 to 5, and the distance between the first electrode and the second electrode may be 500 μm or more and 20,000 μm or less.

[0074] The thermoelectric element according to Embodiment 7 of the present disclosure is the thermoelectric element according to any one of Embodiments 1 to 6, and preferably, the Seebeck coefficient of the thermoelectric material is 10 μV / K or more.

[0075] The thermoelectric element according to Embodiment 8 of the present disclosure is the thermoelectric element according to any one of Embodiments 1 to 7, and preferably, the resistance value of the molded body of the thermoelectric material is 0.1 Ω or more and 3000 Ω or less.

[0076] The thermoelectric element according to Embodiment 9 of the present disclosure is the thermoelectric element according to any one of Embodiments 1 to 8, and the thermoelectric material may be an organic thermoelectric material.

[0077] The thermoelectric conversion module according to Embodiment 10 of the present disclosure includes a plurality of thermoelectric elements according to any one of Embodiments 1 to 9 and a plurality of wiring-embedded partition walls, and each of the plurality of thermoelectric elements is electrically connected in series via the wiring included in each of the plurality of wiring-embedded partition walls such that the first electrode faces the cold source side and the second electrode faces the heat source side.

[0078] The thermoelectric conversion module according to Embodiment 11 of the present disclosure is the thermoelectric conversion module according to Embodiment 10, and each of the plurality of thermoelectric elements may be fixed to at least a part of the plurality of wiring-embedded partition walls via side surfaces other than the first surface and the second surface of the molded body.

[0079] The thermoelectric conversion module according to Embodiment 12 of the present disclosure is the thermoelectric conversion module according to Embodiment 10 or 11, and the plurality of thermoelectric elements are arranged in a matrix of m rows and n columns (where m and n are each natural numbers of 2 or more). The plurality of wiring-embedded partition walls include n - 1 first wiring-embedded partition walls arranged between groups of thermoelectric elements belonging to two adjacent columns, and second wiring-embedded partition walls arranged from the side opposite to the first wiring-embedded partition walls for each of the groups of thermoelectric elements belonging to the first column and the nth column. The first wiring-embedded partition wall includes m electrically separated first wirings that electrically connect one of the first electrode and the second electrode of a first thermoelectric element, which are two adjacent thermoelectric elements in the same row, and the other of the first electrode and the second electrode of a second thermoelectric element, and a first insulating member and a second insulating member that sandwich the first wiring and include a plurality of openings exposing a part of each of the first wirings. The second wiring-embedded partition wall may include a second wiring that electrically connects one of the first electrode and the second electrode of a third thermoelectric element, which are two adjacent thermoelectric elements in the same column of the first column and the nth column, and the other of the first electrode and the second electrode of a fourth thermoelectric element, a third insulating member that sandwiches the second wiring and includes a plurality of openings exposing a part of the second wiring, and a fourth insulating member.

[0080] The thermoelectric conversion module according to Embodiment 13 of the present disclosure is the thermoelectric conversion module according to Embodiment 12, and the thickness of the portion where the first insulating member, the first wiring, and the second insulating member of the first wiring-embedded partition wall are laminated is 0.002 mm or more and 1 mm or less, and the thickness of the portion where the third insulating member, the second wiring, and the fourth insulating member of the second wiring-embedded partition wall are laminated may be 0.002 mm or more and 1 mm or less.

[0081] The thermoelectric conversion module according to aspect 14 of the present disclosure is the thermoelectric conversion module according to aspect 12 or 13. A plurality of openings that expose a part of each of the first wirings of the first wiring embedded partition are composed of a first opening and a second opening formed in each of the first insulating member and the second insulating member. The first opening is formed at a position closer to the first electrode than the second electrode, and the second opening is formed at a position closer to the second electrode than the first electrode. For each of the first wirings of the first wiring embedded partition, one of the first opening and the second opening is formed in the first insulating member, and the other of the first opening and the second opening is formed in the second insulating member. In each of the first insulating member and the second insulating member, the first opening and the second opening are alternately formed for each of the first wirings of the first wiring embedded partition. Each of the plurality of thermoelectric elements is provided with a first metal foil electrically connected to the first electrode so as to overlap at least a part of the first electrode in a plan view seen from the first surface side, and a second metal foil electrically connected to the second electrode so as to overlap at least a part of the second electrode in a plan view seen from the second surface side. A part of the first metal foil is bent so as to face the first opening and contacts a portion of the first wiring exposed from the first wiring embedded partition through the first opening. A part of the second metal foil is bent so as to face the second opening and contacts a portion of the first wiring exposed from the first wiring embedded partition through the second opening. Such a configuration may be adopted.

[0082] The thermoelectric conversion module according to Embodiment 15 of the present disclosure is the thermoelectric conversion module according to Embodiment 14. A plurality of openings that expose a part of the second wiring in the second wiring-embedded partition wall are composed of a third opening and a fourth opening formed in the third insulating member. The third opening is formed at a position closer to the first electrode than the second electrode, and the fourth opening is formed at a position closer to the second electrode than the first electrode. In the third insulating member, the third opening and the fourth opening are alternately formed with respect to the second wiring of the second wiring-embedded partition wall. A part of the first metal foil is bent so as to face the third opening and contacts a portion of the second wiring exposed from the second wiring-embedded partition wall through the third opening. A part of the second metal foil is bent so as to face the fourth opening and contacts a portion of the second wiring exposed from the second wiring-embedded partition wall through the fourth opening. Such a configuration may be adopted.

[0083] The thermoelectric conversion module according to Embodiment 16 of the present disclosure is the thermoelectric conversion module according to any one of Embodiments 12 to 15, and includes m-1 partitions made of a resin material disposed between thermoelectric element groups belonging to two adjacent rows respectively. The partition made of the resin material includes a plurality of cut portions, and the partition made of the resin material may be configured to be inserted into at least the first wiring-embedded partition wall by the plurality of cut portions of the partition made of the resin material.

[0084] The thermoelectric conversion module according to Embodiment 17 of the present disclosure is the thermoelectric conversion module according to Embodiment 16, and the thickness between thermoelectric element groups belonging to two adjacent rows of the partition made of the resin material may be 0.002 mm or more and 1 mm or less.

[0085] The thermoelectric conversion module according to Embodiment 18 of the present disclosure is a thermoelectric conversion module according to Embodiment 10 or 11. The plurality of thermoelectric elements are arranged in a matrix of m rows and n columns (where m and n are each natural numbers of 2 or more). The plurality of wiring-embedded partition walls include n−1 first wiring-embedded partition walls arranged between groups of thermoelectric elements belonging to two adjacent columns, third wiring-embedded partition walls arranged from the side opposite to the first wiring-embedded partition walls for groups of thermoelectric elements belonging to the first column and the nth column respectively, and m−1 fourth wiring-embedded partition walls arranged between groups of thermoelectric elements belonging to two adjacent rows. The first wiring-embedded partition wall includes m electrically separated first wirings that electrically connect one of the first electrode and the second electrode of a first thermoelectric element and the other of the first electrode and the second electrode of a second thermoelectric element, which are two adjacent thermoelectric elements in the same row, and a first insulating member and a second insulating member that sandwich the first wiring and include a plurality of openings exposing a part of each of the first wirings. The third wiring-embedded partition wall includes a plurality of electrically separated third wirings that electrically connect one of the first electrode and the second electrode of the thermoelectric element in the first column or the other of the first electrode and the second electrode of the thermoelectric element in the nth column to a fourth wiring included in the fourth wiring-embedded partition wall, and a fifth insulating member and a sixth insulating member that sandwich the third wiring and include a plurality of cut portions exposing a part of the third wiring. The fourth wiring-embedded partition wall includes the fourth wiring that electrically connects the third wiring included in the third wiring-embedded partition wall arranged for each group of thermoelectric elements belonging to the first column and the third wiring included in the third wiring-embedded partition wall arranged for each group of thermoelectric elements belonging to the nth column, and a seventh insulating member and an eighth insulating member that sandwich the fourth wiring and include a plurality of cut portions exposing a part of the fourth wiring. The fourth wiring-embedded partition wall may be configured to be inserted into the first wiring-embedded partition wall and the third wiring-embedded partition wall by the plurality of cut portions of the fourth wiring-embedded partition wall.

[0086] The thermoelectric conversion module according to Aspect 19 of the present disclosure is the thermoelectric conversion module according to Aspect 18, and the thickness of the portion where the first insulating member, the first wiring, and the second insulating member of the first wiring-embedded partition wall are laminated is 0.002 mm or more and 1 mm or less, and the thickness of the portion where the fifth insulating member, the third wiring, and the sixth insulating member of the third wiring-embedded partition wall are laminated is 0.002 mm or more and 1 mm or less, and the thickness of the portion where the seventh insulating member, the fourth wiring, and the eighth insulating member of the fourth wiring-embedded partition wall are laminated may be 0.002 mm or more and 1 mm or less.

[0087] The thermoelectric conversion module according to aspect 20 of the present disclosure is the thermoelectric conversion module according to aspect 18 or 19, and the plurality of openings exposing a part of each of the first wirings of the first wiring embedded partition wall are composed of a first opening and a second opening formed in each of the first insulating member and the second insulating member. The first opening is formed at a position closer to the first electrode than the second electrode, and the second opening is formed at a position closer to the second electrode than the first electrode. For each of the first wirings of the first wiring embedded partition wall, one of the first opening and the second opening is formed in the first insulating member, and the other of the first opening and the second opening is formed in the second insulating member. A plurality of one of the first opening and the second opening are formed in the first insulating member, and a plurality of the other of the first opening and the second opening are formed in the second insulating member. Each of the plurality of thermoelectric elements is provided with a first metal foil electrically connected to the first electrode so as to overlap at least a part of the first electrode in a plan view seen from the first surface side, and a second metal foil electrically connected to the second electrode so as to overlap at least a part of the second electrode in a plan view seen from the second surface side. A part of the first metal foil is bent so as to face the first opening and contacts a portion of the first wiring exposed from the first wiring embedded partition wall through the first opening. A part of the second metal foil is bent so as to face the second opening and contacts a portion of the first wiring exposed from the first wiring embedded partition wall through the second opening. It may be configured as such.

[0088] The thermoelectric conversion module according to aspect 21 of the present disclosure is the thermoelectric conversion module according to aspect 20, and in the plurality of cut portions that expose a part of each of the third wirings in the third wiring embedded partition wall, the first cut portion formed in the fifth insulating member and the second cut portion formed in the sixth insulating member are overlapped and formed. The width orthogonal to the depth direction of the first cut portion is wider than the width orthogonal to the depth direction of the second cut portion. In each of the plurality of cut portions, an end portion of the third wiring is exposed, and a part of the fourth wiring exposed from the fourth wiring embedded partition wall may be in contact with the end portion of the third wiring exposed in each of the plurality of cut portions of the third wiring embedded partition wall.

[0089] The thermoelectric conversion module according to aspect 22 of the present disclosure is the thermoelectric conversion module according to any one of aspects 10 to 21, and the wirings included in each of the plurality of wiring embedded partition walls may be made of an N-type metal thermoelectric material.

[0090] The thermoelectric conversion module according to aspect 23 of the present disclosure is the thermoelectric conversion module according to aspect 22, and the wirings included in each of the plurality of wiring embedded partition walls may be made of nickel.

[0091] The thermoelectric conversion module according to aspect 24 of the present disclosure is the thermoelectric conversion module according to any one of aspects 10 to 23. When the thermoelectric conversion module is cut so that a cut surface parallel to the first surface and the second surface is formed between the first surface and the second surface of the molded body of each of the plurality of thermoelectric elements, (the total area of the cut surfaces of each of the plurality of molded bodies / the area of the cut surface of the thermoelectric conversion module) × 100% may be 80% or more and 99.96% or less.

[0092] The thermoelectric conversion module according to aspect 25 of the present disclosure is the thermoelectric conversion module according to any one of aspects 10 to 24, and on the cold source side, at least one of a metal plate with heat dissipation fins formed thereon and a member made of a cooling material may be provided.

[0093] The method for manufacturing a thermoelectric element according to aspect 26 of the present disclosure includes a molded body forming step of forming a molded body of a thermoelectric material including a first surface and a second surface facing each other, a first electrode forming step of forming a first electrode on the first surface of the molded body, and a second electrode forming step of forming a second electrode on the second surface that overlaps at least a part of the first electrode in a plan view seen from the first surface side.

[0094] The method for manufacturing a thermoelectric element according to aspect 27 of the present disclosure is the method for manufacturing a thermoelectric element according to aspect 26, and the molded body forming step may include a step of hot pressing a powder of the thermoelectric material or a sheet including the thermoelectric material, and a step of fragmenting the film of the thermoelectric material obtained by the hot pressing step by cutting.

[0095] The method for manufacturing a thermoelectric element according to aspect 28 of the present disclosure is the method for manufacturing a thermoelectric element according to aspect 26, and the molded body forming step may include a step of putting a powder of the thermoelectric material into a mold having a predetermined shape and hot pressing it, and a step of taking out the molded body from the mold having the predetermined shape.

[0096] The method for manufacturing a thermoelectric element according to aspect 29 of the present disclosure is the method for manufacturing a thermoelectric element according to any one of aspects 26 to 28, and in the molded body forming step, a molded body of an organic thermoelectric material may be formed.

[0097] The method for manufacturing a thermoelectric conversion module according to aspect 30 of the present disclosure includes a step of arranging a plurality of thermoelectric elements including a molded body of a thermoelectric material including a first surface and a second surface facing each other, a first electrode provided on the first surface of the molded body, and a second electrode provided on the second surface of the molded body that overlaps at least a part of the first electrode in a plan view seen from the first surface side, a step of arranging a wiring embedding partition wall including a first insulating member and a second insulating member that sandwich one or more wirings therebetween and include a plurality of openings for exposing a part of the wirings between the plurality of thermoelectric elements, and a step of electrically connecting each of the plurality of thermoelectric elements in series via the wirings included in each of the plurality of wiring embedding partition walls.

[0098] The method for manufacturing a thermoelectric conversion module according to Embodiment 31 of the present disclosure is the method for manufacturing a thermoelectric conversion module according to Embodiment 30. In the step of electrically connecting in series, each of the plurality of thermoelectric elements is fixed to at least a part of the plurality of wiring-embedded partition walls via a side surface of the molded body other than the first surface and the second surface, such that the first electrode faces the cold source side and the second electrode faces the heat source side, and they may be electrically connected in series via the wirings included in each of the plurality of wiring-embedded partition walls.

[0099] The method for manufacturing a thermoelectric conversion module according to Embodiment 32 of the present disclosure is the method for manufacturing a thermoelectric conversion module according to Embodiment 30 or 31, and includes a step of manufacturing the wiring-embedded partition wall before the step of arranging the wiring-embedded partition wall. In the step of manufacturing the wiring-embedded partition wall, a metal material is formed on one of the first insulating member and the second insulating member by using any one of a vacuum deposition method, a printing method, and a coating method to form the wiring, and then an organic material or an inorganic material is formed by using any one of a vacuum deposition method, a printing method, and a coating method to form the other of the first insulating member and the second insulating member.

[0100] The method for manufacturing a thermoelectric conversion module according to Embodiment 33 of the present disclosure is the method for manufacturing a thermoelectric conversion module according to Embodiment 30 or 31, and includes a step of manufacturing the wiring-embedded partition wall before the step of arranging the wiring-embedded partition wall. In the step of manufacturing the wiring-embedded partition wall, a metal foil is provided on one of the first insulating member and the second insulating member to form the wiring, and then an organic material or an inorganic material is formed by using any one of a vacuum deposition method, a printing method, and a coating method to form the other of the first insulating member and the second insulating member.

[0101] The method for manufacturing a thermoelectric conversion module according to Embodiment 34 of the present disclosure is the method for manufacturing a thermoelectric conversion module according to Embodiment 30 or 31. The step of arranging the wiring-embedded partition wall is the step of manufacturing the wiring-embedded partition wall. The step of manufacturing the wiring-embedded partition wall includes: a first step of forming one of the first insulating member and the second insulating member by forming an organic material or an inorganic material on a side surface of the molded body of each of the plurality of arranged thermoelectric elements other than the first surface and the second surface by using any one of a vacuum deposition method, a printing method, and a coating method; a second step of forming the wiring by forming a metal material on one of the first insulating member and the second insulating member by using any one of a vacuum deposition method, a printing method, and a coating method; and a third step of forming the other of the first insulating member and the second insulating member by forming an organic material or an inorganic material by using any one of a vacuum deposition method, a printing method, and a coating method.

[0102] The method for manufacturing a thermoelectric conversion module according to Embodiment 35 of the present disclosure is the method for manufacturing a thermoelectric conversion module according to any one of Embodiments 30 to 34, and the molded body of the thermoelectric material may be a molded body of an organic thermoelectric material.

[0103] [Supplementary Notes] The present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present disclosure. Furthermore, by combining the technical means disclosed in each embodiment, new technical features can be formed. [Industrial Applicability]

[0104] The present disclosure can be used for thermoelectric elements, thermoelectric conversion modules, methods for manufacturing thermoelectric elements, and methods for manufacturing thermoelectric conversion modules. [Description of Reference Numerals]

[0105] 1, 1a, 1b Thermoelectric element 2 Molded body of thermoelectric material Sheet containing 2g thermoelectric material 3 First surface 4 Second surface 5 First electrode 6 Second electrode 7 First metal foil 8 Second metal foil 10, 20 Thermoelectric conversion module 11 First wiring-embedded partition wall 11a First insulating member 11b Second insulating member 12, 13 Second wiring-embedded partition wall 12a Fourth insulating member 12b Third insulating member 14 Partition wall made of resin material 19 Fixing member 21 First wiring-embedded partition wall 22, 23 Third wiring-embedded partition wall 22a Fifth insulating member 22b Sixth insulating member 24 Fourth wiring-embedded partition wall 24a Seventh insulating member 24b Eighth insulating member L1~L4, L6 First wiring L5 Second wiring L7, L8 Third wiring L9 Fourth wiring K1~K4 Opening K1’~K6’ Opening G1~G12 Notch

Claims

1. A molded body of a thermoelectric material including a first surface and a second surface facing each other, a first electrode provided on the first surface of the molded body, a second electrode provided on the second surface of the molded body and overlapping at least a part of the first electrode in a plan view seen from the first surface side, the thermoelectric element including the second electrode.

2. The first electrode is provided on the entire first surface of the molded body, The second electrode is provided on the entire second surface of the molded body, the thermoelectric element according to claim 1.

3. In a plan view seen from the first surface side, a first metal foil electrically connected to the first electrode is provided so as to overlap at least a part of the first electrode, In a plan view seen from the second surface side, a second metal foil electrically connected to the second electrode is provided so as to overlap at least a part of the second electrode, the thermoelectric element according to claim 1.

4. Each of the first metal foil and the second metal foil is made of a metal material having a thermal conductivity equal to or higher than that of copper and a specific resistance value equal to or lower than that of copper, the thermoelectric element according to claim 3.

5. The first electrode is made of a metal material selected from gold, platinum, and silver, The second electrode is made of a metal material selected from gold, platinum, and silver, the thermoelectric element according to claim 3.

6. The distance between the first electrode and the second electrode is 500 μm or more and 20,000 μm or less, the thermoelectric element according to claim 1.

7. The Seebeck coefficient of the thermoelectric material is 10 μV / K or more, the thermoelectric element according to claim 1.

8. The resistance value of the molded body of the thermoelectric material is 0.1 Ω or more and 3000 Ω or less, the thermoelectric element according to claim 1.

9. The thermoelectric material is an organic thermoelectric material, the thermoelectric element according to claim 1.

10. A plurality of thermoelectric elements according to any one of claims 1 to 9, a plurality of wiring-embedded partition walls, and each of the plurality of thermoelectric elements is electrically connected in series via wiring included in each of the plurality of wiring-embedded partition walls such that the first electrode faces the cold source side and the second electrode faces the heat source side, a thermoelectric conversion module.

11. Each of the plurality of thermoelectric elements is fixed to at least a part of the plurality of wiring-embedded partition walls via side surfaces other than the first surface and the second surface of the molded body, the thermoelectric conversion module according to claim 10.

12. The plurality of thermoelectric elements are arranged in an m×n matrix (where m and n are each natural numbers of 2 or more). The plurality of wiring-embedded partition walls include n−1 first wiring-embedded partition walls arranged between groups of thermoelectric elements belonging to two adjacent columns respectively, and second wiring-embedded partition walls arranged from the side opposite to the first wiring-embedded partition walls for the groups of thermoelectric elements belonging to the first column and the nth column respectively. The first wiring-embedded partition wall includes m electrically separated first wirings that electrically connect one of the first electrode and the second electrode of a first thermoelectric element, which are two adjacent thermoelectric elements in the same row, and the other of the first electrode and the second electrode of a second thermoelectric element, and a first insulating member and a second insulating member that sandwich the first wiring and include a plurality of openings that expose a part of each of the first wirings. The second wiring-embedded partition wall includes a second wiring that electrically connects one of the first electrode and the second electrode of a third thermoelectric element, which are two adjacent thermoelectric elements in the same column of the first column and the nth column, and the other of the first electrode and the second electrode of a fourth thermoelectric element, a third insulating member that sandwiches the second wiring and includes a plurality of openings that expose a part of the second wiring, and a fourth insulating member. The thermoelectric conversion module according to claim 11.

13. The thickness of the portion where the first insulating member, the first wiring, and the second insulating member of the first wiring-embedded partition wall are laminated is 0.002 mm or more and 1 mm or less. The thickness of the portion where the third insulating member, the second wiring, and the fourth insulating member of the second wiring-embedded partition wall are laminated is 0.002 mm or more and 1 mm or less. The thermoelectric conversion module according to claim 12.

14. The plurality of openings that expose a part of each of the first wirings of the first wiring-embedded partition wall are composed of a first opening and a second opening formed in the first insulating member and the second insulating member respectively. The first opening is formed at a position closer to the first electrode than the second electrode. The second opening is formed at a position closer to the second electrode than the first electrode. For each of the first wirings of the first wiring-embedded partition wall, one of the first opening and the second opening is formed in the first insulating member, and the other of the first opening and the second opening is formed in the second insulating member. In each of the first insulating member and the second insulating member, the first openings and the second openings are alternately formed with respect to the first wirings of the first wiring embedded partition walls, Each of the plurality of thermoelectric elements is provided with In a plan view seen from the first surface side, a first metal foil electrically connected to the first electrode is provided so as to overlap at least a part of the first electrode, In a plan view seen from the second surface side, a second metal foil electrically connected to the second electrode is provided so as to overlap at least a part of the second electrode, A part of the first metal foil is bent so as to face the first opening, and contacts a portion of the first wiring exposed from the first wiring embedded partition wall through the first opening, A part of the second metal foil is bent so as to face the second opening, and contacts a portion of the first wiring exposed from the first wiring embedded partition wall through the second opening. The thermoelectric conversion module according to claim 12.

15. The plurality of openings that expose a part of the second wiring in the second wiring embedded partition wall are composed of a third opening and a fourth opening formed in the third insulating member, The third opening is formed at a position closer to the first electrode than the second electrode, The fourth opening is formed at a position closer to the second electrode than the first electrode, In the third insulating member, the third opening and the fourth opening are alternately formed with respect to the second wiring of the second wiring embedded partition wall, A part of the first metal foil is bent so as to face the third opening, and contacts a portion of the second wiring exposed from the second wiring embedded partition wall through the third opening, A part of the second metal foil is bent so as to face the fourth opening, and contacts a portion of the second wiring exposed from the second wiring embedded partition wall through the fourth opening. The thermoelectric conversion module according to claim 14.

16. m - 1 partitions made of a resin material are provided between thermoelectric element groups belonging to each of two adjacent rows, The partition made of the resin material includes a plurality of cut portions, The partition made of the resin material is inserted into at least the first wiring embedded partition wall by the plurality of cut portions of the partition made of the resin material. The thermoelectric conversion module according to claim 12.

17. The thermoelectric conversion module according to claim 16, wherein the thickness between two adjacent rows of thermoelectric element groups belonging to the partition wall made of the resin material is 0.002 mm or more and 1 mm or less.

18. The plurality of thermoelectric elements are arranged in a matrix of m rows and n columns (where m and n are each natural numbers of 2 or more), The plurality of wiring-embedded partition walls include n - 1 first wiring-embedded partition walls arranged between thermoelectric element groups belonging to two adjacent columns, and third wiring-embedded partition walls arranged from the opposite side of the first wiring-embedded partition walls with respect to the thermoelectric element groups belonging to the first column and the nth column, respectively, and m - 1 fourth wiring-embedded partition walls arranged between thermoelectric element groups belonging to two adjacent rows. The first wiring-embedded partition wall includes m electrically separated first wirings that electrically connect one of the first electrode and the second electrode of a first thermoelectric element, which are two adjacent thermoelectric elements in the same row, and the other of the first electrode and the second electrode of a second thermoelectric element, and a first insulating member and a second insulating member that sandwich the first wiring and include a plurality of openings that expose a part of each of the first wirings. The third wiring-embedded partition wall includes a plurality of electrically separated third wirings that electrically connect one of the first electrode and the second electrode of the thermoelectric elements in the first column or the other of the first electrode and the second electrode of the thermoelectric elements in the nth column to a fourth wiring included in the fourth wiring-embedded partition wall, and a fifth insulating member and a sixth insulating member that sandwich the third wiring and include a plurality of cut portions that expose a part of the third wiring. The fourth wiring-embedded partition wall includes the fourth wiring that electrically connects the third wiring included in the third wiring-embedded partition wall arranged for each thermoelectric element group belonging to the first column and the third wiring included in the third wiring-embedded partition wall arranged for each thermoelectric element group belonging to the nth column, and a seventh insulating member and an eighth insulating member that sandwich the fourth wiring and include a plurality of cut portions that expose a part of the fourth wiring. The thermoelectric conversion module according to claim 11, wherein the fourth wiring-embedded partition wall is inserted into the first wiring-embedded partition wall and the third wiring-embedded partition wall by the plurality of cut portions of the fourth wiring-embedded partition wall.

19. The thickness of the portion where the first insulating member, the first wiring, and the second insulating member of the first wiring-embedded partition are laminated is 0.002 mm or more and 1 mm or less. The thickness of the portion where the fifth insulating member, the third wiring, and the sixth insulating member of the third wiring-embedded partition are laminated is 0.002 mm or more and 1 mm or less. The thickness of the portion where the seventh insulating member, the fourth wiring, and the eighth insulating member of the fourth wiring-embedded partition are laminated is 0.002 mm or more and 1 mm or less. The thermoelectric conversion module according to claim 18.

20. The plurality of openings that expose a part of each of the first wirings of the first wiring-embedded partition are composed of a first opening and a second opening formed in the first insulating member and the second insulating member, respectively. The first opening is formed at a position closer to the first electrode than to the second electrode. The second opening is formed at a position closer to the second electrode than to the first electrode. For each of the first wirings of the first wiring-embedded partition, one of the first opening and the second opening is formed in the first insulating member, and the other of the first opening and the second opening is formed in the second insulating member. A plurality of one of the first opening and the second opening are formed in the first insulating member. A plurality of the other of the first opening and the second opening are formed in the second insulating member. Each of the plurality of thermoelectric elements In a plan view seen from the first surface side, a first metal foil electrically connected to the first electrode is provided so as to overlap at least a part of the first electrode. In a plan view seen from the second surface side, a second metal foil electrically connected to the second electrode is provided so as to overlap at least a part of the second electrode. A part of the first metal foil is bent so as to face the first opening, and contacts a portion of the first wiring exposed from the first wiring-embedded partition through the first opening. A part of the second metal foil is bent so as to face the second opening, and contacts a portion of the first wiring exposed from the first wiring-embedded partition through the second opening. The thermoelectric conversion module according to claim 18.

21. The plurality of cut portions that expose a part of each of the third wirings in the third wiring-embedded partition wall are formed by overlapping a first cut portion formed in the fifth insulating member and a second cut portion formed in the sixth insulating member. The width orthogonal to the depth direction of the first cut portion is wider than the width orthogonal to the depth direction of the second cut portion. In each of the plurality of cut portions, an end portion of the third wiring is exposed. The thermoelectric conversion module according to claim 20, wherein a part of the fourth wiring exposed from the fourth wiring-embedded partition wall is in contact with an end portion of the third wiring exposed in each of the plurality of cut portions of the third wiring-embedded partition wall.

22. The thermoelectric conversion module according to claim 11, wherein the wirings included in each of the plurality of wiring-embedded partition walls are made of an N-type metal thermoelectric material.

23. The thermoelectric conversion module according to claim 22, wherein the wirings included in each of the plurality of wiring-embedded partition walls are made of nickel.

24. When the thermoelectric conversion module is cut so that a cut surface parallel to the first surface and the second surface is formed between the first surface and the second surface of the molded body of each of the plurality of thermoelectric elements, (the total area of the cut surfaces of each of the plurality of molded bodies / the area of the cut surface of the thermoelectric conversion module) × 100% is 80% or more and 99.96% or less. The thermoelectric conversion module according to claim 11.

25. The thermoelectric conversion module according to claim 11, wherein at least one of a metal plate formed with heat dissipation fins and a member made of a cooling material is provided on the cold source side.

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