Display device

Abstract

To provide a display device capable of preventing or reducing unevenness defects.SOLUTION: A display device provided herein comprises a display panel for outputting images, a first functional member disposed on the display panel, a second functional member disposed on the first functional member, and a first additional adhesive layer disposed between the first functional member and the second functional member. The first additional adhesive layer has a creep value of 100% or greater and a storage modulus of 55 KPa or less at a first temperature, and has a creep value of 130% or greater and a storage modulus of 20 KPa or less at a second temperature which is higher than the first temperature.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display device. In particular, for example, embodiments of the present disclosure relate to, but are not limited to, a display device that prevents or reduces defects such as unevenness by using an optically transparent resin having a low modulus in an adhesive layer.

Background Art

[0002] With the development of the information society, the requirements for display devices for displaying images are increasing in various forms. Typical examples of such display devices include a liquid crystal device (LCD) and an organic light emitting display device (OLED).

[0003] Display devices having various forms and functions mainly include a display panel for embodying an image, and a functional layer that can complement various functions such as damage prevention due to external pressure and improvement of light extraction efficiency is added. Such a functional layer and a display panel can be bonded together using an adhesive such as an optically transparent resin.

[0004] An adhesive layer formed using an optically transparent resin should improve the optical characteristics of the display device, play a role in buffering against external impacts, and improve impact resistance. In order to improve impact resistance, the optically transparent resin uses a substance having a low modulus.

[0005] The description provided in the background art section should not be simply assumed to be prior art just because it is mentioned or related in the background art section. The background art section can include information describing one or more aspects of the present technology, and the description provided in the background art section does not limit the present invention.

Summary of the Invention

Problems to be Solved by the Invention

[0006] When applying an optically transparent resin having a low modulus to the next layer, the stress applied to the display panel can be reduced. However, there are problems in that the hardness decreases and the adhesive strength decreases when realizing high light resistance and high heat resistance. When applying an optically transparent resin having a high modulus, there is a problem that defects such as unevenness occur.

[0007] Therefore, the inventors of the present specification have invented a display device in which the optically transparent resin used for the adhesive layer has a low modulus and can prevent or reduce defects such as unevenness.

[0008] Examples of the present disclosure can provide a display device that prevents or reduces unevenness defects by adjusting the modulus and creep of the adhesive layer.

[0009] Examples of the present disclosure can provide a display device that relaxes stress to the outside even at high temperatures and has improved adhesive strength by adjusting the modulus and creep of the adhesive layer.

[0010] Examples of the present disclosure can provide a display device that prevents or reduces unevenness defects by adjusting the thickness of the adhesive layer and the layer adjacent to the adhesive layer.

[0011] The problems of the examples of the present disclosure are not limited to the problems mentioned in this specification, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0012] Examples of the present disclosure include a display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member. The adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the second temperature. A display device can be provided.

[0013] In an embodiment of the present disclosure, the first temperature may be 25°C and the second temperature may be 105°C.

[0014] In an embodiment of the present disclosure, the adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C.

[0015] In an embodiment of the present disclosure, the adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C.

[0016] An embodiment of the present disclosure includes a display panel that outputs an image, a first functional member disposed on the display panel, a second functional member disposed on the first functional member, and a first additional adhesive layer disposed between the first functional member and the second functional member. The first additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature. A display device can be provided.

[0017] In an embodiment of the present disclosure, the first temperature may be 25°C and the second temperature may be 105°C.

[0018] In an embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C.

[0019] In an embodiment of the present disclosure, the adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C.

[0020] In an embodiment of the present disclosure, the first additional adhesive layer can have a thickness of 150 μm or more and 500 μm or less.

[0021] According to an embodiment of the present disclosure, a display device that prevents or reduces unevenness defects can be provided.

[0022] According to an embodiment of the present disclosure, it is possible to provide a display device that prevents or reduces unevenness defects by adjusting the modulus and creep of an adhesive layer.

[0023] According to an embodiment of the present disclosure, it is possible to provide a display device that relaxes stress to the outside even at high temperatures and has improved adhesive strength by adjusting the modulus and creep of an adhesive layer.

[0024] According to an embodiment of the present disclosure, it is possible to provide a display device that prevents or reduces unevenness defects by adjusting the thickness of an adhesive layer and a layer adjacent to the adhesive layer.

[0025] According to an embodiment of the present disclosure, it is possible to provide a display device capable of low power by preventing or reducing unevenness defects and improving the lifespan.

[0026] The effects of the embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Brief Description of the Drawings

[0027] The content of the present disclosure should be more fully understood from the detailed description and the accompanying drawings provided below. The detailed description and the accompanying drawings are provided for illustrative purposes only and do not limit the content of the present disclosure.

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Mode for Carrying Out the Invention

[0028] Hereinafter, some embodiments of the present disclosure will be described in detail with reference to exemplary drawings. When adding reference numerals to the components of each drawing, the same components can be assigned the same reference numerals as much as possible even if they are shown on different drawings. In the description of the present disclosure, when it is determined that a specific description of a related known configuration or function obscures the gist of the present disclosure, the detailed description thereof can be omitted. When terms such as "including", "having", and "performed" are used in this specification, other parts may be added unless "only" is used. When a component is expressed in the singular, it may include the case where a plurality are included unless otherwise explicitly stated.

[0029] In addition, when describing the components of the present disclosure, terms such as first, second, A, B, (a), B, etc. can be used. These terms are for distinguishing the components from other components, and the essence, order, procedure, or number of the components is not limited by these terms.

[0030] Terms such as "lower", "lower part", "upper", "upper part", etc. are used to explain the relationship between components as shown in the drawings. It should be understood that these terms are spatially relative and are used with reference to the directions of the drawings.

[0031] In the description of the positional relationship of components, when it is described that two or more components are "connected", "coupled", or "connected", etc., it should be understood that the two or more components can be directly "connected", "coupled", or "connected", but it is also possible that another component is further "interposed" between the two or more components and "connected", "coupled", or "connected". Here, another component may be included in one or more of the two or more components that are "connected", "coupled", or "connected" to each other.

[0032] "At least one" can be understood to include any combination related to any one component. For example, "at least one of the first component, the second component, and the third component" can include all combinations of two or more components selected from the first, second, and third components, and each individual element of the first, second, and third components.

[0033] In the description of the temporal flow relationship regarding components, operating methods, manufacturing methods, etc., for example, when the temporal front-back relationship or flow front-back relationship is described by "after ~", "subsequent to ~", "after ~", "before ~", etc., unless "immediately" or "directly" is used, it can include cases where it is not continuous.

[0034] On the other hand, when referring to a numerical value of a component or its corresponding information (for example, level, etc.), even without a separate explicit description, the numerical value or its corresponding information can be interpreted to include an error range that can be caused by various factors (for example, process factors, internal or external impacts, noise, etc.).

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein may have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that coincides with the meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms "part" or "unit" can be applied to, for example, separate circuits or structures, integrated circuits, computational blocks of circuit devices, or all structures configured to perform the described functions understood by those skilled in the art.

[0036] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. All components of each display device according to all embodiments of the present disclosure are operatively coupled and configured.

[0037] FIG. 1 is a system configuration diagram of a display device 100 according to an embodiment of the present disclosure.

[0038] Referring to FIG. 1, the display driving system of the display device 100 according to an embodiment of the present disclosure may include a display panel 110 and a display driving circuit for driving the display panel 110.

[0039] The display panel 110 may include a display area DA where an image is displayed and a non-display area NDA where an image is not displayed. The non-display area NDA can be configured to surround the display area DA. The display panel 110 may include a plurality of sub-pixels SP disposed on a substrate SUB for image display. Further, the display panel 110 may further include a circuit portion capable of driving the plurality of sub-pixels SP.

[0040] The display panel 110 can include a number of signal wirings arranged on the substrate SUB. For example, the number of signal wirings can include data lines DL, gate lines GL, drive voltage lines, etc. However, the embodiments of the present disclosure are not limited thereto.

[0041] Each of the number of data lines DL can be arranged while extending in a first direction (e.g., column direction or row direction), and each of the number of gate lines GL can be arranged while extending in a second direction (e.g., horizontal direction or column direction) intersecting the first direction.

[0042] The display driving circuit may be a circuit for driving the display panel, and can include a data driving circuit 120, a gate driving circuit 130, etc., and can further include a controller 140 for controlling the data driving circuit 120 using the data driving control signal DCS and the gate driving circuit 130 using the gate driving control signal GCS. The controller 140 can provide the image data DATA read by the data driving circuit 120.

[0043] The data driving circuit 120 can output a data signal (also referred to as a data voltage) corresponding to the video signal to a number of data lines DL. The gate driving circuit 130 can generate a gate signal and output the gate signal to a number of gate lines GL. The controller 140 can switch the input video data input from the external host 150 to the data signal format used in the data driving circuit 120, and supply the switched video data to the data driving circuit 120.

[0044] The data driving circuit 120 can include one or more source driver integrated circuits. For example, each source driver integrated circuit can be connected to the display panel 110 in a tape automated bonding (TAB) method, connected to the bonding pads of the display panel 110 in a COG (Chip On Glass) or COP (Chip On Panel) method, or implemented in a COF (Chip On Film) method and connected to the display panel 110. However, the embodiments of the present disclosure are not limited thereto.

[0045] The gate driving circuit 130 can be connected to the display panel 110 in a tape automated bonding (TAB) method, connected to the bonding pads of the display panel 110 in a COG or COP method, connected to the display panel 110 in a COF method, or formed in the non-display area NDA of the display panel 110 in a GIP (Gate In Panel) type. However, the embodiments of the present disclosure are not limited thereto.

[0046] Referring to FIG. 1, in the display device 100 according to an embodiment of the present disclosure, each sub-pixel SP can include a light-emitting element ED and a pixel driving circuit SPC for driving the same, and the pixel driving circuit SPC can include a driving transistor DRT, a scan transistor SCT, and a storage capacitor Cst, but is not limited thereto. As an example, each sub-pixel circuit SPC can have a 7T1C structure including seven transistors and one capacitor, but the embodiments of the present disclosure are not limited thereto. For example, the sub-pixel circuit SPC can have structures such as 3T1C, 4T1C, 5T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T1C, 7T2C, 8T2C. Also, more or fewer transistors and capacitors can be included.

[0047] The driving transistor DRT can drive the light-emitting element ED by controlling the current flowing through the light-emitting element ED. The scan transistor SCT can transfer the data voltage Vdata to the second node N2, which is the gate node of the driving transistor DRT. The storage capacitor Cst can be configured to maintain the voltage for a certain period.

[0048] The light-emitting element ED can include an anode electrode AE and a cathode electrode CE, and a light-emitting layer EL positioned between the anode electrode AE and the cathode electrode CE. For example, the light-emitting layer EL can include at least one of a hole injection layer HIL, a hole transport layer HTL, an electron transport layer ETL, and an electron injection layer EIL, but the present disclosure is not limited thereto. The anode electrode AE may be a pixel electrode related to the formation of the light-emitting element ED of each sub-pixel SP, and can be electrically connected to the first node N1 of the driving transistor DRT. The cathode electrode CE may be a common electrode related to the formation of the light-emitting element ED of all sub-pixels SP, and a base voltage EVSS may be applied.

[0049] For example, the light-emitting element ED may be an organic light-emitting diode (OLED), an inorganic-based light-emitting diode (LED), a quantum dot light-emitting element which is a semiconductor crystal that emits light by itself, etc., but is not limited thereto.

[0050] The driving transistor DRT is a transistor for driving the light-emitting element ED, and may include a first node N1, a second node N2, a third node N3, and the like. The first node N1 is a source or drain node of the driving transistor DRT and can be electrically connected to the anode electrode AE of the light-emitting element ED. The second node N2 is a gate node of the driving transistor DRT and can be electrically connected to a source or drain node of the scan transistor SCT. The third node N3 is a drain or source node of the driving transistor DRT and can be electrically connected to a driving voltage line DVL that supplies a driving voltage EVDD. Hereinafter, for convenience of explanation, an example will be given in which the first node N1 is a source node and the third node N3 is a drain node. However, the embodiments of the present disclosure are not limited thereto.

[0051] The scan transistor SCT can switch the connection between the data line DL and the second node N2 of the driving transistor DRT. The scan transistor SCT can control the connection between the second node N2 of the driving transistor DRT and the corresponding data line DL among a plurality of data lines DL in response to a scan signal SCAN supplied from a scan line SCL which is a kind of gate line GL. When the scan transistor SCT is turned on in response to the scan signal SCAN supplied from the scan line SCL, the data voltage Vdata can be transmitted to the second node N2 of the driving transistor DRT.

[0052] The storage capacitor Cst can be configured between the first node N1 and the second node N2 of the driving transistor DRT.

[0053] The structure of the sub-pixel SP illustrated in FIG. 1 is merely an example for explanation, and it can further include one or more transistors or one or more capacitors. Or, each of a number of sub-pixels may have the same structure, or some of the number of sub-pixels may have different structures. However, the embodiments of the present disclosure are not limited thereto. Each of the driving transistor DRT and the scan transistor SCT may be an n-type transistor or a p-type transistor.

[0054] On the other hand, the display device 100 according to the embodiments of the present disclosure may have a top emission structure or a bottom emission structure, but is not limited thereto. Hereinafter, the case of the top emission structure will be taken as an example. For example, in the case of the top emission structure, the anode electrode AE may be a reflective metal, and the cathode electrode CE may be a transparent conductive film.

[0055] FIG. 2 is a cross-sectional view schematically showing the structure of the display device according to the embodiments of the present disclosure. For example, FIG. 2 schematically shows a cross-section taken along line I-I' of FIG. 1. Among the following descriptions, the same or similar contents as those described with reference to FIG. 1 will be omitted or briefly described.

[0056] Referring to FIG. 2, the display device 100 according to the embodiments of the present disclosure may include a display panel 110, an adhesive layer 200, a functional member 300, and the like. For example, the display device 100 may include a display panel 110 that outputs an image, a functional member 300 disposed on the display panel, and an adhesive layer 200 disposed between the display panel 110 and the functional member, but is not limited thereto.

[0057] The display panel 110 may include any display panel capable of outputting an image, such as a liquid crystal display panel including a liquid crystal layer, an organic electroluminescent display panel including an organic electroluminescent element, a quantum dot display panel including a quantum dot light-emitting element, a micro LED display panel including a micro LED, a mini LED display panel including a mini LED, etc., but is not limited thereto.

[0058] An adhesive layer 200 may be disposed between the display panel 110 and the functional member 300. Specifically, the adhesive layer 200 may be disposed on the display panel 110, and the functional member 300 may be disposed on the adhesive layer 200. The adhesive layer 200 can bond the display panel 110 and the functional member 300 together. The adhesive layer 200 can bond the display panel 110 and the functional member 300 together using an optically transparent resin or the like, but is not limited thereto.

[0059] The adhesive layer 200 is manufactured from an optically transparent resin, can improve the optical characteristics of the display device 100, play a role in buffering against external impacts, and play a role in improving impact resistance.

[0060] When the adhesive layer 200 has a low modulus, the stress applied to the display panel can be reduced to improve impact resistance, but there is a possibility that the hardness decreases and the adhesive force decreases. Also, when the modulus of the adhesive layer 200 is too low, it is difficult to control the process, such as the adhesive being extruded in the bonding process, and foreign matter defects such as residues may occur, resulting in a decrease in quality.

[0061] On the other hand, when the adhesive layer 200 has a high modulus, the hardness is guaranteed and the adhesive force can be maintained, but there is a problem that defects such as unevenness occur.

[0062] Therefore, in order to improve defects such as unevenness in the adhesive layer 200, additional physical property factors were derived that can have a hardness that maintains the adhesive force while having a low modulus.

[0063] Creep is a physical property that indicates the degree of deformation over time when under a certain stress. It was confirmed that when the adhesive layer 200 has a low modulus but the creep increases, the adhesive force is maintained and it is effective in improving the unevenness problem.

[0064] The display device 100 according to an embodiment of the present disclosure can prevent or reduce unevenness defects by adjusting the modulus and creep of the adhesive layer 200. Further, the display device 100 according to an embodiment of the present disclosure can adjust the modulus and creep of the adhesive layer 200, relieve the stress to the outside even at high temperatures, and have improved adhesive strength.

[0065] By having a low modulus and high creep, the adhesive layer 200 can prevent or reduce unevenness defects and can relieve the stress to the outside even at high temperatures and have improved adhesive strength.

[0066] As an example, the adhesive layer 200 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature, but is not limited thereto.

[0067] Specifically, the adhesive layer 200 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C, but is not limited thereto.

[0068] The adhesive layer 200 may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C, but is not limited thereto.

[0069] The adhesive layer 200 may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C, but is not limited thereto.

[0070] For example, the adhesive layer 200 may have a creep value of 100% or more and 250% or less and a storage modulus value of 34 KPa or more and 55 KPa or less at a temperature of 25°C, but is not limited thereto.

[0071] For example, the adhesive layer 200 may have a creep value of 130% or more and 350% or less and a storage modulus value of 4 KPa or more and 20 KPa or less at a temperature of 105°C, but is not limited thereto.

[0072] On the other hand, in the examples of the present disclosure, the creep deformation when a force of 10,000 Pa was applied to the adhesive layer sample at 25°C and 105°C was measured. Specifically, after the adhesive layer sample was formed into a circular shape with a diameter of 8 mm and a thickness of 1 mm, using ARES-G2 manufactured by TA instruments, a force of 10,000 Pa was applied at 25°C and 105°C for 10 minutes, and the creep deformation of the adhesive layer was measured. After the creep measurement, a force of 0 Pa was applied for 10 minutes, and recovery, which is the recovery rate with respect to the change, was measured.

[0073] When the creep value and the storage modulus value of the adhesive layer 200 satisfy the above ranges at temperatures of 25°C and 105°C, unevenness defects can be prevented or reduced, and even at high temperatures, the stress to the outside can be relaxed and improved adhesive strength can be obtained.

[0074] As an example, the adhesive layer 200 may also have a thickness of 150 μm or more and 750 μm or less, may have a thickness of 200 μm or more and 400 μm or less, or may have a thickness of 250 μm or more and 350 μm or less, but is not limited thereto. Also, as long as the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects and the stress received from the outside at high temperatures can be relaxed to have improved adhesive strength, other appropriate thicknesses of the adhesive layer 200 are also possible.

[0075] When the thickness of the adhesive layer 200 satisfies the above range, the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects, and even at high temperatures, the stress to the outside can be relaxed and improved adhesive strength can be obtained.

[0076] The functional member 300 may be attached onto the subsequent layer 200. Specifically, the functional member 300 may be attached to one surface of the adhesive layer 200. The display panel 110 may be attached to the other surface of the adhesive layer 200.

[0077] As an example, the functional member 300 can include, but is not limited to, various substrates or panels.

[0078] For example, the functional member 300 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel. The functional member 300 may be a light control film for adjusting the viewing angle region of the display device. In the embodiments of the present disclosure, the functional member is not limited to the above-described substrate or panel.

[0079] As an example, the functional member 300 can be arranged alone on the display panel 110. Also, two or more functional members 300 may be arranged overlapping on the display panel 110.

[0080] When two or more functional members 300 are arranged overlapping on the display panel 110, the above-described adhesive layer 200 is arranged between the functional members 300, and the functional members 300 can be joined together. Also, the above-described adhesive layer 200 is arranged between the display panel 110 and the functional member 300, and the display panel 110 and the functional member 300 can be joined together.

[0081] The functional member 300 can include a base substrate.

[0082] The base substrate can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, and it is possible to prevent the occurrence of delamination between layers. In various embodiments of the present disclosure, the unit of the thickness T may be 1.0 mm.

[0083] FIG. 3 is a cross-sectional view schematically showing the structure of a liquid crystal display device according to an embodiment of the present disclosure. For example, FIG. 3 is a diagram schematically showing a cross-section taken along line I-I' of FIG. 1. Among the following descriptions, the same or similar contents described with reference to FIGS. 1 and 2 will be omitted or briefly described.

[0084] Referring to FIG. 3, the display device 100 according to an embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, a functional member 300, and the like. The adhesive layer 200 can be disposed between the display panel 110 and the functional member 300, but is not limited thereto. The display panel 110 may be a liquid crystal display panel including a display liquid crystal layer 431, but is not limited thereto.

[0085] As an example, the display panel 110 may include at least one thin film transistor disposed on a lower display substrate 401 and a display liquid crystal layer 431 disposed on the thin film transistor, but is not limited thereto.

[0086] The display panel 110 may further include an upper display substrate 441. The display liquid crystal layer 431 can be disposed between the lower display substrate 401 and the upper display substrate 441.

[0087] As an example, at least one of the lower display substrate 401 or the upper display substrate 441 may have a thickness of 0.5T or more and 1.0T or less, but is not limited thereto.

[0088] For example, the lower display substrate 401 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the lower display substrate 401 satisfies the above range, stress can be relieved and the occurrence of lifting between layers can be prevented.

[0089] As an example, the upper display substrate 441 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the upper display substrate 441 satisfies the above range, stress can be relieved and the occurrence of lifting between layers can be prevented.

[0090] The thin film transistors disposed on the lower display substrate 401 may include a gate electrode 411 formed on the lower display substrate 401, a gate insulating layer 421 formed on the gate electrode 411, an active layer 412 formed on the gate insulating layer 421, a source electrode 413 and a drain electrode 414 formed on the active layer 412. A protective layer 423 may be formed on the thin film transistors. Specifically, the protective layer 423 can be disposed on the thin film transistors and the lower display substrate 401.

[0091] On the upper display substrate 441, a black matrix 443 and a color filter layer 445 may be formed. The black matrix 443 can be disposed between the upper display substrate 441 and the color filter layer 445. The black matrix 443 is for preventing light from leaking into areas where actual images are not realized, such as gate lines, data lines, and thin film transistor formation regions, etc., and blocking the transmission of light through this region to prevent image quality degradation.

[0092] The color filter layer 445 is provided with a plurality of color filters such as R, G, and B color filters, but is not limited thereto, and by transmitting light, the corresponding color can be realized to form an image. At this time, the same color filters in the color filter layer 445 may be arranged in a strip shape. Also, an overcoat layer 447 for planarizing the upper display substrate 441 and protecting the color filter layer 445 may be formed on the color filter layer 445.

[0093] A column spacer 433 may be formed between the lower display substrate 401 and the upper display substrate 441. That is, the column spacer 433 may be formed on the lower display substrate 401 or the upper display substrate 441. For example, the column spacer 433 can be disposed in the overcoat layer 447 formed on the upper display substrate 441. In other words, the column spacer 433 may be formed between the lower display substrate 401 and the overcoat layer 447.

[0094] The column spacer 433 can maintain the interval between the lower display substrate 401 and the upper display substrate 441. The thickness of the display liquid crystal layer 431 can be kept constant by the column spacer 433. For example, the column spacer 433 can be disposed between the display liquid crystal layers 431. However, the embodiments of the present disclosure are not limited thereto.

[0095] The column spacers 433 can be distributed at an arrangement density of 100 ppm or more and 750 ppm or less, but are not limited thereto.

[0096] When the arrangement density of the column spacers 433 satisfies the above range, even if the display panel 110 and the functional member 300 are joined together by the adhesive layer 200, the interval of the cell gap can be kept constant, and unevenness defects can be prevented or reduced.

[0097] The column spacer 433 can contact the protective layer of the lower display substrate 401 and keep the cell gap of the display panel 110 constant.

[0098] The adhesive layer 200 and the functional member 300 are disposed on the upper display substrate 441 of the display panel 110, and the display panel 110 and the functional member 300 can be joined together by the adhesive layer 200. When two or more functional members 300 are disposed overlapping on the display panel 110, the above-described adhesive layer 200 is disposed between the functional members 300 so that the functional members 300 can be joined together.

[0099] A backlight unit may be disposed below the display panel 110. The display panel 110 can generate an image provided to the user using the light provided from the backlight unit.

[0100] FIG. 4 is a cross-sectional view schematically showing the structure of an organic electroluminescent display device according to an embodiment of the present disclosure. For example, FIG. 4 schematically shows a cross-section taken along line I-I' of FIG. 1. Among the following descriptions, the same or similar contents as those described with reference to FIGS. 1 to 3 will be omitted or briefly described.

[0101] Referring to FIG. 4, the display device 100 according to an embodiment of the present disclosure can include a display panel 110, an adhesive layer 200, a functional member 300, and the like. The display panel 110 can include, but is not limited to, an organic electroluminescent display panel including an organic electroluminescent element 510.

[0102] As an example, the display panel 110 can include, but is not limited to, at least one thin film transistor disposed on a display substrate 501 and an organic electroluminescent element 510 disposed on the thin film transistor.

[0103] The thin film transistor can include an active layer 503, a gate electrode 505, a source electrode 507, and a drain electrode 508. A planarization layer 509 may be disposed on the thin film transistor.

[0104] The organic electroluminescent element 510 can include a first electrode 511, a light emitting layer 512, and a second electrode 513. For example, the light emitting layer 512 can include at least one of a hole injection layer HIL, a hole transport layer HTL, an electron transport layer ETL, and an electron injection layer EIL, but the present disclosure is not limited thereto.

[0105] Specifically, the display substrate 501 can have a thickness of 0.5T or more and 1.0T or less, but is not limited thereto. When the thickness of the display substrate 501 satisfies the above range, stress can be relaxed and the occurrence of interlayer lifting can be prevented.

[0106] A buffer layer 502 may be disposed on the display substrate 501. The active layer 503 may be disposed on the buffer layer 502.

[0107] The buffer layer 502 can include an inorganic insulating material such as silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiON), but the present disclosure is not limited thereto.

[0108] In FIG. 4, the buffer layer 502 is shown in a single-layer structure, but the buffer layer 502 of the present disclosure can also have a multi-layer structure. The buffer layer 502 prevents moisture from penetrating from the outside.

[0109] When the buffer layer 502 has a multi-layer structure, layers including at least three inorganic insulating materials among inorganic materials such as silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiON) may be alternately arranged, but the present disclosure is not limited thereto.

[0110] In the following description, for convenience, the buffer layer 502 will be described as having a single-layer structure.

[0111] An active layer 503 of a thin film transistor may be disposed on the buffer layer 502.

[0112] The active layer 503 may be various types of semiconductor layers. For example, the active layer 503 can be selected from an oxide semiconductor, an amorphous silicon semiconductor, or a polysilicon semiconductor, but the present disclosure is not limited thereto.

[0113] A gate insulating film 504 may be disposed on the active layer 503, and a gate electrode 505 may be disposed on the gate insulating film 504, but the present disclosure is not limited thereto. Specifically, the gate insulating film 504 may be disposed on a part of the upper surface of the active layer 503. The gate insulating film 504 is an insulating layer for insulating the active layer 503 and the gate electrode 505 from each other.

[0114] The gate insulating film 504 can include an inorganic insulating material such as silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiON), but the present disclosure is not limited thereto.

[0115] In FIG. 4, a structure in which the gate insulating film 504 is disposed on a part of the upper surface of the active layer 503 is shown, but the present disclosure is not limited thereto, and the gate insulating film 504 can also be disposed while covering the active layer 503.

[0116] A gate electrode 505 of the thin film transistor may be disposed on the gate insulating film 504. Specifically, the gate insulating film 504 may be disposed between the active layer 503 of the thin film transistor and the gate electrode 505.

[0117] The gate electrode 505 can include any one of metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), titanium (Ti), or alloys thereof, but the present disclosure is not limited thereto.

[0118] An interlayer insulating film 506 may be disposed on the gate electrode 505. Specifically, the interlayer insulating film 506 may be disposed on the buffer layer 502 and the gate electrode 505.

[0119] The interlayer insulating film 506 can include an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiN x ), or silicon oxynitride (SiON), but the present disclosure is not limited thereto.

[0120] A source electrode 507 and a drain electrode 508 of the thin film transistor may be disposed separately from each other on the interlayer insulating film 506.

[0121] In an embodiment of the present disclosure, 507 may be a drain electrode and 508 may be a source electrode, but the present disclosure is not limited thereto. As another example, 508 may be a drain electrode and 507 may be a source electrode.

[0122] The source electrode 507 and the drain electrode 508 can include any one of metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), titanium (Ti), or alloys thereof, but the present disclosure is not limited thereto.

[0123] Each of the source electrode 507 and the drain electrode 508 can be connected to a part of the upper surface of the active layer 503 through a contact hole provided in the interlayer insulating film 506.

[0124] A planarization layer 509 may be disposed on the display substrate 501 on which the source electrode 507 and the drain electrode 508 are disposed. The planarization layer 509 may be disposed while covering the interlayer insulating film 506 and the source / drain electrodes 507 and 508.

[0125] Although not shown in the drawings, a protective film containing an inorganic insulating substance may be further disposed below the planarization layer 509, but the present disclosure is not limited thereto.

[0126] A first electrode 511 of the organic electroluminescent element 510 may be disposed on a part of the upper surface of the planarization layer 509.

[0127] The first electrode 511 can be electrically connected to the drain electrode 508 of the thin film transistor through a contact hole provided in the planarization layer 509. In FIG. 4, the structure in which the first electrode 511 is connected to the drain electrode 508 of the thin film transistor is shown, but the present disclosure is not limited thereto, and the first electrode 511 can also be connected to the source electrode 507 of the thin film transistor.

[0128] FIG. 4 shows a structure in which the first electrode 511 is a single layer, but the present disclosure is not limited thereto. For example, the first electrode 511 may have a multilayer structure of two or more layers.

[0129] Such a first electrode 511 can include a reflective electrode. For example, the first electrode 511 can include a metallic substance such as Au, W, Pt, Si, Ir, Ag, Cu, Ni, Ti, and Cr, and alloys thereof, but the present disclosure is not limited thereto.

[0130] Specifically, when the first electrode 511 has a single-layer structure, the first electrode 511 may be a reflective electrode including a reflective conductive substance.

[0131] When the first electrode 511 has a multilayer structure, at least one layer may be a reflective electrode including a reflective conductive substance. And the other layers that are not reflective electrodes may be layers made of a transparent conductive substance such as ITO (indium tin oxide) or IZO (indium zinc oxide).

[0132] A bank 520 may be disposed on the planarization layer 509. The bank 520 can include an insulating substance. As an example, the bank 520 can include an organic insulating substance such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and / or a polyimide resin. Or, the bank 520 can include an inorganic insulating substance such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Also, the bank 520 can include a black dye to absorb light incident from the outside.

[0133] As a whole of the display substrate 501, the bank 520 can have a matrix-like grid structure. The bank 520 surrounds the edge of the first electrode 511 and exposes a part of the first electrode 511. The bank 520 can include an opening that exposes a part of the first electrode 511 to define a light-emitting region EA.

[0134] Such a bank 520 can define a light-emitting region EA and a non-light-emitting region NEA within the display region DA of the display device 100. For example, the region where the bank 520 is disposed in the display region DA may be the non-light-emitting region NEA, and the region where the bank 520 is not disposed in the display region DA may be the light-emitting region EA.

[0135] A light-emitting layer 512 of the organic electroluminescent element 510 may be disposed on the first electrode 511.

[0136] The light-emitting layer 512 may be disposed on the upper surface of the first electrode 511 exposed by the bank 520.

[0137] Although FIG. 4 shows a structure in which the light-emitting layer 512 is a single layer, the present disclosure is not limited thereto. The light-emitting layer 512 may be composed of multiple organic layers.

[0138] Such a light-emitting layer 512 can emit at least one color among red (R), green (G), and blue (B). However, the present disclosure is not limited thereto, and the light-emitting layer 512 can also emit other colors such as white (W). Further, the light-emitting layer 512 can emit light such as cyan, magenta, or yellow, but the present disclosure is not limited thereto.

[0139] In the display device 100 according to an embodiment of the present disclosure, the organic electroluminescent element 510 is exemplified as the light-emitting element, but the light-emitting element can be applied with a quantum dot light-emitting element, a micro LED, a mini LED, etc., and the present disclosure is not limited thereto.

[0140] A second electrode 513 of the organic electroluminescent element 510 may be disposed on the display substrate 501 on which the light-emitting layer 512 is disposed.

[0141] The second electrode 513 can include a transparent conductive material or a semi-transparent material such as ITO or IZO, but the present disclosure is not limited thereto.

[0142] In addition, in FIG. 4, the second electrode 513 is shown in a structure of a single layer, but the present disclosure is not limited thereto, and it may have a multilayer structure of two or more layers.

[0143] A sealing layer 530 may be disposed on the second electrode 513.

[0144] Specifically, the sealing layer 530 may include a first sealing layer 531 disposed on the second electrode 513, a second sealing layer 532 disposed on the first sealing layer 531, and a third sealing layer 533 disposed on the second sealing layer 532. Here, the first and third sealing layers 531 and 533 may include an inorganic insulating material, and the second sealing layer 532 may include an organic insulating material. The first and third sealing layers 531 and 533 may include an inorganic insulating material such as silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiO x N y ) or aluminum oxide (Al y O z ), but the present disclosure is not limited thereto. The second sealing layer 532 may include an organic insulating material such as silicon oxycarbon (SiO x C z ) or an acrylic or epoxy resin, but the present disclosure is not limited thereto.

[0145] The first and third sealing layers 531 and 533 containing an inorganic insulating material can play a role in preventing moisture and oxygen from penetrating, and the second sealing layer 532 containing an organic insulating material can play a role in delaying the movement of a small amount of moisture and oxygen that has penetrated through the third sealing layer 533.

[0146] An adhesive layer 200 and a functional member 300 are disposed on the third sealing layer 533 of the display panel 110, and the display panel 110 and the functional member 300 can be joined together by the adhesive layer 200.

[0147] Figs. 5 to 8 are cross-sectional views showing other examples of the display device according to the embodiments of the present disclosure. For example, Figs. 5 to 8 are diagrams schematically showing a cross-section taken along line I-I' of Fig. 1. Among the following descriptions, the same or similar contents described with reference to Figs. 1 to 4 will be omitted or briefly described.

[0148] Fig. 5 is an exemplary diagram showing a case where the functional member is the cover window 600.

[0149] Referring to Fig. 5, the display device 100 according to the embodiments of the present disclosure can include a display panel 110, an adhesive layer 200, a cover window 600, and the like. The adhesive layer 200 can be disposed between the display panel 110 and the cover window 600.

[0150] The cover window 600 can include a glass substrate 610. Further, the cover window 600 can further include a protective layer 620 disposed on the upper side of the glass substrate 610.

[0151] The glass substrate 610 may be tempered glass, but the present disclosure is not limited thereto. The protective layer 620 may be disposed on the front surface of the display device 100. The protective layer 620 can transmit the image provided from the display panel 110 as it is and protect the glass substrate 610 from external impacts.

[0152] As an example, the glass substrate 610 can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the glass substrate 610 satisfies the above range, stress can be relaxed and the occurrence of delamination between layers can be prevented.

[0153] The glass substrate 610 of the adhesive layer 200 and the cover window 600 is disposed on the display panel 110, and the display panel 110 and the cover window 600 can be joined together by the adhesive layer 200.

[0154] Fig. 6 is an exemplary diagram showing a case where the functional member is the barrier panel 700.

[0155] Referring to FIG. 6, the display device 100 according to an embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, a barrier panel 700, etc. The adhesive layer 200 can be disposed between the display panel 110 and the barrier panel 700.

[0156] The barrier panel 700 may include a barrier liquid crystal layer 730 located between a lower base substrate 710 and an upper base substrate 720.

[0157] The base substrate can include a lower base substrate 710 and an upper base substrate 720 facing each other.

[0158] As an example, at least one of the lower base substrate 710 or the upper base substrate 720 can have a thickness of 0.5T or more and 1.0T or less.

[0159] For example, the lower base substrate 710 can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the lower base substrate 710 satisfies the above range, stress can be relieved and the occurrence of delamination between layers can be prevented.

[0160] For example, the upper base substrate 720 can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the upper base substrate 720 satisfies the above range, stress can be relieved and the occurrence of delamination between layers can be prevented.

[0161] In the barrier panel 700, the light-emitting regions formed on the barrier panel 700 by electrical signals may each be bar-shaped extending in one side direction. The display panel 110 can generate a left-eye image provided to the user's left eye and a right-eye image provided to the user's right eye using the light separated by the barrier panel 700.

[0162] The barrier panel 700 can be controlled to selectively provide 2D images and 3D images to the user, but the present disclosure is not limited thereto.

[0163] In addition, the barrier panel 700 can include a channel electrode 740 positioned side by side between a lower base substrate 710 and a barrier liquid crystal layer 730, and a common electrode layer 750 positioned between the barrier liquid crystal layer 730 and an upper base substrate 720.

[0164] The channel electrode 740 can include a first channel electrode 741 and a second channel electrode 742 insulated by a channel insulating film 714. The channel insulating film 714 can be disposed on the first channel electrode 741 and a barrier insulating film 712. The positions of the light-shielding region and the light-projecting region formed by the voltage applied to each channel electrode 740 in the barrier panel 700 can be precisely controlled.

[0165] A barrier insulating film 712 can be positioned between the lower base substrate 710 and the channel electrode 740. The barrier insulating film 712 can be positioned on the lower base substrate 710. The barrier insulating film 712 can prevent damage to the lower base substrate 710 caused by the formation process of the channel electrode 740. The barrier insulating film 712 can include an insulating material.

[0166] A barrier spacer 733 may be formed between the lower base substrate 710 and the upper base substrate 720. The barrier spacer 733 can maintain the interval between the lower base substrate 710 and the upper base substrate 720. The thickness of the barrier liquid crystal layer 730 can be kept constant by the barrier spacer 260. For example, the barrier spacer 733 can be disposed between the barrier liquid crystal layers 730. The barrier spacer 733 can be disposed while covering the second channel electrode 742 and the channel insulating film 714.

[0167] For example, the barrier spacers 733 can be distributed at an arrangement density of 100 ppm or more and 750 ppm or less, but the present disclosure is not limited thereto.

[0168] When the arrangement density of the barrier spacers 733 satisfies the above range, even if the display panel 110 and the barrier panel 700 are joined together by the adhesive layer 200, the interval of the cell gap can be kept constant, and unevenness defects can be prevented or reduced.

[0169] The barrier panel 700 is disposed on the upper display substrate 441 of the display panel 110 with the adhesive layer 200 and the functional member 300, and the barrier panel 700 can be joined to the display panel 110 and the functional member 300 by the adhesive layer 200.

[0170] The lower base substrate 710 of the adhesive layer 200 and the barrier panel 700 is disposed on the display panel 110, and the display panel 110 and the barrier panel 700 can be joined together by the adhesive layer 200.

[0171] FIGS. 7 and 8 are exemplary diagrams showing a case including a plurality of functional members.

[0172] Referring to FIG. 7, the display device 100 according to an embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, and a plurality of functional members 800, etc. The adhesive layer 200 can be disposed between the display panel 110 and the plurality of functional members 800. The display panel 110 and the plurality of functional members 800 can be joined together by the adhesive layer 200.

[0173] The plurality of functional members 800 may include a first functional member 810, a first additional adhesive layer 815, and a second functional member 820. The first additional adhesive layer 815 can be disposed between the first functional member 810 and the second functional member 820. The first functional member 810 and the second functional member 820 can be joined together by the first additional adhesive layer 815.

[0174] The first functional member 810 may be a functional panel such as a touch panel or a 3D barrier panel, but the present disclosure is not limited thereto. The first functional member 810 may be a light control film that adjusts the viewing angle region of the display device. In an embodiment of the present disclosure, the first functional member 810 is not limited to the above-described substrate or panel.

[0175] As an example, the first functional member 810 may include a base substrate.

[0176] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be relaxed and the occurrence of interlayer lifting can be prevented.

[0177] The second functional member 820 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel, but the present disclosure is not limited thereto. The second functional member 820 may be a light control film that adjusts the viewing angle region of the display device. In an embodiment of the present disclosure, the functional member is not limited to the above-described substrate or panel.

[0178] As an example, the second functional member 820 may include a base substrate.

[0179] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be relaxed and the occurrence of interlayer lifting can be prevented.

[0180] The first functional member 810 and the second functional member 820 may be different substrates or panels among the above-described substrates or panels.

[0181] The first additional adhesive layer 815 disposed between the first functional member 810 and the second functional member 820 can prevent or reduce unevenness defects by having a low modulus and high creep, and can have improved adhesive strength by relaxing external stress even at high temperatures.

[0182] As an example, the first additional adhesive layer 815 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature, but the present disclosure is not limited thereto.

[0183] Specifically, the first additional adhesive layer 815 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C, but the present disclosure is not limited thereto.

[0184] The first additional adhesive layer 815 may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C, but is not limited thereto.

[0185] The first additional adhesive layer 815 may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C, but the present disclosure is not limited thereto.

[0186] The first additional adhesive layer 815 may have a creep value of 100% or more and 250% or less, and a storage modulus value of 34 KPa or more and 55 KPa or less at a temperature of 25°C, but the present disclosure is not limited thereto.

[0187] The first additional adhesive layer 815 may have a creep value of 130% or more and 350% or less, and a storage modulus value of 4 KPa or more and 20 KPa or less at a temperature of 105°C, but the present disclosure is not limited thereto.

[0188] When the first additional adhesive layer 815 satisfies the above-mentioned ranges of creep values and storage modulus values at temperatures of 25°C and 105°C, unevenness defects can be prevented or reduced, and stress to the outside can be alleviated even at high temperatures, enabling improved adhesive strength.

[0189] As an example, the first additional adhesive layer 815 can also have a thickness of 150 μm or more and 750 μm or less, a thickness of 200 μm or more and 400 μm or less, or a thickness of 250 μm or more and 350 μm or less, but the present disclosure is not limited thereto. Also, as long as the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects, and the stress received from the outside at high temperatures can be alleviated to have improved adhesive strength, other appropriate thicknesses of the first additional adhesive layer 815 are also possible.

[0190] When the thickness of the first additional adhesive layer 815 satisfies the above-mentioned range, the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects, and the stress to the outside can be alleviated even at high temperatures, enabling improved adhesive strength.

[0191] Referring to FIG. 8, a display device 100 according to an embodiment of the present disclosure can include a display panel 110, an adhesive layer 200, and a plurality of functional members 900, etc. The adhesive layer 200 can be disposed between the display panel 110 and the plurality of functional members 900. The display panel 110 and the plurality of functional members 900 can be joined together by the adhesive layer 200.

[0192] The plurality of functional members 900 can include a first functional member 910, a first additional adhesive layer 915, a second functional member 920, a second additional adhesive layer 925, and a third functional member 930. The first additional adhesive layer 915 can be disposed between the first functional member 910 and the second functional member 920. The second additional adhesive layer 925 can be disposed between the second functional member 920 and the third functional member 930.

[0193] The first functional member 910 may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The first functional member 910 may be a light control film that adjusts the viewing angle region of the display device. In an embodiment of the present disclosure, the first functional member 910 is not limited to the above-described substrate or panel.

[0194] As an example, the first functional member 910 can include a base substrate.

[0195] The base substrate can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be relaxed and occurrence of lifting between layers can be prevented.

[0196] The second functional member 920 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The second functional member 920 may be a light control film that adjusts the viewing angle region of the display device. In an embodiment of the present disclosure, the functional member is not limited to the above-described substrate or panel.

[0197] As an example, the second functional member 920 can include a base substrate.

[0198] The base substrate can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be relaxed and occurrence of lifting between layers can be prevented.

[0199] The third functional member 930 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel. The third functional member 930 may be a light control film that adjusts the viewing angle region of the display device. In an embodiment of the present disclosure, the functional member is not limited to the above-described substrate or panel.

[0200] The third functional member 930 can include a base substrate.

[0201] The base substrate can have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be relaxed and the occurrence of delamination between layers can be prevented.

[0202] The first functional member 910, the second functional member 920, and the third functional member 930 may be different substrates or panels among the above-described substrates or panels.

[0203] The first additional adhesive layer 915 can be disposed between the first functional member 910 and the second functional member 920. The second additional adhesive layer 925 can be disposed between the second functional member 920 and the third functional member 930. By having low modulus and high creep independently, the first additional adhesive layer 915 and the second additional adhesive layer 925 can prevent or reduce unevenness defects and can have improved adhesive strength by relaxing external stress even at high temperatures.

[0204] Specifically, the first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C, but are not limited thereto.

[0205] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C, but are not limited thereto.

[0206] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C, but are not limited thereto.

[0207] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 100% or more and 250% or less and a storage modulus value of 34 KPa or more and 55 KPa or less at a temperature of 25°C, but are not limited thereto.

[0208] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 130% or more and 350% or less and a storage modulus value of 4 KPa or more and 20 KPa or less at a temperature of 105°C, but are not limited thereto.

[0209] When the first additional adhesive layer 915 and the second additional adhesive layer 925 satisfy the above ranges of creep value and storage modulus value at temperatures of 25°C and 105°C, unevenness defects can be prevented or reduced, and stress to the outside can be relaxed even at high temperatures to have improved adhesive strength.

[0210] As an example, the first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a thickness of 150 μm or more and 750 μm or less, may have a thickness of 200 μm or more and 400 μm or less, and may have a thickness of 250 μm or more and 350 μm or less, but are not limited thereto. Also, as long as the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects and the stress received from the outside at high temperatures can be relaxed to have improved adhesive strength, the first additional adhesive layer 915 and the second additional adhesive layer 925 can have other appropriate thicknesses.

[0211] When the thicknesses of the first additional adhesive layer 915 and the second additional adhesive layer 925 satisfy the above ranges, the stress received by the display panel from the outside can be reduced to prevent or reduce unevenness defects, and stress to the outside can be relaxed even at high temperatures to have improved adhesive strength.

[0212] Hereinafter, the display device according to the embodiments of the present disclosure will be specifically described with examples, but the embodiments of the present disclosure are not limited to the following examples. Experimental examples

[0213] An adhesive layer between a display panel and a cover window was formed using the adhesive materials of Examples 1 to 4 and Comparative Examples 1 to 4 having the physical properties described in Table 1 below.

[0214]

Table 1

[0215] Table 2 below shows the physical property results related to the operation, storage evaluation, and reliability during the passage of 500 hours.

[0216]

Table 2

[0217] Referring to Table 2, it can be confirmed that in Examples 1 to 4 containing the adhesive material according to the examples of the present disclosure, the occurrence of grid patterns, stripe patterns, and yellowing on the four sides is absent or minimal in the operation and storage evaluation. Also, it can be confirmed that Examples 1 to 4 containing the adhesive material according to the examples of the present disclosure all satisfy the reliability evaluation.

[0218] On the other hand, in Comparative Examples 1 to 4, it can be confirmed that grid patterns, stripe patterns, and yellowing on the four sides occur in the operation and storage evaluation. Also, it can be confirmed that none of Comparative Examples 1 to 4 satisfy the reliability evaluation.

[0219] Table 3 below shows various ratios of modulus and creep for the adhesive materials of Examples 1 to 4 and Comparative Examples 1 to 4 having the physical properties described in Table 1.

Table 3

[0220] Referring to Table 3, in the case of Examples 1 to 4, the modulus ratio (MR) with respect to the moduli at two temperatures (105°C / 25°C) ranges from about 0.117 to about 0.370, while in the case of Comparative Examples 1 to 4, the modulus ratio (MR) with respect to the moduli at two temperatures (105°C / 25°C) ranges from about 0.500 to about 0.576. Thus, in Examples 1 to 4, the modulus ratio (MR) with respect to the moduli at two temperatures (105°C / 25°C) may be less than about 0.500, but the examples of the present disclosure are not limited thereto.

[0221] Also, in the case of Examples 1 to 4, the creep ratio (CR) with respect to the creep at two temperatures (105°C / 25°C) may range from about 0.975 to about 1.513, while in the case of Comparative Examples 1 to 4, the creep ratio (CR) with respect to the creep at two temperatures (105°C / 25°C) ranges from about 0.541 to about 1.090. Thus, in Examples 1 to 4, the creep ratio (CR) with respect to the creep at two temperatures (105°C / 25°C) may be greater than about 0.975, for example, greater than 1.090, but the examples of the present disclosure are not limited thereto.

[0222] Also, in the case of Examples 1 to 4, the ratio of MR to CR (MR / CR) can range from about 0.120 to about 0.290, while in the case of Comparative Examples 1 to 4, the ratio of MR to CR (MR / CR) ranges from about 0.467 to about 0.953. Thus, in Examples 1 to 4, the ratio of MR to CR (MR / CR) may be less than 0.467, but the examples of the present disclosure are not limited thereto.

[0223] Briefly described, the examples of the present disclosure described above are as follows.

[0224] According to an embodiment of the present disclosure, there is provided a display device including a display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member. The adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0225] In the display device according to an embodiment of the present disclosure, the first temperature may be 25 °C, and the second temperature may be 105 °C.

[0226] In the display device according to an embodiment of the present disclosure, the adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0227] In the display device according to an embodiment of the present disclosure, the adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0228] In the display device according to an embodiment of the present disclosure, the adhesive layer can have a thickness of 150 μm or more and 750 μm or less.

[0229] In the display device according to an embodiment of the present disclosure, the functional member includes a base substrate, and the base substrate can have a thickness of 0.5T or more and 1.0T or less.

[0230] In the display device according to an embodiment of the present disclosure, the base substrate includes an upper base substrate and a lower base substrate facing each other, and at least one of the upper base substrate and the lower base substrate can have a thickness of 0.5T or more and 1.0T or less.

[0231] In the display device according to an embodiment of the present disclosure, the display panel includes a display substrate, and the display substrate can have a thickness of 0.5T or more and 1.0T or less.

[0232] In the display device according to an embodiment of the present disclosure, the display panel includes a display substrate including an upper display substrate and a lower display substrate, column spacers disposed on the upper or lower display substrate, and a display liquid crystal layer located between the upper display substrate and the lower display substrate. The column spacers can be distributed at an arrangement density of 100 ppm or more and 750 ppm or less.

[0233] In the display device according to an embodiment of the present disclosure, the display panel includes a light-emitting element including a first electrode disposed on the display substrate, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer. The light-emitting element may be any one of an organic electroluminescent element, a quantum dot light-emitting element, a micro LED, and a mini LED.

[0234] In the display device according to an embodiment of the present disclosure, the functional member may be any one of a cover window, a touch panel, a barrier panel, and a light control film.

[0235] In the display device according to an embodiment of the present disclosure, the modulus ratio (MR) of the second temperature to the first temperature of the adhesive layer may be in the range of 0.117 or more and 0.370 or less.

[0236] In the display device according to an embodiment of the present disclosure, the creep ratio (CR) of the second temperature to the first temperature of the adhesive layer may be in the range of 0.975 or more and 1.513 or less.

[0237] In the display device according to an embodiment of the present disclosure, the ratio (MR / CR) of the MR of the adhesive layer to the CR may be in the range of 0.120 or more and 0.290 or less.

[0238] According to an embodiment of the present disclosure, a display device is provided that includes a display panel for outputting an image, a first functional member disposed on the display panel, a second functional member disposed on the first functional member, and a first additional adhesive layer disposed between the first functional member and the second functional member. The first additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0239] In the display device according to an embodiment of the present disclosure, the first temperature may be 25 °C and the second temperature may be 105 °C.

[0240] In the display device according to an embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0241] In the display device according to an embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0242] In the display device according to an embodiment of the present disclosure, the first additional adhesive layer can have a thickness of 150 μm or more and 750 μm or less.

[0243] In the display device according to an embodiment of the present disclosure, a first base substrate included in the first functional member and a second base substrate included in the second functional member are included, and at least one of the first base substrate and the second base substrate can have a thickness of 0.5 T or more and 1.0 T or less.

[0244] In a display device according to an embodiment of the present disclosure, it includes a third functional member disposed on a second functional member and a second additional adhesive layer disposed between the second functional member and the third functional member. The second additional adhesive layer may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C.

[0245] In a display device according to an embodiment of the present disclosure, the second additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C.

[0246] In a display device according to an embodiment of the present disclosure, the second additional adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C.

[0247] In a display device according to an embodiment of the present disclosure, the second additional adhesive layer can have a thickness of 150 μm or more and 750 μm or less.

[0248] In a display device according to an embodiment of the present disclosure, the display panel may be any one of a liquid crystal display panel, an organic electroluminescence display panel, a quantum dot display panel, a micro LED display panel, and a mini LED display panel.

[0249] According to an embodiment of the present disclosure, it provides a display device including a display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member. The adhesive layer has a creep value of 100% or more at a first temperature and a creep value of 130% or more at a second temperature higher than the first temperature.

[0250] In a display device according to an embodiment of the present disclosure, the adhesive layer can have a storage modulus value of 55 KPa or less at the first temperature and a storage modulus value of 20 KPa or less at the second temperature.

[0251] The above description merely exemplarily explains the technical idea of the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure pertains can make various modifications and variations without departing from the essential characteristics of the present disclosure. Also, the embodiments disclosed in the present disclosure are for the purpose of explanation rather than limiting the technical idea of the present disclosure. Therefore, the scope of the technical idea of the present disclosure is not limited by such embodiments.

Claims

1. A display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member, wherein the adhesive layer at a first temperature, has a creep value of 100% or more and a storage modulus value of 55 kPa or less, at a second temperature higher than the first temperature, has a creep value of 130% or more and a storage modulus value of 20 kPa or less. A display device.

2. The display device according to claim 1, wherein the first temperature is 25° C. and the second temperature is 105° C.

3. The display device according to claim 2, wherein the adhesive layer has a creep value of 250% or less and a storage modulus value of 34 kPa or more at a temperature of 25° C.

4. The display device according to claim 2, wherein the adhesive layer has a creep value of 350% or less and a storage modulus value of 4 kPa or more at a temperature of 105° C.

5. The display device according to claim 1, wherein the adhesive layer has a thickness of 150 μm or more and 500 μm or less.

6. The functional member includes a base substrate, The display device according to claim 1, wherein the base substrate has a thickness of 0.5 T or more and 1.0 T or less.

7. The base substrate includes an upper base substrate and a lower base substrate facing each other, The display device according to claim 6, wherein at least one of the upper base substrate and the lower base substrate has a thickness of 0.5 T or more and 1.0 T or less.

8. The display panel includes a display substrate, The display device according to claim 1, wherein the display substrate has a thickness of 0.5 T or more and 1.0 T or less.

9. The display panel the display substrate including an upper display substrate and a lower display substrate, a column spacer disposed on the upper display substrate or the lower display substrate, and a display liquid crystal layer located between the upper display substrate and the lower display substrate, wherein The display device according to claim 8, wherein the column spacers are distributed at an arrangement density of 100 ppm or more and 750 ppm or less.

10. The display panel includes a light-emitting element, and the light-emitting element a first electrode disposed on the display substrate, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer, wherein The display device according to claim 8, wherein the light-emitting element is any one of an organic electroluminescence element, a quantum dot light-emitting element, a micro LED, and a mini LED.

11. The display device according to claim 1, wherein the functional member is any one of a cover window, a touch panel, a barrier panel, and a light control film.

12. Is the modulus ratio (MR) of the second temperature to the first temperature of the adhesive layer in the range of 0.117 or more and 0.370 or less, Is the creep ratio (CR) of the second temperature to the first temperature of the adhesive layer in the range of 0.975 or more and 1.513 or less, The display device according to claim 1, wherein the ratio (MR / CR) of MR to CR of the adhesive layer is in the range of 0.120 or more and 0.290 or less.

13. A display panel that outputs an image, A first functional member disposed on the display panel, A second functional member disposed on the first functional member, and A first additional adhesive layer disposed between the first functional member and the second functional member, The first additional adhesive layer, At the first temperature, the creep value is 100% or more and the storage modulus value is 55 kPa or less, A display device, wherein at the second temperature, the creep value is 130% or more and the storage modulus value is 20 kPa or less.

14. The display device according to claim 13, wherein the first additional adhesive layer has a creep value of 250% or less and a storage modulus value of 34 kPa or more at a temperature of 25°C.

15. The display device according to claim 13, wherein the first additional adhesive layer has a creep value of 350% or less and a storage modulus value of 4 kPa or more at a temperature of 105°C.

16. The display device according to claim 13, wherein the first additional adhesive layer has a thickness of 150 µm or more and 500 µm or less.

17. A third functional member disposed on the second functional member, and A second additional adhesive layer disposed between the second functional member and the third functional member, The second additional adhesive layer, At the first temperature, the creep value is 100% or more and the storage modulus value is 55 kPa or less, A display device, wherein at the second temperature, the creep value is 130% or more and the storage modulus value is 20 kPa or less.

18. The display device according to claim 17, wherein the second additional adhesive layer has a thickness of 150 µm or more and 500 µm or less.

19. A display panel that outputs an image, A functional member disposed on the display panel, and An adhesive layer disposed between the display panel and the functional member, The display device, wherein the adhesive layer has a creep value of 100% or more at a first temperature and a creep value of 130% or more at a second temperature higher than the first temperature.

20. The display device according to claim 19, wherein the adhesive layer has a storage modulus value of 55 kPa or less at the first temperature and a storage modulus value of 20 kPa or less at the second temperature.

Images