Function element mounting device, light source apparatus, and projection apparatus

Abstract

To provide a function element mounting device, a light source apparatus, and a projection apparatus that can increase heat diffusibility.SOLUTION: A function element mounting device comprises: an insulating substrate that has a first surface on which a wiring layer is formed, and a second surface on the opposite side of the first surface; a package that has an electrode and a function element electrically connected to the wiring layer, and is arranged on the wiring layer; a heat dissipation pad that is arranged on a surface of the package facing the insulating substrate; and a heat sink that is thermally connected to the heat dissipation pad, and dissipates heat transmitted thereto. The insulating substrate includes an area facing the heat dissipation pad, and has, in an area protruding from the heat dissipation pad, an insertion target part through which the insulating substrate passes from the first surface toward the second surface. The heat sink has a body part, and a projection that projects from the body part toward the heat dissipation pad, is inserted into the insertion target part, and is thermally connected to the heat dissipation pad. The projection includes a first area that faces the heat dissipation pad, and a second area that protrudes from the first area in a first direction directed toward the outside of the heat dissipation pad from the first area.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a functional element mounting device, a light source device, and a projection device.

Background Art

[0002] Conventionally, a lighting device having an LED element has been known (see, for example, Patent Document 1). The lighting device described in Patent Document 1 includes a module substrate on which an LED element is mounted, an insulating sheet, and a heat dissipation member disposed with respect to the module substrate via the insulating sheet. The insulating sheet is provided with an opening, and the heat dissipation member has a convex portion fitted into the opening of the insulating sheet. The convex portion is connected to the lower surface of the module substrate via a heat conductive resin layer made of silicone. More specifically, the upper surface of the convex portion is connected to the lower surface of the region of the module substrate where a plurality of LED elements are mounted via a heat conductive resin layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the lighting device described in Patent Document 1, since the convex portion connected to the lower surface of the module substrate passes through the opening provided according to the arrangement region of the plurality of LED elements in the insulating sheet, it is difficult to increase the cross-sectional area of the convex portion. For this reason, there is a problem that the diffusion thermal resistance in the convex portion tends to increase, and it is difficult to transfer the heat at the central portion where the temperature becomes high in the LED element to the surroundings. For this reason, a configuration capable of enhancing heat diffusivity has been demanded.

Means for Solving the Problems

[0005] The functional element mounting device according to the first aspect of the present disclosure includes an insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface, an electrode electrically connected to the wiring layer, and a functional element, a package disposed on the wiring layer, a heat dissipation pad disposed on the surface of the package on the side of the insulating substrate and dissipating heat generated by the functional element, and a heat dissipation plate thermally connected to the heat dissipation pad and dissipating heat transmitted from the heat dissipation pad. The insulating substrate has an inserted portion penetrating the insulating substrate from the first surface toward the second surface in a region including a region facing the heat dissipation pad and in a region protruding from the heat dissipation pad. The heat dissipation plate has a main body portion disposed to face the second surface, and a convex portion protruding from the main body portion toward the heat dissipation pad, inserted into the inserted portion, and thermally connected to the heat dissipation pad. The convex portion includes a first region facing the heat dissipation pad and a second region protruding from the first region in a first direction from the first region toward the outside of the heat dissipation pad.

[0006] The functional element mounting device according to the second aspect of the present disclosure includes an insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface, an electrode electrically connected to the wiring layer, and a functional element, a package disposed on the wiring layer, a heat dissipation pad disposed on the surface of the package on the side of the insulating substrate and dissipating heat generated by the functional element, and a heat dissipation plate thermally connected to the heat dissipation pad and dissipating heat transmitted from the heat dissipation pad. The insulating substrate has an inserted portion penetrating the insulating substrate from the first surface toward the second surface in a region from a region facing the heat dissipation pad to a region on an end side in a first direction. The wiring layer is disposed at a position in a direction opposite to the first direction on the first surface. The heat dissipation plate has a main body portion disposed to face the second surface, and a convex portion protruding from the main body portion toward the heat dissipation pad corresponding to the inserted portion, inserted into the inserted portion, and thermally connected to the heat dissipation pad.

[0007] The light source device according to the third aspect of the present disclosure includes the functional element mounting device according to the first or second aspect, and the functional element constitutes a light source.

[0008] The projection device according to the fourth aspect of the present disclosure includes the light source device according to the third aspect, a light modulation element that modulates light from the light source device, and a projection optical device that projects the light modulated by the light modulation element.

Brief Description of the Drawings

[0009]

Figure 1

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Mode for Carrying Out the Invention

[0010] [First Embodiment] Hereinafter, a first embodiment of the present disclosure will be described with reference to the drawings. [Schematic Configuration of Projector] FIG. 1 is a schematic diagram showing the configuration of a projector 1 according to the present embodiment. The projector 1 according to the present embodiment is a projection device that projects image light according to image information. As shown in FIG. 1, the projector 1 includes an exterior housing 2 that constitutes the exterior of the projector 1 and an image projection device 3 housed in the exterior housing 2. In addition, although not shown, the projector 1 includes a power supply device that supplies power to the electronic components that make up the projector 1, a cooling device that cools the components to be cooled that make up the projector 1, and a control device that controls the operation of the projector 1.

[0011] [Configuration of Image Projection Device] The image projection device 3 projects the above-described image light. The image projection device 3 includes a light source device 4, a light modulation device 31, a light combining element 32, and a projection lens 33.

[0012] [Configuration of Light Source Device] The light source device 4 includes three light source modules 41. The three light source modules 41 include a blue light source module 41B that emits blue light LB, a green light source module 41G that emits green light LG, and a red light source module 41R that emits red light LR. The blue light LB emitted from the blue light source module 41B is incident on the blue light modulation element 31B of the light modulation device 31. The green light LG emitted from the green light source module 41G is incident on the green light modulation element 31G of the light modulation device 31. The red light LR emitted from the red light source module 41R is incident on the red light modulation element 31R of the light modulation device 31. Note that the configuration of each light source module 41 will be described in detail later.

[0013] [Configuration of Light Modulation Device] The light modulation device 31 modulates the incident light to form image light according to the image information. The light modulation device 31 has a blue light modulation element 31B, a green light modulation element 31G, and a red light modulation element 31R. The blue light modulation element 31B modulates the blue light LB incident from the blue light source module 41B and emits the modulated blue light LB to the light combining element 32. The green light modulation element 31G modulates the green light LG incident from the green light source module 41G and emits the modulated green light LG to the light combining element 32. The red light modulation element 31R modulates the red light LR incident from the red light source module 41R and emits the modulated red light LR to the light combining element 32. In this embodiment, each of the light modulation elements 31B, 31G, and 31R is constituted by a liquid crystal light valve having a liquid crystal panel, an incident side polarizing element provided on the light incident side of the liquid crystal panel, and an emission side polarizing plate provided on the light emission side of the liquid crystal panel. More specifically, each of the light modulation elements 31B, 31G, and 31R is constituted by a liquid crystal light valve having a transmissive liquid crystal panel in which the surface on which light is incident and the surface from which the modulated light is emitted are different.

[0014] [Configuration of Light Combining Element and Projection Lens] The photosynthetic element 32 synthesizes the respective color lights LB, LG, and LR emitted from each of the light modulation elements 31B, 31G, and 31R to form the image light PL. In the present embodiment, the photosynthetic element 32 is configured by a cross-dichroic prism. However, the present invention is not limited to this, and the photosynthetic element 32 may be configured by combining a plurality of dichroic mirrors. The projection lens 33 projects the image light PL synthesized by the photosynthetic element 32 onto the projection surface. As the projection lens 33, a configuration having a lens barrel and at least one lens supported by the lens barrel can be exemplified.

[0015] [Configuration of Light Source Module] FIG. 2 is a perspective view showing the light source module 41. In FIG. 2, reference numerals are attached only to some of the fins 493 provided in the heat radiating member 49. The light source module 41 constitutes the light source device 4 and emits light. As shown in FIG. 2, the light source module 41 includes a functional element mounting device 42 and a heat radiating member 49.

[0016] [Configuration of Heat Radiating Member] First, the heat radiating member 49 will be described in detail. The heat radiating member 49 supports the functional element mounting device 42 and radiates the heat transmitted from the functional element mounting device 42. Specifically, the heat radiating member 49 is heat-transferably connected to a second surface 48B, which will be described later, of a heat radiating plate 48 that constitutes the functional element mounting device 42, and radiates the heat transmitted from the heat radiating plate 48. Such a heat radiating member 49 includes, in the present embodiment, a heat receiving substrate 491 having a recess 492 in which the functional element mounting device 42 is disposed, and a plurality of fins 493 provided on a surface of the heat receiving substrate 491 opposite to the functional element mounting device 42. That is, the heat radiating member 49 has a plurality of fins 493 and is configured by a heat sink that is heat-transferably connected to the heat radiating plate 48 of the functional element mounting device 42.

[0017] [Configuration of Functional Element Mounting Device] FIG. 3 is a perspective view showing the functional element mounting device 42, and FIG. 4 is a plan view showing the functional element mounting device 42 as viewed from the light-emitting side. FIG. 5 is an exploded perspective view showing the functional element mounting device 42 as viewed from the light-emitting side, and FIG. 6 is an exploded perspective view showing the functional element mounting device 42 as viewed from the side opposite to the light-emitting side. FIG. 7 is a diagram schematically showing a cross section of the functional element mounting device 42. In FIGS. 3 to 6, only some of the plurality of openings 452 of the resist 45 are labeled. The functional element mounting device 42 is supported by a heat radiating member 49. As shown in FIGS. 3 to 7, the functional element mounting device 42 includes an insulating substrate 43, a wiring layer 44, a resist 45, a package 46, a heat radiating pad 47, and a heat radiating plate 48. Among these, the insulating substrate 43, the wiring layer 44, and the resist 45 constitute a mounting substrate MB on which the package 46 is mounted.

[0018] [Configuration of Insulating Substrate and Wiring Layer] The insulating substrate 43 is a flat printed circuit board on which the package 46 is mounted. As shown in FIGS. 5 and 6, the insulating substrate 43 has a first surface 43A and a second surface 43B. As shown in FIG. 5, the first surface 43A is the surface of the insulating substrate 43 on the package 46 side. A wiring layer 44 formed of a copper foil is laminated on the first surface 43A. Further, a resist 45 is laminated on the first surface 43A on which the wiring layer 44 is laminated. As shown in FIG. 6, the second surface 43B is the surface of the insulating substrate 43 opposite to the first surface 43A. The second surface 43B is fixed to the heat radiating plate 48 by a prepreg resin PP as shown in FIG. 7.

[0019] In the following description, three mutually perpendicular directions are defined as the +X direction, the +Y direction, and the +Z direction. The +X direction and the +Y direction are along the first surface 43A. When viewed from a position facing the first surface 43A, the +X direction is the right direction and the +Y direction is the downward direction. That is, in the view of FIG. 4, the +X direction is the right direction and the +Y direction is the downward direction. Also, the +Z direction is the direction from the first surface 43A toward the second surface 43B. That is, in the view of FIG. 4, the +Z direction is the direction toward the paper surface. Although not shown, the direction opposite to the +X direction is defined as the -X direction, the direction opposite to the +Y direction is defined as the -Y direction, and the direction opposite to the +Z direction is defined as the -Z direction. Also, the axis along the +X direction is defined as the X axis, the axis along the +Y direction is defined as the Y axis, and the axis along the +Z direction is defined as the Z axis.

[0020] As shown in FIGS. 5 and 6, the insulating substrate 43 further has an inserted portion 431 that penetrates the insulating substrate 43 from the first surface 43A toward the second surface 43B. The inserted portion 431 is a rectangular opening that penetrates the insulating substrate 43 along the Z axis and is a recess that opens in the +Y direction when viewed from the -Z direction or the +Z direction. That is, the inserted portion 431 includes a region facing a heat dissipation pad 47 described later and is formed in a region protruding outward from the heat dissipation pad 47, and penetrates the insulating substrate 43 from the first surface 43A toward the second surface 43B. More specifically, the inserted portion 431 extends from approximately the center of the insulating substrate 43 in the +Y direction toward the end portion in the +Y direction when viewed from the -Z direction or the +Z direction, and extends to the end portion in the +Y direction. In other words, the inserted portion 431 is a notch formed by cutting out the insulating substrate 43 from the end portion in the +Y direction of the insulating substrate 43 toward the center of the insulating substrate 43 and includes a region where the heat dissipation pad 47 is disposed inside. That is, the inserted portion 431 penetrates the insulating substrate 43 from the region facing the heat dissipation pad 47 described later to the region on the +Y direction end side of the insulating substrate 43 from the first surface 43A toward the second surface 43B. A convex portion 482 of a heat dissipation plate 48 described later is inserted into the inserted portion 431 from the +Z direction. The length of the inserted portion 431 on the X axis is substantially the same as the length of the convex portion 482 on the X axis, and the length of the inserted portion 431 on the Y axis is substantially the same as the length of the convex portion 482 on the Y axis.

[0021] [Composition of Resist] FIG. 8 is a plan view of a functional element mounting device 42 with the illustration of the package 46 omitted, as viewed from the -Z direction. In FIG. 8, among the plurality of openings 452, only some of the openings 452 are labeled, and among the plurality of electrodes ER2, only some of the electrodes ER2 are labeled. As shown in FIGS. 3 to 7, the resist 45 is an insulating protective layer laminated from the -Z direction on the first surface 43A and a part of the wiring layer 44. Specifically, the resist 45 is laminated on a portion of the first surface 43A where the wiring layer 44 is not laminated and a part of the wiring layer 44 laminated on the first surface 43A. When the resist 45 is laminated on the first surface 43A and the wiring layer 44, as shown in FIG. 8, two electrodes ER1 to which the electrodes 462 (to be described later) of the package 46 are connected are formed, and a plurality of electrodes ER2 for providing connectors (not shown) are formed. That is, the resist 45 has two openings 451 and a plurality of openings 452, and the mounting substrate MB has two electrodes ER1 exposed in the -Z direction through the two openings 451 and a plurality of electrodes ER2 exposed in the -Z direction through the plurality of openings 452. The electrodes ER1 and ER2 are part of the wiring layer 44.

[0022] [Composition of Package and Heat Sink] The package 46 is a circuit element having a predetermined function and is mounted on the mounting substrate MB. Specifically, the package 46 is provided in the -Z direction with respect to the insulating substrate 43 and is disposed on the wiring layer 44 laminated on the insulating substrate 43. The package 46 has at least one functional element 461 shown in FIG. 5 and two electrodes 462 shown in FIG. 6, and is a circuit element solidified with resin in a state where the functional element 461 and the electrodes 462 are exposed to the outside. As shown in FIG. 5, the functional element 461 is exposed on the surface 46A facing the -Z direction in the package 46. The functional element 461 is a semiconductor element, and in this embodiment, it is a semiconductor light-emitting element that constitutes a light source. Specifically, the functional element 461 is an LED (Light Emitting Diode) element, and emits light in the -Z direction by the power supplied to the electrode 462.

[0023] As shown in FIG. 6, the two electrodes 462 are provided on the surface 46B facing the +Z direction in the package 46. The surface 46B is the surface on the opposite side of the surface 46A in the package 46, and is the surface facing the insulating substrate 43 in the package 46. More specifically, the electrode 462 faces the first surface 43A on which the wiring layer 44 is laminated in the insulating substrate 43. The two electrodes 462 are arranged side by side along the X-axis at the -Y direction end on the surface 46B. Each electrode 462 is connected to the electrode ER1 exposed from the resist 45 in the wiring layer 44 by solder. Note that a heat dissipation pad 47 is provided on the +Y direction portion of the surface 46B with a predetermined gap from the electrode 462. The heat dissipation pad 47 is a heat transfer member formed in a rectangular shape with one side along the Y-axis, and transfers the heat generated in the package 46 to a heat dissipation plate 48 described later.

[0024] [Configuration of the heat dissipation plate] The heat dissipation plate 48 supports the insulating substrate 43 and the package 46. Further, the heat dissipation plate 48 is connected to the package 46 via the heat dissipation pad 47 so as to be heat transferable, receives the heat generated in the package 46 via the heat dissipation pad 47, and dissipates the received heat. The heat dissipation plate 48 is composed of a metal plate such as a copper plate, for example. The heat dissipation plate 48 has a flat main body portion 481 shown in FIGS. 5 to 7 and a convex portion 482 shown in FIGS. 5 and 7.

[0025] The main body portion 481 has a first surface 481A shown in FIGS. 5 and 7 and a second surface 481B shown in FIG. 6. The first surface 481A faces the -Z direction, and the second surface 481B faces the +Z direction. The first surface 481A and the second surface 481B are surfaces on opposite sides of each other. As shown in FIGS. 5 and 7, the first surface 481A faces the second surface 43B of the insulating substrate 43 and supports the insulating substrate 43. As shown in FIG. 7, the second surface 43B is adhered to the first surface 481A via the prepreg resin PP. A convex portion 482 is provided on the first surface 481A. The heat dissipation member 49 shown in FIG. 2 is connected to the second surface 481B in a heat-transferable manner. That is, the second surface 481B dissipates the heat transferred to the heat dissipation plate 48 to the heat dissipation member 49.

[0026] As shown in FIGS. 5 and 7, the convex portion 482 protrudes in the -Z direction from the first surface 481A of the main body portion 481 in a rectangular shape corresponding to the inserted portion 431. Specifically, the convex portion 482 protrudes in the -Z direction from the first surface 481A in a rectangular shape that matches the inner edge shape of the inserted portion 431 so as to be fitted into the inserted portion 431 when the insulating substrate 43 is stacked on the main body portion 481 from the -Z direction.

[0027] As shown in FIG. 8, the convex portion 482 includes a first region 483 and a second region 484. The first region 483 is a region that is arranged inside the inserted portion 431 when the insulating substrate 43 and the heat dissipation plate 48 are combined and the convex portion 482 is inserted into the inserted portion 431. The first region 483 faces the heat dissipation pad 47 provided in the package 46 when the convex portion 482 is inserted into the inserted portion 431. The second region 484 is a region that protrudes from the first region 483 in the +Y direction toward the outside of the heat dissipation pad 47. That is, the second region 484 is a region provided in the convex portion 482 in the +Y direction in which the inserted portion 431 extends from the arrangement region of the package 46 more than the first region 483.

[0028] As shown in FIGS. 7 and 8, the convex portion 482 has a surface 482A which is the surface facing the -Z direction in the convex portion 482 and is the surface on the package 46 side. As shown in FIG. 7, the surface 482A is located in the same plane as the surface in the -Z direction in the wiring layer 44. In other words, the convex portion 482 protrudes from the first surface 481A such that the surface 482A is located in the same plane as the surface in the -Z direction in the wiring layer 44. As shown in FIG. 8, the surface 482A is composed of a first surface region 483A formed by the first region 483 and a second surface region 484A formed by the second region 484. Note that a heat sink 47 provided on the package 46 with the electrode 462 connected to the electrode ER1 is joined to the first surface region 483A by the solder SD shown in FIGS. 5 to 7.

[0029] As shown in FIG. 8, the cross-sectional area of the convex portion 482 along a virtual plane orthogonal to the Z-axis is larger than the surface area of the heat sink 47 along the virtual plane. That is, the cross-sectional area of the convex portion 482 along the XY plane is larger than the surface area of the heat sink 47 along the XY plane. Specifically, the length of the convex portion 482 on the X-axis is substantially the same as the length of the heat sink 47 on the X-axis and is substantially the same as the length of the package 46 on the X-axis. On the other hand, the length of the convex portion 482 on the Y-axis is larger than the length of the heat sink 47 on the Y-axis and is equal to or greater than the length of the package 46 on the Y-axis. Specifically, the length of the first surface region 483A on the Y-axis is substantially the same as the length of the heat sink 47 on the Y-axis. The length of the second surface region 484A on the Y-axis is substantially the same as the length of the heat sink 47 on the Y-axis. That is, the length of the convex portion 482 on the Y-axis is approximately twice the length of the heat sink 47 on the Y-axis. Thereby, the heat diffusibility of the package 46 transmitted through the heat sink 47 in the convex portion 482 is enhanced.

[0030] On the side surface 482B of the convex portion 482, the side surface 43C of the insulating substrate 43 facing the side surface 482B of the convex portion 482 is joined by the prepreg resin PP. That is, an insulating prepreg resin PP is interposed between the heat sink 48 and the insulating substrate 43. For example, as shown in FIG. 7, on the side surface 482B of the convex portion 482 facing the -Y direction, among the side surfaces 43C of the insulating substrate 43, the side surface 43C on the inner surface of the inserted portion 431 and facing the +Y direction is joined by the prepreg resin PP. In other words, a part of the prepreg resin PP fixes the insulating substrate 43 and the heat sink 48 at the side surface 482B of the convex portion 482. Also, a part of the resist 45 laminated on the first surface 43A of the insulating substrate 43 covers a part of the surface 482A of the convex portion 482 in the -Z direction.

[0031] [Manufacturing Process of Functional Element Mounting Device] FIG. 9 is a flowchart showing the manufacturing process of the functional element mounting device 42. The functional element mounting device 42 can be manufactured, for example, by the manufacturing process shown in FIG. 9. The manufacturing process shown in FIG. 9 includes a heat sink forming step S1, a wiring layer forming step S2, an insulating substrate bonding step S3, a resist processing step S4, and a mounting step S5. In the heat sink forming step S1, the convex portion 482 is formed on a substrate of a high thermal conductivity material such as copper and aluminum by etching or the like to form the heat sink 48. In the wiring layer forming step S2, a copper foil is disposed on the first surface 43A of the insulating substrate 43 to form the wiring layer 44. Note that, among the heat sink forming step S1 and the wiring layer forming step S2, one step may be performed prior to the other step, or the steps S1 and S2 may be performed simultaneously.

[0032] In the insulating substrate bonding step S3, the insulating substrate 43 on which the wiring layer 44 is formed is bonded to the heat sink 48 with the prepreg resin PP. At this time, as described above, the prepreg resin PP is interposed between the first surface 481A of the main body portion 481 and the second surface 43B of the insulating substrate 43, and the prepreg resin PP is also interposed between the side surface 482B of the convex portion 482 and the side surface 43C which is the inner surface of the inserted portion 431 of the insulating substrate 43, so as to bond the insulating substrate 43 to the heat sink 48. In the resist treatment step S4, a resist is applied to the region excluding the second surface region 484A of the convex portion 482, the outer region of the heat dissipation pad arrangement region where the heat dissipation pad 47 is arranged in the first surface region 483A of the convex portion 482, the first electrode formation region that becomes the electrode ER1 in the wiring layer 44, and the second electrode formation region that becomes the electrode ER2 in the wiring layer 44. As a result, a resist 45 is provided on the region exposed in the -Z direction on the first surface 43A of the insulating substrate 43, the region excluding the electrodes ER1 and ER2 in the wiring layer 44, and the -Y direction end portion of the convex portion 482, thereby constituting the mounting substrate MB.

[0033] In the mounting step S5, the package 46 is mounted on the mounting substrate MB bonded to the heat sink 48. Specifically, in the mounting step S5, solder SD is applied to each of the above-described heat dissipation pad arrangement region and the electrode ER1. Then, the package 46 is arranged such that the heat dissipation pad 47 provided on the package 46 contacts the solder SD arranged in the heat dissipation pad arrangement region, and the electrode 462 of the package 46 contacts the solder SD arranged on the electrode ER1. After that, the package 46 and the mounting substrate MB bonded to the heat sink 48 are passed through a reflow furnace to melt the solder SD, thereby mounting the package 46 on the mounting substrate MB. That is, the package 46 is bonded to the insulating substrate 43 and the heat sink 48 with the solder SD. Through the above manufacturing process, the above-described functional element mounting device 42 can be manufactured.

[0034] [Effects of the First Embodiment] The projector 1 according to the present embodiment described above has the following effects. The projector 1 as a projection device includes a light source device 4, light modulation elements 31B, 31G, 31R that modulate light from the light source device, and a projection optical device that projects the light modulated by the light modulation elements 31B, 31G, 31R. The light source device 4 includes a functional element mounting device 42, and the functional element 461 of the functional element mounting device 42 constitutes a light source.

[0035] The functional element mounting device 42 includes an insulating substrate 43, a package 46, a heat dissipation pad 47, and a heat dissipation plate 48. The insulating substrate 43 has a first surface 43A and a second surface 43B opposite to the first surface 43A. A wiring layer 44 is formed on the first surface 43A. The insulating substrate 43 has an insertion portion 431. The insertion portion 431 includes a region facing the heat dissipation pad 47 and penetrates the insulating substrate 43 from the first surface 43A toward the second surface 43B in a region protruding from the heat dissipation pad 47. The package 46 is disposed on the wiring layer 44. The package 46 has a functional element 461 and an electrode 462, and the electrode 462 is electrically connected to an electrode ER1 provided on the wiring layer 44. The heat dissipation pad 47 is disposed on a surface 46B on the insulating substrate 43 side in the package 46. The heat dissipation pad 47 dissipates heat generated by the functional element 461.

[0036] The heat dissipation plate 48 is thermally connected to the heat dissipation pad 47 and dissipates heat transmitted from the heat dissipation pad 47. The heat dissipation plate 48 has a main body portion 481 disposed to face the second surface 43B of the insulating substrate 43 and a convex portion 482 provided on the main body portion 481. The convex portion 482 protrudes in the -Z direction from the main body portion 481 toward the heat dissipation pad 47. The convex portion 482 is inserted into the insertion portion 431 and is thermally connected to the heat dissipation pad 47. The convex portion 482 includes a first region 483 facing the heat dissipation pad 47 and a second region 484. The second region 484 is a region that protrudes from the first region 483 in the +Y direction when viewed from the direction opposite to the +Z direction from the first surface 43A toward the second surface 43B. The +Y direction is the direction from the first region 483 toward the outside of the heat dissipation pad 47 and corresponds to the first direction.

[0037] According to such a configuration, the convex portion 482 protruding from the main body portion 481 of the heat dissipation plate 48 is thermally connected to the heat dissipation pad 47 via the insertion portion 431. The convex portion 482 includes a first region 483 facing the heat dissipation pad 47 and a second region 484 that protrudes from the first region 483 in the +Y direction when viewed from the -Z direction. Therefore, in addition to increasing the volume of the heat dissipation plate 48, the cross-sectional area of the convex portion 482 along the virtual plane orthogonal to the -Z direction toward the heat dissipation pad 47 can be increased. Thereby, the heat diffusivity inside the heat dissipation plate 48, for example, the heat diffusivity inside the convex portion 482 in the XY plane can be improved. Therefore, the heat dissipation effect of the heat generated in the package 46 can be improved. Further, since the light source device 4 having a high heat dissipation effect for the functional element 461 which is an LED element can be configured, the output light amount from the light source device 4 can be increased, and the deterioration of the functional element 461 can be suppressed. Thus, the long life of the projector 1 capable of projecting a high-brightness image can be achieved.

[0038] In other words, the functional element mounting device 42 includes an insulating substrate 43, a package 46, a heat dissipation pad 47, and a heat dissipation plate 48. The insulating substrate 43 has a first surface 43A on which a wiring layer 44 is formed and a second surface 43B on the side opposite to the first surface 43A. The insulating substrate 43 has an insertion portion 431 that penetrates the insulating substrate 43 from the first surface 43A toward the second surface 43B in a region from the region facing the heat dissipation pad 47 to the end portion side region in the +Y direction. The +Y direction corresponds to the first direction. Note that the wiring layer 44 is disposed at a position in the -Y direction on the first surface 43A. The -Y direction corresponds to the direction opposite to the first direction. The package 46 is disposed on the wiring layer 44. The package 46 has a functional element 461 and an electrode 462 electrically connected to the wiring layer 44. The heat dissipation pad 47 is disposed on the surface 46B on the insulating substrate 43 side in the package 46, and dissipates the heat generated by the functional element 461.

[0039] The heat dissipation plate 48 is thermally connected to the heat dissipation pad 47, and dissipates the heat transmitted from the heat dissipation pad 47. The heat dissipation plate 48 has a main body portion 481 disposed to face the second surface 43B, and a convex portion 482. The convex portion 482 protrudes in the -Z direction from the main body portion 481 toward the heat dissipation pad 47 corresponding to the inserted portion 431. The convex portion 482 is inserted into the inserted portion 431 and is thermally connected to the heat dissipation pad 47.

[0040] According to such a configuration, the convex portion 482 that receives heat from the heat dissipation pad 47 disposed on the surface 46B of the package 46 protrudes from the main body portion 481 corresponding to the inserted portion 431 provided on the insulating substrate 43. That is, the convex portion 482 extends in the +Y direction from the region facing the heat dissipation pad 47 in the main body portion 481. By providing such a convex portion 482 on the heat dissipation plate 48, the volume of the heat dissipation plate 48 can be increased, and the cross-sectional area of the convex portion 482 along the virtual plane orthogonal to the -Z direction toward the heat dissipation pad 47 can be increased. Thereby, the heat diffusivity inside the heat dissipation plate 48 can be improved, and the heat dissipation effect of the heat generated in the package 46 can be improved. Furthermore, by separating and disposing the wiring layer 44 and the convex portion 482, miniaturization of the functional element mounting device 42 can be achieved.

[0041] In the functional element mounting device 42, the length in the +Y direction in the second region 484 is equal to or greater than the length in the +Y direction in the heat dissipation pad 47. According to such a configuration, the volume of the heat dissipation plate 48 can be increased, and the cross-sectional area of the convex portion 482 along the virtual plane orthogonal to the -Z direction toward the heat dissipation pad 47 can be further increased. Thereby, the heat diffusivity inside the heat dissipation plate 48 can be improved, and the heat dissipation effect of the heat generated in the package 46 can be improved.

[0042] In the functional element mounting device 42, the heat dissipation pad 47 and the convex portion 482 are fixed by the solder SD. According to such a configuration, the solder SD can fix the heat dissipation pad 47 and the heat dissipation plate 48 having the convex portion 482 while ensuring heat transfer from the heat dissipation pad 47 to the convex portion 482.

[0043] The functional element mounting device 42 includes a resist 45 laminated on the first surface 43A of the insulating substrate 43 and the wiring layer 44. According to such a configuration, the electrical insulation of the wiring layer 44 can be maintained.

[0044] In the functional element mounting device 42, the insulating substrate 43 and the heat dissipation plate 48 are fixed by the prepreg resin PP. A part of the prepreg resin PP fixes the insulating substrate 43 and the heat dissipation plate 48 on the side surface 482B of the convex portion 482. According to such a configuration, since the prepreg resin PP is an insulating adhesive, the insulating substrate 43 and the heat dissipation plate 48 can be fixed while maintaining the insulation between the insulating substrate 43 and the heat dissipation plate 48.

[0045] In the functional element mounting device 42, the surface 482A of the convex portion 482 on the package 46 side and the surface of the wiring layer 44 on the package 46 side are located in the same plane. That is, the surface 482A and the surface of the wiring layer 44 facing the -Z direction are located in the same plane. According to such a configuration, it is possible to suppress the inclination of the package 46 with respect to the insulating substrate 43 on which the wiring layer 44 is provided. In addition, since the electrodes 462 of the package 46 and the wiring layer 44 can be easily electrically connected, electrical leakage can be suppressed.

[0046] In the functional element mounting device 42, the electrodes 462 of the package 46 face the first surface 43A of the insulating substrate 43 on which the wiring layer 44 is laminated. According to such a configuration, by arranging the package 46 so as to overlap with the wiring layer 44, the electrode 462 and the electrode ER1 formed by the wiring layer 44 can be connected, so that it is possible to facilitate the connection between the electrode 462 and the electrode ER1 of the wiring layer 44.

[0047] In the functional element mounting device 42, the functional element 461 is a semiconductor element. According to such a configuration, the heat of the semiconductor element, which is likely to cause performance degradation due to heat, can be efficiently dissipated.

[0048] In the functional element mounting device 42, the functional element 461 is a semiconductor light-emitting element. Specifically, the functional element 461 is an LED element. According to such a configuration, the heat of the functional element 461, which is likely to cause performance degradation due to heat, can be efficiently dissipated.

[0049] [Modification of the First Embodiment] In the above functional element mounting device 42, among the first region 483 and the second region 484 of the convex portion 482 of the heat sink 48, the length in the +Y direction in the first region 483 is substantially the same as the length in the +Y direction of the heat dissipation pad 47, and the length in the +Y direction in the second region 484 is substantially the same as the length in the +Y direction of the heat dissipation pad 47. However, the present invention is not limited to this, and the length in the +Y direction in the second region 484 protruding from the first region 483 in the +Y direction can be appropriately changed.

[0050] For example, the length in the +Y direction in the second region 484 may be equal to or greater than the length in the +Y direction of the package 46. According to such a configuration, not only can the volume of the heat sink 48 be increased, but also the cross-sectional area of the convex portion 482 along the virtual plane orthogonal to the -Z direction toward the heat dissipation pad 47 can be further increased. Thereby, the heat diffusivity inside the heat sink 48 can be improved, and the heat dissipation effect of the heat generated in the package 46 can be improved.

[0051] [Second Embodiment] Next, a second embodiment of the present disclosure will be described. The projector according to this embodiment has the same configuration as the projector 1 according to the first embodiment, but the configuration of the light source module is different. Specifically, in the light source module according to this embodiment, the shape of the convex portion of the heat sink is different from that of the light source module 41 according to the first embodiment. In the following description, parts that are the same as or substantially the same as the parts already described will be denoted by the same reference numerals and the description thereof will be omitted.

[0052] [Schematic Configuration of Projector and Light Source Device] FIG. 10 is a perspective view showing a light source module 51 included in the projector according to this embodiment, and FIG. 11 is a plan view showing the light source module 51 viewed from the -Z direction. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it includes the light source module 51 shown in FIGS. 10 and 11 instead of the light source module 41. That is, although not shown, the light source device 4 according to this embodiment includes three light source modules 51, and the three light source modules 51 include a blue light source module that emits blue light, a green light source module that emits green light, and a red light source module that emits red light.

[0053] [Configuration of Light Source Module] FIG. 12 is a plan view showing the functional element mounting device 52 viewed from the -Z direction. In FIG. 12, only some of the plurality of openings 452 are labeled, and only some of the plurality of electrodes ER2 are labeled. The light source module 51 emits light in the same manner as the light source module 41 according to the first embodiment. The light source module 51 includes a functional element mounting device 52 and a heat radiating member 49. The functional element mounting device 52 has the same configuration and functions as the functional element mounting device 42, except that it includes an insulating substrate 53, a heat sink 58, and a heat sink 59 instead of the insulating substrate 43 and the heat sink 48. That is, as shown in FIGS. 10 to 12, the functional element mounting device 52 includes an insulating substrate 53, a wiring layer 44, a resist 45, a package 46, a heat dissipation pad 47, a heat sink 58, and a heat sink 59.

[0054] [Configuration of Insulating Substrate] The insulating substrate 53 is a printed circuit board similar to the insulating substrate 43 and constitutes a mounting substrate MB on which the package 46 is mounted. Although not shown in FIG. 12, the insulating substrate 53 has a first surface 53A and a second surface 53B, similar to the insulating substrate 43. The first surface 53A is the surface on the package 46 side of the insulating substrate 53 and faces the -Z direction. The wiring layer 44 and the resist 45 are laminated on the first surface 53A. The second surface 53B is the surface on the insulating substrate 53 opposite to the first surface 53A and faces the +Z direction. The second surface 53B is joined to the heat sink 58 by a prepreg resin PP.

[0055] The insulating substrate 53 further has an insertion portion 531 that penetrates the insulating substrate 53 in the +Z direction from the first surface 53A to the second surface 53B. The insertion portion 531 is a rectangular opening and is a recess that opens in the +Y direction when viewed from the -Z direction. That is, the insertion portion 531 extends from the central portion of the insulating substrate 53 in the +Y direction towards the end portion in the +Y direction when viewed from the -Z direction, and extends to the end portion in the +Y direction of the insulating substrate 53. In other words, the insertion portion 531 is formed by notching from the end portion in the +Y direction of the insulating substrate 53 towards the center of the insulating substrate 53, and is a notch that includes a region where the heat dissipation pad 47 is disposed inside. That is, the insertion portion 531 penetrates the insulating substrate 53 from the first surface 53A to the second surface 53B from the region facing the heat dissipation pad 47 to the region on the end portion side in the +Y direction of the insulating substrate 43.

[0056] The convex portion 582 of the heat sink 58 is inserted into the inserted portion 531 from the +Z direction. The length of the inserted portion 531 in the +X direction is substantially the same as the length of the heat dissipation pad 47 in the +X direction and substantially the same as the length of the package 46 in the +X direction. The length of the inserted portion 531 in the +Y direction is substantially the same as the length of the heat dissipation pad 47 in the +Y direction. Therefore, when the length of the functional element mounting device 52 in the +Y direction is the same as the length of the functional element mounting device 42 in the +Y direction, the length of the insulating substrate 53 in the +Y direction is smaller than the length of the insulating substrate 43 in the +Y direction, and the length of the inserted portion 531 in the +Y direction is smaller than the length of the inserted portion 431 in the +Y direction.

[0057] [Configuration of the heat sink] FIG. 13 is a perspective view showing the heat sink 58 viewed from the -Z direction. Similar to the heat sink 48, the heat sink 58 supports the insulating substrate 53 and the package 46, and dissipates the heat received from the package 46 through the heat dissipation pad 47. As shown in FIG. 13, the heat sink 58 has a flat main body portion 481 and a convex portion 582 protruding from the main body portion 481 in the -Z direction.

[0058] Similar to the convex portion 482, the convex portion 582 protrudes from the first surface 481A of the main body portion 481 in the -Z direction. The convex portion 582 protrudes from the first surface 48A in a substantially T shape when viewed from the -Z direction, and the surface 582A in the -Z direction of the convex portion 582 is located in the same plane as the surface in the -Z direction of the wiring layer 44. The convex portion 582 has a first region 583 inserted into the inserted portion 531 from the +Z direction and a second region 584 protruding in the +Y direction from the first region 583.

[0059] When the insulating substrate 53 and the heat sink 58 are combined, the first region 583 is inserted and fitted into the inserted portion 531 from the +Z direction. When viewed from the -Z direction, the outer shape of the first region 583 is a rectangular shape that coincides with the inner edge shape of the inserted portion 531. The length of the first region 583 in the +X direction is substantially the same as the length of the inserted portion 531 in the +X direction, and the length of the first region 583 in the +Y direction is substantially the same as the length of the inserted portion 531 in the +Y direction.

[0060] When the insulating substrate 53 and the heat sink 58 are combined, the second region 584 is disposed outside the inserted portion 531. More specifically, the second region 584 is disposed outside the insulating substrate 53 when viewed from the -Z direction. The second region 584 has a first extending region 585 and second extending regions 586, 587. The first extending region 585 corresponds to the second region 484 in the convex portion 482 of the heat sink 48, and is a region that extends continuously from the first region 583 in the +Y direction. The second extending region 586 is a region that extends from the first extending region 585 in the +X direction, and the second extending region 587 is a region that extends from the first extending region 585 in the -X direction. Note that the length of the second region 584 in the +Y direction is substantially the same as the length of the heat dissipation pad 47 in the +Y direction. However, it is not limited to this, and the length of the second region 584 in the +Y direction can be appropriately changed, and may be equal to or greater than the length of the package 46 in the +Y direction, similar to the modification according to the first embodiment described above.

[0061] FIG. 14 is a plan view of the functional element mounting device 52 with the illustration of the package 46 omitted, viewed from the -Z direction, and is a plan view showing the positional relationship between the heat dissipation pad 47 and the convex portion 582. In FIG. 14, among the plurality of openings 452, only some of the openings 452 are labeled, and among the plurality of electrodes ER2, only some of the electrodes ER2 are labeled. On the surface 582A of such a convex portion 582, a first surface region 583A formed by a first region 583 is connected to be heat-transferable to a heat sink 47 via a solder SD (not shown). Therefore, heat transferred from the heat sink 47 diffuses inside the convex portion 582 through the first surface region 583A. The convex portion 582 has a second region 584 protruding from the first region 583 in the +Y direction. The second region 584 has not only a first extending region 585 but also second extending regions 586 and 587 extending in the ±X direction from the first extending region 585.

[0062] Therefore, the cross-sectional area of the convex portion 582 along a virtual plane orthogonal to the +Z direction is larger than the surface area of the heat sink 47 along the virtual plane, and is further larger than the cross-sectional area of the convex portion 482 along the virtual plane. That is, the cross-sectional area of the convex portion 582 is larger than the cross-sectional area of the convex portion 482 by the amount of the second extending regions 586 and 587. Thereby, the diffusibility of heat transferred from the heat sink 47 is enhanced inside the convex portion 582.

[0063] Although detailed illustration is omitted, the side surface of the convex portion 582 is joined to the side surface of the insulating substrate 53 via a prepreg resin PP. Also, the first surface 481A of the main body portion 481 and the second surface 53B of the insulating substrate 53 are joined to each other by the prepreg resin PP. Also, a part of the resist 45 laminated on the first surface 53A of the insulating substrate 53 covers a part of the surface 582A of the convex portion 582.

[0064] [Configuration of Heat Sink] As shown in FIGS. 10 and 11, a heat sink 59 is connected to be heat-transferable to the second region 584 in the convex portion 582. The heat sink 59 has a flat heat-receiving portion 591 and a plurality of fins 592 protruding from the heat-receiving portion 591 in the -Z direction as shown in FIG. 10. The heat-receiving portion 591 contacts a region corresponding to the second region 584 on the surface 582A of the convex portion 582 and dissipates heat transferred from the convex portion 582. Such a functional element mounting device 52 can be manufactured by a manufacturing process including each of the steps S1 to S5 shown in the first embodiment and a heat sink arranging step of arranging a heat sink 59 in the second region 584.

[0065] [Effects of the Second Embodiment] The projector according to the present embodiment described above has the same effects as the projector 1 according to the first embodiment, and also has the following effects. In the functional element mounting device 52, the second region 584 that constitutes the convex portion 582 of the heat dissipation plate 58 includes a first extending region 585 and second extending regions 586 and 587. The first extending region 585 is a region extending in the +Y direction from the first region 583. The second extending regions 586 and 587 are regions extending in at least one of the +X direction intersecting the +Y direction and the direction opposite to the +X direction from the first extending region 585. More specifically, the second extending region 586 is a region extending in the +X direction from the first extending region 585, and the second extending region 587 is a region extending in the -X direction from the first extending region 585. According to such a configuration, since the second region 584 in the convex portion 582 can be further enlarged, the volume of the heat dissipation plate 58 can be further increased, and the cross-sectional area of the convex portion 582 along the virtual plane orthogonal to the -Z direction toward the heat dissipation pad 47 can be further increased. Therefore, the heat diffusibility inside the heat dissipation plate 58 can be improved, and the heat dissipation effect of the heat generated in the package 46 can be improved.

[0066] The functional element mounting device 52 includes a heat sink 59 connected to the second region 584 protruding from the package 46 in the convex portion 582. According to such a configuration, the heat dissipation efficiency of the heat of the package 46 transmitted to the convex portion 582 can be increased, and the heat sink 59 can be arranged using the region protruding from the package 46 in the convex portion 582.

[0067] [Third Embodiment] Next, a third embodiment of the present disclosure will be described. The projector according to this embodiment has the same configuration as the projector 1 according to the first embodiment, but is different in that the resist laminated on the insulating substrate of the functional element mounting device is also laminated on the second region of the heat sink, and an opening in which the solder SD is disposed inside is provided in the resist. In the following description, parts that are the same as or substantially the same as the parts already described are denoted by the same reference numerals and the description thereof is omitted.

[0068] [Schematic Configuration of Projector and Light Source Device] FIG. 15 is a plan view of the light source module 61 included in the projector according to this embodiment as viewed from the -Z direction. In FIG. 15, only some of the plurality of openings 452 are labeled, and only some of the plurality of electrodes ER2 are labeled. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it includes the light source module 61 shown in FIG. 15 instead of the light source module 41. That is, although not shown, the light source device 4 according to this embodiment includes three light source modules 61, and the three light source modules 61 include a blue light source module that emits blue light, a green light source module that emits green light, and a red light source module that emits red light.

[0069] [Configuration of Light Source Module and Functional Element Mounting Device] FIG. 16 is an exploded perspective view showing the functional element mounting device 62 that constitutes the light source module 61 as viewed from the -Z direction. In FIG. 16, only some of the plurality of openings 452 are labeled. The light source module 61 emits light in the same manner as the light source module 41 according to the first embodiment. The light source module 61 includes a functional element mounting device 62 and a heat dissipation member 49. As shown in FIGS. 15 and 16, the functional element mounting device 62 has the same configuration and functions as the functional element mounting device 42 according to the first embodiment, except that it includes a resist 65 instead of the resist 45. That is, the functional element mounting device 62 includes an insulating substrate 43, a wiring layer 44, a resist 65, a package 46, a heat dissipation pad 47, and a heat dissipation plate 48.

[0070] [Configuration of Resist] Similar to the resist 45, the resist 65 is laminated on the first surface 43A of the insulating substrate 43 where the wiring layer 44 is laminated. Further, the resist 65 is also laminated on the surface 482A of the convex portion 482 inserted into the insertion portion 431 of the insulating substrate 43, in a region excluding the region where the heat dissipation pad 47 is connected by the solder SD. Therefore, the resist 65 has a rectangular opening 651 in which the heat dissipation pad is disposed inside when viewed from the -Z direction. That is, the opening 651 is an opening including a region corresponding to the heat dissipation pad 47, and the periphery of the opening 651 surrounds the heat dissipation pad 47. Note that the resist 65 has an opening 451 that exposes the electrode ER1, which is a part of the wiring layer 44, in the -Z direction, and an opening 452 that exposes the electrode ER2, which is a part of the wiring layer 44, in the -Z direction.

[0071] [Effects of the Third Embodiment] The projector according to the present embodiment described above has the same effects as the projector 1 according to the first embodiment, and also has the following effects. In the functional element mounting device 62, the resist 65 has an opening 651 including a region corresponding to the heat dissipation pad. According to such a configuration, the solder SD can be retained in the opening 651. Therefore, the spread of the solder SD outside the opening 651 can be restricted, and the assembly position accuracy of the package 46 can be improved.

[0072] [Modification of the Third Embodiment] FIG. 17 is an exploded perspective view showing a functional element mounting device 62A which is a modification of the functional element mounting device 62. In FIG. 17, among the plurality of openings 452, only some of the openings 452 are labeled. The above-described functional element mounting device 62 was provided with the insulating substrate 43 and the heat sink 48. However, the present invention is not limited to this, and instead of the functional element mounting device 62, the functional element mounting device 62A shown in FIG. 17 may be applied to the light source module 61. The functional element mounting device 62A may have the same configuration and function as the functional element mounting device 52 according to the second embodiment, except that it includes a resist 65 instead of the resist 45. Also in the functional element mounting device 62A, the resist 65 is laminated on the first surface 43A of the insulating substrate 43 on which the wiring layer 44 is laminated, and also on the surface 482A of the convex portion 482 in a region excluding the region where the heat dissipation pad 47 is connected by the solder SD. For example, the resist 65 is also laminated on the second region 584. Therefore, the resist 65 has a rectangular opening 651 in which the heat dissipation pad 47 is disposed inside when viewed from the -Z direction. That is, the opening 651 is an opening including a region corresponding to the heat dissipation pad 47, and the periphery of the opening 651 surrounds the heat dissipation pad 47. A projector including such a functional element mounting device 62A has the same effects as the projector according to the second embodiment, and also has the above-described effects.

[0073] [Fourth Embodiment] Next, a fourth embodiment of the present disclosure will be described. The projector according to the present embodiment has the same configuration as the projector 1 according to the first embodiment, but the connection mode between the electrode provided on the insulating substrate and the package is different. In the following description, parts that are the same as or substantially the same as the parts already described are denoted by the same reference numerals, and the description thereof is omitted.

[0074] [Schematic Configuration of Projector and Light Source Device] FIG. 18 is a diagram schematically showing a cross section of a functional element mounting device 72 included in a light source module of the projector according to the present embodiment. The projector according to the present embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it includes a functional element mounting device 72 partially shown in FIG. 18 instead of the functional element mounting device 42. That is, although not shown, the light source device 4 according to the present embodiment includes three light source modules 41 including a blue light source module, a green light source module, and a red light source module, and each light source module 41 includes a functional element mounting device 72 instead of the functional element mounting device 42.

[0075] [Configuration of Functional Element Mounting Device] The functional element mounting device 72 includes a package 76 instead of the package 46, and has the same configuration and functions as the functional element mounting device 42 according to the first embodiment, except that an electrode ER1 formed by a wiring layer 44 laminated on an insulating substrate 43 and an electrode 762 of the package 76 are electrically connected by a bonding wire BW. That is, the functional element mounting device 72 includes an insulating substrate 43, a wiring layer 44, a resist 45, a package 76, a heat dissipation pad 47, and a heat dissipation plate 48.

[0076] [Configuration of Package] The package 76 is a circuit element having a predetermined function and is mounted on a mounting substrate MB, similarly to the package 46. Specifically, the package 76 is provided in the -Z direction with respect to the insulating substrate 43 and is disposed on the wiring layer 44 laminated on the insulating substrate 43. The package 76 has a functional element 461 and an electrode 762, and is a circuit element solidified with resin in a state where the functional element 461 and the electrode 762 are exposed to the outside. The electrode 762 is provided on the surface 76A facing the -Z direction in the package 76, similarly to the functional element 461. The electrode 762 is composed of the wiring layer 44 and is electrically connected to the electrode ER1 exposed in the -Z direction through the opening 451 of the resist 45 by the bonding wire BW. Such an electrode 762 may be provided on the side surface intersecting the surface 76A in the package 76. On the surface 76B facing the +Z direction in such a package 76, a heat sink 47 is provided, and the heat sink 47 is heat-transferably connected to the convex portion 482 of the heat sink 48 through the solder SD.

[0077] Note that the functional element mounting device 72 may include an insulating substrate 53 and a heat sink 58, similar to the functional element mounting device 52 according to the second embodiment, instead of the insulating substrate 43 and the heat sink 48. Further, the functional element mounting device 72 may include the resist 65 shown in the third embodiment instead of the resist 45. Also, a plurality of electrodes formed by the wiring layer 44 and connected to the electrode 762 may be provided around the package 76.

[0078] [Effects of the Fourth Embodiment] The projector according to the present embodiment described above has the same effects as the projector 1 according to the first embodiment, and also has the following effects. In the functional element mounting device 72, the electrode 762 of the package 76 is electrically connected to the electrode ER1 of the wiring layer 44 by the bonding wire BW. According to such a configuration, when there are relatively many electrodes 762 provided in the package 76, it is possible to easily electrically connect the electrode 762 and the wiring layer 44.

[0079] [Modifications of the Embodiment] The present disclosure is not limited to the above-described embodiments, and modifications and improvements within the scope that can achieve the object of the present disclosure are included in the present disclosure. In each of the above embodiments, the functional element 461 included in the packages 46 and 76 was assumed to be a semiconductor light-emitting element, specifically an LED element. However, the present invention is not limited to this, and the functional element 461 may be another semiconductor light-emitting element such as a semiconductor laser element, or may be an integrated circuit element such as an IC chip. That is, the functional element of the package provided in the functional element mounting device according to the present disclosure may be another semiconductor element, or may be another functional element as long as it can realize a predetermined function by electric power.

[0080] In the second embodiment described above, the functional element mounting device 52 was assumed to include a heat sink 59 that is thermally connected to the convex portion 582. Such a heat sink 59 may be provided in the functional element mounting device 42. In this case, the heat sink 59 may be thermally connected to the second surface region 484A formed by the second region 484 of the convex portion 482.

[0081] In each of the above embodiments, the projector was assumed to include three light modulation elements 31B, 31G, and 31R. However, the present disclosure is not limited to this, and the present disclosure is also applicable to projectors including two or less or four or more light modulation elements. In each of the above embodiments, the image projection device 3 was assumed to have the light modulation elements 31B, 31G, and 31R, the light combining element 32, and the projection lens 33 arranged in the layout shown in FIG. 1. However, the present invention is not limited to this, and the optical components and the layout of the optical components constituting the image projection device 3 are not limited to the above, and can be changed as appropriate.

[0082] In each of the above embodiments, the light modulation elements 31B, 31G, and 31R were assumed to include a transmissive liquid crystal panel in which the light incident surface and the light exit surface are different. However, the present invention is not limited to this, and the light modulation element may include a reflective liquid crystal panel in which the light incident surface and the light exit surface are the same. Further, as long as it is a light modulation device that can modulate an incident light beam to form an image according to image information, a device using a micromirror, for example, a device using a DMD (Digital Micromirror Device) or the like, may use a light modulation element other than liquid crystal.

[0083] In each of the above embodiments, the functional element mounting devices 42, 52, 62, and 72 are applied to the light source modules that constitute the light source device of the projector. However, the present disclosure is not limited to this, and the functional element mounting device of the present disclosure can be applied to electronic devices other than projectors according to the functions of the functional elements adopted in the package.

[0084] [Summary of the Present Disclosure] The summary of the present disclosure is appended below. [Appendix 1] An insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface, An electrode electrically connected to the wiring layer and a package having a functional element, the package being disposed on the wiring layer, A heat dissipation pad disposed on the surface of the package on the side of the insulating substrate, the heat dissipation pad dissipating heat generated by the functional element, A heat dissipation plate thermally connected to the heat dissipation pad and dissipating the heat transmitted from the heat dissipation pad, The insulating substrate includes a region facing the heat dissipation pad and has an inserted portion penetrating the insulating substrate from the first surface toward the second surface in a region protruding from the heat dissipation pad, The heat dissipation plate includes A main body portion disposed to face the second surface, A convex portion protruding from the main body portion toward the heat dissipation pad, inserted into the inserted portion, and thermally connected to the heat dissipation pad, The convex portion includes A first region facing the heat dissipation pad, A second region protruding from the first region in a first direction from the first region toward the outside of the heat dissipation pad, A functional element mounting device characterized by the above.

[0085] According to such a configuration, on the heat dissipation pad, a convex portion protruding from the main body portion of the heat dissipation plate is thermally connected via the inserted portion. The convex portion includes a first region facing the heat dissipation pad and a second region protruding from the first region in a first direction. Therefore, not only can the volume of the heat dissipation plate be increased, but also the cross-sectional area of the convex portion along a virtual plane orthogonal to the direction toward the heat dissipation pad can be enlarged. Thereby, the diffusivity of heat inside the heat dissipation plate can be improved, and the heat dissipation effect of the heat generated in the package can be improved.

[0086] [Appendix 2] In the functional element mounting device described in Appendix 1, the length of the second region in the first direction is equal to or greater than the length of the heat dissipation pad in the first direction, A functional element mounting device characterized by this. According to such a configuration, not only can the volume of the heat dissipation plate be increased, but also the cross-sectional area of the convex portion along a virtual plane orthogonal to the direction toward the heat dissipation pad can be further enlarged. Thereby, the diffusivity of heat inside the heat dissipation plate can be improved, and the heat dissipation effect of the heat generated in the package can be improved.

[0087] [Appendix 3] In the functional element mounting device described in Appendix 1, the length of the second region in the first direction is equal to or greater than the length of the package in the first direction, A functional element mounting device characterized by this. According to such a configuration, similar to the functional element mounting device according to Appendix 3 above, not only can the volume of the heat dissipation plate be increased, but also the cross-sectional area of the convex portion along a virtual plane orthogonal to the direction toward the heat dissipation pad can be further enlarged. Thereby, the diffusivity of heat inside the heat dissipation plate can be improved, and the heat dissipation effect of the heat generated in the package can be improved.

[0088] [Appendix 4] In the functional element mounting device described in any one of Appendices 1 to 3, the second region is a first extending region extending from the first region in the first direction, and a second extending region extending from the first extending region in at least one of a second direction intersecting the first direction and a direction opposite to the second direction. A functional element mounting device characterized by the above. According to such a configuration, since the second region in the convex portion can be further enlarged, the volume of the heat sink can be further increased, and the cross-sectional area of the convex portion along the virtual plane orthogonal to the direction toward the heat dissipation pad can be further increased. Therefore, the diffusivity of heat inside the heat sink can be improved, and the heat dissipation effect of the heat generated in the package can be improved.

[0089] [Appendix 5] An insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface, a package having an electrode electrically connected to the wiring layer and a functional element, and disposed on the wiring layer, a heat dissipation pad disposed on the surface of the package on the side of the insulating substrate, for dissipating heat generated by the functional element, and a heat sink thermally connected to the heat dissipation pad and dissipating heat transmitted from the heat dissipation pad. The insulating substrate has an inserted portion penetrating the insulating substrate from the first surface toward the second surface in a region from a region facing the heat dissipation pad to a region on the end side in the first direction. The wiring layer is disposed at a position in a direction opposite to the first direction on the first surface. The heat sink includes a main body portion disposed to face the second surface, and a convex portion protruding from the main body portion toward the heat dissipation pad corresponding to the inserted portion, inserted into the inserted portion, and thermally connected to the heat dissipation pad. A functional element mounting device characterized by the above.

[0090] According to such a configuration, the convex portion that receives heat from the heat dissipation pad disposed in the package protrudes from the main body portion corresponding to the insertion portion provided on the insulating substrate. That is, the convex portion extends in the first direction from the region facing the heat dissipation pad in the main body portion. By providing such a convex portion on the heat dissipation plate, not only can the volume of the heat dissipation plate be increased, but also the cross-sectional area of the convex portion along the virtual plane orthogonal to the direction toward the heat dissipation pad can be increased. Thereby, the diffusibility of heat inside the heat dissipation plate can be improved, and the heat dissipation effect of the heat generated in the package can be improved. Furthermore, by separating and arranging the wiring layer and the convex portion, miniaturization of the device can be achieved.

[0091] [Appendix 6] In the functional element mounting device according to any one of Appendices 1 to 5, the heat dissipation pad and the convex portion are fixed by solder. A functional element mounting device characterized by this. According to such a configuration, the heat dissipation pad and the heat dissipation plate having the convex portion can be fixed by solder while ensuring heat transfer from the heat dissipation pad to the convex portion.

[0092] [Appendix 7] In the functional element mounting device according to Appendix 6, it includes a resist laminated on the first surface and the wiring layer. A functional element mounting device characterized by this. According to such a configuration, the electrical insulation of the wiring layer can be maintained.

[0093] [Appendix 8] In the functional element mounting device according to Appendix 7, the resist has an opening including a region corresponding to the heat dissipation pad. A functional element mounting device characterized by this. According to such a configuration, solder can be retained in the opening. Therefore, the spread of solder outside the opening can be restricted, and the assembly position accuracy of the package can be improved.

[0094] [Appendix 9] In the functional element mounting device according to any one of Appendices 1 to 8, a heat sink connected to a region protruding from the package in the convex portion is provided. A functional element mounting device characterized by this. According to such a configuration, the heat dissipation efficiency of the heat of the package transmitted to the convex portion can be increased, and in addition, a heat sink can be arranged using the region protruding from the package in the convex portion.

[0095] [Appendix 10] In the functional element mounting device according to any one of Appendices 1 to 9, the insulating substrate and the heat dissipation plate are fixed by a prepreg resin, and a part of the prepreg resin fixes the insulating substrate and the heat dissipation plate on a side surface of the convex portion. A functional element mounting device characterized by this. According to such a configuration, since the prepreg resin is an insulating adhesive, the insulating substrate and the heat dissipation plate can be fixed while maintaining the insulation between the insulating substrate and the heat dissipation plate.

[0096] [Appendix 11] In the functional element mounting device according to any one of Appendices 1 to 10, a surface on the package side in the convex portion and a surface on the package side in the wiring layer are located in the same plane. A functional element mounting device characterized by this. According to such a configuration, it is possible to suppress the package from tilting with respect to the insulating substrate on which the wiring layer is provided. In addition, since it is possible to easily electrically connect the electrodes of the package and the wiring layer, electrical leakage can be suppressed.

[0097] [Appendix 12] In the functional element mounting device according to any one of Appendices 1 to 11, the electrode faces the first surface. A functional element mounting device characterized by the following. According to such a configuration, by arranging the package so as to overlap the wiring layer, the electrode and the wiring layer can be connected, so that it is possible to facilitate the connection between the electrode and the wiring layer.

[0098] [Appendix 13] In the functional element mounting device according to any one of Appendices 1 to 11, The electrode is electrically connected to the wiring layer by a bonding wire. A functional element mounting device characterized by the following. According to such a configuration, when there are relatively many electrodes provided on the package, it is possible to facilitate the electrical connection between the electrode and the wiring layer.

[0099] [Appendix 14] In the functional element mounting device according to any one of Appendices 1 to 13, The functional element is a semiconductor element. A functional element mounting device characterized by the following. According to such a configuration, it is possible to efficiently dissipate the heat of a semiconductor element that is likely to experience a performance degradation due to heat.

[0100] [Appendix 15] In the functional element mounting device according to Appendix 14, The functional element is a semiconductor light-emitting element. A functional element mounting device characterized by the following. According to such a configuration, it is possible to efficiently dissipate the heat of a semiconductor light-emitting element that is likely to experience a performance degradation due to heat.

[0101] [Appendix 16] Comprising the functional element mounting device according to Appendix 15, The functional element constitutes a light source. A light source device characterized by the following. According to such a configuration, it is possible to configure a light source device having a high heat dissipation effect of a semiconductor light-emitting element.

[0102] [Appendix 17] The light source device described in Appendix 16, an optical modulation element that modulates the light from the light source device, and a projection optical device that projects the light modulated by the optical modulation element, and is provided with a projection device characterized by this. According to such a configuration, since a light source device with a high heat dissipation effect of a semiconductor light emitting element is provided, the output light amount from the light source device can be increased, and in addition, the deterioration of the semiconductor light emitting element can be suppressed, so that the long life of a projection device capable of projecting a high-brightness image can be achieved.

Explanation of Signs

[0103] 1... projector, 31B... blue light modulation element (optical modulation element), 31G... green light modulation element (optical modulation element), 31R... red light modulation element (optical modulation element), 32... light combining element, 33... projection lens, 4... light source device, 41, 51, 61... light source module, 42, 52, 62, 72... functional element mounting device, 43, 53... insulating substrate, 431, 531... inserted portion, 43A, 53A... first surface, 43B, 53B... second surface, 44... wiring layer, 45, 65... resist, 451, 452, 651... opening, 46, 76... package, 461... functional element, 462, 762... electrode, 47... heat dissipation pad, 48, 58... heat dissipation plate, 481... main body portion, 481A... first surface, 481B... second surface, 482, 582... convex portion, 483, 583... first region, 483A... first surface region, 484, 584... second region, 484A... second surface region, 585... first extending region, 586, 587... second extending region, 49... heat dissipation member, 59... heat sink.

Claims

1. An insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface; A package having an electrode electrically connected to the wiring layer and a functional element, the package being disposed on the wiring layer; A heat dissipation pad disposed on the surface of the package on the side of the insulating substrate, the heat dissipation pad dissipating heat generated by the functional element; A heat dissipation plate thermally connected to the heat dissipation pad and dissipating heat transmitted from the heat dissipation pad, comprising: The insulating substrate has an insertion portion penetrating the insulating substrate from the first surface toward the second surface in a region including a region facing the heat dissipation pad and a region protruding from the heat dissipation pad; The heat dissipation plate is: A main body portion disposed opposite to the second surface; A convex portion protruding from the main body portion toward the heat dissipation pad, inserted into the insertion portion, and thermally connected to the heat dissipation pad; The convex portion is: A first region facing the heat dissipation pad; A second region protruding from the first region in a first direction from the first region toward the outside of the heat dissipation pad, including; A functional element mounting device, characterized in that.

2. In the functional element mounting device according to claim 1, The length of the second region in the first direction is equal to or greater than the length of the heat dissipation pad in the first direction. A functional element mounting device, characterized in that.

3. In the functional element mounting device according to claim 1, The length of the second region in the first direction is equal to or greater than the length of the package in the first direction. A functional element mounting device, characterized in that.

4. In the functional element mounting device according to claim 1, The second region is: A first extending region extending in the first direction from the first region; A second extending region extending in at least one of a second direction intersecting the first direction and a direction opposite to the second direction from the first extending region, including; A functional element mounting device, characterized in that.

5. An insulating substrate having a first surface on which a wiring layer is formed and a second surface opposite to the first surface; A package having an electrode electrically connected to the wiring layer and a functional element, the package being disposed on the wiring layer; A heat dissipation pad disposed on the surface of the package on the side of the insulating substrate, the heat dissipation pad dissipating heat generated by the functional element; A heat dissipation plate thermally connected to the heat dissipation pad and dissipating heat transmitted from the heat dissipation pad, comprising: The insulating substrate has an insertion part penetrating the insulating substrate from the first surface to the second surface from a region facing the heat dissipation pad to a region on the end side in the first direction. The wiring layer is disposed at a position in a direction opposite to the first direction on the first surface. The heat sink is a main body portion disposed to face the second surface, and a convex portion protruding from the main body portion toward the heat dissipation pad corresponding to the insertion part, inserted into the insertion part, and thermally connected to the heat dissipation pad. A functional element mounting device characterized by the above. **Claim 6** In the functional element mounting device according to any one of Claims 1 to 5, the heat dissipation pad and the convex portion are fixed by solder. A functional element mounting device characterized by the above. **Claim 7** In the functional element mounting device according to Claim 6, a resist laminated on the first surface and the wiring layer is provided. A functional element mounting device characterized by the above. **Claim 8** In the functional element mounting device according to Claim 7, the resist has an opening including a region corresponding to the heat dissipation pad. A functional element mounting device characterized by the above. **Claim 9** In the functional element mounting device according to any one of Claims 1 to 5, a heat sink connected to a region protruding from the package in the convex portion is provided. A functional element mounting device characterized by the above. **Claim 10** In the functional element mounting device according to any one of Claims 1 to 5, the insulating substrate and the heat sink are fixed by a prepreg resin, and a part of the prepreg resin fixes the insulating substrate and the heat sink on the side surface of the convex portion. A functional element mounting device characterized by the above. **Claim 11** In the functional element mounting device according to any one of Claims 1 to 5, the surface of the convex portion on the package side and the surface of the wiring layer on the package side are located in the same plane. A functional element mounting device characterized by the above. **Claim 12** In the functional element mounting device according to any one of Claims 1 to 5, the electrode faces the first surface. A functional element mounting device characterized by the above. **Claim 13** In the functional element mounting device according to any one of Claims 1 to 5, the electrode is electrically connected to the wiring layer by a bonding wire. A functional element mounting device characterized by the following.

14. In the functional element mounting device according to any one of Claims 1 to 5, wherein the functional element is a semiconductor element, a functional element mounting device characterized by the following.

15. In the functional element mounting device according to Claim 14, wherein the functional element is a semiconductor light-emitting element, a functional element mounting device characterized by the following.

16. Comprising the functional element mounting device according to Claim 15, wherein the functional element constitutes a light source, a light source device characterized by the following.

17. A projection device comprising the light source device according to Claim 16, an optical modulation element that modulates light from the light source device, and a projection optical device that projects the light modulated by the optical modulation element. a projection device characterized by the following.

Images