Liquid discharge head, liquid discharge device, and method of manufacturing liquid discharge head

Abstract

To provide a liquid discharge head in which an element substrate and a support member, different in a pitch of a liquid supply port, are fluid-connected together by a channel member, a liquid discharge device, and a method of manufacturing the liquid discharge head.SOLUTION: A feed passage 65 of a silicon substrate 62 and a resin feed passage 66 of a resin channel member 63 are connected together by a channel 64 with channel expansion parts 64a and 64b, formed in a channel member 61.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a liquid ejection head, a liquid ejection device, and a method for manufacturing a liquid ejection head.

Background Art

[0002] In recent years, various silicon devices have been applied to devices such as inkjet recording heads. In the manufacture of such silicon devices, a microfabrication technique, which is a micromachining technique, is used.

[0003] Patent Document 1 describes an inkjet recording head in which an element substrate having a flow path in which a plurality of ejection energy generating elements are arranged, a discharge port for discharging a liquid, and a supply port for supplying ink to the discharge port is bonded and held by a support member having an ink supply path.

[0004] In a configuration such as that of Patent Document 1, in order to provide a small and high-definition liquid ejection head, the pitch of the supply ports of the element substrate may be narrowed. In that case, it is generally difficult to narrow the pitch of the ink supply path of the support member connected to the supply port of the element substrate to match the pitch of the supply port of the element substrate. Therefore, a flow path member for changing the pitch is sandwiched between the element substrate and the support member, and the supply port of the element substrate and the supply path of the support member are connected by a flow path provided in the flow path member.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Flow path members are generally made by bonding together a plurality of members formed by injection molding. However, when forming a flow path member by injection molding, even if the thickness of the resin that forms the wall between the flow paths is made thin, the wall thickness generally has a limit of about 0.5 mm. Therefore, in a conventional flow path member formed by bonding together a plurality of members formed by injection molding, it is difficult to make the pitch of the flow paths narrower in order to accommodate an element substrate with a narrower pitch of supply ports.

[0007] Also, since a flow path member is formed by bonding together a plurality of members, the number of parts increases and the cost tends to increase.

[0008] Therefore, the present invention provides a liquid ejection head, a liquid ejection device, and a method for manufacturing a liquid ejection head in which an element substrate and a support member having different pitches of liquid supply ports are fluid-connected by a flow path member.

Means for Solving the Problems

[0009] The liquid ejection head of the present invention includes a discharge substrate having a first discharge port row in which a plurality of discharge ports for discharging liquid are arranged, and a first supply path for supplying liquid to the first discharge port row, a flow path member having a first flow path that communicates with the first supply path by being laminated with the discharge substrate, and a support member having a first support member supply path that communicates with the first flow path by being laminated on a second surface opposite to a first surface on which the discharge substrate of the flow path member is laminated. The first flow path includes a first through portion that penetrates the flow path member in the lamination direction, a first flow path expansion portion that partially faces a first opening of the first supply path, has a depth in the lamination direction, and extends in a first direction from a position facing the first opening to the first through portion, and a second flow path expansion portion that partially faces a second opening of the first support member supply path, has a depth in the lamination direction, and extends in the first direction from the first through portion to the second opening so as to have an opening area wider than that of the first flow path expansion portion.

Advantages of the Invention

[0010] According to the present invention, it is possible to provide a liquid ejection head in which an element substrate and a support member having different pitches of liquid supply ports are fluid-connected by a flow path member, a liquid ejection device, and a method for manufacturing the liquid ejection head.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0013] Fig. 1 is a diagram for explaining a liquid ejection device, and is an enlarged view of a liquid ejection head 1 of a liquid ejection device 50 and its periphery. First, the schematic configuration of the liquid ejection device 50 in the present embodiment will be described with reference to Fig. 1. Fig. 1 is a perspective view schematically showing a liquid ejection device 50 using a liquid ejection head 1. The liquid ejection device 50 of the present embodiment constitutes a serial type inkjet recording device that ejects ink as a liquid while scanning the liquid ejection head 1 to perform recording on a recording medium P.

[0014] The liquid ejection head 1 is mounted on the carriage 60. The carriage 60 reciprocates in the main scanning direction (X direction) along the guide shaft 51. The recording medium P is conveyed in the sub-scanning direction (Y direction) that intersects (orthogonal in this example) the main scanning direction by the conveyance rollers 55, 56, 57, and 58. That is, the liquid ejection head 1 is configured to eject liquid while scanning in a direction orthogonal to the conveyance direction of the recording medium to which ink is applied. In each figure referred to below, the Z direction indicates the vertical direction and intersects (orthogonal in this example) the X-Y plane defined by the X direction and the Y direction. The liquid ejection head 1 is configured to be removable and attachable to the carriage 60 by the user.

[0015] The liquid ejection head 1 includes a circulation unit 54 and a discharge unit 3 (see FIG. 2 described later). Although the specific configuration will be described later, the discharge unit 3 is provided with a plurality of discharge ports and an energy generating element (hereinafter referred to as a discharge element) that generates discharge energy for discharging liquid from each discharge port.

[0016] Further, the liquid ejection device 50 is provided with an ink tank 2 (liquid storage unit), which is a supply source of ink, and an external pump 21. The ink stored in the ink tank 2 is supplied to the circulation unit 54 via the ink supply tube 59 by the driving force of the external pump 21.

[0017] The liquid ejection device 50 forms a predetermined image on the recording medium P by repeating a recording scan in which the liquid ejection head 1 mounted on the carriage 60 (mountable) ejects ink while moving in the main scanning direction and a conveyance operation for conveying the recording medium P in the sub-scanning direction. Note that the liquid ejection head 1 in the present embodiment is configured to be able to eject three types of ink. However, the configuration of the inkjet recording device in the present invention is not limited to one that ejects three types of liquid.

[0018] For example, a configuration capable of ejecting black (K), cyan (C), magenta (M), yellow (Y), and white (W) inks can be used, and in this case, a full-color image can be recorded using these inks. The present disclosure is also applicable to liquid ejection heads for ejecting other types of ink or reaction liquids other than ink. In other words, the types and number of liquids ejected from the liquid ejection head are not limited.

[0019] Furthermore, the liquid ejection device 50 is provided with a cap member (not shown) capable of covering the ejection port surface on which the ejection ports of the liquid ejection head are formed, at a position offset in the X direction from the transport path of the recording medium P. The cap member covers the ejection port surface of the liquid ejection head 1 when not performing recording, and is used to prevent the ejection ports from drying out, protect the ejection ports, and perform ink suction operations from the ejection ports.

[0020] Although the liquid ejection head 1 shown in FIG. 1 is an example in which the liquid ejection head 1 is provided with three circulation units 54 corresponding to the three types of ink, it is sufficient to provide a circulation unit 54 according to the type of liquid to be ejected. Furthermore, multiple circulation units 54 may be provided for the same type of liquid. In other words, the liquid ejection head 1 can be configured to include one or more circulation units. It may also be configured to circulate only at least one ink rather than circulating all three types of ink. The present invention can be used even if the liquid ejection head 1 is configured not to include a circulation unit 54.

[0021] Fig. 2(a) is a perspective view showing a liquid ejection head 1 to which the present invention can be applied, and Fig. 2(b) is a perspective view showing an ejection unit 3. The liquid ejection head 1 in this embodiment includes three ejection units 3 and three circulation units 54. The ejection units 3 eject liquid circulated by the circulation units 54 from ejection ports 68. A plurality of ejection ports 68 are provided, and the plurality of ejection ports 68 are arranged to form an ejection port array 4.

[0022] <Components of the circulation unit> 3 is a schematic diagram showing the appearance of one circulation unit 54 corresponding to one type of ink applied to the recording apparatus of this embodiment. In addition to the circulation pump 500, the circulation unit 54 preferably has a filter 110, a first pressure adjustment means 120, and a second pressure adjustment means 150. These components are connected by respective flow paths as shown in FIGS. 4 and 5, which will be described later, and form a circulation path within the liquid ejection head 1 that supplies and recovers ink to and from the ejection module 300.

[0023] <Circulation path inside the liquid ejection head> FIG. 4 is a vertical cross-sectional view schematically showing a circulation path for one type of ink (one color of ink) configured within the liquid ejection head 1. To more clearly explain the circulation path, the relative positions of each component (first pressure adjustment means 120, second pressure adjustment means 150, circulation pump 500, etc.) in FIG. 4 have been simplified. Therefore, the relative positions of each component differ from the configuration in FIG. 19 , which will be described later. FIG. 5 is a block diagram schematically showing the circulation path shown in FIG. 4. As shown in FIGS. 4 and 5, the first pressure adjustment means 120 includes a first valve chamber 121 and a first pressure control chamber 122. The second pressure adjustment means 150 includes a second valve chamber 151 and a second pressure control chamber 152. The first pressure adjustment means 120 is configured to have a control pressure relatively higher than that of the second pressure adjustment means 150.

[0024] In this embodiment, by using these two pressure adjustment means 120, 150, circulation within a constant pressure range is achieved within the circulation path. Also, the ink is configured to flow through the pressure chamber 12 (ejection element 15) at a flow rate that corresponds to the pressure difference between the first pressure adjustment means 120 and the second pressure adjustment means 150. Below, the circulation path in the liquid ejection head 1 and the flow of ink within the circulation path will be explained with reference to Figures 4 and 5. Note that the arrows in each figure indicate the direction of ink flow.

[0025] First, the connection state of each component in the liquid ejection head 1 will be described.

[0026] An external pump 21 that sends ink stored in an ink tank 2 (see FIG. 1) provided outside the liquid ejection head 1 to the liquid ejection head 1 is connected to a circulation unit 54 via an ink supply tube 59 (see FIG. 1). A filter 110 is provided in an ink flow path (inflow flow path) located on the upstream side of the circulation unit 54. The ink supply path (inflow flow path) located on the downstream side of the filter 110 is connected to a first valve chamber 121 of a first pressure adjusting means 120. The first valve chamber 121 communicates with a first pressure control chamber 122 via a communication port 191A that can be opened and closed by a valve 190A shown in FIG. 4. Note that the inflow flow path is a flow path through which liquid in the ink tank 2 provided outside the liquid ejection head 1 flows into the liquid ejection head 1 to supply the liquid to the pressure chamber 12.

[0027] The first pressure control chamber 122 is connected to a supply flow path 130, a bypass flow path 160, and a pump outlet flow path 180 of a circulation pump 500. The supply flow path 130 is connected to a common supply flow path 18 via the aforementioned ink supply port provided in the ejection module 300. The bypass flow path 160 is connected to a second valve chamber 151 provided in a second pressure adjusting means 150. The second valve chamber 151 communicates with a second pressure control chamber 152 via a communication port 191B that is opened and closed by a valve 190B shown in FIG. 4.

[0028] Note that FIGS. 4 and 5 show an example in which one end of the bypass flow path 160 is connected to the first pressure control chamber 122 of the first pressure adjusting means 120 and the other end of the bypass flow path 160 is connected to the second valve chamber 151 of the second pressure adjusting means 150. Note that one end of the bypass flow path 160 may be connected to the supply flow path 130 and the other end of the bypass flow path may be connected to the second valve chamber 151.

[0029] The second pressure control chamber 152 is connected to a recovery flow path 140. The recovery flow path 140 is connected to a common recovery flow path 19 via the aforementioned ink recovery port provided in the ejection module 300. Further, the second pressure control chamber 152 is connected to the circulation pump 500 via a pump inlet flow path 170. In FIG. 4, 170a indicates an inlet of the pump inlet flow path 170.

[0030] Next, the ink flow in the liquid ejection head 1 having the above configuration will be described. As shown in FIG. 5, the ink stored in the ink tank 2 is pressurized by an external pump 21 provided in the liquid ejection device 50 and supplied as a positive-pressure ink flow to the circulation unit 54 of the liquid ejection head 1.

[0031] The ink supplied to the circulation unit 54 passes through the filter 110 to remove foreign matters such as dust and bubbles, and then flows into the first valve chamber 121 provided in the first pressure adjusting means 120. The pressure of the ink decreases due to the pressure loss when passing through the filter 110, but the pressure of the ink at this stage is in a positive-pressure state. Thereafter, when the valve 190A is in an open state, the ink flowing into the first valve chamber 121 flows into the first pressure control chamber 122 through the communication port 191A. Due to the pressure loss when passing through the communication port 191A, the ink flowing into the first pressure control chamber 122 switches from a positive pressure to a negative pressure.

[0032] Next, the ink flow in the circulation path will be described. The circulation pump 500 operates to send the ink sucked from the pump inlet passage 170 on the upstream side thereof to the pump outlet passage 180 on the downstream side. Therefore, when the pump is driven, the ink supplied to the first pressure control chamber 122 flows into the supply passage 130 and the bypass passage 160 together with the ink sent from the pump outlet passage 180. Although details will be described later, in the present embodiment, as the circulation pump 500 capable of sending liquid, a piezoelectric diaphragm pump using a piezoelectric element attached to a diaphragm as a drive source is used. The piezoelectric diaphragm pump is a pump that changes the volume in the pump chamber by inputting a drive voltage to the piezoelectric element and sends liquid by alternately moving two check valves due to pressure fluctuations.

[0033] The ink flowing into the supply channel 130 flows into the pressure chamber 12 from the ink supply port of the ejection module 300 via the common supply channel 18, and a part of the ink is ejected from the ejection port 68 by driving (heating) the ejection element 15. Further, the remaining ink not used for ejection flows through the pressure chamber 12, passes through the common recovery channel 19, and then flows into the recovery channel 140 connected to the ejection module 300. The ink flowing into the recovery channel 140 flows into the second pressure control chamber 152 of the second pressure adjustment means 150.

[0034] On the other hand, the ink flowing from the first pressure control chamber 122 into the bypass channel 160 flows into the second valve chamber 151, and then flows into the second pressure control chamber 152 through the communication port 191B. The ink flowing into the second pressure control chamber 152 via the bypass channel 160 and the ink recovered from the recovery channel 140 are sucked into the circulation pump 500 through the pump inlet channel 170 by driving the circulation pump 500. Then, the ink sucked into the circulation pump 500 is sent to the pump outlet channel 180 and flows into the first pressure control chamber 122 again. Thereafter, the ink flowing from the first pressure control chamber 122 into the second pressure control chamber 152 via the supply channel 130 through the ejection module 300 and the ink flowing into the second pressure control chamber 152 via the bypass channel 160 flow into the circulation pump 500. And it is sent from the circulation pump 500 to the first pressure control chamber 122. In this way, the circulation of the ink in the circulation path is performed.

[0035] As described above, in the present embodiment, the circulation pump 500 enables the liquid to be circulated along the circulation path formed in the liquid ejection head 1. Therefore, it is possible to suppress thickening of the ink in the ejection module 300 and deposition of the sediment component of the coloring material in the ink, and it is possible to keep the fluidity of the ink in the ejection module 300 and the ejection characteristics at the ejection port 68 in a good state.

[0036] In addition, the circulation path in this embodiment is configured to be completed between the liquid ejection head 1 and the circulation unit 54, both of which are mounted on the carriage 60. Therefore, the length of the circulation path can be significantly shortened compared to the case where ink is circulated between the ink tank 2 provided outside the carriage 60 and the liquid ejection head 1. For this reason, it becomes possible to circulate the ink with a small circulation pump such as a piezoelectric pump.

[0037] Furthermore, as the connection flow path between the liquid ejection head 1 and the ink tank 2, it is configured to include only the flow path for supplying ink (ink supply tube 59). That is, it adopts a configuration that does not require a flow path for recovering ink from the liquid ejection head 1 to the ink tank 2. For this reason, only a tube for ink supply needs to be provided for the connection between the ink tank 2 and the liquid ejection head 1, and there is no need to provide a tube for ink recovery. Therefore, the inside of the liquid ejection device 50 can be made into a simple configuration with the number of tubes reduced, and the miniaturization of the entire device can be realized. Furthermore, by reducing the number of tubes, it becomes possible to reduce the pressure fluctuation of the ink caused by the swinging of the tubes accompanying the main scanning of the liquid ejection head 1.

[0038] Also, the swinging of the tubes during the main scanning of the liquid ejection head 1 becomes a driving load on the carriage motor that drives the carriage 60. For this reason, by reducing the number of tubes, the driving load on the carriage motor is reduced, and it becomes possible to simplify the main scanning mechanism including the carriage motor and the like. Furthermore, since it is not necessary to recover the ink from the liquid ejection head 1 to the ink tank 2, the external pump 21 can also be miniaturized. Thus, according to this embodiment, while configuring the liquid ejection device 50 to be able to circulate the liquid, miniaturization and cost reduction can be realized.

[0039] FIG. 6(a) is a cross-sectional view taken along line VI-VI of FIG. 2(b), and FIG. 6(b) is a cross-sectional view showing the silicon flow path member 61 in FIG. 6(a). The discharge module 300 is configured by laminating a discharge substrate 69 having discharge elements, a flow path member 61 formed of silicon, and a resin flow path member 63 formed of resin. The discharge substrate 69 is configured by laminating a discharge port forming member 67 (see FIG. 4) and a silicon substrate 62 (hereinafter simply referred to as the silicon substrate 62).

[0040] The discharge port forming member 67 is formed with a plurality of discharge ports 68 and a plurality of pressure chambers 12 (see FIG. 4) communicating with each discharge port 68. At positions on the silicon substrate 62 corresponding to the respective pressure chambers 12, discharge elements 15 for discharging ink from the corresponding discharge ports 68 are provided. Further, on the silicon substrate 62, electrical wirings (not shown) for supplying power and discharge signals to the respective discharge elements 15 are formed. Furthermore, on the silicon substrate 62, a supply path 65 for supplying ink commonly to the respective pressure chambers 12 and a recovery path 65a for recovering ink commonly from the respective pressure chambers 12 are formed. The supply path 65 and the recovery path 65a are formed on the silicon substrate 62 from the surface opposite to the surface on which the discharge port forming member 67 is laminated.

[0041] The discharge port forming member 67 having the pressure chambers 12 formed thereon is provided on the silicon substrate 62, and the pressure generated by the discharge elements 15 is received by the pressure chambers 12. Also, in the discharge port forming member 67, the discharge elements 15 and the discharge ports 68 are provided at positions facing each other. As a result, film boiling occurs in the liquid heated by the discharge elements 15, and the liquid can be discharged from the discharge ports 68 by the pressure due to the film boiling. By forming the discharge port forming member 67 on the silicon substrate 62, the pressure chambers 12 (see FIG. 4) communicate with the supply path 65 of the silicon substrate 62, and the liquid supplied from the supply path 65 flows into the pressure chambers 12.

[0042] The discharge substrate 69 is joined to the flow path member 61 with an adhesive such that the supply path 65 of the silicon substrate 62 communicates with the flow path 64 of the flow path member 61, and the recovery path 65a of the silicon substrate 62 communicates with the flow path 64c of the flow path member 61. In the present embodiment, each flow path in the flow path member 61 is formed by wet anisotropic etching. Details of the method for forming the flow path member 61 will be described later. The supply path 65 can supply liquid to the pressure chamber 12 and the discharge port 68. The liquid that has flowed through the flow path 64 enters the pressure chamber 12 via the supply path 65 and is discharged from the discharge port 68 by the action of the discharge element 15. The two flow paths 64 are provided symmetrically with respect to the flow path 64c in a line.

[0043] At the connection portion of the flow path 64 of the flow path member 61 with the supply path 65 of the discharge substrate 69, a flow path expansion portion 64a is formed. The flow path expansion portion 64a is such that the opening 64d of the flow path 64 connected to the supply path 65 is expanded in the Y direction or the -Y direction (a direction intersecting the arrangement direction of the discharge port row 4 (the X direction in the figure)), and the opening 64d of the flow path expansion portion 64a has an opening larger than the opening of the supply path 65. That is, the flow path expansion portion 64a is provided to expand from the through portion 64h penetrating the flow path member 61 in the Z direction toward the inside of the flow path member 61 (the direction toward the recovery flow path 64c). The flow path expansion portion 64a is provided by forming a depression in the -Z direction from the opening 64d. That is, the flow path expansion portion 64a includes a space having a predetermined depth in the -Z direction from the opening 64d. When the discharge module 300 is viewed in plan along the Z direction, the opening 64d has an opening area that is twice or more the opening area of the opening of the supply path 65.

[0044] The resin flow path member 63, which serves as a support member for the discharge substrate 69 and the flow path member 61, is a resin member formed by injection molding and is molded by pouring resin into a mold. The flow path member 61 and the resin flow path member 63 are joined by an adhesive.

[0045] At the connection part of the resin supply path (support member supply path) 66 of the resin flow path member 63 in the flow path 64 of the flow path member 61, a flow path expansion part 64b is formed. In the flow path expansion part 64b, the opening 64e of the flow path 64 connected to the resin supply path 66 is expanded in the Y direction or the -Y direction, and the opening 64e of the flow path expansion part 64b has an opening larger than the opening (support member supply port) of the resin supply path 66. That is, the flow path expansion part 64b is provided so as to expand from the through part 64h to the outside of the flow path member 61 (in the direction away from the recovery flow path 64c). The flow path expansion part 64b is provided by forming a depression in the Z direction from the opening 64e. That is, the flow path expansion part 64b has a space with a predetermined depth in the Z direction (discharge direction) from the opening 64e. The resin flow path member 63 includes a resin recovery path (support member recovery path) 66a between the two resin supply paths 66.

[0046] As shown in FIG. 6(b), when the width in the Y direction of the flow path expansion part 64a is W1 and the width in the Y direction of the flow path expansion part 64b is W2, it is desirable that W2 be twice or more W1. The amount of the depression (depth) in the -Z direction of the flow path expansion part 64a and the amount of the depression (depth) in the Z direction of the flow path expansion part 64b are desirably about the same as the width in the Y direction of the through part 64h of the flow path 64. The width W3 in the Y direction of the flow path 64c desirably has the same width as the width in the Y direction of the recovery path 65a at the center of the silicon substrate 62. The width W4 of the wall between the flow path expansion part 64a and the flow path 64c desirably has substantially the same width as the wall width between the supply path 65 and the recovery path 65a of the silicon substrate 62.

[0047] In the discharge substrate 69 of the present embodiment, the center-to-center distance in the Y direction between the supply path 65 and the recovery path 65a is 0.6 mm or less. In the present embodiment, by forming the flow path 64 provided with the flow path expansion portions 64a and 64b in the flow path member 61 by wet anisotropic etching, the flow path 64 corresponding to the narrow pitch between the supply path 65 and the recovery path 65a and the recovery path 64c can be formed. Since the flow path 64 corresponding to the narrow pitch between the supply path 65 and the recovery path 65a and the recovery path 64c can be formed, the distance between the supply path 65 and the recovery path 64c can be shortened, and the liquid can be efficiently circulated in the liquid discharge head 1. By adopting wet anisotropic etching, it becomes possible to form a relatively complex flow path as in the present embodiment in which the width and direction are changed halfway in a single silicon member.

[0048] As a result, compared with a configuration in which a complex flow path is formed by laminating a plurality of substrates in which different flow paths are formed, the flow path member 61 can be manufactured at low cost. That is, a flow path member having a relatively complex flow path shape is interposed between a resin flow path member 63 in which a resin supply path 66 and a resin recovery path 66a are arranged at a relatively wide pitch, and a silicon substrate 2 in which a supply path 65 and a recovery path 65a are arranged at a relatively narrow pitch. Thereby, it becomes possible to adjust the difference in these pitches.

[0049] Also, it is desirable that a predetermined depth in the -Z direction of the flow path expansion portion 64a and a predetermined depth in the Z direction of the flow path expansion portion 64b are equal. The flow path expansion portion 64a is preferably partially formed by a surface 64f extending along the joint surface of the silicon substrate 62 with the flow path member 61. This surface 64f is more preferably a surface substantially parallel to the joint surface. The flow path expansion portion 64b is preferably partially formed by a surface 64g extending along the joint surface of the resin flow path member 63 with the flow path member 61. This surface 64g is more preferably a surface substantially parallel to the joint surface.

[0050] By providing the flow path expansion portions 64a and 64b in the flow path member 61 in this manner, even if the pitch T1 between the supply path 65 and the recovery path 65a is narrower than the pitch T2 of the resin supply path 66, a flow path can be ensured between the silicon substrate 62 and the resin flow path member 63. Further, by providing the flow path expansion portions 64a and 64b, the supply path 65 and the resin supply path 66 can be communicated without narrowing the space between the through portion of the flow path 64 and the flow path 64c in the flow path member 61.

[0051] The flow path 64 provided with the flow path expansion portions 64a and 64b extends in the X direction along the discharge port row 4 (see FIG. 2). One flow path 64 provided with the flow path expansion portions 64a and 64b may be provided for one supply path 65, or a plurality of flow paths 64 provided with the flow path expansion portions 64a and 64b may be provided for one supply path 65.

[0052] Hereinafter, the manufacturing process of the flow path member 61 will be described in the order of steps, with specific examples.

[0053] FIGS. 7(a) to (f) are diagrams showing the manufacturing process of the flow path member 61 in the order of steps. In the manufacture of the flow path member 61, first, as shown in FIG. 7(a), a mask material 70 such as a thermal oxide film serving as a patterning mask for not causing damage when immersed in a strong alkaline etching solution is formed on the front and back surfaces of the silicon flow path member 61. Next, as shown in FIG. 7(b), openings (11a, 11b, 11c) are provided in the mask material 70 (opening forming step). Thereby, patterning for forming the flow path expansion portion 4a (11a) on the front side of the substrate and the flow path expansion portion 4b (11b) on the back side is performed. The opening 11a on the front surface and the opening 11b on the back surface are patterned so that a part thereof overlaps on the front and back surfaces (there is an overlapping region) when viewed in plan along the Z direction. The opening width of the opening 11a and the opening 11b is made larger than the width of the connecting supply ports (65, 66).

[0054] Next, as shown in FIG. 7(c), a through-hole 72 is machined, for example, with a YAG laser or the like so as to penetrate the flow path member 61. In this step, for the penetrating portion, a single through-hole 72 is formed in the openings 11a and 11b, and two through-holes 72 are formed in the opening 11c (through-hole forming step). The laser machining can be performed by increasing or decreasing the number of laser machining holes according to the width of the penetrating portion to be formed. To machine the through-hole 72, for example, 220 pulses (the laser is irradiated 220 times) are applied.

[0055] Then, as shown in FIG. 7(d), the flow path member 61 with the through-hole 72 machined is immersed in an aqueous solution of TMAH (tetramethylammonium hydroxide) at a temperature of 83° C. (concentration 22%) for 2 to 3 hours to perform wet anisotropic etching. The liquid contacts the flow path member 61 through the openings 11a and 11b and enters the through portion 72 from the front and back surfaces. As a result, a through-flow path (through-path) 64 including a flow path expansion portion 64a and a flow path expansion portion 64b is formed (through-path forming step). The amount of depression and the width of the through portion of the flow path expansion portion 64a and the flow path expansion portion 64b can be adjusted according to the immersion time. Then, as shown in FIG. 7(e), the unnecessary mask material (mask layer) 70 is immersed in a dedicated removal liquid for a predetermined time to be partially removed.

[0056] The silicon used as the flow path member 61 in the present embodiment is a silicon substrate with a crystal plane of (110). In this case, it is desirable that the side surface of the through portion 64h of the through-flow path 64 formed by etching is formed at an angle of 60° or more and 100° or less with respect to the first surface 73 and the second surface 74 of the flow path member 61. More preferably, it is formed at an angle of 70° or more and 95° or less with respect to the first surface 73 and the second surface 74.

[0057] By using the flow path member 61 made of a silicon material provided with a flow path expansion portion in such a process, an appropriate communication path is formed between the resin flow path member 63 in which a plurality of flow paths are arranged at a wide pitch and the silicon substrate 2 in which a plurality of flow paths are arranged at a narrow pitch. As a result, it becomes possible to suitably supply and recover the liquid.

[0058] (Other Embodiments) In the above-described embodiment, an example in which the discharge module 300 includes a recovery path has been described, but the present invention is not limited to this, and a configuration including only a supply path without a recovery path may be used.

[0059] Further, in the above-described embodiment, an example in which the circulation unit 54 is mounted on the carriage 60 has been described, but the present invention is not limited to this, and a configuration including a circulation path outside the carriage 60 may be used.

[0060] However, the present invention can be particularly preferably used in the liquid discharge head 1 including the circulation unit 54 and having a liquid circulation path formed on the carriage 60 as in the above-described embodiment. In a configuration in which a liquid circulation path is formed on the carriage 60, there is an advantage that even a circulation means having a short circulation path length and a low flow rate can easily circulate the liquid. However, since the liquid is likely to be concentrated and fixed as compared with the case where the circulation path length is long, it is desirable to increase the opening of the flow path. For this reason, in the liquid discharge head having a liquid circulation path formed on the carriage, the flow path member 61 as in the above-described embodiment can be preferably used.

[0061] Further, in the above-described embodiment, a serial type inkjet recording apparatus in which the liquid discharge head 1 moves while performing recording on the recording medium P during the discharge operation has been described as an example, but a line type liquid discharge apparatus that conveys the recording medium for recording with respect to a fixed liquid discharge head may also be used.

[0062] In this way, the supply path 65 of the silicon substrate 62 and the resin supply path 66 of the resin flow path member 63 are connected by the flow path 64 including the flow path expansion portions 64a and 64b formed in the flow path member 61. As a result, it is possible to provide a liquid discharge head, a liquid discharge apparatus, and a method for manufacturing a liquid discharge head that are inexpensive and compatible with an element substrate having a narrow pitch of supply ports.

[0063] The disclosure of the present embodiment includes the following configurations and methods.

[0064] (Configuration 1) A discharge substrate including a first discharge port row in which a plurality of discharge ports for discharging a liquid are arranged, and a first supply path for supplying the liquid to the first discharge port row, A flow path member including a first flow path that communicates with the first supply path by being laminated with the discharge substrate, A support member including a first support member supply path that communicates with the first flow path by being laminated on a second surface of the flow path member opposite to a first surface on which the discharge substrate is laminated, A liquid discharge head having the above, The first flow path includes, A first through portion that penetrates the flow path member in the lamination direction, A first flow path expansion portion, a part of which faces a first opening of the first supply path, has a depth in the lamination direction, and extends in a first direction intersecting the lamination direction from a position facing the first opening to the first through portion, A second flow path expansion portion, a part of which faces a second opening of the first support member supply path, has a depth in the lamination direction, and extends in the first direction from the first through portion to the second opening so as to have an opening area wider than that of the first flow path expansion portion, A liquid discharge head characterized by having the above.

[0065] (Configuration 2) The discharge substrate further includes a second discharge port row in which a plurality of discharge ports for discharging a liquid are arranged, and a second supply path for supplying the liquid to the second discharge port row, The flow path member further includes a second flow path that communicates with the second supply path by being laminated with the discharge substrate, The support member further includes a second support member supply path that communicates with the second flow path by being laminated on the second surface of the flow path member, The second flow path includes, A second through portion that penetrates the flow path member in the lamination direction, A third flow path expansion portion, a part of which faces a third opening of the second supply path, has a depth in the lamination direction, and extends in a second direction opposite to the first direction from a position facing the third opening to the second through portion, One part faces the fourth opening of the second support member supply path, has a depth in the stacking direction, and extends from the second through portion to the fourth opening so as to have an opening area wider than that of the third flow path expansion portion in the second direction. A fourth flow path expansion portion The liquid ejection head according to Configuration 1, characterized by having

[0066] (Configuration 3) The distance in the first direction between the first supply path and the second supply path on the ejection substrate is smaller than the distance in the first direction between the first support member supply path and the second support member supply path on the support member. The liquid ejection head according to Configuration 2, characterized by

[0067] (Configuration 4) The ejection substrate further includes a recovery path communicating with the ejection port, The liquid ejection head according to Configuration 2 or 3, wherein the flow path member further includes a third flow path connected to the recovery path.

[0068] (Configuration 5) The recovery path is between the first supply path and the second supply path in the first direction. The liquid ejection head according to Configuration 4, characterized by

[0069] (Configuration 6) The first flow path and the second flow path are provided symmetrically with respect to the third flow path. The liquid ejection head according to Configuration 5, characterized by

[0070] (Configuration 7) The first through portion and the second through portion include side surfaces at an angle of 60° or more and 100° or less with respect to the first surface and the second surface. The liquid ejection head according to Configuration 2, characterized by

[0071] (Configuration 8) The first through portion and the second through portion include side surfaces at an angle of 70° or more and 95° or less with respect to the first surface and the second surface. The liquid ejection head according to Configuration 7, characterized by

[0072] (Configuration 9) When the flow path member is viewed in a plan view from the stacking direction, the first flow path expansion portion has an opening area that is 2 times or more the opening area of the first opening. The liquid ejection head according to any one of Configurations 1 to 8.

[0073] (Configuration 10) When the flow path member is viewed in a plan view from the stacking direction, the first flow path expansion portion and the second flow path expansion portion partially overlap. The liquid ejection head according to any one of Configurations 1 to 9.

[0074] (Configuration 11) When the flow path member is viewed in a plan view from the stacking direction, the overlapping portion of the first flow path expansion portion and the second flow path expansion portion is the first through portion. The liquid ejection head according to Configuration 10.

[0075] (Configuration 12) The center-to-center distance in the first direction between the first supply path and the recovery path is 0.6 mm or less. The liquid ejection head according to any one of Configurations 4 to 6.

[0076] (Configuration 13) The support member includes a support member recovery path communicating with the discharge port between the first support member supply path and the second support member supply path. The liquid ejection head according to any one of Configurations 4 to 6.

[0077] (Configuration 14) The liquid ejection head further includes a circulation means for supplying the liquid recovered from the recovery path to the first supply path and the second supply path to circulate the liquid. The liquid ejection head according to any one of Configurations 4 to 6 that can be mounted on a carriage of a liquid ejection apparatus.

[0078] (Configuration 15) The flow path member is silicon. The liquid ejection head according to any one of Configurations 1 to 14.

[0079] (Configuration 16) The liquid ejection head according to claim 1, Circulation means for circulating liquid within the liquid ejection head, A carriage on which the liquid ejection head and the circulation means are mounted and which moves along with the ejection operation of the liquid ejection head, Transport means for transporting a recording medium, and comprising, A liquid ejection apparatus for ejecting liquid from the liquid ejection head onto the recording medium.

[0080] (Method 1) A step of forming a mask layer on a first surface of a silicon substrate and a second surface opposite to the first surface, An opening forming step of partially removing the mask layer on the first surface to form a first opening and partially removing the mask layer on the second surface to form a second opening, A through-hole forming step of forming a through-hole penetrating the silicon substrate from the first opening to the second opening, A through-path forming step of forming a through-path penetrating from the first opening to the second opening by immersing the silicon substrate having the through-hole formed therein in an etching solution, A step of removing the mask layer from the first surface and the second surface after the through-path forming step, A step of laminating a discharge substrate having a plurality of discharge ports for discharging liquid and a supply path for supplying liquid to the discharge ports formed on the first surface so that the through-path and the supply path communicate with each other, A step of laminating a support member having a flow path for supplying liquid to the discharge ports formed on the second surface so that the through-path and the flow path communicate with each other, and having, In the opening forming step, when the silicon substrate is viewed in plan view along the lamination direction, the first opening includes an overlapping region overlapping the second opening and a region extending from the overlapping region to the inside of the silicon substrate, and the second opening includes the overlapping region and a region extending from the overlapping region to the outside of the silicon substrate, and the first opening and the second opening are formed in such a manner. A method for manufacturing a liquid ejection head.

[0081] (Method 2) The method for manufacturing a liquid ejection head according to Method 1, wherein the crystal plane of the first surface of the silicon substrate is (110).

[0082] (Method 3) The method for manufacturing a liquid ejection head according to Method 2, wherein in the through-hole forming step, the through-hole is formed at an angle of 60° or more and 100° or less with respect to the first surface and the second surface.

[0083] (Method 4) The method for manufacturing a liquid ejection head according to Method 3, wherein in the through-hole forming step, the through-hole is formed at an angle of 70° or more and 95° or less with respect to the first surface and the second surface.

Explanation of Reference Numerals

[0084] 1 Liquid ejection head 50 Liquid ejection device 60 Carriage 61 Flow path member 62 Silicon substrate 64a Flow path expansion portion 64b Flow path expansion portion 70 Mask material

Claims

1. A discharge substrate including a first discharge port row in which a plurality of discharge ports for discharging a liquid are arranged, and a first supply path for supplying the liquid to the first discharge port row, A flow path member including a first flow path that communicates with the first supply path by being laminated with the discharge substrate, A support member including a first support member supply path that communicates with the first flow path by being laminated on a second surface of the flow path member opposite to a first surface on which the discharge substrate is laminated, A liquid discharge head having: The first flow path includes: A first through portion that penetrates the flow path member in the lamination direction, A first flow path expansion portion that partially faces a first opening of the first supply path, has a depth in the lamination direction, and extends in a first direction intersecting the lamination direction from a position facing the first opening to the first through portion, A second flow path expansion portion that partially faces a second opening of the first support member supply path, has a depth in the lamination direction, and extends in the first direction from the first through portion to the second opening so as to have an opening area wider than that of the first flow path expansion portion, A liquid discharge head characterized by having.

2. The discharge substrate further includes a second discharge port row in which a plurality of discharge ports for discharging a liquid are arranged, and a second supply path for supplying the liquid to the second discharge port row, The flow path member further includes a second flow path that communicates with the second supply path by being laminated with the discharge substrate, The support member further includes a second support member supply path that communicates with the second flow path by being laminated on the second surface of the flow path member, The second flow path includes: A second through portion that penetrates the flow path member in the lamination direction, A third flow path expansion portion that partially faces a third opening of the second supply path, has a depth in the lamination direction, and extends in a second direction opposite to the first direction from a position facing the third opening to the second through portion, A fourth flow path expansion portion that partially faces a fourth opening of the second support member supply path, has a depth in the lamination direction, and extends in the second direction from the second through portion to the fourth opening so as to have an opening area wider than that of the third flow path expansion portion, The liquid discharge head according to claim 1, characterized by having.

3. The liquid discharge head according to claim 2, characterized in that a distance in the first direction between the first supply path and the second supply path on the discharge substrate is smaller than a distance in the first direction between the first support member supply path and the second support member supply path on the support member.

4. the ejection substrate further includes a recovery path communicating with the ejection port, The liquid ejection head according to claim 2 or 3, wherein the flow path member further comprises a third flow path connected to the recovery path.

5. The liquid ejection head according to claim 4 , wherein the recovery path is located between the first supply path and the second supply path in the first direction.

6. The liquid ejection head according to claim 5 , wherein the first flow path and the second flow path are provided line-symmetrically with respect to the third flow path.

7. The liquid ejection head according to claim 2 , wherein the first penetrating portion and the second penetrating portion have side surfaces that form an angle of 60° to 100° with respect to the first surface and the second surface.

8. The liquid ejection head according to claim 7 , wherein the first penetrating portion and the second penetrating portion have side surfaces that form an angle of 70° to 95° with respect to the first surface and the second surface.

9. The liquid ejection head according to claim 1 , wherein, when the flow path member is viewed in a plan view from the stacking direction, the first flow path expansion section has an opening area that is at least twice as large as the opening area of the first opening.

10. The liquid ejection head according to claim 1 , wherein the first flow path expansion section and the second flow path expansion section partially overlap each other when the flow path member is viewed in a plan view from the stacking direction.

11. The liquid ejection head according to claim 10 , wherein when the flow path member is viewed in a plan view from the stacking direction, the portion where the first flow path expansion section and the second flow path expansion section overlap is the first through-hole.

12. 5. The liquid ejection head according to claim 4, wherein the center-to-center distance between the first supply path and the recovery path in the first direction is 0.6 mm or less.

13. The liquid ejection head according to claim 4 , wherein the support member includes a support member recovery path that is in communication with the ejection port and is located between the first support member supply path and the second support member supply path.

14. a circulation means for supplying the liquid recovered from the recovery path to the first supply path and the second supply path to circulate the liquid; 5. The liquid ejection head according to claim 4, which is mountable on a carriage of a liquid ejection device.

15. The liquid ejection head according to claim 1 , wherein the flow path member is made of silicon.

16. The liquid ejection head according to claim 1; a circulation means for circulating liquid within the liquid ejection head; a carriage that carries the liquid ejection head and the circulation means and moves in accordance with the ejection operation of the liquid ejection head; a conveying means for conveying the recording medium; Equipped with A liquid ejection apparatus that ejects liquid from the liquid ejection head onto the recording medium.

17. A step of forming a mask layer on a first surface of a silicon substrate and a second surface opposite to the first surface; An opening forming step of partially removing the mask layer on the first surface to form a first opening and partially removing the mask layer on the second surface to form a second opening; A through-hole forming step of forming a through-hole penetrating the silicon substrate from the first opening to the second opening; A through-path forming step of forming a through-path penetrating from the first opening to the second opening by immersing the silicon substrate having the through-hole formed therein in an etching solution; A step of removing the mask layer from the first surface and the second surface after the through-path forming step; A step of laminating a discharge substrate having a plurality of discharge ports for discharging liquid and a supply path for supplying liquid to the discharge ports formed on the first surface so that the through-path and the supply path communicate with each other; A step of laminating a support member having a flow path for supplying liquid to the discharge ports formed on the second surface so that the through-path and the flow path communicate with each other; characterized by comprising: In the opening forming step, when the silicon substrate is viewed in plan view along the stacking direction, the first opening includes an overlapping region overlapping with the second opening and a region extending from the overlapping region to the inside of the silicon substrate, and the second opening includes the overlapping region and a region extending from the overlapping region to the outside of the silicon substrate. A method for manufacturing a liquid ejection head, characterized in that the first opening and the second opening are formed.

18. The method for manufacturing a liquid ejection head according to claim 17, wherein a crystal plane of the first surface of the silicon substrate is (110).

19. The method for manufacturing a liquid ejection head according to claim 18, wherein in the through-path forming step, the through-path is formed at an angle of 60° or more and 100° or less with respect to the first surface and the second surface.

20. The method for manufacturing a liquid ejection head according to claim 19, wherein in the through-path forming step, the through-path is formed at an angle of 70° or more and 95° or less with respect to the first surface and the second surface.

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