Electronic apparatus

Abstract

To provide an electronic apparatus excellent in portability; or to provide an electronic apparatus excellent in at-a-glance visibility; or to provide an electronic apparatus including new input means.SOLUTION: An electronic apparatus comprises: a display panel having flexibility; and two supports supporting the display panel. The two supports are connected by a connection. The display panel is fixed to one support and is provided to the other support slidably in one direction without being fixed thereto. The electronic apparatus is further provided with detection means that, when the display panel slides, can detect the amount of its displacement.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] TECHNICAL FIELD One embodiment of the present invention relates to a display device or an electronic device including a display device. In particular, the present invention relates to a flexible display device or an electronic device equipped with a flexible display device. Regarding equipment.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. One aspect of the present invention relates to a product, a method, or a manufacturing method. , manufacture, or composition of matter. Therefore, the technical field of one embodiment of the present invention disclosed in this specification is specifically related to semiconductor devices, Display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices , their driving methods, or their manufacturing methods can be cited as examples.

[0003] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. Refers to devices in general, including semiconductor elements such as transistors, semiconductor circuits, arithmetic units, and memory The device is one aspect of a semiconductor device. Optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices The device may include a semiconductor device. [Background technology]

[0004] In recent years, display devices have been expected to be used in a variety of applications, and are becoming increasingly diverse. For example, display devices used in portable electronic devices must be thin and lightweight. There is also a demand for new applications that have not been seen before. are.

[0005] In addition, Patent Document 1 discloses a film substrate on which transistors and other elements serving as switching elements are mounted. Flexible actuator with electroluminescence (EL) element An active matrix light emitting device is disclosed. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, the display area of display devices has been enlarged to increase the amount of information displayed, and the list of displayed information has become On the other hand, for mobile device applications, the display area needs to be enlarged. Therefore, the display quality is improved. It has been difficult to achieve both high performance and high portability.

[0008] It is also desirable that the display panel be provided with an input means as a user interface. For example, a display that allows input by touching the screen with a finger or a stylus is There is a device (touch panel).

[0009] An object of one embodiment of the present invention is to provide an electronic device with excellent portability. It is an object of the present invention to provide an electronic device that is easy to read and that is not easily damaged. One of the objectives is to provide an electronic device equipped with a new input means. One of the goals is to

[0010] Another object of one embodiment of the present invention is to reduce the thickness of an electronic device. One of the objectives is to reduce the weight of the sub-device. Another objective is to provide a new electronic device. This is one of the topics.

[0011] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It will be clear from the description of the specification, etc. that there are other problems than those mentioned above. It is possible to extract it. [Means for solving the problem]

[0012] One aspect of the present invention is a display device having a first support, a second support, a connection portion, and a display panel. The display panel also has a function that allows it to be bent for display. The first support and the second support are connected by a connecting portion. The display panel has a function of rotating relatively via the connecting portion. a second support having a fixed portion and movable in one direction relative to the second support; It is characterized by being supported by a support.

[0013] Another aspect of the present invention is a display device including a first support, a second support, a connection portion, and a display panel. The electronic device has a display panel and a detection means. The first support and the second support are connected by a connecting portion, and the connecting portion The display panel has a function of rotating relative to the first support member via the first support member. and a second support member supporting the second support member so as to be movable in one direction relative to the second support member. When the first support and the second support are rotated relative to each other, The detecting means has a function of changing the relative position between the display panel and the second support. It is characterized by having a function to detect position.

[0014] In the above, the detecting means has a light emitting element and a light receiving element, One of the light emitting element and the light receiving element is fixed to the display panel, and the other of the light emitting element and the light receiving element is The light receiving element is fixed to the second support and has a function of detecting light emitted from the light emitting element. It is preferred that the compound has the following structure:

[0015] Alternatively, in the above, the detecting means has a light emitting element and a light receiving element, The light-emitting element and the light-receiving element are fixed to the second support, and the light-emitting element is a display panel. The light-receiving element has the function of detecting the reflected light from the display panel. It is preferred that the compound has the following structure:

[0016] Alternatively, in the above, the display panel has a display section and a non-display section, and the display section The detecting means has a first light emitting element and a second light receiving element, and the second light emitting element The light receiving element is provided in the non-display portion, and the light receiving element is fixed to the second support. It is preferable that the light emitting element has a function of detecting light emitted from the second light emitting element.

[0017] In the above, the display panel includes the first support, the connection portion, and the second support. It is preferable that they are positioned so as not to overlap with the center positions of the respective layers in the thickness direction.

[0018] The connecting portion preferably has an elastic body.

[0019] Preferably, the display panel has a function as a touch sensor. It is preferable that a touch sensor is provided over the display panel. [Effects of the Invention]

[0020] According to the present invention, an electronic device with excellent portability can be provided. Or, it is possible to provide electronic equipment that is less likely to break. Or, it is possible to provide new input methods. It is possible to provide an electronic device having a stage, or a new electronic device.

[0021] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other effects from the descriptions in the aspects and claims. [Brief explanation of the drawings]

[0022] [Figure 1] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 2] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 3] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 4] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 5] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 6] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 7] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 8]1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 9] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 10] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 11] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 12] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 13] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 15] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 16] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 17] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 18] 1A and 1B are a block diagram and a timing chart of a touch sensor; [Figure 19] Circuit diagram of a touch sensor. [Figure 20] 1 shows an example of the configuration of an electronic device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0024] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0025] In each figure described in this specification, the size, layer thickness, or area of each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0026] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0027] (Embodiment 1) In this embodiment, a structural example of an electronic device according to one embodiment of the present invention will be described with reference to drawings. do.

[0028] An electronic device according to one embodiment of the present invention includes a flexible display panel and two supports for supporting the display panel. The two supports are connected by a connecting part. The two housings can be rotated relative to each other to fold the electronic device. The electronic device according to one embodiment of the present invention is characterized in that the display surface of the display panel is kept flat, and the display panel The display surface of the panel must be folded inward (inward bending), and the display surface of the display panel must be folded outward (inward bending). It is possible to fold it so that it becomes like this.

[0029] The electronic device according to one embodiment of the present invention has a seamless, wide display when the display panel is unfolded. The display area provides excellent visibility, and when the display panel is folded, it is easy to carry.

[0030] In the electronic device of one embodiment of the present invention, the display panel is fixed to one of the supports. The other support is supported without being fixed so that it can slide in one direction. When the angle between the two supports is changed, the display panel The structure is such that it slides relative to the support body that is not fixed, and the relative positions of the two change. By adopting such a configuration, the angle between the two supports can be changed, and the display panel When bending part of the panel, force is applied only in the direction of bending the display panel, and not in the direction perpendicular to this. The force acting in the direction perpendicular to the thickness of the display panel is substantially eliminated. That is, the display panel can be bent by sliding. When removing the display panel, no pulling or compressing force is applied to the panel, preventing damage to the panel. This allows for the realization of highly reliable electronic devices.

[0031] Furthermore, when the display panel is slid as described above, a detection means for detecting the amount of displacement is provided. The amount of displacement of the display panel depends on the angle between the two supports. By detecting this displacement, it is possible to detect the angle between the two supports. For example, the relative position between the display panel and the support on the side to which the display panel is not fixed may be By detecting the change in this relative value, the amount of displacement of the display panel can be detected. The change in position is preferably detected optically. Alternatively, the detection may be performed electromagnetically.

[0032] In this way, by configuring the angle between the two supports to be detectable, the angle can be detected by the electronic device. For example, the angle between two supports can be used as an input means. In addition, it is possible to change the display on the display panel depending on the situation. When the screen is folded so that the other side is facing inward, the display panel will not display any It can be done.

[0033] More specifically, the following configuration can be adopted.

[0034] [Configuration example] FIG. 1A is a schematic perspective view of an electronic device 10 according to one embodiment of the present invention.

[0035] The electronic device 10 includes a support 11a, a support 11b, a connection portion 12, and a display panel 13. , and detection means 14.

[0036] The support 11a and the support 11b are connected via a connection portion 12. 3 is disposed on top of the support 11a, the support 11b and the connection portion 12. The panel 13 is supported by at least the support 11a and the support 11b.

[0037] Specifically, the display panel 13 has an area that is fixed to the support 11a. The panel 13 can slide in one direction without being fixed to the support 11b. The support 11b supports the substrate 11b.

[0038] The display panel 13 is flexible. A pixel has a display area on which an image can be displayed. In the following description, the surface of the display panel 13 on which an image is displayed is referred to as the surface of the display panel 13. It may be written as display surface.

[0039] The support 11a and the support 11b can be rotated relative to each other via the connecting portion 12. For example, the support 11a and the support 11b may be folded via the connecting portion 12 or screwed together. Therefore, the electronic device 10 can be modified by changing the display panel 13. The display surface can be reversibly transformed from a flat state to a curved state.

[0040] The support 11a and the support 11b may have rigidity, or the support itself may have torsional strength. Alternatively, a member that can be deformed by a bending force may be used. b should be made of a material that is less flexible than at least the display panel 13 or the connection portion 12. Alternatively, an elastic body such as hard rubber may be used for the frame. Materials that can be used include plastic, metals such as aluminum, stainless steel, and titanium alloys. An alloy of these, rubber such as silicone rubber, etc. can be used.

[0041] The connecting portion 12 can be made of a material that is partially or entirely elastically deformable. For example, the entire connecting portion 12 is made of an elastic material, or at least the bending portion has an elastic material. Alternatively, the connecting portion 12 may have a hinge having one or more rotation axes. It is also possible to apply a configuration in which

[0042] When the connecting portion 12 is made of an elastically deformable material, the support 11a and the support 11b are When no force is applied to rotate the display, the display surface shown in FIG. 1(A) is kept flat. In order to maintain the state shown in FIG. 1(C) or FIG. 1(E), the support 11a For example, it is preferable that the support 11a and the support 11b are fixed to each other. Alternatively, a separate attachment / detachment tool may be provided to mechanically attach / detach the support 11b. The support 11a and the support 11b may have a detachable mechanism. 11b may be fixed by magnetic force.

[0043] In addition, when the connecting portion 12 has a hinge, as shown in FIG. 1(C) or FIG. 1(E), A hinge having a mechanism for fixing the relative positions of the support 11a and the support 11b in this state is used. This is preferable because it eliminates the need for the above-mentioned attachment and detachment tools and attachment and detachment mechanisms. By using a hinge having a position, the display panel 1 can be easily mounted as shown in FIG. 1(B) and FIG. 1(D). 3 can also be used with the display surface curved.

[0044] The connecting portion 12 is made of a material having a lower Young's modulus than the support members 11a and 11b. In addition, a material having a higher Young's modulus than the support 11a and the support 11b can be used. Even if materials with similar Young's moduli are used, the thickness of the connection portion 12 is It is also possible to use a material that is thinner than the support 11a and the support 11b. The material may be plastic, rubber, metal, alloy, or the like. Materials such as silicone resin or gel may also be used.

[0045] 1A shows a state in which the display surface of the display panel 13 is held flat. By deforming the electronic device 10 so that the display surface of the display panel 13 is bent inward, It can be reversibly transformed from the state shown in Figure 1(B) to the state shown in Figure 1(C). In this case, the display panel 13 is sandwiched between the support members 11a and 11b. When the electronic device 10 is not in use or is stored in a bag or the like, it is in this state. It can be considered as a state.

[0046] Also, the display surface of the display panel 13 is bent outward from the state shown in FIG. By deforming the vessel 10, it is reversibly transformed from the state shown in FIG. 1(D) to the state shown in FIG. 1(E). In FIG. 1(E), the display surface of the display panel 13 is on the top surface of the electronic device 10, and the side surface of the electronic device 10. In the state shown in FIG. 1(E), the slits are positioned along the upper and lower surfaces of the slits shown in FIG. 1(A). It is smaller than when fully opened, making it ideal for use in public places or while traveling. It is suitable for.

[0047] [Cross-section example] FIG. 2A is a schematic cross-sectional view of the electronic device 10 taken along the cross section X1 shown in FIG. 1A. FIG. 2(B) is a schematic cross-sectional view taken along the cutting plane X2 shown in FIG. 1(B). FIG. 2(C) is a schematic cross-sectional view taken along the cutting plane X3 shown in FIG. 1(D).

[0048] In FIG. 2A, the display panel 13 includes a support 11a, a support 11b, and a connection portion. The display panel 13 is also provided with an FPC (Flexible Printed Circuit). The FPC15 is connected to the BLE Print Circuit (FPC15) and is supported by the FPC15. The circuit board 16 is electrically connected to the body 11a. is electrically connected to a battery 17 provided inside the first support 11a. As shown in FIG. 2(A), the battery 17 may be provided inside the second support 11b. Although not shown here, a device for controlling the driving of the detection means 14 is provided inside the support 11b. For example, the IC may include a circuit board on which an IC for detecting the 14 and the function of extracting the signal output from the detection means 14. good.

[0049] The display panel 13 is supported by the support 11a so as to be fixed thereto. For example, the display panel A part of the support 11a may be adhered to the support 11a, or may be mechanically fixed by a fastener such as a screw. It may be specified.

[0050] On the other hand, the display panel 13 is supported without being fixed to the support body 11b. In FIG. 2A, the display panel 13 can slide left and right relative to the support 11b. It is supported as follows.

[0051] Here, the thickness direction of the display panel 13 (the vertical direction in FIG. 2A) and the When the wire is bent, the direction perpendicular to the bending direction (in Figure 2(A), the direction perpendicular to the paper surface) , or both, to prevent the display panel 13 from moving (shifting). It is preferable that 13 is supported by a support 11b.

[0052] As described above, the display panel 13 is fixed to the support 11a and also fixed to the support 11b. Therefore, the support 11a and the support 11b are connected to each other via the connecting portion 12. When the support 11b is rotated relative to the display panel 13, the display panel 13 is displaced relative to the support 11b. The stress acting in the direction perpendicular to the thickness direction of the display panel 13 is alleviated, and the display panel 13 is prevented from breaking. Therefore, it is possible to suppress defects such as damage to the electronic device 10. It can be achieved.

[0053] FIG. 2(A) shows an example in which the detection means 14 is disposed on the second support 11b. The detecting means 14 has a function of detecting the relative position of the support 11b and the display panel 13. A specific example of the configuration of the detection means 14 will be described later. Although the configuration in which the detecting means 14 is disposed on the support 11b is shown, the position of the detecting means 14 is different from that of the support 11b. This can be set appropriately depending on the configuration.

[0054] 2(B) and 2(C) also show enlarged views of a part of the support 11b. There are.

[0055] As shown in FIG. 2(B), when the display panel 13 is bent so that the display surface faces inward, The display panel 13 and the support 11b are moved outward so that the end of the display panel 13 on the support 11b side moves outward. On the other hand, as shown in FIG. When the display panel 13 is bent so that the surface faces outward, the end of the display panel 13 on the support 11b side moves inward. As a result, the relative positions of the display panel 13 and the support 11b are shifted.

[0056] In this way, when the display panel 13 is bent, the contact between the display panel 13 and the support 11b is By detecting the relative positional deviation, the distance between the support 11a and the support 11b can be calculated from the deviation value. As a result, the shape of the electronic device 10 can be detected. This becomes possible.

[0057] The above is a description of the cross-sectional configuration example.

[0058] [Display panel displacement] The following describes the display distortion that occurs when the electronic device 10 is deformed so as to bend the display panel 13. The amount of deviation (amount of displacement) of the relative position between the display panel 13 and the support 11b will now be described.

[0059] FIG. 3A is a schematic diagram illustrating an electronic device of one embodiment of the present invention. In the electronic device, the support 11a and the support 11b are connected by the elastic connecting portion 12. In addition, the support 11a, the connection portion 12, and one surface of the support 11b are A display panel 13_1 is provided on the first surface, and a display panel 13_2 is provided on the other surface. In FIG. 3(A), the display panel 13_1 and the display panel 13_2 are on the front surface of the support 11a. A hatched pattern is provided to indicate that the surface is partially fixed.

[0060] Here, when the connecting portion 12 is bent, the display surface of the display panel may be on the inside or on the outside. In order to simultaneously explain both the case where the display is on one side and the case where the display is on the other side, an example having two display panels will be used. do.

[0061] As shown in FIG. 3A, the support 11a, the support 11b and the connecting portion 12 are The thickness of the connecting portion 12 is defined as thickness t. The length of the connecting portion 12 is defined as length L0. The ends of the display panel 13_1 and the display panel 13_2 are aligned with the end of the support 11b. In addition, FIG. 3(A) shows the neutral line (also called the neutral line) of the connection part 12. ) 12a is shown by a broken line. In this specification, the neutral line is the line where stress is applied to the object. When there is no cross section, it refers to the line connecting the centers of the thickness direction of the cross section of the object.

[0062] Here, as shown in FIG. 3B, the neutral line 12a of the connection portion 12 is formed at an angle θ At this time, since the connecting portion 12 is an elastic body, The stress generated when bending causes the part of the connecting portion 12 inside the neutral line 12a to shrink. Therefore, the portion of the connecting portion 12 outside the neutral line 12a will be stretched.

[0063] For simplicity, it is assumed here that when the connecting portion 12 is bent, the thickness of the connecting portion 12 does not change. The neutral line 12a of the connecting portion 12 always passes through the center of the thickness of the connecting portion 12. When the neutral line 12a of the connecting portion 12 is curved with a constant radius of curvature from one end of the connecting portion 12 to the other end, Consider the situation.

[0064] In FIG. 3B, the length of the neutral line 12a of the connection part 12 is L0. The radius of curvature r1 on the inner surface and the radius of curvature r2 on the outer surface are respectively as follows: It will look like this.

[0065]

number

[0066] Therefore, the length L1 of the inner surface of the connection portion 12 in the cross section shown in FIG. 3(B) and The length L2 of the outer surface is as follows:

[0067]

number

[0068] Here, since the display panel 13_1 is provided in contact with the inner surface of the connection portion 12, If the display panel 13_1 does not stretch, the end of the display panel 13_1 will be the end of the support 11b. A part of the display panel 13_1 moves relative to the support 11b so as to be shifted outward from the part of the display panel 13_1. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connection portion 12, The display panel 13_2 is positioned so that the end of the display panel 13_2 is shifted inward from the end of the support 11b. A part of the display panel 13_2 moves relative to the support 11b. The displacement amount d1 of the display panel 13_2 relative to the support 11b and the displacement amount d2 of the display panel 13_2 relative to the support 11b are If the displacement to is assumed to be positive, then the result is as follows:

[0069]

number

[0070] From the equation (3), the displacement amount d1 of the display panel 13_1 and the displacement amount d 2 depend on the thickness t of the connecting portion 12 and the angle θ. If the length t is constant, the angle θ can be calculated by detecting the displacement d1 or the displacement d2. can be estimated.

[0071] In addition, the magnitude of the displacement amount d1 of the display panel 13_1 and the magnitude of the displacement amount d2 of the display panel 13_2 The longer the distance between the display panel 13_1 or 13_2 and the neutral line 12a, the Therefore, the display panel should be positioned at least away from the neutral line 12a. That is, the display panel is preferably made up of a support 11a, a connection portion 12, and a second support It is preferable that they are positioned so as not to overlap with the center positions of the support members 11b in the thickness direction.

[0072] In reality, there may be some portions where the thickness of the curved portion of the connection portion 12 is thin. Therefore, there are two cases: one in which the display surface is bent inward like the display panel 13_1 in FIG. 3(B), and the other in which the display panel When the display surface is bent outward as in 13_2, the absolute value of the displacement differs, and Therefore, the relative displacement between the display panel 13 and the support 11b may be different from the actual value. When calculating the angle θ from the relative displacement, the shape change when the connecting portion 12 is bent is calculated as follows: It is preferable to take this into consideration and make corrections.

[0073] Further, although the connecting portion 12 has a plate-like shape in this example, the shape is not limited to this. For example, as shown in FIGS. 4(A) and 4(B), by forming a connection part 12 having a cavity therein, Wiring 18 may be provided in the cavity. The circuit board, the battery, etc. provided inside the body 11b can be electrically connected to each other. As shown in Figs. 4(C) and 4(D), the connecting portion 12 may have a bellows structure. This reduces the stress applied to the connection portion 12 when the connection portion 12 is bent. As shown in Figs. 4(E) and (F), the connecting portion 12 is formed in a bellows structure with a cavity therein. and the wiring 18 may be provided in the cavity.

[0074] In addition, although the case where an elastic body is used as the connecting portion 12 has been described here, the connecting portion 12 When a hinge is used as the support, the relative movable range of the support 11a and the support 11b is limited. Therefore, the angle θ can be calculated more precisely from the relative displacement between the support 11b and the display panel 13. In this case, the hinge has two or more rotation axes. This is preferable because it allows for greater design freedom.

[0075] This concludes the description of the displacement amount of the display panel.

[0076] [Detection method configuration example] As described above, the detecting means 14 detects a change in the relative position between the support 11b and the display panel 13. It refers to a mechanism that has the function of detecting.

[0077] The detection means 14 is preferably configured to detect the change in position optically. For example, one of the light emitting element and the light receiving element is provided on the support 11b, and the other is provided on the display panel 13. Alternatively, both the light emitting element and the light receiving element may be provided on the support 11b. and a light receiving element detects light from the light emitting element reflected by the display panel 13. Alternatively, both the light emitting element and the light receiving element may be provided on the display panel 13, and the light emitting element and the light receiving element may be provided on the display panel 13. The reflecting light from the reflecting surface may be received.

[0078] More specifically, the following configuration can be used.

[0079] [Configuration example 1] FIG. 5(A) shows a schematic cross-sectional view of the area including the detection means 14 of the support 11b.

[0080] The support 11b has a first portion 31 that supports the display panel 13 and a display portion 32 that supports the display panel 13. a second portion 32 located on the side opposite to the display surface side of the display panel 13; and a third portion 33 located on the side opposite to the display surface side of the display panel 13. The second portion 32 and the third portion 33 are used as exterior members of the support body 11b. It may also function as

[0081] The detecting means 14 has a plurality of light receiving elements 21 and a light emitting element 22 .

[0082] In the configuration shown in FIG. 5A, the plurality of light receiving elements 21 are respectively mounted on the second portion of the support 11b. 32, and is fixed to the surface facing the display panel 13. The light emitting element 22 is fixed to the display panel 13. The light emitting element 22 is fixed to the second part of the support 11b. 32, more specifically, the light receiving element 21.

[0083] The light emitted by the light emitting element 22 may be visible light, infrared light, or ultraviolet light. For example, it may have one or more peaks in the wavelength range from 300 nm to 3000 nm. In particular, light emitting elements that emit infrared light with wavelengths of 750 nm or more can be used. When using ultraviolet light, it is not necessary to consider light leakage from the support 11b compared to when visible light or ultraviolet light is used. This is preferable because the requirements are low, the design is easy, and safety can be improved.

[0084] The light emitting element 22 is, for example, an LED (Light Emitting Diode). Light-emitting elements such as organic EL elements and inorganic EL elements can be applied. When the display panel 13 has a light emitting element such as an organic EL element in a pixel, the light emitting element 22 By using a light-emitting element manufactured in the same process as the pixel, the number of parts can be reduced. In this case, the light emitted from the light emitting element 22 contains visible light.

[0085] The light receiving element 21 is an element that can receive light emitted from the light emitting element 22. The element 21 includes a photoelectric conversion element such as a photodiode or a phototransistor. In addition, CCD image sensors, CMOS image sensors, etc. A solid-state image sensor such as a holographic sensor can also be used.

[0086] As will be described later, a light receiving element 21 may be provided on the display panel 13. At this time, in particular, when the display panel 13 has a photoelectric conversion element such as a photodiode in the display area, In the case of an optical touch panel, the light receiving element 21 and the photoelectric conversion element are manufactured in the same process. It is preferable to do so.

[0087] 5(B) and (C) are perspective schematic diagrams showing the detection means 14 and its main peripheral parts.

[0088] The display panel 13 has a display section 13a and a non-display section 13b. The non-display area 13b has a number of pixels and is capable of displaying an image. The light emitting element 22 is disposed in the second portion 32 of the support 11b. 13 so as to overlap with the non-display portion 13b of the display panel 13.

[0089] As shown in FIG. 5B, the light 23 emitted by the light emitting element 22 is incident on the display surface side of the display panel 13. At this time, the light receiving element 21 located in the traveling direction of the light 23 detects the light 23. do.

[0090] Next, from the state shown in FIG. 5(B), the display panel 13 is moved in the direction of the arrow shown in FIG. 5(C) toward the support. 11b, the light emitting element 22 and the plurality of light receiving elements 21 Since the relative position of the light receiving element 21 changes, a light receiving element 21 different from that in the state of FIG. 5(B) emits light. It is located in the traveling direction of light 23 emitted by optical element 22.

[0091] In FIG. 5B etc., the traveling direction of the light 23 is approximately perpendicular to the surface of the display panel 13. However, the light is not limited to this and may travel in an oblique direction. As the light source, a light emitting element with high directivity may be used, or a light emitting element having an intensity distribution in the direction of travel may be used. An optical element may also be used.

[0092] In this way, by comparing the detected intensities of the light 23 received by the plurality of light receiving elements 21, This makes it possible to detect the relative positional relationship between the display panel 13 and the support 11b.

[0093] The accuracy of the position detected by the detecting means 14 depends on the relationship between the display panel 13 and the support 11b. By arranging the plurality of light receiving elements 21 with as few gaps as possible in the relative displacement direction, For example, as shown in Figure 6(A), the vector parallel to the direction of displacement The projections of two adjacent light receiving elements 21 onto the target (arrow) are arranged so as to overlap each other. This can improve the accuracy of the detected position.

[0094] As shown in FIG. 6B, two adjacent light receiving elements 21 are arranged with a gap therebetween. Even if the angle dependency of the light 23 from the light emitting element 22 is known in advance, In this case, the peak position of the detected intensity is calculated from the values of the detected intensities by the plurality of light receiving elements 21. This makes it possible to detect the position of the light emitting element 22 with high accuracy.

[0095] In this case, the detecting means 14 is a plurality of light receiving elements 21 attached to the second part of the support 11b. 32 and the light emitting element 22 is provided on the display panel 13, but the present invention is not limited to this. For example, as shown in FIG. 7A, a plurality of light receiving elements are provided on the display panel 13, and the support 11b The light emitting element 22 may be provided in the second portion 32 .

[0096] As shown in FIG. 7B, the first portion 31 of the support 11b has an opening. The light emitting element 22 emits light on the opposite side of the display surface of the display panel 13, and the support 11b A configuration including a plurality of light receiving elements 21 provided in the third portion 33 may also be used.

[0097] 7C, a plurality of light receiving elements are provided on the opposite side of the display surface of the display panel 13. Alternatively, a light emitting element 21 may be provided in a third portion of the support 11b, and a light emitting element 22 may be provided in a third portion of the support 11b.

[0098] 7B and 7C, the opening of the first portion 31 has at least the light emitting element 22 It is sufficient that the light emitted by the light source 100 is transmitted through the light source 100, and the light source 100 may have a light-transmitting member.

[0099] The above is the explanation of the first configuration example.

[0100] [Configuration example 2] Below, a configuration example will be described that is partially different from the above-mentioned configuration example 1. Explanation of duplicated parts may be omitted.

[0101] FIG. 8(A) is a perspective schematic diagram showing the detection means 14 and its main peripheral parts.

[0102] The surface of the second portion 32 of the support 11b facing the display panel 13 is provided with a light receiving element 21 and a light emitting element 22. The optical elements 22 are arranged side by side.

[0103] As shown in FIG. 8A, light 23 emitted by the light emitting element 22 is incident on the non-display area of the display panel 13. The light is reflected by a part of the display panel 13b, and a part of the reflected light is received by the light receiving element 21. As the filter 13 is displaced relative to the support 11b, the intensity of the light received by the light receiving element 21 By detecting this change, the relative position between the display panel 13 and the support 11b can be determined. The amount of displacement can be detected.

[0104] In the non-display area 13b of the display panel 13, a portion that reflects the light 23 emitted by the light emitting element 22 It is preferable that the display panel has portions with different reflectances. It is sufficient that the reflectance of the light beam 13 is different in a direction perpendicular to the displacement direction. For example, the wiring pattern provided in the non-display area 13b, the pattern of the driving circuit, etc. may be used. It is also possible to do so.

[0105] In addition, a pattern for position detection is provided on the surface or inside of the non-display section 13b of the display panel 13. For example, when the display panel 13 is displaced, a portion with high reflectivity may be formed. A pattern in which high and low portions alternate is formed. The surface of the display panel 13 may be formed by a printing method or by forming a concave-convex shape on the surface of the display panel 13. may also be used.

[0106] 8B to 8E show the position detection functions of the non-display section 13b of the display panel 13. The arrows in each figure indicate the direction of displacement of the display panel 13. do.

[0107] In FIG. 8A, a first region 24 having a first reflectance and a second region 25 having a second reflectance are shown. The second stripe-shaped region 25 is arranged in a direction substantially parallel to the displacement direction of the display panel 13. The region 25 has a pattern in which a plurality of regions are arranged.

[0108] Here, the difference between the first reflectance and the second reflectance is, for example, 5% or more, preferably The reflectance may be 10% or more, and more preferably 15% or more. There may be a difference in reflectance between the first and second reflectances, and the first reflectance may be higher than the second reflectance. It can be low.

[0109] As shown in FIG. 8C, the striped second region 25 is Alternatively, as shown in FIG. 8(D), the second region 25 may be arranged in a lattice pattern. As shown in FIG. 8(E), the second region 25 may have a dotted shape. It may also be an arrayed pattern.

[0110] Here, we have shown an example in which two areas with different reflectances are regularly arranged. The above-mentioned portions with different reflectances may be arranged regularly. The portions may be arranged irregularly.

[0111] Here, the light receiving element 21 and the light emitting element 22 are disposed on the second portion 32 of the support 11b. However, it may be arranged in the third portion 33. In that case, As illustrated in the first configuration example, the first section has an opening that transmits the light emitted by the light emitting element 22. Just set up minute 31.

[0112] In this way, both the light receiving element 21 and the light emitting element 22 are provided on the support 11b, and reflected light is used. By using this configuration to detect the relative position between the display panel 13 and the support 11b, In addition, the number of points can be reduced. Since the wiring pattern of the display panel 13 can be used as the turn, This allows for greater freedom in design.

[0113] The above is the explanation of configuration example 2.

[0114] In this embodiment, the configuration includes two supports, but the configuration may include three or more supports. The more supports there are, the more easily the electronic device can be deformed into various shapes. This allows for a wider range of applications. 9(A) shows an example of the configuration of an electronic device equipped with the electronic devices 11c, 11d, and 11e. The device can be folded at two points to change from the state shown in FIG. 9(B) to the state shown in FIG. 9(C). C) Electronic devices can be folded.

[0115] In addition, when the display panel 13 is configured to have three or more supports, the display panel 13 may be one of the supports. It is fixed to a support and supported so that it can slide without being fixed to another support. In addition, among the supports that do not support the display panel 13, one or more supports may be In other words, the number of supports provided in the electronic device is If n is the number of supports, the detection means may be provided on 1 to n-1 of the supports. The more supports having detection means, the more detailed the shape of the electronic device can be detected. It is preferable that the test be carried out on all supports that do not support the display panel 13. It is advisable to provide an output means.

[0116] In addition, the electronic device of one embodiment of the present invention may include a support provided with various input means, output means, or input / output means. For example, in FIG. 20, the input button 41 and the power button a touch panel 42, an external connection terminal 43, a card slot 44, an optical sensor 45, a camera 46, and a light source; 47, a speaker 48 and a microphone 49 are provided on the support 11a or the support 11b. In addition, in FIG. 20, the support 11a and the support 11b are provided with backings. The support 11b has a built-in terry 17. An antenna 51 is mounted on a part of the support 11b.

[0117] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0118] (Embodiment 2) In this embodiment, a light-emitting panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention will be described. An example of the configuration and manufacturing method of the panel will be described.

[0119] [Example 1] FIG. 10A shows a plan view of the light-emitting panel, and the dashed line A1-A2 in FIG. An example of a cross-sectional view between the color filters is shown in FIG. In this embodiment, the light-emitting panel is a top-emission type light-emitting panel using the For example, a panel has a structure in which one color is expressed using three sub-pixels of R (red), G (green), and B (blue). Composition: R (red), G (green), B (blue), W (white), or R (red), G (green), B (blue) A configuration in which one color is expressed by four sub-pixels of Y (yellow), Y (yellow), and Y (yellow) can be applied. However, colors other than RGBW may be used, for example, yellow, cyan, magenta, etc. It may be configured as such.

[0120] The light-emitting panel shown in FIG. 10A includes a light-emitting section 804, a driving circuit section 806, an FPC (Flexible Printed Circuit) The light emitting unit 804 and the driving circuit The light emitting element and the transistor included in the circuit portion 806 are formed on the substrate 801, the substrate 803, and the sealing layer It is sealed by 823.

[0121] The light-emitting panel shown in FIG. 10(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 84 3, adhesive layer 841, and substrate 803. The sealing layer 823, overcoat 849, and insulating layer The edge layer 843, adhesive layer 841, and substrate 803 are transparent to visible light.

[0122] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0123] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823. There are.

[0124] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0125] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 10C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0126] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the insulating layer 803 are bonded to each other by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may get into the light emitting element 830 or the transistor 820. This is preferable because it can prevent objects from entering and improve the reliability of the light-emitting panel.

[0127] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. To prevent this, the conductive layer 857 is made of the same material as the electrodes and wiring used in the light emitting section and the drive circuit section. Here, the conductive layer 857 is preferably formed by a process. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0128] In the light-emitting panel shown in FIG. 10C, the connector 825 is located on the substrate 803. 825 includes the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and The connecting body 8 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. 25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected to each other via the connector 825. When the conductive layer 857 and the substrate 803 overlap, the substrate 803 is opened. By using a substrate with an opening, the conductive layer 857, the connector 825, and the F The PC 808 can be electrically connected.

[0129] In Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. In addition, in Example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. and a light-shielding layer 847 is formed, the substrate on which the layer is formed is peeled off, and the layer is formed on the substrate 803 using the adhesive layer 841. A light-emitting panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0130] If a substrate is made of a material with low heat resistance (such as resin), the substrate is exposed to high temperatures during the manufacturing process. Therefore, there are limitations on the conditions for fabricating transistors and insulating layers on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, it is preferable to form a transistor on a manufacturing substrate having high heat resistance. High temperature can be used to produce highly reliable transistors and transistors with sufficient water permeability. Then, they can be transferred to the substrate 801 or the substrate 803. Thus, a highly reliable light-emitting panel can be manufactured. A light-weight or thin, highly reliable light-emitting panel can be realized. Details of the manufacturing method will be described later. do.

[0131] It should be noted that a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0132] [Example 2] FIG. 10(B) shows a plan view of the light-emitting panel, and the dashed line A3-A4 in FIG. An example of a cross-sectional view between the two is shown in FIG. 10(D). The light-emitting panel shown in Example 2 is different from Example 1 in that This is a top-emission type light-emitting panel that uses a color filter system. Only the differences from Example 1 will be described in detail, and explanations of the points in common with Example 1 will be omitted.

[0133] The light-emitting panel shown in FIG. 10(D) differs from the light-emitting panel shown in FIG. 10(C) in the following respects: .

[0134] The light-emitting panel shown in FIG. 10(D) has spacers 827 on the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0135] In addition, in the light-emitting panel shown in FIG. 10(D), the substrate 801 and the substrate 803 are different in size. The connecting body 825 is located on the insulating layer 843 and does not overlap the substrate 803. through openings provided in the edge layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. The conductive layer 857 is connected to the substrate 803. Since there is no need to provide an opening in the substrate 803, the There are no restrictions on materials.

[0136] It should be noted that a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0137] [Example 3] FIG. 11(A) shows a plan view of the light-emitting panel, and the dashed line A5-A6 in FIG. An example of a cross-sectional view between the two panels is shown in Figure 11(C). The light-emitting panel used is a top-emission type.

[0138] The light-emitting panel shown in FIG. 11(A) includes a light-emitting section 804, a driving circuit section 806, and an FPC 808. The light emitting element and the transistor included in the light emitting section 804 and the driving circuit section 806 are mounted on the substrate 8 01, and is sealed by a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0139] The light-emitting panel shown in FIG. 11(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The substrate 803 is transparent to visible light.

[0140] The frame-shaped sealing layer 824 is preferably a layer having higher gas barrier properties than the sealing layer 823. This prevents moisture and oxygen from entering the light-emitting panel from the outside. This makes it possible to realize a highly reliable light-emitting panel.

[0141] In Example 3, light emitted from the light emitting element 830 is extracted from the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has higher light-transmitting properties than the frame-shaped sealing layer 824. Furthermore, it is preferable that the refractive index of the sealing layer 823 is higher than that of the frame-shaped sealing layer 824. Furthermore, the sealing layer 823 has a smaller shrinkage in volume when hardened than the frame-shaped sealing layer 824. It is preferable that:

[0142] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0143] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 11C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0144] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate into the light emitting element 830 and the transistor 820. This is preferable because it can suppress the penetration of light and improve the reliability of the light-emitting panel.

[0145] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is made of the same material as the electrode of the transistor 820. An example produced using the same process is shown below.

[0146] In the light-emitting panel shown in FIG. 11(C), the connector 825 is located on the substrate 803. 825 is a substrate 803, a sealing layer 823, an insulating layer 817, and an opening provided in the insulating layer 815. The connector 825 is connected to the conductive layer 857 through a hole. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0147] In Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. Therefore, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized. Cut.

[0148] It should be noted that a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0149] [Example 4] FIG. 11(B) shows a plan view of the light-emitting panel, and the dashed line A7-A8 in FIG. An example of a cross-sectional view between the color filters is shown in FIG. This is a bottom-emission type light-emitting panel that uses this method.

[0150] The light-emitting panel shown in FIG. 11(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of Transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 8 17b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, The insulating layer 817b transmits visible light.

[0151] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes an insulating layer A lower electrode 831 on the EL layer 833, an EL layer 833 on the lower electrode 831, and an upper electrode 832 on the EL layer 833. The lower electrode 831 is the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 preferably transmits visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited. If it is provided between the edge layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, good.

[0152] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 11C, the driver circuit portion 806 includes a plurality of transistors. Two transistors are shown.

[0153] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water can easily penetrate the light emitting element 830 and the transistors 820 and 822. This is preferable because it can prevent impurities from entering and improve the reliability of the light-emitting panel.

[0154] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is formed using the same material and in the same process as the conductive layer 816. Here is an example.

[0155] In Example 4, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A light-emitting panel that can be produced by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. As a result, in one embodiment of the present invention, a light-weight or thin and highly reliable light-emitting panel can be realized. It can be realized.

[0156] It should be noted that a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0157] [Example 5] FIG. 11(E) shows an example of a light-emitting panel different from the specific examples 1 to 4.

[0158] The light-emitting panel shown in FIG. 11(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 82 3, and a substrate 803.

[0159] The conductive layer 857a and the conductive layer 857b function as external connection electrodes of the light-emitting panel. , and can be electrically connected to FPC, etc.

[0160] The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitting element. The light extraction side is either a top-emission type or a dual-emission type. The electrode, the substrate, the insulating layer, etc. are transparent to visible light. and electrically connect it.

[0161] The substrate on the light extraction side has a hemispherical lens and a microlens array as a light extraction structure. For example, the resin substrate may have a film with a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate with a refractive index similar to that of the substrate or the lens or film. By bonding the substrate using an adhesive having the above-mentioned properties, a light extraction structure can be formed.

[0162] The conductive layer 814 is not necessarily provided, but it is possible to reduce the voltage drop due to the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the electrode A conductive layer for electrical connection is formed on the insulating layer 821, the EL layer 833, the upper electrode 835, or the like. It may be provided.

[0163] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.1 μm or less. It is less than 0.5μm.

[0164] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it becomes easier to electrically connect the conductive layer to the conductive layer.

[0165] In Example 5, the insulating layer 813, the light emitting element 830, etc. are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a light-emitting panel that can be manufactured by transposing 0 etc. on a highly heat-resistant manufacturing substrate. By applying high temperature to form a film with sufficiently low water permeability and transferring it to the substrate 801, reliability is improved. Thus, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin can be manufactured. Moreover, a highly reliable light-emitting panel can be realized.

[0166] Although an example in which a light-emitting element is used as a display element has been shown here, The embodiment is not limited to this.

[0167] For example, in this specification, a display element, a display device which is a device having a display element, or Display panels, light-emitting elements, and light-emitting devices that have light-emitting elements can be used in various forms. It can have various elements, such as a display element, a display device, a display panel, a light-emitting element, etc. An example of an element or a light-emitting device is an EL (electroluminescence) element (organic and EL elements containing inorganic substances, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs) D, green LED, blue LED, etc.), transistors (transistors that emit light according to the current ), electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), MEMS (microelectromechanical systems) Display elements using the Digital Micromirror Device (DMD), D MS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD (In Interference modulation element, shutter-type MEMS display element, optical Interferometric MEMS display elements, electrowetting elements, piezoelectric ceramic displays Rays, carbon nanotubes, etc., electromagnetic effects, contrast, brightness, reflection Some display devices use EL elements, which have a display medium that changes its reflectivity and transmittance. Examples include EL displays. is a field emission display (FED) or SED type flat panel display (SED:Surface-conduction Electron-emitter An example of a display device using a liquid crystal element is a liquid crystal display. Ray (transmissive LCD, semi-transmissive LCD, reflective LCD, Direct-view LCDs, projection LCDs, etc. Electronic ink, electronic powder An example of a display device using an electrophoretic element is electronic paper. When realizing a semi-transmissive or reflective LCD, one of the pixel electrodes For example, a part of the pixel electrode or the whole of the pixel electrode may be made to function as a reflective electrode. A part or all of the poles may be made of aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This further reduces power consumption.

[0168] It should be noted that a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0169] [Example of materials] Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0170] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0171] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a flexible substrate may be used. Any thickness of glass, metal or alloy can be used.

[0172] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting panel to be lighter than when glass is used.

[0173] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and breakage resistance. For example, it is possible to realize a light-emitting panel that is hard to damage. By using a metal or alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to create a light-emitting panel.

[0174] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0175] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Metals such as aluminum, copper, iron, titanium, nickel, etc., or one or more metals selected from these metals The alloy may be, for example, an aluminum alloy or a stainless steel alloy. Polycarbonate or the like can be suitably used.

[0176] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. This can prevent damage to the light-emitting panel and a decrease in reliability. A stack of high emissivity layers (for example, metal oxides or ceramic materials can be used) It may also be constructed as such.

[0177] Examples of materials that are flexible and transparent include polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples of resins that can be used include polystyrene resins, polyamide-imide resins, and polyvinyl chloride resins. It is preferable to use a material with a low expansion coefficient, such as polyamide-imide resin or polyimide. Resin, PET, etc. can be suitably used. Also, a substrate (printed) in which a fiber body is impregnated with resin can be used. Use a substrate with a reduced thermal expansion coefficient by mixing inorganic fillers into organic resins. It is also possible.

[0178] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers) and layers of materials that can disperse pressure (e.g., ara The insulating layer may be laminated with a polymer layer (e.g., a polymer layer).

[0179] The flexible substrate may be formed by stacking a plurality of layers. This means that the barrier properties against water and oxygen can be improved, resulting in a highly reliable light-emitting panel. can.

[0180] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness is preferably 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The thickness of the organic resin layer can be set to 1. The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the mechanical resin layer on the outside of the glass layer, breakage and cracks in the glass layer are suppressed. The composite material of such glass material and organic resin can improve the mechanical strength. By applying it to the substrate, it becomes possible to create a highly reliable flexible light-emitting panel. can.

[0181] For adhesive and sealing layers, there are various types of adhesives, such as UV-curable adhesives, reactive-curable adhesives, and thermosetting adhesives. Various curing adhesives such as adhesives and anaerobic adhesives can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of suitable resins include EVA (ethylene vinyl acetate) resins. A material with low wettability is preferred. A two-component resin may also be used. etc. may also be used.

[0182] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0183] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0184] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, and nitride semiconductor. Indium, gallium, etc., such as In-Ga-Zn based metal oxides, Alternatively, an oxide semiconductor containing at least one of sodium and zinc may be used.

[0185] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0186] Here, transistors used in pixels, drive circuits, touch sensors, etc., which will be described later, It is preferable to use an oxide semiconductor for any semiconductor device. It is preferable to use an oxide semiconductor with a larger band gap than silicon. When a semiconductor material with a wide band and low carrier density is used, the off state of the transistor This is preferable because it can reduce the current in the

[0187] For example, the oxide semiconductor may contain at least indium (In) or It is preferable that zinc (Zn) is contained. More preferably, it is an In-M-Zn-based oxide (wherein M is A). (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf) Contains oxides.

[0188] In particular, the semiconductor layer has a plurality of crystal portions, and the c-axes of the crystal portions are aligned with the surface on which the semiconductor layer is formed. or oriented perpendicular to the upper surface of the semiconductor layer and having no grain boundary between adjacent crystal portions. An oxide semiconductor film is preferably used.

[0189] Such oxide semiconductors have no crystal grain boundaries, so when the display panel is bent, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in flexible display panels that are used in a curved state. You can be there.

[0190] By using such materials for the semiconductor layer, fluctuations in electrical characteristics are suppressed, and reliability is improved. High-performance transistors can be realized.

[0191] In addition, due to its low off-state current, the charge stored in the capacitance can be released for a long period of time via the transistor. By applying such a transistor to a pixel, It is also possible to stop the driving circuit while maintaining the gradation of the image displayed in the display area. As a result, electronic equipment with extremely reduced power consumption can be realized.

[0192] For stabilizing the characteristics of the transistor, it is preferable to provide an underlayer film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film does not have to be provided if it is not necessary. The layer 813 can also serve as an underlying film for the transistor.

[0193] The light emitting element can be a self-luminous element that can be illuminated by current or voltage. This category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0194] Light-emitting elements are available in top-emission, bottom-emission, and dual-emission types. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0195] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide containing gold, silver, platinum, magnesium, etc. , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and a tungsten alloy, as this can increase the electrical conductivity. Graphene or the like may also be used.

[0196] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO can be used.

[0197] The electrodes may be formed by evaporation or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0198] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It glows.

[0199] The EL layer 833 has at least a light-emitting layer. The EL layer 833 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0200] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0201] When a white light emitting element is used as the light emitting element 830, two types of It is preferable that the light emitting element contains two or more luminescent materials. White light can be obtained by selecting luminescent materials so that the light is complementary in color. For example, they emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. or luminescent materials that emit light containing spectral components of two or more of the colors R, G, and B. It is preferable that the light emitting element 830 contains two or more of the above substances. The wavelength of the visible light (e.g., 350 nm to 750 nm) has two or more peaks. It is preferable to use a light-emitting element having a peak in the yellow wavelength region. The emission spectrum of this material has spectral components in the green and red wavelength regions. It is preferable that:

[0202] More preferably, the EL layer 833 is a light-emitting layer containing a light-emitting material that emits light of one color and a light-emitting layer containing a light-emitting material that emits light of another color. It is preferable that the light-emitting layer has a laminated structure including a light-emitting layer containing a light-emitting material that emits light of E The plurality of light-emitting layers in the L layer 833 may be stacked in contact with each other or may be stacked with a separating layer interposed therebetween. For example, a structure in which a separation layer is provided between the fluorescent-emitting layer and the phosphorescent-emitting layer may be used. It may also be composed.

[0203] The separation layer is used to convert the excited state of a phosphorescent material generated in the phosphorescent-emitting layer into the fluorescent material in the fluorescent-emitting layer. Prevents energy transfer (especially triplet energy transfer) to optical materials via the Dexter mechanism The separation layer only needs to be a few nanometers thick. 1 nm to 20 nm, or 1 nm to 10 nm, or 1 nm to 5 nm The separating layer may be a single material (preferably a bipolar material) or a plurality of materials. (preferably a hole transporting material and an electron transporting material).

[0204] The separation layer may be formed using a material contained in the light-emitting layer that is in contact with the separation layer. This makes it easier to fabricate the light-emitting device and reduces the driving voltage. When the separation layer is made of a host material, an assist material, and a phosphorescent material (guest material), The separation layer may be formed of a host material and an assist material. The phosphorescent layer has a region that does not contain the material, and the phosphorescent layer has a region that contains the phosphorescent material. The separation layer and the phosphorescent layer can be deposited with or without a phosphorescent material. This configuration makes it possible to form the separation layer and the phosphorescent layer in the same chamber. This allows the manufacturing costs to be reduced.

[0205] The light emitting element 830 may be a single element having one EL layer, or may be a light emitting element having multiple EL layers. The device may be a tandem device in which an EL layer is stacked via a charge generating layer.

[0206] The light emitting element is preferably provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. It can be controlled.

[0207] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon oxynitride film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0208] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / m2 ·day] Below, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, more preferably 1 × 10 -8 [g / m 2 ·day] or less do.

[0209] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0210] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. An inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. Each insulating layer may be formed by

[0211] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, photosensitive resin materials can be used. It is preferable that the side wall of the opening is formed as an inclined surface having a continuous curvature. I wish.

[0212] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0213] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This can suppress the potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward tapered shape or a reverse tapered shape.

[0214] For light-emitting panels that function as electrodes and wiring of transistors or auxiliary electrodes of light-emitting elements, The conductive layer used may be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I ZnO, etc.) or these metal oxide materials containing silicon oxide. It is possible.

[0215] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength band, and a green (G) color filter transmits light in the green wavelength band. A blue (B) color filter that transmits light in the blue wavelength band can be used. Each color layer can be formed using various materials by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using a graphic technique or the like.

[0216] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer to prevent color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, and include, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material containing the light-shielding layer. If the light emitting element is provided in an area other than the light emitting part, unintended light leakage due to guided light can be suppressed. This is preferable.

[0217] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. The insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0218] In addition, when the material for the sealing layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the sealing layer. As the substrate, oxide conductive films such as ITO films and metal films such as Ag films that are thin enough to be transparent are used. It is preferred to use a membrane.

[0219] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when thermocompressed can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal. I wish.

[0220] [Example of manufacturing method] Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 12 and 13. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 11(C)) as an example.

[0221] First, a peeling layer 203 is formed on a fabrication substrate 201, and an insulating layer 813 is formed on the peeling layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 816, and a conductive layer 857 are formed on the insulating layer 813. An edge layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed. In this manner, openings are formed in the insulating layer 821, the insulating layer 817, and the insulating layer 815 (FIG. 12(A)). ).

[0222] In addition, a peeling layer 207 is formed on the fabrication substrate 205, and an insulating layer 843 is formed on the peeling layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are formed on the insulating layer 843. 9 is formed (Figure 12(B)).

[0223] The substrates 201 and 205 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0224] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0225] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0226] The peeling layer 203 and the peeling layer 207 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0227] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0228] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0229] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0230] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0231] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material for the sealing layer 823 is applied to the surface on which the element 230 and the like are provided, and the sealing layer 823 is then applied to the surface on which the element 230 and the like are provided. The fabrication substrate 201 and fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 12( C).

[0232] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are bonded to the adhesive layer 81 1. The manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 13A, the substrate 803 is attached to the conductive layer 803 by using an adhesive layer 841. Although the conductive layer 857 does not overlap with the substrate 803, the conductive layer 857 may overlap with the substrate 803.

[0233] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or fluorinated with a solution or fluoride gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0234] In addition, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Peeling can also be performed by physical force (using a machine, etc.).

[0235] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0236] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0237] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Forming organic resins such as polyolefin, polyamide, polycarbonate, and acrylic, Insulating films, transistors, etc. are formed on the resin. In this case, by heating the organic resin, It can be peeled off at the interface between the substrate and the organic resin. A metal layer is provided, and the metal layer is heated by passing an electric current through the metal layer, and an organic resin is formed at the interface between the metal layer and the organic resin. Peeling may also be performed.

[0238] Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857. (FIG. 13B). In the case where the substrate 803 overlaps with the conductive layer 857, The substrate 803 and adhesive layer 841 are also opened to expose 7 (FIG. 13(C)). The method is not particularly limited, and examples thereof include laser ablation, etching, and ion beam. A sputtering method or the like may be used. Alternatively, an incision may be made in the membrane and a portion of the membrane may be peeled off by physical force.

[0239] In this manner, a light-emitting panel can be manufactured.

[0240] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0241] (Embodiment 3) In this embodiment, a folding LCD panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention will be described. An example of the configuration of a bendable touch panel will be described with reference to FIGS. 14 to 17. For materials that can be used for the layers, refer to Embodiment 2.

[0242] [Configuration example 1] 14(A) is a top view of the touch panel. 14(C) is a cross-sectional view taken along the dashed line in FIG. This is a cross-sectional view between EF.

[0243] As shown in FIG. 14A, the touch panel 390 includes a display unit 301 .

[0244] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. This allows the detection of a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0245] The pixel 302 includes a plurality of sub-pixels (for example, the sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0246] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0247] The touch panel 390 also includes a scan line driver that can supply selection signals to the pixels 302. circuit 303g(1), and an image signal line driving circuit capable of supplying an image signal to the pixel 302. It has a path 303s(1).

[0248] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0249] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. It is electrically connected to the wiring that can be used.

[0250] The control signal is used to select an imaging pixel circuit that reads out the recorded imaging signal, for example. a signal that can initialize the imaging pixel circuit, and a signal that can initialize the imaging pixel circuit Examples of such signals include signals that can determine the time at which the signal is detected.

[0251] The touch panel 390 may provide control signals to the imaging pixels 308. and an image pickup signal line drive circuit 303s(2) that reads out the image pickup signal. .

[0252] As shown in FIG. 14B, the touch panel 390 is formed on a substrate 510 and a substrate 510 facing the substrate 510. The substrate 570 is a substrate for supporting the semiconductor device.

[0253] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0254] The substrates 510 and 570 are preferably made of a material that is inhibited from permeating unintended impurities. For example, if the water vapor permeability is 10 -5 g / m 2 -day or less, preferably 1 0 -6 g / m 2 Materials with a shelf life of 10 days or less can be suitably used.

[0255] Materials with approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, better Preferably 1 x 10 -5 A material having a solubility of 0.1 kJ / K or less can be suitably used.

[0256] The substrate 510 includes a flexible substrate 510b and an insulating substrate 510c that prevents unintended diffusion of impurities into the light emitting element. and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a. It is a laminated body.

[0257] The substrate 570 includes a flexible substrate 570b and an insulating substrate 570c that prevents unintended diffusion of impurities into the light emitting element. layer 570a, and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. It is a laminate.

[0258] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Imide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having the above formula can be used for the adhesive layer.

[0259] The sealing layer 560 bonds the substrate 570 to the substrate 510. The sealing layer 560 is In addition, when light is extracted to the sealing layer 560 side, the sealing layer 560 has a high refractive index. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are mounted on the substrate 51. 0 and the substrate 570.

[0260] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 14 (C)). The subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0261] For example, the subpixel 302R supplies power to the first light-emitting element 350R and the second light-emitting element 350R. (FIG. 14(B)) The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a color layer 367R).

[0262] The light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and a lower electrode 351R. It has an EL layer 353 between upper electrodes 352 (FIG. 14(C)).

[0263] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a second EL layer 353c. An intermediate layer 354 is provided between 53a and the second EL layer 353b.

[0264] The light emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer is particularly It is sufficient if it transmits light having a certain wavelength, for example, red, green, or blue. Alternatively, the light emitted by the light emitting element can be directly transmitted through the light emitting element. Alternatively, a transparent region may be provided.

[0265] For example, the light emitting module 380R includes a first light emitting element 350R and a first color layer 367R. The sealing layer 360 is in contact with the substrate.

[0266] The first colored layer 367R is located so as to overlap the first light emitting element 350R. A part of the light emitted by the optical element 350R is reflected by the sealing layer 360, which also serves as an optical bonding layer, and the first colored layer 367R and is emitted to the outside of the light emitting module 380R as shown by the arrow in the figure. do.

[0267] The touch panel 390 has a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM , and is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0268] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The antireflection layer 367p may be, for example, a circular polarizer.

[0269] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is connected to the transistor 302t. The insulating layer 321 serves to flatten the unevenness caused by the pixel circuit. In addition, the diffusion of impurities into the transistor 302t and the like can be suppressed. An insulating layer having a laminate of layers that can be formed can be applied to the insulating layer 321.

[0270] The touch panel 390 has a light emitting element (for example, a first light emitting element 350R) mounted on an insulating layer 321. has.

[0271] The touch panel 390 has a partition wall 328 overlapping the end of the first lower electrode 351R and an insulating layer 3 21. Also, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided on the substrate 510. It is located on the wall 328.

[0272] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in (B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, different potentials may be applied to the first and second electrodes. The second gate 304 may be provided to the transistor 308t, the transistor 302t, and so on.

[0273] The imaging pixel 308 converts light incident on the photoelectric conversion element 308p and the photoelectric conversion element 308p into a The imaging pixel circuit includes a transistor 308t. include.

[0274] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0275] The touch panel 390 includes wiring 311 through which signals can be supplied, and terminals 319 The wiring 311 is provided to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 319. 1) may have a printed wiring board (PWB) attached.

[0276] The transistors formed in the same process are referred to as transistor 302t and transistor 303. This can be applied to transistors such as transistor 308t. Please refer to the second embodiment.

[0277] In addition to the gate, source, and drain of the transistor, each element constituting the touch panel Materials that can be used for the seed wiring and electrodes include aluminum, titanium, chromium, nickel, and the like. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten A single metal or an alloy containing this as the main component is used as a single layer structure or a laminated structure. For example, a single layer structure of aluminum film containing silicon, or an aluminum film stacked on a titanium film, Two-layer structure with an aluminum film on a tungsten film, two-layer structure with an aluminum film on a tungsten film, copper-magnesium Two-layer structure in which a copper film is laminated on a titanium-aluminum alloy film, and two-layer structure in which a copper film is laminated on a titanium film. a two-layer structure in which a copper film is laminated on a tungsten film; a titanium film or titanium nitride film; An aluminum film or a copper film is laminated on the titanium film or titanium nitride film, and then a three-layer structure in which a titanium film or titanium nitride film is formed on the surface of the substrate; a molybdenum film or molybdenum nitride film; an aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film; Furthermore, there is a three-layer structure in which a molybdenum film or a molybdenum nitride film is formed on top of that. Transparent conductive materials including indium oxide, tin oxide, or zinc oxide may also be used. The use of copper containing silicon is preferable because it improves the controllability of the shape by etching.

[0278] It should be noted that the light-emitting element manufactured in the same process as the above-described light-emitting element (for example, the first light-emitting element 350R, etc.) By providing a light element in the non-display section, it can be used as the light emitting element 22 exemplified in the first embodiment. In addition, an imaging pixel including the above-described photoelectric conversion element 308p and imaging pixel circuit can be By providing an imaging pixel manufactured in the same process as the pixel 308 in the non-display area, The light receiving element 21 shown in FIG.

[0279] [Configuration example 2] 15(A) and (B) are perspective views of the touch panel 505. FIG. 16 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 15(A). be.

[0280] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 15(B)). The touch panel 505 also includes a substrate 510, a substrate 570, and a substrate 590. , the substrate 510, the substrate 570 and the substrate 590 are all flexible.

[0281] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The plurality of wirings 511 are arranged on the periphery of the substrate 510. The terminal 519 is connected to the FPC 509 (1 ) and electrically connect it.

[0282] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is routed around the periphery of the substrate 590, and some of the wiring 598 The terminal is electrically connected to the FPC 509(2). 15B, for clarity, the touch panel 590 is provided on the rear side (the back side of the page) of the substrate 590. The electrodes, wiring, etc. of the sensor 595 are shown by solid lines.

[0283] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The capacitance type includes a surface capacitance type, a projected capacitance type, and the like.

[0284] The projected capacitive type is mainly divided into self-capacitance type and mutual capacitance type, which differ mainly in the driving method. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0285] In the following, when a projected capacitive touch sensor is applied, the following will be explained. This will be explained using:

[0286] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are used. It can be used.

[0287] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 591 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connected to one of the plurality of wirings 598. and electrically connect to any other of the above.

[0288] As shown in FIGS. 15(A) and 15(B), the electrodes 592 are made up of a plurality of electrodes repeatedly arranged in one direction. The shape is such that two quadrilaterals are connected at their corners.

[0289] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It has been done.

[0290] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable to have a shape that minimizes the area of the intersection between the electrode 592 and the wiring 594. This reduces the area of the region where no electrodes are provided, and reduces variations in transmittance. As a result, unevenness in brightness of light passing through the touch sensor 595 can be reduced.

[0291] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes. For example, a plurality of electrodes 591 are arranged with as few gaps as possible, and the electrodes 591 are connected to each other via an insulating layer. 92 may be provided at intervals so as to form an area that does not overlap with the electrode 591. At this time, a dummy electrode 592 is placed between two adjacent electrodes 592, and is electrically insulated from these electrodes. Providing an electrode is preferable because it can reduce the area of the region with different transmittance.

[0292] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and and electrode 592, an insulating layer 593 covering electrode 591 and electrode 592, and adjacent electrodes 591 and a wiring 594 for electrically connecting the

[0293] The adhesive layer 597 adheres the substrate 590 to the touch sensor 595 so that the touch sensor 595 overlaps the display unit 501. It is glued to board 570.

[0294] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. A film containing graphene can also be used. The film containing graphene is, for example, in the form of a film. The graphene oxide film can be formed by reducing the graphene oxide film. Examples of the method include a method of applying heat.

[0295] After forming a film of a light-transmitting conductive material on a substrate 590 by sputtering, By using various patterning techniques such as lithography, unnecessary parts are removed to form electrodes 59. 1 and electrode 592 can be formed.

[0296] The insulating layer 593 may be made of a resin such as acrylic or epoxy. In addition to resins with siloxane bonds, silicon oxide, silicon oxynitride, and aluminum oxide Inorganic insulating materials such as the above may also be used.

[0297] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is formed on the adjacent electrode 591 is electrically connected. The transparent conductive material increases the aperture ratio of the touch panel. Therefore, it can be suitably used for the wiring 594. 2. Materials with higher conductivity can reduce electrical resistance and are therefore suitable for use as wiring 594. can.

[0298] One electrode 592 extends in one direction, and multiple electrodes 592 are provided in a stripe pattern. .

[0299] The wiring 594 is provided to intersect with the electrodes 592 .

[0300] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 is connected to the pair of electrodes 591 are electrically connected.

[0301] The plurality of electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. The angle between the two electrodes may be less than 90 degrees.

[0302] One of the wirings 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 is made of, for example, aluminum, gold, platinum, silver, or the like. , nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or para Metallic materials such as zinc and alloy materials containing such metallic materials can be used.

[0303] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0304] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0305] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) Pic Conductive Paste) can be used.

[0306] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, the resin may have an acrylic, urethane, epoxy, or siloxane bond. Resins such as resins can be used.

[0307] The display unit 501 includes a plurality of pixels arranged in a matrix. The display device includes a pixel circuit that drives the display element.

[0308] In this embodiment, an organic EL element that emits white light is applied to a display element. However, the display element is not limited to this.

[0309] For example, organic EL elements with different luminescent colors can be used as sub-pixels so that the color of light emitted varies from sub-pixel to sub-pixel. It may be applied pixel by pixel.

[0310] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as in the first configuration example.

[0311] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0312] The sub-pixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The light emitting module further includes a pixel circuit including a transistor 502t. 580R includes a first light emitting element 550R and an optical element (eg, a color layer 567R).

[0313] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. .

[0314] The light emitting module 580R has a first colored layer 567R in the light extraction direction.

[0315] In addition, when the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is It contacts the light emitting element 550R and the first colored layer 567R.

[0316] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the optical element 550R passes through the first colored layer 567R and is reflected by the arrows in the figure. The light is emitted to the outside of the light-emitting module 580R in the direction of the arrow.

[0317] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0318] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizer can be used as p.

[0319] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities may be applied to the insulating film 521. This can prevent unexpected impurity diffusion from occurring in the transistor 502t, etc. This can prevent a decrease in reliability.

[0320] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. do.

[0321] The display portion 501 has a partition wall 528 on the insulating film 521, which overlaps with an end portion of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0322] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0323] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 11. In addition, F PC 509(1) is electrically connected to terminal 519.

[0324] A printed wiring board (PWB) may be attached to the FPC509(1). stomach.

[0325] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. can be used for wiring.

[0326] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0327] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0328] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing. The layer is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0329] 16 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0330] For example, a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. The semiconductor layer including the above is used as the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0331] It should be noted that a light-emitting element manufactured in the same process as the above-described light-emitting element (for example, the first light-emitting element 550R, etc.) By providing a light element in the non-display section, it can be used as the light emitting element 22 exemplified in the first embodiment. It is possible.

[0332] [Configuration example 3] 17 is a cross-sectional view of touch panel 505B. The display unit 505B displays the supplied image information on the side where the transistor is provided. The touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of Example 2. The different configuration will be described in detail here. The above description is applicable to the parts where the above configuration can be used.

[0333] The first colored layer 567R is located so as to overlap the first light emitting element 550R. The light emitting element 550R shown in A) emits light toward the side where the transistor 502t is provided. As a result, part of the light emitted by the light emitting element 550R is transmitted through the first colored layer 567R. , and is emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0334] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0335] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 17(A)). ).

[0336] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 5 Glue 95 together.

[0337] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0338] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0339] For example, a semiconductor layer containing polycrystalline silicon or the like is formed as a transistor 5 shown in FIG. 02t and transistor 503t.

[0340] 17 shows a configuration in which a top-gate type transistor is applied to the display unit 501. Illustrated in (C).

[0341] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. do.

[0342] It should be noted that a light-emitting element manufactured in the same process as the above-described light-emitting element (for example, the first light-emitting element 550R, etc.) By providing a light element in the non-display section, it can be used as the light emitting element 22 exemplified in the first embodiment. It is possible.

[0343] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0344] (Fourth embodiment) In this embodiment, a touch panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention is described. An example of a method for driving the panel will be described with reference to the drawings.

[0345] [Example of sensor detection method] FIG. 18A is a block diagram showing the configuration of a mutual capacitance type touch sensor. In (A), a pulse voltage output circuit 601 and a current detection circuit 602 are shown. In (A), an electrode 621 to which a pulse voltage is applied and an electrode 622 to which a change in current is detected are arranged. These are shown as six wires, X1-X6 and Y1-Y6, respectively. A) illustrates a capacitance 603 formed by overlapping electrodes 121 and 122. The functions of electrode 121 and electrode 122 may be interchangeable.

[0346] The pulse voltage output circuit 601 is a circuit for applying pulses to the X1-X6 wirings in sequence. When a pulse voltage is applied to the wirings X1-X6, the electrodes 111, 112, 113, 114, 115, 116, 117, 118, 119, 119, 120, 121, 122, 123, 124, 125, 126, 127, 128, 129, 130, 131 An electric field is generated between the electrodes 21 and 122. The electric field generated between the electrodes is reduced by the capacitance 60 due to shielding or the like. This changes the mutual capacitance of the sensor 3, and is used to detect the proximity or contact of an object to be detected. It is possible.

[0347] The current detection circuit 602 detects the current flowing through the wirings Y1 to Y6 due to the change in mutual capacitance at the capacitor 603. This is a circuit for detecting changes in current. The wiring of Y1-Y6 detects the proximity of the object to be detected, or The detected current value does not change if there is no contact, but the proximity or contact of the object to be detected When the mutual capacitance decreases due to the current flowing through the resistor, a decrease in the current value is detected. This can be done using an integrating circuit or the like.

[0348] Next, FIG. 18(B) shows the input voltage of the mutual capacitance type touch sensor shown in FIG. 18(A). The timing chart of the output waveform is shown in FIG. 18(B). In FIG. 18(B), when the object to be detected is not detected ( Two cases are shown: when the object is detected (touched) and when the object is not detected (touched). For the wiring of Y1-Y6, the waveform is shown as a voltage value corresponding to the detected current value. There are.

[0349] A pulse voltage is applied to the wires X1-X6 in order, and the The waveform in the Y6 wiring changes. When there is no proximity or contact of the object to be detected, X1-X6 The waveforms of Y1-Y6 change uniformly according to the change in the voltage of the wiring. Or, at the contact point, the current value decreases, and the corresponding voltage waveform also changes. do.

[0350] In this way, by detecting the change in mutual capacitance, the proximity or contact of the object to be detected can be detected. It is possible.

[0351] In addition, in FIG. 18(A), a panel in which only a capacitor 603 is provided at the intersection of the wiring as a touch sensor is used. The configuration of a passive type touch sensor has been shown, but an active type with a transistor and a capacitor may also be used. The touch sensor shown in FIG. 19 is an example of one of the sensors included in the active touch sensor. 1 shows an example of a capacitor circuit.

[0352] The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor The transistor 613 has a gate to which a signal G2 is applied, and a source or A voltage VRES is applied to one of the drains, and the other is connected to one electrode of the capacitor 603 and the transistor. The transistor 611 is electrically connected to the gate of the transistor 611. One is electrically connected to one of the source and drain of the transistor 612, and the other is connected to a voltage V The transistor 612 receives a signal G2 at its gate and a signal G3 at its source or drain. The other electrode of the capacitor 603 is electrically connected to the wiring ML. can be obtained.

[0353] Next, the operation of the sensor circuit will be described. First, the signal G2 is output from the transistor 613. When a potential that turns on the transistor 611 is applied, the gate of the transistor 611 is connected to the node A potential corresponding to the voltage VRES is applied to node n. By applying a potential that turns off 613, the potential of the node n is maintained.

[0354] Next, the mutual capacitance of the capacitor 603 changes when a detected object such as a finger approaches or touches the sensor. As a result, the potential of the node n changes from VRES.

[0355] The read operation applies a potential to the signal G1 that turns on the transistor 612. The current flowing through the transistor 611 in accordance with the potential of the node n, that is, the current flowing through the wiring ML, is By detecting this current, it is possible to detect the proximity or contact of an object to be detected. can.

[0356] The transistors 611, 612, and 613 have channels It is preferable to use a transistor in which an oxide semiconductor is used for a semiconductor layer to be formed. By applying such a transistor to the transistor 613, the potential of the node n It is possible to maintain VRES for a long period of time, and the operation of supplying VRES to node n again ( This reduces the frequency of the refresh operation.

[0357] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0358] 10 Electronic equipment 11a Support 11b Support 11c Support 11d Support 11e Support 12 Connection 12a neutral line 13 Display panel 13_1 Display panel 13_2 Display panel 13a Display section 13b Hidden part 14 Detection methods 15 FPC 16 Circuit Board 17 Battery 18 Wiring 21 Photodetector 22 Light-emitting element 23 light 24 areas 25 areas 31 parts 32 parts 33 parts 41 Input button 42 Power button 43 External connection terminal 44 card slots 45 Optical Sensor 46 Camera 47 Light source 48 speakers 49 Mike 51 Antenna 121 Electrode 122 electrodes 201 Fabricated substrate 203 Peeling layer 205 Fabricated substrate 207 Peeling layer 230 Light-emitting element 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 sealing layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 505 touch panel 505B Touch Panel 509 FPC 510 board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Sealing Layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Insulating layer 570b flexible substrate 570c adhesive layer 580R Light Emitting Module 590 PCB 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 601 Pulse voltage output circuit 602 Current detection circuit 603 capacity 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 board 803 board 804 Light-emitting part 806 Drive circuit section 808 FPC 811 Adhesive layer 813 Insulation layer 814 Conductive layer 815 Insulation layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulation layer 822 transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light-emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation Layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

1. a display panel provided with a display unit; An electronic device that can be folded with the display surface of the display panel facing inward, a support member that is disposed on the back side of the display surface when the display panel is unfolded and has an opening; a light receiving element disposed on the back side of the display surface when the display panel is unfolded, When the display panel is unfolded in a plan view, the opening overlaps with the display unit, In a plan view in a state in which the display panel is unfolded, the light receiving element overlaps with the display unit and also overlaps with the opening, the light receiving element has a function of detecting light transmitted through the opening from the display panel side, The display panel is an electronic device having a function of controlling display in accordance with the light detected by the light receiving element.

2. a display panel provided with a display unit; An electronic device that can be folded with the display surface of the display panel facing inward, a support member that is disposed on the back side of the display surface when the display panel is unfolded and has an opening; a light receiving element disposed on the back side of the display surface when the display panel is unfolded, the display panel has greater flexibility than the support; When the display panel is unfolded in a plan view, the opening overlaps with the display unit, In a plan view in a state in which the display panel is unfolded, the light receiving element overlaps with the display unit and also overlaps with the opening, the light receiving element has a function of detecting light transmitted through the opening from the display panel side, The display panel is an electronic device having a function of controlling display in accordance with the light detected by the light receiving element.

3. a display panel provided with a display unit; An electronic device that can be folded with the display surface of the display panel facing inward, a support member that is disposed on the back side of the display surface when the display panel is unfolded and that includes a first portion having an opening; a light receiving element disposed on the back side of the display surface when the display panel is unfolded, When the display panel is unfolded in a plan view, the opening overlaps with the display unit, In a plan view in a state in which the display panel is unfolded, the light receiving element overlaps with the display unit and also overlaps with the opening, the light receiving element is disposed on a second portion of the support; the light receiving element has a function of detecting light transmitted through the opening from the display panel side, The display panel is an electronic device having a function of controlling display in accordance with the light detected by the light receiving element.

4. a display panel provided with a display unit; An electronic device that can be folded with the display surface of the display panel facing inward, a support member that is disposed on the back side of the display surface when the display panel is unfolded and that includes a first portion having an opening; a light receiving element disposed on the back side of the display surface when the display panel is unfolded, the display panel has greater flexibility than the support; When the display panel is unfolded in a plan view, the opening overlaps with the display unit, In a plan view in a state in which the display panel is unfolded, the light receiving element overlaps with the display unit and also overlaps with the opening, the light receiving element is disposed on a second portion of the support; the light receiving element has a function of detecting light transmitted through the opening from the display panel side, The display panel is an electronic device having a function of controlling display in accordance with the light detected by the light receiving element.

Images