Nickel alloy powder
A nickel alloy powder with 1% to 30% Cu and 70% to 99% Ni addresses sintering issues by ensuring uniform alloyed Ni and Cu components, reducing defects in multilayer ceramic chip capacitors.
JP2025117412APending Publication Date: 2025-08-12TOHO TITANIUM CO LTD
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Patent Information
- Application Number
- JP2024012237
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-08-12
AI Technical Summary
Technical Problem
Existing nickel and copper powders used in multilayer ceramic chip capacitors exhibit different sintering behaviors, leading to defects such as delamination and cracks due to segregated states and localized resistivity differences, necessitating a nickel alloy powder with a higher sintering initiation temperature.
Method used
A nickel alloy powder containing 1% to 30% Cu and 70% to 99% Ni, with a shrinkage rate reaching 3% at 380°C or higher, ensuring alloyed Ni and Cu components for uniform sintering.
Benefits of technology
The nickel alloy powder achieves uniform sintering with reduced defects, suitable for forming internal electrode layers in multilayer ceramic chip capacitors.
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Abstract
To provide a nickel alloy powder having a relatively high sintering start temperature.SOLUTION: A nickel alloy powder of the present invention comprises nickel alloy particles containing 1 to 30 mass% of Cu and 70 to 99 mass% of Ni, and exhibits a temperature of 380°C or higher at which shrinkage reaches 3%, in thermomechanical analysis (TMA).SELECTED DRAWING: None
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Citation Information
Patent Citations
Nickel particles, conductive paste, internal electrodes and multilayer ceramic capacitors
JP6799936B2