Disk device

Abstract

To provide a disk device capable of suppressing components from peeling off from an adhesive material.SOLUTION: A disk device according to one embodiment includes an electronic component, a flexible printed circuit board, a first adhesive, a member, and a first bonding layer. The flexible printed circuit board has a first surface facing the electronic component, a second surface opposite the first surface, and a pad provided on the first surface and connected to the electronic component by a conductive conjugate. The first adhesive is provided on the second surface. The member has a third surface facing the second surface. The first bonding layer is provided on the third surface, fits into a recess on the third surface, and adheres to the second surface by the first adhesive.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a disk drive. [Background technology]

[0002] A disk device such as a hard disk drive (HDD) has a flexible printed circuit (FPC), electronic components connected to the FPC by conductive bonding materials, and members bonded to the FPC. For example, a flexure is connected to the FPC by solder, and a metal stiffener is bonded to the FPC. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 3940652 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, when the bonded assembly is heated, the components may peel off from the adhesive that bonds them to the FPC.

[0005] One example of a problem to be solved by the present invention is to provide a disk drive that can prevent components from peeling off from an adhesive. [Means for solving the problem]

[0006] A disk drive according to one embodiment includes an electronic component, a flexible printed circuit board, a first adhesive, a member, and a first bonding layer. The flexible printed circuit board has a first surface facing the electronic component, a second surface opposite the first surface, and a pad provided on the first surface and connected to the electronic component by a conductive bonding material. The first adhesive is provided on the second surface. The member has a third surface facing the second surface. The first bonding layer is provided on the third surface, fills a recess in the third surface, and is fixed to the second surface by the first adhesive. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is an exemplary perspective view showing an exploded HDD according to the first embodiment. [Figure 2] FIG. 2 is an exemplary exploded view schematically illustrating the FPC and the flexure according to the first embodiment. [Figure 3] FIG. 3 is an exemplary plan view that schematically illustrates a part of the carriage, the FPC, and the flexure according to the first embodiment. [Figure 4] FIG. 4 is an exemplary cross-sectional view schematically illustrating a part of the carriage and the FPC according to the first embodiment, taken along line F4-F4 in FIG. [Figure 5] FIG. 5 is an exemplary cross-sectional view that schematically illustrates a part of the carriage and the FPC according to the second embodiment. [Figure 6] FIG. 6 is an exemplary cross-sectional view that schematically illustrates a part of the carriage and the FPC according to the third embodiment. [Figure 7] FIG. 7 is an exemplary plan view that schematically illustrates a carriage, an FPC, and a part of a flexure according to the fourth embodiment. [Figure 8] FIG. 8 is an exemplary cross-sectional view schematically illustrating a part of the carriage and the FPC according to the fourth embodiment, taken along line F8-F8 in FIG. [Figure 9] FIG. 9 is an exemplary cross-sectional view schematically illustrating a carriage and an FPC according to the fifth embodiment. [Figure 10] FIG. 10 is an exemplary plan view that schematically illustrates a carriage, an FPC, and a part of a flexure according to the sixth embodiment. [Figure 11] FIG. 11 is an exemplary plan view schematically illustrating a carriage, an FPC, and a part of a flexure according to the seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] (First embodiment) The first embodiment will be described below with reference to FIGS. 1 to 4. In this specification, components according to the embodiment and descriptions of the components may be described using multiple expressions. The components and their descriptions are merely examples and are not limited by the expressions in this specification. The components may also be identified by names different from those in this specification. Furthermore, the components may also be described using expressions different from those in this specification.

[0009] In the following description, "suppress" is defined as, for example, preventing an event, action, or influence from occurring, or reducing the severity of an event, action, or influence. Also, in the following description, "restrict" is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a predetermined range and preventing movement or rotation beyond the predetermined range.

[0010] 1 is an exemplary exploded perspective view showing a hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of a disk device, and may also be called an electronic device, a storage device, an external storage device, or a magnetic disk device.

[0011] 1, the HDD 10 includes a housing 11, multiple magnetic disks 12, a spindle motor 13, a head stack assembly (HSA) 14, a voice coil motor (VCM) 15, a ramp load mechanism 16, and a printed circuit board (PCB) 17. Note that the HDD 10 is not limited to this example.

[0012] The housing 11 accommodates the magnetic disk 12, the spindle motor 13, the HSA 14, the VCM 15, and the ramp load mechanism 16. The housing 11 has a base 21, an inner cover 22, and an outer cover .

[0013] The base 21 is formed in the shape of a substantially rectangular parallelepiped box that is open in one direction. The base 21 has a bottom wall 25 and side walls 26. The bottom wall 25 is formed in the shape of a substantially rectangular (quadrilateral) plate. The side walls 26 protrude from the edges of the bottom wall 25 and are formed in the shape of a substantially rectangular frame.

[0014] The inner cover 22 is attached to the end of the side wall 26 by, for example, screws, and closes the space inside the base 21. The outer cover 23 covers the inner cover 22 and is attached to the end of the side wall 26 by, for example, welding. A vent 27 is provided in the inner cover 22. Furthermore, a vent 28 is provided in the outer cover 23.

[0015] After components are attached inside base 21 and inner cover 22 and outer cover 23 are attached to base 21, the air inside housing 11 is evacuated through vent holes 27 and 28. Furthermore, the inside of housing 11 is filled with a gas other than air.

[0016] The gas filled inside the housing 11 is, for example, a low-density gas having a density lower than that of air, an inert gas having low reactivity, etc. For example, helium is filled inside the housing 11. Note that the housing 11 may also be filled with other fluids.

[0017] The vent hole 28 in the outer cover 23 is closed by a seal 29. The seal 29 airtightly seals the vent hole 28 and restricts the fluid filled inside the housing 11 from leaking out through the vent hole 28.

[0018] The plurality of magnetic disks 12 are formed in a substantially circular disk shape. A magnetic recording layer is provided on at least one of the upper and lower surfaces of the magnetic disks 12. The plurality of magnetic disks 12 are stacked with gaps between them.

[0019] The spindle motor 13 supports the plurality of magnetic disks 12. The spindle motor 13 rotates the plurality of magnetic disks 12 around a central axis Axd of the spindle motor 13. The plurality of magnetic disks 12 are held on a hub of the spindle motor 13 by, for example, a clamp spring.

[0020] The HSA 14 is rotatably supported by a support shaft 31. The support shaft 31 is provided at a position spaced apart from the magnetic disk 12 in a direction perpendicular to the central axis Axd. The support shaft 31 protrudes from the bottom wall 25 of the housing 11.

[0021] The HSA 14 can rotate around a central axis Axh. The central axis Axh is an imaginary axis that extends substantially parallel to the central axis Axd of the magnetic disk 12. The central axis Axh is, for example, the center of rotation of the HSA 14 and also the central axis of the support shaft 31.

[0022] The HSA 14 has a carriage 35, a plurality of head gimbal assemblies (HGA) 36, and a flexible printed circuit board (FPC) 37. The carriage 35 has an actuator block 41 and a plurality of arms 42.

[0023] The actuator block 41 is rotatably supported on the support shaft 31 via, for example, a bearing. The arms 42 protrude from the actuator block 41 in a direction perpendicular to the central axis Axh. Note that the carriage 35 may be divided, and an arm 42 may protrude from each of the multiple actuator blocks 41.

[0024] The arms 42 extend substantially parallel to one another and are spaced apart along the central axis Axh. Each arm 42 is formed in a plate shape that can enter the gap between two adjacent ones of the magnetic disks 12.

[0025] The voice coil of the VCM 15 is attached to the actuator block 41. The support shaft 31 is located between the arm 42 and the voice coil. The VCM 15 has the voice coil, a pair of yokes, and a magnet provided in the yokes.

[0026] The multiple HGAs 36 are attached to the tip of a corresponding one of the multiple arms 42. As a result, the multiple HGAs 36 are arranged at intervals along the central axis Axh. Each of the multiple HGAs 36 has a base plate 51, a load beam 52, a flexure 53, and a magnetic head 54. The flexure 53 is an example of an electronic component. The magnetic head 54 may also be referred to as a slider.

[0027] The base plate 51 is formed in a plate shape and is attached to the tip of the arm 42. The load beam 52 is formed in a plate shape that is thinner than the base plate 51. The load beam 52 is attached to the base plate 51 so as to protrude therefrom.

[0028] The flexure 53 is a type of flexible printed wiring board formed in a long, thin strip shape, and includes, for example, a metal backing layer, an insulating base layer, a conductive layer, and an insulating cover layer.

[0029] 2 is an exemplary exploded view schematically illustrating the FPC 37 and the flexure 53 according to the first embodiment. As shown in FIG. 2, the flexure 53 includes, for example, a gimbal 61, a tail 62, a plurality of pads 63, and a plurality of wirings 64.

[0030] The gimbal 61 is provided at one end of the flexure 53. The magnetic head 54 is mounted on the gimbal 61. The gimbal 61 is attached to the load beam 52 so that the portion of the gimbal 61 on which the magnetic head 54 is mounted is rotatable.

[0031] The tail 62 is provided at the other end of the flexure 53. The tail 62 extends, for example, along the arm 42. The pad 63 and the wiring 64 are provided on the conductive layer of the flexure 53.

[0032] A plurality of pads 63 are arranged on the tail 62. The pads 63 are arranged at intervals in the longitudinal direction of the tail 62 to form flying leads. A plurality of wirings 64 extend between the gimbal 61 and the tail 62. Each of the plurality of wirings 64 electrically connects at least one of the pads 63 to a read element, a write element, a heater, or other components of the magnetic head 54.

[0033] The FPC 37 is formed, for example, in a strip shape. The FPC 37 has two joints 71 and 72, a flexible portion 73, and a plurality of pads 74. As shown in FIG. 1 , the joint 71 is provided at one end of the FPC 37 and is attached to the actuator block 41. The joint 72 is provided at the other end of the FPC 37 and is attached to the bottom wall 25 of the base 21. The flexible portion 73 is provided between the joints 71 and 72 and bends elastically in response to rotation of the HSA 14.

[0034] As shown in FIG. 2, a plurality of pads 74 are provided on the joint portion 71. The pads 63 of the plurality of flexures 53 are joined to the plurality of pads 74 by solder 75. That is, the pads 74 are connected to the flexure 53 by the solder 75. In this way, the flexure 53 electrically connects the FPC 37 and the magnetic head 54. The solder 75 is an example of a conductive joint. The joint may be another joint such as a conductive adhesive.

[0035] 1 rotates the carriage 35 around the central axis Axh. By rotating around the central axis Axh, the carriage 35 moves the magnetic head 54 to a desired position on the magnetic disk 12. The magnetic head 54 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 54 reads and writes information from and to the magnetic disk 12.

[0036] When the magnetic head 54 moves to the outermost periphery of the magnetic disk 12 due to the rotation of the carriage 35 by the VCM 15, the ramp load mechanism 16 holds the HGA 36. When the HGA 36 is held by the ramp load mechanism 16, the magnetic head 54 is spaced apart from the magnetic disk 12.

[0037] The PCB 17 is, for example, a rigid board such as a glass epoxy board, and is a multi-layer board or a build-up board, etc. The PCB 17 is disposed outside the housing 11 and attached to the bottom wall 25 of the base 21.

[0038] Various electronic components are mounted on the PCB 17, such as a relay connector connected to the FPC 37, an interface (I / F) connector connected to a host computer, and a controller that controls the operation of the HDD 10. The relay connector is electrically connected to a joint 72 of the FPC 37 via a connector provided on the bottom wall 25, for example.

[0039] The PCB 17 is electrically connected to the magnetic head 54 through the FPC 37 and the flexure 53. A controller on the PCB 17 controls the magnetic head 54 to read and write information from and to the magnetic disk 12.

[0040] FIG. 3 is an exemplary plan view schematically illustrating a portion of the carriage 35, the FPC 37, and the flexure 53 according to the first embodiment. FIG. 4 is an exemplary cross-sectional view schematically illustrating a portion of the carriage 35 and the FPC 37 according to the first embodiment, taken along line F4-F4 in FIG. 3. As shown in FIG. 4, the joint 71 of the FPC 37 has two surfaces 71a and 71b. The surface 71a is an example of a first surface. The surface 71b is an example of a second surface.

[0041] As shown in Fig. 3, the pads 74 are provided on one surface 71a. Therefore, the surface 71a faces the tails 62 of the flexures 53. As shown in Fig. 4, the other surface 71b is located on the opposite side of the surface 71a. The surface 71b faces the actuator block 41 of the carriage 35.

[0042] The FPC 37 has, for example, a base layer 81, a conductive layer 82, two cover layers 83 and 84, and two adhesive layers 85 and 86. Note that the FPC 37 is not limited to this example and may have fewer or more layers. The bonding portion 71, the bonding portion 72, and the flexible portion 73 each partially have the base layer 81, the conductive layer 82, the cover layers 83 and 84, and the adhesive layers 85 and 86.

[0043] The base layer 81 and the cover layers 83, 84 are made of an insulating synthetic resin such as polyimide (PI). However, the base layer 81 and the cover layers 83, 84 are not limited to this example and may be made of different materials.

[0044] The base layer 81 has two surfaces 81a and 81b. The surface 81a faces the tail 62 of the flexure 53. The other surface 81b is located opposite the surface 81a and faces the actuator block 41 of the carriage 35.

[0045] The conductive layer 82 is provided on the surface 81a of the base layer 81. The conductive layer 82 is bonded to the surface 81a of the base layer 81, for example, by an adhesive that is integrated with the base layer 81. Note that the conductive layer 82 is not limited to this example. Furthermore, the FPC 37 may further have another conductive layer provided on the other surface 81b.

[0046] The conductive layer 82 is made of a conductive material such as copper foil. The conductive layer 82 has a plurality of pads 74. Furthermore, as shown in FIG. 3, the conductive layer 82 has a plurality of wirings 87 and a ground plane 88. Each of the plurality of wirings 87 transmits an electrical signal, supplies power, or is set to a ground potential, for example. The ground plane 88 is provided along the surface 81 a and is set to a ground potential.

[0047] 4, the cover layer 83 covers the surface 81a of the base layer 81 and the conductive layer 82. For example, the cover layer 83 and the pad 74 of the conductive layer 82 form the surface 71a of the joint 71. The cover layer 84 covers the surface 81b of the base layer 81. The cover layer 84 forms the surface 71b of the joint 71. Note that the surfaces 71a and 71b are not limited to this example.

[0048] The adhesive layers 85 and 86 are made of, for example, an acrylic adhesive. The adhesive layer 85 bonds the cover layer 83 to the surface 81a of the base layer 81 and the conductive layer 82. The adhesive layer 86 bonds the cover layer 84 to the surface 81b of the base layer 81.

[0049] 3, the HSA 14 further includes a plurality of preamplifiers 91, a reinforcing plate 92, and a plurality of screws 93. The preamplifiers 91 may also be referred to as head ICs or head amplifiers. The reinforcing plate 92 is an example of a member and a metal member.

[0050] The preamplifier 91 is mounted on the surface 71a of the joint 71. The preamplifier 91 is electrically connected to the PCB 17 through at least one of the plurality of wirings 87. Furthermore, the preamplifier 91 is electrically connected to the plurality of pads 74 through at least one of the plurality of wirings 87.

[0051] The preamplifier 91 amplifies, for example, a write signal transmitted from the PCB 17 to the FPC 37 toward the magnetic head 54, and a read signal transmitted from the magnetic head 54 to the FPC 37 toward the PCB 17. The write signal corresponds to information that the magnetic head 54 writes to the magnetic disk 12. The read signal corresponds to information that the magnetic head 54 reads from the magnetic disk.

[0052] The reinforcing plate 92 is made of a metal such as stainless steel or an aluminum alloy and is formed into a plate shape. However, the reinforcing plate 92 is not limited to this example. The reinforcing plate 92 has higher rigidity than the FPC 37.

[0053] 4, the reinforcing plate 92 has two surfaces 92a and 92b. The surface 92a is an example of a third surface and a first outer surface. The surface 92b is an example of a fourth surface and a second outer surface.

[0054] One surface 92a faces the surface 71b of the joint 71. The other surface 92b is located opposite the surface 92a. At least a portion of the surface 92b faces the actuator block 41 of the carriage 35.

[0055] The reinforcing plate 92 is partially bent. Therefore, the reinforcing plate 92 has a flat portion 95 and a guide portion 96. Note that the reinforcing plate 92 is not limited to this example. The flat portion 95 and the guide portion 96 each partially have surfaces 92a and 92b, respectively.

[0056] The flat portion 95 is formed in a substantially flat plate shape. The flat portion 95 is disposed between the actuator block 41 of the carriage 35 and the joint portion 71 of the FPC 37. The flat portion 95 supports the tail 62 of the flexure 53 and the preamplifier 91 via the FPC 37.

[0057] The guide portion 96 extends from the edge of the flat portion 95 and is bent relative to the flat portion 95. For convenience, the guide portion 96 shown in FIG. 3 is not bent and extends straight from the flat portion 95.

[0058] As shown in FIG. 4, the surface 92a of the reinforcing plate 92 has a flat surface 92c, an inclined surface 92d, and a curved surface 92e. The inclined surface 92d may be omitted from the surface 92a. The flat surface 92c is provided on the flat portion 95 and is formed to be approximately flat. The inclined surface 92d and the curved surface 92e are provided on the guide portion 96. The inclined surface 92d is inclined with respect to the flat surface 92c. The curved surface 92e is provided between the flat surface 92c and the inclined surface 92d and is continuous with the flat surface 92c and the inclined surface 92d. The curved surface 92e is a curved surface bent in an approximately arc shape.

[0059] For convenience, the X-axis, Y-axis, and Z-axis are defined below. The X-axis, Y-axis, and Z-axis are perpendicular to each other. The X-axis is aligned along the width of the plane 92c. The Y-axis is aligned along the length of the plane 92c. The Z-axis is aligned perpendicular to the plane 92c.

[0060] Furthermore, in this specification, the X direction, Y direction, and Z direction are defined. The X direction is a direction along the X axis, and includes the +X direction indicated by the X axis arrow and the -X direction opposite to the X axis arrow. The Y direction is a direction along the Y axis, and includes the +Y direction indicated by the Y axis arrow and the -Y direction opposite to the Y axis arrow. The Z direction is a direction along the Z axis, and includes the +Z direction indicated by the Z axis arrow and the -Z direction opposite to the Z axis arrow.

[0061] 3, the pads 74 are arranged near the end of the joint 71 in the +Y direction. The pads 63, 74 are aligned in the Y direction. The guide portion 96 of the reinforcing plate 92 extends from the end of the flat portion 95 in the -Y direction.

[0062] A through hole 97 is provided in the guide portion 96. The through hole 97 extends substantially in the X direction along the edge of the flat portion 95. The through hole 97 passes through the guide portion 96 and makes it easier to bend the guide portion 96. Note that the through hole 97 may be omitted from the guide portion 96.

[0063] The screw 93 penetrates the joint portion 71 of the FPC 37 and the flat portion 95 of the reinforcing plate 92, and is coupled to the actuator block 41 of the carriage 35. In this way, the screw 93 attaches the joint portion 71 and the flat portion 95 to the actuator block 41. Two screws 93 are disposed at both ends of the joint portion 71 and the flat portion 95 in the X direction.

[0064] As shown in Figure 4, the HSA 14 further includes two bonding layers 101 and 102 and an adhesive 103. The bonding layer 101 is an example of a first bonding layer. The bonding layer 102 is an example of a second bonding layer. The adhesive 103 is an example of a first adhesive.

[0065] The bonding layers 101 and 102 are organic compounds, such as primers. The bonding layers 101 and 102 may also be films made of other organic materials. The bonding layer 101 is provided on one surface 92a of the reinforcing plate 92 and is directly attached to the surface 92a. The bonding layer 102 is provided on the other surface 92b of the reinforcing plate 92 and is directly attached to the surface 92b.

[0066] The adhesive 103 is, for example, an acrylic adhesive. However, the adhesive 103 is not limited to this example and may be made of other organic materials such as polyolefin. The adhesive 103 is provided on the surface 71b of the joint portion 71.

[0067] The adhesive 103 bonds the bonding layer 101 to the surface 71b of the joint 71. In other words, the adhesive 103 bonds the surface 92a of the reinforcing plate 92, on which the bonding layer 101 is provided, to the surface 71b of the joint 71.

[0068] The adhesive 103 adheres more easily to the bonding layers 101 and 102 than to the surface 92a of the reinforcing plate 92 made of stainless steel or an aluminum alloy. For example, the reinforcing plate 92 provided with the bonding layer 101 adheres strongly to the adhesive 103 by non-covalent bonds such as hydrogen bonds.

[0069] The bonding layer 101 has two surfaces 101a and 101b. The surface 101a is an example of a fifth surface. The surface 101b is an example of a sixth surface. One surface 101a is directly attached to the surface 92a of the reinforcing plate 92. The other surface 101b is located opposite the surface 101a and is directly attached to the adhesive 103.

[0070] The bonding layer 101 penetrates into fine depressions 105 present on the surface 92a of the reinforcing plate 92. On the other hand, the surface 101b of the bonding layer 101 has a lower surface roughness than the surface 92a of the reinforcing plate 92. Therefore, the bonding layer 101 adheres to the adhesive 103 with almost no gaps and strengthens the bond between the reinforcing plate 92 and the adhesive 103 through an anchor effect. The bonding layer 102 also penetrates into fine depressions 106 present on the surface 92b of the reinforcing plate 92. The depressions 105 and 106 are formed by minute irregularities that cause surface roughness on the surfaces 92a and 92b and are shown exaggerated in the drawings.

[0071] Gaps are unlikely to occur between the bonding layer 101 and the surface 92a of the reinforcing plate 92. Gaps are also unlikely to occur between the bonding layer 101 and the adhesive 103. Therefore, moisture is unlikely to exist between the bonding layer 101 and the reinforcing plate 92, and between the bonding layer 101 and the adhesive 103.

[0072] In this embodiment, the FPC 37, bonding layer 101, and adhesive 103 cover the entire surface 92a of one of the stiffening plates 92. That is, the bonding layer 101 is provided over the entire surface 92a of the stiffening plate 92. The adhesive 103 adheres to the entire surface 101b of the bonding layer 101. The adhesive 103 bonds the entire surface 101b of the bonding layer 101 and the FPC 37 to each other. In this embodiment, the FPC 37 also covers the through-hole 97.

[0073] The joint portion 71 has a flat portion 111 and a bent portion 112. The flat portion 111 is fixed to the flat portion 95 of the reinforcing plate 92 with an adhesive 103. The bent portion 112 extends from an end of the flat portion 111 in the -Y direction and is bonded to the guide portion 96 of the reinforcing plate 92. In other words, the bent portion 112 is fixed to the curved surface 92e via the adhesive 103 and the bonding layer 102. The bent portion 112 is connected to the flexible portion 73.

[0074] When the carriage 35 rotates around the central axis Axh, the reinforcing plate 92 also rotates around the central axis Axh. The flexible portion 73 of the FPC 37 elastically deforms in response to the rotation of the reinforcing plate 92. Because the bent portion 112 of the FPC 37 is bonded to the entire inclined surface 92d and curved surface 92e of the guide portion 96, the bonding area between the FPC 37 and the guide portion 96 is increased. This improves the ability of the flexible portion 73 to follow the rotation of the carriage 35.

[0075] 3, a portion of the wiring 87 and a portion of the ground plane 88 are provided in the bent portion 112. A portion of the wiring 87 extends so as to cross the through-hole 97 of the guide portion 96. A portion of the ground plane 88 is provided between both ends of the bent portion 112 in the X direction and the plurality of wirings 87. Note that the wirings 87 and the ground plane 88 are not limited to this example.

[0076] 4, the bonding layer 102 contacts the actuator block 41 of the carriage 35 and is disposed between the reinforcing plate 92 and the actuator block 41. The reinforcing plate 92 is supported by the actuator block 41 via the bonding layer 102. Almost the entire bonding layer 102 is covered by the actuator block 41. Note that the bonding layer 102 may be covered by another member or may be spaced apart from the actuator block 41.

[0077] During the assembly of the HDD 10, the pad 65 of the flexure 53 is joined to the pad 74 of the FPC 37 by the solder 75. For example, a paste containing the solder 75 is applied to one of the pads 65, 74. Next, the tail 62 of the flexure 53 and the joint portion 71 of the FPC 37 are overlapped, and the paste is attached to the other of the pads 65, 74.

[0078] Next, for example, a laser beam is irradiated onto the tail 62 and the joint 71. The laser beam is an area laser, and is irradiated onto a relatively wide range of the tail 62 and the joint 71. Note that the laser beam is not limited to this example.

[0079] The laser light is irradiated onto the tail 62 and the joint 71, and also onto the solder 75 through, for example, a hole provided in the tail 62. Heat is transferred from the tail 62 and the joint 71 heated by the laser light to the solder 75. Furthermore, the solder 75 is directly heated by the laser light. This melts the paste, and the pad 65 and the pad 74 are joined by the solder 75. Meanwhile, the joint 71 heated by the laser light dissipates heat to the reinforcing plate 92.

[0080] If the bonding strength of the adhesive 103 between the joint 71 and the reinforcing plate 92 is weak, there is a risk of delamination occurring between the reinforcing plate 92 and the adhesive 103 due to, for example, moisture. A gap between the reinforcing plate 92 and the adhesive 103 hinders heat conduction from the joint 71 to the reinforcing plate 92. In this case, there is a risk that the joint 71 will become excessively heated, causing delamination between the conductive layer 82 and the base layer 81 or burning the joint 71.

[0081] In the HDD 10 of this embodiment, the bonding layer 101 strengthens the bonding strength of the adhesive 103, thereby preventing the reinforcing plate 92 from peeling off from the adhesive 103. This allows the joint 71 to dissipate heat through the reinforcing plate 92, thereby preventing delamination between the conductive layer 82 and the base layer 81 and preventing the joint 71 from burning.

[0082] The bonding layers 101 and 102 strengthen the bonding strength of the adhesive 103, but are prone to adhesion of contaminants such as dust. Furthermore, contaminants that adhere to the bonding layers 101 and 102 are difficult to remove by cleaning. In the HDD 10 of this embodiment, the entire surface 101a of the bonding layer 101 is covered with the FPC 37 and the adhesive 103, thereby preventing contaminants from adhering to the bonding layer 101. Furthermore, the bonding layer 102 is covered by the actuator block 41 of the carriage 35, and is therefore protected from contaminants by the actuator block 41.

[0083] In the HDD 10 according to the first embodiment described above, the FPC 37 has a surface 71a, a surface 71b, and pads 74. The surface 71a faces the flexure 53. The surface 71b is located on the opposite side of the surface 71a. The pads 74 are provided on the surface 71a and connected to the flexure 53 by solder 75. The adhesive 103 is provided on the surface 71b. The reinforcing plate 92 has a surface 92a facing the surface 71b.

[0084] The bonding layer 101 is provided on the surface 92a, penetrates into the recesses 105 in the surface 92a, and is fixed to the surface 71b by the adhesive 103. This allows the bonding layer 101 to strengthen the bond between the reinforcing plate 92 and the adhesive 103, for example, by an anchor effect.

[0085] The solder 75 is heated during bonding. The bonding layer 101 increases the bonding strength of the adhesive 103. Therefore, the bonding layer 101 can prevent the reinforcing plate 92 from peeling off from the adhesive 103, for example, when the solder 75 is heated. Because the reinforcing plate 92 remains fixed to the FPC 37 by the adhesive 103, heat from the FPC 37 can be dissipated, and thus damage to the FPC 37 due to heat can be prevented.

[0086] The housing 11 accommodates the flexure 53, the FPC 37, the adhesive 103, the reinforcing plate 92, and the bonding layer 101. The magnetic disk 12 is accommodated in the housing 11. The magnetic head 54 is configured to read and write information from and to the magnetic disk 12. The carriage 35 is configured to move the magnetic head 54 by rotating. The flexure 53 is connected to the pads 74 by solder 75, and electrically connects the FPC 37 and the magnetic head 54. The reinforcing plate 92 is attached to the carriage 35.

[0087] The solder 75 connecting the pads 74 of the FPC 37 and the flexure 53 is heated, for example, by irradiation with laser light. The bonding layer 101 increases the bonding strength of the adhesive 103. Therefore, the bonding layer 101 can prevent the reinforcing plate 92 from peeling off from the adhesive 103 when the solder 75 is heated, for example.

[0088] The stiffener plate 92 has a surface 92b opposite the surface 92a and facing the carriage 35. The bonding layer 102 is provided on the surface 92b and extends into a recess 106 in the surface 92b.

[0089] The bonding layers 101 and 102 are provided on both surfaces 92a and 92b of the reinforcing plate 92. Therefore, the material for the bonding layers 101 and 102 can be more easily applied to the reinforcing plate 92 by, for example, dipping, compared to when the bonding layer 102 is not provided on the surface 92b. This makes it easier to manufacture the HDD 10.

[0090] The bonding layer 101 is provided over the entire surface 92a. Therefore, compared to when the bonding layer 101 is provided only on a portion of the surface 92a, for example, there is no need to provide a mask on the surface 92a, and the bonding layer 101 can be easily applied to the surface 92a. This makes the HDD 10 easier to manufacture.

[0091] Bonding layer 101 has surface 101a that adheres to surface 92a and surface 101b located opposite surface 101a. Adhesive 103 adheres to the entire surface 101b. That is, adhesive 103 covers the entire bonding layer 101. Therefore, adhesive 103 can prevent contaminants from adhering to bonding layer 101, and ultimately prevent the interior of housing 11 from becoming contaminated.

[0092] The adhesive 103 bonds the entire surface 101b to the FPC 37. That is, the FPC 37 covers the entire bonding layer 101. Therefore, the FPC 37 can prevent contaminants from adhering to the bonding layer 101, and thus can prevent the inside of the housing 11 from being contaminated.

[0093] The surface 92a has a flat surface 92c and a curved surface 92e that is continuous with the flat surface 92c. The FPC 37 has a ground plane 88. A portion of the ground plane 88 is provided at a bent portion 112 of the FPC 37 that is fixed to the curved surface 92e via an adhesive 103 and a bonding layer 101.

[0094] The curved surface 92e bends the FPC 37, generating an elastic force in the FPC 37. Therefore, in a typical HDD, the curved surface is difficult to adhere to the FPC and is partially exposed. However, in this embodiment, the bonding layer 101 increases the bonding strength of the adhesive 103, so the FPC 37 can be fixed to the curved surface 92e via the adhesive 103 and the bonding layer 101. In the HDD 10 of this embodiment, the FPC 37 extends over the entire curved surface 92e, thereby expanding the ground plane 88. Therefore, the electrical characteristics of the FPC 37 can be improved.

[0095] The magnetic disk 12 is housed in the housing 11. The magnetic head 54 is configured to read and write information from and to the magnetic disk 12. The carriage 35 is configured to move the magnetic head 54 by rotating. The FPC 37 has pads 74. The flexure 53 is joined to the pads 74 with solder 75 and electrically connects the FPC 37 and the magnetic head 54. The reinforcing plate 92 has surfaces 92a and 92b. The surface 92a faces the FPC 37 and is entirely covered by the FPC 37. The surface 92b is located opposite the surface 92a and faces the carriage 35. The reinforcing plate 92 is attached to the carriage 35.

[0096] Metal surfaces 92a, 92b of the reinforcing plate 92 are generally rougher than surfaces 71a, 71b of the FPC 37, and contaminants tend to adhere to them. However, the entire surface 92a of the reinforcing plate 92 is covered by the FPC 37. This prevents contaminants from adhering to the surface 92a of the HDD 10, and ultimately prevents the interior of the housing 11 from becoming contaminated.

[0097] The bonding layer 101 includes an organic compound and is directly attached to the surface 92a, thereby strengthening the bond between the reinforcing plate 92 and the adhesive 103, for example, by non-covalent bonding.

[0098] (Second embodiment) The second embodiment will be described below with reference to Fig. 5. In the following description of the embodiments, components having the same functions as components already described are given the same reference numerals as the components already described, and further description may be omitted. Furthermore, components given the same reference numerals do not necessarily have all the same functions and properties, and may have different functions and properties according to each embodiment.

[0099] 5 is an exemplary cross-sectional view schematically illustrating a portion of the carriage 35 and the FPC 37 according to the second embodiment. As shown in FIG. 5, in the second embodiment, the HSA 14 does not have the bonding layer 102. Therefore, the surface 92b of the reinforcing plate 92 contacts the actuator block 41 of the carriage 35.

[0100] For example, the reinforcing plate 92 is made from a single metal plate. For example, the metal plate is dipped in the material of the bonding layer 101 to apply the material. Before the dipping, a mask is provided on one surface of the metal plate, which will become surface 92b. This allows the bonding layer 101 to be formed on surface 92a, but the bonding layer 102 is not formed on surface 92b.

[0101] The reinforcing plate 92 is cut out from the metal plate. Therefore, no bonding layer is provided on the edges of the reinforcing plate 92. The cut-out reinforcing plate 92 is bent to provide the flat portion 95 and the guide portion 96 on the reinforcing plate 92.

[0102] In the HDD 10 of the second embodiment described above, the reinforcing plate 92 has a surface 92b located on the opposite side of the surface 92a and in contact with the carriage 35. In other words, the surface 92b is in direct contact with the carriage 35 and is not covered by the bonding layer 102. Therefore, the HDD 10 can prevent contaminants from adhering to the bonding layer 102, and therefore can prevent the inside of the housing 11 from becoming contaminated.

[0103] (Third embodiment) The third embodiment will be described below with reference to FIG. 6. FIG. 6 is an exemplary cross-sectional view that schematically illustrates a portion of a carriage 35 and an FPC 37 according to the third embodiment. As shown in FIG. 6, the HSA 14 of the third embodiment further includes an adhesive 301. The adhesive 301 is an example of a second adhesive.

[0104] The adhesive 301 is an acrylic adhesive, similar to the adhesive 103. However, the adhesive 301 may be different from the adhesive 103. The adhesive 301 bonds the bonding layer 102 and the actuator block 41 of the carriage 35 to each other.

[0105] In this embodiment, the adhesive 301 is interposed between the entire bonding layer 102 and the carriage 35. Therefore, the adhesive 301 covers the entire bonding layer 102. Note that the adhesive 301 may cover only a portion of the bonding layer 102.

[0106] In the HDD 10 of the third embodiment described above, the adhesive 301 bonds the bonding layer 102 and the carriage 35 together. The bonding layer 102 is generally susceptible to adhesion of not only the adhesives 103 and 301 but also other substances such as contaminants. However, the bonding layer 102 is covered with the adhesive 301. This prevents contaminants from adhering to the bonding layer 102, and thus prevents the interior of the housing 11 from becoming contaminated. Furthermore, the adhesive 301 firmly bonds the reinforcing plate 92 to the carriage 35, and thus prevents the reinforcing plate 92 from displacing and vibrating relative to the carriage 35.

[0107] (Fourth embodiment) The fourth embodiment will be described below with reference to Fig. 7 and Fig. 8. Fig. 7 is an exemplary plan view showing a carriage 35, an FPC 37, and a portion of a flexure 53 according to the fourth embodiment. Fig. 8 is an exemplary cross-sectional view showing a portion of the carriage 35 and the FPC 37 of the fourth embodiment along line F8-F8 in Fig. 7.

[0108] 7, the joint portion 71 of the fourth embodiment has a bent portion 401 instead of the bent portion 112. The bent portion 401 is substantially the same as the bent portion 112, except for the points described below. The bent portion 401 partially covers the surface 92a of the guide portion 96 of the reinforcing plate 92. A plurality of wirings 87 are provided in the bent portion 401.

[0109] The FPC 37 of the fourth embodiment has a ground plane 405 instead of the ground plane 88. The ground plane 405 is substantially the same as the ground plane 88, except for the points described below. The ground plane 405 is not provided in the bent portion 401, but is provided in the flat portion 111. Therefore, the ground plane 405 is spaced apart from the bent portion 401.

[0110] The adhesive 103 covers the entire surface 92a and adheres to the entire surface 101b of the bonding layer 101. That is, a portion of the bonding layer 101 provided on the surface 92a is covered with the adhesive 103 and the folded portion 401, and another portion of the bonding layer 101 is covered with the adhesive 103. The solidified adhesive 103 covers the surface 101b of the bonding layer 101 as a layer of synthetic resin.

[0111] In the HDD 10 of the fourth embodiment described above, the surface 92a has a flat surface 92c and a curved surface 92e that is continuous with the flat surface 92c. The FPC 37 has a ground plane 405. The ground plane 405 is spaced apart from a bent portion 401 of the FPC 37 that is fixed to the curved surface 92e via the adhesive 103 and the bonding layer 101.

[0112] The bent portion 401 of the FPC 37 is bent along the curved surface 92e. Meanwhile, the ground plane 405 improves the rigidity of the FPC 37. By being spaced apart from the bent portion 401, the ground plane 405 can make it easier for the FPC 37 to bend along the curved surface 92e.

[0113] (Fifth embodiment) The fifth embodiment will be described below with reference to FIG. 9. FIG. 9 is an exemplary cross-sectional view schematically illustrating a carriage 35 and an FPC 37 according to the fifth embodiment. Similar to the fourth embodiment, the joint 71 of the fifth embodiment has a bent portion 401 instead of the bent portion 112. Also, as shown in FIG. 9, the HSA 14 of the fifth embodiment has an adhesive 501 and an outer layer 502 instead of the adhesive 103. The adhesive 501 is substantially the same as the adhesive 103, except as described below.

[0114] The adhesive 501 adheres to the entire surface 101b of the bonding layer 101 provided on the flat surface 92c and to portions of the surface 101b of the bonding layer 101 provided on the inclined surface 92d and the curved surface 92e. The bent portion 401 is fixed to the reinforcing plate 92 via the adhesive 501 and the bonding layer 101. Note that the adhesive 501 does not have to adhere to the bonding layer 101 provided on the inclined surface 92d and the curved surface 92e.

[0115] The outer layer 502 adheres to the surface 101b of the other portion of the bonding layer 101 provided on the inclined surface 92d and the curved surface 92e. Therefore, the entire surface 101b of the bonding layer 101 adheres to the adhesive 501 and the outer layer 502. The FPC 37 does not cover the outer layer 502 but exposes it. Note that the FPC 37 may cover a portion of the outer layer 502.

[0116] The outer layer 502 is made of an organic material such as polyolefin. However, the outer layer 502 is not limited to this example. The outer layer 502 is made of a different material from the adhesive 501. The adhesive 501 is less likely to adhere to the outer layer 502 than the bonding layer 101. Therefore, contaminants are also less likely to adhere to the outer layer 502.

[0117] In the HDD 10 of the fifth embodiment described above, the outer layer 502 is different from the adhesive 501. The bonding layer 101 has surfaces 101a and 101b. The surface 101a is attached to the surface 92a. The surface 101b is located opposite the surface 101a, and its entire area is attached to the adhesive 501 and the outer layer 502. In other words, the adhesive 501 and the outer layer 502 cover the entire bonding layer 101. Therefore, the adhesive 501 and the outer layer 502 can prevent contaminants from adhering to the bonding layer 101, and ultimately prevent the inside of the housing 11 from becoming contaminated.

[0118] (Sixth embodiment) The sixth embodiment will be described below with reference to FIG. 10. FIG. 10 is an exemplary plan view schematically illustrating a carriage 35, an FPC 37, and a portion of a flexure 53 according to the sixth embodiment. As shown in FIG. 10, the joint 71 of the sixth embodiment has a bent portion 401 instead of the bent portion 112, as in the fourth embodiment. Furthermore, the HSA 14 of the sixth embodiment has an adhesive 501 instead of the adhesive 103, as in the fifth embodiment.

[0119] The surface 92a of the reinforcing plate 92 of the sixth embodiment has two regions 601 and 602. The region 601 is an example of a first region. The region 602 is an example of a second region. Each of the regions 601 and 602 is a part of the surface 92a. For convenience, FIG. 10 separates the region 601 from the region 602 with a dashed line.

[0120] The region 601 has a part of the plane 92c. The region 601 overlaps with the pads 74 of the FPC 37, the tails 62 of the flexure 53, and the solders 75 in the Z direction. The Z direction is a direction perpendicular to the plane 92c of the surface 92a. Therefore, the region 601 supports the tails 62 via the FPC 37.

[0121] The region 602 has the other portion of the flat surface 92c, an inclined surface 92d, and a curved surface 92e. The region 602 is adjacent to the region 601. The region 602 is spaced apart in the -Y direction from the pads 74 of the FPC 37, the tails 62 of the flexure 53, and the solders 75. The -Y direction is a direction along the flat surface 92c of the surface 92a. The region 602 supports the preamplifier 91. Furthermore, a hole through which the screw 93 passes opens in the region 602.

[0122] In the sixth embodiment, HSA 14 has bonding layer 605 instead of bonding layer 101. Bonding layer 605 is substantially identical to bonding layer 101, except as described below. Bonding layer 605 is provided in region 601 and spaced apart from region 602. In other words, bonding layer 605 is not provided in region 602.

[0123] A portion of adhesive 501 bonds bonding layer 605 in region 601 to surface 71b of joint 71. Adhesive 501 adheres to the entire surface 101b of bonding layer 605. Another portion of adhesive 501 bonds region 602 to surface 71b.

[0124] In the region 602, a part of the inclined surface 92d and a part of the curved surface 92e are exposed without being covered by the bent portion 401, the adhesive 501, and the bonding layer 605. Note that the inclined surface 92d and the curved surface 92e are not limited to this example.

[0125] In the HDD 10 of the sixth embodiment described above, the surface 92a has regions 601 and 602. Region 601 overlaps the solder 75 in the Z direction perpendicular to the surface 92a. Region 602 is spaced apart from the solder 75 in the −Y direction along the surface 92a. The bonding layer 605 is provided in region 601 and spaced apart from region 602. This allows the bonding layer 605 to improve the bonding strength of the adhesive 501 in the vicinity of the heated solder 75, and ultimately prevents the reinforcing plate 92 from peeling off from the adhesive 501 when the solder 75 is heated. Furthermore, the HDD 10 can be manufactured at lower costs than when the bonding layer 605 is provided over the entire surface 92a.

[0126] (Seventh embodiment) The seventh embodiment will be described below with reference to FIG. 11. FIG. 11 is an exemplary plan view schematically illustrating a carriage 35, an FPC 37, and a portion of a flexure 53 according to the seventh embodiment. The joint portion 71 of the seventh embodiment has a bent portion 401 instead of the bent portion 112, as in the fourth embodiment. Furthermore, the HSA 14 of the seventh embodiment has an adhesive 501 instead of the adhesive 103, as in the fifth embodiment.

[0127] The surface 92a of the reinforcing plate 92 of the seventh embodiment has two regions 701, 702, and 703. The region 701 is an example of a third region. The region 702 is an example of a fourth region. Each of the regions 701, 702, and 703 is a part of the surface 92a. For convenience, FIG. 11 divides the regions 701, 702, and 703 with dashed lines.

[0128] Region 701 has a portion of the flat surface 92c. Region 702 has the other portion of the flat surface 92c. Region 703 has an inclined surface 92d and a curved surface 92e. Region 701 surrounds region 702. Regions 701 and 702 each overlap, in the Z direction, with the pads 74 of the FPC 37, the tails 62 of the flexures 53, and the solders 75. Note that one of regions 701 and 702 does not necessarily overlap with the solders 75.

[0129] In the seventh embodiment, HSA 14 has bonding layer 705 instead of bonding layer 101. Bonding layer 705 is substantially the same as bonding layer 101, except as described below. Bonding layer 705 is provided in region 701 and is spaced apart from regions 702 and 703. In other words, bonding layer 705 is not provided in regions 702 and 703. Region 702 is surrounded by bonding layer 705 provided in region 701.

[0130] A portion of the adhesive 501 bonds the bonding layer 705 provided in the region 701 to the surface 71b of the joint 71. The adhesive 501 adheres to the entire surface 71b of the bonding layer 705. Another portion of the adhesive 501 bonds the region 702 to the surface 71b. The region 703 is exposed and not covered by the bent portion 401, the adhesive 501, and the bonding layer 705. Note that the region 703 is not limited to this example.

[0131] In the seventh embodiment 10 described above, the surface 92a has a region 701 and a region 702. A bonding layer 705 is provided in the region 701. The region 702 is surrounded by the bonding layer 705 provided in the region 701, and is fixed to the surface 92b by the adhesive 501. This allows the bonding layer 705 to prevent external moisture from penetrating the adhesive 501 that bonds the region 702 and the surface 92b together, thereby preventing the moisture from causing the adhesive 501 to peel off from the region 702.

[0132] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0133] 10...Hard disk drive (HDD), 11...Housing, 12...Magnetic disk, 35...Carriage, 37...Flexible printed circuit board (FPC), 53...Flexure, 54...Magnetic head, 71a, 71b...Surface, 74...Pad, 75...Solder, 88, 405...Ground plane, 92...Stiffener, 92a, 92b...Surface, 92c...Flat surface, 92e...Curved surface, 101, 102, 605, 705...Bonding layer, 101a, 101b...Surface, 103, 301, 501...Adhesive, 105, 106...Recess, 502...Outer layer, 601, 602, 701, 702...Area.

Claims

1. Electronic components and a flexible printed circuit board having a first surface facing the electronic component, a second surface located opposite the first surface, and a pad provided on the first surface and connected to the electronic component by a conductive bonding material; a first adhesive provided on the second surface; a member having a third surface facing the second surface; a first bonding layer disposed on the third surface, recessed in the third surface, and secured to the second surface by the first adhesive; A disk device comprising:

2. a housing that accommodates the electronic component, the flexible printed circuit board, the first adhesive, the member, and the first bonding layer; a magnetic disk housed in the housing; a magnetic head configured to read and write information from and to the magnetic disk; a carriage configured to rotate to move the magnetic head; Further comprising: the electronic component includes a flexure that is connected to the pad by the bonding body and electrically connects the flexible printed circuit board and the magnetic head, The member is attached to the carriage.

2. The disk device according to claim 1.

3. a second bonding layer; Further comprising: the member has a fourth surface opposite the third surface and facing the carriage; the second bonding layer is disposed on the fourth surface and extends into a recess in the fourth surface; 3. The disk device according to claim 2.

4. a second adhesive that bonds the second bonding layer and the carriage together; 4. The disk drive of claim 3, further comprising:

5. the member has a fourth surface opposite the third surface and in contact with the carriage; 3. The disk device according to claim 2.

6. The first bonding layer is provided over the entire third surface.

3. The disk device according to claim 1 or 2.

7. the first bonding layer has a fifth surface attached to the third surface and a sixth surface opposite the fifth surface; the first adhesive is attached to the entire sixth surface; 7. The disk device according to claim 6.

8. the first adhesive bonds the entire sixth surface and the flexible printed circuit board to each other; 8. The disk device according to claim 7.

9. the third surface has a flat surface and a curved surface continuing from the flat surface, the flexible printed circuit board has a ground plane; a portion of the ground plane is provided on a portion of the flexible printed circuit board that is fixed to the curved surface via the first adhesive and the first bonding layer; 9. The disk device according to claim 8.

10. the third surface has a flat surface and a curved surface continuing from the flat surface, the flexible printed circuit board has a ground plane; the ground plane is spaced apart from a portion of the flexible printed circuit board that is fixed to the curved surface via the first adhesive and the first bonding layer; 9. The disk device according to claim 8.

11. an outer layer different from the first adhesive; Further comprising: the first bonding layer has a fifth surface attached to the third surface and a sixth surface located opposite the fifth surface and entirely attached to the first adhesive and the outer layer; 7. The disk device according to claim 6.

12. the third surface has a first region overlapping the bonded body in a direction perpendicular to the third surface and a second region spaced apart from the bonded body in a direction along the third surface; the first bonding layer is provided in the first region and spaced apart from the second region; 3. The disk device according to claim 1 or 2.

13. The third surface has a third region in which the first bonding layer is provided, and a fourth region that is surrounded by the first bonding layer provided in the third region and is fixed to the second surface by the first adhesive.

3. The disk device according to claim 1 or 2.

14. the first bonding layer comprises an organic compound and is directly attached to the third surface; 3. The disk device according to claim 1 or 2.

15. The housing and a magnetic disk housed in the housing; a magnetic head configured to read and write information from and to the magnetic disk; a carriage configured to rotate to move the magnetic head; a flexible printed circuit board having pads; a flexure connected to the pad by a conductive bonding material and electrically connecting the flexible printed circuit board and the magnetic head; a metal member attached to the carriage, the metal member having a first outer surface facing the flexible printed circuit board and entirely covered by the flexible printed circuit board, and a second outer surface located on the opposite side of the first outer surface and facing the carriage; A disk device comprising:

Images