Through via waist depth detection device and detection method for TGV glass substrate

Abstract

To provide a through via waist depth detection device for a TGV glass substrate.SOLUTION: A through via waist depth detection device for a TGV glass substrate comprises a first depth of field camera, a first collimated light source, and microcomputer unit. The first depth of field camera and a first collimated light source are respectively installed above and below a glass substrate having at least one glass substrate through via and respectively obliquely face an upper surface and a lower surface of the glass substrate, or respectively installed below and above the glass substrate and respectively obliquely face the lower surface and the upper surface of the glass substrate. The microcomputer unit is electrically connected to the first depth of field camera and first collimated light source. The first collimated light source is used to emit a first collimated beam to obliquely irradiate the glass substrate therewith, the first depth of field camera is used to obtain a first image, and the microcomputer unit is used to obtain at least one detection result of at least one glass substrate through via on the basis of the first image.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a device and method for detecting waist depth of a through via in a TGV (Through Glass Via) glass substrate, and more particularly to a via waist depth detection device and method for through Glass Via (TGV) substrate that irradiates the glass substrate with an oblique light source and photographs the glass substrate obliquely using a depth-of-field camera to obtain a detection result of the through-glass via. [Background technology]

[0002] Conventional two-dimensional (2D) chip packaging technology can no longer meet the speed, efficiency, and slimness requirements of current chips, so two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have been proposed. 2.5D and 3D chip packaging technologies require interposers with through-silicon vias to electrically connect different chips. Traditionally, silicon substrates with through-silicon vias (TSVs) have been used as interposers. However, silicon is a 4A-group semiconductor material, and surrounding charge carriers can move freely under the influence of electric or magnetic fields, potentially affecting adjacent circuits and signals and significantly impacting chip performance. Furthermore, glass materials lack freely moving charges, offering good dielectric properties and a coefficient of thermal expansion (CTE) similar to that of silicon. Therefore, glass substrates with through-glass vias (TGVs) have been proposed as an alternative interposer to silicon substrates.

[0003] The method for manufacturing a glass substrate with a through-glass via is to first modify the glass substrate by irradiating a laser at a predetermined position where the through-glass via will be formed, and then form the through-glass via at the predetermined position using immersion etching. FIG. 1 is a schematic plan view of a glass substrate having through-glass-substrate vias according to an embodiment of the present invention, as viewed from above. FIG. 2 is a schematic side view of the cross section shown in FIG. 1. The cross section of FIG. 2 is taken along the cross section line AA in FIG. 1. The glass substrate 1 has a plurality of through-glass-substrate vias 12 penetrating the upper surface 10 and the lower surface 12 of the glass substrate 1. Each of the through-glass-substrate vias 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and a waist depth is defined between the upper surface 10 and the lower surface 11. Through-vias 122 are formed at the waist depth, and each has a waist depth D. The waist depth D of the through-via 122 is defined as the height difference from the narrowest point of the through-via 122 to the upper surface 10 of the glass substrate 1. The upper opening 121 and the lower opening 123 have opening diameters Rt and Rb, respectively, and the through-vias 122 at the waist depth form a through-via diameter Rm. Summary of the Invention [Problem to be solved by the invention]

[0004] The ratio of the waist depth D to the opening diameter Rt or the ratio of the waist depth D to the opening diameter Rb obtained by subtracting the waist depth D from the thickness T is an important basis for evaluating whether the through-glass substrate via 12 of the glass substrate 1 is good. One prior art method is to use X-rays for detection. However, when X-rays are used for detection, there is a possibility that the glass substrate 1 may be destroyed, and other defects may occur in the glass substrate 1. Another prior art method is to first fill the through-glass substrate via 12 with a lossless plastic material, and then remove the lossless plastic material to make the above information measurable. However, this method requires filling the lossless plastic material, which not only has problems with cost and detection time but also has the problem that the lossless plastic material remains in the through-glass substrate via 12.

[0005] The present invention was made through extensive research by the inventors in view of the above problems, and its object is to provide a novel device for detecting the waist depth of a through via in a TGV glass substrate. [Means for solving the problem]

[0006] To achieve the above object, one aspect of the present invention provides a waist depth detection device for a through-via in a TGV glass substrate, comprising a first depth-of-field camera, a first collimated light source, and a microcomputer unit. The first depth-of-field camera and the first collimated light source are respectively installed above and below a glass substrate having at least one through-glass substrate via, and obliquely facing the upper and lower surfaces of the glass substrate, or respectively installed below and above the glass substrate, and obliquely facing the lower and upper surfaces of the glass substrate. The microcomputer unit is electrically connected to the first depth-of-field camera and the first collimated light source. The first collimated light source is used to emit a first collimated beam to irradiate the glass substrate in an oblique direction, the first depth-of-field camera is used to capture a first image, and the microcomputer unit is used to obtain at least one detection result for at least one through-glass substrate via based on the first image.

[0007] In order to achieve the above object, another aspect of the present invention provides a method for detecting the waist depth of a through via in a TGV glass substrate, which is implemented in an apparatus for detecting the waist depth of a through via in a TGV glass substrate, and comprises moving and rotating a first depth-of-field camera and a first collimated light source of the apparatus for detecting the waist depth of a through via in a TGV glass substrate, the first depth-of-field camera and the first collimated light source being respectively installed above and below a glass substrate having at least one through-glass via, and facing obliquely to the upper and lower surfaces of the glass substrate, respectively, or the first depth-of-field camera and the first collimated light source being respectively installed above and below the glass substrate. the microcomputer unit of the TGV glass substrate through-via waist depth detection device is used to control the first depth-of-field camera and the first collimated light source, the first collimated light source is used to emit a first collimated beam to irradiate the glass substrate in an oblique direction, and the first depth-of-field camera is used to acquire a first image; and the microcomputer unit of the TGV glass substrate through-via waist depth detection device is used to obtain at least one detection result of at least one glass substrate through-via based on the first image.

[0008] In summary, the present invention provides an optical device and method for detecting the waist depth of a through via in a TGV glass substrate, which does not require filling with lossless plastic material, and detects the waist depth of a through via in a TGV glass substrate, thereby shortening the detection time, reducing costs, and further preventing damage to the glass substrate. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view of a glass substrate having a through-glass substrate via according to an embodiment of the present invention, viewed from above; [Figure 2] FIG. 2 is a schematic side view of the cross section shown in FIG. [Figure 3] 1 is a schematic top view of a glass substrate detected by a waist depth detection device for a through-via in a TGV glass substrate according to an embodiment of the present invention. FIG. [Figure 4]1 is a schematic cross-sectional view of a glass substrate detected by a waist depth detection device for a through-via in a TGV glass substrate according to an embodiment of the present invention. [Figure 5] 1 is a schematic diagram showing a first image and a second image according to an embodiment of the present invention. [Figure 6] FIG. 10 is a schematic diagram showing a first image and a second image according to another embodiment of the present invention. [Figure 7] FIG. 10 is a schematic side cross-sectional view showing a waist depth detection device for a through-via of a TGV glass substrate for detecting a glass substrate according to another embodiment of the present invention. [Figure 8A] FIG. 10 is a schematic perspective view showing a partial structure of a glass substrate waist depth detection device according to another embodiment of the present invention. [Figure 8B] FIG. 10 is a schematic front view showing a partial structure of a glass substrate waist depth detection device according to another embodiment of the present invention. [Figure 8C] FIG. 10 is a schematic side view showing a partial structure of a glass substrate waist depth detection device according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] Below, we will explain embodiments of the waist depth detection device for through-vias in TGV glass substrates of the present invention with reference to Figures 3 to 6, but the present invention is not limited to these embodiments, and the components, materials, etc. described below can be modified in various ways within the scope of the spirit of the present invention.

[0011] Fig. 3 is a schematic top view of a glass substrate detected by a device for detecting the waist depth of a through via in a TGV glass substrate according to an embodiment of the present invention. Fig. 4 is a schematic cross-sectional view of a glass substrate detected by a device for detecting the waist depth of a through via in a TGV glass substrate according to an embodiment of the present invention. The cross-sectional view of glass substrate 1 in Fig. 4 shows a cross-section obtained by cutting along cross-sectional line BB in Fig. 3. The waist depth detection device for a through via in a TGV glass substrate includes at least a first depth-of-field camera 21, a first collimated light source 24, and a microcomputer unit 25.

[0012] The first depth of field camera 21 and the first collimated light source 24 are respectively installed above and below the glass substrate 1 having at least one glass substrate through-via 12, and obliquely facing the upper surface 10 and lower surface 11 of the glass substrate 1, or the first depth of field camera 21 and the first collimated light source 24 are respectively installed below and above the glass substrate 1, and obliquely facing the lower surface 11 and upper surface 10 of the glass substrate 1, In this embodiment, the first depth-of-field camera 21 and the first collimating light source 24 are respectively installed above and below the glass substrate 1 having at least one through-glass substrate via 12. Furthermore, the fact that the first depth-of-field camera 21 and the first collimating light source 24 are respectively obliquely opposed to the upper surface 10 and the lower surface 11 of the glass substrate 1 means that the extension direction of the imaging end of the first depth-of-field camera 21 and the extension direction of the emission end of the first collimating light source 24 form a first oblique angle between the upper surface 10 and the lower surface 11 of the glass substrate 1 in the range of 15 to 75 degrees, preferably in the range of 30 to 45 degrees.

[0013] The microcomputer unit 25 is electrically connected to and controls the first depth-of-field camera 21 and the first collimated light source 24. The first collimated light source 24 is used to emit a first collimated beam L1 to obliquely irradiate the glass substrate 1, the first depth-of-field camera 21 is used to acquire a first image, and the microcomputer unit 25 is used to obtain at least one detection result of at least one through-glass substrate via 12 based on the first image. The detection result includes at least the waist depth D of the through-glass substrate via 12, and by acquiring the waist depth D and the upper opening diameter Rt, it becomes possible to calculate the depth-to-width ratio of the through-glass substrate via 12. The waist depth D of the through-glass substrate via 122 is defined as the height difference from the narrowest point of the through-glass substrate via 122 to the upper surface 10 of the glass substrate 1. Furthermore, the collimation accuracy of the first collimation beam L1 and the maximum distinguishable depth of the first depth-of-field camera 21 are related to the depth of the through-glass substrate via 12, that is, the thickness T of the glass substrate 1.

[0014] Furthermore, the device for detecting waist depth of a through via in a TGV glass substrate may further include a second depth-of-field camera 22 and a second collimated light source 23. When the first depth-of-field camera 21 and the first collimated light source 24 are respectively installed above and below the glass substrate 1, the second depth-of-field camera 22 and the second collimated light source 23 are respectively installed below and above the glass substrate 1 and obliquely face the bottom surface 11 and the top surface 10 of the glass substrate 1, respectively. When the first depth-of-field camera 21 and the first collimated light source 24 are respectively installed below and above the glass substrate 1, the second depth-of-field camera 22 and the second collimated light source 23 are respectively installed above and below the glass substrate 1 and obliquely face the top surface 10 and the bottom surface 11 of the glass substrate 1, respectively. In this embodiment, the second depth-of-field camera 22 and the second collimating light source 23 are respectively installed below and above the glass substrate 1. Furthermore, the phrase "the second depth-of-field camera 22 and the second collimating light source 23 are obliquely opposed to the lower surface 11 and the upper surface 10 of the glass substrate 1" refers to the extension direction of the imaging end of the second depth-of-field camera 22 and the extension direction of the emission end of the second collimating light source 23 forming a second oblique angle between the upper surface 10 and the lower surface 11 of the glass substrate 1 in the range of 15 to 75 degrees, preferably in the range of 30 to 45 degrees. Furthermore, in the example of FIG. 4, the first collimating light source 24 and the first depth-of-field camera 21 are diagonally arranged, and the second collimating light source 23 and the second depth-of-field camera 22 are diagonally arranged. Furthermore, the first oblique angle and the second oblique angle may be the same or different, and the present invention is not limited thereto.

[0015] The microcomputer unit 25 is electrically connected to and controls the second depth-of-field camera 22 and the second collimated light source 23. The second collimated light source 23 is used to emit a second collimated beam L2 to obliquely irradiate the glass substrate 1, and the beam color (wavelength band of light) of the first collimated beam L1 is different from the beam color (wavelength band of light) of the second collimated beam L2. The second depth-of-field camera 22 is used to acquire a second image, and the microcomputer unit 25 obtains at least one detection result of at least one through-glass substrate via 12 based on the first image and the second image. The beam color of the first collimated beam L1 and the beam color of the second collimated beam L2 are selected from two of red, green, and blue, but the present invention is not limited thereto. In addition, the collimation accuracy of the second collimated beam L2 and the maximum discrimination depth of the second depth-of-field camera 22 are related to the through-via depth of the glass substrate through-via 12, that is, the thickness T of the glass substrate 1.

[0016] Furthermore, the device for detecting waist depth of a through via in a TGV glass substrate further includes a frame and a mounting structure. The mounting structure is installed in the frame and is used to mount the glass substrate 1 by contacting multiple corners of the glass substrate 1. The first collimated light source 24 and the second depth-of-field camera 22 are movably installed on the frame and adjacent to the inner bottom side of the frame, and the second collimated light source 23 and the first depth-of-field camera 21 are movably installed on the frame and adjacent to the inner top side of the frame. Alternatively, the second collimated light source 23 and the first depth-of-field camera 21 are movably installed on the frame and adjacent to the inner bottom side of the frame, and the first collimated light source 24 and the second depth-of-field camera 22 are movably installed on the frame and adjacent to the inner top side of the frame. In this embodiment, the first collimated light source 24 and the second depth of field camera 22 are movably mounted on the frame and adjacent to the inner bottom side of the frame, and the second collimated light source 23 and the first depth of field camera 21 are movably mounted on the frame and adjacent to the inner upper side of the frame.

[0017] Furthermore, the waist depth detection device for a through via in a TGV glass substrate further includes a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism. The first transmission mechanism, the second transmission mechanism, the third transmission mechanism, and the fourth transmission mechanism are connected to the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23, respectively, and are used to move the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23 in two or three dimensions and to rotate the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23 to adjust their multiple oblique angles.

[0018] 5 is a schematic diagram showing a first image and a second image according to an embodiment of the present invention. In an embodiment in which only the first depth-of-field camera 21 and the first collimated light source 24 are installed, but the second depth-of-field camera 22 and the second collimated light source 23 are not installed, the first image shows the upper opening 121, the lower opening 123, and the through via 122 of at least one glass substrate through via 12 in the glass substrate 1, as well as a partial image of the glass substrate 1 near the upper opening 121, the lower opening 123, and the through via 122, where the upper opening 121, the lower opening 123, and the through via 122 form a dogbone shape. The color of the dogbone shape is the beam color of the first collimated beam L1, and the color of the outer region of the dogbone shape is different from the beam color of the first collimated beam L1. For example, the color of the outer region of the dogbone shape is darker than the beam color of the first collimated beam L1.

[0019] In an embodiment in which a first depth-of-field camera 21, a first collimated light source 24, a second depth-of-field camera 22, and a second collimated light source 23 are installed, the first image shows an upper opening 121, a lower opening 123, and a through via 122 of at least one through-glass substrate via 12 of the glass substrate 1, as well as a partial image of the glass substrate 1 near the upper opening 121, the lower opening 123, and the through via 122, where the upper opening 121, the lower opening 123, and the through via 122 form a dogbone shape. The color of the dogbone shape is the beam color of the first collimated beam L1, and the color of the outer region of the dogbone shape is a mixture of the beam color of the first collimated beam L1 and the beam color of the second collimated beam L2.

[0020] The second image shows an image of the upper opening 121, the lower opening 123, and the through via 122 of at least one glass substrate through via 12 of the glass substrate 1, as well as an image of the partial glass substrate 1 near the upper opening 121, the lower opening 123, and the through via 122, where the upper opening 121, the lower opening 123, and the through via 122 form a dogbone shape. The color of the dogbone shape is the beam color of the second collimated beam L2, and the color of the outer region of the dogbone shape is a mixture of the beam color of the first collimated beam L1 and the beam color of the second collimated beam L2.

[0021] 6 is a schematic diagram showing a first image and a second image according to another embodiment of the present invention. The present invention acquires the waist depth D of the through-glass via 12 by illuminating and photographing from an oblique angle. Therefore, in some situations, two adjacent dogbone shapes in the same image may overlap (see the left side of FIG. 6), and the lower opening 123 of one dogbone shape may overlap the upper opening 121 of another dogbone shape.

[0022] To allow a user to conveniently view the first image and / or the second image, the microcomputer unit 25 further processes the two overlapping dogbone shapes in the first image to separate them, and processes the two overlapping dogbone shapes in the second image to separate them (see the right side of FIG. 6 ). Furthermore, in a situation where the first collimated light source 24 and the second collimated light source 23 are provided, the microcomputer unit 25 can distinguish between two dogbone shapes of different colors, and after matching the dogbone shapes of different colors, separate the two overlapping dogbone shapes in the first image using an algorithm, and processes the two overlapping dogbone shapes in the second image.

[0023] Furthermore, based on the above, the present invention further provides a through-glass substrate via detection method. The through-glass substrate via detection method is implemented in a through-via waist depth detection device for a TGV glass substrate, and includes moving and rotating a first depth-of-field camera and a first collimated light source of the through-via waist depth detection device for a TGV glass substrate, the first depth-of-field camera and the first collimated light source being respectively installed above and below a glass substrate having at least one through-glass substrate via, and obliquely facing the upper and lower surfaces of the glass substrate, or the first depth-of-field camera and the first collimated light source being respectively installed below and above the glass substrate, and facing the lower and upper surfaces of the glass substrate. the microcomputer unit of the TGV glass substrate through-via waist depth detection device to control a first depth-of-field camera and a first collimated light source, the first collimated light source being used to emit a first collimated beam to irradiate the glass substrate in an oblique direction, and the first depth-of-field camera being used to acquire a first image; and the microcomputer unit of the TGV glass substrate through-via waist depth detection device to obtain at least one detection result of at least one glass substrate through-via based on the first image.

[0024] In conclusion, the present invention provides an optical device and method for detecting the waist depth of a through via in a TGV glass substrate, which does not require filling with lossless plastic material, thereby shortening the detection time, reducing costs, and further preventing damage to the glass substrate.

[0025] The present invention can be embodied in various other forms without departing from its spirit or main characteristics. Therefore, the above-described embodiments are merely illustrative in all respects and should not be interpreted as limiting. The scope of the present invention is defined by the claims and is not limited to the text of the specification. Furthermore, all modifications and variations within the equivalent range of the claims are within the scope of the present invention. [Explanation of symbols]

[0026] 1. Glass substrate 10 Top side 11 Bottom side 12 Glass substrate through via 121 Top opening 122 through via 123 Lower opening 21 First Depth of Field Camera 22 Second Depth of Field Camera 23 Second collimated light source 24 1st collimated light source 25 Microcomputer Unit Rt Upper opening diameter Rb Lower opening diameter Rm Through via diameter D waist depth T Thickness L1 First collimated beam L2 Second collimated beam AA section line BB cross section line

Claims

1. a first depth-of-field camera (21) and a first collimated light source (24) respectively installed above and below a glass substrate (1) having at least one through-glass substrate via (12) and facing obliquely to the upper surface (10) and lower surface (11) of the glass substrate (1), or installed below and above the glass substrate (1) and facing obliquely to the lower surface (11) and upper surface (10) of the glass substrate (1); a microcomputer unit (25) electrically connected to the first depth-of-field camera (21) and the first collimated light source (24); The first collimated light source (24) is used to emit a first collimated beam (L1) to irradiate the glass substrate (1) in an oblique direction; the first depth-of-field camera (21) is used to acquire a first image; the microcomputer unit (25) is used to obtain at least one detection result of at least one of the through-glass substrate vias (12) based on the first image; TGV glass substrate through-via waist depth detection device.

2. 2. The apparatus for detecting waist depth of a through via in a TGV glass substrate according to claim 1, wherein the detection result includes a waist depth of the through via (12).

3. When the first depth-of-field camera (21) and the first collimated light source (24) are respectively installed above and below the glass substrate (1), the second depth-of-field camera (22) and the second collimated light source (23) are respectively installed below and above the glass substrate (1) and obliquely face the bottom surface (11) and the top surface (10) of the glass substrate (1); when the first depth-of-field camera (21) and the first collimated light source (24) are respectively installed below and above the glass substrate (1), the second depth-of-field camera (22) and the second collimated light source (23) are respectively installed above and below the glass substrate (1) and obliquely face the top surface (10) and the bottom surface (11) of the glass substrate (1), 2. The TGV glass substrate through via waist depth detection device according to claim 1, wherein the microcomputer unit (25) is electrically connected to the second depth-of-field camera (22) and the second collimated light source (23), the second collimated light source (23) is used to emit a second collimated beam (L2) to irradiate the glass substrate (1) in an oblique direction, the wavelength band of the light of the first collimated beam (L1) is different from the wavelength band of the light of the second collimated beam (L2), the second depth-of-field camera (22) is used to acquire a second image, and the microcomputer unit (25) is used to obtain at least one detection result of at least one of the glass substrate through vias (12) based on the first image and the second image.

4. 4. The device for detecting waist depth of a through via in a TGV glass substrate according to claim 3, wherein the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2) are selected from two of red, green, and blue.

5. The waist depth detection device for a through via in a TGV glass substrate according to claim 3, characterized in that a first oblique angle of 30 to 45 degrees is formed between the extension direction of the imaging end of the first depth-of-field camera (21) and the extension direction of the emission end of the first collimated light source (24) and the upper surface (10) and the lower surface (11) of the glass substrate (1), and a second oblique angle of 30 to 45 degrees is formed between the extension direction of the imaging end of the second depth-of-field camera (22) and the extension direction of the emission end of the second collimated light source (23) and the upper surface (10) and the lower surface (11) of the glass substrate (1), and the first oblique angle is the same as or different from the second oblique angle.

6. The frame and a mounting structure installed in the frame and used to mount the glass substrate (1) by contacting multiple corners of the glass substrate (1); 6. The apparatus for detecting waist depth of a through via in a TGV glass substrate according to claim 5, wherein the first collimated light source (24) and the second depth of field camera (22) are movably mounted on the frame and adjacent to the inner bottom side of the frame, the second collimated light source (23) and the first depth of field camera (21) are movably mounted on the frame and adjacent to the inner upper side of the frame, or the second collimated light source (23) and the first depth of field camera (21) are movably mounted on the frame and adjacent to the inner bottom side of the frame, and the first collimated light source (24) and the second depth of field camera (22) are movably mounted on the frame and adjacent to the inner upper side of the frame.

7. 7. The waist depth detection device for a through via in a TGV glass substrate according to claim 6, further comprising a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism, each connected to the first depth of field camera (21), the first collimated light source (24), the second depth of field camera (22), and the second collimated light source (23), and used to move the first depth of field camera (21), the first collimated light source (24), the second depth of field camera (22), and the second collimated light source (23) in two or three dimensions and to adjust the multiple oblique angles by rotating the first depth of field camera (21), the first collimated light source (24), the second depth of field camera (22), and the second collimated light source (23).

8. The first image shows the upper opening (121), the lower opening (123), and the through via (122) of at least one of the glass substrate through vias (12) of the glass substrate (1), as well as a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the color of the beam of the first collimated beam (L1), and the color of the outer area of the dogbone shape is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

9. The second image shows the upper opening (121), the lower opening (123), and the through via (122) of at least one of the through vias (12) of the glass substrate (1), as well as a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the color of the beam of the second collimated beam (L2), and the color of the outer area of the dogbone shape is a mixture of the color of the beam of the first collimated beam (L1) and the color of the beam of the second collimated beam (L2).

10. The waist depth detection device for a through via in a TGV glass substrate according to claim 9, characterized in that the microcomputer unit (25) is used to process two overlapping dogbone shapes in the first image and separate the two overlapping dogbone shapes in the first image, and to process two overlapping dogbone shapes in the second image and separate the two overlapping dogbone shapes in the second image.

11. A method for detecting a waist depth of a through via in a TGV glass substrate, which is carried out in an apparatus for detecting a waist depth of a through via in a TGV glass substrate, comprising: a step of moving and rotating a first depth-of-field camera (21) and a first collimated light source (24) of the TGV glass substrate through-via waist depth detection device, the first depth-of-field camera (21) and the first collimated light source (24) being respectively installed above and below a glass substrate (1) having at least one glass substrate through-via (12) and obliquely facing the upper surface (10) and the lower surface (11) of the glass substrate (1), or the first depth-of-field camera (21) and the first collimated light source (24) being respectively installed below and above the glass substrate (1) and obliquely facing the lower surface (11) and the upper surface (10) of the glass substrate (1); a step of controlling the first depth-of-field camera (21) and the first collimated light source (24) using a microcomputer unit (25) of the waist depth detection device for the through via of the TGV glass substrate, the first collimated light source (24) being used to emit a first collimated beam (L1) to irradiate the glass substrate (1) in an oblique direction, and the first depth-of-field camera (21) being used to acquire a first image; and obtaining at least one detection result of at least one of the through-glass substrate vias (12) based on the first image using the microcomputer unit (25) of the through-glass substrate waist depth detection device.

12. The method for detecting waist depth of a through via in a TGV glass substrate according to claim 11, wherein the detection result includes a waist depth of the through via in the glass substrate (12).

13. The method for detecting the waist depth of a through via in a TGV glass substrate according to claim 11, characterized in that the extension direction of the imaging end of the first depth-of-field camera (21) and the extension direction of the emission end of the first collimated light source (24) each have a first oblique angle of 30 to 45 degrees with the upper surface (10) and the lower surface (11) of the glass substrate (1).

14. 12. The method for detecting the waist depth of a through via in a TGV glass substrate according to claim 11, wherein the first image shows an upper opening (121), a lower opening (123), and a through via (122) of at least one of the through vias in the glass substrate (1), as well as a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the color of the beam of the first collimated beam (L1), and the color of the outer area of the dogbone shape is different from the color of the beam of the first collimated beam (L1).

Images