Through via detection device and detection method for TGV glass substrate

Abstract

To provide a through via detection device for a TGV glass substrate.SOLUTION: A first depth of field camera and a first collimated light source installed above a glass substrate orthogonally face an upper surface of the glass substrate, and a second depth of field camera and a second collimated light source installed below the glass substrate orthogonally face a lower surface of the glass substrate. The first collimated light source and the second collimated light source respectively emit a first collimated beam and a second collimated beam to the glass substrate, and an optical waveband of the first collimated beam is identical to or different from an optical waveband of the second collimated beam. The first depth of field camera and the second depth of field camera are respectively used to obtain a first image and a second image, and a microcomputer unit of the through via detection device for a TGV glass substrate obtains at least one detection result of at least one glass substrate through via of the glass substrate on the basis of the first image and the second image.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a through via detection device and method for a TGV (Through Glass Via) glass substrate, and more particularly to a through via detection device and method for a TGV (Through Glass Via) glass substrate that obtains through via detection results using two depth-of-field cameras and two collimated light sources located above and below the glass substrate. [Background technology]

[0002] Conventional two-dimensional (2D) chip packaging technology can no longer meet the current demands for speed, efficiency, and slimness of chips, leading to the development of 2.5-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies. 2.5D and 3D chip packaging technologies require the use of interposers with through-silicon vias to electrically connect different chips. Conventional interposers use silicon substrates with through-silicon vias (TSVs). However, because silicon is a 4A-group semiconductor material, surrounding charge carriers can move freely under the influence of electric or magnetic fields, potentially affecting adjacent circuits and signals and severely impacting chip performance. However, since glass materials do not have freely moving charges, they have good dielectric properties, and their coefficient of thermal expansion (CTE) is close to that of silicon. Therefore, glass substrates with through glass vias (TGV) (Note: Glass substrates with TGV are also called TGV glass substrates) have been proposed to replace silicon substrates as interposers.

[0003] A method for manufacturing a glass substrate having through-glass vias involves first modifying the glass substrate by irradiating a laser at predetermined positions on the glass substrate where the through-glass vias will be formed. Next, immersion etching is used to form the through-glass vias at the predetermined positions. FIG. 1 is a schematic plan view of a glass substrate having through-glass vias according to an embodiment of the present invention, as viewed from above. FIG. 2 is a schematic side view of the cross section shown in FIG. 1. The cross section of FIG. 2 is taken along the cross section line AA in FIG. 1. The glass substrate 1 has a plurality of through-glass vias 12 penetrating the upper surface 10 and the lower surface 12 of the glass substrate 1. Each of the through-glass vias 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and a waist depth between the upper surface 10 and the lower surface 11. A through-glass via 122 is formed at the waist depth. The upper opening 121 and the lower opening 123 have opening diameters Rt and Rb, respectively, and the through-glass via 122 at the waist depth forms a through-glass via diameter Rm.

[0004] It is necessary to detect parameter information such as opening diameters Rt and Rb and through-via diameter Rm to evaluate whether the glass substrate 1 meets the requirements. One prior art method uses X-rays for detection. However, X-ray detection can destroy the glass substrate 1 and cause other defects in the glass substrate 1. Another prior art method uses a microscope for detection, but inspection using a microscope is very time-consuming and not economically beneficial. Another prior art method involves first filling the through-glass vias 12 with a lossless plastic material and then removing the lossless plastic material to measure the above information. However, this method requires filling the lossless plastic material, which not only increases cost and detection time but also leaves the lossless plastic material remaining in the through-glass vias 12. Therefore, in consideration of the above problems and to solve the above technical issues, the present invention proposes a novel through-glass via detection technology. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a through via detection device for a TGV glass substrate. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, one embodiment of the present invention provides a through via detection device for a TGV glass substrate, which includes a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, a second collimated light source, and a microcomputer unit. The first depth-of-field camera and the first collimated light source are installed on a glass substrate having at least one through-glass substrate via and directly face the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are installed below the glass substrate and directly face the lower surface of the glass substrate. The microcomputer unit is electrically connected to the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source. The first collimated light source and the second collimated light source respectively emit a first collimated beam and a second collimated beam onto the glass substrate, and the wavelength band of the light of the first collimated beam is different from the wavelength band of the light of the second collimated beam. The first depth-of-field camera and the second depth-of-field camera are used to acquire a first image and a second image, respectively, and the microcomputer unit is used to obtain at least one detection result of at least one through-glass substrate via based on the first image and the second image.

[0007] To solve the above problem, another aspect of the present invention provides a through via detection device for a TGV glass substrate, comprising a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, a second collimated light source, a spectrometer module, a third depth-of-field camera, and a control microcomputer unit. The first depth-of-field camera and the first collimated light source are installed on a glass substrate having at least one through-glass substrate via and directly facing the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are installed below the glass substrate and directly facing the lower surface of the glass substrate. The control microcomputer unit is electrically connected to the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, the second collimated light source, and the third depth-of-field camera. The spectrometer module is installed between the upper surface of the glass substrate and the first collimated light source. The third depth-of-field camera is installed on one side of the spectrometer module. The first collimated light source and the second collimated light source respectively emit a first collimated beam and a second collimated beam toward the glass substrate, and a spectrometer module is used for the first collimated beam emitted toward the glass substrate, the first collimated beam reflected by the glass substrate, and the second collimated beam transmitted through the glass substrate. A portion of the second collimated beam that passes through the through-glass via, a portion of the first collimated beam that is emitted toward the glass substrate, and a portion of the first collimated beam that is reflected by the glass substrate are received by a third depth-of-field camera. Another portion of the second collimated beam that passes through the through-glass via and another portion of the first collimated beam that is reflected by the glass substrate are received by a first depth-of-field camera. The other portion of the first collimated beam that is emitted toward the glass substrate is irradiated onto the glass substrate. The wavelength band of the first collimated beam light is the same as or different from the wavelength band of the second collimated beam light. The first depth-of-field camera, the second depth-of-field camera, and the third depth-of-field camera are used to acquire a first image, a second image, and a third image, respectively, and the control microcomputer unit is used to obtain at least one detection result of at least one through-glass substrate via based on the first image, the second image, and the third image.

[0008] In order to achieve the above object, a method for detecting a through via in a TGV glass substrate according to yet another aspect of the present invention is carried out in a through via detection device for a TGV glass substrate, and includes the steps of moving a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source of the through via detection device for a TGV glass substrate, so that the first depth-of-field camera and the first collimated light source are installed above a glass substrate having at least one through via in the glass substrate and directly face the upper surface of the glass substrate, and the second depth-of-field camera and the second collimated light source are installed below the glass substrate and directly face the lower surface of the glass substrate; and The method includes using a microcomputer unit to control the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source, causing the first collimated light source and the second collimated light source to emit a first collimated beam and a second collimated beam onto the glass substrate, respectively, and the first depth-of-field camera and the second depth-of-field camera are used to obtain a first image and a second image, respectively, wherein the wavelength band of the light of the first collimated beam is different from the wavelength band of the light of the second collimated beam; and using the microcomputer unit of the TGV glass substrate through-via detection device to obtain at least one detection result of at least one glass substrate through-via based on the first image and the second image.

[0009] In summary, the present invention provides an optical TGV glass substrate through-via detection device and method that does not require filling with lossless plastic material, thereby shortening the detection time, reducing costs, and further preventing damage to the glass substrate. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic plan view of a glass substrate having a through-glass substrate via according to an embodiment of the present invention, viewed from above; [Figure 2] FIG. 2 is a schematic side view of the cross section shown in FIG. [Figure 3] 1 is a schematic top view of a glass substrate detected by a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 4]1 is a schematic cross-sectional view of a glass substrate detected by a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 5] 1 is a schematic diagram illustrating a first depth-of-field camera and a first collimated light source realized by a first telecentric lens imaging module according to an embodiment of the present invention; [Figure 6] 1 is a schematic diagram showing a first image and a second image according to an embodiment of the present invention. [Figure 7] 1 shows types of defects that can be detected by a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 8A] 1 is a schematic perspective view of a part of a configuration showing a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 8B] 1 is a schematic front view of a partial configuration showing a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 8C] 1 is a schematic side view of a portion of a configuration showing a through via detection device for a TGV glass substrate according to an embodiment of the present invention. [Figure 9] 10 is a schematic side view of a through via detection device for a TGV glass substrate according to another embodiment of the present invention, viewed from the glass substrate detection side. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following describes in detail the embodiments of the present invention, but the present invention is not limited to these, and various modifications are possible within the scope of the description. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention.

[0012] FIG. 3 is a schematic top view of a glass substrate detected by a through-via detection device for TGV glass substrates according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a glass substrate detected by a through-via detection device for TGV glass substrates according to an embodiment of the present invention. The cross-sectional view of glass substrate 1 in FIG. 4 shows a cross-section obtained by cutting along section line BB in FIG. 3. The through-via detection device for TGV glass substrates includes a first depth-of-field camera 211, a first collimating light source 212, a second depth-of-field camera 221, a second collimating light source 222, and a microcomputer unit 23. The first depth-of-field camera 211 and the first collimating light source 212 can be integrated into a single first telecentric lens imaging module 21, and the second depth-of-field camera 221 and the second collimating light source 222 can be integrated into a single second telecentric lens imaging module 22, but the present invention is not limited to this.

[0013] The first depth-of-field camera 211 and the first collimated light source 212 are installed on a glass substrate 1 having at least one through-glass substrate via 12, and face the upper surface 10 of the glass substrate 1. Here, the fact that the first depth-of-field camera 211 and the first collimated light source 212 face the upper surface 10 of the glass substrate 1 means that the extension directions of both the imaging end of the first depth-of-field camera 211 and the emission end of the first collimated light source 212 are perpendicular to the upper surface 10 of the glass substrate 1. The second depth-of-field camera 221 and the second collimated light source 222 are installed below the glass substrate 1, and face the lower surface 11 of the glass substrate 1. Here, the second depth of field camera 221 and the second collimating light source 222 facing directly to the underside 11 of the glass substrate 1 means that the extension directions of both the imaging end of the second depth of field camera 221 and the emission end of the second collimating light source 222 are perpendicular to the underside 11 of the glass substrate 1.

[0014] The microcomputer unit 23 is electrically connected to the first depth-of-field camera 211, the first collimating light source 212, the second depth-of-field camera 221, and the second collimating light source 222, which are controlled by the microcomputer unit 23. The microcomputer unit 23 controls the first collimating light source 212 and the second collimating light source 222 to emit the first collimating beam L1 and the second collimating beam L2, respectively, toward the glass substrate 1, and the wavelength band of the light of the first collimating beam L1 is the same as or different from the wavelength band of the light of the second collimating beam L2. The wavelength band of the light of the first collimating beam L1 being the same as or different from the wavelength band of the light of the second collimating beam L2 means that the beam color of the first collimating beam L1 is the same as or different from the beam color of the second collimating beam L2. For example, the beam color of the first collimated beam L1 and the beam color of the second collimated beam L2 are each selected from red, green, blue, and white. Incidentally, the collimation accuracy of the first collimated beam L1 and the second collimated beam L2 is related to the depth of the through-glass substrate via 12, that is, related to the thickness of the glass substrate 1. The first depth-of-field camera 211 and the second depth-of-field camera 221 may be a black-and-white camera or a color camera depending on actual usage conditions.

[0015] The first collimated beam L1 and the second collimated beam L2 are irradiated onto the glass substrate 1, and then the second sensing beam L1 and the first sensing beam L2 are generated and provided to the first depth-of-field camera 211 and the second depth-of-field camera 221, respectively, so that the first depth-of-field camera 211 and the second depth-of-field camera 221 acquire a first image and a second image. Next, the microcomputer unit 23 is used to obtain at least one detection result of at least one through-glass via 12 based on the first image and the second image. Incidentally, the maximum discrimination depth of the first depth-of-field camera 211 and the second depth-of-field camera 221 is related to the depth of the through-glass via 12, i.e., related to the thickness of the glass substrate 1.

[0016] 3, 4 and 7, the detection results include at least one of the upper opening diameter Rt and the lower opening diameter Rb of the upper opening 121 and the lower opening 123 of the through-glass substrate via 12 (which is used to determine whether there is any abnormality in the hole diameter), the opening coordinates, the opening circularity (which is used to determine whether there is any abnormality in the circularity), the crack detection result, the dirt detection result, the puncture detection result, the abrasion detection result, the impurity detection result, the edge chipping detection result, the through-glass substrate via diameter Rm of the through-glass substrate via 12, the hole blockage detection result of the through-glass substrate via 12 (which is used to determine whether there is any abnormality in the hole blockage), and the amount of deviation between the upper opening and the lower opening (which is used to determine whether there is any abnormality in the deviation).

[0017] 5 is a schematic diagram illustrating a first telecentric lens imaging module 21, in which a first depth-of-field camera and a first collimated light source are realized by the first telecentric lens imaging module 21 according to an embodiment of the present invention. The first telecentric lens imaging module 21 includes a light-receiving lens module 213, a telecentric lens module 214, and an imaging module 215. The first telecentric lens imaging module 21 has a T-shaped exterior. The imaging module 215 is located at the top of the first telecentric lens imaging module 21, the light-receiving lens module 213 is located at a side of the first telecentric lens imaging module 21, and the telecentric lens module 214 is located at the bottom of the first telecentric lens imaging module 21. The receiving lens module 213 is used to receive the beam L0 of the initial light source, the telecentric lens module 214 is used to emit the first collimated beam L1 and receive the first sensing beam L2' (generated by the second collimated beam L2 irradiating the glass substrate 1), and the imaging module 215 is used to generate a first image based on the first sensing beam L2'.

[0018] 5, the second telecentric lens imaging module 22 of FIG. 4 includes another receiving lens module, another telecentric lens module, and another imaging module. The second telecentric lens imaging module 22 has a T-shaped outer shape. The other imaging module is located at the top end of the second telecentric lens imaging module 22, the other receiving lens module is located at the side end of the second telecentric lens imaging module 22, and the other telecentric lens module is located at the bottom end of the second telecentric lens imaging module 22. The other receiving lens module receives a beam from another initial light source, the other telecentric lens module emits a second collimated beam L2 and receives a second sensing beam (generated by the first collimated beam L1 irradiating the glass substrate 1), and the other imaging module is used to generate a second image based on the second sensing beam.

[0019] 6 is a schematic diagram showing a first image and a second image according to an embodiment of the present invention. The left side of FIG. 6 shows the first image, and the right side of FIG. 6 shows the second image. The first image shows an upper opening 121 of at least one through-glass-substrate via 12 of the glass substrate 1, a waist-depth through-via 122, and a partial image of the upper surface 10 of the glass substrate 1 near the upper opening 121. The color of the through-glass via is the color of the second collimated beam L2, the color from the upper opening 121 to the through-glass via 122 is black, and the partial color of the upper surface 10 of the glass substrate 1 near the upper opening 121 is a mixture of the color of the first collimated beam L1 and the color of the second collimated beam L2.

[0020] The second image shows a lower opening 123 of at least one glass substrate through-via 12 of the glass substrate 1, a waist-depth through-via 122, and a partial image of the underside 11 of the glass substrate 1 near the lower opening 123, where the color of the through-via 122 is the beam color of the first collimated beam L1, the color from the lower opening 123 to the through-via 122 is black, and the color of the partial underside 11 of the glass substrate 1 near the lower opening 123 is a mixture of the beam color of the first collimated beam L1 and the beam color of the second collimated beam L2.

[0021] The TGV glass substrate through-via detection device further includes a main frame (not shown) and a glass substrate mounting structure (not shown). The glass substrate mounting structure is installed in the main frame and is used to contact at least a portion of the glass substrate 1 (for example, the four corners, but the present invention is not limited to this), and mounts the glass substrate 1. Also, please refer to FIGS. 8A to 8C. FIG. 8A is a schematic oblique view of a portion of the configuration of a through via detection apparatus for a TGV glass substrate according to an embodiment of the present invention. FIG. 8B is a schematic front view of a portion of the configuration of a through via detection apparatus for a TGV glass substrate according to an embodiment of the present invention. FIG. 8C is a schematic side view of a portion of the configuration of a through via detection apparatus for a TGV glass substrate according to an embodiment of the present invention. In addition to a main frame (not shown) and a glass substrate mounting structure (not shown), the through via detection apparatus for a TGV glass substrate further includes a base structure 24 for mounting and fixing the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. The base structure 24 includes a common base 240, a first base 241a, and a second base 241b. The first base 241a and the second base 241b are installed on opposite sides of the common base 240 and are used to mount and fix the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively.

[0022] In one embodiment, if the size of the glass substrate 1 is not large, the first and second images of the entire glass substrate 1 can be acquired without moving the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, and the joint base 240 is fixed in the main frame. The glass substrate mounting structure is also fixed in the main frame, and the glass substrate 1 does not move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. If the size of the glass substrate 1 is too large, the first and second images of the entire glass substrate 1 can be acquired without moving the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, and therefore the glass substrate 1 needs to be designed to be movable relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. In this case, the joint base 240 may be fixed in the main frame, and the glass substrate mounting structure may be designed to be movably mounted in the main frame, or the joint base 240 may be designed to be movably mounted in the main frame, and the glass substrate mounting structure may be designed to be fixed in the main frame. Furthermore, the TGV glass substrate through-via detection device further includes a transmission mechanism for connecting to either the joint base 240 for connection and movement or the glass substrate supporting structure to move it, thereby enabling the glass substrate 1 to move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22.

[0023] In addition, the first base 241a and the second base 241b each have an adjustment structure, such as an adjustment gasket, an adjustment screw, an adjustment bearing, or other adjustment members, but the present invention is not limited thereto. The adjustment structures of the first base 241a and the second base 241b are used to adjust the deviations of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively. The deviations may be, for example, deviations along the X-axis and Y-axis, or deviations along the X-axis, Y-axis, and Z-axis. Overall, the present invention does not limit the implementation manner of the adjustment structure. Also, as mentioned above, in the present invention, when the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 move relative to the glass substrate 1, the movements of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 relative to the glass substrate 1 are designed to be jointly and cooperatively moved. The advantage of this is that after the deviation has been adjusted, there is no need to readjust the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, which may become shifted when moved independently, thereby improving measurement accuracy and reducing the time and human costs required to adjust the deviation.

[0024] Furthermore, based on the above, the present invention further provides a through via detection method for TGV glass substrates, which is carried out in a through via detection device for TGV glass substrates, and includes the steps of moving a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source of the through via detection device for TGV glass substrates, the first depth-of-field camera and the first collimated light source being installed above a glass substrate having at least one through via in order to face the upper surface of the glass substrate, and the second depth-of-field camera and the second collimated light source being installed below the glass substrate in order to face the lower surface of the glass substrate; The method includes controlling the depth of field camera, the first collimated light source, the second depth of field camera, and the second collimated light source, causing the first collimated light source and the second collimated light source to respectively emit a first collimated beam and a second collimated beam onto the glass substrate, and the first depth of field camera and the second depth of field camera are used to respectively obtain a first image and a second image, wherein the beam color of the first collimated beam is different from the beam color of the second collimated beam; and using a microcomputer unit of the TGV glass substrate through via detection device to obtain at least one detection result of at least one glass substrate through via based on the first image and the second image.

[0025] FIG. 9 is a schematic side view of a through-via detection apparatus for a TGV glass substrate according to another embodiment of the present invention, viewed from the glass substrate detection side. Unlike the embodiment of FIG. 4, this embodiment of the through-via detection apparatus further includes a prism-type beam splitter module 25 disposed on the upper surface 10 of the glass substrate 1 and a first telecentric lens imaging module 21, and a third telecentric lens imaging module 26 located on one side (e.g., the right side) of the prism-type beam splitter module 25. The third telecentric lens imaging module 26 includes a third depth-of-field camera 261 and a third collimating light source 262, although the third collimating light source 262 is disabled in this case, i.e., does not emit a third collimating beam. The third depth-of-field camera 261 is electrically connected to the control microcomputer unit 23. The second collimating beam L2 passes through the glass substrate 1 in a collimated manner. The second collimated beam passes through a portion of the glass substrate 1 other than the through via 122 and the upper opening 121 (when the upper opening diameter Rt is equal to or greater than the lower opening diameter Rb), or the second collimated beam passes through a portion of the glass substrate 1 other than the through via 122 and the lower opening 123 (when the upper opening diameter Rt is less than the lower opening diameter Rb). The prism-type beam splitter module 25 is used to split the second collimated beam L2 passing through the glass substrate 1, and is also used to split the first collimated beam L1 emitted toward the glass substrate 1 and the first collimated beam L1 reflected by the glass substrate 1.

[0026] A portion of the second collimated beam L2 that passes through the glass substrate 1, a portion of the first collimated beam L1 that is emitted toward the glass substrate 1, and a portion of the first collimated beam L1 that is reflected by the glass substrate 1 are received by the third depth-of-field camera 261 to form a third image. The other portions of the second collimated beam L2 that pass through the glass substrate 1 and the other portions of the first collimated beam L1 that is reflected by the glass substrate 1 are received by the first depth-of-field camera 211 to form a first image. As a result, the brightness of the third image is higher than that of the first image, and the beam color of the first collimated beam L1 is biased. The other portions of the first collimated beam L1 that is emitted toward the glass substrate 1 that is emitted toward the glass substrate 1 are partially transmitted through the glass substrate 1 and partially reflected by the glass substrate 1. In this way, the second depth of field camera 221 receives the first collimated beam L1 that passes through the glass substrate 1 and the second collimated beam L2 that is reflected by the glass substrate 1, and a second image is formed.

[0027] In this embodiment, the first, second, and third images are used to more accurately obtain the detection result of the through-glass substrate via 12. Furthermore, in this embodiment, the beam colors of the first collimated beam L1 and the second collimated beam L2 are the same or different from each other. For example, the beam colors of the first collimated beam L1 and the second collimated beam L2 are each selected from white, red, green, and blue. Furthermore, the first depth-of-field camera 211, the second depth-of-field camera 221, and the third depth-of-field camera 261 may be color or monochrome cameras depending on the actual situation.

[0028] In conclusion, the present invention provides an optical through via detection device and method for TGV glass substrates that does not require filling with lossless plastic material, and the detectable items include at least one of the opening diameter of the upper and lower openings of the through vias, opening coordinates, opening roundness, crack detection results, impurity detection results, edge chipping detection results, through via diameter of the through vias, hole blockage detection results of the through vias, and misalignment between the upper and lower openings. Furthermore, the through via detection device and method for TGV glass substrates according to the present invention not only shortens the detection time and reduces costs, but also further prevents damage to the glass substrate.

[0029] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention includes equivalents thereof. [Explanation of symbols]

[0030] 1. Glass substrate 10 Top side 11 Bottom side 12 Glass substrate through via 121 Top opening 122 through via 123 Lower opening 21 First telecentric lens imaging module 211 1st Depth of Field Camera 212 1st collimated light source 213 Light receiving lens module 214 Telecentric Lens Module 215 Imaging Module 22 Second telecentric lens imaging module 221 Second Depth of Field Camera 222 Second collimated light source 23 Microcomputer Unit 25 Spectrometer Module 26 Second telecentric lens imaging module 261 Third Depth of Field Camera 262 Third collimated light source Rt Upper opening diameter Rb Lower opening diameter Rm Through via diameter AA section line BB cross section line L1 First collimated beam L2 Second collimated beam L2' First sensing beam L0 beam

Claims

1. a first depth-of-field camera (211) and a first collimated light source (212) that are installed on a glass substrate (1) having at least one through-glass substrate via (12) and that face the upper surface (10) of the glass substrate (1); a second depth-of-field camera (221) and a second collimated light source (222) installed under the glass substrate (1) and facing the lower surface (11) of the glass substrate (1); a microcomputer unit (23) electrically connected to the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222); The first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated beam (L1) and a second collimated beam (L2) to the glass substrate (1); The wavelength band of the light of the first collimated beam (L1) is the same as or different from the wavelength band of the light of the second collimated beam (L2); the first depth-of-field camera (211) and the second depth-of-field camera (221) are used to acquire a first image and a second image, respectively; the microcomputer unit (23) is used to obtain at least one detection result of at least one of the through-glass substrate vias (12) based on the first image and the second image. TGV glass substrate through-via detection device.

2. 2. The TGV glass substrate through-via detection device according to claim 1, wherein the detection results include at least one of the opening diameters (Rt, Rb) of the upper opening (121) and the lower opening (123) of the glass substrate through-via (12), opening coordinates, opening circularity, crack detection results, dirt detection results, puncture detection results, abrasion detection results, impurity detection results, edge chipping detection results, through-via diameter (Rm) of the glass substrate through-via (12), hole blockage detection results of the glass substrate through-via (12), and the amount of misalignment between the upper opening and the lower opening.

3. The first depth-of-field camera (211) and the first collimated light source (212) are integrated into a first telecentric lens imaging module (21), which includes a receiving lens module (213), a telecentric lens module (214), and an imaging module (215). The first telecentric lens imaging module (21) has a T-shaped outer shape, and the imaging module (215) is installed at the upper end of the first telecentric lens imaging module (21). The receiving lens module (213) is connected to the first telecentric lens imaging module (21).

2. The through via detection device for TGV glass substrates according to claim 1, wherein the first telecentric lens module (214) is installed at the side end of the first telecentric lens imaging module (21), the receiving lens module (213) receives the beam (L0) of the initial light source, the telecentric lens module (214) is used to emit the first collimated beam (L1) and receive the first sensing beam (L2'), and the imaging module (215) is used to generate the first image based on the first sensing beam (L2').

4. The second depth-of-field camera (221) and the second collimated light source (222) are integrated into a second telecentric lens imaging module (22), which includes another light-receiving lens module, another telecentric lens module, and another imaging module, and the second telecentric lens imaging module (22) has a T-shaped outer shape, the other imaging module is installed at the upper end of the second telecentric lens imaging module (22), and the other light-receiving lens module is installed at the second telecentric lens imaging module (22).

4. The TGV glass substrate through-via detection device of claim 3, wherein the first telecentric lens module is installed at a side end of the first telecentric lens imaging module (22), the other telecentric lens module is installed at a bottom end of the second telecentric lens imaging module (22), the other light-receiving lens module receives the beam of the other initial light source, the other telecentric lens module is used to emit the second collimated beam (L2) and receive the second sensing beam, and the other imaging module is used to generate the second image based on the second sensing beam.

5. The frame and a mounting structure that is installed in the frame, contacts a plurality of corners of the glass substrate (1), and supports the glass substrate (1); 5. The TGV glass substrate through-via detection device of claim 4, wherein the first telecentric lens imaging module is movably installed on the frame and adjacent to the inner upper side of the frame, and the second telecentric lens imaging module is movably installed on the frame and adjacent to the inner bottom side of the frame.

6. 6. The TGV glass substrate through-via detection device of claim 5, further comprising a first transmission mechanism and a second transmission mechanism connected to the first telecentric lens imaging module and the second telecentric lens imaging module, respectively, for moving the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222) in two dimensions or three dimensions.

7. The first transmission mechanism and the second transmission mechanism are a first axial movement arm; a second axial movement arm connected perpendicularly to the first axial movement arm and connected to a portion of the frame, the first axial movement arm being driven to move in a first axial direction relative to the second axial movement arm, and the second axial movement arm being driven to move in a second axial direction relative to the frame; 7. The TGV glass substrate through-via detection device of claim 6, further comprising: a third axial movement arm connected to the first telecentric lens imaging module or the second telecentric lens imaging module and connected perpendicular to the first axial movement arm, the third axial movement arm being driven to move in a third axial direction relative to the first axial movement arm, and the first axial direction, the second axial direction, and the third axial direction are perpendicular to each other.

8. 2. The TGV glass substrate through-via detection device according to claim 1, wherein the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2) are each selected from the group consisting of red, green, blue, and white.

9. 2. The TGV glass substrate through-via detection device of claim 1, wherein the first image shows an image of an upper opening (121) of at least one of the glass substrate through-vias (12) of the glass substrate (1), a waist-depth through-via (122), and a partial image of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the through-via is the color of the beam of the second collimated beam (L2), the color from the upper opening (121) to the through-via (122) is black, and the partial color of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

10. 2. The TGV glass substrate through-via detection device of claim 1, wherein the second image presents an image of a lower opening (123) of at least one of the glass substrate through-vias (12) of the glass substrate (1), a waist-depth through-via (122), and a portion of the underside (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through-via (122) is the color of the beam of the first collimated beam (L1), the color from the lower opening (123) to the through-via (122) is black, and the color of the portion of the underside (11) of the glass substrate (1) near the lower opening (123) is a mixture of the color of the beam of the first collimated beam (L1) and the color of the beam of the second collimated beam (L2).

11. a first depth-of-field camera (211) and a first collimated light source (212) that are installed on a glass substrate (1) having at least one through-glass substrate via (12) and that face the upper surface (10) of the glass substrate (1); a second depth-of-field camera (221) and a second collimated light source (222) installed under the glass substrate (1) and facing the lower surface (11) of the glass substrate (1); a microcomputer unit (23) electrically connected to the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222); a spectrometer module (25) disposed between the upper surface (10) of the glass substrate (1) and the first collimated light source (212); a third depth-of-field camera (261) installed on one side of the spectrometer module (25) and electrically connected to the control microcomputer unit (23); The first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated beam (L1) and a second collimated beam (L2) to the glass substrate (1); The spectrometer module (25) is used to separate the first collimated beam (L1) emitted toward the glass substrate (1), the first collimated beam (L1) reflected by the glass substrate (1), and the second collimated beam (L2) passing through the glass substrate through-via (12), A portion of the first collimated beam (L1) emitted toward the glass substrate (1) after being split, a portion of the first collimated beam (L1) reflected by the glass substrate (1) after being split, and a portion of the second collimated beam (L2) passing through the glass substrate through-via (12) after being split are received by the third depth-of-field camera (261), The other portion of the first collimated beam (L1) reflected by the glass substrate (1) after being split and the other portion of the second collimated beam (L2) passing through the glass substrate through-via (12) after being split are received by the first depth-of-field camera (221), The remaining portion of the first collimated beam (L1) emitted toward the glass substrate (1) after being split is partially transmitted through the glass substrate (1) and partially reflected by the glass substrate (1), The wavelength band of the first collimated beam (L1) is the same as or different from the wavelength band of the second collimated beam (L2); the first depth-of-field camera (211), the second depth-of-field camera (221), and the third depth-of-field camera (261) are used to acquire a first image, a second image, and a third image, respectively; the control microcomputer unit (23) is used to obtain at least one detection result of the at least one through-glass substrate via (12) based on the first image, the second image, and the third image. TGV glass substrate through-via detection device.

12. 12. The TGV glass substrate through-via detection device of claim 11, wherein the detection results include at least one of the opening diameters (Rt, Rb) of the upper opening (121) and the lower opening (123) of the glass substrate through-via (12), opening coordinates, opening circularity, crack detection results, dirt detection results, puncture detection results, abrasion detection results, impurity detection results, edge chipping detection results, through-via diameter (Rm) of the glass substrate through-via (12), hole blockage detection results of the glass substrate through-via (12), and the amount of misalignment between the upper opening and the lower opening.

13. The through via detection device for a TGV glass substrate according to claim 11, wherein the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2) are each selected from the group consisting of white, red, green, and blue.

14. 12. The TGV glass substrate through-via detection device of claim 11, wherein each of the first image and the third image shows an image of an upper opening (121) of at least one of the glass substrate through-vias (12) of the glass substrate (1), a waist-depth through-via (122), and a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the through-via is the color of the beam of the second collimated beam (L2), the color from the upper opening (121) to the through-via (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

15. 2. The TGV glass substrate through-via detection device of claim 1, wherein the second image presents a partial image of a lower opening (123) of at least one of the glass substrate through-vias (12) of the glass substrate (1), a waist-depth through-via (122), and the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through-via (122) is the color of the beam of the first collimated beam (L1), the color from the lower opening (123) to the through-via (122) is black, and the partial color of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

16. A method for detecting through vias in a TGV glass substrate, which is executed in a through via detection device for a TGV glass substrate, comprising: The through via detection device includes a first depth of field camera (211), a first collimated light source (212), a second depth of field camera (221), and a second collimated light source (222); The first depth-of-field camera (211) and the first collimated light source (212) are installed on a glass substrate (1) having at least one through-glass substrate via (12) and directly face the upper surface (10) of the glass substrate (1); The second depth-of-field camera (221) and the second collimated light source (222) are installed under the glass substrate (1) and directly face the lower surface (11) of the glass substrate (1); A control microcomputer unit (23) of the TGV glass substrate through via detection device is used to control the first depth of field camera (211), the first collimated light source (212), the second depth of field camera (221), and the second collimated light source (222), so that the first collimated light source (212) and the second collimated light source (222) emit a first collimated beam (L1) and a second collimated beam (L2) onto the glass substrate (1), respectively, and the first depth of field camera (211) and the second depth of field camera (221) are used to obtain a first image and a second image, respectively, and the wavelength band of the light of the first collimated beam (L1) is the same as or different from the wavelength band of the light of the second collimated beam (L2); and obtaining at least one detection result of at least one of the through-glass substrate vias (12) based on the first image and the second image using the control microcomputer unit (23) of the TGV glass substrate through-via detection device. A method for detecting through vias in TGV glass substrates.

17. 17. The TGV glass substrate through-via detection method according to claim 16, wherein the detection results include at least one of the opening diameters (Rt, Rb) of the upper opening (121) and the lower opening (123) of the glass substrate through-via (12), opening coordinates, opening circularity, crack detection results, dirt detection results, puncture detection results, abrasion detection results, impurity detection results, edge chipping detection results, through-via diameter (Rm) of the glass substrate through-via (12), hole blockage detection results of the glass substrate through-via (12), and the amount of misalignment between the upper opening and the lower opening.

18. 17. The method of claim 16, wherein the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2) are two selected from the group consisting of red, green, and blue.

19. 17. The method for detecting through vias in a TGV glass substrate according to claim 16, wherein the first image shows an image of an upper opening (121) of at least one of the through vias (12) of the glass substrate (1), a waist-depth through via (122), and a partial image of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the through via is the color of the beam of the second collimated beam (L2), the color from the upper opening (121) to the through via (122) is black, and the partial color of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

20. 17. The method for detecting through vias in a TGV glass substrate according to claim 16, wherein the second image shows a partial image of a lower opening (123) of at least one of the through vias (12) of the glass substrate (1), a waist-depth through via (122), and the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the through via (122) is the color of the beam of the first collimated beam (L1), the color from the lower opening (123) to the through via (122) is black, and the partial color of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated beam (L1) and the beam color of the second collimated beam (L2).

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