Camera module and endoscope

Abstract

To provide a camera module and an endoscope capable of suppressing damage of an electronic component caused by a volumetric change of a filler.SOLUTION: A camera module 20 for endoscope includes: a first flat part 26a mounting an electronic component 30; a second flat part 26c facing the surface of the first flat part 26a where the electronic component 30 is mounted; a filler 38 filled in a space between the first flat part 26a and the second flat part 26c and having adhesiveness; and a release material 40 installed on the surface of the first flat part 26a and reduces an adhesive force between the surface and the filler 38 weaker than an adhesive force when the surface and the filler 38 are in direct contact.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a camera module and an endoscope. [Background technology]

[0002] Patent document 1 describes an imaging device that includes an observation optical system, a solid-state imaging element that photoelectrically converts an image from the observation optical system, a flexible substrate electrically connected to the solid-state imaging element, a plurality of electronic components and a plurality of signal cables electrically connected to the flexible substrate, a first resin that seals the electronic components, and a second resin that seals the connection portion of the signal cable, and the space between the substrates is filled with a third resin that has lower elasticity than the first and second resins.

[0003] Patent document 2 describes an endoscope in which a flexible substrate on which an electronic circuit is mounted is stored in an S-shaped folded state at the tip of the insertion section, and the flexible substrates are bonded together with a dismantling adhesive.

[0004] Patent Document 3 describes an endoscopic imaging device that has a lens barrel with an imaging lens inside, an imaging element that receives light that has passed through the imaging lens and performs photoelectric conversion, a holder that holds the lens barrel, a signal cable that is electrically connected to the imaging element, and a connecting member that connects the holder and the signal cable, where the holder and the connecting member are engaged at an engaging portion and an adhesive layer containing a filler is provided at the engaging portion. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-069231 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-059438 [Patent Document 3] Japanese Patent Application Publication No. 2023-150240 Summary of the Invention

[0006] One embodiment of the technique of the present disclosure provides a camera module and an endoscope that can suppress damage to electronic components that occurs due to volume changes of a filler material. [Means for solving the problem]

[0007] (1) A camera module for an endoscope, a first electronic component mounting section on which a first electronic component is mounted; an opposing portion of the first electronic component mounting portion that faces a surface on which the first electronic component is mounted; a filler having adhesiveness, the filler being filled in a space between the first electronic component mounting portion and the opposing portion; a first release material provided on a first surface of the first electronic component, the first release material reducing an adhesive force between the first surface and the filler to a value less than an adhesive force that would be obtained if the first surface and the filler were in direct contact with each other; A camera module comprising:

[0008] (2) The camera module according to (1), the first electronic component mounting portion and the opposing portion have rigidity; Camera module.

[0009] (3) The camera module according to (1) or (2), the first surface is a surface of the first electronic component that faces the facing portion; Camera module.

[0010] (4) A camera module according to any one of (1) to (3), The filler and the first release material are made of different materials. Camera module.

[0011] (5) The camera module according to (4), the filler is an epoxy resin or an acrylic resin, The first release material is a silicone resin or a fluorine resin. Camera module.

[0012] (6) A camera module according to any one of (1) to (5), An imaging device comprising: an imaging element; and a housing that houses the imaging element; the first electronic component is an electronic component provided between the imaging element and the housing; Camera module.

[0013] (7) A camera module according to any one of (1) to (6), a second electronic component is mounted on a surface of the facing portion that faces the first electronic component mounting portion; a second release material provided on a second surface of the second electronic component, the second release material reducing the adhesive strength between the second surface and the filler to less than the adhesive strength when the second surface and the filler are in direct contact with each other; Camera module.

[0014] (8) The camera module according to (7), the second surface is a surface of the second electronic component facing the first electronic component mounting portion; Camera module.

[0015] (9) A camera module according to any one of (1) to (8), a first planar portion; A second planar portion; a third planar portion; a first bent portion connecting the first flat portion and the second flat portion; a second bent portion connecting the second flat portion and the third flat portion; a flexible wiring board having one of the first electronic component mounting portion and the opposing portion is the first flat portion, the other of the first electronic component mounting portion and the opposing portion is the second flat portion; Camera module.

[0016] (10) The camera module according to (9), the third flat surface portion faces the second flat surface portion and has rigidity; The filler is also filled in a space between the second flat surface portion and the third flat surface portion. Camera module.

[0017] (11) An endoscope, An insertion portion; a camera module according to any one of (1) to (10) provided in the insertion section; An endoscope comprising: [Effects of the Invention]

[0018] According to the present invention, it is possible to provide a camera module and an endoscope that can suppress damage to electronic components that is caused by changes in the volume of the filler. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a schematic diagram illustrating an example of a camera system according to an embodiment of the present invention. [Figure 2] 1 is a cross-sectional view showing a tip portion 12a and a bending portion 12b of an endoscope 12 having a camera module 20 according to an embodiment of the present invention. [Figure 3] 1 is a perspective view showing an example of a camera module 20 according to an embodiment of the present invention. [Figure 4] FIG. 4 is a side view of the camera module 20 shown in FIG. [Figure 5] FIG. 4 is a bottom view of the camera module 20 shown in FIG. [Figure 6] FIG. 10 is a diagram showing an example of attaching a release material. [Figure 7] 10A and 10B are diagrams showing modified examples of attachment of the release material 40. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] An example of an embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the terms "parallel," "perpendicular," and "orthogonal" are used, but these terms include the error range generally accepted in the relevant technical field.

[0021] <Camera system> The camera system is an endoscopic camera system that irradiates an observation area, such as the inside of a subject, with illumination light (not shown), captures an image of the observation area, generates a display image of the observation area based on the image signal obtained by capturing the image, and displays the display image.

[0022] Fig. 1 is a schematic diagram showing an example of a camera system according to an embodiment of the present invention. As shown in Fig. 1, the camera system 10 includes an endoscope 12, a light source device 13, and a processor device 14. The camera system 10 has the same configuration as a general endoscope, except for the camera module 20 (see Figs. 2 and 3) in the endoscope 12.

[0023] The endoscope 12 has a camera module 20 (see FIGS. 2 and 3). Although not shown in detail, the endoscope 12 also has an insertion section that is inserted into the subject, an operation section that is connected to the insertion section, and a universal cord that extends from the operation section. The insertion section is composed of a tip section 12a (see FIG. 2), a bending section 12b (see FIG. 2) that is connected to the tip section 12a, and a flexible section that connects the bending section 12b and the operation section. The camera module 20 will be described in detail with reference to FIGS. 2 and 3.

[0024] The distal end 12a (see FIG. 2) of the endoscope 12 is provided with an illumination optical system that emits illumination light to illuminate the observation site, and a camera module 20 (see FIGS. 2 and 3) that has an imaging element and imaging optical system for imaging the observation site. The bending section 12b (see FIG. 2) is configured to be bendable in a direction perpendicular to the longitudinal axis of the insertion section. While FIG. 2 shows a configuration in which the bending section 12b bends in two directions, it normally bends in four directions as described below. The bending operation of the bending section 12b is controlled by an operating section. The flexible section is configured to be relatively flexible enough to be deformable to follow the shape of the insertion path of the insertion section. The endoscope 12 is, for example, a flexible endoscope having angles that can be bent in the UDLR directions (up / down / left / right directions) or a flexible endoscope having an insertion section that can be bent and rotated in the UD direction (up / down direction).

[0025] The operation unit is provided with buttons for operating the image capturing operation of the camera module 20 (see FIGS. 2 and 3) of the distal end portion 12a (see FIG. 2), knobs for operating the bending operation of the bending portion 12b (see FIG. 2), etc. The operation unit is also provided with an introduction port through which a treatment tool such as an electric scalpel is introduced. The insertion portion is provided with a treatment tool channel inside that extends from the introduction port of the operation unit to the distal end portion and through which a treatment tool such as forceps is inserted.

[0026] The universal cord has a connector at its end. The endoscope 12 is connected via the connector to a light source device 13 that generates illumination light emitted from an illumination optical system at the tip. The endoscope 12 is also connected via the connector to a processor device 14 that processes video signals acquired by a camera module 20 (see FIGS. 2 and 3) at the tip 12a (see FIG. 2).

[0027] The processor unit 14 processes the input video signal to generate video data of the observed region, and displays the generated video data on a monitor (not shown) or records it on a storage medium such as a hard disk. The processor unit 14 may be configured by a processor such as a personal computer.

[0028] The light source device 13 generates illumination light such as white light or light of a specific wavelength composed of three primary colors of light, such as red light (R), green light (G), and blue light (B). The light source device 13 supplies the illumination light to the endoscope 12, where it propagates through a light guide or the like within the endoscope 12 and is emitted from an illumination optical system at the tip (see FIG. 2) of the insertion section of the endoscope 12. The illumination light from the light source device 13 is used as light for capturing an image of an observation target site within a body cavity using the camera module 20 (see FIGS. 2 and 3) of the endoscope 12 to obtain an image signal of the observation target.

[0029] A light guide or a group of electric wires (cable) is housed inside the insertion section, the operation section, and the universal cord. The light guide guides illumination light generated by the light source device 13 to the illumination optical system in the distal end portion 12a (see FIG. 2). The group of electric wires transmits at least one of a signal and power between the camera module 20 (see FIGS. 2 and 3) in the distal end portion 12a (see FIG. 2) and the processor device 14.

[0030] The camera system 10 may also include a water tank for storing cleaning water, a suction pump for sucking up the suction material (including the supplied cleaning water) from within the body cavity, etc. The camera system 10 may further include a supply pump for supplying cleaning water from the water tank and gas such as external air to a conduit (not shown) within the endoscope 12.

[0031] Fig. 2 is a cross-sectional view showing the tip portion 12a and bending portion 12b of an endoscope 12 having a camera module 20 according to an embodiment of the present invention. As shown in Fig. 2, the endoscope 12 of the camera system 10 shown in Fig. 1 has the bending portion 12b connected to the tip portion 12a. The camera module 20 is disposed inside the tip portion 12a of the endoscope 12 as shown in Fig. 2. The camera module 20 is also referred to as a camera head.

[0032] The bending portion 12b is a cylindrical body having angles 15 with multiple joints. The angles 15 are connected to each other by connecting pins 16 and can rotate relative to each other. The connecting pins 16 form the joints in the bending portion 12b. Furthermore, an operating wire 17 is provided at the outer end of each angle 15 along the direction in which the angle 15 is arranged. The bending portion 12b is bent by pushing and pulling the operating wire 17. Note that there is another angle (not shown) connected by a connecting pin (not shown) that is perpendicular to the connecting pin 16 shown in FIG. 2. This angle (not shown) is also provided with an operating wire as described above. As a result, the bending portion 12b can be bent in four directions by operating the operating wire 17.

[0033] The tip of the operating wire 17 is fixed to the angle 15 by brazing, adhesive bonding, crimping, or the like. The angle 15, connecting pin 16, and operating wire 17 are made of, for example, stainless steel. The bending portion 12b is provided with an angle net (not shown) that covers the outer surface of the angle 15, and a soft bending portion outer skin (not shown) that covers the outer surface of the angle net. The angle net is made of metal wire such as stainless steel or copper, or a net woven with carbon fiber, or the like. The tip portion 12a is provided with a forceps outlet 21 in addition to the camera module 20. The tip portion 12a is also provided with a lighting device, an air supply nozzle, a water supply nozzle, and the like, although not shown.

[0034] <Camera Module 20> Fig. 3 is a perspective view showing an example of camera module 20 according to an embodiment of the present invention. Fig. 4 is a side view of camera module 20 shown in Fig. 3. Note that in Fig. 4, the illustration of connecting member 29 is partially omitted.

[0035] 3 and 4, the camera module 20 has an imaging lens 23, a lens barrel 22, a holder 24, an imaging element 25, a circuit board 26, a prism 27, a cable 28, and a connecting member 29. The camera module 20 acquires an image of an object to be observed.

[0036] Prism 27 is, for example, a right-angle prism in which incident surface 27a and exit surface 27b are orthogonal to each other. Prism 27 has an inclined surface 27c connecting incident surface 27a and exit surface 27b. Inclined surface 27c is a reflective surface of prism 27. Prism 27 is an example of an optical member arranged between lens barrel 22 and image sensor 25. However, the optical member is not limited to prism 27. Furthermore, the arrangement of prism 27 is not particularly limited. Furthermore, prism 27 may not be necessary depending on the arrangement position of image sensor 25, and a configuration in which another optical member is arranged may also be used. In this example, a prism is used to bend light by 90 degrees, but a configuration in which light is made to enter a sensor directly without using a prism may also be used.

[0037] The imaging lens 23 is an optical element that forms an image of light incident on the imaging lens 23 on a light receiving surface 25a of the imaging element 25. The imaging lens 23 is held by the lens barrel 22.

[0038] Lens barrel 22 is a cylindrical member that holds one or more imaging lenses 23 therein. Lens barrel 22 holds imaging lenses 23 so that optical axes C of imaging lenses 23 are perpendicular to incident surface 27a of prism 27. Camera module 20 has, for example, three imaging lenses 23, which are held by lens barrel 22.

[0039] Here, the direction parallel to the optical axis C is defined as the X direction. Of the two directions perpendicular to the optical axis C, one is defined as the Y direction and the other is defined as the Z direction. The Y direction corresponds to the width direction of the camera module 20, and the Z direction corresponds to the height direction of the camera module 20.

[0040] There are no particular limitations on the configuration of the imaging lens 23 and the lens barrel 22. For example, the imaging lens 23 may be configured to have one imaging lens 23, or two, or four or more imaging lenses 23. Furthermore, each imaging lens 23 may be a convex lens or a concave lens.

[0041] The imaging element 25 is an imaging element that captures an image by converting light focused by the imaging lens 23 into an electrical signal through photoelectric conversion. The imaging element 25 is a conventionally known imaging element, and may be, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0042] The imaging element 25 is disposed on the opposite side of the holder 24 from the lens barrel 22. The imaging element 25 is electrically connected to the surface 26f of the first flat portion 26a of the circuit board 26, for example, via conductive bumps 34. The imaging element 25 is mounted on the circuit board 26 so that the light receiving surface 25a is parallel to the optical axis C of the imaging lens 23. An underfill layer (not shown) may be provided between the imaging element 25 and the circuit board 26 to firmly connect the imaging element 25 and the circuit board 26.

[0043] The bumps 34 are made of a metal or an alloy. Specifically, the bumps 34 are made of solder. Bumps 34 made of solder are also called solder balls. The bumps 34 are not limited to solder or the like as long as they can electrically connect the imaging element 25 and the circuit board 26. The imaging element 25 and the circuit board 26 may also be electrically connected directly.

[0044] The circuit board 26 is a board on which the imaging element 25 is mounted. In addition to the imaging element 25, electronic components 30, 30a, for example, are mounted on the circuit board 26. The electronic components 30, 30a are used to drive the imaging element 25, and include, but are not limited to, a voltage regulator, a resistor, a capacitor, a crystal oscillator, and the like. The voltage regulator is a device that stabilizes the voltage to the imaging element 25 and outputs a constant voltage to the imaging element 25.

[0045] In the illustrated example, the circuit board 26 has a first flat portion 26a, a second flat portion 26c connected to the first flat portion 26a by a first bent portion 26b, and a third flat portion 26e connected to the second flat portion 26c by a second bent portion 26d. The first flat portion 26a and the third flat portion 26e are parallel to the optical axis C of the imaging lens 23. The second flat portion 26c is tilted at an angle with respect to the optical axis C of the imaging lens 23. The second flat portion 26c is not parallel to the optical axis C. The second flat portion 26c is tilted so that the second bent portion 26d is higher in the Z direction than the first bent portion 26b. The first flat portion 26a, the second flat portion 26c, and the third flat portion 26e are generally plate-shaped portions.

[0046] Furthermore, the circuit board 26 has a plurality of connection terminals (not shown) on a back surface 26h of the third flat surface 26e facing the second flat surface 26c, through which signals or power are input and output to and from the imaging element 25 and the electronic components 30, 30a. A plurality of signal lines 28a arranged in the cable 28 are electrically connected to the connection terminals. The signal lines 28a connected to the connection terminals are exposed after the shield 28c and outer sheath 28d have been removed. The connection terminals are electronic contacts of the circuit board 26. The circuit board 26 is made of, for example, a flexible substrate. The circuit board 26 is made of, for example, a flexible wiring substrate.

[0047] The first bent portion 26b and the second bent portion 26d are both formed of curved surfaces, for example. The first bent portion 26b is bent so that the angle between the first flat portion 26a and the second flat portion 26c is less than 90°. The second bent portion 26d is bent so that the angle between the second flat portion 26c and the third flat portion 26e is less than 90°. The radii of curvature of the first bent portion 26b and the second bent portion 26d may be the same or different. In the illustrated example, the radius of curvature of the first bent portion 26b is larger than that of the second bent portion 26d. By adjusting the radii of curvature of the first bent portion 26b and the second bent portion 26d, it is possible to adjust the space between the first flat portion 26a and the second flat portion 26c and the space between the second flat portion 26c and the third flat portion 26e.

[0048] The imaging element 25 is mounted on the surface 26f of the first flat portion 26a. An electronic component 30 is also mounted on the surface 26f of the first flat portion 26a. Electronic components 30, 30a are mounted on the back surface 26g of the second flat portion 26c, which faces the surface 26f of the first flat portion 26a. The electronic components mounted on the surface 26f of the first flat portion 26a are an example of a "first electronic component" in the present invention. The electronic components mounted on the back surface 26g of the second flat portion 26c are an example of a "second electronic component" in the present invention.

[0049] The second flat portion 26c is inclined relative to the first flat portion 26a. This creates a wide space between the first flat portion 26a and the second flat portion 26c. A large electronic component 30a can be mounted between the first flat portion 26a and the second flat portion 26c. For example, on the back surface 26g of the second flat portion 26c, the electronic component 30a mounted on the second bent portion 26d side is taller than the electronic component 30a mounted on the first bent portion 26b side. The second flat portion 26c faces the surface 26f of the first flat portion 26a on which the imaging element 25 and the electronic component 30 are mounted. The first flat portion 26a is an example of a "first electronic component mounting portion" in the present invention. The second flat portion 26c is an example of a "facing portion" in the present invention.

[0050] The first flat portion 26a may be an example of a "facing portion," and the second flat portion 26c may be an example of a "first electronic component mounting portion." In that case, the electronic component mounted on the front surface 26f of the first flat portion 26a is an example of a "second electronic component," and the electronic component mounted on the back surface 26g of the second flat portion 26c is an example of a "first electronic component."

[0051] A signal line 28a of the cable 28 is electrically connected to a connection terminal provided on the back surface 26h of the third flat surface portion 26e of the circuit board 26, and the imaging element 25 is electrically connected to the cable 28. Light formed as an image by the imaging lens 23 is converted into an electrical signal by the imaging element 25, and this electrical signal is transmitted via the cable 28. The cable 28 is inserted into the insertion portion, operation portion, universal cord, etc. of the endoscope 12, and is electrically connected to the processor device 14.

[0052] The cable 28 includes, for example, multiple signal wires 28a, a coating layer 28b that coats the multiple signal wires 28a, a shield 28c that surrounds the entire multiple signal wires 28a covered by the coating layer 28b, and an outer sheath 28d that coats the shield 28c. The outer sheath 28d forms the outer periphery of the cable 28. The cable 28 is a multi-core cable in which the multiple signal wires 28a are bundled together and surrounded by the shield 28c, and housed within the cylindrical outer sheath 28d. The diameter of the cable 28 is 2.5 mm or less. The cable 28 includes, for example, five signal wires 28a. The number of signal wires 28a depends on the configuration of the camera module 20 and is not limited to two, three, four, six, or more. The signal wires 28a are single wires, and include, for example, normal wires, coaxial wires, and twin-ax wires. The bundled signal wires 28a are wound, for example, in a spiral shape. The covering layer 28b, the shield 28c, and the outer jacket 28d are, for example, cylindrical.

[0053] The prism 27 is disposed between the lens barrel 22 and the image sensor 25 via a cover glass 31. The prism 27 guides light that has passed through the imaging lens 23 to the light receiving surface 25a of the image sensor 25. The prism 27 bends the light that has passed through the imaging lens 23 held in the lens barrel 22 at an inclined surface 27c (reflecting surface) by, for example, 90° to change the optical path, and guides the light to the light receiving surface 25a of the image sensor 25. The transmitted light that has passed through the imaging lens 23 enters the prism 27, is reflected by the inclined surface 27c of the prism 27, and then enters the light receiving surface 25a of the image sensor 25. For example, the prism 27 is disposed so that the incident surface 27a faces the surface on the base end side of the lens barrel 22. The prism 27 is disposed so that the exit surface 27b faces the light receiving surface 25a of the image sensor 25. In this case, the prism 27 is disposed on the cover glass 31 with the exit surface 27b facing the cover glass 31. The cover glass 31 is disposed on the light receiving surface 25a of the image sensor 25 to protect the light receiving surface 25a. The prism 27 and the cover glass 31 are bonded together with, for example, a photo-curing adhesive. Note that the cover glass 31 may not be provided.

[0054] The holder 24 is a member that holds the lens barrel 22 and the prism 27. The holder 24 is a substantially cylindrical member, and the lens barrel 22 is fitted into the interior of the cylindrical portion to hold the lens barrel 22. The inner surface of the holder 24 and the outer peripheral surface of the lens barrel 22 are adhesively fixed together. Any of a variety of known adhesives used in conventional endoscopes can be used as the adhesive that bonds the holder 24 and the lens barrel 22 together. The same applies to adhesives that bond other components together.

[0055] The holder 24 has a polygonal flange portion 24b on the end surface of the base end side of the mounting tube portion 24a. Restricting members 24c are provided on both ends of the flange portion 24b in the Y direction. The prism 27 is disposed between the restricting members 24c, and its incident surface 27a abuts against the flange portion 24b while sandwiched between the restricting members 24c. This determines the position of the prism 27 in the X direction. The holder 24 holds the lens barrel 22 and the prism 27 in a predetermined position, thereby fixing the relative position between the lens barrel 22 and the prism 27, i.e., the relative position between the lens barrel 22 and the light receiving surface 25a of the image sensor 25. This positions the exit surface 27b of the prism 27 opposite the image sensor 25. The lens barrel 22 is adhesively fixed to the holder 24 after the relative position of the imaging lens 23 with respect to the holder 24 in the optical axis C direction is adjusted so that the light receiving surface 25a of the image sensor 25 is focused.

[0056] The connecting member 29 connects the holder 24 and the cable 28. The connecting member 29 holds the cable 28 inside. The connecting member 29 is a member formed, for example, by bending a single plate material. Specifically, the connecting member 29 has a shape obtained by bending a single plate material at two bending portions extending in the direction of the optical axis C. Therefore, the cross section of the connecting member 29 perpendicular to the direction of the optical axis C is approximately C-shaped. The connecting member 29 is arranged so that the connection terminals (connection points with the cable 28) on the circuit board 26 are enclosed inside the approximately C-shape. Specifically, the connecting member 29 has a base portion 29b that covers the circuit board 26 from above in the Z direction and a side portion 29c formed by bending an end of the base portion 29b. The side portion 29c has, for example, an edge 29g that is parallel to the second flat portion 26c of the circuit board 26. The edge 29g is located closer to the base 29b than the second flat surface 26c, and when the circuit board 26 is covered from above with the connecting member 29, the second flat surface 26c of the circuit board 26 is exposed.

[0057] The connecting member 29 covers the circuit board 26, the prism 27, the image sensor 25, and the tip of the cable 28, and also serves as a housing for these components. The connecting member 29 also functions as a protective member for the circuit board 26, the prism 27, the image sensor 25, and the cable 28. Inside the connecting member 29, the electronic components 30, 30a mounted on the circuit board 26 are provided between the image sensor 25 and the connecting member 29. The connecting member 29 is an example of the "housing" in the present invention.

[0058] The connecting member 29 also has a pair of arm portions 29a on the tip side. Tip portions 29h of the pair of arm portions 29a are each bent parallel to the Y direction and form claw portions. The pair of arm portions 29a sandwich the flange portion 24b of the holder 24, and the tip portions 29h of the arm portions 29a engage with each other, thereby fixing the connecting member 29 to the holder 24. The connecting member 29 also has a holding portion 29d that holds the cable 28 on the base end side of the side portion 29c. The holding portion 29d is bent along the outer sheath 28d of the cable 28, and its width in the Y direction narrows from the arm portions 29a toward the holding portion 29d. The cable 28 is fixed and held inside the holding portion 29d. The holding portion 29d is a member that is continuous with the side portion 29c.

[0059] By connecting the holder 24 and the cable 28, the connecting member 29 prevents breakage of the signal line 28a at the connection point between the connection terminal on the circuit board 26 and the signal line 28a of the cable 28, for example, when the cable 28 is pulled. There are no particular restrictions on the material from which the connecting member 29 is made, but metal materials with high thermal conductivity, such as stainless steel or copper alloy, are preferred.

[0060] Cable 28 is covered by an inner tube 36 (see FIG. 5) and an outer tube 37, which overlap each other. Inner tube 36 is the inner tube. Outer tube 37 is the outer tube. Inner tube 36 and outer tube 37 protect cable 28, prevent cable 28 from bending, and prevent signal line 28a from breaking. Cable 28 is also provided with a fixing member 35. Fixing member 35 fixes cable 28, restricts movement of signal line 28a within cable 28, and prevents signal line 28a from breaking.

[0061] FIG. 5 is a bottom view of the camera module 20 shown in FIG. 3. As shown in FIG. 5, the inner tube 36 and the outer tube 37, which are covered by the cable 28, have their respective tip ends 36a and 37a housed within the connecting member 29. For example, the tip end 36a of the inner tube 36 and the tip end 37a of the outer tube 37 are located closer to the lens barrel 22 than the rear end face 29e of the connecting member 29 on the side opposite to the lens barrel 22, and are positioned inside the holding portion 29d. The tip end 36a of the inner tube 36 and the tip end 37a of the outer tube 37 refer to the end of each tube on the lens barrel 22 side. The inner tube 36 and the outer tube 37 are, for example, heat-shrinkable tubes. Examples of materials for the inner tube 36 and the outer tube 37 include polyolefin, silicone, and fluororesin.

[0062] The fixing member 35 is provided at the tip of the cable 28 on the connecting member 29 side. The tip of the cable 28 is a connection portion of the cable 28 that is connected to the third flat portion 26e of the circuit board 26. The fixing member 35 is a cable compression member that compresses and fixes the cable 28 from the outer periphery of the outer sheath 28d of the cable 28 toward the center of the cable 28. The fixing member 35 is, for example, an annular member that is attached to the outer sheath 28d of the cable 28 and compresses it toward the center of the cable 28, i.e., tightens by crimping, thereby fixing the outer sheath 28d to the signal wires 28a of the cable 28. Crimping the cable 28 means fixing the outer sheath 28d and shield 28c in a compressed state toward the multiple signal wires 28a.

[0063] The fixing member 35 is not limited to a circular ring shape, and may be a polygonal ring-shaped member, as long as it can fix the outer sheath 28d to the signal line 28a of the cable 28. Furthermore, the fixing member 35 does not have to be strictly ring-shaped, and may have a gap between them rather than being continuous around the entire circumference, such as a C-shaped ring. In this case, the separated ends are brought closer together by crimping, thereby reducing the opening of the fixing member 35 and fixing the outer sheath 28d to the signal line 28a of the cable 28. Furthermore, the fixing member 35 may be, for example, a metal ring made of metal. The metal ring may be hollow, for example. Various metals, such as stainless steel, brass, copper, aluminum, nickel-copper alloy, copper-zinc alloy, copper-tin alloy, and aluminum alloy, can be used as the metal for the fixing member 35.

[0064] In addition, the inner tube 36 and the outer tube 37 are covered on the outer periphery of the cable 28 so that a gap 39 is provided between the end 35b of the connecting member 29 on the holding portion 29d side of the fixing member 35 and the tip end 36a of the inner tube 36 and the tip end 37a of the outer tube 37.

[0065] Furthermore, the connecting member 29 has a recess 29f that protrudes inward of the connecting member 29 toward, for example, the cable 28 held therein. The recess 29f is provided so as to overlap at least a portion of a fixing member 35 that is provided on the cable 28. The recess 29f is formed, for example, by locally narrowing a side surface portion 29c of the connecting member 29. The recess 29f and the fixing member 35 are provided so that the narrowest portion of the recess 29f, i.e., the portion with the narrowest width, overlaps the fixing member 35. Specifically, the position of the narrowest portion of the recess 29f in the direction of the optical axis C of the imaging lens 23 overlaps with any position in the width of the fixing member 35 in the same direction of the optical axis C.

[0066] The holding portion 29d of the connecting member 29 and the outer sheath 28d of the cable 28 are adhesively fixed to each other with an adhesive filler 38. Similarly, the holding portion 29d of the connecting member 29 and the fixing member 35 attached to the outer sheath 28d are adhesively fixed to each other with the filler 38. Furthermore, among the multiple signal wires 28a of the cable 28, the portions exposed from the ends of the shield 28c and the outer sheath 28d and connected to the connection terminals of the circuit board 26 (see FIG. 4) are adhesively fixed to each other with the filler 38. Furthermore, the electronic components 30 mounted on the first flat portion 26a and the electronic components 30, 30a mounted on the second flat portion 26c (see FIG. 6) are adhesively fixed to each other with the filler 38.

[0067] When these members are adhesively fixed with the filler 38, the filler 38 is in a hardened state. Therefore, the outer sheath 28d of the cable 28 and the fixing member 35 attached to the outer sheath 28d are circumferentially covered with the hardened filler 38 and are adhesively fixed to the connecting member 29 by the hardened filler 38. Furthermore, the shield 28c and the portions of the multiple signal wires 28a exposed from the ends of the outer sheath 28d (see FIG. 4) are entirely covered with the hardened filler 38, and the signal wires 28a are adhesively fixed to each other. Furthermore, the electronic components mounted on the first flat portion 26a and the second flat portion 26c (see FIG. 6) are circumferentially covered with the hardened filler 38 and are adhesively fixed to the connecting member 29 by the hardened filler 38.

[0068] Furthermore, when components are bonded and fixed together using filler 38, the temperature inside connecting member 29 changes depending on, for example, how camera module 20 is used, and when the temperature inside connecting member 29 is high, filler 38 expands, and when the temperature is low, filler 38 contracts. As a result, stress is applied to electronic components 30, 30a bonded to filler 38 due to the expansion and contraction of filler 38, which may cause problems such as electronic components 30, 30a becoming detached from circuit board 26. To address this issue, the present inventors came up with the idea of providing an intermediate member (e.g., a release material) between filler 38 and the components bonded and fixed by filler 38.

[0069] <Attaching the release material> Fig. 6 is a diagram showing an example of attachment of a release material. As shown in Fig. 6, the space between the first flat surface portion 26a and the second flat surface portion 26c is filled with adhesive filler 38. The space between the second flat surface portion 26c and the third flat surface portion 26e is also filled with filler 38. This configuration is similar to the configuration described above with reference to Figs. 3 and 4, etc.

[0070] Furthermore, a release material 40 is provided on at least the surface of the electronic component 30 mounted on the first flat portion 26a. Similarly, a release material 40 is also provided on at least the surface of the electronic component 30, 30a mounted on the second flat portion 26c. The release material 40 is a member that reduces the adhesive strength between the electronic component 30, 30a and the filler 38 to be smaller than the adhesive strength that would occur if the surfaces of the electronic component 30, 30a were in direct contact with the filler 38. The release material 40 is a member that peels off from at least one of the surfaces of the electronic component 30, 30a and the filler 38 when the filler 38 contracts due to a temperature change.

[0071] The surface of the electronic component 30, 30a refers to, for example, the surface of the electronic component 30, 30a mounted on the circuit board 26 opposite the circuit board 26, for example, the ceiling surface of the electronic component 30, 30a. The surface of the electronic component 30 mounted on the first flat surface 26a refers to the surface of the electronic component 30 facing the second flat surface 26c. The surface of the electronic component 30, 30a mounted on the second flat surface 26c refers to the surface of the electronic component 30, 30a facing the first flat surface 26a. The surface of the electronic component 30 mounted on the first flat surface 26a is an example of the "first surface" in the present invention. The surface of the electronic component 30, 30a mounted on the second flat surface 26c is an example of the "second surface" in the present invention. The release material 40 provided on the surface of the electronic component 30 mounted on the first flat surface 26a is an example of the "first release material" in the present invention. The release material 40 provided on the surfaces of the electronic components 30, 30a mounted on the second flat surface portion 26c is an example of the "second release material" of the present invention.

[0072] The first and second planar portions 26a and 26c of the circuit board 26, on which electronic components are mounted, are rigid substrates. The third planar portion 26e, which is disposed above the second planar portion 26c and faces the second planar portion 26c, is also rigid. Rigidity refers to the fact that, if the release material 40 were not present, the adhesive strength between the first planar portion 26a and the filler 38 and the adhesive strength between the second planar portion 26c and the filler 38 would be such that, when the filler 38 contracts due to a temperature change, the adhesive strength would be such that the connection between the electronic component 30 and the first planar portion 26a, the connection between the electronic component 30, 30a and the second planar portion 26c, or the electronic component 30, 30a itself would not be deformed to such an extent that it would break. In other words, the first and second planar portions 26a and 26c are rigid enough not to follow the contraction or expansion of the filler 38. The connection portion between the electronic component 30, 30a and the first flat portion 26a or the second flat portion 26c is, for example, a soldered portion that connects the two members.

[0073] The filler 38 and the release material 40 are made of different materials. The filler 38 is made of, for example, an epoxy resin or an acrylic resin. The release material 40 is made of, for example, a silicon resin or a fluorine resin.

[0074] <Modification of attachment of release material 40> 7 is a diagram showing a modified example of the attachment of the release material 40. As shown in FIG. 7, the release material 40 may be provided on the surface of, for example, the image sensor 25 mounted on the first flat surface 26a. The image sensor 25 shown in the figure has a cover glass 31 provided on its surface, and so providing the release material 40 on the surface of the cover glass 31 results in a configuration in which the release material 40 is provided on the image sensor 25. Note that the configuration in which the release material 40 is provided on the electronic component 30 mounted on the first flat surface 26a and the electronic components 30, 30a mounted on the second flat surface 26c, as well as other configurations within the connecting member 29, are the same as those described in FIG. 6.

[0075] When the filler 38 is filled in the space between the first flat surface 26a on which the electronic components 30 and the imaging element 25 are mounted and the second flat surface 26c on which the electronic components 30, 30a are mounted, the adhesive force of the filler 38 adheres and fixes the filler 38 to the electronic components 30, 30a and the imaging element 25, and also adheres and fixes the filler 38 to the first flat surface 26a and the second flat surface 26c. Therefore, when the filler 38 expands or contracts due to a temperature change inside the connecting member 29, the contraction force of the filler 38, which is adhered to the rigid first flat surface 26a, pulls the electronic components 30, 30a mounted on the opposing second flat surface 26c and adhered to the same filler 38, toward the rigid first flat surface 26a. Similarly, when the filler 38 shrinks, the contraction force of the filler 38 attached to the rigid second flat portion 26c pulls the electronic components 30 and the image sensor 25 mounted on the opposing first flat portion 26a and attached to the same filler 38 toward the rigid second flat portion 26c. This pulling force can cause problems, such as the adhesive portions (soldered portions) of the electronic components 30, 30a or the image sensor 25 attached to the first flat portion 26a or the second flat portion 26c being peeled off from the first flat portion 26a or the second flat portion 26c.

[0076] In contrast, in the camera module 20 of the present embodiment, a release material 40 is provided on the surfaces of the electronic components 30 and the image sensor 25 mounted on the rigid first flat portion 26a and the surfaces of the electronic components 30, 30a mounted on the rigid second flat portion 26c, and the release material 40 reduces the adhesive strength between the electronic components 30, 30a or the image sensor 25 and the filler 38 to less than the adhesive strength that would occur if the surfaces of the electronic components 30, 30a or the image sensor 25 were in direct contact with the filler 38. With this configuration, when the filler 38 shrinks due to a temperature change within the connecting member 29, the release material 40 peels off from, for example, the surfaces of the electronic components 30, 30a or the image sensor 25. This prevents the electronic components 30, 30a or the image sensor 25 from being subjected to a tensile force due to the shrinkage of the filler 38 adhered to the first flat portion 26a and the second flat portion 26c, and thus prevents damage to the electronic components 30, 30a or the image sensor 25. In addition, the release material 40 may peel off from the filler 38 when the filler 38 shrinks, so that the tensile force caused by the shrinkage of the filler 38 is not applied to the electronic components 30, 30a and the imaging element 25, and even in this case, damage to the electronic components 30, 30a and the imaging element 25 can be suppressed.

[0077] Furthermore, according to the camera module 20, the filler 38 is also filled in the space between the second flat portion 26c and the third flat portion 26e. In this configuration, when the filler 38 contracts due to a temperature change within the connecting member 29, the second flat portion 26c is pulled toward the third flat portion 26e (upward) by the contraction of the filler 38 filling the space between the second flat portion 26c and the third flat portion 26e, which makes it more likely that the electronic components 30, 30a, etc. mounted on the second flat portion 26c will be damaged. In contrast, according to the above configuration, the release material 40 is easily peeled off from the surfaces of the electronic components 30, 30a mounted on the second flat portion 26c, which makes it possible to suppress damage to the electronic components 30, 30a, etc. mounted on the second flat portion 26c. [Explanation of symbols]

[0078] 10 Camera System 12 Endoscopy 12a,29h,37a Tip 12b Curved section 13 Light source device 14 Processor unit 15 Angle 16 connecting pin 17 Control wire 20 Camera Module 21 Forceps exit 22 Lens barrel 23 Imaging lens 24 Holder 24a Mounting tube 24b Flange part 24c Regulatory Material 25 Image sensor 25a Photosensitive surface 26 Circuit Board 26a 1st plane part 26b 1st bending part 26c 2nd plane part 26d 2nd bending part 26e 3rd plane section 26f surface 26g,26h back side 27 Prism 27a Entrance plane 27b Output surface 27c slope 28 Cable 28a signal line 28b Covering layer 28c shield 28d Hull 29 Connecting members 29a Arm section 29b base 29c Side part 29d Holding part 29e Rear end surface 29f recess 29g edge 30,30a Electronic Components 31 Coverslip 34 Bump 35 Fixing member 35b end 36 Inner tube 37 Outer tube 38 Filling material 39 Gap 40 Release material

Claims

1. A camera module for an endoscope, a first electronic component mounting portion on which a first electronic component is mounted; an opposing portion of the first electronic component mounting portion that faces a surface on which the first electronic component is mounted; a filler having adhesiveness and filled in a space between the first electronic component mounting portion and the facing portion; a first release material provided on a first surface of the first electronic component, the first release material reducing an adhesive strength between the first surface and the filler to a level lower than an adhesive strength that would be obtained if the first surface and the filler were in direct contact with each other; A camera module comprising:

2. 2. The camera module according to claim 1, the first electronic component mounting portion and the opposing portion have rigidity; Camera module.

3. 2. The camera module according to claim 1, the first surface is a surface of the first electronic component facing the facing portion; Camera module.

4. 2. The camera module according to claim 1, The filler and the first release material are made of different materials. Camera module.

5. 5. The camera module according to claim 4, the filler is an epoxy resin or an acrylic resin, The first release material is a silicone-based resin or a fluorine-based resin. Camera module.

6. 2. The camera module according to claim 1, An imaging device comprising: an imaging element; and a housing that houses the imaging element; the first electronic component is an electronic component provided between the imaging element and the housing; Camera module.

7. 2. The camera module according to claim 1, a second electronic component is mounted on a surface of the facing portion that faces the first electronic component mounting portion; a second release material provided on a second surface of the second electronic component, the second release material reducing the adhesive strength between the second surface and the filler to less than the adhesive strength when the second surface and the filler are in direct contact with each other; Camera module.

8. 8. The camera module according to claim 7, the second surface is a surface of the second electronic component facing the first electronic component mounting portion; Camera module.

9. 2. The camera module according to claim 1, a first planar portion; A second planar portion; a third planar portion; a first bent portion connecting the first planar portion and the second planar portion; a second bent portion connecting the second flat portion and the third flat portion; a flexible wiring board having one of the first electronic component mounting portion and the opposing portion is the first flat portion, the other of the first electronic component mounting portion and the opposing portion is the second flat portion; Camera module.

10. 10. The camera module of claim 9, the third planar portion faces the second planar portion and has rigidity; The filler is also filled in a space between the second planar portion and the third planar portion. Camera module.

11. An endoscope, An insertion portion; a camera module according to any one of claims 1 to 10, which is provided in the insertion section; An endoscope comprising:

Images