Liquid jet head, and liquid jet device

Abstract

To provide a liquid jet head and a liquid jet device in which lowering of reliability is suppressed.SOLUTION: A liquid jet head includes a first head module for jetting liquid in a first direction, a supply flow channel member for supplying liquid to the first head module, and an elastic first seal member which is sandwiched between the first head module and the supply flow channel member in the first direction, and thereby connects a first flow channel opening of the first head module and a flow channel opening of the supply flow channel member in a liquid-tight manner, wherein the first head module includes a flow channel opening formation member formed with the first flow channel opening, and a chip arranged in the first direction with respect to the flow channel opening formation member, and a seal region sandwiched between the flow channel opening formation member and the supply flow channel member in the first seal member does not overlap the chip when viewed in the first direction.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] 2. Description of the Related Art Liquid ejection apparatuses equipped with liquid ejection heads that eject liquid such as ink onto a medium such as printing paper have been proposed.

[0003] The liquid ejection head described in Patent Document 1 comprises a recording element unit (head module) including an element recording substrate having an ejection port for ejecting liquid and a support member for fixing the element recording substrate, and a flow path unit (supply flow path member) having a liquid supply path for supplying liquid to the recording element unit, and the recording element unit and the flow path unit are fluid-tightly connected via an elastic member (sealing member). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-226988 Summary of the Invention [Problem to be solved by the invention]

[0005] In conventional liquid jet heads in which a liquid-tight flow path is formed by sandwiching an elastic sealing member between the head module and the supply flow path member, the reaction force of the elastic member may reduce the reliability of the head module. [Means for solving the problem]

[0006] A liquid ejection head according to one aspect of the present disclosure includes a first head module that ejects liquid in a first direction, a supply flow path member that supplies liquid to the first head module, and an elastic first sealing member that is sandwiched between the first head module and the supply flow path member in the first direction to liquid-tightly connect a first flow path opening of the first head module to a flow path opening of the supply flow path member, the first head module including a flow path opening forming member in which the first flow path opening is formed, and a chip that is arranged in the first direction relative to the flow path opening forming member, and a sealing region of the first sealing member that is sandwiched between the flow path opening forming member and the supply flow path member does not overlap with the chip when viewed in the first direction.

[0007] A liquid ejection apparatus according to one aspect of the present disclosure includes a plurality of liquid ejection heads and a unit base to which the plurality of liquid ejection heads are fixed. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the liquid jet unit shown in FIG. [Figure 3] FIG. 3 is a cross-sectional perspective view of the liquid jet head shown in FIG. [Figure 4] 4 is a cross-sectional view of the liquid jet head shown in FIG. 3 as viewed in a direction along the X axis. [Figure 5] 4 is a cross-sectional view of the liquid jet head shown in FIG. 3 as viewed in the direction along the Y axis. [Figure 6] FIG. 4 is a bottom view of the liquid jet head shown in FIG. [Figure 7] FIG. 5 is a cross-sectional view of a chip included in the head module shown in FIG. [Figure 8] 6 is a top view of a flow path opening forming member included in the head module shown in FIG. 5. FIG. [Figure 9] FIG. 6 is a bottom view of the supply flow path member shown in FIG. [Figure 10] FIG. 6 is a top view of the supply flow path member shown in FIG. [Figure 11] FIG. 6 is a top view of the sealing member shown in FIG. [Figure 12] FIG. 6 is a top view of the support member shown in FIG. 5. [Figure 13] FIG. 6 is a top view of the upper portion of the holder shown in FIG. 5. [Figure 14] FIG. 6 is a view showing the lower part of the holder shown in FIG. 5. [Figure 15] 10 is a cross-sectional view of a portion of a liquid jet head according to a first modified example. [Figure 16] 10 is a cross-sectional view of a portion of a liquid jet head according to a first modified example. [Figure 17] FIG. 10 is a top view of a liquid jet head according to a first modified example. [Figure 18] FIG. 10 is a cross-sectional view of a portion of a liquid jet head according to a second modified example. [Figure 19] FIG. 10 is a cross-sectional view of a portion of a liquid jet head according to a second modified example. [Figure 20] 10 is a cross-sectional view of a portion of a liquid jet head according to a third modified example. [Figure 21] 10 is a cross-sectional view of a portion of a liquid jet head according to a third modified example. [Figure 22] FIG. 10 is a view showing a second member of a holder according to a third modified example. [Figure 23] FIG. 13 is a cross-sectional view of a portion of a liquid jet head according to a fifth modified example. [Figure 24] FIG. 13 is a cross-sectional view showing a sealing member and its vicinity in a sixth modified example. [Figure 25] 13 is a cross-sectional view of a portion of a liquid jet head according to a sixth modified example. [Figure 26] FIG. 13 is a cross-sectional view showing a sealing member and its vicinity in a seventh modified example. [Figure 27] FIG. 13 is a cross-sectional view showing a first positioning portion and a second positioning portion of an eighth modified example. [Figure 28] 10 is a cross-sectional view of a liquid jet head according to a second embodiment, as viewed in a direction along the X axis. FIG. [Figure 29] 10 is a cross-sectional view of a liquid jet head according to a second embodiment, as viewed in the direction along the Y axis. FIG. [Figure 30]29 is a bottom view of the liquid jet head shown in FIG. 28. FIG. [Figure 31] 29 is a top view of a flow path opening forming member included in the head module shown in FIG. 28. FIG. [Figure 32] 29 is a bottom view showing the holder and the wiring board shown in FIG. 28. FIG. [Figure 33] FIG. 29 is a top view of the seal member shown in FIG. 28. [Figure 34] FIG. 29 is a top view of the seal member shown in FIG. 28. [Figure 35] FIG. 29 is a top view of the support member shown in FIG. 28. [Figure 36] 13 is a cross-sectional view of a portion of a liquid jet head according to a ninth modified example. [Figure 37] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to a tenth modified example. [Figure 38] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to an eleventh modified example. [Figure 39] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to a twelfth modified example. [Figure 40] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to a thirteenth modified example. [Figure 41] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to a fifteenth modified example. [Figure 42] FIG. 23 is a top view of a liquid jet head according to a fifteenth modified example. [Figure 43] FIG. 23 is a cross-sectional view of a portion of a liquid jet head according to a sixteenth modified example. [Figure 44] FIG. 23 is a top view of a liquid jet head according to a sixteenth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The dimensions and scale of each part in the drawings may differ from the actual dimensions, and some parts are shown schematically to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to limit the present invention. Furthermore, the term "element β on element γ" is not limited to a configuration in which element γ and element β are in direct contact with each other, but also includes a configuration in which element γ and element β are not in direct contact with each other. The term "element γ and element β are equal" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like. The term "element γ and element β are the same" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like.

[0010] 1. First embodiment 1-1. Overall configuration of the liquid ejection device 100 FIG. 1 is a schematic diagram illustrating the configuration of a liquid ejection device 100 according to a first embodiment. For ease of explanation, the following description will appropriately use mutually perpendicular X, Y, and Z axes. A direction along the X axis will be referred to as the X1 direction, and a direction opposite to the X1 direction will be referred to as the X2 direction. Similarly, a direction along the Y axis will be referred to as the Y1 direction, and a direction opposite to the Y1 direction will be referred to as the Y2 direction. A direction along the Z axis will be referred to as the Z1 direction, and a direction opposite to the Z1 direction will be referred to as the Z2 direction. The Z1 direction corresponds to the "first direction." The Z2 direction corresponds to the "second direction opposite to the first direction." The Z1 direction relative to a certain point is referred to as "downward," and the Z2 direction from a certain point is referred to as "upward." Viewing in the Z1 or Z2 direction is referred to as a "planar view."

[0011] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 9, a control unit 91, a conveying section 92, a head unit 10, and a movement mechanism 40.

[0012] The liquid storage unit 9 is a container that stores ink. Specific examples of the liquid storage unit 9 include a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid storage unit 9 is not particularly limited and can be any type.

[0013] The control unit 91 controls the operation of each element of the liquid ejection device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0014] The transport unit 92 transports the medium 90 in a direction DM under the control of the control unit 91. In this embodiment, the direction DM is the Y1 direction. In the example shown in FIG. 1, the transport unit 92 includes a long transport roller along the X axis and a motor that rotates the transport roller. Note that the transport unit 92 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or endless belt that transports the medium 90 while adsorbing it to its outer peripheral surface using electrostatic force or the like.

[0015] The movement mechanism 40 has a conveyor belt to which the unit base 11 of the head unit 10 is fixed, and moves the head unit 10 back and forth in the X1 direction and the X2 direction under the control of a control unit 91. Under the control of the control unit 91, the head unit 10 ejects ink supplied from a liquid storage section 9 from each of a plurality of nozzles N onto the medium 90 in the Z1 direction. The ejection of ink from the head unit 10 is performed in parallel with the movement of the head unit 10 by the movement mechanism 40, thereby forming an ink image on the surface of the medium 90.

[0016] The number and arrangement of the multiple liquid jet heads 1 included in the head unit 10 are not limited to the example shown in Fig. 1 and are arbitrary. Furthermore, if the head unit 10 is configured to be able to circulate ink, the head unit 10 may be connected to the liquid storage section 9 via a circulation mechanism for circulating the ink within the head unit 10.

[0017] 1-2. Head unit 10 Fig. 2 is a plan view showing the head unit 10 shown in Fig. 1. As shown in Fig. 2, the head unit 10 includes a unit base 11 and a plurality of liquid jet heads 1. The plurality of liquid jet heads 1 are fixed to the unit base 11. The unit base 11 is a member that holds the plurality of liquid jet heads 1. In the illustrated example, the number of liquid jet heads 1 relative to the unit base 11 is not particularly limited, and may be any number equal to or greater than one.

[0018] The unit base 11 is, for example, a plate-like member whose thickness direction is along the Z axis. A recess 111 is provided in the unit base 11. The recess 111 is a depression provided in the unit base 11. A plurality of through holes 11H are provided in the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a rectangle. One through hole 11H is provided for each liquid jet head 1. A part of the liquid jet head 1 is inserted into each through hole 11H. Note that in Figure 2, some of the liquid jet heads 1 arranged in part of the unit base 11 are not shown in order to show the through holes 11H.

[0019] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H in plan view. Note that the number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to the example shown in FIG. 2 and are arbitrary.

[0020] The mounting holes 101 are provided, for example, near the four corners of the through-hole 11H in plan view. The mounting holes 101 are used to mount the liquid jet head 1 to the unit base 11. The mounting holes 101 penetrate the unit base 11, for example, in the thickness direction.

[0021] Each third positioning portion 102 is provided, for example, between two mounting holes 101 aligned in the direction along the X axis and spaced apart from each other. Each third positioning portion 102 is used for positioning when mounting the unit base 11 of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole that opens on the surface of the unit base 11 facing in the Z1 direction. It can also be said that each third positioning portion 102 is a recess formed in the surface of the unit base 11 facing in the Z1 direction.

[0022] Note that each mounting hole 101 does not have to penetrate the unit base 11 in the thickness direction. Similarly, each third positioning portion 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be, for example, a box shape.

[0023] As described above, the liquid ejection device 100 includes a plurality of liquid ejection heads 1 and a unit base 11 to which the plurality of liquid ejection heads 1 are fixed. The liquid ejection device 100 includes the liquid ejection heads 1 described below. As described below, each of the plurality of liquid ejection heads 1 is detachable from the unit base 11 and is configured to improve alignment accuracy between the plurality of liquid ejection heads 1. Therefore, according to the liquid ejection device 100, even when any one of the plurality of liquid ejection heads 1 is replaced, it is possible to suppress deterioration in print quality.

[0024] 1-3. Liquid jet head 1 FIG. 3 is a cross-sectional perspective view of the liquid jet head 1 shown in FIG. 2. FIG. 4 is a cross-sectional view of the liquid jet head 1 shown in FIG. 3, viewed in a direction along the X-axis. FIG. 5 is a cross-sectional view of the liquid jet head 1 shown in FIG. 3, viewed in a direction along the Y-axis. As shown in FIG. 5, in this embodiment, the liquid jet head 1 is configured to be approximately symmetrical with respect to a central imaginary plane A10 along the XZ plane. The liquid jet head 1 does not have to be configured to be symmetrical with respect to the central imaginary plane A10. A partition wall portion 63 of a holder 6, which will be described later, is not shown in FIG.

[0025] 3 to 5, the liquid jet head 1 includes a plurality of head modules 2, two supply flow path members 3, a sealing member 4, a plurality of support members 5, a holder 6, a plurality of wiring substrates 7, and a relay substrate 70. In this embodiment, a support member 5 is provided for each head module 2. As shown in FIG. 4, the head modules 2 and the corresponding support members 5 form a subunit 15.

[0026] 1-3A. Head Module 2 4, the plurality of head modules 2 are six head modules 2. The number of head modules 2 is not limited to six, and may be one to five, or seven or more. Therefore, the liquid jet head 1 may be configured to have only one head module 2.

[0027] In this embodiment, the multiple head modules 2 are aligned along the X axis. As shown in FIGS. 3 and 5, each head module 2 is elongated along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow path opening forming member 25. The chip 20 is disposed in the Z1 direction relative to the flow path opening forming member 25.

[0028] FIG. 6 is a bottom view of the liquid jet head 1 shown in FIG. 3. As shown in FIG. 6, each head module 2 has a plurality of nozzles N that eject ink. The plurality of nozzles N are arranged along the Y axis. The plurality of nozzles N are divided into nozzle rows La and nozzle rows Lb that are arranged side by side at intervals along the X axis. Each of the nozzle rows La and Lb is a collection of a plurality of nozzles N that are linearly arranged along the Y axis. Furthermore, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as the nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 that faces the Z1 direction. Note that, for example, the plurality of nozzles N may be arranged in a direction that intersects the X axis and the Y axis when viewed in the Z1 direction.

[0029] 1-3Aa. Chip 20 7 is a cross-sectional view of the chip 20 included in the head module 2 shown in FIG. 4. The chip 20 has a structure in which elements related to each nozzle N of the nozzle row La and elements related to each nozzle N of the nozzle row Lb are arranged in a substantially plane-symmetrical manner. In the following explanation, the elements corresponding to the nozzle row La will be mainly explained, and explanations of elements corresponding to the nozzle row Lb will be omitted as appropriate. In the following, when there is no need to distinguish between the nozzle row La and the nozzle row Lb, they will be referred to as the nozzle row L.

[0030] As shown in FIG. 7, the chip 20 of each head module 2 includes, for example, a communication plate 202, a pressure chamber substrate 203, a vibration plate 204, a nozzle plate 201, a cover 206, a plurality of drive elements E, and a sealing substrate 205.

[0031] The communicating plate 202, pressure chamber substrate 203, diaphragm 204, nozzle plate 201, and cover 206 are each a long plate-like member extending along the Y axis. The pressure chamber substrate 203 is placed on the surface of the communicating plate 202 facing the Z2 direction. The nozzle plate 201 and cover 206 are placed on the surface of the communicating plate 202 facing the Z1 direction. The components are fixed together, for example, with an adhesive.

[0032] The nozzle plate 201 is a plate-like member in which a plurality of nozzles N are formed. The nozzle plate 201 is the member of the head module 2 that is located furthest in the Z1 direction. The surface of the nozzle plate 201 that faces the Z1 direction is the nozzle surface SN. Each of the plurality of nozzles N is a circular through-hole that ejects ink. For example, the nozzle plate 201 is manufactured by processing a silicon (Si) single crystal substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0033] The communicating plate 202 is formed with a plurality of throttle portions R1, a plurality of communicating channels R2, a communicating space Ra, and a common channel Rb. Each of the throttle portions R1 and the communicating channels R2 extends in the Z1 direction and is a through-hole formed for each nozzle N. The communicating channels R2 overlap with the nozzles N in plan view. The communicating spaces Ra are elongated openings formed along the Y axis. The communicating spaces Ra extend along the Y axis. The common channels Rb communicate with the communicating spaces Ra and overlap with the communicating spaces Ra in plan view. The common channels Rb extend along the Y axis. The common channels Rb communicate with the plurality of throttle portions R1. Furthermore, the communicating spaces Ra communicate with the spaces Rc of the channel opening forming member 25.

[0034] The communication space Ra, the common flow path Rb, and the space Rc form a common space R that is shared by multiple nozzles N. The common space R functions as an ink reservoir. The ink stored in the common space R branches off into each throttle section R1 and is supplied to and filled in multiple pressure chambers C in parallel.

[0035] A plurality of pressure chambers C are formed in the pressure chamber substrate 203. The pressure chambers C are located between the communication plate 202 and the vibration plate 204, and are spaces formed by the wall surfaces of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is an elongated space extending in the X1 direction. The plurality of pressure chambers C are arranged along the Y axis.

[0036] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate.

[0037] An elastically deformable vibration plate 204 is disposed above the pressure chamber C. The vibration plate 204 is laminated on the pressure chamber substrate 203 and contacts the surface of the pressure chamber substrate 203 opposite the communicating plate 202. The vibration plate 204 is a long, rectangular plate-like member that extends along the Y-axis in a plan view. The pressure chamber C communicates with the communicating flow path R2 and the throttle portion R1. Therefore, the pressure chamber C communicates with the nozzle N via the communicating flow path R2, and also communicates with the communicating space Ra via the throttle portion R1. Note that the nozzle N, the communicating flow path R2, the pressure chamber C, and the throttle portion R1 form an individual flow path for each nozzle N. Also, for ease of explanation, in FIG. 7, the pressure chamber substrate 203 and the vibration plate 204 are illustrated as separate substrates, but in reality they are laminated on a single silicon substrate.

[0038] A driving element E is formed for each pressure chamber C on the surface of the vibration plate 204 opposite to the pressure chamber C. The driving element E is an elongated piezoelectric element extending along the X-axis in a plan view. The driving element E includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. The driving element E may also be an electrothermal conversion element that generates thermal energy.

[0039] The sealing substrate 205 is a structure that protects the multiple drive elements E. The sealing substrate 205 is fixed to the surface of the diaphragm 204 with, for example, an adhesive. The multiple drive elements E are housed inside a recess formed on the surface of the sealing substrate 205 that faces the diaphragm 204. The sealing substrate 205 also has a through hole 20H for inserting a wiring substrate 7, which will be described later.

[0040] The cover 206 is a thin metal plate that forms the wall surface of the common flow path Rb. The cover 206 has a thickness similar to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame shape that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction forms part of the nozzle surface SN.

[0041] In this chip 20, when the drive element E contracts due to energization, the vibration plate 204 bends and deflects in the direction that reduces the volume of the pressure chamber C, causing the pressure inside the pressure chamber C to rise and eject an ink droplet from the nozzle N. At this time, pressure also propagates from the pressure chamber C toward the throttle portion R1, causing ink to flow into the common flow path Rb through the throttle portion R1. After the ink is ejected, the drive element E returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, at the same time as the meniscus of the nozzle N returns to its original position, ink is supplied from the throttle portion R1. Through this series of operations, ink is ejected from the nozzle N.

[0042] The chip 20 of this embodiment includes all of the elements shown in FIG. 3, but the components of the chip 20 do not necessarily have to include all of the elements, and may further include additional elements.

[0043] The chip 20 may have, for example, a monolithic structure and be thinner than the flow path opening-forming member 25, e.g., a component having a thickness of less than 3000 μm. The chip 20 may be a component having a thickness of 1500 μm or less, or 1000 μm or less. The thickness of the chip 20 may be ⅕ or less of the length of the short side as viewed in the direction along the Z axis, which is the thickness direction of the chip 20. The chip 20 may include at least one element of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, or the driving element E, and the sealing substrate 205. The chip 20 preferably includes at least the nozzle plate 201, more preferably further includes the pressure chamber substrate 203, and particularly preferably further includes the communication plate 202. At least one of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, the pressure chamber substrate 203 on which the driving element E is stacked, and the sealing substrate 205 may be considered to be the chip 20. Furthermore, the chip 20 may be not only a laminate of silicon substrates manufactured by MEMS, but also a laminate of thin plates such as ceramic sheets or metals, or a laminate of thin plate-like members of each of the aforementioned materials.

[0044] 1-3Ab. Flow path opening forming member 25 5 and 7, a flow path opening forming member 25 is disposed in the Z2 direction of the chip 20. The flow path opening forming member 25 and the chip 20 are fixed to each other, for example, by an adhesive or the like. The flow path opening forming member 25 and the chip 20 are positioned with high precision in advance. The flow path opening forming member 25 also has a flow path that supplies ink to the chip 20, for example.

[0045] Furthermore, the flow path opening-forming member 25 is preferably a member having a thickness of, for example, 3000 μm or more, more preferably a member having a thickness of 5000 μm or more, and even more preferably a member having a thickness of 8000 μm or more. Furthermore, the flow path opening-forming member 25 may be formed of a single member or may be a laminate of multiple members. Furthermore, the flow path opening-forming member 25 may contain resin or may contain metal.

[0046] 5, the length of the flow path opening-forming member 25 in the direction along the Z axis, i.e., the thickness, is thicker than the thickness D2 of the chip 20. The thickness of the flow path opening-forming member 25 here is the thickness at a position overlapping with a sealing region 4S, which will be described later, when viewed in the Z1 direction. In other words, the chip 20 is thinner than the flow path opening-forming member 25. The flow path opening-forming member 25 also includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0047] Fig. 8 is a top view of the flow path opening forming member 25 included in the head module 2 shown in Fig. 5. As shown in Fig. 8, the planar shape of the flow path opening forming member 25 is larger than the planar shape of the chip 20. That is, the chip 20 has a smaller outer shape than the flow path opening forming member 25 when viewed in the Z1 direction. The flow path opening forming member 25 is disposed so as to overlap and cover the chip 20 when viewed in the Z1 direction.

[0048] As shown in FIGS. 5 and 8, the flow path opening forming member 25 has a flange portion 250 for fixing to a support member 5 described later. The planar shape of the flange portion 250 is a rectangular frame shape that surrounds an opening 5H of the support member 5 described later. As shown in FIG. 5, the surface of the flange portion 250 facing the Z1 direction is a supported surface 2511 that is supported by the support member 5 described later. Since the planar shape of the flange portion 250 is a rectangular frame shape that surrounds the opening 5H, the planar shape of the supported surface 2511 is also a rectangular frame shape that surrounds the opening 5H. The supported surface 2511 is located further in the Z2 direction than the chip 20. Therefore, the supported surface 2511 is located in the Z2 direction of the nozzle plate 201.

[0049] 8, a through hole 25H is provided in the flow path opening forming member 25. A wiring substrate 7, which will be described later, is inserted into the through hole 25H. The through hole 25H is provided in the center of the flow path opening forming member 25 in plan view. Referring to FIG. 7, the through hole 25H overlaps with the through hole 20H of the sealing substrate 205 in plan view.

[0050] 5 and 7, a flow path 25R is formed inside the flow path opening forming member 25. The flow path 25R is provided to supply ink to the chip 20. As shown in Fig. 7, a space Rc is provided on the chip 20 side of the flow path 25R, i.e., on the downstream side. The flow path 25R and the space Rc are in communication with each other.

[0051] As shown in FIG. 5, a plurality of flow path openings 251H are provided on the side of the flow path 25R of the flow path opening forming member 25 opposite to the chip 20, i.e., on the upstream side. Each flow path opening 251H is an open end of the flow path 25R in the Z2 direction. The flow path opening 251H is an opening for connecting the flow path 25R of the flow path opening forming member 25 of the head module 2A to a flow path 3R of the supply flow path member 3, which will be described later. As shown in FIGS. 5 and 8, the plurality of flow path openings 251H are provided in the flange portion 250 of the flow path opening forming member 25. The flow path openings 251H are arranged outside the chip 20 when viewed in the Z1 direction. In this embodiment, two flow path openings 251H are provided for each nozzle row L.

[0052] 1-3B. Supply flow path member 3 As shown in FIGS. 3 to 5, each supply flow path member 3 is disposed in the Z2 direction relative to the plurality of head modules 2. Each supply flow path member 3 is common to the plurality of head modules 2. As shown in FIG. 5, the supply flow path member 3 has one flow path 3R. The flow path 3R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow path 3R is a common flow path shared by the plurality of head modules 2, and has a common portion 3RA extending along the X-axis and a plurality of branch portions 3RB branching from the common portion 3RA and extending in the Z1 direction. Although not shown, the supply flow path member 3 is provided with a flow path joint for connecting to a supply flow path outside the liquid jet head 1 in order to communicate with the liquid storage portion 9. This flow path joint (not shown) is exposed to the outside of the liquid jet head 1, for example, through an opening (not shown) formed in the holder 6.

[0053] The supply flow path member 3 may have a plurality of flow paths 3R that communicate with a plurality of head modules 2. In other words, the flow path 3R may not have a common portion 3RA that communicates with a plurality of head modules 2, but may have a plurality of flow paths 3R that communicate with each of the plurality of head modules 2.

[0054] 5, a flow path opening 31H is provided on the head module 2 side, i.e., downstream side, of the flow path 3R. The flow path opening 31H is an open end of the flow path 3R in the Z1 direction. The flow path opening 31H is provided corresponding to the above-mentioned flow path opening 251H.

[0055] 9 is a bottom view of the supply flow path member 3 shown in FIG. 5. FIG. 10 is a top view of the supply flow path member 3 shown in FIG. 5. As shown in FIGS. 9 and 10, each supply flow path member 3 is a long member extending in the X-axis direction. As shown in FIG. 9, two supply flow path members 3 are placed in a recess 610 of a holder 6, which will be described later. The two supply flow path members 3 are also placed so as to sandwich a relay substrate 70, which will be described later, when viewed in the Z2 direction. The multiple flow path openings 31H of each supply flow path member 3 are spaced apart and aligned along the X-axis.

[0056] As shown in FIG. 10, each supply flow path member 3 overlaps with multiple head modules 2 when viewed in the Z1 direction. The supply flow path member 3 is provided in common to multiple head modules 2. Specifically, each supply flow path member 3 overlaps with the flange portions 250 of multiple flow path opening forming members 25 when viewed in the Z1 direction. The multiple flow path openings 31H overlap with the multiple flow path openings 251H described above in a one-to-one relationship when viewed in the Z1 direction. Furthermore, each supply flow path member 3 does not overlap with the multiple chips 20 when viewed in the Z1 direction, and is disposed at a position different from the chips 20. Furthermore, each supply flow path member 3 overlaps with some of the multiple sealing members 4 described below when viewed in the Z1 direction.

[0057] 1-3C. Sealing member 4 As shown in FIGS. 3 to 5, the sealing member 4 is provided between each head module 2 and the supply flow path member 3 in the Z1 direction. A sealing member 4 is provided for each head module 2. The sealing member 4 has elasticity. The sealing member 4 is made of an elastic material such as an elastomer. In this embodiment, the length of the sealing member 4 along the Z axis, i.e., the thickness, is constant. The thickness of the sealing member 4 is thinner than the thicknesses of the flow path opening forming member 25 and the supply flow path member 3. The sealing member 4 is crushed by the head module 2 and the supply flow path member 3.

[0058] 11 is a top view of the sealing member 4 shown in FIG. 5. In the example shown in FIG. 11, two sealing members 4 are provided for each head module 2. The two sealing members 4 are provided at both longitudinal ends of one head module 2. Each sealing member 4 is rectangular when viewed in the Z1 direction. When viewed in the Z1 direction, each sealing member 4 overlaps with a flange portion 250 of the flow path opening forming member 25 of the head module 2. On the other hand, in this embodiment, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing member 4 does not overlap with the chip 20 when viewed in the Z1 direction.

[0059] As shown in FIGS. 5 and 11 , each seal member 4 has two communication openings 4H. As shown in FIG. 5 , each communication opening 4H is provided corresponding to one flow path opening 251H of the flow path opening forming member 25 and one flow path opening 31H of the supply flow path member 3. As shown in FIG. 10 , the communication opening 4H overlaps with each of the flow path openings 31H and 251H when viewed in the Z1 direction. As shown in FIG. 5 , the communication opening 4H is connected to the flow path 25R via the flow path opening 251H. The communication opening 4H is connected to the flow path 3R via the flow path opening 31H. Therefore, the flow path 25R and the flow path 3R are in communication with each other via the communication opening 4H. Specifically, the seal member 4 is compressed between the flow path opening forming member 25 and the supply flow path member 3, thereby connecting the flow path 25R and the flow path 3R via the communication opening 4H.

[0060] The sealing member 4 having such a communication port 4H is a member that liquid-tightly connects the flow path opening 251H of the head module 2 and the flow path opening 31H of the supply flow path member 3. Ink flowing through the flow path 3R of the supply flow path member 3 flows into the flow path 25R of the flow path opening forming member 25 via the communication port 4H, and is supplied to the individual flow paths of the chip 20 via the common space R.

[0061] As shown in FIG. 11 , the seal member 4 has a seal region 4S. In this embodiment, the entire seal member 4 corresponds to the seal region 4S. The seal region 4S is in contact with both the flow path opening-forming member 25 and the supply flow path member 3, and is a region of the seal member 4 that is sandwiched between the flow path opening-forming member 25 and the supply flow path member 3. The seal region 4S is a region that is crushed by the load from the flow path opening-forming member 25 and the supply flow path member 3 in order to liquid-tightly connect the flow path opening 251H and the flow path opening 31H to each other. In other words, even in a region of the seal member 4 that is sandwiched between both the flow path opening-forming member 25 and the supply flow path member 3, a portion that is not crushed by the load from both members and that does not substantially contribute to liquid-tightly connecting the flow path opening 251H and the flow path opening 31H to each other is not included in the seal region 4S.

[0062] 11, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction, and therefore the sealing area 4S is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction. Because the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction, the reaction force of the sealing member 4 is less likely to affect the chip 20 compared to when they overlap. This makes it possible to improve the reliability of the head module 2.

[0063] As described above, the sealing member 4 is crushed between the flow path opening forming member 25 and the supply flow path member 3, so that the flow path 25R and the flow path 3R are connected to each other via the communication opening 4H. The reaction force of the crushed sealing member 4 applies stress to the chip 20, which may cause warping of the chip 20. If the reaction force of the sealing member 4 acts on the chip 20 in this way, for example, the nozzle plate 201 may be deformed, causing the nozzles N to shift in position, the pressure chamber substrate 203 or the communication plate 202 may be deformed, causing changes in ejection characteristics, or if the components constituting the chip 20 include a silicon substrate or a ceramic sheet, the component may be cracked, which may result in a decrease in reliability of the head module 2.

[0064] In this embodiment, the sealing area 4S of the sealing member 4 does not overlap with the chip 20 when viewed in the Z1 direction. This makes it possible to suppress a decrease in the sealing performance of the sealing member 4, while also suppressing the effect of the reaction force of the sealing member 4 on the chip 20. This makes it possible to improve the reliability of the head module 2.

[0065] As described above, the liquid jet head 1 has a plurality of head modules 2. For example, the head module 2 located on the leftmost side in FIG. 11 is referred to as the "first head module 2a." The head module 2 adjacent to the first head module 2a on the right is referred to as the "second head module 2b." In this case, the flow path opening 251H of the first head module 2a is referred to as the "first flow path opening 251Ha," and the flow path opening 251H of the second head module 2b is referred to as the "second flow path opening 251Hb." The seal member 4 corresponding to the first head module 2a is referred to as the "first seal member 4a," and the seal member 4 corresponding to the second head module 2b is referred to as the "second seal member 4b." The first seal member 4a is sandwiched between the first head module 2a and the supply flow path member 3, thereby liquid-tightly connecting the first flow path opening 251Ha of the first head module 2a and the flow path opening 31H of the supply flow path member 3. Similarly, the second seal member 4b is sandwiched between the second head module 2b and the supply flow path member 3, thereby liquid-tightly connecting the second flow path opening 251Hb of the second head module 2b to the flow path opening 31H of the supply flow path member 3. The first head module 2a and the second head module 2b each eject ink supplied from the supply flow path member 3.

[0066] The sealing area 4S of the first sealing member 4a does not overlap with the chip 20 of the first sealing member 4a when viewed in the Z1 direction. Similarly, the sealing area 4S of the second sealing member 4b does not overlap with the chip 20 of the second sealing member 4b when viewed in the Z1 direction. Furthermore, the sealing members 4 corresponding to each of the multiple head modules 2 of the liquid jet head 1 do not overlap with the chip 20 when viewed in the Z1 direction. Therefore, in the multiple head modules 2, it is possible to suppress a decrease in the sealing performance of the sealing members 4 while suppressing the effect of the reaction force of the sealing members 4 on the chip 20. This makes it possible to improve the reliability of the liquid jet head 1.

[0067] 10, the communication port 4H, the flow path opening 251H, and the flow path opening 31H do not overlap with the chip 20 when viewed in the Z1 direction. The communication port 4H, the flow path opening 251H, and the flow path opening 31H are each disposed outside the chip 20 when viewed in the Z1 direction. Specifically, the communication port 4H, the flow path openings 251H, and 31H are disposed on both longitudinal sides of the chip 20 when viewed in the Z1 direction. Therefore, as described above, the sealing region 4S of the sealing member 4 that liquid-tightly seals the flow paths 25R and 3R can be disposed outside the chip 20. Therefore, as described above, the influence of the reaction force of the sealing member 4 on the chip 20 can be suppressed.

[0068] Furthermore, the sealing area 4S is arranged in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2 relative to the chip 20, when viewed in the Z1 direction. By arranging the sealing area 4S in the longitudinal direction of the chip 20, it is possible to prevent the sealing area 4S from being arranged between adjacent chips 20. Therefore, providing the sealing area 4S prevents the distance between adjacent chips 20 from becoming too large. This makes it less likely that the printing quality will be affected.

[0069] The sealing region 4S may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2. The sealing member 4 may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2.

[0070] 1-3D. Support member 5 The support member 5 shown in FIGS. 4 to 6 is a member that supports the head module 2. The support members 5 are provided in a one-to-one correspondence with the head modules 2. The support member 5 is a long, plate-like member that extends along the Y axis and has its thickness direction along the Z axis. The support member 5 is disposed in the Z1 direction relative to the flow path opening forming member 25. The support member 5 is a member that sandwiches the seal member 4 and the flow path opening forming member 25 between itself and the supply flow path member 3. As shown in FIG. 5, the support member 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The support member 5 is a member that does not have a flow path through which ink flows.

[0071] Each support member 5 and the corresponding head module 2 are fixed to each other with an adhesive. Furthermore, a subunit 15 including each support member 5 is detachably fixed to a holder 6, which will be described later. Specifically, the support members 5 are not joined with an adhesive or the like. Therefore, each subunit 15 can be replaced individually. The support members 5 and the head modules 2 are fixed to each other with an adhesive.

[0072] Therefore, for example, when one of the multiple head modules 2 included in the head unit 10 breaks down, the liquid jet head 1 can be refurbished by replacing the sub-unit 15 including the broken head module 2 with another sub-unit 15 including a non-faulty head module 2.

[0073] Furthermore, the head module 2 and the supply flow path member 3 are not connected to each other by adhesive, but are connected to each other by a sealing member 4. Therefore, when replacing the head module 2, it is easy to release the flow path connection between the head module 2 and the supply flow path member 3. Therefore, the head module 2 can be easily replaced.

[0074] It is preferable that each support member 5 and the corresponding head module 2 are fixed with an adhesive, but the head module 2 may be configured to be removable from the support member 5 by disassembling the adhesive.

[0075] The support member 5 is made of, for example, a metal. The support member 5 is made of, for example, a metal such as aluminum or stainless steel. The support member 5 has the rigidity to support the plurality of head modules 2.

[0076] An opening 5H is provided in the support member 5. The opening 5H is a hole that penetrates the support member 5 in the thickness direction. The opening 5H is provided to expose a part of the head module 2 to the outside. Specifically, as shown in FIG. 6, the chip 20 is exposed from the opening 5H. Therefore, a plurality of nozzles N are exposed from the opening 5H.

[0077] FIG. 12 is a top view of the support member 5 shown in FIG. 5. As shown in FIGS. 5 and 12, the support member 5 includes a support region 5S. The support region 5S is part of the surface 512 of the support member 5 facing the Z2 direction. In FIG. 12, the support region 5S is shaded to make it easier to understand. In the example of FIG. 12, the support region 5S has a rectangular frame shape when viewed in the Z1 direction.

[0078] As shown in Fig. 5, the support region 5S is in contact with the flow path opening-forming member 25 and is a region that directly supports the flow path opening-forming member 25. The support region 5S is in contact with the supported surface 2511 of the flow path opening-forming member 25. Furthermore, as shown in Fig. 12, the support region 5S includes a region S50 that overlaps with the sealing region 4S when viewed in the Z1 direction. In Fig. 12, the region S50 is indicated by dots.

[0079] Since the support region 5S includes a region S50 that overlaps with the sealing region 4S when viewed in the Z1 direction, the support member 5 receives the reaction force of the sealing member 4 perpendicularly. Therefore, the support member 5 can firmly support the sealing region 4S of the sealing member 4 between itself and the supply flow path member 3. Therefore, the reaction force of the sealing member 4 can be alleviated particularly effectively.

[0080] Furthermore, a portion of the surface 251 of the flow path opening forming member 25 facing the Z1 direction has a supported surface 2511. When viewed in the Z1 direction, the supported surface 2511 is supported so as to surround the opening 5H of the support member 5 and to be in contact with the support member 5. Specifically, as described above, the flange portion 250 of the flow path opening forming member 25 has the supported surface 2511, and the supported surface 2511 comes into contact with the support region 5S of the support member 5, thereby holding the head module 2 to the support member 5. By supporting the flow path opening forming member 25 by the support member 5 in this way, the load of the seal member 4 can be dispersed. This makes it possible to make the flow path opening forming member 25 less likely to break.

[0081] The contact between the supported surface 2511 and the support region 5S includes both direct contact between them and connection between them via an adhesive or an elastic bushing or the like. Therefore, the flow path opening-forming member 25 may be in direct contact with the support member 5, or indirect contact between them via an adhesive or another member such as a bushing. The flange portion 250 does not have to be a rectangular frame in plan view. For example, the flange portion 250 may be rectangular in plan view and provided in both the Y1 direction and the Y2 direction with respect to the opening 5H.

[0082] Furthermore, the thickness of the flange portion 250, i.e., the length along the Z1 direction, is preferably thicker than the thickness of the portion disposed within the opening 5H of the flow path opening-forming member 25. Furthermore, the thickness of the flange portion 250 is preferably at least half the maximum thickness of the flow path opening-forming member 25. Such a thickness relationship prevents a decrease in the strength of the flange portion 250, and makes it easy to ensure strength when subjected to the reaction force of the sealing member 4.

[0083] 5, the thickness D5 of the support member 5 in the Z1 direction is greater than the thickness D2 in the Z1 direction of the chip 20. This reduces the risk that the support member 5 will be deformed by the reaction force of the seal member 4.

[0084] Furthermore, the thickness D5 of the support member 5 is preferably at least twice, and more preferably at least three times, the thickness D2 of the chip 20. This further reduces the risk of the support member 5 being deformed by the reaction force of the seal member 4. Note that the thickness D5 may be equal to or less than the thickness D2.

[0085] From the same viewpoint, the thickness D5 of the support member 5 is preferably 1 mm or more, and more preferably 2 mm or more. Furthermore, the thickness D5 may be 3 mm or more, 5 mm or more, or 6 mm or more to further increase the strength of the support member 5. From the viewpoint of increasing the distance between the medium 90 and the nozzle surface SN, i.e., the paper gap, the thickness D5 of the support member 5 is preferably 10 mm or less, and more preferably 7 mm or less.

[0086] As shown in FIG. 5, in addition to the chip 20, a portion of the flow path opening-forming member 25 is disposed within the opening 5H of the support member 5. That is, a portion of the flow path opening-forming member 25 is inserted into the opening 5H of the support member 5. When the support member 5 is present, the paper gap may increase depending on the thickness D5 of the support member 5. Specifically, if the thickness D5 of the support member 5 is excessively large, the surface of the chip 20 facing the Z1 direction may be positioned further in the Z2 direction than the surface of the support member 5 facing the Z1 direction. This increase in distance may result in a decrease in the accuracy of the ink landing position on the medium 90.

[0087] In this embodiment, as described above, in addition to the chip 20, a portion of the flow path opening forming member 25 is disposed within the opening 5H. Therefore, even if the thickness D5 of the support member 5 is increased to further increase the strength of the support member 5, an increase in the paper gap can be prevented.

[0088] Furthermore, the surface of the nozzle plate 201 of the chip 20 facing the Z1 direction, i.e., the nozzle surface SN, and the surface 511 of the support member 5 facing the Z1 direction are substantially flush with each other. That is, the nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction are at the same position on the Z axis. Therefore, an increase in the paper gap can be suppressed compared to when the nozzle surface SN is positioned further in the Z2 direction than the surface of the support member 5 facing the Z1 direction. Furthermore, it is easy to wipe the surface 511 of the support member 5 facing the Z1 direction and the nozzle surface SN together.

[0089] The nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction being approximately flush with each other means that they are not only completely flush with each other, but also include cases where there is a step to the extent that it includes manufacturing errors, etc.

[0090] The nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction do not have to be substantially flush. The nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction may be at different positions on the Z axis, and a step may exist between these surfaces. In this case, from the perspective of ease of wiping, the distance between the nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction is preferably 100 μm or less, and more preferably 50 μm or less.

[0091] Furthermore, the support member 5 is detachably fixed to a holder 6, which will be described later. For example, when the support member 5 is removed from the holder 6, the head module 2 and a wiring board 7, which will be described later, are removed from the holder 6 together with the support member 5. The liquid jet head 1 of this embodiment is configured so that when each head module 2 is removed and then reattached to the holder 6, the alignment accuracy between the multiple head modules 2 does not decrease.

[0092] 5 and 12, each support member 5 has two first positioning portions 502 and two fixing holes 501. Each first positioning portion 502 is used for positioning the support member 5 relative to the holder 6. Each fixing hole 501 is used for fixing the support member 5 to the holder 6.

[0093] Each first positioning portion 502 is provided on a surface 512 of the support member 5 facing the Z2 direction. In this embodiment, each first positioning portion 502 is a bottomed hole that opens on the surface 512 of the support member 5 facing the Z2 direction. Each first positioning portion 502 is a recessed portion provided on the surface 512 of the support member 5 facing the Z2 direction, and can also be considered to be a depression formed on the surface 512. The two first positioning portions 502 are provided on both sides of the opening 5H in the longitudinal direction of the support member 5. One of the two first positioning portions 502 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0094] Each fixing hole 501 is provided in a surface 512 of the support member 5 facing the Z2 direction. Each fixing hole 501 is a bottomed hole provided in the surface 512 of the support member 5 facing the Z2 direction. Each fixing hole 501 is also a recess provided in the surface 512 of the support member 5 facing the Z2 direction, and can also be considered to be a depression formed in the surface 512. The two fixing holes 501 are provided on both sides of the opening 5H in the longitudinal direction of the support member 5. One of the two fixing holes 501 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0095] The fixing holes 501 are spaced apart from the first positioning portions 502 and the opening 5H. The fixing holes 501 positioned in the Y1 direction relative to the opening 5H are closer to the opening 5H than the first positioning portions 502 positioned in the Y1 direction relative to the opening 5H. Similarly, the fixing holes 501 positioned in the Y2 direction relative to the opening 5H are closer to the opening 5H than the first positioning portions 502 positioned in the Y2 direction relative to the opening 5H. The first positioning portions 502, fixing holes 501, and opening 5H are aligned along the longitudinal direction of the support member 5.

[0096] The shortest distance between the fixing hole 501 and the opening 5H is shorter than the shortest distance between the first positioning portion 502 and the opening 5H, but it may be longer. Furthermore, the first positioning portion 502, the fixing hole 501, and the opening 5H do not have to be aligned along the longitudinal direction of the support member 5. For example, the first positioning portion 502 may be provided on both sides of the opening 5H in the X-axis direction.

[0097] 1-3E. Holder 6 As shown in FIGS. 3 to 5, the holder 6 is a case that houses multiple head modules 2 and supply flow path members 3. The holder 6 is box-shaped and has a recess 610 that opens in the Z1 direction. The multiple head modules 2 and supply flow path members 3 are arranged in the housing space inside the recess 610 of the holder 6. It can also be said that the housing space for the multiple head modules 2 and supply flow path members 3 is formed by the holder 6 and the multiple support members 5.

[0098] The relay substrate 70 is disposed on the bottom surface of the recess 610 of the holder 6. The bottom surface is the surface of the recess 610 of the holder 6 that faces the Z1 direction. The holder 6 is made of a metal such as aluminum or stainless steel. Although not shown in detail, the holder 6 has an opening through which an external wiring member of the liquid jet head 1 is inserted to electrically connect the relay substrate 70 and the control unit 91.

[0099] The holder 6 includes a flat plate portion 61, a side wall portion 62, a plurality of partition wall portions 63, and two flange portions 64. The flat plate portion 61, the side wall portion 62, the plurality of partition wall portions 63, and the two flange portions 64 are integrally formed. The flat plate portion 61 is a flat portion along the XY plane and is located in the Z2 direction of the supply flow path member 3. The side wall portion 62 is a portion extending in the Z1 direction from the outer edge of the flat plate portion 61. The planar shape of the side wall portion 62 is a rectangular frame. As shown in FIG. 4, the plurality of partition wall portions 63 are arranged between the plurality of head modules 2. Each partition wall portion 63 extends along the Y axis. The partition wall portions 63 and the head modules 2 are arranged alternately along the X axis.

[0100] Fig. 13 is a top view of the upper part of the holder 6 shown in Fig. 5. Fig. 14 is a view showing the lower part of the holder 6 shown in Fig. 5. As shown in Figs. 4 and 13, the upper part of the holder 6 does not have a plurality of partitions 63. In contrast, as shown in Figs. 4 and 14, the lower part of the holder 6 has a plurality of partitions 63. The part of the holder 6 where the plurality of partitions 63 are provided can be considered to be the lower part of the holder 6, and the part where the plurality of partitions 63 are not provided can be considered to be the upper part of the holder 6.

[0101] 12 and 13, the partition walls 63 are present in an area where the head modules 2 are provided. The partition walls 63 are located in the Z1 direction from the center of the holder 6 in the Z axis direction. The partition walls 63 are not provided in a portion of the holder 6 in the Z2 direction from the center of the Z axis direction so that the supply flow path member 3 can be disposed therein.

[0102] 5 and 14, each holder 6 has two second positioning portions 602 and two first fixing holes 61H. As described above, the support member 5 is detachable from the holder 6. The second positioning portions 602 are used for positioning the support member 5 relative to the holder 6. The first fixing holes 61H are used for fixing the support member 5 to the holder 6.

[0103] Each second positioning portion 602 is provided on a surface 605 of the holder 6 facing the Z1 direction. In this embodiment, each second positioning portion 602 is a protrusion that protrudes in the Z1 direction from the surface 605 of the holder 6 facing the Z1 direction. As shown in FIG. 13 , each second positioning portion 602 is provided in the Y1 direction or the Y2 direction with respect to the recess 610 as viewed in the Z1 direction. Furthermore, the two second positioning portions 602 are provided corresponding to the two first positioning portions 502 described above, and overlap the two first positioning portions 502 as viewed in the Z1 direction. Therefore, the multiple second positioning portions 602 are provided in one-to-one correspondence with the multiple first positioning portions 502.

[0104] Each first fixing hole 61H is a hole that penetrates the holder 6 in the Z1 direction. When viewed in the Z1 direction, each first fixing hole 61H is provided in the Y1 direction or the Y2 direction relative to the recess 610. The two first fixing holes 61H are provided corresponding to the two fixing holes 501 described above, and overlap with the two fixing holes 501 when viewed in the Z1 direction.

[0105] Each first fixing hole 61H positioned in the Y1 direction relative to the recess 610 is closer to the recess 610 than the second positioning portion 602 positioned in the Y1 direction relative to the recess 610. Similarly, each first fixing hole 61H positioned in the Y2 direction relative to the recess 610 is closer to the recess 610 than the first positioning portion 502 positioned in the Y2 direction relative to the recess 610. Furthermore, the first fixing holes 61H and the second positioning portions 602 are spaced apart from each other and aligned along the Y axis.

[0106] The shortest distance between the first fixing hole 61H and the recess 610 is shorter than the shortest distance between the second positioning portion 602 and the recess 610, but it may be longer. In addition, the second positioning portion 602 and the first fixing hole 61H do not have to be aligned along the longitudinal direction of the support member 5.

[0107] Each second positioning portion 602 is press-fitted into the aforementioned first positioning portion 502 to position the support member 5 relative to the holder 6. Furthermore, the first positioning portion 502 and the second positioning portion 602 are provided for each support member 5, i.e., for each head module 2 held by the support member 5.

[0108] The provision of the first positioning portion 502 and the second positioning portion 602 makes it easy to position the support member 5 when attaching it to the holder 6. Furthermore, the provision of the first positioning portion 502 and the second positioning portion 602 for each support member 5 makes it possible to align the multiple support members 5 with each other with high precision using the holder 6 as a reference.

[0109] As described above, each support member 5 holds a head module 2. Therefore, by providing the first positioning portion 502 and the second positioning portion 602, it is possible to position the head module 2 fixed to the support member 5 with respect to the holder 6. Furthermore, by providing the first positioning portion 502 and the second positioning portion 602 for each support member 5, it is possible to align the multiple head modules 2 with respect to each other with high precision, using the holder 6 as a reference. In other words, it is possible to align the multiple head modules 2 with each other for each support member 5, using the holder 6 as a reference. Therefore, when replacing only some of the multiple head modules 2, it is not necessary to redo the alignment of all of the head modules 2.

[0110] Furthermore, alignment between the multiple head modules 2 can be performed with high precision by the simple method of press-fitting the second positioning portion 602 into the first positioning portion 502. This makes it easy to replace a desired head module 2 from among the multiple head modules 2. Therefore, it is easy to remanufacture the liquid jet head 1 by replacing the head module 2.

[0111] Furthermore, the multiple second positioning parts 602 are arranged on a surface 605 of the holder 6 facing the Z1 direction. Furthermore, as described above, the first positioning parts 502 are arranged on a surface 512 of the support member 5 facing the Z2 direction, which is the opposite direction to the Z1 direction. Each head module 2 is supported on the surface 512 of the support member 5 facing the Z2 direction. By arranging the first positioning parts 502, the second positioning parts 602, and the head modules 2 in this manner, it is possible to easily attach and detach only the subunit 15 including the support member 5 and head module 2 to be replaced from below the holder 6. Therefore, when replacing the subunit 15 to be replaced with a subunit 15 including a head module 2 that is not faulty and reattaching it to the holder 6, it is sufficient to connect the flow path of the head module 2 to be replaced to the supply flow path member 3 and electrically connect the wiring board 7 attached to the head module 2 to be replaced to the relay board 70. Therefore, it is not necessary to connect the flow paths to the supply flow path members 3 of the head modules 2 other than the head module to be replaced, and it is not necessary to electrically connect the wiring board 7 to the relay board 70. This makes it possible to simplify the attachment and detachment work when repairing the liquid jet head 1.

[0112] Furthermore, the supply flow path member 3 and the wiring board 7 are disposed on the bottom surface of the recess 610 of the holder 6, and the support member 5 that holds the head module 2 is disposed so as to cover the opening of the recess 610. This makes it easy to shorten the distance between the head module 2 and the supply flow path member 3, and also makes it easy to shorten the length of the wiring board 7.

[0113] Furthermore, in this embodiment, as described above, the first positioning portion 502 is a hole provided on the surface of the support member 5 facing the Z2 direction, and has a bottom surface recessed in the Z1 direction. Therefore, the first positioning portion 502 is not exposed to the outside of the support member 5. The first positioning portion 502 is not provided on the surface of the support member 5 facing the Z1 direction. Therefore, it is possible to prevent mist of ink ejected from the nozzle N from adhering to the first positioning portion 502.

[0114] Furthermore, the aforementioned supply flow path member 3 is disposed in the Z2 direction relative to the multiple head modules 2, and overlaps the multiple head modules 2 when viewed in the Z1 direction. In this configuration in which multiple head modules 2 are disposed below the supply flow path member 3, the first positioning portion 502 is provided on the surface of the support member 5 that faces the Z2 direction. This makes it easy to attach and detach only the subunit 15 to be replaced from below the holder 6 and the supply flow path member 3. This eliminates the need to disconnect the flow paths of subunits 15 other than the one to be replaced from the supply flow path member 3, simplifying the attachment and detachment work.

[0115] Although the holder 6 and the supply flow path member 3 are separate bodies, they may be integrated.

[0116] Furthermore, fixing members 151 are inserted through the first fixing holes 61H and the fixing holes 501. The fixing members 151 fix the support members 5 to the holder 6. As shown in FIGS. 3, 4 and 13, the fixing members 151 are provided for each support member 5. In this embodiment, two fixing members 151 are provided for one support member 5.

[0117] The multiple fixing members 151 detachably fix each of the multiple support members 5 to the holder 6. Therefore, each fixing member 151 can be considered to fix the head module 2 to the supply flow path member 3 by fixing the support member 5 to the holder 6.

[0118] The fixing member 151 is inserted in the Z1 direction through the first fixing hole 61H, which is a through-hole, and the recessed fixing hole 501, in that order. Therefore, a portion of the fixing member 151 is exposed from the surface 606 of the holder 6 facing the Z2 direction, but the fixing member 151 is not exposed from the surface 511 of the support member 5 facing the Z1 direction. This makes it possible to prevent ink mist from adhering to the fixing member 151 and solidifying. This makes it possible to prevent the fixing member 151 from becoming difficult to remove from the holder 6 and the support member 5 due to the adhesion of the ink mist.

[0119] Depth D61 of first fixing hole 61H is deeper than depth D51 of fixing hole 501. First fixing hole 61H and fixing hole 501 are each formed along the Z1 direction. Depths D61 and D51 are each the depth along the Z1 direction.

[0120] Subunit 15 is small for the user and difficult to grip. Depth D61 of first fixing hole 61H is deeper than depth D51 of fixing hole 501, that is, depth D51 of fixing hole 501 is shallower than depth D61 of first fixing hole 61H, so that even if subunit 15 is difficult to grip, it is easy to release subunit 15 from holder 6.

[0121] For example, after removing the fixing member 151 from the first fixing hole 61H, a long rod-shaped member is inserted into the first fixing hole 61H and the member is used to press the support member 5 in the Z1 direction. This makes it possible to easily release the support member 5 from being pressed into the holder 6. In other words, by using the first fixing hole 61H as a hole for releasing the press-fit, the support member 5 from being pressed into the holder 6 can be easily released. Furthermore, because the thickness D6 of the holder 6 is thicker than the thickness D5 of the support member 5, it is easier to remove the support member 5 from the holder 6 than when the thickness D6 is thinner than the thickness D5.

[0122] A distance L51 from the bottom surface of the fixing hole 501 to a surface 511 of the support member 5 facing the Z1 direction is greater than a depth D51 of the fixing hole 501. Because the distance L51 is greater than the depth D51, the support member 5 is less likely to deform when the support member 5 is released from the holder 6 compared to when the distance L51 is smaller.

[0123] The distance L51 may be smaller than the depth D51. In this case, by reducing the distance L51 while ensuring the depth D51 necessary for positioning, it is easy to reduce the thickness D5 of the support member 5. Reducing the thickness D5 makes it possible to suppress an increase in the paper gap.

[0124] In this embodiment, the fixing member 151 is a screw. Therefore, a female thread is formed on the inner peripheral wall surface that forms the fixing hole 501. Since the fixing member 151 is a screw, the fixing of the support member 5 to the holder 6 can be easily released by rotating and fastening the screw. Since the fixing member 151 is a screw, the support member 5 can be detachably fixed to the holder 6 without using adhesive.

[0125] The fixing member 151 may be something other than a screw, and may include, for example, an L-shaped or T-shaped pin with the tip in the Z1 direction bent at a right angle and an elastic member such as a leaf spring or a coil spring, and may be configured to fix the holder 6 and the support member 5 together using the elastic force of the elastic member.

[0126] In this way, the fixing member 151 may have any configuration as long as it is a member that can fix the holder 6 and the support member 5 to each other.

[0127] 5 and 14, for example, two fixing members 151 are provided for each support member 5. The fixing members 151 are arranged so as not to overlap the chip 20 when viewed in the Z1 direction and so as to sandwich the sealing area 4S between them and the chip 20.

[0128] Because the fixing member 151 does not overlap with the chip 20 when viewed in the Z1 direction, the load generated by the fixing of the fixing member 151 is less likely to be applied to the chip 20 than when they overlap. Furthermore, by disposing the sealing member 4 between the fixing member 151 and the chip 20 when viewed in the Z1 direction, the distance between the chip 20 and the fixing member 151 can be increased by the dimension of the sealing member 4. Therefore, the load generated by the fixing of the fixing member 151 is less likely to be applied to the chip 20.

[0129] 13, the holder 6 has a plurality of fourth positioning portions 642. The plurality of fourth positioning portions 642 are provided on the flange portion 64. As shown in FIG. 5, the fourth positioning portions 642 are protrusions that protrude in the Z2 direction from the Z2-direction surface of the flange portion 64. The plurality of fourth positioning portions 642 are provided in one-to-one correspondence with the plurality of third positioning portions 102 of the unit base 11 shown in FIG. 2.

[0130] The fourth positioning portion 642 is press-fitted into one of the plurality of third positioning portions 102 provided on the unit base 11, thereby positioning the liquid jet head 1 with respect to the unit base 11. This makes it possible to improve the alignment accuracy between the plurality of liquid jet heads 1 with respect to the unit base 11.

[0131] Furthermore, mounting holes 64H are provided in the flange portion 64. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. Each mounting hole 64H is, for example, a bottomed hole that opens on the surface of the flange portion 64 in the Z2 direction, and is, for example, a screw hole for mounting the liquid jet head 1 to the unit base 11 with a member such as a screw. The flange portion 64 and the unit base 11 are fixed together by inserting screws or the like (not shown) through the mounting holes 101 and then the mounting holes 64H and fastening them together with the screws. As a result, the liquid jet head 1 is fixed to the unit base 11.

[0132] 1-3E. Wiring board 7, relay board 70 and connector 71 As shown in FIG. 4, a wiring board 7 is provided for each head module 2. The wiring board 7 is inserted through the through-hole 25H of the chip 20 and the through-hole 20H of the flow path opening forming member 25. The wiring board 7 is bonded to the vibration plate 204. The wiring board 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring board 7 is a mounting component on which a plurality of wires are formed for electrically connecting the chip 20 and the relay substrate 70. The wiring board 7 is, for example, a flexible board such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film) or a rigid board. A drive signal and a reference voltage for driving the drive elements E are supplied to each drive element E from the wiring board 7.

[0133] The relay board 70 is fixed to the bottom surface of a recess 610 in the Z1-direction surface 605 of the flat plate portion 61 of the holder 6. The relay board 70 is flat and fixed to the holder 6 with an adhesive or the like. The relay board 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay board 70. The plurality of connectors 71 are provided one-to-one with the plurality of wiring boards 7. An end of the wiring board 7, on which a plurality of terminals are provided, is detachably inserted into each connector 71. In other words, the wiring board 7 is preferably rigid so that the end of the wiring board 7 can be easily inserted into and removed from the connector 71. When the wiring board 7 is made of a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. When the end of the wiring board 7 is inserted into the connector 71, the wiring board 7 is electrically connected to the control unit 91 via the relay board 70.

[0134] The relay board 70 is electrically connected to the multiple head modules 2. The relay board 70 is arranged in the Z2 direction, which is the opposite direction to the Z1 direction, relative to the multiple head modules 2, and overlaps the multiple head modules 2 when viewed in the Z1 direction. The first positioning portion 502 is also provided on the surface of the support member 5 that faces the Z2 direction. This makes it easy to attach and detach only the subunit 15 to be replaced from below the holder 6 and the relay board 70. This eliminates the need to disconnect the electrical connections of subunits 15 other than the one to be replaced, simplifying the attachment and detachment work.

[0135] As described above, when only the subunit 15 to be replaced is attached to the holder 6 from below the holder 6, the wiring board 7 moves in the Z2 direction from below the connector 71 toward the connector 71. Then, the wiring board 7 is inserted into the connector 71. This establishes an electrical connection between the wiring board 7 and the relay board 70.

[0136] 1-3F. Bush As shown in FIG. 4, bushes 521 are provided between the multiple support members 5. The bushes 521 fill gaps formed between adjacent support members 5. For example, when viewed in the Z1 direction, the bushes 521 are elongated along the Y axis between adjacent support members 5. Furthermore, as shown in FIG. 5, bushes 522 are arranged between the holder 6 and the support members 5. Specifically, the bushes 522 are arranged between the holder 6 and both ends of the support members 5 in the longitudinal direction. Each of the bushes 521 and 522 is made of, for example, an elastic resin material.

[0137] By providing the bushes 521 and 522, it is possible to reduce the risk of ink mist or the like entering the accommodation space in the recess 610 of the holder 6 from the outside of the liquid jet head 1.

[0138] 2. Variations The first embodiment exemplified above can be modified in various ways. Specific modified aspects that can be applied to the first embodiment are exemplified below. Two or more aspects arbitrarily selected from the following examples can be combined as appropriate within a range that does not contradict each other.

[0139] 2-1. First modified example Figures 15 and 16 are cross-sectional views of a portion of the liquid jet head 1 of the first modified example. Figure 17 is a top view of the liquid jet head 1 of the first modified example.

[0140] 15, a bushing 523 is provided. Although not shown in detail, the bushing 523 has a rectangular frame shape that follows the outer periphery of the support member 5 when viewed in the Z1 direction. This prevents ink mist and the like from entering the space inside the recess 610 of the holder 6. Note that the multiple bushings 523 may be configured as a single unit, or may be a common member for the multiple support members 5.

[0141] As shown in FIG. 16 , in the first modified example, the support member 5 and the head module 2 are molded with adhesives 531 and 532. The adhesive 531 molds the gap between the flow path opening forming member 25 and the support member 5. The adhesive 531 also overlaps the seal member 4 when viewed in the Z1 direction. The adhesive 532 molds the gap between the chip 20 and the support member 5. Although not shown in detail, the adhesive 531 is provided in the shape of a rectangular frame surrounding the opening 5H when viewed in the Z1 direction. The adhesive 532 is provided along the inner peripheral wall of the opening 5H. This makes it possible to prevent ink mist and the like from entering the space within the recess 610 of the holder 6.

[0142] The holder 6 of the liquid jet head 1 of the first modified example includes a first member 691 and a second member 692. The first member 691 and the second member 692 are configured as separate bodies. The first member 691 corresponds to the upper part of the holder 6 of the first embodiment described above. Therefore, the first member 691 is configured from the flat plate portion 61 and a part of the side wall portion 62. The second member 692 corresponds to the lower part of the holder 6 of the first embodiment described above. The second member 692 is configured from a part of the side wall portion 62 and a plurality of partition wall portions 63.

[0143] The first member 691 is provided with a plurality of fixing holes 611H and 612H. The second member 692 is provided with a plurality of fixing holes 613 and a fixing hole 614H. The fixing holes 613 correspond one-to-one to the fixing holes 611H and overlap with the fixing holes 611H when viewed in the Z1 direction. The fixing holes 611H and 612H are holes that penetrate the first member 691 in the thickness direction. The fixing hole 611H does not overlap with the recess 610 when viewed in the Z1 direction. The fixing hole 612H overlaps with the recess 610 when viewed in the Z1 direction. The fixing hole 614H penetrates the second member 692 in the thickness direction. The fixing hole 614H does not overlap with the recess 610 when viewed in the Z1 direction. The fixing hole 614H is provided for each support member 5. The fixing hole 613 is a bottomed hole that opens onto the surface of the second member 692 facing the Z2 direction.

[0144] In the first modified example, fixing holes 321 are provided in the supply flow path member 3. The fixing holes 321 are bottomed holes that open on the surface of the supply flow path member 3 facing the Z2 direction. The fixing holes 321 are provided for each fixing hole 612H and overlap the fixing holes 612H when viewed in the Z1 direction.

[0145] Moreover, in the first modified example, the support member 5 is provided with fixing holes 504. The fixing holes 504 are bottomed holes that open to the surface 512 of the support member 5 facing the Z2 direction. The fixing holes 504 are provided for each fixing hole 614H and overlap with the fixing holes 614H when viewed in the Z1 direction.

[0146] Furthermore, the liquid jet head 1 of the first modified example has a fixed member group 150. The fixed member group 150 includes a plurality of fixed members 152, 153, and 154.

[0147] Fixing member 152 is inserted through fixing hole 611H and fixing hole 613 in this order. Fixing member 152 fixes first member 691 and second member 692 to each other. Fixing member 153 is inserted through fixing hole 612H and fixing hole 321 in this order. Fixing member 153 fixes first member 691 and supply flow path member 3 to each other. Fixing member 154 is inserted through fixing hole 614H and fixing hole 504 in this order. Fixing member 154 fixes second member 692 and support member 5 to each other.

[0148] 17, the plurality of fixing members 152 are provided, for example, near the corners of the holder 6, which has a rectangular shape when viewed in the Z1 direction. The plurality of fixing members 153 are provided, for example, near the corners of the holder 6, which has a rectangular shape when viewed in the Z1 direction. The fixing members 154 are provided for each support member 5.

[0149] The fixing member group 150 fixes the support member 5 to the holder 6, and indirectly fixes the multiple head modules 2 to the holder 6. Furthermore, by providing the multiple fixing members 153, the supply flow path member 3 is not joined to the holder 6, but is fixed so that it can be attached and detached. Therefore, in addition to the subunit 15, the supply flow path member 3 can be replaced.

[0150] The fixing members 152, 153, and 154 are, for example, screws, but may also be the aforementioned L-shaped pins or T-shaped pins.

[0151] It is preferable that fixing member 152 is longer than fixing member 154, and that fixing member 152 and fixing member 154 have male threads with the same outer shape and pitch. First, fixing member 152 is removed from fixing hole 613, thereby removing first member 691 from second member 692. Next, fixing member 154 is removed from fixing hole 504, and then fixing member 152, which is longer than fixing member 154, is fastened to fixing hole 504, thereby allowing support member 5 to move in the Z1 direction relative to second member 692, and therefore facilitating the release of the press-fit state between first positioning portion 502 and second positioning portion 602.

[0152] 2-2. Second modified example 18 and 19 are cross-sectional views of a portion of a liquid jet head 1 according to a second modified example. The liquid jet head 1 according to the second modified example shown in Fig. 18 and Fig. 19 has a cover 85. The cover 85 is fixed to the flange portion 64 of the holder 6.

[0153] The cover 85 is provided in common to the multiple support members 5 and covers the multiple support members 5 except for the openings 5H. The cover 85 is a plate-shaped member made of, for example, metal. The cover 85 is positioned in the Z1 direction of the multiple support members 5 and contacts the multiple support members 5. The cover 85 has multiple openings 85H. The multiple openings 85H are provided in one-to-one correspondence with the nozzle surfaces SN of the multiple head modules 2 and expose the nozzle surfaces SN.

[0154] Furthermore, the cover 85 covers the side wall surfaces of the multiple support members 5. A portion of the cover 85 has a flange 851 that is in contact with the surface of the flange portion 64 facing the Z2 direction. A through hole is formed in the flange 851 for inserting the mounting screw 156. The flange portion 64 is also formed with a screw hole 643 that overlaps the through hole when viewed from the Z1 direction. The screw hole 643 is a bottomed hole that opens on the surface of the flange portion 64 facing the Z1 direction. With the cover 85 in contact with the multiple support members 5, the mounting screw 156 is inserted into the screw hole 643 and screwed in, thereby fixing the cover 85 to the flange portion 64.

[0155] By providing the cover 85, the ink mist is prevented from entering the recess 610 of the holder 6.

[0156] 2-3. Third modified example 20 and 21 are cross-sectional views of a portion of the liquid jet head 1 of the third modified example. Fig. 22 is a diagram showing a second member 692 of the holder 6 of the third modified example. The following mainly describes the parts that differ from the first modified example.

[0157] 20, a bushing 524 is provided. Although not shown in detail, the bushing 524 has a rectangular frame shape that surrounds the opening 5H of the support member 5 when viewed in the Z1 direction. This makes it possible to prevent ink mist and the like from entering the space within the recess 610 of the holder 6.

[0158] 21 and 22, the flow path opening forming member 25 of the third modified example has a flange 209. The flange 209 is provided in the Y1 and Y2 directions of the chip 20 when viewed in the Z1 direction. As shown in FIG. 21, a fixing hole 211H is provided in the flange 209. Furthermore, the support member 5 is provided with a fixing hole 505 corresponding to the fixing hole 211H. The fixing hole 505 is a bottomed hole that opens on the surface of the support member 5 facing the Z2 direction. The fixing hole 505 is provided to correspond to the fixing hole 211H and overlaps with the fixing hole 211H when viewed in the Z1 direction.

[0159] Furthermore, the fixing member group 150 of the third modified example includes a plurality of fixing members 155, 152, and 154. The fixing member 155 is inserted through the fixing hole 211H and the fixing hole 505 in this order. The fixing member 155 fixes the flow path opening forming member 25 and the support member 5 to each other. The fixing member 155 is provided for each support member 5.

[0160] The fixing member group 150 fixes the support member 5 to the holder 6 and fixes the head module 2 to the support member 5, thereby indirectly fixing the multiple head modules 2 to the holder 6. Furthermore, by providing the multiple fixing members 155, the head module 2 is fixed to the support member 5 without using adhesive or the like. This makes it easy to attach and detach the head module 2 to and from the support member 5. In particular, since the fixing members 155 are screws, it is particularly easy to attach and detach the head module 2 to and from the support member 5. Note that the fixing members 155 may be, for example, T-shaped or L-shaped pins. Furthermore, by fixing the head module 2 to the support member 5 with the fixing members 155, it is possible to suppress misalignment between the multiple head modules 2 compared to when the head modules 2 are fixed using an adhesive.

[0161] Furthermore, the bushing 524, the support member 5, the head module 2, and the seal member 4 overlap when viewed in the Z1 direction. Therefore, compared to when these do not overlap, the risk of the flange 209 being deformed by the reaction force of the seal member 4 is reduced.

[0162] 2-5. Fifth Variation 23 is a cross-sectional view of a portion of the liquid jet head 1 of the fifth modified example. In the liquid jet head 1 of the fifth modified example shown in FIG. 23, the first positioning portion 502a is a pin that protrudes in the Z2 direction from the surface of the support member 5 facing the Z2 direction. The second positioning portion 602a is a bottomed hole that opens in the Z1 direction of the holder 6. The second positioning portion 602a is also a recess, i.e., a depression, formed in the holder 6 in the Z1 direction. The second positioning portion 602a is press-fitted into the first positioning portion 502a, thereby positioning the support member 5 with respect to the holder 6.

[0163] Even with these first positioning portion 502a and second positioning portion 602a, it is possible to easily perform positioning when attaching the support member 5 to the holder 6, as in the first embodiment. Furthermore, it is possible to perform highly accurate alignment between multiple support members 5 with respect to the holder 6. Therefore, it is possible to perform highly accurate alignment between multiple head modules 2 with respect to the holder 6. Furthermore, when replacing only some of the multiple head modules 2, it is not necessary to redo the alignment of all of the head modules 2.

[0164] As shown in the first embodiment and the fifth modified example, alignment of multiple head modules 2 can be performed with high precision by the simple method of press-fitting either the second positioning portion 602 or the first positioning portion 502 into the other.

[0165] Furthermore, the fourth positioning portion 642a is a bottomed hole that opens in the Z2 direction of the flange portion 64. The fourth positioning portion 642a is also a recess, i.e., a depression, formed in the Z1 direction of the flange portion 64. Although not shown, in this case, the third positioning portion 102 is configured by a protrusion provided on the unit base 11. The fourth positioning portion 642a is press-fitted into the third positioning portion 102, thereby enabling the liquid jet head 1 to be positioned with respect to the unit base 11. This makes it possible to improve the alignment accuracy between multiple liquid jet heads 1 using the unit base 11 as a reference.

[0166] 2-6. Sixth Variation FIG. 24 is a cross-sectional view showing a sealing member 4 of a sixth modified example and its vicinity. FIG. 25 is a cross-sectional view of a portion of a liquid jet head 1 of a sixth modified example. The thickness of the sealing member 4 of the sixth modified example shown in FIG. 24 is not constant. The sealing member 4 of the sixth modified example includes a thick portion 41 and a thin portion 42. The thick portion 41 is located near the inner wall surface that forms the communication port 4H, and is thicker than the thin portion 42. The thin portion 42 is located outside the thick portion 41.

[0167] In the sixth modified example, the thick portion 41 of the seal member 4 has the sealing region 4S. The thick portion 41 is in contact with the flow path opening forming member 25 and the supply flow path member 3, and is sandwiched between the flow path opening forming member 25 and the supply flow path member 3.

[0168] 25, fixing member 151 for fixing head module 2 and supply flow path member 3 is arranged so as not to overlap chip 20 when viewed in the Z1 direction, and so as to sandwich sealing region 4S between chip 20. Furthermore, support region 5S includes region S55 that is arranged between sealing region 4S and chip 20 when viewed in the Z1 direction. Therefore, it is possible to reduce the influence of the reaction force of sealing member 4 on chip 20 compared to when support region 5S does not include region S55.

[0169] 2-7. 7th Variation FIG. 26 is a cross-sectional view showing a sealing member 4 of a seventh modified example and its vicinity. The sealing member 4 of the seventh modified example shown in FIG. 26 includes a portion that is not in contact with both the supply flow path member 3 and the flow path opening formation member 25. The sealing member 4 of the seventh modified example has a sealing region 4S near the communication port 4H. Thus, depending on the shapes of the supply flow path member 3 and the flow path opening formation member 25, the sealing member 4 may include a portion that is not in contact with both the supply flow path member 3 and the flow path opening formation member 25 and is not sandwiched between them. The portion of the sealing member 4 that is not sandwiched between the supply flow path member 3 and the flow path opening formation member 25 corresponds to the sealing region 4S.

[0170] 2-8. Eighth Variation FIG. 27 is a cross-sectional view showing the first positioning portion and the second positioning portion of the eighth modified example. In the eighth modified example shown in FIG. 27, one support member 5a holds multiple head modules 2. In this way, one support member 5a does not have to hold one head module 2. In this case, one support member 5a has multiple openings 5H corresponding to the multiple head modules 2. In this case, the support member 5a serves as the reference for positioning the multiple head modules 2. In the example shown in the figure, one support member 5a supports three head modules 2. That is, a support member 5a is provided for each of the three head modules 2. Two first positioning portions 502 are provided for each support member 5a. Therefore, the two first positioning portions 502 are common to the three head modules 2. The support member 5a serves as the reference for positioning the three head modules 2. Two fixing holes 501 are also provided for each support member 5a. Therefore, the two fixing holes 501 are common to the three head modules 2.

[0171] In the eighth modified example, one support member 5a holds multiple head modules 2. That is, one support member 5 holds two or more head modules 2. For example, two or more head modules 2 that are to be replaced at similar times are held by one support member 5. This makes it possible to replace two or more head modules 2 that are to be replaced at similar times together, making the work easier.

[0172] In the eighth modification, for example, it is preferable that the support member 5 holds, among the plurality of head modules 2, a plurality of head modules 2 that eject the same type of liquid. This makes it possible to collectively replace head modules 2 that are nearing the end of their lifespan, for example, head modules 2 that eject types of liquids with a high ejection frequency (for example, black ink, white ink, pre-treatment liquid such as a reaction liquid that aggregates the pigment contained in the ink, and post-treatment liquid such as an overcoat liquid). This improves the workability of replacement. Note that two or more head modules 2 held by one support member 5 do not have to eject the same type of ink. Also, one head module 2 may be capable of ejecting one type of ink, or may be capable of ejecting two or more types of ink.

[0173] 3. Second embodiment A second embodiment of the present disclosure will be described below. In the following exemplary embodiments, elements whose actions or functions are similar to those of the first embodiment will be designated by the same reference numerals as those used in the description of the first embodiment, and detailed descriptions of each element will be omitted where appropriate.

[0174] 3-1. Liquid jet head 1A Fig. 28 is a cross-sectional view of the liquid jet head 1A according to the second embodiment, as viewed in the direction along the Y axis. Fig. 29 is a cross-sectional view of the liquid jet head 1A according to the second embodiment, as viewed in the direction along the X axis.

[0175] As shown in FIGS. 28 and 29, the liquid jet head 1A includes a plurality of head modules 2A, a seal member 4, a support member 5A, a holder 6A, a plurality of wiring boards 7, a relay board 70, and a fixing member group 150A.

[0176] In the second embodiment, the two supply flow path members 3 of the first embodiment are not provided, and the holder 6A has the function of the supply flow path members 3 of the first embodiment, that is, the function of a common flow path member. In other words, the holder 6A is an example of a "supply flow path member." Also, one support member 5A holds multiple head modules 2A. Also, in the second embodiment, the head modules 2A and the support member 5A are not fixed to the holder 6A with adhesive, and are detachable from the holder 6A.

[0177] 3-1A. Head module 2A In the second embodiment, a plurality of head modules 2A are provided, similarly to the first embodiment. Each head module 2A in the second embodiment includes a chip 20 and a flow path opening forming member 25A.

[0178] Fig. 30 is a bottom view of the liquid jet head 1A shown in Fig. 28. As shown in Fig. 21, each head module 2A has a plurality of nozzles N that eject ink, similar to the first embodiment. Furthermore, each nozzle N is exposed from an opening 5H that is provided in a support member 5A, which will be described later.

[0179] Fig. 31 is a top view of a flow path opening forming member 25A included in the head module 2A shown in Fig. 28. As shown in Fig. 28, in this embodiment, as in the first embodiment, the planar shape of the flow path opening forming member 25A is larger than the planar shape of the chip 20. That is, the chip 20 has a smaller outer shape than the flow path opening forming member 25A when viewed in the Z1 direction.

[0180] 29 and 31, the flow path opening-forming member 25A of this embodiment has a flange portion 250 for fixing to the support member 5A, similar to the first embodiment. The surface of the flange portion 250 facing the Z1 direction is a supported surface 2511 that is supported by the support member 5A. The planar shape of the flange portion 250 and the planar shape of the supported surface 2511 are each a rectangular frame that surrounds the opening 5H. Similarly to the first embodiment, the flow path opening-forming member 25A of this embodiment has a flow path 25R therein. The open ends of the flow path 25R in the Z1 direction are each a flow path opening 251H.

[0181] 29 and 31, each flow path opening forming member 25 is provided with two fixing holes 215 and two first positioning portions 216. The head module 2A including the flow path opening forming member 25A is detachable from the holder 6A. Each first positioning portion 216 is used for positioning the head module 2A relative to the holder 6A. Each fixing hole 215 is used to fix the head module 2A to the holder 6A.

[0182] Each first positioning portion 216 is provided on a surface 252 of the flow path opening forming member 25A facing the Z2 direction. This surface 252 is also the surface of the head module 2A facing the Z2 direction. In this embodiment, each first positioning portion 216 is a protrusion that protrudes in the Z2 direction from the surface 252 of the flow path opening forming member 25A facing the Z2 direction. The two first positioning portions 216 are provided on both sides of the opening 5H of the holder 6A in the longitudinal direction of the flow path opening forming member 25A. One of the two first positioning portions 216 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0183] Each fixing hole 215 is provided in a surface 252 of the flow path opening-forming member 25A facing the Z2 direction. Each fixing hole 215 is a bottomed hole that opens in the surface 252 of the flow path opening-forming member 25A facing the Z2 direction. Each fixing hole 215 is a recessed portion provided in the surface 252 of the flow path opening-forming member 25A facing the Z2 direction, and can also be considered to be a depression formed in the surface 252. Two fixing holes 215 are provided in the longitudinal direction of the flow path opening-forming member 25A, on both sides of the through-hole 25H and on both sides of the opening 5H of the holder 6A. One of the two fixing holes 215 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0184] Each fixing hole 215 positioned in the Y1 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 positioned in the Y1 direction relative to the opening 5H. Similarly, each fixing hole 215 positioned in the Y2 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 positioned in the Y2 direction relative to the opening 5H. The first positioning portions 216 and the fixing holes 215 do not overlap with the opening 5H when viewed in the Z1 direction. Furthermore, the two flow path openings 251H, the fixing holes 215, and the first positioning portion 216 are located farthest from the opening 5H in this order. Of these, the two flow path openings 251H are closest to the opening 5H.

[0185] The shortest distance between the fixing hole 215 and the opening 5H is shorter than the shortest distance between the first positioning portion 216 and the opening 5H, but it may be longer. Furthermore, the first positioning portion 216, the fixing hole 215, and the opening 5H are aligned along the longitudinal direction of the support member 5, but they do not have to be aligned. For example, the first positioning portion 216 may be provided on both sides of the opening 5H in the X-axis direction.

[0186] 3-1B. Holder 6A 28 and 29 holds and houses multiple head modules 2A, and has a common flow path that supplies and distributes ink to the multiple head modules 2A. The holder 6A is common to the multiple head modules 2A.

[0187] As shown in FIG. 29, the holder 6A has a flow path 6R. The flow path 6R supplies ink to each head module 2A and distributes the ink to each head module 2A. The flow path 6R is a common flow path shared by multiple head modules 2A. Therefore, the holder 6A is equipped with a supply flow path member having the flow path 6R, which is a common flow path. The flow path 6R is a common flow path shared by multiple head modules 2A, and has a common portion 6RA extending along the X axis and multiple branch portions 6RB branching from the common portion 6RA and extending in the Z1 direction. Although not shown, the holder 6 is provided with a flow path joint for connecting to a supply flow path outside the liquid jet head 1 to communicate with the liquid storage portion 9. This flow path joint, not shown, is exposed to the outside of the liquid jet head 1, for example, through an opening, not shown, formed in the holder 6.

[0188] The holder 6 may have a plurality of flow paths 6R that communicate with a plurality of head modules 2. In other words, the flow path 6R may not have a common portion 6RA that communicates with a plurality of head modules 2, but may have a plurality of flow paths 6R that communicate with each of the plurality of head modules 2.

[0189] A flow path opening 650H is provided on the head module 2A side of the flow path 6R, i.e., on the downstream side. The flow path opening 650H is an open end of the flow path 6R in the Z1 direction. The flow path opening 650H is provided corresponding to the flow path opening 251H of the head module 2A. The flow path opening 650H is an opening for connecting the flow path 25R of the head module 2A and the flow path 6R of the holder 6A.

[0190] FIG. 32 is a bottom view showing the holder 6A and relay board 70 shown in FIG. 28. FIG. 33 is a top view of the holder 6A shown in FIG. 28. As shown in FIGS. 29 and 32, a recess 610A of the holder 6A includes a first recess 611 and a second recess 612. As shown in FIG. 29, the second recess 612 is formed in the bottom surface of the first recess 611. The opening area of ​​the second recess 612 is larger than the opening area of ​​the first recess 611. Therefore, the recess 610A has a stepped surface. Furthermore, the relay board 70 is disposed on the bottom surface of the recess 610A, specifically, on the bottom surface of the second recess 612.

[0191] 29, the holder 6A has two fixing holes 651H, two fixing holes 652H, and two second positioning portions 653. Each fixing hole 651H is used to fix the holder 6A to the head module 2A. Each fixing hole 652H is used to fix the holder 6A to the support member 5A. Each second positioning portion 653 is used to position the head module 2A relative to the holder 6A.

[0192] Each fixing hole 651H is a hole that penetrates the holder 6A in the Z1 direction. Two fixing holes 651H are provided for each head module 2A. Each fixing hole 651H is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed in the Z1 direction. The two fixing holes 651H are provided corresponding to the two fixing holes 215 described above and overlap with the two fixing holes 215 when viewed in the Z1 direction. Each fixing hole 651H does not overlap with the chip 20 when viewed in the Z1 direction, but overlaps with the flow path opening forming member 25A. The opening end of each fixing hole 651H in the Z1 direction opens to the bottom surface of the first recess 611 when viewed in the Z1 direction.

[0193] Each fixing hole 652H is a hole that penetrates the holder 6A in the Z1 direction. The multiple fixing holes 652H are, for example, four fixing holes 652H, and each fixing hole 652H is provided at one of the four corners of the rectangular holder 6A when viewed in the Z1 direction. Each fixing hole 652H is provided to correspond to a fixing hole 503 of the support member 5A and overlaps with the fixing hole 503 when viewed in the Z1 direction.

[0194] Each second positioning portion 653 is provided on the surface 605 of the holder 6A facing the Z1 direction. Two second positioning portions 653 are provided for each head module 2A. In this embodiment, each second positioning portion 653 is a bottomed hole that opens on the surface 605 of the holder 6A facing the Z1 direction, specifically, on the bottom surface of the first recess 611. That is, each second positioning portion 653 is a recess formed on the bottom surface of the first recess 611. Each second positioning portion 653 is provided in the Y1 direction or Y2 direction relative to the second recess 612 when viewed in the Z1 direction. Furthermore, the two second positioning portions 653 are provided corresponding to the two first positioning portions 216 described above and overlap the two first positioning portions 216 when viewed in the Z1 direction. Therefore, the multiple second positioning portions 653 are provided in one-to-one correspondence with the multiple first positioning portions 216.

[0195] Of fixing hole 651H, second positioning portion 653, and fixing hole 652H, fixing hole 651H is closest to opening 5H and fixing hole 652H is farthest from opening 5H when viewed in the Z1 direction. Note that the distances between fixing hole 651H, second positioning portion 653, and fixing hole 652H and opening 5H may be the same or different.

[0196] 3-1C. Sealing material 4 28 and 29, the seal member 4 is provided between each head module 2A and the holder 6A in the Z1 direction. The seal member 4 is crushed by the head module 2A and the holder 6A.

[0197] 34 is a top view of the seal member 4 shown in FIG. 28. As in the first embodiment, in this embodiment, two seal members 4 are provided for each head module 2A. The two seal members 4 overlap the flange portion 250 of the flow path opening forming member 25A. Furthermore, the seal members 4 are provided at positions different from the chip 20 when viewed in the Z1 direction. In other words, the seal members 4 do not overlap the chip 20 when viewed in the Z1 direction.

[0198] The communication opening 4H of each seal member 4 is provided corresponding to one flow path opening 251H of the flow path opening forming member 25 and one flow path opening 650H of the holder 6A. When viewed in the Z1 direction, the communication opening 4H overlaps with the flow path opening 650H and the flow path opening 251H, respectively. The seal member 4 is compressed between the flow path opening forming member 25A and the holder 6A, so that the flow path 25R and the flow path 6R communicate with each other via the communication opening 4H. The seal member 4 is a member that liquid-tightly connects the flow path opening 251H of the head module 2A and the flow path opening 650H of the holder 6A.

[0199] 33, in the present embodiment, similarly to the first embodiment, the seal member 4 has a seal area 4S. The entire area of ​​the seal member 4 corresponds to the seal area 4S. The seal area 4S is in contact with both the flow path opening-forming member 25A and the holder 6A, and is the area of ​​the seal member 4 that is sandwiched between the flow path opening-forming member 25A and the holder 6A. The seal area 4S is the area that receives a load from the flow path opening-forming member 25A and the holder 6A to liquid-tightly connect the flow path opening 251H and the flow path opening 650H to each other.

[0200] As in the first embodiment, in this embodiment, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction, and therefore the sealing area 4S is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction. This makes it possible to achieve the same effects as the first embodiment.

[0201] In this embodiment, for example, the head module 2A located on the leftmost side in FIG. 34 is referred to as the "first head module 2a." The head module 2A located to the right of the first head module 2a is referred to as the "second head module 2b." In this case, the seal member 4 corresponding to the first head module 2a is referred to as the "first seal member 4a," and the seal member 4 corresponding to the second head module 2b is referred to as the "second seal member 4b." The first seal member 4a is sandwiched between the first head module 2a and the holder 6A, thereby liquid-tightly connecting the first flow path opening 251Ha of the first head module 2a to the corresponding flow path opening 650H. Similarly, the second seal member 4b is sandwiched between the second head module 2b and the holder 6A, thereby liquid-tightly connecting the second flow path opening 251Hb of the second head module 2b to the corresponding flow path opening 650H. The first head module 2a and the second head module 2b each eject ink supplied from the holder 6A, which has a supply flow path member.

[0202] Furthermore, the communication port 4H, the flow path opening 251H, and the flow path opening 650H do not overlap with the chip 20 when viewed in the Z1 direction. The communication port 4H, the flow path opening 251H, and the flow path opening 650H are each disposed outside the chip 20 when viewed in the Z1 direction. Therefore, as described above, the sealing region 4S of the sealing member 4 that liquid-tightly seals the flow paths 25R and 6R can be disposed outside the chip 20. Therefore, the same effects as those of the first embodiment can be achieved.

[0203] Furthermore, when viewed in the Z1 direction, the sealing area 4S is arranged in the Y1 direction or Y2 direction, which is the longitudinal direction of the head module 2A, relative to the chip 20. Therefore, the same effects as in the first embodiment can be achieved.

[0204] 3-1D. Support member 5 The support member 5A shown in Figures 28 and 29 is a member that supports multiple head modules 2A. The support member 5A is common to multiple head modules 2A, but may be provided individually for each head module 2A. The support member 5A is a long, flat member that is aligned along the Y axis and whose thickness direction is along the Z axis. The support member 5A is arranged in the Z1 direction relative to the multiple flow path opening forming members 25A. The support member 5A is a member that does not have a flow path through which ink flows. In addition, the support member 5A is detachably fixed to the holder 6A.

[0205] FIG. 35 is a top view of the support member 5A shown in FIG. 28. As shown in FIGS. 29 and 35, the support member 5A includes a plurality of support regions 5S. In FIG. 35, for ease of understanding, the support regions 5S are shaded and regions S50 are dotted. As shown in FIG. 29, the support regions 5S are in contact with the supported surface 2511 of the flow path opening-forming member 25A. Also, as shown in FIG. 35, the support regions 5S include regions S50 that overlap with the sealing regions 4S when viewed in the Z1 direction. This makes it possible to achieve the same effects as the first embodiment.

[0206] Furthermore, similarly to the first embodiment, the supported surface 2511 of the flow path opening forming member 25A is supported so as to be in contact with the support member 5A and surround the opening 5H of the support member 5A when viewed in the Z1 direction. Specifically, the supported surface 2511 comes into contact with the support region 5S of the support member 5A, thereby holding the head module 2A on the support member 5A. This makes it possible to achieve the same effects as the first embodiment.

[0207] Furthermore, similarly to the first embodiment, in this embodiment, the thickness D5 in the Z1 direction of the support member 5A is greater than the thickness D2 in the Z1 direction of the chip 20. This makes it possible to achieve the same effects as in the first embodiment.

[0208] The thickness D5, the relationship between the thickness D5 and the thickness D2, and the specific numerical value of the thickness D5 are the same as those in the first embodiment.

[0209] Also, similarly to the first embodiment, in this embodiment, in addition to the chip 20, a part of the flow path opening forming member 25A is disposed within the opening 5H of the support member 5A, as shown in Fig. 29. This makes it possible to achieve the same effects as the first embodiment.

[0210] Furthermore, similarly to the first embodiment, in this embodiment, the nozzle surface SN of the chip 20 and the surface 511 of the support member 5A facing the Z1 direction are substantially flush with each other.

[0211] 29 and 35, the support member 5A has a plurality of fixing holes 503. Each fixing hole 503 is used to fix the support member 5A to the holder 6A. As shown in FIG. 29, each fixing hole 503 is provided on a surface 512 of the support member 5A facing the Z2 direction. Each fixing hole 503 is a bottomed hole provided on the surface 512 of the support member 5A facing the Z2 direction. Each fixing hole 503 is a recess provided on the surface 512 of the support member 5A facing the Z2 direction, and can also be considered to be a depression formed on the surface 512.

[0212] The support member 5A, the holder 6A, and the plurality of head modules 2A are detachable from one another. The support member 5A can be removed from the holder 6A, and each head module 2 can be removed individually from the holder 6A. When removing each head module 2A from the holder 6A, the wiring board 7 attached to each head module 2A is removed from the connector 71. In this way, each head module 2A can be removed individually from the holder 6A. Therefore, the liquid jet head 1 can be regenerated by replacing each head module 2A.

[0213] Each first positioning portion 216 of the flow path opening forming member 25A is press-fitted into the second positioning portion 653 to position the head module 2A relative to the holder 6A. The first positioning portion 216 and the second positioning portion 653 are provided for each holder 6, that is, for each head module 2A held by the support member 5.

[0214] The provision of the first positioning portion 216 and the second positioning portion 653 described above makes it easy to position the head module 2A when attaching it to the holder 6A. Furthermore, the provision of the first positioning portion 216 and the second positioning portion 653 for each head module 2A makes it possible to align the multiple head modules 2A with each other with high precision. Therefore, when replacing only some of the multiple head modules 2A, it is not necessary to redo the alignment of all of the head modules 2A.

[0215] Furthermore, alignment between the multiple head modules 2A can be performed with high precision by the simple method of press-fitting the first positioning portion 216 into the second positioning portion 653. This makes it easy to replace a desired head module 2A from among the multiple head modules 2A. This makes it easy to repair the liquid jet head 1A.

[0216] Furthermore, because the head module 2A is provided with a positioning portion, the support member 5A can be configured as a single member that is common to multiple head modules 2A, unlike in the first embodiment. Therefore, the number of parts can be reduced compared to the first embodiment.

[0217] As described above, the flow path opening 650H and the flow path opening 251H correspond to each other. Specifically, the flow path opening 650H and the flow path opening 251H overlap when viewed in the direction in which one of the first positioning portion 216 and the second positioning portion 653 is press-fitted into the other, i.e., the direction along the Z axis. That is, the direction in which the flow path opening 650H and the flow path opening 251H overlap is the same as the direction in which the second positioning portion 653 is press-fitted into the first positioning portion 216. Therefore, when attaching the head module 2A to the holder 6A, the flow path connection between the flow path 6R and the flow path 25R can be easily and accurately performed. That is, when positioning the head module 2A on the holder 6A, highly accurate positioning of the flow path connection can be performed simultaneously and simply.

[0218] The multiple second positioning portions 653 are arranged on a surface 605 of the holder 6A facing the Z1 direction, specifically, on the bottom surface of the first recess 611. The first positioning portion 216 is arranged on a surface 252 of the support member 5A facing the Z2 direction, which is the opposite direction to the Z1 direction.

[0219] By arranging the first positioning portion 216 and the second positioning portion 653 in this manner, it is possible to easily attach and detach only the head module 2A to be replaced from below the holder 6A. Therefore, when replacing the head module 2A to be replaced and reattaching it to the holder 6A, it is only necessary to connect the flow paths of the head module 2A to be replaced to the holder 6A. Therefore, it is not necessary to connect the flow paths of head modules 2A other than the head module 2A to be replaced to the holder 6A. This makes it possible to simplify the attachment and detachment work when repairing the liquid jet head 1A.

[0220] Furthermore, the relay substrate 70 is disposed in the Z2 direction relative to the multiple head modules 2A, and overlaps the multiple head modules 2A when viewed in the Z1 direction. Furthermore, the first positioning portion 216 is provided on the surface of the flow path opening forming member 25 that faces the Z2 direction. This makes it easy to attach and detach only the head module 2A to be replaced from below. This eliminates the need to disconnect the electrical connections of head modules 2A other than the head module to be replaced, simplifying the attachment and detachment work.

[0221] Furthermore, the wiring board 7 is disposed on the bottom surface of the recess 610A of the holder 6A. Therefore, it is easier to shorten the length of the head module 2A and the wiring board 7 compared to when the wiring board 7 is disposed on the surface 606 of the holder 6A facing the Z2 direction. Also, in this embodiment, as described above, the first positioning portion 216 is a protrusion provided on the surface 252. Therefore, the first positioning portion 216 is not exposed on the nozzle surface SN side. This makes it possible to prevent ink mist and the like from adhering to the first positioning portion 216.

[0222] As described above, the holder 6A can be considered to be equipped with a common flow path member having one or more flow paths 6R that communicate with the multiple head modules 2A. The holder 6A, which includes the common flow path member, is disposed in the Z2 direction relative to the multiple head modules 2A and overlaps the multiple head modules 2A when viewed in the Z1 direction. The first positioning portion 216 is provided on a surface 252 of the flow path opening forming member 25A that faces the Z2 direction. This makes it easy to attach and detach only the subunit 15 to be replaced from below. This eliminates the need to disconnect the flow paths between the holder 6A and head modules 2A other than the one to be replaced, simplifying the attachment and detachment process.

[0223] As described above, the first positioning portion 216 is provided on the surface of the flow path opening forming member 25A opposite to the surface on which the chip 20 is provided, i.e., the surface 252 in the Z2 direction. The first positioning portion 216 does not overlap with the chip 20 when viewed in the Z1 direction. By arranging the first positioning portion 216 in this manner, when the second positioning portion 653 of the holder 6A is press-fitted into the first positioning portion 216, it is possible to prevent the load caused by the press-fitting from acting on the chip 20.

[0224] As described above, the holder 6A has a first recess 611 whose bottom surface is the surface on which the multiple second positioning portions 653 are arranged. The bottom surface of the recess 610A includes the bottom surface of the first recess 611 and the bottom surface of the second recess 612. The support member 5A is fixed so as to come into contact with the outer peripheral wall of the recess 610A, i.e., the surface 605 of the holder 6A facing the Z1 direction. As described above, the support member 5A has multiple openings 5H for exposing each of the multiple head modules 2A to the outside.

[0225] By providing such a support member 5A, the nozzle surface SN, which is the ink ejection surface, can be exposed by the support member 5A, while preventing ink mist from entering the recess 610A of the holder 6A.

[0226] 3-1E. Fixing member group 150A As shown in FIG. 29, fixing member group 150A includes a plurality of fixing members 155 and a plurality of fixing members 157.

[0227] The fixing member 155 fixes the holder 6A and the support member 5A. The fixing member 155 is inserted through the through-hole fixing hole 652H and the recessed fixing hole 503, in that order. Therefore, the fixing member 155 is not exposed on the nozzle surface SN side. On the other hand, a portion of the fixing member 155 is exposed on the surface 606 of the holder 6A facing the Z2 direction.

[0228] For example, after removing fixing member 155 from fixing hole 652H, a long rod-shaped member is inserted into fixing hole 652H and the member is used to press support member 5A in the Z1 direction. This allows the support member 5A to be easily released from the press-fit state in holder 6A. In other words, by using fixing hole 652H as a hole for releasing the press-fit state, the support member 5A can be easily released from the press-fit state in holder 6A.

[0229] The fixing member 157 directly fixes the holder 6A and the head module 2A. The fixing member 157 is inserted through the fixing hole 651H, which is a through-hole, and the recessed fixing hole 215, in that order. Therefore, the fixing member 157 is not exposed on the surface of the liquid jet head 1A in the Z1 direction, specifically on the nozzle surface SN side. On the other hand, a portion of the fixing member 157 is exposed on the surface 606 of the holder 6A facing the Z2 direction. Because the fixing member 157 is not exposed on the nozzle surface SN side, it is possible to prevent ink mist from adhering to the fixing member 157 and solidifying. This makes it possible to prevent the fixing member 157 from becoming difficult to remove from the holder 6A and the head module 2A due to the adhesion of the mist.

[0230] For example, after removing the fixing member 157 from the fixing hole 651H, a long rod-shaped member is inserted into the fixing hole 651H and the member is used to press the head module 2A in the Z1 direction. This makes it possible to easily release the head module 2A from being pressed into the holder 6A. In other words, by using the fixing hole 651H as a hole for releasing the press-fit, it is possible to easily release the head module 2A from being pressed into the holder 6A.

[0231] Furthermore, the depth D66 of the fixing hole 651H is deeper than the depth D26 of the fixing hole 215. Because the depth D66 is deeper than the depth D26, it is easier to remove the flow path opening forming member 25A from the holder 6A than if the depth D66 were shallower.

[0232] 33, the multiple fixing members 155 are provided, for example, near the corners of the holder 6A, which has a rectangular shape when viewed in the Z1 direction. The multiple fixing members 157 are provided for each head module 2A. Specifically, two fixing members 157 are provided for each head module 2A. One of the two fixing members 157 is disposed in the Y1 direction of the head module 2A when viewed in the Z1 direction, and the other is disposed in the Y2 direction of the head module 2A.

[0233] Each of the fixing members 155 and 157 is preferably a screw. Therefore, for example, a female screw is formed on each wall surface forming fixing hole 651H, fixing hole 652H, fixing hole 215, and fixing hole 503. When the fixing members 155 and 157 are screws, the fixing of the support member 5 and the multiple head modules 2A to the holder 6A can be easily released by rotating and fastening the screws. When the fixing members 155 and 157 are screws, the fixing of the multiple head modules 2A and the support member 5 to the holder 6A can be arbitrarily attached to and detached from the holder 6A without using adhesive.

[0234] Each of the fixing members 155 and 157 may be a member other than a screw, and may be an L-shaped or T-shaped pin, as in the first embodiment.

[0235] Furthermore, each of the fixing members 155 and 157 is disposed so as not to overlap the chip 20 when viewed in the Z1 direction, and so as to sandwich the sealing area 4S between itself and the chip 20.

[0236] Because fixing members 155 and 157 do not overlap chip 20 when viewed in the Z1 direction, the load generated by fixing fixing members 155 and 157 is less likely to be applied to chip 20 than if they overlap. Furthermore, by disposing sealing member 4 between fixing members 155 and 157 and chip 20 when viewed in the Z1 direction, the distance between chip 20 and fixing members 155 and 157 can be increased by the seal member 4. Therefore, the load generated by fixing fixing members 155 and 157 is less likely to be applied to chip 20.

[0237] 3-1F. Bush 29, a bushing 526 is disposed between the flow path opening forming member 25A and the support member 5A. Although not shown in detail, for example, the bushing 526 is disposed in the shape of a rectangular frame along the outer periphery of each flow path opening forming member 25A when viewed in the Z1 direction. The bushing 526 is, for example, an elastic elastomer. By providing the bushing 526, it is possible to reduce the risk of ink mist or the like entering the storage space in the recess 610A of the holder 6A from the outside of the liquid jet head 1A.

[0238] 4. Variations The second embodiment exemplified above can be modified in various ways. Specific modified aspects that can be applied to the second embodiment are exemplified below. Two or more aspects arbitrarily selected from the following examples can be combined as appropriate within the scope of not being mutually contradictory.

[0239] 4-1. 9th Variation FIG. 36 is a cross-sectional view of a portion of a liquid jet head 1A according to a ninth modified example. A fixing member 157 according to the ninth modified example shown in FIG. 36 fixes the support member 5A in addition to the holder 6A and the head module 2A. Furthermore, in the ninth modified example, the fixing member 155 is omitted. According to the ninth modified example, the number of fixing members can be reduced compared to the second embodiment. Therefore, according to the ninth modified example, the head module 2A can be attached and detached from the holder 6A using fewer fixing members compared to the first embodiment.

[0240] 4-2. 10th Variation Fig. 37 is a cross-sectional view of a portion of a liquid jet head 1A according to a tenth modified example. In the tenth modified example shown in Fig. 37, the holder 6A does not have a second recess 612. In other words, the recess 610A of the holder 6A according to the tenth modified example does not have a step surface. The recess 610A is an accommodation space that accommodates the relay substrate 70.

[0241] Furthermore, the support member 5A of the tenth modification is composed of a bottom plate portion 51 and a side wall portion 52. The bottom plate portion 51 is flat and has the same configuration as the support member 5A of the first embodiment. The side wall portion 52 is a frame-shaped portion that protrudes in the Z2 direction from the outer edge of the bottom plate portion 51. The support member 5A has a recess 510. The interior of the recess 510 forms a storage space that stores multiple head modules 2A.

[0242] Thus, the shapes of the holder 6A and the support member 5A are not particularly limited and may be any shapes. Furthermore, a space for accommodating the head module 2A is formed by one or both of the holder 6A and the support member 5A.

[0243] Moreover, the holder 6A of the tenth modification is provided with a fourth positioning portion 642. The fourth positioning portion 642 is provided on a surface 606 of the holder 6A facing in two directions.

[0244] In the tenth modification, for example, the head module 2A is fixed to the support member 5A with an adhesive or the like. Therefore, the head module 2A can be removed from the holder 6A by removing the fixing member 155 and melting the adhesive with heat. In other words, even if the head module 2A is fixed to the support member 5A with an adhesive, if it is possible to separate the head module 2A from the support member 5A by melting the adhesive with heat or the like, the head module 2A can be considered to be detachably fixed to the support member 5A and the head module 2A.

[0245] 4-3. 11th Variation Figure 38 is a cross-sectional view of a portion of a liquid jet head 1A according to an eleventh modified example. In the eleventh modified example shown in Figure 38, the support member 5A is omitted. According to the eleventh modified example, the number of parts can be reduced compared to the second embodiment. Furthermore, because the support member 5A is omitted, the head module 2A can be attached to and detached from the holder 6A more easily than in the second embodiment.

[0246] The fixing member 157 directly fixes the holder 6A and the head module 2A. The fixing member 157 does not overlap with the chip 20 when viewed in the Z1 direction. This makes it possible to make it difficult for the reaction force of the sealing member 4 to be transmitted to the chip 20 even if the liquid jet head 1A does not include the support member 5A.

[0247] 4-4. 12th Variation Figure 39 is a cross-sectional view of a portion of a liquid jet head 1A according to a twelfth modified example. The liquid jet head 1A according to the twelfth modified example shown in Figure 39 has a holder 8. The holder 8 has a first holder 81 and a second holder 82. The first holder 81 is the same as the holder 6 according to the second embodiment, except that the flange portion 64 is omitted.

[0248] The second holder 82 is the same as the support member 5A of the second embodiment except for the following elements: When viewed in the Z1 direction, the second holder 82 has a portion that extends further in the Y1 or Y2 direction than the first holder 81. A fourth positioning portion 824 is provided in this extending portion. The fourth positioning portion 824 has the same configuration as the fourth positioning portion 642 of the second embodiment, and is press-fitted into the third positioning portion 102 of the unit base 11.

[0249] The second holder 82 also has a plurality of fixing holes 821 and a plurality of second positioning portions 822. Two fixing holes 821 are provided for each head module 2A. One of the two fixing holes 821 is located in the Y1 direction relative to the chip 20 when viewed in the Z1 direction, and the other is located in the Y2 direction. The fixing hole 821 is a hole that opens into the surface 512 of the second holder 82 that faces the Z2 direction. The fixing hole 821 can also be said to be a recess formed in the surface 512 of the second holder 82 that faces the Z2 direction. The head module 2A also has fixing holes 218H that correspond to the fixing holes 821. The fixing holes 218H are holes that penetrate the flow path opening forming member 25A of the head module 2A.

[0250] Two second positioning portions 822 are provided for each head module 2A. One of the two second positioning portions 822 is located in the Y1 direction relative to the chip 20 when viewed in the Z1 direction, and the other is located in the Y2 direction. The second positioning portion 822 is a hole that opens into the surface 512 of the second holder 82 that faces the Z2 direction. The second positioning portion 822 is a recessed portion formed in the surface 512 of the second holder 82 that faces the Z2 direction, and can also be said to be a depression provided in the surface 512.

[0251] The head module 2A also has a first positioning portion 217 corresponding to the second positioning portion 822. The first positioning portion 217 is a protrusion that protrudes in the Z1 direction from a surface 251 of the flow path opening forming member 25A facing the Z1 direction. The first positioning portion 217 is press-fitted into the second positioning portion 822. This positions the head module 2A relative to the holder 8 including the second holder 82.

[0252] Furthermore, fixing members 158 are inserted into fixing holes 218H and 821 in this order. The fixing members 158 are, for example, screws, and female threads are formed on the inner wall surfaces that form fixing holes 218H and 821. The head module 2A is fixed to the second holder 82 by inserting fixing members 158 into fixing holes 218H and 821 and fastening them with the screws. Note that the first holder 81 and the second holder 82 are fixed to each other by fixing members 155, similar to the support member 5A and holder 6A of the second embodiment.

[0253] Furthermore, the second holder 82 of the holder 8 has a plurality of openings 5H, similar to the support member 5A. Each of the plurality of head modules 2A is exposed to the outside through the plurality of openings 5H. A portion of the flow path opening forming member 25A is inserted into the opening 5H. Therefore, the second holder 82 having a plurality of openings 5H can suppress an increase in the paper gap, similar to the support member 5A of the second embodiment. Furthermore, there is no need to reduce the thickness of the second holder 82 in order to suppress an increase in the paper gap. Therefore, a decrease in the rigidity of the second holder 82 can be suppressed.

[0254] 4-6. 13th Variation Fig. 40 is a cross-sectional view of a portion of a liquid jet head 1A according to a thirteenth modified example. In the thirteenth modified example shown in Fig. 40, compared to the twelfth modified example, the fixing holes 218H, 821, and the fixing member 158 are omitted. In other words, in the thirteenth modified example, the support member 5A and the holder 6A may be fixed to each other by the fixing member 155, with the sealing member 4 and the head module 2A sandwiched therebetween.

[0255] The second holder 82 and each head module 2A may be fixed with an adhesive, etc. When the second holder 82 and each head module 2A are fixed with an adhesive, if they can be separated by, for example, melting the adhesive with heat, then the second holder 82 and each head module 2A are considered to be detachably fixed.

[0256] 4-7. 15th Variation Fig. 41 is a cross-sectional view of a portion of a liquid jet head 1A according to a fifteenth modified example. Fig. 42 is a top view of the liquid jet head 1A according to the fifteenth modified example. In the fifteenth modified example shown in Fig. 41, the positional relationship of the fixing member 157 and the sealing member 4 with respect to the chip 20 is different. The shortest distance between the fixing member 157 and the chip 20 is shorter than the shortest distance between the sealing member 4 and the chip 20.

[0257] 42, the fixing member 157 does not overlap the chip 20 when viewed in the Z1 direction, and is disposed between the chip 20 and the sealing region 4S. This arrangement makes it easier for a reaction force to occur outside the fixing member 157 when viewed from the chip 20. This makes it possible to make it difficult for the effect of the reaction force of the sealing member 4 to be transmitted to the chip 20 in particular.

[0258] 4-8. 16th Variation Figure 43 is a cross-sectional view of a portion of a liquid jet head 1A according to a sixteenth modified example. Figure 44 is a top view of a liquid jet head 1A according to the sixteenth modified example. In the sixteenth modified example shown in Figures 43 and 44, the fixing member 157 overlaps with the chip 20 when viewed in the Z1 direction. Even when the fixing member 157 overlaps with the chip 20 when viewed in the Z1 direction, the presence of the support member 5A makes it possible to suppress the reaction force of the sealing member 4 from affecting the chip 20 compared to when the support member 5A is not present.

[0259] 5. Other Modifications The above-described embodiments and modifications may be modified in various ways. Specific modifications that may be applied to the above-described embodiments and modifications are exemplified below. Two or more modifications arbitrarily selected from the following examples may be combined as appropriate to the extent that they are not mutually inconsistent.

[0260] In the above description, the sealing member 4 is provided for each head module 2, but the sealing member 4 may be integrated and shared by a plurality of head modules 2.

[0261] The "first positioning portion" and the "second positioning portion" are not particularly limited in configuration to the above-described embodiment and modified examples, as long as they are configured so that one is press-fitted into the other.

[0262] In the above embodiment, the liquid ejecting apparatus 100 is of a serial type, but the liquid ejecting apparatus may be of a line type in which the plurality of nozzles N provided in the head unit 10 are distributed across the entire width of the medium 90 .

[0263] "Liquid ejection devices" can be used in various devices such as facsimile machines and copiers, as well as devices dedicated to printing. The uses of liquid ejection devices are not limited to printing. For example, a liquid ejection device that ejects a solution of coloring material is used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid ejection device that ejects a solution of conductive material is used as a manufacturing device for forming wiring and electrodes on relay boards. A liquid ejection device that ejects a solution of organic matter related to living organisms is used as a manufacturing device for manufacturing biochips, for example.

[0264] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the above-described embodiments. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above-described embodiments, and any configuration can be added. [Explanation of symbols]

[0265] 1...liquid jet head, 2...head module, 3...supply flow path member, 3R...flow path, 4...sealing member, 4H...communication port, 4S...sealing area, 5...supporting member, 5S...supporting area, 6...holder, 6R...flow path, 7...wiring board, 10...head unit, 11...unit base, 20...chip, 25...flow path opening forming member, 25R...flow path, 31H...flow path opening, 61H...first fixing hole, 64...flange portion, 70...relay board, 71...connector, 100...liquid jet device, 102...third positioning portion, 151...fixing member, 152...fixing member, 153...fixing member, 154...fixing member, 155...fixing member, 157...fixing member, 158...fixing member, 201...nozzle plate, 211H...fixing hole, 215...fixing hole, 216...first positioning portion, 218H...fixing hole, 251H...flow path opening, 321...fixing hole, 501...fixing hole, 502...first positioning portion, 503...fixing hole, 504...fixing hole, 505...fixing hole, 510...recess, 602...second positioning portion, 610...recess, 612H...fixing hole, 613...fixing hole, 614H...fixing hole, 642...fourth positioning portion, 650H...flow path opening, 651H...fixing hole, 652H...fixing hole, 653...second positioning portion, 2511...supported surface, C...pressure chamber, E...drive element, N...nozzle, R...common space, S50...area, S55...area, SN...nozzle surface.

Claims

1. a first head module that ejects liquid in a first direction; a supply flow path member that supplies liquid to the first head module; an elastic first seal member that is sandwiched between the first head module and the supply flow path member in the first direction, thereby liquid-tightly connecting a first flow path opening of the first head module and a flow path opening of the supply flow path member; Equipped with the first head module includes a flow path opening forming member in which the first flow path opening is formed, and a chip arranged in the first direction with respect to the flow path opening forming member, a sealing region of the first sealing member that is sandwiched between the flow path opening forming member and the supply flow path member does not overlap with the chip when viewed in the first direction; A liquid jet head characterized by:

2. the chip is thinner than the flow path opening forming member and has a smaller outer shape than the flow path opening forming member when viewed in the first direction; The first flow path opening is disposed on the outer side of the chip when viewed in the first direction. The liquid jet head according to claim 1 .

3. a metal support member disposed in the first direction relative to the flow path opening forming member, the metal support member sandwiching the first seal member and the flow path opening forming member between the metal support member and the supply flow path member; the support member supports the flow path opening forming member in a support region including a region overlapping with the sealing region when viewed in the first direction. The liquid jet head according to claim 1 .

4. The thickness of the support member in the first direction is greater than the thickness of the chip in the first direction. The liquid jet head according to claim 3 .

5. the support member has an opening for exposing the first head module to the outside, a portion of the flow path opening forming member is disposed within the opening of the support member; The liquid jet head according to claim 3 .

6. a fixing member that fixes the first head module and the supply flow path member, the fixing member is disposed so as not to overlap the chip when viewed in the first direction and so as to sandwich the sealing area between the fixing member and the chip; the support region includes a region disposed between the sealing region and the chip when viewed in the first direction. The liquid jet head according to claim 3 .

7. a fixing member that fixes the first head module and the supply flow path member, the fixing member does not overlap the chip when viewed in the first direction and is disposed between the chip and the sealing area. The liquid jet head according to claim 3 .

8. the support member has an opening for exposing the first head module to the outside, a part of a surface of the flow path opening forming member facing the first direction is supported so as to be in contact with the support member and surround the opening of the support member when viewed in the first direction; The liquid jet head according to claim 3 .

9. a fixing member that fixes the first head module and the supply flow path member, the fixing member overlaps with the chip when viewed in the first direction; The liquid jet head according to claim 3 .

10. a fixing member for directly and detachably fixing the first head module and the supply flow path member; the fixing member does not overlap the chip when viewed in the first direction; The liquid jet head according to claim 1 .

11. the sealing area is disposed in a longitudinal direction of the first head module relative to the chip when viewed in the first direction. The liquid jet head according to claim 1 .

12. a second head module that ejects the liquid supplied from the supply flow path member; an elastic second seal member that is sandwiched between the second head module and the supply flow path member to liquid-tightly connect a second flow path opening of the second head module and a flow path opening of the supply flow path member; Equipped with the second head module includes a flow path opening forming member in which the second flow path opening is formed, and a chip that is disposed in the first direction with respect to the flow path opening forming member of the second head module, a sealing region of the second sealing member that is sandwiched between the flow path opening forming member and the supply flow path member does not overlap with the chip of the second head module when viewed in the first direction; The liquid jet head according to claim 1 .

13. A plurality of liquid jet heads according to claim 1; a unit base to which the plurality of liquid jet heads are fixed; A liquid ejection device comprising:

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