Adhesive-layer-equipped gas barrier film and photoelectric conversion device

Abstract

To provide a gas barrier film and a photoelectric conversion device that can solve the problem of water vapor in an organic solar battery with an extremely simple configuration, that is, one or more gas barrier films.SOLUTION: An adhesive-layer-equipped gas barrier film includes a base material film, a gas barrier layer, a first adhesive layer, and a second adhesive layer in this order, the second adhesive layer being thicker than the first adhesive layer, an area of the second adhesive layer in a plane direction being smaller than an area of the first adhesive layer in the plane direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a gas barrier film with an adhesive layer, and a photoelectric conversion device using the same. [Background technology]

[0002] Until now, silicon-based solar cells have dominated the solar cell market, but recently, organic solar cells such as perovskite and dye-sensitized solar cells have been attracting attention due to their various properties, such as not requiring rare metals as raw materials, being able to generate electricity even with weak sunlight, and being flexible. Although such organic solar cells have the excellent properties described above, they have the drawback of being very sensitive to water vapor. In Patent Document 1, to solve this problem, a gas barrier film is provided not only on the top and bottom surfaces of the solar cell element but also on the side surfaces.In Patent Document 2, the top and bottom surfaces are covered with a gas barrier film and an aluminum foil PET film, and the entire surface of the solar cell element is covered with a sealing layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-34875 [Patent Document 2] International Publication No. 2019 / 230534 Summary of the Invention [Problem to be solved by the invention]

[0004] As mentioned above, organic solar cells are very sensitive to water vapor, so it has been necessary to attach a gas barrier film to four or more surfaces of the solar cell element as in Patent Document 1, or to cover the entire surface with a sealing layer separate from the gas barrier film as in Patent Document 2. In other words, organic solar cells have required extensive measures to deal with water vapor.

[0005] In view of the above problems, an object of the present invention is to provide a gas barrier film with a pressure-sensitive adhesive layer and a photoelectric conversion device that can solve the problem of water vapor in organic solar cells with an extremely simple configuration, i.e., with one or two gas barrier films. [Means for solving the problem]

[0006] As a result of extensive investigations into solving the above-mentioned problems, the present inventors have found that the above-mentioned problems can be solved by providing a gas barrier film with two pressure-sensitive adhesive layers arranged in a predetermined relationship, and have thus completed the present invention. That is, the present invention provides the following [1] to [8].

[0007] [1] A film having a base film, a gas barrier layer, a first adhesive layer, and a second adhesive layer in this order, the second adhesive layer is thicker than the first adhesive layer, a gas barrier film with an adhesive layer, wherein the area of ​​the second adhesive layer in a planar direction is smaller than the area of ​​the first adhesive layer in a planar direction; [2] Water vapor permeability is 1.0 x 10 -2 g / m 2 / day or less. [3] The gas barrier film with a pressure-sensitive adhesive layer according to the above [1] or [2], wherein the light transmittance in the wavelength region of 400 to 780 nm in the region where the second pressure-sensitive adhesive layer is present is 50% or more. [4] The gas barrier film with a pressure-sensitive adhesive layer according to any one of the above [1] to [3], wherein the first pressure-sensitive adhesive layer comprises a curable pressure-sensitive adhesive, and the storage modulus of the first pressure-sensitive adhesive layer after curing is higher at 23°C than the storage modulus of the second pressure-sensitive adhesive layer at 23°C. [5] The gas barrier film with an adhesive layer according to [4] above, wherein the first adhesive layer has a storage modulus at 23°C after curing of 0.5 GPa or more. [6] The gas barrier film with an adhesive layer according to any one of the above [1] to [5], wherein the second adhesive layer has a storage modulus at 100°C of 1 MPa or less. [7] A photoelectric conversion device comprising a photoelectric conversion element and the gas barrier film with a pressure-sensitive adhesive layer according to any one of [1] to [6] above, a back surface material facing a back surface side of the photoelectric conversion element; a front surface and a side surface of the photoelectric conversion element are embedded in the second adhesive layer of the adhesive layer-attached gas barrier film, A photoelectric conversion device in which the first adhesive layer of the adhesive-layer-attached gas barrier film is bonded to the backing material. [8] A photoelectric conversion device comprising two pairs of a photoelectric conversion element and the gas barrier film with a pressure-sensitive adhesive layer according to any one of [1] to [6] above, the second adhesive layer of the first adhesive layer-having gas barrier film (F1) of the two sets of adhesive layer-having gas barrier films faces the back surface side of the photoelectric conversion element, the second adhesive layer of the second adhesive layer-having gas barrier film (F2) of the two sets of adhesive layer-having gas barrier films faces the front surface side of the photoelectric conversion element, the first adhesive layer of the first adhesive layer-provided gas barrier film (F1) and the first adhesive layer of the second adhesive layer-provided gas barrier film (F2) are bonded to each other, the second adhesive layer of the first adhesive layer-provided gas barrier film (F1) and the second adhesive layer of the second adhesive layer-provided gas barrier film (F2) are bonded to each other, A photoelectric conversion device, wherein the photoelectric conversion element is embedded in the second adhesive layer of the first adhesive layer-equipped gas barrier film (F1) and the second adhesive layer of the second adhesive layer-equipped gas barrier film (F2). [Effects of the Invention]

[0008] According to the present invention, there are provided a gas barrier film with a pressure-sensitive adhesive layer, which can cover the entire thick photoelectric conversion element with one or two sheets and block water vapor from all directions, and a photoelectric conversion device. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a gas barrier film with an adhesive layer. [Figure 2] FIG. 2 is a cross-sectional view showing another example of a gas barrier film with an adhesive layer. [Figure 3] FIG. 2 is a plan view showing another example of a gas barrier film with an adhesive layer. [Figure 4] FIG. 1 is a process diagram illustrating an example of a method for producing a gas barrier film with an adhesive layer. [Figure 5] FIG. 1 is a cross-sectional view illustrating an example of a photoelectric conversion device. [Figure 6] 1A to 1C are process diagrams illustrating an example of a method for manufacturing a photoelectric conversion device. [Figure 7] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] In this specification, preferred definitions can be selected arbitrarily, and combinations of preferred definitions can be considered more preferred. In this specification, the expression "XX to YY" means "XX or more and YY or less." In this specification, for preferred numerical ranges (e.g., ranges of content, etc.), the lower and upper limits described in stages can be independently combined. For example, the description "preferably 10 to 90, more preferably 30 to 60" can be combined with the "preferable lower limit (10)" and the "more preferable upper limit (60)" to form "10 to 60." In this specification, for example, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid," and the same applies to other similar terms. In this specification, the property of inhibiting the permeation of water vapor or oxygen is referred to as "gas barrier property," and a film having gas barrier property is referred to as "gas barrier film." In this specification, the term "solid content" refers to components other than the solvent in the coating liquid. Although the present invention will be described using drawings in various places to facilitate understanding, the present invention is not limited to those shown in the drawings. Furthermore, each drawing is a schematic view, and for ease of understanding, the dimensions are exaggerated. Furthermore, unless otherwise specified, the upper surface of each cross-sectional view will be referred to as the "front surface" or "top surface," and the lower surface of each cross-sectional view will be referred to as the "back surface" or "bottom surface." Hereinafter, a gas barrier film with a pressure-sensitive adhesive layer according to an embodiment of the present invention (hereinafter sometimes referred to as "the present embodiment") and a photoelectric conversion device using the same will be described.

[0011] 1. Gas barrier film with adhesive layer A gas barrier film with a pressure-sensitive adhesive layer according to an embodiment of the present invention comprises a base film, a gas barrier layer, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order, wherein the second pressure-sensitive adhesive layer is thicker than the first pressure-sensitive adhesive layer, and the area of ​​the second pressure-sensitive adhesive layer in a planar direction is smaller than the area of ​​the first pressure-sensitive adhesive layer in the planar direction.

[0012] The gas barrier film with a pressure-sensitive adhesive layer according to this embodiment ensures good embeddability in an object to be stuck by the second pressure-sensitive adhesive layer, which is thicker than the first pressure-sensitive adhesive layer. Also, the first pressure-sensitive adhesive layer, which is thinner than the second pressure-sensitive adhesive layer and has a larger area in the planar direction than the second pressure-sensitive adhesive layer, can provide good sealing around the object to be stuck. Furthermore, as will be described later, by making the first adhesive layer comprise a curable adhesive, and by curing the first adhesive layer after the gas barrier film with the adhesive layer is attached to the object, it is possible to suppress the occurrence of cracks in the gas barrier layer even when the region of the gas barrier film with the adhesive layer that surrounds the object to be attached is cut in order to remove unnecessary portions or to separate the film, and therefore it is possible to obtain a gas barrier film with a adhesive layer that is less likely to lose its gas barrier property even when cut.

[0013] 1-1. Example of gas barrier film structure with adhesive layer An example of a specific configuration of a gas barrier film with a pressure-sensitive adhesive layer according to an embodiment of the present invention is shown in Fig. 1. Fig. 1(b) is a plan view of a gas barrier film 100 with a pressure-sensitive adhesive layer, and Fig. 1(a) is a cross-sectional view taken along line IA-IA in Fig. 1(b).

[0014] The gas barrier film 100 with a pressure-sensitive adhesive layer shown in Fig. 1(a) has a base film 10 in which an anchor layer 2 is formed on a support layer 1, and a gas barrier layer 20 formed on the anchor layer 2 side of the base film 10. A first pressure-sensitive adhesive layer 31 is formed so as to cover the entire front surface of the gas barrier layer 20 (the surface opposite to the base film 10). Furthermore, a second pressure-sensitive adhesive layer 32 is formed so as to cover a part of the front surface of the first pressure-sensitive adhesive layer 31 (the surface opposite to the gas barrier layer 20). That is, compared to the first adhesive layer 31, one end of the second adhesive layer 32 is shorter in the longitudinal direction by a distance d1 and the other end is shorter by a distance d2, and the length L2 of the second adhesive layer 32 in the longitudinal direction is shorter than the length L1 of the first adhesive layer 31 in the longitudinal direction. Furthermore, one end of the second adhesive layer 32 is shorter by a distance d3 and the other end is shorter by a distance d4 in the lateral direction, and the length W2 of the second adhesive layer 32 in the lateral direction is shorter than the length W1 of the first adhesive layer 31 in the lateral direction. Furthermore, the area SA2 of the second adhesive layer 32 (here, the product of the length L2 and the length W2) is smaller than the area SA1 of the first adhesive layer 31 (here, the product of the length L1 and the length W1).

[0015] From the viewpoint of enhancing the sealing property of the first adhesive layer, the area SA2 of the second adhesive layer is preferably 0.8 times or less, more preferably 0.7 times or less, and even more preferably 0.6 times or less the area SA1 of the first adhesive layer. There is no particular restriction on the lower limit of the area SA2, but from the viewpoint of embedding and arranging a plurality of objects to be stuck at high density, it is preferably 0.1 times or more, and more preferably 0.3 times or more the area SA1.

[0016] One or two corners of the second adhesive layer 32 may overlap one or two corners of the first adhesive layer 31, and any one to three sides of the second adhesive layer 32 may overlap any one to three sides of the first adhesive layer 31. However, from the viewpoint of improving the sealing property of the photoelectric conversion element 60, it is preferable that none of the corners and all of the sides of the second adhesive layer 32 overlap any of the corners and sides of the first adhesive layer 31.

[0017] Furthermore, the thickness h2 of the second adhesive layer 32 is greater than the thickness h1 of the first adhesive layer 31. From the viewpoint of enhancing embeddability in an object to be stuck, the thickness h2 is preferably 1.1 times or more, more preferably 1.4 times or more, and even more preferably 1.8 times or more the thickness h1. There is no particular upper limit to the thickness h2, but from the viewpoint of ease of production, etc., it is preferably, for example, 10 times or less, and more preferably 5.0 times or less.

[0018] 2 and 3 are cross-sectional views showing other examples of the structure of the gas barrier film with the adhesive layer. The gas barrier film 101 with adhesive layers shown in Fig. 2 has a recess 31R on the front surface (the surface opposite to the gas barrier layer 20) of the first adhesive layer 31, and has a configuration in which the lower part of the second adhesive layer 32 fits into this recess 31R. Other than that, it has the same configuration as the gas barrier film 100 with adhesive layers shown in Fig. 1. The depth h3 of the recess 31R can be set to, for example, 10 to 70% of the thickness of the first adhesive layer 31.

[0019] The gas barrier film 102 with adhesive layers shown in Figure 3 has a configuration in which multiple second adhesive layers are arranged in a matrix at intervals on the front surface (the surface opposite to the gas barrier layer 20) of the first adhesive layer 31. The gas barrier film 102 with the adhesive layer is cut into individual pieces along dicing lines DL set between adjacent second adhesive layers 32 after the object to be attached is attached. Here, the dicing lines DL may be virtual, or may be physically provided in advance by using paint or processing on the support layer 1 of the base film 10.

[0020] The thickness of the gas barrier film with the adhesive layer can be appropriately determined depending on the intended use of the electronic device, etc. From the viewpoint of handleability, the thickness of the gas barrier film with the adhesive layer is preferably 1 to 1,000 μm, more preferably 5 to 200 μm, and more preferably 50 to 150 μm. Note that this thickness refers to the thickness of the portion where the second adhesive layer is present.

[0021] The water vapor transmission rate of the pressure-sensitive adhesive layer-attached gas barrier film under an atmosphere of 40°C and a relative humidity of 90% is preferably 1.0 × 10 -2 g / m 2 / day or less, preferably 9.0×10 -3 g / m 2 / day or less, more preferably 6.0 × 10 -3 g / m 2 / day or less, and even more preferably 4.0 × 10 -3 g / m 2 / day or less, particularly preferably 9.0 × 10 -4 g / m 2 / day or less. The water vapor permeability of the gas barrier film with the adhesive layer can be set to the above-mentioned numerical range by obtaining a gas barrier film with the adhesive layer that satisfies the above-mentioned requirements (1) and (2) according to the manufacturing method of a gas barrier film with the adhesive layer described below. The water vapor transmission rate is measured by a known method.

[0022] The light transmittance in the wavelength region of 400 to 780 nm in the region where the second adhesive layer of the pressure-sensitive adhesive layer-attached gas barrier film is present is, from the viewpoint of obtaining high light transmittance, preferably 50% or more, more preferably 75% or more, even more preferably 80% or more, and particularly preferably 85% or more. There is no particular upper limit, and it is 100%. The light transmittance of the gas barrier film with the pressure-sensitive adhesive layer can be set to the above-mentioned numerical range by obtaining a gas barrier film with a pressure-sensitive adhesive layer that satisfies the following requirements (1) and (2) in accordance with the manufacturing method of a gas barrier film with a pressure-sensitive adhesive layer described below. The light transmittance is measured by a known method.

[0023] 1-2.Base film As the base film, various resin films can be used, and preferably, polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polylactic acid (PLA) film, polycarbonate film, cycloolefin-based film, cellulose-based film, etc. are used. These substrate films are inexpensive and readily available with good optical transparency. The substrate film may have various layers on its surface, such as a layer (anchor layer) for increasing adhesion to a layer formed on the substrate film, an oligomer precipitation prevention layer, a lubricating layer, an antistatic layer, or a hard coat layer. The substrate film may also be treated to increase adhesion by corona treatment, flame treatment, or the like. The base film may be one that has not been subjected to a heat-resistant treatment such as annealing, or may be one that has been subjected to a heat-resistant treatment.

[0024] 1-3.Gas barrier layer The pressure-sensitive adhesive layer-attached gas barrier film preferably has a gas barrier layer containing silicon and oxygen, from the viewpoint of ensuring high gas barrier properties at low cost. The gas barrier layer is preferably formed from a coating of a composition containing a polysilazane compound and, optionally, a carbon-containing silicon-based polymer compound, as described below. The gas barrier layer preferably has, in the thickness direction thereof, a first region (high-nitrogen-containing region) that contains silicon, oxygen, and nitrogen, and, optionally, carbon, and has a higher nitrogen content than other regions.

[0025] As will be described later, the first region is formed by a modification process and has a relatively higher nitrogen content than the second region, which is a region other than the first region. Therefore, in the following description, the first region may also be referred to as a "modified region" or a "high-nitrogen-content region." The second region may also be referred to as a "non-modified region" or a "low-nitrogen-content region." The "high-nitrogen-content region" refers to a region that is stable over time and whose thickness does not decrease over time.

[0026] The gas barrier layer preferably has a first region containing silicon, oxygen, carbon, and nitrogen in its thickness direction, and satisfies the following requirements (1) and (2). Requirement (1): The composition of the first region is SiO x C y N z It is expressed as: x:0.20~0.50 y:0~0.30 z: 0.20~0.70 Requirement (2): The thickness d of the first region M is 10 nm or more.

[0027] The first region satisfying the above requirement (1) is thought to reflect a hard structure in which silicon and nitrogen are bonded, which is advantageous for achieving high gas barrier performance and high light transmittance. Furthermore, in the following requirement (1-1), the presence of a predetermined proportion of carbon is thought to impart appropriate flexibility to the gas barrier layer. Furthermore, as specified in the above requirement (2), it is believed that by making the thickness of the first region 10 nm or more, a region with high gas barrier properties is sufficiently ensured. In the above requirement (1), from the viewpoint of easily increasing light transmittance, it is more preferable that x, y, and z are in the following ranges (requirement (1-1)). x:0.25~0.45 y: 0.03~0.20 z: 0.20~0.65

[0028] The above thickness d M From the viewpoint of enhancing the gas barrier property, the thickness is preferably 12 nm or more, more preferably 30 nm or more, and from the viewpoint of increasing the strength of the gas barrier layer, it is even more preferably 50 nm or more, and even more preferably 60 nm or more. There is no particular upper limit, but from the viewpoint of ease of production, it is preferably 300 nm or less, more preferably 150 nm or less, and particularly preferably 90 nm or less.

[0029] The high nitrogen content region may be located on the outermost surface of the gas barrier layer or inside the gas barrier layer, but is preferably located on the outermost surface of the gas barrier layer from the viewpoints of exhibiting good gas barrier properties and ease of production.

[0030] A plurality of high nitrogen content regions may be present in the depth direction. When a plurality of high nitrogen content regions are present, the total thickness of the regions may be 10 nm or more. From the viewpoint of preventing water vapor permeation from the edge, it is preferred that one of the plurality of high nitrogen content regions is located on the outermost surface of the pressure-sensitive adhesive layer-attached gas barrier film. A gas barrier layer having a plurality of high nitrogen content regions in the depth direction can be obtained, for example, by repeating the formation of a gas barrier precursor layer for forming the gas barrier layer and the modification treatment described below.

[0031] In the depth direction of the gas barrier layer, the element ratio of nitrogen atoms can be made to gradually and continuously change from the outermost surface by forming a high nitrogen content region through a modification treatment, as will be described later. Typically, in the change in the element ratio of each element in silicon, oxygen, and nitrogen (and optionally, carbon) in the thickness direction of the gas barrier layer, there is a region where the element ratio of nitrogen is higher than in the deeper layer.

[0032] In the gas barrier film with the pressure-sensitive adhesive layer, from the viewpoint of easily ensuring high gas barrier properties and light transmittance, and good flexibility, and from the viewpoint of ease of production, the thickness d of the gas barrier layer is G and the thickness d of the first region M However, 1.00 ≥ d M / d G ≧0.01, and 0.80≧d M / d G It is more preferable that the relationship of 0.60 ≧ d M / d G It is more preferable that the relationship is ≧0.03.

[0033] Gas barrier layer thickness d G From the viewpoint of easily ensuring gas barrier properties, light transparency, and flexibility, as well as from the viewpoint of ease of production, the thickness is preferably 30 to 1,500 nm, more preferably 50 to 1,000 nm, and even more preferably 100 to 400 nm. Gas barrier layer thickness d G Even if the nitrogen content is on the order of nanometers, by providing a high nitrogen content region, it is possible to obtain a gas barrier film with a pressure-sensitive adhesive layer that has sufficient gas barrier performance.

[0034] Each of the above thicknesses d G , d M can be set within the above-mentioned numerical range by producing a gas barrier film with a pressure-sensitive adhesive layer according to the method for producing a gas barrier film with a pressure-sensitive adhesive layer described below, and adjusting the composition of the coating liquid and the conditions for the modification treatment during the production.

[0035] The gas barrier layer is formed from a gas barrier precursor layer, and is preferably formed from a layer obtained by drying a coating film of a coating liquid (hereinafter also referred to as "gas barrier precursor layer coating liquid") containing a polysilazane compound and, if desired, a carbon-containing silicon-based polymer compound. The high nitrogen content region can be formed by a modification treatment described below.

[0043] By providing a high nitrogen content region obtained by subjecting the gas barrier precursor layer, which is a layer obtained by drying a coating of the above-mentioned gas barrier precursor layer coating liquid, to a modification treatment described below, a gas barrier layer with excellent gas barrier properties can be efficiently formed. In particular, when the above-mentioned modification treatment is carried out by plasma irradiation in the presence of helium gas, it becomes easier to form a high nitrogen-containing region with a sufficient thickness.

[0036] By using a coating liquid containing a mixture of a polysilazane compound and a carbon-containing silicon-based polymer compound, it becomes easier to distribute carbon uniformly throughout the gas barrier precursor layer, compared to when organic compound ions are implanted into a polysilazane compound film or when ions are implanted into a film formed from a mixture of a polysilazane compound and an organic compound other than a carbon-containing silicon-based polymer compound, and it becomes easier to ensure the above-mentioned gas barrier properties, light transparency, and flexibility.

[0037]

[0023] Examples of polysilazane compounds include inorganic polysilazanes and organic polysilazanes. Examples of inorganic polysilazanes include perhydropolysilazane, and examples of organic polysilazanes include compounds in which part or all of the hydrogen atoms in perhydropolysilazane have been substituted with organic groups such as alkyl groups. Among these, inorganic polysilazanes are more preferred from the viewpoints of availability and the ability to form a gas barrier layer with excellent gas barrier properties. Furthermore, as the polysilazane compound, commercially available products available as glass coating materials and the like can also be used as they are. The polysilazane compounds can be used singly or in combination of two or more.

[0038] Examples of the carbon-containing silicon-based polymer compound include polycarbosilane-based compounds, polysilane-based compounds, and mixtures thereof.

[0039] In the gas barrier precursor layer, the mass of the carbon-containing silicon-based polymer compound relative to 100 parts by mass of the polysilazane-based compound is preferably 1 to 100 parts by mass, from the viewpoint of easily ensuring flexibility.

[0040] Examples of methods for forming a layer obtained by applying and drying a coating liquid for a gas barrier precursor layer include a method in which a coating liquid for a gas barrier precursor layer containing a polysilazane compound, and optionally a carbon-containing silicon-based polymer compound, other components (for example, a curing agent, other polymers, an antioxidant, a light stabilizer, and a flame retardant), a solvent, and the like is applied onto a substrate film by a known method, and the resulting coating film is then appropriately dried to form the layer. Since the coating liquid for the gas barrier precursor layer contains the polysilazane compound described above, a conversion reaction of the polysilazane occurs when the coating liquid is heated after coating, resulting in a coating film (gas barrier precursor layer) with gas barrier properties.

[0041] The thickness of the gas barrier precursor layer is preferably 30 to 1,500 nm, more preferably 40 to 1,000 nm, even more preferably 60 to 600 nm, and even more preferably 100 to 400 nm. Even if the thickness of the gas barrier precursor layer is on the order of nanometers, by subsequently subjecting it to a modification treatment, it is possible to obtain a gas barrier film with a pressure-sensitive adhesive layer that has sufficient gas barrier properties.

[0042] Examples of the modification treatment include ion implantation and vacuum ultraviolet light irradiation (irradiation with an excimer laser or the like). Among these, ion implantation is preferred because it can provide high gas barrier performance. In the ion implantation, the amount of ions implanted into the polymer layer may be appropriately determined depending on the intended use of the pressure-sensitive adhesive layer-attached gas barrier film to be formed (for example, the required gas barrier properties, light transparency, or flexibility).

[0043] Examples of ions to be implanted include ions of rare gases such as argon, helium, neon, krypton, and xenon, and ions of fluorocarbons, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur. These ions may be used alone or in combination of two or more.

[0044] The method for injecting ions is not particularly limited, but examples thereof include a method of irradiating ions (ion beam) accelerated by an electric field and a method of injecting ions in plasma. Of these, the latter method of injecting plasma ions is preferred because it allows a gas barrier film to be easily obtained.

[0045] The ion species to be implanted by plasma ion implantation include the same ions as those exemplified above as the ions to be implanted.

[0046] 1-4. First adhesive layer The first adhesive layer is provided on the substrate film. As described above, the planar area of ​​the first adhesive layer is larger than the planar area of ​​the second adhesive layer, and the thickness of the first adhesive layer is smaller than the thickness of the second adhesive layer. The area of ​​the first adhesive layer in the planar direction is not particularly limited and may be set according to the size of the object to be attached. For example, it may be 0.002 to 0.2 m 2 It can be said that: From the viewpoint of lamination properties and the like, the thickness of the first adhesive layer is preferably 1 to 40 μm, more preferably 5 to 35 μm, and even more preferably 15 to 30 μm.

[0047] In the gas barrier film with the adhesive layer, the first adhesive layer is preferably made of a curable adhesive such as an energy ray-curable adhesive or a thermosetting adhesive, and more preferably made of a thermosetting adhesive. Hereinafter, the adhesive composition used to form the first adhesive layer is also referred to as the "first adhesive composition." In particular, it is more preferable that the first adhesive layer comprises a curable adhesive, and that the storage modulus of the first adhesive layer after curing at 23°C is higher than the storage modulus of the second adhesive layer at 23°C. Such a configuration can improve the sealing property of the gas barrier film with the adhesive layer. Note that the "storage modulus of the first adhesive layer after curing at 23°C" refers to the storage modulus of the first adhesive layer after curing under heat curing conditions of 150°C and 1 hour.

[0048] In the gas barrier film with the pressure-sensitive adhesive layer, from the viewpoint of enhancing sealing properties, the storage modulus of the first pressure-sensitive adhesive layer after curing at 23°C is preferably 0.5 GPa or more, more preferably 1.0 GPa or more, even more preferably 1.5 GPa or more, and still more preferably 2.0 GPa or more. There is no particular upper limit, but from the viewpoint of ease of production, it is, for example, 10.0 GPa. The storage modulus can be adjusted to fall within the above range by using, for example, a cured resin having a plurality of aromatic rings.

[0049] The curable pressure-sensitive adhesive, which is the first pressure-sensitive adhesive composition used to form the first pressure-sensitive adhesive layer, preferably contains a thermosetting resin component, at least one of a curing agent and a curing catalyst, other resin components, and a filler.

[0050] Examples of the thermosetting resin component that can be contained in the first pressure-sensitive adhesive composition include epoxy resins, phenolic resins, melamine resins, urea resins, polyester resins, urethane resins, acrylic resins, polyimide resins, benzoxazine resins, etc., which can be used alone or in combination of two or more. Among these, from the viewpoint of adhesiveness, etc., epoxy resins and phenolic resins are preferred, and epoxy resins are particularly preferred.

[0044] The content of the thermosetting resin component in the first adhesive composition is preferably 5% by mass or more, more preferably 10% by mass or more, and is preferably 75% by mass or less, more preferably 55% by mass or less, based on the total mass of the first adhesive composition.

[0051] The curing agent is not particularly limited, but examples thereof include phenols, amines, and thiols, and can be appropriately selected depending on the type of the thermosetting component. For example, when an epoxy resin is used as the thermosetting resin component, phenols are preferred from the viewpoint of reactivity with the epoxy resin. The curing catalyst is not particularly limited, but examples thereof include imidazole-based, phosphorus-based, and amine-based catalysts, and can be appropriately selected depending on the type of the thermosetting component described above. For example, when an epoxy resin is used as the curable resin component, it is preferable to use an imidazole-based curing catalyst as the curing catalyst from the viewpoints of reactivity with the epoxy resin, storage stability, physical properties of the cured product, curing speed, etc. As the imidazole-based curing catalyst, known ones can be used, but from the viewpoints of excellent curability, storage stability, etc., imidazole catalysts having a triazine skeleton are preferred. These may be used alone or in combination of two or more.

[0052] The content of the curing catalyst in the first pressure-sensitive adhesive composition is, based on the total mass of the first pressure-sensitive adhesive composition, preferably 0.1 mass% or more, more preferably 0.2 mass% or more, even more preferably 0.4 mass% or more, and is preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 3 mass% or less. When the content of the curing catalyst in the first pressure-sensitive adhesive composition is equal to or more than the above-mentioned lower limit, the thermosetting resin component can be sufficiently cured. On the other hand, when the content of the curing catalyst is equal to or less than the above-mentioned upper limit, the storage stability of the pressure-sensitive adhesive layer becomes good.

[0053] The first adhesive composition preferably contains a resin component other than the thermosetting resin component as another resin component. By containing the other resin component, the heat sealability of the first adhesive layer can be easily ensured and excessive thermal expansion of the first adhesive layer after curing can be easily suppressed. Examples of other resin components include (meth)acrylic resins, phenoxy resins, polyester resins, polyurethane resins, polyimide resins, polyamideimide resins, siloxane-modified polyimide resins, polybutadiene resins, polypropylene resins, styrene-butadiene-styrene copolymers, styrene-ethylene-butylene-styrene copolymers, polyacetal resins, polyvinyl acetal resins such as polyvinyl butyral resins, butyl rubber, chloroprene rubber, polyamide resins, acrylonitrile-butadiene copolymers, acrylonitrile-butadiene-acrylic acid copolymers, acrylonitrile-butadiene-styrene copolymers, polyvinyl acetate, and nylon, and these may be used alone or in combination of two or more.

[0054] The weight-average molecular weight of the other resin component is preferably 10,000 or more, more preferably 30,000 or more, and even more preferably 50,000 or more, and is preferably 1,000,000 or less, more preferably 500,000 or less, and even more preferably 100,000 or less. The weight-average molecular weight is a value measured by gel permeation chromatography (GPC) in terms of standard polystyrene.

[0055]

[0044] The content of the other resin component in the first pressure-sensitive adhesive composition is, based on the total mass of the first pressure-sensitive adhesive composition, preferably 3 mass% or more, more preferably 7 mass% or more, even more preferably 12 mass% or more, and is preferably 95 mass% or less, more preferably 80 mass% or less, even more preferably 40 mass% or less, particularly preferably 25 mass% or less.

[0056] As the filler, it is preferable to use an inorganic filler. The inorganic filler that can be used in this embodiment is not particularly limited, but examples include silica, alumina, glass, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, amorphous silica, complex oxides such as mullite and cordierite, montmorillonite, smectite, etc., which can be used alone or in combination of two or more. Among these, silica filler is preferred. The shape of the silica filler is preferably spherical. The inorganic filler is preferably surface-modified with a silane coupling agent or the like.

[0057] The average particle size of the filler is preferably 10 nm or more, more preferably 20 nm or more, and even more preferably 30 nm or more, and is preferably 200 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. The average particle size of the filler can be determined, for example, by measuring the particle size distribution using a laser diffraction particle size analyzer (Malvern, Mastersizer 3000).

[0058] Furthermore, the content of the filler in the first pressure-sensitive adhesive composition is, based on the mass of the entire first pressure-sensitive adhesive composition, preferably 10 mass % or more, more preferably 20 mass % or more, even more preferably 30 mass % or more, and is preferably 80 mass % or less, more preferably 60 mass % or less, even more preferably 50 mass % or less. When the content of the filler is within the above range, the obtained first pressure-sensitive adhesive layer is more likely to satisfy the desired range for the storage modulus at 23°C before and after curing.

[0059] The first pressure-sensitive adhesive composition may further contain a flux component, a plasticizer, a stabilizer, a tackifier, a colorant, a coupling agent, an antistatic agent, an antioxidant, conductive particles, and the like.

[0060] 1-5. Second adhesive layer The second adhesive layer is provided on the first adhesive layer. As described above, the area of ​​the second adhesive layer in the planar direction is smaller than the area of ​​the first adhesive layer in the planar direction, and the thickness of the second adhesive layer is greater than the thickness of the first adhesive layer. The area of ​​the second adhesive layer in the planar direction may be determined depending on the size of the object to be attached, and may be, for example, 0.001 to 0.1 m 2 It can be said that: From the viewpoint of ensuring good embeddability, the thickness of the second adhesive layer is preferably 30 to 1,000 μm, more preferably 40 to 500 μm, and even more preferably 45 to 100 μm.

[0061] In the gas barrier film with the adhesive layer, the second adhesive layer is formed, for example, from an adhesive composition containing a modified polyolefin resin as component (A) and a multifunctional epoxy compound as component (B). Hereinafter, the adhesive composition used to form the second adhesive layer is also referred to as the "second adhesive composition". The second adhesive composition contains a modified polyolefin resin, which results in excellent adhesive strength. Furthermore, the second adhesive composition contains a polyfunctional epoxy compound, which results in a low storage modulus before curing. Furthermore, the cured product of the second adhesive composition containing a polyfunctional epoxy compound has excellent water vapor barrier properties.

[0062] The second pressure-sensitive adhesive composition may contain components other than the components (A) and (B). Examples of the components other than the components (A) and (B) include the following components (C), (D), and (E). Component (C): a tackifier with a softening point of 80°C or higher Component (D): Imidazole-based curing catalyst Component (E): Silane coupling agent

[0063] The modified polyolefin resin as component (A) is a polyolefin resin into which a functional group has been introduced. A polyolefin resin is a polymer containing repeating units derived from an olefin-based monomer. The polyolefin resin may be a homopolymer consisting of only one type of repeating unit derived from an olefin-based monomer, a copolymer consisting of two or more types of repeating units derived from olefin-based monomers, or a copolymer consisting of repeating units derived from an olefin-based monomer and repeating units derived from another monomer (a monomer other than an olefin-based monomer) copolymerizable with the olefin-based monomer.

[0064] The olefin monomer is preferably an α-olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene, or 1-hexene, and even more preferably ethylene or propylene. Examples of other monomers copolymerizable with the olefinic monomer include vinyl acetate, (meth)acrylic acid esters, and styrene.

[0065] Examples of polyolefin resins include, but are not limited to, very low density polyethylene (VLDPE), low density polyethylene (LDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), linear low density polyethylene, polypropylene (PP), ethylene-propylene copolymer, olefin elastomer (TPO), ethylene-vinyl acetate copolymer (EVA), ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester copolymer.

[0066] The modified polyolefin resin can be obtained by subjecting a precursor polyolefin resin to a modification treatment using a modifying agent. The modifier used in the modification treatment of the polyolefin resin is a compound having a functional group, that is, a group capable of contributing to a crosslinking reaction, in the molecule. Examples of functional groups include carboxyl groups, carboxylic anhydride groups, carboxylic ester groups, hydroxyl groups, epoxy groups, amide groups, ammonium groups, nitrile groups, amino groups, imide groups, isocyanate groups, acetyl groups, thiol groups, ether groups, thioether groups, sulfone groups, phosphate groups, nitro groups, urethane groups, and halogen atoms. Among these, carboxyl groups, carboxylic anhydride groups, carboxylic ester groups, hydroxyl groups, ammonium groups, amino groups, imide groups, and isocyanate groups are preferred, carboxylic anhydride groups and alkoxysilyl groups are more preferred, and carboxylic anhydride groups are particularly preferred. The compound having a functional group may have two or more types of functional groups in the molecule.

[0067] Examples of modified polyolefin resins include acid-modified polyolefin resins and silane-modified polyolefin resins, of which acid-modified polyolefin resins are preferred from the viewpoint of obtaining more excellent effects of the present invention.

[0068] Commercially available acid-modified polyolefin resins may also be used, such as Admer (registered trademark) (manufactured by Mitsui Chemicals, Inc.), Unistall (registered trademark) (manufactured by Mitsui Chemicals, Inc.), BondyRam (manufactured by Polyram), orevac (registered trademark) (manufactured by ARKEMA), and Modic (registered trademark) (manufactured by Mitsubishi Chemical Corporation).

[0069] The modified polyolefin resins can be used alone or in combination of two or more.

[0070] The weight average molecular weight (Mw) of the modified polyolefin resin is not particularly limited, but from the viewpoint of obtaining better effects of the present invention, it is preferably 10,000 to 2,000,000, and more preferably 10,000 to 1,000,000. The weight average molecular weight (Mw) of the modified polyolefin resin can be determined as a standard polystyrene equivalent value by performing gel permeation chromatography using tetrahydrofuran as a solvent.

[0071] The content of the modified polyolefin resin is not particularly limited, but from the viewpoint of obtaining more excellent effects of the present invention, it is preferable that the total amount of the modified polyolefin resin and the following component (B) is 30 mass % or more based on the solid content of the second pressure-sensitive adhesive composition.

[0072] The polyfunctional epoxy compound as component (B) is a compound having at least two epoxy groups in the molecule.

[0073] Examples of epoxy compounds having two or more epoxy groups include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, novolac epoxy resins (e.g., phenol-novolac epoxy resins, cresol-novolac epoxy resins, brominated phenol-novolac epoxy resins), hydrogenated bisphenols, and the like. Examples of suitable glycidyl ethers include bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, pentaerythritol polyglycidyl ether, 1,6-hexanediol diglycidyl ether, hexahydrophthalic acid diglycidyl ester, neopentyl glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, 2,2-bis(3-glycidyl-4-glycidyloxyphenyl)propane, and dimethyloltricyclodecane diglycidyl ether. These polyfunctional epoxy compounds can be used alone or in combination of two or more.

[0074] The second adhesive composition preferably contains, as component (B), a polyfunctional epoxy compound (B1) that is liquid at 25°C. Component (B) has the effect of reducing the storage modulus of the second adhesive composition when the second adhesive composition is heated to a high temperature (hereinafter, sometimes referred to as "storage modulus reducing effect"). Therefore, by using the second adhesive composition, a second adhesive layer that is excellent in unevenness-following ability can be efficiently formed.

[0075] The lower limit of the weight-average molecular weight of the polyfunctional epoxy compound (B1) that is liquid at 25°C is preferably 500, more preferably 700. The upper limit of the molecular weight of the polyfunctional epoxy compound is preferably 3,700, more preferably 3,400. By using an adhesive composition in which the weight-average molecular weight of the polyfunctional epoxy compound (B1) is 700 or more, a sealing material with even lower outgassing properties can be formed. An adhesive composition in which the weight-average molecular weight of the polyfunctional epoxy compound (B1) is 3,700 or less has excellent fluidity and can sufficiently fill in unevenness on the surface of the sealed object or unevenness caused by the thickness of the sealed object.

[0076] The second adhesive composition may contain, as the component (B), a polyfunctional epoxy compound (B2) that is solid at 25°C. Unlike the polyfunctional epoxy compound of the component (B1), the polyfunctional epoxy compound of the component (B2) is thought to have almost no effect on reducing the storage modulus. On the other hand, when the second pressure-sensitive adhesive composition contains the component (B2), the adhesive layer is improved in its ability to maintain its sheet shape. As a result of this tendency, when the component (B2) is used in combination with the component (B1), the storage modulus reducing effect of the component (B1) can be further enhanced. The presence of the component (B2) makes it possible to increase the content of the component (B) in the second adhesive composition while maintaining the ability to maintain the sheet shape of the adhesive layer. Therefore, in the phase-separated structure formed by the component (A) and the component (B) in the adhesive composition, the proportion of the continuous phase region of the component (B) increases. When the temperature of the adhesive layer formed from such a second adhesive composition is increased, the continuous phase region of the component (B) softens, thereby achieving a high storage modulus reducing effect. Therefore, the second adhesive composition preferably contains the component (B2), and more preferably contains both the component (B1) and the component (B2).

[0077] The lower limit of the weight average molecular weight of the polyfunctional epoxy compound (B2) that is solid at 25°C is preferably 3,800, more preferably 4,000. The upper limit of the weight average molecular weight of the polyfunctional epoxy compound (B2) is preferably 8,000, more preferably 7,000. By using a second pressure-sensitive adhesive composition in which the weight average molecular weight of the polyfunctional epoxy compound (B2) is 3,800 or more, the sheet shape of the pressure-sensitive adhesive layer is more easily maintained.

[0078] The content of the polyfunctional epoxy compound as component (B) in the second adhesive composition of the present invention is preferably 25 to 200 parts by mass per 100 parts by mass of component (A). When the content of the polyfunctional epoxy compound is within this range, the cured product of the adhesive composition has excellent water vapor barrier properties.

[0079] Examples of component (C) include rosin-based resins such as polymerized rosin, polymerized rosin esters, and rosin derivatives; terpene-based resins such as polyterpene resins, aromatic-modified terpene resins and their hydrogenated products, and terpene-phenolic resins; coumarone-indene resins; petroleum resins such as aliphatic petroleum resins, aromatic petroleum resins and their hydrogenated products, and aliphatic / aromatic copolymer petroleum resins; low-molecular-weight polymers of styrene or substituted styrene; and styrene-based resins such as α-methylstyrene homopolymer resins, α-methylstyrene / styrene copolymer resins, styrene-based monomer / aliphatic monomer copolymer resins, styrene-based monomer / α-methylstyrene / aliphatic monomer copolymer resins, styrene-based monomer homopolymer resins, and styrene-based monomer / aromatic monomer copolymer resins. Among these, styrene-based resins are preferred, and styrene-based monomer / aliphatic monomer copolymer resins are more preferred. These tackifiers can be used alone or in combination of two or more.

[0080] The softening point of the tackifier is 80° C. or higher. When the softening point of the tackifier is 80° C. or higher, an adhesive composition having excellent adhesive properties at high temperatures can be obtained. In addition, the workability when molding the second pressure-sensitive adhesive composition into a sheet shape is improved.

[0081] When the second pressure-sensitive adhesive composition contains a tackifier having a softening point of 80°C or higher as component (C), the content thereof is preferably 1 to 200 parts by mass relative to 100 parts by mass of the component (A).

[0082] The imidazole curing catalyst as component (D) is a compound having an imidazole skeleton, and has the effect of catalyzing the curing reaction of the adhesive composition. Examples of imidazole curing catalysts include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole. Among these, 2-ethyl-4-methylimidazole is preferred. These imidazole curing catalysts can be used alone or in combination of two or more.

[0083] When the second adhesive composition contains an imidazole curing catalyst, the content thereof is preferably 0.1 to 10 parts by mass relative to 100 parts by mass of the component (A).

[0084] The second adhesive composition may contain a solvent. Examples of the solvent include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; aliphatic hydrocarbon solvents such as n-pentane, n-hexane and n-heptane; and alicyclic hydrocarbon solvents such as cyclopentane, cyclohexane and methylcyclohexane. These solvents can be used alone or in combination of two or more. The content of the solvent can be appropriately determined taking into consideration the coatability and the like.

[0085] The second pressure-sensitive adhesive composition may contain other components as long as the effects of the present invention are not impaired. Examples of other components include additives such as ultraviolet absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, and softeners. These may be used alone or in combination of two or more. When the second pressure-sensitive adhesive composition contains these additives, the content thereof can be appropriately determined depending on the purpose.

[0086] The second adhesive composition is prepared by appropriately mixing and stirring the predetermined components according to a conventional method.

[0087] In the gas barrier film with the pressure-sensitive adhesive layer, from the viewpoint of melting and embedding the object to be coated, the storage modulus of the second pressure-sensitive adhesive layer at 100° C. is preferably 1 MPa or less, more preferably 0.5 MPa or less, and even more preferably 0.1 MPa or less. There are no particular restrictions on the lower limit of the storage modulus, but in consideration of ease of production, it is, for example, 0.001 MPa.

[0088] 1-6. Other examples of gas barrier films with adhesive layers The gas barrier film with a pressure-sensitive adhesive layer according to the embodiment of the present invention is not limited to the one shown in Figs. 1 to 3, and may include one or more other layers on the base film, between the base film and the gas barrier layer, or on the gas barrier layer, etc., within the scope of not impairing the object of the present invention. Examples of the other layers include other gas barrier layers, protective layers, etc. The positions of the other layers are not limited to those described above.

[0089] The gas barrier film with the adhesive layer may be a long film. In this case, the gas barrier film with the adhesive layer may be in the form of a roll wound around a core material.

[0090] 2. Manufacturing method of gas barrier film with adhesive layer The method for producing a gas barrier film with a pressure-sensitive adhesive layer according to an embodiment of the present invention includes the following steps. Process 1: Gas barrier layer formation process ·Step 2: First adhesive layer formation step ·Step 3: Second adhesive layer formation step Step 1 preferably further comprises the following steps: Step 1-1: Preparation of the base film Step 1-2: Formation of gas barrier layer

[0091] Fig. 4 shows an example of a manufacturing process for a gas barrier film with a pressure-sensitive adhesive layer according to an embodiment of the present invention, and is illustrated using the pressure-sensitive adhesive layer-attached gas barrier film 100 of Fig. 1 as an example. Each step will be described below with appropriate reference to the drawings.

[0092] 2-1. Preparation of the base film (Step 1-1) A substrate film is prepared in which an anchor layer 2 is formed on the surface of a support layer 1 (reference numeral 10 in FIG. 4(a)). The substrate film may be produced by forming an anchor layer on a support layer, or a commercially available substrate film with an anchor layer may be used.

[0093] 2-2. Formation of gas barrier layer (step 1-2) In step 1-2, the gas barrier layer 20 is formed on the substrate film according to the procedure described in the above section "1-3. Gas barrier layer" (see FIG. 4(b)).

[0094] 2-3. Formation of adhesive layer (Step 2: First adhesive layer formation step) A first adhesive layer (reference numeral 31 in FIG. 4(c)) is formed by applying an adhesive composition for forming a first adhesive layer onto a release film (reference numeral 41 in FIG. 4(b)) in advance and drying it. In this way, a first sheet 51 for forming a gas barrier film with an adhesive layer is produced. Next, as shown in FIG. 4( b ), the first adhesive layer 31 of the first sheet 51 for forming a gas barrier film with an adhesive layer is placed opposite the surface of the gas barrier layer 20 . Furthermore, by pressing using a laminator or the like, the first adhesive layer 31 is laminated on the gas barrier layer 20 as shown in FIG. 4(c), and the release film 41 is removed.

[0095] (Step 3: Second adhesive layer formation step) The adhesive composition for forming the first adhesive layer is applied to a release film (reference numeral 42 in FIG. 4(d)) in advance, and dried to form the first adhesive layer (reference numeral 32 in FIG. 4(d)). In this way, a second sheet 52 for forming a gas barrier film with an adhesive layer is prepared. Next, as shown in FIG. 4( d ), the second adhesive layer 32 of the second sheet 52 for forming an adhesive-layered gas barrier film is placed on the first adhesive layer 31 so as to face the first adhesive layer 31 . Furthermore, after pressing using a laminator or the like, the release film 42 is removed, thereby forming a gas barrier film 100 with adhesive layers, in which the first adhesive layer 31 and the second adhesive layer 32 are laminated in this order on the gas barrier layer 20, as shown in Figure 4(e).

[0096] 2-4. Gas barrier film production kit with adhesive layer The first sheet 51 for forming a gas barrier film with a pressure-sensitive adhesive layer and the second sheet 52 for forming a gas barrier film with a pressure-sensitive adhesive layer may be combined to form a kit for producing a gas barrier film with a pressure-sensitive adhesive layer. In this case, a user (i) attaches the first sheet 51 for forming a gas barrier film with a pressure-sensitive adhesive layer to the gas barrier layer 20 on the base film 10, removes the release film 41, and then attaches the second sheet 52 for forming a gas barrier film with a pressure-sensitive adhesive layer, or (ii) attaches the second pressure-sensitive adhesive layer 32 of the second sheet 52 for forming a gas barrier film with a pressure-sensitive adhesive layer to the first pressure-sensitive adhesive layer 31 of the first sheet 51 for forming a gas barrier film with a pressure-sensitive adhesive layer to form a laminate, and then removes the release film 41 from the laminate to attach the second pressure-sensitive adhesive layer 32 of the laminate to the gas barrier layer 20 of the base film 10.

[0097] 3. Photoelectric conversion device Furthermore, a first photovoltaic device according to an embodiment of the present invention is a photovoltaic device including a photovoltaic element and two sets of the above-mentioned gas barrier films with adhesive layers, wherein the second adhesive layer of the first gas barrier film with adhesive layers (F1) of the two sets of gas barrier films with adhesive layers faces the back surface side of the photovoltaic element, and the second adhesive layer of the second gas barrier film with adhesive layers (F2) of the two sets of gas barrier films with adhesive layers faces the front surface side of the photovoltaic element, and The first adhesive layer of the gas barrier film (F1) and the first adhesive layer of the gas barrier film (F2) with the second adhesive layer are bonded to each other, the second adhesive layer of the gas barrier film (F1) with the first adhesive layer and the second adhesive layer of the gas barrier film (F2) with the second adhesive layer are bonded to each other, and the photoelectric conversion element is embedded in the second adhesive layer of the gas barrier film (F1) with the first adhesive layer and the second adhesive layer of the gas barrier film (F2) with the second adhesive layer.

[0098] FIG. 5(a) shows an example of the configuration of the first photoelectric conversion device. The photovoltaic device 200 shown in Figure 5(a) has a configuration in which the front and back surfaces of the photovoltaic element 60 are covered with two sets of gas barrier films with adhesive layers, each having the same configuration as the gas barrier film with adhesive layers 100 shown in Figure 1. The photoelectric conversion element 60 has its upper surface, lower surface and side surfaces covered with the second adhesive layer 32 derived from the two sets of gas barrier films with adhesive layers, and is embedded in the second adhesive layer 32. The second adhesive layer 32 has its upper surface, lower surface and side surfaces covered with the first adhesive layer 31 derived from the two sets of gas barrier films with adhesive layers. The back surface side of the photoelectric conversion element 60 has a base film 10a including a support layer 1a and an anchor layer 2a, which are derived from the first gas barrier film (F1) with a pressure-sensitive adhesive layer, and a gas barrier layer 20. The front surface side of the photoelectric conversion element 60 has a base film 10b including a support layer 1b and an anchor layer 2b, which are derived from the second gas barrier film (F2) with a pressure-sensitive adhesive layer, and a gas barrier layer 20b. The photoelectric conversion element 60 and the second adhesive layer 32 are not present in the peripheral portion of the photoelectric conversion device 200, and the thickness of the peripheral portion is smaller than the thickness of the central portion. In addition, the side surface of the peripheral portion forms a cut surface CS.

[0099] The photoelectric conversion element 60 may be, for example, a solar cell element, an organic electroluminescence display element, or an electronic paper element.

[0100] A second photovoltaic device according to an embodiment of the present invention is a photovoltaic device comprising a photovoltaic element and the above-mentioned gas barrier film with a pressure-sensitive adhesive layer, and has a backing material facing the back surface of the photovoltaic element, wherein the front and side surfaces of the photovoltaic element are embedded in the second pressure-sensitive adhesive layer of the gas barrier film with a pressure-sensitive adhesive layer, and the first pressure-sensitive adhesive layer of the gas barrier film with a pressure-sensitive adhesive layer is bonded to the backing material. Preferably, a second pressure-sensitive adhesive layer is further bonded to the backing material.

[0101] FIG. 5(b) shows an example of the configuration of the first photoelectric conversion device. The photovoltaic device 201 shown in FIG. 5(b) has a configuration in which the front and back surfaces of the photovoltaic element 60 are covered with the gas barrier film 100 with the adhesive layer and the back surface material 70 shown in FIG. The photoelectric conversion element 60 has its upper and side surfaces covered with the second adhesive layer 32 derived from the adhesive layer-provided gas barrier film 100, and is embedded in the second adhesive layer 32. The second adhesive layer 32 has its upper and side surfaces covered with the first adhesive layer 31 derived from the adhesive layer-provided gas barrier film 100. A back surface material 70 is in contact with the back surface of the photoelectric conversion element 60, and a second adhesive layer 32 and a first adhesive layer 31 are bonded to the front surface of the back surface material 70 around the photoelectric conversion element 60. The photoelectric conversion element 60 and the second adhesive layer 32 are not present in the peripheral portion of the photoelectric conversion device 200, and the thickness of the peripheral portion is smaller than the thickness of the central portion. In addition, the side surface of the peripheral portion forms a cut surface CS.

[0102] It is desirable to use a glass back surface material, a metal back surface material, a resin-coated metal back surface material, a back surface material in which metal is vapor-deposited onto a base material, etc. as the back surface material 70. These may be in the form of a plate, sheet, or film.

[0103] 4. Photoelectric conversion device manufacturing method The method for manufacturing a photoelectric conversion device according to the embodiment of the present invention includes at least a sealing step (step 4), and further includes a cutting step (step 5) as needed. 6 and 7 show an example of a manufacturing process for a photoelectric conversion device according to an embodiment of the present invention, taking the above-described photoelectric conversion device 200 as an example. Figures 6(a) to 6(d) correspond to step 4, and Figure 7 corresponds to step 5. Fig. 7(a) is a longitudinal cross-sectional view of the photoelectric conversion device 200, and Fig. 7(b) is a transverse cross-sectional view of the photoelectric conversion device 200. Fig. 7(a) is a cross-sectional view taken along line VIIA-VIIA in Fig. 7(b), and Fig. 7(b) is a cross-sectional view taken along line VIIB-VIIB in Fig. 7(b). Each step will be described below with reference to the drawings as appropriate.

[0104] (Process 4: Sealing process) As shown in FIG. 6(a), a gas barrier film (F1) with a first adhesive layer is prepared, which has a base film 10a, a gas barrier layer 20a, a first adhesive layer 31a, and a second adhesive layer 32a, and has the same configuration as that shown in FIG. 1 described above. Next, as shown in FIG. 6(b), a photoelectric conversion element 60, which is an object to be attached, is placed on the second adhesive layer 32a of the first adhesive layer-coated gas barrier film (F1). Next, using a gas barrier film (F2) with a second adhesive layer, which has been prepared in advance and includes a base film 10b, a gas barrier layer 20b, a first adhesive layer 31b, and a second adhesive layer 32b, and has a configuration similar to that shown in FIG. 1 above, the second adhesive layer 32b is attached to the front surface of the photoelectric conversion element 60, which is the object to be attached, as shown in FIG. 6(c). Then, the first gas barrier film (F1) with adhesive layer and the second gas barrier film (F2) with adhesive layer are pressed together using a laminator or the like, thereby embedding the photoelectric conversion element 60 in the second adhesive layer 32 derived from the second adhesive layer 32a and the second adhesive layer 32b. At this time, the first adhesive layer 31a and the first adhesive layer 31b are bonded to each other at their peripheral portions, and the second adhesive layer 32 and the photoelectric conversion element are sealed by the first adhesive layer 31, the gas barrier layers 20a, 20b, and the base films 10a, 10b derived from both of them. In this way, as shown in FIG. 6(d), a photoelectric conversion device 200' is obtained whose peripheral edge has not been cut. In the case of the photoelectric conversion device 201, the photoelectric conversion element 60 is placed on the back surface material 70 instead of the first gas barrier film with adhesive layer (F1), and is fixed to the back surface material by an adhesive layer or the like as needed, but the photoelectric conversion element is sealed by the back surface material and the gas barrier film with adhesive layer in the same manner as described above.

[0105] (Process 5: Cutting process) Next, as shown in Figure 7(a), the photoelectric conversion device 200' is cut along the dicing line DL to remove unnecessary portions, thereby obtaining the photoelectric conversion device 200 having the configuration shown in Figure 5(a) described above. 7(b), the dicing lines DL are set at positions close to the outer side of the second adhesive layer 32 that spreads in the planar direction. By setting the dicing lines DL in this manner, the adhesive layer that appears on the cut surface CS can be the first adhesive layer 31 alone, which makes it easier to improve the sealing performance around the entire photoelectric conversion element 60. Furthermore, if the first adhesive layer 31 is a cured product of the curable adhesive, it is possible to suppress the occurrence of cracks in the gas barrier layer 20 during the cutting step. [Example]

[0106] Next, specific examples of the present invention will be described, but the present invention is not limited to these examples in any way. The storage modulus of the pressure-sensitive adhesive layer produced in the Production Examples described below, and the water vapor transmission rate of the gas barrier film with a pressure-sensitive adhesive layer and the light transmission rate of the gas barrier film with a pressure-sensitive adhesive layer produced in the Examples and Comparative Examples were measured, calculated, and evaluated by the following procedures.

[0107] [Storage modulus] The storage modulus of each adhesive layer described below was measured by the following procedure. A plurality of pre-cured pressure-sensitive adhesive layers were laminated using a laminator at 23°C to a total thickness of 200 μm to prepare a pre-cured measurement sample. A plurality of pre-cured pressure-sensitive adhesive layers were laminated using a laminator at 23°C to a total thickness of 200 μm, and then thermally cured at 150°C for 1 hour to prepare a post-cured measurement sample. The storage modulus of the obtained measurement sample was measured using a storage modulus measuring device (manufactured by TA Instruments, product name: DMAQ800) under conditions of a frequency of 11 Hz, an amplitude of 5 μm, and a heating rate of 3°C / min over a temperature range of -20°C to +150°C. The value at 23°C was designated as the storage modulus at 23°C before curing (E0), and the storage modulus at 23°C after curing (E1). For the pressure-sensitive adhesive layer 1C before curing in Examples 7 to 9 and Comparative Example 1, a measurement sample was prepared by laminating layers to a total thickness of 1 mm using a laminator at 23° C. Then, the storage modulus of this measurement sample was measured in the temperature range of −20° C. to +150° C. using a storage modulus measuring device (manufactured by Anton Paar, trade name: Physica MCR301) under conditions of a frequency of 1 Hz, a strain of 1%, and a heating rate of 3° C. / min, and the value at 23° C. was taken as the storage modulus E0.

[0108] [Light transmittance] The gas barrier films with pressure-sensitive adhesive layers obtained in the examples and comparative examples were measured for light transmittance (%) using an ultraviolet-visible-near-infrared (UV-Vis-NIR) spectrophotometer (Shimadzu Corporation, product name "UV-3600"). A film having a light transmittance of 85% or more in the wavelength range of 400 to 780 nm was rated "G", and a film having a lower light transmittance was rated "NG", with "G" being considered a pass.

[0109] [Water Vapor Transmission Rate (WVTR)] The water vapor transmission rate (WVTR) (unit: g / m) of the gas barrier films with pressure-sensitive adhesive layers obtained in the examples and comparative examples was measured under conditions of a relative humidity of 90% and 40°C using a water vapor transmission rate measuring device (AQUATRAN-2 (AQUATRAN is a registered trademark) manufactured by MOCON). 2 / day).

[0110] [Calcium corrosion test] A metal calcium-laminated glass plate was obtained by laminating metal calcium onto the surface of a glass plate measuring 200 μm thick, 100 mm long, and 100 mm wide using a vapor deposition apparatus (ALS, E-200) at a vapor deposition rate of 80 nm / min for 20 minutes. The obtained glass plate was covered from both sides with two gas barrier films with adhesive layers obtained in the examples described below, so that one side of the glass plate was in contact with the second adhesive layer of one of the two gas barrier films with adhesive layers, and the other side of the glass plate was in contact with the second adhesive layer of the other of the two gas barrier films with adhesive layers, and the glass plate was positioned at the center between them, and the two films were heated and pressed at 100°C to obtain a measurement sample. The thermocompression bonding was performed using a metal box-shaped jig that was in contact with the region where the second adhesive layer was not laminated and where only the first adhesive layer was present, and that had a depth such that the portion where the second adhesive layer was present would have a planned height after thermocompression bonding, so that both sides were covered with two of the jigs. The obtained measurement samples were stored for 500 hours at 40°C and 90% relative humidity, and then the calcium film surface was photographed with a 12,000-pixel digital camera. The water vapor transmission rate (WVTR) of the obtained measurement samples was calculated according to the "calcium corrosion method" specified in JIS K 7129-7:2016. When the WVTR was 1.0 x 10 -3 g / m 2 / day is defined as "G", and WVTR is 1.0 x 10 -3 g / m 2 / day or more was rated as "NG" and "G" was rated as passing.

[0111] [Cutting test] Two continuous gas barrier films with adhesive layers were prepared for each example, each having a first adhesive layer and a second adhesive layer formed at five equal intervals (40 mm) on the first adhesive layer. Similarly to the calcium corrosion test, both sides of a metal-calcium laminated glass plate were covered with the second adhesive layer, and the resulting glass plate was heated and pressed to obtain a sealed structure having five sealed portions of the metal-calcium laminated glass plate. The resulting sealed body was cut at the center of the gap using a super cutter (Ogino Seiki Seisakusho Co., Ltd., continuous automatic cutting machine super cutter model: PR1-06NF) to obtain five sets of test samples each representing a 120 mm x 120 mm square photoelectric conversion device. The WVTR of the resulting test samples was measured under the same conditions as in the "calcium corrosion test" described above, and the arithmetic mean value was calculated. When the arithmetic mean value of the WVTR was 1.0 x 10 -3 g / m 2 / day is "G", 1.0 × 10 -3 g / m 2 / day or more was rated as "NG" and "G" was rated as passing.

[0112] [Preparation of gas barrier film] <Gas barrier film A> A perhydropolysilazane (Aquamica NL110A, manufactured by Merck) was applied to the untreated side (PET side) of a 50 μm-thick polyethylene terephthalate (PET) film (A-4160, manufactured by Toyobo Co., Ltd.) that had been treated for easy adhesion on one side, and then heat-cured at 120°C for 2 minutes to form a polysilazane layer. The polysilazane layer had a thickness of 200 nm. Next, using a plasma ion implantation device, plasma ion implantation was performed on the polysilazane layer under the following conditions to modify the surface of the polysilazane layer, thereby obtaining a first gas barrier layer. Next, a second gas barrier layer was formed using the same procedure, thereby obtaining gas barrier film A. The water vapor permeability of gas barrier film A was 4.8 x 10 -4 g / m 2 It was / day. The plasma ion implantation apparatus and plasma ion implantation conditions used in the above modification treatment are as follows: (Plasma ion implantation equipment) RF power supply: Model number "RF56000", manufactured by JEOL Ltd. High-voltage pulse power supply: "PV-3-HSHV-0835", manufactured by Kurita Manufacturing Co., Ltd. (Plasma ion implantation conditions) Plasma generating gas: He Gas flow rate: 100sccm ·Duty ratio: 0.5% Repetition rate: 1,000Hz Applied voltage: -10kV ·RF power supply: Frequency 13.56MHz, applied power 1,000W Chamber pressure: 0.2 Pa Pulse width: 5μsec Processing time (ion implantation time): 800 seconds

[0113] [Preparation of first adhesive layer] Pressure-sensitive adhesive compositions 1A and 1B were prepared by mixing the components according to the formulations shown in Table 1 and adjusting the solid content to 20 mass % by adding methyl ethyl ketone as a solvent. These pressure-sensitive adhesives were individually coated onto silicone-treated release films (SP-PET381031, manufactured by Lintec Corporation), and the resulting coatings were dried in an oven at 100°C for 1 minute to prepare first pressure-sensitive adhesive layers having the thicknesses shown in Table 1. Hereinafter, these pressure-sensitive adhesive layers are also referred to as "pressure-sensitive adhesive layer 1A" and "pressure-sensitive adhesive layer 1B". Furthermore, 100 parts by mass of a modified polyolefin resin (acid-modified α-olefin polymer, manufactured by Mitsui Chemicals, Inc., trade name: UNISTOL H-200, weight average molecular weight: 52,000, functional group: carboxyl group, glass transition temperature: 25°C), 100 parts by mass of a compound having a cyclic ether group (manufactured by Nissan Chemical Corporation, trade name: TEPIC-FL, molecular weight: 525, functional group: glycidyl group), 1 part by mass of a cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., trade name: SAN-AID SI-B2A) as a curing catalyst, and 0.2 parts by mass of a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM4803) were dissolved in methyl ethyl ketone to prepare a coating liquid with a solids concentration of 20% by mass (adhesive composition 1C). This coating liquid was applied to the release-treated surface of a release film (manufactured by Lintec Corporation, product name: SP-PET382150), and the resulting coating film was dried at 100°C for 2 minutes to prepare a first adhesive layer having a thickness of 25 µm. Hereinafter, this adhesive layer will also be referred to as "adhesive layer 1C".

[0114] [Table 1]

[0115] The storage moduli of the above-mentioned adhesive layers 1A to 1C, which are the first adhesive layers, were measured. In this measurement, the storage moduli at 23°C of the adhesive layer in an uncured state after coating and drying, and the storage moduli at 23°C of the adhesive layer after coating and drying and curing at 150°C for 1 hour were measured. The results are shown in Table 2.

[0116] [Table 2]

[0117] [Preparation of second adhesive layer] (Preparation of second adhesive layer 2A) 100 parts by mass of an acid-modified polyolefin resin (α-olefin polymer, manufactured by Mitsui Chemicals, Inc., trade name: UNISTOL H-200, weight average molecular weight: 52,000), 100 parts by mass of a multifunctional epoxy compound (1) (hydrogenated bisphenol A diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd., trade name: Epolite 4000, liquid at 25°C, epoxy equivalent: 215 to 245 g / eq, weight average molecular weight: 800), 50 parts by mass of a tackifier (styrene-based monomer-aliphatic monomer copolymer, softening point: 95°C, manufactured by Mitsui Chemicals, Inc., trade name: FTR6100), and 1 part by mass of an imidazole-based curing catalyst (manufactured by Shikoku Chemicals Corporation, trade name: Curesol 2E4MZ, 2-ethyl-4-methylimidazole) were dissolved in methyl ethyl ketone to prepare a pressure-sensitive adhesive composition 1 with a solids concentration of 30% by mass. This adhesive composition 1 was coated on the release-treated surface of a release film (manufactured by Lintec Corporation, product name: SP-PET382150), and the resulting coating was dried at 100°C for 2 minutes to form an adhesive layer with a thickness of 50 µm. Onto this, the release-treated surface of another release film (manufactured by Lintec Corporation, product name: SP-PET381031) was laminated to obtain a second adhesive layer with release films laminated on both the front and back sides. Hereinafter, this adhesive layer will also be referred to as "adhesive layer 2A".

[0118] (Preparation of second adhesive layers 2B and 2C) Adhesive 2B and adhesive 2C were prepared in the same procedure as for adhesive 2A, except that the components used were changed to those shown in Table 3. Furthermore, a second adhesive layer was produced using these in the same procedure as for adhesive layer 2A. Hereinafter, these adhesive layers will also be referred to as "adhesive layer 2B" and "adhesive layer 2C". In Table 3, "polyfunctional epoxy compound (2)" is manufactured by Mitsubishi Chemical Corporation, trade name: YX8034 (liquid at 25°C, epoxy equivalent: 270 g / eq, weight average molecular weight: 3,200).

[0119] [Table 3]

[0120] (Preparation of second adhesive layer 2D) 20 parts by mass of maleic anhydride modified polyolefin resin (manufactured by Mitsui Chemicals, Inc., product name: Admer SE731) and 80 parts by mass of silane modified polyolefin resin (manufactured by Mitsubishi Chemical Corporation, product name: Linkron XLE815N) were dry blended and coated onto the release-treated surface of the release sheet by extrusion film formation (200°C) to prepare a second adhesive layer with a thickness of 50 μm. Hereinafter, this adhesive layer will also be referred to as "adhesive layer 2D".

[0121] The storage moduli of the above adhesive layers 2A to 2D, which were the second adhesive layers, were measured at 23° C. and 100° C. The results are shown in Table 4.

[0122] [Table 4]

[0123] [Preparation of sealed body for evaluation] A first adhesive layer (150 mm × 150 mm) was laminated to the obtained gas barrier film (150 mm × 150 mm), and then a second adhesive layer (110 mm × 110 mm) was laminated to obtain a gas barrier film with an adhesive layer. A 200 μm thick glass plate (100 mm × 100 mm) representing the photoelectric conversion element to be attached was laminated on the surface of the second adhesive layer of the obtained gas barrier film with an adhesive layer, and laminated at 100°C to produce an encapsulated product for evaluation having a configuration similar to that of the photoelectric conversion device 201 shown in Figure 5(b). The initial light transmittance and water vapor transmittance in Table 5 are the results obtained using this encapsulated product for evaluation.

[0124] The results of the measurement and evaluation of the gas barrier films with pressure-sensitive adhesive layers of the respective Examples and Comparative Examples are shown in Table 5, together with the thickness of the gas barrier layer, the type and thickness of the first pressure-sensitive adhesive layer, and the type and thickness of the second pressure-sensitive adhesive layer.

[0125] [Table 5]

[0126] As is clear from the results in Table 5, the gas barrier films with adhesive layers of Examples 1 to 9, which had a configuration in which the second adhesive layer was thicker than the first adhesive layer and the area of ​​the second adhesive layer in the planar direction was smaller than the area of ​​the first adhesive layer in the planar direction, had high light transmittance and high gas barrier properties, and maintained the gas barrier properties at a high level even after the calcium test. Furthermore, the gas barrier films with adhesive layers of Examples 1 to 6 also had good gas barrier properties even after cutting. On the other hand, the gas barrier film with a pressure-sensitive adhesive layer of Comparative Example 1 had good light transmittance and initial gas barrier property, but the gas barrier property after the calcium corrosion test and the cut test was inferior to those of the gas barrier films with a pressure-sensitive adhesive layer of Examples 1 to 6. [Explanation of symbols]

[0127] 1, 1a, 1b: Support layer 2, 2a, 2b: Anchor layer 10, 10a, 10b: Base film 20, 20a, 20b: gas barrier layer 31, 31a, 31b: First adhesive layer 31R: Recess 32, 32a, 32b: Second adhesive layer 41, 42: Release film 51: First sheet for forming a gas barrier film with a pressure-sensitive adhesive layer 52: Second sheet for forming gas barrier film with adhesive layer 60: Photoelectric conversion element 70: Backing material 100, 101, 102: Gas barrier film with adhesive layer 200, 200', 201: Photoelectric conversion device F1: First adhesive layer-attached gas barrier film F2: Gas barrier film with second adhesive layer L1: Length in the longitudinal direction of the first adhesive layer L2: Length in the longitudinal direction of the second adhesive layer W1: Length in the short direction of the first adhesive layer W2: Length in the short direction of the second adhesive layer d1: distance between an end of the first adhesive layer and an end of the second adhesive layer in one longitudinal direction d2: distance between the end of the first adhesive layer and the end of the second adhesive layer on the other side in the longitudinal direction d3: Distance between an end of the first adhesive layer and an end of the second adhesive layer in one of the short-side directions d4: Distance between the end of the first adhesive layer and the end of the second adhesive layer on the other side in the short direction h1: thickness of the first adhesive layer h2: thickness of the second adhesive layer CS: Cut surface DL: Dicing line

Claims

1. a substrate film, a gas barrier layer, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order; the second adhesive layer is thicker than the first adhesive layer, a gas barrier film with an adhesive layer, wherein the area of ​​the second adhesive layer in a planar direction is smaller than the area of ​​the first adhesive layer in a planar direction.

2. Water vapor permeability is 1.0 x 10 －２ g / m ２ The gas barrier film with a pressure-sensitive adhesive layer according to claim 1 , wherein the gas barrier film has a viscosity of 1000 psi or less.

3. 3. The gas barrier film with a pressure-sensitive adhesive layer according to claim 1, wherein a light transmittance in a wavelength region of 400 to 780 nm in a region where the second pressure-sensitive adhesive layer is present is 50% or more.

4. 3. The gas barrier film with a pressure-sensitive adhesive layer according to claim 1 or 2, wherein the first pressure-sensitive adhesive layer comprises a curable pressure-sensitive adhesive, and a storage modulus at 23°C of the first pressure-sensitive adhesive layer after curing is higher than a storage modulus at 23°C of the second pressure-sensitive adhesive layer.

5. The gas barrier film with a pressure-sensitive adhesive layer according to claim 4 , wherein the first pressure-sensitive adhesive layer has a storage modulus at 23° C. after curing of 0.5 GPa or more.

6. The gas barrier film with a pressure-sensitive adhesive layer according to claim 1 or 2, wherein the second pressure-sensitive adhesive layer has a storage modulus at 100°C of 1 MPa or less.

7. A photoelectric conversion device comprising a photoelectric conversion element and the gas barrier film with the pressure-sensitive adhesive layer according to claim 1 or 2, a back surface material facing a back surface side of the photoelectric conversion element; a front surface and a side surface of the photoelectric conversion element are embedded in the second adhesive layer of the adhesive layer-attached gas barrier film, A photoelectric conversion device, wherein the first adhesive layer of the adhesive-layer-attached gas barrier film is bonded to the backing material.

8. A photoelectric conversion device comprising a photoelectric conversion element and two pairs of the pressure-sensitive adhesive layer-attached gas barrier films according to claim 1 or 2, the second adhesive layer of the first adhesive layer-having gas barrier film (F1) of the two sets of adhesive layer-having gas barrier films faces the back surface side of the photoelectric conversion element, the second adhesive layer of the second adhesive layer-having gas barrier film (F2) of the two sets of adhesive layer-having gas barrier films faces the front surface side of the photoelectric conversion element, the first adhesive layer of the first adhesive layer-provided gas barrier film (F1) and the first adhesive layer of the second adhesive layer-provided gas barrier film (F2) are bonded to each other, the second adhesive layer of the first adhesive layer-provided gas barrier film (F1) and the second adhesive layer of the second adhesive layer-provided gas barrier film (F2) are bonded to each other, a photoelectric conversion device, wherein the photoelectric conversion element is embedded in the second adhesive layer of the first adhesive layer-provided gas barrier film (F1) and the second adhesive layer of the second adhesive layer-provided gas barrier film (F2).

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