Thermal design support device, thermal design support method, and program

Abstract

To facilitate setting of thermal environment even in the case of a celestial body whose infrared radiation amount or albedo greatly varies, in a thermal design technique such as a satellite.SOLUTION: A thermal design support device includes: an orbit condition definition part for acquiring an orbital condition which is a condition related to an orbit of a satellite; a photovoltaic power input amount calculation part for calculating a photovoltaic power input amount received on the orbit of the satellite using the orbital condition; an albedo amount calculation part for acquiring an albedo amount received on the orbit of the satellite by numerical integration in an integration range calculated using the orbital condition; an infrared radiation amount calculation part for acquiring an infrared radiation amount received on the orbit of the satellite by numerical integration in the integration range calculated using the orbital condition; and a thermal environment calculation result output part for acquiring the photovoltaic power input amount, the albedo amount and the infrared radiation amount, and outputting a thermal environment calculation result.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The disclosed technology relates to thermal design technology. [Background technology]

[0002] Among thermal design technologies, there is one that is used to confirm the thermal feasibility of a satellite in the early stages of its design. For example, as a thermal design method for small satellites, design feasibility may be confirmed using an analytical method such as two-node analysis. In thermal design technology using two-node analysis, in the early stages of thermal design of a small satellite, the satellite's exterior and interior are each considered as one node, and the thermal-optical properties of the satellite's exterior are determined by analyzing the satellite's exterior while changing them (Non-Patent Document 1). In thermal design technology using such analytical methods, the thermal environment of a satellite is traditionally determined by analytically setting a certain amount of infrared radiation and albedo predetermined for each celestial body around which the satellite orbits, in addition to the amount of sunlight that the satellite will be directly exposed to. Infrared radiation indicates the amount of radiant energy in the infrared wavelength range emitted from the surface of a celestial body. Albedo is expressed as reflectance, or the ratio of reflected solar radiation to the amount of solar radiation hitting the surface of a celestial body. [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] Trans. JSASS Aerospace Tech. Japan Vol. 11, pp. 71-78, 2013 “One Nodal Thermal Analysis for Nano and Micro Satellites on Sun-Synchronous and Circular Orbits” Summary of the Invention [Problem to be solved by the invention]

[0004] However, some celestial bodies, such as natural satellites like the Moon or bodies with thin atmospheres, have large variations in infrared radiation or albedo. In the case of celestial bodies with large variations in infrared radiation or albedo, there is a problem in that it is difficult to set the thermal environment related to artificial satellites using two-node analysis.

[0005] The present disclosure is intended to solve the above-mentioned problems, and aims to facilitate the setting of the thermal environment in thermal design technology for artificial satellites and the like, even in the case of celestial bodies whose infrared radiation or albedo fluctuates greatly. [Means for solving the problem]

[0006] The thermal design support device of the present disclosure includes: an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires an albedo amount that the satellite will experience on its orbit by performing numerical integration within an integration range calculated using the orbital conditions; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration within an integration range calculated using the orbit conditions; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; Equipped with. [Effects of the Invention]

[0007] According to the present disclosure, for example, in thermal design technology for artificial satellites and the like, it is possible to easily set the thermal environment even in the case of a celestial body whose infrared radiation amount or albedo varies greatly. [Brief explanation of the drawings]

[0008] [Figure 1]FIG. 1 is a diagram for explaining the configuration factors of a flat plate on an orbit and the ground surface used in the theory according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a diagram for explaining the integral range of Φ used in the theory according to the embodiment of the present disclosure. [Figure 3] FIG. 3 is a diagram for explaining the concept of integral ranges used in the theory according to the embodiment of the present disclosure. [Figure 4] FIG. 4 is a diagram for explaining the calculation of ω used in the theory according to the embodiment of the present disclosure. [Figure 5] FIG. 5 is a diagram for explaining the angle at which an artificial satellite used in the theory according to the embodiment of the present disclosure is hidden in the shadow of a planet. [Figure 6] FIG. 6 is a diagram illustrating an example of the configuration of a thermal design assistance apparatus according to the first embodiment of the present disclosure. [Figure 7] FIG. 7 is a diagram illustrating an example of a reception display related to thermal environment calculation in the thermal design assistance apparatus according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is a flowchart illustrating an example of processing performed by the thermal design assistance apparatus according to the first embodiment of the present disclosure. [Figure 9] FIG. 9 is a diagram illustrating an example of a configuration of a thermal design assistance apparatus according to the second embodiment of the present disclosure. [Figure 10] FIG. 10 is a diagram showing an example of a second reception display related to the unsteady analysis according to the second embodiment of the present disclosure. [Figure 11] FIG. 11 is a flowchart illustrating an example of processing performed by the thermal design assistance apparatus according to the second embodiment of the present disclosure. [Figure 12] FIG. 12 is a diagram illustrating a configuration example of a thermal design assistance apparatus according to the third embodiment of the present disclosure. [Figure 13] FIG. 13 is a diagram illustrating an example configuration of a food case temperature calculation unit in a thermal design assistance device according to the third embodiment of the present disclosure. [Figure 14] FIG. 14 is a flowchart illustrating an example of processing performed by the thermal design assistance apparatus according to the third embodiment of the present disclosure. [Figure 15]FIG. 15 is a flowchart illustrating a detailed example of a food case temperature calculation process in the thermal design support device according to the third embodiment of the present disclosure. [Figure 16] FIG. 16 is a diagram showing an example of the calculation result of the Earth's albedo by the thermal design support system of the present disclosure. [Figure 17] FIG. 17 is a diagram showing an example of the calculation result of the terrestrial infrared radiation by the thermal design support system of the present disclosure. [Figure 18] FIG. 18 is a diagram illustrating a first example of a hardware configuration for realizing the functions according to the configuration of the present disclosure. [Figure 19] FIG. 19 is a diagram illustrating a second example of a hardware configuration for realizing the functions according to the configuration of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Theory according to the embodiment of the present disclosure] First, the theory according to the embodiment of the present disclosure will be described. Main symbols used in the explanation β: Beta angle [rad] Re:Earth radius [km] γ: Flat plate angle [rad] h:Satellite altitude [km] C max : Lunar surface infrared radiation (maximum) [W / m 2 ] C min :Lunar surface infrared radiation (minimum) [W / m 2 ] αR: Albedo coefficient [-] θ S :Angle between the Earth's surface and the sun [rad] S: Solar constant [W / m 2 ] σ: Stefan-Boltzmann constant = 5.67 × 10 -8 [W / (m 2 ·K 4 )] A: Area [m 2 ] α: Solar absorption rate [-] ε:Emissivity[-] FR: View factor [-] QH: Heat generation of the satellite [W] Q Heater : Heater capacity [W]

[0010] 1. View Factor In order to calculate the thermal environment that an artificial satellite (hereinafter simply referred to as "satellite") experiences in orbit, it is necessary to calculate the view factor between the satellite and the Earth's surface. FIG. 1 is a diagram for explaining the configuration factors of a flat plate on an orbit and the ground surface used in the theory according to an embodiment of the present disclosure. Here, as shown in FIG. 1, the satellite is considered as a six-sided flat plate (flat plate model) 1000, and the view factor is calculated for each of them. The view factor FR for the flat plate 1000 is given by equation (4) from equations (1), (2), and (3). (References 1-4) Reference 1: BALLINGER, JOHN C., and EMMET H. CHRISTENSEN. ENVIRONMENTAL CONTROL STUDY OF SPACE VEHICLES. PART II. THERMAL ENVIRONMENT OF SPACE. SUPPLEMENT B. TABULAR PRESENTATION OF PLANETARY THERMAL AND PLANETARY ALBEDO RADIATION INCIDENT TO SPACE VEHICLES. GENERAL DYNAMICS CORP POMONA CA POMONA DIV, 1961. Reference 2: FG Cunningham, POWER INPUT TO A SMALL FLAT PLATE FROM A DIFFUSELY RADIATING SPHERE, WITH APPLICATION TO EARTH SATELLITES, NASA TN D-710. Reference 3: Kobayashi, Y. "Optimal Launch Planning of Artificial Satellites from the Viewpoint of Thermal Design." Report of the Institute of Space and Aeronautical Science, University of Tokyo 6.3_A (1970): 509-548. Reference 4: Yoshida Ryuichi. (1986). Research on thermal analysis methods for spacecraft. Kawasaki Heavy Industries Technical Report, (92), pp. 26-32. TIFF2025136190000002.tif39166

[0011] [Integration range] Here, the integration range of Φ can be determined as follows: FIG. 2 is a diagram for explaining the integral range of Φ used in the theory according to the embodiment of the present disclosure. In Figure 2, when the angle γ is defined as the angle between the vertical direction (the direction the surface is facing) to the surface of flat plate 1000 and a line extending from the center of the celestial body to the center of the surface of the flat plate, Figure 2(a) shows the range π / 2-γ≧θ, Figure 2(b) shows the range 0≦π / 2≦θ, and Figure 2(c) shows the range 0≦γ-π / 2<θ. FIG. 3 is a diagram for explaining the concept of integral ranges used in the theory according to the embodiment of the present disclosure.

[0012] Here, the integration range in the case of FIG. 2(a) is −π≦Φ≦π. The integral ranges in the cases of FIG. 2(b) and FIG. 2(c) are given by equations (5) and (6), respectively, based on the concept of the integral range shown in FIG. TIFF2025136190000003.tif29166 FIG. 4 is a diagram for explaining the calculation of "ω" used in the theory according to the embodiment of the present disclosure. Here, since "ω" in the above equation cannot be found analytically, it is calculated by considering it as shown in FIG. 4 and solving equation (7) by Newton's method. TIFF2025136190000004.tif18166

[0013] 2. External heat input The albedo of the celestial surface and the heat input q to a satellite due to surface infrared radiation. R is the angle θ between the earth's surface and sunlight S(Reference 5) That is, it is given by the following equation (Equation (8)): where "Q" is the θ of the albedo and the Earth's infrared radiation. s The heat flux Q of the albedo depends on albedo is given by equation (9). When the object is the moon, the infrared radiation heat flux Q IR is the angle θ between the earth's surface and sunlight s and is given by equation (10). Reference 5: Baker, Charles, et al. "Lunar Reconnaissance Orbiter (LRO) Thermal On-Orbit Performance." 40th International Conference on Environmental Systems. 2011. TIFF2025136190000005.tif33166

[0014] Here, the integral can be calculated by, for example, the Simpson method. Also, solar heat input Q S is the solar unit vector “S n The equation (11) was calculated from the inner product of “→” and the unit normal vector “n→” of each surface. Here, the solar unit vector “S n →” is S n The original intention was to put a → above the n Furthermore, the unit normal vector "n→" is originally intended to be expressed as n with a → above it, but in the text it is expressed as "n→".

[0015] FIG. 5 is a diagram for explaining the angle at which an artificial satellite used in the theory according to the embodiment of the present disclosure is hidden in the shadow of a planet. The angle at which the satellite is hidden in the shadow of the planet is θ d was calculated from Figure 5 using equation (12). TIFF2025136190000006.tif25166

[0016] 3. Heat balance calculation The thermal balance equation of the satellite can be expressed as simultaneous differential equations, Equation (13) for one node and Equation (14) and Equation (15) for two nodes. That is, the amount of heat generated by the satellite QH, the heater capacity Q Heater、 Solar input q S , albedo input quantity q albedo , the infrared radiation input q from a celestial body such as the Earth or the Moon IR , and the radiation from the satellite. This differential equation can be implemented, for example, using a fourth-order Runge-Kutta method. TIFF2025136190000007.tif77166 Based on the above theory, the following describes an embodiment that mainly realizes the functions (1) or (2). (1) Ability to analyze the amount of heat input received by an orbiting satellite (2) The ability to analyze temperature changes in orbit by changing the orbital conditions and the optical characteristics of the satellite.

[0017] In order to explain the present disclosure in more detail, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0018] Embodiment 1 In the first embodiment, a basic form of the present disclosure will be described.

[0019] An example of the configuration of a thermal design support device according to a first embodiment of the present disclosure will be described. FIG. 6 is a diagram illustrating an example of the configuration of a thermal design assistance apparatus according to the first embodiment of the present disclosure. The thermal design support device 100A performs a thermal environment calculation for the satellite using the orbital conditions of the satellite, and outputs the thermal environment calculation result. In the thermal environment calculation, the amount of sunlight input, albedo, and infrared radiation are calculated. The thermal design support device 100A of the present disclosure can also be expressed as a "thermal environment calculation device." The thermal design support device 100A shown in FIG. 6 includes an orbit condition receiving unit 101A, an orbit condition defining unit 102A, a sunlight input amount calculating unit 103A, an albedo amount calculating unit 104A, an infrared radiation amount calculating unit 105A, and a thermal environment calculation result output unit 106A.

[0020] The orbital condition receiving unit 101A receives the orbital conditions of the satellite. Specifically, the orbital condition receiving unit 101A receives, via a receiving image, orbital conditions including information indicating the positional relationship between the satellite and the celestial body around which the satellite orbits. FIG. 7 is a diagram illustrating an example of a reception display related to thermal environment calculation in the thermal design assistance apparatus according to the first embodiment of the present disclosure. The trajectory condition receiving unit 101A presents, for example, a reception image (thermal environment calculation reception image) 3100A as shown in FIG. 7 via an input / output device (not shown), and receives the trajectory conditions input via the input / output device (not shown). The reception image (thermal environment calculation reception image) 3100A shown in Figure 7 is composed of a condition name display field (trajectory condition) 3110, a value display field 3120, a remarks display field 3130, and an execution command button (thermal environment calculation execution command button) 3140. The condition name display field (orbital condition) 3110 displays the number of divisions, radius [km], GM [km 3 / s 2 ], Altitude [km], IRmax[W / m 2 ], IRmin [W / m 2 ], albedo coefficient, solar constant [W / m 2 ], beta angle [deg], etc. are displayed. The value display field 3120 is an area for inputting a value corresponding to the item name of the condition. The remarks display column 3130 is an area where information such as an explanation of the item or notes on input is displayed for each item. "Division number" is a value that indicates the number of divisions of the orbit. For example, when calculating the thermal environment, the orbit is usually preset to be divided into 8000 parts, but since calculating all orbital conditions takes a long time, this value is set to calculate only the parts divided by the entered value, and linear interpolation is performed between them. For example, if "40" is entered as the division number, the heat input is calculated for every 1 / 40th of the orbit, and linear interpolation is performed for the 200 points in between. "Radius [km]" is a value that indicates the radius of a celestial body (e.g., a planet, the moon, etc.). "GM [km 3 / s 2 ]" indicates the value obtained by multiplying the gravitational constant by the mass of the celestial body (planet). "Altitude [km]" is the altitude of the satellite, indicating the height of the celestial body above the Earth's surface. "IRmax [W / m 2 ]" is a value that indicates the maximum infrared radiation of a celestial body. "IRmin [W / m 2 ]" is a value that indicates the minimum infrared radiation value of the celestial body. For example, if "0" is entered, it is configured to be set as a constant infrared radiation regardless of the position in the orbit. The "albedo coefficient" is a reflection coefficient that indicates the degree to which incident light on a celestial body is reflected by the body. For example, it is a value such that "1" indicates that all incident light is reflected, and "0" indicates that no light is reflected. "Solar constant [W / m 2 ] is the amount of solar energy per unit area per unit time that is incident perpendicularly to the direction of incidence at the top of the Earth's atmosphere when the distance between the Sun and the Earth is 1 AU. According to measurements by artificial satellites, this amount is approximately 1.4 kW / m 2 is. "Beta angle [deg]" indicates the angle between the orbital plane and the direction of the sun. It is preferable that the condition items include all of the above, but for values ​​that can be set in advance, stored values ​​may be used. The execution command button (thermal environment calculation execution command button) 3140 is a box-shaped button that displays, for example, "Calculate thermal environment," and is configured so that when the button is operated, the thermal design support device 100A executes the thermal environment calculation.

[0021] The orbital condition definition unit 102A acquires orbital conditions, which are conditions related to the orbit of the satellite, and is received by the orbital condition receiving unit 101A.

[0022] The sunlight input amount calculation unit 103A calculates the amount of sunlight input that the satellite will receive on its orbit using the orbital conditions. The sunlight input amount calculation unit 103A calculates the amount of sunlight input that the satellite will receive directly from the sun based on the orbital conditions, for example, using known technology.

[0023] The albedo calculation unit 104A performs numerical integration within the integration range calculated using the orbital conditions to obtain the amount of albedo that the satellite will experience on its orbit. Specifically, the albedo amount calculation unit 104A determines the integration range based on the concept of the integration range already explained in the above [Integration Range], and performs numerical integration using equations (8) and (9).

[0024] The infrared radiation amount calculation unit 105A obtains the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration within the integration range calculated using the orbital conditions. Specifically, the infrared radiation amount calculation unit 105A determines the integration range based on the concept of the integration range already explained in the above [Integration Range], and performs numerical integration using equations (8) and (10).

[0025] Here, it is sufficient that at least one of the albedo amount calculation unit 104A and the infrared radiation amount calculation unit 105A is configured to calculate the integration range using the orbital conditions. When the albedo amount calculation unit 104A calculates the integration range, the albedo amount calculation unit 104A calculates the integration range using the orbital conditions and performs numerical integration to obtain the amount of albedo that the satellite will be subjected to on orbit. When the infrared radiation amount calculation unit 105A calculates the integration range, the infrared radiation amount calculation unit 105A calculates the integration range using the orbital conditions and performs numerical integration to obtain the amount of infrared radiation that the satellite will receive on orbit. Furthermore, even if only the albedo amount or the infrared radiation amount is calculated by numerical integration, since it becomes easier to calculate the thermal environment for either one, the albedo amount calculation unit 104A may be configured to calculate the integration range using the orbital conditions and perform numerical integration to obtain the albedo amount that the satellite will be exposed to in its orbit, or the infrared radiation amount calculation unit 105A may be configured to calculate the integration range using the orbital conditions and perform numerical integration to obtain the infrared radiation amount that the satellite will be exposed to in its orbit.

[0026] The thermal environment calculation result output unit 106A acquires the amount of sunlight input, the amount of albedo, and the amount of infrared radiation, and outputs the thermal environment calculation result, which is a thermal input amount that represents the heat that will be input to the satellite. The thermal environment calculation result output unit 106A acquires the sunlight input amount from the sunlight input amount calculation unit 103A, the albedo amount from the albedo amount calculation unit 104A, and the infrared radiation amount from the infrared radiation amount calculation unit 105A, and outputs each in the form of heat flux. The thermal environment calculation result output unit 106A multiplies the sunlight input amount by a coefficient of the optical properties of sunlight and outputs the result in the form of heat flux. The thermal environment calculation result output unit 106A also multiplies the albedo amount by a coefficient of the optical properties of the albedo and outputs the result in the form of heat flux. The thermal environment calculation result output unit 106A also multiplies the infrared radiation amount by a coefficient of the optical properties of infrared radiation and outputs the result in the form of heat flux.

[0027] In addition to the above components, the thermal design support device 100 (100A) also includes a control unit (not shown), a storage unit (not shown), and a communication unit (not shown). A control unit (not shown) controls the entire thermal design support device 100 (100A) and each of its components. The control unit (not shown) starts up the thermal design support device 100 (100A) in accordance with, for example, an external command. The control unit (not shown) also controls the state (operating state = start-up, shutdown, sleep, etc.) of the thermal design support device 100 (100A). A storage unit (not shown) stores each piece of data used in the thermal design support device 100 (100A). The storage unit (not shown) stores, for example, the output (output data) from each component in the thermal design support device 100 (100A), and outputs data requested by each component to the requesting component. The communication unit (not shown) communicates with an external device. For example, communication is performed between the thermal design support device 100 (100A) and a peripheral device. For example, when the thermal design support device 100 (100A) and the peripheral device are not connected by wire, the communication unit (not shown) has a function of communicating between the thermal design support device 100 (100A) and a device mounted on a mobile body. The communication unit (not shown) also has a function of communicating with a server device, which is an external device. The control unit (not shown), the storage unit (not shown), and the communication unit (not shown) are the same in the embodiments described below.

[0028] An example of processing by the thermal design support device (thermal environment calculation device) according to the first embodiment will be described.

[0029] FIG. 8 is a flowchart illustrating an example of processing performed by the thermal design assistance apparatus according to the first embodiment of the present disclosure. 8 is a thermal design support method performed by a thermal design support device, or a thermal environment calculation method performed by a thermal environment calculation device. The thermal design support device 100A shown in FIG. 7 starts the process shown in FIG. 8 upon receiving, for example, an external command.

[0030] The thermal design support device 100A then executes a trajectory condition acceptance determination process (step ST1110). In the orbital condition acceptance determination process, the orbital condition acceptance unit 101A of the thermal design support device 100A accepts orbital conditions, including, for example, information indicating the positional relationship between the satellite and the celestial body around which the satellite orbits, via a acceptance image. When the execution command button (thermal environment calculation execution command button) 3140 on the acceptance image (thermal environment calculation acceptance image) 3100A is operated to accept an execution command, the orbital condition acceptance unit 101A accepts the input values ​​for each condition item as orbital conditions. The orbital condition acceptance unit 101A outputs the accepted orbital conditions to the orbital condition definition unit 102A.

[0031] Next, the thermal design support device 100A executes a trajectory condition definition process (step ST1120). In the orbit condition definition process, the orbit condition definition unit 102A of the thermal design support device 100A acquires orbit conditions, which are conditions related to the satellite orbit. The orbit condition definition unit 102A acquires values ​​for each condition item of the orbit condition accepted by the orbit condition acceptance unit 101A. The orbit condition definition unit 102A defines the orbit condition using the acquired values ​​for each condition item.

[0032] Next, the thermal design support device 100A executes a sunlight input amount calculation process (step ST1130). In the sunlight input amount calculation process, the sunlight input amount calculation unit 103A of the thermal design support device 100A acquires the orbital conditions and calculates the amount of sunlight input that the satellite will receive on its orbit using the orbital conditions. The sunlight input amount calculation unit 103A calculates the amount of sunlight input that the satellite will receive directly from the sun based on the orbital conditions, for example, using known technology. The sunlight input amount calculation unit 103A outputs the calculated sunlight input amount to the thermal environment calculation result output unit 106A.

[0033] Next, the thermal design support device 100A executes an albedo amount calculation process (step ST1140). In the albedo calculation process, the albedo calculation unit 104A of the thermal design support device 100A acquires the orbital conditions and performs numerical integration within the integration range calculated using the orbital conditions to acquire the albedo that the satellite will experience in its orbit. Specifically, the albedo calculation unit 104A determines the integration range using the concept of the integration range already explained in the above [Integration Range] and performs numerical integration using Equations (8) and (9). The albedo calculation unit 104A outputs the acquired albedo to the thermal environment calculation result output unit 106A.

[0034] Next, the thermal design support device 100A executes an infrared radiation amount calculation process (step ST1150). In the infrared radiation amount calculation process, the infrared radiation amount calculation unit 105A of the thermal design support device 100A acquires the orbital conditions and performs numerical integration within the integration range calculated using the orbital conditions to acquire the amount of infrared radiation that the satellite will receive in its orbit. Specifically, the infrared radiation amount calculation unit 105A determines the integration range using the concept of the integration range already explained in the above [Integration Range] and performs numerical integration using Equations (8) and (10). The infrared radiation amount calculation unit 105A outputs the acquired infrared radiation amount to the thermal environment calculation result output unit 106A.

[0035] Next, the thermal design support device 100A executes a thermal environment calculation result output process (step ST1160). In the thermal environment calculation result output process, the thermal environment calculation result output unit 106A of the thermal design support device 100A acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs the thermal environment calculation result. Specifically, the thermal environment calculation result output unit 106A acquires the sunlight input amount from the sunlight input amount calculation unit 103A, the albedo amount from the albedo amount calculation unit 104A, and the infrared radiation amount from the infrared radiation amount calculation unit 105A, and multiplies them by the optical characteristic coefficients corresponding to each thermal environment amount to output the result in the form of heat flux. The thermal environment calculation result output unit 106A outputs the heat input amount based on the thermal environment amount.

[0036] After executing the thermal environment calculation result output process, the thermal design support device 100A then ends the process shown in FIG.

[0037] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is configured, for example, as follows. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires an albedo amount that the satellite will experience on its orbit by performing numerical integration within an integration range calculated using the orbital conditions; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration within an integration range calculated using the orbit conditions; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; Equipped with Thermal design support equipment. As a result, the present disclosure has the effect of providing a thermal design support device that makes it possible to easily set the thermal environment, for example, in thermal design technology for artificial satellites, even in the case of celestial bodies whose infrared radiation amount or albedo varies greatly. Furthermore, by equipping a thermal environment calculation device with the above-mentioned configurations, it is possible to provide a thermal environment calculation device that can easily perform thermal environment calculations even for celestial bodies whose infrared radiation or albedo fluctuates greatly.

[0038] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is configured, for example, as follows. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that calculates an integration range using the orbital conditions and performs numerical integration to obtain an albedo amount that the satellite will receive on its orbit; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive in its orbit; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; Equipped with Thermal design support equipment. As a result, the present disclosure has the effect of providing a thermal design support device that makes it possible to easily set the thermal environment, even in the case of celestial bodies whose albedo varies greatly, for example in thermal design technology for artificial satellites and the like. Furthermore, by providing the thermal environment calculation device with the above-described configurations, it is possible to provide a thermal environment calculation device that can easily perform thermal environment calculations even for celestial bodies whose albedo varies greatly.

[0039] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is configured, for example, as follows. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires the amount of albedo that the satellite will receive in its orbit; an infrared radiation amount calculation unit that calculates an integration range using the orbital conditions and performs numerical integration to obtain the amount of infrared radiation that the satellite will receive on its orbit; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; Equipped with Thermal design support equipment. As a result, the present disclosure has the effect of providing a thermal design support device that makes it possible to easily set the thermal environment, for example, in thermal design technology for artificial satellites, even in the case of celestial bodies whose infrared radiation amount fluctuates greatly. Furthermore, by providing the above-described configurations as a thermal environment calculation device, it is possible to provide a thermal environment calculation device that can easily perform thermal environment calculations even in the case of celestial bodies whose infrared radiation amount fluctuates greatly.

[0040] The present disclosure provides the following configuration. The thermal design support method of the present disclosure is configured, for example, as follows. A thermal design support method using a thermal design support device, an orbital condition definition step in which an orbital condition definition unit of the thermal design support device acquires orbital conditions that are conditions related to the orbit of a satellite that is a design target; a sunlight input amount calculation step in which a sunlight input amount calculation unit of the thermal design support device calculates a sunlight input amount that will be received in the orbit of the satellite using the orbital conditions; an albedo calculation step in which an albedo calculation unit of the thermal design support system acquires an albedo amount that the satellite will receive in its orbit by performing numerical integration using the orbital conditions; an infrared radiation amount calculation step in which an infrared radiation amount calculation unit of the thermal design support device acquires an amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; a thermal environment calculation result output step in which a thermal environment calculation result output unit of the thermal design support device acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A thermal design support method comprising: As a result, the present disclosure has the effect of providing a thermal design support method that makes it possible to easily set the thermal environment, for example, in thermal design technology for artificial satellites, even in the case of celestial bodies whose infrared radiation amount or albedo varies greatly. Furthermore, by incorporating the above-described configurations as a thermal environment calculation method, it is possible to provide a thermal environment calculation method that can easily perform thermal environment calculations even in the case of celestial bodies whose infrared radiation or albedo fluctuates greatly.

[0041] The present disclosure provides the following configuration. The program of the present disclosure is configured, for example, as follows. Computer, an orbit condition definition unit that acquires orbit conditions that are conditions related to the orbit of a satellite that is a thermal design target; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires the amount of albedo that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A program that operates as a thermal environment calculation device equipped with the above. As a result, the present disclosure has the effect of providing a program that can easily set the thermal environment, for example, in thermal design technology for artificial satellites, even in the case of celestial bodies whose infrared radiation or albedo fluctuates greatly.

[0042] Embodiment 2 In the second embodiment, in addition to the first embodiment, a non-steady state analysis is performed using the thermal environment calculation results. In the second embodiment, among the components according to the second embodiment, those components that are the same as the components according to the first embodiment that have already been described will not be described again.

[0043] A configuration example of a thermal design support device according to a second embodiment of the present disclosure will be described. FIG. 9 is a diagram illustrating an example of a configuration of a thermal design assistance apparatus according to the second embodiment of the present disclosure. The thermal design support device 100B performs unsteady analysis using the thermal environment calculation results and outputs the unsteady analysis results. The thermal design support device 100B shown in FIG. 9 includes a trajectory condition receiving unit 101B, a trajectory condition definition unit 102B, a solar light input amount calculation unit 103B, an albedo amount calculation unit 104B, an infrared radiation amount calculation unit 105B, a thermal environment calculation result output unit 106B, and an unsteady state analysis unit 110B. The orbit condition receiving unit 101B, orbit condition defining unit 102B, sunlight input amount calculation unit 103B, albedo amount calculation unit 104B, infrared radiation amount calculation unit 105B, and thermal environment calculation result output unit 106B have the same functions as the orbit condition receiving unit 101A, orbit condition defining unit 102A, sunlight input amount calculation unit 103A, albedo amount calculation unit 104A, infrared radiation amount calculation unit 105A, and thermal environment calculation result output unit 106A, which have already been described. Below, we will mainly explain the contents that are different from the contents already described.

[0044] The unsteady state analysis unit 110B performs unsteady state analysis using the thermal environment calculation results, and outputs the unsteady state analysis results. The unsteady state analysis unit 110B shown in FIG. 9 includes an analysis condition receiving unit 111B, an analysis condition defining unit 112B, a thermal environment calculation result acquiring unit 113B, an unsteady state analysis processing unit 114B, and an on-orbit temperature output unit 115B.

[0045] The analysis condition receiving unit 111B has a function of determining whether analysis conditions have been received. The analysis condition receiving unit 111B also has a function of determining whether an execution command for unsteady analysis has been received. FIG. 10 is a diagram showing an example of a second reception display related to the unsteady analysis according to the second embodiment of the present disclosure. The analysis condition receiving unit 111B presents, for example, an image for receiving data as shown in FIG. 10 via an input / output device (not shown), and receives analysis conditions input via the input / output device (not shown). The reception image (non-steady state analysis reception image) 3200B shown in Figure 10 is composed of a condition name display field (analysis conditions) 3210, a value display field 3220, a remarks display field 3230, an execution command button (one-node analysis execution command button) 3240, and an execution command button (two-node analysis execution command button) 3250. The condition name display field (analysis conditions) 3210 is an area where the names of condition items such as the number of steady-state calculation cycles, maximum number of calculation cycles, orbital period [s], calculation result output period [cycle], external structure inner emissivity, internal structure outer emissivity, eclipse calculation, eclipse duration [s], eclipse data worksheet, heater control, BAT mass [kg], BAT remaining capacity [%], BAT capacity per mass [Wh / kg], BAT capacity [Wh], heater output [W], heater ON temperature [K], heater OFF temperature [K], and CSV output are displayed. The number of steady-state calculation cycles indicates the number of revolutions required to determine the steady state. The thermal design support system is configured so that data prior to this revolution is not calculated as maximum or minimum values. The maximum number of calculation cycles indicates the maximum number of calculation cycles. The orbital period [s] is configured to be calculated automatically and does not need to be input from an external source. The calculation result output cycle [cycle] is a value for outputting the calculation result every specified cycle (one cycle is 8000 cycles). The calculation result output cycle [cycle] does not necessarily have to be entered. The eclipse calculation is configured to perform an eclipse calculation based on the minimum temperature value after analysis when set to TRUE, for example. This will be used in the embodiment described later. Heater control is a value that, when set to TRUE, maintains the temperature with a heater during eclipse calculation. BAT mass [kg] is a value indicating the mass of the heater. The BAT capacity [Wh] is configured to be input by automatic calculation. The heater output [W] is configured to be input by automatic calculation. The csv output is a value indicating whether or not the analysis results are to be output in csv data format. Furthermore, the condition name display field (analysis conditions) 3210 in the reception image (unsteady analysis reception image) 3200B shown in FIG. 13 includes items for each condition, such as external structure, internal structure, thermal characteristics, and optical characteristics. The external structure conditions are conditions related to the thermal design of the external structure of the satellite, such as heat capacity [J / K], heat generation amount [W], and initial temperature [K]. The internal structure conditions are, for example, conditions related to the thermal design of the internal structure of the satellite, such as heat capacity [J / K], heat generation amount [W], and initial temperature [K]. The thermal property condition is, for example, thermal conductance [W / K], which is a condition indicating the thermal conductance of the external structure and the internal structure. The optical property conditions are configured so that multiple conditions can be set for each element (PX, MX, PY, MY, PZ, MZ, and solar cell) of the satellite (satellite model). The conditions are, for example, the area [m 2 ], solar cell percentage, solar absorptivity, and emissivity can be set. In the present disclosure, not all items are necessarily required, and items are set in advance according to the needs of the analysis. Also, among the condition items included in the reception image (unsteady analysis reception image) 3200B shown in FIG. 10, some items are unnecessary in this embodiment, so not all items are required. Specifically, the items below the eclipse calculation column shown in FIG. 10 are values ​​used in the third embodiment. The value display field 3220 is an area for inputting a value corresponding to the item name of the condition. The remarks display column 3230 is an area where information such as an explanation of the item or notes on input is displayed for each item. The execution command button (single node analysis execution command button) 3240 is displayed as a box-shaped button that says, for example, "Output single node analysis results." When the button is operated, the thermal design support device 100B executes a single node analysis (unsteady analysis) and outputs the analysis results. The execution command button (two-node analysis execution command button) 3250 is displayed as a box-shaped button that reads, for example, "Output two-node analysis results." When the button is operated, the thermal design support device 100B executes a two-node analysis (unsteady analysis) and outputs the analysis results.

[0046] The analysis condition definition unit 112B acquires analysis conditions for the unsteady analysis, which is an analysis of the temperature that the satellite will be subjected to in orbit. The analysis condition definition unit 112B acquires the analysis conditions accepted by the analysis condition acceptance unit 111B.

[0047] The thermal environment calculation result acquisition unit 113B acquires the thermal environment calculation result output by the thermal environment calculation result output unit 106A.

[0048] The unsteady state analysis processing unit 114B uses the analysis conditions and the thermal environment calculation results to analyze the temperature that the satellite will be subjected to in orbit. The unsteady analysis processing unit 114B outputs data capable of expressing temperature changes according to movement on the orbit as the unsteady analysis result.

[0049] The on-orbit temperature output unit 115B outputs, for example, the temperature on the satellite's orbit. The on-orbit temperature output unit 115B selects and outputs the minimum temperature on the satellite orbit using the unsteady analysis result output by the unsteady analysis processing unit 114B. Alternatively, the on-orbit temperature output unit 115B may select and output the maximum temperature on the satellite orbit.

[0050] A processing example of the thermal design assistance device 100B according to the second embodiment of the present disclosure will be described. First, the thermal design support device 100B executes the processes from step ST1110 to step ST1160 in the same manner as the processes (processes shown in FIG. 8) of the thermal design support device 100A already described. FIG. 11 is a flowchart illustrating an example of processing by the thermal design assistance device 100B according to the second embodiment of the present disclosure. The process shown in FIG. 11 is a thermal design support method performed by the thermal design support device 100B. For example, when the thermal design support device 100B shown in Fig. 9 receives a command to transition to processing related to unsteady analysis after executing the thermal environment calculation result output processing in step ST1160, the thermal design support device 100B transitions to processing related to unsteady analysis. Specifically, the thermal design support device 100B starts the processing shown in Fig. 11 when, for example, an execution button in a reception image presented by the trajectory condition reception unit 101 is operated.

[0051] Next, the thermal design support device 100B executes an analysis condition acceptance determination process (step ST2110). In the analysis condition acceptance determination process, the analysis condition acceptance unit 111B of the thermal design support device 100B determines whether the analysis conditions have been accepted and whether a command to execute a transient analysis has been accepted. The analysis condition acceptance unit 111B accepts the analysis conditions via an acceptance image. For example, when the execution command button (transition to thermal environment calculation result button) 3150 on the acceptance image (image for accepting thermal environment calculation) 3100B is operated and an execution command to transition to the thermal environment calculation result is accepted, the analysis condition acceptance unit 111B accepts the input values ​​for each condition item as analysis conditions. The analysis condition acceptance unit 111B outputs the accepted analysis conditions to the analysis condition definition unit 112B. The analysis condition acceptance unit 111B also notifies the thermal environment calculation result acquisition unit 113B of the start of execution of the transient analysis.

[0052] Next, the thermal design support device 100B executes an analysis condition definition process (step ST2120). In the analysis condition definition process, the analysis condition definition unit 112B of the thermal design support device 100B acquires analysis conditions for a transient analysis, which is an analysis of the temperatures to which the satellite will be subjected while in orbit. The analysis condition definition unit 112B acquires values ​​for each condition item of the analysis conditions accepted by the analysis condition acceptance unit 111B. The analysis condition definition unit 112B defines the analysis conditions using the acquired values ​​for each condition item. The analysis condition definition unit 112B outputs the analysis conditions to the transient analysis processing unit 114B.

[0053] Next, the thermal design support device 100B executes a thermal environment calculation result acquisition process (step ST2130). In the thermal environment calculation result acquisition process, the thermal environment calculation result acquisition unit 113B of the thermal design support device 100B acquires the thermal environment calculation result output by the thermal environment calculation result output unit 106A. The thermal environment calculation result acquisition unit 113B outputs the acquired thermal environment calculation result to the unsteady state analysis processing unit 114B.

[0054] Next, the thermal design support device 100B executes an unsteady analysis process (step ST2140). In the transient analysis process, the transient analysis processor 114B of the thermal design support system 100B acquires analysis conditions from the analysis condition definition unit 112B and acquires thermal environment calculation results from the thermal environment calculation result acquisition unit 113B. The transient analysis processor 114B uses the analysis conditions and the thermal environment calculation results to analyze the temperature that the satellite will be subjected to in orbit. The transient analysis processor 114B outputs data that can represent temperature changes corresponding to movement in orbit as the transient analysis result.

[0055] Next, the thermal design support device 100B executes an on-orbit temperature output process (step ST2150). In the on-orbit temperature output process, the on-orbit temperature output unit 115B of the thermal design support device 100B outputs the temperature on the satellite's orbit. The on-orbit temperature output unit 115B selects and outputs the minimum temperature on the satellite orbit using the unsteady analysis result output by the unsteady analysis processing unit 114B. Alternatively, the on-orbit temperature output unit 115B may select and output the maximum temperature on the satellite orbit. The on-orbit temperature output unit 115B outputs the temperature on the satellite's orbit so that it is displayed on a display unit (not shown), for example.

[0056] After executing the on-orbit temperature output process in step ST2150, the thermal design support device 100B ends the process shown in FIG.

[0057] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is further configured as follows, for example. an analysis condition definition unit for acquiring analysis conditions for a transient analysis that is an analysis of the temperature that the satellite will be subjected to in orbit; a thermal environment calculation result acquisition unit that acquires the thermal environment calculation result; an unsteady state analysis processing unit that analyzes the temperature that the satellite will be subjected to in orbit using the analysis conditions and the thermal environment calculation results; an on-orbit temperature output unit that outputs the temperature on the satellite's orbit; A thermal design support device further equipped with the above. As a result, the present disclosure further has the effect of providing a thermal design support device that makes it possible to easily perform everything from setting the thermal environment to unsteady analysis. Furthermore, the present disclosure achieves the same effects as those described above by applying the above configuration to a thermal design support system, the above thermal design support method, or the above program.

[0058] Embodiment 3 In the third embodiment, in addition to the configuration of the second embodiment, a form for carrying out unsteady analysis of a food container will be described. In embodiment 3, among the components of embodiment 3, those components that are similar to the components of embodiment 1 or embodiment 2 already described will be omitted from redundant description as appropriate.

[0059] A configuration example of a thermal design support device according to a third embodiment of the present disclosure will be described. FIG. 12 is a diagram illustrating a configuration example of a thermal design assistance apparatus according to the third embodiment of the present disclosure. The thermal design support device 100C performs a non-steady state analysis using the thermal environment calculation results, and further performs a non-steady state analysis of the food case, and outputs the non-steady state analysis results of the food case. The thermal design support device 100C shown in FIG. 12 includes a trajectory condition receiving unit 101C, a trajectory condition definition unit 102C, a solar light input amount calculation unit 103C, an albedo amount calculation unit 104C, an infrared radiation amount calculation unit 105C, a thermal environment calculation result output unit 106C, and an unsteady state analysis unit 110C. The orbit condition receiving unit 101C, orbit condition defining unit 102C, sunlight input amount calculating unit 103C, albedo amount calculating unit 104C, infrared radiation amount calculating unit 105C, and thermal environment calculation result output unit 106C have the same functions as the orbit condition receiving unit 101B, orbit condition defining unit 102B, sunlight input amount calculating unit 103B, albedo amount calculating unit 104B, infrared radiation amount calculating unit 105B, and thermal environment calculation result output unit 106B, which have already been described. Below, we will mainly explain the contents that are different from the contents already described.

[0060] In addition to the functions of the unsteady state analysis unit 110B already described, the unsteady state analysis unit 110C has a function of calculating the temperature on the satellite orbit during an eclipse. The unsteady state analysis unit 110C shown in FIG. 12 is configured to include an unsteady state analysis unit 110C, an analysis condition receiving unit 111C, an analysis condition definition unit 112C, a thermal environment calculation result acquisition unit 113C, an unsteady state analysis processing unit 114C, an on-orbit temperature output unit 115C, and a food case temperature calculation unit 116C. The unsteady state analysis unit 110C is configured in the same manner as the unsteady state analysis unit 110B already described, and a detailed description thereof will be omitted. Analysis condition receiving section 111C is configured in the same manner as analysis condition receiving section 111B already described, and detailed description thereof will be omitted. The analytical condition definition section 112C has the same configuration as the analytical condition definition section 112B already explained, and a detailed explanation thereof will be omitted. The thermal environment calculation result acquisition unit 113C is configured in the same manner as the thermal environment calculation result acquisition unit 113B already described, and detailed description thereof will be omitted. The unsteady state analysis processing unit 114C has the same configuration as the unsteady state analysis processing unit 114B already described, and a detailed description thereof will be omitted. The on-orbit temperature output unit 115C has the same configuration as the on-orbit temperature output unit 115B already described, and a detailed description thereof will be omitted.

[0061] The eclipse case temperature calculation unit 116C calculates the temperature on the satellite orbit during the eclipse state. Specifically, based on the information calculated in the configuration up to the on-orbit temperature output unit 115C, the eclipse case temperature calculation unit 116C calculates the temperature in the orbit of the satellite in an eclipse state in which the sun, the celestial body, and the natural satellite are arranged in that order, assuming that the satellite is a satellite orbiting a natural satellite of a celestial body, and the natural satellite is hidden in the shadow of the celestial body relative to the sun. FIG. 13 is a diagram illustrating an example configuration of a food case temperature calculation unit in a thermal design assistance device according to the third embodiment of the present disclosure. The food case temperature calculation unit 116C shown in Figure 13 is composed of an on-orbit minimum temperature acquisition unit 117, a food case thermal environment calculation result acquisition unit 118, a food case unsteady analysis processing unit 119, and a food case minimum temperature output unit 120.

[0062] The on-orbit minimum temperature acquisition unit 117 acquires the minimum temperature on the satellite's orbit using the thermal environment calculation results. The on-orbit minimum temperature acquisition unit 117 acquires, as the minimum temperature, the temperature that is the minimum value among the temperature values ​​according to the change in the on-orbit position and the change over time indicated in the thermal environment calculation result.

[0063] Food case thermal environment calculation result acquisition unit 118 uses the thermal environment calculation result to acquire a food case thermal environment calculation result, which is a thermal environment calculation result on the satellite's orbit in the eclipse state. Food case thermal environment calculation result acquisition unit 118 calculates the thermal environment calculation result of the food case from the thermal environment calculation result acquired by the thermal environment calculation result acquisition unit.

[0064] The food case unsteady state analysis processing unit 119 executes unsteady state analysis on the food case using the minimum temperature on the satellite orbit and the food case thermal environment calculation result. The food case unsteady state analysis processing unit 119 outputs the food case unsteady state analysis result, which is the result of the unsteady state analysis on the food case.

[0065] The eclipse case minimum temperature output unit 120 uses the eclipse case unsteady analysis results from the eclipse case unsteady analysis processing unit 119 to output the minimum temperature that the satellite will be subjected to in the eclipse state. The food case minimum temperature output unit 120 acquires and outputs the minimum temperature among the temperature values ​​according to the change in position on the trajectory and the change over time shown in the food case unsteady analysis result.

[0066] A processing example of the thermal design support apparatus according to the third embodiment of the present disclosure will be described. FIG. 14 is a flowchart illustrating an example of processing performed by the thermal design assistance apparatus according to the third embodiment of the present disclosure. First, the thermal design support device 100C executes the processes from step ST1110 to step ST1160 in the same manner as the processes (processes shown in FIG. 8) of the thermal design support device 100A already described.

[0067] Next, the thermal design support device 100C executes the processes from step ST3110 to step ST3150 in the same manner as the processes from step ST2110 to step ST2150 of the thermal design support device 100B already described (the processes shown in FIG. 11).

[0068] Thermal design support device 100C then executes a food case temperature calculation execution determination process (step ST3160). In the food case temperature calculation execution determination process, the food case temperature calculation unit 116C in the non-steady state analysis unit 110C of the thermal design support device 100C specifically determines to execute the food case temperature calculation process if the value of the item "food calculation" in the analysis conditions is TRUE, and determines not to execute the food case temperature calculation process if the value of the item "food calculation" in the analysis conditions is FALSE.

[0069] In the food case temperature calculation execution determination process of step ST3160, when it is determined that the food case temperature calculation process is not to be executed (step ST3160 "NO"), the thermal design support device 100C ends the process shown in FIG.

[0070] In the food case temperature calculation execution determination process of step ST3160, when it is determined that the food case temperature calculation process is to be executed (step ST3160 "YES"), the thermal design support device 100C then executes the food case temperature calculation process (step ST3170). In the food case temperature calculation process, the food case temperature calculation unit 116C of the thermal design support device 100C calculates the temperature on the satellite orbit in the eclipse state. The food case temperature calculation unit 116C acquires the temperature on the satellite's orbit output from the on-orbit temperature output unit 115C. Assuming that the satellite is a satellite orbiting a natural satellite of a celestial body, the food case temperature calculation unit 116C calculates the temperature on the satellite's orbit in an eclipse state in which the sun, the celestial body, and the natural satellite are arranged in that order and the natural satellite is hidden in the shadow of the celestial body relative to the sun. Here, a detailed example of the food case temperature calculation process will be described. FIG. 15 is a flowchart illustrating a detailed example of a food case temperature calculation process in the thermal design support device according to the third embodiment of the present disclosure.

[0071] When the thermal design support device 100C starts the food case temperature calculation process, it executes an on-orbit minimum temperature acquisition process (step ST3171). In the on-orbit minimum temperature acquisition process, the on-orbit minimum temperature acquisition unit 117 of the thermal design support device 100C acquires the minimum temperature on the satellite's orbit using the thermal environment calculation results. The on-orbit minimum temperature acquisition unit 117 acquires the minimum temperature among the temperature values ​​corresponding to the change in on-orbit position and the change in time shown in the thermal environment calculation result as the minimum temperature. The on-orbit minimum temperature acquisition unit 117 outputs the minimum temperature to the food case unsteady state analysis processing unit 119.

[0072] Thermal design support device 100C then executes food case thermal environment calculation result acquisition processing (step ST3172). In the food case thermal environment calculation result acquisition process, the food case thermal environment calculation result acquisition unit 118 of the thermal design support device 100C uses the thermal environment calculation result to acquire the food case thermal environment calculation result, which is the thermal environment calculation result on the satellite's orbit during the eclipse state. Food case thermal environment calculation result acquisition unit 118 calculates food case thermal environment calculation results from the thermal environment calculation results acquired by the thermal environment calculation result acquisition unit. Food case thermal environment calculation result acquisition unit 118 outputs the calculated food case thermal environment calculation results to food case unsteady state analysis processing unit 119.

[0073] Next, the thermal design support device 100C executes a food case unsteady state analysis process (step ST3173). In the food case transient analysis process, the food case transient analysis processing unit 119 of the thermal design support device 100C performs a transient analysis of the food case using the minimum temperature in the satellite's orbit and the food case thermal environment calculation results. The food case transient analysis processing unit 119 outputs the food case transient analysis results, which are the results of the transient analysis of the food case. Food case unsteady state analysis processing unit 119 outputs the food case unsteady state analysis result to food case minimum temperature output unit 120.

[0074] Thermal design support device 100C then executes food case minimum temperature output processing (step ST3174). In the food case minimum temperature output processing, the food case minimum temperature output unit 120 of the thermal design support device 100C uses the food case unsteady analysis results by the food case unsteady analysis processing unit 119 to output the minimum temperature that the satellite will be subjected to in the eclipse state. The eclipse case minimum temperature output unit 120 acquires and outputs the minimum temperature among the temperature values ​​corresponding to the change in orbital position and time change shown in the eclipse case unsteady analysis result. The eclipse case minimum temperature output unit 120 outputs the minimum temperature that the satellite will be exposed to in the eclipse state to, for example, a display unit (not shown).

[0075] Returning to the description of the processing shown in FIG. After executing the food case temperature calculation process in step ST3170, thermal design support device 100C ends the process shown in FIG.

[0076] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is further configured as follows, for example. Assuming that the satellite is a satellite orbiting a natural satellite of a celestial body, an eclipse case temperature calculation unit that calculates the temperature on the orbit of the satellite in an eclipse state in which the sun, the celestial body, and the natural satellite are arranged in this order and the natural satellite is hidden in the shadow of the celestial body relative to the sun; A thermal design support device further equipped with the above. As a result, the present disclosure further has the effect of being able to provide a thermal design support device that can facilitate the thermal design of a satellite orbiting a celestial body that may be eclipsed, such as a lunar eclipse. Furthermore, the present disclosure achieves the same effects as those described above by applying the above configuration to a thermal design support system, the above thermal design support method, or the above program.

[0077] The present disclosure provides the following configuration. The thermal design support device of the present disclosure is further configured as follows, for example. The food case temperature calculation unit an on-orbit temperature acquisition unit that acquires a minimum temperature on the satellite's orbit using the thermal environment calculation result; a food case thermal environment calculation result acquisition unit that uses the thermal environment calculation result to acquire a food case thermal environment calculation result, which is a thermal environment calculation result on the orbit of the satellite in the eclipse state; a food case transient analysis processing unit that executes a transient analysis of the food case using the minimum temperature on the satellite's orbit and the food case thermal environment calculation result; an eclipse case minimum temperature output unit that outputs the minimum temperature that the satellite will experience in the eclipse state using the eclipse case unsteady analysis result by the eclipse case unsteady analysis processing unit; A thermal design support device equipped with As a result, the present disclosure further has the effect of providing a thermal design support device that can facilitate design of the minimum temperature during an eclipse, for example, in relation to the thermal design of a satellite orbiting a celestial body that may be in an eclipse state, such as a lunar eclipse. Furthermore, the present disclosure achieves the same effects as those described above by applying the above configuration to a thermal design support system, the above thermal design support method, or the above program.

[0078] Here, the results of verification of the technology of the present disclosure will be described. [Verification based on the results of a two-node analysis of a lunar orbiter] External heat input verification To verify the external heat input calculation, the calculated results of the Earth's albedo and Earth's infrared radiation are compared with literature values ​​(Reference 6). Reference 6: Akira Onishi et al., Thermal Design of Spacecraft, (2014), Nagoya University Press. FIG. 16 is a diagram showing an example of the calculation result of the Earth's albedo by the thermal design support system of the present disclosure. FIG. 17 is a diagram showing an example of the calculation result of the terrestrial infrared radiation by the thermal design support system of the present disclosure. Figures 16 and 17 show the calculation results of the Earth's albedo and the Earth's infrared radiation, respectively. Since the calculation results are all in close agreement with the literature values, the calculations based on this disclosure are considered to be valid.

[0079] Here, a hardware configuration for realizing the functions of the present disclosure will be described. FIG. 18 is a diagram illustrating a first example of a hardware configuration for realizing the functions according to the configuration of the present disclosure. FIG. 19 is a diagram illustrating a second example of a hardware configuration for realizing the functions according to the configuration of the present disclosure. The thermal design support device (thermal environment calculation device) 100 (100A, 100B, 100C) of the present disclosure is realized by hardware such as that shown in FIG. 18 or FIG.

[0080] Each of the thermal design support devices (thermal environment calculation devices) 100 (100A, 100B, 100C) is configured with, for example, a processor 10001, a memory 10002, an input / output interface 10003, and a communication circuit 10004, as shown in FIG. The processor 10001 and the memory 10002 are, for example, installed in a computer. The memory 10002 stores the computer, a trajectory condition receiving unit 101 (101A, 101B, 101C), a trajectory condition definition unit 102 (102A, 102B, 102C), a sunlight input amount calculation unit 103 (103A, 103B, 103C), an albedo amount calculation unit 104 (104A, 104B, 104C), an infrared radiation amount calculation unit 105 (105A, 105B, 105C), a thermal environment calculation result output unit 106 (106A, 106B, 106C), an unsteady analysis unit 110 (110B, 110C), an analysis condition receiving unit 111 (111B, 111C), and an analysis condition definition unit 112 (112B, 112C). The storage device stores a thermal environment calculation result acquisition unit 113 (113B, 113C), a non-steady-state analysis processing unit 114 (114B, 114C), an on-orbit temperature output unit 115 (115B, 115C), a food case temperature calculation unit 116 (116C), an on-orbit minimum temperature acquisition unit 117, a food case thermal environment calculation result acquisition unit 118, a food case non-steady-state analysis processing unit 119, a food case minimum temperature output unit 120, and a program for functioning as a control unit not shown. The processor 10001 reads and executes the programs stored in the memory 10002, thereby controlling a trajectory condition receiving unit 101 (101A, 101B, 101C), a trajectory condition definition unit 102 (102A, 102B, 102C), a sunlight input amount calculation unit 103 (103A, 103B, 103C), an albedo amount calculation unit 104 (104A, 104B, 104C), an infrared radiation amount calculation unit 105 (105A, 105B, 105C), a thermal environment calculation result output unit 106 (106A, 106B, 106C), an unsteady analysis unit 110 (110B, 110C), an analysis condition receiving unit 111 (111B, 111C), and an analysis condition definition unit 112 (112B, 112C). The functions of a thermal environment calculation result acquisition unit 113 (113B, 113C), a non-steady-state analysis processing unit 114 (114B, 114C), an on-orbit temperature output unit 115 (115B, 115C), a food case temperature calculation unit 116 (116C), an on-orbit minimum temperature acquisition unit 117, a food case thermal environment calculation result acquisition unit 118, a food case non-steady-state analysis processing unit 119, a food case minimum temperature output unit 120, and a control unit not shown are realized. Furthermore, the memory 10002 or another memory not shown implements a storage unit not shown. Furthermore, the communication circuit 10004 realizes a communication unit (not shown).

[0081] The processor 10001 is, for example, a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor, a microcontroller, or a digital signal processor (DSP). Memory 10002 may be a non-volatile or volatile semiconductor memory such as RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable ROM), EEPROM (Electrically Erasable Programmable Read Only Memory) or flash memory, or a magnetic disk such as a hard disk or flexible disk, or an optical disk such as a CD (Compact Disc) or DVD (Digital Versatile Disc), or a magneto-optical disk. The processor 10001 and the memory 10002 or the communication circuit 10004 are connected in a state where they can transmit data to each other. The processor 10001, the memory 10002, and the communication circuit 10004 are also connected in a state where they can transmit data to other hardware via the input / output interface 10003.

[0082] Or, in a thermal design support device (thermal environment calculation device) 100 (100A, 100B, 100C), a trajectory condition receiving unit 101 (101A, 101B, 101C), a trajectory condition defining unit 102 (102A, 102B, 102C), a sunlight input amount calculating unit 103 (103A, 103B, 103C), an albedo amount calculating unit 104 (104A, 104B, 104C), an infrared radiation amount calculating unit 105 (105A, 105B, 105C), a thermal environment calculation result output unit 106 (106A, 106B, 106C), an unsteady analysis unit 110 (110B, 110C), and an analysis condition receiving unit 111 (111B, 111C) The functions of the analysis condition definition unit 112 (112B, 112C), thermal environment calculation result acquisition unit 113 (113B, 113C), unsteady analysis processing unit 114 (114B, 114C), on-orbit temperature output unit 115 (115B, 115C), food case temperature calculation unit 116 (116C), on-orbit minimum temperature acquisition unit 117, food case thermal environment calculation result acquisition unit 118, food case unsteady analysis processing unit 119, food case minimum temperature output unit 120, and a control unit not shown may be realized by a dedicated processing circuit 20001, as shown in FIG. 19.

[0083] The processing circuit 20001 may be, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), a PLD (Programmable Logic Device), an FPGA (Field-Programmable Gate Array), an SoC (System-on-a-Chip), or a system LSI (Large-Scale Integration). Furthermore, the memory 20002 or another memory not shown implements a storage unit not shown. Memory 20002 may be a non-volatile or volatile semiconductor memory such as RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable ROM), EEPROM (Electrically Erasable Programmable Read Only Memory) or flash memory, or a magnetic disk such as a hard disk or flexible disk, or an optical disk such as a CD (Compact Disc) or DVD (Digital Versatile Disc), or a magneto-optical disk. Furthermore, the communication circuit 20004 realizes a communication unit (not shown). The processing circuit 20001 and the memory 20002 or the communication circuit 20004 are connected in a state where they can transmit data to each other. In addition, the processing circuit 20001, the memory 20002, and the communication circuit 20004 are connected in a state where they can transmit data to other hardware via the input / output interface 20003. In addition, in the thermal design support device (thermal environment calculation device) 100 (100A, 100B, 100C), a trajectory condition receiving unit 101 (101A, 101B, 101C), a trajectory condition defining unit 102 (102A, 102B, 102C), a sunlight input amount calculating unit 103 (103A, 103B, 103C), an albedo amount calculating unit 104 (104A, 104B, 104C), an infrared radiation amount calculating unit 105 (105A, 105B, 105C), a thermal environment calculation result output unit 106 (106A, 106B, 106C), an unsteady analysis unit 110 (110B, 110C), and an analysis condition receiving unit 111 (111B, 111C) The functions of the analysis condition definition unit 112 (112B, 112C), the thermal environment calculation result acquisition unit 113 (113B, 113C), the unsteady analysis processing unit 114 (114B, 114C), the on-orbit temperature output unit 115 (115B, 115C), the food case temperature calculation unit 116 (116C), the on-orbit minimum temperature acquisition unit 117, the food case thermal environment calculation result acquisition unit 118, the food case unsteady analysis processing unit 119, the food case minimum temperature output unit 120, and the control unit (not shown) may be realized by separate processing circuits, or may be realized together by a processing circuit. Similarly, in the occupant monitoring device 300A, the functions of the video acquisition unit 301A, the operation determination unit 302A, and the control unit (not shown) may be realized by separate processing circuits, or may be realized collectively by a processing circuit. Similarly, in server device 600E, the functions of operation information collecting unit 601E and a control unit (not shown) may be realized by separate processing circuits, or may be realized together by a processing circuit.

[0084] Or, in a thermal design support device (thermal environment calculation device) 100 (100A, 100B, 100C), a trajectory condition receiving unit 101 (101A, 101B, 101C), a trajectory condition defining unit 102 (102A, 102B, 102C), a sunlight input amount calculating unit 103 (103A, 103B, 103C), an albedo amount calculating unit 104 (104A, 104B, 104C), an infrared radiation amount calculating unit 105 (105A, 105B, 105C), a thermal environment calculation result output unit 106 (106A, 106B, 106C), an unsteady analysis unit 110 (110B, 110C), and an analysis condition receiving unit 111 (111B, 111C) , analysis condition definition unit 112 (112B, 112C), thermal environment calculation result acquisition unit 113 (113B, 113C), unsteady analysis processing unit 114 (114B, 114C), on-orbit temperature output unit 115 (115B, 115C), food case temperature calculation unit 116 (116C), on-orbit minimum temperature acquisition unit 117, food case thermal environment calculation result acquisition unit 118, food case unsteady analysis processing unit 119, food case minimum temperature output unit 120, and a control unit (not shown) may have some of their functions realized by processor 10001 and memory 10002, and the remaining functions realized by processing circuit 20001.

[0085] It should be noted that, within the scope of this disclosure, the embodiments may be freely combined, any component of each embodiment may be modified, or any component of each embodiment may be omitted.

[0086] The present disclosure is suitable for use in thermal design technology for artificial satellites and the like, for example, in thermal design support devices and thermal design support methods, because it can facilitate the setting of the thermal environment even in the case of celestial bodies whose infrared radiation or albedo varies greatly. [Explanation of symbols]

[0087] 100 (100A, 100B, 100C) thermal design support device (thermal environment calculation device), 101 (101A, 101B, 101C) orbit condition acceptance unit, 102 (102A, 102B, 102C) orbit condition definition unit, 103 (103A, 103B, 103C) solar input amount calculation unit, 104 (104A, 104B, 104C) albedo amount calculation unit, 105 (105A, 105B, 105C) infrared radiation amount calculation unit, 106 (106A, 106B, 106C) thermal environment calculation result output unit, 110 (110B, 110C) unsteady analysis unit, 111 (111B, 111C) analysis condition acceptance unit, 112 (112B, 112C) Analysis condition definition unit, 113 (113B, 113C) thermal environment calculation result acquisition unit, 114 (114B, 114C) unsteady analysis processing unit, 115 (115B, 115C) on-orbit temperature output unit, 116 (116C) food case temperature calculation unit, 117 on-orbit minimum temperature acquisition unit, 118 food case thermal environment calculation result acquisition unit, 119 food case unsteady analysis processing unit, 120 food case minimum temperature output unit, 1000 flat plate (flat plate model), 1100 celestial body (including natural satellite), 1110 Earth's surface, 1120 integration range, 1300 range (range hidden in the shadow of the celestial body), 2000 satellite (artificial satellite model), 2010 orbit (artificial satellite orbit), 3100 (3100A, 3100B) Reception image (image for receiving thermal environment calculation), 3110 condition name display field (trajectory conditions), 3120 value display field, 3130 remarks display field, 3140 execution command button (thermal environment calculation execution command button), 3150 execution command button (thermal environment calculation result transition button), 3200 (3200B) reception image (image for receiving transient analysis), 3210 condition name display field (analysis conditions), 3220 value display field, 3230 remarks display field, 3240 execution command button (single-node analysis execution command button), 3250 execution command button (two-node analysis execution command button), 10001 processor, 10002 memory, 10003 input / output interface, 10004 communication circuit, 20001 processing circuit, 20002 memory, 20003 input / output interface, 20004 communication circuit.

Claims

1. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires an albedo amount that the satellite will experience on its orbit by performing numerical integration within an integration range calculated using the orbital conditions; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration within an integration range calculated using the orbit conditions; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A thermal design support device equipped with the above.

2. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that calculates an integration range using the orbital conditions and performs numerical integration to obtain an albedo amount that the satellite will receive on its orbit; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive in its orbit; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A thermal design support device equipped with the above.

3. an orbit condition definition unit that acquires orbit conditions that are conditions related to the satellite orbit; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires the amount of albedo that the satellite will receive in its orbit; an infrared radiation amount calculation unit that calculates an integration range using the orbital conditions and performs numerical integration to obtain the amount of infrared radiation that the satellite will receive on its orbit; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A thermal design support device equipped with the above.

4. an analysis condition definition unit for acquiring analysis conditions for a transient analysis that is an analysis of the temperature that the satellite will be subjected to in orbit; a thermal environment calculation result acquisition unit that acquires the thermal environment calculation result; an unsteady state analysis processing unit that analyzes the temperature that the satellite will be subjected to in orbit using the analysis conditions and the thermal environment calculation results; an on-orbit temperature output unit that outputs the temperature on the satellite's orbit; The thermal design support device according to claim 1 , further comprising:

5. Assuming that the satellite is a satellite orbiting a natural satellite of a celestial body, an eclipse case temperature calculation unit that calculates the temperature on the orbit of the satellite in an eclipse state in which the sun, the celestial body, and the natural satellite are arranged in this order and the natural satellite is hidden in the shadow of the celestial body relative to the sun; The thermal design support system according to claim 4, further comprising:

6. The food case temperature calculation unit an on-orbit temperature acquisition unit that acquires a minimum temperature on the satellite's orbit using the thermal environment calculation result; a food case thermal environment calculation result acquisition unit that uses the thermal environment calculation result to acquire a food case thermal environment calculation result, which is a thermal environment calculation result on the orbit of the satellite in the eclipse state; a food case transient analysis processing unit that executes a transient analysis of the food case using the minimum temperature on the satellite's orbit and the food case thermal environment calculation result; an eclipse case minimum temperature output unit that outputs the minimum temperature that the satellite will experience in the eclipse state using the eclipse case unsteady analysis result by the eclipse case unsteady analysis processing unit; The thermal design support device according to claim 5, comprising:

7. A thermal design support method using a thermal design support device, an orbital condition definition step in which an orbital condition definition unit of the thermal design support device acquires orbital conditions that are conditions related to the orbit of a satellite that is a design target; a sunlight input amount calculation step in which a sunlight input amount calculation unit of the thermal design support device calculates a sunlight input amount that will be received in the orbit of the satellite using the orbital conditions; an albedo calculation step in which an albedo calculation unit of the thermal design support system acquires an albedo amount that the satellite will receive in its orbit by performing numerical integration using the orbital conditions; an infrared radiation amount calculation step in which an infrared radiation amount calculation unit of the thermal design support device acquires an amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; a thermal environment calculation result output step in which a thermal environment calculation result output unit of the thermal design support device acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A thermal design support method comprising:

8. Computer, an orbit condition definition unit that acquires orbit conditions that are conditions related to the orbit of a satellite that is a thermal design target; a solar light input amount calculation unit that calculates the amount of solar light input that the satellite will receive on its orbit using the orbital conditions; an albedo amount calculation unit that acquires the amount of albedo that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; an infrared radiation amount calculation unit that acquires the amount of infrared radiation that the satellite will receive on its orbit by performing numerical integration using the orbital conditions; a thermal environment calculation result output unit that acquires the sunlight input amount, the albedo amount, and the infrared radiation amount, and outputs a thermal environment calculation result; A program that operates as a thermal environment calculation device equipped with the above.

Images