Display device and manufacturing method of the same

Abstract

To improve the performance of a display device.SOLUTION: The display device comprises: a plurality of LED elements 20 mounted on a substrate 10; a resin layer 41 sealing the plurality of LED elements 20; a light-blocking layer 51 arranged on the resin layer 41; a resin layer 42 arranged on the light-blocking layer 51; and a light-blocking layer 53 arranged on the resin layer 42. Each of the resin layer 41 and the resin layer 42 is composed of an organic material containing photocurable resin component that is curable by irradiation with light. The light-blocking layer 51 includes a plurality of light-blocking parts 51LS and a plurality of openings 51BL. The light-blocking layer 53 includes a plurality of light-blocking parts 53LS and a plurality of openings 53BL. Each of the plurality of light-blocking parts 51LS and the plurality of light-blocking parts 53LS includes an opening 50TH. Each of the plurality of light-blocking parts 51LS is arranged on a position overlapping with any of the plurality of openings 53BL. Each of the plurality of light-blocking parts 53LS is arranged on a position overlapping with any of the plurality of openings 51BL.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a display device. [Background technology]

[0002] Patent Document 1 (JP 2021-67763 A) describes a micro LED display device in which LED elements are sealed with a resin layer.

[0003] Patent Document 2 (JP 2017-32812 A) describes a display device in which light-shielding portions formed in stripes intersect with each other. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-67763 [Patent Document 2] Japanese Patent Application Publication No. 2017-32812 Summary of the Invention [Problem to be solved by the invention]

[0005] There is a micro LED display device that uses multiple LED elements (inorganic light emitting diode elements) as light emitting elements. The inventors of the present application are studying a technology to improve the performance of display devices that use multiple LED elements, such as the micro LED display device.

[0006] An object of the present invention is to provide a technique for improving the performance of a display device. [Means for solving the problem]

[0007] A display device according to one embodiment includes a plurality of light-emitting diode elements mounted on a first substrate, a first resin layer encapsulating the plurality of light-emitting diode elements, a first light-shielding layer disposed on the first resin layer, a second resin layer disposed on the first light-shielding layer, and a second light-shielding layer disposed on the second resin layer. Each of the first resin layer and the second resin layer is made of an organic material containing a photocurable resin component that hardens when irradiated with light. The first light-shielding layer includes a plurality of first light-shielding portions and a plurality of first openings alternately arranged along a first direction and a second direction intersecting the first direction. The second light-shielding layer includes a plurality of second light-shielding portions and a plurality of second openings alternately arranged along the first direction and the second direction. Each of the plurality of first light-shielding portions and the plurality of second light-shielding portions includes a third opening positioned so as to overlap one of the plurality of light-emitting diodes. The opening area of ​​the third opening is smaller than the opening area of ​​the first opening and the opening area of ​​the second opening. Each of the plurality of first light-shielding portions is disposed at a position overlapping one of the plurality of second openings. Each of the plurality of second light-shielding portions is disposed at a position overlapping one of the plurality of first openings. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view showing an example of the configuration of a micro LED display device according to an embodiment; [Figure 2] 2 is a circuit diagram showing an example of the configuration of a circuit around the pixel shown in FIG. 1. [Figure 3] 2 is an enlarged transparent plan view showing an example of a peripheral structure of LED elements arranged in each of a plurality of pixels of the display device shown in FIG. [Figure 4] FIG. 4 is an enlarged cross-sectional view taken along line AA in FIG. 3. [Figure 5] FIG. 5 is an enlarged cross-sectional view taken along line BB in FIG. 4. [Figure 6] 6 is an enlarged plan view of the light-shielding layer that is located relatively closer to the LED element, of the two light-shielding layers shown in FIGS. 4 and 5, and the substrate that supports it. FIG. [Figure 7] FIG. 6 is an enlarged plan view of one of the two light-shielding layers shown in FIGS. 4 and 5 that is located relatively far from the LED element, and of the substrate that supports it. [Figure 8] FIG. 8 is an enlarged cross-sectional view taken along line CC in FIGS. 6 and 7. [Figure 9] FIG. 9 is an enlarged cross-sectional view showing an example of consideration for FIG. 8. [Figure 10] 8 is an enlarged transparent plan view showing a state in which the substrate shown in FIG. 6 and the substrate shown in FIG. 7 are superimposed. [Figure 11] 7 is an enlarged plan view showing a modified example of the light-shielding layer shown in FIG. 6. [Figure 12] 8 is an enlarged plan view showing a modified example of the light-shielding layer shown in FIG. 7. [Figure 13] FIG. 13 is an enlarged cross-sectional view taken along line DD in FIGS. 11 and 12. [Figure 14] FIG. 7 is an enlarged plan view showing another modified example of the light-shielding layer shown in FIG. [Figure 15] 8 is an enlarged plan view showing another modified example of the light-shielding layer shown in FIG. 7. FIG. [Figure 16] 16 is an enlarged plan view showing an example of the layout of light-shielding layers stacked on the substrate shown in FIG. 15. FIG. [Figure 17] FIG. 17 is an enlarged cross-sectional view taken along line EE in FIGS. 14, 15 and 16. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, in order to clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings may be designated by the same or related reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] <Display device> First, a configuration example of a micro LED display device, which is a display device of the present embodiment, will be described. Fig. 1 is a plan view showing a configuration example of a micro LED display device, which is one embodiment. In Fig. 1, the boundary between the display area DA and the peripheral area PFA, the control circuit 5, the drive circuit 6, and the multiple pixels PIX are each indicated by a two-dot chain line. Fig. 2 is a circuit diagram showing a configuration example of the circuit around the pixels shown in Fig. 1.

[0011] FIG. 1 shows the X direction and the Y direction. The X direction and the Y direction intersect with each other. In the example described below, the X direction is perpendicular to the Y direction. In the following description, the XY plane including the X direction and the Y direction will be described as a plane parallel to the display surface of the display device. In the following description, unless otherwise specified, the term "planar view" refers to the view of a plane parallel to the XY plane. Furthermore, as will be described later, the normal direction to the XY plane will be described as the "Z direction" or thickness direction. The X direction, the Y direction, and the Z direction are directions that intersect with each other, and more specifically, are directions that are perpendicular to each other.

[0012] As shown in Fig. 1, the display device DSP1 of this embodiment has a display area DA, a peripheral area PFA that surrounds the periphery of the display area DA in a frame shape, and a plurality of pixels PIX arranged in a matrix within the display area DA. The display device DSP1 also has a substrate 10, a control circuit 5 formed on the substrate 10, and a drive circuit 6 formed on the substrate 10. The substrate 10 is made of glass or resin. As shown in Fig. 4, the substrate 10 has a surface 10f and a surface 10b opposite to surface 10f.

[0013] The control circuit 5 is a control circuit that controls the driving of the display function of the display device DSP1. For example, the control circuit 5 is a driver IC (Integrated Circuit) mounted on the substrate 10. In the example shown in FIG. 1, the control circuit 5 is arranged along one of the four short sides of the substrate 10. In the example of the present embodiment, the control circuit 5 includes a signal line drive circuit that drives the wiring (video signal wiring) VL (see FIG. 2) connected to the multiple pixels PIX. However, the position and configuration of the control circuit 5 are not limited to the example shown in FIG. 1 and various modifications are possible. For example, in FIG. 1, a circuit board such as a flexible board may be connected to the position shown as the control circuit 5, and the above-mentioned driver IC may be mounted on the circuit board. In addition, for example, the signal line drive circuit that drives the wiring VL may be formed separately from the control circuit 5.

[0014] The drive circuit 6 includes a circuit that drives the scanning signal lines GL (see FIG. 2, described later) of the multiple pixels PIX. The drive circuit 6 also includes a circuit that supplies a reference potential to the LED elements mounted on each of the multiple pixels PIX. The drive circuit 6 drives the multiple scanning signal lines GL based on control signals from the control circuit 5. In the example shown in FIG. 1, the drive circuit 6 is arranged along each of two of the four long sides of the substrate 10. However, the position and configuration of the drive circuit 6 are not limited to the example shown in FIG. 1, and various modifications are possible. For example, in FIG. 1, a circuit board such as a flexible board may be connected to the position shown as the control circuit 5, and the above-mentioned drive circuit 6 may be mounted on the circuit board.

[0015] Next, an example of the circuit configuration of a pixel PIX will be described using Fig. 2. Note that Fig. 2 shows four pixels PIX as representative examples, but each of the multiple pixels PIX shown in Fig. 1 has a circuit similar to that of the pixel PIX shown in Fig. 2. Hereinafter, the switch provided in the pixel PIX and the circuit including the LED element 20 may be referred to as the pixel circuit. The pixel circuit is a voltage signal type circuit that controls the light emission state of the LED element 20 in response to the video signal Vsg supplied from the control circuit 5 (see Fig. 1).

[0016] As shown in FIG. 2, the pixel PIX includes an LED element 20. The LED element 20 is the above-described micro light-emitting diode. The LED element 20 has an anode electrode 20EA and a cathode electrode 20EC. The cathode electrode 20EC of the LED element 20 is connected to a wiring VSL to which a reference potential (fixed potential) PVS is supplied. The anode electrode 20EA of the LED element 20 is electrically connected to the drain electrode ED of the switching element SW via a wiring 31.

[0017] The pixel PIX includes a switching element SW. The switching element SW is a transistor that controls the connection state (on or off state) between the pixel circuit and the wiring VL in response to a control signal Gs. The switching element SW is, for example, a thin film transistor. When the switching element SW is in the on state, a video signal Vsg is input to the pixel circuit from the wiring VL.

[0018] The driving circuit 6 includes a shift register circuit, an output buffer circuit, etc. not shown. The driving circuit 6 outputs a pulse based on a horizontal scanning start pulse transmitted from the control circuit 5 (see FIG. 1) and outputs a control signal Gs.

[0019] Each of the plurality of scanning signal lines GL extends in the X direction. The scanning signal line GL is connected to the gate electrode of the switching element SW. When a control signal Gs is supplied to the scanning signal line GL, the switching element SW becomes in the on state, and a video signal Vsg is supplied to the LED element 20.

[0020] <Peripheral Structure of LED Element> Next, the peripheral structure of the LED elements arranged in each of the multiple pixels PIX shown in Fig. 1 will be described. Fig. 3 is an enlarged plan view showing an example of the peripheral structure of the LED elements arranged in each of the multiple pixels of the display device shown in Fig. 1. In Fig. 3, the inorganic insulating layer 14, resin layer 41, light-shielding layer 51, substrate 52, resin layer 42, light-shielding layer 53, and substrate 54 shown in Figs. 4 and 5 are omitted. In Fig. 3, the outlines of the semiconductor layer, electrodes, and scanning signal lines are indicated by dotted lines. Fig. 4 is an enlarged cross-sectional view taken along line AA in Fig. 3. Fig. 5 is an enlarged cross-sectional view taken along line BB in Fig. 4.

[0021] 3, the display device DSP1 has a plurality of pixels PIX including pixel PIX1 (pixels PIX1, PIX2, and PIX3 in the example shown in FIG. 3). Each of the plurality of pixels PIX has a switching element SW, an LED element (light-emitting diode element) 20, a wiring 31, and a wiring 32.

[0022] Each of the pixels PIX1, PIX2, and PIX3 is equipped with an LED element 20 that emits visible light of one color, for example, red, green, or blue, and is formed with a switching element SW that drives the LED element 20. Color display is possible by controlling the output and timing of the visible light emitted from the LED element 20 provided in each of the pixels PIX1, PIX2, and PIX3. When multiple pixels PIX that emit visible light of different colors are combined in this way, the pixels PIX for each color are sometimes called sub-pixels, and a set of multiple pixels PIX is sometimes called a pixel. In this embodiment, the parts corresponding to the sub-pixels are called pixels PIX.

[0023] The wiring 31 is electrically connected to the drain electrode ED of the switching element SW and the anode electrode 20EA of the LED element 20. The wiring 32 is connected to the source electrode ES of the switching element SW. In the example shown in FIG. 3, the wiring 32 has a bent structure, with one end connected to the source electrode ES of the switching element SW and the other end connected to the wiring VL. The scanning signal line GL is used as the gate electrode EG of the switching element SW.

[0024] The display device DSP1 further includes a wiring VL extending across multiple pixels PIX (see FIG. 2) along the Y direction and electrically connected to the wiring 32, and a wiring VSL extending across multiple pixels PIX along the X direction intersecting the Y direction (orthogonal in FIG. 3) and electrically connected to the cathode electrode 20EC of the LED element 20. The layout shown in FIG. 3 is merely an example, and various modifications are possible. For example, one modification of FIG. 3 may be a structure in which the switching element SW has a gate electrode (not shown) connected to a scanning signal line GL. In this modification, the scanning signal line GL may be positioned so as not to overlap with the semiconductor layer SCL.

[0025] As shown in Figure 4, display device DSP1 is an electronic device including a substrate 10 made of glass or resin and a plurality of insulating layers laminated on substrate 10. The plurality of insulating layers included in display device DSP1 include inorganic insulating layer 11, inorganic insulating layer 12, inorganic insulating layer 13, and inorganic insulating layer 14 laminated on substrate 10. Substrate 10 has a surface 10f and a surface 10b opposite surface 10f. Each of inorganic insulating layers 11, 12, 13, and 14 is laminated on surface 10f of substrate 10.

[0026] The switching element SW includes an inorganic insulating layer 12 formed on a substrate 10, a semiconductor layer SCL formed on the inorganic insulating layer 12, a drain electrode ED connected to the drain region of the semiconductor layer SCL, a source electrode ES connected to the source region of the semiconductor layer SCL, and an inorganic insulating layer 13 covering the semiconductor layer SCL. Each of the wiring 31 and the wiring 32 is a laminated film made of, for example, a conductor layer made of titanium or a titanium alloy and a conductor layer made of aluminum or an aluminum alloy. A laminated film in which an aluminum layer is sandwiched between titanium layers is called a TAT laminated film.

[0027] The example shown in FIG. 4 is a bottom-gate example in which the gate electrode EG is located between the semiconductor layer SCL and the substrate 10. In the bottom-gate example, the portion of the inorganic insulating layer 12 located between the gate electrode EG and the semiconductor layer SCL functions as a gate insulating layer. The inorganic insulating layer 12 also functions as a base layer for forming the semiconductor layer SCL. The position of the gate electrode EG is not limited to the example shown in FIG. 4, and may be, for example, a top-gate example, as a modified example described later.

[0028] There are no particular limitations on the material constituting each of the inorganic insulating layers 11, 12, 13, and 14. Examples include silicon oxide (SiO2) and silicon nitride (SiN). The semiconductor layer SCL is a semiconductor film in which a silicon film made of silicon is doped with impurities of P-type or N-type conductivity.

[0029] The source electrode ES and the drain electrode ED are contact plugs for making electrical contact with either the source region or the drain region of the semiconductor layer SCL. Examples of materials for the contact plugs include tungsten. As a variation of FIG. 4 , contact holes exposing the source region and the drain region of the semiconductor layer SCL are formed in the inorganic insulating layer 13, and portions of the wiring 31 and the wiring 32 are embedded in the contact holes. In this case, the portions of the wiring 31 and the wiring 32 embedded in the contact holes contact the semiconductor layer SCL, and the contact interfaces between the wiring 31 and the wiring 32 and the semiconductor layer SCL can be regarded as the drain electrode ED and the source electrode ES.

[0030] The substrate SUB1 is defined as a laminate of the substrate 10 and a plurality of insulating layers (inorganic insulating layers 11, 12, 13, and 14 in the example shown in FIG. 4) stacked on the substrate 10. The substrate SUB1 has a surface SUBf.

[0031] The display device DSP1 also includes a plurality of bump electrodes 33. The bump electrodes 33 are terminals for mounting the LED elements 20 on the substrate 10. Therefore, one of the two bump electrodes 33 is connected to the anode electrode 20EA of the LED element 20, and the other is connected to the cathode electrode 20EC of the LED element 20.

[0032] The bump electrode 33 is connected to the wiring 31 at a position overlapping the opening 14H formed in the inorganic insulating layer 14, and protrudes from the inorganic insulating layer 14. The bump electrode 33 is made of, for example, solder containing tin. Alternatively, the bump electrode 33 may be a laminate of a solder layer and a metal layer made of a metal material, such as copper, that has higher electrical conductivity than solder.

[0033] 4 and 5, in this embodiment, the LED elements 20 are sealed with a resin layer 41. The display device DSP1 has the resin layer 41 that seals the LED elements 20, a light-shielding layer 51 arranged on the resin layer 41, a resin layer 42 arranged on the light-shielding layer 51, and a light-shielding layer 53 arranged on the resin layer 42.

[0034] Light-shielding members 50 are partially disposed on each of the light-shielding layers 51 and 53. The light-shielding members 50 disposed on each of the light-shielding layers 51 and 53 are members that have the property of absorbing black or dark-colored visible light. Examples of materials that constitute the light-shielding members 50 include resin mixed with a black pigment, metal such as chromium, and metal oxide such as chromium oxide.

[0035] The light-shielding layers 51 and 53 have a function of preventing external light irradiated from outside the display device DSP1 from reaching the substrate SUB1. The light-shielding layers 51 and 53 also have a function of preventing reflected light, which is external light reflected by the wiring pattern of the substrate SUB1 (for example, the wiring 31, wiring 32, wiring VL, or wiring VSL shown in FIG. 3), from being mixed with the displayed image and being visible. The wiring pattern of the substrate SUB1 is connected to at least one of the multiple LED elements 20.

[0036] A micro LED display device using LED elements 20, which are self-luminous elements, can achieve a higher contrast ratio than, for example, a liquid crystal display device. However, if external light is reflected from the substrate SUB1 on which the LED elements 20 are mounted, this can cause a decrease in the contrast ratio.

[0037] In the present embodiment, when light-shielding layers 51, 53 are arranged on the substrate SUB1 and an LED element 20 is arranged between the light-shielding layers 51, 53 and the substrate SUB1, as described above, the intrusion of external light and the emission of reflected light can be suppressed, thereby increasing the contrast ratio of the display device DSP1.

[0038] The detailed structures of the light-shielding layer 51 and the light-shielding layer 53 will be described later.

[0039] <Details of the light-shielding layer> Next, the details of the light-shielding layer 51 and the light-shielding layer 53 shown in FIGS. 4 and 5 will be described. FIG. 6 is an enlarged plan view of one of the two light-shielding layers shown in FIGS. 4 and 5 that is located relatively close to the LED elements, and the substrate supporting the layer. FIG. 7 is an enlarged plan view of one of the two light-shielding layers shown in FIGS. 4 and 5 that is located relatively far from the LED elements, and the substrate supporting the layer. FIG. 8 is an enlarged cross-sectional view taken along line CC in FIGS. 6 and 7. FIG. 9 is an enlarged cross-sectional view showing an example of consideration of FIG. 8. FIG. 10 is an enlarged transmission plan view showing the state in which the substrate shown in FIG. 6 and the substrate shown in FIG. 7 are superimposed. Although FIGS. 6, 7, and 10 are plan views, the light-shielding portions (light-shielding members) are hatched to make the locations where they are located easier to see. Hereinafter, plan views showing the positions of the light-shielding portions will be similarly illustrated with hatching.

[0040] 8 is a spacer member for ensuring a separation distance between the light-shielding layer 51 (more specifically, the substrate 52 supporting the light-shielding layer 51) and the LED element 20. The resin layer 42 is a spacer member for ensuring a separation distance between the light-shielding layer 53 (more specifically, the substrate 54 supporting the light-shielding layer 53) and the light-shielding layer 51 (more specifically, the substrate 52 supporting the light-shielding layer 51).

[0041] In the case of such a spacer member, it is preferable to use a material that is liquid or paste-like during formation and that can be hardened by applying energy after formation. In particular, the material that constitutes resin layer 41 preferably has a certain degree of fluidity during formation, since it is preferable to seal LED element 20 without leaving any air bubbles.

[0042] In this embodiment, each of the resin layers 41 and 42 is made of an organic material containing a photocurable resin component that is cured by irradiation with light. An example of the photocurable resin is an ultraviolet curable resin that is cured by irradiation with ultraviolet light.

[0043] The light-shielding layer 51 includes a plurality of light-shielding portions 51LS and a plurality of openings 51BL arranged alternately along the X direction and the Y direction intersecting the X direction. The light-shielding layer 53 includes a plurality of light-shielding portions 53LS and a plurality of openings 53BL arranged alternately along the X direction and the Y direction. The openings 51BL are through-holes that pass through the light-shielding layer 51 shown in FIG. 8 in the thickness direction. The openings 53BL are through-holes that pass through the light-shielding layer 53 shown in FIG. 8 in the thickness direction.

[0044] Each of the plurality of light-shielding portions 51LS and the plurality of light-shielding portions 53LS has an opening (through-hole) 50TH arranged at a position overlapping one of the plurality of LED elements 20. The opening 50TH is a hole for transmitting light emitted from the LED element 20. The opening 50TH is formed to penetrate the light-shielding portion 51LS or the light-shielding portion 53LS in the thickness direction (Z direction). A resin layer 41 or a resin layer 42 is embedded in the opening 50TH.

[0045] In consideration of the efficiency of light emission from the openings 50TH, it is preferable that each of the openings 50TH is disposed at a position overlapping with an LED element 20.

[0046] Furthermore, the opening area of ​​the opening 50TH is smaller than the opening area of ​​the opening 51BL and the opening area of ​​the opening 53BL. Each of the plurality of light-shielding portions 53LS is arranged at a position overlapping one of the plurality of openings 51BL. Each of the plurality of light-shielding portions 51LS is arranged at a position overlapping one of the plurality of openings 53BL. In the present embodiment, since the light-shielding layer has a two-layer structure, each of the plurality of openings 53BL is arranged at a position overlapping one of the plurality of light-shielding portions 51LS. Furthermore, each of the plurality of openings 51BL is arranged at a position overlapping one of the plurality of light-shielding portions 53LS. This suppresses the intrusion of external light and the emission of reflected light, and allows the light emitted from the LED element 20 to be visible.

[0047] Incidentally, when focusing on the effect of suppressing the intrusion of external light and the emission of reflected light, a similar effect can be achieved even when a single light-shielding layer is provided, rather than when multiple light-shielding layers are provided as in the present embodiment. For example, the display device DSP2 shown in FIG. 9 includes a single-phase light-shielding layer 55 having multiple openings 50TH. The light-shielding layer 55 does not include the openings 51BL of the light-shielding layer 51 shown in FIG. 8 or the openings 53BL of the light-shielding layer 53. In the display device DSP2, most of the external light that intrudes from above the LED elements 20 is absorbed (blocked) by the light-shielding layer 55. Furthermore, even if external light intrudes through one of the multiple openings 53BL and is reflected by a wiring pattern (e.g., wiring 31), most of the reflected light is absorbed (blocked) by the light-shielding layer 55. Therefore, even in the case of the display device DSP2, the intrusion of external light and the emission of reflected light as described above are suppressed, and the light emitted from the LED elements 20 can be viewed.

[0048] However, the display device DSP2 has the following problem: Since the light-shielding layer 55 occupies a large area of ​​the light-shielding member 50, it is difficult for light (e.g., ultraviolet light) irradiated to harden the resin layer 41 to reach the resin layer 41. Therefore, the light-shielding layer 55 inhibits hardening of the resin layer 41, particularly at positions overlapping with the light-shielding member 50.

[0049] Another method for curing the resin layer 41 is to irradiate it with light (e.g., ultraviolet light) from the surface 10b side. However, even in this case, the light irradiated from the surface 10b side is reflected by the multiple wiring patterns formed on the substrate SUB1, making it difficult for the light to reach the resin layer 41.

[0050] From the above viewpoint, the inventors of the present application have investigated a structure that suppresses the intrusion of external light and the emission of reflected light as described above, and that makes it easy to irradiate the resin layer 41 with light for hardening the resin layer 41, and have discovered the structure of the present embodiment.

[0051] In the present embodiment, the light-shielding layer 51 covering the resin layer 41 has, in addition to the plurality of openings 50TH, a plurality of openings 51BL each having an area larger than that of the openings 50TH. In the present embodiment, the planar shape of each of the light-shielding portions 51LS and the openings 51BL is quadrangular (e.g., rectangular). Also, in the present embodiment, the area of ​​each of the plurality of light-shielding portions 51LS is equal to the area of ​​each of the plurality of openings 51BL. Therefore, considering the area occupied by the openings 50TH, the occupied area ratio of the light-shielding member 50 to the entire light-shielding layer 51, in other words, the light-shielding rate of the light-shielding layer 51, is less than 50%. Therefore, comparing the display device DSP1 shown in FIG. 8 with the display device DSP2 shown in FIG. 9, the display device DSP1 is more likely to irradiate the entire resin layer 41 with light (e.g., ultraviolet light) for curing the resin layer 41 than the display device DSP2.

[0052] 8, the light-shielding layer 51 is covered with the light-shielding layer 53. However, the step of irradiating the resin layer 41 with light to harden the resin layer 41 is carried out before the resin layer 42 is laminated on the light-shielding layer 51 (more specifically, on the substrate 52 that supports the light-shielding layer 51). Therefore, the amount of light irradiated onto the resin layer 41 in the step of hardening the resin layer 41 is determined by the light-shielding rate of the light-shielding layer 51 (in other words, the aperture rate), regardless of the light-shielding rate of the light-shielding layer 53 (in other words, the aperture rate).

[0053] Furthermore, the display device DSP1 has the resin layer 42 containing a photocurable resin component as described above. Therefore, after the light-shielding layer 53 and the substrate 54 are arranged so as to cover the resin layer 42, it is necessary to irradiate the resin layer 42 with light (e.g., ultraviolet light) to cure the resin layer 42.

[0054] In the present embodiment, the light-shielding layer 53 covering the resin layer 42 has, in addition to the plurality of openings 50TH, a plurality of openings 53BL each having an area larger than that of the openings 50TH. In the present embodiment, the planar shape of each of the light-shielding portions 53LS and the openings 53BL is quadrangular (e.g., rectangular). Also, in the present embodiment, the area of ​​each of the plurality of light-shielding portions 53LS is equal to the area of ​​each of the plurality of openings 53BL. Therefore, considering the area occupied by the openings 50TH, the area ratio of the light-shielding member 50 to the entire light-shielding layer 53, in other words, the light-shielding rate of the light-shielding layer 53, is less than 50%. In the display device DSP1, similar to the process of irradiating the resin layer 41 with light, in the process of curing the resin layer 42, the entire resin layer 42 is likely to be irradiated with light (e.g., ultraviolet light) for curing the resin layer 42.

[0055] As described above, according to this embodiment, it is necessary to harden each of the resin layers 41 and 42, but the resin layers 41 and 42 are each provided with a structure that allows them to be easily irradiated with light.

[0056] As described above, each of the plurality of light-shielding portions 53LS is disposed at a position overlapping one of the plurality of openings 51BL, and each of the plurality of openings 53BL is disposed at a position overlapping one of the plurality of light-shielding portions 51LS. Therefore, as shown in Fig. 10, when the substrate 52 shown in Fig. 6 and the substrate 54 shown in Fig. 7 are overlapped, in a transmitted plan view, the substrate SUB1 (see Fig. 8) is covered by either the plurality of light-shielding portions 51LS or the plurality of light-shielding portions 53LS in an area other than the plurality of openings 50TH. Therefore, as described above, the display device DSP1 can suppress the intrusion of external light and the emission of reflected light.

[0057] In this embodiment, the light-shielding portions and the openings are arranged to correspond one-to-one with the LED elements. Specifically, as shown in Fig. 6, one of the LED elements 20 is arranged at a position overlapping with each of the light-shielding portions 51LS and the openings 51BL. Furthermore, as shown in Fig. 7, another one of the LED elements 20 is arranged at a position overlapping with each of the light-shielding portions 53LS and the openings 53BL.

[0058] 6 are arranged so as to overlap one of the LED elements, the light-shielding portions 51LS and the openings 51BL have small areas, which is advantageous in that the area that is not reached by light for curing the resin layer 41 can be reduced in the step of curing the resin layer 41 shown in FIG.

[0059] In the case of the display device DSP1, the light-shielding layer 51 is supported by the substrate 52, and the light-shielding layer 53 is supported by the substrate 54. In other words, the light-transmitting substrate 52 is interposed between the resin layer 41 and the resin layer 42, and the light-shielding layer 51 is fixed to the substrate 52. In addition, the light-transmitting substrate 54 is located on the resin layer 42, and the light-shielding layer 53 is fixed to the substrate 54. As the light-transmitting substrate 52 and the substrate 54, for example, a glass substrate or a transparent resin substrate can be used.

[0060] As a modification of the present embodiment, there is a case where light-shielding layer 51 and light-shielding layer 53 are provided without providing substrate 52 or substrate 54. In addition, as another modification, there is a structure where either substrate 52 or substrate 54 is not provided.

[0061] In the case of a structure in which a substrate 52 is not provided, it is preferable that the plurality of light-shielding portions 51LS provided in the light-shielding layer 51 are connected to each other. By connecting the plurality of light-shielding portions 51LS to each other, the light-shielding layer 51 can be handled as a single component. Furthermore, in the case of a structure in which a substrate 54 is not provided, it is preferable that the plurality of light-shielding portions 53LS provided in the light-shielding layer 53 are connected to each other. By connecting the plurality of light-shielding portions 53LS to each other, the light-shielding layer 53 can be handled as a single component.

[0062] On the other hand, in a structure in which the light-shielding layer 51 is fixed to the substrate 52, as in the present embodiment, there is a high degree of freedom regarding the shape and thickness of the light-shielding layer 51. For example, even if the multiple light-shielding portions 51LS of the light-shielding layer 51 are spaced apart from each other, if each of the multiple light-shielding portions 51LS is fixed to the substrate 52, the set of the light-shielding layer 51 and the substrate 52 can be handled as a single component. Furthermore, for example, if each of the multiple light-shielding portions 51LS is fixed to the substrate 52, the thickness of the light-shielding portion 51LS can be made extremely thin within a range in which light-shielding properties can be obtained. Similarly, in a structure in which the light-shielding layer 53 is fixed to the substrate 54, there is a high degree of freedom regarding the shape and thickness of the light-shielding layer 53.

[0063] <Modification of the shape of the light-shielding part> Next, representative modified examples of the light-shielding layer already described will be described. Fig. 11 is an enlarged plan view showing a modified example of the light-shielding layer shown in Fig. 6. Fig. 12 is an enlarged plan view showing a modified example of the light-shielding layer shown in Fig. 7. Fig. 13 is an enlarged cross-sectional view taken along line DD in Figs. 11 and 12. In Fig. 11, the boundaries of each of the multiple light-shielding portions 51LS are shown by two-dot chain lines.

[0064] The display device DSP3 shown in FIGS. 11 to 13 differs from the display device DSP1 shown in FIGS. 6 to 8 in the following respects. First, as shown in FIG. 11, the area of ​​each of the plurality of light-shielding portions 51LS provided in the light-shielding layer 51 (see FIG. 13) of the display device DSP3 is larger than the opening area of ​​each of the plurality of openings 51BL. Also, as shown in FIG. 12, the area of ​​each of the plurality of light-shielding portions 53LS provided in the light-shielding layer 53 (see FIG. 13) of the display device DSP3 is larger than the opening area of ​​each of the plurality of openings 53BL. Also, as shown in FIG. 13, the peripheral portion of each of the plurality of light-shielding portions 51LS overlaps with one of the plurality of light-shielding portions 53LS.

[0065] 11 and 12, each of the plurality of light-shielding portions 51LS and the plurality of light-shielding portions 53LS is hexagonal. Each of the plurality of openings 51BL and the plurality of openings 51BL is rectangular and has a smaller area than each of the plurality of openings 51BL and the plurality of openings 51BL shown in FIGS. 6 and 7. Each of the plurality of light-shielding portions 51LS shown in FIG. 11 is connected to one another. Each of the plurality of light-shielding portions 53LS shown in FIG. 12 is connected to one another.

[0066] In the case of the display device DSP3, the openings 51BL and the opening area of ​​each of the openings 51BL are smaller than those of the display device DSP1 shown in FIGS. 6 to 8, and therefore the total amount of light reaching the resin layer 41 and the resin layer 42 is smaller.

[0067] 13, when the peripheral edge of each of the plurality of light-shielding portions 51LS overlaps with one of the plurality of light-shielding portions 53LS, it is possible to block external light entering from a direction inclined toward the normal direction, in addition to blocking external light entering from the normal direction to the surface 54f of the substrate 54. Therefore, from the viewpoint of suppressing the entry of external light and the emission of reflected light, the display device DSP3 is preferable.

[0068] Except for the differences described above, the display device DSP3 shown in Figures 11 to 13 is similar to the display device DSP1 described with reference to Figures 1 to 10. Therefore, a duplicated description will be omitted.

[0069] <Modification of the Layer Structure of the Light-Shielding Layer> Each of the above-described display devices DSP1 and DSP3 is a display device having a two-layer light-shielding layer. However, the number of layers in the light-shielding layer is not limited to two, and may be three or more. For example, the display device DSP4 shown in FIGS. 14 to 17 is a modified example having a three-layer light-shielding layer.

[0070] Fig. 14 is an enlarged plan view showing another modified example of the light-shielding layer shown in Fig. 6. Fig. 15 is an enlarged plan view showing another modified example of the light-shielding layer shown in Fig. 7. Fig. 16 is an enlarged plan view showing an example of the layout of the light-shielding layer stacked on the substrate shown in Fig. 15. Fig. 17 is an enlarged cross-sectional view taken along the line E-E in Figs. 14, 15, and 16.

[0071] As shown in Figure 17, the display device DSP4 has a resin layer 41 that seals the LED element 20, a light-shielding layer 51 arranged on the resin layer 41, a resin layer 42 arranged on the light-shielding layer 51 (more specifically, on a substrate 52 that supports the light-shielding layer 51), a light-shielding layer 53 arranged on the resin layer 42, a resin layer 43 arranged on the light-shielding layer 53 (more specifically, on a substrate 54 that supports the light-shielding layer 53), and a light-shielding layer 56 arranged on the resin layer 43.

[0072] Like the light-shielding layers 51 and 53, the light-shielding layer 56 is supported by a substrate 57. Like the substrates 52 and 54, the substrate 57 supporting the light-shielding layer 56 is a light-transmitting substrate (for example, a glass substrate or a transparent resin substrate).

[0073] The resin layer 43 is made of an organic material containing a photocurable resin component that is cured by irradiation with light (e.g., ultraviolet light), similar to the resin layers 41 and 42. The resin layers 41, 42, and 43 are made of, for example, the same material.

[0074] The light-shielding layer 51, the light-shielding layer 53, and the light-shielding layer 56 each have a light-shielding member 50 partially disposed thereon.

[0075] 14, the light-shielding layer 51 (see FIG. 17) includes a plurality of light-shielding portions 51LS and a plurality of openings 51BL alternately arranged along the X direction and the Y direction intersecting the X direction. In the X direction, each of the plurality of light-shielding portions 51LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 51BL is arranged at a position overlapping two LED elements 20. Similarly, in the Y direction, each of the plurality of light-shielding portions 51LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 51BL is arranged at a position overlapping two or more LED elements 20.

[0076] 15, the light-shielding layer 53 (see FIG. 17) includes a plurality of light-shielding portions 53LS and a plurality of openings 53BL alternately arranged along the X direction and the Y direction intersecting the X direction. In the X direction, each of the plurality of light-shielding portions 53LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 53BL is arranged at a position overlapping two LED elements 20. Similarly, in the Y direction, each of the plurality of light-shielding portions 53LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 53BL is arranged at a position overlapping two or more LED elements 20.

[0077] 16, the light-shielding layer 56 (see FIG. 17) includes a plurality of light-shielding portions 56LS and a plurality of openings 56BL alternately arranged along the X direction and the Y direction intersecting the X direction. In the X direction, each of the plurality of light-shielding portions 56LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 56BL is arranged at a position overlapping two LED elements 20. Similarly, in the Y direction, each of the plurality of light-shielding portions 56LS is arranged at a position overlapping one LED element 20, and each of the plurality of openings 56BL is arranged at a position overlapping two or more LED elements 20.

[0078] Each of the plurality of light-shielding portions 51LS (see FIG. 14), the plurality of light-shielding portions 53LS (see FIG. 15), and the plurality of light-shielding portions 56LS (see FIG. 16) has an opening 50TH arranged at a position overlapping one of the plurality of LED elements 20. The opening area of ​​the opening 50TH is smaller than the opening area of ​​the opening 51BL (see FIG. 14), the opening 53BL (see FIG. 15), and the opening 56BL (see FIG. 16).

[0079] Each of the plurality of light-shielding portions 51LS shown in Fig. 14 overlaps with one of the plurality of openings 53BL shown in Fig. 15 and also overlaps with one of the plurality of openings 56BL shown in Fig. 16. Each of the plurality of light-shielding portions 53LS shown in Fig. 15 overlaps with one of the plurality of openings 51BL shown in Fig. 14 and also overlaps with one of the plurality of openings 56BL shown in Fig. 16. Each of the plurality of light-shielding portions 56LS shown in Fig. 16 overlaps with one of the plurality of openings 51BL shown in Fig. 14 and also overlaps with one of the plurality of openings 53BL shown in Fig. 15.

[0080] Furthermore, each of the plurality of openings 51BL shown in Fig. 14 overlaps with one of the plurality of light-shielding portions 53LS shown in Fig. 15 or one of the plurality of light-shielding portions 56LS shown in Fig. 16. Each of the plurality of openings 53BL shown in Fig. 15 overlaps with one of the plurality of light-shielding portions 51LS shown in Fig. 14 or one of the plurality of light-shielding portions 56LS shown in Fig. 16. Each of the plurality of openings 56BL shown in Fig. 16 overlaps with one of the plurality of light-shielding portions 51LS shown in Fig. 14 or one of the plurality of light-shielding portions 53LS shown in Fig. 15.

[0081] In this modified example, by using a three-layer structure for the light-shielding layer, it is possible to reduce the light-shielding rate of each of the light-shielding layers 51, 53, and 56 (in other words, increase the aperture ratio) compared to the example described with reference to Figures 6 to 8. Therefore, it is possible to increase the amount of light irradiated onto the resin layers in the steps of curing each of the resin layers 41, 42, and 43 shown in Figure 17 compared to the example described with reference to Figures 6 to 8.

[0082] 10, when the light-shielding layer 51, the light-shielding layer 53, and the light-shielding layer 56 are overlapped, the substrate SUB1 shown in FIG. 17 is covered with any one of the plurality of light-shielding portions 51LS, the plurality of light-shielding portions 53LS, or the plurality of light-shielding portions 56LS in the portion other than the plurality of openings 50TH in a transmitted plan view. Therefore, like the display device DSP1 described above, the display device DSP4 can suppress the intrusion of external light and the emission of reflected light.

[0083] Although the present modified example has been described with reference to a three-layer structure, there are also cases where four or more light-shielding layers are used. However, as the number of light-shielding layers increases, the number of steps for curing the resin layers also increases. Therefore, in consideration of manufacturing efficiency, the two-layer structure shown in Figures 6 to 8 or the three-layer structure shown in Figures 14 to 17 are particularly preferable.

[0084] Except for the differences described above, the display device DSP4 shown in Figures 14 to 17 is similar to the display device DSP1 described with reference to Figures 1 to 10. Therefore, a duplicated description will be omitted.

[0085] Although the embodiment and representative modifications have been described above, the above-described technology can be applied to various modifications other than the modifications exemplified. For example, the above-described modifications may be combined with each other.

[0086] Within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications and alterations, and it is understood that these modifications and alterations also fall within the scope of the present invention. For example, to the above-described embodiments, a person skilled in the art may appropriately add, delete, or modify components, or add, omit, or change conditions of steps, and these modifications are also included within the scope of the present invention as long as they maintain the gist of the present invention. [Industrial Applicability]

[0087] The present invention can be used in display devices and electronic devices incorporating display devices. [Explanation of symbols]

[0088] 5 Control circuit 6 Drive circuit 10, 52, 54, 57, SUB1 board 10b,10f,20b,20f,54f,SUBf surface 11, 12, 13, 14 Inorganic insulating layer 14H opening 20 LED elements (light-emitting diode elements) 20EA anode electrode 20EC cathode electrode 31,32 Wiring 33 Bump electrode 41, 42, 43 Resin layer 50 Light-shielding member 50TH opening 51,53,55,56 Light shielding layer 51BL,53BL,56BL opening 51LS,53LS,56LS Light shielding part DA display area DSP1,DSP2,DSP3,DSP4 Display device ED drain electrode EG gate electrode ES source electrode GL scanning signal line Gs control signal PFA surrounding area PIX, PIX1, PIX2, PIX3 pixels PVS reference potential (fixed potential) SCL semiconductor layer SW Switching element VL wiring (video signal wiring) Vsg video signal VSL wiring

Claims

1. a plurality of light emitting diode elements mounted on a first substrate; a first resin layer that encapsulates the plurality of light-emitting diode elements; a first light-shielding layer disposed on the first resin layer; a second resin layer disposed on the first light-shielding layer; a second light-shielding layer disposed on the second resin layer; and each of the first resin layer and the second resin layer is made of an organic material containing a photocurable resin component that is cured by irradiation with light; the first light-shielding layer includes a plurality of first light-shielding portions and a plurality of first openings alternately arranged along a first direction and a second direction intersecting the first direction, the second light-shielding layer includes a plurality of second light-shielding portions and a plurality of second openings alternately arranged along the first direction and the second direction, each of the plurality of first light-shielding portions and the plurality of second light-shielding portions includes a third opening portion disposed at a position overlapping with any one of the plurality of light-emitting diode elements; an opening area of ​​the third opening is smaller than an opening area of ​​the first opening and an opening area of ​​the second opening; each of the plurality of first light-shielding portions is disposed at a position overlapping with one of the plurality of second openings; A display device, wherein each of the plurality of second light-shielding portions is disposed at a position overlapping one of the plurality of first openings.

2. In claim 1, a light-transmitting second substrate is interposed between the first resin layer and the second resin layer, and the first light-shielding layer is fixed to the second substrate.

3. In claim 2, a light-transmitting third substrate is provided on the second resin layer; The display device, wherein the second light-shielding layer is fixed to the third substrate.

4. In claim 1, each of the plurality of first openings is disposed at a position overlapping with one of the plurality of second light-shielding portions; A display device, wherein each of the plurality of second openings is arranged at a position overlapping one of the plurality of first light-shielding portions.

5. In claim 4, a display device, wherein the plurality of first light-shielding portions, the plurality of second light-shielding portions, the plurality of first openings, and the plurality of second openings each have a rectangular opening shape;

6. In claim 4, an area of ​​each of the plurality of first light-shielding portions is equal to an opening area of ​​each of the plurality of first openings, a display device in which the area of ​​each of the plurality of second light-shielding portions is equal to the opening area of ​​each of the plurality of second openings;

7. In claim 4, an area of ​​each of the plurality of first light-shielding portions is larger than an opening area of ​​each of the plurality of first openings; an area of ​​each of the plurality of second light-shielding portions is larger than an opening area of ​​each of the plurality of second openings; A display device, wherein a peripheral portion of each of the plurality of first light-shielding portions overlaps with one of the plurality of second light-shielding portions.

8. In claim 1, A display device, wherein a wiring pattern connected to any one of the plurality of light emitting diode elements is formed between the first substrate and the plurality of light emitting diode elements.

9. In claim 1, any one of the plurality of light-emitting diode elements is disposed at a position overlapping with each of the plurality of first light-shielding portions and the plurality of first openings; a display device in which any one of the plurality of light-emitting diode elements is disposed at a position overlapping with each of the plurality of second light-shielding portions and the plurality of second openings.

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