Panel substrate and method for manufacturing display module using the same

Abstract

To provide an improved technique of panels.SOLUTION: The panel substrate of the present invention includes: a mother substrate including a plurality of cell regions and a peripheral region surrounding the plurality of cell regions; and a protective layer disposed under the mother substrate and including the mother substrate. The protective layer includes: a plurality of main parts overlapping the plurality of cell regions; and a plurality of bridge patterns overlapping the peripheral region and connecting main parts adjacent to each other among the plurality of main parts.SELECTED DRAWING: Figure 8B

Description

[Technical Field]

[0001] The present invention relates to a panel and a method for manufacturing a display module using the same, and more particularly to a panel with improved reliability and a method for manufacturing a display module using the same. [Background technology]

[0002] 2. Description of the Related Art Electronic devices including display devices such as smartphones, digital cameras, laptops, navigation systems, and smart televisions provide users with images via their display screens.

[0003] A display device may include a display panel that provides image information and a protective layer that protects the display panel from external influences. The protective layer protects the display panel from external influences by preventing deformation of the display panel due to external impacts and effectively dissipating heat generated from the display panel. To provide various functions for protecting the display panel, the protective layer may have a structure in which multiple functional layers are stacked. Meanwhile, research is also being conducted on electronic devices that use a single-layer protective layer that integrally has various functions for protecting the display panel, and methods for controlling the same. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Korean Patent Publication No. 2019-0107214 Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a panel substrate with improved reliability and an electronic module including the same. [Means for solving the problem]

[0006] A panel substrate according to one embodiment of the present invention includes a mother substrate including a plurality of cell regions and a peripheral region surrounding the plurality of cell regions, and a protective layer disposed under the mother substrate, the protective layer including a plurality of main parts overlapping the plurality of cell regions and a plurality of bridge patterns overlapping the peripheral region and connecting adjacent main parts among the plurality of main parts.

[0007] The main part may include a first main part, a second main part spaced apart from the first main part in a first direction, and a third main part spaced apart from the first main part in a second direction intersecting the first direction.

[0008] The bridge pattern may include a first bridge pattern connecting the first main part and the second main part to each other, and a second bridge pattern connecting the first main part and the third main part to each other.

[0009] The first bridge pattern and the second bridge pattern may each be provided in plural numbers.

[0010] The second bridge patterns may extend in the second direction and be aligned in the first direction.

[0011] The first bridge pattern and the second bridge pattern may have different shapes.

[0012] The first bridge pattern may have a zigzag shape in the second direction.

[0013] The second bridge pattern may include a first portion and a second portion extending from the first portion, and a first width of the first portion in the first direction and a second width of the second portion in the first direction may be different from each other.

[0014] The main part may further include a fourth main part spaced apart from the first main part in a second direction intersecting the first direction, and a fifth main part spaced apart from the first main part in a direction opposite to the second direction.

[0015] The bridge pattern may further include a third bridge pattern connecting the first main part and the fourth main part to each other, and a fourth bridge pattern connecting the first main part and the fifth main part to each other.

[0016] A first distance between the first main part and the second main part and a second distance between the first main part and the third main part may be the same.

[0017] The main portions may each have a rectangular shape on a plane, and each of the bridge patterns may connect one surface of one of the main portions to one surface of an adjacent main portion.

[0018] The main parts may have the same shape and size.

[0019] The number of bridge patterns arranged in the central region of the protective layer may be greater than the number of bridge patterns arranged in the outer region surrounding the central region.

[0020] The thickness of the main portion and the thickness of the bridge pattern may be different from each other.

[0021] The bridge patterns may extend from each of the main portions.

[0022] According to an embodiment of the present invention, a method for manufacturing a display module includes providing a mother substrate including a plurality of cell regions and a peripheral region surrounding the plurality of cell regions, forming a panel substrate by forming a protective layer on the mother substrate, and cutting the panel substrate to form a display module. The protective layer may include a plurality of main parts overlapping the plurality of cell regions and a plurality of bridge patterns overlapping the peripheral region and connecting adjacent main parts of the plurality of main parts.

[0023] The step of forming the protective layer may include the steps of applying a resin composition on the upper surface of the mother substrate to form a preliminary protective layer, and curing the preliminary protective layer.

[0024] In the step of forming the preliminary protective layer, the step of applying the resin composition may be performed by a screen printing process or a slit coating process.

[0025] The step of cutting the panel substrate may include a first step of cutting the panel substrate along a cutting line overlapping the peripheral region, and a second step of cutting a plurality of sub-panel substrates corresponding to the plurality of cell regions.

[0026] The method for manufacturing a display module according to an embodiment of the present invention may further include transferring the panel substrate after forming the panel substrate.

[0027] The mother substrate may include a preliminary base layer, a preliminary circuit layer disposed on the preliminary base layer, and a preliminary light emitting element layer disposed on the preliminary circuit layer. [Effects of the Invention]

[0028] By disposing a plurality of bridge patterns under the mother substrate during the transfer of the panel substrate, the tensile force applied to the mother substrate is dispersed, reducing the possibility of damage to the mother substrate, thereby improving the reliability of the display module formed using the panel substrate. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a perspective view of an electronic device according to an embodiment of the present invention; [Figure 2] 1 is an exploded perspective view of an electronic device according to an embodiment of the present invention; [Figure 3] 1 is a cross-sectional view of a display panel according to an embodiment of the present invention. [Figure 4A]1 is a plan view of a display module according to an embodiment of the present invention; [Figure 4B] FIG. 2 is a rear view of a display module according to an embodiment of the present invention. [Figure 5A] 1 is a cross-sectional view showing a partial configuration of an electronic device according to an embodiment of the present invention. [Figure 5B] 1 is a cross-sectional view showing a partial configuration of an electronic device according to an embodiment of the present invention. [Figure 6A] 3 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention. [Figure 6B] 3 is a flowchart illustrating some steps of a method for manufacturing a display module according to an embodiment of the present invention. [Figure 7A] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 7B] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 8A] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 8B] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 9A] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 9B] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 10A] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 10B] 2A to 2C are diagrams illustrating some steps in a method for manufacturing a display module according to an embodiment of the present invention. [Figure 11A] FIG. 10 is a plan view showing a panel substrate according to another embodiment of the present invention. [Figure 11B] FIG. 10 is a plan view showing a panel substrate according to another embodiment of the present invention. [Figure 11C]FIG. 10 is a plan view showing a panel substrate according to another embodiment of the present invention. [Figure 11D] FIG. 10 is a plan view showing a panel substrate according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] Because the present invention can be modified in various ways and can take various forms, specific embodiments are shown by way of example in the drawings and described in detail herein, but it is to be understood that this is not intended to limit the invention to the particular disclosed form, but rather to include all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.

[0031] As used herein, when a component (or region, layer, portion, etc.) is referred to as being "on" or "coupled" to another component, it means that it may be directly positioned, coupled, or connected to the other component, or that a third component may be disposed therebetween.

[0032] The same reference numerals refer to the same components, and in the drawings, thickness, proportions, and dimensions of the components are exaggerated for the purpose of effectively explaining the technical contents.

[0033] "And / or" includes all combinations of one or more of the associated constructs.

[0034] Terms such as "first" and "second" are used to describe various components, but the components are not limited to these terms. These terms are used only to distinguish one component from another. For example, a first component may be designated as a "second component" without departing from the scope of the present invention, and similarly, a second component may be designated as a "first component." A singular expression includes a plural expression unless the context clearly dictates otherwise.

[0035] Furthermore, terms such as "under," "below," "on," and "above" are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0036] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted to have a meaning consistent with the meaning in the context of the relevant art, and are expressly defined herein unless interpreted in an idealized or overly formal sense.

[0037] It should be understood that the terms "comprise" or "have" and the like specify the presence of any feature, numeral, step, operation, component, part, or combination thereof set forth above in the specification, but do not preclude the possible presence or addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof.

[0038] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0039] 1 and 2 are perspective and exploded views of an electronic device according to an embodiment of the present invention.

[0040] 1 and 2, the electronic device ED may be a device activated by an electrical signal. For example, the electronic device ED may be, but is not limited to, a mobile phone, a tablet, a car navigation system, a game console, or a wearable device. In FIG. 1, the electronic device ED is illustratively shown as a mobile phone.

[0041] The electronic device ED may display an image IM through an active area AA-ED. The active area AA-ED may include a plane defined by a first direction DR1 and a second direction DR2. The active area AA-ED may further include a curved surface bent from at least one side of the plane defined by the first direction DR1 and the second direction DR2. The electronic device ED of the embodiment shown in FIG. 1 is illustrated as including two curved surfaces bent from both sides of the plane defined by the first direction DR1 and the second direction DR2. However, the shape of the active area AA-ED is not limited thereto. For example, the active area AA-ED may include only the plane, or may further include curved surfaces bent from at least two or more, e.g., four, sides of the plane.

[0042] Meanwhile, although FIG. 1 and the following drawings show the first direction DR1 to the third direction DR3, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 described in this specification are relative concepts and may be converted to other directions.

[0043] In this specification, the first direction DR1 and the second direction DR2 are perpendicular to each other, and the third direction DR3 may be a normal direction to a plane defined by the first direction DR1 and the second direction DR2. Meanwhile, in this specification, the meaning of "on a plane" may refer to a view on a plane defined by the first direction DR1 and the second direction DR2, and the thickness direction may refer to the third direction DR3, which is a normal direction to the plane defined by the first direction DR1 and the second direction DR2.

[0044] The electronic device ED may include an active area AA-ED and a peripheral area NAA-ED adjacent to the active area AA-ED. The active area AA-ED corresponds to the active area AA of the display panel DP, which will be described later, and the peripheral area NAA-ED may be a portion corresponding to the peripheral area NAA of the display panel DP.

[0045] The peripheral area NAA-ED is an area that blocks optical signals and may be located outside the active area AA-ED and surround the active area AA-ED. In one embodiment, the peripheral area NAA-ED may be located on the side of the electronic device ED rather than on the front. In one embodiment, the peripheral area NAA-ED may be omitted.

[0046] The electronic device ED of the present invention may include a window WM, an upper member UM, a display module DM, and a housing HU. Although not shown, the electronic device ED of the present invention may further include an electronic module housed in the housing HU. The electronic module may be an electronic component that outputs or receives an optical signal. For example, the electronic module may include a camera module and a sensor module.

[0047] The window WM provides the outer surface of the electronic device ED. The window WM covers the front surface of the display panel DP and can protect the display panel DP from external impacts and scratches. The window WM can be bonded to the upper member UM via an adhesive layer.

[0048] The window WM may include an optically transparent insulating material. For example, the window WM may include a glass film or a synthetic resin film as a base film. The window WM may have a single-layer or multi-layer structure. For example, the window WM may include multiple plastic films bonded together with an adhesive, or may include a glass film and a plastic film bonded together with an adhesive. The window WM may further include a functional layer, such as an anti-fingerprint layer, a phase control layer, or a hard coating layer, disposed on the transparent film.

[0049] The upper member UM may be disposed between the window WM and the display module DM. The upper member UM may include an anti-reflection layer and an input detection sensor. The anti-reflection layer reduces the reflectance of external light. The input detection sensor detects an external input from a user. The upper member UM may further include an adhesive layer that bonds the anti-reflection layer and the input detection sensor.

[0050] A display module DM may be disposed below the upper member UM. The display module DM may include a display panel DP and a protective layer PL disposed below the display panel DP.

[0051] The display panel DP may include an active area AA where an image IM is displayed and a peripheral area NAA adjacent to the active area AA. That is, the front surface of the display panel DP may include the active area AA and the peripheral area NAA. The active area AA may be an area activated by an electrical signal to generate the image IM to be displayed in the active areas AA-ED of the electronic device ED.

[0052] The peripheral area NAA may be adjacent to the active area AA or may surround the active area AA. The peripheral area NAA may include drive circuits and drive wiring for driving the active area AA, various signal lines and pads for providing electrical signals to the active area AA, and electronic elements.

[0053] The display panel DP may include a first non-folding region NBA1, a second non-folding region NBA2, and a folding region BA defined between the first non-folding region NBA1 and the second non-folding region NBA2. The folding region BA may be defined as a portion that can be folded based on a predetermined axis extending in the first direction DR1. By folding the display panel DP in the folding region BA, the display panel DP in the second non-folding region NBA2 may be disposed below the display panel DP in the first non-folding region NBA1. The folding region BA is located between the first non-folding region NBA1 located on one side of the first direction DR1 and the second non-folding region NBA2 located on the other side of the first direction DR1, and extends with the second direction DR2 as its longitudinal direction. By bending, curving, or otherwise folding the folding region BA in the second direction DR2, the display panel DP in the second non-folding region NBA2 may be disposed below the display panel DP in the first non-folding region NBA1, as shown in FIG. 5B .

[0054] The first non-folding area NBA1 of the display panel DP may include an active area AA including pixels. The remaining area of ​​the first non-folding area NBA1 excluding the active area AA, the folding area BA, and the second non-folding area NBA2 may correspond to the peripheral area NAA.

[0055] A driver chip DIC for driving the display panel DP may be mounted in the second non-folding area NBA2 of the display panel DP. The display panel DP may include a plurality of display pads disposed adjacent to an end of the second non-folding area NBA2. A circuit board PCB may be disposed at an end portion of the second non-folding area MBA2 of the display panel DP. The plurality of display pads may be connected to the circuit board PCB in the second non-folding area NBA2. However, embodiments of the present invention are not limited thereto, and the driver chip DIC may be mounted on the circuit board PCB as needed.

[0056] The circuit board PCB may overlap the second non-bending region NBA2. The circuit board PCB may transmit signals for controlling the image IM and power signals from a main board in the display device DD to the display panel DP. The circuit board PCB may be a flexible circuit board. The circuit board PCB may include circuit pads disposed adjacent to an end thereof. The circuit pads may be connected to the display pads, thereby electrically connecting the circuit board PCB and the display panel DP.

[0057] The display panel DP may include a light-emitting element layer DP-ED (see FIG. 3) including organic light-emitting elements, quantum dot light-emitting elements, micro LED light-emitting elements, nano LED light-emitting elements, etc. The light-emitting element layer DP-ED (see FIG. 3) may be configured to substantially generate an image.

[0058] The protective layer PL may be disposed below the display panel DP. The protective layer PL may be a member that supports the display panel DP, absorbs impacts applied to the display panel DP, and performs a heat dissipation function by dissipating heat generated from components disposed below the display panel DP, such as the electronic module EM.

[0059] The housing HU may be disposed below the display module DM. The housing HU may be coupled to the window WM. The housing HU may be coupled to the window WM to provide a predetermined internal space. The display module DM and the upper member UM may be housed in the internal space of the housing HU.

[0060] The housing HU may include a material having a relatively high rigidity. For example, the housing HU may include glass, plastic, or metal, or may include a plurality of frames and / or plates made of a combination of these. The housing HU may stably protect the components of the electronic device ED housed within its internal space from external impacts.

[0061] FIG. 3 is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0062] Referring to FIG. 3, the display panel DP may include a base layer BL, a circuit layer DP-CL disposed on the base layer BD, a light-emitting element layer DP-ED, and an encapsulation layer ENL.

[0063] The base layer BL may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate. For example, the base layer BL may include at least one polyimide layer. The protective layer PL may be disposed below the base layer BL.

[0064] The circuit layer DP-CL includes at least one insulating layer, a semiconductor pattern, and a conductive pattern. The insulating layer includes at least one inorganic layer and at least one organic layer. The semiconductor pattern and the conductive pattern may form signal lines, pixel driving circuits, and scan driving circuits. The circuit layer DP-CL may also include a backside metal layer.

[0065] The light-emitting element layer DP-ED includes a display element, such as a light-emitting element. For example, the light-emitting element can be an organic light-emitting element, a quantum dot light-emitting element, a micro LED light-emitting element, or a nano LED light-emitting element. The light-emitting element layer DP-ED can further include an organic film such as a pixel-defining film.

[0066] The light emitting device layers DP-ED may be disposed in the active area AA. The peripheral area NAA may be disposed on the outer periphery of the active area AA and surround the active area AA, and light emitting devices may not be disposed in the peripheral area NAA.

[0067] The encapsulation layer ENL may be disposed on the light-emitting element layer DP-ED to cover the light-emitting element layer DP-ED. The encapsulation layer ENL may be disposed on the circuit layer DP-CL to seal the light-emitting element layer DP-ED. The encapsulation layer ENL may be a thin-film encapsulation layer including a plurality of organic thin films and inorganic thin films. The encapsulation layer ENL may include a thin-film encapsulation layer including a laminated structure of inorganic layer / organic layer / inorganic layer. The laminated structure of the encapsulation layer ENL is not particularly limited.

[0068] 4A and 4B are plan and rear views of a display module according to an embodiment of the present invention.

[0069] 4A and 4B, the display module DM may include a display panel DP and a protective layer PL disposed below the display panel DP. The display module DM may consist of the display panel DP and the protective layer PL.

[0070] The protective layer PL may be disposed directly below the display panel DP. The protective layer PL may include a first protective layer PL1 overlapping the first non-bending region NBA1 and a second protective layer PL2 overlapping the second non-bending region NBA2. The first protective layer PL1 and the second protective layer PL2 may be made of substantially the same material except for the overlapping regions. For example, the first protective layer PL1 and the second protective layer PL2 may be formed simultaneously using the same material and the same process. The first protective layer PL1 and the second protective layer PL2 may have substantially the same thickness. In this specification, the term "substantially the same" refers not only to cases where the thickness of components is completely the same physically, but also to cases where there is a difference within the tolerance range that occurs during the process despite the same design.

[0071] 5A and 5B are cross-sectional views showing a partial configuration of an electronic device according to an embodiment of the present invention. Fig. 5A shows an electronic device ED according to an embodiment of the present invention in a state where the display panel DP is not folded, and Fig. 5B shows an electronic device ED according to an embodiment of the present invention in a state where the folding area BA of the display panel DP is folded. Hereinafter, the same or similar reference numerals will be used for components that are the same as or similar to those described in Figs. 1 to 4B, and redundant descriptions will be omitted.

[0072] 5A and 5B, an electronic device ED according to an embodiment of the present invention may include a window WM, an upper member UM, and a display module DM (a display panel DP and a protective layer PL). The electronic device ED may include a front surface and a back surface, and the front surface of the electronic device ED may be defined by the window WM, and the back surface of the electronic device ED may be defined by the protective layer PL.

[0073] The window WM may cover the front surface of the display panel DP. The window WM may include a base substrate (not shown) and a bezel pattern (not shown). The base substrate (not shown) may include a transparent base layer such as a glass substrate or a transparent film. The bezel pattern (not shown) may have a multi-layer structure. The multi-layer structure may include a colored color layer and a black light-shielding layer.

[0074] The upper member UM includes an anti-reflection layer UM-1 and an input sensor UM-2. The window WM and the anti-reflection layer UM-1 may be bonded together via a first adhesive layer AL1, and the anti-reflection layer UM-1 and the input sensor UM-2 may be bonded together via a second adhesive layer AL2. Alternatively, at least one of the first adhesive layer AL1 and the second adhesive layer AL2 may be omitted. For example, the second adhesive layer AL2 may be omitted, and the anti-reflection layer UM-1 may be disposed directly on the input sensor UM-2.

[0075] The anti-reflection layer UM-1 may reduce the reflectance of external light. The anti-reflection layer UM-1 may include a phase retarder and / or a polarizer. The anti-reflection layer UM-1 may include a polarizing film or a color filter. The color filter may have a predetermined arrangement. The arrangement of the color filter may be determined taking into account the emission color of the pixels included in the display panel DP. The anti-reflection layer UM-1 may further include a dividing layer adjacent to the color filter.

[0076] The input sensor UM-2 may include a plurality of sensing electrodes (not shown) for sensing an external input, trace lines (not shown) connected to the plurality of sensing electrodes, and an inorganic and / or organic layer for insulating / protecting the plurality of sensing electrodes or trace lines. The input sensor UM-2 may be, but is not limited to, a capacitance sensor.

[0077] The input sensor UM-2 may be formed directly on the thin film encapsulation layer through a continuous process when manufacturing the display panel DP, but is not limited thereto. The input sensor UM-2 may also be manufactured as a separate panel from the display panel DP and attached to the display panel DP by an adhesive layer.

[0078] The display module DM may include a display panel DP and a protective layer PL disposed below the display panel DP. The protective layer PL may be disposed directly below the display panel DP. The protective layer PL may contact the lower surface of the display panel DP. A separate adhesive member may not be disposed between the protective layer PL and the display panel DP. The thickness of the protective layer PL may be 50 μm or more and 300 μm or less. For example, the thickness of the protective layer PL may be 100 μm or more and 200 μm or less.

[0079] In one embodiment of the display module DM, a single-layer protective layer PL may be provided on the lower surface of the display panel DP. The protective layer PL supports the display panel DP, absorbs impacts applied to the display panel DP, and may be a member that performs a heat dissipation function by dissipating heat generated from a configuration disposed below the display panel DP, such as an electronic module. In the electronic device ED according to one embodiment, the single-layer protective layer PL simultaneously performs the functions of impact absorption and heat dissipation, thereby reducing the thickness of the electronic device ED, simplifying components, and improving process efficiency when manufacturing the electronic device ED according to one embodiment. However, the present invention is not limited thereto, and although not shown, the electronic device ED according to one embodiment may further include at least one of an impact absorbing layer, a heat dissipation layer, a shielding layer, or a support layer disposed below the protective layer PL, if necessary.

[0080] The protective layer PL may include a base resin. The protective layer PL may include a base resin having a curing property. For example, the protective layer PL may include a thermosetting resin or a photocurable resin. The protective layer PL may include at least one of a curing acrylic resin, a urethane resin, a fluorine-based resin, an epoxy resin, a polyester resin, a polyamide resin, and a silicone resin. The protective layer PL may further include a plurality of fillers dispersed in the base resin. Each of the plurality of fillers may perform a shielding function, a heat dissipation function, or a shock absorption function. The filler is preferably an insulating material, such as, but not limited to, aluminum oxide, magnesium oxide, aluminum nitride, or boron nitride. Other fillers may include, but are not limited to, carbonaceous materials such as graphite, graphene, carbon black, carbon fiber, and carbon nanotubes.

[0081] As shown in FIGS. 4A to 5B, the protective layer PL may include a first protective layer PL1 overlapping the first non-bending region NBA1 and a second protective layer PL2 overlapping the second non-bending region NBA2. On a plane defined by the first direction DR1 and the second direction DR2, the first protective layer PL1 and the second protective layer PL2 do not overlap with the bending region BA sandwiched therebetween. The absence of the protective layer PL in the bending region BA may reduce stress generated in the circuit layer DP-CL (see FIG. 3) when the display panel DP is bent. For example, FIG. 3 may be a cross-sectional view of the display panel DP of FIG. 2, taken along a plane including the second direction DR2 and the third direction DR3, through the first non-bending region NBA1. The circuit layer DP-CL may be formed only in the first non-bending region NBA1. Here, when the bending region BA does not include the protective layer PL, bending of the bending region BA is easier than when the bending region BA includes the protective layer PL. Furthermore, because the bending area BA can be easily bent, the bending stress can be largely contained within the bending area BA, and the bending stress transmitted to the first non-bending area NBA1 and the second non-bending area NBA2 can be kept small, thereby preventing damage to the circuit layer DP-CL in the first non-bending area NBA1 and the circuit board PCB in the second non-bending area NBA2. 4A to 5B, as described above, the protective layer PL includes a first protective layer PL1 overlapping the first non-bending region NBA1 and a second protective layer PL2 overlapping the second non-bending region NBA2. Between the first protective layer PL1 and the second protective layer PL2, there is a bending region BA where the protective layer PL is not disposed. However, the arrangement region of the protective layer PL is not limited to this. For example, the protective layer PL may be disposed only in the first non-bending region NBA1, or in the first non-bending region NBA1 and the bending region BA, or in the first and second non-bending regions NBA1 and NBA2 and the bending region BA. However, in order to reduce bending stress generated in the circuit layer DP-CL when the display panel DP is bent, it is preferable that the protective layer PL not be disposed in the bending region BA. In the above description, the circuit layer DP-CL of the display panel DP is formed in the first non-bending region NBA1, but not in the bending region BA. However, for example, the circuit layer DP-CL of the display panel DP may be formed across the first non-bending region NBA1 and the bending region BA, or across the first non-bending region NBA1, the bending region BA, and the second non-bending region NBA2. In this case, it is preferable that the circuit layer DP-CL be made of a material that is easily bent.

[0082] FIG. 6A is a flowchart showing a method for manufacturing a display module according to an embodiment of the present invention. FIG. 6B is a flowchart showing some steps of a method for manufacturing a display module according to an embodiment of the present invention. FIGS. 7A to 10B are views showing some steps of a method for manufacturing a display module according to an embodiment of the present invention. The method for manufacturing a display module according to the present invention may represent a method for manufacturing the display module DM described with reference to FIGS. 1 to 5B. In the following description of a method for manufacturing a display module DM according to an embodiment of the present invention with reference to FIGS. 6A to 10B, the same reference numerals are used to designate the same components as those previously described, and detailed description thereof will be omitted.

[0083] 6A, a method for manufacturing a display module according to an embodiment of the present invention may include step S100 of providing a mother substrate, step S200 of forming a panel substrate by forming a protective layer on the mother substrate, step S300 of transferring the panel substrate, and step S400 of cutting the panel substrate to form a display module. Referring to FIG. 6B, in the method for manufacturing a display module according to an embodiment of the present invention, step S200 of forming a panel substrate by forming a protective layer on the mother substrate may include step S210 of forming a preliminary protective layer and step S220 of curing the preliminary protective layer.

[0084] 6A, 7A, and 7B, step S100 of providing a mother substrate MB may be performed. The mother substrate MB may include a plurality of cell regions CA and a peripheral region NCA surrounding each of the cell regions CA. The cell regions CA may be spaced apart from each other in a first direction DR1 and a second direction DR2. Adjacent cell regions CA among the plurality of cell regions CA may be spaced apart at equal intervals in the first direction DR1 and the second direction DR2. A space between the plurality of cell regions CA may be defined as a peripheral region NCA. Each of the plurality of cell regions CA may have a rectangular shape. The size and pattern of each of the plurality of cell regions CA may be the same. However, the size and pattern of each of the plurality of cell regions CA may be different from each other.

[0085] Although not shown, the mother substrate MB may include a spare base layer, a spare circuit layer disposed on the spare base layer, and a spare light-emitting element layer disposed on the spare circuit layer. The configurations of the spare base layer, the spare circuit layer, and the spare light-emitting element layer may be the same as those of the base layer BL, the circuit layers DP-CL, and the light-emitting element layers DP-ED shown in FIG. 3. In other words, the mother substrate MB is an apparatus used in an intermediate step of manufacturing the display panel DP and may be referred to as a spare display panel. The mother substrate MB may then be cut to correspond to a plurality of cell areas CA. The mother substrate MB cut to correspond to one cell area CA may be one component of the display module DM shown in FIG. 1. The cell area CA may be, for example, the active area AA shown in FIGS. 2 and 3. The active area AA may include the light-emitting element layers DP-ED. The peripheral area NCA may be, for example, the peripheral area NAA shown in FIGS. 2 and 3. The peripheral area NAA may include the remaining area of ​​the first non-folding area NBA1 excluding the active area AA, the folding area BA, and the second non-folding area NBA2.

[0086] 6A, 8A, and 8B, step S200 may be performed in which a protective layer PL' is formed on a mother substrate MB to form a panel substrate PB. The panel substrate PB may include a mother substrate MB and a protective layer PL' formed on the mother substrate MB. The protective layer PL' may correspond to the protective layer PL shown in FIG. 2. However, without being limited thereto, the protective layer PL' may be a component of an upper member UM disposed on a display module DM.

[0087] Referring to FIG. 8A, a resin composition RS may be applied onto a mother substrate MB using a nozzle NZ. The nozzle NZ moves in a first direction DR1 above the mother substrate MB to apply the resin composition RS onto the mother substrate MB. The resin composition RS may include a curable resin. The resin composition RS may include at least one of an acrylic resin, a urethane resin, a fluorine resin, an epoxy resin, a polyester resin, a polyamide resin, and a silicone resin, which have curing properties. The curable resin included in the resin composition RS may be in a liquid form before being cured.

[0088] According to an embodiment of the present invention, the resin composition RS may be applied onto the mother substrate MB by any one of a spin coating method, a slit coating method, a jet printing method, a metal mask printing method, and a screen printing method. For example, the resin composition RS may be applied by a screen printing process or a slit coating process.

[0089] The resin composition RS can be directly applied onto the mother substrate MB, thereby improving the reliability of the electronic device ED including the display panel DP and the protective layer PL, without requiring a separate adhesive layer between the display panel DP and the protective layer PL (shown in FIG. 2) that will be formed later.

[0090] 6B, 8A, and 8B, the step of forming the protective layer PL′ may include step S210 of forming a preliminary protective layer PPL and step S220 of curing the preliminary protective layer PPL. The preliminary protective layer PPL may be a resin composition RS in a liquid state before curing. That is, the preliminary protective layer PPL may be formed by applying the resin composition RS in a liquid state before curing onto the mother substrate MB. Next, the protective layer PL′ may be formed by applying light to the preliminary protective layer PPL. For example, the light may be ultraviolet light having a center wavelength in the wavelength range of 100 nm to 400 nm. The preliminary protective layer PPL may include a curable resin and be photocured by applying light. However, this embodiment of the present invention is not limited thereto, and step S220 of curing the preliminary protective layer PPL may also be a step of applying heat to the preliminary protective layer PPL to form the protective layer PL′. That is, the preliminary protective layer PPL may be thermally cured by applying heat.

[0091] The resin composition RS may be uniformly applied on the mother substrate MB. However, the resin composition RS may not be applied to some regions on the mother substrate MB. That is, as shown in FIG. 8B, the protective layer PL' formed on the mother substrate MB may be applied to the cell region CA (see FIG. 7B) and part of the peripheral region NCA (see FIG. 7B) of the mother substrate MB. According to one embodiment of the present invention, the protective layer PL' may include a plurality of main portions MP and a plurality of bridge patterns BP connecting the plurality of main portions MP to each other.

[0092] The plurality of main parts MP may be arranged corresponding to the plurality of cell regions CA of the mother substrate MB shown in FIG. 7B. The cell regions CA may be, for example, the active regions AA shown in FIGS. 2 and 3, and may include light-emitting element layers DP-ED. Accordingly, the plurality of main parts MP may have a rectangular shape similar to the plurality of cell regions CA. The sizes and patterns of the plurality of main parts MP may be the same as each other. However, without being limited thereto, the sizes and patterns of the plurality of main parts MP may be different from each other. The plurality of main parts MP may be arranged spaced apart from each other in a first direction DR1 and a second direction DR2. The plurality of main parts MP may be arranged spaced apart from each other in the first direction DR1 by a first distance d1 and spaced apart from each other in the second direction DR2 by a second distance d2. The first distance d1 and the second distance d2 may be the same.

[0093] A plurality of bridge patterns BP may be disposed in a peripheral region NCA surrounding each of a plurality of cell regions CA of the mother substrate MB shown in FIG. 7B. Each bridge pattern BP may connect one side of one of the main parts MP to one side of an adjacent main part MP. According to one embodiment of the present invention, the bridge pattern BP may extend from each of the main parts MP. That is, the bridge pattern BP may be formed in the same process as the main parts MP, and the bridge pattern BP and the main parts MP may be integrally formed.

[0094] The bridge pattern BP may include a first bridge pattern BP1 and a second bridge pattern BP2. The first bridge pattern BP1 may be disposed between main parts MP spaced apart in a first direction DR1, and the second bridge pattern BP2 may be disposed between main parts MP spaced apart in a second direction DR2. A plurality of first bridge patterns BP1 and second bridge patterns BP2 may be provided. While two first bridge patterns BP1 and two second bridge patterns BP2 are shown in FIG. 8B, connecting one side of one main part BP to one side of the main part MP adjacent to the main part MP, the present invention is not limited thereto. There may be three or more first bridge patterns BP1 and two second bridge patterns BP2 connecting one side of one main part BP to one side of the main part MP adjacent to the main part MP. Even if there is only one bridge pattern BP between adjacent main parts MP that is placed under the mother substrate MB during the process of transferring the panel substrate PB, it is possible that there is only one bridge pattern BP between adjacent main parts MP as long as the tensile force applied to the mother substrate MB can be dispersed. This also applies to the following embodiments. In the above embodiment, bridge patterns BP are formed between all adjacent main portions MP, but if the tensile force applied to the mother substrate MB can be dispersed, it is not necessary to form bridge patterns BP between all adjacent main portions MP. This also applies to the following embodiment.

[0095] The first bridge pattern BP1 may extend in the first direction DR1 and be aligned in the second direction DR2, while the second bridge pattern BP2 may extend in the second direction DR2 and be aligned in the first direction DR1. As shown in FIG. 8B, the main portion MP, the first bridge pattern BP1, and the second bridge pattern BP2 may define a plurality of openings in the protective layer PL'. Although not shown, the thickness of the main portion MP in the third direction DR3 and the thickness of the bridge pattern BP in the third direction DR3 may be different from each other. In FIG. 8A, when the resin composition RS is applied onto the mother substrate MB, the thickness of the main portion MP and the thickness of the bridge pattern BP may be different from each other by adjusting the amount of the resin composition RS applied. For example, the thickness of the main portion MP may be thicker than the thickness of the bridge pattern BP. Increasing the thickness of the main portion MP can suppress damage to various element layers formed corresponding to the main portion MP. Furthermore, reducing the thickness of the bridge pattern BP can make it easier for the bridge pattern BP to elastically deform than the main portion MP, thereby dispersing tensile force applied to the mother substrate MB. Furthermore, to facilitate distribution of the tensile force applied to the mother substrate MB, the width and number of the first and second bridge patterns BP1, BP2 in a plan view can be varied depending on the positions of the first and second bridge patterns BP1, BP2 on the mother substrate MB. For example, as shown in FIG. 9B , due to the mother substrate MB's own weight, a greater load is applied to the center than to the gripped ends, making it more likely to bend. Therefore, various designs are possible, such as a design in which the number of first and second bridge patterns BP1, BP2 is increased in the center of the mother substrate MB compared to the ends of the mother substrate MB, a design in which the widths are increased or decreased, or a design in which the number is increased and the width is narrowed.

[0096] In a method for manufacturing a display module DM (see FIG. 2) according to an embodiment of the present invention, the protective layer PL′ may be formed by a surface coating method such as slit coating or screen printing, etc. Therefore, since no separate adhesive is used, the manufacturing efficiency of the display module DM may be improved.

[0097] 6A, 9A, and 9B, step S300 of transferring the panel substrate PB may be performed. FIG. 9B is a cross-sectional view of the panel substrate PB taken along the cutting line II' shown in FIG. 9A. The panel substrate PB may be transferred in a first direction DR1 by a picking device PK. The panel substrate PB shown in FIGS. 9A and 9B may have an inverted phase relative to the panel substrate PB shown in FIGS. 8A and 8B. That is, step S300 of transferring the panel substrate PB may be performed after the panel substrate PB shown in FIGS. 8A and 8B is inverted.

[0098] The two picking devices PK are fixed to both sides of the panel substrate PB spaced apart in the first direction DR1 to transfer the panel substrate PB. However, not limited to the illustrated embodiment, four picking devices PK may be provided and disposed at the corners of the panel substrate PB to transfer the panel substrate PB.

[0099] The picking device PK is fixed to both sides of the panel substrate PB and transports the panel substrate PB in the first direction DR1, so that gravity can lift the panel substrate PB downward (e.g., in the direction opposite to the third direction DR3) and transport it. During the transport of the panel substrate PB, the mother substrate MB may be subjected to tensile forces in the first direction DR1 and the direction opposite to the first direction DR1, which can result in damage. During the transport of the panel substrate PB, the degree of lift of the panel substrate PB in the direction opposite to the third direction DR3 (the tensile force associated with the lift of the panel substrate PB) in the panel substrate PB of the present invention can be reduced by approximately three to four times compared to a comparative panel substrate that does not have multiple bridge patterns BP disposed below the mother substrate MB. In other words, during the transport of the panel substrate PB, the tensile force is dispersed by the multiple bridge patterns BP disposed below the mother substrate MB, reducing the possibility of damage to the mother substrate MB. As a result, a reliable display module DM (see FIG. 2) can be provided.

[0100] 6A, 10A, and 10B, a step S400 may be performed in which the panel substrate PB is cut to form display modules DM (see FIG. 2). Fig. 10A shows a step of first cutting the panel substrate PB along first cutting lines CL1, and Fig. 10B shows a step of second cutting the plurality of separated sub-panel substrates SPB along second cutting lines CL2a and CL2b.

[0101] Referring to FIG. 10A, a first cut line CL1 may be formed in the peripheral area NCA (see FIG. 7B). The laser irradiation device LD of the present invention may irradiate a laser beam LZ along the first cut line CL1 of the panel substrate PB to cut it. The laser irradiation device LD may cut the panel substrate PB while moving along the first cut line CL1. The first cut line CL1 may overlap with a plurality of bridge patterns BP. That is, the first cutting step may be a step of simultaneously cutting the mother substrate MB and the plurality of bridge patterns BP along the first cut line CL1.

[0102] The thickness of the panel substrate PB in the portion where the bridge patterns BP are not arranged is smaller than the thickness of the panel substrate PB in the portion where the bridge patterns BP are arranged. Therefore, in the step of first cutting the panel substrate PB of the present invention, the cutting load (load, stress due to cutting) can be reduced compared to the step of cutting a panel substrate PB in which a protective layer PL' is formed on the entire lower surface of the mother substrate MB. As a result, the manufacturing process of the display module DM (see FIG. 2) can be simplified.

[0103] 10A and 10B, after the first cutting step, the panel substrate PB may be separated into a plurality of sub-panel substrates SPB, each of which may correspond to a display module DM (see FIG. 2) shown in FIG.

[0104] Referring to FIG. 10B, second cut lines CL2a and CL2b may be formed in the cell area CA (see FIG. 7B). The laser irradiation device LD may cut the plurality of sub-panel substrates SPB by irradiating a laser beam LZ along the second cut lines CL2a and CL2b. The laser irradiation device LD may cut the plurality of sub-panel substrates SPB while moving along the second cut lines CL2a and CL2b. Although not shown, the second cut lines CL2a and CL2b may be formed on each of the plurality of sub-panel substrates SPB, and each of the plurality of sub-panel substrates SPB may be cut by the laser irradiation device LD.

[0105] The second cut lines CL2a and CL2b may overlap with the main portions MP. That is, the second cutting step may be a step of simultaneously cutting the mother substrate MB and the main portions MP along the second cut lines CL2a and CL2b, or a step of simultaneously cutting the mother substrate MB, the main portions MP, and the bridge patterns BP along the second cut line CL2b. After the second cutting step, a display module DM (see FIG. 2) may be formed. The display module DM formed along the second cut line CL2b may have a folding area BA and a second non-folding area NBA2 defined therein, as in the display module DM shown in FIG. 2. However, the display module DM formed along the second cut line CL2a may not have the folding area BA and the second non-folding area NBA2 defined therein, unlike the display module DM shown in FIG. 2. That is, the shape of the display module DM may vary depending on the second cut lines CL2a and CL2b. After the second cutting step, each of the sub-panel substrates SPB may be manufactured as a single display module DM. Here, in the display module DM after being cut along the second cut line CL2b, the region corresponding to the main portion MP may correspond to the first non-bending region NBA1. Furthermore, in the display module DM after being cut along the second cut line CL2b, the region including the portion where the bridge pattern BP is formed, that is, in the example of Fig. 10B, the two second bridge patterns BP2 extending from the main portion MP and the region between these two second bridge patterns BP2 in the display module DM after being cut along the second cut line CL2b, may correspond to, for example, the bending region BA and the second non-bending region NBA2. In the above example, the protective layer PL is not formed in the bending region BA, but is formed in the second non-bending region NBA2 (see, for example, FIGS. 5A and 5B). To fit the display module DM after cutting along the second cut line CL2b in FIG. 10B, for example, in the step of forming the protective layer PL' on the mother substrate MB as shown in FIG. 8B, a plurality of second bridge patterns BP2 extending from the main portions MP in the second direction DR2 between adjacent main portions MP in the second direction DR2 may be formed, and a bridge pattern (hereinafter, intermediate bridge pattern) long in the first direction DR1 connecting the plurality of second bridge patterns BP2 may be formed, for example, in an intermediate portion in the second direction DR2 between adjacent main portions MP. In other words, the protective layer PL' may include the intermediate bridge pattern in addition to the main portions MP and the first and second bridge patterns BP1 and BP2. In this case, between main parts MP adjacent in the second direction DR1, an intermediate bridge pattern, multiple second bridge patterns BP2 extending to one main part MP across the intermediate bridge pattern, and multiple second bridge patterns BP2 extending to the other main part MP may be arranged. When cutting the mother substrate MB along the second cut line CL2b, the center portion of the intermediate bridge pattern in the second direction DR2 is cut roughly in half along the first direction DR1 while cutting the region corresponding to one main part MP. At this time, the cut is made to include the multiple second bridge patterns BP2 extending from the intermediate bridge pattern to one main part MP and the region between the multiple second bridge patterns BP2. When cut in this manner, the region of the intermediate bridge pattern cut in half can correspond to the second non-bending region NBA2. Then, by removing the multiple second bridge patterns BP2 extending to one main part MP by etching or the like, the region including the removed portion and the region between the removed portions can correspond to the bending region BA. As described above, the plurality of second bridge patterns BP2 extending to one of the main parts MP may not be removed by etching or the like, and the area including the plurality of second bridge patterns BP2 extending to one of the main parts MP may correspond to the bending area BA.Even in this case, the bending region BA can be easily bent because the amount of protective layer PL arranged therein is smaller than that in the first and second non-bending regions NBA1 and NBA2. Therefore, the stress caused by bending can be largely contained in the bending region BA, and the stress caused by bending transmitted to the first non-bending region NBA1 and the second non-bending region NBA2 can be kept small.

[0106] 11A to 11D are plan views showing a panel substrate according to another embodiment of the present invention. Hereinafter, the same description as above will be omitted.

[0107] 11A, the panel substrate PBa may include a mother substrate MB and a protective layer PLa' disposed on the mother substrate MB. The protective layer PLa' may include a plurality of main portions MP and a plurality of bridge patterns BPa connecting the plurality of main portions MP to one another. The bridge pattern BPa may include a first bridge pattern BP1a and a second bridge pattern BP2.

[0108] According to an embodiment of the present invention, the shape of the first bridge pattern BP1a and the shape of the second bridge pattern BP2 may be different from each other. For example, the first bridge pattern BP1a may be extended in the second direction DR2 and have a zigzag shape. The shape of the second bridge pattern BP2 may be the same as the shape of the second bridge pattern BP2 shown in FIG. 8B. The first bridge pattern BP1a is disposed between one surface of one main part MP and one surface of the main part MP adjacent to the one main part MP. However, this is not limited to this. The first bridge pattern BP1a may not be disposed in the outer periphery of the mother substrate MB. For example, as shown in FIG. 11A, the first bridge pattern BP1a may not be formed in the outer periphery of the mother substrate MB (the peripheral region that is the periphery of the mother substrate MB). Similarly, the second bridge pattern BP2 may not be formed in the outer periphery (peripheral region) of the mother substrate MB. Also, as described above, bridge patterns BP do not need to be formed between all adjacent main parts MP.

[0109] FIG. 11B is a view showing a portion of a panel substrate PBb. FIG. 11C is an enlarged view of an area AA' shown in FIG. 11B. The protective layer PLb' of the panel substrate PBb may include a plurality of main parts MP and a plurality of bridge patterns BPb connecting the plurality of main parts MP to each other. The plurality of main parts MP may include first to fifth main parts MP1, MP2, MP3, MP4, and MP5. The second main part MP2 may be spaced apart from the first main part MP1 in the first direction DR1, the third main part MP3 may be spaced apart from the first main part MP1 in the second direction DR2, the fourth main part MP4 may be spaced apart from the first main part MP1 in the direction opposite to the first direction DR1, and the fifth main part MP5 may be spaced apart from the first main part MP1 in the direction opposite to the second direction DR2. That is, the second to fifth main parts MP2, MP3, MP4, and MP5 can be disposed so as to face each of the side surfaces of the first main part MP1 in a plan view.

[0110] The bridge patterns BPb may include first to fourth bridge patterns BP1b, BP2b, BP3b, and BP4b. The first bridge pattern BP1b connects the first main part MP1 and the second main part MP2, the second bridge pattern BP2b connects the first main part MP1 and the third main part MP3, the third bridge pattern BP3b connects the first main part MP1 and the fourth main part MP4, and the fourth bridge pattern BP4b connects the first main part MP1 and the fifth main part MP5. The first to fourth bridge patterns BP1b, BP2b, BP3b, and BP4b may each extend from the first main part MP1. The first to fourth bridge patterns BP1b, BP2b, BP3b, and BP4b and the first to fifth main parts MP1, MP2, MP3, MP4, and MP5 may be integrally formed using the same process.

[0111] According to an embodiment of the present invention, the first to fourth bridge patterns BP1b, BP2b, BP3b, and BP4b may have different shapes. For example, the shape of the first bridge pattern BP1b may be the same as the shape of the first bridge pattern BP1a shown in Fig. 11A, and the shape of the fourth bridge pattern BP4b may be the same as the shape of the second bridge pattern BP2 shown in Fig. 8B. Therefore, a description thereof will be omitted.

[0112] 11B and 11C, the second bridge pattern BP2b may include a first portion B1 extending from the third main part MP3 toward the first main part MP1 and a second portion B2 extending from the first portion B1 toward the first main part MP1. According to an embodiment of the present invention, in a plan view, a first width W1 of the first portion B1 in the first direction DR1 and a second width W2 of the second portion B2 in the first direction DR1 may be different from each other. Specifically, the second width W2 is larger than the first width W1. The shape of a display module DM (see FIG. 2) including the third main part MP3 may correspond to the shape of the display module DM shown in FIG. 2. That is, the display module DM including the third main part MP3 may be defined with a first non-folding region NBA1, a folding region BA, and a second non-folding region NBA2, as in the display module DM shown in FIG. 2. In this case, a protective layer PL is disposed in the folding region BA. Alternatively, the protective layer PLb' in the area of ​​the third main part MP3 corresponding to the bending area BA may be removed by etching so that the protective layer PL is not positioned in the bending area BA, as in the embodiment of Figure 5B and the like described above.

[0113] 11B, each of the two sets of third bridge patterns BP3b may have an "X" shape. A plurality of sets of third bridge patterns BP3b may be provided. While two sets of third bridge patterns BP3b are shown in FIG. 11B, this is not limiting, and three or more sets of third bridge patterns BP3b may be provided.

[0114] Referring to FIG. 11D , a central region CTA and an enclosure region OA surrounding the central region CTA may be defined in the protective layer PLc′. The bridge patterns BPc may include a plurality of first bridge patterns BP1c arranged in the central region CTA and a plurality of second bridge patterns BP2c arranged in the enclosure region OA. The first bridge patterns BP1c and the second bridge patterns BP2c may be defined as patterns formed between one side surface of one main part MP and one side surface of the main part MP adjacent to the one main part MP in a plan view. According to one embodiment of the present invention, the number of first bridge patterns BP1c is greater than the number of second bridge patterns BP2c. Specifically, in the example of FIG. 11D , four first bridge patterns BP1c are arranged between one side surface of one main part MP located at the center of the central region CTA and one side surface of the main part MP adjacent to the one main part MP in the first direction DR1. Similarly, four first bridge patterns BP1c are arranged between one surface of the side of one main part MP located at the center of the central region CTA and one surface of the side of the main part MP adjacent to that one main part MP in the opposite direction to the first direction DR1. Furthermore, for three main parts MP adjacent along the first direction DR1 in the central region CTA, the main part MP adjacent in the first direction DR1, the main part MP adjacent in the second direction DR2, the main part MP adjacent in the opposite direction to the first direction DR1, and the main part MP adjacent in the opposite direction to the second direction DR2 are arranged in the enclosed region OA. Three first bridge patterns BP1c are arranged between each of the three main parts MP in the central region CTA and their adjacent main parts MP. Furthermore, two second bridge patterns BP2c are arranged between the main parts MP adjacent in the first direction in the enclosed region OA, and two second bridge patterns BP2c are arranged between the main parts MP adjacent in the second direction in the enclosed region OA. That is, the number of first bridge patterns BP1c increases toward the central area CTA, and the number of second bridge patterns BP2c in the enclosed area OA is smaller than the number of first bridge patterns BP1c.

[0115] 9A and 9B, when the panel substrate PBc of the present invention is transferred in the first direction DR1, the panel substrate PBc may be lifted and transferred in the direction opposite to the third direction DR3. During the transfer of the panel substrate PBc, tensile force is concentrated in the center region CTA of the mother substrate MB. Therefore, by providing the first bridge patterns BP1c, the mother substrate MB in the center region CTA can be dispersed by the first bridge patterns BP1c, thereby reducing the possibility of damage. In other words, by increasing the number of bridge patterns BP in the center region CTA, the mother substrate MB can be supported by the bridge patterns BP in the center region CTA of the mother substrate MB, which is most susceptible to bending, while the bridge patterns BP can more easily disperse the tensile force in the center region CTA of the mother substrate MB, which is most susceptible to tension.

[0116] Although the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and variations of the present invention can be made without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0117] Therefore, the technical scope of the present invention should be determined by the claims, not by the contents described in the detailed description of the specification. [Explanation of symbols]

[0118] ED: Electronic device DM: Display module PB: Panel board MB: Motherboard PL: Protection layer MP: Main part BP: Bridge Pattern

Claims

1. a mother substrate including a plurality of cell regions and a peripheral region surrounding the plurality of cell regions; a protective layer disposed under the mother substrate; The protective layer is a plurality of main portions overlapping the plurality of cell regions; a plurality of bridge patterns overlapping the peripheral region and connecting adjacent ones of the plurality of main parts;

2. The main part is A first main section; a second main part spaced apart from the first main part in a first direction; The panel substrate of claim 1 , comprising: a third main part spaced apart from the first main part in a second direction intersecting the first direction.

3. The bridge pattern is a first bridge pattern connecting the first main part and the second main part to each other; The panel substrate of claim 2 , further comprising: a second bridge pattern connecting the first main part and the third main part to each other.

4. The panel substrate of claim 3 , wherein the first bridge pattern and the second bridge pattern are each provided in plural numbers.

5. the first bridge patterns extend in the first direction and are aligned in the second direction; The panel substrate of claim 4 , wherein the second bridge patterns extend in the second direction and are aligned in the first direction.

6. The panel substrate of claim 3 , wherein the first bridge pattern and the second bridge pattern have different shapes.

7. The panel substrate of claim 6 , wherein the first bridge pattern has a zigzag shape in the second direction.

8. The second bridge pattern is A first part; and a second portion extending from the first portion, The panel substrate according to claim 6 , wherein a first width of the first portion in the first direction and a second width of the second portion in the first direction are different from each other.

9. The main part is a fourth main part spaced apart from the first main part in a second direction intersecting the first direction; The panel substrate of claim 3 , further comprising a fifth main part spaced apart from the first main part in a direction opposite to the second direction.

10. The bridge pattern is a third bridge pattern connecting the first main part and the fourth main part to each other; The panel substrate of claim 9 , further comprising a fourth bridge pattern connecting the first main part and the fifth main part to each other.

11. The panel substrate of claim 2 , wherein a first distance between the first main part and the second main part and a second distance between the first main part and the third main part are the same.

12. The main portions each have a rectangular planar shape, 2. The panel substrate of claim 1, wherein each of the bridge patterns connects one surface of one of the main portions to one surface of a main portion adjacent to the main portion.

13. The panel substrate of claim 12, wherein the main parts have the same shape and size.

14. The panel substrate of claim 1 , wherein the number of bridge patterns arranged in the central region of the protective layer is greater than the number of bridge patterns arranged in an outer region surrounding the central region.

15. The panel substrate of claim 1 , wherein the thickness of the main portion and the thickness of the bridge pattern are different from each other.

16. The panel substrate of claim 1 , wherein the bridge patterns extend from each of the main portions.

17. providing a mother substrate including a plurality of cell regions and a peripheral region surrounding the plurality of cell regions; forming a protection layer on the mother substrate to form a panel substrate; and cutting the panel substrate to form a display module; The protective layer is a plurality of main portions overlapping the plurality of cell regions; a plurality of bridge patterns overlapping the peripheral region and connecting adjacent main parts among the plurality of main parts.

18. The step of forming the protective layer includes: applying a resin composition onto the upper surface of the mother substrate to form a preliminary protective layer; The method for manufacturing a display module according to claim 17, further comprising the step of curing the preliminary protective layer.

19. In the step of forming the preliminary protective layer, The method of claim 18 , wherein the step of applying the resin composition is performed by a screen printing process or a slit coating process.

20. The step of cutting the panel substrate includes: making a first cut in the panel substrate along a cut line overlapping the peripheral region; 18. The method of claim 17, further comprising: a second cutting step of cutting the plurality of sub-panel substrates corresponding to the plurality of cell regions.

21. The method of claim 17 , further comprising the step of transferring the panel substrate after the step of forming the panel substrate.

22. The mother substrate is a spare base layer; a spare circuit layer disposed on the spare base layer; The method for manufacturing a display module according to claim 17 , further comprising: a preliminary light emitting element layer disposed on the preliminary circuit layer.

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