Resin composition

Abstract

PURPOSE: To provide a resin composition which enhances suspensibility of a filler, and simultaneously can maintain performance of a manufactured substrate.SOLUTION: A resin composition contains a resin, a filler, and a polysiloxane compound. The resin contains an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. The number of equivalents of the polysiloxane compound is 1,000 g / mol or more.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] Current resin compositions typically contain fillers. However, fillers tend to settle, making the resin compositions difficult to transport, store, and process, which impacts production efficiency and yield. Therefore, how to maintain the performance of the manufactured substrate while simultaneously improving the suspension of fillers in the resin composition has become an important technological development issue. Summary of the Invention [Problem to be solved by the invention]

[0003] How to maintain the performance of the manufactured substrate while simultaneously increasing the suspendability of the filler in the resin composition has become an important issue in technological development. [Means for solving the problem]

[0004] The present invention provides a resin composition that can improve the suspendability of a filler while maintaining the performance of the manufactured substrate.

[0005] The resin composition of the present invention includes a resin, a filler, and a polysiloxane compound. The resin includes an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. The polysiloxane compound has an equivalent weight of 1000 grams / mole or more.

[0006] In one embodiment of the present invention, the polysiloxane compound has hydrogen bonds.

[0007] In one embodiment of the present invention, the polysiloxane compound has an amino group or a carboxyl group.

[0008] In one embodiment of the present invention, the polysiloxane compound described above comprises structural formula (1).

[0009] [ka] Here, R is, for example, CH3, m is 1 to 15, and n is 1 to 15. Here, the values ​​of m and n affect the molecular weight and further affect the number of equivalents.

[0010] In one embodiment of the present invention, the equivalent weight of the aforementioned polysiloxane compound is 5000 grams / mole or less.

[0011] In one embodiment of the present invention, the weight ratio of the above-mentioned polysiloxane compound in the resin composition is between 0.1 wt % and 10 wt %.

[0012] In one embodiment of the present invention, the weight ratio of the above-mentioned filler in the resin composition is 75 wt % or more.

[0013] In one embodiment of the present invention, the weight ratio of the above-mentioned filler in the resin composition is between 60 wt % and 80 wt %.

[0014] In one embodiment of the present invention, the filler has an epoxy group or an amino group.

[0015] In one embodiment of the present invention, the weight ratio of the above-mentioned epoxy resin in the resin is 1 wt% to 10 wt%, the weight ratio of the bismaleimide resin in the resin is 10 wt% to 20 wt%, and the weight ratio of the curing agent in the resin is 3 wt% to 10 wt%. [Effects of the Invention]

[0016] As described above, the present invention uses a polymeric polysiloxane compound in a resin composition to encapsulate the filler and synchronize its movement, thereby improving vibration resistance and viscosity. At the same time, the polymeric polysiloxane compound does not significantly affect the subsequent substrate properties, so it can improve the suspension of the filler while maintaining the performance of the manufactured substrate.

[0017] In order to make the above features and advantages of the present invention more clearly understandable, the following embodiments are provided and described in detail. DETAILED DESCRIPTION OF THE INVENTION

[0018] In the following detailed description, for purposes of explanation and not limitation, exemplary embodiments disclosing specific details are set forth to provide a thorough understanding of various principles of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments that depart from the specific details disclosed herein.

[0019] Unless otherwise specified, the term "between" used herein to qualify a range of numerical values ​​is intended to cover a range equal to and between the recited endpoints; for example, if a size range is between a first number and a second number, it means that the range can cover the first number, the second number, and any number between the first and second numbers.

[0020] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0021] In this embodiment, the resin composition includes a resin, a filler, and a polysiloxane compound, and the resin includes an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. More specifically, the polysiloxane compound has an equivalent weight of 1000 grams per mole (g / mol) or more. By using the polymeric polysiloxane compound to encapsulate the filler and coordinate its movement, the vibration resistance and viscosity can be improved. At the same time, the polymeric polysiloxane compound does not significantly adversely affect the subsequent substrate properties, thereby improving the suspension of the filler while maintaining the performance of the manufactured substrate.

[0022] For example, polysiloxane compounds have hydrogen bonds, and the large number of functional groups of this type present in these compounds with strong bonding power strengthens the connecting network, increases viscosity, and tightly encapsulates the filler. This reduces sedimentation when stationary, and allows the compound to return to a relatively low viscosity state simply by stirring appropriately before use, which is advantageous in both production efficiency and yield, but the present invention is not limited thereto.

[0023] The equivalent weight of the polysiloxane compound may be less than or equal to 5000 g / mol. That is, the equivalent weight of the polysiloxane compound may be between 1000 g / mol and 5000 g / mol, thereby achieving a better suspending effect, but the present invention is not limited to this upper limit. The upper limit can be selected appropriately according to the actual design requirements, and as long as the equivalent weight of the polysiloxane compound meets the lower limit (i.e., 1000 g / mol or more), the technical effect of improving suspendability can be achieved.

[0024] In recent years, semiconductor development has been moving toward heterogeneous integration to improve efficiency, and a key technology for this is advanced packaging. Advanced packaging requires high precision and reliability, and a substrate manufactured using the resin composition of the present embodiment can more appropriately meet these requirements, but the present invention is not limited thereto.

[0025] In some embodiments, the polysiloxane compound has amino or carboxyl groups, which can improve compatibility with the resin and / or further reduce the flowability of the overall resin composition, although the invention is not limited thereto.

[0026] In some embodiments, the polysiloxane compound comprises the following structural formula (1):

[0027] [ka] Here, R is, for example, CH3, m is 1 to 15, and n is 1 to 15. Here, the values ​​of m and n affect the molecular weight and further affect the number of equivalents.

[0028] In some embodiments, the weight ratio of the polysiloxane compound in the resin composition may be between 0.1 wt % and 10 wt %, but the present invention is not limited thereto.

[0029] In some embodiments, the weight ratio of the filler in the resin composition is greater than or equal to 75 wt %, or the weight ratio of the filler in the resin composition is between 60 wt % and 80 wt %. The use of this design has further advantages when a high proportion of filler is added, as suspension problems become more pronounced, but the present invention is not limited thereto.

[0030] In some embodiments, the filler has an epoxy group or an amino group, which improves compatibility with the resin. For example, the filler includes silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride. The particle size range of the filler may be between 0.01 μm and 5 μm, but the present invention is not limited thereto. The particle size range of the filler can be determined according to actual design requirements.

[0031] In some embodiments, the weight ratio of the epoxy resin in the resin is 1 wt % to 10 wt % (e.g., 1 wt %, 5 wt %, 7 wt %, 10 wt %, or any suitable number between 1 wt % and 10 wt %), the weight ratio of the bismaleimide resin in the resin is 10 wt % to 20 wt % (e.g., 10 wt %, 12 wt %, 15 wt %, 20 wt %, or any suitable number between 10 wt % and 20 wt %), and the weight ratio of the curing agent in the resin is 3 wt % to 10 wt % (e.g., 3 wt %, 5 wt %, 7 wt %, 10 wt %, or any suitable number between 3 wt % and 10 wt %), although the present invention is not limited thereto.

[0032] In some embodiments, the weight ratio of the bismaleimide resin in the resin is greater than the weight ratio of the epoxy resin in the resin and the weight ratio of the hardener in the resin, but the present invention is not limited thereto.

[0033] In some embodiments, the resin is composed only of an epoxy resin, a bismaleimide resin, and a curing agent, i.e., the total weight ratio of the epoxy resin, the bismaleimide resin, and the curing agent in the resin is 100 wt %, although the present invention is not limited thereto.

[0034] In some embodiments, the epoxy resin comprises a biphenyl structure, a naphthalene structure, or an epoxy resin similar thereto.

[0035] In some embodiments, the bismaleimide (BMI) resin comprises BMI-1000 (CAS NO: 13676-54-5), BMI-2000 (CAS NO: 67784-74-1), BMI-2300 (CAS NO: 67784-74-1), BMI-3000 (CAS NO: 3006-93-7), BMI-4000 (CAS NO: 79922-55-7), BMI-5100 (CAS NO: 105391-33-1), BMI-7000 (CAS NO: 6422-83-9), or the like.

[0036] In some embodiments, the curing agent comprises an acid anhydride such as phenolic novolac resin, cresol novolac resin, bisphenol A novolak resin, benzoxazine resin, biphenyl novolac type phenolic resin, aminotriazine novolac type phenolic resin, pyromellitic anhydride, trimellitic anhydride, or benzophenonetetracarboxylic acid.

[0037] In some embodiments, the resin composition is composed of a resin, a filler, and a polysiloxane compound, i.e., the total weight ratio of the resin, the filler, and the polysiloxane compound in the resin composition is 100 wt%, although the present invention is not limited thereto.

[0038] It should be noted that the resin composition of the present invention can be processed into a prepreg or a copper foil substrate (CCL) according to actual design requirements. However, the above-mentioned specific embodiments do not limit the present invention, and any resin composition containing a polysiloxane compound is within the scope of protection of the present invention.

[0039] The following examples and comparative examples are provided to clarify the effects of the present invention, but the scope of the present invention is not limited to the scope of the examples alone.

[0040] The substrates produced in each of the examples and comparative examples were evaluated by the following methods.

[0041] Glass transition temperature (°C): Tested using a dynamic mechanical analyzer (DMA).

[0042] Coefficient of thermal expansion (CTE): The coefficient of thermal expansion (xy plane direction) of the material was measured from 50℃ to 120℃ using TMA.

[0043] Water absorption rate (%): After heating the sample in a pressure cooker at 120°C and 2 atm for 120 minutes, the change in weight before and after heating was calculated.

[0044] Suspension settling time: The time during which the varnish remained in a well-dispersed state was measured using a Turbiscan dispersion stability analyzer (measurement point: 5 minutes / time).

[0045] <Examples 1 to 4, Comparative Example 1>

[0046] The varnish formed from the resin composition shown in Table 1 was impregnated into Nan Ya glass fiber cloth (Nan Ya Plastics Corporation, fabric model number 2118S) at room temperature, and then dried at 120°C (impregnation machine) for several minutes to obtain a prepreg with a resin content of 50 wt%. 2 The copper foil substrate was then heated to 250°C at a heating rate of 3°C / min, maintained at a constant temperature for 20 minutes, and then slowly cooled to obtain a copper foil substrate. The copper foil on the surface was then removed to form a bare board, and various performance evaluations were performed. The physical properties of the resulting copper foil substrate were tested, and the results are shown in Table 1. Comparing the results of Examples 1-4 and Comparative Example 1 in Table 1, the following conclusion can be drawn: the substrates produced in Examples 1-4 did not significantly affect the performance of the substrate (glass transition temperature, thermal expansion coefficient, water absorption, etc.) compared to the substrate produced in Comparative Example 1, even when the resin composition was left suspended in the substrate for more than two weeks. Therefore, adding a polysiloxane compound with an equivalent weight greater than 1000 g / mol reliably increases the suspension of the filler while maintaining the performance of the produced substrate.

[0047] [Table 1]

[0048] As described above, the present invention uses a polymeric polysiloxane compound in a resin composition to encapsulate the filler and synchronize its movement, thereby improving vibration resistance and viscosity. At the same time, the polymeric polysiloxane compound does not significantly affect the subsequent substrate properties, so it can improve the suspension of the filler while maintaining the performance of the manufactured substrate.

[0049] Although the present invention has been described with reference to the above embodiments, it is not intended to limit the present invention, and any person skilled in the art to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is based on the scope of the appended claims. [Industrial Applicability]

[0050] The resin composition of the present invention can be applied in the field of resin compositions.

Claims

1. a resin comprising an epoxy resin, a bismaleimide resin, a hardener, or a combination thereof; A filler; a polysiloxane compound having an equivalent weight of 1000 g / mol or more; A resin composition comprising:

2. The resin composition according to claim 1 , wherein the polysiloxane compound has a hydrogen bond.

3. The resin composition according to claim 1, wherein the polysiloxane compound has an amino group or a carboxyl group.

4. The polysiloxane compound comprises structural formula (1): 【Chemistry 1】 R is CH ３ 2. The resin composition according to claim 1, wherein m is 1 to 15 and n is 1 to 15.

5. 2. The resin composition according to claim 1, wherein the equivalent weight of the polysiloxane compound is 5000 g / mol or less.

6. 2. The resin composition according to claim 1, wherein the weight ratio of the polysiloxane compound in the resin composition is between 0.1 wt % and 10 wt %.

7. 2. The resin composition according to claim 1, wherein the weight ratio of the filler in the resin composition is 75 wt % or more.

8. 2. The resin composition according to claim 1, wherein the weight ratio of the filler in the resin composition is between 60 wt % and 80 wt %.

9. The resin composition according to claim 1, wherein the filler has an epoxy group or an amino group.

10. 2. The resin composition according to claim 1, wherein a weight ratio of the epoxy resin in the resin is 1 wt % to 10 wt %, a weight ratio of the bismaleimide resin in the resin is 10 wt % to 20 wt %, and a weight ratio of the curing agent in the resin is 3 wt % to 10 wt %.

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