Scientific-research-type wet etching full-automatic system and machine table

Abstract

To satisfy smart, downsized, flexible and varied scientific research scenarios, improve efficiency of scientific research, and save a scientific research resource.SOLUTION: Disclosed are a scientific research type wet etching full-automatic system and a machine table. The system comprises: a machine table system for providing a miniaturized machine room; an etching system that comprises a plurality of liquid medicine modules which are arranged in the miniaturized machine room in an arc arrangement mode; a feeding system that achieves automatic conveying of workpieces; a robot system that comprises a robot module and a vision module in communication connection with the robot module; and a control system. The liquid medicine module comprises a liquid medicine unit and a liquid supply mechanism for supplying liquid to the liquid medicine unit and controlling an etching environment in the liquid medicine unit. The robot module is arranged at a top of an operation space to grab a workpiece according to feedback of the vision module and place the workpiece into the liquid medicine unit to complete etching.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] This application relates to the field of semiconductor cleaning and etching technology, and in particular to organic wet pedestals for scientific research. [Background technology]

[0002] In the manufacturing process of semiconductor micro-nano devices, wafer surface cleaning and acid-alkali etching must be performed using a wet machine, but in the field of scientific research, there is currently no fully automated wet machine equipment that can be used for scientific research. Traditional enterprise-level wet machines have a high degree of automation, but are only suitable for mass production, which has the following problems:

[0003] 1. The size of the equipment is large, occupying space in the clean room of scientific research places and wasting resources.

[0004] 2. The centralized liquid supply and large chemical solution section design results in large chemical solution consumption, which significantly increases the cost of scientific research.

[0005] 3. It is only applicable to large semiconductors (4 / 6 / 8 / 12 inch wafers) and is not compatible with small semiconductors (1cm~2cm wafers).

[0006] 4. It is designed according to the standard process flow of industrial production, which cannot meet the flexible and changing scientific research scenarios.

[0007] Therefore, current university semiconductor research methods are still mainly manual, such as manually obtaining and placing chemical reagents. Because the wet etching process involves many dangerous chemical reagents, if the protection is inadequate or the operation is not standardized, dangers are likely to occur, endangering the lives and health of researchers. In addition, many experimental scenarios require manual operation of small equipment, which is inconvenient and results in unstable and low efficiency processes overall.

[0008] To sum up, the conventional technology still has a gap in research on how to improve the efficiency of scientific research and the stability of processes, which seriously restricts the development of semiconductor scientific research. Therefore, it is necessary to provide a solution to solve the above problems. Summary of the Invention [Problem to be solved by the invention]

[0009] In view of this, the purpose of this application is to provide a fully automated wet etching system and machine for scientific research that meets the scientific research needs of universities and improves the efficiency and process stability of scientific research. [Means for solving the problem]

[0010] In order to achieve the above technical objectives, the present application provides a fully automated wet etching system for scientific research, which includes a machine base system, an etching system, a feed system, a robot system, and a control system; the machine base system is used to provide a compact machine room including an installation space and a working space; the etching system includes a plurality of chemical modules arranged in the miniaturized machine chamber in an arcuate arrangement; the chemical module includes a chemical unit and a liquid supply mechanism; the liquid supply mechanism is used to supply liquid to the chemical liquid unit in accordance with a preset liquid supply policy and to control an etching environment in the chemical liquid unit; the feed system is used to transport the workpiece to the working space and close the working space after the transport is completed; the robotic system includes a robot module and a vision module communicatively coupled to the robot module; the robot module is disposed at the top of the workspace to grasp a workpiece based on image information fed back by the vision module, and place the workpiece in the chemical solution unit according to a preset etching policy to complete etching; The control system is communicatively connected to the machine base system, the feed system, the robot system and the etching system to implement automated etching operations based on user commands.

[0011] In one more specific embodiment, the robotic module is further adapted to grasp a cleaning tool and perform cleaning operations based on image information fed back by the vision module.

[0012] In one more specific embodiment, the robotic module is further capable of performing at least one of a telescoping motion, a rotational motion, and a jitter motion.

[0013] In one more specific embodiment, the method further includes a timing system, The timing system is used to obtain operating time information of the base system, the feed system, and the robot system and feed it back to the control system so that the control system can control the base system, the feed system, the robot system, and the etching system according to a preset time policy.

[0014] In one more specific embodiment, the system further includes a human-computer interaction system and a monitoring system; the human-computer interaction system is communicatively connected to the control system; the monitoring system is used to acquire operation data of the machine system, the robot system, the etching system, and the feed system, respectively, and issue an alarm when the operation data exceeds a threshold; The monitoring system is further used to monitor the machine system, the robot system, the etching system and the feed system in real time according to a preset monitoring policy.

[0015] In one more specific embodiment, the liquid supply mechanism includes a liquid supply module and an etching environment module; the liquid supply module is used to supply a liquid chemical in a small-capacity liquid chemical tank to the liquid chemical unit; The etching environment module includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulation filtration module; The chemical section is provided with an overflow recovery module.

[0016] The present application further discloses a fully automated wet etching machine for scientific research, which includes a machine body and a fully automated wet etching system for scientific research; The fully automated wet etching system for scientific research is disposed on the machine body and includes a machine system, an etching system, a feed system, a robot system, and a control system; the machine base system is used to provide a compact machine room including an installation space and a working space; the etching system includes a plurality of chemical modules arranged in the miniaturized machine chamber in an arcuate arrangement; the chemical module includes a chemical unit and a liquid supply mechanism; the liquid supply mechanism is used to supply liquid to the chemical liquid unit in accordance with a preset liquid supply policy and to control an etching environment in the chemical liquid unit; the feed system is used to transport the workpiece to the working space and close the working space after the transport is completed; the robotic system includes a robot module and a vision module communicatively coupled to the robot module; the robot module is disposed at the top of the workspace to grasp a workpiece based on image information fed back by the vision module, and place the workpiece in the chemical solution unit according to a preset etching policy to complete etching; The control system is communicatively connected to the machine base system, the feed system, the robot system and the etching system to implement automated etching operations based on user commands.

[0017] In one more specific embodiment, the robotic module is further adapted to grasp a cleaning tool and perform cleaning operations based on image information fed back by the vision module.

[0018] In one more specific embodiment, the robotic module is further capable of performing at least one of a telescoping motion, a rotational motion, and a jitter motion.

[0019] In one more specific embodiment, the method further includes a timing system, The timing system is used to obtain operating time information of the base system, the feed system, and the robot system and feed it back to the control system so that the control system can control the base system, the feed system, the robot system, and the etching system according to a preset time policy.

[0020] In one more specific embodiment, the system further includes a human-computer interaction system and a monitoring system; the human-computer interaction system is communicatively connected to the control system; the monitoring system is used to acquire operation data of the machine system, the robot system, the etching system, and the feed system, respectively, and issue an alarm when the operation data exceeds a threshold; The monitoring system is further used to monitor the machine system, the robot system, the etching system and the feed system in real time according to a preset monitoring policy.

[0021] In one more specific embodiment, the liquid supply mechanism includes a liquid supply module and an etching environment module; the liquid supply module is used to supply a liquid chemical in a small-capacity liquid chemical tank to the liquid chemical unit; The etching environment module includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulation filtration module; The chemical section is provided with an overflow recovery module.

[0022] In one more specific embodiment, the robotic module is a collaborative robot.

[0023] In one more specific embodiment, the miniaturized machine room is provided in the machine body, The miniaturized machine chamber is provided with a support partition plate, The support partition plate divides the miniaturized machine chamber into an upper chamber and a lower chamber, The upper chamber defines a working space.

[0024] In one more specific embodiment, the chemical solution modules are circumferentially arranged in the lower chamber; The support partition plate is provided with first evacuation ports that communicate with the chemical liquid sections in the respective chemical liquid modules in one-to-one correspondence.

[0025] In one more specific embodiment, the space below the miniaturized machine chamber within the machine body is provided with an electrical control chamber and a concentrate chamber for storing small-capacity chemical tanks.

[0026] In one more specific embodiment, the machine system further includes a fan filter unit; The machine body is provided with an exhaust port and an air supply port communicating with the upper chamber, The fan filter unit is attached to the machine body and connected to the air outlet.

[0027] In one more specific embodiment, a spray cleaning device is further attached to the machine body, the spray cleaning device includes a spray assembly and a spray moving device; the spray moving device is attached to the upper chamber and connected to the spray assembly for moving the spray assembly; The support partition plate has a plurality of first drainage holes formed therein, The lower chamber is provided with a main drain pipe that communicates with the outside of the machine body.

[0028] In one more specific embodiment, a water collecting portion is provided in the center of the support partition plate, The water collecting portion is provided with a second drain hole.

[0029] In one more specific embodiment, a support cylinder that connects the support partition plate is provided in the center of the lower chamber, A position control chamber is provided within the support cylinder, the second drain hole communicates with the position control chamber; a branch drain pipe connecting the second drain hole is provided in the position control chamber; The end of the branch drain pipe remote from the second drain hole extends outside the support cylinder.

[0030] In one more specific embodiment, the apparatus further includes a cassette for storing the workpiece, A cassette jaw mechanism is connected to the end of the robot module for grasping the cassette.

[0031] In one more specific embodiment, the cassette jaw mechanism includes a clamp drive assembly and two jaw members; the clamp drive assembly is connected to the two jaw members for driving the two jaw members to open and close to clamp the cassette; The clamp drive assembly is covered with an explosion-proof and corrosion-proof protective cover.

[0032] In one more specific embodiment, the cassette includes two fixed plates: The two fixed plates are installed in parallel with each other at an interval, and are fixedly connected therebetween via a plurality of connecting rods; The space between each connecting rod and the two fixing plates is surrounded to form a storage cavity for storing a workpiece, a handle block fixedly connected to the top of the two fixed plates; The handle block has guide grooves on both sides. The clamping surfaces of the two jaw members are provided with positioning protrusions that engage with the guide engagement grooves, The bottom of each of the jaw members is provided with a stopper flange that can come into contact with and abut against the bottom of the handle block.

[0033] In one more specific embodiment, the cassette includes a bottom plate and two fixing plates; The two fixed plates are installed on top of the fixed plate at a distance from each other in parallel, a handle block fixedly connected to the top of the two fixed plates; The handle block has guide grooves on both sides. The clamping surfaces of the two jaw members are provided with positioning protrusions that engage with the guide engagement grooves, The bottom of each of the jaw members is provided with a stopper flange that can come into contact with the bottom of the handle block, A plurality of stopper levers are fixed between the two fixing plates on the bottom plate, The space between the adjacent stopper levers and the bottom plate is surrounded to form a storage cavity for storing a workpiece.

[0034] In one more specific embodiment, positioning blocks are fixed to opposite side surfaces of the two fixing plates, A pressing block for pressing the workpiece is movably inserted between the two positioning blocks.

[0035] In one more specific embodiment, the fluid supply mechanism includes a fluid delivery device and a fluid drainage device to form a fluid supply module; the liquid delivery device includes a pump pipe and a chemical liquid pump; one end of the pump pipe is connected to the chemical liquid section, and the other end is connected to a small-capacity chemical liquid tank; the chemical pump is attached to the pump pipe to pump the chemical in the small-capacity chemical tank to the chemical unit in accordance with a preset liquid supply policy; the drainage device includes a drainage tube and a drainage valve; the drainage tube is connected to the chemical solution unit, the drain valve is connected to the drain for controlling the flow rate of the drain according to a preset fluid supply policy; The chemical liquid section is provided with a liquid level sensor for detecting the liquid level of the chemical liquid.

[0036] In one more specific embodiment, the chemical solution unit is provided with a chemical solution chamber and an overflow chamber for forming an overflow module, the chemical chamber is used to accommodate the chemical supplied by the liquid supply mechanism and to place the workpiece therein; the overflow chamber is used to receive the chemical solution that has overflowed from the chemical solution chamber; The pump piping and the drain pipe connect the chemical chambers.

[0037] In one more specific embodiment, the drug solution portion includes an inner tank body, An inlet is formed at the top opening of the inner tank body, the chemical solution chamber is formed by the internal space of the inner tank body, A connection flange is provided around the outer circumferential surface of the inner tank body, A sidewall is connected to the top edge of the connecting flange; The overflow chamber is defined between the side wall, the top surface of the connection flange, and the outer peripheral surface of the inner tank body.

[0038] In one more specific embodiment, the fluid supply mechanism further includes a heating device to form a heating module; The heating device is used to heat the chemical liquid in the chemical liquid chamber according to a preset liquid supply policy.

[0039] In one more specific embodiment, the drug solution portion further includes an outer tank body, the bottom of the inner tank body projects into the outer tank body, and the connection flange is connected to the outer tank body so that a heating chamber is formed between the connection flange, the outer tank body, and the inner tank body; the outer tank body is provided with a medium inlet pipe and a medium outlet pipe that communicate with the heating chamber; The heating device is attached to the heating chamber for heating a heat conducting medium in the heating chamber.

[0040] In one more specific embodiment, the liquid supply mechanism further includes a circulation device for forming a circulation filtration module or a circulation spray device for forming a spray module, the circulation device is used to extract the chemical solution from the chemical solution chamber in accordance with a preset liquid supply policy, and return the extracted chemical solution to the chemical solution chamber after passing through filtration; The circulation spray device is used to extract the chemical liquid from the chemical liquid chamber according to a preset liquid supply policy, and return it to the chemical liquid chamber in a spray manner after passing through filtration.

[0041] In one more specific embodiment, the etching system further includes a cleaning apparatus to form a cleaning module; The cleaning device is used to clean the workpiece in the chemical liquid chamber.

[0042] In one more specific embodiment, the liquid supply mechanism further includes a bubbling device to form a bubbling module; The bubbling device is used to bubble the chemical liquid in the chemical liquid chamber according to a preset liquid supply policy.

[0043] In one more specific embodiment, the etching system further includes an etching switch cover device; The etching switch cover device is used to control the opening and closing of the inlet of the chemical chamber.

[0044] In one more specific embodiment, the feed system includes a transport device and a first feed switch cover device; the transport device is used to transport the workpiece from a material preparation position outside the machine body to a loading position in the miniaturized machine room; The machine body is provided with a loading port that communicates with the miniaturized machine chamber and allows a workpiece to pass through, The first feed switch cover device is used to control the opening and closing of the loading port.

[0045] In one more specific embodiment, the feed system further includes a second feed switch cover device; the transport device is attached to the lower chamber and includes a first feed mechanism and a second feed mechanism; The support partition plate is provided with a second evacuation opening for the workpiece to enter the upper chamber; the first feed mechanism is used to transport the workpiece from the material preparation position to a delivery position in the lower chamber; the second feed mechanism is used to transport the workpiece from the transfer position to a loading position in the upper chamber; The second feed switch cover device is used to control the opening and closing of the second escape opening. [Effects of the Invention]

[0046] As can be seen from the above technical solution, the embodiment of the fully automated wet etching system for scientific research according to the present application has the following beneficial effects:

[0047] 1. An automated liquid supply mechanism is used to supply liquid to the chemical section according to a preset liquid supply policy, controlling the etching environment. An automated robot module is also used in combination with a vision module to flexibly simulate manual operation, and etching is completed according to a preset etching policy, thereby enabling flexible process changes and satisfying flexible and varied scientific research scenarios.

[0048] 2. Realize the overall fully automated control, completely replace manual operation, accurately control process parameters, ensure process stability, greatly improve the efficiency of scientific research, and eliminate the need for manual handling of tools and consumables, or manual contact with hazardous chemicals, effectively ensuring the health and safety of personnel.

[0049] 3. The chemical module and robot module are integrated and placed in the workspace of the miniaturized machine room. The robot module is assembled from the top, while the multiple chemical modules are arranged in an arc shape. The overall arrangement structure is optimized, achieving a miniaturized design, reducing the space occupied by the clean room in scientific research facilities, and reducing installation and maintenance costs.

[0050] 4. By integrating an etching system with independent liquid supply and etching environment control into the machine system, it can effectively reduce the size and realize a more compact design compared with the enterprise-level centralized liquid supply design, and is compatible with small workpiece experiments. It also reduces the consumption of chemicals and the use of expensive chemicals, significantly reducing the cost of scientific research and providing more functions.

[0051] 5. The design of this fully automated wet etching system for scientific research fills the gap in research on wet equipment / processes for scientific research in the field of traditional technology, greatly improves the efficiency of scientific research and the stability of the process, has a positive and profound impact on the development of semiconductor scientific research, makes important technological contributions to the field of scientific research, and provides great help in promoting economic development.

[0052] As can be seen from the above technical solutions, the embodiment of the fully automated wet etching machine for scientific research according to the present application has the following beneficial effects:

[0053] 1. An automated liquid supply mechanism is used to supply liquid to the chemical section according to a preset liquid supply policy, controlling the etching environment. An automated robot module is also used to flexibly simulate manual operation and complete the etching according to a preset etching policy, thereby enabling flexible process changes and satisfying flexible and varied scientific research scenarios.

[0054] 2. The robot module combines a feeding system that can automatically transport materials and an etching system that can automatically provide chemicals, thereby achieving overall automation control, completely replacing manual operation, accurately controlling process parameters, ensuring process stability, greatly improving the efficiency of scientific research, and eliminating the need for manual handling of tools and consumables, or manual contact with hazardous chemicals, effectively ensuring the health and safety of personnel.

[0055] 3. Each system module is integrated into the machine body, optimizing the overall structure, reducing the size of the equipment, and achieving a compact design, which reduces the space occupied by the clean room in scientific research facilities and reduces installation and maintenance costs.

[0056] 4. An etching system with independent liquid supply and etching environment control is designed and integrated into the machine body. Compared with enterprise-level centralized liquid supply designs, this effectively reduces the size and realizes a more compact design, making it compatible with small workpiece experiments, further reducing the consumption of chemicals and expensive chemicals, significantly reducing the cost of scientific research and enriching the functionality of the machine.

[0057] 5. This design of fully automated wet etching machine for scientific research fills the gap in research on wet equipment / processes for scientific research in the field of traditional technology, greatly improves the efficiency of scientific research and the stability of the process, has a positive and profound impact on the development of semiconductor scientific research, makes important technological contributions to the field of scientific research, and provides great help in promoting economic development.

[0058] In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following briefly describes the drawings that need to be used in the description of the embodiments or the prior art. It is obvious that the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without any creative efforts. [Brief explanation of the drawings]

[0059] [Figure 1] 1 is a perspective view of a fully automated wet etching machine for scientific research according to the present application; FIG. [Figure 2] 1 is a cross-sectional view of a fully automated wet etching machine for scientific research according to the present application. [Figure 3] 1 is a first partial schematic diagram of a fully automated wet etching machine for scientific research according to the present application; FIG. [Figure 4] FIG. 2 is a second partial schematic diagram of a fully automated wet etching machine for scientific research according to the present application. [Figure 5] 1 is a first partial cross-sectional view of a fully automated wet etching machine for scientific research according to the present application; FIG. [Figure 6] FIG. 1 is a perspective view showing the cooperation between the jaw mechanism and the cassette of a fully automated wet etching machine for scientific research according to the present application. [Figure 7] 1 is an exploded schematic diagram of the cooperation between the jaw mechanism and cassette of a fully automated wet etching machine for scientific research according to the present application; FIG. [Figure 8] FIG. 1 is a perspective view of a chemical part with a heater in a fully automated wet etching machine for scientific research according to the present application. [Figure 9] 1 is a cross-sectional view of a chemical part with a heater in a fully automated wet etching machine for scientific research according to the present application. FIG. [Figure 10] FIG. 1 is a perspective view of the chemical part with a heater of the fully automated wet etching machine for scientific research according to the present application, without the tank cover. [Figure 11] FIG. 1 is a perspective view of the chemical part of the fully automated wet etching machine for scientific research according to the present application without a heater, with the tank cover removed. [Figure 12] 1 is a cross-sectional view of the chemical solution section of a fully automated wet etching machine for scientific research according to the present application, without a heating device. [Figure 13] 1 is a schematic diagram of the local structure of a fully automated wet etching machine for scientific research according to the present application, equipped with a transport device; FIG. [Figure 14] 1 is a structural schematic diagram of a transport device for a fully automated wet etching machine for scientific research according to the present application; [Figure 15] FIG. 1 is a system block diagram of a fully automated wet etching system for scientific research according to the present application. DETAILED DESCRIPTION OF THE INVENTION

[0060] The following clearly and completely describes the technical solutions of the embodiments of the present application with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without any creative efforts fall within the scope of protection of the embodiments of the present application.

[0061] In describing the embodiments of the present application, the orientations or positional relationships indicated by terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" are orientations or positional relationships shown based on the drawings, and are intended merely for the convenience and simplification of the description of the embodiments of the present application. They do not indicate or imply that the referenced devices or elements must have a specific orientation or be configured and operated in a specific orientation, and should not be understood as limitations on the embodiments of the present application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

[0062] In the description of the embodiments of the present application, unless otherwise clearly defined or limited, the terms "attached," "connected," and "connected" should be understood in a broad sense, and may refer to, for example, a fixed connection, an exchangeable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or internal communication between two elements. Those skilled in the art may understand the specific meanings of the above terms in the embodiments of the present application according to specific circumstances.

[0063] As a result of research, the applicant has discovered the following.

[0064] The following shortcomings exist in enterprise-level fully automated wet mills:

[0065] 1. It is unable to adapt to the flexible and changing scientific research scenarios, its operation logic is relatively fixed, and it can only complete predetermined simple and repetitive work tasks.

[0066] 2. It is designed for mass production cassettes (4 / 6 / 8 / 12 inch, 25 sheets) and is not compatible with small wafers.

[0067] 3. Chemicals are consumed in large quantities, resulting in waste, inconvenient replacement, and storage safety issues. In scientific research, chemicals are consumed in small quantities (approximately tens to hundreds of milliliters), expensive (several hundred to tens of thousands of yuan per liter), and subject to strict storage requirements. Enterprise-level fully automated wet processing machines are designed for mass production (e.g., solar cell factories) and consume large amounts of chemicals. Furthermore, they employ centralized supply systems, with large storage tanks (20 L to 1,000 L) and large tank capacities (20 to 50 L), requiring periodic replacement (typically one day to two weeks in factories), consuming labor and materials. While reducing the frequency of chemical replacement can save some chemicals, long-term failure can lead to problems such as reduced purity, reagent evaporation, and storage safety. High-temperature chemicals, in particular, are typically mixed and used immediately. Furthermore, the CDS solution must be supplied through long pipes, and if the chemical remains in the pipes and is not cleaned for a long period of time, it will affect the quality of the solution. Even when pumping from the buffer tank to the cleaning tank, there is a certain amount of temperature loss and concentration loss. Scientific research generally uses small-volume chemical buckets (several hundred milliliters to several liters), which are easy to handle and do not require regular replacement. Fully automated wet-type machines use large amounts of chemicals and require regular replacement by a qualified professional. However, university laboratories generally do not have such professionals on hand, and commercial wet-type machine manufacturers generally do not offer chemical replacement services.

[0068] In scientific research, manual operation has the following shortcomings:

[0069] 1. It requires the assistance of small equipment, which makes operation inconvenient. For heating or shaking, it is generally necessary to use a water bath, ultrasonic cleaner, etc., which requires a lot of manual operation and wastes the energy of scientific researchers.

[0070] 2. Inaccurate process control reduces the efficiency of scientific research. Temperature, liquid concentration, rotation speed, etc. are controlled by simple devices, which are inaccurate and have low repeatability, affecting the efficiency of scientific research.

[0071] In order to better solve the above problem, an embodiment of the present application discloses a fully automated wet etching system for scientific research, which, as shown in FIG. 15, comprises: The system includes a machine base system 8, an etching system 3, a feed system 4, a robot system 2, and a control system 1.

[0072] The machine stand system 8 is used to provide a compact machine room including installation space and working space. The term "compact machine room" is a specific noun and does not limit the size of the machine room.

[0073] The etching system 3 includes a plurality of chemical liquid modules 31 arranged in an arc-shaped arrangement in a miniaturized machine room. Each chemical liquid module 31 includes a chemical liquid section 301 and a liquid supply mechanism 32. The liquid supply mechanism 32 supplies liquid to the chemical liquid section 301 according to a preset liquid supply policy and is used to control the etching environment in the chemical liquid section 301.

[0074] For the chemical liquid module 31, the general single-row parallel arrangement method is improved to an arc-shaped arrangement, and more preferably a circumferential arrangement method is adopted, thereby saving space and making the movement trajectory of the robot module 21 more flexible.

[0075] The feed system 4 is used to realize automated transport of the workpiece.

[0076] The robot system 2 includes a robot module 21 and a vision module 22 that is communicatively connected to the robot module 21. The robot module 21 is disposed at the top of the workspace to grasp a workpiece based on image information fed back by the vision module 22, and place the workpiece in the chemical solution section 301 according to a preset etching policy to complete etching.

[0077] The control system 1 is communicatively connected to the machine base system 8, the feed system 4, the robot system 2 and the etching system 3 to realize automated etching operations based on user commands.

[0078] The embodiment of the fully automated wet etching system for scientific research according to the present application has the following beneficial effects.

[0079] 1. The automated liquid supply mechanism 32 is used to supply liquid to the chemical part 301 according to a preset liquid supply policy, controlling the etching environment. The automated robot module 21 is further used in combination with the vision module 22 to flexibly simulate manual operation, and etching is completed according to the preset etching policy, thereby realizing flexible process changes and satisfying flexible and varied scientific research scenarios.

[0080] 2. Realize the overall fully automated control, completely replace manual operation, accurately control process parameters, ensure process stability, greatly improve the efficiency of scientific research, and eliminate the need for manual handling of tools and consumables, or manual contact with hazardous chemicals, effectively ensuring the health and safety of personnel.

[0081] 3. The chemical module 31 and the robot module 21 are integrated and placed in the workspace of the miniaturized machine room, and the robot module 21 is assembled from the top, but the multiple chemical modules 31 are arranged in an arc, optimizing the overall arrangement structure and achieving a miniaturized design, reducing the space occupied by the clean room in scientific research facilities and lowering installation and maintenance costs. (In clean rooms, to maintain cleanliness class 100 and meet the equipment environmental requirements, many measures (circulating air, temperature control, vibration prevention, ultra-pure water, etc.) are required, which results in high operation and maintenance costs. Therefore, by reducing the space occupied by the clean room, installation and maintenance costs can be significantly reduced.)

[0082] 4. By integrating the etching system 3, which can independently supply liquid and control the etching environment, into the machine system 8, it is possible to effectively reduce the size compared to the centralized liquid supply design at the enterprise level, realize a miniaturized design, and be compatible with small workpiece experiments (e.g., small workpieces of 1cm to 2cm). It also reduces the consumption of chemicals and the amount of expensive chemicals used, significantly reducing the cost of scientific research and providing more functions.

[0083] 5. The design of this fully automated wet etching system for scientific research fills the gap in research on wet equipment / processes for scientific research in the field of traditional technology, greatly improves the efficiency of scientific research and the stability of the process, has a positive and profound impact on the development of semiconductor scientific research, makes important technological contributions to the field of scientific research, and provides great help in promoting economic development.

[0084] In one more specific embodiment, the robotic module 21 is further used to grasp a cleaning tool and perform cleaning operations based on image information fed back by the vision module 22 .

[0085] The robot module 21 is configured to perform cleaning operations. Specifically, the vision module 22 captures an image of the interior of the machine room, identifies the location of dirt in the image, and the robot module 21 grabs a cleaning tool to clean the dirty location. By adding a vision identification function to the robot module 21, the robot module 21 can perform cleaning operations tailored to the work area. Combining the robot module 21 with the vision module 22 not only enables cleaning operations, but also enhances operational efficiency by cooperating with 6S management to perform expanded functions such as organizing the work surface.

[0086] If the cleaning function is not provided in the robot module 21, a dedicated cleaning system 9 may be added to perform the cleaning operation. The cleaning system 9 may include at least one of a purge cleaning device and a spray cleaning device.

[0087] In one more specific embodiment, the robot module 21 is designed to be able to perform the operations of grasping (sampling), placing (lofting) the workpiece into the chemical solution section 301, and moving (transporting) the workpiece, as well as to further perform at least one of an extension / retraction operation, a rotation operation, and a jitter operation.

[0088] 1. The robot module 21 has a telescopic function, i.e., when a telescopic mechanism or module is arranged, it can perform telescopic operations, thereby adjusting the overall telescopic length as needed, and further increasing the coverage of the robot module 21 to adapt to different operating scenarios and operational demands.

[0089] 2. If the robot module 21 has a jittering function, i.e., if a jittering mechanism or module is installed, it can perform jittering operations, which allow the robot module 21 to simulate jittering operations performed by a human hand to achieve etching policy operations such as shaking or vibrating the workpiece or material, thereby achieving specific process requirements. Specifically, the robot module 21 can jitter the chemical solution portion 301 or the workpiece at a set frequency and amplitude within a predetermined time period to promote mixing or reaction.

[0090] 3. If the robot module 21 has a rotation function, i.e., if a rotation mechanism or module is configured, it can perform a rotation operation to realize an etching policy operation that rotates the workpiece in the chemical solution unit 301 to complete a specific process step or task. Specifically, the robot module 21 can rotate the chemical solution unit 301 or the workpiece at a set speed and direction within a predetermined time period to achieve stirring and mixing.

[0091] In a more specific embodiment, the apparatus further includes a timing system 6. The timing system 6 is used to obtain operation time information of the machine base system 8, the feed system 4, and the robot system 2 and feed it back to the control system 1 so that the control system 1 can control the machine base system 8, the feed system 4, the robot system 2, and the etching system 3 according to a preset time policy. For example, the timing system 6 can cause the robot module 21 / liquid supply mechanism 32, etc., to perform operations such as timing addition or timing sampling of chemical solutions according to a preset time interval, thereby achieving stable control of process parameters and time.

[0092] In one more specific embodiment, the system further includes a human-computer interaction system 5 and a monitoring system 7 .

[0093] The human-computer interaction system 5 is communicatively connected to the control system 1 and realizes human-computer interaction between an operator and each system module. For example, the operator can issue various execution commands to each system module to control the execution operations and functions of each system module, or easily obtain each operation data of each system module.

[0094] The monitoring system 7 is used to acquire operation data of the machine base system 8, the robot system 2, the etching system 3, and the feed system 4, and to issue an alarm when the operation data exceeds a threshold. The monitoring system 7 is further used to monitor the machine base system 8, the robot system 2, the etching system 3, and the feed system 4 in real time according to a preset monitoring policy.

[0095] In one more specific embodiment, the liquid supply mechanism 32 includes a liquid supply module 33 and an etching environment module 34 .

[0096] The liquid supply module 33 is used to supply the liquid chemical in the small-capacity liquid tank 600 to the liquid chemical unit 301, and has the functions of supplying liquid, distributing liquid, and controlling the liquid level. The term "small-capacity liquid tank" is a specific noun and does not limit the size of the liquid chemical unit. Of course, this application achieves a compact design by optimizing the overall structure, and the size of the small-capacity liquid chemical tank 600 connected thereto is also naturally small. The use of a small-capacity and small-volume liquid chemical unit further conserves the amount of liquid chemical.

[0097] The etching environment module 34 includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulation filtration module.

[0098] The chemical solution unit 301 has a heating function, a bubbling function, an ultrasonic vibration function, a cleaning function, a spray function, a circulating filtration function, and the like, under the control of the etching environment module 34. The etching environment control realized based on these functions may be, for example, to create an etching environment by simultaneously performing heating at a preset temperature with circulating filtration and spraying, or simultaneously performing bubbling with circulating filtration, or simultaneously performing ultrasonic vibration with bubbling, or simultaneously performing bubbling with liquid spraying, and this policy may be implemented by the liquid supply mechanism 32 in cooperation with the human-computer interaction system 5, the timing system 6, etc.

[0099] The chemical solution section 301 is provided with an overflow recovery module so as to have an overflow function.

[0100] The above-mentioned fully automated wet etching system for scientific research has the advantages of being intelligent and compact, and can be flexibly applied to various scientific research scenarios, improving the efficiency of scientific research, saving scientific research resources, and ensuring the safety of personnel and equipment, and has very good commercial value and economic benefits.

[0101] The embodiments of the present application further disclose a fully automated wet etching machine platform for scientific research, which is constructed based on the fully automated wet etching system for scientific research described above.

[0102] Referring to FIGS. 1, 2 and 15, one embodiment of a fully automated wet etching machine for scientific research according to the present application includes: It includes a machine body 100 and a fully automated wet etching system for scientific research.

[0103] The fully automated wet etching system for scientific research is arranged on the machine body and includes a machine base system 8, an etching system 3, a feed system 4, a robot system 2, and a control system 1.

[0104] The machine stand system 8 is used to provide a compact machine room including mounting space and working space.

[0105] The etching system 3 includes a plurality of chemical liquid modules 31 arranged in an arc-shaped arrangement in a miniaturized machine room. Each chemical liquid module 31 includes a chemical liquid section 301 and a liquid supply mechanism 32. The liquid supply mechanism 32 supplies liquid to the chemical liquid section 301 according to a preset liquid supply policy and is used to control the etching environment in the chemical liquid section 301.

[0106] The feed system 4 is used to transport the workpiece 500 to the working space and to close the working space after the transportation is completed.

[0107] The robot system 2 includes a robot module 21 and a vision module 22 that is communicatively connected to the robot module 21. The robot module 21 is disposed at the top of the workspace to grasp a workpiece based on image information fed back by the vision module 22, and place the workpiece in the chemical solution section 301 according to a preset etching policy to complete etching.

[0108] The control system 1 is communicatively connected to the machine base system 8, the feed system 4, the robot system 2 and the etching system 3 to realize automated etching operations based on user commands.

[0109] The fully automated wet etching machine for scientific research according to this embodiment or the combination of the machine and its modules has all or some of the following beneficial effects.

[0110] 1. The automated liquid supply mechanism 32 is used to create an etching environment in the chemical section according to a preset liquid supply policy, and the automated robot module 21 is used to flexibly simulate manual operation and complete the etching according to the preset etching policy, thereby enabling flexible changes in the process and satisfying flexible and varied scientific research scenarios.

[0111] 2. The robot module 21, combined with the feeding system 4 that can automatically transport materials and the etching system 3 that can automatically provide chemicals, achieves overall automated control, completely replaces manual operation, accurately controls process parameters, ensures process stability, greatly improves the efficiency of scientific research, and eliminates the need for manual handling of tools and consumables, or manual contact with hazardous chemicals, effectively ensuring the health and safety of personnel.

[0112] 3. Furthermore, based on the general process of scientific research, each system module is integrated into the base 100, optimizing the overall structure, reducing the size of the equipment, and achieving a compact design, avoiding the occupation of valuable clean room space for scientific research. This also facilitates flexible positioning and avoiding collisions between personnel. To achieve flexible movement, the base 100 is equipped with a wheel device and a fixing device at its bottom, and an anti-corrosion base is added, allowing for height adjustment and locking. It can also be firmly fixed to the floor and locked, preventing shaking and jitter caused by the operation of the robot module 21. When multiple bases 100 are used, they can be divided into different bases 100 to perform different processes. Each base 100 is provided with a removable etching system 3, enhancing flexibility of use.

[0113] 4. By designing and integrating an etching system 3 that can independently supply liquid and control the etching environment into the machine body 100, compared with enterprise-level centralized liquid supply designs, it effectively achieves size reduction, realizes a compact design, is compatible with small workpiece experiments, further reduces the consumption of chemical liquids, reduces the use of expensive chemicals, significantly saves scientific research costs, and enriches the functions of the machine body 100.

[0114] 5. This design of fully automated wet etching machine for scientific research fills the gap in research on wet equipment / processes for scientific research in the field of traditional technology, greatly improves the efficiency of scientific research and the stability of the process, has a positive and profound impact on the development of semiconductor scientific research, makes important technological contributions to the field of scientific research, and provides great help in promoting economic development.

[0115] The above is Embodiment 1 of the fully automated wet etching machine for scientific research according to the present application. The following is Embodiment 2 of the fully automated wet etching machine for scientific research according to the present application, specifically referring to Figures 1 to 15.

[0116] According to the first embodiment of the fully automated wet etching machine for scientific research, In one more specific embodiment, the robot module 21 is designed to be able to perform the operations of grasping (sampling), placing (lofting) the workpiece into the chemical solution section 301, and moving (transporting) the workpiece, as well as to further perform at least one of an extension / retraction operation, a rotation operation, and a jitter operation.

[0117] 1. The robot module 21 has a telescopic function, i.e., when a telescopic mechanism or module is arranged, it can perform telescopic operations, thereby adjusting the overall telescopic length as needed, and further increasing the coverage of the robot module 21 to adapt to different operating scenarios and operational demands.

[0118] 2. If the robot module 21 has a jittering function, i.e., if a jittering mechanism or module is installed, it can perform jittering operations, which allow the robot module 21 to simulate jittering operations performed by a human hand to achieve etching policy operations such as shaking or vibrating the workpiece or material, thereby achieving specific process requirements. Specifically, the robot module 21 can jitter the chemical solution portion 301 or the workpiece at a set frequency and amplitude within a predetermined time period to promote mixing or reaction.

[0119] 3. If the robot module 21 has a rotation function, i.e., if a rotation mechanism or module is configured, it can perform a rotation operation to realize an etching policy operation that rotates the workpiece in the chemical solution unit 301 to complete a specific process step or task. Specifically, the robot module 21 can rotate the chemical solution unit 301 or the workpiece at a set speed and direction within a predetermined time period to achieve stirring and mixing.

[0120] Since the operating environment in which the robot module 21 is located involves flammable and explosive hazardous materials such as acids, alkalis, and organic substances, the explosion and corrosion protection design of the robot module 21 must be sufficiently good. For the safety explosion-proof design reinforcement design, explosion-proof materials and explosion-proof devices are used in the structure and electrical system of the robot module 21 to ensure that no fire or explosion accidents occur in flammable and explosive environments. For the corrosion-proof performance reinforcement design, corrosion-resistant materials or special coating treatments are used for the housing and key components of the robot module 21 to prevent damage to the robot module 21 from corrosive substances such as acids and alkalis.

[0121] The robot module 21 of the present application is designed to have the functions of grasping (sampling) the workpiece 500, placing (lofting) the workpiece 500 into the chemical solution section 301, and moving (transporting) the workpiece 500, where there are two methods for sampling and lofting.

[0122] First type of method: Sampling is performed by extracting the cassette 205 in which the workpiece 500 is stored. The cassette 205 is designed adaptively according to the size of the workpiece 500 to be tested in order to accommodate small workpieces 500.

[0123] Type 2: The workpiece 500 is directly gripped and sampled from the tool. This method has the following features: 1. A double-sided clamping method is used to ensure that square pieces of 1cm to 2cm can be stably and flexibly clamped without affecting the surface of the workpiece 500. 2. The control force is accurate to 0.01N, making it less likely to break into pieces. 3. The sample can be loaded and unloaded and transported.

[0124] Both of these sampling methods can meet the sampling needs of different scenarios and further increase the throughput, especially for workpieces 500 such as small wafers.

[0125] The robot module 21 realizes automatic control through the control system 1, realizes control of the lofting positioning accuracy and conveying speed, effectively solves process problems such as adhesive coating uniformity, temperature change, and corrosion time control, and improves process stability.

[0126] The robot module 21 may be configured to have a cleaning function for cleaning the internal working area of ​​the machine body 100 .

[0127] Cleaning control method 1: The robot module 21 grasps the cleaning tool and cleans the upper chamber according to a preset cleaning path. Specifically, it grasps the cleaning tool with dust-free paper / cloth to simulate the wiping action of a human hand. This robot module 21 may also be equipped with the ability to suck up the cleaning tool.

[0128] Cleaning control method 2: Using the vision module 22, the vision module 22 acquires an image of the interior of the machine room and identifies the location of dirt in the image, and the robot module 21 grabs the cleaning tool to clean the dirty location. By adding a vision identification function to the robot module 21, the robot module 21 can perform cleaning operations according to the purpose of the work area. Combining the robot module 21 with the vision module 22 not only enables cleaning operations, but also cooperates with 6S management to perform extended functions such as organizing the work surface, improving operating efficiency.

[0129] The installation of the vision module allows for more accurate interconnection between the robot module 21 and the feed system 4 and etching system 3, realizing highly intelligent operation and improving production efficiency and precision.

[0130] The robot module 21 in cleaning control method 1 and cleaning control method 2 may be an independently added robot module dedicated to cleaning, thereby realizing a dual robot module design.

[0131] In one more specific embodiment, the system further includes a timing system 6, which is used to obtain the operation time of the robot module 21 and control the operation of the robot module 21 according to a preset operation time policy. The timing system 6 allows the robot module 21 / liquid supply mechanism, etc., to perform operations such as timing addition or timing sampling of chemical solutions according to a preset time interval, thereby achieving stable control of process parameters and time.

[0132] In one more specific embodiment, if the robot module 21 does not have a cleaning function, a dedicated cleaning system 9 may be added. The cleaning system 9 is installed in the machine body 100 to clean the inside of the machine chamber. The cleaning system 9 includes at least one of a purge cleaning device and a spray cleaning device, and specifically realizes, for example, nitrogen gas purge cleaning, spray cleaning, etc.

[0133] In one more specific embodiment, the system further includes a human-computer interaction system 5 and a monitoring system 7 .

[0134] The human-computer interaction system 5 is communicatively connected to the control system 1 and realizes human-computer interaction between an operator and each system module. For example, the operator can issue various execution commands to each system module to control the execution operations and functions of each system module, or easily obtain each operation data of each system module.

[0135] As shown in FIG. 1, the human-computer interaction system 5 of the present application includes an electrically controlled cantilever 111 fixed to a machine body 100, and / or a remote control terminal.

[0136] The monitoring system 7 is used to acquire operation data of the machine base system 8, the robot system 2, the etching system 3, and the feed system 4, and to issue an alarm when the operation data exceeds a threshold. The monitoring system 7 is further used to monitor the machine base system 8, the robot system 2, the etching system 3, and the feed system 4 in real time according to a preset monitoring policy.

[0137] The monitoring system 7 is configured with various sensors, such as a temperature sensor for detecting the temperature of the liquid chemical in the liquid chemical section 301, a liquid level sensor for detecting the amount of the liquid chemical in the liquid chemical section 301, an air pressure sensor for detecting the air pressure in the operating area in the machine room, etc. As shown in Fig. 1, an anemometer 112 and a thermometer 113 may be disposed on the front of the machine body 100.

[0138] In one more specific embodiment, the liquid supply mechanism 32 includes a liquid supply module 33 and an etching environment module 34 .

[0139] The liquid supply module 33 is used to supply the liquid chemical in the small-capacity liquid tank 600 to the liquid chemical unit 301, and has the functions of supplying liquid, distributing liquid, and controlling the liquid level. The term "small-capacity liquid tank" is a specific noun and does not limit the size of the liquid chemical unit. Of course, this application achieves a compact design by optimizing the overall structure, and the size of the small-capacity liquid chemical tank 600 connected thereto is also naturally small. The use of a small-capacity and small-volume liquid chemical unit further conserves the amount of liquid chemical.

[0140] The etching environment module 34 includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulation filtration module.

[0141] The chemical solution unit 301 has a heating function, a bubbling function, an ultrasonic vibration function, a cleaning function, a spray function, a circulating filtration function, and the like, under the control of the etching environment module 34. The etching environment control realized based on these functions may be, for example, to create an etching environment by simultaneously performing heating at a preset temperature with circulating filtration and spraying, or simultaneously performing bubbling with circulating filtration, or simultaneously performing ultrasonic vibration with bubbling, or simultaneously performing bubbling with liquid spraying, and this policy may be implemented by the liquid supply mechanism 32 in cooperation with the human-computer interaction system 5, the timing system 6, etc.

[0142] The chemical solution section 301 is provided with an overflow recovery module so as to have an overflow function.

[0143] Based on the above solution, the automated scientific research scenario of the present application can be realized, for example, as follows:

[0144] 1. After the robot module 21 identifies the size and position of the workpiece 500 using the vision module 22, it moves to the corresponding position to grab the workpiece 500, and then places the workpiece 500 into the corresponding chemical solution section 301.

[0145] 2. When the workpiece 500 is immersed in the chemical solution section 301, the robot module 21 jitters or rotates the workpiece 500 located in the chemical solution section 301 at preset time intervals under the control of the timing system 6, and can detect the debris situation through feedback from the vision module 22 or other sensor modules.

[0146] According to the present application, the robot module 21 and the automation function module of the machine body 100 can be interconnected to realize human-machine interconnection and advanced intelligence, specifically, the following functions can be realized:

[0147] 1. Human-machine interconnection: The robot module 21 exchanges data and transmits commands with humans in real time. Humans can monitor the operating status of the robot module 21 and the machine body 100 and view experimental data and results in real time through a monitoring system 7 consisting of a computer or mobile device. The robot module 21 can interact with or be operated by humans through a human-computer interaction system 5 consisting of a voice or touchscreen interface.

[0148] 2. Automated Operation: The robot module 21 can perform various operations, such as sampling, adding liquid, stirring, heating, etc. By arranging the sensor and vision module 22, the robot module 21 can automatically adjust and make decisions by monitoring and identifying the conditions of the experimental environment and the workpiece 500.

[0149] 3. Smart decision-making: The robot module 21 can automatically analyze experimental data and make appropriate decisions based on pre-set workflows and algorithms. For example, it can automatically adjust reaction conditions and dosages based on real-time parameters such as temperature and chemical concentration to achieve optimal reaction results.

[0150] 4. Automatic fault diagnosis and maintenance: The robot module 21 can monitor the operating status of the entire wet machine base through the monitoring system 7, and detect and report potential faults in a timely manner. When a fault occurs, the robot module 21 can automatically stop operation and provide a preliminary analysis of the fault cause and suggest repair methods.

[0151] In a more specific embodiment, as shown in FIG. 2 , the robot module 21 may be a multi-axis collaborative robot, specifically a six-axis collaborative robot. Conventional modular robots or industrial robots have strong load-bearing capabilities and a large working range, but compared to collaborative robots, they lack flexibility and intelligence in terms of movement, movement trajectory, operation logic, and functions, making them unable to adapt to flexible and varied scientific research scenarios. Industrial robot modules generally have pre-programmed movement trajectories, relatively fixed movements and operation logic, and are only capable of completing certain simple, repetitive tasks. In contrast, collaborative robots use human-computer interaction to sense the surrounding environment in real time through sensors, autonomously make decisions, and adjust their movement trajectories and movements according to changes in tasks and actual situations, resulting in greater flexibility and adaptability and the ability to accomplish more complex tasks. Therefore, the robot module 21 in this application is designed as a collaborative robot.

[0152] For a preset etching policy, it may be summarized as a time / state change policy in the constructed etching environment of the workpiece 500, for example:

[0153] 1. Immersion time policy. This may be continuous immersion within a certain time range or immersion at certain time intervals. The execution of this policy may be realized by the robot module 21 in cooperation with the telescopic mechanism and timing system 6.

[0154] 2. Stationary state policy: This may involve a specific state change within a certain time range, for example, jittering the workpiece 500 at a set frequency or rotating it at a set speed at regular intervals during the stationary state process. The execution of this policy may be achieved by the robot module 21 through cooperation of the timing system 6, the jitter mechanism, the rotation mechanism, etc.

[0155] Of course, the present invention is not limited to the above control policy, and those skilled in the art may change the control policy according to the needs of the actual process, and is not limited thereto.

[0156] In one more specific embodiment, as shown in Figures 3 and 4, a support partition plate 101 is provided in the miniaturized machine chamber, and the support partition plate 101 divides the miniaturized machine chamber into an upper chamber and a lower chamber.

[0157] The robot module 21 is mounted on top of the upper chamber, a design that is both aesthetic and space-saving.

[0158] In a more specific embodiment, the chemical solution units 301 are multiple and arranged in a circumferential direction in the lower chamber, improving the general parallel arrangement in a single row to a circular arrangement, which saves space and makes the robot module 21's movement trajectory more flexible.

[0159] The support partition plate 101 is provided with first evacuation ports 102 which communicate with the respective chemical liquid sections 301 in one-to-one correspondence.

[0160] In this design layout of the present application, the quantity of chemical solution section 301 can be reduced to some extent compared to the design of an enterprise-level wet machine stand, thereby realizing a reduction in the size of the equipment, facilitating user use and improving equipment utilization. Based on the design that reduces the size of the equipment, the capacity of chemical solution section 301 can be reduced, and the amount of chemical solution used can be significantly reduced compared to the design of an enterprise-level wet machine stand.

[0161] In one more specific embodiment, in terms of the layout of the machine body 100, an electrical control room 115 and a concentrate room 114 for storing small-capacity chemical tanks 600 shown in Figure 2 may be provided in the space below the compact machine room within the machine body 100. The controllers for the robot module 21, the transport device 402, and the etching system 3 are all centrally installed in the electrical control room 115, and all electrical equipment and wiring that may come into contact with chemical mist are treated with PFA corrosion protection and insulation.

[0162] In one more specific embodiment, as shown in FIG. 3, the machine base system 8 further includes a fan filter unit (FFU) 106, in which a high-efficiency filtration device is disposed.

[0163] For example, if the robot module 21 is placed at the top of the upper chamber, the fan filter unit 106 may be designed to be split into two units and installed at an interval to allow the installation of the robot module 21 to be evacuated and create more space.

[0164] The machine base body 100 is provided with an exhaust port and an air inlet that communicate with the upper chamber, and a fan filter unit 106 is attached to the machine base body 100 and connected to the air inlet. The fan filter unit 106 is used to ensure that the air quality in the operating area of ​​the robot module 21 complies with the cleanliness class 100 requirements.

[0165] In one more specific embodiment, a nitrogen gas gun and a pure water gun are further installed on the left and right sides of the front of the upper chamber, respectively, and the pure water gun is designed to drip live water, making it easier to clean the fragile workpiece 500.

[0166] In one more specific embodiment, an automatic fire suppression system is further provided, the automatic fire suppression system including sensors for detecting smoke, temperature, open flame, etc., and the automatic fire suppression system is configured to have the ability to operate even during a power outage.

[0167] In one more specific embodiment, as shown in FIG. 1, the machine base system 8 further includes an explosion-proof lighting device 107, which is mounted on the machine base body 100 to illuminate the upper chamber.

[0168] The machine base 100 is provided with an observation window 117 for observing the upper chamber to facilitate observation of the operating status of the robot module 21. The machine base 100 is also provided with an automatic lifting safety door, and the automatic lifting safety door is equipped with an erroneous operation alarm device to ensure the safety of personnel.

[0169] In one more specific embodiment, the spray cleaning device is arranged as shown in FIG. 4, specifically including a spray assembly 109 and a spray moving device 108. The spray moving device 108 is attached to the upper chamber and connected to the spray assembly 109 to move the spray assembly 109. The spray moving device 108 may be two sets, specifically linear displacement modules, symmetrically installed at both edge positions of the support partition 101, with their respective driving ends connected to the spray assemblies 109 to move the spray assembly 109 back and forth above the support partition 101. The spray assembly 109 is a spray pipe with an array of nozzles, which cleans the working surface of the support partition 101 by spraying and dispersing water.

[0170] To facilitate drainage, the support partition plate 101 is provided with a plurality of first drainage holes 103, and the lower chamber is provided with a main drainage pipe that communicates with the outside of the machine body 100. The wastewater discharged into the lower chamber through the first drainage holes 103 is discharged from the machine body 100 through the main drainage pipe.

[0171] In one more specific embodiment, as shown in Fig. 4, in order to prevent water from accumulating on the top of the support partition plate 101, a water collecting section 104 is provided in the center of the support partition plate 101, and the accumulated water is collected by the water collecting section 104 and discharged through a second drainage hole 105 provided in the water collecting section 104. To achieve a better water collection and drainage effect, the entire support partition plate 101 may be configured to have a constant slope from the periphery toward the center, or the entire support partition plate may be configured to have a constant slope toward one position, and there are no specific limitations.

[0172] 5, in order to prevent water leaking through the first drain hole 103 from affecting some electrical control devices, control elements, wiring conduits, etc., a support cylinder 110 is provided in the center of the lower chamber to connect the support partition plate 101. An independent positioning control chamber is provided within the support cylinder 110, and this support cylinder 110 can also serve to support and reinforce the support partition plate 101.

[0173] In the present application, the second drain hole 105 is configured to communicate with the position control chamber. To prevent water leaking through the second drain hole 105 from affecting components inside the position control chamber, a branch drain pipe connecting the second drain hole 105 is provided inside the position control chamber. The end of the branch drain pipe remote from the second drain hole 105 extends outside the support cylinder 110, and specifically, may extend directly outside the machine base body 100.

[0174] In one more specific embodiment, as shown in FIG. 6, in order to grasp the workpiece 500, a cassette jaw mechanism 204 for grasping a cassette 205 is connected to the end of the robot module 21, and therefore, the robot module 21 further includes a cassette 205 for storing the workpiece 500, and uses the cassette jaw mechanism 204 to grasp / release the cassette 205.

[0175] The cassette jaw mechanism 204 specifically includes a clamp drive assembly 201 and two jaw members 202, and the clamp drive assembly 201 is connected to the two jaw members 202 to drive the opening and closing of the two jaw members 202 and clamp the cassette 205.

[0176] In order to achieve a relatively good explosion-proof and corrosion-proof effect, the clamp drive assembly 201 is exteriorly covered with an explosion-proof and corrosion-proof protective cover 203 .

[0177] In one more specific embodiment, as shown in Figures 6 and 7, the cassette 205 of the present application is designed to accommodate the storage needs of small workpieces 500, and the design specifications are applicable to, for example, 4 / 6 inch workpieces 500 and 1 cm to 2 cm square strip workpieces 500.

[0178] Taking a design applied to a 4 / 6 inch workpiece 500 as an example, the cassette 205 specifically includes two fixing plates 206 .

[0179] The two fixed plates 206 are installed parallel to each other at a distance from each other and are fixedly connected between them via a number of connecting rods 207. The space between each connecting rod 207 and the two fixed plates 206 is surrounded to form a storage cavity 500 for storing the workpiece. The workpiece 500 enters through the two fixed plates 206 and is placed in the enclosed storage cavity, and can be fixed by utilizing the stopper action of the fixed plates 206 and the connecting rods 207.

[0180] To facilitate gripping of the jaw members 202, a handle block 210 is fixedly connected at the top position between the two fixed plates 206, and guide locking grooves 211 are provided on both sides of the handle block 210. Positioning protrusions 212 that lock into the guide locking grooves 211 are provided on the clamping surfaces of the two jaw members 202, and the positioning cooperation between the positioning protrusions 212 and the guide locking grooves 211 is utilized to achieve a secure connection between the jaw members 202 and the handle block 210.

[0181] In addition, a stopper flange 213 is provided on the bottom of each jaw member 202 so as to be able to come into contact with the bottom of the handle block 210, and the stopper flange 213 can hold down the handle block 210 to prevent it from falling.

[0182] In one more specific embodiment, taking a design applied to a 1 cm to 2 cm square workpiece 500 as an example, the cassette 205 includes a bottom plate and two fixing plates 206 shown in FIGS.

[0183] The two fixed plates 206 are installed on top of the fixed plates 206 at a distance from each other, and a handle block 210 is fixedly connected to the top position between the two fixed plates 206, with guide locking grooves 211 formed on both side surfaces of the handle block 210. The clamping surfaces of the two jaw members 202 are provided with positioning protrusions 212 that lock into the guide locking grooves 211, and the bottoms of the jaw members 202 are each provided with a stopper flange 213 that can come into contact with and abut against the bottom of the handle block 210.

[0184] A plurality of stopper levers are fixed between the two fixing plates 206 of the bottom plate, and the space between the adjacent stopper levers and the bottom plate is surrounded to form a storage cavity for storing the workpiece 500. The difference between this design and the design using the 4 / 6 inch lies in the formation of the bottom plate and the storage cavity, and those skilled in the art may change the design as needed, and is not limited to this.

[0185] 6 and 7, in the design proposal of the two cassettes 205, positioning blocks 209 are fixed to the opposing sides of the two fixing plates 206, and the positioning blocks 209 may have an L-shaped structure. A pressing block 208 for pressing the workpiece 500 is movably inserted between the two positioning blocks 209, and gaps are provided on both sides of the pressing block 208 to allow the vertical blocking portions of the positioning block 209 to movably pass through, while the horizontal blocking portions of the positioning block 209 act as stoppers to prevent the attached pressing block 208 from sliding downward and coming off the positioning block 209. In this configuration, the pressing block 208 is adjustable and movable up and down, and can be flexibly adjusted according to the size of the workpiece 500 to be stored, thereby realizing a pressing effect on workpieces 500 of various sizes, preventing the workpiece 500 from being immersed in the chemical solution and floating up and dropping, and ensuring the stability and safety of the small workpiece 500 within the cassette 205. The positioning block 209 may be configured so that the mounting position up and down can be adjusted, thereby further widening the range of application of the pressing block 208.

[0186] In one more specific embodiment, in order to better position and fix the workpiece 500, as shown in FIG. 7, the connecting rod 207 and the stopper lever are both provided with a slot 214 for the workpiece 500 to engage.

[0187] In one more specific embodiment, the fluid supply mechanism 32 includes a fluid delivery device and a fluid drainage device to form a fluid supply module 33 .

[0188] The liquid delivery device includes a pump pipe and a chemical pump.

[0189] One end of the pump piping is connected to the chemical liquid section 301 and the other end is connected to the small-capacity chemical liquid tank 600, and the chemical liquid pipe is designed as a vial. A chemical liquid pump is attached to the pump piping to pump the chemical liquid in the small-capacity chemical liquid tank 600 to the chemical liquid section 301 according to a preset liquid supply policy. The chemical liquid in the small-capacity chemical liquid tank 600 is pumped directly to the chemical liquid section 301 via the chemical liquid pump. One small-capacity chemical liquid tank 600 corresponds to one pump piping, and each pump piping corresponds to one chemical liquid pump, so one small-capacity chemical liquid tank 600 can supply liquid to multiple chemical liquid sections 301.

[0190] The drainage device includes a drainage tube and a drainage valve 310 , and the drainage tube is connected to the chemical solution section 301 .

[0191] The drain valve 310 is connected to a drain pipe and is used to control the flow rate of the drain pipe according to a preset liquid supply policy. A liquid level sensor is provided in the chemical liquid section 301 to detect the liquid level of the chemical liquid. This configuration allows for dynamic changes in the liquid level and allows the liquid level to be adjusted according to the etching demands of different workpieces.

[0192] The chemical pump may be, specifically, a pneumatic diaphragm pump, which is a small flow pump, and by pumping the chemical directly into the chemical section 301, the pumping time can be significantly reduced and the residue in the chemical pipeline can be reduced.

[0193] In this configuration, a centralized liquid supply port may be provided for use in mass production.

[0194] Depending on the process needs, each chemical section 301 can accommodate multiple small-capacity chemical tanks 600 containing different chemicals, allowing for direct chemical mixing within the chemical section 301. If the mixed liquid has a severe reaction, an additional mixing tank can be added. By setting the parameters of the chemical pump, the solution blending ratio and amount used can be accurately controlled, enabling automatic liquid distribution. The small-capacity chemical tanks 600 are designed as small-capacity flasks, and their small volume design further reduces the amount of chemical used.

[0195] In one more specific embodiment, as shown in FIGS. 9 and 12, chemical solution section 301 is provided with chemical solution chamber 305 and overflow chamber 306 for forming an overflow module.

[0196] The chemical chamber 305 contains the chemical supplied by the liquid supply mechanism 32 and is used to hold the workpiece 500, while the overflow chamber 306 is used to receive the chemical that overflows from the chemical chamber 305.

[0197] The overflow chamber 306 is provided with an overflow recovery port 307, and the chemical chamber 305 is provided with an inlet port 308 connected to a pump pipe and a drain port 309 connected to a drain pipe. The drain valve 310 may be a quick drain valve. The chemical chamber 305 is provided with the aforementioned liquid level sensor for detecting the liquid level. This liquid level sensor enables automatic liquid level control, thereby saving the amount of chemical and ensuring the safety of the equipment. Before inserting cassettes 205 containing workpieces 500 of different sizes, different liquid levels may be set depending on the size of the workpieces 500 and the cassette 205. The liquid level sensor monitors the liquid level in the chemical chamber 305 in real time and provides feedback to the control system 1. The control system 1 controls the pumping rate of the chemical pump or the opening and closing degree of the drain valve 310 to maintain the liquid level within a set range, thereby achieving accurate and stable liquid level control.

[0198] In one more specific embodiment, as shown in FIGS. 8 to 11, the chemical solution portion 301 specifically includes an inner tank body 302.

[0199] An inlet is formed in the top opening of the inner tank body 302. The chemical solution chamber 305 is formed by the internal space of the inner tank body 302, and a positioning structure for positioning the cassette 205 is provided at the bottom of the inner tank body 302.

[0200] A connecting flange 303 is provided around the outer periphery of the inner tank body 302, and a side wall 304 is connected to the top edge of the connecting flange 303. An overflow chamber 306 is defined between the side wall 304, the top surface of the connecting flange 303, and the outer periphery of the inner tank body 302. The inner tank body 302, connecting flange 303, and side wall 304 are connected and fixed by welding, but specific manufacturing materials are adaptively selected to match the chemical liquid to be stored. The chemical liquid section 301 of the present application has a small capacity of 1.3 L and 130 mL, which is compatible with 4 / 6-inch workpieces 500 and small workpieces 500 measuring 1 cm to 2 cm, allowing for significant savings in the amount of chemical liquid used.

[0201] 9, in a more specific embodiment, the liquid supply mechanism 32 further includes a heating device 312 for forming a heating module, and the heating device 312 is used to heat the liquid in the liquid chamber 305 according to a preset liquid supply policy. The heating device 312 is not necessarily provided in all liquid sections 301, and may be flexibly provided as needed. For example, if the liquid in some liquid sections 301 does not require heating for the liquid experiment, the heating device 312 may not be provided.

[0202] In a more specific embodiment, the heating device 312 may be configured for direct heating or water bath heating, with water bath heating being safer for flammable and explosive organic chemicals. As shown in Figure 9, the chemical solution section 301 further includes an outer tank body.

[0203] The bottom of the inner tank body 302 extends into the outer tank body, and the connecting flange 303 is connected to the outer tank body so that the area between the connecting flange 303, the outer tank body, and the inner tank body 302 forms a heating chamber 311. The outer tank body is provided with a medium inlet pipe and a medium outlet pipe communicating with the heating chamber 311. A heating device 312 is attached to the heating chamber 311 to heat the heat conduction medium in the heating chamber 311. The heat conduction medium may be conventional water or heat conduction oil, but is not specifically limited. The heating device 312 may also be an electric heating tube or electric heating wire. A temperature sensor may be installed in the heating chamber 311 to detect the temperature of the heat conduction medium and provide feedback to the control system 1, so that the control system 1 can accurately control the heating temperature of the chemical solution chamber 305 by controlling the power of the heating device 312.

[0204] In a more specific embodiment, the liquid supply mechanism 32 further includes a circulation device for forming a circulation filtering module or a circulation spray device for forming a spray module, where the circulation device is used to extract the liquid medicine from the liquid medicine chamber 305 according to a preset liquid supply policy, filter the liquid medicine, and then return it to the liquid medicine chamber 305. The circulation spray device is used to extract the liquid medicine from the liquid medicine chamber 305 according to a preset liquid supply policy, filter the liquid medicine, and then return it to the liquid medicine chamber 305 in a spray manner.

[0205] By adding a circulation device, the chemical solution is circulated, and the chemical solution in the chemical solution chamber 305 is made to flow, allowing it to contact the workpiece 500 more thoroughly, thereby enhancing the cleaning and etching effect. Specifically, the circulation device may include a circulation pump, a circulation transport pipe, and a filtration device. The input end of the circulation pump is connected to the filter and connected to one side of the chemical solution chamber 305 via the circulation transport pipe, and the output end of the circulation pump is connected to the other side of the chemical solution chamber 305 via the circulation transport pipe.

[0206] On the other hand, the circulation spray device differs from the circulation device in its reflux method, and since it circulates in the form of a spray, the circulation spray device may specifically include a circulation pump, a circulation transport pipe, a spray head, and a filtration device.

[0207] Of course, for the spray, a spray head can be connected to one end of the pump pipe to realize the spray function, that is, the liquid can be introduced in the form of a spray.

[0208] In one more specific embodiment, the liquid supply mechanism 32 further includes a bubbling device for forming a bubbling module, and the bubbling device is used to bubble the liquid chemical in the liquid chemical chamber 305 according to a preset liquid supply policy to realize the bubbling function of the liquid chemical section 301.

[0209] In a more specific embodiment, the etching system 3 further includes a cleaning device 315, which is used to clean the workpiece 500 in the chemical chamber 305. The cleaning device 315 may be configured in two, specifically, may be a spray pipe. The two cleaning devices 315 may be symmetrically attached to the chemical section 301 and installed facing the chemical chamber 305, as shown in FIG. 10 , and one of the cleaning devices 315 may be connected to a nitrogen gas tank via a sprinkler, while the other cleaning device 315 may be connected to a pure water tank via a sprinkler.

[0210] In a more specific embodiment, as shown in FIG. 8 , the etching system 3 further includes an etching switch cover device for controlling the opening and closing of the inlet of the chemical chamber 305. The etching switch cover device includes an etching end cap 313 and a switch driver 314. One end of the etching end cap 313 is hingedly connected to one end of the inner tank body 302 via a rotating shaft. The switch driver 314 is attached to the chemical unit 301 and connected to the rotating shaft to rotate the rotating shaft and further control the opening and closing of the etching end cap 313. The etching switch cover device can improve data accuracy and ensure personnel safety.

[0211] The automatically controlled etching switch cover device can improve operational efficiency and reduce direct contact between operators and hazardous substances, and can be interconnected with the control system 1. For example, when the monitoring system 7 detects an abnormality in the equipment, it controls the etching switch cover device to close the chemical solution section 301. The switch driver 314 may be a pneumatic telescopic cylinder, which rotates the rotary shaft via a link mechanism, and the timing and frequency of automatically opening and closing the etching end cap 313 can be set according to process and safety needs, thereby improving the reliability, efficiency, and safety of scientific research experiments.

[0212] In one more specific embodiment, the liquid supply mechanism 32 further includes an ultrasonic device for vibrating the liquid supply chamber 305 according to a preset liquid supply policy.

[0213] The functions of the etching system 3 listed in this application, such as spray, circulating filtration spray, heating, circulating filtration, automatic liquid distribution, vibration, bubbling, and overflow, may be arranged in the corresponding chemical liquid section 301 according to process demands.

[0214] For example, in the case of the chemical liquid section 301 for acetone / IPA / EKC, spray, circulating filtration spray, heating, and circulating filtration functions may be provided, and the tank material may be SUS316L. In the case of the DIW chemical liquid section 301, circulating filtration spray, bubbling, overflow, and quick drain may be provided, and the tank material may be NPP.

[0215] The liquid supply policy set in advance may specifically be an etching environment+liquid supply policy, and for example, the liquid supply policy may be a liquid supply amount control policy or a liquid distribution control policy.

[0216] The etching environment policy may be an etching environment change policy constructed such that heating to a preset temperature is performed simultaneously with circulating filtration spray, or bubbling is performed simultaneously with circulating filtration, or ultrasonic vibration is performed simultaneously with bubbling, or bubbling is performed simultaneously with liquid inlet spray, and the execution of this policy may be realized by the liquid supply mechanism 32 in cooperation with the human-computer interaction system 5, the timing system 6, etc.

[0217] In one more specific embodiment, as shown in FIG. 13, the feed system 4 includes a transport device 402 and a first feed switch cover device 401 .

[0218] The transport device 402 is used to transport the workpiece 500 from a material preparation position outside the machine body 100 to a loading position in the machine room. As shown in Fig. 1, the material preparation position outside the machine body 100 is provided with a carrier stage 116 for placing the workpiece 500 to be experimented or a cassette 205 containing the workpiece 500.

[0219] The machine base body 100 is provided with a loading port that communicates with the machine room and allows the transported workpieces 500 to pass through, and the first feed switch cover device 401 is used to control the opening and closing of the loading port. The first feed switch cover device 401 includes a baffle 404 and a plate driver 403. The baffle 404 is slidably mounted on the machine base body 100 to cover the loading port. The plate driver 403 may be a telescopic cylinder connected to the baffle 404 and causes the baffle 404 to telescope, thereby realizing opening and closing control, opening the loading port before loading and closing the loading port after loading is completed.

[0220] In one more specific embodiment, as shown in FIG. 14, taking the aforementioned support partition plate 101 as an example, the feed system 4 further includes a second feed switch cover device.

[0221] Specifically, the transport device 402 may be attached to the lower chamber. To avoid being affected by water leaking through the first drain hole 103 when attached to the lower chamber, a separate attachment chamber for attaching the transport device 402 may be arranged in the lower chamber.

[0222] The transport device 402 includes a first feed mechanism 405 and a second feed mechanism 406 .

[0223] The support partition plate 101 is provided with a second evacuation opening for the workpiece 500 to enter the upper chamber, and the second evacuation opening communicates with this mounting chamber.

[0224] The first feed mechanism 405 is used to transport the workpiece 500 from the material preparation position to the delivery position in the lower chamber, and the second feed mechanism 406 is used to transport the workpiece 500 from the delivery position to the loading position in the upper chamber. The first feed mechanism 405 may be a horizontal displacement mechanism, while the second feed mechanism 406 may be a vertical displacement mechanism. A first receiving member 407 is connected to the drive end of the first feed mechanism 405. The first receiving member 407 has a positioning groove for fixing the cassette 205, and a retraction slot 408 is provided at the position of the positioning groove. A second receiving member 409 is connected to the drive end of the second feed mechanism 406. The second receiving member 409 can lift the cassette 205 from the first receiving member 407 through the retraction slot 408 and continue transporting it to the loading position.

[0225] The second feed switch cover device is used to control the opening and closing of the second evacuation opening, and the configuration of the second feed switch cover device can be referred to the configuration of the first feed switch cover, and a detailed description thereof will be omitted. After the workpiece 500 is delivered to the loading position and the robot module 21 grasps the workpiece 500, the second feed switch cover device may be switched to a state in which the second evacuation opening is closed.

[0226] The beneficial effects of the fully automated wet etching machine for scientific research according to the present application are summarized below.

[0227] 1. Improve the efficiency of scientific research. The fully automated design can significantly reduce experimental time, provide more accurate and stable experimental results, improve the reliability of scientific research results, accelerate the progress of scientific research, improve the efficiency of scientific research, and promote the formation of scientific knowledge and innovation.

[0228] 2. Conserves scientific research resources. The fully automated design accurately controls the amount of chemicals used, reducing reagent consumption and lowering scientific research costs, improving resource utilization efficiency. It automatically monitors and adjusts experimental conditions, reducing the risk of experimental failure and reducing waste of experimental consumables, thereby reducing resource waste. Furthermore, the optimized, compact design of the equipment makes it compatible with small-scale experiments, reducing the space required and saving installation and maintenance costs, while also significantly reducing chemical consumption and saving scientific research costs.

[0229] 3. Ensures the safety of personnel and equipment. Remote operation is achieved through automated flow and precise control systems1, reducing the chances of personnel coming into contact with hazardous chemicals, reducing operational risks, and ensuring the safety of personnel and equipment.

[0230] 4. It has commercial value and economic benefits. This fully automated machine has a wide range of applications, filling the gap in research on wet equipment / processes for scientific research in the field of traditional technology. It is used in various university laboratories and scientific research institutions, meeting the needs of scientific research and having a positive and profound impact on the development of semiconductor scientific research. The intelligent and automated nature of this fully automated machine is expected to attract user demand and achieve great success in the market. Furthermore, the introduction of this fully automated machine into the market will promote the development of related industrial chains and drive the upgrade and innovation of related technologies and equipment, thereby providing great support for promoting economic progress.

[0231] The above describes in detail the fully automated system and machine for wet etching for scientific research according to the present application. However, those skilled in the art will recognize that there are changes in the form for carrying out the invention and the scope of application according to the concept of the embodiments of the present application. In summary, the contents of this specification should not be construed as limitations on the present application. [Explanation of symbols]

[0232] 1. Control system 2. Robot system 21. Robot module 22. Vision module 3. Etching system 31. Chemical module 32, Liquid supply mechanism 33. Liquid supply module 34. Etching environment module 4. Feed system 5. Human-computer interaction systems 6. Timing system 7. Monitoring system 8. Machine system 9. Cleaning system 100, Machine body 101, support partition plate 102, First Exit 103. First drain hole 104. Water catchment area 105, second drain hole 106. Fan filter unit 107. Explosion-proof lighting equipment 108. Spray transfer device 109, spray assembly 110, support cylinder 111. Electrically controlled cantilever 112. Wind pressure gauge 113, thermometer 114, stock solution room 115. Electrical control room 116. Career Stage 117. Observation window 201, clamp drive assembly 202, jaw member 203. Protective cover 204, jaw mechanism 205, cassette 206, fixed plate 207, connecting rod 208 - Pressing block 209, Positioning block 210, handle block 211, guide locking groove 212, positioning protrusion 213, stopper flange 214, Slots 301, Chemical Solution Department 302, inner tank body 303, connection flange 304, side wall 305. Chemical chamber 306, Overflow Room 307, overflow collection port 308, inlet 309, drainage port 310 , drain valve 311, heating chamber 312, heating device 313, Etched end cap 314, Switch driver 315, cleaning equipment 401, first feed switch cover device 402, transportation equipment 403, Plate driver 404, Baffle 405, first feed mechanism 406, second feed mechanism 407 - First Support 408, Evacuation Ditch 409 - Second support material 500, Work 600, small capacity chemical tank

Claims

1. A fully automated wet etching machine for scientific research, comprising: a machine body (100) and a fully automated wet etching system for scientific research; The fully automated wet etching system for scientific research is disposed on the machine body and includes a machine system (8), an etching system (3), a feed system (4), a robot system (2), and a control system (1); The machine stand system (8) is used to provide a compact machine room including an installation space and a working space; The etching system (3) includes a plurality of chemical modules (31) arranged in an arc-shaped arrangement in the miniaturized machine chamber; The chemical module (31) includes a chemical unit (301) and a liquid supply mechanism (32), the liquid supply mechanism (32) is used to supply liquid to the chemical liquid section (301) in accordance with a preset liquid supply policy and to control the etching environment in the chemical liquid section (301); The feed system (4) is used to transport the workpiece (500) to the working space and close the working space after the transportation is completed; The robot system (2) includes a robot module (21) and a vision module (22) communicatively connected to the robot module (21); The robot module (21) is disposed at the top of the working space to grasp the workpiece (500) based on the image information fed back by the vision module (22) and place the workpiece into the chemical solution section (301) according to a preset etching policy to complete the etching; The control system (1) is communicatively connected to the machine base system (8), the feed system (4), the robot system (2) and the etching system (3) to realize automated etching operations based on user commands; The miniaturized machine room is provided in the machine body (100), The miniaturized machine chamber is provided with a support partition plate (101), The support partition (101) divides the miniaturized machine room into an upper chamber and a lower chamber, the upper chamber defining a working space; The chemical liquid modules (31) are arranged in the circumferential direction in the lower chamber, The support partition plate (101) is provided with first evacuation ports (102) communicating with the chemical liquid sections (301) in one-to-one correspondence with each other in the chemical liquid modules (31); A spray cleaning device is further attached to the machine body (100), The spray cleaning device includes a spray assembly (109) and a spray moving device (108); the spray moving device (108) is attached to the upper chamber and connected to the spray assembly (109) for moving the spray assembly (109); The support partition plate (101) has a plurality of first drain holes (103) formed therein; The fully automated wet etching machine for scientific research is characterized in that the lower chamber is provided with a main drain pipe communicating with the outside of the machine body (100).

2. 2. The fully automated wet etching machine platform for scientific research according to claim 1, wherein the robot module (21) is further used to grasp a cleaning tool and perform cleaning operations based on image information fed back by the vision module (22).

3. The fully automated wet etching machine platform for scientific research according to claim 1, characterized in that the robot module (21) can further perform at least one of an extension / retraction motion, a rotation motion, and a jitter motion.

4. further comprising a timing system (6); 2. The fully automated wet etching platform for scientific research according to claim 1, wherein the timing system (6) is used to obtain operating time information of the platform system (8), the feed system (4) and the robot system (2) and feed it back to the control system (1), so that the control system (1) can control the platform system (8), the feed system (4), the robot system (2) and the etching system (3) according to a preset time policy.

5. Further comprising a human-computer interaction system (5) and a monitoring system (7), The human-computer interaction system (5) is communicatively connected to the control system (1); The monitoring system (7) is used to acquire operation data of the machine system (8), the robot system (2), the etching system (3), and the feed system (4), respectively, and to issue an alarm when the operation data exceeds a threshold value; 2. The fully automated wet etching machine platform for scientific research according to claim 1, wherein the monitoring system (7) is further used to monitor the machine platform system (8), the robot system (2), the etching system (3) and the feed system (4) in real time according to a preset monitoring policy.

6. The liquid supply mechanism (32) includes a liquid supply module (33) and an etching environment module (34); The liquid supply module (33) is used to supply the liquid chemical in the small-capacity liquid chemical tank (600) to the liquid chemical section (301); The etching environment module (34) includes at least one of a heating module, a bubbling module, an ultrasonic vibration module, a cleaning module, a spray module, and a circulation filtration module; 2. The fully automated wet etching machine for scientific research according to claim 1, wherein the chemical section (301) is provided with an overflow recovery module.

7. The fully automated wet etching machine platform for scientific research according to claim 1, wherein the robot module (21) is a collaborative robot.

8. 2. The fully automated wet etching machine platform for scientific research according to claim 1, wherein an electrical control room (115) and a liquid concentrate room (114) for storing small-capacity chemical tanks (600) are provided in the space below the miniaturized machine room in the machine body (100).

9. The machine system (8) further includes a fan filter unit (106); The machine body (100) is provided with an exhaust port and an air supply port communicating with the upper chamber, 2. The fully automated wet etching machine platform for scientific research according to claim 1, wherein the fan filter unit (106) is attached to the machine body (100) and connected to the air outlet.

10. A water collecting section (104) is provided in the center of the support partition plate (101), 2. The fully automated wet etching machine for scientific research according to claim 1, wherein the water collecting section (104) is provided with a second drain hole (105).

11. A support cylinder (110) that connects the support partition plate (101) is provided in the center of the lower chamber, A position control chamber is provided within the support cylinder (110), The second drain hole (105) communicates with the position control chamber; A branch drain pipe is provided in the position control chamber to connect the second drain hole (105), The fully automated wet etching machine for scientific research according to claim 10, characterized in that the end of the branch drain pipe away from the second drain hole (105) extends outside the supporting cylinder (110).

12. Further including a cassette (205) for storing the workpiece (500); 2. The fully automated wet etching machine platform for scientific research according to claim 1, wherein a cassette jaw mechanism (204) for grasping the cassette (205) is connected to the end of the robot module (21).

13. The cassette jaw mechanism (204) includes a clamp drive assembly (201) and two jaw members (202); the clamp drive assembly (201) is connected to the two jaw members (202) for driving the two jaw members (202) to open and close to clamp the cassette (205); 13. The fully automated wet etching machine for scientific research according to claim 12, wherein the clamp drive assembly (201) is covered with an explosion-proof and corrosion-proof protective cover (203).

14. The cassette (205) includes two fixed plates (206), The two fixed plates (206) are installed in parallel with each other at an interval, and are fixedly connected therebetween via a plurality of connecting rods (207); The space between each connecting rod (207) and the two fixing plates (206) is surrounded to form a storage cavity for storing a workpiece (500), A handle block (210) is fixedly connected to the top position between the two fixed plates (206), The handle block (210) has guide grooves (211) on both sides thereof. The clamping surfaces of the two jaw members (202) are provided with positioning protrusions (212) that engage with the guide engaging grooves (211), The fully automated wet etching machine platform for scientific research as described in claim 13, characterized in that the bottom of each of the jaw members (202) is provided with a stopper flange (213) that contacts and abuts against the bottom of the handle block (210).

15. The cassette (205) includes a bottom plate and two fixing plates (206), The two fixed plates (206) are installed on top of the fixed plate (206) at a distance from each other in parallel; A handle block (210) is fixedly connected to the top position between the two fixed plates (206), The handle block (210) has guide grooves (211) on both sides thereof. The clamping surfaces of the two jaw members (202) are provided with positioning protrusions (212) that engage with the guide engaging grooves (211), The bottom of each of the jaw members (202) is provided with a stopper flange (213) that contacts and abuts against the bottom of the handle block (210), A plurality of stopper levers are fixed between the two fixing plates (206) on the bottom plate, The fully automated wet etching machine base for scientific research according to claim 13, characterized in that the space between the adjacent stopper lever and the bottom plate is surrounded to form a storage cavity for storing the workpiece (500).

16. Positioning blocks (209) are fixed to the opposing sides of the two fixed plates (206), 16. A fully automated wet etching machine for scientific research according to claim 14 or 15, characterized in that a pressing block (208) for pressing the workpiece (500) is movably inserted between the two positioning blocks (209).

17. The liquid supply mechanism (32) includes a liquid delivery device and a liquid drainage device for forming a liquid supply module (33), the liquid delivery device includes a pump pipe and a chemical liquid pump; One end of the pump piping is connected to the chemical liquid section (301), and the other end is connected to a small-capacity chemical liquid tank (600), the chemical pump is attached to the pump piping to pump the chemical in the small-capacity chemical tank (600) to the chemical unit (301) according to a preset liquid supply policy; The drainage device includes a drain tube and a drain valve (310); The drainage tube is connected to the chemical solution section (301), the drain valve (310) is connected to the drain for controlling the flow rate of the drain according to a preset fluid supply policy; 7. The fully automated wet etching machine for scientific research according to claim 6, wherein the chemical section (301) is provided with a liquid level sensor for detecting the liquid level of the chemical.

18. The chemical solution section (301) is provided with a chemical solution chamber (305) and an overflow chamber (306) for forming an overflow module, The chemical chamber (305) is used to contain the chemical supplied by the liquid supply mechanism (32) and to place the work (500) therein; The overflow chamber (306) is used to receive the chemical solution overflowing from the chemical solution chamber (305); 18. The fully automated wet etching machine for scientific research according to claim 17, wherein the pump piping and the drainage pipe connect the chemical chamber (305).

19. The chemical solution section (301) includes an inner tank body (302), An inlet is formed at the top opening of the inner tank body (302), The chemical solution chamber (305) is formed by the internal space of the inner tank body (302), A connection flange (303) is provided around the outer circumferential surface of the inner tank body (302), A side wall (304) is connected to the top edge of the connecting flange (303), 19. The fully automated wet etching machine for scientific research according to claim 18, wherein the overflow chamber (306) is surrounded between the side wall (304), the top surface of the connecting flange (303), and the outer circumferential surface of the inner tank body (302).

20. The liquid supply mechanism (32) further includes a heating device (312) for forming a heating module; 20. The fully automated wet etching machine for scientific research according to claim 19, wherein the heating device (312) is used to heat the chemical solution in the chemical solution chamber (305) according to a preset liquid supply policy.

21. The chemical solution section (301) further includes an outer tank body, The bottom of the inner tank body (302) is inserted into the outer tank body, and the connection flange (303) is connected to the outer tank body so that the space between the connection flange (303), the outer tank body, and the inner tank body (302) is surrounded by a heating chamber (311); The outer tank body is provided with a medium inlet pipe and a medium outlet pipe that communicate with the heating chamber (311), The fully automated wet etching machine platform for scientific research as described in claim 20, characterized in that the heating device (312) is attached to the heating chamber (311) to heat the heat conduction medium in the heating chamber (311).

22. The liquid supply mechanism (32) further includes a circulation device for forming a circulation filtration module or a circulation spray device for forming a spray module; The circulation device is used to extract the chemical solution in the chemical solution chamber (305) according to a preset liquid supply policy, and return the extracted chemical solution to the chemical solution chamber (305) after passing through filtration; 19. The fully automated wet etching machine for scientific research according to claim 18, wherein the circulation spray device is used to extract the chemical solution in the chemical solution chamber (305) according to a preset liquid supply policy, and return it to the chemical solution chamber (305) in a spray manner after filtering.

23. The etching system (3) further includes a cleaning device (315) for forming a cleaning module; 19. The fully automated wet etching machine for scientific research according to claim 18, wherein the cleaning device (315) is used to clean the workpiece (500) in the chemical chamber (305).

24. The liquid supply mechanism (32) further includes a bubbling device for forming a bubbling module; 19. The fully automated wet etching machine for scientific research according to claim 18, wherein the bubbling device is used to bubbling the chemical solution in the chemical solution chamber (305) according to a preset liquid supply policy.

25. The etching system (3) further includes an etching switch cover device; 19. The fully automated wet etching machine platform for scientific research as claimed in claim 18, wherein the etching switch cover device is used to control the opening and closing of the inlet of the chemical chamber (305).

26. The feed system (4) includes a transport device (402) and a first feed switch cover device (401); The transport device (402) is used to transport the workpiece (500) from a material preparation position outside the machine body (100) to a loading position in the miniaturized machine room; The machine body (100) is provided with a loading port that communicates with the miniaturized machine chamber and allows the work (500) to pass through. The fully automated wet etching machine platform for scientific research according to claim 9, characterized in that the first feed switch cover device (401) is used to control the opening and closing of the loading port.

27. The feed system (4) further includes a second feed switch cover device; the transport device (402) is attached to the lower chamber and includes a first feed mechanism (405) and a second feed mechanism (406); The support partition (101) is provided with a second evacuation opening for the work (500) to enter the upper chamber; the first feed mechanism (405) is used to transport the workpiece (500) from the material preparation position to a transfer position in the lower chamber; the second feed mechanism (406) is used to transport the workpiece (500) from the transfer position to a loading position in the upper chamber; The fully automated wet etching platform for scientific research according to claim 26, wherein the second feed switch cover device is used to control the opening and closing of the second escape port.

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