Display device
The display device enhances resolution by arranging light-emitting element groups with specific drive circuits and signal lines, addressing the challenge of reducing drive circuit pitch in organic EL devices, thereby improving image quality and brightness.
Patent Information
- Application Number
- JP2025136728
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-11-05
- Filing Date
- 2025-08-20
- Publication Date
- 2025-10-30
AI Technical Summary
Existing organic EL display devices face challenges in increasing resolution due to the difficulty in reducing the formation pitch of drive circuits, which is necessary when pixel pitch is reduced, as organic EL devices require relatively high voltage.
A display device design where multiple light-emitting element groups are arranged in different directions, each group comprising light-emitting elements of different colors, with specific drive circuits and signal lines configurations, including gradation-averaging signals to drive multiple elements, allowing for increased resolution with a simple structure.
The design enables higher resolution in organic EL display devices by optimizing the arrangement and drive circuits, improving image quality and brightness while maintaining a compact form factor.
Smart Images

Figure 2025164830000001_ABST
Abstract
Description
[Technical Field]
[0001] The present disclosure relates to a display device. [Background technology]
[0002] FIG. 24 shows a schematic partial cross-sectional view of a conventional organic electroluminescence display device (hereinafter simply referred to as an "organic EL display device"). A driving circuit 20' is disposed on a first substrate 41 made of a silicon semiconductor substrate, and a first electrode 31 is provided on an insulating layer 26 formed on the first substrate 41. An organic layer 33 is formed on the first electrode 31 using a vapor deposition method, a printing method, or the like, and a second electrode 32, a planarization layer 35, and a color filter layer CF are further formed on the organic layer 33. This structure is then bonded to a second substrate 42 via a sealing resin layer 36. The reference numerals in FIG. 24 will be described in Example 1.
[0003] A light-emitting element unit (one pixel) is typically composed of three light-emitting elements (sub-pixels): a red light-emitting element 12R that emits red light, a green light-emitting element 12G that emits green light, and a blue light-emitting element 12B that emits blue light. To enhance brightness, a white light-emitting element that emits white light may also be added. Also, a so-called Pen Tile type arrangement is well known, in which the number of light-emitting elements that emit a certain color is reduced compared to the number of light-emitting elements that emit other colors in order to enhance definition (see, for example, JP 2013-187187 A).
[0004] One drive circuit is provided for one light emitting element. Fig. 25A and Fig. 26A show the arrangement of light emitting elements in a light emitting element unit having a delta arrangement and a stripe arrangement. Fig. 25B and Fig. 26B show the arrangement of one drive circuit DC provided for one light emitting element 12R, 12G, 12B. R ,DC G ,DC B The light emitting elements 12R, 12G, and 12B and the driving circuit DC R ,DC G ,DCB are connected by contact holes and wiring layers (not shown). Figures 25A and 26A show 4 x 2 (8 sets) of light-emitting element units (pixels), and Figures 25B and 26B show 4 x 2 (8 sets) of drive circuits. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-187187 Summary of the Invention [Problem to be solved by the invention]
[0006] However, when the pixel pitch is reduced to increase the resolution of an organic EL display device having such a structure, it is necessary to reduce both the formation pitch of the light-emitting elements and the formation pitch of the drive circuits. To reduce the formation pitch of the drive circuits, it is necessary to shrink the design of the transistors, capacitors, wiring, etc. that make up the drive circuits. However, because organic EL display devices require a relatively high voltage, it is often difficult to reduce the formation pitch of the drive circuits.
[0007] Therefore, an object of the present disclosure is to provide a display device that can increase the resolution with a simple configuration and structure. [Means for solving the problem]
[0008] In order to achieve the above object, a display device of the present disclosure is a display device in which a plurality of light-emitting element groups are arranged in a first direction and a second direction different from the first direction, Each light-emitting element group is composed of a plurality of light-emitting element units, Each light-emitting element unit is composed of one first light-emitting element that emits a first color, one second light-emitting element that emits a second color, and one third light-emitting element that emits a third color; Each light emitting element group includes a first drive circuit for driving a first light emitting element, a second drive circuit for driving a second light emitting element, and a third drive circuit for driving a third light emitting element; In each light emitting element group, the number of first drive circuits is equal to the number of first light emitting elements, the number of second drive circuits is less than the number of second light emitting elements, and the number of third drive circuits is less than the number of third light emitting elements. [Brief explanation of the drawings]
[0009] [Figure 1] Figures 1A, 1B, and 1C are respectively a schematic partial plan view of a group of light-emitting elements in the display device of Example 1, a diagram showing a schematic arrangement of a driving circuit, and a diagram showing a schematic arrangement of a driving circuit and signal lines. [Figure 2] FIG. 2 is a schematic partial cross-sectional view of the display device of the first embodiment. [Figure 3] FIG. 3 is a schematic partial cross-sectional view of the display device of Example 1 connected to the portion indicated by [A] of the display device shown in FIG. [Figure 4] FIG. 4A is a schematic partial plan view of a group of light-emitting elements in the display device of Example 2, and FIGS. 4B and 4C are diagrams showing the layout of the drive circuits. [Figure 5] FIG. 5 is a diagram schematically showing the arrangement of drive circuits and signal lines in the display device of Example 2. In FIG. [Figure 6] 6A and 6B are diagrams schematically showing the arrangement of drive circuits and signal lines in the display device of Example 2. FIG. [Figure 7] FIG. 7A is a schematic partial plan view of a group of light-emitting elements in a display device of Example 3, and FIGS. 7B, 7C, and 7D are diagrams each showing a schematic arrangement of a drive circuit. [Figure 8] 8A and 8B are a schematic partial plan view of a group of light-emitting elements in a display device of Example 4, and a diagram schematically showing the arrangement of a drive circuit, respectively. [Figure 9] 9A and 9B are a schematic partial plan view of a group of light-emitting elements in a display device of Example 5, and a diagram schematically showing the arrangement of a drive circuit, respectively. [Figure 10] 10A and 10B are a schematic partial plan view of a group of light-emitting elements in a modified example of the display device of Example 5, and a diagram schematically showing the arrangement of a drive circuit, respectively. [Figure 11] FIG. 11 is a schematic partial cross-sectional view of a first modification of the display device of the first embodiment. [Figure 12] FIG. 12 is a schematic partial cross-sectional view of a second modification of the display device of the first embodiment. [Figure 13] FIG. 13 is a schematic partial cross-sectional view of a third modified example of the display device of the first embodiment. [Figure 14] FIG. 14 is a schematic partial cross-sectional view of a fourth modification of the display device of the first embodiment. [Figure 15] FIG. 15 is a conceptual diagram of an image display device constituting a head-mounted display according to a sixth embodiment. [Figure 16] FIG. 16 is a schematic diagram of the head mounted display of Example 6 viewed from above. [Figure 17] FIG. 17 is a schematic diagram of the head mounted display of Example 6 viewed from the front. [Figure 18] 18A and 18B are a schematic side view of the head-mounted display of Example 6 and a schematic enlarged cross-sectional view of a portion of the reflective volume hologram diffraction grating in the head-mounted display of Example 5, respectively. [Figure 19] 19A and 19B show an example in which the display device of the present disclosure is applied to a single-lens reflex digital still camera with interchangeable lenses. FIG. 19A shows a front view of the digital still camera, and FIG. 19B shows a rear view. [Figure 20] FIG. 20 is a block diagram showing the overall circuit configuration of the display device of the present disclosure. [Figure 21] FIG. 21 is an equivalent circuit diagram of the light emitting element and the drive circuit included in the display device shown in FIG. [Figure 22] FIG. 22 is a timing chart illustrating the operation of the light emitting element and the driving circuit shown in FIG. [Figure 23]FIG. 23 is a diagram for explaining the gradation average. [Figure 24] FIG. 24 is a schematic partial cross-sectional view of a conventional display device. [Figure 25] 25A and 25B are a schematic partial plan view of a group of light-emitting elements in a conventional display device and a diagram showing a schematic arrangement of a drive circuit, respectively. [Figure 26] 26A and 26B are a schematic partial plan view of a group of light-emitting elements in a conventional display device and a diagram showing a schematic arrangement of a drive circuit, respectively. [Figure 27] 27A and 27B are conceptual diagrams of first and second examples of light-emitting devices having a resonator structure. [Figure 28] 28A and 28B are conceptual diagrams of third and fourth examples of light-emitting devices having a resonator structure. [Figure 29] 29A and 29B are conceptual diagrams of fifth and sixth examples of light-emitting devices having a resonator structure. [Figure 30] FIG. 30A is a conceptual diagram of a seventh example of a light-emitting device having a resonator structure, and FIGS. 30B and 30C are conceptual diagrams of eighth example of a light-emitting device having a resonator structure. DETAILED DESCRIPTION OF THE INVENTION
[0010] The present disclosure will be described below based on examples with reference to the drawings, but the present disclosure is not limited to the examples, and various numerical values and materials in the examples are merely examples. The description will be made in the following order. 1. General Description of the Display Device of the Present Disclosure 2. Example 1 (Display Device of the Present Disclosure, Display Device of the First Embodiment) 3. Second Embodiment (Modification of the First Embodiment, a Display Device of a Second Form) 4. Example 3 (another variation of Example 1) 5. Example 4 (another modification of Example 1) 6. Example 5 (Modification of Example 1 and Example 2) 7.Other
[0011] <General Description of Display Device of the Present Disclosure> The display device of the present disclosure further includes a first signal line extending in a second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction; In each light-emitting element group, the light-emitting element units are arranged along a first direction, the first drive circuit, the second drive circuit, and the third drive circuit are arranged along a first direction; Each of the first driving circuits is connected to a corresponding one of the first signal lines; Each of the second driving circuits is connected to a corresponding one of the second signal lines; The third driving circuits may be connected to the third signal lines, respectively. For convenience, a display device of this type will be referred to as a "display device of a first type."
[0012] Alternatively, the display device of the present disclosure further includes a first signal line extending in the second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction, In each light-emitting element group, the light-emitting element units are arranged along the second direction, the first drive circuit, the second drive circuit, and the third drive circuit are arranged along a second direction; All of the first driving circuits are connected to a single shared first signal line; The second and third drive circuits may be connected to a single shared second signal line. For convenience, this type of display device will be referred to as a "second type display device."
[0013] Furthermore, in the display device of the present disclosure including these preferred embodiments, when the number of first light-emitting elements is M1, the number of second light-emitting elements is M2, the number of third light-emitting elements is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3 in each light-emitting element group, M1=M2=M3=2 N1=2 N2=N3=1 It is possible to have a configuration that satisfies the above.
[0014] In the display device of the first embodiment, when the number of first signal lines is SL1, the number of second signal lines is SL2, and the number of third signal lines is SL3, N1=SL1=2 N2=SL2=1 N3=SL3=1 are in a relationship.
[0015] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, The second driving circuit is supplied with a signal obtained by gradation-averaging the signals for the two second light-emitting elements, The third driving circuit may be configured to receive a signal obtained by gradation-averaging the signals for the two third light-emitting elements.
[0016] Alternatively, in the display device of the first embodiment, when the number of first light-emitting elements is M1, the number of second light-emitting elements is M2, the number of third light-emitting elements is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3 in each light-emitting element group, M1=M2=M3=4 N1=4 N2=2 N3=1 It is possible to have a configuration that satisfies the above.
[0017] In the display device of the first embodiment, when the number of first signal lines is SL1, the number of second signal lines is SL2, and the number of third signal lines is SL3, N1=SL1=4 N2=SL2=2 N3=SL3=1 are in a relationship.
[0018] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, The second driving circuit is supplied with a signal obtained by gradation-averaging the signals for the two second light-emitting elements, The third driving circuit may be configured to receive signals obtained by gradation-averaging signals for the four third light-emitting elements.
[0019] Furthermore, in the display device of the present disclosure including these preferred forms and configurations, in each light-emitting element unit, the arrangement of the first light-emitting element, the second light-emitting element, and the third light-emitting element can be a delta arrangement or a stripe arrangement.
[0020] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, the first color may be green, the second color may be red, and the third color may be blue. Alternatively, the first color may be yellow, the second color may be cyan, and the third color may be magenta. However, the present disclosure is not limited to these.
[0021] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, Each light-emitting element unit further includes a fourth light-emitting element that emits a fourth color; Each light-emitting element group further includes a fourth drive circuit that drives the fourth light-emitting element, In each light-emitting element group, the number of fourth driving circuits may be equal to or less than the number of fourth light-emitting elements, in which case the first color may be green, the second color may be red, the third color may be blue, and the fourth color may be white. Alternatively, the first color may be yellow, the second color may be cyan, the third color may be magenta, and the fourth color may be white, but is not limited to these.
[0022] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, the size of the light-emitting portion of the first light-emitting element can be larger than the size of the light-emitting portion of the second light-emitting element and the size of the light-emitting portion of the third light-emitting element. This allows the light emission amount of the first light-emitting element to be larger than the light emission amounts of the second light-emitting element and the third light-emitting element, or allows the light emission amounts of the first light-emitting element, the second light-emitting element, and the third light-emitting element to be optimized, thereby improving image quality. Assuming that the first light-emitting element emits green light, the second light-emitting element emits red light, the third light-emitting element emits blue light, and the fourth light-emitting element emits white light, from the viewpoint of brightness, it is preferable that the size of the light-emitting region of the first light-emitting element and the fourth light-emitting element be larger than the size of the light-emitting region of the second light-emitting element and the third light-emitting element. Furthermore, from the viewpoint of the life span of the light-emitting elements, it is preferable that the size of the light-emitting region of the third light-emitting element be larger than the size of the light-emitting region of the first light-emitting element, the second light-emitting element, and the fourth light-emitting element.
[0023] Furthermore, in the display device of the present disclosure including these preferred embodiments and configurations, the light-emitting element may be configured as an organic electroluminescence element.
[0024] Hereinafter, a description will be given of an embodiment in which the light-emitting portion of the light-emitting element includes an organic electroluminescence layer, that is, an embodiment in which the display device of the present disclosure is configured as an organic electroluminescence display device (organic EL display device).
[0025] The display device is A first substrate, a second substrate, and a plurality of light-emitting elements arranged two-dimensionally between the first substrate and the second substrate; It is equipped with The light-emitting element includes a light-emitting portion, The light emitting section provided on the base formed on the first substrate is first electrode, A second electrode, and an organic layer (including a light-emitting layer including an organic electroluminescent layer) sandwiched between a first electrode and a second electrode; and Light from the organic layer is emitted to the outside through the second substrate, or alternatively, is emitted to the outside through the first substrate.
[0026] That is, the display device of the present disclosure can be a top-emission type (top-emitting type) display device (top-emitting type display device) that emits light from the second substrate, or a bottom-emission type (bottom-emitting type) display device (bottom-emitting type display device) that emits light from the first substrate.
[0027] As described above, the light-emitting section is composed of a first electrode, an organic layer, and a second electrode from the first substrate side. The first electrode may be configured to be in contact with a portion of the organic layer, or the organic layer may be configured to be in contact with a portion of the first electrode. Specifically, the size of the first electrode may be smaller than the organic layer, or the size of the first electrode may be the same as that of the organic layer but an insulating layer may be formed in a portion between the first electrode and the organic layer, or the size of the first electrode may be larger than the organic layer. The size of the light-emitting section refers to the size of the region where the first electrode and the organic layer are in contact (light-emitting region).
[0028] The organic layer can be configured to emit white light. In this case, the organic layer can be configured to be composed of at least two light-emitting layers that emit different colors. Specifically, the organic layer can be configured to have a stacked structure of three layers: a red-light-emitting layer that emits red light (wavelength: 620 nm to 750 nm), a green-light-emitting layer that emits green light (wavelength: 495 nm to 570 nm), and a blue-light-emitting layer that emits blue light (wavelength: 450 nm to 495 nm), and emits white light as a whole. Alternatively, the organic layer can be configured to have a stacked structure of two layers: a blue-light-emitting layer that emits blue light and a yellow-light-emitting layer that emits yellow light, and emits white light as a whole. Alternatively, the organic layer can be configured to have a stacked structure of two layers: a blue-light-emitting layer that emits blue light and an orange-light-emitting layer that emits orange light, and emits white light as a whole. The organic layer may be common to multiple light-emitting elements, or may be provided individually for each light-emitting element. A red light emitting element is formed by combining such an organic layer (light emitting portion) that emits white light with a red color filter layer (or a planarizing layer that functions as a red color filter layer), a green light emitting element is formed by combining such an organic layer (light emitting portion) that emits white light with a green color filter layer (or a planarizing layer that functions as a green color filter layer), and a blue light emitting element is formed by combining such an organic layer (light emitting portion) that emits white light with a blue color filter layer (or a planarizing layer that functions as a blue color filter layer). The planarizing layer will be described later. As described above, a light emitting element unit (one pixel) is formed by combining sub-pixels such as a red light emitting element, a green light emitting element, and a blue light emitting element. In some cases, as described above, a light emitting element unit (one pixel) may be formed by a red light emitting element, a green light emitting element, a blue light emitting element, and a light emitting element that emits white (or a fourth color) (or a light emitting element that emits complementary color light). In a configuration that includes at least two light emitting layers that emit different colors, the light emitting layers that emit different colors may actually be mixed and not clearly separated into each layer.
[0029] Alternatively, the organic layer may be configured to consist of a single light-emitting layer. In this case, the light-emitting element may be configured, for example, of a red-light-emitting element having an organic layer including a red-light-emitting layer, a green-light-emitting element having an organic layer including a green-light-emitting layer, or a blue-light-emitting element having an organic layer including a blue-light-emitting layer. In the case of a color display device, a light-emitting element unit (one pixel) is configured from these three types of light-emitting elements (sub-pixels). Although the formation of a color filter layer is not required in principle, a color filter layer may be provided to improve color purity. Alternatively, one sub-pixel may be configured from a stacked structure of a red-light-emitting element having an organic layer including a red-light-emitting layer, a green-light-emitting element having an organic layer including a green-light-emitting layer, and a blue-light-emitting element having an organic layer including a blue-light-emitting layer.
[0030] The base is formed on or above the first substrate. Examples of materials constituting the base include insulating materials such as SiO2, SiN, and SiON. The base can be formed by a formation method suitable for the material constituting the base, specifically, a known method such as various CVD methods, various coating methods, various PVD methods including sputtering and vacuum deposition, various printing methods such as screen printing, plating, electrodeposition, immersion, and sol-gel methods.
[0031] A driving circuit is provided below or below the base. The driving circuit is composed of, for example, transistors (specifically, MOSFETs, for example) formed on a silicon semiconductor substrate constituting the first substrate, or thin film transistors (TFTs) provided on various substrates constituting the first substrate. The transistors or TFTs constituting the driving circuit and the first electrode may be connected via contact holes (contact plugs) and wiring layers formed in the base or the like. The driving circuit may have a well-known circuit configuration. The second electrode is connected to the driving section via contact holes (contact plugs) formed in the base or the like at the periphery of the display device (specifically, the periphery of a pixel array section 72, which will be described later).
[0032] The first electrode is provided for each light-emitting element. The organic layer is provided for each light-emitting element, or alternatively, is provided in common to all the light-emitting elements. The second electrode may be a common electrode for a plurality of light-emitting elements. That is, the second electrode may be a so-called solid electrode. A first substrate is disposed below or below the base, and a second substrate is disposed above the second electrode. The light-emitting elements are formed on the first substrate side, and the light-emitting section is provided on the base.
[0033] The first or second substrate can be made of a silicon semiconductor substrate, a high-strain-point glass substrate, a soda glass (NaO·CaO·SiO2) substrate, a borosilicate glass (NaO·B2O3·SiO2) substrate, a forsterite (2MgO·SiO2) substrate, a lead glass (Na2O·PbO·SiO2) substrate, various glass substrates with an insulating material layer formed on their surfaces, a quartz substrate, a quartz substrate with an insulating material layer formed on its surface, or an organic polymer (in the form of a polymer material such as a flexible plastic film, sheet, or substrate made of a polymer material) such as polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyethersulfone (PES), polyimide, polycarbonate, polyethylene terephthalate (PET), or polyethylene naphthalate (PEN). The materials making up the first and second substrates can be the same or different. However, in the case of a top-emitting display device, the second substrate is required to be transparent to the light from the light-emitting element, and in the case of a bottom-emitting display device, the first substrate is required to be transparent to the light from the light-emitting element.
[0034] When the first electrode functions as an anode electrode, examples of materials constituting the first electrode include metals or alloys with high work functions, such as platinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron (Fe), cobalt (Co), and tantalum (Ta) (e.g., an Ag-Pd-Cu alloy containing silver as the main component, 0.3 to 1% by mass of palladium (Pd), and 0.3 to 1% by mass of copper (Cu), an Al-Nd alloy, an Al-Cu alloy, or an Al-Cu-Ni alloy). Furthermore, when a conductive material with a low work function and high light reflectance, such as aluminum (Al) or an aluminum-containing alloy, is used, it can be used as an anode electrode by improving the hole injection characteristics by providing an appropriate hole injection layer. The thickness of the first electrode can be, for example, 0.1 to 1 μm. Alternatively, when a light-reflecting layer (described later) is provided, the first electrode is required to be transparent to light from the light-emitting element. Therefore, the material for the first electrode may be indium oxide, indium-tin oxide (ITO, Indium Tin Oxide, including Sn-doped In2O3, crystalline ITO, and amorphous ITO), indium-zinc oxide (IZO, Indium Zinc Oxide), or the like. These include transparent conductive materials based on a host layer of indium gallium oxide (IGO), indium-doped gallium zinc oxide (IGZO, In-GaZnO), IFO (F-doped In2O3), ITiO (Ti-doped In2O3), InSn, InSnZnO, tin oxide (SnO2), ATO (Sb-doped SnO2), FTO (F-doped SnO2), zinc oxide (ZnO), aluminum oxide-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), B-doped ZnO, AlMgZnO (aluminum oxide and magnesium oxide-doped zinc oxide), antimony oxide, titanium oxide, NiO, spinel oxides, oxides with a YbFe2O4 structure, gallium oxide, titanium oxide, niobium oxide, nickel oxide, etc.Alternatively, a structure can be used in which a transparent conductive material with excellent hole injection properties, such as indium tin oxide (ITO) or indium zinc oxide (IZO), is laminated on a highly light-reflecting reflective film such as a dielectric multilayer film, aluminum (Al), or its alloy (e.g., an Al-Cu-Ni alloy). On the other hand, when the first electrode is to function as a cathode electrode, it is desirable to configure it from a conductive material with a small work function and high light reflectance. However, by improving the electron injection properties by providing an appropriate electron injection layer on the conductive material with high light reflectance used as the anode electrode, it can also be used as a cathode electrode.
[0035] When the second electrode functions as a cathode, it is desirable to use a conductive material (semi-transparent or transparent) that transmits emitted light and has a low work function to efficiently inject electrons into the organic layer (light-emitting layer). Examples of low-work-function metals or alloys include aluminum (Al), silver (Ag), magnesium (Mg), calcium (Ca), sodium (Na), strontium (Sr), alkali metals or alkaline earth metals and silver (Ag) [e.g., alloys of magnesium (Mg) and silver (Ag) (Mg-Ag alloy)], magnesium-calcium alloys (Mg-Ca alloys), and aluminum (Al) and lithium (Li) alloys (Al-Li alloys). Among these, Mg-Ag alloys are preferred, with the volume ratio of magnesium to silver being 5:1 to 30:1. Alternatively, the volume ratio of magnesium to calcium being 2:1 to 10:1. The thickness of the second electrode can be 4 nm to 50 nm, preferably 4 nm to 20 nm, and more preferably 6 nm to 12 nm. Alternatively, at least one material selected from the group consisting of Ag-Nd-Cu, Ag-Cu, Au, and Al-Cu can be used. Alternatively, the second electrode can be formed by stacking, from the organic layer side, the above-mentioned material layer and a so-called transparent electrode (for example, a layer having a thickness of 3×10 -8 m to 1×10 -6The second electrode may have a laminated structure with a metal (metal oxide) or a metal (metal oxide film) (m). A bus electrode (auxiliary electrode) made of a low-resistance material such as aluminum, aluminum alloy, silver, silver alloy, copper, copper alloy, gold, or gold alloy may be provided on the second electrode to reduce the resistance of the entire second electrode. The average light transmittance of the second electrode is desirably 50% to 90%, preferably 60% to 90%. On the other hand, when the second electrode is to function as an anode electrode, it is desirably made of a conductive material that transmits emitted light as necessary and has a large work function.
[0036] Examples of methods for forming the first and second electrodes include deposition methods including electron beam deposition, hot filament deposition, and vacuum deposition; sputtering; chemical vapor deposition (CVD); MOCVD; a combination of ion plating and etching; various printing methods such as screen printing, inkjet printing, and metal mask printing; plating methods (electroplating and electroless plating); lift-off; laser ablation; and sol-gel processes. Various printing and plating methods can directly form the first and second electrodes with the desired shape (pattern). Furthermore, when forming the second electrode after forming the organic layer, it is preferable to use a film formation method with low particle energy, such as vacuum deposition, or MOCVD, in order to prevent damage to the organic layer. Damage to the organic layer can result in the generation of non-emitting pixels (or non-emitting sub-pixels) known as "dark dots" due to leakage current.
[0037] The organic layer includes an emitting layer containing an organic emitting material. Specifically, the organic layer can be formed, for example, from a laminated structure of a hole transport layer, an emitting layer, and an electron transport layer; a laminated structure of a hole transport layer and an emitting layer that also functions as an electron transport layer; or a laminated structure of a hole injection layer, a hole transport layer, an emitting layer, an electron transport layer, and an electron injection layer. Examples of methods for forming the organic layer include physical vapor deposition (PVD) methods such as vacuum deposition; printing methods such as screen printing and inkjet printing; laser transfer methods in which a laser is irradiated onto a laminated structure of a laser absorbing layer and an organic layer formed on a transfer substrate to separate the organic layer on the laser absorbing layer and transfer the organic layer; and various coating methods. When the organic layer is formed by vacuum deposition, for example, a so-called metal mask can be used, and the organic layer can be obtained by depositing a material that has passed through an opening in the metal mask.
[0038] A light-shielding portion may be provided between the light-emitting elements. Specific examples of light-shielding materials that make up the light-shielding portion include materials that can block light, such as titanium (Ti), chromium (Cr), tungsten (W), tantalum (Ta), aluminum (Al), and MoSi2. The light-shielding portion can be formed by a deposition method, such as electron beam deposition, hot filament deposition, or vacuum deposition, a sputtering method, a CVD method, or an ion plating method.
[0039] It is preferable that a protective layer is formed so as to cover the second electrode. Alternatively, a lens member may be formed on or above the protective layer, or a color filter layer may be formed on or above the protective layer, and a lens member may be formed on or above the color filter layer, or a lens member may be formed on or above the protective layer, and a color filter layer may be formed on or above the lens member. Furthermore, a planarizing layer may be further formed on these. As described above, a planarizing layer that functions as a color filter layer may be provided.
[0040] The lens member can be hemispherical or can be configured as a part of a sphere, or can be configured as a shape suitable for functioning as a lens. The lens member (on-chip microlens) can be configured from, for example, a transparent resin material such as an acrylic resin, an epoxy resin, a polycarbonate resin, or a polyimide resin, or a transparent inorganic material such as SiO2, and can be obtained by melt flowing the transparent resin material, or by etching back the transparent resin material, or by a combination of photolithography using a gray-tone mask and an etching method, or by forming the transparent resin material into a lens shape based on a nanoprint method.
[0041] A light-absorbing layer (black matrix layer) may be formed between the color filter layers, above the color filter layers, or between adjacent lens elements, thereby reliably suppressing color mixing between adjacent light-emitting elements. The light-absorbing layer (black matrix layer) may be made of, for example, a black resin film (specifically, a black polyimide resin) containing a black colorant and having an optical density of 1 or more, or may be made of a thin-film filter utilizing thin-film interference. The thin-film filter may be made of, for example, two or more thin films made of metal, metal nitride, or metal oxide, stacked together, and utilizes thin-film interference to attenuate light. Specific examples of thin-film filters include those made by alternately stacking Cr and chromium (III) oxide (Cr2O3).
[0042] Examples of materials constituting the protective layer and the planarizing layer include acrylic resins, SiO2, SiN, SiON, SiC, amorphous silicon (α-Si), Al2O3, and TiO2. The protective layer and the planarizing layer can be a single layer or can be composed of multiple layers. The protective layer and the planarizing layer can be formed based on known methods such as various CVD methods, various coating methods, various PVD methods including sputtering and vacuum deposition, and various printing methods such as screen printing. Furthermore, the protective layer and the planarizing layer can also be formed by atomic layer deposition (ALD). The protective layer and the planarizing layer may be common to multiple light-emitting elements, or may be provided individually for each light-emitting element.
[0043] The planarizing layer and the second substrate are bonded via, for example, a resin layer (sealing resin layer). Materials constituting the resin layer (sealing resin layer) include thermosetting adhesives such as acrylic adhesives, epoxy adhesives, urethane adhesives, silicone adhesives, and cyanoacrylate adhesives, as well as ultraviolet curing adhesives. The resin layer (sealing resin layer) may also serve as the planarizing layer.
[0044] As described above, in some cases, the planarization layer may also function as a color filter layer. Such a planarization layer may be made of a known color resist material. In the case of a light-emitting element that emits white light, a transparent filter may be disposed. By making the planarization layer function as a color filter layer in this way, the organic layer and the planarization layer (color filter layer) are close to each other, so that color mixing can be effectively prevented even when the angle of light emitted from the light-emitting element is widened, thereby improving the viewing angle characteristics. However, the color filter layer may be provided independently, separately from the planarization layer, on or above the planarization layer, or below or below the planarization layer.
[0045] An ultraviolet absorbing layer, an anti-fouling layer, a hard coat layer, an anti-static layer, or a protective member (e.g., a cover glass) may be formed on the outermost surface of the display device that emits light (specifically, for example, the outer surface of the second substrate).
[0046] Insulating layers and interlayer insulating films are formed in display devices, and the insulating materials that make up these include SiO2, NSG (non-doped silicate glass), BPSG (boron phosphorus silicate glass), PSG, BSG, AsSG, SbSG, PbSG, SOG (spin-on glass), LTO (low temperature oxide, low-temperature CVD-SiO2), low-melting point glass, glass paste, and other SiO X Examples of the silicon oxide include: SiON-based materials (materials that form silicon oxide films); SiN-based materials including SiON-based materials; SiOC; SiOF; and SiCN. Alternatively, titanium oxide (TiO2), tantalum oxide (Ta2O5), aluminum oxide (Al2O3), magnesium oxide (MgO), and chromium oxide (CrO x ), zirconium oxide (ZrO2), niobium oxide (Nb2O5), tin oxide (SnO2), vanadium oxide (VO xExamples of suitable insulating materials include inorganic insulating materials such as SiOCH, organic SOG, and fluorine-based resins. Alternatively, examples include various resins such as polyimide resins, epoxy resins, and acrylic resins, as well as low-dielectric-constant insulating materials (e.g., materials with a dielectric constant k (=ε / ε) of 3.5 or less, specifically, fluorocarbon, cycloperfluorocarbon polymer, benzocyclobutene, cyclic fluorine-based resins, polytetrafluoroethylene, amorphous tetrafluoroethylene, polyaryl ether, fluorinated aryl ether, fluorinated polyimide, amorphous carbon, parylene (polyparaxylylene), and fluorinated fullerene). Other examples include Silk (a trademark of The Dow Chemical Co., a coating-type low-dielectric-constant interlayer insulating film material) and Flare (a trademark of Honeywell Electronic Materials Co., a polyaryl ether (PAE)-based material). These materials can be used alone or in appropriate combination. In some cases, the substrate may be made of the materials described above. The insulating layer, interlayer insulating film, and substrate can be formed based on known methods such as various CVD methods, various coating methods, various PVD methods including sputtering and vacuum deposition, various printing methods such as screen printing, plating methods, electrodeposition methods, immersion methods, and sol-gel methods.
[0047] To further improve light extraction efficiency, the organic EL display device preferably has a resonator structure. Specifically, light emitted from the light-emitting layer is resonated between a first interface formed by the interface between the first electrode and the organic layer (or, in a structure in which an interlayer insulating film is provided below the first electrode and a light-reflecting layer is provided below the interlayer insulating film, the first interface formed by the interface between the light-reflecting layer and the interlayer insulating film) and a second interface formed by the interface between the second electrode and the organic layer, and a portion of the light is emitted from the second electrode. The organic EL display device can be configured to satisfy the following formulas (1-1) and (1-2), where OL1 is the optical distance from the maximum light-emitting position of the light-emitting layer to the first interface, OL2 is the optical distance from the maximum light-emitting position of the light-emitting layer to the second interface, and m1 and m2 are integers:
[0048] 0.7{-Φ1 / (2π)+m1}≦2×OL1 / λ≦1.2{-Φ1 / (2π)+m1} (1-1) 0.7{-Φ2 / (2π)+m2}≦2×OL2 / λ≦1.2{-Φ2 / (2π)+m2} (1-2) where: λ: maximum peak wavelength of the spectrum of light generated in the light-emitting layer (or a desired wavelength of the light generated in the light-emitting layer) Φ1: Phase shift of the light reflected at the first interface (unit: radian), where -2π<Φ1≦0 Φ2: Phase shift of the light reflected at the second interface (unit: radian), where -2π<Φ2≦0 is.
[0049] Here, the value of m1 is a value of 0 or greater, and the value of m2 is a value of 0 or greater, independently of the value of m1. However, examples include a form where (m1, m2) = (0, 0), a form where (m1, m2) = (0, 1), a form where (m1, m2) = (1, 0), and a form where (m1, m2) = (1, 1).
[0050] The distance L1 from the maximum light-emitting position of the light-emitting layer to the first interface refers to the actual distance (physical distance) from the maximum light-emitting position of the light-emitting layer to the first interface, and the distance L2 from the maximum light-emitting position of the light-emitting layer to the second interface refers to the actual distance (physical distance) from the maximum light-emitting position of the light-emitting layer to the second interface. The optical distance is also called the optical path length, and generally refers to n × L when a ray of light passes through a medium with a refractive index of n for a distance L. This also applies below. Therefore, if the average refractive index is n ave When OL1=L1×n ave OL2=L2×n ave Here, the average refractive index n ave is the sum of the products of the refractive index and thickness of each layer constituting the organic layer (or the organic layer, the first electrode, and the interlayer insulating film), divided by the thickness of the organic layer (or the organic layer, the first electrode, and the interlayer insulating film).
[0051] The desired wavelength λ of the light generated in the light-emitting layer (specifically, for example, the red wavelength, green wavelength, or blue wavelength) is determined, and various parameters such as OL1 and OL2 of the light-emitting element are calculated based on the formulas (1-1) and (1-2), and the light-emitting element can be designed.
[0052] The first electrode or the light-reflecting layer and the second electrode absorb a portion of the incident light and reflect the remainder. This causes a phase shift in the reflected light. The phase shifts Φ1 and Φ2 can be determined by measuring the real and imaginary parts of the complex refractive index of the material constituting the first electrode or the light-reflecting layer and the second electrode, for example, using an ellipsometer, and performing calculations based on these values (see, for example, "Principles of Optic," Max Born and Emil Wolf, 1974 (PERGAMON PRESS)). The refractive index of the organic layer, interlayer insulating film, etc., or the refractive index of the first electrode, or the refractive index of the first electrode when the first electrode absorbs a portion of the incident light and reflects the remainder, can also be determined by measuring using an ellipsometer.
[0053] Examples of materials that can be used to form the light-reflecting layer include aluminum, aluminum alloys (e.g., Al-Nd and Al-Cu), Al / Ti stacked structures, Al-Cu / Ti stacked structures, chromium (Cr), silver (Ag), and silver alloys (e.g., Ag-Cu, Ag-Pd-Cu, and Ag-Sm-Cu). The light-reflecting layer can be formed by a variety of techniques, including electron beam evaporation, hot filament evaporation, and vacuum evaporation, as well as sputtering, CVD, and ion plating; plating (electroplating and electroless plating); lift-off; laser ablation; and sol-gel processes. Depending on the material used to form the light-reflecting layer, it may be preferable to form an underlayer, such as TiN, to control the crystalline state of the resulting light-reflecting layer.
[0054] In this way, in an organic EL display device having a resonator structure, a red light-emitting element configured by combining a white-emitting organic layer with a red color filter layer (or a planarizing layer functioning as a red color filter layer) actually resonates the red light emitted from the light-emitting layer to emit reddish light (light having a peak in the red region of the optical spectrum) from the second electrode. A green light-emitting element configured by combining a white-emitting organic layer with a green color filter layer (or a planarizing layer functioning as a green color filter layer) resonates the green light emitted from the light-emitting layer to emit greenish light (light having a peak in the green region of the optical spectrum) from the second electrode. A blue light-emitting element configured by combining a white-emitting organic layer with a blue color filter layer (or a planarizing layer functioning as a blue color filter layer) resonates the blue light emitted from the light-emitting layer to emit bluish light (light having a peak in the blue region of the optical spectrum) from the second electrode. That is, the desired wavelength λ (specifically, the red wavelength, green wavelength, and blue wavelength) of the light generated in the light-emitting layer is determined, and various parameters such as OL1 and OL2 for each of the red light-emitting element, green light-emitting element, and blue light-emitting element are calculated based on formulas (1-1) and (1-2), and each light-emitting element can be designed. For example, paragraph
[0041] of JP2012-216495A discloses an organic EL element having a resonator structure in which an organic layer is used as a resonator part, and states that the thickness of the organic layer is preferably 80 nm to 500 nm, and more preferably 150 nm to 350 nm, because this enables appropriate adjustment of the distance from the light-emitting point (light-emitting surface) to the reflecting surface.
[0055] In organic EL display devices, it is desirable that the thickness of the hole transport layer (hole supply layer) and the thickness of the electron transport layer (electron supply layer) are approximately equal. Alternatively, the electron transport layer (electron supply layer) may be thicker than the hole transport layer (hole supply layer), thereby enabling sufficient electron supply to the light-emitting layer, which is necessary for high efficiency at a low driving voltage. That is, by disposing the hole transport layer between the first electrode corresponding to the anode electrode and the light-emitting layer and forming it thinner than the electron transport layer, it is possible to increase the supply of holes. This then results in a carrier balance with no excess or deficiency of holes and electrons and a sufficiently high carrier supply, thereby achieving high light-emitting efficiency. Furthermore, the absence of excess or deficiency of holes and electrons makes it difficult for the carrier balance to be disrupted, suppressing driving degradation and extending the light-emitting lifetime.
[0056] The display device can be used, for example, as a monitor device constituting a personal computer, a monitor device incorporated in a television receiver, a mobile phone, a PDA (personal digital assistant), a game console, or a display device incorporated in a projector. Alternatively, the display device can be applied to an electronic viewfinder (EVF) or a head-mounted display (HMD), or a display device for VR (virtual reality), MR (mixed reality), or AR (augmented reality). Alternatively, the display device can be used to constitute image display devices for electronic paper such as e-books and e-newspapers, signs, posters, bulletin boards such as blackboards, rewritable paper as a printer paper substitute, displays for home appliances, card displays for point cards, electronic advertisements, and electronic POP displays. The display device of the present disclosure can be used as a light-emitting device to constitute various lighting devices, including backlight devices for liquid crystal display devices and planar light source devices.
[0057] [Example 1] Example 1 relates to a display device of the present disclosure, a display device of a first embodiment. Fig. 1A shows a schematic partial plan view of a group of light-emitting elements in the display device of Example 1, Fig. 1B shows a schematic arrangement of a drive circuit, Fig. 1C shows a schematic arrangement of a drive circuit and a signal line, Fig. 2 shows a schematic partial cross-sectional view of the display device of Example 1, and Fig. 3 shows a schematic partial cross-sectional view of a display device connected to the portion indicated by [A] in Fig. 2. Fig. 1A shows four (four sets) of light-emitting element units, and Figs. 1B and 1C show four (four sets) of drive circuits.
[0058] Here, Figures 1A and 4A illustrate four (four sets) of light-emitting element units, and Figures 1B, 1C, 4B, 4C, 5, 6A, 6B, 7A, 7B, 7C, and 7D illustrate four sets of drive circuits. Also, Figures 8A, 9A, and 10A illustrate two (two sets) of light-emitting element units, and Figures 8B, 9B, and 10B illustrate two sets of drive circuits. For convenience, the first direction is indicated by "X" and the second direction is indicated by "Y" in the drawings. In the schematic partial plan view of the light-emitting element groups, one light-emitting element group is surrounded by a solid line, and the light-emitting elements are surrounded by a dotted line. Furthermore, signal lines are indicated by dashed lines.
[0059] In the following description, light-emitting elements that emit green light, such as light-emitting element 12G1 and light-emitting element 12G2, may be collectively referred to as "light-emitting element 12G," light-emitting elements that emit red light, such as light-emitting element 12R1 and light-emitting element 12R2, may be collectively referred to as "light-emitting element 12R," light-emitting elements that emit blue light, such as light-emitting element 12B1 and light-emitting element 12B2, may be collectively referred to as "light-emitting element 12B," light-emitting elements that emit white light, such as light-emitting element 12W1 and light-emitting element 12W2, may be collectively referred to as "light-emitting element 12," and light-emitting element 12G, light-emitting element 12R, light-emitting element 12B, and light-emitting element 12W may be collectively referred to as "light-emitting element 12."
[0060] In the display device of Example 1, a plurality of light-emitting element groups 10 are arranged in a first direction and a second direction different from the first direction, Each light emitting element group 10 is composed of a plurality of light emitting element units 11. Each light-emitting element unit 11 is composed of one first light-emitting element 12G that emits a first color, one second light-emitting element 12R that emits a second color, and one third light-emitting element 12B that emits a third color, Each light emitting element group 10 includes a first drive circuit for driving the first light emitting element 12G, a second drive circuit for driving the second light emitting element 12R, and a third drive circuit for driving the third light emitting element 12B, In each light-emitting element group 10, the number of first driving circuits is equal to the number of first light-emitting elements 12G, the number of second driving circuits is less than the number of second light-emitting elements 12R, and the number of third driving circuits is less than the number of third light-emitting elements 12B.
[0061] The display device of Example 1 further includes a first signal line extending in the second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction, In each light-emitting element group 10, the light-emitting element units 11 are arranged along a first direction, the first drive circuit, the second drive circuit, and the third drive circuit are arranged along a first direction; Each of the first driving circuits is connected to a corresponding one of the first signal lines; Each of the second driving circuits is connected to a corresponding one of the second signal lines; Each of the third driving circuits is connected to a corresponding one of the third signal lines.
[0062] Specifically, in the display device of Example 1, in each light-emitting element group 10, when the number of first light-emitting elements 12G is M1, the number of second light-emitting elements 12R is M2, the number of third light-emitting elements 12B is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3, M1=M2=M3=2 N1=2 N2=N3=1 In the first embodiment, the light emitting element group 10 is composed of two light emitting element units 11. That is, The first light-emitting element unit 111 is composed of a light-emitting element 12G1, a light-emitting element 12R1, and a light-emitting element 12B1. The second light-emitting element unit 112 is composed of a light-emitting element 12G2, a light-emitting element 12R2, and a light-emitting element 12B2.
[0063] Then, when the number of first signal lines is SL1, the number of second signal lines is SL2, and the number of third signal lines is SL3, N1=SL1=2 N2=SL2=1 N3=SL3=1 are in a relationship.
[0064] where: The two first light-emitting elements 12G are denoted by reference numerals 12G1 and 12G2. The two second light-emitting elements 12R are designated by reference numerals 12R1 and 12R2. The two third light-emitting elements 12B are denoted by reference numerals 12B1 and 12B2.
[0065] Also, The two first drive circuits are designated by the reference numeral DR G1 ,DR G2 It is expressed as One second drive circuit is designated by reference numeral DR R12 It is expressed as One third drive circuit is designated by reference numeral DR B12 It is expressed as:
[0066] Furthermore, The two first signal lines are designated by reference numeral SL G1 ,SL G2 It is expressed as One second signal line is designated by reference numeral SL R12 It is expressed as One third signal line is designated by reference numeral SL B12 It is expressed as:
[0067] More specifically, First drive circuit DR G1 is the first signal line SL G1 is connected to First drive circuit DR G2 is the first signal line SL G2 are connected to each of the One second driver circuit DRR12 is the second signal line SL R12 is connected to One third driver circuit DR B12 is the third signal line SL B12 is connected to.
[0068] and, Second drive circuit DR R12 The signal DT R12 is supplied, Third drive circuit DR B12 The signal DT B12 is supplied.
[0069] Specifically, the first signal line SL G1 , and a data signal DT G1 is the first drive circuit DR G1 , the brightness of the first light emitting element 12G1 is controlled, and the first signal line SL G2 , and a data signal DT G2 is the first drive circuit DR G2 and the brightness of the first light emitting element 12G2 is controlled.
[0070] In addition, in the horizontal selector, the grayscale average T R12 is obtained, and the second signal line SL R12 The gray level average T R12 Signal (data signal) based on DT R12 is the second drive circuit DR R12 Further, in the horizontal selector, the gray level average T B12 is obtained, and the third signal line SLB12 , and the gradation average T B12 Signal (data signal) based on DT B12 is the third drive circuit DR B12 and the brightness of the third light emitting elements 12B1 and 12B2 is controlled.
[0071] As shown in the schematic diagram of FIG. 23, in general, when k is a constant, there is a relationship between the input grayscale T and the luminance L, for example, L=k×T 2.2 "2.2" is the gamma value. Therefore, for example, when averaging the luminance in a data signal having a gradation of "100" and the luminance in a data signal having a gradation of "200", the horizontal selector does not output a data signal of (100+200) / 2=150 gradations, but needs to send a gradation average that will give the average luminance as a data signal to the second light-emitting elements 12R1, 12R2 and the third light-emitting elements 12B1, 12B2. That is, for example, if the luminance of an image that should be displayed on the second light-emitting element 12R1 is to be adjusted to L R1 , the luminance of the image to be displayed by the second light emitting element 12R2 is set to L R2 Then, the average luminance of the image to be displayed by the second light emitting elements 12R1 and 12R2 is [(L R1 +L R2 ) / 2]. Therefore, [(L R1 +L R2 ) / 2]=k×T R12 2.2 The gradation average T that satisfies R12 , and furthermore, the gradation average T R12 Data signal DT based on R12 The horizontal selector generates the second signal line SL R12 The same applies to the third light-emitting elements 12B1 and 12B2.
[0072] In the display device of Example 1, in each light-emitting element unit 11, the first light-emitting element 12G, the second light-emitting element 12R, and the third light-emitting element 12B are arranged in a delta arrangement.
[0073] In addition, in the light-emitting element of Example 1, although not limited thereto, the first color is green, the second color is red, and the third color is blue. The light-emitting element 12 is composed of an organic electroluminescence element (organic EL element), and the display device is composed of an organic electroluminescence display device (organic EL display device), and is an active matrix display device.
[0074] Specifically, the display device of Example 1 or Examples 2 to 5 described later has the following features: A first substrate 41, a second substrate 42, and a plurality of light-emitting elements 12 (12R, 12G, 12B) arranged two-dimensionally between a first substrate 41 and a second substrate 42; It is equipped with The light-emitting element 12 (12R, 12G, 12B) includes a light-emitting portion 30, The light-emitting section 30 provided on the base 26 formed on the first substrate 41 is first electrode 31, A second electrode 32, and an organic layer 33 (having a light-emitting layer including an organic electroluminescent layer) sandwiched between a first electrode 31 and a second electrode 32; and Light from the organic layer 33 is emitted to the outside through the second substrate .
[0075] More specifically, the light-emitting unit 30 included in each of the light-emitting elements 12 (12R, 12G, 12B) is provided on a base 26 formed on a first substrate 41, The light emitting unit 30 is first electrode 31, an organic layer (organic electroluminescence layer) 33 formed on the first electrode 31; and a second electrode 32 formed on the organic layer 33; At least one of the following is provided:
[0076] A protective layer 34 made of an acrylic resin is formed on the second electrode 32 so as to cover the second electrode 32. A color filter layer CF made of a known material is formed on the top surface or above the protective layer 34 (specifically, on the protective layer 34 in Example 1 or Examples 2 to 5 described below) by a known method, and a planarization layer 35 is formed on the color filter layer CF. Note that although the outer shapes of the light-emitting section 30 and the color filter layer CF are circular, for example, they are not limited to such shapes.
[0077] Color filter layer CF (CF R ,CF G ,CF B The planarization layer 35 formed on the organic layer 33 is bonded to the second substrate 42 via the sealing resin layer 36. Examples of materials that can be used to form the sealing resin layer 36 include thermosetting adhesives such as acrylic adhesives, epoxy adhesives, urethane adhesives, silicone adhesives, and cyanoacrylate adhesives, as well as ultraviolet-curing adhesives. The color filter layer CF is an on-chip color filter layer (OCCF) formed on the first substrate side. This can shorten the distance between the organic layer 33 and the color filter layer CF, preventing light emitted from the organic layer 33 from entering an adjacent color filter layer CF of another color and causing color mixing. In some cases, the planarization layer 35 may be omitted, and the color filter layer CF may be bonded to the second substrate 42 via the sealing resin layer 36.
[0078] In the light emitting elements 12 of Examples 1 to 5 that are made up of organic EL elements, the organic layer 33 has a laminated structure of a red light emitting layer, a green light emitting layer, and a blue light emitting layer. As described above, one light emitting element unit (one pixel) is made up of three light emitting elements: a red light emitting element 12R, a green light emitting element 12G, and a blue light emitting element 12B. The organic layer 33 that constitutes the light emitting element 12 emits white light, and each of the light emitting elements 12R, 12G, and 12B is made up of an organic layer 33 that emits white light and a color filter layer CF R ,CF G ,CF BThe red light emitting element 12R that displays red is provided with a red color filter layer CF R The green light emitting element 12G that should display green is provided with a green color filter layer CF G The blue light emitting element 12B that is to display blue is provided with a blue color filter layer CF B The red light emitting element 12R, the green light emitting element 12G, and the blue light emitting element 12B have substantially the same configuration and structure, except for the positions of the color filter layer and the light emitting layer. The number of pixels is, for example, 1920 x 1080, with one light emitting element (display element) constituting one sub-pixel, and the number of light emitting elements (specifically, organic EL elements) being three times the number of pixels.
[0079] A drive circuit is provided below a base 26 made of SiO2 formed by a CVD method. The drive circuit can have a known circuit configuration. The drive circuit is composed of a transistor (specifically, a MOSFET) formed on a silicon semiconductor substrate corresponding to a first substrate 41. A transistor 20 made of a MOSFET is composed of a gate insulating layer 22 formed on the first substrate 41, a gate electrode 21 formed on the gate insulating layer 22, source / drain regions 24 formed in the first substrate 41, a channel formation region 23 formed between the source / drain regions 24, and an element isolation region 25 surrounding the channel formation region 23 and the source / drain region 24. The base 26 is composed of a lower interlayer insulating layer 26A and an upper interlayer insulating layer 26B.
[0080] In the first light emitting element 12G1, the transistor 20 (first driving circuit DR G1 ) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and G1 , and are electrically connected via a contact plug 27B. In addition, in the first light emitting element 12G2, the transistor 20 (first driving circuit DR G2) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and G2 , are electrically connected via contact plug 27B.
[0081] In the second light emitting element 12R1, a transistor 20 (second driving circuit DR R12 ) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and B12-A , and are electrically connected via a contact plug 27B. In addition, in the second light emitting element 12R2, the transistor 20 (second driving circuit DR R12 ) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and B12-A , a wiring layer (not shown) provided on the lower interlayer insulating layer 26A, and a pad portion 27C provided on the lower interlayer insulating layer 26A. B12-B , are electrically connected via contact plug 27B.
[0082] In the third light emitting element 12B1, the transistor 20 (the third driving circuit DR B12 ) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and B12-A , and are electrically connected via a contact plug 27B. In addition, in the third light emitting element 12B2, the transistor 20 (third drive circuit DR B12 ) and the first electrode 31 are connected to a contact plug 27A provided in the lower interlayer insulating layer 26A, a pad portion 27C provided on the lower interlayer insulating layer 26A, and B12-A , a wiring layer (not shown) provided on the lower interlayer insulating layer 26A, and a pad portion 27C provided on the lower interlayer insulating layer 26A. B12-B , are electrically connected via contact plug 27B.
[0083] In the drawing, one transistor 20 is shown for one driving circuit.
[0084] The second electrode 32 is connected to the driving section at the outer periphery of the display device (specifically, the outer periphery of a pixel array section 72, which will be described later) via a contact hole (contact plug), not shown, formed in the base 26. At the outer periphery of the display device, an auxiliary electrode connected to the second electrode 32 may be provided below the second electrode 32, and the auxiliary electrode may be connected to the driving circuit.
[0085] The first electrode 31 functions as an anode electrode, and the second electrode 32 functions as a cathode electrode. The first electrode 31 is made of a light-reflecting material layer, specifically, a laminated structure of an Al-Nd alloy layer, an Al-Cu alloy layer, an Al-Ti alloy layer, and an ITO layer, for example. The second electrode 32 is made of a transparent conductive material such as ITO. The first electrode 31 is formed on the substrate 26 using a combination of vacuum deposition and etching. The second electrode 32 is formed by a film formation method with low particle energy, particularly vacuum deposition, and is not patterned. The organic layer 33 is also not patterned. However, this is not a limitation, and the organic layer 33 may be patterned. That is, the organic layer 33 may be colored differently for each subpixel, with the organic layer 33 for the red-light-emitting element being composed of an organic layer that emits red light, the organic layer 33 for the green-light-emitting element being composed of an organic layer that emits green light, and the organic layer 33 for the blue-light-emitting element being composed of an organic layer that emits blue light.
[0086] In Example 1, the organic layer 33 has a stacked structure of a hole injection layer (HIL), a hole transport layer (HTL), an emissive layer, an electron transport layer (ETL), and an electron injection layer (EIL). The emissive layer is composed of at least two emissive layers that emit light of different colors, and as described above, the light emitted from the organic layer 33 is white. Specifically, as described above, the organic layer has a structure in which three layers are stacked: a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light. The organic layer may have a structure in which two layers, a blue light emitting layer that emits blue light and a yellow light emitting layer, are stacked, or a structure in which two layers, a blue light emitting layer that emits blue light and an orange light emitting layer, are stacked.
[0087] The hole injection layer not only increases hole injection efficiency but also functions as a buffer layer to prevent leakage, and has a thickness of, for example, about 2 to 10 nm. The hole injection layer is made of, for example, a hexaazatriphenylene derivative represented by the following formula (A) or formula (B). If the edge of the hole injection layer comes into contact with the second electrode, this will be the main cause of brightness variations between pixels, leading to a deterioration in display quality.
[0088] [ka]
[0089] where R 1 ~R 6are each independently a substituent selected from hydrogen, halogen, a hydroxy group, an amino group, an arylamino group, a substituted or unsubstituted carbonyl group having 20 or less carbon atoms, a substituted or unsubstituted carbonyl ester group having 20 or less carbon atoms, a substituted or unsubstituted alkyl group having 20 or less carbon atoms, a substituted or unsubstituted alkenyl group having 20 or less carbon atoms, a substituted or unsubstituted alkoxy group having 20 or less carbon atoms, a substituted or unsubstituted aryl group having 30 or less carbon atoms, a substituted or unsubstituted heterocyclic group having 30 or less carbon atoms, a nitrile group, a cyano group, a nitro group, or a silyl group; and an adjacent R m (m=1 to 6) may be bonded to each other via a cyclic structure. 1 ~X 6 are each independently a carbon or nitrogen atom.
[0090] [ka]
[0091] The hole transport layer is a layer that increases the efficiency of hole transport to the light-emitting layer. In the light-emitting layer, when an electric field is applied, electrons and holes recombine to generate light. The electron transport layer is a layer that increases the efficiency of electron transport to the light-emitting layer, and the electron injection layer is a layer that increases the efficiency of electron injection into the light-emitting layer.
[0092] The hole transport layer is made of, for example, 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine (m-MTDATA) or α-naphthylphenyldiamine (αNPD) with a thickness of about 40 nm.
[0093] The light-emitting layer is a light-emitting layer that generates white light by mixing colors, and is formed by laminating, for example, a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, as described above.
[0094] In the red light-emitting layer, application of an electric field causes some of the holes injected from the first electrode 31 and some of the electrons injected from the second electrode 32 to recombine, thereby generating red light. Such a red light-emitting layer contains, for example, at least one material selected from a red light-emitting material, a hole transport material, an electron transport material, and a bipolar charge transport material. The red light-emitting material may be a fluorescent material or a phosphorescent material. A red light-emitting layer having a thickness of approximately 5 nm may be formed, for example, by mixing 30 mass % of 2,6-bis[(4'-methoxydiphenylamino)styryl]-1,5-dicyanonaphthalene (BSN) with 4,4-bis(2,2-diphenylvinyl)biphenyl (DPVBi).
[0095] In the green light-emitting layer, application of an electric field causes some of the holes injected from the first electrode 31 and some of the electrons injected from the second electrode 32 to recombine, thereby generating green light. Such a green light-emitting layer contains, for example, at least one material selected from a green light-emitting material, a hole transport material, an electron transport material, and a positive and negative charge transport material. The green light-emitting material may be a fluorescent material or a phosphorescent material. A green light-emitting layer having a thickness of approximately 10 nm is made, for example, of DPVBi mixed with 5% by mass of coumarin 6.
[0096] In the blue light-emitting layer, application of an electric field causes some of the holes injected from the first electrode 31 and some of the electrons injected from the second electrode 32 to recombine, generating blue light. Such a blue light-emitting layer contains, for example, at least one material selected from a blue light-emitting material, a hole transport material, an electron transport material, and a positive and negative charge transport material. The blue light-emitting material may be a fluorescent material or a phosphorescent material. A blue light-emitting layer having a thickness of approximately 30 nm may be formed, for example, by mixing 2.5 mass % of 4,4'-bis[2-{4-(N,N-diphenylamino)phenyl}vinyl]biphenyl (DPAVBi) with DPVBi.
[0097] The electron transport layer, which is about 20 nm thick, is made of, for example, 8-hydroxyquinoline aluminum (Alq3), and the electron injection layer, which is about 0.3 nm thick, is made of, for example, LiF or Li2O.
[0098] However, the materials constituting each layer are merely examples and are not limited to these materials. If the light-emitting layer is made of a phosphorescent material, it is possible to increase the brightness by about 2.5 to 3 times compared to when it is made of a fluorescent material. The light-emitting layer can also be made of a thermally activated delayed fluorescence (TADF) material. Furthermore, for example, the light-emitting layer may be made of a blue-light-emitting layer and a yellow-light-emitting layer, or a blue-light-emitting layer and an orange-light-emitting layer.
[0099] The light emitting element 12 has a resonator structure in which the organic layer 33 serves as a resonator. In order to appropriately adjust the distance from the light emitting surface to the reflecting surface (specifically, the distance from the light emitting surface to the first electrode 31 and the second electrode 32), the thickness of the organic layer 33 is set to 8×10 -8 m or more, 5×10 -7 m or less, and 1.5 × 10 -7 m or more, 3.5×10 -7 m or less. In an organic EL display device having a resonator structure, the red light emitting element 12R actually resonates red light emitted in the light emitting layer to emit reddish light (light having a peak in the red region of the optical spectrum) from the second electrode 32. The green light emitting element 12G resonates green light emitted in the light emitting layer to emit greenish light (light having a peak in the green region of the optical spectrum) from the second electrode 32. Furthermore, the blue light emitting element 12B resonates blue light emitted in the light emitting layer to emit bluish light (light having a peak in the blue region of the optical spectrum) from the second electrode 32.
[0100] An outline of a method for manufacturing the light emitting device 12 of Example 1 shown in FIGS. 1 and 2 will be described below.
[0101] [Process-100] First, a drive circuit is formed on a silicon semiconductor substrate (first substrate 41) based on a known MOSFET manufacturing process.
[0102] [Process-110] Next, a lower interlayer insulating layer 26A is formed on the entire surface by a CVD method. Then, a connection hole is formed in a portion of the lower interlayer insulating layer 26A located above one source / drain region 24 of the transistor 20 by photolithography and etching, a metal layer is formed on the lower interlayer insulating layer 26A including the connection hole by, for example, sputtering, and further, the metal layer is patterned by photolithography and etching, thereby forming a contact hole (contact plug) 27A and a pad portion 27C, and forming a wiring (not shown) connecting the pad portion 27C to the pad portion.
[0103] [Process-120] Then, an upper interlayer insulating layer 26B is formed on the entire surface, and a connection hole is formed in the portion of the upper interlayer insulating layer 26B located above the desired pad portion 27C using photolithography and etching techniques. A metal layer is formed on the upper interlayer insulating layer 26B including the connection hole using, for example, a sputtering method, and then the metal layer is patterned using photolithography and etching techniques, thereby forming a first electrode 31 on a portion of the base 26. The first electrode 31 is separated for each light-emitting element. Additionally, a contact hole (contact plug) 27B that electrically connects the first electrode 31 to the transistor 20 can be formed in the connection hole.
[0104] [Process-130] Next, for example, an insulating layer 28 is formed on the entire surface based on the CVD method, and then the insulating layer 28 is left on the base 26 between the first electrodes 31 based on photolithography and etching techniques.
[0105] [Process-140] Thereafter, the organic layer 33 is formed on the first electrode 31 and the insulating layer 28 by, for example, a PVD method such as vacuum deposition or sputtering, or a coating method such as spin coating or die coating. In some cases, the organic layer 33 may be patterned into a desired shape.
[0106] [Process-150] Next, the second electrode 32 is formed on the entire surface, for example, by vacuum deposition. In some cases, the second electrode 32 may be patterned into a desired shape. In this manner, the organic layer 33 and the second electrode 32 can be formed on the first electrode 31.
[0107] [Process-160] Thereafter, a protective layer 34 is formed on the entire surface by a coating method, and then the top surface of the protective layer 34 is planarized. Since the protective layer 34 can be formed by a coating method, there are fewer restrictions on the processing process, a wide range of materials can be selected, and high refractive index materials can be used. Thereafter, a color filter layer CF (CF R ,CF G ,CF B ) is formed.
[0108] [Process-170] Then, a planarization layer 35 is formed on the color filter layer CF. Thereafter, the planarization layer 35 and the second substrate 42 are bonded together with a sealing resin layer 36 made of an acrylic adhesive. In this way, the light-emitting element (organic EL element) 12 shown in FIGS. 1 and 2 and the display device of Example 1 can be obtained. In this way, by providing the color filter layer CF on the first substrate side rather than on the second substrate side, a so-called OCCF type can be used, thereby shortening the distance between the organic layer 33 and the color filter layer CF.
[0109] In the display device of Example 1, the second and third drive circuits for driving the second and third light-emitting elements are thinned out. This allows for a reduction in the total number of drive circuits relative to the total number of light-emitting elements. This allows for a greater number of light-emitting elements to be arranged without reducing the pitch of the drive circuits, thereby increasing the resolution of the light-emitting elements. Alternatively, the density of the drive circuits can be reduced, thereby improving the manufacturing yield of the display device, improving image quality, and reducing manufacturing costs. Furthermore, since the configuration and structure of the light-emitting element groups can be similar to those of conventional display devices, the design and manufacturing of the display device do not require significant changes from conventional display devices and can be applied regardless of the arrangement and alignment of the light-emitting element groups. Furthermore, it allows for a high degree of flexibility in combining light-emitting element groups and drive circuits. Green has higher visibility than red or blue. Therefore, even if, in one light-emitting element group, two green light-emitting elements are driven independently, two red light-emitting elements are driven based on an averaged data signal, and two blue light-emitting elements are driven based on an averaged data signal, there will be no particular problem with the image quality displayed on the display device.
[0110] The driving unit will be explained below. A block diagram showing the overall circuit configuration of the display device in Examples 1 to 6 is shown in Figure 20, an equivalent circuit diagram of the light-emitting element and driving circuit included in the display device shown in Figure 20 is shown in Figure 21, and a timing chart for explaining the operation of the sub-pixel 76 shown in Figure 21 is shown in Figure 22.
[0111] The display device 71 includes a pixel array section 72 and a driver section (73, 74, 75) that drives the pixel array section.
[0112] The pixel array section 72 includes: Scan lines WSL extending in the first direction 101 ~WSL 10m , Signal line (SL) DTL extending in the second direction 101 ~DTL 10n , A sub-pixel (PXLC) 76 arranged in an area where a scanning line and a signal line intersect, and Power supply lines DSL arranged corresponding to the sub-pixels 76 arranged along the first direction 101 ~DSL 10m , It is equipped with:
[0113] The drive units (73, 74, 75) are Each scan line WSL 101 ~WSL 10m a write scanner (main scanner WSCN) 74 that sequentially supplies control signals to the sub-pixels 76 to perform line-sequential scanning on a row-by-row basis; In accordance with this line sequential scanning, each power line DSL 101 ~DSL 10m a power supply scanner (DSCN) 75 for supplying a voltage that switches between a first potential and a second potential to the In accordance with this line-sequential scanning, the signal lines DTL extending in the second direction 101 ~DTL 10n a horizontal selector (signal selector HSEL) 73 that supplies a signal potential (data signal) that becomes an image signal and a reference potential to the It is equipped with:
[0114] The sub-pixel 76 includes a light-emitting element 12 , which is typified by an organic EL element, a sampling transistor 81 , a driving transistor 82 , and a storage capacitor 83 .
[0115] The gate of the sampling transistor 81 is connected to the scanning line WSL 101 and one of the source / drain regions is connected to the signal line DTL 101 and the other is connected to the gate 82A of the driving transistor 82. One source / drain region 82C of the driving transistor 82 is connected to the light emitting element 12, and the other source / drain region 82B is connected to the power supply line DSL 101The second electrode 32 of the light-emitting element 12 is connected to a ground wiring 84. The ground wiring 84 is wired in common to all of the sub-pixels 76. One end of the storage capacitor 83 is connected to one source / drain region 82C of the driving transistor 82, and the other end is connected to a gate portion 82A of the driving transistor 82.
[0116] The sampling transistor 81 is connected to the scanning line WSL 101 The signal line DTL 101 The signal potential supplied from the power supply line DSL is sampled and stored in the storage capacitor 83. The driving transistor 82 is connected to the power supply line DSL 101 The power supply scanner (DSCN) 75 receives a current from the horizontal selector (HSEL) 73 and supplies a drive current to the light emitting element 12 according to the signal potential held in the holding capacitor 83. The power supply scanner (DSCN) 75 operates after the sampling transistor 81 is turned on and the horizontal selector (HSEL) 73 turns on the signal line DTL 101 While supplying the reference potential to the power line DSL 101 between the first potential and the second potential, thereby controlling the threshold voltage V th The storage capacitor 83 stores a voltage equivalent to the threshold voltage Vth of the driving transistor 82. This threshold voltage correction function enables the display device 71 to cancel the influence of the threshold voltage of the driving transistor 82, which varies from subpixel to subpixel.
[0117] 21 has a mobility correction function in addition to the threshold voltage correction function described above. That is, after the sampling transistor 81 is turned on, the horizontal selector (HSEL) 73 turns on the signal line DTL 101 from the reference potential to the signal potential, while the write scanner (WSCN) 74 switches the scanning line WSL 101By canceling the application of the control signal to the horizontal selector 73 to place the sampling transistor 81 in a non-conductive state and appropriately setting the period between the first timing and the second timing, a correction for the mobility μ of the driving transistor 82 is applied to the signal potential when the signal potential is held in the holding capacitor 83. In this case, the driving unit (73, 74, 75) can optimize the period between the first timing and the second timing (mobility correction period) by adjusting the relative phase difference between the image signal supplied by the horizontal selector 73 and the control signal supplied by the light scanner 74. The horizontal selector 73 can also apply a slope to the rising edge of the image signal that switches from the reference potential to the signal potential, so that the mobility correction period between the first timing and the second timing automatically follows the signal potential.
[0118] In addition, the write scanner (WSCN) 74 has a bootstrap function. That is, when the signal potential is held in the holding capacitor 83, the write scanner (WSCN) 74 holds the scanning line WSL 101 The application of the control signal to the sampling transistor 81 is stopped, the sampling transistor 81 is put into a non-conductive state, and the gate 82A of the driving transistor 82 is connected to the signal line DTL 101 , and the source potential V s The gate potential V g and the gate-source voltage V gs can be maintained constant.
[0119] FIG. 22 is a timing chart illustrating the operation of the sub-pixel 76 shown in FIG. 21. The time axis is shared, and the scanning lines (WSL 101 ) potential change, power line (DSL 101 ) potential change and signal line (DTL 101 ) potential changes. In addition to these potential changes, the gate potential V g and the source potential V s The change in is also shown.
[0120] In this timing chart, the periods are conveniently divided into periods (B) to (G) in accordance with the transition of the operation of the sub-pixels 76. In the light-emitting period (B), the light-emitting element 12 is in a light-emitting state. After the light-emitting period (B), a new field of line-sequential scanning begins, and first, in the first period (C), the gate potential V g is initialized. In the next period (D), the source potential V s In this way, the gate potential V g and the source potential V s By initializing the threshold voltage, preparation for the threshold voltage correction operation is completed. Subsequently, the threshold voltage correction operation is actually performed in the threshold voltage correction period (E), and the threshold voltage V is applied between the gate portion 82A of the driving transistor 82 and one of the source / drain regions 82C. th In reality, a voltage equivalent to the threshold voltage V th is written to the storage capacitor 83 connected between the gate 82A of the driving transistor 82 and one of the source / drain regions 82C. Then, the sampling period / mobility correction period (F) begins, and the signal potential V of the image signal is in is the threshold voltage V th The voltage V is written to the storage capacitor 83 in a state where it is added to the voltage V, and a voltage ΔV for mobility correction is subtracted from the voltage stored in the storage capacitor 83. Then, the light emission period (G) begins, and the signal potential V in The light emitting element emits light at a brightness corresponding to the signal potential V in is the threshold voltage V th and the mobility correction voltage ΔV, the light emission luminance of the light emitting element 12 is adjusted by the threshold voltage V of the driving transistor 82. th The gate-source voltage V of the driving transistor 82 is not affected by variations in the capacitance and mobility μ. gs (=V in +V th -ΔV) is kept constant, the gate potential V of the driving transistor 82 is g and the source potential V s increases.
[0121] Although an example in which the drive circuit is configured from two transistors has been described above, the drive circuit may also have a well-known circuit configuration configured from three transistors, four transistors, five transistors, six transistors, etc. Furthermore, in the drive circuits for the first light-emitting element, the second light-emitting element, and the third light-emitting element, the constants and specifications of the various transistors and storage capacitors may be the same or may be different for each light-emitting element.
[0122] [Example 2] Example 2 is a modification of Example 1 and relates to a display device of a second embodiment. A schematic partial plan view of a group of light-emitting elements in the display device of Example 2 is shown in Fig. 4A, the layout of the drive circuits is shown in Fig. 4B and Fig. 4C, and the layout of the drive circuits and signal lines is shown in Fig. 5, Fig. 6A, and Fig. 6B. Note that Fig. 4B and Fig. 4C differ in the layout of the second drive circuit and the third drive circuit along the second direction.
[0123] The display device of Example 2 further includes a first signal line extending in a second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction; In each light-emitting element group 10, the light-emitting element units 11 are arranged along a second direction, First drive circuit DR G1 ,DR G2 , second drive circuit DR R12 and the third drive circuit DR B12 are arranged along a second direction, All DRs of the first drive circuit G1 ,DR G2 is a shared first signal line SL G12 is connected to Second drive circuit DR R12 and the third drive circuit DR B12 is a shared second signal line SL R-B12 is connected to.
[0124] Generally, a viewer viewing a display device has high visibility in the horizontal direction. In the display device of Example 2, the second and third light-emitting elements are arranged in the horizontal direction (first direction in the illustrated example) in the same manner as in a conventional display device, while the two light-emitting elements display images of the same luminance in the vertical direction (second direction in the illustrated example). On the other hand, in the display device of Example 1, the second and third light-emitting elements are arranged in the vertical direction (second direction in the illustrated example) in the same manner as in a conventional display device, while the two light-emitting elements display images of the same luminance in the horizontal direction (first direction in the illustrated example). Therefore, the display device of Example 2 can display a higher-quality image to a viewer than the display device of Example 1. However, with regard to signal lines, the display device of Example 1 can be simplified more than the display device of Example 2. Therefore, whether to adopt the display device of Example 1 or the display device of Example 2 can be determined taking these factors into consideration.
[0125] 6A and 6B are schematic diagrams showing modified examples of the arrangement of the driving circuits and signal lines in the display device of Example 2. In the example shown in FIG. R12 and the third drive circuit DR B12 is a shared second signal line SL R-B12 On the other hand, in the example shown in FIGS. 6A and 6B, the second driving circuit DR R12 is one second signal line SL R12 and the third driver circuit DR B12 is one third signal line SL B12 In FIGS. 6A and 6B, the second signal line SL R12 and the third signal line SL B12 The relative positions of the
[0126] Except for the above points, the configuration and structure of the display device of Example 2 can be the same as the configuration and structure of the display device of Example 1, so detailed description will be omitted.
[0127] [Example 3] Example 3 is a modification of Example 1. A schematic partial plan view of a group of light-emitting elements in the display device of Example 3 is shown in Figure 7A, and the arrangement of the drive circuits is shown in Figures 7B, 7C, and 7D. In the display device of the first form of Example 3, the first light-emitting elements 12G1 and 12G2, the second light-emitting elements 12R1 and 12R2, and the third light-emitting elements 12B1 and 12B2 in each light-emitting element unit are arranged in a stripe pattern. The drive circuit DR shown in Figure 7B G1 ,DR G2 ,DR R12 ,DR B12 The arrangement of the driving circuits DR1 and DR2 shown in FIGS. 7C and 7D is the same as that of the display device of the first embodiment shown in FIG. 1B. G1 ,DR G2 ,DR R12 ,DR B12 The arrangement is substantially the same as that of the display device of Example 2 shown in FIGS. 4B and 4C.
[0128] Except for the above points, the configuration and structure of the display device of Example 3 can be the same as the configuration and structure of the display device of Example 1, so detailed description will be omitted.
[0129] [Example 4] Example 4 is a modification of Examples 1 to 3. Fig. 8A shows a schematic partial plan view of the light emitting element group 10 in the display device of Example 4, and Fig. 8B shows a schematic arrangement of the drive circuits. In the display device of the first form of Example 4, in each light emitting element group 10, when the number of first light emitting elements 12G is M1, the number of second light emitting elements 12R is M2, the number of third light emitting elements 12B is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3, M1=M2=M3=4 N1=4 N2=2 N3=1 Here, when the number of first signal lines is SL1, the number of second signal lines is SL2, and the number of third signal lines is SL3, N1=SL1=4 N2=SL2=2 N3=SL3=1 are in a relationship.
[0130] That is, the light emitting element group (one pixel) in Example 4 is composed of four light emitting element units (sub-pixels). The first light-emitting element unit 111 is composed of light-emitting elements 12G1, 12R1, and 12B1. The second light-emitting element unit 112 is composed of light-emitting elements 12G2, 12R2, and 12B2. The third light-emitting element unit 113 is composed of light-emitting elements 12G3, 12R3, and 12B3. The fourth light-emitting element unit 114 is composed of light-emitting elements 12G4, 12R4, and 12B4.
[0131] In the display device of Example 4, in each light-emitting element unit 11, the first light-emitting element 12G, the second light-emitting element 12R, and the third light-emitting element 12B are also arranged in the delta arrangement.
[0132] The display device of Example 4 includes first signal lines SL1 extending in the second direction, second signal lines SL2 extending in the second direction, and third signal lines SL3 extending in the second direction, In each light-emitting element group 10, the light-emitting element units 11 are arranged along a first direction, First drive circuit DR G1 ,DR G2 ,DR G3 ,DR G4 , second drive circuit DR R12 ,DR R34 , third drive circuit DR B1234 are arranged along a first direction, First drive circuit DR G1 is connected to the first signal line SL1, First drive circuit DR G2 is connected to the first signal line SL2, First drive circuit DR G3 is connected to the first signal line SL3, First drive circuit DR G4 is connected to the first signal line SL4, Second drive circuit DR R12is connected to the second signal line (shared with the first signal line SL1), Second drive circuit DR R34 is connected to the second signal line (shared with the first signal line SL3), Third drive circuit DR B1234 is connected to the third signal line (shared with the first signal line SL2).
[0133] The first signal line SL G4 is a first driving circuit DR constituting an adjacent light emitting element group. G4 The first signal line SL to which G4 It is shared with.
[0134] and, Second drive circuit DR R12 is supplied with a signal obtained by averaging the gray levels of the signals for the two second light-emitting elements 12R1 and 12R2, Second drive circuit DR R34 is supplied with a signal obtained by averaging the gray levels of the signals for the two second light-emitting elements 12R3 and 12R4, Third drive circuit DR B1234 is supplied with a signal obtained by averaging the gray levels of the signals for the four third light emitting elements 12B1, 12B2, 12B3, and 12B4.
[0135] Specifically, from the horizontal selector, A data signal for controlling the luminance of the first light emitting element 12G1 is supplied to the first driving circuit DR via the first signal line SL1. G1 and the brightness of the first light emitting element 12G1 is controlled. A data signal for controlling the luminance of the first light emitting element 12G2 is sent to the first driving circuit DR via the first signal line SL2. G2 and the brightness of the first light emitting element 12G2 is controlled. A data signal for controlling the luminance of the first light emitting element 12G3 is supplied to the first driving circuit DR via the first signal line SL3. G3 and the brightness of the first light emitting element 12G3 is controlled. A data signal for controlling the luminance of the first light emitting element 12G4 is sent to the first driving circuit DR via the first signal line SL4. G4 and the brightness of the first light emitting element 12G4 is controlled.
[0136] Also, in the horizontal selector, The data signal DT that controls the brightness of the second light-emitting element 12R1 R1 and a data signal DT that controls the brightness of the second light-emitting element 12R2. R2 However, in the same way as described above, the gradation average T R12 and the second driving circuit DR R12 and the brightness of the second light emitting elements 12R1 and 12R2 is controlled. The data signal DT that controls the brightness of the second light-emitting element 12R3 R3 and a data signal DT that controls the brightness of the second light-emitting element 12R4. R4 However, in the same way as described above, the gradation average T R34 and the second driving circuit DR R34 and the brightness of the second light emitting elements 12R3 and 12R4 is controlled.
[0137] Furthermore, in the horizontal selector, a data signal DT B1 , the data signal DT B2 , the data signal DT B3 , the data signal DT B4 However, in the same way as described above, the gradation average T B1234 and the third driving circuit DR B1234 and the brightness of the third light emitting elements 12B1, 12B2, 12B3, and 12B4 is controlled.
[0138] Except for the above points, the configuration and structure of the display device of Example 4 can be the same as the configuration and structure of the display device of Example 1, so detailed description will be omitted. Note that the arrangement of the light-emitting elements can also be a stripe arrangement, and the display device can also be the display device of the second form.
[0139] [Example 5] Example 5 is also a modification of Examples 1 to 3. Fig. 9A shows a schematic partial plan view of a group of light emitting elements in a display device of a first form of Example 5, and Fig. 9B shows a schematic arrangement of a drive circuit.
[0140] In the display device of Example 5 (the display device of the first embodiment), Each light-emitting element unit 11 further includes a fourth light-emitting element 12W1, 12W2 that emits a fourth color. Each light emitting element group 10 further includes a fourth drive circuit DR that drives the fourth light emitting elements 12W1 and 12W2. W1 ,DR W2 It is equipped with In each light-emitting element group 10, a fourth drive circuit DR W1 ,DR W2 The number of the fourth light-emitting elements 12W1 and 12W2 is equal to or less than the number of the fourth light-emitting elements 12W1 and 12W2. Specifically, in Example 5, they are equal. The first color may be green, the second color may be red, the third color may be blue, and the fourth color may be white.
[0141] FIG. 10A shows a schematic partial plan view of a group of light emitting elements in a modified example (a display device of a second embodiment) of the display device of Example 5, and FIG. 10B shows a schematic arrangement of the drive circuits.
[0142] Except for the above points, the configuration and structure of the display device of Example 5 can be the same as the configuration and structure of the display device of Example 1 or Example 2, so detailed description will be omitted. Note that the arrangement of the light-emitting elements can also be a stripe arrangement, and the display device can also be the display device of the second form.
[0143] [Example 6] In Example 6, the display devices described in Examples 1 to 5 were applied to a head-mounted display (HMD). A conceptual diagram of an image display device constituting the head-mounted display of Example 6 is shown in Fig. 15, a schematic view of the head-mounted display of Example 6 viewed from above is shown in Fig. 16, a schematic view of the head-mounted display of Example 6 viewed from the front is shown in Fig. 17, and a schematic view of the head-mounted display of Example 6 viewed from the side is shown in Fig. 18A. Also, Fig. 18B is a schematic cross-sectional view showing an enlarged portion of a reflective volume hologram diffraction grating in the display device of Example 6.
[0144] The image display device 100 of the sixth embodiment is an image forming device 110 including the display device 111 described in the first to fifth embodiments; light guide plate 121, a first deflection means 131 attached to the light guide plate 121; and a second deflection means 132 attached to the light guide plate 121; And, Light from the image forming device 110 is deflected (or reflected) by the first deflection means 131, propagates inside the light guide plate 121 by total reflection, is deflected by the second deflection means 132, and is emitted toward the pupil 151 of the viewer 150.
[0145] The system formed by the light guide plate 121 and the second deflection means 132 is of a semi-transmissive type (see-through type).
[0146] The head-mounted display of Example 6 is (A) A frame 140 (for example, a glasses-type frame 140) to be worn on the head of an observer 150, and (B) Image display device 100 attached to frame 140; The head mounted display of Example 6 is specifically a binocular type having two image display devices, but it may also be a monocular type having one. The image display device 100 may be fixedly attached to the frame 140, or may be detachably attached. The head mounted display is, for example, a direct drawing type head mounted display that draws an image directly on the pupil 151 of the observer 150.
[0147] The light guide plate 121 has a first surface 122 onto which light from the image forming device 110 is incident, and a second surface 123 opposite to the first surface 122. That is, the light guide plate 121, which is made of optical glass or a plastic material, has two parallel surfaces (the first surface 122 and the second surface 123) extending parallel to the direction of light propagation (x direction) due to total internal reflection in the light guide plate 121. The first surface 122 and the second surface 123 are opposite to each other. The first deflection unit 131 is disposed on (specifically, bonded to) the second surface 123 of the light guide plate 121, and the second deflection unit 132 is disposed on (specifically, bonded to) the second surface 123 of the light guide plate 121.
[0148] First deflection means (first diffraction grating member) 131 is made up of a hologram diffraction grating, specifically a reflective volume hologram diffraction grating, and second deflection means (second diffraction grating member) 132 is also made up of a hologram diffraction grating, specifically a reflective volume hologram diffraction grating. First interference fringes are formed inside the hologram diffraction grating that constitutes first deflection means 131, and second interference fringes are formed inside the hologram diffraction grating that constitutes second deflection means 132.
[0149] The first deflection means 131 diffracts and reflects the parallel light incident on the light guide plate 121 from the second surface 123 so that the light is totally reflected inside the light guide plate 121. The second deflection means 132 diffracts and reflects the light that has propagated through the light guide plate 121 by total reflection, and guides it to the pupil 151 of the observer 150. The second deflection means 132 forms a virtual image formation region in the light guide plate 121. The axes of the first deflection means 131 and the second deflection means 132 are parallel to the x direction, and their normals are parallel to the z direction. Each reflection-type volume hologram diffraction grating made of a photopolymer material has interference fringes corresponding to one wavelength band (or wavelength) formed therein and is fabricated by a conventional method. The pitch of the interference fringes formed on the reflection-type volume hologram diffraction grating is constant, the interference fringes are linear, and they are parallel to the y direction.
[0150] FIG. 18B shows an enlarged schematic partial cross-sectional view of a reflection-type volume hologram diffraction grating. Interference fringes with a slant angle φ are formed on the reflection-type volume hologram diffraction grating. Here, the slant angle φ refers to the angle between the surface of the reflection-type volume hologram diffraction grating and the interference fringes. The interference fringes are formed from the interior to the surface of the reflection-type volume hologram diffraction grating. The interference fringes satisfy the Bragg condition. Here, the Bragg condition refers to the condition that satisfies the following formula (A). In formula (A), m is a positive integer, λ is the wavelength, d is the pitch of the grating surface (the spacing in the normal direction of an imaginary plane containing the interference fringes), and Θ is the complement angle of the angle of incidence on the interference fringes. Furthermore, when light enters the diffraction grating member at an incident angle ψ, the relationship between Θ, the slant angle φ, and the incident angle ψ is as shown in formula (B).
[0151] m λ=2 d sin(Θ) (A) Θ=90°-(φ+ψ) (B)
[0152] In the sixth embodiment, the display device 111 constituting the image forming device 110 is configured from the display device of the first embodiment, but is not limited to this. The entire image forming device 110 is housed in a housing 112. Note that an optical system through which the image emitted from the display device 111 passes may be provided in order to control the display size, display position, etc. of the image emitted from the display device 111. The type of optical system to be provided depends on the specifications required for the head-mounted display and the image forming device 110. In a head-mounted display or an image forming device of a type in which an image is sent to both eyes from one display device 111, the display devices of the first to fifth embodiments may be adopted.
[0153] The frame 140 is composed of a front portion 141 disposed in front of the viewer 150, two temple portions 143 rotatably attached to both ends of the front portion 141 via hinges 142, and end pieces (also called tip pieces, earmuffs, or ear pads) 144 attached to the tip of each temple portion 143. Nose pads 140' are also attached. That is, the assembly of the frame 140 and nose pads 140' basically has substantially the same structure as ordinary eyeglasses. Furthermore, each housing 112 is attached to the temple portion 143 with attachment members 149. The frame 140 is made of metal or plastic. Note that each housing 112 may be detachably attached to the temple portion 143 with the attachment members 149. Furthermore, for a viewer who owns and wears eyeglasses, each housing 112 may be detachably attached to the temple portion 143 of the frame 140 of the viewer's eyeglasses with the attachment members 149. Each housing 112 may be attached to the outside of the temple portion 143 or may be attached to the inside of the temple portion 143. Alternatively, the light guide plate 121 may be fitted into a rim provided on the front portion 141.
[0154] Furthermore, wiring (such as signal lines and power lines) 145 extending from one image forming device 110 passes through the temple portion 143 and the interior of the end piece 144, extends from the tip of the end piece 144 to the outside, and is connected to a control device (control circuit, control means) 148. Furthermore, each image forming device 110 is equipped with a headphone portion 146, and headphone portion wiring 146' extending from each image forming device 110 passes through the temple portion 143 and the interior of the end piece 144, and extends from the tip of the end piece 144 to the headphone portion 146. More specifically, the headphone portion wiring 146' extends from the tip of the end piece 144 to the headphone portion 146, wrapping around the back side of the auricle (auricle). With this configuration, the headphone portion 146 and the headphone portion wiring 146' do not give the impression of being arranged in a disorderly manner, and a neat and tidy head-mounted display can be achieved.
[0155] As described above, the wiring (signal lines, power supply lines, etc.) 145 is connected to the control device (control circuit) 148, and processing for image display is performed in the control device 148. The control device 148 can be configured from a known circuit.
[0156] A camera 147, which is composed of a solid-state image pickup element such as a CCD or CMOS sensor and a lens (not shown), is attached by an appropriate mounting member (not shown) to a central portion 141' of the front part 141, as required. A signal from the camera 147 is sent to a control device (control circuit) 148 via wiring (not shown) extending from the camera 147.
[0157] In the image display device of Example 6, light (e.g., corresponding to the size of one pixel or one sub-pixel) emitted from the display device 111 at a certain moment is made into parallel light. Then, this light reaches the pupil 151 (specifically, the crystalline lens) of the observer 150, and the light that passes through the crystalline lens finally forms an image on the retina of the pupil 151 of the observer 150.
[0158] Alternatively, the head-mounted display can be a retinal projection display based on Maxwellian vision, specifically a retinal projection head-mounted display, which displays an image by directly projecting an image (light beam) onto the observer's retina.
[0159] The present disclosure has been described above based on preferred embodiments, but the present disclosure is not limited to these embodiments. The configurations and structures of the display device (organic EL display device) and light-emitting element (organic EL element) described in the embodiments are examples and can be modified as appropriate, and the manufacturing method of the display device is also examples and can be modified as appropriate. In addition to organic EL display devices, liquid crystal display devices can also be used as display devices. In the embodiments, the drive circuit is configured from MOSFETs, but it can also be configured from TFTs. The first electrode and the second electrode may have a single-layer structure or a multi-layer structure.
[0160] The size of the light-emitting portion of the first light-emitting element 12G may be larger than the size of the light-emitting portion of the second light-emitting element 12R and the size of the light-emitting portion of the third light-emitting element 12B. That is, the size of the light-emitting region of the first light-emitting element 12G may be larger than the size of the light-emitting region of the second light-emitting element 12R and the size of the light-emitting region of the third light-emitting element 12B.
[0161] The light-emitting elements may be configured as a red light-emitting element 12R whose organic layer generates red light, a green light-emitting element 12G whose organic layer generates green light, and a blue light-emitting element 12B whose organic layer generates blue light, and these three types of light-emitting elements may be combined into a light-emitting element unit (one pixel). In this case, the color filter layer may be omitted, or a color filter layer may be provided to improve color purity.
[0162] As shown in Figure 11, which is a schematic partial cross-sectional view of variant 1 of the display device of Example 1, a lens member (on-chip microlens) 50 through which light emitted from the light-emitting section 30 passes may be provided in the portion of the protective layer 34 above the light-emitting section 30.
[0163] 12 is a schematic partial cross-sectional view of a modified example 2 of the display device of the first embodiment. A color filter layer CF (CF R ,CF G ,CF B ) may be provided. The color filter layer CF and the planarizing layer 35 are bonded together by a sealing resin layer 36 made of an acrylic adhesive. The planarizing layer 35 may be omitted, and the color filter layer CF and the protective layer 34 may be bonded together by the sealing resin layer 36.
[0164] 13 is a schematic partial cross-sectional view of a third modification of the display device of the first embodiment, and a light absorbing layer (black matrix layer) BM may be formed between the color filter layers CF of adjacent light emitting elements. The black matrix layer BM may be made of, for example, a black resin film (specifically, for example, a black polyimide resin) containing a black colorant and having an optical density of 1 or more.
[0165] 14 shows a schematic partial cross section of Modification 4 of the display device of Example 1, and a light absorption layer (black matrix layer) BM' may be formed above and between the color filter layers CF of adjacent light-emitting elements. Modifications 3 and 4 may also be combined, and these various modifications or combinations of modifications may also be applied to other Examples.
[0166] The planarization layer may also function as a color filter layer. That is, the planarization layer having such a function may be made of a known color resist material. By making the planarization layer function as a color filter layer in this way, it becomes possible to arrange the organic layer and the planarization layer in close proximity, and color mixing can be effectively prevented even when the angle of light emitted from the light-emitting element is widened, thereby improving the viewing angle characteristics.
[0167] To prevent optical crosstalk caused by light emitted from a light-emitting element penetrating into an adjacent light-emitting element, a light-shielding portion may be provided between the light-emitting elements. Specifically, a groove may be formed between the light-emitting elements and filled with a light-shielding material to form the light-shielding portion. Such a light-shielding portion can reduce the rate at which light emitted from a light-emitting element penetrates into an adjacent light-emitting element, thereby suppressing color mixing and the resulting deviation of the chromaticity of the entire pixel from the desired chromaticity. Furthermore, preventing color mixing increases color purity when the pixel emits a single color, deepening the chromaticity point. This widens the color gamut and broadens the range of color expression of the display device. Furthermore, while a color filter layer is provided for each pixel to improve color purity, depending on the configuration of the light-emitting element, the color filter layer may be thinned or omitted, allowing light absorbed by the color filter layer to be extracted, resulting in improved luminous efficiency. Alternatively, a light-absorbing layer (black matrix layer) may be provided with light-shielding properties.
[0168] The light guide may include a light reflecting portion (light reflective portion, reflector portion) that controls the direction of travel of light emitted from the light emitting portion. Specifically, the light guide may be made of a material that reflects the light emitted from the light emitting portion. Examples of the light guide include a metal material, an alloy material, a dielectric material (insulating material) having a refractive index smaller than that of the medium through which the light emitted from the light emitting portion passes, or a multilayer structure of a dielectric material. Specifically, examples of the metal material or alloy material include an aluminum (Al) layer, an aluminum alloy layer (e.g., an Al-Nd layer), a chromium (Cr) layer, a silver (Ag) layer, and a silver alloy layer (e.g., an Ag-Cu layer, an Ag-Pd-Cu layer, an Ag-Sm-Cu layer). These layers can be formed by evaporation methods, including electron beam evaporation, hot filament evaporation, and vacuum evaporation, sputtering, CVD, and ion plating; plating methods (electroplating and electroless plating); lift-off; laser ablation; and sol-gel processes. The light reflecting portion of the light guide portion may have, for example, a cylindrical side surface.
[0169] The display device of the present disclosure can be applied to a single-lens reflex digital still camera with interchangeable lenses. A front view of the digital still camera is shown in FIG. 19A, and a rear view is shown in FIG. 19B. This single-lens reflex digital still camera with interchangeable lenses has, for example, an interchangeable taking lens unit (interchangeable lens) 212 on the right side of the front of a camera main body (camera body) 211, and a grip unit 213 for the photographer to hold on the left side of the front. A monitor 214 is provided in the approximate center of the back of the camera main body 211. An electronic viewfinder (eyepiece window) 215 is provided above the monitor 214. By looking through the electronic viewfinder 215, the photographer can visually confirm the optical image of the subject guided by the taking lens unit 212 and determine the composition of the shot. In a single-lens reflex digital still camera with interchangeable lenses configured as described above, the display device of the present disclosure can be used as the electronic viewfinder 215.
[0170] When a resonator structure is provided, the light reflecting layer 37 may be formed below the first electrode 31 (on the first substrate 41 side). That is, when the light reflecting layer 37 is provided on the base 26 and the first electrode 31 is provided on the interlayer insulating film 38 that covers the light reflecting layer 37, the first electrode 31, the light reflecting layer 37, and the interlayer insulating film 38 may be made of the materials described above. The light reflecting layer 37 may or may not be connected to the contact hole (contact plug) 27.
[0171] Hereinafter, resonator structures will be described based on Examples 1 to 8 with reference to Figures 27A (First Example), 27B (Second Example), 28A (Third Example), 28B (Fourth Example), 29A (Fifth Example), 29B (Sixth Example), 30A (Seventh Example), and 30B and 30C (Eighth Example). In Examples 1 to 7, the first electrode and the second electrode have the same thickness in each light-emitting section. On the other hand, in Examples 5 and 6, the first electrode has different thicknesses in each light-emitting section, and the second electrode has the same thickness in each light-emitting section. In Example 8, the first electrode may have different thicknesses or the same thickness in each light-emitting section, and the second electrode has the same thickness in each light-emitting section.
[0172] In the following description, the light-emitting portions constituting the first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 are denoted by reference numerals 301, 302, and 303, the first electrodes are denoted by reference numerals 311, 312, and 313, the second electrodes are denoted by reference numerals 321, 322, and 323, the organic layers are denoted by reference numerals 331, 332, and 333, the light-reflecting layers are denoted by reference numerals 371, 372, and 373, and the interlayer insulating films are denoted by reference numerals 381, 382, 383, 381', 382', and 383'. In the following description, the materials used are examples only and can be changed as appropriate.
[0173] In the illustrated example, the resonator lengths of the first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123 derived from equations (1-1) and (1-2) are shortened in the order of the first light-emitting element 121, the second light-emitting element 122, and the third light-emitting element 123, but this is not limited to this, and the optimal resonator length can be determined by appropriately setting the values of m1 and m2.
[0174] FIG. 27A shows a conceptual diagram of a light-emitting device having a first example of a resonator structure, FIG. 27B shows a conceptual diagram of a light-emitting device having a second example of a resonator structure, FIG. 28A shows a conceptual diagram of a light-emitting device having a third example of a resonator structure, and FIG. 28B shows a conceptual diagram of a light-emitting device having a fourth example of a resonator structure. In the first to sixth examples and part of the eighth example, interlayer insulating films 38 and 38' are formed under the first electrode 31 of the light-emitting section 30, and a light-reflecting layer 37 is formed under the interlayer insulating films 38 and 38'. In the first to fourth examples, the thicknesses of the interlayer insulating films 38 and 38' are different in the light-emitting sections 301, 302, and 303. By appropriately setting the thicknesses of the interlayer insulating films 381, 382, 383, 381', 382', and 383', it is possible to set the optical distance that generates optimal resonance for the emission wavelength of the light-emitting section 30.
[0175] In the first example, the first interfaces (shown by dotted lines in the drawings) are at the same level in the light-emitting sections 301, 302, and 303, while the levels of the second interfaces (shown by dashed lines in the drawings) are different in the light-emitting sections 301, 302, and 303. In the second example, the first interfaces are at different levels in the light-emitting sections 301, 302, and 303, while the levels of the second interfaces are the same in the light-emitting sections 301, 302, and 303.
[0176] In the second example, the interlayer insulating films 381′, 382′, and 383′ are made of an oxide film formed by oxidizing the surface of the light-reflecting layer 37. The oxide interlayer insulating film 38′ is made of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, or zirconium oxide, depending on the material constituting the light-reflecting layer 37. The surface of the light-reflecting layer 37 can be oxidized, for example, by the following method. That is, the first substrate 41 on which the light-reflecting layer 37 is formed is immersed in an electrolyte filled in a container. A cathode is placed facing the light-reflecting layer 37. The light-reflecting layer 37 is then anodized using the light-reflecting layer 37 as the anode. The thickness of the oxide film formed by anodization is proportional to the potential difference between the light-reflecting layer 37, which serves as the anode, and the cathode. Therefore, anodization is performed while applying voltages to the light-reflecting layers 371, 372, and 373 corresponding to the light-emitting sections 301, 302, and 303, respectively. This allows interlayer insulating films 381', 382', and 383' made of oxide films of different thicknesses to be formed all at once on the surface of the light reflecting layer 37. The thicknesses of the light reflecting layers 371, 372, and 373 and the interlayer insulating films 381', 382', and 383' differ depending on the light emitting sections 301, 302, and 303.
[0177] In the third example, an undercoat film 39 is disposed under the light-reflecting layer 37, and the undercoat film 39 has different thicknesses in the light-emitting sections 301, 302, and 303. That is, in the example shown in the figure, the thicknesses of the undercoat films 39 are greater in the order of the light-emitting section 301, the light-emitting section 302, and the light-emitting section 303.
[0178] In the fourth example, the thicknesses of the light reflecting layers 371, 372, and 373 during deposition differ between the light emitting sections 301, 302, and 303. In the third and fourth examples, the second interfaces are at the same level between the light emitting sections 301, 302, and 303, while the levels of the first interfaces differ between the light emitting sections 301, 302, and 303.
[0179] In the fifth and sixth examples, the thicknesses of the first electrodes 311, 312, and 313 are different in the light-emitting sections 301, 302, and 303. The light-reflecting layer 37 has the same thickness in each light-emitting section 30.
[0180] In the fifth example, the level of the first interface is the same in the light emitting portions 301, 302, and 303, while the level of the second interface is different in the light emitting portions 301, 302, and 303.
[0181] In the sixth example, an undercoat film 39 is disposed under the light-reflecting layer 37, and the undercoat film 39 has different thicknesses in the light-emitting portions 301, 302, and 303. That is, in the example shown, the thickness of the undercoat film 39 increases in the order of the light-emitting portion 301, the light-emitting portion 302, and the light-emitting portion 303. In the sixth example, the second interfaces are at the same level in the light-emitting portions 301, 302, and 303, while the levels of the first interfaces are different in the light-emitting portions 301, 302, and 303.
[0182] In the seventh example, the first electrodes 311, 312, and 313 also serve as light reflecting layers, and the optical constants (specifically, the amount of phase shift) of the materials constituting the first electrodes 311, 312, and 313 differ depending on the light emitting sections 301, 302, and 303. For example, the first electrode 311 of the light emitting section 301 may be made of copper (Cu), and the first electrode 312 of the light emitting section 302 and the first electrode 313 of the light emitting section 303 may be made of aluminum (Al).
[0183] In the eighth example, the first electrodes 311 and 312 also serve as light-reflecting layers, and the optical constants (specifically, the amount of phase shift) of the materials constituting the first electrodes 311 and 312 differ depending on the light-emitting sections 301 and 302. For example, the first electrode 311 of the light-emitting section 301 may be made of copper (Cu), and the first electrode 312 of the light-emitting section 302 and the first electrode 313 of the light-emitting section 303 may be made of aluminum (Al). In the eighth example, for example, the seventh example is applied to the light-emitting sections 301 and 302, and the first example is applied to the light-emitting section 303. The thicknesses of the first electrodes 311, 312, and 313 may be different or the same.
[0184] The present disclosure can also be configured as follows. [A01]《Display device》 A display device in which a plurality of light-emitting element groups are arranged in a first direction and a second direction different from the first direction, Each light-emitting element group is composed of a plurality of light-emitting element units, Each light-emitting element unit is composed of one first light-emitting element that emits a first color, one second light-emitting element that emits a second color, and one third light-emitting element that emits a third color; Each light emitting element group includes a first drive circuit for driving a first light emitting element, a second drive circuit for driving a second light emitting element, and a third drive circuit for driving a third light emitting element; A display device in which, in each light-emitting element group, the number of first drive circuits is equal to the number of first light-emitting elements, the number of second drive circuits is less than the number of second light-emitting elements, and the number of third drive circuits is less than the number of third light-emitting elements. [A02] The optical fiber circuit further includes a first signal line extending in a second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction; In each light-emitting element group, the light-emitting element units are arranged along a first direction, the first drive circuit, the second drive circuit, and the third drive circuit are arranged along a first direction; Each of the first driving circuits is connected to a corresponding one of the first signal lines; Each of the second driving circuits is connected to a corresponding one of the second signal lines; The display device according to [A01], wherein each of the third driving circuits is connected to each of the third signal lines. [A03] The optical fiber circuit further includes a first signal line extending in a second direction, a second signal line extending in the second direction, and a third signal line extending in the second direction; In each light-emitting element group, the light-emitting element units are arranged along the second direction, the first drive circuit, the second drive circuit, and the third drive circuit are arranged along a second direction; All of the first driving circuits are connected to a single shared first signal line; The display device according to [A01], wherein the second driving circuit and the third driving circuit are connected to a single shared second signal line. [A04] In each light-emitting element group, when the number of first light-emitting elements is M1, the number of second light-emitting elements is M2, the number of third light-emitting elements is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3, M1=M2=M3=2 N1=2 N2=N3=1 The display device according to any one of [A01] to [A03], which satisfies the following. [A05] A signal obtained by gradation-averaging signals for the two second light-emitting elements is supplied to the second driving circuit; The display device according to [A04], wherein the third driving circuit is supplied with a signal obtained by gradation-averaging the signals for the two third light-emitting elements. [A06] In each light-emitting element group, when the number of first light-emitting elements is M1, the number of second light-emitting elements is M2, the number of third light-emitting elements is M3, the number of first drive circuits is N1, the number of second drive circuits is N2, and the number of third drive circuits is N3, M1=M2=M3=4 N1=4 N2=2 N3=1 The display device according to [A02], which satisfies the following. [A07] A signal obtained by gradation-averaging signals for the two second light-emitting elements is supplied to the second driving circuit; The display device according to [A06], wherein the third driving circuit is supplied with a signal obtained by gradation-averaging the signals for the four third light-emitting elements. [A08] The display device according to any one of [A01] to [A07], wherein in each light-emitting element unit, the first light-emitting element, the second light-emitting element, and the third light-emitting element are arranged in a delta arrangement. [A09] The display device according to any one of [A01] to [A07], wherein in each light-emitting element unit, the first light-emitting element, the second light-emitting element, and the third light-emitting element are arranged in a stripe arrangement. [A10] The display device according to any one of [A01] to [A09], wherein the first color is green, the second color is red, and the third color is blue. [A11] Each light-emitting element unit further includes a fourth light-emitting element that emits a fourth color; Each light-emitting element group further includes a fourth drive circuit that drives the fourth light-emitting element, The display device according to any one of [A01] to [A10], wherein in each light emitting element group, the number of fourth drive circuits is equal to or less than the number of fourth light emitting elements. [A12] The display device according to [A11], wherein the first color is green, the second color is red, the third color is blue, and the fourth color is white. [A13] The display device according to any one of [A01] to [A12], wherein the size of the light-emitting portion of the first light-emitting element is larger than the size of the light-emitting portion of the second light-emitting element and the size of the light-emitting portion of the third light-emitting element. [A14] The display device according to any one of [A01] to [A13], wherein the light-emitting element is an organic electroluminescence element. [Explanation of symbols]
[0185] 10···Light-emitting element group, 11, 111, 112, 113, 114···Light-emitting element units, 12···Light-emitting elements, 12G, 12G1, 12G2, 12G3, 12G4···First light-emitting elements, 12R, 12R1, 12R2, 12R3, 12R4···Second light-emitting elements, 12B, 12B1, 12R2, 12B3, 12B4···Third light-emitting elements, 12W, 12W1, 12W2···Fourth light-emitting elements, DR G1 ,DR G2 ,DR G3 ,DR G4 First drive circuit, DR R12 ,DR R34 Second drive circuit, DR B12 ,DR B34 Third drive circuit, DR W1 ,DR W2 4th drive circuit, SL G1 ,SL G2 1st signal line, SL R12 ,SL2...Second signal line, SL B12 ,SL3···Third signal line, SL1,SL2,SL3,SL4···First signal line, SL G12,SL R-B12 Shared signal lines, DT G1 ,DT G2 ,DT R12 ,DT B12 Data signal, T R12 ,T B12 26A lower interlayer insulating layer, 26B upper interlayer insulating layer, 27A, 27B contact plugs, 27C G1 ,27C G2 ,27C B12-A ,27C B12-A ,27C B12-B ,27C B12-A ,27C B12-A ,27C B12-B Pad portion, 28 insulating layer, 30 light-emitting portion, 31 first electrode, 32 second electrode, 33 organic layer (having a light-emitting layer including an organic electroluminescence layer), 34 protective layer, CF, CF R ,CF G ,CF B1. Color filter layer, 35. Planarization layer, 36. Sealing resin layer, 37. Light-reflecting layer, 38. Interlayer insulating film, 39. Undercoat layer, 41. First substrate, 42. Second substrate, 50. Lens member (on-chip microlens), BM, BM'. Light-absorbing layer (black matrix layer), 100. Image display device, 110. Image forming device, 111. Display device, 112. Housing, 121. Light guide plate, 122. First surface of light guide plate, 123. Second surface of light guide plate, 131. First deflection means, 132. Second deflection means, 140. Frame, 140'. Nose pad, 141 Front portion, 141', central portion of the front portion, 142, hinge, 143, temple portion, 144, end cap portion (cell tip, earmuffs, ear pads), 145, wiring (signal line, power line, etc.), 146, headphone portion, 146', wiring for headphone portion, 147, camera, 148, control device (control circuit, control means), 149, mounting member, 150, observer, 151, pupil, 211, camera main body portion (camera body), 212, photographing lens unit (interchangeable lens), 213, grip portion, 214, monitor, 215, electronic viewfinder (eyepiece window)
Claims
[Claim 1] A display device in which a plurality of light-emitting element groups are arranged in a first direction and a second direction different from the first direction, Each light-emitting element group is composed of a plurality of light-emitting element units, Each light-emitting element unit is composed of one first light-emitting element that emits a first color, one second light-emitting element that emits a second color, and one third light-emitting element that emits a third color; Each light emitting element group includes a first drive circuit for driving a first light emitting element, a second drive circuit for driving a second light emitting element, and a third drive circuit for driving a third light emitting element, A display device in which, in each light-emitting element group, the number of first driving circuits is equal to the number of first light-emitting elements, the number of second driving circuits is less than the number of second light-emitting elements, and the number of third driving circuits is less than the number of third light-emitting elements.
Citation Information
Patent Citations
Pixel arrangement structure for organic light emitting display device
JP2013187187A