Imaging apparatus

Abstract

To provide an imaging apparatus that can improve miniaturization and connection reliability of electric wiring.SOLUTION: An imaging apparatus 1 comprises a first electric board 101, a second electric board 102 having a notch part 102a and having a connector mounted along one side of the notch part 102a, and pieces of electric wiring 105, 106 connected to the connector. The first electric board 101 is arranged so that it is substantially orthogonal to the second electric board 102 at the notch part 102a, and a substrate surface of the first electric board 101 covers the pieces of electric wiring 105, 106.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an imaging device such as a digital video camera. [Background technology]

[0002] Many recent imaging devices, such as digital video cameras, are equipped with multiple external connection terminals for high-speed communication and Internet Protocol communication, and there is a demand for technology to prevent the device body from becoming larger due to the inclusion of multiple external connection terminals. Therefore, for example, Patent Document 1 discloses an external connection terminal section provided on the rear side of the device body, and arranging the multiple external connection terminals so that they do not overlap each other when viewed from the front to back of the device body, but overlap each other when viewed from the top to bottom, and so that they face diagonally downward and rearward of the device body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-87056 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology described in Patent Document 1 achieves miniaturization of the device body, but does not propose a configuration for reliably connecting electrical wiring between electrical boards inside the device. As a result, there is a risk that the connector of the electrical wiring connected to the connector mounted on the electrical board may come loose, resulting in a loss of connection reliability. Therefore, there is an urgent need to establish a technology that achieves both miniaturization of the device body and improvement of connection reliability of the electrical wiring.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide an imaging device that can be made smaller and that has improved connection reliability of electrical wiring. [Means for solving the problem]

[0006] The imaging device of the present invention is an imaging device comprising a first electrical board, a second electrical board having a cutout portion and a first connector mounted along one side of the cutout portion, and electrical wiring connected to the first connector, wherein the first electrical board is positioned approximately perpendicular to the second electrical board in the cutout portion, and the board surface of the first electrical board covers the electrical wiring. [Effects of the Invention]

[0007] According to the present invention, it is possible to reduce the size of the imaging device body and improve the connection reliability of the electrical wiring. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a first external perspective view of an imaging device according to an embodiment. [Figure 2] FIG. 2 is a second external perspective view of the imaging device. [Figure 3] FIG. 2 is an exploded perspective view of the imaging device. [Figure 4] FIG. 2 is an exploded perspective view of a main unit that constitutes the imaging device. [Figure 5] FIG. [Figure 6] FIG. 2 is a bottom view of a first electric board that constitutes the main unit. [Figure 7] 1A and 1B are a perspective view and an exploded perspective view partially showing the internal structure of an imaging device. [Figure 8] 3A and 3B are diagrams illustrating a connection state between electric boards inside the imaging device. [Figure 9] FIG. 2 is an exploded perspective view of a sensor unit that constitutes the imaging device. [Figure 10] FIG. 2 is an exploded perspective view of the sensor unit. [Figure 11] FIG. 2 is a rear view of a sensor substrate that constitutes the sensor unit. [Figure 12] FIG. 2 is a front view of a thermally conductive sheet that constitutes the sensor unit. [Figure 13]2 is a rear view of the sensor unit and a cross-sectional view taken along the line WW in the rear view. FIG. [Figure 14] FIG. 10 is a front view illustrating changes in a modified example of the sensor unit. [Figure 15] 2 is a perspective view showing the appearance of an imaging device according to a modified example of the imaging device of FIG. 1. FIG. [Figure 16] 1A is a partial rear view showing a state in which a cable is connected to an external connection terminal, and FIG. 1B is a rear view showing the internal configuration around the external connection terminal. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of the appearance of an imaging device 1 according to an embodiment. For convenience of explanation, a three-dimensional Cartesian coordinate system (X, Y, and Z axes) is defined for the imaging device 1 as shown in FIG. 1. The Z axis is parallel to the imaging optical axis of the imaging device 1, with the direction from the imaging device 1 toward a subject (not shown) being the positive direction (+Z) and the opposite direction being the negative direction (-Z). The X axis is the width direction of the imaging device 1, with the direction from left to right as viewed from the +Z side being the positive direction (+X) and the opposite direction being the negative direction (-X). The Y axis is the height direction of the imaging device 1, with the direction from the bottom surface toward the top surface being the positive direction (+Y) and the opposite direction being the negative direction (-Y).

[0010] Fig. 1(a) is an external perspective view of the imaging device 1 as seen from the front upper right, and Fig. 1(b) is an external perspective view of the imaging device 1 as seen from the front upper left. Fig. 2(a) is an external perspective view of the imaging device 1 as seen from the rear upper left, and Fig. 2(b) is an external perspective view of the imaging device 1 as seen from the rear lower left.

[0011] The imaging device 1 includes an imaging device main body 1A (hereinafter referred to as "device main body 1A"), a lens unit 2 attached to the front (+Z side) of the device main body 1A, and a grip belt 3 attached to the left side (-X side) of the device main body 1A. The lens unit 2 is a so-called interchangeable lens that can be replaced by a user. The grip belt 3 is a member that assists the user in stably holding the imaging device 1 and is detachable from the device main body 1A. By using the grip belt 3 to stabilize the hand holding the imaging device 1, the user can firmly hold the imaging device 1 with one hand and take pictures. The grip belt 3 is provided on the left side of the imaging device 1 because many people are generally right-handed, and so the imaging device 1 can be held with the right hand.

[0012] A gripping portion is provided on the left side (-X side) of the device body 1A so that the user can grip the imaging device 1. The gripping portion is provided with a media slot for detachably storing a storage medium such as a media card for saving image data of captured still images and videos. Note that in Figure 1(b), the media slot is hidden by a slot cover 7.

[0013] On the top surface (+Y side) of device main body 1A, there are arranged a power switch 5 for turning the power of imaging device 1 on / off, a recording operation button 6 for starting and stopping recording (shooting) still images and videos, and an accessory mounting section 10 for connecting accessories (not shown). On the back surface (-Z side) of device main body 1A, there are arranged a DC jack 8 for supplying power to imaging device 1 from an external source, a battery compartment 9 for storing a battery, and a rear display unit 11 for displaying images, etc. Note that a stepped section is provided on the rear surface of imaging device 1 that protrudes rearward (-Z side) from the rear surface of the grip section, and rear display unit 11 is arranged on the top surface (-Z side) of this stepped section.

[0014] Various operating members are provided on the right side (+X side) of the device body 1A. An external connection terminal 4 for establishing a communication connection with an external device is provided near the top surface of the right side of the device body 1A (at the corner where the top surface and right side intersect). The external connection terminal 4 is, for example, a USB terminal or an HDMI (registered trademark) terminal, but is not limited to these. The direction in which a cable (not shown) is inserted into or removed from the external connection terminal 4 is substantially parallel to the X direction (a direction substantially perpendicular to the right side of the device body 1A). In the imaging device 1, the external connection terminal 4 is located near the top surface of the right side of the device body 1A, thereby preventing the overall length of the imaging device 1 from increasing in the X and Y directions. The external connection terminal 4 is provided on the right side of the imaging device 1, opposite the left side to which the grip belt 3 is attached, and cables are inserted into or removed from the external connection terminal 4 in the space on the right side of the imaging device 1. Therefore, the hand holding the imaging device 1 using the grip belt 3 does not hinder workability when inserting or removing a cable into or from the external connection terminal 4, but rather plays a role in supporting the imaging device 1 and making insertion and removal easier.

[0015] The imaging device 1 is equipped with a forced air-cooling unit (details of which will be described later) having an air-cooling fan to cool heat-generating components on a circuit board (not shown) contained therein. An air intake 12 is provided on the right side of the device body 1A to introduce air into the device body 1A to cool the inside of the device body 1A. A first exhaust vent 13 is provided on the left side of the device body 1A above the grip (+Y side) to exhaust the air taken in from the air intake vent 12 into the device body 1A. A second exhaust vent 14 is provided on the bottom (-Y side) of the device body 1A to exhaust the air taken in from the air intake vent 12 into the device body 1A.

[0016] When the cooling fan is operated, air is drawn into the device body 1A through the air intake 12. The air heated by heat transfer from the heat-generating components inside the device body 1A is then exhausted to the outside air through the first exhaust vent 13 and the second exhaust vent 14. The first exhaust vent 13 is positioned so that the air exhausted from the first exhaust vent 13 does not hit the hand holding the grip. The second exhaust vent 14 is located on the bottom surface of the device body 1A and is therefore not visible from the front side (+Z side), thereby maintaining the aesthetic appearance of the imaging device 1. The second exhaust vent 14 is not blocked by the floor even when the imaging device 1 is placed on the floor, and is formed so that the exhaust air escapes to the rear side of the imaging device 1. Therefore, even when the imaging device 1 is placed on the floor, the cooling performance is not reduced.

[0017] 3 is an exploded perspective view of the imaging device 1. The imaging device 1 generally includes a lens unit 2, a main unit 100, a rear unit 200, a grip unit 300, an R unit 400, a sensor unit 500, a front unit 600, a bottom unit 700, a top unit 800, and an ND unit.

[0018] The main unit 100 has a forced air-cooling unit consisting of a duct, an air-cooling fan, etc., a control board for various controls, and an external connection terminal 4. The rear unit 200 has a rear display unit 11, an LCD panel, and a battery compartment 9. The grip unit 300 has a handle with a media slot for storing recording media. The R unit 400 has various operation members and an air intake 12. The sensor unit 500 has a sensor board mounted with an imaging element that photoelectrically converts light that passes through the lens unit 2. The front unit 600 has a mount section for attaching and detaching the lens unit 2. The bottom unit 700 has a second exhaust vent 14, a tripod mount, etc. The top unit 800 has a power switch 5, etc. The ND unit has multiple optical glasses for adjusting the amount of light.

[0019] The imaging device 1 is assembled, for example, by attaching the main unit 100 to the rear unit 200, and then attaching the grip unit 300 and the R unit 400 in that order. Next, the sensor unit 500 and the front unit 600, to which the ND unit has already been attached, are attached to the main unit 100, and then the top unit 800 and the bottom unit 700 are attached. When the desired lens unit 2 is attached to the front unit 600 of the completed device main body 1A in this way, the imaging device 1 is completed.

[0020] Next, the internal configuration of the imaging device 1 will be described. Fig. 4 is an exploded perspective view of the main unit 100. The main unit 100 is composed of a first electric board 101, a second electric board 102, a main duct unit 103, and a sensor duct unit 104. The electric board is a circuit board such as a printed wiring board on which electronic and electrical components are mounted. Figs. 5(a) and (b) are rear views (viewed from the -Z side) of the main unit 100. The main duct unit 103 and the sensor duct unit 104 are not shown in Figs. 5(a) and (b).

[0021] A cutout portion 102a is formed in second electric board 102. Two connectors for electrical connection with other electric boards are mounted on second electric board 102 along one side of cutout portion 102a, and electrical wiring 105, 106 are connected to each connector. Note that electrical wiring 105, 106 each include a connector whose shape corresponds to the connector provided on the second electric board, and the connectors are connected to each other.

[0022] External connection terminals 4 are mounted on first electric board 101. First electric board 101 is disposed in cutout portion 102a provided in second electric board 102, allowing external connection terminals 4 to be disposed lower on the -Y side, thereby achieving a reduction in size of device main body 1A. First electric board 101 is disposed such that its board surface covers electrical wiring 105, 106 electrically connected to second electric board 102 on the +Y side (the direction in which electrical wiring 105, 106 is connected to second electric board 102). In this manner, the board surface of first electric board 101 is configured to press electrical wiring 105, 106 against second electric board 102, making it difficult for the connectors of electrical wiring 105, 106 to come loose from the connectors mounted on second electric board 102, significantly improving the connection reliability of the electrical wiring.

[0023] In this embodiment, the side of the cutout portion 102a to which the electrical wirings 105 and 106 are connected is substantially parallel to the X-axis, but this side may be formed at a predetermined angle with respect to the X-axis. This increases the length of the side available for connecting the electrical wirings, making it possible to increase the number of poles of the contacts to which the electrical wirings 105 and 106 are connected and to connect more electrical wirings.

[0024] FIG. 6(a) is a bottom view (viewed from the -Y direction) of first electric board 101 on which external connection terminals 4 are mounted. First electric board 101 has mounting portion 101a for mounting external connection terminals 4 and non-mounting portion 101b on which no electronic or electrical components are mounted. First electric board 101 is arranged so that non-mounting portion 101b covers electrical wiring 105, 106 electrically connected to second electric board 102. This allows electrical wiring 105, 106 to be securely held down by the flat surface of non-mounting portion 101b, preventing defects due to contact between components mounted on first electric board 101 and electrical wiring 105, 106 and improving the reliability of the electrical circuit.

[0025] 6(b) is a bottom view of first electric board 101 and second electric board 102 on which external connection terminals 4 are mounted. The long sides of first electric board 101 and second electric board 102 are not substantially parallel to each other, and the overlapping range (length) of first electric board 101 and second electric board 102 is wider when viewed from the -Y direction than when they are substantially parallel. Therefore, first electric board 101 covers a wider range of electrical wiring 105, 106 electrically connected to second electric board 102, thereby improving the effect of preventing electrical wiring 105, 106 from coming loose from second electric board 102.

[0026] The imaging device 1 has multiple electric boards inside, such as the second electric board 102 and a sensor board, and electronic components mounted on the electric boards consume power and generate heat during imaging operations. To prevent performance degradation due to heat generated by the electronic components, it is necessary to maintain the electronic components at or below their guaranteed operating temperature, and therefore a heat dissipation mechanism (cooling mechanism) is required to prevent the electronic components from exceeding the guaranteed temperature.

[0027] Fig. 7(a) is a perspective view partially showing the internal structure of the imaging device 1, and Fig. 7(b) is an exploded perspective view of the structural portion shown in Fig. 7(a). Electronic components such as an MPU mounted on a second electric board 102 that is responsible for overall control of the imaging device 1 and an imaging element mounted on a sensor unit 500 generate heat and their temperatures rise during imaging operations. For this reason, as shown in Fig. 7(a), the imaging device 1 is equipped with a forced air-cooling unit including an air-cooling fan 1000, a main duct unit 103, and a sensor duct unit 104. Inside the imaging device 1, as shown in Fig. 7(b), the sensor unit 500, the sensor duct unit 104, the second electric board 102, the main duct unit 103, and the air-cooling fan 1000 are arranged in this order from the front (+Z side) to the rear (-Z side).

[0028] The air flow in the forced air cooling unit is indicated by dashed arrows in Figure 7(b). Air drawn in from the outside by the driving of the air cooling fan 1000 is supplied to the main duct unit 103, and part of the air passes through the inside of the main duct unit 103 before being exhausted to the outside. In addition, part of the air drawn into the main duct unit 103 passes through the connecting hole 1001 and flows into the sensor duct unit 104, then returns to the main duct unit 103, passes through the connecting hole 1002, and is exhausted to the outside.

[0029] Here, the electronic components mounted on the back side (-Z side) of the second electric board 102 face the main duct unit 103. The electronic components and sensor unit 500 mounted on the front side (+Z side) of the second electric board 102 are arranged with the sensor duct unit 104 sandwiched between them. Therefore, by placing a heat transfer member (not shown) between the electronic components and the duct, heat generated by the electronic components and imaging element can be efficiently transferred to the main duct unit 103 and the sensor duct unit 104. The heat transferred to the main duct unit 103 and the sensor duct unit 104 is transferred to the air flowing inside and is discharged to the outside.

[0030] Next, a heat dissipation means (heat dissipation path) provided for a heat generating component that cannot be placed opposite a duct, such as electronic component 1004, for reasons such as avoiding other components, will be described.

[0031] FIG. 8 is a diagram illustrating the connection between electrical boards via electrical wiring inside the imaging device 1, with FIG. 8(a) showing a perspective view and FIG. 8(b) showing a front view (viewed from the +Z side). The multiple electrical boards arranged inside the imaging device 1 are electrically connected to each other via electrical wiring. External connection terminals 1006 and 1007 and a second connector 1010 are mounted on a third electrical board 1005. The electrical wiring 1008 is a cable made up of multiple electric wires 1013, with a third connector 1011 attached to one end and a fourth connector 1012 attached to the other end. The third connector 1011 is connected to a first connector 1009 mounted on the second electrical board 102, and the fourth connector 1012 is connected to a second connector 1010 mounted on the third electrical board 1005. Thus, the second electrical board 102 and the third electrical board 1005 are electrically connected via the electrical wiring 1008.

[0032] The electrical wiring 1008 is arranged so as to run along the outer wall surface on the +Y side of the sensor duct unit 104 (hereinafter referred to as the "side surface of the sensor duct unit 104") by a wiring restrictor 1014 provided on the sensor duct unit 104. In this way, by bringing the electrical wiring 1008 into contact with the side surface of the sensor duct unit 104, heat transfer from the electrical wiring 1008 to the sensor duct unit 104 is possible. Heat generated by the electronic component 1004 mounted on the second electric board 102 is transferred to the first connector 1009 mounted nearby by thermal conduction of the wiring within the second electric board 102 and the board itself. The heat transferred to the first connector 1009 is transferred to the sensor duct unit 104 via the third connector 1011 and the electrical wiring 1008. In this way, the heat generated by the electronic component 1004 can be transferred to the sensor duct unit 104 using the electrical wiring 1008 as a heat transfer path, and can be dissipated into the air flowing inside the sensor duct unit 104 .

[0033] As shown in FIG. 8, a curved portion 1015 is provided on the side surface of the sensor duct unit 104. By arranging the electrical wiring 1008 so that it runs along the curved surface of the curved portion 1015, the electrical wiring 1008 can be lengthened, thereby increasing the contact area between the electrical wiring 1008 and the side surface of the sensor duct unit 104. This improves the heat transfer effect from the electrical wiring 1008 to the sensor duct unit 104. Furthermore, in general, in a heat dissipation structure using a duct, a high heat dissipation effect can be achieved by increasing the contact area with the air flowing inside the duct, so the length of the duct in the direction in which the air flows is sometimes increased. In the imaging device 1, the routing path of the electrical wiring 1008 is approximately parallel to the direction in which the air flows inside the sensor duct unit 104, as indicated by the arrow in FIG. 8(b), thereby improving the heat dissipation effect.

[0034] The heat dissipation configuration of the electrical board using electrical wiring is not limited to the above configuration. The electrical wiring may be a flexible flat cable or a flexible printed circuit board, and the electrical wiring may be routed not only on the side surface of the duct but also on other surfaces.

[0035] Next, the relationship between the sensor unit 500 and the sensor duct unit 104 will be described. Figures 9(a) and (b) are external perspective views of the sensor unit 500, with the sensor unit 500 viewed from different directions in Figures 9(a) and 9(b). Figures 10(a) and (b) are exploded perspective views of the sensor unit 500, with the sensor unit 500 viewed from different directions in Figures 10(a) and 10(b).

[0036] The sensor unit 500 includes an imaging element 2000, a sensor holding member 2003, a heat conductive sheet 2005 (first heat conductive member), a heat conductive plate 2004 (second heat conductive member), electrical wiring 2006, 2007, a fourth electrical board 2008, and a fifth electrical board 2010.

[0037] The imaging element 2000 is composed of an imaging section 2000a and a sensor substrate 2000b, and the imaging section 2000a is soldered and fixed to the sensor substrate 2000b. The imaging element 2000 is fixed to a sensor holding member 2003 with an adhesive. The sensor holding member 2003 has an opening 2003a for avoiding interference with the sensor substrate 2000b and an attachment surface 2003b to which a thermally conductive sheet 2005 is attached. The thermally conductive plate 2004 is formed in a flat plate shape with cutouts for avoiding interference with the first board-to-board connector 2001 (see FIG. 11) and the second board-to-board connector 2002 (see FIG. 11) mounted on the sensor substrate 2000b. One surface of the thermally conductive plate 2004 is attached to the sensor substrate 2000b, and the thermally conductive sheet 2005 is attached to the other surface.

[0038] 11 is a rear view of the sensor board 2000b. A plurality of electrical elements such as a first board-to-board connector 2001 and a second board-to-board connector 2002 are mounted on the sensor board 2000b.

[0039] 12 is a front view of the thermally conductive sheet 2005. The thermally conductive sheet 2005 has an attachment portion 2005a, which is attached to an attachment surface 2003b of the sensor holding member 2003 and the thermally conductive plate 2004. The thermally conductive sheet 2005 also has a plurality of extending portions, which are thermally connected to members in the vicinity of the sensor holding member 2003.

[0040] FIG. 13(a) is a rear view of the sensor unit 500, and FIG. 13(b) shows a cross-sectional view taken along the arrows WW in FIG. 13(a). In FIG. 13(a), the outline of the clamping portion 2005b (see FIG. 10(b)) of the thermally conductive sheet 2005 is indicated by a dashed line. As shown in FIGS. 10 and 13, a third board-to-board connector 2009 is mounted on the fourth electric board 2008. The third board-to-board connector 2009 is connected to the first board-to-board connector 2001 of the sensor board 2000b and is also connected to the electrical wiring 2006. In addition, a fourth board-to-board connector 2011 is mounted on the fifth electric board 2010. The fourth board-to-board connector 2011 is connected to the second board-to-board connector 2002 of the sensor board 2000b and is also connected to the electrical wiring 2007. Electrical wiring 2006, 2007 are each electrically connected to second electric board 102. In this manner, fourth electric board 2008 and fifth electric board 2010 are connected to second electric board 102.

[0041] An elastic member 2121 is disposed on the fourth electric board 2008 on the side opposite the third board-to-board connector 2009, and an elastic member 2013 is disposed on the fifth electric board 2010 on the side opposite the fourth board-to-board connector 2011. The Z-direction dimension of the elastic member 2012 is longer than the Z-direction distance between the fourth electric board 2008 and the sensor duct unit 104. Similarly, the Z-direction dimension of the elastic member 2013 is longer than the Z-direction distance between the fifth electric board 2010 and the sensor duct unit 104. Thus, the elastic members 2012 and 2013 are each compressed, generating a repulsive force in the ±Z directions. This repulsive force serves to sandwich and hold the clamping portion 2005b of the thermally conductive sheet 2005 between the elastic members 2012 and 2013 and the sensor duct unit 104, and also serves to prevent the third board-to-board connector 2009 and the fourth board-to-board connector 2011 from coming off.

[0042] As explained with reference to Figures 9 to 13, heat generated by the imaging element 2000 during operation of the imaging device 1 is mainly transferred to the sensor duct unit 104, making it possible to maintain the imaging element 2000 at a predetermined temperature or below.

[0043] Next, we will explain a modified example of sensor unit 500. This modified example differs from sensor unit 500 in that the routing of electrical wiring 2006, 2007 has been changed and an elastic member having a cord clamping function has been provided, and only this change will be explained with reference to Fig. 14.

[0044] 14 is a front view illustrating changes in a modified example of the sensor unit 500. The elastic members 2014 and 2015 are arranged at a predetermined interval in the X direction on the side opposite the mounting position of the third board-to-board connector 2009 on the fourth electric board 2008, and the gap between the elastic members 2014 and 2015 is used as a routing path for the electrical wiring 2006. Similarly, the elastic members 2016 and 2017 are arranged at a predetermined interval in the X direction on the side opposite the mounting position of the fourth board-to-board connector 2011 on the fifth electric board 2010, and the gap between the elastic members 2016 and 2017 is used as a routing path for the electrical wiring 2007. This configuration allows the elastic members 2014 and 2015 and the elastic members 2016 and 2017 to have a clamping function for the electrical wiring.

[0045] Next, another layout of the external connection terminal will be described. Fig. 15 is a perspective view of an imaging device 3001, which is a modified example of the imaging device 1. The imaging device 3001 differs from the imaging device 1 in that it includes an external connection terminal 3000, but other configurations are the same as those of the imaging device 1, so only the differences will be described below.

[0046] The external connection terminal 3000 is disposed rearward (toward the -Z side) of the rear surface of the grip unit 300 and forward (toward the +Z side) of the rear display unit 11, and is disposed so as not to protrude upward (toward the +Y side) from the upper surface of the accessory mount 10. Furthermore, the socket of the external connection terminal 3000 faces upward from the grip portion, forming an angle θ with the horizontal plane when the imaging device 3001 is in the normal posture (the ZX plane is parallel to the horizontal plane, and the +Y direction is facing vertically upward). Therefore, even when an accessory (not shown), such as a flash device, is attached to the accessory mount 10, a cable can be easily inserted into or removed from the external connection terminal 3000.

[0047] 16(a) is a partial rear view showing a state in which a cable 3010 having a plug 3002 is connected to an external connection terminal 3000. The grip unit 300 is provided with an operation unit 3003 that is operated by a user's finger, but the external connection terminal 3000 and the plug 3002 connected thereto do not overlap with the operation unit 3003 of the grip unit 3000 when viewed from the Z direction. Therefore, even when the cable 3010 is connected to the external connection terminal 3000, operation of the operation unit 3003 is not hindered.

[0048] FIG. 16(b) is a rear view showing the internal structure around the external connection terminal 3000. The external connection terminal 3000 is mounted on a substrate 3004. The accessory mounting unit 10 is provided on the upper surface of the imaging device 3001, and a portion of the substrate 3004 overlaps with the accessory mounting unit 10 when viewed from the Y direction. The accessory mounting unit 10 needs to be provided on the top surface of the device body to facilitate attachment and detachment of accessories. Because the accessory mounting unit 10 is located in a protruding portion of the upper surface of the imaging device 3001, space is generated below the accessory mounting unit 10 (−Y side). By inserting a portion of the substrate 3004 on which the external connection terminal 3000 is mounted into this space and effectively utilizing the available space, the device body can be made more compact. Although not shown, not only the substrate 3004 but also a portion of the external connection terminal 3000 may be arranged to overlap the accessory mounting unit 10 when viewed from the Y direction.

[0049] While the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Furthermore, each of the above-described embodiments merely represents one embodiment of the present invention, and each embodiment can be combined as appropriate.

[0050] In the above embodiment, the second electric board 102 is provided with a cutout portion 102a, and the first electric board 101 presses down the electric wiring 105, 106 connected to the connector mounted along one side of the cutout portion 102a, thereby improving the reliability of the electrical connection. Here, the shape of the electric board is not necessarily limited to a rectangle, and in many cases, recesses, extensions (protrusions), bent portions, etc. are appropriately provided depending on the internal configuration of the device in which it is mounted. The present invention can also be realized with a configuration in which electric wiring extending from one side of the periphery of one board or the bottom side of a recess is pressed down by a protrusion or bent portion of another board. Furthermore, in the above embodiment, the present invention is described as being applied to an imaging device, but the present invention can also be applied to an electronic device having multiple electric boards.

[0051] The disclosure of this embodiment includes the following configuration. (Configuration 1) An imaging device comprising a first electrical board, a second electrical board having a cutout portion and a first connector mounted along one side of the cutout portion, and electrical wiring connected to the first connector, wherein the first electrical board is positioned approximately perpendicular to the second electrical board in the cutout portion, and the board surface of the first electrical board covers the electrical wiring. (Configuration 2) The imaging device described in Configuration 1, characterized in that the electrical wiring has a second connector that is connected to the first connector, and the board surface of the first electrical board covers the electrical wiring from a first direction that connects the second connector to the first connector. (Configuration 3) The imaging device according to configuration 2, wherein the first direction is substantially parallel to the board surface of the second electric board. (Configuration 4) The imaging device according to Configuration 3, wherein the one side of the cutout portion is substantially perpendicular to the first direction. (Configuration 5) The imaging device according to configuration 3, wherein the one side of the cutout portion is inclined at a predetermined angle with respect to a second direction perpendicular to the first direction. (Configuration 6) An imaging device described in any one of configurations 1 to 5, characterized in that the electrical wiring is in contact with the first electrical board in a non-mounting portion of the board surface of the first electrical board where no electrical components are mounted. (Configuration 7) An imaging device described in any one of configurations 1 to 6, characterized in that when viewed from a direction perpendicular to the substrate surface of the first electrical substrate, the long sides of the first electrical substrate and the long sides of the second electrical substrate are not parallel to each other. (Configuration 8) An imaging device described in any one of configurations 1 to 7, characterized in that it has a first external connection terminal mounted on the first electrical board and arranged at a corner where a side surface and a top surface of the device body of the imaging device intersect, and the direction in which a cable is inserted into or removed from the first external connection terminal is perpendicular to the side surface. (Configuration 9) An imaging device described in any one of configurations 1 to 8, characterized in that it comprises electrical wiring that electrically connects multiple electrical boards, an air-cooling fan, a duct through which air flows when the air-cooling fan is driven, and a wiring regulator that holds the electrical wiring against the duct, and the electrical wiring is arranged so that it crawls around the duct by the wiring regulator. (Configuration 10) The imaging device according to configuration 9, wherein the duct has a curved portion, and the electrical wiring is arranged so as to run along the curved surface of the curved portion. (Configuration 11) The imaging device according to configuration 9 or 10, wherein the electrical wiring is arranged in a path that is substantially parallel to the air flow inside the duct. (Configuration 12) An imaging device described in any one of configurations 9 to 11, comprising two electrical boards electrically connected by a board-to-board connector, and a heat conductive member thermally connecting one of the two electrical boards to the duct, wherein the one electrical board is arranged between the other of the two electrical boards and the duct, an elastic member is arranged on the one board on the opposite side of the board-to-board connector, and a portion of the heat conductive member is sandwiched between the elastic member and the duct. (Configuration 13) The imaging device according to configuration 12, wherein the other substrate has an imaging element mounted thereon. (Configuration 14) An imaging device described in configuration 12 or 13, characterized in that the elastic member is arranged in two parts with a predetermined gap between them, and the gap is used as a routing path for some of the electrical wiring provided inside the imaging device. (Configuration 15) An imaging device described in any one of configurations 1 to 14, comprising: a gripping portion for a user to grip the imaging device; a step portion that does not overlap with the gripping portion when viewed from behind the imaging device and that protrudes further rearward than the gripping portion from the imaging device; a display unit arranged on the top surface of the step portion; and a second external connection terminal arranged on the step portion behind the back surface of the gripping portion and in front of the display unit, wherein the socket of the second external connection terminal faces the gripping portion. (Configuration 16) An imaging device according to Configuration 15, characterized in that an operating unit is provided on the back surface of the gripping portion, and the second external connection terminal does not overlap with the operating unit when viewed from behind the imaging device. (Configuration 17) An imaging device described in configuration 15 or 16, characterized in that the socket of the second external connection terminal faces upward of the gripping portion at a predetermined angle with respect to the horizontal plane when the imaging device is in a normal position. (Configuration 18) An imaging device described in any one of configurations 15 to 17, characterized in that it has an accessory mounting portion provided on the upper surface of the imaging device, and the second external connection terminal does not protrude upward from the upper surface of the accessory mounting portion. (Configuration 19) The imaging device according to configuration 18, wherein when viewed from above the imaging device, a portion of a board on which the second external connection terminal is mounted overlaps with the accessory mounting portion. (Configuration 20) An electronic device comprising a first electrical board, a second electrical board on which a first connector is mounted, and a cable having a second connector connected to the first connector, characterized in that in the vicinity of the second connector connected to the first connector, the board surface of the first electrical board covers the cable from the direction in which the second connector is connected to the first connector. [Explanation of symbols]

[0052] 1,3001 Imaging device 1A Device body 4,3000 external connection terminal 10 Accessory mounting part 11 Rear display unit 101 First electric board 101b Non-mounted part 102 Second electric board 102a Notch 103 Main duct unit 104 Sensor duct unit 105, 106 Electrical wiring 1000 air cooling fan 1015 Curved section 2005 Thermal Conduction Sheet 2012,2013 Elastic member 3003 Operation unit

Claims

1. a first electrical substrate; a second electric board having a cutout portion and a first connector mounted along one side of the cutout portion; an electrical wiring connected to the first connector, The imaging device is characterized in that the first electric board is disposed in the cutout portion so as to be substantially perpendicular to the second electric board, and a board surface of the first electric board covers the electric wiring.

2. the electrical wiring has a second connector connected to the first connector; 2. The imaging device according to claim 1, wherein a board surface of the first electrical board covers the electrical wiring from a first direction in which the second connector is connected to the first connector.

3. 3. The imaging device according to claim 2, wherein the first direction is substantially parallel to a surface of the second electric board.

4. The imaging device according to claim 3 , wherein the one side of the cutout portion is substantially perpendicular to the first direction.

5. 4. The imaging device according to claim 3, wherein the one side of the notch is inclined at a predetermined angle with respect to a second direction perpendicular to the first direction.

6. An imaging device as described in any one of claims 1 to 5, characterized in that the electrical wiring is in contact with the first electrical board in a non-mounting portion of the board surface of the first electrical board where no electrical components are mounted.

7. An imaging device as described in any one of claims 1 to 5, characterized in that when viewed from a direction perpendicular to the board surface of the first electrical board, the long sides of the first electrical board and the long sides of the second electrical board are not parallel to each other.

8. a first external connection terminal mounted on the first electric board and arranged at a corner where a side surface and an upper surface of a device body of the imaging device intersect; 6. The imaging device according to claim 1, wherein a direction in which a cable is inserted into or removed from said first external connection terminal is perpendicular to said side surface.

9. Electrical wiring that electrically connects the plurality of electrical boards; Cooling fans and a duct through which air flows when the cooling fan is driven; a wiring restricting portion that holds the electrical wiring relative to the duct, The imaging device according to claim 1 , wherein the electrical wiring is arranged so as to crawl through the duct by the wiring restrictor.

10. the duct has a curved portion; 10. The imaging device according to claim 9, wherein the electrical wiring is arranged so as to run along the curved surface of the curved portion.

11. 11. The imaging device according to claim 9, wherein the electrical wiring is arranged in a path substantially parallel to the air flow inside the duct.

12. two electrical boards electrically connected by a board-to-board connector; a heat conductive member that thermally connects one of the two electric boards to the duct, the one electric board is disposed between the other electric board of the two electric boards and the duct; an elastic member is disposed on the one board on the opposite side of the board-to-board connector; 10. The imaging device according to claim 9, wherein a portion of the heat conducting member is sandwiched between the elastic member and the duct.

13. 13. The imaging device according to claim 12, wherein the other substrate has an imaging element mounted thereon.

14. The elastic member is arranged in two parts with a predetermined gap between them, 14. The imaging device according to claim 12, wherein the gap is used as a routing path for some of the electrical wiring provided inside the imaging device.

15. a gripping portion for a user to grip the imaging device; a step portion that does not overlap with the grip portion when viewed from behind the imaging device and that protrudes further rearward than the grip portion of the imaging device; a display unit disposed on a top surface of the step portion; a second external connection terminal disposed on the step portion behind the rear surface of the grip portion and in front of the display unit, 2. The imaging device according to claim 1, wherein the insertion port of the second external connection terminal faces the grip portion.

16. 16. The imaging device according to claim 15, wherein an operation unit is provided on the rear surface of the grip portion, and the second external connection terminal does not overlap with the operation unit when viewed from behind the imaging device.

17. 17. The imaging device according to claim 15, wherein the socket for the second external connection terminal faces upward of the grip portion at a predetermined angle with respect to the horizontal plane when the imaging device is in a normal position.

18. an accessory mounting portion provided on an upper surface of the imaging device; 17. The imaging device according to claim 15, wherein the second external connection terminal does not protrude upward from an upper surface of the accessory mounting portion.

19. 19. The imaging device according to claim 18, wherein a part of a substrate on which the second external connection terminal is mounted overlaps with the accessory mounting portion when viewed from above the imaging device.

20. a first electrical substrate; a second electrical board on which the first connector is mounted; a cable having a second connector connected to the first connector, An electronic device characterized in that, in the vicinity of the second connector connected to the first connector, the board surface of the first electrical board covers the cable from the direction of connecting the second connector to the first connector.

Images