Organic light-emitting element and manufacturing method for the same

Abstract

To provide an organic light-emitting element having an identification unit that enables the pre-cutting position of each organic light-emitting element to be identified after cutting a substrate, when manufacturing multiple organic light-emitting elements from a single substrate.SOLUTION: The organic light-emitting element is configured to form at least one protrusion 5 or recess 7 at the outer edge of an organic compound layer and metal layer 4 when forming the organic compound layers and metal layers 4 on multiple light-emitting regions 2 on a substrate 1 and make it possible to identify the pre-cutting position of each organic light-emitting element after cutting a substrate 1 by varying the number, positions, shapes, etc., of the protrusions 5 or recesses 7 associated with each light-emitting region 2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an organic light-emitting element, a method for producing the same, and a device or apparatus using the organic light-emitting element. [Background technology]

[0002] Organic electroluminescence elements (hereinafter also referred to as "organic EL elements" or "organic light-emitting elements") are light-emitting devices that can be made low power, emit high-luminance light, and are miniaturized, and are used in displays and lighting. Organic EL elements generally have a laminated structure in which multiple layers are stacked on a substrate, such as an organic compound layer including an anode electrode, a hole transport layer, a light-emitting layer, and an electron transport layer, and a cathode electrode. Methods for forming this laminated structure include vacuum deposition onto a substrate using evaporation or sublimation, and film formation methods using inkjet or spin coating in which an organic material is dissolved in a solvent. When forming multiple layers on a substrate, a vacuum deposition method using a deposition mask having openings corresponding to a desired pattern is known as a common manufacturing method. In the vacuum deposition method, in order to form a film of the desired pattern on the substrate, a deposition mask having openings corresponding to the pattern is placed between the substrate and a deposition material source, and film formation is performed to form a film of the deposition material on the substrate, thereby producing an organic light-emitting device. Organic light-emitting elements are usually manufactured by forming a chip on which light-emitting regions of multiple organic EL elements are simultaneously fabricated using a single substrate, and then cutting the chip to obtain individual organic light-emitting elements. In order to specify and identify the positions of the organic EL elements within the substrate after cutting, identification information may be attached to each organic light-emitting element. For example, in Patent Document 1, identification numbers are printed with a laser marker on a plurality of organic light-emitting elements before cutting, so that each organic light-emitting element can be identified. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-171128 Summary of the Invention [Problem to be solved by the invention]

[0004] However, as the number of organic light-emitting elements obtained from one substrate, or the so-called yield, increases due to the increase in the size of silicon wafers used as substrates and the miniaturization of organic light-emitting elements, the method of forming an identification number on each individual organic light-emitting element poses a problem in that it increases the processing load. Another method for attaching identification information is to form an identification number by one-shot exposure using photolithography, but this method has the drawback of requiring exposure equipment and requiring a large capital investment burden, such as the need to prepare additional equipment if a larger number of identifications than the already set number is desired. An object of the present invention is to provide an organic light-emitting element in which identification information can be easily formed on each organic light-emitting element when manufacturing multiple organic light-emitting elements from a single substrate, and which allows the element to be analyzed and identified at its position within the substrate even after it has been separated from the substrate. Another object of the present invention is to realize the formation of identification information without requiring additional manufacturing processes or facilities. Another object of the present invention is to provide an organic light-emitting element on which identification information is formed, which is easier to recognize than letters or symbols, even if the identification information becomes smaller along with the miniaturization of the organic light-emitting element. [Means for solving the problem]

[0005] A first aspect of the present invention is an organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, The organic compound layer and / or the metal layer have an identification portion formed of at least one of a convex portion and a concave portion on the outer edge thereof. A second aspect of the present invention is an organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, The organic compound layer and the metal layer are characterized in that at least two layers made of different materials have an identification part, which is a convex part or a concave part, on the outer edge of each layer. A third aspect of the present invention is a method for producing the organic light-emitting device of the first aspect of the present invention, comprising the steps of: forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, When forming at least one of the organic compound layer and the metal layer by vapor deposition, a vapor deposition mask is used which has at least one of a convex portion and a concave portion in the opening, and the shape of the opening differs for at least one of the light-emitting regions. A fourth aspect of the present invention is a method for producing the organic light-emitting device according to the third aspect of the present invention, comprising the steps of: forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, When forming at least two layers of different film materials from the organic compound layer and the metal layer by vapor deposition, a vapor deposition mask having at least one of a convex portion and a concave portion in an opening portion is used, and the shape of the opening portion differs for at least one of the light-emitting regions. [Effects of the Invention]

[0006] In the present invention, by forming recesses or protrusions on the outer edge of the organic compound layer or metal layer constituting the organic light-emitting element to serve as an identification part, it is possible to easily provide identification information to each organic light-emitting element without burdening the manufacturing process or using special equipment. Furthermore, such identification parts are easier to identify than letters or symbols and can be made smaller, so that more organic light-emitting elements can be obtained from a single substrate. Therefore, according to the present invention, organic light-emitting elements having identification information can be obtained more inexpensively. [Brief explanation of the drawings]

[0007] [Figure 1] 1A and 1B are schematic plan views of an embodiment of an organic light-emitting device of the present invention before chip cutting, in which (a) shows an embodiment in which the identification portion is formed as a convex portion, and (b) shows an embodiment in which the identification portion is formed as a concave portion. [Figure 2] FIG. 2 is a plan view schematically illustrating a deposition mask used in manufacturing the organic light-emitting element of FIG. [Figure 3] FIG. 2 is a cross-sectional view illustrating a configuration of a vapor deposition apparatus. [Figure 4] FIG. 1 is a schematic plan view of a conventional organic light-emitting element before chip cutting. [Figure 5] 1A and 1B are schematic plan views of another embodiment of the organic light-emitting element of the present invention before chip cutting, in which (a) shows the planar shape of the organic compound layer, (b) shows the planar shape of the metal layer, and (c) shows the planar shape after vapor deposition up to the metal layer. [Figure 6] 1A and 1B are schematic plan views of another embodiment of the organic light-emitting element of the present invention before chip cutting, in which (a) shows the state in which an identification number has been assigned, and (b) shows the state in which an organic compound layer and / or a metal layer has been vapor-deposited. [Figure 7] 1A and 1B are schematic plan views of another embodiment of the organic light-emitting element of the present invention before chip cutting, in which (a) shows the state in which an identification number has been assigned, and (b) shows the state in which an organic compound layer and / or a metal layer has been vapor-deposited. [Figure 8] FIG. 1 is a plan view schematically illustrating the basic structure of an organic light-emitting element. [Figure 9] 1A and 1B are planar schematic views of the organic light-emitting element of Example 1 of the present invention, where FIG. 1A shows one element before cutting the chips, and FIG. 1B shows one element after cutting the chips. [Figure 10] FIG. 2 is a schematic plan view of an organic light-emitting element according to Example 2 of the present invention before chip cutting. [Figure 11] FIG. 10 is an enlarged schematic plan view of an identification portion of the organic light-emitting element according to Example 3 of the present invention. [Figure 12] 1A is a schematic cross-sectional view showing an example of a pixel of a display device according to one embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view showing an example of a display device using an organic light-emitting element according to one embodiment of the present invention. [Figure 13] 1 is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention. [Figure 14] 1A is a schematic diagram illustrating an example of an imaging device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of an electronic device according to an embodiment of the present invention. [Figure 15] 1A is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of a foldable display device. [Figure 16] 1A is a schematic diagram showing an example of an illumination device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram showing an example of an automobile having a vehicle lamp according to an embodiment of the present invention. [Figure 17] 1A and 1B are schematic diagrams illustrating an example of a wearable device according to an embodiment of the present invention, each of which has an imaging device; [Figure 18] 1A is a schematic diagram showing an example of an image forming apparatus according to an embodiment of the present invention, FIG. 1B is a schematic diagram showing an example of an exposure light source of an image forming apparatus according to an embodiment of the present invention, and FIG. 1C is a schematic diagram showing an example of an exposure light source of an image forming apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0008] The present invention is an organic light-emitting device having a light-emitting region on a substrate, the light-emitting region including at least one electrode, and an organic compound layer and a metal layer covering the electrode. The organic compound layer and the metal layer each have an identifier portion formed of at least one of a convex portion and a concave portion on the outer edge thereof. In the present invention, the convex portion and the concave portion of the identifier portion are both convex and concave in the direction parallel to the surface of the substrate.

[0009] Furthermore, a plurality of organic light-emitting elements of the present invention are simultaneously fabricated using a single substrate. That is, a plurality of light-emitting regions of the organic light-emitting element are formed, and the substrate is cut into each light-emitting region to obtain individual organic light-emitting elements. Hereinafter, the continuous configuration of a plurality of organic light-emitting elements before cutting is referred to as a chip. Within a chip, the identification parts of the individual organic light-emitting elements are different from one another. Therefore, the identification parts allow the position of the chip before cutting to be identified even after cutting.

[0010] Hereinafter, embodiments will be described with reference to the drawings. Although the following embodiments describe multiple features, not all of these features are necessarily essential to the invention, and multiple features may be combined in any desired manner. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions will be omitted.

[0011] Figure 1 shows a schematic structure of a preferred embodiment of the organic light-emitting device of the present invention before chip cutting. In both Figures 1(a) and 1(b), an organic compound layer and a metal layer (hereinafter referred to as "organic compound layer / metal layer") 4 are formed on a substrate 1 to cover a light-emitting region 2, and in this embodiment, convex portions 5 are provided as identification portions in the organic compound layer / metal layer 4 in Figure 1(a), while in Figure 1(b) concave portions 7 are provided as identification portions. There are no particular limitations on the convex portions 5 and concave portions 7 as long as they can be identified by their presence or absence, number, position, size, shape, or color.

[0012] The dimensions of the convex portions 5 and the concave portions 7 are not limited, but the width, the height of the convex portions 5, and the depth of the concave portions 7 are preferably 10 μm to 1000 μm, and are preferably 50 μm or more in consideration of visibility and the processing accuracy of the convex portions 5 and the concave portions 7 on the deposition mask.

[0013] The shape of the convex portions 5 and the opening shape of the concave portions 7 may be trapezoidal, triangular, polygonal, or rectangular with rounded corners depending on the film formation conditions such as the positional relationship between the substrate, the deposition mask, and the evaporation source, the degree of vacuum during film formation, the film formation rate, and the rotation speed of the substrate, the processing accuracy of the deposition mask, etc., but it is sufficient if they are sufficiently distinguishable. Therefore, the shape of the convex portions 5 and the opening shape of the concave portions 7 are not limited to rectangular.

[0014] In the organic compound layer / metal layer 4 of the chip in Figure 1, the identifier is formed during vapor deposition in at least one of the organic compound layer / metal layer 4. Figure 2 shows a schematic plan view of the vapor deposition mask used to deposit the layer having the identifier. Figure 2(a) shows the mask used to deposit the layer having the identifier in Figure 1(a), and Figure 2(b) shows the mask used to deposit the layer having the identifier in Figure 1(b).

[0015] As shown in Fig. 2, the deposition mask 8 has openings 9 corresponding to the shape of the organic compound layer / metal layer 4 having the identification portion. The openings 9 of the deposition mask 8 in Fig. 2(a) are provided with convex portions 10 corresponding to the convex portions 5 in Fig. 1(a), and the openings 9 of the deposition mask in Fig. 2(b) are provided with concave portions 11 corresponding to the concave portions 7 in Fig. 1(b).

[0016] A known deposition mask 8 is a metal plate with through holes formed by etching. The material can be any of stainless steel, iron, copper, aluminum, silver, titanium, molybdenum, tungsten, invar, silicon, and resin, or a combination of these, but is not limited to these materials. A method using plating instead of etching is also known, but the present invention does not limit the method for manufacturing the mask 8.

[0017] At least one of the organic compound layer and metal layer 4 is formed by vacuum deposition. The deposition source may be a point source, in which the substrate on which the film is to be formed is rotated while the film is formed, or a linear source, in which the crucible and the substrate are moved relative to each other while the film is formed.

[0018] Figure 3 shows a schematic diagram of an evaporation system in which the evaporation source is a point source and rotates the substrate. Figure 3 is a vertical cross-sectional view. The deposition chamber 13, where evaporation takes place, is connected to an exhaust pipe 14 evacuated by an exhaust pump such as a cryopump or dry pump, and is evacuated to a vacuum. The deposition chamber 13 contains an evaporation source 15 containing the organic or metallic material to be deposited, and a substrate 16 on which the film is to be deposited. Furthermore, an evaporation mask 19 is placed between the evaporation source 15 and the substrate 16. The desired evaporation mask 19 is selected and transported from a mask stock chamber 20, a separate chamber connected to the deposition chamber 13, into the deposition chamber 13 without breaking the vacuum, and placed near the substrate 16. It is common to prepare multiple evaporation masks 19 and use them according to the pattern and material to be deposited.

[0019] The evaporation source 15 is heated by a nearby heater 21, and the evaporation material is emitted radially from a nozzle 22 of the evaporation source 15. The emitted material passes through openings 23 in the evaporation mask and reaches the substrate 16, where it becomes an evaporated layer 24. The substrate 16 is held by a substrate holder 17, and a film is formed by evaporation while the substrate is rotated by a substrate rotation shaft 18. Here, by forming the convex portion 10 shown in FIG. 2(a) or the concave portion 11 shown in FIG. 2(b) in the opening shape of the opening 23 of the deposition mask 19, it is possible to form the desired convex portion or concave portion on the outer edge of the deposition layer 24 on the substrate 16.

[0020] 3 shows one evaporation source and one film formation chamber, multiple evaporation sources may be arranged in the film formation chamber, and evaporation may be performed using a single or multiple evaporation sources. Therefore, when the organic compound layer is a multilayer film, multiple film formation chambers may be arranged, and a multilayer film may be formed using a different film formation chamber for each layer.

[0021] In the present invention, by providing different protrusions and recesses in the organic compound layer and metal layer for each organic light-emitting element within a single substrate, in terms of their presence, number, position, size, shape, and color, the position of the organic light-emitting element within the chip before cutting can be identified.

[0022] The method of forming identification information on organic light-emitting elements by vacuum deposition using a deposition mask, as in the present invention, can be performed simultaneously with film formation by deposition and can be performed simultaneously on all organic light-emitting elements on a substrate, unlike the method disclosed in Patent Document 1, which requires a step of forming identification information on each organic light-emitting element using a laser marker or the like. Furthermore, even if the number of organic light-emitting elements to be cut from one substrate increases, this can be easily accommodated by simply changing the opening specifications of the deposition mask, and identification information can be formed without adding steps in the film formation process or additional equipment.

[0023] Figure 4 shows a schematic plan view of a chip in which an identification number is assigned to the organic compound layer and metal layer for each organic light-emitting element by a conventional method. In Figure 4, 27 denotes the identification number. When miniaturizing such an identification number 27, it becomes difficult to process numbers or letters into the vapor deposition mask used to form the identification number 27 and to identify it. However, the identification information in the embodiment of the present invention has simple shapes such as convex and concave portions, which make it easier to process than numbers or letters and easier to identify than letters or symbols even when miniaturized.

[0024] 5 is a plan view showing another embodiment of the organic light-emitting device of the present invention before cutting into chips. This embodiment is an example in which convex portions are formed on both the organic compound layer and the metal layer. FIG. 5(a) is a schematic plan view of an organic compound layer 28 on a substrate 1. The organic compound layer 28 has protrusions 29 formed on its outer edge, forming three types of patterns depending on the location and number of the protrusions 29. FIG. 5(b) is a schematic plan view of a metal layer 30. The metal layer 30 has protrusions 31 formed on its outer edge, forming two types of patterns depending on the location and number of the protrusions 31. FIG. 5(c) is a schematic plan view showing the metal layer 30 of FIG. 5(b) stacked on top of the organic compound layer 28 of FIG. 5(a). The organic compound layer 28 has protrusions 29 on the lower side of the light-emitting region 2 in the figure, and the metal layer 30 has protrusions 31 on the upper side of the light-emitting region 2. By combining the patterns of the protrusions 29 of the organic compound layer 28 and the protrusions 31 of the metal layer 30, a total of six types of protrusion patterns can be obtained as identification features. Since the organic compound layer 28 and the metal layer 30 are different in color, the protrusions 29 and the protrusions 31 can be visually distinguished from each other.

[0025] FIG. 5 shows an example in which the convex portions 29 of the organic compound layer 28 and the convex portions 31 of the metal layer 30 are formed in different locations. However, when an optically transparent, translucent metal layer 30 is laminated on the organic compound layer 28, the organic compound layer 28 and the metal layer 30 are formed as films of different colors. Therefore, the organic compound layer 28 and the metal layer 30 can be distinguished even if an identification portion is formed by overlapping them in the same location.

[0026] Furthermore, the organic compound layer 28 is usually formed by laminating multiple layers made of different materials, and the protrusions 29 may be formed on the entire surface or on only some of the layers. Alternatively, the protrusions 31 may not be formed on the metal layer 30, but two or more layers made of different film materials may be selected in the organic compound layer 28, and protrusions of different patterns may be formed on each of them, thereby forming an identification part as shown in Figure 5(c).

[0027] 6 and 7 are schematic plan views of another embodiment of the organic light-emitting device of the present invention, showing an organic compound layer and metal layer 4 having a protrusion 5 formed on a substrate 1 previously given an identification number 27, before cutting into chips. Figs. 6(a) and 7(a) show the state before the organic compound layer and metal layer 4 are formed, and Figs. 6(b) and 7(b) show the state after the film formation.

[0028] Figure 6 shows an example in which three types of identification numbers 27 are pre-applied to the substrate 1, and two types of protrusions 5 (one or two) are formed on the organic compound layer / metal layer 4, forming six types of identification parts. The identification numbers 27 are typically applied to the substrate 1 by engraving them with a laser marker, and the number of identification numbers 27 that can be formed is limited by the number of elements to be manufactured from a single substrate and the equipment specifications. If more identification numbers than the upper limit are formed, the same identification number will be repeated, resulting in multiple occurrences of the same identification number. Therefore, when the organic light-emitting elements are separated from the substrate, chips with the same identification number will be indistinguishable. Furthermore, increasing the number of identification numbers requires the introduction of a new laser marker for engraving the identification numbers and peripheral equipment, or changes to the specifications.

[0029] 7 shows an example in which three types of identification numbers 27 are assigned to the substrate 1 in advance, and one or two protrusions 5 on the organic compound layer / metal layer 4 are arranged in different positions to form six types of identification parts. In the example of FIG. 7, by using the identification numbers "1," "2," and "3" on the substrate 1 as position information for the protrusions 5, the positional accuracy for identifying the protrusions 5 is improved, and misidentification of the identification parts is prevented. 6 and 7, the convex portions 5 of the organic compound layer / metal layer 4 can be combined without interfering with the identification number 27 formed on the substrate 1. Alternatively, a concave portion may be provided in the organic compound layer / metal layer 4 to be combined with the identification number 27.

[0030] The opening of the deposition mask for forming the film formation region of the organic compound layer / metal layer 4 is made wider than the light-emitting region 2 in the substrate, and it is preferable to select the location of the convex portion 5 or concave portion to be formed on the outer edge of the opening so that it does not affect the device characteristics.

[0031] In an organic light-emitting device, at least one electrode (anode or cathode) is provided in the light-emitting region on a substrate, and an organic compound layer and a metal layer are formed to cover the electrode. The electrode is connected to a wiring substrate to supply power, causing the organic compound layer to emit light and extracting light. The metal layer is preferably used as a counter electrode (cathode or anode) to the electrode.

[0032] Fig. 8 shows a schematic plan view of an example of the configuration of a typical organic light-emitting element. In Fig. 8, an anode electrode 36, an organic compound layer 28 serving as a light-emitting body, and a cathode electrode 39 serving as a metal layer are stacked in this order from the substrate 1 side. The organic compound layer 28 is sandwiched between the anode electrode 36 and the cathode electrode 39. An insulating layer (not shown) is disposed on the outer edge of the organic compound layer 28, and the anode electrode 36 and the cathode electrode 39 are electrically insulated from each other and each receives power from a wiring board external to the element.

[0033] Organic light-emitting elements often have contact areas to facilitate connection between the electrodes and a wiring board outside the element. An example of a cathode contact, which is the contact area of ​​the cathode electrode, will be explained using Figure 8.

[0034] The cathode electrode 39 must be extended to a recess 37 to receive power from an external wiring board. In the configuration example shown in FIG. 8 , a recess 37 is provided on a portion of the outer edge of the anode electrode 36, and a protrusion 40 of the cathode electrode 39, provided as an identification feature in the recess 37, doubles as the extension of the cathode electrode 39. In the configuration example shown in FIG. 8 , only one cathode contact region is provided on the outer edge of the anode electrode 36. However, depending on the chip shape and performance, multiple or wider cathode contact regions may be provided to provide sufficient power to the organic light-emitting element or to ensure uniform current flow within the organic compound layer (light-emitting layer). Since the protrusions and recesses formed in the organic compound layer and metal layer according to the present invention are located on the outer edge of the film formation region, it is preferable to set the regions so as not to impair the cathode contact function.

[0035] As shown in the configuration example in Figure 8, if the cathode contact region has already been designed, the convex portion can be easily positioned by utilizing that region without having to newly design a location for the convex portion. Therefore, in existing organic light-emitting devices that cannot be identified after chip cutting, by changing the mask used to form the organic compound layer and metal layer, it is possible to easily provide an identification portion to each organic light-emitting device, making it possible to track the device during analysis.

[0036] In the above embodiment, the positions of the convex portions and concave portions formed in the organic compound layer and the metal layer are provided on one or two sides of the light-emitting region, but the number of sides and the number of locations where the convex portions and concave portions are provided are not limited. Furthermore, when vapor deposition is performed by placing the substrate and the vapor deposition mask close to each other, protrusions (ribs) may be provided on some of the bars of the vapor deposition mask to make contact with and support the substrate. However, since film cannot be formed on the contact areas between the substrate and the vapor deposition mask, it is preferable to avoid these areas from being areas where recesses or protrusions are to be formed.

[0037] <Configuration of organic light-emitting element> Other configurations of the organic light-emitting device of the present invention will be described below. An organic light-emitting device is usually provided by forming an insulating layer, a first electrode (anode electrode 36 in FIG. 8), an organic compound layer (organic compound layer 28 in FIG. 8), and a second electrode (cathode electrode 39 in FIG. 8) on a substrate (substrate 1 in FIG. 8). The organic compound layer has at least a light-emitting layer. A protective layer, a color filter, a microlens, etc. may be provided on the second electrode. When a color filter is provided, a planarizing layer may be provided between the protective layer. The planarizing layer can be made of acrylic resin or the like. The same applies when a planarizing layer is provided between the color filter and the microlens. Preferred configurations of the organic light-emitting element of the present invention and the device having the organic light-emitting element will be described below.

[0038] [substrate] Examples of the substrate include quartz, glass, silicon wafer, resin, and metal. Furthermore, the substrate may be provided with switching elements such as transistors and wiring, and an insulating layer thereon. Any material can be used for the insulating layer, as long as it allows for the formation of contact holes so that wiring can be formed between the first electrode and the insulating layer, and ensures insulation from unconnected wiring. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0039] [electrode] An organic light-emitting element has a pair of electrodes, and when an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode electrode, and the other is the cathode electrode. Alternatively, the electrode that supplies holes to the light-emitting layer can be called the anode electrode, and the electrode that supplies electrons can be called the cathode electrode. In the present invention, either the anode electrode or the cathode electrode can be used as the first electrode (substrate side).

[0040] The anode electrode is preferably made of a material with as high a work function as possible. Examples include simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, mixtures containing these metals, alloys of these metals, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO). Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used. These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0041] When the anode electrode is used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. When used as a transparent electrode, transparent conductive oxide layers such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO) can be used, but are not limited to these. Photolithography can be used to form the electrode.

[0042] On the other hand, materials with a low work function are preferred for the cathode electrode. Examples include alkali metals such as lithium, alkaline earth metals such as calcium, and metals such as aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these metals can be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials can be used alone or in combination. The cathode electrode can have either a single-layer or multi-layer structure. Among these, silver is preferred, and a silver alloy is even more preferred to reduce silver aggregation. The alloy ratio is not critical as long as silver aggregation can be reduced. For example, the silver:other metal ratio can be 1:1, 3:1, or the like.

[0043] The cathode electrode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode electrode is not particularly limited, but DC and AC sputtering methods are preferred because they provide good film coverage and make it easier to reduce resistance.

[0044] In particular, in the present invention, a thin film of conductive metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO), or a metal (including alloys) such as silver, platinum, or aluminum, with the thickness controlled to be semitransparent, is preferred for the anode electrode 36 in Fig. 6, and an alkali metal such as lithium, an alkaline earth metal such as calcium, or a metal (including alloys) such as silver or aluminum is preferably used for the cathode electrode 39 in Fig. 6. The film thickness of the electrode is not limited by the presence or absence of protrusions or recesses in the organic compound layer or metal layer, and may be any thickness that allows the device to fully exhibit its functions.

[0045] [Organic compound layer] The organic compound layer is composed of, for example, a hole transport layer / light emitting layer / electron transport layer, but it can also be a multilayer film incorporating multiple functional layers such as a hole injection layer or electron injection layer to make it easier to supply holes and electrons to the light emitting layer, a hole blocking layer or electron blocking layer to prevent excessive movement of holes and electrons, and a buffer layer to adjust the movement of holes and electrons from the electrode, or a single layer film. When the organic light-emitting element according to the present invention has a plurality of electrodes on a substrate, the organic compound layer is formed on the plurality of electrodes as a common layer, which means that the layer is disposed across the plurality of organic light-emitting elements.

[0046] The organic compound layer can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.). Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining with an appropriate binder resin.

[0047] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin. These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, if necessary.

[0048] [Protective layer] A protective layer may be provided on the second electrode. For example, by adhering glass with a moisture absorbent on the second electrode, the infiltration of water and other substances into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the second electrode to reduce the infiltration of water and other substances into the organic compound layer. For example, after forming the second electrode, the second electrode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride film may be formed by CVD to serve as a protective layer. A protective layer may be provided using atomic layer deposition (ALD) after the CVD film formation. The material of the film formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed on the film formed by ALD by CVD. The film formed by ALD may have a thickness smaller than that of the film formed by CVD. Specifically, it may be 50% or less, or even 10% or less.

[0049] [Color Filter] A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on a separate substrate and then bonded to the substrate on which the organic light-emitting element is provided, or a color filter may be patterned on the protective layer described above using photolithography technology. The color filter may be made of a polymer.

[0050] [Planarization layer] A planarization layer may be provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the underlying layer. It may also be called a material resin layer without limiting its purpose. The planarization layer may be composed of an organic compound, and may be either a low molecular weight or a high molecular weight, but a high molecular weight is preferred. The planarizing layer may be provided above or below the color filter, and may be made of the same or different materials, such as polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0051] [Microlens] An organic light-emitting element or an organic light-emitting device having the organic light-emitting element may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting element or organic light-emitting device or to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens. It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0052] [Counter substrate] An opposing substrate may be provided on the planarization layer. The opposing substrate is called the opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The constituent material of the opposing substrate may be the same as that of the aforementioned substrate (the substrate on the first electrode side). When the aforementioned substrate is the first substrate, the opposing substrate may be the second substrate.

[0053] [Pixel circuit] An organic light-emitting device having an organic light-emitting element may have a pixel circuit connected to the organic light-emitting element. The pixel circuit may be an active matrix type that controls the emission of a plurality of light-emitting elements independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0054] The light-emitting device has a display area and a peripheral area arranged around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of a transistor constituting the pixel circuit may be smaller than the mobility of a transistor constituting the display control circuit. The slope of the current-voltage characteristics of the transistor constituting the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistor constituting the display control circuit. The slope of the current-voltage characteristics can be measured by the so-called Vg-Ig characteristics. The transistor constituting the pixel circuit is a transistor connected to a light-emitting element, such as a first light-emitting element.

[0055] [Pixels] An organic light-emitting device having an organic light-emitting element may have a plurality of pixels, each of which has sub-pixels that emit different colors, and each of which may emit, for example, RGB colors.

[0056] A pixel has an area, also called a pixel aperture, from which light is emitted. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc. The distance between subpixels may be 10 μm or less, more specifically, it may be 8 μm, 7.4 μm, or 6.4 μm.

[0057] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0058] <Applications of organic light-emitting devices> The organic light-emitting element of the present invention can be used as a component of a display device or a lighting device, and also as an exposure light source for an electrophotographic image forming apparatus, a backlight for a liquid crystal display device, a light-emitting device having a white light source and a color filter, etc.

[0059] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit that processes the input information, and displays the input image on a display unit. The display device may have a plurality of pixels, at least one of which has the organic light-emitting element according to this embodiment and a transistor connected to the organic light-emitting element.

[0060] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0061] Next, the display device according to this embodiment will be described with reference to the drawings. FIG. 12 is a cross-sectional view showing an example of a display device having an organic light-emitting element according to this embodiment and a transistor connected to this organic light-emitting element. FIG. 12(a) shows an example of a pixel, which is a component of the display device according to this embodiment. The pixel includes subpixels 120. The subpixels are divided into 120R, 120G, and 120B based on their light emission. The emitted colors may be determined by the wavelength of light emitted from the light-emitting layer, or the light emitted from the subpixels may be selectively transmitted or color-converted using a color filter or the like. Each subpixel includes a first electrode 112, which serves as a reflective electrode, on an interlayer insulating layer 111; an insulating layer 113 covering the edges of the first electrode 112; an organic compound layer 114 covering the first electrode 112 and the insulating layer 113; a second electrode 115; a protective layer 116; and a color filter 117. The first electrode 112, the organic compound layer 114, and the second electrode 115 constitute an organic light-emitting element 118 according to this embodiment.

[0062] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 111. The transistor and the first electrode 112 may be electrically connected via a contact hole or the like (not shown). The insulating layer 113 is also called a bank or a pixel separation film. It covers the edges of the first electrodes 112 and is disposed to surround the first electrodes 112. The portions where the insulating layer 113 is not disposed are in contact with the organic compound layer 114 and become light-emitting regions.

[0063] The protective layer 116 reduces the penetration of moisture into the organic compound layer 114. Although the protective layer 116 is illustrated as being a single layer, it may be a multi-layer structure, with each layer being an inorganic compound layer and each layer being an organic compound layer.

[0064] The color filters 117 are divided into 117R, 117G, and 117B depending on their colors. The color filters may be formed on a planarization film (not shown). A resin protective layer (not shown) may be provided on the color filters. The color filters 117 may be formed on a protective layer 116. Alternatively, the color filters 117 may be provided on an opposing substrate such as a glass substrate and then bonded thereto.

[0065] 12(b) has an organic light-emitting element 136 and a TFT 128 as an example of a transistor. Specifically, a substrate 121 made of glass, silicon, or the like is provided with an insulating layer 122 on top of it, and a TFT 128 having a gate electrode 123, a gate insulating film 124, a semiconductor layer 125, a drain electrode 126, and a source electrode 127 is disposed on the insulating layer 122. An insulating film 129 is provided on top of the TFT 128, and an anode 131 and source electrode 127 that constitute the organic light-emitting element 136 are connected via a contact hole 130 provided in the insulating film 129.

[0066] The electrical connection between the electrodes (anode 131, cathode 133) included in the organic light-emitting element 136 and the electrodes (source electrode 127, drain electrode 126) included in the TFT 128 is not limited to the mode shown in Fig. 12(b). In other words, it is sufficient that either the anode 131 or the cathode 133 is electrically connected to either the source electrode 127 or the drain electrode 126. The TFT 128 refers to a thin film transistor. On the cathode 133, a first protective layer 134 and a second protective layer 135 are provided to reduce deterioration of the organic light-emitting element.

[0067] The organic light emitting element 136 according to this embodiment has its light emission brightness controlled by the TFT 128, and by providing a plurality of organic light emitting elements 136 on a surface, an image can be displayed with the respective light emission brightnesses. In the display device of FIG. 12(b), transistors are used as switching elements, but other switching elements may be used instead. 12(b) is not limited to a TFT having an active layer on an insulating surface of a substrate, but may be a transistor using a single-crystal silicon wafer. The active layer may be made of non-single-crystal silicon such as amorphous silicon or microcrystalline silicon, or a non-single-crystal oxide semiconductor such as indium zinc oxide or indium gallium zinc oxide.

[0068] Alternatively, the transistor may be formed from low-temperature polysilicon, or an active matrix driver may be formed on a substrate such as a Si substrate. "On a substrate" can also mean "within the substrate." The choice of whether to provide a transistor within the substrate or to use a TFT is determined by the size of the display unit. For example, for a display size of about 0.5 inches, it is preferable to provide an organic light-emitting element on a Si substrate. Here, "formed within the substrate" means that the substrate itself, such as a Si substrate, is processed to fabricate the transistor. In other words, having a transistor within a substrate can be considered as the substrate and the transistor being integrally formed.

[0069] 13 is a schematic diagram showing an example of a display device according to this embodiment. The display device 1000 has a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected by flexible printed circuits FPCs 1002 and 1004. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0070] The display device according to this embodiment may have color filters having red, green, and blue colors, and the red, green, and blue colors may be arranged in a delta configuration in the color filters.

[0071] The display device according to the present embodiment is used as a display unit of a mobile terminal. In this case, the display device may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0072] The display device according to this embodiment is used in a display unit of an imaging device having an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit located within the viewfinder. The imaging device may be a digital camera or a digital video camera.

[0073] 14(a) is a schematic diagram showing an example of an imaging device according to this embodiment. The imaging device 1100 has a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 has a display device according to this embodiment. In this case, the display device may display not only the captured image but also environmental information, imaging instructions, etc. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, etc.

[0074] Since the optimum timing for capturing an image is very short, it is better to display information as soon as possible. Therefore, it is preferable to use a display device using the organic light-emitting element according to this embodiment. This is because the organic light-emitting element has a fast response speed. A display device using the organic light-emitting element can be used more preferably than a liquid crystal display device, which requires a high display speed.

[0075] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be called a photoelectric conversion device. Instead of sequentially capturing images, the photoelectric conversion device can include an imaging method that detects the difference from the previous image, or a method of cutting out an image from a constantly recorded image, etc.

[0076] FIG. 14(b) is a schematic diagram showing an example of an electronic device according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a laptop computer.

[0077] FIG. 15 is a schematic diagram illustrating an example of a display device according to this embodiment. FIG. 15(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 includes a frame 1301 and a display unit 1302. The display unit 1302 uses the light-emitting device according to this embodiment. The display device 1300 includes the frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 15(a). The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0078] FIG. 15(b) is a schematic diagram illustrating another example of a display device according to this embodiment. The display device 1310 in FIG. 15(b) is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 have a light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single, seamless display unit. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may display a single image.

[0079] FIG. 16(a) is a schematic diagram illustrating an example of a lighting device according to this embodiment. The lighting device 1400 includes a housing 1401, a light source 1402, a circuit board 1403, an optical filter 1404, and a light diffusion unit 1405. The light source 1402 includes an organic light-emitting element according to this embodiment. The optical filter 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source 1402, such as for illumination, and deliver the light over a wide area. The optical filter 1404 and the light diffusion unit 1405 may be provided on the light output side of the lighting. If necessary, a cover may be provided on the outermost surface.

[0080] The lighting device is, for example, a device that illuminates a room. The lighting device may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit that dims these colors. The lighting device has the organic light-emitting element according to this embodiment and a power supply circuit connected to it. The power supply circuit is a circuit that converts AC voltage into DC voltage. Furthermore, white has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device may have a color filter. The lighting device according to this embodiment may also include a heat dissipation unit, which dissipates heat from within the device to the outside, and may be made of a material such as metal or liquid silicone with a high specific heat.

[0081] 16(b) is a schematic diagram of an automobile, which is an example of a moving body according to this embodiment. The automobile has tail lamps, which are an example of lighting fixtures. The automobile 1500 may have tail lamps 1501, and may be configured to turn on the tail lamps when braking or the like is performed. The tail lamp 1501 includes an organic light-emitting element according to this embodiment. The tail lamp 1501 may include a protective member for protecting the organic light-emitting element. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but it is preferable that the protective member be made of polycarbonate or the like. Polycarbonate may be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0082] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window 1502 may be a transparent display as long as it is not a window for checking the front and rear of the automobile. The transparent display may have the organic light-emitting element according to this embodiment. In this case, the constituent materials of the electrodes and the like of the organic light-emitting element are made of transparent materials. The moving body according to this embodiment may be a ship, an aircraft, a drone, or the like. The moving body has a body and a lighting device provided on the body. The lighting device emits light to indicate the position of the body. The lighting device has the organic light-emitting element according to this embodiment.

[0083] An application example of the display device of each of the above-described embodiments will be described with reference to Fig. 17. The display device can be applied to a system that can be attached as a wearable device, such as smart glasses, an HMD, or a smart contact lens. An image capturing and displaying device used in such an application example includes an image capturing device capable of photoelectrically converting visible light and a displaying device capable of emitting visible light.

[0084] 17(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. Furthermore, a display device according to any of the above-described embodiments is provided on the back side of the lens 1601.

[0085] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0086] FIG. 17(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 in FIG. 17(a) and a display device. A lens 1611 includes an optical system for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the display device and controls the operation of the imaging device and the display device. The control device 1612 may also include a gaze detection unit for detecting the wearer's gaze. Infrared light may be used for gaze detection. The infrared light emitter emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit with a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. A reduction unit for reducing light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality.

[0087] The user's line of sight with respect to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using an image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used. More specifically, gaze detection processing is performed based on the pupil-corneal reflex method. Using the pupil-corneal reflex method, a gaze vector representing the direction (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image contained in the image of the eyeball, thereby detecting the user's gaze.

[0088] The display device according to this embodiment may include an imaging device having a light receiving element, and may control the display image of the display device based on user line-of-sight information from the imaging device. Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0089] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0090] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI ​​program may be included in the display device, the imaging device, or an external device. If included in an external device, it is transmitted to the display device via communication. When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0091] FIG. 18(a) is a schematic diagram showing an example of an image forming apparatus according to one embodiment of the present invention. The image forming apparatus 1700 is an electrophotographic image forming apparatus and includes a photoconductor 1707, an exposure light source 1708, a charging unit 1710, a developing unit 1711, a transfer unit 1712, transport rollers 1713, and a fixing unit 1715. Light 1709 is irradiated from the exposure light source 1708, and an electrostatic latent image is formed on the surface of the photoconductor 1707. The exposure light source 1708 includes an organic light-emitting element according to this embodiment. The developing unit 1711 includes toner and the like. The charging unit 1710 charges the photoconductor 1707. The transfer unit 1712 transfers the developed image to a recording medium 1714. The transport rollers 1713 transport the recording medium 1714. The recording medium 1714 is, for example, paper. The fixing unit 1715 fixes the image formed on the recording medium 1714.

[0092] 18(b) and 18(c) are diagrams showing an exposure light source 1708 and are schematic diagrams illustrating a state in which multiple light-emitting units 1726 are arranged on a long substrate. Arrow 1727 indicates the direction parallel to the axis of the photoconductor, representing the column direction in which the organic light-emitting elements are arranged. This column direction is the same as the axis direction about which the photoconductor 1707 rotates. This direction can also be referred to as the long axis direction of the photoconductor 1707. FIG. 18(b) shows a configuration in which the light-emitting units 1726 are arranged along the long axis direction of the photoconductor 1707. The light-emitting units 1726 include organic light-emitting elements according to this embodiment. FIG. 18(c) shows a configuration different from FIG. 18(b), in which the light-emitting units 1726 are alternately arranged in the column direction in the first and second columns. The first and second columns are arranged at different positions in the row direction. In the first column, multiple light-emitting units 1726 are arranged at intervals. The second column has light emitting units 1726 at positions corresponding to the spacing between the light emitting units 1726 in the first column. That is, the light emitting units 1726 are also arranged at intervals in the row direction. The arrangement in Figure 18(c) can also be described as, for example, a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0093] As described above, by using a device using the organic light-emitting element according to this embodiment, it is possible to provide a stable display with good image quality even over a long period of time.

[0094] [Included components] The disclosure of this embodiment includes the following configuration. (Configuration 1) An organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region having at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, The organic light-emitting element has an identification portion, which is at least one of a convex portion and a concave portion, on the outer edge of at least one of the organic compound layer and the metal layer. (Configuration 2) The organic light-emitting element according to configuration 1, characterized in that the identification portion has two or more different forms depending on at least one element or a combination of multiple elements selected from the elements of the presence or absence, number, position, size, shape, and color of at least one of the convex portion and the concave portion. (Configuration 3) The organic light-emitting element according to configuration 1 or 2, wherein a plurality of organic light-emitting elements formed on a single substrate are separated by cutting the substrate, and the position of each element on the substrate is identified by the identification portion. (Configuration 4) 4. The organic light-emitting device according to any one of configurations 1 to 3, wherein the metal layer is an electrode.

[0095] (Configuration 5) An organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region having at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, An organic light-emitting element characterized in that at least two of the organic compound layer and the metal layer, which are made of different film materials, have an identification part consisting of at least one of a convex part and a concave part on the outer edge of each of them.

[0096] (Configuration 6) A method for producing an organic light-emitting element according to any one of configurations 1 to 4, comprising: forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, a deposition mask having at least one of a convex portion and a concave portion at an opening, the shape of the opening being different for at least one of the light-emitting regions, when forming at least one of the organic compound layer and the metal layer by vapor deposition;

[0097] (Configuration 7) A method for producing an organic light-emitting device according to configuration 5, comprising: forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, a deposition mask having at least one of a convex portion and a concave portion at an opening, the shape of the opening being different for at least one of the light-emitting regions, when forming at least two layers from different film materials from the organic compound layer and the metal layer by vapor deposition, the deposition mask being used;

[0098] (Configuration 8) 6. A display device comprising: a display unit having the organic light-emitting element according to any one of configurations 1 to 5; and a housing in which the display unit is provided. (Configuration 9) an imaging element that receives light; and a display unit that displays an image captured by the imaging element; The photoelectric conversion device, wherein the display section comprises the organic light-emitting element according to any one of the first to fifth aspects. (Configuration 10) 6. An electronic device comprising: a display unit having the organic light-emitting element according to any one of configurations 1 to 5; a housing in which the display unit is provided; and a communication unit provided in the housing and communicating with an external device. (Configuration 11) A wearable device comprising: a display unit having the organic light-emitting element according to any one of configurations 1 to 5; an optical system that collects light from the display unit; and a control device that controls the display of the display unit. (Configuration 12) 6. A lighting device comprising: a light source having the organic light-emitting element according to any one of configurations 1 to 5; and a housing in which the light source is provided. (Configuration 13) A moving body comprising: a lighting fixture having the organic light-emitting element according to any one of configurations 1 to 5; and a vehicle on which the lighting fixture is provided. (Configuration 14) 6. An image forming apparatus comprising: a photosensitive member; and an exposure light source for exposing the photosensitive member, wherein the exposure light source comprises the organic light-emitting element according to any one of configurations 1 to 5. [Example]

[0099] Examples are shown below. However, the present invention is not limited to these. Unless otherwise specified, the terms used in this embodiment are the same as those used in the embodiment, and redundant explanations will be omitted.

[0100] Example 1 27 organic light-emitting element chips were fabricated using the vapor deposition device shown in Figure 3. A schematic plan view is shown in Figure 9. Figure 9(a) is an overall view, and Figure 9(b) is an enlarged view of the organic light-emitting element at the top left of Figure 9(a).

[0101] In this example, an anode electrode 36 was formed to cover the light-emitting region 2 of the substrate 1, an organic compound layer was formed in the light-emitting region 2 on the anode electrode 36, and a cathode electrode (metal layer) 39 was formed to cover the organic compound layer. The anode electrode 36 was provided with three recesses 37 for recessing the cathode electrode 39, and the positions of the recesses 37 were the same for all 27 organic light-emitting elements within the substrate 1. The cathode electrode 39 had protrusions 40, which also served as extension portions, formed in the recesses 37 of the anode electrode 36, and the combination of the number and positions of the protrusions 40 was different for each of the 27 organic light-emitting elements within the substrate 1.

[0102] Specifically, in three recesses 37, one on the left side of the paper in Figure 9(a), one on the right side, and one on the bottom, there are one or two protrusions 40, and one of them is located in two places, resulting in 3 x 3 x 3 = 27 combinations.

[0103] In this example, a 50 nm thick aluminum (Al) film was formed as the anode electrode 36 on a 725 μm thick silicon wafer as the substrate 1. The width of the recess 37 in the anode electrode 36 was 500 μm and the depth was 100 μm. After the anode electrode 36 was formed, a 120 nm thick organic compound layer 28 including a hole transport layer, a light-emitting layer, and an electron transport layer was formed. After the organic compound layer 28 was formed, a 20 nm thick magnesium-silver film was formed as the cathode electrode 39. The width of the protrusion 40 of the cathode electrode 39 was 100 μm, and the tip side of the protrusion 40 was formed so as to protrude 100 μm into the recess 37.

[0104] Example 2 Using the vapor deposition apparatus shown in Fig. 3, 27 organic light-emitting element chips were fabricated on the substrate 1 in the same manner as in Example 1. A plan view is shown in Fig. 10. In this example, the widths of the protrusions 40 were set to three types: 100 µm, 200 µm, and 300 µm, resulting in 3 x 3 x 3 = 27 combinations.

[0105] Example 3 In Examples 1 and 2, protrusions were formed on a metal layer to form an identification section. However, in this example, protrusions were formed on both an organic compound layer and a metal layer, and the two layers were combined to form the identification section. Specifically, a nitrogen-containing heterocyclic derivative serving as an electron transport layer was laminated to a thickness of 10 nm as the organic compound layer, and a cathode electrode was laminated to a thickness of 20 nm. The deposition apparatus shown in FIG. 3, which is the same as in Examples 1 and 2, was used to form the organic compound layer and the cathode electrode, and deposition masks were prepared for each of the organic compound layer and the metal layer. The shapes of the substrate 1, the light-emitting region, the anode electrode 36, and the recess 37 were the same as in Examples 1 and 2. The combination method is shown in FIG. 11.

[0106] As shown in FIG. 11 , in this example, three types of identifiers were formed in two locations in the recess 37 of the anode electrode: a convex portion 29 of the organic compound layer alone, a convex portion 40 of the cathode electrode alone, and a stacked convex portion 41 of the convex portions 29 and 40. A total of eight types of identifiers were obtained by forming these three types of identifiers. The convex portions 29 and 40 have approximately the same shape. The organic compound layer and the metal layer have different colors, allowing them to be distinguished even when they are the same size. Furthermore, when a metal layer is layered on an organic compound layer, the metal layer is translucent with a thickness of 20 nm, and therefore overlaps with the color of the underlying organic compound layer, resulting in a color different from both the organic compound layer and the metal layer, making them distinguishable. Since the convex portion 40 of the cathode electrode also serves as the lead-out portion of the cathode electrode, at least one of the convex portions 40 and 41 is formed in each of (a) to (h).

[0107] By providing three recesses 37 in the anode electrode 36 within the organic light-emitting element, it becomes possible to identify 8 × 8 × 8 = 512 organic light-emitting elements. That is, compared to 27 in Examples 1 and 2, it becomes possible to dramatically increase the number of identifiable organic light-emitting elements. [Explanation of symbols]

[0108] 1: substrate, 2: light-emitting region, 4: organic compound layer and metal layer, 5: convex portion, 7: concave portion, 8: deposition mask, 9: opening, 10: convex portion of mask opening, 11: concave portion of mask opening, 27: identification number, 28: organic compound layer, 29: convex portion of organic compound layer, 30: metal layer, 31: convex portion of metal layer

Claims

1. An organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region having at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, The organic light-emitting element has an identification portion, which is at least one of a convex portion and a concave portion, on the outer edge of at least one of the organic compound layer and the metal layer.

2. 2. The organic light-emitting element according to claim 1, wherein the identification portion has two or more different forms depending on at least one element or a combination of a plurality of elements selected from the presence or absence, number, position, size, shape, and color of at least one of the convex portion and the concave portion.

3. The organic light-emitting element according to claim 1, wherein the organic light-emitting element is formed by cutting a plurality of organic light-emitting elements formed on a single substrate and separating the organic light-emitting elements from the substrate, and the identification portion identifies the position of the organic light-emitting element on the substrate.

4. The organic light-emitting element according to claim 1 , wherein the metal layer is an electrode.

5. An organic light-emitting device having a light-emitting region on a part of a substrate, the light-emitting region having at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer, An organic light-emitting element, characterized in that at least two of the organic compound layer and the metal layer, which are made of different film materials, have an identification part consisting of at least one of a convex part and a concave part on the outer edge of each of them.

6. A method for producing the organic light-emitting device according to any one of claims 1 to 4, comprising the steps of: forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, a deposition mask having at least one of a convex portion and a concave portion at an opening, the shape of the opening being different for at least one of the light-emitting regions, when forming at least one of the organic compound layer and the metal layer by vapor deposition;

7. The method for manufacturing an organic light-emitting element according to claim 5, forming a plurality of light-emitting regions on a substrate, each of the light-emitting regions including at least one electrode, an organic compound layer covering the electrode, and a metal layer covering the organic compound layer; and cutting the substrate into individual light-emitting regions, a deposition mask having at least one of a convex portion and a concave portion at an opening, the shape of the opening being different for at least one of the light-emitting regions, when forming at least two layers from different film materials from the organic compound layer and the metal layer by vapor deposition, the deposition mask being used;

8. A display device comprising: a display unit having the organic light-emitting element according to claim 1; and a housing in which the display unit is provided.

9. an imaging element that receives light; and a display unit that displays an image captured by the imaging element; The photoelectric conversion device, wherein the display section comprises the organic light-emitting element according to claim 1 .

10. 6. An electronic device comprising: a display unit having the organic light-emitting element according to claim 1; a housing in which the display unit is provided; and a communication unit provided in the housing and communicating with an external device.

11. A wearable device comprising: a display unit having the organic light-emitting element according to claim 1; an optical system for concentrating light from the display unit; and a control device for controlling the display of the display unit.

12. A lighting device comprising: a light source having the organic light-emitting element according to claim 1 ; and a housing in which the light source is provided.

13. A moving body comprising: a lamp having the organic light-emitting element according to claim 1; and a vehicle on which the lamp is provided.

14. An image forming apparatus comprising: a photosensitive member; and an exposure light source for exposing said photosensitive member, said exposure light source comprising the organic light-emitting element according to claim 1 .

Images