Cooling body and stacked-type cooler

Abstract

To provide a cooling body and a stacked-type cooler capable of improving a cooling effect on a heat-generating body.SOLUTION: This invention relates to a cooling fin 13 housed in a cooling body 10 for cooling an electronic component 20 while extending along a longitudinal direction L with respect to the electronic component 20. A direction orthogonal to the longitudinal direction L and facing the electronic component 20 is defined as a height direction H, and a direction orthogonal to both the longitudinal direction L and the height direction H is defined as a depth direction D. The cooling fin has a valley part 132 forming a longitudinal-direction flow passage RL through which a coolant 100 flows in the longitudinal direction L. The valley part 132 is provided with a valley-side concave portion 1342 (a height-direction widened portion RLa) for forming a first transverse vortex Vf extending along the longitudinal direction L and the height direction H with respect to the coolant 100 flowing through the longitudinal-direction flow passage RL.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cooling element and a layered cooler for cooling a heat-generating element such as an electronic component. [Background technology]

[0002] Recently, the number of automobiles that run on motors, such as electric vehicles and hybrid vehicles, is increasing, and these vehicles are equipped with inverters that convert the direct current from the onboard battery into alternating current to drive the motor.

[0003] The inverter includes semiconductor elements that drive the motor for running the vehicle as described above, and therefore outputs an extremely large current and generates a large amount of heat, making cooling essential for proper operation. As a cooling structure for heat-generating elements such as semiconductor elements in such inverters, a cooling structure has been proposed, as disclosed in Patent Document 1, for example.

[0004] The cooling structure disclosed in Patent Document 1 is an outer packaging material with an inlet and outlet for the refrigerant, and an inner core material with an uneven shape that divides the refrigerant flow path into multiple sections and forms the flow paths, etc., is placed inside the outer packaging material, and it is said that the heat-generating element to which the cooling structure is attached can be cooled by circulating the refrigerant through the flow paths.

[0005] However, since the refrigerant flows inside the outer packaging material along the flow path formed by the inner packaging material, it is not possible to sufficiently cool the heating element, which becomes even hotter, or whose heat dissipation performance decreases due to space saving, so there was a need for further improvement in the cooling effect. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2023-168762 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a cooling element and a layered cooler that can improve the cooling effect on a heat-generating element. [Means for solving the problem]

[0008] This invention is a cooling element that is aligned in a predetermined direction relative to a heating element and cools the heating element, wherein a direction perpendicular to the predetermined direction and facing the heating element is defined as a thickness direction, and a direction perpendicular to the predetermined direction and the thickness direction is defined as an orthogonal direction, and a flow path forming element is provided having a flow path forming portion that forms a refrigerant flow path through which refrigerant flows in the predetermined direction, and the flow path forming portion is provided with a vortex forming portion that forms a vortex in the predetermined direction and along the thickness direction for the refrigerant flowing through the refrigerant flow path.

[0009] The heat generating element includes electronic components such as those provided in an inverter, and the main body and exhaust section of an internal combustion engine. The refrigerant may be in a liquid, gel, or gaseous state.

[0010] The vortex along the above-mentioned predetermined direction and the thickness direction is a vortex that swirls around an axis perpendicular to the predetermined direction, which is the direction in which the refrigerant flows, and the thickness direction, and is also called a transverse vortex. The vortex generating portion includes a recess or a protrusion provided in the coolant flow path.

[0011] According to this invention, the cooling effect on the heat generating body can be improved. In more detail, a cooling element that is aligned in a predetermined direction relative to a heating element and cools the heating element is provided with a flow path forming body having a flow path forming portion that forms a refrigerant flow path through which the refrigerant flows in the predetermined direction, so that the refrigerant can be circulated in the predetermined direction by the refrigerant flow path formed by the flow path forming portion of the flow path forming body.

[0012] In addition, the flow path forming portion is provided with a vortex forming portion that forms a vortex in the specified direction and along the thickness direction in the refrigerant flowing through the refrigerant flow path, so that the vortex forming portion generates a vortex in the refrigerant flowing through the refrigerant flow path in the specified direction and along the thickness direction.

[0013] The vortices generated in the refrigerant by the vortex generating part along the predetermined direction and the thickness direction improve heat exchange with the heating element compared to a laminar flow of refrigerant. Furthermore, heat is transferred from the vortexes heated by heat exchange with the heating element to the refrigerant flowing in the predetermined direction through the refrigerant flow path, thereby improving the cooling efficiency of the heating element compared to a laminar flow of refrigerant.

[0014] As an aspect of the present invention, the vortex forming portion may be a first vortex forming portion, the vortex may be a first vortex, and the flow path forming portion may be provided with a second vortex forming portion that forms a second vortex along the predetermined direction and the perpendicular direction in the refrigerant flowing through the refrigerant flow path.

[0015] The second vortex along the above-mentioned predetermined direction and the perpendicular direction is a vortex that swirls around an axis in the thickness direction that is perpendicular to the predetermined direction and the perpendicular direction, which is the direction in which the refrigerant flows, and is also called a transverse vortex, just like the vortex along the predetermined direction and the thickness direction. The second vortex forming portion includes a recess or a protrusion provided in the refrigerant flow path.

[0016] According to this invention, the second vortex forming section generates a second vortex along the predetermined direction, which is different from the first vortex generated by the first vortex forming section and along the thickness direction, and along the perpendicular direction, thereby further improving heat exchange with the heat-generating body and further improving the cooling efficiency of cooling the heat-generating body.

[0017] In another aspect of the present invention, a plurality of the flow path forming portions may be arranged in parallel in the orthogonal direction, and the flow path forming portions adjacent to each other in the orthogonal direction may be formed in opposite directions relative to the thickness direction.

[0018] According to this invention, the flow path forming portions formed in opposite directions in the thickness direction are alternately arranged in the perpendicular direction, so that the refrigerant flow paths formed by the flow path forming portions can be densely arranged in the perpendicular direction, thereby allowing a large amount of refrigerant to circulate in the perpendicular direction, and further improving the cooling effect of the cooling body.

[0019] Furthermore, since the flow path forming portions adjacent to each other in the perpendicular direction are arranged in opposite directions in the thickness direction, a portion of the flow path forming portions can be shared, thereby allowing heat exchange between the refrigerants flowing through the refrigerant flow paths formed by the flow path forming portions adjacent to each other in the perpendicular direction, thereby improving the cooling effect in the perpendicular direction.

[0020] As another aspect of the present invention, the first vortex forming portion and the second vortex forming portion in the plurality of flow path forming portions arranged in parallel may be formed at the same position in the predetermined direction. This invention improves the formability of the cooling body compared to when the first vortex forming portion and the second vortex forming portion are randomly arranged in each of the multiple flow path forming portions arranged in parallel.

[0021] In another aspect of the present invention, the refrigerant flow path may be a first refrigerant flow path, and the flow path forming portion may be a first flow path forming portion, and the second vortex forming portions in the flow path forming portions arranged in parallel may be connected to each other in the perpendicular direction to form a second refrigerant flow path in which the refrigerant flows in the perpendicular direction, and the second vortex forming portion may function as a second flow path forming portion that forms the second refrigerant flow path.

[0022] According to this invention, the refrigerant flows not only in the predetermined direction through the first refrigerant flow path formed by the first flow path forming portion, but also in the perpendicular direction through the second refrigerant flow path formed by the second flow path forming portion, so that the refrigerant flows in the perpendicular direction in addition to the predetermined direction, thereby achieving a planar cooling effect.

[0023] Furthermore, since the second vortex forming portion functions as a second flow path forming portion that forms the second refrigerant flow path, the second vortex forming portion can generate a second vortex along the specified direction and the perpendicular direction, while also circulating in the perpendicular direction, allowing for a more compact configuration than when the second flow path forming portion that forms the second refrigerant flow path and the second vortex forming portion are provided separately.

[0024] As another aspect of the present invention, an outer shell member may be provided having an accommodation space for accommodating the flow path forming body therein so that a portion of the flow path forming portion abuts against an inner surface thereof. The term "contact" includes contact that allows heat conduction, and contacting a part of the flow passage forming portion and the outer shell member in an integrated manner by welding, brazing, or the like.

[0025] According to this invention, the refrigerant flows through the refrigerant flow path formed by the flow path forming portion of the flow path forming body in the accommodation space, so that the refrigerant can flow through the refrigerant flow path efficiently. Furthermore, because a portion of the flow path forming portion abuts against the inner surface of the outer shell member, heat is conducted to the flow path forming portion via the outer shell member, and heat can be efficiently exchanged with the refrigerant flowing through the refrigerant flow path formed by the flow path forming portion, thereby further improving the cooling effect of the cooling body.

[0026] As another aspect of the present invention, an intermediate plate may be provided to divide the storage space in the thickness direction, and the flow path forming body may be disposed in each of the storage spaces divided by the intermediate plate. According to this invention, two flow path formation bodies are disposed in the accommodation space, so that the refrigerant can circulate more efficiently so as to be able to exchange heat, and the cooling effect of the cooling body can be further improved.

[0027] The present invention is also characterized in that it is a stacked type cooler in which a plurality of the above-mentioned cooling bodies are stacked in the thickness direction, the refrigerant is connected so as to be conductive, the heat generating body is disposed between the cooling bodies stacked in the thickness direction, and a refrigerant supply section is provided for supplying the refrigerant to the cooling bodies stacked in the thickness direction, and a refrigerant discharge section is provided for discharging the refrigerant from the cooling bodies.

[0028] The heat-generating body includes, for example, electronic components such as semiconductor devices and CPUs, electronic circuit boards on which they are mounted, electrical devices incorporating them, pipes through which heated fluid flows, etc. Furthermore, the heat-generating body also includes the fins of heat sinks, which are cooling devices, and cells of storage batteries.

[0029] The coolant supply unit is provided in each of the stacked cooling bodies and communicates with each other to supply coolant, or supplies coolant to each of the stacked cooling bodies. The coolant discharge section is provided in each of the stacked cooling bodies and communicates with each other to discharge the coolant, or discharges the coolant from each of the stacked cooling bodies.

[0030] According to this invention, the heat generating element disposed between the stacked cooling elements can be efficiently cooled. In more detail, the cooling device includes a cooling medium supply section that supplies the cooling medium to cooling bodies that are connected to each other so that the cooling medium is conductive and that are stacked in the thickness direction, and a cooling medium discharge section that discharges the cooling medium from the cooling bodies, and the heat generating body is disposed between the cooling bodies that are stacked in the thickness direction. Therefore, the cooling medium supplied from the cooling medium supply section flows through the stacked and connected cooling bodies and is discharged from the cooling medium discharge section. Furthermore, since electronic components are disposed between the stacked cooling bodies, the cooling medium supplied from the cooling medium supply section, flowing through the cooling bodies, and discharged from the cooling medium discharge section exchanges heat with the electronic components, thereby efficiently cooling the electronic components. [Effects of the Invention]

[0031] According to the present invention, it is possible to provide a cooling element and a layered cooler that can improve the cooling effect on a heat-generating element. [Brief explanation of the drawings]

[0032] [Figure 1] FIG. 1 is a schematic perspective view of a layered cooler. [Figure 2] FIG. 2 is a schematic exploded perspective view of a stacked cooler. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. 1 is a schematic cross-sectional view of a stacked cooler. [Figure 11] FIG. 1 is an explanatory diagram of a layered cooler. [Figure 12] FIG. 10 is a schematic exploded perspective view of a cooling body according to a second embodiment. [Figure 13] FIG. 10 is a schematic exploded perspective view of a lower cooling body in a second embodiment. [Figure 14] FIG. 10 is an explanatory diagram of a cooling body in a second embodiment. [Figure 15] FIG. 10 is an explanatory diagram of a cooling body in a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0033] An embodiment of the present invention will be described below with reference to FIGS. (First embodiment) Fig. 1 shows a schematic perspective view of the layered cooler 1, and Fig. 2 shows a schematic exploded perspective view of the layered cooler 1. Fig. 3 shows a schematic exploded perspective view of the cooling body 10, Fig. 4 shows a schematic exploded perspective view of the lower cooling body 10B, and Fig. 5 shows an explanatory diagram of the cooling body 10. Figs. 6 to 9 show explanatory diagrams of the cooling fins 13, Fig. 10 shows a schematic enlarged cross-sectional view of the layered cooler 1, and Fig. 11 shows an explanatory diagram of the layered cooler 1.

[0034] Here, the direction along the long side of cooling body 10, which has a generally oval shape in plan view, is defined as longitudinal direction L, with the right rear side in FIG. 1 defined as one side La and the left front side defined as the other side Lb. Furthermore, of the directions perpendicular to longitudinal direction L, the direction connecting the right front side and the left rear side is defined as depth direction D, and the up-down direction is defined as height direction H. The upper side of height direction H is defined as upper side Hu, and the lower side is defined as lower side Hd. The same applies hereinafter to FIGS. 2 to 11.

[0035] Figures 5 to 11 will be described in detail. Figure 5(a) shows a schematic cross-sectional view of the cooling body 10 taken along the longitudinal direction L at the center of the cooling body 10 in the depth direction D, and Figure 5(b) shows a schematic cross-sectional view of the cooling body 10 taken along the depth direction D at the center of the cooling body 10 in the longitudinal direction L. Figure 6(a) shows a schematic enlarged perspective view of the cooling fins 13 as viewed from above, and Figure 6(b) shows an enlarged view of part a in Figure 6(a). Figure 7(a) shows a schematic enlarged perspective view of the cooling fins 13 as viewed from below, and Figure 7(b) shows an enlarged view of part b in Figure 7(a).

[0036] Fig. 8(a) shows a schematic enlarged plan view of the cooling fin 13, and Fig. 8(b) shows an enlarged view of part c in Fig. 8(a). Fig. 9(a) shows an enlarged view as seen from the arrow AA in Fig. 8(a), Fig. 9(b) shows an enlarged view as seen from the arrow BB in Fig. 8(a), Fig. 9(c) shows an enlarged view as seen from the arrow CC in Fig. 8(a), and Fig. 9(d) shows an enlarged view as seen from the arrow DD in Fig. 8(a).

[0037] Figure 10 shows a schematic enlarged cross-sectional view along the longitudinal direction L at the central portion of the depth direction D of the layered cooler 1, Figure 11(a) shows a schematic enlarged cross-sectional view of portion d in Figure 10, Figure 11(b) shows a schematic enlarged cross-sectional view of portion e in Figure 10, Figure 11(c) shows a schematic enlarged cross-sectional view of portion f in Figure 10, and Figure 11(d) shows a schematic enlarged cross-sectional view of portion g in Figure 10(c).

[0038] As shown in Figures 1 and 2, the stacked type cooler 1 is composed of multiple cooling bodies 10 stacked in the height direction H and electronic components 20, which are heat-generating bodies, sandwiched and held between the cooling bodies 10, and cools the electronic components 20 by circulating a liquid refrigerant 100 inside the cooling bodies 10. The refrigerant 100 may be a natural refrigerant such as water or ammonia, an alcohol-based refrigerant such as methanol, or even a fluorocarbon-based refrigerant such as gaseous HFC134a.

[0039] In addition, in the stacked type cooler 1 of this embodiment, nine cooling bodies 10 are stacked in the height direction H, and each of the eight electronic components 20 is arranged between the cooling bodies 10.Furthermore, of the cooling bodies 10 stacked in the height direction H, the cooling body 10 arranged on the uppermost side Hu is referred to as the upper cooling body 10A, and the cooling body 10 arranged on the lowermost side Hd is referred to as the lower cooling body 10B.

[0040] In the upper cooling element 10A, which is located on the uppermost side Hu of the laminated cooler 1, a pipe 30 that supplies the refrigerant 100 to the cooling element 10 of the laminated cooler 1 or discharges the refrigerant 100 from the cooling element 10 is connected to an upper rib 114, which will be described later. The other end of the pipe 30 is connected to a radiator (not shown) or the like.

[0041] More specifically, of the pipes 30 connected to the upper ribs 114 described below, the pipe 30 connected to the upper supply rib 114a on one side La is an inlet pipe 31 for supplying the refrigerant 100 into the cooling body 10, and the pipe 30 connected to the upper discharge rib 114b on the other side Lb is an outlet pipe 32 for discharging the refrigerant 100 from the cooling body 10. The upper ribs 114, the upper supply ribs 114a, and the upper discharge ribs 114b will be described in detail later.

[0042] First, the electronic component 20 disposed between the cooling bodies 10 in the stacked cooler 1 will be described. The electronic component 20 is a so-called semiconductor device for power control, and is composed of a semiconductor element such as an insulated gate bipolar transistor (IGBT). Such an electronic component 20 includes a thin, rectangular parallelepiped component body 21 and three flat terminals 22 protruding from the component body 21. When an electric wire is connected to the terminal 22 and electricity is applied, the electronic component 20 generates heat.

[0043] 3, the cooling body 10 for cooling the electronic component 20 is composed of a housing 11, an intermediate plate 12 attached to the housing 11, and cooling fins 13 housed in the housing 11. The housing 11, intermediate plate 12, and cooling fins 13 are made of an appropriate metal, such as an aluminum alloy, that satisfies the required performance such as thermal conductivity and strength.

[0044] The housing 11 is a case body having a hollow structure, which is formed in a substantially elliptical shape that is long in the longitudinal direction L in a plan view and has a flow space S therein through which the refrigerant 100 can flow. The housing 11 is made up of an upper plate 111 disposed on the upper side Hu, and a lower plate 112 attached to the lower side Hd of the upper plate 111.

[0045] The upper plate 111 has a generally oval shape that is long in the longitudinal direction L that forms the shape of the housing 11 in a plan view, and a generally flat shape that is lower in the height direction H than in the longitudinal direction L, and is formed with a generally inverted concave cross section. More specifically, a portion of the upper plate 111 that is spaced a predetermined distance inward from the outer edge portion 111a protrudes toward the upper side Hu by a size that is slightly smaller than the outer shape of the upper plate 111 (see FIG. 3). In this way, the upper plate 111 is formed with a generally inverted concave cross section in which the surface on the lower side Hd is concave toward the upper side Hu.

[0046] The upper plate 111 having such a shape is provided with a circular upper through-hole 113 and upper ribs 114 standing upright from the inner edge of the upper through-hole 113 near both ends in the longitudinal direction L. The upper through-holes 113 are holes in the cooling body 10 for supplying the coolant 100 into the housing 11 or for discharging the coolant 100 from the inside of the housing 11 to the outside. The upper through-holes 113 are provided near both ends of the upper plate 111 in the longitudinal direction L. Of the upper through-holes 113, the upper through-hole 113 provided on one side La serves as a first supply port 113a for supplying the coolant 100, and the upper through-hole 113 provided on the other side Lb serves as a first discharge port 113b for discharging the coolant 100. The first supply port 113a has a diameter slightly larger than that of the first discharge port 113b.

[0047] The upper ribs 114 are connecting parts for connecting stacked cooling bodies 10 together or the above-mentioned pipes 30 in the stacked cooler 1, and the upper ribs 114 erected in the height direction H from the inner edge of the upper through-hole 113 are formed in a cylindrical shape. Here, the side of the upper ribs 114 erected from the inner edge of the first supply port 113a is referred to as the upper supply rib 114a, and the side erected from the inner edge of the first discharge port 113b is referred to as the upper discharge rib 114b. The upper supply rib 114a erected from the inner edge of the first supply port 113a, which has a diameter slightly larger than that of the first discharge port 113b, is cylindrical and has a larger diameter than the upper discharge rib 114b erected from the inner edge of the first discharge port 113b.

[0048] The lower plate 112 attached to the upper plate 111 has substantially the same shape as the upper plate 111 and is disposed in a vertically symmetrical orientation. Specifically, a portion spaced a predetermined distance inward from the outer edge portion 112a protrudes toward the lower side Hd by a size slightly smaller than the outer shape of the lower plate 112. In this way, the lower plate 112 is formed with a generally concave cross section, with the surface on the upper side Hu being concave toward the lower side Hd.

[0049] In this way, the lower plate 112, which is oriented vertically symmetrically to the upper plate 111, has a circular lower through-hole 115 and a lower rib 116 standing up from the inner edge of the lower through-hole 115 near both ends in the longitudinal direction L.

[0050] Similar to the upper through-holes 113, the lower through-holes 115 are holes in the cooling body 10 for supplying the coolant 100 to the interior or discharging the coolant 100 to the exterior. The lower through-holes 115 are provided near both ends of the upper plate 111 in the longitudinal direction L. Of the lower through-holes 115, the lower through-hole 115 provided on one side La is a second outlet 115a for discharging the coolant 100, and the lower through-hole 115 provided on the other side Lb is a second supply port 115b for supplying the coolant 100. The second supply port 115b has a diameter slightly larger than that of the second outlet 115a.

[0051] The lower ribs 116 are connecting parts for connecting the stacked cooling bodies 10 together in the stacked cooler 1, and the lower ribs 116 erected in the height direction H from the inner edge of the lower through-hole 115 are cylindrical. Here, the side of the lower ribs 116 erected from the inner edge of the second discharge port 115a is referred to as the lower discharge rib 116a, and the side erected from the inner edge of the second supply port 115b is referred to as the lower supply rib 116b. The lower supply rib 116b erected from the inner edge of the second supply port 115b, which has a diameter slightly larger than that of the second discharge port 115a, is cylindrical and has a larger diameter than the lower discharge rib 116a erected from the inner edge of the second discharge port 115a.

[0052] The lower plate 112 configured in this manner is attached to the upper plate 111, whose upper ribs 114 face the upward side Hu, so that the lower ribs 116 face the downward side Hd (see FIG. 3). Specifically, the outer edge portion 111a of the upper plate 111 and the outer edge portion 112a of the lower plate 112 are overlapped in the height direction H and integrated.

[0053] In this case, the housing 11 assembled with the upper plate 111 and the lower plate 112 is mounted so that the upper supply rib 114a of the upper plate 111 and the lower discharge rib 116a of the lower plate 112, and the upper discharge rib 114b of the upper plate 111 and the lower supply rib 116b of the lower plate 112 face each other in the height direction H.

[0054] Here, as described above, the upper plate 111 and the lower plate 112 are formed to have a generally concave cross section, and therefore, by assembling the upper plate 111 and the lower plate 112 together, a predetermined space (referred to as a flow space S) is formed therein through which the refrigerant 100 flows. Note that, as shown in Figures 5(a) and 5(b), one intermediate plate 12 and two cooling fins 13 are arranged in the flow space S.

[0055] As described above, the intermediate plate 12 arranged in the flow space S is a flat plate-like body having approximately the same shape in plan view as the upper plate 111 and the lower plate 112 that constitute the housing 11, and plate holes 121 are formed near both ends in the longitudinal direction L.

[0056] The plate holes 121 provided near both ends in the longitudinal direction L are positioned at locations corresponding to the upper through hole 113 and the lower through hole 115 when the intermediate plate 12 is assembled to the cooling body 10, that is, at positions where the upper through hole 113 of the upper plate 111, the plate holes 121 of the intermediate plate 12, and the lower through hole 115 of the lower plate 112 are connected in the height direction H.

[0057] Inside the cooling body 10, the cooling fins 13, each arranged in the upper space S1 and the lower space S2 described later, are metal plate-like bodies that are approximately rectangular in plan view and have uneven shapes on both sides along the longitudinal direction L and the depth direction D, as shown in Figures 6 to 9.

[0058] 6(a) and 6(b), the cooling fin 13 has convex peaks 131 and concave valleys 132 formed alternately along the longitudinal direction L in the depth direction D, and convex convex portions 133 and concave valleys 134 formed alternately in each of the peaks 131 and the valleys 132 in the longitudinal direction L. Of the convex portions 133 formed in each of the peaks 131 and the valleys 132, the convex portion 133 formed in the peak 131 is referred to as a peak-side convex portion 1331, and the convex portion 133 formed in the valley 132 is referred to as a valley-side convex portion 1332. Similarly, of the concave portions 134 formed in each of the peaks 131 and the valleys 132, the concave portion 134 formed in the peak 131 is referred to as a peak-side concave portion 1341, and the concave portion 134 formed in the valley 132 is referred to as a valley-side concave portion 1342.

[0059] In this way, by forming the peaks 131, valleys 132, convex portions 133 and concave portions 134, the cooling fin 13 has an uneven shape that repeatedly protrudes and recesses in the height direction H along the depth direction D, and also has an uneven shape that repeatedly protrudes and recesses in the height direction H along the longitudinal direction L.

[0060] As shown in Figures 6(a) and 6(b), the mountain portion 131 is formed with an isosceles trapezoidal cross section that is convex toward the upper side Hu, with a pair of inclined surfaces 141 that are close to each other as it approaches the upper side Hu, and an upper surface 142 that connects the tips of the inclined surfaces on the upper side Hu.

[0061] As shown in Figures 6(a) and 6(b), the valley portion 132 is formed with an isosceles trapezoidal cross section that is convex toward the downward side Hd, with a pair of inclined surfaces 141 that approach each other as it approaches the downward side Hd, and a bottom surface 143 that connects the tips of the inclined surfaces on the downward side Hd. The peaks 131 and valleys 132 are set to have the same width in the depth direction D.

[0062] Therefore, the inclined surface 141 connects the top surface 142 and the bottom surface 143 that are adjacent in the depth direction D in a direction that inclines in the height direction H and the depth direction D. Therefore, the height of the peaks 131, that is, the length in the height direction H from the bottom surface 143 to the top surface 142, is equal to the depth of the valleys 132, that is, the length in the height direction H from the top surface 142 to the bottom surface 143, and the cross-sectional shapes of the peaks 131 and the valleys 132 are opposite in the height direction H but are equal to each other.

[0063] The sloped surface 141 that forms the peak 131 and the sloped surface 141 that forms the valley 132 are common. Furthermore, the top surface 142 that forms the peak 131, which has the peak-side convex portion 1331 and the peak-side concave portion 1341, has a convex top surface 1421, a concave top surface 1422, and a sloped top surface 1423.

[0064] In detail, the upper surface 142 has a convex upper surface 1421 that forms the upper surface of the mountain-side convex portion 1331, a concave upper surface 1422 that forms the bottom surface of the mountain-side concave portion 1341, and an inclined upper surface 1423 that connects the convex upper surface 1421 and the concave upper surface 1422 in an inclined direction with respect to the height direction H, and is formed in a wavy shape along the longitudinal direction L (see Figure 6(b)).

[0065] The bottom surface 143 forming the valley portion 132 having the valley-side convex portion 1332 and the valley-side concave portion 1342 has a convex lower surface 1431 , a concave lower surface 1432 , and an inclined lower surface 1433 . In detail, the bottom surface 143 has a convex lower surface 1431 that forms the upper surface of the valley-side convex portion 1332, a concave lower surface 1432 that forms the bottom surface of the valley-side concave portion 1342, and an inclined lower surface 1433 that connects the convex lower surface 1431 and the concave lower surface 1432 in an inclined direction with respect to the height direction H, and is formed in a wavy shape along the longitudinal direction L (see Figure 6(b)). The inclined surface 141 connecting the top surface 142 and the bottom surface 143 configured in this manner in a direction inclined with respect to the height direction H and the depth direction D has a wave-like shape in a side view.

[0066] Furthermore, the convex portions 133 and the concave portions 134 formed on the peaks 131 and the valleys 132, respectively, are formed at the same positions in the longitudinal direction L. Specifically, the peak-side convex portions 1331 formed on the peaks 131 and the valley-side convex portions 1332 formed on the valleys 132, as well as the peak-side concave portions 1341 formed on the peaks 131 and the valley-side concave portions 1342 formed on the valleys 132, are formed so that their central positions in the longitudinal direction L are at the same position.

[0067] Therefore, the mountain-side convex portions 1331 and valley-side convex portions 1332, and the mountain-side concave portions 1341 and valley-side concave portions 1342 in the mountain portions 131 and valley portions 132 that are alternately formed along the depth direction D, are also arranged alternately along the depth direction D.

[0068] Furthermore, the height of the mountain-side convex portion 1331 relative to the valley-side convex portion 1332 and the height of the mountain-side concave portion 1341 relative to the valley-side concave portion 1342 are equal. Specifically, the height of the convex upper surface 1421 that constitutes the mountain side convex portion 1331 relative to the convex lower surface 1431 that constitutes the valley side convex portion 1332 is equal to the height of the convex lower surface 1431 that constitutes the mountain side concave portion 1341 relative to the concave lower surface 1432 that constitutes the valley side concave portion 1342.

[0069] 6 has been described for the peaks 131, valleys 132, convex portions 133, and concave portions 134 formed on the surface of the upper side Hu of the cooling fin 13, but as shown in Fig. 7, the peaks 131, valleys 132, convex portions 133, and concave portions 134 are also formed on the surface of the lower side Hd of the cooling fin 13. However, the peaks 131 and valleys 132, and the convex portions 133 and concave portions 134 on the surface of the upper side Hu become the valleys 132 and peaks 131, and the concave portions 134 and convex portions 133 on the surface of the lower side Hd. In other words, the peaks 131 and convex portions 133 that are convex toward the upper side Hu on the surface of the upper side Hu become valleys 132 and concave portions 134 that are concave toward the upper side Hu on the surface of the lower side Hd, and the valleys 132 and concave portions 134 that are concave toward the lower side Hd on the surface of the upper side Hu become peaks 131 and convex portions 133 that protrude toward the upper side Hu on the surface of the lower side Hd.

[0070] Therefore, with regard to the peaks 131 to the concave portions 134 on the lower side Hd surface of the cooling fin 13, i.e., the surface on the side of the intermediate plate 12, the peaks 131 and convex portions 133 on the upper side Hu surface can be read as valleys 132 and concave portions 134 on the lower side Hd surface, and the valleys 132 and concave portions 134 on the upper side Hu surface can be read as peaks 131 and convex portions 133 on the lower side Hd surface.

[0071] In the cooling fin 13 configured in this manner, a flow path R through which the coolant 100 flows is formed. Specifically, on the upper side Hu of the cooling fin 13, longitudinal flow paths RL extending in the longitudinal direction L are formed in the valleys 132 between the peaks 131 (see FIG. 6(b)).

[0072] The longitudinal flow path RL formed in the valley portion 132 is concave in the height direction H by the valley side concave portion 1342, and a height direction widening portion RLa is formed which widens the longitudinal flow path RL in the height direction H.

[0073] Further, the recessed portions 134 of the peaks 131 form lateral flow paths RS extending in the depth direction D. Since the longitudinal flow paths RL and the lateral flow paths RS are perpendicular to each other when viewed in a plane, a lattice-like flow path R can be formed by a plurality of longitudinal flow paths RL formed by a plurality of valley portions 132 provided in the depth direction D and a plurality of lateral flow paths RS formed by the mountain-side concave portions 1341 of the mountain portions 131.

[0074] As described above, the short-side flow path RS formed by the mountain-side concave portion 1341 of the mountain portion 131 is perpendicular to the longitudinal flow path RL, and the mountain-side concave portion 1341 forming the short-side flow path RS is concave toward the depth direction D with respect to the longitudinal flow path RL formed in the valley portion 132, and a depth direction widening portion RLb that widens the longitudinal flow path RL in the depth direction D is formed (see Figure 6(b)). Similarly, on the lower side Hd of the cooling fin 13, the valley portions 132 form longitudinal flow paths RL, and the mountain-side recessed portions 1341 form lateral flow paths RS.

[0075] The cooling body 10 having the above-described elements configured has the intermediate plate 12 and the cooling fins 13 housed in a flow space S formed inside the housing 11 (see FIG. 5). In the cooling body 10, the intermediate plate 12 is disposed in the flow space S, thereby dividing the flow space S into two in the height direction H. Of the divided flow space S, the space on the upper side Hu is referred to as the upper space S1, and the space on the lower side Hd is referred to as the lower space S2 (see FIGS. 5(a) and 5(b)).

[0076] Cooling fins 13 are arranged in each of the upper space S1 and the lower space S2. The cooling fins 13 arranged in each of the upper space S1 and the lower space S2 are arranged facing opposite directions in the height direction H. Each of the cooling fins 13 arranged in the upper space S1 and the lower space S2 is arranged so that the surface arranged on the uppermost side Hu, i.e., the convex upper surface 1421 of the upper surface 142 constituting the peak portion 131, abuts against the upper plate 111, and the surface arranged on the lowermost side Hd, i.e., the concave lower surface 1432 of the bottom surface 143 constituting the valley portion 132, abuts against the intermediate plate 12.

[0077] The housing 11 that houses the intermediate plate 12 and the cooling fins 13 inside is formed by stacking the upper plate 111 and the lower plate 112 in the height direction H and integrating them. In the cooling fin 13, the contact between the convex upper surface 1421 of the upper surface 142 constituting the peak portion 131 and the upper plate 111, and the contact between the concave lower surface 1432 of the bottom surface 143 constituting the valley portion 132 and the intermediate plate 12 need only be in contact to allow heat conduction, and one may be in contact so as to press against the other, or the contact state may be fixed by welding, brazing, etc.

[0078] The cooling body 10 configured in this manner can form a flow path R through which the coolant 100 flows between the upper space S1 and the lower space S2 in which the cooling fins 13 are arranged. In detail, in the upper space S1, a flow path R is formed between the inner surface of the upper plate 111 and the upper side Hu surface of the cooling fin 13, and between the lower side Hd surface of the cooling fin 13 and the upper side Hu surface of the intermediate plate 12, and in the lower space S2, a flow path R is formed between the upper side Hu surface of the cooling fin 13 and the lower side Hd surface of the intermediate plate 12, and between the lower side Hd surface of the cooling fin 13 and the inner surface of the lower plate 112 (see Figure 5).

[0079] More specifically, on the upper side Hu of the cooling fin 13 in the upper space S1, a longitudinal flow path RL extending in the longitudinal direction L is formed between the valley portion 132 and the inner surface of the upper plate 111, and a lateral flow path RS extending in the depth direction D is formed between the mountain side concave portion 1341 of the peak portion 131 and the inner surface of the upper plate 111.

[0080] Furthermore, on the lower side Hd of the cooling fin 13 in the upper space S1, the valley portion 132 and the surface of the upper side Hu of the intermediate plate 12 form a longitudinal flow path RL extending in the longitudinal direction L, and the mountain-side concave portion 1341 of the peak portion 131 and the surface of the upper side Hu of the intermediate plate 12 form a short-side flow path RS extending in the depth direction D.

[0081] Furthermore, in the lower space S2, longitudinal flow paths RL and lateral flow paths RS are formed in a similar configuration. That is, in the upper space S1 and the lower space S2 obtained by dividing the flow space S in the height direction H by the intermediate plate 12, longitudinal flow paths RL and lateral flow paths RS are formed on the upper side Hu and the lower side Hd of the cooling fin 13, respectively.

[0082] Furthermore, the longitudinal flow paths RL extending in the longitudinal direction L and the lateral flow paths RS extending in the depth direction D are arranged in a lattice pattern in a planar view, and are fluidly connected by the recessed portions 134 of the valley portions 132 (see Figure 8(b)).

[0083] Cooling bodies 10 configured in this manner are stacked in the height direction H, and electronic components 20 are disposed between the cooling bodies 10 to form the stacked-type cooler 1. Here, in the stacked-type cooler 1 of this embodiment, nine cooling bodies 10 are stacked in the height direction H as described above, and eight electronic components 20 are disposed between the cooling bodies 10. Furthermore, of the cooling bodies 10 stacked in the height direction H, the cooling body 10 disposed on the uppermost side Hu is referred to as the upper cooling body 10A, and the cooling body 10 disposed on the lowermost side Hd is referred to as the lower cooling body 10B, but only the lower cooling body 10B has a different shape from the other cooling bodies 10.

[0084] In the layered cooler 1, the lower cooling body 10B arranged on the lowest side Hd has the same shape as the other cooling bodies 10, except that the shape of the lower plate 112 constituting the housing 11 is different from that of the other cooling bodies 10. Here, the lower plate 112 constituting the lower cooling body 10B is referred to as the lower lower plate 112B. The lower plate 112B is different from the lower plate 112 in that it is formed with a generally concave cross section and is not provided with the lower through-holes 115 and the lower ribs 116 (see FIG. 4).

[0085] Then, by stacking eight cooling bodies 10 on the upper side Hu of the lower cooling body 10B configured in this manner and arranging electronic components 20 between the lower cooling body 10B and the cooling bodies 10 and between the cooling bodies 10, and then connecting an inlet pipe 31 to the upper supply rib 114a of the upper cooling body 10A and connecting an outlet pipe 32 to the upper discharge rib 114b, a stacked type cooler 1 can be constructed that can circulate the refrigerant 100 inside.

[0086] Specifically, as shown in Figure 10, cooling bodies 10 can be assembled together, or the upper cooling body 10A and the cooling body 10, or the lower cooling body 10B and the cooling body 10 can be assembled together by inserting and fitting the lower discharge rib 116a of the upper side Hu into the inside of the upper supply rib 114a of the lower side Hd, and by inserting and fitting the upper discharge rib 114b of the lower side Hd into the inside of the lower supply rib 116b of the upper side Hu, so that the upper through hole 113, the plate hole 121, and the lower through hole 115 can be connected.

[0087] The laminated cooler 1 configured in this manner allows the refrigerant 100 to circulate through the flow space S inside the cooling body 10. In the following description, unless otherwise specified, the upper cooling body 10A and the lower cooling body 10B will also be described as the cooling body 10.

[0088] In detail, when the refrigerant 100 is supplied to the upper cooling body 10A from the inlet pipe 31 of the laminated cooler 1, as shown in Figure 11(a), the refrigerant 100 is introduced into the flow space S from the first supply port 113a, and the refrigerant 100 passes through the plate hole 121 and is discharged from the second discharge port 115a.

[0089] The refrigerant 100 discharged from the second discharge port 115a is supplied to the flow space S of the cooling body 10 on the lower side Hd from the first supply port 113a of the cooling body 10 on the lower side Hd fitted into the lower discharge rib 116a. This process is repeated for the cooling bodies 10 on the lower side Hd, and in the lower cooling body 10B on the lowest side Hd, as shown in Figure 11(b), the refrigerant 100 discharged from the second discharge port 115a of the cooling body 10 on the upper side Hu is supplied to the flow space S from the first supply port 113a of the upper supply rib 114a that is fitted and connected to the lower discharge rib 116a of the cooling body 10. Note that the lower cooling body 10B does not have a lower through-hole 115, so the supplied refrigerant 100 flows through the flow space S.

[0090] As described above, the refrigerant 100 supplied to the flow space S flows into the upper space S1 and the lower space S2 which are divided in the height direction H by the intermediate plate 12. As described above, the refrigerant 100 that flows into the upper space S1 and the lower space S2 flows through the flow path R formed by the inner surface of the housing 11, the cooling fins 13 and the intermediate plate 12, and exchanges heat with the electronic components 20 sandwiched between the cooling bodies 10, thereby cooling the electronic components 20.

[0091] Specifically, the refrigerant 100 that has flowed into the upper space S1 and the lower space S2 passes through the longitudinal flow paths RL extending in the longitudinal direction L, and flows from one side La to the other side Lb in the longitudinal direction L. At this time, the refrigerant 100 flowing through the longitudinal flow paths RL flows along the longitudinal direction L and the height direction H due to the height-direction widening portion RLa of the valley-side recessed portion 1342 that widens in the height direction H, and a first transverse vortex Vf having a central axis in the depth direction D is generated (see FIGS. 9(a) and 9(b)).

[0092] In addition, in the longitudinal flow path RL, the depth-wise widening portion RLb, which is widened in the depth direction D by the mountain-side concave portion 1341 of the mountain portion 131, generates a second transverse vortex Vs that runs along the longitudinal direction L and the depth direction D and has its central axis in the height direction H (see Figure 8(b)).

[0093] In this way, a first transverse vortex Vf is generated in the refrigerant 100 flowing through the longitudinal flow path RL by the height-direction widening portion RLa formed by the valley-side recessed portion 1342 that widens in the height direction H, and a second transverse vortex Vs is generated by the depth-direction widening portion RLb formed by the mountain-side recessed portion 1341 that widens in the depth direction D. The first transverse vortex Vf and the second transverse vortex Vs generated in the refrigerant 100 enable more efficient heat exchange with the cooling fins 13, which have high thermal conductivity, than when the refrigerant 100 simply flows through the longitudinal flow path RL in the longitudinal direction L. Therefore, the heat-generating electronic component 20 can be efficiently cooled via the housing 11.

[0094] In this way, the coolant 100 supplied from the first supply port 113a on the one side La flows through the flow path R in the flow space S, reaches the other side Lb, and can be discharged from the first discharge port 113b. More specifically, in the lower cooling body 10B, the refrigerant 100 passes through the flow path R and reaches the other side Lb, and is discharged from the first outlet 113b toward the cooling body 10 on the upper side Hu, as shown in FIG. 11(c).

[0095] In the cooling body 10 on the upper side Hu, in which the lower supply rib 116b is fitted into the upper discharge rib 114b of the cooling body 10 on the lower side Hd, the refrigerant 100 discharged from the cooling body 10 on the lower side Hd flows in through the second supply port 115b, and the refrigerant 100 that has circulated through the flow space S of the cooling body 10 reaches the other side Lb, joins together, and is discharged toward the cooling body 10 on the upper side Hu from the first discharge port 113b.

[0096] This process is repeated until, in the upper cooling body 10A on the uppermost side Hu, as shown in Figure 11(d), the refrigerant 100 discharged from the cooling body 10 on the lower side Hd flows in through the second supply port 115b, and the refrigerant 100 that has circulated through the flow space S of the cooling body 10 reaches the other side Lb, joins together, and is discharged from the outlet pipe 32 via the first discharge port 113b.

[0097] In this way, the refrigerant 100 supplied from the inlet pipe 31 flows through the flow space S of each cooling body 10, and the stacked cooler 1 discharged from the outlet pipe 32 flows through the flow path R formed by the cooling fins 13 arranged in the flow space S, thereby being able to cool the electronic components 20 arranged between the cooling bodies 10.

[0098] As described above, the cooling fin 13, which is aligned with the longitudinal direction L relative to the electronic component 20 and cools the electronic component 20, has a height direction H that is perpendicular to the longitudinal direction L and facing the electronic component 20, and a depth direction D that is perpendicular to the longitudinal direction L and the height direction H, and has valley portions 132 that form longitudinal flow paths RL through which the refrigerant 100 flows in the longitudinal direction L, and the valley portions 132 are provided with valley-side concave portions 1342 (height-direction widening portions RLa) that form first transverse vortices Vf along the longitudinal direction L and the height direction H for the refrigerant 100 flowing through the longitudinal flow paths RL, thereby improving the cooling effect on the electronic component 20.

[0099] In more detail, the cooling fin 13, which is aligned with the longitudinal direction L of the electronic component 20 and cools the electronic component 20, has valley portions 132 that form longitudinal flow paths RL through which the refrigerant 100 flows in the longitudinal direction L, and therefore the refrigerant 100 can flow in the longitudinal direction L through the longitudinal flow paths RL formed by the valley portions 132 of the cooling fin 13.

[0100] In addition, the valley portion 132 is provided with a valley side concave portion 1342 (height direction widening portion RLa) that forms a first transverse vortex Vf along the longitudinal direction L and the height direction H in the refrigerant 100 flowing through the longitudinal flow path RL, so that the valley side concave portion 1342 (height direction widening portion RLa) generates a first transverse vortex Vf along the longitudinal direction L and the height direction H in the refrigerant 100 flowing through the longitudinal flow path RL.

[0101] The first transverse vortices Vf generated in the refrigerant 100 by the valley-side concave portions 1342 (height-direction widening portions RLa) along the longitudinal direction L and the height direction H improve the heat exchange performance with the electronic components 20 compared to the laminar flow of the refrigerant 100. Furthermore, the first transverse vortices Vf, which have been heated through heat exchange with the electronic components 20, transfer heat to the refrigerant 100 flowing through the longitudinal flow paths RL in the longitudinal direction L, so that the cooling efficiency of the electronic components 20 can be improved compared to when the refrigerant 100 flows in a laminar flow.

[0102] The peak portion 131 is provided with a peak-side recess 1341 (depth direction widening portion RLb) that forms a second transverse vortex Vs along the longitudinal direction L and the depth direction D in the refrigerant 100 flowing through the longitudinal flow path RL.

[0103] Therefore, the mountain-side recess 1341 (depth-direction widening portion RLb) generates a second transverse vortex Vs along the longitudinal direction L and depth direction D, which is different from the first transverse vortex Vf along the longitudinal direction L and height direction H generated by the valley-side recess 1342 (height-direction widening portion RLa), thereby further improving heat exchange with the electronic component 20 and further improving the cooling efficiency for cooling the electronic component 20.

[0104] Furthermore, a plurality of valleys 132 are arranged in parallel in the depth direction D, and adjacent valleys 132 in the depth direction D are formed in opposite directions to each other with respect to the height direction H. Therefore, the valleys 132 formed in opposite directions to each other in the height direction H are alternately arranged in the depth direction D, and the longitudinal flow paths RL formed by the valleys 132 can be densely arranged in the depth direction D. Therefore, a large amount of refrigerant 100 can be circulated in the depth direction D, and the cooling effect of the cooling fins 13 can be further improved.

[0105] Furthermore, since the valleys 132 adjacent to each other in the depth direction D are arranged in opposite directions in the height direction H, the inclined surfaces 141 that are part of the valleys 132 can be shared. Therefore, heat exchange also occurs between the refrigerants 100 flowing through the longitudinal flow paths RL formed by the valleys 132 adjacent to each other in the depth direction D, and the cooling effect in the depth direction D can be improved.

[0106] Furthermore, since the valley-side concave portions 1342 (height-wise widening portions RLa) in the multiple parallel-arranged valley portions 132 and the mountain-side concave portions 1341 (depth-wise widening portions RLb) in the mountain portions 131 are each formed at the same position in the longitudinal direction L, the formability of the cooling fin 13 can be improved compared to when the valley-side concave portions 1342 (height-wise widening portions RLa) and the mountain-side concave portions 1341 (depth-wise widening portions RLb) are randomly arranged in each of the multiple parallel-arranged valley portions 132.

[0107] In addition, the mountain-side concave portions 1341 (depth-direction widening portions RLb) of the multiple parallelly arranged mountain portions 131 are connected to each other in the depth direction D, forming a short-side flow path RS through which the refrigerant 100 flows in the depth direction D, and the mountain-side concave portions 1341 (depth-direction widening portions RLb) function as the depth-direction widening portions RLb that form the short-side flow path RS.

[0108] Therefore, the refrigerant 100 flows not only in the longitudinal direction L through the longitudinal flow paths RL formed by the valley portions 132, but also in the depth direction D through the lateral flow paths RS formed by the depth direction widening portions RLb. Therefore, the refrigerant 100 can flow in the depth direction D as well as in the longitudinal direction L, thereby achieving a planar cooling effect.

[0109] Furthermore, since the mountain-side concave portion 1341 (depth-direction widening portion RLb) functions as the depth-direction widening portion RLb that forms the short-side flow path RS, the mountain-side concave portion 1341 (depth-direction widening portion RLb) can generate a second transverse vortex Vs along the longitudinal direction L and the depth direction D, while also circulating in the depth direction D, allowing for a more compact configuration than when the depth-direction widening portion RLb that forms the short-side flow path RS and the mountain-side concave portion 1341 (depth-direction widening portion RLb) are provided separately.

[0110] In addition, the housing 11 has a flow space S that houses the cooling fins 13 so that the convex upper surface 1421, which is part of the peak portion 131, abuts the inner surface, so that the refrigerant 100 can efficiently flow through the longitudinal flow path RL formed by the valley portion 132 of the cooling fins 13 in the flow space S.

[0111] Furthermore, since the convex upper surfaces 1421 of the peaks 131 abut against the inner surface of the housing 11, heat is conducted to the peaks 131 via the housing 11, and can be efficiently exchanged with the refrigerant 100 flowing through the longitudinal flow paths RL formed by the valleys 132. This further improves the cooling effect of the cooling fins 13.

[0112] In addition, in the cooling body 10, an intermediate plate 12 is provided that divides the flow space S in the height direction H, and a cooling fin 13 is arranged in each of the flow spaces S (S1, S2) divided by the intermediate plate 12. Therefore, two cooling fins 13 are arranged in the flow space S, so that the refrigerant 100 can flow more efficiently to exchange heat, and the cooling effect of the cooling fins 13 can be further improved.

[0113] Furthermore, a stacked type cooler 1 in which a plurality of cooling bodies 10 having the above-mentioned cooling fins 13 are stacked in the height direction H, a refrigerant 100 is connected in a conductive manner, electronic components 20 are arranged between the cooling bodies 10 stacked in the height direction H, and an inlet pipe 31 for supplying the refrigerant 100 to the cooling bodies 10 stacked in the height direction H and an outlet pipe 32 for discharging the refrigerant 100 from the cooling bodies 10 is provided can efficiently cool the electronic components 20 arranged between the stacked cooling bodies 10.

[0114] More specifically, an inlet pipe 31 is provided that supplies the coolant 100 to cooling bodies 10 that are connected to each other so that the coolant 100 is conductive and that are stacked in a height direction H, and an outlet pipe 32 is provided that discharges the coolant 100 from the cooling bodies 10, and electronic components 20 are disposed between the cooling bodies 10 that are stacked in the height direction H. Therefore, the coolant 100 supplied from the inlet pipe 31 flows through the stacked and connected cooling bodies 10 and is discharged from the outlet pipe 32. Note that, because electronic components are disposed between the stacked cooling bodies 10, the coolant 100 that is supplied from the inlet pipe 31, flows through the cooling bodies 10, and is discharged from the outlet pipe 32 exchanges heat with the electronic components 20, thereby efficiently cooling the electronic components 20.

[0115] The cooling bodies 10, 10A, 10B provided in the above-described layered cooler 1 to cool the electronic components 20 include the housing 11, the intermediate plate 12 attached to the housing 11, and the two cooling fins 13 housed in the flow space S of the housing 11. However, as shown in Figures 12 to 14, cooling bodies 10C to 10E may be configured by housing one cooling fin 13C in the flow space S inside the housing 11.

[0116] Fig. 12 shows a schematic exploded perspective view of cooling bodies 10C and 10D of the second embodiment, Fig. 13 shows a schematic exploded perspective view of lower cooling body 10E of the second embodiment, and Fig. 14 shows a schematic exploded cross-sectional view of cooling bodies 10C and 10D. Specifically, Fig. 14(a) shows a schematic cross-sectional view of cooling bodies 10C and 10D taken along the longitudinal direction L at a central portion in the depth direction D, and Fig. 14(b) shows a schematic cross-sectional view of cooling bodies 10C and 10D taken along the longitudinal direction D at a central portion in the longitudinal direction L. In the following description of cooling bodies 10C to 10E, the same components as those in the above-described cooling bodies 10, 10A, and 10B will be designated by the same reference numerals and their description will be omitted.

[0117] The cooling bodies 10C to 10E of the second embodiment differ from the cooling bodies 10, 10A, and 10B in that an intermediate plate 12 is assembled to the housing 11 and two cooling fins 13 are housed in the flow space S, in that, as described above, they do not have an intermediate plate 12 and house one cooling fin 13C.

[0118] The cooling fin 13C has peaks 131, valleys 132, convex portions 133 and concave portions 134 which are formed to be taller in the height direction H than the cooling fin 13 described above. In this way, the cooling fin 13C, which has a high height in the height direction H of the peaks 131, valleys 132, convex portions 133 and concave portions 134, is positioned in the flow space S of the housing 11 so that the surface located on the uppermost side Hu, i.e., the convex upper surface 1421 of the upper surface 142 constituting the peaks 131, abuts against the upper plate 111, and the surface located on the lowermost side Hd, i.e., the concave lower surface 1432 of the bottom surface 143 constituting the valleys 132, abuts against the lower plate 112.

[0119] In this way, cooling fin 13C, in which peaks 131, valleys 132, convex portions 133, and concave portions 134 are formed to be higher in height direction H than the above-described cooling fin 13, has longitudinal flow paths RL in the longitudinal direction L and lateral flow paths RS in the depth direction D, like the above-described cooling fin 13, but these flow paths are also formed to be higher in height than cooling fin 13. Therefore, cooling bodies 10C to 10E having cooling fin 13C and laminated cooler 1 constituted by cooling bodies 10C to 10E exhibit the same functions and effects as cooling bodies 10, 10A, 10B having cooling fin 13 described above and laminated cooler 1 constituted by cooling bodies 10, 10A, 10B.

[0120] In addition, the housing 11 has a flow space S that houses the cooling fin 13C inside so that the convex upper surface 1421 of the peak portion 131 and the concave lower surface 1432 of the valley portion 132 abut against the inner surface, so that the refrigerant 100 can efficiently flow through the longitudinal flow path RL formed by the valley portion 132 of the cooling fin 13C in the flow space S.

[0121] Furthermore, since the convex upper surfaces 1421 of the peaks 131 and the concave lower surfaces 1432 of the valleys 132 abut against the inner surface of the housing 11, heat is conducted to the valleys 132 via the housing 11, and heat can be efficiently exchanged with the refrigerant 100 flowing through the longitudinal flow paths RL formed by the valleys 132. This further improves the cooling effect of the cooling fins 13C.

[0122] Furthermore, the cooling elements 10, 10A, and 10B described above and the layered cooler 1 constituted by the cooling elements 10, 10A, and 10B are configured by accommodating the cooling fins 13 in the flow space S inside the housing 11. Alternatively, as shown in Fig. 15, the cooling fins 13 may not be accommodated in the flow space S of the housing 11, but may be attached directly to the electronic component 20, and the cooling fins 13 may be used as the cooling element 10F.

[0123] Fig. 15 is an explanatory diagram of a cooling element 10F in the third embodiment. In detail, Fig. 15(a) is a perspective view from above of the cooling element 10F attached to an electronic component 20, Fig. 15(b) is a view seen from the arrow EE in Fig. 15(a), Fig. 15(c) is a view seen from the arrow FF in Fig. 15(a), and Fig. 15(d) is a partially enlarged plan view of the cooling element 10F attached to an electronic component 20.

[0124] Cooling body 10F composed of cooling fins 13 is attached by an appropriate method to the surface of electronic component 20. Then, longitudinal flow paths RL and lateral flow paths RS are formed on the surface of upper side Hu of electronic component 20, i.e., on the upper side Hu of cooling fins 13 constituting cooling body 10F attached to component top surface 20a of electronic component 20, and between component top surface 20a and lower side Hd of cooling fins 13, respectively.

[0125] However, unlike the case where refrigerant 100 is circulated through cooling fins 13 arranged in the flow space S of housing 11, gaseous refrigerant is forced to circulate through cooling fins 13 by a blower or the like for cooling fins 13 attached to component top surface 20a of electronic component 20, and the gaseous refrigerant flows through longitudinal flow paths RL. This allows for a cooling effect associated with heat exchange achieved by refrigerant 100 flowing through cooling fins 13. Therefore, cooling element 10F formed of cooling fins 13 attached to component top surface 20a of electronic component 20 has the same functions and effects as cooling elements 10, 10A to 10E described above.

[0126] Although the cooling element 10F composed of the cooling fins 13 is attached to the upper surface 20a of the electronic component 20, it may be attached to a predetermined location on various high-temperature members or components, such as an internal combustion engine or its accessories, for cooling purposes, in addition to the electronic component 20. Furthermore, the predetermined location may not only be on the surface, but also on a recess, and the cooling element 10F may be placed in the recess. For example, a recess may be formed on the outer surface of an aluminum die-cast member, and the cooling element 10F may be placed in the recess.

[0127] Cooling body 10F is then fixed to the recess by brazing or the like, and a gaseous refrigerant is forced to flow through cooling fins 13 that make up cooling body 10F by a blower or the like. As a result, the flow of refrigerant 100 through cooling fins 13 produces a cooling effect through heat exchange, and cooling body 10F, which is made up of cooling fins 13 attached to the recess of the die-cast member, can produce the same effects and advantages as cooling bodies 10, 10A to 10E described above.

[0128] In the configuration of this invention and the correspondence with the above-mentioned embodiment, the heating element of this invention corresponds to the electronic component 20, Similarly, The predetermined direction corresponds to the longitudinal direction L, The cooling body corresponds to the cooling fins 13 and 13C. The thickness direction corresponds to the height direction H, The orthogonal direction corresponds to the depth direction D, The refrigerant corresponds to refrigerant 100, The coolant flow path corresponds to the longitudinal flow path RL, The flow path forming portion corresponds to the valley portion 132, The flow path formation body corresponds to the cooling fin 13, The vortex forming portion and the first vortex forming portion correspond to the valley-side concave portion 1342 (height-direction widening portion RLa), The first vortex corresponds to the first transverse vortex Vf, The second vortex corresponds to the second transverse vortex Vs, The second vortex forming portion corresponds to the mountain-side concave portion 1341 (depth direction widening portion RLb), The first refrigerant flow path corresponds to the longitudinal flow path RL, The first flow path forming portion corresponds to the valley portion 132, The second refrigerant flow path corresponds to the short-side flow path RS, The storage space corresponds to the circulation space S, The outer shell member corresponds to the housing 11, The intermediate plate corresponds to the intermediate plate 12, The refrigerant supply section corresponds to the inlet pipe 31, The refrigerant discharge part corresponds to the outlet pipe 32, Although the layered cooler corresponds to the layered cooler 1, the present invention is not limited to the configuration of the above-described embodiment, and many other embodiments can be obtained.

[0129] For example, in the above description, the electronic component 20 is a so-called semiconductor device for power control, such as a semiconductor element such as an insulated gate bipolar transistor (IGBT), but it may also be an electronic component such as a switching element such as a thyristor, a diode, or a MOSFET (metal-oxide-semiconductor field-effect transistor).In addition, instead of the electronic component 20, a heat-generating body may be an electronic board on which the electronic component 20 is mounted, an electric device in which the electronic component 20 is incorporated, a pipe through which a heated fluid flows, a fin of a heat sink or a cell of a storage battery, or even, for example, the main body or exhaust part of an internal combustion engine.

[0130] Furthermore, in order to form the first transverse vortex Vf and the second transverse vortex Vs, recesses such as a height-direction widening portion RLa formed by a concave lower surface 1432 and a depth-direction widening portion RLb formed by a convex lower surface 1431 are provided in the longitudinal flow path RL, but they may also be formed by convex portions protruding into the longitudinal flow path RL.

[0131] Furthermore, in the cooling fin 13 described above, the recessed portions 134 of the peak portions 131 are connected in the depth direction D to form the short-side flow paths RS extending in the depth direction D. However, as long as they function as depth-direction widening portions RLb that are widened in the depth direction D relative to the long-side flow paths RL, for example, a wall may be provided in the center of the recessed portions 134, so that the recessed portions 134 do not need to be connected.

[0132] Furthermore, in the above-described cooling fin 13, the height of the mountain-side convex portion 1331 relative to the valley-side convex portion 1332 and the height of the mountain-side concave portion 1341 relative to the valley-side concave portion 1342 are set to be equal, but the height of the mountain-side convex portion 1331 relative to the valley-side convex portion 1332 and the height of the mountain-side concave portion 1341 relative to the valley-side concave portion 1342 may be set to be different depending on desired conditions such as cooling performance. Similarly, although the widths of the peaks 131 and valleys 132 in the depth direction D are set to be the same, the widths of the peaks 131 and valleys 132 in the depth direction D may be set to be different depending on desired conditions such as cooling performance.

[0133] Furthermore, the length in the longitudinal direction L of the valley-side concave portion 1342 that constitutes the height-wise widening portion RLa and the mountain-side concave portion 1341 that constitutes the depth-wise widening portion RLb, or the ratio of the length in the longitudinal direction L of the convex portion 133 and the concave portion 134, may be set appropriately depending on the desired conditions such as cooling performance.

[0134] Furthermore, in the cooling body 10 described above, the cooling fins 13 arranged in the upper space S1 and the lower space S2 inside the housing 11 are arranged in opposite directions in the height direction H. However, the cooling fins 13 arranged in the upper space S1 and the lower space S2 inside the housing 11 may be arranged in the same direction.

[0135] In this case, the cooling fins 13 arranged in the lower space S2 are arranged so that the surface arranged on the uppermost side Hu, i.e., the convex upper surface 1421 of the upper surface 142 constituting the peak portion 131, abuts against the intermediate plate 12, and the surface arranged on the lowermost side Hd, i.e., the concave lower surface 1432 of the bottom surface 143 constituting the valley portion 132, abuts against the lower plate 112. Even in this case, the same effects as those of the cooling body 10 and the layered cooler 1 using the cooling body 10 described above can be achieved. [Explanation of symbols]

[0136] 1…Stacked cooler 10,10A~10F…Cooling body 11...Housing 12...Intermediate plate 13,13C...Cooling fins 20...Electronic components 31...Inlet pipe 32...Outlet pipe 100...refrigerant 132... Valley 1341... Mountain side concave part 1342... Valley side concave part D: Depth direction H: Height L...Longitudinal direction RL: Longitudinal flow channel RLa: Height direction widening section RLb: Depth direction widening section RS: Short-side flow channel S…Distribution space Vf…1st horizontal vortex Vs…Second horizontal vortex

Claims

1. A cooling element that is aligned in a predetermined direction with respect to a heating element and cools the heating element, A direction perpendicular to the predetermined direction and facing the heating element is defined as a thickness direction, A direction perpendicular to the predetermined direction and the thickness direction is defined as an orthogonal direction, a flow path forming body having a flow path forming portion that forms a refrigerant flow path through which the refrigerant flows in the predetermined direction is provided; The flow path forming portion is provided with a vortex forming portion that forms a vortex in the predetermined direction and along the thickness direction in the refrigerant flowing through the refrigerant flow path. Cooling body.

2. the vortex generating portion is a first vortex generating portion, and the vortex is a first vortex; The flow path forming portion is provided with a second vortex forming portion that forms a second vortex along the predetermined direction and the perpendicular direction in the refrigerant flowing through the refrigerant flow path. The cooling body according to claim 1 .

3. The flow path forming portions are arranged in parallel in the orthogonal direction, and The flow path forming portions adjacent to each other in the orthogonal direction are formed in opposite directions with respect to the thickness direction. The cooling body according to claim 2 .

4. The first vortex forming portion and the second vortex forming portion in the plurality of flow path forming portions arranged in parallel are formed at the same position in the predetermined direction. The cooling body according to claim 3 .

5. the refrigerant flow path is a first refrigerant flow path, and the flow path forming portion is a first flow path forming portion; the second vortex forming portions in the plurality of flow path forming portions arranged in parallel communicate with each other in the perpendicular direction, thereby forming a second refrigerant flow path in which the refrigerant flows in the perpendicular direction; The second vortex forming portion functions as a second flow path forming portion that forms the second refrigerant flow path. The cooling body according to claim 4.

6. An outer shell member is provided having an accommodation space for accommodating the flow path forming body therein so that a part of the flow path forming portion abuts against an inner surface thereof. The cooling body according to claim 1 .

7. an intermediate plate is provided to divide the accommodation space in the thickness direction; The flow path forming body is disposed in each of the storage spaces divided by the intermediate plate. The cooling body according to claim 6.

8. A plurality of cooling bodies according to claim 6 are stacked in the thickness direction, and the cooling bodies are connected to each other so that the coolant can be conducted therethrough, the electronic component as the heat generating body is disposed between the cooling bodies stacked in the thickness direction, a coolant supply unit that supplies the coolant to the cooling bodies stacked in the thickness direction; a coolant discharge portion through which the coolant is discharged from the cooling body; Stacked cooler.

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