Electronic unit and cooler

Abstract

To provide an electronic unit that achieves sufficient cooling effect.SOLUTION: An electronic unit 15U comprises a semiconductor switch 40 and a cooler 30. The cooler 30 is thermally connected to the cooling surface 40a of the semiconductor switch 40 and cools the semiconductor switch 40 using a cooling medium. The cooler 30 has a passage member 31 that forms a refrigerant passage 31a internally. The passage member 31 comprises an elastic sheet portion 320 and a support portion 310. The support portion 310 has higher rigidity than the elastic sheet portion 320 to support the elastic sheet portion 320. The elastic sheet portion 320 undergoes elastic deformation due to the pressure difference between the inside and outside of the refrigerant passage 31a and is pressed against the cooling surface 40a in its elastically deformed state.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The disclosure herein relates to an electronic unit having a cooler for cooling electronic components, and to a cooler for cooling electronic components. [Background technology]

[0002] Patent Document 1 describes a structure for cooling electronic components with a liquid refrigerant. Specifically, one end of a heat transfer member with high thermal conductivity is disposed in a passage for the liquid refrigerant. The other end of the heat transfer member is thermally connected to the electronic component. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-224576 Summary of the Invention [Problem to be solved by the invention]

[0004] In this type of cooling structure, it is necessary to increase the adhesion between the heat transfer member and the electronic component to obtain a sufficient cooling effect.

[0005] One disclosed object is to provide an electronic unit and a cooler that can provide sufficient cooling effect. [Means for solving the problem]

[0006] In order to achieve the above object, an electronic unit according to one aspect of the present disclosure comprises: a heat-generating electronic component (40); a cooler (30) thermally connected to the cooling surface (40a) of the electronic component and cooling the electronic component with a cooling medium; The cooler has a passage member (31) that defines a passage (31a) for a cooling medium therein, The passage member has an elastic sheet portion (320) that elastically deforms due to a pressure difference between the inside and outside of the passage, and a support portion (310) that is formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state.

[0007] According to the electronic unit, the thermal resistance between the passage member and the electronic components can be reduced, and therefore, the electronic unit can achieve a sufficient cooling effect.

[0008] In order to achieve the above object, a cooler according to one aspect of the present disclosure comprises: A cooler that is thermally connected to a cooling surface (40a) of a heat-generating electronic component (40) and cools the electronic component with a cooling medium, a passage member (31) that defines a passage (31a) for a cooling medium therein; The passage member has an elastic sheet portion (320) that elastically deforms due to a pressure difference between the inside and outside of the passage, and a support portion (310) that is formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state.

[0009] The above-described cooler can reduce the thermal resistance between the passage member and the electronic component, thereby achieving a sufficient cooling effect.

[0010] The reference numbers in parentheses above merely indicate an example of the correspondence with specific configurations in the embodiments described below, and do not in any way limit the technical scope. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram of a compressor to which an electronic unit according to a first embodiment is applied, and a refrigeration cycle to which the compressor is applied. [Figure 2] 2 is a plan view of the electronic unit shown in FIG. 1 as seen from above in a state where the electronic unit is mounted on a vehicle. [Figure 3]3 is a plan view of the electronic unit shown in FIG. 2 with the substrate removed. FIG. [Figure 4] 4 is a cross-sectional view taken along the dashed line indicated by IV-IV in FIG. 2, showing the cooler and the semiconductor switch in a state where no liquid refrigerant flows in. FIG. [Figure 5] FIG. 4 is a cross-sectional view showing the cooler and the semiconductor switch in a state in which liquid refrigerant has flowed in. [Figure 6] FIG. 10 is a cross-sectional view showing a cooler and a semiconductor switch according to a second embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing a cooler and a semiconductor switch according to a third embodiment. [Figure 8] FIG. 10 is a cross-sectional view showing a cooler and a semiconductor switch according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, several embodiments will be described with reference to the drawings. Note that, in each embodiment, corresponding components are denoted by the same reference numerals, and redundant description may be omitted.

[0013] (First embodiment) The refrigeration cycle 10 shown in FIG. 1 is configured so that a liquid refrigerant, which is a cooling medium, circulates through an electric compressor 11, a condenser 12, an expansion valve 13, and an evaporator 14 in this order. The electric compressor 11 compresses the refrigerant and discharges it in a high-temperature, high-pressure gas state. The condenser 12 cools the refrigerant by exchanging heat with outside air, condensing it into a low-temperature, high-pressure liquid state. The expansion valve 13 expands the refrigerant to a low temperature and low pressure. The evaporator 14 exchanges heat between the refrigerant and conditioned air, cooling the conditioned air. The refrigerant that has exchanged heat with the conditioned air flows into the electric compressor 11 in a low-pressure gas state, where it is compressed again by the electric compressor 11 and becomes a high-pressure gas.

[0014] As described above, low-temperature air conditioning (cold air) is generated by circulating the refrigerant using the electric compressor 11. For example, in the case of the refrigeration cycle 10 mounted on a vehicle, the generated cold air is sent into the vehicle cabin to cool the interior of the vehicle. Specific examples of the refrigerant include R-1234yf, propane, carbon dioxide, hydrocarbons, ammonia, and olefins.

[0015] The electric compressor 11 has a compressor and an electric motor 11a. The compressor is driven by the electric motor 11a, causing the compressor to compress and discharge the refrigerant. The electric motor 11a is driven by a supply of three-phase AC power. The electric compressor 11 is integrally provided with an inverter 15 and a control device (ECU 16).

[0016] The inverter 15 has a plurality of semiconductor switches 40 (see FIG. 2). The plurality of semiconductor switches 40 constitute an upper arm and a lower arm of an inverter circuit. This inverter circuit converts DC power into AC power and supplies it to the electric motor 11a. The semiconductor switches 40 are electronic components that generate heat when power is applied. The heated semiconductor switches 40 are cooled by the cooler 30. The inverter 15 and the cooler 30 are assembled together into a unit, which is configured as an electronic unit 15U.

[0017] The control device is also called ECU 16. ECU is an abbreviation for Electronic Control Unit. ECU 16 has a processor and a memory. The processor executes arithmetic processing in accordance with a program stored in the memory. Through this arithmetic processing, ECU 16 outputs a drive signal to inverter 15 and controls the operation of inverter 15. ECU 16 may be unitized by being included in electronic unit 15U.

[0018] 2 is a plan view of the electronic unit 15U mounted on a vehicle, viewed from above. The cooler 30 included in the electronic unit 15U includes a metal passage member 31. The passage member 31 defines a refrigerant passage 31a therein, which is a passage for liquid refrigerant. The liquid refrigerant flowing through the refrigerant passage 31a is supplied from the refrigeration cycle 10. For example, liquid refrigerant present in a portion of the refrigeration cycle 10 downstream of the expansion valve 13 and upstream of the evaporator 14 is supplied to the cooler 30.

[0019] An inlet pipe 32 and an outlet pipe 33 are attached to the passage member 31. The inlet pipe 32 defines an inlet passage 32a therein. The outlet pipe 33 defines an outlet passage 33a therein. Liquid refrigerant flows from the refrigeration cycle 10 into the refrigerant passage 31a through the inlet passage 32a, exchanges heat with the semiconductor switch 40, and then returns to the refrigeration cycle 10 through the outlet passage 33a. The inlet passage 32a communicates with a portion of the refrigeration cycle 10 downstream of the expansion valve 13 and upstream of the evaporator 14. The outlet passage 33a communicates with a portion of the refrigeration cycle 10 downstream of the evaporator 14 and upstream of the electric compressor 11.

[0020] The inverter 15 has semiconductor switches 40 and a substrate 50. The semiconductor switches 40 are mounted on the substrate 50. There are basically six semiconductor switches 40, which function as upper and lower arm circuits for each phase when converting direct current into three-phase alternating current. Note that FIG. 2 shows an example in which six semiconductor switches 40 are modularized into one package.

[0021] 3 is a plan view showing the state in which the substrate 50 has been removed from the electronic unit 15U. As shown in FIG. 3, the passage member 31 is provided with a plurality of bosses 31b. The substrate 50 is fixed to the passage member 31 by fastening the bolts 51 shown in FIG. 2 to these bosses 31b. Furthermore, a power supply connector 52 is supported on the passage member 31. The power supply connector 52 is connected to a secondary battery mounted on the vehicle. DC power from the secondary battery is supplied to the inverter 15 through the power supply connector 52.

[0022] As shown in FIG. 4, the passage member 31 has a recess formed therein into which the semiconductor switch 40 is inserted. The recess is formed by a side wall portion and a bottom wall portion. The bottom wall portion corresponds to the elastic sheet portion 320, which will be described in detail later. The side wall portion corresponds to the support portion 310 that supports the elastic sheet portion 320. The support portion 310 has an annular shape that surrounds the side surface 40b of the semiconductor switch 40. The elastic sheet portion 320 faces the bottom surface (cooling surface 40a) of the semiconductor switch 40.

[0023] The semiconductor switch 40 has a semiconductor element, a heat dissipation plate, terminals 41, and molded resin. The entire semiconductor element and part of the terminals 41 are sealed in molded resin. The heat dissipation plate is a metal plate. One surface of the heat dissipation plate is thermally connected to the semiconductor element. The other surface of the heat dissipation plate is exposed from the molded resin. The side surface 40b of the semiconductor switch 40 mentioned above is provided by the side surface of the molded resin. The bottom surface of the semiconductor switch 40 is provided by the other surface of the heat dissipation plate and corresponds to the cooling surface 40a.

[0024] The multiple terminals 41 include an input terminal, an output terminal, and a control terminal. The input terminal is a terminal to which DC power from a secondary battery is input. The output terminal is a terminal that outputs AC power converted by the inverter circuit. The control terminal is a terminal to which a signal commanding the on / off operation of the semiconductor switch 40 is input. One end of these terminals 41 is connected to the semiconductor element.

[0025] As shown in Fig. 4, the other end of terminal 41 extends from the surface of the molded resin opposite to cooling surface 40a. The other end of terminal 41 is connected to substrate 50. Substrate 50 according to this embodiment is provided with a high-voltage circuit to which input terminals and output terminals are connected, and a low-voltage circuit to which control terminals are connected. Alternatively, the substrate for the high-voltage circuit and the substrate for the low-voltage circuit may be provided separately.

[0026] The passage member 31 has the support portion 310 and the elastic sheet portion 320 described above. Both the support portion 310 and the elastic sheet portion 320 are made of resin. The resin used for the support portion 310 is more rigid than the elastic sheet portion 320. The resin used for the elastic sheet portion 320 is elastically deformable. The thickness of the elastic sheet portion 320 is thinner than the thickness of the support portion 310.

[0027] In this embodiment, the support portion 310 and the elastic sheet portion 320 are resin-molded by injecting molten resin into a mold in the same process (so-called two-color molding). Alternatively, the support portion 310 and the elastic sheet portion 320 may be resin-molded in separate processes. In this case, the elastic sheet portion 320 is attached to the support portion 310. This attachment may be performed using an adhesive or a member that presses the elastic sheet portion 320 against the support portion 310. In either case, the elastic sheet portion 320 is supported at the tip of the support portion 310. The elastic sheet portion 320 and the support portion 310 are connected in a manner that prevents leakage of the liquid refrigerant.

[0028] The inner surface of the support portion 310 functions as a passage wall surface of the refrigerant passage 31a. The outer surface 310a of the support portion 310 faces the side surface 40b of the semiconductor switch 40. In this way, the support portion 310 restricts the semiconductor switch 40 from moving in a direction perpendicular to the up-down direction. The semiconductor switch 40 may be press-fitted and fixed to the outer surface 310a of the support portion 310. The side surface 40b of the semiconductor switch 40 may be disposed on the support portion 310 with a gap formed between it and the outer surface 310a.

[0029] The inner surface of the elastic sheet portion 320 functions as a passage wall surface of the refrigerant passage 31a. The outer surface of the elastic sheet portion 320 faces the cooling surface 40a of the semiconductor switch 40. The elastic sheet portion 320 elastically deforms so as to bulge toward the semiconductor switch 40 under the pressure of the liquid refrigerant flowing through the refrigerant passage 31a. Note that FIG. 4 shows the cooler 30 in a state where no liquid refrigerant has flowed into the refrigerant passage 31a. Therefore, the elastic sheet portion 320 is not elastically deformed. In contrast, in FIG. 5, liquid refrigerant has flowed into the refrigerant passage 31a, and the elastic sheet portion 320 is elastically deformed under the pressure of the liquid refrigerant.

[0030] 4, when the elastic sheet portion 320 is not elastically deformed, the elastic sheet portion 320 is not in contact with the cooling surface 40a. In other words, a gap is formed between the elastic sheet portion 320 and the cooling surface 40a. In contrast, when the elastic sheet portion 320 is not elastically deformed, the elastic sheet portion 320 may be in contact with the cooling surface 40a.

[0031] As shown in FIG. 5, when the elastic sheet portion 320 is elastically deformed, the elastic sheet portion 320 is pressed against the cooling surface 40a. As shown in FIG. 3, the elastic sheet portion 320 has a rectangular shape that conforms to the outer shape of the semiconductor switch 40 in a top view. The rectangular outer edge of the elastic sheet portion 320 is integrated with the support portion 310. In a top view, the elastic sheet portion 320 is sized to include the entire cooling surface 40a. In other words, the entire cooling surface 40a is included within the range obtained by projecting the elastic sheet portion 320 in a direction perpendicular to the sheet surface of the elastic sheet portion 320. In this embodiment, the elastic sheet portion 320 has the same shape and size as the cooling surface 40a.

[0032] 5, when elastic sheet portion 320 is elastically deformed, the central portion of elastic sheet portion 320 is in close contact with cooling surface 40a. In contrast, the outer peripheral portion of elastic sheet portion 320 is supported by support portion 310 and is therefore not in contact with cooling surface 40a. The area of ​​the portion of elastic sheet portion 320 that is in close contact with cooling surface 40a is larger than the area of ​​the non-contact portion.

[0033] When the inverter 15 is driven to supply power to the electric compressor 11, the refrigerant circulates through the refrigeration cycle 10. This generates cool air and cools the vehicle interior. At this time, the semiconductor element of the semiconductor switch 40, which constitutes the inverter circuit, generates heat as electricity is applied. The heat generated by the semiconductor element is transferred in order to the heat dissipation plate that provides the cooling surface 40a and to the elastic sheet portion 320. The heat transferred to the elastic sheet portion 320 is then transferred to the liquid refrigerant drawn from the refrigeration cycle 10 into the refrigerant passage 31a. In other words, the semiconductor switch 40 is cooled by the liquid refrigerant, and a temperature rise is suppressed.

[0034] <Summary of the first embodiment> As described above, the electronic unit 15U according to this embodiment includes a cooler 30 that cools the semiconductor switch 40 with a liquid refrigerant. The cooler 30 is thermally connected to the cooling surface 40a of the semiconductor switch 40. The cooler 30 has a passage member 31 that defines a refrigerant passage 31a therein. The passage member 31 has an elastic sheet portion 320 and a support portion 310. The elastic sheet portion 320 elastically deforms due to the pressure difference between the inside and outside of the refrigerant passage 31a. The support portion 310 is formed with higher rigidity than the elastic sheet portion 320 so as to support the elastic sheet portion 320. The elastic sheet portion 320 is pressed against the cooling surface 40a in an elastically deformed state.

[0035] This allows the semiconductor switch 40 to be tightly attached to the passage member 31 with a simple structure, while eliminating the need for a structure that presses the semiconductor switch 40 against the passage member 31 using a leaf spring. In other words, the thermal resistance between the passage member 31 and the semiconductor switch 40 can be reduced with a simple structure. Therefore, the cooler 30 according to this embodiment can achieve a sufficient cooling effect with a simple structure. In addition, in the aforementioned Patent Document 1, the cooler is equipped with a bimetal that reversibly deforms depending on temperature and a differential pressure sensor that senses the pressure difference of the refrigerant. In this case, a bimetal and a differential pressure sensor are required, and a structure for sealing the bimetal is also required. In this embodiment, the semiconductor switch 40 is tightly attached to the passage member 31 with a simple structure, while eliminating the need for the bimetal and differential pressure sensor.

[0036] Contrary to this embodiment, it is also possible to press the elastic sheet 320 against the semiconductor switch 40 by reducing the pressure of the air on the surface of the elastic sheet 320 facing the semiconductor switch 40. However, if such a reduction in pressure is attempted to create a pressure difference between the inside and outside of the elastic sheet 320, the pressing force will vary due to the influence of ambient temperature. This will result in inconsistent adhesion of the semiconductor switch 40 to the passage member 31. In contrast, in this embodiment, liquid refrigerant discharged from the electric compressor 11 is allowed to flow into the refrigerant passage 31a. In other words, liquid refrigerant at a pressure higher than atmospheric pressure is allowed to flow into the refrigerant passage 31a. The pressure of the liquid refrigerant then presses the elastic sheet 320 against the cooling surface 40a. This ensures adhesion without being affected by ambient temperature.

[0037] Furthermore, in this embodiment, the liquid refrigerant used in the cooler 30 is the liquid refrigerant compressed by the electric compressor 11 and circulated through the refrigeration cycle 10. The semiconductor switch 40 constitutes an inverter circuit that converts direct current to alternating current and supplies the converted current to the electric compressor 11. As a result, the greater the current flowing through the semiconductor switch 40, the higher the temperature of the semiconductor switch 40 becomes, but the greater the amount of power supplied to the electric compressor 11 becomes. In other words, the load on the semiconductor switch 40 becomes higher when the electric compressor 11 is under high load. Therefore, as the temperature of the semiconductor switch 40 increases, the discharge pressure of the liquid refrigerant from the electric compressor 11 also increases, improving the adhesion between the cooler 30 and the semiconductor switch 40. Furthermore, as the temperature of the semiconductor switch 40 increases, the temperature of the liquid refrigerant decreases. Therefore, as the temperature of the semiconductor switch 40 increases, the cooling performance of the cooler 30 improves, thereby improving the reliability of preventing the semiconductor switch 40 from becoming abnormally high temperature.

[0038] Furthermore, in this embodiment, the elastic sheet portion 320 is large enough to include the entire cooling surface 40a. This increases the area of ​​the portion of the cooling surface 40a that is in close contact with the elastic sheet portion 320. This improves the cooling performance of the cooler 30.

[0039] (Second embodiment) In the first embodiment, the elastic sheet portion 320 is large enough to include the entire cooling surface 40a. In contrast, in the present embodiment shown in Fig. 6, the elastic sheet portion 320 is smaller than the cooling surface 40a. In other words, the outer periphery of the cooling surface 40a extends beyond the range obtained by projecting the elastic sheet portion 320 in a direction perpendicular to the sheet surface of the elastic sheet portion 320. In other words, the entire elastic sheet portion 320 is included within the range obtained by projecting the cooling surface 40a in a direction perpendicular to the sheet surface.

[0040] 6, the support portion 310 has a frame portion 311 that faces the cooling surface 40a. The frame portion 311 has a ring-shaped shape that extends along the outer edge of the elastic sheet portion 320. The frame portion 311 supports the outer edge of the elastic sheet portion 320.

[0041] In this embodiment, similarly to the first embodiment, the elastic sheet portion 320 is elastically deformed by the liquid refrigerant and pressed against the cooling surface 40a, so that a sufficient cooling effect can be achieved with a simple structure.

[0042] Furthermore, in this embodiment, the elastic sheet portion 320 is smaller than the cooling surface 40a, which improves the strength of the elastic sheet portion 320 and improves the durability of the elastic sheet portion 320.

[0043] (Third embodiment) In the first embodiment, the elastic sheet portion 320 is the same size as the cooling surface 40a. In contrast, in the present embodiment shown in Fig. 7, the elastic sheet portion 320 is larger than the cooling surface 40a. In other words, the outer periphery of the elastic sheet portion 320 extends beyond the range of the cooling surface 40a projected in a direction perpendicular to the sheet surface of the elastic sheet portion 320. In other words, the entire cooling surface 40a is included within the range of the elastic sheet portion 320 projected in a direction perpendicular to the sheet surface.

[0044] As shown in FIG. 7, the outer surface 310a of the support portion 310 faces the side surface 40b of the semiconductor switch 40, but a gap is formed between the side surface 40b and the outer surface 310a.

[0045] In this embodiment, as in the first embodiment, the elastic sheet portion 320 is elastically deformed by the liquid refrigerant and pressed against the cooling surface 40a, thereby achieving a sufficient cooling effect with a simple structure. Furthermore, in this embodiment, the elastic sheet portion 320 is larger than the cooling surface 40a. This reduces the area of ​​the portion of the cooling surface 40a that is not in close contact with the elastic sheet portion 320. Alternatively, the entire cooling surface 40a can be in close contact with the elastic sheet portion 320. This improves the cooling performance of the cooler 30.

[0046] (Fourth embodiment) In the present embodiment shown in FIG. 8, the support portion 310 has an engagement portion 312. The engagement portion 312 is also called a snap-fit ​​engagement claw. When the semiconductor switch 40 is inserted into a predetermined position in the support portion 310, the engagement portion 312 elastically deforms without engaging with the semiconductor switch 40. This allows the semiconductor switch 40 to climb over the engagement portion 312 and be inserted into the predetermined position.

[0047] After the semiconductor switch 40 is inserted into the predetermined position, the engaging portion 312 engages with the semiconductor switch 40. This engagement restricts the semiconductor switch 40 from moving from the predetermined position toward the opposite side of the elastic sheet portion 320. In other words, the engaging portion 312 functions as a restricting member that restricts the semiconductor switch 40 from moving when pressed by the elastic sheet portion 320.

[0048] As described above, this embodiment includes the engagement portion 312 that functions as a restricting member. Therefore, it is possible to restrict movement of the semiconductor switch 40 due to the pressing of the elastic sheet portion 320. This improves the adhesion of the elastic sheet portion 320 to the semiconductor switch 40 when pressed, thereby improving the cooling performance of the cooler 30.

[0049] (Other embodiments) Although multiple embodiments of the present disclosure have been described above, not only the combinations of configurations explicitly stated in the description of each embodiment but also partial combinations of configurations of multiple embodiments can be made without explicit statements, as long as there are no particular problems with the combinations. Furthermore, combinations of configurations described in multiple embodiments and modified examples that are not explicitly stated are also considered to be disclosed by the following description.

[0050] In each of the above embodiments, the pressure on the inner surface side of the elastic sheet portion 320 is made higher than the pressure on the outer surface side, thereby generating a pressure difference between the inside and outside of the elastic sheet portion 320. In contrast to this, the pressure on the outer surface side of the elastic sheet portion 320 may be made lower than the pressure on the inner surface side, thereby generating a pressure difference between the inside and outside of the elastic sheet portion 320. For example, the pressure in the atmosphere around the semiconductor switch 40 may be reduced below atmospheric pressure, thereby elastically deforming the elastic sheet portion 320 and pressing it against the cooling surface 40a.

[0051] In each of the above embodiments, the refrigerant of the refrigeration cycle 10 is used as the cooling medium for cooling the semiconductor switch 40. However, a liquid refrigerant different from the refrigerant of the refrigeration cycle 10 may be used for cooling the semiconductor switch 40. For example, the coolant used to cool an internal combustion engine mounted on a vehicle may be used for cooling the semiconductor switch 40. Alternatively, a liquid refrigerant dedicated to cooling the semiconductor switch 40 may be used. The cooling medium may be water or gas.

[0052] In each of the above embodiments, the semiconductor switch 40 is applied as the electronic component to be cooled by the cooler 30. However, the electronic component to be cooled may be another electronic component other than the semiconductor switch 40, as long as it generates heat when powered on. Furthermore, the electronic component to be cooled by the cooler 30 may be a component that generates heat without being powered on.

[0053] In each of the above embodiments, the elastic sheet portion 320 has electrical insulation properties, and therefore no separate electrical insulating material is provided between the semiconductor switch 40 and the elastic sheet portion 320. However, an electrical insulating material may be interposed between the semiconductor switch 40 and the elastic sheet portion 320. In this case, the semiconductor switch 40 does not come into direct contact with the elastic sheet portion 320, and the elastic sheet portion 320 does not need to have electrical insulation properties.

[0054] In each of the above embodiments, one elastic sheet portion 320 is provided for one semiconductor switch 40. However, one elastic sheet portion 320 may be provided for multiple semiconductor switches 40. In other words, a structure may be adopted in which multiple semiconductor switches 40 are in close contact with one elastic sheet portion 320.

[0055] In each of the above embodiments, the passage member 31 is formed integrally with the case that houses the electric motor 11a. That is, a part of the case that houses the electric motor 11a functions as the passage member 31. However, the passage member 31 may be separate from the case.

[0056] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0057] (Technical thought 1) a heat-generating electronic component (40); a cooler (30) thermally connected to the cooling surface (40a) of the electronic component and cooling the electronic component with a cooling medium; The cooler has a passage member (31) that defines a passage (31a) for the cooling medium therein, The passage member is an elastic sheet portion (320) that is elastically deformed by the pressure difference between the inside and outside of the passage; a support portion (310) formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state.

[0058] (Technical thought 2) The electronic unit according to Technical Idea 1, wherein the elastic sheet portion is pressed against the cooling surface by causing the cooling medium to flow into the passage at a pressure higher than atmospheric pressure.

[0059] (Technical Thought 3) The cooling medium is compressed by an electric compressor (11) and circulated through a refrigeration cycle (10). The electronic unit according to Technical Idea 2, wherein the electronic component constitutes an inverter circuit that converts direct current into alternating current and supplies the converted alternating current to the electric compressor.

[0060] (Technical Thought 4) The electronic unit according to any one of Technical Ideas 1 to 3, further comprising a restricting member (312) that restricts movement of the electronic component due to the pressure of the elastic sheet portion.

[0061] (Technical Thought 5) The electronic unit according to any one of Technical Concepts 1 to 4, wherein the elastic sheet portion is large enough to include the entire cooling surface.

[0062] (Technical Thought 6) The electronic unit according to any one of Technical Concepts 1 to 4, wherein the elastic sheet portion is smaller in size than the cooling surface.

[0063] (Technical Thought 7) A cooler that is thermally connected to a cooling surface (40a) of a heat-generating electronic component (40) and cools the electronic component with a cooling medium, a passage member (31) that defines a passage (31a) for the cooling medium therein; The passage member is an elastic sheet portion (320) that is elastically deformed by the pressure difference between the inside and outside of the passage; a support portion (310) formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state. [Explanation of symbols]

[0064] 10 Refrigeration cycle, 11 Electric compressor, 30 Cooler, 31 Passage member, 310 Support portion, 312 Regulating member, 31a Passage, 320 Elastic sheet portion, 40 Electronic component, 40a Cooling surface

Claims

1. a heat-generating electronic component (40); a cooler (30) that is thermally connected to the cooling surface (40a) of the electronic component and cools the electronic component with a cooling medium; The cooler has a passage member (31) that forms a passage (31a) for the cooling medium therein, The passage member is an elastic sheet portion (320) that is elastically deformed by the pressure difference between the inside and outside of the passage; a support portion (310) formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state.

2. 2. The electronic unit according to claim 1, wherein the elastic sheet portion is pressed against the cooling surface by causing the cooling medium to flow into the passage at a pressure higher than atmospheric pressure.

3. The cooling medium is compressed by an electric compressor (11) and circulated through a refrigeration cycle (10), 3. The electronic unit according to claim 2, wherein the electronic components form an inverter circuit that converts direct current into alternating current and supplies the converted alternating current to the electric compressor.

4. 4. The electronic unit according to claim 1, further comprising a restricting member (312) that restricts movement of the electronic component due to the pressure of the elastic sheet portion.

5. 4. The electronic unit according to claim 1, wherein the elastic sheet portion is large enough to include the entire cooling surface.

6. 4. The electronic unit according to claim 1, wherein the elastic sheet portion is smaller than the cooling surface.

7. A cooler that is thermally connected to a cooling surface (40a) of a heat-generating electronic component (40) and cools the electronic component with a cooling medium, a passage member (31) that forms a passage (31a) for the cooling medium therein; The passage member is an elastic sheet portion (320) that is elastically deformed by the pressure difference between the inside and outside of the passage; a support portion (310) formed to have higher rigidity than the elastic sheet portion so as to support the elastic sheet portion, The elastic sheet portion is pressed against the cooling surface in an elastically deformed state.

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