Sound Generator
Patent Information
- Application Number
- JP2024549441
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-12-30
- Filing Date
- 2023-03-24
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2043-03-24
Smart Images

Figure 2025506548000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates to the field of acoustics, and in particular to acoustic generating units.
[0002] [Incorporated by reference] This application claims priority to a Chinese patent application having application number 202211336918.4 filed on October 28, 2022, priority to a Chinese patent application having application number 202223239628.6 filed on December 1, 2022, and priority to an international application having application number PCT / CN2022 / 144339 filed on December 30, 2022, the entire contents of which are incorporated herein by reference. [Background technology]
[0003] With the development of sound output technology, sound generating units (e.g., earphones) are widely applied in people's daily life, and by using them with electronic devices such as mobile phones and computers, users can enjoy a feast of hearing. The output performance of the sound generating unit has a great impact on the user's comfort of use. The structure of the diaphragm in the sound generating unit and the support structure cooperating with the diaphragm usually affect the output performance of the sound generating unit. Summary of the Invention [Problem to be solved by the invention]
[0004] Therefore, it is necessary to provide a sound generating unit having high output performance. [Means for solving the problem]
[0005] The sound generating unit according to an embodiment of the present specification includes a diaphragm, a magnetic circuit assembly, a coil, and a support frame arranged to surround the magnetic circuit assembly, the coil is connected to the diaphragm and at least a portion of the coil is located in a magnetic gap formed by the magnetic circuit assembly, the coil vibrates the diaphragm when current is applied to generate sound, the diaphragm includes a main body region and an edge region surrounding the main body region, a first portion of the support frame is connected to the edge region, a thickness of the first portion is within a range of 0.3 mm to 3 mm, and the thickness of the first portion is the minimum distance in the vibration direction of the diaphragm between a connection region between the support frame and the edge region and a region of the support frame directly attached to the magnetic circuit assembly.
[0006] In some embodiments, the main body region includes a first inclined portion and a first connection portion connected to the coil, the first inclined portion being bonded to a portion of the edge region, and the first inclined portion being inclined in a direction away from the coil relative to the first connection portion.
[0007] In some embodiments, the edge region includes a second beveled portion, the second beveled portion being at least partially attached to the first beveled portion.
[0008] In some embodiments, the second tapered portion is located on a side of the first tapered portion away from the coil.
[0009] In some embodiments, the edge region includes an arcuate portion, and a ratio of a height of the arcuate portion to a span of the arcuate portion is in the range of 0.35 to 0.4.
[0010] In some embodiments, an inclination angle of the first inclined portion with respect to the first connection portion is within a range of 5° to 30°, and the first connection portion is perpendicular to a vibration direction of a vibrating membrane.
[0011] In some embodiments, the body region includes a dome located at one end away from the first sloped portion of the first connection portion, the span of the dome being in the range of 2 mm to 8 mm, and the height of the dome being in the range of 0.7 mm to 1.2 mm.
[0012] In some embodiments, the height to span ratio of the dome is in the range of 0.1 to 0.3.
[0013] In some embodiments, the frequency at which the high frequency splitting vibrations occur is 20 kHz or higher.
[0014] In some embodiments, the magnetic circuit assembly includes a housing member, and within an input voltage range of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz, the distance from the bottom of the coil to the bottom of the housing member is within a range of 0.8 mm to 0.9 mm.
[0015] In some embodiments, the acoustic generating portion further includes a support frame disposed around the magnetic circuit assembly, a first portion of the support frame being connected to a second connection portion of the edge region.
[0016] In some embodiments, the second connection portion of the edge region is connected to the first portion of the support frame by a fixing ring.
[0017] In some embodiments, the sound generating unit further includes a housing having a decompression hole, a back cavity is formed between the decompression hole and a rear surface of the vibrating membrane, and the resonant frequency of the back cavity is 3.3 kHz or more.
[0018] In some embodiments, the volume of the back cavity is 60 mm 3 ~110mm 3 is within the range.
[0019] In some embodiments, the sound generating unit further includes a housing having a decompression hole, a plurality of air vents are formed in the support frame, sound from the rear surface of the diaphragm is transmitted to the decompression hole through the plurality of air vents, the plurality of air vents include at least a first air vent and a second air vent, a distance from a center of the first air vent to a center of the decompression hole is greater than a distance from a center of the second air vent to a center of the decompression hole, and an area of the first air vent is greater than an area of the second air vent.
[0020] In some embodiments, the sound generating unit further includes a housing having a decompression hole, a plurality of air vents are formed in the support frame, sound from the rear surface of the diaphragm is transmitted to the decompression hole through the plurality of air vents, and in the vibration direction of the diaphragm, a ratio of a total area of the plurality of air vents to a projected area of the diaphragm is within a range of 0.008 to 0.3.
[0021] In some embodiments, the projected area of the diaphragm in the direction of vibration of the diaphragm is 90 mm 2 ~560mm 2 and the total area of the plurality of vents is within the range of 4.54 mm 2 ~12.96mm 2 is within the range.
[0022] In some embodiments, the sound generating unit further includes a housing, and a ratio of a projected area of the diaphragm to a projected area of the housing in a vibration direction of the diaphragm is 0.5 or more.
[0023] In some embodiments, the ratio of the projected area of the diaphragm to the projected area of the housing in the vibration direction of the diaphragm is in the range of 0.8 to 0.95.
[0024] In some embodiments, the diaphragm has a major axis dimension in the range of 13 mm to 25 mm and a minor axis dimension in the range of 4 mm to 13 mm.
[0025] In some embodiments, a plurality of ventilation holes are formed in a bottom wall of the housing member of the magnetic circuit assembly or in a side wall attached to the support frame.
[0026] In some embodiments, the dome is woven from interlaced carbon fibers, with at least some of the carbon fibers interlaced at a first angle in the range of 45° to 90°.
[0027] In some embodiments, the thickness of the dome in the direction of vibration of the membrane is less than 80 μm.
[0028] In some embodiments, the minimum distance from the coil to the first tapered portion is greater than or equal to 0.3 mm.
[0029] In some embodiments, the magnetic circuit assembly includes a magnetic plate and a magnet, the magnetic plate being located between the magnet and the vibration membrane and attached to the surface of the magnet, and in the vibration direction of the vibration membrane, the distance between the center of the coil and the center of the magnetic plate is less than 0.3 mm.
[0030] In some embodiments, the distance from the lowest point of the dome to the upper surface of the magnetically permeable plate in the direction of vibration of the diaphragm is greater than 0.8 mm.
[0031] In some embodiments, the magnetic circuit assembly includes a housing member, and a distance between a bottom of the coil and a bottom wall of the housing member in a vibration direction of a diaphragm is within a range of 0.2 mm to 4 mm.
[0032] In some embodiments, the distance between the coil and the side wall of the housing member is in the range of 0.1 mm to 0.5 mm.
[0033] The present specification will be further illustrated by exemplary embodiments, which are not limiting and will be described in detail with reference to the drawings, in which like reference numerals indicate like structures. [Brief description of the drawings]
[0034] [Figure 1] 1 is a schematic diagram of an exemplary ear in accordance with some embodiments of the present application. [Diagram 2] FIG. 1 is an exemplary schematic wearing diagram of an open-type earphone in accordance with some embodiments of the present disclosure. [Diagram 3] FIG. 1 is an exemplary schematic wearing diagram of an open-type earphone in accordance with some embodiments of the present disclosure. [Figure 4] FIG. 13 is an exemplary wearing diagram of another open-type earphone in accordance with some embodiments of the present disclosure. [Diagram 5] FIG. 13 is an exemplary schematic distribution diagram of a cavity structure installed around one of the dual sound sources, according to some embodiments of the present disclosure. [Figure 6] 1 is a schematic diagram of an example internal structure of a sound generating unit according to some embodiments of the present disclosure. [Figure 7] 1 is an example external view of a transducer in accordance with some embodiments of the present disclosure. [Figure 8] FIG. 2 illustrates an exemplary exploded view of a transducer in accordance with some embodiments of the present disclosure. [Figure 9] 2 is an exemplary internal structural diagram of a sound generating unit according to some embodiments of the present disclosure; FIG. [Figure 10] 1 is an exemplary structural diagram of a diaphragm according to some embodiments of the present disclosure. [Figure 11A] 1 is a schematic diagram of an exemplary high frequency bandwidth of an acoustic generating unit according to some embodiments of the present disclosure. [Figure 11B] FIG. 2 is a schematic diagram of an exemplary carbon fiber weave structure according to certain embodiments herein. [Figure 12] 13 is a schematic diagram of the amplitude of an acoustic generator at different driving voltages according to some embodiments of the present disclosure. [Figure 13] 2 is an example structural diagram of a back cavity according to some embodiments of the present disclosure. [Figure 14] FIG. 11 illustrates a frequency response curve diagram of a back cavity corresponding to different thicknesses of the first portion, according to certain embodiments herein. [Figure 15] 4A-4C are frequency response curve diagrams of an acoustic generating unit at different driving voltages, according to some embodiments of the present disclosure. [Figure 16] 1 is an example schematic location diagram of a support frame, a first vacuum hole, and a second vacuum hole, according to some embodiments herein; FIG. [Figure 17] 11 illustrates frequency response curves of a back cavity corresponding to different total areas of vent holes, according to certain embodiments herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0035] In order to more clearly describe the technical means of the embodiments of the present specification, the drawings necessary for the description of the embodiments will be briefly described below. Obviously, the drawings described below are only some of the examples or embodiments of the present specification, and those skilled in the art can apply the present specification to other similar scenarios based on these drawings without creative efforts. Unless otherwise clear from the language environment or otherwise described, the same symbols in the drawings represent the same structures or operations.
[0036] It should be understood that the terms "system," "apparatus," "unit," and / or "module" used herein are ways of distinguishing between different levels of assemblies, elements, components, parts, or structures, however, other terms may be used in place of the above terms if they achieve the same purpose.
[0037] As used in this specification and claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "containing" are merely intended to indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not intended to be an exclusive listing, and a method or apparatus may include other steps or elements.
[0038] It should be noted that in the description of this specification, the terms "first", "second", "third", "fourth", etc. are for explanatory purposes only and should not be understood as indicating or suggesting the relative importance or the quantity of the technical features shown. Thus, a feature defined by "first", "second", "third", "fourth" may explicitly or implicitly indicate that it includes at least one of the feature. In the description of this specification, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.
[0039] In this specification, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense. For example, unless otherwise clearly limited, the term "connected" may be a fixed connection, a removable connection, or an integral connection, may be a mechanical connection or an electrical connection, may be a direct connection, may be an indirect connection via an intermediate medium, may be an internal communication between two elements, or may be an interactive relationship between two elements. A person skilled in the art can understand the specific meaning of the above terms in this specification according to the specific situation.
[0040] Flowcharts are used herein to describe operations performed by the system according to the embodiments of the present invention. It should be understood that the preceding and subsequent operations are not necessarily performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to these processes, or one or more operations may be removed from these processes.
[0041] FIG. 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. As shown in FIG. 1, the ear 100 may include an ear canal 101, a concha cavity 102, a concha scapula 103, a triangular fossa 104, an antihelix 105, a scapha 106, a helix 107, an earlobe 108, and a crus helix 109. In some embodiments, the attachment and stability of an acoustic device can be achieved by one or more parts of the ear 100. In some embodiments, parts such as the ear canal 101, the concha cavity 102, the concha scapula 103, and the triangular fossa 104 have certain depths and volumes in three-dimensional space, and can realize the attachment needs of the acoustic device. For example, an acoustic device (e.g., an in-ear type earphone) may be attached to the ear canal 101. In some embodiments, the attachment of the acoustic device can be realized by other parts of the ear 100 other than the ear canal 101. For example, the acoustic device can be attached by the concha scapula 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, and the helix 107, or a combination thereof. In some embodiments, the user's earlobe 108 can be further utilized to improve the comfort and reliability of the acoustic device. The acoustic device can be attached and sound can be transmitted by other parts of the ear 100 other than the ear canal 101, and the user's ear canal 101 can be "opened" to reduce the impact of the acoustic device on the user's ear health. When the user wears the acoustic device on the road, the acoustic device does not block the user's ear canal 101, and the user can hear the sound from the acoustic device as well as the sound from the environment (e.g., horn sounds, bicycle bell sounds, voices of people around, traffic control voices, etc.), thereby reducing the probability of traffic accidents. For example, when the user wears the acoustic device, the entire or partial structure of the acoustic device can be located in front of the helical crus 109 (e.g., the area J surrounded by the dashed line in FIG. 1). Also, for example, when a user is wearing an acoustic device, all or part of the structure of the acoustic device may contact the upper part of the ear canal 101 (e.g., at the location of one or more areas such as the crus helix 109, the concha navicularis 103, the triangular fossa 104, the antihelix 105, the navicular fossa 106, and the helix 107).Further, for example, when a user is wearing an acoustic device, all or part of the structure of the acoustic device may be located within one or more regions of the ear (e.g., the concha cavity 102, the concha scapha 103, and the triangular fossa 104, etc.) (e.g., areas M1 and M2 surrounded by dashed lines in FIG. 1).
[0042] Furthermore, different users may have individual differences, so that ears have different shapes, sizes, and other dimensional differences. For ease of explanation and understanding, unless otherwise specified, this specification mainly uses an ear model having a "standard" shape and size as a reference to further describe the mounting method of the acoustic device to the ear model in different embodiments. For example, a simulator including a head and its (left and right) ears manufactured according to ANSI: S3.36, S3.25 and IEC: 60318-7 standards, such as GRAS KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, can be used as a reference for mounting the acoustic device, thereby showing the scene in which most users normally mount the acoustic device. Taking GRAS KEMAR as an example, the ear simulator may be any of GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG, etc. Taking HEAD Acoustics as an example, the ear simulator may be any of HMS II.3, HMS II.3 LN, HMS II.3LN HEC, etc. In the examples of the present specification, the measured data range is measured based on GRAS 45BC KEMAR, but it should be understood that there may be differences between different head and ear models, and other models may have a variation of ±10% in the relevant data range. By way of example only, the reference ear may have a characteristic that the vertical axis dimension of the projection of the pinna onto the sagittal plane may be within a range of 49.5 mm to 74.3 mm, and the sagittal axis dimension of the projection of the pinna onto the sagittal plane may be 36.6 mm to 55 mm. The projection of the pinna onto the sagittal plane is the projection of the edge of the pinna onto the sagittal plane. The edge of the pinna consists of at least the outer contour of the helix, the contour of the earlobe, the contour of the tragus, the intertragal notch, the antitragal apex, the antitragal notch, etc. Thus, the descriptions herein of "worn by a user," "in a worn state," and "in a worn state" may refer to the acoustic device described herein being worn on the ears of the simulator described above.Naturally, taking into account the individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear 100 can be differentially designed to suit ears of different shapes and sizes, and these differential designs can be expressed by having different ranges of numerical values for the characteristic parameters of one or more parts of the audio device (e.g., the sound generating unit, ear hook, etc. described below) to adapt to different ears.
[0043] In addition, in the fields of medicine, anatomy, and the like, three basic cutting planes of the human body, the sagittal plane, the coronal plane, and the horizontal plane, and three basic axes, the sagittal axis, the coronal axis, and the vertical axis, can be defined. The sagittal plane is a cutting plane perpendicular to the ground cut along the front-back direction of the body, dividing the human body into two parts, the left and right, the coronal plane is a cutting plane perpendicular to the ground cut along the left-right direction of the body, dividing the human body into two parts, the front and the back, and the horizontal plane is a cutting plane parallel to the ground cut along the up-down direction perpendicular to the body, dividing the human body into two parts, the top and the bottom. Accordingly, the sagittal axis is an axis perpendicular to the coronal plane along the front-back direction of the body, the coronal axis is an axis perpendicular to the sagittal plane along the left-right direction of the body, and the vertical axis is an axis perpendicular to the horizontal plane along the up-down direction of the body. Furthermore, the term "anterior of the ear" as used herein refers to the ear along the sagittal axis and toward the face region of the human body. Looking at the ear of the simulator from the direction along which the coronal axis of the human body is located, a schematic diagram of the anterior contour of the ear is obtained as shown in FIG. 1.
[0044] The above description of the ear 100 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, some structures of the acoustic device may block part or all of the ear canal 101. These changes and modifications are still within the protection scope of the present application.
[0045] FIG. 2 is an exemplary schematic view of an open-type earphone according to some embodiments of the present specification, FIG. 3 is an exemplary schematic view of an open-type earphone according to some embodiments of the present specification, and FIG. 4 is an exemplary view of another open-type earphone according to some embodiments of the present specification. In some embodiments, the open-type earphone 10 may include, but is not limited to, an air conduction earphone and a bone conduction earphone. In some embodiments, the open-type earphone 10 may be combined with a product such as glasses, headphones, a head-mounted display, or an AR / VR helmet. As shown in FIGS. 2 to 4, the open-type earphone 10 may include a sound generating unit 11 and an ear hook 12. In some embodiments, the open-type earphone 10 may be attached to a user's body (e.g., the head, neck, or upper torso of a human body) by the ear hook 12.
[0046] In some embodiments, when the open-type earphone 10 is in a worn state, the first portion of the ear hook 12 is hung between the user's auricle and the head, and the second portion extends to the side of the auricle away from the head and is connected to the sound-generating unit 11, and fixes the sound-generating unit 11 in a position near the ear canal that does not block the ear canal. In some embodiments, the ear hook 12 may have an arc-shaped structure that fits the user's auricle so as to be suspended from the user's upper auricle. In some embodiments, the ear hook 12 may have a clamping structure that fits the user's auricle so as to be clamped to the user's auricle. In some embodiments, the ear hook 12 may include, but is not limited to, a hook structure, an elastic band, etc., so as to better fix the open-type earphone 10 to the user's body and prevent it from falling off during use by the user.
[0047] In some embodiments, the sound generating unit 11 may be attached to the user's body, and a transducer (e.g., transducer 112) may be provided in the sound generating unit 11 to generate sound and input it to the user's ear 100. In some embodiments, the open-type earphone 10 may be combined with a product such as glasses, headphones, a head-mounted display, or an AR / VR helmet, and in this case, the sound generating unit 11 may be attached near the user's ear 100 in a hanging or clamping manner. In some embodiments, the sound generating unit 11 may be in a ring shape, an ellipse shape, a (regular or irregular) polygonal shape, a U-shape, a V-shape, a semicircle shape, or the like so that it can be directly hung on the user's ear 100.
[0048] As shown in FIG. 1 and FIG. 2, in some embodiments, when a user wears the open-type earphone 10, at least a part of the sound generating unit 11 may be located in the region J on the anterior side of the tragus of the user's ear 100 shown in FIG. 1 or in the regions M1 and M2 in the pinna. Different wearing positions of the sound generating unit 11 (11A, 11B, and 11C shown in FIG. 2) are exemplarily described below. Note that the anterior outer surface of the pinna referred to in the embodiments of this specification is the side away from the head along the coronal axis direction of the pinna, and correspondingly, the posterior inner surface of the pinna is the side toward the human head along the coronal axis direction of the pinna. In some embodiments, the sound generating unit 11 being located at 11A means that the sound generating unit 11 is located on the side toward the face region of the human body along the sagittal axis direction of the user's ear 100, that is, the sound generating unit 11 is located in the region J on the anterior side of the ear 100.
[0049] Further, a transducer (e.g., transducer 112) may be provided inside the housing of the sound generating unit 11, and at least one sound output hole (e.g., sound output hole 111a, not shown in FIG. 2) may be provided in the housing of the sound generating unit 11 (e.g., housing 111), the sound output hole may be located on a side wall of the housing of the sound generating unit facing or close to the ear canal 101 of the user, and the transducer may output sound to the ear canal 101 of the user through the sound output hole. The transducer is an element that can receive an electric signal, convert it into an audio signal, and output it. In some embodiments, when distinguished according to frequency, the type of the transducer 112 may include a low-frequency (e.g., 30Hz to 150Hz) speaker, a mid-low frequency (e.g., 150Hz to 500Hz) speaker, a mid-high frequency (e.g., 500Hz to 5kHz) speaker, a high frequency (e.g., 5kHz to 16kHz) speaker, or a wideband (e.g., 30Hz to 16kHz) speaker, or any combination thereof. Here, low frequency, high frequency, etc., only represent approximate frequency ranges, and may have different distinction methods in different application scenarios. For example, a crossover frequency is determined, and low frequency represents the frequency range below the crossover frequency, and high frequency represents the frequency range above the crossover frequency. The crossover frequency may be any value within the audible range of the human ear, such as 500Hz, 600Hz, 700Hz, 800Hz, 1000Hz, etc.
[0050] In some embodiments, the transducer may include a diaphragm (e.g., diaphragm 1121). When the diaphragm vibrates, sound is emitted from the front and rear sides of the diaphragm, respectively. The cavity inside the housing of the sound generating unit 11 is partitioned by the diaphragm into at least a front cavity (e.g., front cavity 114) located in front of the diaphragm and a back cavity (e.g., back cavity 116) located behind the diaphragm, and the sound emission hole is acoustically coupled to the front cavity, and the diaphragm vibrates to vibrate the air in the front cavity to generate air-conducted sound, and the air-conducted sound generated in the front cavity is propagated to the outside via the sound emission hole. In some embodiments, the housing of the sound generating unit 11 may further include one or more decompression holes (e.g., a first decompression hole 111c and a second decompression hole 111d), which may be located in a side wall adjacent to or opposite to the side wall in which the sound emission hole in the housing is located, and the decompression holes are acoustically coupled to the back cavity, so that as the diaphragm vibrates, the air in the back cavity vibrates to generate air-conducted sound, and the air-conducted sound generated in the back cavity may be transmitted to the outside via the decompression holes. For example, in some embodiments, the transducer in the sound generating unit 11 can output sound having a phase difference (e.g., opposite phase) through a sound emission hole and a decompression hole, and the sound emission hole may be located on a side wall of the housing of the sound generating unit 11 facing the user's ear canal 101, and the decompression hole may be located on a side of the housing of the sound generating unit 11 facing away from the user's ear canal 101, in which case the housing functions as a baffle to increase the difference in acoustic distance between the sound emission hole and the decompression hole to the ear canal 101, thereby increasing the intensity of the sound in the ear canal 101 and reducing the volume of far-field sound leakage.
[0051] In some embodiments, the sound generating unit 11 may have a long axis direction Y and a short axis direction Z that are perpendicular to the thickness direction X and perpendicular to each other. The long axis direction Y may be defined as a direction having the largest extension dimension in the shape of a two-dimensional projection surface of the sound generating unit 11 (e.g., a projection onto a plane on which the outer surface of the sound generating unit 11 is located, or a projection onto a sagittal plane) (e.g., when the projection shape is a rectangle or an approximately rectangle, the long axis direction is the longitudinal direction of the rectangle or the approximately rectangle), and the short axis direction Z may be defined as a direction perpendicular to the long axis Y in the shape of the projection of the sound generating unit 11 onto the sagittal plane (e.g., when the projection shape is a rectangle or an approximately rectangle, the short axis direction is the width direction of the rectangle or the approximately rectangle). The thickness direction X may be defined as a direction perpendicular to the two-dimensional projection surface, for example, coincides with the direction of the coronal axis, and both face the left-right direction of the body. In some embodiments, when the sound generating unit 11 is in an inclined state in the wearing state, the long axis direction Y and the short axis direction Z are still parallel or approximately parallel to the sagittal plane, the long axis direction Y may have a certain included angle with the direction of the sagittal axis, i.e., the long axis direction Y is also installed with an inclination accordingly, and the short axis direction Z may have a certain included angle with the direction of the vertical axis, i.e., the short axis direction Z is also installed with an inclination, for example, as in the situation in which the sound generating unit 11 is worn on 11B shown in FIG. 2 and the wearing situation of the sound generating unit 11 shown in FIG. 4. In some embodiments, the entire or part of the structure of the sound generating unit 11 may be inserted into the concha cavity, i.e., the projection of the sound generating unit 11 onto the sagittal plane and the projection of the concha cavity onto the sagittal plane have an overlapping portion. For specific details regarding the situation in which the sound generating unit 11 is worn on 11B, reference may be made to other contents of this specification, for example, FIG. 3 and its related descriptions. In some embodiments, the sound generating unit 11 in the attached state may be in a horizontal state or an approximately horizontal state. For example, as in the situation in which the sound generating unit 11 is attached to 11C in FIG. 2 and as in the sound generating unit 11 shown in FIG. 3, the long axis direction Y may coincide or approximately coincide with the direction of the sagittal axis, and either may point in the front-to-back direction of the body, and the short axis direction Z may coincide or approximately coincide with the direction of the vertical axis, and either may point in the up-down direction of the body.In addition, when the sound generating unit 11 is worn, the sound generating unit 11 may be in a substantially horizontal state when the angle between the long axis direction and the sagittal axis of the sound generating unit 11 shown in FIG. 2 is within a specific range (for example, 20° or less). In addition, the wearing position of the sound generating unit 11 is not limited to 11A, 11B, and 11C shown in FIG. 2, and may be any position that satisfies the region J, region M1, or region M2 shown in FIG. 1. For example, the entire or part of the structure of the sound generating unit 11 may be located in the region J surrounded by the dashed line in FIG. 1. In addition, for example, the entire or part of the structure of the sound generating unit 11 may contact one or more parts of the external auditory canal 101, such as the crus helicalis 109, the concha navicularis 103, the triangular fossa 104, the antihelix 105, the navicular fossa 106, and the helix 107. Furthermore, for example, the entire or partial structure of the sound generating unit 11 may be located within a cavity formed by one or more parts of the ear 100 (e.g., the concha cavity 102, the concha scapha 103, and the triangular fossa 104, etc.) (e.g., region M1 including at least the concha cavity 103 and the triangular fossa 104, and region M2 including at least the concha cavity 102, surrounded by dashed lines in Figure 1).
[0052] In some embodiments, in order to improve the stability of the open-type earphone 10 in the worn state, the open-type earphone 10 can use any one of the following methods or a combination thereof. For example, at least a part of the ear hook 12 is installed as a conforming structure bonded to at least one of the back side of the ear and the head, and the contact area between the ear hook 12 and the ear and / or the head is increased, thereby increasing the resistance of the open-type earphone 10 to fall off from the ear. For example, at least a part of the ear hook 12 is installed as an elastic structure so as to have a certain amount of deformation in the worn state, and the positive pressure of the ear hook 12 against the ear and / or the head is increased, thereby increasing the resistance of the open-type earphone 10 to fall off from the ear. For example, at least a part of the ear hook 12 is installed so as to abut against the head in the worn state and generate a reaction force that presses the ear, and the sound generating unit 11 is pressed to the front side of the ear, thereby increasing the resistance of the open-type earphone 10 to fall off from the ear. For example, the sound generating unit 11 and the ear hook 12 are installed so as to sandwich physiological parts such as the area where the antihelix is located and the area where the concha cavity is located from both the front and back of the ear when worn, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear. Furthermore, for example, the sound generating unit 11 or the auxiliary structure connected thereto is installed so that at least a part of it is inserted into physiological parts such as the concha cavity, the concha navicularis, the triangular fossa, and the navicular fossa, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear.
[0053] The sound generating unit 11 may have a connection end CE connected to the ear hook 12 and a free end FE not connected to the ear hook 12. For example, as shown in FIG. 4, the free end FE of the sound generating unit 11 may be inserted into the cavity of the concha in the worn state. Preferably, the sound generating unit 11 and the ear hook 12 are installed so as to sandwich the ear region corresponding to the cavity of the concha from both the front and rear sides, thereby increasing the resistance of the open-type earphone 10 to fall off from the ear and further improving the stability of the open-type earphone 10 in the worn state. For example, the free end FE of the sound generating unit 11 is pressed into the cavity of the concha in the thickness direction X. Also, for example, the free end FE abuts against the inside of the cavity of the concha in the long axis direction Y and / or the short axis direction Z (for example, abuts against the inner wall of the cavity of the concha facing the free end FE). The free end FE of the sound generating unit 11 is an end portion installed opposite to the fixed end of the sound generating unit 11 connected to the ear hook 12. The sound generating unit 11 may be a regular or irregular structure, and the free end FE of the sound generating unit 11 will be described here as an example to further explain it. For example, when the sound generating unit 11 has a rectangular parallelepiped structure, the end wall surface of the sound generating unit 11 is a plane, and in this case, the free end FE of the sound generating unit 11 is an end side wall installed opposite the fixed end of the sound generating unit 11 connected to the ear hook 12. Also, for example, when the sound generating unit 11 is a sphere, an ellipsoid, or an irregular structure, the free end FE of the sound generating unit 11 may be a specific area away from the fixed end obtained by cutting the sound generating unit 11 along the YZ plane (a plane formed by the short axis direction Z and the long axis direction Y). In addition, in the worn state, the free end FE of the sound generating unit 11 may be inserted into the cavity of the concha, or may be orthogonally projected to fit into the antihelix, or may be orthogonally projected to fit into a position on both the left and right sides of the head and in front of the ear in the sagittal axis of the human body. In other words, the ear hook 12 can support the sound generating unit 11 so as to be attached to a wearing position such as the cavity of the concha, the antihelix, or the front of the ear.
[0054] The open-type earphone 10 is described in detail below by taking the open-type earphone 10 shown in Fig. 4 as an example. It should be noted that, on the premise that it does not violate the corresponding acoustic principle, the structure of the open-type earphone 10 shown in Fig. 4 and the corresponding parameters can be similarly applied to the open-type earphones of other configurations mentioned above.
[0055] By inserting at least a part of the sound generating unit 11 into the concha cavity, the sound volume at the listening position (particularly the ear canal opening), particularly the medium-low frequency sound volume, can be improved, while still maintaining the effect of reducing the sound leakage volume in the excellent far field. As a mere illustrative explanation, when the whole or part of the structure of the sound generating unit 11 is inserted into the concha cavity, the sound generating unit 11 and the concha cavity form a structure similar to a cavity (hereinafter, abbreviated as a similar cavity), and in the embodiment of the specification, the similar cavity may be understood as a semi-closed structure surrounded by the side wall of the sound generating unit 11 and the concha cavity structure, and the semi-closed structure does not completely seal and block the inside from the outside environment, but has a leaking structure (e.g., an opening, a gap, a duct, etc.) that acoustically communicates with the outside environment. When a user wears the open-type earphone 10, one or more sound emission holes may be provided on the housing of the sound generating unit 11 close to or facing the user's ear canal, and one or more decompression holes may be provided on another side wall (e.g., a side wall away from the user's ear canal) of the housing of the sound generating unit 11, the sound emission holes are acoustically coupled to the front cavity of the open-type earphone 10, and the decompression holes are acoustically coupled to the back cavity of the open-type earphone 10. For example, when the sound generating unit 11 includes one sound emission hole and one decompression hole, the sound output from the sound emission hole and the sound output from the decompression hole can be approximately regarded as two sound sources, and the sound waves of the two sound sources have opposite phases, the sound generating unit 11 and the inner wall corresponding to the concha cavity form a similar cavity structure, the sound source corresponding to the sound emission hole is located inside the similar cavity structure, and the sound source corresponding to the decompression hole is located outside the similar cavity structure, forming the acoustic model shown in FIG. 5.
[0056] FIG. 5 is an exemplary schematic distribution diagram when a cavity structure is installed around one of the dual sound sources according to some embodiments of the present specification. As shown in FIG. 5, the similar cavity structure 502 may include a listening position and at least one sound source 501A. Here, "including" may indicate that at least one of the listening position and the sound source 501A is inside the similar cavity structure 502, or at least one of the listening position and the sound source 501A is located at the edge of the inside of the similar cavity structure 502. The listening position may be equivalent to the entrance of the ear canal of the ear, or may be an acoustic reference point of the ear, such as an ear reference point (ERP), an ear-drum reference point (DRP), etc., or may be an entrance structure that guides the listener, etc. Since the sound source 501A is surrounded by the similar cavity structure 502, most of the radiated sound reaches the listening position by direct or reflected manner. In contrast, without the similar cavity structure 502, most of the sound radiated from the sound source 501A does not reach the listening position. Therefore, by installing the cavity structure, the sound volume reaching the listening position can be significantly increased. At the same time, only a small part of the anti-phase sound radiated from the anti-phase sound source 501B outside the similar cavity structure 502 enters the similar cavity structure 502 through the leakage structure 503 of the similar cavity structure 502. This corresponds to the secondary sound source 501B' being generated in the leakage structure 503, and the strength of the secondary sound source 501B' is significantly lower than that of the sound source 501B and also significantly lower than that of the sound source 501A. The sound generated by the secondary sound source 501B' has a weak effect of canceling the sound generated from the sound source 501A in the cavity, which can significantly increase the listening volume at the listening position. With regard to sound leakage, when sound source 501A radiates sound to the outside through cavity leakage structure 503, this is equivalent to secondary sound source 501A' being generated in leakage structure 503, and since almost all of the sound radiated from sound source 501A is output from leakage structure 503 and the structural scale of similar cavity structure 502 is far smaller (at least one order of magnitude smaller) than the spatial scale for evaluating sound leakage, the intensity of secondary sound source 501A' is considered to be equivalent to that of sound source 501A.A dual sound source is formed by the secondary sound source 501A' and the sound source 501B in the external space, and the two sound sources cancel each other out to reduce sound leakage.
[0057] In a specific application scenario, the outer wall surface of the housing of the sound generating unit 11 is usually flat or curved, and the contour of the user's concha 102 has an uneven structure. By inserting a part or the entire structure of the sound generating unit 11 into the concha, a similar cavity structure communicating with the outside is formed between the sound generating unit 11 and the contour of the concha. Furthermore, by setting a sound emission hole at a position close to the edge of the concha 102 toward the user's ear canal opening of the housing of the sound generating unit 11, and setting a decompression hole at a position away from the ear canal opening of the sound generating unit 11, the acoustic model shown in FIG. 5 can be configured, whereby when the user wears the open-type earphone 10, the listening volume at the user's ear canal can be increased and sound leakage in the far field can be reduced.
[0058] FIG. 6 is a schematic diagram of an exemplary internal structure of a sound generating unit according to some embodiments of the present disclosure. As shown in FIG. 6, in some embodiments, the sound generating unit 11 may include a transducer 112 and a housing 111 that accommodates the transducer 112, and the transducer 112 may include a vibrating membrane 1121. A front cavity 114 located in front of the vibrating membrane 1121 and a back cavity 116 located behind the vibrating membrane 1121 may be formed between the vibrating membrane 1121 and the housing 111. The housing 111 may be provided with a sound emission hole 111a acoustically coupled to the front cavity 114 and a decompression hole (e.g., a first decompression hole 111c and a second decompression hole 111d not shown in FIG. 6) acoustically coupled to the back cavity 116. A connection frame 115 may be installed in the housing 111. The connecting frame 115 is provided with an acoustic passage 1151 for connecting the first decompression hole 111c and the back cavity 116, which facilitates communication between the back cavity 116 and the external environment, i.e., air can freely enter and exit the back cavity 116, thereby helping to reduce the resistance in the vibration process of the vibrating membrane of the transducer 112.
[0059] FIG. 7 is an exemplary external view of a transducer according to some embodiments of the present specification, and FIG. 8 is an exemplary exploded view of a transducer according to some embodiments of the present specification. As shown in FIG. 7 and FIG. 8, in some embodiments, the sound generating unit 11 may include a vibrating membrane 1121, a coil 1122, a support frame 1123, a terminal 1124, and a magnetic circuit assembly 1125. The support frame 1123 provides a mounting and fixing platform, and the sound generating unit 11 may be connected to the housing 111 by the support frame 1123, and the terminal 1124 may be fixed to the support frame 1123 and used for circuit connection (e.g., connection of a lead wire, etc.). The coil 1122 is connected to the vibrating membrane 1121 and is located in a magnetic gap at least partially formed by the magnetic circuit assembly 1125, and the magnetic circuit assembly 1125 generates an acting force on the energized coil 1122 to drive the vibrating membrane 1121 to generate mechanical vibration, and further generates sound by propagation through a medium such as air. The magnetic circuit assembly 1125 may include a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. The magnetically permeable plate 11251 is located between the magnet 11252 and the vibration membrane 1121, and is attached to a surface of the magnet 11252.
[0060] 9 is an exemplary internal structural view of the sound generating unit according to some embodiments of the present specification, and FIG. 10 is an exemplary structural view of the vibrating membrane according to some embodiments of the present specification. The sound generating unit 11 includes a vibrating membrane 1121, a coil 1122, a support frame 1123, and a magnetic circuit assembly 1125. The support frame 1123 is installed surrounding the vibrating membrane 1121, the coil 1122, and the magnetic circuit assembly 1125, and provides a mounting and fixing platform. The sound generating unit 11 may be connected to the housing 111 by the support frame 1123, the coil 1122 is inserted into the magnetic circuit assembly 1125 and connected to the vibrating membrane 1121, and the magnetic circuit assembly 1125 generates an acting force on the energized coil 1122 to drive the vibrating membrane 1121 to generate mechanical vibration, and further generates sound by propagation through a medium such as air, and the sound is output through a sound output hole. In some embodiments, the magnetic circuit assembly 1125 includes a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253, the magnetically permeable plate 11251 and the magnet 11252 are connected to each other, the side of the magnet 11252 away from the magnetically permeable plate 11251 is attached to the bottom wall of the housing member 11253, and there is a gap between the peripheral side of the magnet 11252 and the inner wall of the peripheral side of the housing member 11253. In some embodiments, the outer wall of the peripheral side of the housing member 11253 is connected and fixed to the support frame 1123. In some embodiments, both the housing member 11253 and the magnetically permeable plate 11251 can be made of a magnetically permeable material (e.g., iron, etc.). In some embodiments, the peripheral side of the vibrating membrane 1121 can be connected to the support frame 1123 by a fixing ring 1155. In some embodiments, the material of the fixing ring 1155 can include stainless steel or other metal materials to suit the processing and manufacturing process of the vibrating membrane 1121. 8, the magnetic circuit assembly 1125 may include a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. The housing member 11253 and the magnetically permeable plate 11251 may both be made of a magnetically permeable material (e.g., iron, etc.). In some embodiments, the housing member 11253 includes a bottom 11253a and a peripheral sidewall 11253b.The storage space is surrounded by the bottom 11253a and sidewall 11253b of the storage member, and the magnetically permeable plate 11251 and the magnet 11252 are stored in the storage space. The magnetically permeable plate 11251 and the magnet 11252 are connected to each other, and the side of the magnet 11252 away from the magnetically permeable plate 11251 is attached to the bottom 11253a of the storage member, and there is a gap between the peripheral side of the magnet 11252 and the peripheral sidewall 11253b of the storage member 11253. In some embodiments, the coil 1122 may be inserted into the gap between the magnet 11252 and the sidewall 11253b.
[0061] In some embodiments, in the process of the vibrating membrane 1121 vibrating up and down, at least a part of the coil 1122 is located in an area of high magnetic flux density in the magnetic circuit assembly 1125, and the distance dd between the center point J of the coil 1122 and the center point K of the magnetic permeable plate 11251 in the vibration direction of the vibrating membrane 1121 is less than 0.3 mm in order to improve the magnetic field utilization efficiency of the magnetic circuit assembly 1125. For example, the center point J of the coil 1122 and the center point K of the magnetic permeable plate 11251 may be located on approximately the same horizontal line, so that the magnetic circuit assembly 1125 generates a larger acting force on the coil 1122 and provides power to the vibration of the vibrating membrane 1121.
[0062] As shown in FIG. 9 and FIG. 10, in some embodiments, the vibrating membrane 1121 may include a main body region 11211 and an edge region 11212 surrounding the main body region 11211. In some embodiments, the main body region 11211 includes a first inclined portion 11211a and a first connecting portion 11211b connected to the coil 1122. As shown in FIG. 9, the first connecting portion 11211b is used to connect the coil 1122, and the first connecting portion 11211b is arranged parallel to the short axis direction Z and perpendicular to the vibration direction of the vibrating membrane. The first inclined portion 11211a is bonded to a part of the edge region 11212. In some embodiments, the first inclined portion 11211a is inclined in a direction away from the coil 1122 with respect to the first connecting portion 11211b. 9 and 10, the coil 1122 is located below the first connection portion 11211b, and the first inclined portion 11211a is inclined upward (i.e., in a direction away from the coil 1122) with respect to the first connection portion 11211b. With the above-mentioned installation, it is possible to prevent the adhesive for adhesion from overflowing onto the edge region 11212 when the coil 1122 is adhered to the diaphragm 1121, causing the adhesive to corrode the edge region 11212 and affect the vibration performance of the diaphragm 1121.
[0063] In some embodiments, the magnetic circuit assembly 1125 mainly includes a magnetic permeable plate 11251, a magnet 11252, and a housing member 11253, the magnetic permeable plate 11251 and the magnet 11252 are connected to each other, the side of the magnet 11252 away from the magnetic permeable plate 11251 is attached to the bottom wall of the housing member 11253, and there is a gap between the peripheral side of the magnet 11252 and the inner wall of the peripheral side of the housing member 11253. The coil 1122 may be inserted into the gap between the magnet 11252 and the housing member 11253. If the distance between the coil 1122 and the side wall of the housing member 11253 is too large, the coil will not be located in the area of high magnetic flux density of the magnetic circuit assembly 1125, weakening the power provided from the magnetic circuit assembly 1125 to the vibrating membrane 1121, and if the distance is too small, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, in order to avoid the collision of the coil 1122 and ensure the power provided from the magnetic field to the vibrating membrane 1121, in some embodiments, in the above-mentioned gap, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.1 mm to 0.25 mm, and the distance ww between the coil 1122 and the inner wall of the circumferential side of the housing member 11253 may be 0.1 mm to 0.5 mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.12 mm to 0.24 mm, and the distance ww between the coil 1122 and the inner wall of the circumferential side of the housing member 11253 may be 0.15 mm to 0.3 mm. In some embodiments, in the above-mentioned gap, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.17 mm to 0.21 mm, and the distance ww between the coil 1122 and the inner wall of the circumferential side of the housing member 11253 may be 0.19 mm to 0.23 mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.2 mm, and the distance ww between the coil 1122 and the inner wall of the circumferential side of the housing member 11253 may be 0.2 mm.If the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 is too large, the overall volume of the sound generating unit 11 becomes large, and if the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 in the vibration direction of the diaphragm 1121 is too small, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, in order to avoid the volume of the sound generating unit 11 being too large and to avoid the collision of the coil 1122, in some embodiments, the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 (i.e., the distance between one end of the coil 1122 that is away from the diaphragm 1121 and the bottom wall of the housing member 11253) may be 0.2 mm to 4 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be 0.6 mm to 3 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be between 1 mm and 2 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be between 1.4 mm and 1.6 mm.
[0064] In some embodiments, the relative position between the coil 1122 and the magnetic circuit assembly 1125 can be changed by designing the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b, thereby nearly matching the thrust received by the coil 1122, and further adjusting the low-frequency distortion of the sound generating unit 11, and enriching the low-frequency hearing sensation. In addition, by designing the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b, it is possible to prevent the adhesive from overflowing into the edge region 11212 due to the coil 1122, corroding the edge region 11212, and affecting the vibration of the edge region 11212. As shown in FIG. 10, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b is the included angle between the first inclined portion 11211a and the straight line on which the first connecting portion 11211b is located, in the direction away from the first connecting portion 11211b.
[0065] In some embodiments, in order to reduce the degree of distortion of the sound generating unit 11 and avoid corroding the edge region 11212 and affecting the vibration of the edge region 11212, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b may be in the range of 5° to 30°. In some embodiments, in order to further reduce the degree of distortion of the sound generating unit 11, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b may be in the range of 10° to 25°. For example, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b may be 15°. Also, for example, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b may be 22°.
[0066] In some embodiments, the minimum distance from the coil 1122 to the first inclined portion 11211a is 0.3 mm or more, i.e., the distance between the connection point between the first inclined portion 11211a and the first connection portion 11211b and the connection area between the coil 1122 and the first connection portion 11211b is 0.3 mm or more, thereby maintaining a safe distance between the edge region 11212 and the mounting position of the coil 1122 and avoiding the adhesive for mounting the coil 1122 from overflowing onto the edge region 11212.
[0067] In some embodiments, the edge region 11212 includes a second inclined portion 11212a, and the second inclined portion 11212a is at least partially attached to the first inclined portion 11211a. The body region 11211 and the edge region 11212 are connected by the first inclined portion 11211a and the second inclined portion 11212a. In some embodiments, the first inclined portion 11211a and the second inclined portion 11212a may be connected by an adhesive to simplify the attachment process. In some embodiments, the second inclined portion 11212a may be located on a side of the first inclined portion 11211a closer to the coil 1122 to realize the connection between the body region 11211 and the edge region 11212. In some embodiments, the second inclined portion 11212a may be located on the side of the first inclined portion 11211a away from the coil 1122 to achieve connection between the main body region 11211 and the edge region 11212 and to reduce corrosion of the edge region 11212 by adhesive when bonding the coil 1122.
[0068] Since the amplitude of the vibrating membrane 1121 is large at low frequencies, if the edge region 11212 uses a planar structure, its deformation ability is low, which affects the vibration amplitude of the vibrating membrane 1121. Therefore, in order to allow the vibrating membrane 1121 to have excellent deformation ability, in some embodiments, the edge region 11212 may include an arc-shaped portion 11212c.
[0069] In some embodiments, the ratio of the height h1 and span w1 of the arc-shaped portion 11212c can affect the deformation ability of the arc-shaped portion 11212c. The height of the arc-shaped portion 11212c is the distance between the highest point of the arc-shaped portion 11212c and the lowest point of the arc-shaped portion in the vibration direction of the vibrating membrane 1121. As shown in FIG. 10, the height of the arc-shaped portion 11212c is denoted as h1. The span of the arc-shaped portion 11212c is the maximum distance between two points in the arc-shaped portion 11212c. As shown in FIG. 10, the span of the arc-shaped portion 11212c is denoted as w1. If the ratio of the height h1 and span w1 of the arc-shaped portion 11212c is too small, the protrusion degree of the arc-shaped portion 11212c is too small, so that the shape becomes close to a planar structure, and the deformation ability may be reduced. If the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c is too large, the degree of protrusion of the arc-shaped portion 11212c is too large, so that the resistance received when the vibrating membrane 1121 vibrates is large, which affects the output of the sound generating unit 11. Therefore, in some embodiments, in order to provide the sound generating unit 11 with excellent output and low distortion, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be in the range of 0.35 to 0.4. In some embodiments, in order to further improve the output of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be in the range of 0.36 to 0.39. In some embodiments, in order to further reduce the distortion of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be 0.37 to 0.38. For example, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be 0.38.
[0070] In some embodiments, the height h1 of the arcuate portion 11212c may be in the range of 0.5 mm to 0.7 mm. For example, the height h1 of the arcuate portion 11212c may be in the range of 0.55 mm to 0.65 mm. In some embodiments, the height h1 of the arcuate portion 11212c may be 0.6 mm. Taking into account the error dimension, in some embodiments, the height h1 of the arcuate portion 11212c may be 0.6 mm ± 0.05 mm. In some embodiments, the span (width) w1 of the arcuate portion 11212c of the edge region 11212 may be less than twice the radius of curvature r1. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.7 mm to 0.9 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.75 mm to 0.88 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.8 mm to 0.83 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.2 mm to 1.7 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.3 mm to 1.65 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.5 mm to 1.6 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.82 mm and the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.58 mm. Taking into account tolerances, in some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.82 mm ± 0.05 mm, and the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.58 mm ± 0.1 mm.
[0071] In some embodiments, the edge region 11212 may include a wave-like structure consisting of a plurality of arc-shaped portions 11212c, and the orientation of any two adjacent arc-shaped portions 11212c is opposite. The wave-like structure can make the degree of resistance to the upward and downward vibrations in the vibration process of the vibrating membrane 1121 as symmetrical as possible, reduce the degree of distortion of the sound generating unit 11, and improve the low-frequency output of the sound generating unit 11. In some embodiments, the height-to-span ratio of each of the plurality of arc-shaped portions 11212c may be the same as the height-to-span ratio of the single arc-shaped portion 11212c described above. In some embodiments, the height-to-span ratio of each of the plurality of arc-shaped portions 11212c may be different. For example, in the radial direction of the diaphragm 1121, the height of each of the multiple arcuate portions 11212c may gradually decrease from the center of the diaphragm 1121 to the edge thereof, and the span of each arcuate portion 11212c is the same.
[0072] In order to restrain the vibrating membrane 1121 and prevent the coil 1122 from colliding with the magnetic circuit assembly 1125 when the vibrating membrane 1121 is vibrated significantly, in some embodiments, the main body region 11211 may include an arched dome 11211c located at one end away from the first inclined portion 11211a of the first connecting portion 11211b, and the arched dome 11211c and the arc-shaped portion 11212c have the same arch direction, that is, the arched dome 11211c protrudes toward the side away from the coil 1122. The arched dome 11211c can prevent the vibrating membrane 1121 from swinging when the vibrating membrane 1121 is vibrated significantly, and ensure that the coil 1122 and the magnetic circuit assembly 1125 do not collide. At the same time, the arched dome 11211c also has high strength and rigidity, which can suppress the split vibration of the main body region 11211 to a certain extent, thereby improving the high-frequency vibration characteristics of the transducer 112. Without a front cover, the aspect ratio (i.e., the ratio of height to span) of the dome is increased, increasing the high frequency bandwidth, but if the aspect ratio of the dome is too high, the non-uniformity increases and the overall dimensions increase.
[0073] In some embodiments, the height h2 of the dome 11211c is related to the dimension in the arch extension direction of the dome 11211c (i.e., the span dimension w2). The height of the dome 11211c is the distance between the highest point of the dome 11211c and the lowest point of the dome 11211c (i.e., the end point connected to the first connection portion 11211b) in the vibration direction of the vibrating membrane 1121. As shown in FIG. 10, the height of the dome 11211c is h2. The span of the dome 11211c is the maximum distance between two points in the dome 11211c. As shown in FIG. 10, the span of the dome 11211c is w2. As the span dimension w2 of the dome 11211c becomes larger, the height h2 of the dome 11211c becomes larger in order to maintain the arch structure of the dome 11211c (for example, to maintain the radian degree corresponding to the dome 11211c within a preset radian degree range), and the overall thickness dimension of the transducer 112 may become too large. Considering the overall thickness and structural design of the transducer 112 in a comprehensive manner, in some embodiments, the preset radian degree range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 0.5263 rad to 3.1416 rad. In some embodiments, the preset radian degree range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 0.7869 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 1.0526 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 1.5789 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 2.1053 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 2.6316 rad to 3.1416 rad. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 2 mm to 8 mm.In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 3 mm to 7 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 4 mm to 6 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 4.8 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 (i.e., the distance between the highest point and the lowest point of the dome 11211c in the vibration direction of the vibrating membrane) may be in the range of 0.7 mm to 1.2 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.9 mm to 1.1 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 1 mm to 1.05 mm. In some embodiments, the height h2 of the dome 11211c of the body region 11211 may be 0.8 mm. In some embodiments, due to processing tolerances, the height h2 of the dome 11211c of the body region 11211 may be 0.8 mm±0.08 mm.
[0074] In some embodiments, the ratio of the height h2 to the span w2 of the dome 11211c may affect the overall dimensions of the sound generating unit 11 and the vibration of the vibrating membrane 1121. If the ratio of the height h2 to the span w2 of the dome 11211c is too small, the protrusion of the dome 11211c is too small, so the shape of the dome 11211c is close to a planar structure, the strength and rigidity of the dome 11211c are low, and split vibration is likely to occur in the dome 11211c, and many peaks and bottoms appear in the high frequency range, which affects the high frequency vibration characteristics of the transducer 112. If the ratio of the height h2 to the span w2 of the dome 11211c is too large, the protrusion of the dome 11211c is too large, so the overall thickness dimension of the transducer 112 may be too large, and the non-uniformity and overall dimensions are also increased. Therefore, in order for the entire sound generating unit 11 to have an appropriate thickness dimension and to improve the high frequency vibration characteristics of the sound generating unit 11, the ratio of the height h2 and the span w2 of the dome 11211c may be in the range of 0.1 to 0.6. In some embodiments, in order to further improve the high frequency vibration characteristics of the transducer 112, the ratio of the height h2 and the span w2 of the dome 11211c may be in the range of 0.1 to 0.4. In some embodiments, in order to further improve the high frequency vibration characteristics of the transducer 112, the ratio of the height h2 and the span w2 of the dome 11211c may be in the range of 0.1 to 0.3.
[0075] In some embodiments, in consideration of the structural strength, the difficulty of realizing the process, and the limitation of the overall thickness of the sound generating unit 11, and in order to satisfy the maximum amplitude of the vibrating membrane 1121 and prevent the vibrating membrane 1121 from colliding with the magnetically permeable plate 11251 during vibration, the distance (distance hd shown in FIG. 9) from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 in the vibration direction of the vibrating membrane may be greater than 0.8 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.85 mm to 0.95 mm, that is, 0.9 mm ± 0.05 mm. 0.9 mm is a structural dimension, and 0.05 mm is a dimension within the error range. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.86 mm to 0.93 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.88 mm to 0.92 mm.
[0076] 11A is a schematic diagram of an example high-frequency bandwidth of a sound-generating unit according to some embodiments of the present disclosure. As shown in FIG. 11A, in the frequency response curve of the sound-generating unit 11, there is a first inflection point f0 in the low-frequency region, which is located at about 300 Hz. f0 is related to the hardness and softness of the edge region 11212 of the vibrating membrane 1121 and the vibration weight (mainly the weight of the main body region 11211). The second inflection point f h is around 25kHz, and f h may be determined based on the overall trend of the frequency response curve. h From f0 and f100kHz onwards, there are some small peaks in the curve, but the curve generally shows a downward trend. h The peak values in the frequency band between 300 Hz and 25 kHz (i.e., between 300 Hz and 25 kHz) are selected and averaged, and the first reference line Lm That is, the upper line in FIG. 11A is formed, and the second line L is formed by lowering the reference line by 10 dB. n (the lower straight line in FIG. 11A), i.e., the selected bandwidth is 100 Hz to 45 kHz.
[0077] In some embodiments, the frequency of the high-frequency divided vibration of the vibrating membrane 1121 is proportional to E / ρ. E is the Young's modulus of the vibrating membrane 1121, and ρ is the equivalent density of the vibrating membrane 1121. Therefore, the high-frequency bandwidth can be determined by E / ρ. When E is constant, the smaller the mass of the vibrating membrane 1121, the smaller the equivalent density ρ of the vibrating membrane 1121, the larger E / ρ, and the wider the high-frequency bandwidth. When ρ is constant, the larger the Young's modulus E of the vibrating membrane 1121, the larger E / ρ, the higher the frequency of the high-frequency divided vibration of the vibrating membrane 1121, and the wider the high-frequency bandwidth.
[0078] In some embodiments, the high frequency split vibration region of the sound generating unit 11 is a region where the frequency response curve reaches the highest peak, and then the frequency response drops rapidly, alternating between peak and trough values. As shown in FIG. 11A, h After reaching the sound pressure level corresponding to f, the frequency response drops off rapidly and alternates between peaks and troughs. h The region to the right of is the high-frequency split vibration region. The frequency at which the corresponding curve reaches its highest peak is the frequency at which the high-frequency split vibration appears (f h). In some embodiments, in order to avoid the vibrations of different parts in the main body region 11211 being significantly different and the high frequency effect being low, the frequency of the high frequency split vibration of the main body region 11211 (dome 11211c) can be designed so that the vibrating membrane 1121 has a wide high frequency bandwidth and the number of occurrences of the high frequency split vibration in the bandwidth region can be reduced. In some embodiments, the frequency of the high frequency split vibration of the dome 11211c can be 20 kHz or more. For example, the frequency of the high frequency split vibration of the dome 11211c can be 25 kHz or more. In some embodiments, in order to ensure that the output of the main body region 11211 is high in the effective frequency band, it is necessary to reduce the mass of the main body region 11211, thereby reducing the difficulty of the main body region 11211 vibrating in the effective frequency band. Therefore, the material of the main body region 11211 can be selected to be a material and structure with low density and high strength. Therefore, the Young's modulus of the dome 11211c can be 6 GPa or more. In some embodiments, the Young's modulus of the dome 11211c may be in the range of 6 GPa to 7 GPa. For example, the Young's modulus of the dome 11211c may be 6.5 GPa. The Young's modulus of the dome 11211c may be measured by a static method or a dynamic method (e.g., a pulse excitation method, an acoustic resonance method, a sound velocity method, etc.).
[0079] In some embodiments, the main body region 11211 may be made of carbon fiber material. FIG. 11B is a schematic diagram of an exemplary carbon fiber weave structure according to some embodiments herein. Carbon fiber material has low density and high strength, which helps to weaken higher modes of the speaker 112. In some embodiments, to further improve the strength of the main body region 11211 and reduce the equivalent density of the main body region 11211, the main body region 11211 may be woven with interlaced carbon fibers, and at least some of the carbon fibers are interlaced at a first angle. In some embodiments, the first angle is in the range of 45° to 90°. For example, when weaving multiple independent carbon fibers, the warp and weft can be interlaced at any angle such as 45°, 60°, or 90°. As shown in FIG. 11B, the multiple carbon fibers 112111 and the multiple carbon fibers 112112 may be woven with an angle close to 90°. In some embodiments, since the carbon fibers are very thin, the plurality of carbon fibers 112111 and the plurality of carbon fibers 112112 may be laid at an angle close to 90° and connected by adhesion. In some embodiments, the main body region 11211 may include multiple layers (e.g., two layers, three layers, etc.) of a structure in which the carbon fibers are woven by interlacing. In order to facilitate interlacing and weaving the carbon fibers, in some embodiments, the length of a single carbon fiber is 5 mm or more. In some embodiments, the length of a single carbon fiber may be in the range of 5 mm to 10 mm. For example, the length of a single carbon fiber may be 7 mm. Since the single carbon fibers are too thin, it is difficult and difficult to weave them one by one. In some embodiments, multiple carbon fibers can be laid and connected (e.g., connected by adhesion) to form multiple sets of carbon fibers, and warp and weft threads are interlaced and woven between the multiple sets of carbon fibers.
[0080] In some embodiments, the thickness of the body region 11211 can be designed to obtain a selected high frequency bandwidth using a very smoothly aligned carbon fiber structure to reduce the weight of the body region 11211. In some embodiments, the thickness of the body region 11211 can be less than 80 μm. In some embodiments, the thickness of the body region 11211 can be in the range of 10 μm to 60 μm. In some embodiments, the thickness of the body region 11211 can be 25 μm.
[0081] FIG. 12 is a schematic diagram of the amplitude of the sound generating unit at different driving voltages according to some embodiments of the present specification. As shown in FIG. 12, the amplitude of the vibration of the diaphragm 1121 of the transducer 112 in two opposite directions (positive and negative directions of the thickness direction X shown in FIG. 6, i.e., positive and negative directions of the ordinate axis in FIG. 12) is different at the same voltage, which is due to the asymmetry of the diaphragm 1121. In FIG. 12, the unit Vrms indicates the effective voltage value of a sinusoidal AC signal, and for example, 0.7 Vrms indicates that the effective voltage value of the input sinusoidal AC signal is 0.7 V. As shown in FIG. 12, in the input voltage range of 0.4 V to 0.7 V, the amplitude of the vibration of the diaphragm 1121 in the downward direction (negative direction of the ordinate axis) (about 0.8 mm) is larger than the amplitude of the vibration of the diaphragm 1121 in the upward direction (positive direction of the ordinate axis) (about 0.6 mm). The upward vibration of the diaphragm 1121 means that the diaphragm 1121 vibrates toward the front cavity 114, and the downward vibration of the diaphragm 1121 means that the diaphragm 1121 vibrates toward the back cavity 116 (toward the magnetic circuit assembly 1125). As shown in FIG. 12, as the input voltage continues to increase (for example, increasing from 0.7V to 1V), the amplitude change width of the diaphragm 1121 gradually decreases and finally approaches a threshold value, and the downward vibration amplitude of the diaphragm 1121 approaches a first threshold value (about 0.9mm), and the upward vibration amplitude approaches a second threshold value (about 0.8mm). Since the downward vibration amplitude of the diaphragm 1121 is larger than the upward vibration amplitude, the amplitudes of the diaphragm 1121 in this specification are both the large downward vibration amplitudes of the diaphragm 1121. In some embodiments, in order to avoid the coil 1122 colliding with the magnetic circuit assembly 1125 when the vibrating membrane 1121 vibrates, the maximum amplitude of the vibrating membrane 1121 may be designed not to exceed 0.8 mm, that is, the amplitude of the vibrating membrane 1121 may be in the range of 0 mm to 0.8 mm. In some embodiments, the amplitude of the vibrating membrane 1121 may be in the range of 0 mm to 0.75 mm. In some embodiments, the amplitude of the vibrating membrane 1121 may be in the range of 0 mm to 0.7 mm.
[0082] In some embodiments, within an amplitude range of 0 mm to 0.8 mm, the difference in amplitude of the vibrating membrane 1121 vibrating in two opposite directions (i.e., upward and downward vibrations) may be less than 0.05 mm, thereby reducing the degree of distortion of the transducer 112. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude of the vibrating membrane 1121 vibrating in two opposite directions (i.e., upward and downward vibrations) may be less than 0.04 mm. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude of the vibrating membrane 1121 vibrating in two opposite directions (i.e., upward and downward vibrations) may be less than 0.03 mm.
[0083] 8 and 9, in some embodiments, the support frame 1123 is installed surrounding the magnetic circuit assembly 1125. As shown in Fig. 9, in the vibration direction of the vibrating membrane, the support frame 1123 may include a first portion 112311, a second portion 11232, and a third portion 11233. The first portion 112311 is a portion between a highest point D of a connection area between the support frame 1123 and the vibrating membrane 1121 and a highest point of a connection area between the support frame 1123 and the housing member 11253 in the vibration direction of the vibrating membrane 1121. The second portion 11232 is a region where the vent hole is formed in the support frame 1123, and as shown in FIG. 9, the second portion 11232 is a portion between the highest point of the connection region between the support frame 1123 and the housing member 11253 and the side wall where the bottom of the vent hole of the support frame 1123 is located (i.e., toward the bottom 11253a of the housing member 11253) in the vibration direction of the vibration membrane 1121. The third portion 11233 is a portion between the side wall where the bottom of the vent hole of the support frame 1123 is located and the bottom close to the magnetic circuit assembly 1125 of the support frame 1123 (i.e., close to the bottom 11253a of the housing member 11253). As shown in FIG. 10, a second connection portion 11212b for connecting the support frame 1123 is provided at one end of the edge region 11212 away from the main body region 11211. The second connecting portion 11212b is arranged parallel to the short axis direction Z and perpendicular to the vibration direction of the diaphragm. In some embodiments, the first portion 112311 of the support frame 1123 is connected to the second connecting portion 11212b of the edge region 11212. In some embodiments, the second connecting portion 11212b of the edge region 11212 is connected to the first portion 112311 of the support frame 1123 by a fixing ring 1155, thereby realizing the fixing of the diaphragm 1121 and the support frame 1123.
[0084] 13 is an exemplary structural diagram of a partial structure of a back cavity according to some embodiments of the present specification. As shown in FIG. 6 and FIG. 13, in some embodiments, a connection frame 115 may be installed in the housing 111, and a second acoustic cavity may be surrounded by the connection frame 115 and the support frame 1123 of the transducer 112, and the second acoustic cavity may function as a back cavity 116. The back cavity 116 is separated from other structures (such as a main control circuit board) in the housing 111, which helps to improve the acoustic expression of the sound generating unit 11. A decompression hole (e.g., a first decompression hole 111c and / or a second decompression hole 111d) is provided in the housing 111, and an acoustic passage 1151 is provided in the connecting frame 115 to connect the decompression hole and the back cavity 116, facilitating communication between the back cavity 116 and the external environment, i.e., air can freely enter and exit the back cavity 116, thereby helping to reduce the resistance in the vibration process of the vibrating membrane 1121 of the transducer 112.
[0085] In some embodiments, the cross section of the back cavity 116 may be composed of two perpendicular sides and one curved side, and the two end points of the curved side may be connected to make the cross section (e.g., cross section ABC) approximately triangular. The hypotenuse AC is composed of a line connecting the two end points formed by the contact between the curved surface formed on the connection frame 115 and the two straight sides of the support frame 1123. In some embodiments, the thickness h4 of the first part 112311 of the support frame 1123 in the vibration direction of the vibrating membrane 1121 can affect the volume of the back cavity 116. When the thickness h4 of the first part 112311 is thickened, the volume of the back cavity 116 is reduced if the volume of the entire sound generating unit 11 does not change, and accordingly, when the thickness h4 of the first part 112311 is reduced, the volume of the back cavity 116 is increased. In some embodiments, the thickness of the first portion 112311 of the support frame 1123 can affect the volume of the back cavity 116, thereby affecting the resonant frequency of the back cavity 116. In some embodiments, the back cavity 116 may be a cavity configured on the rear side of the vibrating membrane, in which case, when the thickness h4 of the first portion 112311 of the support frame 1123 is increased, the volume of the back cavity 116 increases if the volume of the entire sound generating unit 11 does not change, and correspondingly, when the thickness h4 of the first portion 112311 is decreased, the volume of the back cavity 116 decreases.
[0086] In some embodiments, the combination of the back cavity 116 and the decompression holes (e.g., the first decompression hole 111c and / or the second decompression hole 111d) installed in the housing 111 can be regarded as a Helmholtz resonant cavity model. The back cavity 116 can function as the cavity of the Helmholtz resonant cavity model, and the decompression hole can function as the neck of the Helmholtz resonant cavity model, and the resonant frequency of the Helmholtz resonant cavity model is the resonant frequency f2 of the back cavity 116. In the Helmholtz resonant cavity model, the volume of the cavity (e.g., the back cavity 116) can affect the resonant frequency f of the cavity (e.g., the back cavity 116), and the specific relationship is as shown in Equation (1).
[0087]
number
[0088] where c represents the speed of sound, S represents the cross-sectional area of the neck (eg, vacuum hole), V represents the volume of the cavity (eg, back cavity 116), and L represents the depth of the neck (eg, vacuum hole).
[0089] As can be seen from equation (1), if the cross-sectional area S of the decompression hole (e.g., the first decompression hole 111c and / or the second decompression hole 111d) and the depth L of the decompression hole do not change, when the volume of the back cavity 116 increases, the resonant frequency f2 of the back cavity 116 decreases, i.e., moves to a lower frequency.
[0090] 14 is a frequency response curve diagram of the back cavity corresponding to different thicknesses of the first portion 112311 according to some embodiments of the present disclosure. As can be seen from FIG. 14, as the thickness h4 of the first portion 112311 of the support frame 1123 gradually increases from 0.3 mm to 3 mm, the volume of the back cavity 116 gradually increases, the resonance peak of the back cavity 116 gradually moves to a lower frequency, and the flat range of the frequency response curve decreases, which affects the output performance of the sound generating unit 11.
[0091] If the thickness h4 of the first portion 112311 is too small, the amplitude of the vibrating membrane 1121 is limited by the support frame 1123, and if the thickness h4 of the first portion 112311 is too large, the dimensions of the entire sound generating unit 11 are too large, the resonance peak of the back cavity 116 moves to a lower frequency, and the range of the flat region of the frequency response curve of the back cavity 116 is reduced, affecting the sound quality of the sound generating unit 11. The thickness of the first portion 112311 is the minimum distance between the connection region between the support frame 1123 and the edge region 11212 and the region directly bonded to the magnetic circuit assembly 1125 in the vibration direction of the vibrating membrane 1121.
[0092] In some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 may be in the range of 0.3 mm to 3 mm to provide the sound generating unit 11 with high low frequency output and to increase the range of the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.5 mm to 2 mm to further improve the low frequency output of the sound generating unit 11. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.8 mm to 1 mm to further increase the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be 0.9 mm, in which case the resonance peak of the back cavity 116 is at around 6.1 kHz, the sound generating unit 11 has excellent low frequency output, and the frequency response curve of the back cavity 116 has a wide flat region.
[0093] In some embodiments, the weight of the transducer 112 is mainly related to the support frame 1123 and the magnetic circuit assembly 1125, and the weight of the magnetic circuit assembly 1125 accounts for a large proportion. In some embodiments, if the material of the support frame 1123 is not changed, an increase in the weight of the support frame 1123 means an increase in the dimensions of the support frame 1123, which may correspond to an increase in the area of the diaphragm 1121. In some embodiments, an increase in the weight of the magnetic circuit assembly 1125 increases the magnetic induction strength near the coil 1122, which increases the driving force generated for the coil, which increases the amplitude of the diaphragm 1121, and the transducer 112 has higher sensitivity and better low-frequency effect. However, if the weight of the transducer 112 is too large, the weight of the sound generating unit 11 becomes too large, which affects the wearing stability and comfort of the open-type earphone 10.
[0094] Considering the two types of wearing situations, that is, at least a part of the sound generating unit 11 shown in FIG. 3 covers the antihelix region, and the whole or a part of the sound generating unit 11 shown in FIG. 4 is inserted into the cavity of the concha, the volume of sound heard by the ear 100 becomes louder (corresponding to higher sound generation efficiency), so the weight of the transducer 112 can be reduced by reducing the dimensions of the diaphragm 1121 or the weight of the magnetic circuit assembly 1125, etc., so that the transducer 112 has high sensitivity and low-frequency output, and the open-type earphone 10 has high wearing stability and comfort. In some embodiments, the weight of the transducer 112 may be in the range of 1.1 g to 3.3 g. In some embodiments, in order to further improve the sensitivity and low-frequency output of the transducer 112, the weight of the transducer 112 may be in the range of 1.5 g to 3 g. In some embodiments, the weight of the transducer 112 may be in the range of 2g to 2.5g to further improve the wearing stability and comfort of the open-type earphone 10. In some embodiments, the weight of the transducer 112 may be 2.2g.
[0095] FIG. 15 is a frequency response curve diagram of the sound generating unit at different driving voltages according to some embodiments of the present specification. The surface of the diaphragm of the speaker 112 is directly facing the measurement microphone at a distance of 4 mm, a voltage in the range of 0.1 V to 0.7 V is applied to the speaker 112, and the measurement frequency range is set to 20 Hz to 20000 Hz, and the frequency response curve (shown in FIG. 15) at different driving voltages of the speaker 112 is obtained. As shown in FIG. 12 and FIG. 15, when the input voltage is in the range of 0.1 V to 0.7 V and the frequency is in the range of 20 Hz to 6.1 kHz, the amplitude of the diaphragm 1121 is in the range of 0 mm to 0.8 mm. In this case, in order to prevent the coil 1122 from contacting the bottom 11253a of the housing member during vibration, the distance h3 (shown in FIG. 9) between the bottom of the coil 1122 and the bottom 11253a of the housing member may be greater than 0.8 mm. In some embodiments, in order to reduce the size of the sound generating unit 11 and improve the comfort of the user when worn, the distance h3 (shown in FIG. 9) between the bottom of the coil 1122 and the bottom 11253a of the housing member may be 0.9 mm or less. Therefore, with an input voltage of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz, the distance h3 (shown in FIG. 9) from the bottom of the coil 1122 to the bottom 11253a of the housing member may be in the range of 0.8 mm to 0.9 mm.
[0096] As shown in Fig. 15, as the input voltage gradually increases from 100mV to 700mV, the output of the sound generating unit 11 gradually increases, and the sensitivity gradually increases, but the frequency of the resonance peak hardly changes and is located around 6.1kHz. Considering two types of wearing conditions, that is, at least a part of the sound generating unit 11 shown in Fig. 3 covers the antihelix region, and the whole or a part of the sound generating unit 11 shown in Fig. 4 is inserted into the cavity of the concha, the sound generating unit 11 has high sensitivity by controlling the distance h3 (shown in Fig. 9) from the bottom of the coil 1122 to the bottom 11253a of the housing member within a range of 0.8mm to 0.9mm. As shown in Fig. 15, when the input voltage is 100mV to 700mV, the sound pressure level (SPL) of the sound generating unit 11 is within a range of 85dB to 103dB at a frequency of 1kHz.
[0097] In some embodiments, as can be seen from the above, the thickness h4 of the first portion 112311 of the support frame 1123 is in the range of 0.3 mm to 3 mm. When the thickness h4 of the first portion 112311 is increased to 3 mm, the resonance frequency f2 of the corresponding back cavity 116 is decreased to 3.3 kHz, the range of the flat area is reduced, and the sound quality is affected. In some embodiments, in order to increase the range of the flat area and improve the sound quality of the sound generating unit 11, the thickness h4 of the first portion 112311 may be less than 3 mm, and the resonance frequency f2 of the back cavity 116 may be 3.3 kHz or more. In some embodiments, in order to further improve the sound quality of the sound generating unit 11, the resonance frequency f2 of the back cavity 116 may be 3.5 kHz or more. In some embodiments, in order to further improve the sound quality of the sound generating unit 11, the resonance frequency f2 of the back cavity 116 may be 4 kHz or more. In some embodiments, to further improve the sound quality of the sound-generating unit 11, the resonant frequency f2 of the back cavity 116 may be 6 kHz or higher.
[0098] In some embodiments, according to equation (1), the volume of the back cavity 116 can affect the resonant frequency f2 of the back cavity 116. The volume of the back cavity 116 is affected by the thickness h4 of the first portion 112311 of the support frame 1123. Based on the range of values of the thickness h4 of the first portion 112311 and the range of values of the resonant frequency f2 of the back cavity 116, a range of values of the volume of the back cavity 116 can be determined. In some embodiments, the volume of the back cavity 116 can be determined to be 60 mm or less. 3 ~110mm 3 may be also possible.
[0099] 16 is an exemplary schematic location diagram of a support frame, a first decompression hole, and a second decompression hole according to some embodiments of the present disclosure. As shown in FIG. 16, in some embodiments, a plurality of ventilation holes 11231 are formed in the support frame 1123. By installing the ventilation holes 11231, the sound on the back of the diaphragm 1121 can be transmitted to the back cavity 116 and the decompression holes through the plurality of ventilation holes 11231 and propagated to the outside, providing a good passage for sound to radiate on both sides of the diaphragm 1121.
[0100] In some embodiments, the plurality of ventilation holes 11231 may be designed asymmetrically to better balance the airflow and balance the air pressure in the back cavity 116. For example, the plurality of ventilation holes 11231 may be arranged asymmetrically around the short axis of the support frame 1123. Specifically, a first ventilation hole 11231a and a second ventilation hole 11231b are formed in the support frame 1123. As shown in FIG. 16, the distance La between the center of the first ventilation hole 11231a and the center of the second decompression hole 111d is greater than the distance Lb between the center of the second ventilation hole 11231b and the center of the second decompression hole 111d. In some embodiments, the area of the first vent hole 11231a is larger than the area of the second vent hole 11231b in order to balance the air pressure in the back cavity 116, since the air pressure in the back cavity 116 is higher at a position farther from the second decompression hole 111d. That is, the area of the vent hole is smaller closer to the second decompression hole 111d (or the first decompression hole 111c), and the area of the vent hole is larger farther from the second decompression hole 111d (or the first decompression hole 111c). The distance between the vent hole 11231 and the decompression hole is the distance between the center of the vent hole 11231 and the center of the corresponding decompression hole. In this specification, the center of the vent hole or the decompression hole is the geometric center of the hole-like structure.
[0101] In the back cavity 116, the air pressure is high at a position far from the first decompression hole 111c and / or the second decompression hole 111d, so the area of the vent hole 11231 can be set large. In the position close to the first decompression hole 111c and / or the second decompression hole 111d, the air pressure is low, so the area of the vent hole 11231 can be set small. If the areas of the multiple vent holes 11231 are the same, the air pressure is high at a position far from the first decompression hole 111c and / or the second decompression hole 111d in the back cavity 116, and the area of the vent hole 11231 here is small, so the air pressure in the back cavity 116 cannot be well balanced, and the air resistance received when the vibrating membrane 1121 here vibrates is large. Similarly, the resistance received when the vibrating membrane 1121 vibrates is small at a position close to the first decompression hole 111c and / or the second decompression hole 111d in the back cavity 116. This causes the force that vibrating membrane 1121 receives to become non-uniform, resulting in unstable vibration of vibrating membrane 1121. Therefore, by adjusting the area of air hole 11231, the low-frequency vibration of sound generating unit 11 can be made more stable.
[0102] In some embodiments, the vent holes 11231 can balance the air pressure in the back cavity 116 and affect the uniformity of the air resistance experienced by the vibrating membrane 1121 when it vibrates, so that the total area of the vent holes 11231 can affect the output performance of the sound generating unit 11. The ratio of the total area of the multiple vent holes 11231 to the projected area in the vibration direction of the vibrating membrane 1121 can affect the air resistance when the vibrating membrane 1121 vibrates. If the ratio of the total area of the multiple vent holes 11231 to the projected area in the vibration direction of the vibrating membrane 1121 is too small, the air pressure in the back cavity 116 will be large, and the air resistance experienced by the vibrating membrane 1121 will be large when it vibrates, affecting the low-frequency output performance of the vibrating membrane 1121. If the ratio between the total area of the plurality of vent holes 11231 and the projected area in the vibration direction of the vibrating membrane 1121 reaches a certain threshold value, further increasing the ratio reduces the change in the influence of the air in the back cavity 116 on the vibration of the vibrating membrane 1121 and affects the structural strength of the support frame. Therefore, in some embodiments, in order to ensure that the vibrating membrane 1121 receives uniform and small air resistance when vibrating, and to ensure excellent output performance of the sound generating unit 11, the ratio between the total area of the plurality of vent holes 11231 and the projected area in the vibration direction of the vibrating membrane 1121 may be in the range of 0.008 to 0.3. In some embodiments, in order to further reduce the air resistance received when the vibrating membrane 1121 vibrates, the ratio between the total area of the plurality of vent holes 11231 and the projected area in the vibration direction of the vibrating membrane 1121 may be in the range of 0.1 to 0.25. In some embodiments, in order to further reduce the air resistance experienced when the vibrating membrane 1121 vibrates, the ratio of the total area of the multiple air vents 11231 to the projected area in the vibration direction of the vibrating membrane 1121 may be within the range of 0.11 to 0.23.
[0103] FIG. 17 is a frequency response curve of the back cavity corresponding to different total areas of the vent holes according to some embodiments of the present specification. Different total areas of the vent holes 11231 can be achieved by blocking the vent holes 11231 with rubber clay. By directly facing the surface of the diaphragm of the speaker 112 to the measurement microphone at a distance of 4 mm, applying a voltage of 0.4 V to the speaker 112, and setting the measurement frequency range to 20 Hz to 20,000 Hz, the frequency response curves (shown in FIG. 17) for different vent hole areas of the speaker 112 can be obtained. 2 The difference is that the ventilation holes 11231 are completely blocked, i.e., no holes are formed in the support frame. As shown in FIG. 17, the total area of the ventilation holes 11231 is 0 mm 2 From 4.54 mm 2 As the total area of the vent holes 11231 gradually increases to 4.54 mm, the frequency response curve of the back cavity 116 gradually moves upward in the low frequency (e.g., 100 Hz to 1000 Hz) region, i.e., the low frequency response of the back cavity 116 gradually increases. 2 From 12.96 mm 2 In the process of gradually increasing the area of the vent holes 11231 to 4.54 mm, the change in the low frequency response of the back cavity 116 is not obvious. This is because the total area of the vent holes 11231 is a constant area (e.g., 4.54 mm 2 ), the effect of the air in back cavity 116 on the vibration of vibrating membrane 1121 gradually weakens in low-frequency vibrations, so that further increasing the total area of air vents 11231 does not have a significant effect on the frequency response curve of back cavity 116 in the low-frequency range.
[0104] As shown in FIG. 17, the total area of the ventilation hole 11231 is 0 mm 2 From 12.96 mm 2 As the area of the vent hole 11231 increases to 4.54 mm, the resonance peak of the back cavity 116 gradually moves to higher frequencies, and the frequency response curve in the low frequency range (e.g., 100 Hz to 1000 Hz) gradually becomes flatter. In some embodiments, to provide the back cavity 116 with a good low frequency response, the total area of the vent hole 11231 is set to 4.54 mm. 2 ~12.96mm2 In some embodiments, to provide good low frequency response for the back cavity 116, the total area of the vent holes 11231 may be in the range of 5 mm 2 ~11mm 2 In some embodiments, to provide good low frequency response in the back cavity 116, the total area of the vent holes 11231 may be in the range of 7 mm 2 ~10mm 2 In some embodiments, to provide good low frequency response in the back cavity 116, the total area of the vent holes 11231 may be in the range of 8 mm 2 ~10mm 2 may be in the range.
[0105] In some embodiments, in order to improve the structural strength, multiple ventilation holes 11231 may be formed in the support frame 1123, and reinforcing ribs are formed at the connection parts between the multiple ventilation holes 11231. In some embodiments, when the total area of the ventilation holes 11231 is filled, the quantity of the ventilation holes 11231 may be set to only one, in order to simplify the process of forming the holes.
[0106] In some embodiments, multiple vent holes may also be formed on the bottom 11253a or side wall 11253b of the housing member 11253 of the magnetic circuit assembly 1125. The sound on the back of the diaphragm 1121 may be transmitted to the back cavity 116 and the decompression hole through multiple vent holes, and the vent holes provide a good passage for sound to radiate to both sides of the diaphragm 1121.
[0107] In some embodiments, the projected area of the vibrating membrane 1121 in the vibration direction affects the amount of air pushed away when the vibrating membrane 1121 vibrates, affects the efficiency of the vibrating membrane 1121 vibrating to generate sound, and affects the sound output effect of the sound generating unit 11. If the projected area of the vibrating membrane 1121 in the vibration direction is too small, the amount of air pushed away when the vibrating membrane 1121 vibrates is small, and the sound output effect of the sound generating unit 11 is low. If the projected area of the vibrating membrane 1121 in the vibration direction is too large, the dimensions of the support frame 1123 become too large, the weight of the support frame 1123 increases, and the weight of the sound generating unit 11 increases, affecting the structure and weight of the sound generating unit 11 and affecting the comfort and stability of wearing. Considering two types of wearing situations, that is, at least a part of the sound generating unit 11 shown in Fig. 3 covers the antihelix region, and the whole or a part of the sound generating unit 11 shown in Fig. 4 is inserted into the cavity of the concha, the sound volume heard by the ear 100 becomes louder (corresponding to higher sound emission efficiency), so the dimensions of the diaphragm 1121 do not need to be too large. In some embodiments, the sound emission hole 111a is provided on a side wall of the housing 111 of the sound generating unit 11 close to the user's ear, the sound emission hole 111a is provided on the front side of the diaphragm 1121 and communicates with the front cavity 114, the vibration direction of the diaphragm 1121 is the thickness direction X of the sound generating unit 11 or is approximately equivalent thereto, the projected area of the diaphragm 1121 in the vibration direction is the projected area of the diaphragm 1121 in the sagittal plane or is approximately equivalent thereto, and the projected area of the diaphragm 1121 in the vibration direction affects the projected area of the sound generating unit 11 in the sagittal plane of the user. The overlap ratio between the projection area of the sound generating unit 11 on the sagittal plane of the user and the projection area of the concha cavity on the sagittal plane affects the similar cavity structure formed when the sound generating unit 11 is inserted into the concha cavity, thereby affecting the acoustic output effect of the sound generating unit 11. Furthermore, the long axis dimension and the short axis dimension of the vibration membrane 1121 can affect the long axis dimension and the short axis dimension of the projection of the sound generating unit 11 on the sagittal plane.
[0108] In some embodiments, taking into consideration two situations, namely, that at least a part of the sound generating unit 11 shown in FIG. 3 covers the antihelix region, and that the whole or a part of the sound generating unit 11 shown in FIG. 4 is inserted into the cavity of the concha, the sound generating unit 11 has an excellent acoustic output, and the projection area of the sound generating unit 11 onto the sagittal plane has an appropriate area or the sound generating unit 11 has an appropriate thickness, the projection area of the diaphragm 1121 in the vibration direction is set to 90 mm 2 ~560mm 2 Preferably, the projected area of the diaphragm 1121 in the vibration direction is 120 mm 2 ~300mm 2 More preferably, the projected area of the diaphragm 1121 in the vibration direction is 150 mm 2 ~200mm 2 may be also possible.
[0109] Taking into consideration the two situations, namely, that at least a part of the sound generating unit 11 shown in FIG. 3 covers the antihelix region, and that the whole or a part of the sound generating unit 11 shown in FIG. 4 is inserted into the cavity of the concha, in order to improve the sound output performance of the sound generating unit 11 by making the vibrating membrane 1121 have as large an area as possible within the limited dimensions of the sound generating unit 11, in some embodiments, when the vibration direction of the vibrating membrane 1121 is parallel to the thickness direction X of the sound generating unit 11, the ratio of the projection area of the vibrating membrane 1121 in the vibration direction of the vibrating membrane (i.e., the projection area of the vibrating membrane 1121 on the sagittal plane) to the projection area of the housing 111 in the vibration direction of the vibrating membrane (i.e., the projection area of the housing 111 on the sagittal plane) may be 0.5 or more. In some embodiments, in order to improve the sound output performance of the sound generating unit 11 by making the vibrating membrane 1121 have as large an area as possible within the limited dimensions of the sound generating unit 11, the ratio of the projected area of the vibrating membrane 1121 in the vibration direction of the vibrating membrane to the projected area of the housing 111 in the vibration direction of the vibrating membrane may be 0.8 or more. In some embodiments, in order to improve the sound output performance of the sound generating unit 11 by making the vibrating membrane 1121 have as large an area as possible, the ratio of the projected area of the vibrating membrane 1121 in the vibration direction of the vibrating membrane to the projected area of the housing 111 in the vibration direction of the vibrating membrane may be within a range of 0.8 to 0.95.
[0110] In some embodiments, in combination with the mounting method in which at least a part of the sound generating unit 11 covers the antihelix region as shown in FIG. 3, the long axis dimension of the diaphragm 1121 may be within a range of 13 mm to 25 mm, and the short axis dimension of the diaphragm may be within a range of 4 mm to 13 mm. In combination with the mounting method in which the whole or a part of the sound generating unit 11 is inserted into the cavity of the concha as shown in FIG. 4, the short axis dimension of the diaphragm 1121 may be within a range of 4 mm to 13 mm, in order to facilitate the whole or a part of the sound generating unit 11 being inserted into the cavity of the concha to form an effective similar cavity. Based on the above short axis dimension, the projected area of the diaphragm 1121 (for example, the projected area of the diaphragm 1121 in the vibration direction) may be 52 mm. 2 ~325mm 2Based on the above, it is further determined that the long axis dimension of diaphragm 1121 is within the range of 13 mm to 25 mm. For example, the long axis dimension of diaphragm 1121 may be within the range of 15 mm to 20 mm, and the short axis dimension of diaphragm may be within the range of 5 mm to 10 mm. Also, for example, the long axis dimension of diaphragm 1121 may be within the range of 17 mm to 18 mm, and the short axis dimension of diaphragm may be within the range of 7 mm to 8 mm.
[0111] Although the basic concept has been described above, it is clear to those skilled in the art that the above detailed disclosure is merely given as an example and does not limit the present application. Although not explicitly described in this specification, those skilled in the art can make various changes, improvements and modifications to the present application. These changes, improvements and modifications are intended to be suggested by the present application and therefore still fall within the spirit and scope of the exemplary embodiments of the present application.
[0112] Furthermore, certain terms are used herein to describe embodiments of the present application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the present application. Thus, it is emphasized and understood that references to "one embodiment" or "one embodiment" or "one alternative embodiment" more than one in various parts of this specification do not necessarily all refer to the same embodiment. Also, certain features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.
[0113] Moreover, as will be appreciated by those skilled in the art, aspects of the present application may be illustrated and described in several patentable classes or contexts, including any new and useful process, machine, manufacture, or combination of matter, or any new and useful improvement thereto. Thus, aspects of the present application may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. Any of the above hardware or software may be referred to as a "data block," "module," "engine," "unit," "assembly," or "system." Additionally, aspects of the present application may take the form of a computer program product embodied in one or more computer-readable medium(s) containing computer-readable program code.
[0114] The computer storage medium may include a propagated data signal, propagated on baseband or as part of a carrier wave, for carrying the computer program code. The propagated signal may include various forms, such as electromagnetic signals, optical signals, or suitable combinations. The computer storage medium may be any computer readable medium other than a computer readable storage medium, which may be connected to an instruction execution system, device, or equipment to realize the communication, propagation, or transmission of the program used. The program code on the computer storage medium may be propagated via any suitable medium, including wireless, cable, fiber optic cable, RF, or similar media, or any combination of the above media.
[0115] The computer program code necessary for the operation of each part of this application may be coded in one or more programming languages, including object-oriented programming languages such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, traditional procedural programming languages such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages. The program code may be executed entirely on the user's computer, on the user's computer as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or processing device. In the latter case, the remote computer may be connected to the user's computer by any form of network, such as a local area network (LAN) or wide area network (WAN), may be connected to an external computer (e.g., via the Internet), may be in a cloud computing environment, may be used as a service, such as Software as a Service (SaaS).
[0116] Additionally, unless expressly stated in the claims, the recited order of the processing elements or sequences described herein, the use of alphanumeric characters, or the use of other designations, are not intended to limit the order of procedures and methods of the present application. While the above disclosure describes through various examples what are presently believed to be various useful embodiments of the invention, it is to be understood that such details are merely illustrative and that the appended claims are not limited to only the disclosed embodiments, but on the contrary are intended to cover all modifications and equivalent combinations within the spirit and scope of the embodiments of the present application. For example, the system assembly described above may be implemented by a hardware device, but may also be implemented as a software-only solution, for example, by installing the described system on an existing server or mobile device.
[0117] Similarly, in the foregoing description of embodiments of the present application, various features may be grouped together in a single embodiment, figure, or description for the purpose of simplifying the description of the present disclosure and facilitating an understanding of one or more embodiments of the present invention. However, this method of disclosure should not be interpreted as reflecting an intention that the present subject matter requires more features than are recited in each claim. Rather, claimed subject matter may include less than all features of a single foregoing disclosed embodiment.
[0118] In some examples, numbers describing the number of components and attributes are used, and it is understood that the numbers describing such examples are modified in some instances by the modifiers "about," "approximately," or "generally." Unless otherwise specified, "about," "approximately," or "substantially" indicate that the value described by the number is allowed to vary by ±20%. Accordingly, in some implementations, all numerical parameters used in the specification and claims are approximations that may vary depending on the characteristics required for a particular embodiment. In some embodiments, the numerical parameters should be applied with the stated number of significant digits and ordinary rounding techniques. In some embodiments, the numerical ranges and parameters for determining the ranges are approximations; however, in specific embodiments, such numerical values are set as precisely as possible.
[0119] All patents, patent applications, published patent applications, and other materials, such as articles, books, specifications, publications, documents, etc., referenced in this application are incorporated herein by reference in their entirety, except for prosecution history documents that are inconsistent or inconsistent with the content of this application, and documents that may have a limiting effect on the broadest scope of the claims of this application (now or later related to this application). In addition, if the explanations, definitions, and / or use of terms in the accompanying materials of this application are inconsistent or inconsistent with the content set forth in this application, the explanations, definitions, and / or use of terms in this application shall control.
[0120] Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are possible within the scope of the present application. Thus, by way of example, and not of limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments expressly introduced and described herein. [Explanation of symbols]
[0121] 11 Sound generating unit 112 Transducer 11211 Body area 11212 Edge Area 1122 Coil 1123 Support Frame 1124 Terminal 1125 Magnetic Circuit Assembly 11251 Magnetic permeable plate 11252 Magnet 11253 Storage material 1155 Fixing Ring 111 Housing 111a Sound emission hole 111c First decompression hole 111d Second decompression hole 114 Front Cavity 115 Connection Frame 1151 Acoustic Corridor 116 Back Cavity 12 Ear hooks
Claims
1. A diaphragm; The magnetic circuit assembly includes a magnetic circuit assembly, a coil, and a support frame that is disposed around the magnetic circuit assembly. The coil is connected to the diaphragm and at least a portion of the coil is located in a magnetic gap formed by the magnetic circuit assembly. When energized, the coil vibrates the diaphragm to generate sound. The diaphragm includes a main body region and an edge region surrounding the main body region. an acoustic generating unit, wherein a first portion of the support frame is connected to the edge region, a thickness of the first portion is within a range of 0.3 mm to 3 mm, and the thickness of the first portion is the minimum distance in the vibration direction of the vibration membrane between a connection area between the support frame and the edge region and a region of the support frame that is directly attached to the magnetic circuit assembly.
2. 2. The sound generating unit according to claim 1, further comprising a housing having a decompression hole, a back cavity being formed between the decompression hole and a rear surface of the vibrating membrane, and a resonant frequency of the back cavity being 3.3 kHz or more.
3. The volume of the back cavity is 60 mm 3 ~110mm 3 The sound generating unit according to claim 2, characterized in that the sound generating unit has a frequency of 100 Hz to 100 Hz.
4. 2. The sound generating unit of claim 1, characterized in that the main body region includes a first inclined portion and a first connection portion connected to the coil, the first inclined portion is bonded to a portion of the edge region, and the first inclined portion is inclined in a direction away from the coil relative to the first connection portion.
5. The sound generating unit according to claim 4 , wherein the edge region includes a second inclined portion, and at least a portion of the second inclined portion is bonded to the first inclined portion.
6. The sound generating unit according to claim 5 , wherein the second inclined portion is located on a side of the first inclined portion that is away from the coil.
7. 5. The sound generating unit according to claim 4, wherein the edge region includes an arcuate portion, and a ratio of the height of the arcuate portion to the span of the arcuate portion is in the range of 0.35 to 0.
4.
8. The sound generating unit of claim 4, characterized in that the inclination angle of the first inclined portion relative to the first connection portion is within a range of 5° to 30°, and the first connection portion is perpendicular to the vibration direction of the vibration membrane.
9. 5. The sound generating unit of claim 4, wherein the body region includes a dome located at one end of the first connection portion away from the first inclined portion, the span of the dome being in the range of 2 mm to 8 mm, and the height of the dome being in the range of 0.7 mm to 1.2 mm.
10. 10. The sound generating unit according to claim 9, wherein the height to span ratio of the dome is in the range of 0.1 to 0.
3.
11. 10. The sound generating unit according to claim 9, wherein the high-frequency split vibration occurs at a frequency of 20 kHz or more.
12. 10. The sound generating unit of claim 9, wherein the dome is woven from interlaced carbon fibers, and at least some of the carbon fibers interlace at a first angle in the range of 45° to 90°.
13. 10. The sound generating unit according to claim 9, wherein the thickness of the dome in the vibration direction of the diaphragm is less than 80 [mu]m.
14. The sound generating unit of claim 13, characterized in that the magnetic circuit assembly includes a magnetically permeable plate and a magnet, the magnetically permeable plate is located between the magnet and the vibration membrane and is attached to a surface of the magnet, and the distance from the lowest point of the dome to the upper surface of the magnetically permeable plate in the vibration direction of the vibration membrane is greater than 0.8 mm.
15. 2. The sound generating unit of claim 1, wherein the magnetic circuit assembly includes a housing member, and within an input voltage range of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz, a distance from a bottom of the coil to a bottom of the housing member is within a range of 0.8 mm to 0.9 mm.
16. 2. The sound generating unit according to claim 1, characterized in that the first portion of the support frame is connected to a second connection portion of the edge region.
17. 17. The sound generating unit according to claim 16, characterized in that the second connection portion of the edge region is connected to the first part of the support frame by a fixing ring.
18. 18. The sound generating unit of claim 16 or 17, further comprising a housing having a decompression hole, a plurality of air vents are formed in the support frame, sound from the rear surface of the diaphragm is transmitted to the decompression hole through the plurality of air vents, the plurality of air vents include at least a first air vent and a second air vent, the distance from the center of the first air vent to the center of the decompression hole is greater than the distance from the center of the second air vent to the center of the decompression hole, and the area of the first air vent is greater than the area of the second air vent.
19. The sound generating unit of claim 16, further comprising a housing having a decompression hole, a plurality of air vents are formed in the support frame, sound from the rear surface of the diaphragm is transmitted to the decompression hole through the plurality of air vents, and a ratio of a total area of the plurality of air vents to a projected area of the diaphragm in a vibration direction of the diaphragm is within a range of 0.008 to 0.
3.
20. In the vibration direction of the diaphragm, the projected area of the diaphragm is 90 mm 2 ~560mm 2 and the total area of the plurality of vents is within the range of 4.54 mm 2 ~12.96mm 2 20. The sound generating unit according to claim 19, wherein the sound generating unit has a frequency of 100 Hz to 100 Hz.
21. 2. The sound generating unit according to claim 1, further comprising a housing, wherein a ratio of a projected area of the diaphragm to a projected area of the housing in a vibration direction of the diaphragm is 0.5 or more.
22. 22. The sound generating unit according to claim 21, wherein a ratio of a projected area of the diaphragm to a projected area of the housing in a vibration direction of the diaphragm is within a range of 0.8 to 0.
95.
23. 22. The sound generating unit according to claim 21, wherein the vibration membrane has a major axis dimension within a range of 13 mm to 25 mm and a minor axis dimension within a range of 4 mm to 13 mm.
24. 18. The sound generating unit according to claim 16, wherein the magnetic circuit assembly includes a housing member, and a plurality of ventilation holes are formed in a bottom wall of the housing member of the magnetic circuit assembly or in a side wall attached to the support frame.
25. 5. The sound generating unit according to claim 4, wherein a minimum distance from the coil to the first inclined portion is 0.3 mm or more.
26. 2. The sound generating unit of claim 1, characterized in that the magnetic circuit assembly includes a magnetic permeable plate and a magnet, the magnetic permeable plate is located between the magnet and the vibration membrane and is attached to a surface of the magnet, and the distance between the center of the coil and the center of the magnetic permeable plate in the vibration direction of the vibration membrane is less than 0.3 mm.
27. The sound generating unit of claim 1, characterized in that the magnetic circuit assembly includes a housing member, and in the vibration direction of the vibration membrane, the distance between the bottom of the coil and the bottom wall of the housing member is within a range of 0.2 mm to 4 mm.
28. 28. The sound generating unit according to claim 27, wherein the distance between the coil and the side wall of the housing member is within a range of 0.1 mm to 0.5 mm.
Citation Information
Patent Citations
Electroacoustic transducer
JP2007235427A