Heat transfer from non-groundable electronic components

Abstract

An electronic package is provided, the electronic package comprising an electronic component, a substrate, a ground plane, a thermally conductive path, and at least one thermally conductive member. The ground plane is included in or supported by the substrate. The electronic component includes an ungroundable thermal output and is attached to the substrate. The thermally conductive path extends between an interface in the substrate exposed at a surface of the substrate and the ground plane. The thermally conductive path is configured to electrically insulate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Description

[Technical field]

[0001] background Field The present disclosure relates to electronic packages having electronic components with non-groundable thermal outputs, to electronic devices incorporating such electronic packages, and to methods of manufacturing such electronic packages. [Background technology]

[0002] 2. Description of Related Art Electronic components are known that have a non-groundable thermal output, the operation of which depends on the absence of a conductive path from the output to ground. A cascode amplifier is one example of such an electronic component, having an emitter that heats up during use. The operation of the cascode amplifier depends on the emitter not being shorted to ground. The cascode amplifier may be mounted on a substrate panel to define an electronic package, with a molded structure formed of insulating material filling the space between the emitter of the cascode amplifier and the substrate panel. Summary of the Invention [Means for solving the problem]

[0003] overview According to one aspect, an electronic package is provided that includes a substrate, at least one ground plane contained within or supported by the substrate, at least one electronic component attached to the substrate and including at least one non-groundable thermal output, at least one thermally conductive path extending within the substrate between an interface exposed on the substrate and the ground plane, the thermally conductive path configured to electrically insulate the interface from the ground plane, and at least one thermally conductive member coupling the output to the interface.

[0004] In one example, the thermally conductive member comprises a pillar extending between opposing first and second ends, the first end coupled to the output and the second end coupled to the interface, hi one example, the pillar has a substantially uniform cross-section extending from the first end to the second end.

[0005] In one example, the thermally conductive member is substantially spherical or oval in shape. In one example, the electronic package includes a plurality of thermally conductive members coupling the outputs to the interfaces.

[0006] In one example, the thermally conductive member is formed from one of copper or solder. In one example, the interface is configured for soldering.

[0007] In one example, the interface comprises a metal pad, hi one example, the metal pad is formed of copper.

[0008] In one example, the thermally conductive member comprises solder balls that define a solder connection between the output and the interface.

[0009] In one example, a first end of the thermally conductive member is soldered to the electronic component and a second end of the thermally conductive member is soldered to the interface.

[0010] In one example, a first end of the thermally conductive member is soldered to the electronic component and a second end of the thermally conductive member is in non-bonded surface contact with the interface.

[0011] In one example, a first end of the thermally conductive member is in non-bonded surface contact with the output portion and a second end of the thermally conductive member is soldered to the interface.

[0012] In one example, the thermally conductive path includes or consists of either aluminum nitride, silicon carbide, or diamond.

[0013] In one example, the thermal conduction path comprises or consists of an electrically insulating material whose thermal conductivity at room temperature is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0014] In one example, the thermally conductive path comprises at least one section of a thermally conductive, electrically insulating material.

[0015] In one example, the thermally conductive path further comprises one or more electrically conductive portions, and the section of thermally conductive, electrically insulating material is coupled to the one or more electrically conductive portions so as to electrically insulate the interface from the ground plane.

[0016] In one example, the section of thermally conductive, electrically insulating material comprises or consists of either aluminum nitride, silicon carbide, or diamond.

[0017] In one example, a section made of a thermally conductive, electrically insulating material has a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0018] In one example, the one or more conductive portions are formed from copper. In one example, the one or more conductive portions include one or more conductive paths coupled to one or more vias.

[0019] In one example, a section of thermally conductive, electrically insulating material is encapsulated within the substrate. In one example, the section of thermally conductive, electrically insulating material is positioned relative to a ground plane.

[0020] In one example, an exposed area of ​​a portion of thermally conductive, electrically insulating material defines the interface.

[0021] In one example, a metal layer is defined on the exposed area of ​​the portion of the thermally conductive, electrically insulating material, the metal layer defining an interface, hi one example, the metal layer is configured for soldering.

[0022] In one example, the at least one non-groundable thermal output includes first and second non-groundable thermal outputs.

[0023] In one example, the at least one electronic component includes first and second electronic components, the first electronic component including a first non-groundable thermal output and the second electronic component including a second non-groundable thermal output.

[0024] In one example, the at least one thermal conduction path includes first and second thermal conduction paths, the first thermal conduction path extending between a first interface exposed on the substrate and a ground plane, and the second thermal conduction path extending between a second interface exposed on the substrate and the ground plane.

[0025] In one example, the first thermally conductive path is configured to electrically insulate the first interface from the ground plane, and the second thermally conductive path is configured to electrically insulate the second interface from the ground plane.

[0026] In one example, the at least one thermally conductive member includes a first thermally conductive member and a second thermally conductive member, the first thermally conductive member coupling the first output to the first interface and the second thermally conductive member coupling the second output to the second interface.

[0027] In one example, the first and second thermally conductive paths include or consist of either aluminum nitride, silicon carbide, or diamond.

[0028] In one example, the first and second thermal conduction paths comprise or consist of an electrically insulating material having a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0029] In one example, the first and second thermally conductive paths comprise respective first and second portions of a thermally conductive, electrically insulating material, the first and second portions being spatially distinct from one another.

[0030] In one example, the first and second sections of thermally conductive, electrically insulating material comprise or consist of either aluminum nitride, silicon carbide, or diamond.

[0031] In one example, the first and second portions comprise or consist of an electrically insulating material having a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0032] In one example, the first and second thermally conductive paths include a shared portion of a thermally conductive, electrically insulating material that couples the first and second thermally conductive paths to one another.

[0033] In one example, the shared portion of thermally conductive, electrically insulating material comprises or consists of either aluminum nitride, silicon carbide, or diamond.

[0034] In one example, the shared portion comprises or consists of an electrically insulating material having a thermal conductivity at room temperature within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0035] In one example, either or both of the first and second thermally conductive members include a pillar extending between opposing first and second ends, the first end coupled to a respective first or second output, and the second end coupled to a respective first or second interface. In one example, the pillar has a uniform cross-section extending from the first end to the second end.

[0036] In one example, either or both of the first and second thermally conductive members are substantially spherical or oval in shape.

[0037] In one example, a plurality of first thermally conductive members couple the first output to the first interface.

[0038] In one example, a plurality of second thermally conductive members couple the second output to the second interface.

[0039] In one example, either or both of the first and second thermally conductive members are formed of copper or solder.

[0040] In one example, the electronic component comprises a cascode power amplifier. In one example, the electronic components are integrated into a die and the die is attached to a substrate.

[0041] In one example, the die is attached to the substrate by surface-mount technology (SMT). In one example, the die is attached to the substrate by solder balls or wire bonds.

[0042] In one example, the electronic components are surface mount technology (SMT) components. In one example, the electronic components are attached directly to the substrate by SMT. In one example, the electronic components are attached directly to the substrate by solder balls or wire bonds.

[0043] According to another aspect, an electronic device is provided that includes a circuit board configured to receive one or more electronic packages and an electronic package attached to the circuit board, the electronic package including a substrate, at least one ground plane contained within or supported by the substrate, at least one electronic component attached to the substrate and including at least one non-groundable thermal output, at least one thermally conductive path extending within the substrate between an interface exposed on the substrate and the ground plane and configured to electrically insulate the interface from the ground plane, and at least one thermally conductive member coupling the output to the interface.

[0044] In one example, the electronic device is a wireless mobile device. According to another aspect, there is provided a method for manufacturing an electronic package, the method including providing at least one electronic component including at least one non-groundable thermal output, providing a substrate including or supporting a ground plane, defining at least one thermally conductive path extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.

[0045] In one example, the thermally conductive member includes a pillar extending between opposing first and second ends, and the step of attaching the electronic component to the substrate includes coupling the first end of the pillar to the output and coupling the second end of the pillar to the interface. In one example, the pillar has a substantially uniform cross-section extending from the first end to the second end.

[0046] In one example, the thermally conductive member is substantially spherical or oval in shape. In one example, the attaching step includes thermally coupling the output to the interface with a plurality of thermally conductive members.

[0047] In one example, the thermally conductive member is formed from copper or solder. In one example, the interface is configured for soldering.

[0048] In one example, thermally coupling the output to the interface includes soldering a thermally conductive member to the interface.

[0049] In one example, the interface comprises a metal pad, hi one example, the metal pad is formed of copper.

[0050] In one example, the thermally conductive member comprises a solder ball, and thermally coupling the output to the interface includes heating the solder ball to define a solder connection between the output and the interface.

[0051] In one example, thermally coupling the output to the interface includes soldering a first end of a thermally conductive member to the electronic component and soldering a second end of the thermally conductive member to the interface.

[0052] In one example, thermally coupling the output to the interface includes soldering a first end of a thermally conductive member to the electronic component and positioning a second end of the thermally conductive member in non-bonded surface contact with the interface.

[0053] In one example, thermally coupling the output portion to the interface includes placing a first end of a thermally conductive member in non-bonded surface contact with the output portion and soldering a second end of the thermally conductive member to the interface.

[0054] In one example, the thermally conductive path includes or consists of either aluminum nitride, silicon carbide, or diamond.

[0055] In one example, the thermal conduction path comprises or consists of an electrically insulating material whose thermal conductivity at room temperature is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0056] In one example, the thermally conductive path comprises at least one section of a thermally conductive, electrically insulating material.

[0057] In one example, the thermally conductive path further comprises one or more conductive portions, and defining the thermally conductive path includes coupling a section of thermally conductive, electrically insulating material to the one or more conductive portions such that the interface is electrically insulated from the ground plane.

[0058] In one example, the section of thermally conductive, electrically insulating material comprises or consists of either aluminum nitride, silicon carbide, or diamond.

[0059] In one example, a section made of a thermally conductive, electrically insulating material has a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0060] In one example, the one or more conductive portions are formed from copper. In one example, the one or more conductive portions include one or more conductive paths coupled to one or more vias.

[0061] In one example, defining the thermally conductive path includes encapsulating a section of thermally conductive, electrically insulating material within the substrate.

[0062] In one example, defining the thermally conductive path includes placing a section of thermally conductive, electrically insulating material relative to the ground plane.

[0063] In one example, an exposed area of ​​a portion of thermally conductive, electrically insulating material defines the interface.

[0064] In one example, the method further includes providing a metal layer on the exposed area of ​​the portion of thermally conductive, electrically insulating material, the metal layer defining the interface.

[0065] In one example, the metal layer is configured for soldering. In one example, thermally coupling the output to the interface includes soldering a thermally conductive member to the metal layer.

[0066] In one example, the at least one non-groundable thermal output includes first and second non-groundable thermal outputs.

[0067] In one example, the at least one electronic component includes first and second electronic components, the first electronic component including a first non-groundable thermal output and the second electronic component including a second non-groundable thermal output.

[0068] In one example, the step of defining at least one thermal conduction path includes defining a first thermal conduction path extending between a first interface exposed on the substrate and a ground plane, and defining a second thermal conduction path extending between a second interface exposed on the substrate and the ground plane.

[0069] In one example, a first thermally conductive path is defined to electrically isolate the first interface from the ground plane, and a second thermally conductive path is defined to electrically isolate the second interface from the ground plane.

[0070] In one example, the attaching step includes thermally coupling the first output to the first interface with at least one first thermally conductive member, and thermally coupling the second output to the second interface with at least one second thermally conductive member.

[0071] In one example, the first and second thermally conductive paths include or consist of either aluminum nitride, silicon carbide, or diamond.

[0072] In one example, the first and second thermal conduction paths comprise or consist of an electrically insulating material having a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0073] In one example, the first and second thermally conductive paths comprise respective first and second portions of a thermally conductive, electrically insulating material, the first and second portions being positioned to be spatially distinct from one another.

[0074] In one example, the first and second sections of thermally conductive, electrically insulating material comprise or consist of either aluminum nitride, silicon carbide, or diamond.

[0075] In one example, the first and second portions comprise or consist of an electrically insulating material having a thermal conductivity at room temperature that is within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0076] In one example, the first and second thermally conductive paths include a shared portion of a thermally conductive, electrically insulating material that couples the first and second thermally conductive paths to one another.

[0077] In one example, the shared portion of thermally conductive, electrically insulating material comprises or consists of either aluminum nitride, silicon carbide, or diamond.

[0078] In one example, the shared portion comprises or consists of an electrically insulating material having a thermal conductivity at room temperature within 35%, or within 30%, or within 25%, or within 20%, or within 15%, or within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0079] In one example, either or both of the first and second thermally conductive members include a pillar extending between opposing first and second ends, and mounting the electronic component to the substrate includes coupling the first end of the pillar to a respective first or second output and coupling the second end of the pillar to a respective first or second interface. In one example, the pillar has a uniform cross-section extending from the first end to the second end.

[0080] In one example, either or both of the first and second thermally conductive members are substantially spherical or oval in shape.

[0081] In one example, the attaching step includes thermally coupling the first output to the first interface with a plurality of first thermally conductive members.

[0082] In one example, the attaching step includes thermally coupling the second output to the second interface with a plurality of second thermally conductive members.

[0083] In one example, either or both of the first and second thermally conductive members are formed of copper or solder.

[0084] In one example, the at least one electronic component comprises a cascode power amplifier. In one example, at least one electronic component is integrated into a die, and attaching the electronic component to the substrate includes attaching the die to the substrate.

[0085] Further aspects, embodiments, and advantages of these exemplary aspects and embodiments are described in detail below. The embodiments disclosed herein may be combined with other embodiments in any manner not inconsistent with at least one of the principles disclosed herein, and references to "embodiments," "some embodiments," "another embodiment," "various embodiments," "one embodiment," and the like are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described may be included in at least one embodiment. Appearances of such terms in this specification do not necessarily all refer to the same embodiment.

[0086] BRIEF DESCRIPTION OF THE DRAWINGS Various aspects of at least one embodiment are described below with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are included to provide illustration and further understanding of the various aspects and embodiments, and are incorporated into and constitute a part of this specification, but are not intended as a definition of the limits of the disclosed aspects and embodiments. In the drawings, each of the same or nearly identical components shown in the various figures are represented by a similar reference numeral. For purposes of clarity, not all components are labeled in every figure. [Brief description of the drawings]

[0087] [Figure 1] 1 is a cross-sectional schematic diagram of a background art electronic package; [Diagram 2] 1 is a cross-sectional schematic diagram of a first example of an electronic package according to some embodiments of the present disclosure. [Figure 3A] FIG. 3 is a detailed schematic diagram of region “A” of the electronic package shown in FIG. 2, illustrating an example of how a thermally conductive member can be coupled between an ungroundable thermal output of an electronic component and an interface provided on a substrate of the electronic package. [Figure 3B] FIG. 3 is a detailed schematic diagram of region “A” of the electronic package shown in FIG. 2, illustrating an example of how a thermally conductive member can be coupled between an ungroundable thermal output of an electronic component and an interface provided on a substrate of the electronic package. [Figure 3C] FIG. 3 is a detailed schematic diagram of region “A” of the electronic package shown in FIG. 2, illustrating an example of how a thermally conductive member can be coupled between an ungroundable thermal output of an electronic component and an interface provided on a substrate of the electronic package. [Figure 4] 1 is a cross-sectional schematic diagram of a second example of an electronic package according to some embodiments of the present disclosure. [Diagram 5] FIG. 2 is a cross-sectional schematic diagram of a third example of an electronic package according to some embodiments of the present disclosure. [Figure 6]FIG. 13 is a cross-sectional schematic diagram of a fourth example of an electronic package according to some embodiments of the present disclosure. [Figure 7] 1 illustrates steps of a first example method for manufacturing an electronic package according to some aspects of the present disclosure. [Figure 8] 1 illustrates an electronic package implemented in a wireless device according to some aspects of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0088] Detailed Description Aspects and embodiments described herein relate to electronic packages, electronic devices comprising the electronic packages, and methods of manufacturing the electronic packages. The electronic packages may be suitable for bonding to a separate circuit board.

[0089] In particular, aspects and embodiments described herein provide for mounting an electronic component having an ungroundable thermal output to a substrate panel to form an electronic package, and the electronic package and method of manufacture thereof provide for transferring heat from the ungroundable thermal output to the substrate panel to avoid overheating of the electronic component while avoiding shorting the output to ground.

[0090] It is to be understood that the embodiments of the packages, devices, and methods described herein are not limited in application to the details of the configuration and arrangement of components set forth in the following description or illustrated in the accompanying drawings. The packages, devices, and methods are capable of implementation in other embodiments and of being practiced or carried out in various ways. Examples of specific implementations are provided herein for purposes of illustration only and are not intended to be limiting. Additionally, the phraseology and terminology used herein are for purposes of description and should not be considered limiting. The use herein of "including," "comprising," "having," "containing," "involving," and variations thereof, is meant to encompass the items listed therein and equivalents thereof as well as additional items. References to "or" may be construed as inclusive, such that any term described using "or" may refer to any one, more than one, and all of the described term.

[0091] 1 shows a cross-sectional schematic diagram of a background art electronic package 1. Electronic package 1 comprises a semiconductor die 20 mounted on a substrate panel 30. Semiconductor die 20 defines an integrated circuit, of which electronic component 21 forms a part. Electronic component 21 has an ungroundable thermal output 22. Correct operation of electronic component 21 depends on avoiding shorting ungroundable output 22 to ground.

[0092] The substrate panel 30 includes a plurality of conductive pads 31, 32 disposed on a first surface 33a of the substrate panel 30. Each of the conductive pads 31, 32 is electrically coupled to a ground plane 34 via a conductive path extending through the substrate panel 30.

[0093] The semiconductor die 20 is attached to the first surface 33a of the substrate panel 30 via an annular arrangement of connectors arranged around the periphery of the underside of the die. The connectors 23 are in the form of solder balls, each of which is soldered to a corresponding one of the conductive pads 31. The space between the die 20 and the first surface 33a of the substrate panel 30 is filled with a mold structure 40 of epoxy material, and the solder balls 23 are encapsulated within the mold structure. The epoxy mold structure 40 is thermally insulating and therefore prevents the transfer of heat from the non-groundable thermal output 22 of the electronic component 21. The prevention of the transfer of heat from the output 22 may make it necessary to limit the current through the component and / or limit the duty cycle of the component to avoid overheating of the electronic component 21.

[0094] Electronic packages and their features: FIG. 2 illustrates a cross-sectional schematic diagram of a first example of an electronic package 100 according to some aspects of the disclosure. The electronic package 100 includes a semiconductor die 200 attached to a substrate panel 300. The semiconductor die 200 defines an integrated circuit, and an electronic component 201 forms a part of the integrated circuit. In the illustrated example, the electronic component 201 is a cascode power amplifier having an emitter 202 that cannot be grounded. During operation of the cascode power amplifier 201, the temperature of the emitter 202 increases. However, the correct operation of the cascode power amplifier 201 depends on the emitter 202 not being shorted to ground. Thus, the emitter 202 of the cascode power amplifier 201 corresponds to a "thermal output that cannot be grounded". However, it will be understood that the electronic component 201 is not limited to being a cascode power amplifier. Rather, the electronic component 201 may be any electronic component having a thermal output, where the correct operation of the component depends on the output being ungrounded.

[0095] The substrate panel 300 is generally planar in form. The substrate panel 300 may have a laminated structure. The substrate panel 300 may include a ceramic substrate. The ceramic substrate may include a low temperature co-fired ceramic substrate. However, it will be understood that other materials may be used to form the substrate panel 300. The substrate panel 300 may define a printed circuit board.

[0096] The substrate panel 300 includes a plurality of conductive pads 301, 302 disposed on a first surface 303a of the substrate panel 300. A ground plane 304 is defined on a second surface 303b of the substrate panel 300. Each of the conductive pads 301 is electrically coupled to the ground plane 304 via a conductive path 305 extending through the substrate panel 300. The conductive path 305 is defined by a combination of the conductive paths L1-L4 and vias embedded in the substrate panel 300. The conductive pads 301, 302, the conductive path 305, and the ground plane 304 may be formed of copper, which is thermally and electrically conductive. At an ambient room temperature of 20° C., copper has a thermal conductivity of approximately 401 W / m° C. and a thermal conductivity of approximately 59.6×10 6 304 has a conductivity of 1000 siemens / meter (S / m). However, it will be appreciated that other electrically and / or thermally conductive materials may be used for any of the conductive pads 301, 302, the conductive paths 305, and / or the ground plane 304. It will also be appreciated that in other embodiments, the ground plane 304 may be completely embedded within the substrate panel 300.

[0097] The semiconductor die 200 is attached to the first surface 303a of the substrate panel 300 via an annular array of connectors 203 arranged around the periphery of the underside of the die. The connectors 203 are arranged to directly couple the die 200 to corresponding ones of the conductive pads 301. The array of connectors 203 may provide electrical and thermal coupling between the die 200 and the substrate panel 300. The connectors 203 are in the form of solder balls. It will be appreciated that in other embodiments, an annular array of metal pillars may be used instead of the solder balls. By way of example, such metal pillars may be formed of copper or other conductive metal / metal alloy, with both ends of the pillars soldered to the die 200 and the substrate panel 300, respectively. It will be further appreciated that the connectors 203 may be any suitable form of surface mount technology (SMT) suitable for attaching the die 200 to the substrate panel 300.

[0098] The thermally conductive member 500 is provided for directly coupling the emitter 202 of the cascode power amplifier 201 to the conductive pad 302. The thermally conductive member 500 shown in FIG. 2 has the form of a cylindrical pillar of copper with a substantially uniform cross-section between first and second opposing ends 501, 502 of the pillar, which directly couple to the non-groundable emitter 202 and the conductive pad 302, respectively. It will be appreciated that the thermally conductive member 500 may have a cross-sectional shape other than cylindrical and / or may have a cross-sectional shape that may vary between the ends. For example, the thermally conductive member 500 may be spheroidal or oval in shape. It will also be appreciated that thermally conductive materials other than copper may be used for the thermally conductive member 500, for example solder balls may be used instead of copper. Thermally conductive metals / metal alloys other than copper may be employed for the thermally conductive member 500.

[0099] A mold structure 400 fills the space defined between the underside of the die 200 and the first surface 303a of the substrate panel 300. The mold structure 400 may be formed from an epoxy material. However, it will be understood that in other embodiments, other materials may be used to form the mold structure 400. The thermally conductive member 500 and the array of solder balls 203 are substantially encapsulated in the mold structure 400.

[0100] Although the example of FIG. 2 shows only a single thermally conductive member 500 coupling the emitter 202 to the conductive pad 302, it will be understood that in other embodiments, multiple thermally conductive members 500 may be used to couple the emitter 202 to the conductive pad 302.

[0101] 2, the conductive pad 302 is integrated with a first conductive portion 306a. The first conductive portion 306a extends from the pad 302 into the interior of the substrate panel 300. A second conductive portion 306b is integrated with the ground plane 304 and extends from the ground plane into the interior of the substrate panel 300. A section 307 of thermally conductive, electrically insulating material is encapsulated within the substrate panel 200. The thermally conductive, electrically insulating material used for section 307 may be aluminum nitride, as shown in FIG. 2. Aluminum nitride has a thermal conductivity of the order of 321 W / m° C. at room temperature, while also being an electrical insulator. However, in other embodiments, silicon carbide, diamond, or other materials that combine the properties of being thermally conductive and electrically insulating may be used for section 307. In embodiments in which the thermally conductive pillar 500, the conductive pad 302, and the first and second conductive portions 306a, 306b are formed from copper, it may be preferable to use a thermally conductive, electrically insulating material having a thermal conductivity close to that of copper for the portion 307. In other embodiments, the material used for the thermally conductive and electrically insulating portion 307 may be selected to have a thermal conductivity within 35%, within 30%, within 25%, within 20%, within 15%, within 10%, or within 5% of the thermal conductivity of copper at room temperature.

[0102] 2, the first conductive portion 306a, the thermally conductive and electrically insulating section 307, and the second conductive portion 306b are arranged in succession to define a thermal conduction path 308 extending between the conductive pad 302 and the ground plane 304. The section 307 of thermally conductive and electrically insulating material physically separates and electrically isolates the first and second conductive portions 306a, 306b from one another while allowing the conduction of heat received from the emitter 202 via the thermally conductive pillar 500 along the length of the thermal conduction path 308. In this manner, the emitter 202 and the conductive pad 302 are electrically isolated from the ground plane 304, thereby avoiding shorting of the emitter to ground.

[0103] 3A-3B are detailed schematic diagrams of region "A" of electronic package 100 of FIG. 2, showing three examples of how the cylindrical copper pillars that define thermally conductive member 500 can be bonded between emitter 202 and conductive pad 302. For convenience, mold structure 400 has been omitted from these figures.

[0104] 3A, first and second opposing ends 501, 502 of cylindrical copper pillar 500 are connected to corresponding surfaces of die 200 and conductive pad 302 by respective solder connections 511, 512. Solder connections 511, 512 are formed from sections of solder printed on both ends of pillar 500 and / or corresponding surfaces of die 200 and pad 302, and heat is applied to the printed solder to form solder connections 511, 512 that couple pillar 500 to die 200 and conductive pad 302, respectively. A solder mask 513 may be provided on the surfaces of die 200 and pad 302 to surround solder connections 511, 512. Solder connections 511, 512 ensure that both ends 501, 502 of the cylindrical copper pillar 500 are held in surface contact with the emitter 202 and pad 302, respectively.

[0105] In the example of FIG. 3B, a first end 501 of a cylindrical copper pillar 500 is connected to the underside of the die 200 by a solder connection 511, and a second end 502 of the pillar is in non-bonded surface contact with the conductive pad 302. A non-bonded contact is such that the cylindrical copper pillar 500 and the conductive pad 302 are in surface contact with each other but are not physically bonded to each other. The solder connection 511 is formed from a section of solder printed on the first end 501 of the pillar 500 and / or the corresponding surface of the die 200, and heat is applied to the printed solder to form the solder connection 511 that couples the first end 501 of the pillar 500 to the die 200. Coupling of the die 200 to the substrate panel 300 by the connector 203 (as shown in FIG. 2) ensures that the second end 502 of the pillar 500 is held in surface contact with the conductive pad 302. Similar to the example of FIG. 3A, opposite ends 501, 502 of a cylindrical copper pillar 500 are held in surface contact with the emitter 202 and conductive pad 302, respectively.

[0106] In the example of FIG. 3C, the first end 501 of the cylindrical copper pillar 500 is in non-bonded surface contact with the emitter 202, and the second end 502 of the pillar is connected to the conductive pad 302 by a solder connection 512. The non-bonded contact is such that the cylindrical copper pillar 500 and the die 200 are in surface contact with each other but are not physically bonded to each other. The solder connection 512 is formed from a section of solder printed on the second end 502 of the pillar 500 and / or the corresponding surface of the conductive pad 302, and heat is applied to the printed solder to form the solder connection 512 that couples the second end 502 of the pillar 500 to the conductive pad 302. The coupling of the die 200 to the substrate panel 300 by the connector 203 (as shown in FIG. 2) ensures that the first end 501 of the pillar 500 is held in surface contact with the emitter 202. Similar to the example of FIG. 3A, opposite ends 501, 502 of a cylindrical copper pillar 500 are held in surface contact with the emitter 202 and conductive pad 302, respectively.

[0107] 3A-3C, as indicated in the preceding paragraphs of this disclosure, the thermally conductive member 500 may have a cross-section other than a cylindrical pillar and / or may be formed from a thermally conductive material other than copper. By way of example, the thermally conductive member 500 may be provided as a solder ball, which defines a solder connection between corresponding surfaces of the die 200 and the conductive pads 302.

[0108] 2, the connector 203 and the thermally conductive member 500 may be coupled to the semiconductor die 200 before the die is attached to the substrate panel 300. For example, the connector 203 and the thermally conductive member 500 may first be coupled to the die 200 by a soldering operation. The die 200 may then be positioned above the first surface 303a of the substrate panel 300 such that the connector 203 and the thermally conductive member 500 are positioned against the corresponding conductive pads 301, 302. A soldering operation may then be performed to couple the connector 203 and the thermally conductive member 500 to the pads 301, 302. An epoxy material may then be injected into the space between the underside of the die 200 and the first surface 303a of the substrate panel 300 to fill the space and form the mold structure 400 (see FIG. 2). The mold structure 400 substantially encapsulates the thermally conductive member 500 and the connector 203. As discussed above, it will be appreciated that in other embodiments, other materials may be used to form the mold structure 400.

[0109] When power is applied to the semiconductor die 200 of the electronic package 100, the cascode power amplifier 201 operates. The operation of the cascode power amplifier 201 results in heating of the emitter 202. Heat from the emitter 202 is conducted to the conductive pad 302 via the thermally conductive member 500. The heat is then conducted along the thermally conductive path 308 to the ground plane 304. The thermally conductive properties of the section 307 of aluminum nitride (or other suitable thermally conductive, electrically insulating material) facilitate the conduction of heat between the conductive pad 302 and the ground plane 304. The electrically insulating properties of the section 307 of aluminum nitride (or other suitable thermally conductive, electrically insulating material) facilitate the electrical isolation of the emitter 202 and the conductive pad 302 from the ground plane 304, thereby avoiding shorting the emitter to ground.

[0110] FIG. 4 illustrates a cross-sectional schematic diagram of a second example of an electronic package 100′ according to some aspects of the disclosure. Features of the electronic package 100′ in common with the electronic package 100 of FIG. 2 are referenced by similar reference numerals. The electronic package 100′ of FIG. 4 differs from the electronic package 100 of FIG. 2 in that a section 307′ of aluminum nitride (or other suitable thermally conductive, electrically insulating material) is disposed relative to the conductive pad 302. Thus, with respect to the electronic package 100′ of FIG. 4, a thermally conductive path 308′ extending between the conductive pad 302 and the ground plane 304 is formed by the continuous arrangement of the section 307′ of aluminum nitride and the conductive portion 306b′. As shown in FIG. 4, the conductive portion 306b′ is coupled to the conductive path 305 extending between the conductive pad 301 and the ground plane 304. The location of aluminum nitride (or other suitable thermally conductive, electrically insulating material) portion 307' is such that the emitter 202 and conductive pad 302 remain electrically isolated from the conductive path 305 and ground plane 304.

[0111] 4, the exposed areas of the aluminum nitride portions 307′ may be covered with a metal layer that replaces the conductive pads 302. This metal layer may be configured to receive soldering, such that the thermal conduction member 500 may be soldered to the metal layer.

[0112] FIG. 5 illustrates a cross-sectional schematic view of a third example of an electronic package 100″ according to some embodiments of the present disclosure. Features of the electronic package 100″ in common with the electronic package 100 of FIG. 2 are referenced by like reference numerals. The electronic package 100″ of FIG. 5 differs from the electronic package 100 of FIG. 2 in that a section of aluminum nitride (or other suitable thermally conductive, electrically insulating material) is disposed relative to the ground plane 304. Thus, with respect to the electronic package 100″ of FIG. 5, the thermally conductive path 308″ extending between the conductive pad 302 and the ground plane 304 is formed by the continuous disposition of the conductive portion 306a″ and the section of aluminum nitride (or other suitable thermally conductive, electrically insulating material). The location of the section of aluminum nitride is such that the emitter 202 and the conductive pad 302 remain electrically insulated from the ground plane 304.

[0113] FIG. 6 illustrates a cross-sectional schematic view of a fourth example of an electronic package 100′″ according to some embodiments of the present disclosure. Features of the electronic package 100′″ in common with the electronic package 100 of FIG. 2 are referenced by like reference numerals. The electronic package 100′″ of FIG. 6 differs from the electronic packages 100, 100′, 100″ of FIGS. 2, 4, and 5 in that the semiconductor die 200 includes first and second ungroundable thermal outputs 2021, 2022. The first and second ungroundable thermal outputs 2021, 2022 form part of respective first and second electronic components 2011, 2012. Each of the electronic components 2011, 2012 may be in the form of a cascode power amplifier, with the outputs 2021, 2022 being respective emitters of the cascode power amplifiers. However, as previously mentioned, it will be understood that the electronic components 2011, 2012 are not limited to being cascode power amplifiers. Rather, electronic components 2011, 2012 may be any electronic component having a thermal output where correct operation of the component depends on the output being ungrounded. It will further be appreciated that in other embodiments, non-groundable thermal outputs 2021, 2022 are not related to separate electronic components 2011, 2012, but may form part of the same electronic component.

[0114] First and second thermally conductive members 5001, 5002 directly couple the respective first and second non-groundable thermal output portions 2021, 2022 to the respective conductive pads 3021, 3022. Similar to the example of FIG. 2, the thermally conductive members 5001, 5002 shown in FIG. 6 have the form of cylindrical pillars of copper having a substantially uniform cross-section between opposed first and second ends. Both ends of each pillar directly couple to a corresponding output portion 2021, 2022 and conductive pad 3021, 3022. Again, it will be appreciated that the thermally conductive members 5001, 5002 may have a cross-sectional shape other than cylindrical and / or may have a cross-sectional shape that may vary between the ends, for example, the thermally conductive members 5001, 5002 may be spheroidal or oval in shape. It will also be appreciated that thermally conductive materials other than copper may be used for the thermally conductive members 5001, 5002, for example solder balls may be used instead of copper. Thermally conductive metals / metal alloys other than copper may also be employed for the thermally conductive member 500.

[0115] The first and second conductive pads 3021, 3022 are integrated with respective conductive portions 3061a, 3062a. The conductive portions 3061a, 3062a extend from their corresponding pads 3021, 3022 into the interior of the substrate panel 300. The conductive portions 3061b, 3062b are integrated with the ground plane 304 and extend from the ground plane into the interior of the substrate panel 300. A single section of thermally conductive, electrically insulating material is encapsulated within the substrate panel 300. A first thermally conductive path 3081 is defined between the conductive pad 3021 and the ground plane 304 by the sequential arrangement of the conductive portion 3061a, the thermally conductive and electrically insulating portion, and the conductive portion 3061b. Similarly, a second thermal conduction path 3082 is defined between the conductive pad 3022 and the ground plane 304 by the sequential arrangement of the conductive portion 3062a, the thermally conductive and electrically insulating portion, and the conductive portion 3062b. The thermally conductive and electrically insulating portion is included in both the first and second thermal conduction paths 3081, 3082. The thermally conductive and electrically insulating portion thermally couples the first and second thermal conduction paths 3081, 3082 to each other. The thermally conductive and electrically insulating portion provides conduction of heat received from the output portions 2021, 2022 through the thermally conductive members 5001, 5002 and the pads 3021, 3022 while ensuring that the output portions 2021, 2022 and the respective conductive pads 3021, 3022 remain electrically insulated from the ground plane 304. It can thus be seen that it is possible to conduct heat from the non-groundable thermal outputs 2021, 2022 to the substrate panel 300 while avoiding shorting the outputs to ground. As discussed above with respect to the examples of Figures 2, 4 and 5, the thermally conductive and electrically insulating material used in the thermally conductive and electrically insulating sections may be aluminum nitride. However, in other embodiments, silicon carbide, diamond, or other materials that combine the properties of being thermally conductive and electrically insulating may be used in the thermally conductive and electrically insulating sections.In embodiments in which the thermally conductive pillars 5001, 5002, the conductive pads 3021, 3022, and the first and second conductive portions 3061a / b, 3062a / b are formed from copper, it may be preferable to use a thermally conductive, electrically insulating material for the thermally conductive, electrically insulating portions that has a thermal conductivity close to that of copper. In other embodiments, the material used for the thermally conductive, electrically insulating portions may be selected to have a thermal conductivity within 35%, 30%, 25%, 20%, 15%, 10%, or 5% of the thermal conductivity of copper at room temperature.

[0116] Although FIG. 6 shows sections of thermally conductive, electrically insulating material coupling the first and second thermally conductive paths 3081, 3082 to one another, in other embodiments the first and second thermally conductive paths may be separate from one another, with each path having a separate section of thermally conductive, electrically insulating material instead of a shared section.

[0117] Although FIGS. 2 and 4-6 show exemplary electronic packages in which the electronic components are attached to a single side of the packaging substrate 300, in other embodiments the electronic package may be a double-sided electronic package.

[0118] It will also be appreciated that in other embodiments, the semiconductor die 200 may be attached to the substrate panel 300 by any suitable form of surface mount technology (SMT), such as, for example, but not limited to, wire bonding.

[0119] It will also be appreciated that in other embodiments, electronic components 201, 2011, 2012 may be SMT components that are attached directly to substrate panel 300 by SMT, without being incorporated into or forming part of a semiconductor die.

[0120] Electronic packaging manufacturing method: FIG. 7 illustrates various exemplary steps in a method 1000 for manufacturing an electronic package, such as electronic package 100, 100', 100'', or 100''' described above. Method 1000 is applicable, but not limited to, to the manufacture of electronic packages 100, 100', 100'', and 100''' of FIGS. 2, 4, 5, and 6. For convenience, method 1000 will be described with reference to features of electronic package 100 of FIG. 2.

[0121] In a first step 1001, an electronic component 201 is provided, the electronic component having at least one non-groundable thermal output 202. As mentioned above, the electronic component 201 may take the form of a cascode power amplifier having a non-groundable emitter 202. However, as mentioned above, it will be appreciated that the electronic component 201 is not limited to being a cascode power amplifier. Rather, the electronic component 201 may be any electronic component having a thermal output 202, the correct operation of which depends on the output being non-grounded. As explained in relation to FIG. 2, the electronic component 201 forms part of an integrated circuit of a semiconductor die 200. However, as mentioned above, it will be appreciated that in other embodiments the electronic component 201 may be directly mountable to the substrate panel 300 by SMT, without being incorporated in or forming part of the semiconductor die.

[0122] In a second step 1002, a substrate is provided, the substrate encasing or supporting a ground plane 304. The substrate may be in the form of a substrate panel 300, as described in relation to FIG.

[0123] In a third step 1003, a thermally conductive path is defined extending between the interface exposed on the substrate and a ground plane, the interface being electrically isolated from the ground plane. As described in connection with FIG. 2, the thermally conductive path may be in the form of a thermally conductive path 308. The thermally conductive path 308 may extend between the interface (such as the conductive pad 302) and the ground plane 304. Using a section 307 of aluminum nitride (or other suitable thermally conductive, electrically insulating material) to form all or part of the thermally conductive path 308 facilitates electrical isolation of the conductive pad 302 from the ground plane 304 while allowing heat to be conducted along the path 308.

[0124] In a fourth step 1004, the electronic component 201 is attached to the substrate. The attaching step 1004 includes thermally coupling the non-groundable thermal output 202 to the interface with at least one thermally conductive member. As mentioned above, the interface may be in the form of a conductive pad 302 and the thermally conductive member may be in the form of the thermally conductive member 500 described above. The thermally conductive member 500 may be coupled between the output 202 and the conductive pad 302. As described in the preceding paragraphs and shown in the figures, the thermally conductive member 500 may have the form of a cylindrical pillar of copper having a substantially uniform cross-section between first and second opposing ends 501, 502 of the pillar (see FIG. 2). It will be appreciated that the thermally conductive member 500 may have a cross-sectional shape other than cylindrical and / or may have a cross-sectional shape that may vary between the ends. For example, the thermally conductive member 500 may be spheroidal or oval in shape. It will also be appreciated that thermally conductive materials other than copper may be used for the thermally conductive member 500, for example, solder balls may be used instead of copper. Thermally conductive metals / metal alloys other than copper may also be employed for the thermally conductive member 500. Various non-limiting examples of coupling the thermally conductive member 500 to the output portion 202 and the conductive pads 302 are shown in Figures 3A-3C and described above.

[0125] The electronic package resulting from method 1000 can correspond to, but is not limited to, electronic packages 100, 100', 100'', or 100''' of Figures 2, 4, 5, and 6. As noted above, it will be understood that the above descriptions of the technical features, materials, and other characteristics of the various features of electronic packages 100, 100', 100'', or 100''' of Figures 2, 4, 5, and 6 are applicable to manufacturing method 1000 outlined in Figure 7.

[0126] Exemplary devices incorporating the electronic package: The electronic packages described herein may be included in electronic devices such as wireless devices. By way of example and not limitation, such wireless devices may include, for example, mobile phones, smart phones, handheld wireless devices with or without telephony capabilities, wireless tablets, wireless routers, wireless access points, wireless base stations, etc. However, it will be understood that the electronic packages of the present disclosure are not limited to incorporation into wireless devices.

[0127] 8 illustrates an exemplary implementation of the electronic package 101 of the present disclosure in a WLAN-enabled device 800. The electronic package 101 is in the form of a WLAN FE module to which various semiconductor dies, such as die 200, are attached. The die 200 may include a low noise amplifier (LNA) 211, a power amplifier (PA) 212, and a transmit / receive (T / R) switch 213. The LNA 211 is implemented in a cascode configuration. In the example of FIG. 8, the wireless device 800 may further include a transceiver 822 for generating an RF signal amplified by the PA 212 and transmitted via an antenna 820, and for processing a received RF signal received via the antenna 820 and amplified by the LNA 211. Additionally, the wireless device 800 may include a processor 824 configured to provide various control functions.

[0128] Please note that the drawings are for illustrative purposes and are not to scale. Although several aspects of at least one embodiment have been described above, it should be understood that various changes, modifications, and improvements may readily occur to those skilled in the art. Such changes, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of the aspects and embodiments disclosed herein. Accordingly, the foregoing description and drawings are by way of example only, and the scope of the aspects and embodiments disclosed herein should be determined from a proper interpretation of the appended claims and their equivalents.

Claims

1. A substrate; at least one ground plane contained within or supported by said substrate; at least one electronic component attached to the substrate and including at least one non-groundable thermal output; at least one thermally conductive path extending within the substrate between an interface exposed on the substrate and the ground plane, the thermally conductive path being configured to electrically insulate the interface from the ground plane, the thermally conductive path comprising at least one section of thermally conductive, electrically insulating material encapsulated within the substrate and one or more electrically conductive portions, the section of thermally conductive, electrically insulating material coupled to the one or more electrically conductive portions; and At least one thermally conductive member coupling the output to the interface. An electronic package comprising:

2. 2. The electronic package of claim 1, wherein the thermally conductive member comprises a pillar extending between opposite first and second ends, the first end coupled to the output and the second end coupled to the interface.

3. The electronic package of claim 1 , wherein the thermally conductive member is formed of one of copper or solder, and the interface comprises a metal pad.

4. The electronic package of claim 1 , wherein the thermally conductive member comprises solder balls defining a solder connection between the output and the interface.

5. 2. The electronic package of claim 1, wherein a first end of the thermally conductive member is soldered to the electronic component and a second end of the thermally conductive member is soldered to the interface.

6. 10. The electronic package of claim 1, wherein a first end of the thermally conductive member is soldered to the electronic component and a second end of the thermally conductive member is in non-bonded surface contact with the interface.

7. 2. The electronic package of claim 1, wherein a first end of the thermally conductive member is in non-bonded surface contact with the output portion, and a second end of the thermally conductive member is soldered to the interface.

8. 10. The electronic package of claim 1, wherein the at least one section of thermally conductive, electrically insulating material comprises or consists of one of aluminum nitride, silicon carbide, or diamond.

9. An electronic package as described in claim 1, wherein the thermal conductivity of at least one portion of the thermally conductive, electrically insulating material at room temperature is within one of the following ranges: 35%, 30%, 25%, 20%, 15%, 10%, or 5% of the thermal conductivity of copper at room temperature.

10. The electronic package of claim 1 , wherein the one or more conductive portions comprise one or more conductive paths coupled to one or more vias.

11. 10. The electronic package of claim 1, wherein the portion of thermally conductive, electrically insulating material is positioned relative to the ground plane.

12. 10. The electronic package of claim 1, wherein a metal layer is defined on the exposed area of ​​the portion of thermally conductive, electrically insulating material, the metal layer defining the interface.

13. 2. The electronic package of claim 1, wherein the at least one thermal conduction path includes first and second thermal conduction paths, the first thermal conduction path extending between a first interface exposed on the substrate and the ground plane, and the second thermal conduction path extending between a second interface exposed on the substrate and the ground plane.

14. 14. The electronic package of claim 13, wherein the first thermally conductive path is configured to electrically insulate the first interface from the ground plane, and the second thermally conductive path is configured to electrically insulate the second interface from the ground plane.

15. The electronic package of claim 13, wherein the at least one electronic component includes a first non-groundable heat output portion and a second non-groundable heat output portion, the at least one heat conduction member includes a first heat conduction member and a second heat conduction member, the first heat conduction member coupling the first non-groundable heat output portion to the first interface, and the second heat conduction member coupling the second non-groundable heat output portion to the second interface.

16. 15. The electronic package of claim 14, wherein the first and second thermally conductive paths comprise respective first and second portions of a thermally conductive, electrically insulating material, the first and second portions being spatially distinct from one another.

17. 15. The electronic package of claim 14, wherein the first and second thermally conductive paths comprise a shared portion of thermally conductive, electrically insulating material coupling the first and second thermally conductive paths to one another.

18. a circuit board configured to receive one or more electronic packages; an electronic package attached to the circuit board; Equipped with the electronic package includes a substrate, at least one ground plane contained within or supported by the substrate, at least one electronic component attached to the substrate and including at least one non-groundable thermal output, at least one thermally conductive path extending within the substrate between an interface exposed on the substrate and the ground plane, the path being configured to electrically insulate the interface from the ground plane, and at least one thermally conductive member coupling the output to the interface, the thermally conductive path including at least one section made of a thermally conductive, electrically insulating material encapsulated within the substrate and a metal layer defined on an exposed area of ​​the at least one section made of the thermally conductive, electrically insulating material, the metal layer defining the interface.

19. A substrate; at least one ground plane contained within or supported by said substrate; at least one electronic component attached to the substrate and including at least one non-groundable thermal output; at least one thermally conductive path extending within the substrate between an interface exposed on the substrate and the ground plane, the at least one thermally conductive path being configured to electrically insulate the interface from the ground plane, the at least one thermally conductive path including first and second thermally conductive paths, the first thermally conductive path extending between a first interface exposed on the substrate and the ground plane, and the second thermally conductive path extending between a second interface exposed on the substrate and the ground plane; and at least one thermally conductive member coupling said thermal output to said interface; An electronic package comprising:

20. 1. A method for manufacturing an electronic package, comprising: Providing at least one electronic component including at least one non-groundable thermal output; providing a substrate including or supporting a ground plane; defining at least one thermally conductive path extending between an interface exposed on the substrate and the ground plane, such that the interface is electrically isolated from the ground plane; attaching the electronic component to the substrate; It contains The method, wherein the attaching includes thermally coupling the output to the interface with at least one thermally conductive member.

21. 21. The method of claim 20, wherein the thermally conductive member comprises a pillar extending between opposite first and second ends, and wherein attaching the electronic component to the substrate comprises coupling the first end of the pillar to the output and coupling the second end of the pillar to the interface.

22. 21. The method of claim 20, wherein attaching the electronic component to the substrate comprises thermally coupling the output to the interface with a plurality of thermally conductive members.

23. 21. The method of claim 20, wherein thermally coupling the output to the interface comprises soldering the thermally conductive member to the interface.

24. 21. The method of claim 20, wherein the thermally conductive member comprises a solder ball, and wherein thermally coupling the output to the interface comprises heating the solder ball to define a solder connection between the output and the interface.

25. 21. The method of claim 20, wherein thermally coupling the output to the interface comprises soldering a first end of the thermally conductive member to the electronic component and soldering a second end of the thermally conductive member to the interface.

26. 21. The method of claim 20, wherein thermally coupling the output portion to the interface comprises soldering a first end of the thermally conductive member to the electronic component and positioning a second end of the thermally conductive member in non-bonded surface contact with the interface.

27. 21. The method of claim 20, wherein thermally coupling the output to the interface comprises placing a first end of the thermally conductive member in non-bonded surface contact with the output and soldering a second end of the thermally conductive member to the interface.

28. 21. The method of claim 20, wherein the thermal conduction path comprises or consists of an electrically insulating material having a thermal conductivity at room temperature that is within one of 35%, 30%, 25%, 20%, 15%, 10%, or 5% of the thermal conductivity of copper at room temperature.

29. The method described in claim 20, wherein the thermal conduction path comprises at least one portion made of a thermally conductive, electrically insulating material.

30. 30. The method of claim 29, wherein the thermally conductive path further comprises one or more electrically conductive portions, and wherein defining the thermally conductive path comprises coupling the section of thermally conductive, electrically insulating material to the one or more electrically conductive portions such that the interface is electrically insulated from the ground plane.

31. 31. The method of claim 30, wherein defining the thermally conductive path comprises encapsulating the section of thermally conductive, electrically insulating material within the substrate.

32. 32. The method of claim 31 , wherein defining the thermally conductive path comprises positioning the section of thermally conductive, electrically insulating material relative to the ground plane.

33. 32. The method of claim 31 , wherein an exposed area of ​​the section of thermally conductive, electrically insulating material defines the interface.

34. 32. The method of claim 31, further comprising providing a metal layer on the exposed area of ​​the section of thermally conductive, electrically insulating material, the metal layer defining the interface.

35. 21. The method of claim 20, wherein defining the at least one thermal conduction path comprises defining a first thermal conduction path extending between a first interface exposed on the substrate and the ground plane, and defining a second thermal conduction path extending between a second interface exposed on the substrate and the ground plane.

36. 36. The method of claim 35, wherein attaching the electronic component to the substrate comprises thermally coupling the output to the first interface with at least one first thermally conductive member, and thermally coupling a second output to the second interface with at least one second thermally conductive member.

37. 36. The method of claim 35, wherein the first and second thermally conductive paths comprise a common section of thermally conductive, electrically insulating material coupling the first and second thermally conductive paths to one another.

38. 21. The method of claim 20, wherein the at least one electronic component is integrated into a die, and attaching the electronic component to the substrate comprises attaching the die to the substrate.

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