Grounding processing method and system of printed circuit board, electronic equipment and storage medium

Abstract

The application discloses a grounding processing method and system of a printed circuit board, electronic equipment and a storage medium. The printed circuit board is connected with a chip. The grounding processing method comprises the following steps: acquiring the use state of the chip pin between the main ground to be extended and the target grounding area of the printed circuit board; grounding the connection point on the printed circuit board corresponding to the unused chip pin; connecting the grounded connection point into an extended ground wire; and extending the main ground to be extended to the target grounding area through the extended ground wire. According to the grounding processing method, the connection point on the circuit board corresponding to the unused pin of the chip is grounded, and the ground under the chip is connected into the ground wire through the grounded connection point and extended to other areas, so that the area and continuity of the ground under the chip are increased, the impedance between the digital ground and the analog ground in the chip is reduced, the static electricity in the chip is quickly returned to the ground, and the stability of the system is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip design, and in particular to a grounding processing method and system for a printed circuit board, an electronic device, and a storage medium. BACKGROUND

[0002] In order to prevent the crosstalk of high-speed digital signals inside a chip to analog signals, and based on simulation, the digital ground and the analog ground inside the chip can be independent, and the digital ground and the analog ground are respectively connected to the main ground of a printed circuit board (PCB). In an electro-static discharge (ESD) test or normal use, static electricity can enter the inside of the chip through the PCB. Due to the need for more wirings, punching, and layer-through processing under the chip, the main ground of the PCB under the chip is broken by the wirings, resulting in a large impedance between the digital ground and the analog ground inside the chip, and the static electricity inside the chip cannot quickly flow back to the ground, causing the system to be unstable or dead. SUMMARY

[0003] The present application aims to solve the problem that the main ground of the PCB under the chip is damaged by the wirings, resulting in the static electricity inside the chip being unable to quickly flow back to the ground, and provides a grounding processing method and system for a printed circuit board, an electronic device, and a storage medium.

[0004] The present application solves the above technical problems by the following technical solutions:

[0005] The present application provides a grounding processing method for a printed circuit board, wherein the printed circuit board is connected to a chip. The grounding processing method comprises the following steps:

[0006] Obtaining the usage state of the chip pins between the main ground to be extended and the target grounding area of the printed circuit board;

[0007] Grounding the connection points on the printed circuit board corresponding to the unused chip pins;

[0008] Connecting the grounded connection points into an extended ground wire;

[0009] Extending the main ground to be extended to the target grounding area through the extended ground wire.

[0010] Preferably, the usage state includes default At Reset and default After Reset.

[0011] The step of grounding the connection points on the printed circuit board corresponding to the unused chip pins comprises:

[0012] The connection points of the unused pins with the default At Reset and the default After Reset state of low are grounded.

[0013] Preferably, the step of connecting the grounded connection points into the extended ground line comprises:

[0014] The grounded connection points are connected into the extended ground line by a connection mode requiring the least number of the connection points.

[0015] Preferably, the step of connecting the grounded connection points into the extended ground line by a connection mode requiring the least number of the connection points comprises:

[0016] The shortest path between the main ground to be extended and the target connection region is obtained based on a depth-first search algorithm.

[0017] The shortest path is recorded based on a backtracking algorithm.

[0018] The grounded connection points are connected into the extended ground line according to the shortest path.

[0019] Preferably, the target connection region comprises a main ground outside the chip; and the step of extending the main ground to be extended to the target connection region by the extended ground line comprises:

[0020] The main ground to be extended below the chip is extended to the main ground outside the chip by the extended ground line; and / or,

[0021] The target connection region comprises another main ground below the chip; and the step of extending the main ground to be extended to the target connection region by the extended ground line comprises:

[0022] The main ground to be extended below the chip is extended to the another main ground below the chip by the extended ground line.

[0023] Preferably, after the step of connecting the grounded connection points into the extended ground line, the grounding processing method further comprises:

[0024] A plurality of ground holes are arranged below the extended ground line.

[0025] The application further provides a grounding processing system of a printed circuit board, the printed circuit board being connected with a chip, and the grounding processing system comprising:

[0026] A pin state obtaining module, configured to obtain the usage state of the chip pins between the main ground to be extended and the target connection region of the printed circuit board.

[0027] A connection point grounding module, configured to ground the connection points on the printed circuit board corresponding to the unused chip pins.

[0028] The ground connection module is used for connecting the grounded connection points into an extended ground line.

[0029] The main ground extension module is used for extending the to-be-extended main ground to a target connection area through the extended ground line.

[0030] Preferably, the use states include default At Reset and default After Reset.

[0031] The connection point grounding module is specifically used for grounding the connection points corresponding to the unused pin pairs with both the default At Reset and the default After Reset states being low.

[0032] Preferably, the ground connection module is specifically used for connecting the grounded connection points into an extended ground line through a connection mode requiring the least number of connection points.

[0033] Preferably, the shortest path acquisition unit is used for acquiring the shortest path between the to-be-extended main ground and the target connection area based on a depth-first search algorithm.

[0034] The shortest path recording unit is used for recording the shortest path based on a backtracking algorithm.

[0035] The extended ground line connection unit is used for connecting the grounded connection points into an extended ground line according to the shortest path.

[0036] Preferably, the target connection area includes a main ground outside the chip; the main ground extension module is specifically used for extending the to-be-extended main ground below the chip to the main ground outside the chip through the extended ground line; and / or,

[0037] The target connection area includes another main ground below the chip; the main ground extension module is specifically used for extending the to-be-extended main ground below the chip to the another main ground below the chip through the extended ground line.

[0038] Preferably, the ground processing system further includes:

[0039] The ground hole setting module is used for setting a plurality of ground holes below the extended ground line.

[0040] The application further provides an electronic device including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, wherein the processor implements the ground processing method of the printed circuit board as described above when executing the computer program.

[0041] The application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the ground processing method of the printed circuit board.

[0042] The application further provides a chip, which executes the ground processing method of the printed circuit board.

[0043] The chip can be a single chip or a chip module, or a chip or a chip module integrated in a UE (User Equipment).

[0044] The positive progress effect of the application is that:

[0045] The ground processing method of the printed circuit board increases the area and continuity of the ground below the chip, reduces the impedance between the digital ground and the analog ground in the chip, makes the static electricity in the chip quickly return to the ground, and improves the stability of the system. BRIEF DESCRIPTION OF DRAWINGS

[0046] Figure 1 The first flowchart of the ground processing method of the printed circuit board in the embodiment 1 of the application.

[0047] Figure 2 The second flowchart of the ground processing method of the printed circuit board in the embodiment 1 of the application.

[0048] Figure 3a The principle diagram of the shortest path generation in the embodiment 1 of the application.

[0049] Figure 3b The result diagram of the shortest path generation in the embodiment 1 of the application.

[0050] Figure 4 The layout of the printed circuit board which is not processed by the ground processing method in the embodiment 1 of the application.

[0051] Figure 5 The layout of the printed circuit board processed by the ground processing method in the embodiment 1 of the application.

[0052] Figure 6 The first structure diagram of the ground processing system of the printed circuit board in the embodiment 2 of the application.

[0053] Figure 7 The second structure diagram of the ground processing system of the printed circuit board in the embodiment 2 of the application.

[0054] Figure 8 Fig. 3 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0055] The present disclosure will be further described by embodiments, but the present disclosure is not limited to the embodiments.

[0056] Hereinafter, the terms "first" and "second" are used only for the purpose of description, and can not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0057] It should be noted that the execution subject of the grounding processing method of the printed circuit board provided in the embodiments can be a single chip, a chip module, or a UE, or a chip or a chip module integrated in the UE.

[0058] The grounding processing system of the printed circuit board described in the embodiments can be a single chip, a chip module, or a UE, or a chip or a chip module integrated in the UE. Each module / unit included in the grounding processing system of the printed circuit board can be a software module / unit, or a hardware module / unit, or part of a software module / unit and part of a hardware module / unit.

[0059] For example, for each device, product applied to or integrated in a chip, each module / unit included therein can be implemented in the form of hardware such as a circuit, or at least part of the modules / units can be implemented in the form of a software program running on a processor integrated in the chip, and the remaining part of the modules / units can be implemented in the form of hardware such as a circuit; for each device, product applied to or integrated in a chip module, each module / unit included therein can be implemented in the form of hardware such as a circuit, and different modules / units can be located in the same component (for example, a chip, a circuit module, etc.) or different components of the chip module, or at least part of the modules / units can be implemented in the form of a software program running on a processor integrated in the chip module, and the remaining part of the modules / units can be implemented in the form of hardware such as a circuit; for each device, product applied to or integrated in a UE, each module / unit included therein can be implemented in the form of hardware such as a circuit, and different modules / units can be located in the same component (for example, a chip, a circuit module, etc.) or different components of the UE, or at least part of the modules / units can be implemented in the form of a software program running on a processor integrated in the UE, and the remaining part of the modules / units can be implemented in the form of hardware such as a circuit.

[0060] Embodiment 1

[0061] Please refer to Figure 1 , which is the first flowchart of the grounding processing method of the printed circuit board in this embodiment. Specifically, the printed circuit board is connected with a chip, and the grounding processing method comprises the following steps:

[0062] S101, obtaining the use state of the chip pin between the main ground to be extended and the target grounding area of the printed circuit board. Specifically, the main ground to be extended is a small piece of main ground below the chip formed after the wiring is cut. These small pieces of main ground may have the problem of too small grounding area or not being connected with other main ground, resulting in fewer ground holes and poor antistatic effect of static conduction to the ground. The target grounding area can include the peripheral grounding area of the chip and the main ground below the chip with larger area or connected with the peripheral grounding area. Preferably, since the impedance of the ground wire connecting the main ground to be extended and the target grounding area increases with the increase of the length, the target grounding area is the grounding area near the main ground to be extended.

[0063] S102, grounding the connection point on the printed circuit board corresponding to the unused chip pin.

[0064] S103, connecting the grounded connection points into an extended ground wire.

[0065] S104, extending the main ground to be extended to the target grounding area through the extended ground wire.

[0066] Please refer to Figure 2 , which is the second flowchart of the grounding processing method of the printed circuit board in this embodiment. Specifically, in an optional embodiment, the use state includes default At Reset and default After Reset; step S102 comprises:

[0067] S1021, grounding the connection point corresponding to the unused pin with both default At Reset and default After Reset in low state. Specifically, default At Reset and default After Reset are the states of GPIO (General Purpose Input / Output) pin before the configuration of the pin is effective. The fact that the states of default At Reset and default After Reset are both low indicates that the power domain of the pin is turned off by default, that is, the connection point corresponding to the unused pin with the power domain turned off by default is grounded, which can prevent the chip from leaking due to grounding.

[0068] In an optional embodiment, step S103 comprises:

[0069] The ground connection points are connected into the extension ground line by a connection mode requiring the least number of connection points. Specifically, as the length of the extension ground line increases, the impedance between the main ground to be extended and the target grounding region also increases, and thus connecting the two by the shortest extension ground line can maximize the reduction of the impedance between the main ground to be extended and the target grounding region. The connection points on the PCB are usually uniformly distributed, and thus the shortest extension ground line passes through the least number of connection points.

[0070] In an alternative embodiment, as shown in Figure 2 connecting the ground connection points into the extension ground line by a connection mode requiring the least number of connection points comprises:

[0071] S1031, obtaining the shortest path between the main ground to be extended and the target grounding region based on a depth-first search algorithm; as shown in Figure 3a In order to automatically find the shortest path from a to b, based on the depth-first search algorithm, the positions in the up, down, left and right of the initial position a that can be grounded to form the extension ground line are added by 1, the black obstacles (such as the wiring area of the chip) are not added by 1, and the positions that have been marked are not added by 1, and then the above operations are repeated from the next position until the end point b is encountered, as shown in Figure 3b which is the shortest path.

[0072] S1032, recording the shortest path based on a backtracking algorithm; specifically, based on the backtracking algorithm, after the end point is found, the numbers are found back from the last position, the numbers that are 1 less than the previous numbers are found in sequence, and the path is recorded. The recorded path is the shortest path between the main ground to be extended and the target grounding region.

[0073] S1033, connecting the ground connection points into the extension ground line according to the shortest path. Connecting the ground connection points into the extension ground line according to the shortest path minimizes the impedance between the main ground to be extended and the target grounding region.

[0074] In an alternative embodiment, the target grounding region includes the main ground outside the chip; and the step S104 comprises:

[0075] S1041, extending the main ground to be extended below the chip to the main ground outside the chip by the extension ground line; specifically, Figure 4 the layout of the printed circuit board not processed by the grounding processing method of the embodiment;

[0076] Figure 5 the layout of the printed circuit board processed by the grounding processing method of the embodiment, wherein, Figure 4 、 Figure 5 the gray thick line in is the ground line, the gray area at the edge is the main ground outside the chip, and the black area is the PCB wiring area. As shown in Figure 4As shown, the main ground under the chip in regions 1 and 2 is to be extended, and the main ground is not connected with the main ground of the chip periphery, as shown in Figure 5 As shown, the main ground under the chip in regions 1 and 2 is to be extended, and the main ground is connected with the main ground of the chip periphery through at least one extended ground line, which increases the continuity of the ground under the chip, as shown in Figure 4 As shown, there is no main ground under the chip in regions 3 and 4, as shown in Figure 5 As shown, the main ground under the chip in regions 3 and 4 is to be extended, and the main ground is connected with the main ground of the chip periphery through several extended ground lines, which increases the area and continuity of the ground under the chip.

[0077] In another optional embodiment, the target grounding region includes another main ground under the chip; step S104 includes:

[0078] S1042, extending the main ground under the chip to be extended to the another main ground under the chip through the extended ground line, as shown in Figure 4 As shown, there is no main ground under the chip in regions 5, as shown in Figure 5 As shown, the main ground under the chip in regions 5 is to be extended, and the main ground is connected with the another main ground under the chip through several extended ground lines, which increases the area and continuity of the ground under the chip.

[0079] It is worth noting that steps S1041 and S1042 can be executed simultaneously, or only step S1041 or step S1042 can be executed, and the present embodiment only lists one case, which is not limited thereto.

[0080] In an optional embodiment, after step S103, the grounding processing method further includes:

[0081] S105, arranging several ground holes under the extended ground line. Specifically, the ground holes can be punched under the extended ground line, thereby increasing the number of ground holes, improving the number of ground holes of the PCB, thereby speeding up the static electricity of the chip to flow into the ground plane and improving the anti-static performance.

[0082] The grounding processing method of the printed circuit board of the present embodiment connects the ground line formed by the connection points after grounding under the chip to other regions through the unused pins of the chip that will not cause leakage due to grounding, thereby increasing the area and continuity of the ground under the chip, reducing the impedance between the digital ground and the analog ground inside the chip, making the static electricity inside the chip quickly flow back to the ground, and improving the stability of the system; the extended ground line with the shortest distance between the main ground to be extended and the target grounding region is automatically generated based on the shortest path algorithm, which maximally reduces the impedance between the main ground to be extended and the target grounding region, so as to improve the anti-static performance of the system.

[0083] Embodiment 2

[0084] Referring to Figure 6 , which is a first structural schematic diagram of a grounding processing system of a printed circuit board in the embodiment. Specifically, the printed circuit board is connected with a chip, and the grounding processing system comprises:

[0085] a pin state acquisition module 1, configured to acquire a use state of a chip pin between a main ground to be extended and a target grounding region of a printed circuit board; specifically, the main ground to be extended is a small piece of main ground below the chip formed after the wiring is cut, and these small pieces of main ground may have a situation that the grounding area is too small or not connected with other main grounds, resulting in a small number of ground holes and poor antistatic effect of static conduction to the ground; the target grounding region can include a peripheral grounding region of the chip and a main ground below the chip which has a larger area or is connected with the peripheral grounding region, and preferably, since the impedance of the ground line connecting the main ground to be extended and the target grounding region increases with the length, the target grounding region is the grounding region near the main ground to be extended; a connection point grounding module 2, configured to ground a connection point on the printed circuit board corresponding to an unused chip pin; a ground line connection module 3, configured to connect the grounded connection points into an extended ground line; and a main ground extension module 4, configured to extend the main ground to be extended to the target grounding region through the extended ground line.

[0086] In an optional embodiment, the use state includes default At Reset and default After Reset; and the connection point grounding module 2 is specifically configured to ground the connection point corresponding to the unused pin with the states of default At Reset and default After Reset both being low. Specifically, default At Reset and default After Reset are states before the GPIO pin configuration is effective, and the states of default At Reset and default After Reset both being low indicates that the power domain of the pin is turned off by default, that is, the connection point corresponding to the unused pin with the power domain turned off by default is grounded, which can prevent the chip from leaking due to grounding.

[0087] In an optional embodiment, the ground line connection module 3 is specifically configured to connect the grounded connection points into the extended ground line through a connection mode with the least number of connection points. Specifically, as the length of the extended ground line increases, the impedance between the main ground to be extended and the target grounding region also increases, and therefore, connecting the two through the shortest extended ground line can maximize the reduction of the impedance between the main ground to be extended and the target grounding region. The connection points on the PCB are usually uniformly distributed, and therefore, the shortest extended ground line passes through the least number of connection points.

[0088] In an optional embodiment, the ground line connection module 3 comprises: a shortest path acquisition unit 31, configured to acquire a shortest path between the main ground to be extended and the target grounding region based on a depth-first search algorithm; for example,Figure 3a As shown, in order to automatically find the shortest path from a to b, based on the depth-first search algorithm, in the up, down, left and right of the initial position a, the positions where the grounding processing is performed to form the extended ground line are added by 1 respectively, the black obstacles (such as the wiring area of the chip) are not added by 1, the positions which have been marked with the value are not added by 1, and then the repeated action is performed from the next position until the end point b is encountered. Figure 3b As shown, it is the shortest path.

[0089] The shortest path recording unit 32 is configured to record the shortest path based on the backtracking algorithm; specifically, based on the backtracking algorithm, after the end point is found, the number is found back from the last position, the number which is smaller than the last number by 1 is found in sequence, and the path is recorded. The recorded path is the shortest path between the main ground to be extended and the target grounding area.

[0090] The extended ground line connecting unit 33 is configured to connect the grounding connection points into an extended ground line according to the shortest path. The connection into the extended ground line according to the shortest path makes the impedance between the main ground to be extended and the target grounding area minimum.

[0091] In an optional embodiment, the target grounding area includes the main ground of the chip periphery; and the main ground extension module 4 is specifically configured to extend the main ground to be extended under the chip to the main ground of the chip periphery through the extended ground line. Figure 4 The layout of the printed circuit board which has not been processed by the grounding processing method of the embodiment; Figure 5 The layout of the printed circuit board which has been processed by the grounding processing method of the embodiment, wherein, Figure 4 、 Figure 5 The gray thick line in the figure is the ground line, the gray area at the edge is the main ground of the chip periphery, and the black area is the PCB wiring area. As shown, Figure 4 The main ground to be extended under the chip in the areas 1 and 2 is not connected with the main ground of the chip periphery, as shown, Figure 5 The main ground to be extended under the chip in the areas 1 and 2 is connected with the main ground of the chip periphery through at least one extended ground line, which increases the continuity of the ground under the chip. As shown, Figure 4 The main ground to be extended under the chip in the areas 3 and 4 is not formed, as shown, Figure 5 The main ground to be extended under the chip in the areas 3 and 4 is formed through a plurality of extended ground lines, and is connected with the main ground of the chip periphery through the extended ground line, which increases the area and continuity of the ground under the chip.

[0092] In another optional embodiment, the target grounding area includes another main ground under the chip; and the main ground extension module 4 is specifically configured to extend the main ground to be extended under the chip to the another main ground under the chip through the extended ground line. Figure 4 As shown, the main ground to be extended under the chip in the area 5 is not formed, as shown,Figure 5 As shown, the main ground under the chip in region 5 is formed by several extension ground lines, and is connected to another main ground under the chip through the extension ground lines, thereby increasing the area and continuity of the ground under the chip.

[0093] Referring to Figure 7 which is a second structural schematic diagram of the grounding processing system of the printed circuit board in the embodiment. In an alternative implementation, the grounding processing system further comprises:

[0094] The ground hole setting module 5 is configured to set a plurality of ground holes under the extension ground lines. Specifically, the ground holes can be punched under the extension ground lines, thereby increasing the number of ground holes, improving the number of ground holes of the PCB, and thus accelerating the electrostatic conduction of the chip to the ground plane and improving the anti-static performance.

[0095] The grounding processing system of the printed circuit board in the embodiment connects the ground under the chip through the connection points after grounding, and the extension ground lines of the ground under the chip extend to other regions, thereby increasing the area and continuity of the ground under the chip, reducing the impedance between the digital ground and the analog ground inside the chip, making the static electricity inside the chip quickly flow back to the ground, and improving the stability of the system; based on the shortest path algorithm, the extension ground lines with the shortest distance between the main ground to be extended and the target grounding region are automatically generated, thereby minimizing the impedance between the main ground to be extended and the target grounding region, and improving the anti-static performance of the system.

[0096] Embodiment 3

[0097] Figure 8 which is a structural schematic diagram of an electronic device provided in the embodiment 3 of the present application. The electronic device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the grounding processing method of the printed circuit board in the embodiment 1 when executing the program. Figure 8 The electronic device 30 shown is merely an example, and should not impose any limitation on the functions and use range of the embodiment of the present application.

[0098] As Figure 8 shown, the electronic device 30 can be in the form of a general computing device, for example, it can be a server device. The components of the electronic device 30 can include but are not limited to the above-mentioned at least one processor 31, the above-mentioned at least one memory 32, and a bus 33 connecting different system components including the memory 32 and the processor 31.

[0099] The bus 33 includes a data bus, an address bus, and a control bus.

[0100] The memory 32 can include volatile memory, such as random access memory (RAM) 321 and / or cache memory 322, and / or non-volatile memory, such as read only memory (ROM) 323.

[0101] The memory 32 can also include a program / utility 325 having a set (at least one) of program modules 324, including but not limited to an operating system, one or more application programs, other program modules, and program data, each of which

[0102] The processor 31 can execute the various functional applications and data processing of the computer program stored in the memory 32, such as the printed circuit board grounding processing method of embodiment 1 of the present application.

[0103] The electronic device 30 can also communicate with one or more external devices 34 such as a keyboard, a pointing device, etc. through an input / output (I / O) interface 35. Further, the model generating device 30 can communicate with one or more networks, such as a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet, through a network adapter 36. As depicted, the network adapter 36 communicates with the other modules of the model generating device 30 through the bus 33. It should be appreciated that other hardware and / or software modules can be used in conjunction with the model generating device 30, such as a microcode, device drivers, redundant processing units, external disk drive arrays, RAID (Redundant Array of Independent Disks) systems, tape drives, and data archival storage systems, etc., although not depicted.

[0104] It should be noted that although several units / modules or sub-units / modules of the electronic device are mentioned in the foregoing detailed description, such a division is merely exemplary and not mandatory. Indeed, according to embodiments of the present application, the features and functionalities of two or more units / modules described above can be embodied in one unit / module. Conversely, the features and functionalities of one unit / module described above can be further divided into a plurality of units / modules.

[0105] Embodiment 4

[0106] The present embodiment provides a computer readable storage medium having stored thereon a computer program, which, when executed by a processor, implements the printed circuit board grounding processing method of embodiment 1.

[0107] More specifically, the computer readable storage medium can include, but is not limited to, portable discs, hard disks, random access memories, read only memories, erasable programmable read only memories, optical storage devices, magnetic storage devices, or any suitable combination of the above.

[0108] In a possible implementation, the present application can also be implemented in the form of a program product, which comprises program codes for causing a terminal device to execute the grounding processing method of the printed circuit board of embodiment 1 when the program product is run on the terminal device.

[0109] Wherein, the program codes for executing the present application can be written in any combination of one or more programming languages, which can be executed completely on the user device, partially on the user device, as an independent software package, partially on the user device and partially on a remote device, or completely on a remote device.

[0110] Embodiment 5

[0111] The embodiment provides a chip, which executes the grounding processing method of the printed circuit board in embodiment 1.

[0112] The chip provided by the embodiment increases the area and continuity of the ground below the chip, reduces the impedance between the digital ground and the analog ground inside the chip, makes the static electricity inside the chip quickly return to the ground, improves the stability of the system, automatically generates the extension ground wire with the shortest distance between the main ground to be extended and the target grounding area based on the shortest path algorithm, maximally reduces the impedance between the main ground to be extended and the target grounding area, and improves the anti-static performance of the system.

[0113] Although the specific embodiments of the present application are described above, those skilled in the art should understand that this is only an example, and the protection scope of the present application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present application, and these changes and modifications all fall within the protection scope of the present application.

Claims

1. A method of grounding a printed circuit board to which a chip is connected, characterized by, The ground processing method comprises: obtaining a use state of a chip pin between a main ground to be extended and a target ground region of the printed circuit board; grounding a connection point on the printed circuit board corresponding to an unused chip pin; connecting the grounded connection points into an extended ground wire; extending the main ground to be extended to the target ground region through the extended ground wire.

2. The grounding treatment method according to claim 1, wherein The use state comprises default At Reset and default After Reset. The step of grounding the connection point on the printed circuit board corresponding to the unused chip pin comprises: grounding the connection point corresponding to the unused pin whose state of default At Reset and default After Reset is low.

3. The ground treatment method of claim 1, wherein The step of connecting the grounded connection points into an extended ground wire comprises: connecting the grounded connection points into an extended ground wire through a connection mode requiring the least number of connection points.

4. The grounding processing method according to claim 3, wherein The step of connecting the grounded connection points into an extended ground wire through a connection mode requiring the least number of connection points comprises: obtaining a shortest path between the main ground to be extended and the target ground region based on a depth-first search algorithm; recording the shortest path based on a backtracking algorithm; connecting the grounded connection points into an extended ground wire according to the shortest path.

5. The ground treatment method according to claim 1, wherein The target ground region comprises a main ground of a periphery of the chip. The step of extending the main ground to be extended to the target ground region through the extended ground wire comprises: extending the main ground to be extended below the chip to the main ground of the periphery of the chip; and / or The target ground region comprises another main ground below the chip; the step of extending the main ground to be extended to the target ground region through the extended ground wire comprises: extending the main ground to be extended below the chip to the another main ground below the chip.

6. The ground treatment method of claim 1, wherein After the step of connecting the grounded connection points into an extended ground wire, the ground processing method further comprises: providing a plurality of ground holes below the extended ground wire.

7. A ground handling system for a printed circuit board to which a chip is connected, characterized by The ground processing system comprises: a pin state obtaining module, configured to obtain a use state of a chip pin between a main ground to be extended and a target ground region of the printed circuit board; a connection point grounding module, configured to ground a connection point on the printed circuit board corresponding to an unused chip pin; a ground wire connecting module, configured to connect the grounded connection points into an extended ground wire; a main ground extending module, configured to extend the main ground to be extended to the target ground region through the extended ground wire.

8. The ground treatment system of claim 7, wherein, The use state comprises default At Reset and default After Reset. The connection point grounding module is specifically configured to ground the connection point corresponding to the unused pin whose state of default At Reset and default After Reset is low.

9. The ground treatment system of claim 7, wherein, The ground wire connecting module is specifically configured to connect the grounded connection points into an extended ground wire through a connection mode requiring the least number of connection points.

10. The ground treatment system of claim 9, wherein, The ground wire connecting module comprises: a shortest path obtaining unit, configured to obtain a shortest path between the main ground to be extended and the target ground region based on a depth-first search algorithm; A shortest path recording unit is configured to record the shortest path based on a backtracking algorithm. An extended ground wire connecting unit is configured to connect the grounded connecting points into an extended ground wire according to the shortest path.

11. The ground treatment system of claim 7, wherein, The target grounding area includes a main ground of the chip periphery; the main ground extension module is specifically configured to extend the main ground to be extended under the chip to the main ground of the chip periphery through the extended ground wire; and / or, The target grounding area includes another main ground under the chip; the main ground extension module is specifically configured to extend the main ground to be extended under the chip to the another main ground under the chip through the extended ground wire.

12. The ground treatment system of claim 7, wherein, The grounding processing system further includes: A ground hole setting module is configured to set a plurality of ground holes under the extended ground wire.

13. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the grounding processing method of the printed circuit board in any one of claims 1 to 6.

14. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the grounding processing method of the printed circuit board in any one of claims 1 to 6.

15. A chip, characterized by The chip executes the grounding processing method of the printed circuit board in any one of claims 1 to 6.

Images