Release Composition

Abstract

The present application provides a release composition, a release layer, a release film, and an adhesive film. The release composition of the present application has excellent curability, and can be stably cured to form a release layer. The present application can provide a release composition that, when the release layer is formed, exhibits a stable residual adhesion rate even when the release layer is repeatedly applied to an adhesive layer, etc. The release layer of the present application can maintain the desired release properties even when maintained at room temperature and high temperature for a long period of time. In addition, the release layer can stably maintain a balance between high-speed and low-speed peeling forces.

Description

[Technical field]

[0001] Cross-reference to related applications This application claims priority based on Korean Patent Application No. 10-2022-0035335 filed on March 22, 2022, the contents of which are incorporated herein by reference.

[0002] Technical Field The present application relates to a release composition, a release layer, a release film and an adhesive film. [Background technology]

[0003] Release films are used for protecting adhesive or bonding surfaces, as carriers, and as coating substrates. For example, so-called light-thin or medium-thin release films can be used to protect optically clear adhesives (OCA). Release films can also be used as carriers for tapes and as coating substrates for multi-layer ceramic capacitors (MLCCs).

[0004] For example, Patent Document 1 discloses a release sheet having a release layer (mold release layer) formed from a release agent composition (mold release composition) containing a polyolefin, an isocyanate compound, and a polyolefin polyol.

[0005] In addition to the method disclosed in Patent Document 1, the release layer of the release film can also be formed using a silicon-based compound.

[0006] However, release layers formed using silicon-based compounds have problems such as poor curing and a lower residual adhesion rate than release layers formed using non-silicon-based compounds. In addition, such release layers usually do not have a high bonding strength with the substrate film, and the adhesive strength tends to increase if the layer is attached to the substrate film for a long time.

[0007] Therefore, it is an important issue to ensure appropriate curability and a high residual adhesion rate, while maintaining the release characteristics of the release layer even when maintained at room temperature and at high temperatures for a long period of time.

[0008] Furthermore, when the protective film is peeled off at a high speed for use in a product or for assembly in other products, the release film is required to have a relatively low peeling force (hereinafter referred to as the high-speed peeling force), whereas when the protective film is peeled off at a slow speed (hereinafter referred to as the low-speed peeling force), the release film is required to have a relatively high peeling force.

[0009] If the release film does not have the appropriate low-speed peel strength, quality problems may occur, and if the high-speed peel strength is not appropriate, the adherend may be damaged during peeling. Therefore, it is an important issue for the release film to balance the high-speed and low-speed peel strengths. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] JP 2011-52207 A Summary of the Invention [Problem to be solved by the invention]

[0011] The present application provides a release composition, a release layer, a release film and an adhesive film.

[0012] An object of the present application is to provide a release composition that has excellent curability and can be stably cured to form a release layer.

[0013] An object of the present application is to provide a release composition which, when the release layer is formed, exhibits a stable residual adhesion rate even when the release layer is repeatedly applied to a pressure-sensitive adhesive layer or the like.

[0014] An object of the present application is to provide a release layer that can maintain desired release properties even when maintained at room temperature and at high temperatures for long periods of time.

[0015] Another object of the present application is to provide a release layer that can stably maintain a balance between high-speed and low-speed peel forces. [Means for solving the problem]

[0016] In the present specification, when a physical property is affected by the measurement temperature, the physical property is measured at room temperature, unless otherwise specified.

[0017] The term "room temperature" refers to a natural temperature that is not artificially heated or cooled, and means, for example, any one temperature within the range of 10°C to 30°C, or a temperature that is about 15°C or higher, about 18°C ​​or higher, about 20°C or higher, or about 23°C or higher, and not higher than about 27°C, or a temperature of about 25°C.

[0018] Unless otherwise specified, temperatures are all measured in degrees Celsius.

[0019] In the present application, when a physical property is affected by the measurement pressure, the physical property is measured at normal pressure, unless otherwise specified.

[0020] As used herein, the term "normal pressure" refers to a natural pressure that is not artificially increased or decreased, and usually means a pressure at atmospheric pressure level, for example, any one pressure within the range of 0.9 atm to 1.2 atm or any one pressure within the range of approximately 740 mmHg to 780 mmHg.

[0021] The term "relative humidity" used in this application is the percentage (%) of the amount of water vapor contained in a unit volume of air to the maximum saturated water vapor pressure that a unit volume of air can contain, and can be expressed as RH%. When the relative humidity has an effect on any physical property mentioned in this application, the physical property is measured in a normal humidity environment (approximately 30RH% to 70RH%) unless otherwise specified.

[0022] The term a to b used in this application includes a and b and means within the range between a and b. For example, including a to b parts by weight is the same as including within the range of a to b parts by weight.

[0023] In this specification, the terms weight average molecular weight (Mw) and number average molecular weight (Mn) are physical properties measured using GPC (gel permeation chromatography), and the term polydispersity index (PDI) is the value (Mw / Mn) obtained by dividing the weight average molecular weight (Mw) by the number average molecular weight (Mn). The unit of the weight average molecular weight (Mw) and number average molecular weight (Mn) referred to in this specification is g / mol. Specific methods for measuring the weight average molecular weight (Mw), number average molecular weight (Mn) and polydispersity index are summarized in the Examples section.

[0024] In this specification, the term alkyl or alkoxy group, unless otherwise specified, may be a straight or branched alkyl or alkoxy group having 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or 1 to 6 carbon atoms, or 1 to 4 carbon atoms, or a cyclic alkyl or alkoxy group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. The category of the cyclic alkyl or alkoxy group includes an alkyl or alkoxy group having only a ring structure and an alkyl or alkoxy group containing a ring structure. For example, a cyclohexyl group and a methylcyclohexyl group are both cyclic alkyl groups.

[0025] In this specification, unless otherwise specified, the term alkenyl group may be a straight-chain or branched-chain non-cyclic alkenyl group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms, or a cyclic alkenyl group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. The category of the cyclic alkenyl group includes an alkenyl group having only a ring structure and an alkenyl group containing a ring structure.

[0026] In this specification, unless otherwise specified, the term alkynyl group may be a straight-chain or branched-chain alkynyl group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms, or a cyclic alkynyl group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, when an alkynyl group having a ring structure is included, it corresponds to a cyclic alkynyl group.

[0027] The alkyl group, alkoxy group, alkenyl group and alkynyl group may be substituted with any one or more substituents, which may be, but are not limited to, one or more selected from the group consisting of halogen (chlorine (Cl), iodine (I), bromine (Br), fluorine (F)), aryl group, heteroaryl group, epoxy group, alkoxy group, cyano group, carboxyl group, acryloyl group, methacryloyl group, acryloyloxy group, methacryloyloxy group, carbonyl group and hydroxy group.

[0028] In the present specification, the term "aryl group" refers to a substituent formed by removing one hydrogen from an aromatic hydrocarbon ring compound, and the aromatic hydrocarbon ring compound may be a monocyclic or polycyclic ring compound. The number of carbon atoms in the aryl group is not particularly limited, but unless otherwise specified, the aryl group may be an aryl group having 6 to 20 carbon atoms, 6 to 18 carbon atoms, or 6 to 15 carbon atoms.

[0029] Examples of the aryl group include, but are not limited to, a phenyl group, a phenylethyl group, a phenylpropyl group, a benzyl group, a tolyl group, a xylyl group, and a naphthyl group.

[0030] The aryl group may be optionally substituted with one or more substituents, which may be, but are not limited to, one or more selected from the group consisting of halogens (chlorine (Cl), iodine (I), bromine (Br), fluorine (F)), aryl groups, heteroaryl groups, epoxy groups, alkoxy groups, cyano groups, carboxyl groups, acryloyl groups, methacryloyl groups, acryloyloxy groups, methacryloyloxy groups, carbonyl groups, and hydroxy groups.

[0031] In this specification, the term monovalent hydrocarbon group refers to a monovalent substituent derived from a hydrocarbon (an organic compound consisting of carbon and hydrogen). The number of carbon atoms in such a monovalent hydrocarbon group may be within the range of 1 to 20, 1 to 16, 1 to 12, 1 to 8, or 1 to 4. Examples of the monovalent hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, or an aryl group. The alkyl group, the alkenyl group, the alkynyl group, or the aryl group may be, respectively, the alkyl group, the alkenyl group, the alkynyl group, or the aryl group specifically described at the beginning of this specification.

[0032] The present application relates to a release composition. The term release composition means a composition capable of forming a release layer, the meaning of which is the same as that known in the art.

[0033] The release composition may be a curable composition, in which case the composition can form the release layer before or after curing.

[0034] The release composition of the present application may include a polyorganosiloxane component.

[0035] The term polyorganosiloxane, as is known in the art, refers to a polymer that includes a chain formed by siloxane bonds (Si-O-Si). The polyorganosiloxane referred to in this specification may be a single molecule of polyorganosiloxane or a mixture of two or more molecules of polyorganosiloxane. Polyorganosiloxane is a polymeric compound, and in the polymerization process to form a polymeric compound, only one molecule of the polymer may be produced, but two or more molecules of the polymer may also be produced, so the meaning of the term polyorganosiloxane also includes a mixture of two or more molecules of polyorganosiloxane.

[0036] Polyorganosiloxanes are usually formed comprising one or more siloxane units selected from the group consisting of so-called M units, D units, T units and Q units.

[0037] In this specification, the M unit is usually represented by (RSiO 1 / 2 ), and the D unit is usually represented by (RSiO 2 / 2 ), and the T unit is usually represented by (RSiO 3 / 2 ), and the Q unit is usually represented by (SiO 4 / 2 ) are so-called tetrafunctional siloxane units (i.e., siloxane units in which a silicon atom is linked to four oxygen atoms).

[0038] The polyorganosiloxane of the present application contains a specific siloxane unit, which allows the formation of the release layer intended in the present application.

[0039] As described above, the polyorganosiloxane may be a single molecule of polyorganosiloxane or a mixture of two or more molecules of polyorganosiloxane. For example, the single molecule of polyorganosiloxane or the mixture of two or more molecules of polyorganosiloxane may have the average unit described below.

[0040] The polyorganosiloxane component of the present application may be a polyorganosiloxane having siloxane units of the following chemical formula 1, siloxane units of the following chemical formula 2, and siloxane units of the following chemical formula 3: [Chemical formula 1] (R 1 2SiO 2 / 2 ) [Chemical formula 2] (R 1 R 2 SiO 2 / 2 ) [Chemical formula 3] (R 3 2SiO 2 / 2 ) In Chemical Formulas 1 to 3, R 1 is an alkyl group, R 2 is an alkenyl group, R 3 may be an aryl group. Specific types of the alkyl group, alkenyl group and aryl group contained in Chemical Formulae 1 to 3 are as described at the beginning of this specification.

[0041] The ratio of the total number of moles of the siloxane units of the above chemical formulas 1 to 3 can be adjusted based on the total number of moles of the total siloxane units contained in the polyorganosiloxane of the present application. For example, the lower limit of the ratio of the total number of moles of the siloxane units of the above chemical formulas 1 to 3 (based on the total number of moles of the total siloxane units) may be about 85 mol%, 86 mol%, 87 mol%, 88 mol%, 89 mol%, 90 mol%, 91 mol%, 92 mol%, 93 mol%, 94 mol%, 95 mol%, 96 mol%, 97 mol%, 98 mol% or 99 mol%, and the upper limit may be about 100 mol% or 99.9 mol%. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. At such a ratio, appropriate curing properties can be ensured, and a release layer having desired release properties can be formed.

[0042] In the polyorganosiloxane of the present application, the ratio between the siloxane units of the above chemical formulas 1 to 3 can also be adjusted.

[0043] For example, the lower limit of the ratio of the number of moles of siloxane units of Chemical Formula 1 to the number of moles of siloxane units of Chemical Formula 2 contained in the polyorganosiloxane may be about 0.5, 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85 or 90, and the upper limit may be about 2,000, 1,500, 1,000, 500, 400, 300, 200, 100, 90, 80, 70, 60, 50, 40, 30 or 20. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. At such a ratio, appropriate curing properties can be ensured, and a release layer having desired release properties can be formed.

[0044] The lower limit of the ratio of the number of moles of siloxane units of Chemical Formula 1 to the number of moles of siloxane units of Chemical Formula 3 contained in the polyorganosiloxane of the present application may be about 0.5, 1, 5, 10, 12, 14, 16, 18, 20, 25, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, or 130, and the upper limit may be about 2,000, 1000, 500, 300, 200, 150, 140, 130, 120, 110, 100, 90, 80, 70, 60, 50, 40, 30, or 20. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. Under such a ratio, it is possible to ensure appropriate curability and form a release layer having desired release properties. As long as the polyorganosiloxane contains the siloxane units of the above chemical formulas 1 to 3, it may also have other siloxane units.

[0045] For example, the polyorganosiloxane of the present application may further include one or more siloxane units selected from the group consisting of siloxane units of the following chemical formula 4 and siloxane units of the following chemical formula 5: [Chemical formula 4] (R 1 3SiO 1 / 2 ) [Chemical formula 5] (R 2 R 1 2SiO 1 / 2 ) In formulas 4 and 5, R 1 is an alkyl group, R 2 may be an alkenyl group.

[0046] The specific types of the alkyl group and the alkenyl group in Chemical Formulas 4 and 5 are as described at the beginning of this specification.

[0047] The siloxane units of the above formulas 4 and 5 are so-called M units, and such units can be present at the end and / or side chains of the polymer chain of the polyorganosiloxane. In one example, the polyorganosiloxane may contain only one of the siloxane units of the above formulas 4 and 5, or may contain both of them.

[0048] Such polyorganosiloxanes of the present application can have, for example, average units of the following formula 6: [Chemical formula 6] R 1 a R 2 b R 3 c R 4 d SiO (4-a-b-c-d) / 2 In Chemical Formula 6, R 1 is an alkyl group, R 2 is an alkenyl group, R 3 is an aryl group, R 4 may be, but is not limited to, an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group.

[0049] Specific types of the alkyl group, the alkenyl group, the aryl group, the alkoxy group and the monovalent hydrocarbon group in Chemical Formula 6 are as described at the beginning of this specification.

[0050] In this specification, the term "average unit of polyorganosiloxane" refers to a formula expressed by assuming that the number of moles of silicon atoms contained in polyorganosiloxane is 1 mole, and converting the average number of moles of oxygen atoms, which are functional groups and linkers (linkers that connect silicon atoms to silicon atoms) directly bonded to silicon atoms contained in the polyorganosiloxane, based on this. Such an average unit may be related to one molecule of polyorganosiloxane, or to a mixture of two or more molecules of polyorganosiloxane. When the average unit is related to a mixture of two or more molecules of polyorganosiloxane, the proportion of the functional group or linker is calculated by assuming that the number of all silicon atoms contained in the polyorganosiloxane is 1 mole.

[0051] R shown to the left of the silicon atom (Si) in chemical formula 6 1 , R 2 , R 3 and R 4 represents a functional group directly linked to the silicon atom, and the oxygen atom (O) on the right represents a linker connecting the silicon atoms.

[0052] In Chemical Formula 6, a is the functional group R 1 In Chemical Formula 6, b is the number of moles of the functional group R 2 In Chemical Formula 6, c is the number of moles of the functional group R 3 In Chemical Formula 6, d is the number of moles of the functional group R 4 is the number of moles.

[0053] In addition, in Chemical Formula 6, (4-abcd) is the number of moles of the oxygen atom (O) as the linker, calculated assuming that the number of moles of silicon atoms contained in the compound is 1 mole. In the case of the oxygen atom (O) as the linker, two silicon atoms are bonded, so the number of moles is expressed by dividing it by 2.

[0054] In Chemical Formula 6, the lower limit of a may be about 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8 or 1.9, and the upper limit may be about 6, 5.5, 5, 4.5, 4, 3.5, 3, 2.5 or 2. The a may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0055] In Chemical Formula 6, the lower limit of b may be about 0.001, 0.005, 0.01, 0.02, 0.04, or 0.05, and the upper limit may be about 0.7, 0.6, 0.5, 0.4, 0.2, 0.1, 0.05, 0.03, or 0.02. The b may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0056] In Chemical Formula 6, the lower limit of c may be about 0.001, 0.01, 0.03, 0.05, 0.07, or 0.09, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2, 1, 0.8, 0.5, 0.2, 0.1, or 0.05. The c may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits mentioned above.

[0057] In Chemical Formula 6, the upper limit of d may be about 1, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, 0.05, 0.01, or 0.001, and the lower limit may be 0. The d may be equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits mentioned above, and equal to or less than any one of the upper limits mentioned above.

[0058] By applying a polyorganosiloxane having the above average units, it is possible to provide a release composition that has suitable curability and forms a release layer having desired properties after curing.

[0059] The polyorganosiloxane may have a substantially linear structure. For example, the polyorganosiloxane may be substantially composed of only M units and D units, or may have a structure containing T and / or Q units together with M and D units, with the proportion of the T and / or Q units being equal to or less than a certain level.

[0060] For example, the upper limit of the ratio of the total number of moles of trifunctional siloxane units (T units) and tetrafunctional siloxane units (Q units) to the total number of moles of siloxane units contained in the polyorganosiloxane (100X (moles of T units + moles of Q units) / total number of moles of siloxane units) may be about 10 mol%, 9 mol%, 8 mol%, 7 mol%, 6 mol%, 4 mol%, 3 mol%, 2 mol%, 1 mol%, 0.5 mol% or 0.1 mol%, and the lower limit may be 0 mol%. The ratio may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. Under such a ratio, appropriate curability can be ensured and a release layer having desired release properties can be formed.

[0061] The polyorganosiloxane can have a certain level of weight average molecular weight. For example, the lower limit of the weight average molecular weight may be about 20,000 g / mol, 50,000 g / mol, 100,000 g / mol, 150,000 g / mol, 200,000 g / mol, 250,000 g / mol, 300,000 g / mol, 350,000 g / mol, 400,000 g / mol, 450,000 g / mol, 500,000 g / mol, or 550,000 g / mol, and the upper limit may be about 2,000,000 g / mol, 1,500,000 g / mol, 1,000,000 g / mol, 900,000 g / mol, 800,000 g / mol, 700,000 g / mol, or 650,000 g / mol. The weight average molecular weight may be equal to or greater than any one of the lower limits mentioned above, or equal to or less than any one of the upper limits mentioned above, or may be equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits mentioned above.

[0062] The polyorganosiloxanes of the present application may have a certain level of polydispersity index, which is the weight average molecular weight (Mw) of the compound divided by the number average molecular weight (Mn) (Mw / Mn).

[0063] The lower limit of the polydispersity index (PDI) may be about 1, 1.25, 1.5, 1.75 or 1.8, and the upper limit may be about 5, 3.5, 3, 2.5, 2.2 or 2. The polydispersity index may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. When the polyorganosiloxane component has a polydispersity index within the above range, excellent release properties and smooth coating film formability can be ensured.

[0064] The lower limit of the content of the polyorganosiloxane component in the mold release composition may be about 0.5% by weight, 1% by weight, 3% by weight, 5% by weight, 7% by weight, 8% by weight, 10% by weight, 20% by weight, 30% by weight, 40% by weight, 50% by weight, 60% by weight, 70% by weight or 75% by weight, and the upper limit may be about 95% by weight, 90% by weight, 85% by weight, 80% by weight, 75% by weight, 70% by weight, 65% by weight, 60% by weight, 55% by weight, 50% by weight, 45% by weight, 40% by weight, 35% by weight, 30% by weight, 25% by weight, 20% by weight, 15% by weight or 10% by weight. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. The ratio is based on the solid content, and therefore, when the release composition contains a solvent, it is the ratio to the total weight of the release composition excluding the weight of the solvent. By including the polyorganosiloxane within the above range, a release composition having excellent curability and forming a release layer with desired physical properties can be provided.

[0065] The polyorganosiloxane as described above can be produced by a known method. In general, the polyorganosiloxane can be produced by polymerizing an alkoxysilane compound or a partial condensate thereof, or by ring-opening polymerization of a cyclic siloxane compound, and such known methods can be applied to the present application.

[0066] The release composition of the present application, when containing the polyorganosiloxane, may further contain other components.

[0067] For example, the release composition may further contain a curable silicone resin component in addition to the polyorganosiloxane.

[0068] The term "curable silicone resin component" refers to a silicone resin component that can be cured. As is well known, the term "curing" refers to a phenomenon in which the viscosity of the release composition increases or the release composition hardens through a chemical or physical reaction or interaction.

[0069] Such a curable silicone resin component may contain a compound having the above-mentioned curable functional group. However, the category of the curable silicone resin component or curable compound referred to in this specification does not include polyorganosiloxanes having siloxane units of the above chemical formulas 1 to 3.

[0070] For example, the curable silicone resin component may be an addition curing type silicone resin component described later, and such an addition curing type silicone resin component may contain a polyorganosiloxane having an alkenyl group such as a vinyl group. Meanwhile, since the polyorganosiloxane having the siloxane unit of the above chemical formulas 1 to 3 also has an alkenyl group, the polyorganosiloxane can also be strictly classified as a curable silicone resin component, but for convenience of explanation, the components and compounds referred to as the curable silicone resin component in this specification do not include the polyorganosiloxane having the siloxane unit of the above chemical formulas 1 to 3. However, this explanation does not mean that the polyorganosiloxane having the siloxane unit of the above chemical formulas 1 to 3 is not curable.

[0071] In this specification, the polyorganosiloxanes having the siloxane units of the above chemical formulas 1 to 3 are sometimes called added polyorganosiloxanes in order to distinguish them from the polyorganosiloxanes contained in the curable silicone resin component.

[0072] The curable silicone resin component may consist of one type of polyorganosiloxane or a mixture of two or more types of polyorganosiloxanes.

[0073] In one example, the silicone resin component of the release composition may be a so-called addition curing type component. Such a resin component may include, for example, a polyorganosiloxane that includes a siloxane unit having an alkenyl group bonded to a silicon atom (hereinafter, also referred to as the first polyorganosiloxane or the first polyorganosiloxane component).

[0074] The first polyorganosiloxane or the first polyorganosiloxane component may have, for example, an average unit of the following formula 7. The meaning of the average unit is as described above. [Chemical formula 7] P 2 c Q 2 d SiO (4-c-d) / 2 In Chemical Formula 7, P 2 is an alkenyl group, and Q 2 may be an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group.

[0075] In Chemical Formula 7, c and d are arbitrary numbers.

[0076] In Chemical Formula 7, the specific types of the alkenyl group, alkoxy group, and monovalent hydrocarbon group are as described at the beginning of this specification.

[0077] In one example, the lower limit of c may be about 0.0001, 0.0005, 0.001, 0.002, 0.005, or 0.01, and the upper limit may be about 0.1, 0.09, 0.08, 0.07, 0.06, 0.05, 0.04, 0.03, 0.02, 0.01, 0.009, 0.008, 0.007, 0.006, 0.005, 0.004, or 0.003. The c may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0078] In one example, the lower limit of d may be about 0.5, 1, 1.5, 1.7, or 1.9, and the upper limit may be about 5, 4, 3.5, 3, 2.5, or 2. The d may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above.

[0079] The first polyorganosiloxane may include an alkenyl group bonded to a silicon atom, and the ratio of the alkenyl group based on the total molar number of organic groups bonded to silicon atoms contained in the polyorganosiloxane can be adjusted. For example, the lower limit of the mole ratio of the silicon-bonded alkenyl groups based on the mole number of all silicon-bonded organic groups contained in the first polyorganosiloxane may be about 0.01 mol%, 0.05 mol%, 0.1 mol%, 0.15 mol%, 0.2 mol%, 0.25 mol%, 0.3 mol%, 0.35 mol%, 0.4 mol%, 0.45 mol%, 0.5 mol%, 0.6 mol%, 0.7 mol%, 0.8 mol%, 0.9 mol%, or 1 mol%, and the upper limit may be about 1.5 mol%, 1.4 mol%, 1.3 mol%, 1.2 mol%, 1.1 mol%, 0.9 mol%, 0.8 mol%, 0.7 mol%, 0.6 mol%, 0.5 mol%, 0.4 mol%, 0.3 mol%, 0.2 mol%, or 0.1 mol%. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. Under such a ratio, appropriate curability can be ensured and a release layer having desired release properties can be formed.

[0080] Such an alkenyl group may be contained in a siloxane unit of a specific structure in the polyorganosiloxane. For example, the first polyorganosiloxane may contain one or more siloxane units selected from the group consisting of siloxane units of the following chemical formula 9 and siloxane units of the following chemical formula 10. [Chemical formula 9] ViR 3 2SiO 1 / 2 [Chemical formula 10] ViR 3 SiO 2 / 2 In formulas 9 and 10, Vi is an alkenyl group, and R 3 may be a hydroxy group, an alkoxy group, or a monovalent hydrocarbon group. Specific types of the alkenyl group, alkoxy group, and monovalent hydrocarbon group are as described in Chemical Formula 7.

[0081] The lower limit of the ratio of the siloxane units of the above formula 9 based on the total siloxane units in the first polyorganosiloxane component may be about 0.001 mol%, 0.005 mol%, 0.01 mol%, 0.02 mol%, 0.03 mol%, 0.04 mol%, 0.05 mol%, 0.06 mol%, 0.07 mol%, 0.08 mol%, 0.09 mol%, or 0.095 mol%, and the upper limit may be about 0.5 mol%, 0.4 mol%, 0.3 mol%, 0.2 mol%, 0.1 mol%, 0.09 mol%, 0.08 mol%, or 0.07 mol%. The ratio may be greater than or equal to any one of the lower limits mentioned above, or less than or equal to any one of the upper limits mentioned above, or may be within a range of greater than or equal to any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0082] The lower limit of the ratio of the siloxane units of the formula 10 based on the total siloxane units in the first polyorganosiloxane component may be about 0.01 mol%, 0.05 mol%, 0.1 mol%, 0.15 mol%, 0.2 mol%, 0.3 mol%, 0.4 mol%, 0.5 mol%, 0.6 mol%, 0.7 mol%, 0.8 mol%, or 0.9 mol%, and the upper limit may be about 10 mol%, 9 mol%, 8 mol%, 7 mol%, 6 mol%, 5 mol%, 4 mol%, 3 mol%, 2 mol%, or 1 mol%. The ratio may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits.

[0083] The first polyorganosiloxane component may include all of the siloxane units of formulas 9 and 10. In this case, the molar ratio of the siloxane units of formula 10 to the siloxane units of formula 9 may be about 0.1, 0.5, 1, 1.5, 2, 2.5, 3, 4, 5, 6, 7, 8, 9, or 9.5, and the upper limit may be about 20, 18, 16, 14, 12, 11, 10, 9, 8, 7, 6, 5, 4, or 3. The molar ratio may be greater than or exceed any one of the lower limits, less than or equal to any one of the upper limits, or greater than or exceed any one of the lower limits and less than or equal to any one of the upper limits.

[0084] The lower limit of the number of silicon atoms contained in the first polyorganosiloxane component may be about 500, 1,500, 2,000, 2,500 or 3,000, and the upper limit may be about 10,000, 5,000, 4,000, 3,500, 3,000, 2,500 or 2,100. The number of silicon atoms may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0085] The first polyorganosiloxane component can have a substantially linear structure. In this case, the polyorganosiloxane can be substantially composed of only M units (monofunctional siloxane units) and D units (difunctional siloxane units), or can have a structure that includes T units (trifunctional siloxane units) and / or Q units (tetrafunctional siloxane units) together with M units (monofunctional siloxane units) and D units (difunctional siloxane units), and the proportion of the T units (trifunctional siloxane units) and / or Q units (tetrafunctional siloxane units) is below a certain level.

[0086] For example, in the first polyorganosiloxane component, the upper limit of the ratio of the total moles of the T and Q units to the total moles of the siloxane units contained in the polyorganosiloxane (100X (moles of T units + moles of Q units) / total moles of siloxane units) may be about 10 mol%, 9 mol%, 8 mol%, 7 mol%, 6 mol%, 5 mol%, 4 mol%, 3 mol%, 2 mol%, 1 mol% or 0.5 mol%, and the lower limit may be 0 mol%. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0087] The lower limit of the weight average molecular weight of the first polyorganosiloxane component may be about 100,000 g / mol, 150,000 g / mol, 200,000 g / mol, 250,000 g / mol, or 300,000 g / mol, and the upper limit may be about 1,000,000 g / mol, 950,000 g / mol, 900,000 g / mol, 850,000 g / mol, 800,000 g / mol, 750,000 g / mol, 700,000 g / mol, 650,000 g / mol, 600,000 g / mol, 550,000 g / mol, 500,000 g / mol, 450,000 g / mol, or 400,000 g / mol. The weight average molecular weight may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. The first polyorganosiloxane has a weight average molecular weight within the above range, thereby ensuring an appropriate viscosity and exhibiting excellent coating properties.

[0088] The polydispersity index (PDI) of the first polyorganosiloxane component may have a lower limit of about 1, 1.25, or 1.5, and an upper limit of about 5, 3.5, or 2.5. The polydispersity index may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above.

[0089] The curable silicone resin component may contain a polyorganosiloxane having an average unit of the following chemical formula 8 (hereinafter, may be referred to as a second polyorganosiloxane or a second polyorganosiloxane component) together with the first polyorganosiloxane described above. The meaning of the average unit is as described above. The average unit may relate to one molecule of polyorganosiloxane or a mixture of two or more molecules of polyorganosiloxane. [Chemical formula 8] H e Q 3 f SiO (4-e-f) / 2 In Chemical Formula 8, Q 3 may be an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group.

[0090] In Chemical Formula 8, e and f are arbitrary numbers.

[0091] Specific examples of the alkoxy group or monovalent hydrocarbon group in the above Chemical Formula 8 are the same as those in Chemical Formula 7.

[0092] In the above formula 8, the lower limit of e may be about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, or 0.6, and the upper limit may be about 2, 1.5, 1, 0.9, 0.8, 0.7, 0.65, 0.6, 0.5, 0.4, 0.39, 0.38, 0.37, 0.36, or 0.35. The e may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits.

[0093] In the above Chemical Formula 8, the lower limit of f may be about 0.5, 1, 1.1, 1.2, 1.3, 1.4, 1.5 or 1.6, and the upper limit may be about 4, 3.5, 3, 2.5, 2, 1.9, 1.8, 1.7, 1.6 or 1.5. The f may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0094] The second polyorganosiloxane may contain hydrogen atoms bonded to silicon atoms, and the ratio of the hydrogen atoms based on the molar number of the organic groups bonded to the entire silicon atoms contained in the polyorganosiloxane can be adjusted.For example, the lower limit of the ratio of the molar number of the silicon-bonded hydrogen atoms based on the molar number of the entire silicon-bonded organic groups contained in the second polyorganosiloxane may be about 1 mol%, 5 mol%, 10 mol%, 15 mol%, 20 mol%, 25 mol% or 30 mol%, and the upper limit may be about 85 mol%, 80 mol%, 75 mol%, 70 mol%, 65 mol%, 60 mol%, 55 mol%, 50 mol%, 45 mol%, 40 mol%, 35 mol%, 30 mol%, 25 mol% or 20 mol%. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. Under such a ratio, appropriate curability can be ensured and a release layer having desired release properties can be formed.

[0095] Such hydrogen atoms may be contained in siloxane units of a specific structure in the polyorganosiloxane.

[0096] For example, the silicon-bonded hydrogen atoms may be present at least in the siloxane unit of the following formula 11: [Chemical formula 11] HR 4 SiO 2 / 2 In formula 11, R 4 may be a hydroxy group, an alkoxy group, or a monovalent hydrocarbon group. The specific types of the alkoxy group and the monovalent hydrocarbon group in the above Chemical Formula 11 are the same as those in Chemical Formula 8.

[0097] The lower limit of the ratio of the number of moles of the siloxane units of the above formula 11 based on the total number of moles of the siloxane units containing silicon-bonded hydrogen atoms among all the siloxane units contained in the second polyorganosiloxane component may be about 85 mol%, 90 mol%, 95 mol%, 96 mol%, 97 mol%, 98 mol%, 99 mol% or 99.5 mol%, and the upper limit may be about 100 mol%. The ratio may be equal to or greater than any one of the lower limits mentioned above, or may be equal to or greater than any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0098] The lower limit of the ratio of the siloxane units of the above formula 11 based on the total siloxane units in the second polyorganosiloxane component may be about 10 mol%, 15 mol%, 20 mol%, 25 mol%, 30 mol%, 35 mol%, 40 mol%, 45 mol%, 50 mol%, 55 mol% or 60 mol%, and the upper limit may be about 85 mol%, 80 mol%, 75 mol%, 70 mol%, 65 mol%, 60 mol%, 55 mol% or 50 mol%. The ratio may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or equal to or greater than any one of the lower limits mentioned above and equal to or less than any one of the upper limits mentioned above.

[0099] The lower limit of the number of silicon atoms contained in the second polyorganosiloxane component may be about 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85 or 90, and the upper limit may be about 1,000, 950, 900, 850, 800, 750, 700, 650, 600, 550, 500, 450, 400, 350, 300, 250, 200, 150, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55 or 50. The number of silicon atoms may be greater than or equal to any one of the lower limits mentioned above, or less than or equal to any one of the upper limits mentioned above, or may be greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits mentioned above.

[0100] The second polyorganosiloxane component may have a substantially linear structure. In this case, the polyorganosiloxane may have a structure that is substantially composed of only M units and D units, or that includes T and / or Q units together with M units and D units, and the proportion of the T and / or Q units is below a certain level.

[0101] For example, in the second polyorganosiloxane component, the upper limit of the ratio of the total moles of the T and Q units to the total moles of the siloxane units contained in the polyorganosiloxane (100X (moles of T units + moles of Q units) / total moles of siloxane units) may be about 10 mol%, 9 mol%, 8 mol%, 7 mol%, 6 mol%, 5 mol%, 4 mol%, 3 mol%, 2 mol%, 1 mol% or 0.5 mol%, and the lower limit may be 0 mol%. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0102] The lower limit of the weight average molecular weight of the second polyorganosiloxane may be about 1,000 g / mol, 2,000 g / mol, 3,000 g / mol, 4,000 g / mol, 5,000 g / mol, 6,000 g / mol, 7,000 g / mol, 8,000 g / mol, or 9,000 g / mol, and the upper limit may be about 100,000 g / mol, 90,000 g / mol, 80,000 g / mol, 70,000 g / mol, 60,000 g / mol, 50,000 g / mol, 45,000 g / mol, 40,000 g / mol, 30,000 g / mol, 20,000 g / mol, 15,000 g / mol, or 12,000 g / mol. The weight average molecular weight may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. By having the weight average molecular weight of the second polyorganosiloxane within the above range, excellent curability can be ensured.

[0103] The lower limit of the polydispersity index of the second polyorganosiloxane may be about 1, 1.25 or 1.5, and the upper limit may be about 5, 3.5 or 2.5. The polydispersity index may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0104] The lower limit of the first polyorganosiloxane component in the curable silicone resin component or the release composition may be about 20% by weight, 25% by weight, 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, or 90% by weight, and the upper limit may be about 98% by weight, 96% by weight, 94% by weight, 92% by weight, 90% by weight, 85% by weight, 80% by weight, 75% by weight, 70% by weight, 65% by weight, 60% by weight, 55% by weight, 50% by weight, 45% by weight, 40% by weight, 35% by weight, or 30% by weight. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. The ratio is based on the solid content, and therefore, when the release composition contains a solvent, it is the ratio to the total weight of the release composition excluding the weight of the solvent. By including the first polyorganosiloxane within the above range, it is possible to ensure an appropriate level of release peel force and excellent residual adhesion rate of the release layer described later.

[0105] The lower limit of the weight of the second polyorganosiloxane in the curable silicone resin component or the release composition relative to 100 parts by weight of the first polyorganosiloxane may be about 0.1 parts by weight, 0.25 parts by weight, 0.5 parts by weight, 0.75 parts by weight, 1 part by weight, 1.25 parts by weight, 1.5 parts by weight, 1.75 parts by weight or 2 parts by weight, and the upper limit may be about 10 parts by weight, 8 parts by weight, 6 parts by weight, 4 parts by weight or 3.5 parts by weight, 3 parts by weight or 2.5 parts by weight. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. When the second polyorganosiloxane is included within the above range, the crosslink density can be improved to ensure a cured product with excellent durability.

[0106] In the release composition of the present application, the lower limit of the weight of the added polyorganosiloxane relative to 100 parts by weight of the curable silicone resin component may be about 1 part by weight, 5 parts by weight, 10 parts by weight, 50 parts by weight, 100 parts by weight, 200 parts by weight, 300 parts by weight, or 350 parts by weight, and the upper limit may be about 1000 parts by weight, 900 parts by weight, 800 parts by weight, 700 parts by weight, 600 parts by weight, 500 parts by weight, 400 parts by weight, 300 parts by weight, 200 parts by weight, 100 parts by weight, 50 parts by weight, 40 parts by weight, 30 parts by weight, 20 parts by weight, or 10 parts by weight. The ratio may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. By adjusting the proportion of the added polyorganosiloxane, the desired release layer can be formed more effectively.

[0107] The release composition of the present application may further include a catalyst if necessary in consideration of the curability. As the catalyst, a suitable known catalyst may be used in consideration of the curing type of the curable silicone resin component. For example, when the curable silicone resin component is an addition curing type, a metal catalyst may be used as the catalyst. The metal catalyst may include one or more central metal elements selected from the group consisting of aluminum, bismuth, lead, mercury, tin, zinc, platinum, silver, and zirconium. As the metal catalyst, for example, Bis[1,3-bis(2-ethenyl)-1,1,3,3-tetramethyldisiloxane]platinum (CAS No. 81032-58-8), dibutyltin dilaurate, or dimethyltin diacetate may be used, but is not limited thereto. For example, the catalyst may be a catalyst known in the art as a so-called addition curing type catalyst.

[0108] The content of the catalyst is not particularly limited as long as it is included in the catalytic amount. For example, the lower limit of the weight part of the catalyst relative to 100 parts by weight of the curable silicone resin component may be about 0.1 parts by weight, 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, or 3 parts by weight, and the upper limit may be about 10 parts by weight, 9 parts by weight, 8 parts by weight, 7 parts by weight, 6 parts by weight, 5 parts by weight, 4 parts by weight, or 3 parts by weight. The content may be equal to or greater than any one of the lower limits described above, equal to or greater than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. By including the catalyst within the above range, it is possible to effectively proceed with the reaction of forming a cured product by reducing side reactions.

[0109] The release composition according to an embodiment of the present application may further include an organic solvent. In consideration of the composition of the release composition, the solvent is preferably an organic solvent. The organic solvent is not particularly limited as long as it is generally used in the industry, and tetrahydrofuran, methyl ethyl ketone, toluene, heptane, or a mixture of these solvents can be used. The mixing ratio of these solvents is not particularly limited, and they can be appropriately mixed as needed.

[0110] The amount of the solvent can be adjusted as necessary and is not particularly limited.

[0111] The present application also relates to a release layer. The release layer may comprise the release composition described above or a cured product thereof.

[0112] Therefore, the release layer includes the additive polyorganosiloxane, and may further include the curable silicone resin component, and may include a reaction product of the component in some cases. The release layer may be formed, for example, by curing the release composition according to the example of the present application described above. The method of performing such curing is not particularly limited, and an appropriate curing method may be adopted depending on the type of the curable resin component.

[0113] The release layer contains the release composition or a cured product thereof, and thus can effectively satisfy the physical properties targeted in the present application.

[0114] That is, the release layer can stably maintain the desired release properties even after being maintained for a long period of time regardless of temperature. In addition, the release layer can stably maintain the balance between so-called high-speed and low-speed peeling forces. In addition, the release layer can stably maintain the release properties even when the adhesive or the like is attached and peeled off multiple times. The release composition can have excellent curability and can therefore stably cure to form the release layer described above.

[0115] For example, the release layer may satisfy one or more of the physical properties represented by the following formulas 1 to 5. That is, the release layer may satisfy one of the physical properties represented by the following formulas 1 to 5, may simultaneously satisfy two or more of the physical properties, or may satisfy all of the physical properties represented by the formulas 1 to 5.

[0116] For example, the release layer has a peel force change rate over time (A R1 ) may be within a predetermined range. For example, R1 The upper limit of the rate of change in peel force over time (A) may be about 18%, 17%, 16%, 15%, 14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.9%, 0.8%, 0.7% or 0.6%, and the lower limit may be about 0%. R1 ) may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. By making the rate of change in the release force over time satisfy the above range, the present application can provide a release layer having an appropriate level of release force and residual adhesion rate. [Formula 1] A R1 =100Х(|A7-A1|) / A1 In formula 1, A1 may be the release force measured while maintaining the pressure-sensitive adhesive layer attached to the release layer for 24 hours at 25°C, and then peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25°C, and A7 may be the release force measured while maintaining the pressure-sensitive adhesive layer attached to the release layer for 168 hours at 25°C, and then peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25°C.

[0117] In Equation 1, |A7-A1| means the absolute value of the difference between A7 and A1.

[0118] The rate of change in peel force over time (A R1Specific measurement methods (including measurement methods for release peel strengths A7 and A1) will be described in the Examples section.

[0119] The release layer of the present application is R1 By satisfying the above range, an appropriate level of release force can be exhibited even after a long period of time has elapsed.

[0120] The upper limit of the release peel force A7 in the formula 1 may be about 500gf / inch, 400gf / inch, 300gf / inch, 200gf / inch, 100gf / inch, 50gf / inch, 30gf / inch, 20gf / inch, 15gf / inch or 10gf / inch, and the lower limit may be about 1gf / inch or 5gf / inch. The release peel force A7 may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. The release layer of the present application has a release peel force A7 that satisfies the above range and can exhibit desired releasability in various applications.

[0121] The release layer of the present application has a peel force change rate over time (A R2 For example, the peel force change rate over time (A R2 ) may be about 0% or 1%, and the upper limit may be about 20%, 19%, 18%, 17%, 16%, 15%, 14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or 0.5%. The rate of change in peel force over time may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. In the present application, by making the rate of change in peel force over time satisfy the above range, the desired releasability can be stably maintained even when the release layer is maintained at high temperature for a long period of time. [Formula 2] AR2 =100Х|A 60℃,7 -A 60℃,1 | / A 60℃,1 In Equation 2, A 60℃,1 is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 24 hours; A 60℃,7 may be a release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180 degrees and a peel speed of 0.3 m / min at 25°C after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60°C for 168 hours.

[0122] In Equation 2, |A 60℃,7 -A 60℃,1 | is A 60℃,7 and A 60℃,1 means the absolute value of the difference between

[0123] The rate of change in peel force over time (A R2 ) Specific measurement method (mold release peel force A 60℃,7 and A 60℃,1 (including methods for measuring) are described in the Examples section of this specification.

[0124] The release force A of the above formula 2 60℃,1 The upper limit of may be about 500 gf / inch, 400 gf / inch, 300 gf / inch, 200 gf / inch, 100 gf / inch, 50 gf / inch, 30 gf / inch, 20 gf / inch or 10 gf / inch, and the lower limit may be about 1 gf / inch or 5 gf / inch. The release peel force may be equal to or less than any one of the upper limits mentioned above, or equal to or more than any one of the lower limits mentioned above, and may be within a range equal to or less than any one of the upper limits mentioned above. The present application relates to a release peel force (A) that satisfies the above range. 60℃,1 ), it is possible to provide a release layer having an appropriate level of release force and residual adhesion rate even at high temperatures.

[0125] The release force A of the above formula 2 60℃,7 The upper limit may be about 500 gf / inch, 400 gf / inch, 300 gf / inch, 200 gf / inch, 100 gf / inch, 50 gf / inch, 30 gf / inch, 20 gf / inch or 10 gf / inch, and the lower limit may be about 1 gf / inch or 5 gf / inch. The release force may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. By satisfying the above range, the present application can provide a release layer having an appropriate level of release force and residual adhesion rate even after time has elapsed at high temperatures.

[0126] The rate of change in peel strength over time (A R3 ) may be about 30%, 29%, 28%, 27%, 26%, 25%, 20%, 15%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2% or 1%, and its lower limit may be about 0% or 0.1%. The room temperature (about 25°C)-60°C peel force change rate over time may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. By satisfying the above range, the present application can stably maintain the desired release properties even when the release layer is maintained for a long period of time in an environment with temperature changes. [Formula 3] A R3 =100Х|A 60℃,7 -A1| / A1 In Equation 3, A1 is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 24 hours, and A 60℃,7may be a release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180 degrees and a peel speed of 0.3 m / min at 25°C after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60°C for 168 hours.

[0127] In Equation 3, |A 60℃,7 -A1| is A 60℃,7 and A1.

[0128] The rate of change in peel strength over time from room temperature (approximately 25°C) to 60°C according to the above formula 3 (A R3 ) Specific measurement method (mold release peel force A 60℃,7 and A1) are described in the Examples section of this specification.

[0129] The release layer of the present application is a peel force ratio (A R4 ) may be within a predetermined range. For example, R4 ) may be about 50%, 100%, 150%, 155%, 160%, 165%, 170%, 175%, 180% or 185%, and its upper limit may be about 600%, 590%, 580%, 570%, 560%, 550%, 540%, 530%, 520%, 500%, 450%, 400%, 350%, 300%, 250%, 200% or 190%. The peel force ratio according to the peel speed may be less than or equal to any one of the upper limits described above, or may be greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. The present application can provide a release layer that exhibits a relatively high peel force when peeled at a relatively low speed and a relatively low peel force when peeled at a relatively high speed by satisfying the above range. The release layer can stably exhibit such a balance of the peeling force depending on the peeling speed even under high temperature conditions. [Formula 4] A R4 =100ХA H / A L In Equation 4, A His the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 30 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 30 m / min at 25° C. L may be a release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25°C after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60°C for 24 hours.

[0130] The peel force ratio (A R4 ) Specific measurement method (mold release peel force A H and A L The method for measuring the amount of β-amino acid is described in the Examples section of this specification.

[0131] The release layer of the present application has a residual adhesion rate (A d ) may be within a predetermined range. For example, d The lower limit of may be about 80%, 82.5%, 85%, 87.5% or 90%, and the upper limit may be about 100% or 99%. The residual adhesion rate may be equal to or greater than any one of the lower limits mentioned above, or may be equal to or greater than any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0132] The residual adhesion rate (A d ), the release property can be stably maintained even after the pressure-sensitive adhesive layer is attached to and peeled off from the release layer several times. [Formula 5] Residual adhesion rate (A d )=100ХA f / A i In Equation 5, A iis the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. f A i The release peel force may be measured after measuring the above-mentioned adhesion state of the pressure-sensitive adhesive layer to the release layer at 25°C for 24 hours, and then measuring the release peel force while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25°C.

[0133] The residual adhesion rate (A d ) Specific measurement method (mold release peel force A f and A i The measurement method is described in the Examples section.

[0134] In the release layer of the present application, the release force A i The upper limit of may be about 500gf / inch, 400gf / inch, 300gf / inch, 200gf / inch, 100gf / inch, 50gf / inch or 25gf / inch, and the lower limit may be about 1gf / inch or 5gf / inch. The release force may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits and equal to or less than any one of the upper limits described above. When the release layer according to one example of the present application has a release force that satisfies the above range, it can be said to have an appropriate level of release force and residual adhesion rate.

[0135] In the release layer of the present application, the release force A fThe lower limit may be about 1 gf / inch or 5 gf / inch, and the upper limit may be about 500 gf / inch, 400 gf / inch, 300 gf / inch, 200 gf / inch, 100 gf / inch, 50 gf / inch, or 25 gf / inch. The demolding peeling force may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0136] The present application relates to a mold release peel force (A f ) and the residual adhesion rate (A d ) can provide a release layer having an appropriate level of release force and residual adhesion rate.

[0137] The present application also relates to a release film.

[0138] The release film may include a base film and a release layer formed on one or both sides of the base film.

[0139] The specific details regarding the release layer are as described above.

[0140] The type of the base film of the release film according to the embodiment of the present application is not particularly limited. As the base film, a base film that is generally applicable to the formation of a release film can be used.

[0141] For example, the substrate film may be, but is not limited to, a PET (poly(ethylene terephthalate)) film, a PTFE (poly(tetrafluoroethylene)) film, a PP (polypropylene) film, a PE (polyethylene) film, a polyimide film, a polyamide film, a COP (cyclic olefin polymer) film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film, and / or a polyimide film.

[0142] The substrate film may be composed of a single layer or may be composed of two or more layers, and may further include a functional layer such as an antifouling layer or an antistatic layer, etc. From the viewpoint of improving the adhesion to the substrate, one or both sides of the substrate may be further subjected to a surface treatment such as a primer treatment.

[0143] The thickness of the base film is appropriately selected depending on the application, and is not particularly limited, and can usually be formed to a thickness of 5 μm to 500 μm, 5 μm to 250 μm, or 5 μm to 100 μm.

[0144] The release film of the present application may be manufactured by a known method. In one example, the release film of the present application may be manufactured by applying a release composition according to one example of the present application to one or both sides of a substrate, and then curing the composition to form a release layer. Here, the application method of the release composition is not particularly limited as long as it is a method commonly used in the art, and may be, for example, knife coating, roll coating, or reverse coating. In addition, when forming the release layer, it may be performed after sufficiently removing bubble-inducing components such as volatile components and reaction residues of the release composition. In addition, the method of curing the release composition is not particularly limited, and the release composition may be cured through an appropriate aging process or in an appropriate high-temperature environment or light irradiation environment as described above.

[0145] The thickness of the release layer contained in the release film is not particularly limited and may be, for example, 10 nm to 10 μm, 10 nm to 1 μm, or 10 nm to 100 nm.

[0146] The present application also relates to an adhesive film.

[0147] The adhesive film according to an embodiment of the present application may include the above-mentioned release layer and the adhesive layer to which the release layer is attached. By including the release layer, the adhesive layer can be protected before use.

[0148] The release layer of the adhesive film according to this example of the present application is as described above.

[0149] The adhesive that forms the adhesive layer of the adhesive film according to one example of the present application is not particularly limited.

[0150] For example, the adhesive for forming the adhesive layer can be appropriately selected from those having a base polymer such as an acrylic polymer, a silicon polymer, a polyester, a polyurethane, a polyamide, a polyether, or a fluorine-based or rubber-based polymer. Effect of the Invention

[0151] The present application provides a release composition, a release layer, a release film and an adhesive film.

[0152] Since the release composition of the present application has excellent curability, it can be stably cured to form a release layer.

[0153] The present application can provide a release composition that, when the release layer is formed, exhibits a stable residual adhesion rate even when the release layer is repeatedly applied to a pressure-sensitive adhesive layer or the like.

[0154] The release layer of the present application can maintain the desired release properties even when maintained at room temperature or high temperature for a long period of time. In addition, the release layer can stably maintain a balance between high-speed and low-speed peel forces. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0155] The present application will be described in more detail below with reference to examples and comparative examples, but the scope of the present application is not limited to the contents presented below.

[0156] 1.Method of measuring release force A test piece was prepared by laminating the adhesive layer of a standard tape (TESA, TESA7475) having an adhesive layer on the surface of the release layer of the release film prepared with the release composition of the Examples or Comparative Examples. The adhesion was performed by placing the adhesive layer of the standard tape on the release layer and then rolling a roller with a load of 2.5 kg back and forth three times. Next, the test piece was kept at room temperature (about 25°C) for 24 hours and the release peel force was measured, or the release peel force was measured after keeping it at 60°C for 24 hours. The release peel force was measured by peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min using a physical property measuring device (Cheminstruments, AR-1000) (low-speed peel force), or by peeling the standard tape at a peel angle of 180° and a peel speed of 30 m / min (high-speed peel force). The peel force was measured at room temperature (about 25°C).

[0157] 2. Room temperature peel strength change rate over time (A R1 ) Measurement method The release layer of the release film produced using the release composition of the Examples or Comparative Examples was calculated based on the room temperature peel strength change rate (A R1 ) was measured. [Formula 1] A R1 =100Х|A7-A1| / A1 In formula 1, A1 is the release peel force measured after a test piece prepared by laminating a standard tape (TESA, TESA7475) on the release layer of a release film in the same manner as described in the release peel force measurement method was maintained at room temperature (about 25°C) for about 24 hours. The release peel force was measured by peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min at room temperature (about 25°C) using a physical property measurement device (Cheminstruments, AR-1000). A7 in formula 1 is the release peel force measured after the test piece was maintained at room temperature (about 25°C) for 168 hours, and the release peel force was also measured by peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min at room temperature (about 25°C) using a physical property measurement device (Cheminstruments, AR-1000).

[0158] 3.60℃ peel strength change rate over time (A R2 ) Measurement method The release layer of the release film produced using the release composition of the Examples or Comparative Examples was calculated based on the 60°C peel strength change over time (A R2 ) was measured. [Formula 2] A R2 =100Х|A 60℃,7 -A 60℃,1 | / A 60℃,1 In Equation 2, A 60℃,1 is the release peel strength measured after maintaining the test piece at 60° C. for 24 hours, which was prepared by laminating a standard tape (TESA, TESA7475) on the release layer of the release film in the same manner as described in the release peel strength measurement method. A in Equation 2 60℃,7is the release peel strength measured after a test piece prepared by laminating a standard tape (TESA, TESA7475) to the release layer of the release film in the same manner as described in the release peel strength measurement method was maintained at 60° C. for 168 hours. The release peel strength was measured by peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min at room temperature (about 25° C.) using a physical property measurement device (Cheminstruments, AR-1000).

[0159] 4. Room temperature - 60℃ peel strength change rate over time (A R3 ) Measurement method The release layer of the release film produced using the release composition of the Examples or Comparative Examples was calculated based on the room temperature -60°C peel strength change rate (A R3 ) was measured. [Formula 3] A R3 =100Х|A 60℃,7 -A1| / A1 In Equation 3, A1 is the release peel strength measured after laminating a standard tape (TESA, TESA7475) on the release layer of the release film in the same manner as described in the release peel strength measurement method and maintaining the test piece at room temperature (about 25° C.) for 24 hours, and A 60℃,7 is the release peel strength measured after the test piece was kept at 60° C. for 168 hours. The release peel strength was measured by peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min at room temperature (about 25° C.) using a physical property measuring device (Cheminstruments, AR-1000).

[0160] 5. Peel force ratio by peel speed (A R4 ) Measurement method The release layer of the release film produced using the release composition of the Examples or Comparative Examples was calculated based on the following Equation 4: R4 ) was measured. [Formula 4] A R4 =100ХA H / A L In Equation 4, A His the release peel strength measured after laminating a standard tape (TESA, TESA7475) to the release layer of the release film in the same manner as described in the release peel strength measurement method, and maintaining the test piece at 60°C for 24 hours. The release peel strength was measured by peeling the standard tape at a peel angle of 180° and a peel speed of 30 m / min at room temperature (about 25°C) using a physical property measurement device (Cheminstruments, AR-1000). In addition, A in Equation 4 L is the release peel force measured after maintaining the test piece at 60°C for 24 hours, and is the release peel force measured while peeling the tape at room temperature (about 25°C) at a peel angle of 180° and a peel speed of 0.3 m / min using a physical property measuring device (Cheminstruments, AR-1000).

[0161] 6.Residual adhesion rate (A d ) Measurement method The release layer of the release film prepared using the release composition prepared in the Examples or Comparative Examples was calculated using the following formula 5 to determine the residual adhesion rate (A d ) was measured. [Formula 5] A d =100ХA f / A i In Equation 5, A i is the release peel force measured after laminating a standard tape (TESA, TESA7475) on the release layer of the release film in the same manner as described in the release peel force measurement method, and maintaining the test piece at room temperature (about 25°C) for about 24 hours. It is the release peel force measured while peeling the standard tape at a peel angle of 180 degrees and a peel speed of 0.3 m / min at room temperature (about 25°C) using a physical property measuring device (Cheminstruments, AR-1000). f A iAfter measuring the peel strength, a standard tape (TESA, TESA7475) was laminated on the release layer of the same release film in the same manner as described in the above peel strength measurement method to prepare a test piece, which was then kept at room temperature (about 25°C) for 24 hours and then the peel strength was measured. The peel strength was measured while peeling the standard tape at a peel angle of 180° and a peel speed of 0.3 m / min at room temperature (about 25°C) using a physical property measurement device (Cheminstruments, AR-1000).

[0162] 7. Method for evaluating the curability of release compositions The curability of the release composition was evaluated by a rub-off evaluation method for the release layer of the release film prepared using the release composition of the above Examples or Comparative Examples. The rub-off evaluation method is an evaluation method in which the surface of the release layer is rubbed with a constant load three times while wearing latex gloves, and then the change occurring thereafter is observed.

[0163] The curability was evaluated according to the following criteria.

[0164] <Curability evaluation criteria> PASS: If there is no change in the release layer after the Rub-off evaluation NG: If the release layer falls off or the base film is blurred after the Rub-off evaluation.

[0165] 8. Evaluation of weight-average molecular weight The weight average molecular weight (Mw) and polydispersity index (PDI) were measured using gel permeation chromatography (GPC). The weight average molecular weight (Mw) and number average molecular weight (Mn) referred to in this specification are in g / mol.

[0166] The sample (sample to be analyzed) was placed in a 20 mL vial and diluted with THF (tetrahydrofuran) to a concentration of approximately 20 mg / mL. After filtering the calibration standard sample and the sample to be analyzed through a syringe filter (pore size: 0.2 μm), the molecular weight characteristics were measured. As the analysis program, ChemStation from Agilent technologies was used. After comparing the elution time of the sample with the calibration curve to obtain the number average molecular weight (Mn) and the weight average molecular weight (Mw), the value obtained by dividing the weight average molecular weight (Mw) by the number average molecular weight (Mn) (Mw / Mn) was taken as the polydispersity index.

[0167] <GPC Measurement Conditions> Instrument: 1200 series from Agilent technologies Column: TL Mix.A&B from Agilent technologies was used Solvent: THF Column temperature: 40 °C Sample concentration: 20 mg / mL, 10 μL injection MP: 364000, 91450, 17970, 4910, 1300 were used as standard samples

[0168] Production Example 1. The polyorganosiloxane of the following Chemical Formula A was produced. [Chemical Formula A]

Chemical Structure

[0169] As monomers for forming the polyorganosiloxane, octamethylcyclotetrasiloxane (M), 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane (V) and octaphenylcyclotetrasiloxane (P) were mixed in a weight ratio of 170:10:10 (M:V:P) (primary mixture). P4-t-butyl-phosphazene (C) and chlorodimethylvinyl silane (S) were further added to the mixture (secondary mixture). The addition was performed in a weight ratio of about 6250:2.5:1 (primary mixture:C:S).

[0170] The secondary mixture was polymerized at about 60° C. for 12 hours to produce the polyorganosiloxane component of Formula A. The weight average molecular weight of the polyorganosiloxane component was about 600,000 g / mol, and the polydispersity index was about 1.85.

[0171] Production example 2. A polyorganosiloxane of the following formula B was produced. [Chemical formula B] [ka] In chemical formula B, x is a number of about 1,000, y is a number of about 60, and z is a number of about 7 to 8.

[0172] The polyorganosiloxane component of the above formula B was produced in the same manner as the polyorganosiloxane component of the above formula A, except that in the production of the polyorganosiloxane component of the above formula B, the weight ratio of octamethylcyclotetrasiloxane (M), 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane (V) and octaphenylcyclotetrasiloxane (P) was 130:9:1 (M:V:P) in the production of the primary mixture. The weight average molecular weight of the polyorganosiloxane component was about 600,000 g / mol, and the polydispersity index was about 1.85.

[0173] Production example 3. A polyorganosiloxane of the following formula D was prepared. [Chemical formula D] [ka] In chemical formula D, x is a number of about 1,000, y is a number of about 11, and z is a number of about 70.

[0174] The polyorganosiloxane component of formula D was prepared in the same manner as in Preparation Example 1. However, when preparing the polyorganosiloxane component of formula D, the weight ratio of octamethylcyclotetrasiloxane (M), 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane (V) and octaphenylcyclotetrasiloxane (P) in the primary mixture was adjusted to about 145:1:10 (M:V:P). The weight average molecular weight of the polyorganosiloxane component of formula D was about 600,000 g / mol, and the polydispersity index was about 1.85.

[0175] Example 1. A polyorganosiloxane (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol) of the following chemical formula E, a polyorganosiloxane (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol) of the following chemical formula F, a platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (A) of Preparation Example 1 were mixed in a weight ratio of 5:0.1:0.15:0.5 (E:F:C:A) and dispersed in a solvent to prepare a release composition. As the solvent (S), a mixture of THF (tetrahydrofuran), MEK (methylethyl ketone), toluene (T) and n-heptane (H) in a weight ratio of 50:30:10:10 (THF:MEK:T:H) was used. [Chemical formula E] [ka] In chemical formula E, m is a number of about 1,500, and n is a number of about 12 to 13.

[0176] [Chemical formula F] [ka] In chemical formula F, a is a number of about 34 to 36, and b is a number of about 34 to 36.

[0177] Example 2. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (A) of the above Production Example 1 were mixed in a weight ratio of 5:0.1:0.15:2.5 (E:F:C:A) and dispersed in a solvent to produce a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0178] Example 3. The polyorganosiloxane of the above formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (A) of the above preparation example 1 were mixed in a weight ratio of 5:0.1:0.15:12.5 (E:F:C:A) and dispersed in a solvent to prepare a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0179] Example 4. Instead of the polyorganosiloxane component of Production Example 1, the polyorganosiloxane component (B) of Production Example 2 was used. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (B) of Production Example 2 were mixed in a weight ratio of 5:0.1:0.15:0.5 (E:F:C:B) and dispersed in a solvent to produce a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0180] Example 5. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (B) of the above Preparation Example 2 were mixed in a weight ratio of 5:0.1:0.15:2.5 (E:F:C:B) and dispersed in a solvent to prepare a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0181] Example 6. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (B) of the above Production Example 2 were mixed in a weight ratio of 5:0.1:0.15:10 (E:F:C:B) and dispersed in a solvent to produce a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0182] Example 7. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (B) of the above Production Example 2 were mixed in a weight ratio of 5:0.1:0.15:12.5 (E:F:C:B) and dispersed in a solvent to produce a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0183] Example 8. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (B) of the above Preparation Example 2 were mixed in a weight ratio of 5:0.1:0.15:20 (E:F:C:B) and dispersed in a solvent to prepare a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0184] Example 9. Instead of the polyorganosiloxane component of Production Example 1, the polyorganosiloxane component (D) of Production Example 3 was used. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (D) of Production Example 3 were mixed in a weight ratio of 5:0.1:0.15:2.5 (E:F:C:D) and dispersed in a solvent to produce a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0185] Example 10. The polyorganosiloxane of the above chemical formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above chemical formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), the platinum catalyst (PL-50L, Shinetsu Silicone) (C) and the polyorganosiloxane component (D) of the above Preparation Example 3 were mixed in a weight ratio of 5:0.1:0.15:12.5 (E:F:C:D) and dispersed in a solvent to prepare a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0186] Comparative Example 1 The polyorganosiloxane of the above formula E (KS-847H, Shinetsu Silicone) (weight average molecular weight about 350,000 g / mol), the polyorganosiloxane of the above formula F (X-92-122, Shinetsu Silicone) (weight average molecular weight about 10,000 g / mol), and the platinum catalyst (PL-50L, Shinetsu Silicone) (C) were mixed in a weight ratio of 5:0.1:0.15 (E:F:C) and dispersed in a solvent to prepare a release composition. The same solvent as in Example 1 was used as the solvent (S).

[0187] A release film was manufactured using the release composition of the Examples or Comparative Examples. The release film was manufactured by applying the release composition of the Examples or Comparative Examples to one side of a substrate film using a Mayer bar, and then curing the applied release composition at 150° C. for 3 minutes to form a release layer.

[0188] The release layer had a thickness of about 200 nm to 300 nm, and a PET (polyethylene terephthalate) film having a thickness of about 50 μm was used as the base film.

[0189] The test data results measured in the examples and comparative examples are summarized in the following Tables 1 and 2. In the following Tables 1 and 2, the units of the release peel force are all gf / inch.

[0190] [Table 1] [Table 2]

[0191] In Table 1, A1, A7 and A R1 is as defined in Equation 1, and A 60℃,1 , A 60℃,7 and A R2 is as defined in Equation 2, and A R3 is as defined in Equation 3. In Table 2, A H , A L and A R4 is as defined in Equation 4, and the residual adhesion is as defined in Equation 5.

Claims

1. A mold release composition comprising a polyorganosiloxane having a siloxane unit of the following chemical formula 1, a siloxane unit of the following chemical formula 2, and a siloxane unit of the following chemical formula 3: [Chemical formula 1] (R １ ２ SiO ２／２ ) [Chemical formula 2] (R １ R ２ SiO ２／２ ) [Chemical formula 3] (R ３ ２ SiO ２／２ ) In Chemical Formulas 1 to 3, R １ is an alkyl group, R ２ is an alkenyl group, R ３ is an aryl group.

2. 2. The mold release composition according to claim 1, wherein the ratio of the total number of moles of the siloxane units of the chemical formulas 1 to 3 to the total number of moles of all siloxane units of the polyorganosiloxane is 85 mol % or more.

3. 2. The mold release composition of claim 1, wherein the ratio of the number of moles of the siloxane units of Chemical Formula 1 to the number of moles of the siloxane units of Chemical Formula 2 is in the range of 0.5 to 2,000.

4. 2. The mold release composition of claim 1, wherein the ratio of the number of moles of the siloxane units of Chemical Formula 1 to the number of moles of the siloxane units of Chemical Formula 3 is in the range of 0.5 to 2,000.

5. 2. The mold release composition of claim 1, wherein the polyorganosiloxane further comprises one or more siloxane units selected from the group consisting of siloxane units of the following formula 4 and siloxane units of the following formula 5: [Chemical formula 4] (R １ ３ SiO １／２ ) [Chemical formula 5] (R ２ R １ ２ SiO １／２ ) In Formulas 4 and 5, R １ is an alkyl group, R ２ is an alkenyl group.

6. 2. The mold release composition of claim 1, wherein the polyorganosiloxane has an average unit of the following formula 6: [Chemical formula 6] R １ ａ R ２ ｂ R ３ ｃ R ４ ｄ SiO （４－ａ－ｂ－ｃ－ｄ）／２ In the above formula 6, R １ is an alkyl group, R ２ is an alkenyl group, R ３ is an aryl group, R ４ is an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group, a is a number in the range of 0.6 to 2, b is a number in the range of 0.001 to 0.7, c is a number in the range of 0.001 to 1.4, and d is a number in the range of 0 to 0.

5.

7. 2. The mold release composition according to claim 1, wherein the ratio of the total number of moles of trifunctional siloxane units and tetrafunctional siloxane units is 10 mol% or less based on the number of moles of all siloxane units contained in the polyorganosiloxane.

8. 2. The mold release composition of claim 1, wherein the polyorganosiloxane has a weight average molecular weight in the range of 20,000 g / mol to 2,000,000 g / mol.

9. 9. The mold release composition of claim 8, wherein the polyorganosiloxane has a polydispersity index in the range of 1 to 5.

10. 10. The mold release composition of claim 1 further comprising a curable silicone resin component.

11. The release composition according to claim 10, wherein the polyorganosiloxane is contained in an amount of 1 to 500 parts by weight per 100 parts by weight of the curable silicone resin component.

12. The curable silicone resin component is a polyorganosiloxane having an average unit of the following chemical formula 7 and a mold release composition containing the polyorganosiloxane of claim 10 having an average unit of the following chemical formula 8: [Chemical formula 7] P ２ ｃ Q ２ ｄ Yes （４－ｃ－ｄ）／２ In Chemical Formula 7, P ２ is an alkenyl group, and Q ２ is an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group, c is a number in the range of 0.0001 to 0.1, and d is a number in the range of 1 to 4: [Chemical formula 8] H ｅ Q ３ ｆ Yes （４－ｅ－ｆ）／２ In Chemical Formula 8, Q ３ is an alkoxy group, a hydroxy group, or a monovalent hydrocarbon group; e is a number in the range of 0.01 to 0.9; and f is a number in the range of 1 to 4.

13. The mold release composition of claim 12, wherein the polyorganosiloxane of formula 7 comprises one or more siloxane units selected from the group consisting of siloxane units of formula 9 and siloxane units of formula 10: [Chemical formula 9] Viｲ ３ ２ SiO １／２ [Chemical formula 10] Viｲ ３ SiO ２／２ In the above formulas 9 and 10, Vi is an alkenyl group, R ３ is a hydroxy group, an alkoxy group, or a monovalent hydrocarbon group.

14. The mold release composition according to claim 12, wherein the polyorganosiloxane of formula 8 comprises a siloxane unit of formula 11: [Chemical formula 11] HR ４ SiO ２／２ In the above formula 11, R ４ is a hydroxy group, an alkoxy group, or a monovalent hydrocarbon group.

15. The polyorganosiloxane having an average unit of the chemical formula 7 has a weight average molecular weight in the range of 100,000 g / mol to 1,000,000 g / mol, and the polyorganosiloxane having an average unit of the chemical formula 8 has a weight average molecular weight in the range of 1,000 g / mol to 50,000 g / mol. The release composition according to claim 12.

16. A release layer comprising the release composition according to claim 1 or a cured product thereof.

17. The release layer according to claim 16, which satisfies at least one of the following formulas 1 to 5: [Formula 1] 18≧A Ｒ１ =100Х(|A ７ -A １ |) / A １ In the above formula 1, A １ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. ７ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180 degrees and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 168 hours. [Formula 2] 20≧A Ｒ２ =100Х|A ６０℃，７ -A ６０℃，１ | / A ６０℃，１ In the above formula 2, A ６０℃，１ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 24 hours; A ６０℃，７ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 168 hours. [Formula 3] 30≧A Ｒ３ =100Х|A ６０℃，７ -A １ | / A １ In the above formula 3, A １ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. ６０℃，７ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 168 hours. [Formula 4] 150≦A Ｒ４ =100ХA Ｈ / A Ｌ In the above formula 4, A Ｈ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 30 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 30 m / min at 25° C. Ｌ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 60° C. for 24 hours. [Formula 5] 80≦A ｄ =100ХA ｆ / A ｉ In the above formula 5, A ｉ is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. after maintaining the pressure-sensitive adhesive layer attached to the release layer at 25° C. for 24 hours, and A is the release force measured while peeling the pressure-sensitive adhesive layer from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C. ｆ is the above A ｉ After measuring the peel strength, the pressure-sensitive adhesive layer was again maintained attached to the release layer at 25° C. for 24 hours, and then the pressure-sensitive adhesive layer was peeled off from the release layer at a peel angle of 180° and a peel speed of 0.3 m / min at 25° C., and the peel strength was measured.

18. A release film comprising a base film and the release layer according to claim 16 formed on one or both sides of the base film.

19. 17. A pressure-sensitive adhesive film comprising: the release layer according to claim 16; and a pressure-sensitive adhesive layer attached to the release layer.

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