Illumination module and lighting device including same

Abstract

The lighting device disclosed in the embodiment of the present invention includes a heat dissipation plate having a recess, a circuit board housed in the recess of the heat dissipation plate and having a plurality of pads, a light source unit having a plurality of bonding pads, a plurality of connecting members connecting the plurality of pads and the plurality of bonding pads, respectively, and an adhesive member for bonding the light source unit to the heat dissipation plate. The light source unit includes a support member, a plurality of light emitting elements having a plurality of light emitting chips and a wavelength conversion layer, and a resin member. Each of the plurality of connecting members has a ribbon shape, and the width of each of the plurality of connecting members is more than twice the thickness of each of the connecting members, and each of the plurality of connecting members includes both ends connected to the plurality of bonding pads and the plurality of pads, respectively, and a center portion extending in a convex shape between the both ends.

Description

[Technical field]

[0001] An embodiment of the present invention relates to a lighting module and a lighting device including the same. [Background technology]

[0002] Lighting applications include vehicle lighting, displays, and backlights for signs. Light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Such light-emitting diodes are applied to various lighting devices such as various display devices, interior lights, and exterior lights. Recently, lamps using light-emitting diodes as the light source for vehicles have been proposed. Compared to incandescent lamps, light-emitting diodes have the advantage of low power consumption. However, since the emission angle of light emitted from light-emitting diodes is small, when light-emitting diodes are used as vehicle lamps, it is necessary to increase the light-emitting area of ​​the lamp using the light-emitting diode. Since light-emitting diodes are small in size, they can increase the freedom of lamp design, and they are also economical due to their semi-permanent life. Summary of the Invention [Problem to be solved by the invention]

[0003] According to an embodiment of the present invention, there is provided a lighting module having a light source unit for improving heat dissipation efficiency and preventing cracks in a connecting member, and a lighting device having the same. According to an embodiment of the present invention, there is provided a lighting module in which a plurality of light emitting chips or a light source unit emitting light of a plurality of colors are flip-bonded, and a lighting device having the same.

[0004] According to an embodiment of the present invention, there is provided a lighting module in which at least a portion of a light source unit having a light emitting element is coupled to a portion of a circuit board, and a lighting device having the same. According to an embodiment of the present invention, there is provided a lighting module in which a light source unit arranged on a heat dissipation plate and a pad of the circuit board are connected by a connecting member, and the connecting member is located inside one side of the circuit board. [Means for solving the problem]

[0005] The lighting device according to the embodiment includes a heat dissipation plate having an upper surface and a recessed portion concave from the upper surface, a circuit board housed in the recessed portion of the heat dissipation plate and having a plurality of pads, a light source unit arranged on the heat dissipation plate adjacent to the circuit board and having a plurality of bonding pads, a plurality of connecting members respectively connecting the plurality of pads and the plurality of bonding pads, and an adhesive member for adhering the light source unit to the heat dissipation plate, the light source unit including a support member, a plurality of light emitting elements having a plurality of light emitting chips and a wavelength conversion layer on the plurality of light emitting chips on the support member, and the plurality of light emitting elements having a wavelength conversion layer on the plurality of light emitting chips. and a resin member covering a number of light-emitting elements, wherein the bonding pads have a thickness greater than a thickness of the light-emitting chip and are sealed with the resin member so as to be exposed on an upper surface of the resin member, each of the plurality of connecting members has a ribbon shape, a width of each of the plurality of connecting members is more than twice the thickness of the connecting member, and each of the plurality of connecting members includes one end bonded to each of the plurality of bonding pads, the other end connected to each of the plurality of pads, and a center portion extending convexly from the one end toward the other end.

[0006] According to an embodiment of the present invention, a length between the one end and the other end of each of the plurality of connecting members may be equal to or greater than a width of each of the plurality of connecting members. The width of each of the plurality of connecting members may be in a range of 0.4 mm to 0.9 mm, and the length of one side of each of the plurality of bonding pads may be in a range of 1.5 to 4 times the width.

[0007] According to an embodiment of the present invention, the upper surface of the circuit board may be positioned lower than the upper surfaces of the plurality of light-emitting chips, and the high point height of each of the plurality of connecting members may be smaller than the straight-line distance between one end and the other end of each connecting member.

[0008] According to an embodiment of the present invention, the support member may include an upper electrode pattern on which the plurality of light emitting chips are arranged, and a lower electrode pattern electrically connected to a portion of the plurality of electrode patterns and the heat dissipation plate.

[0009] According to an embodiment of the present invention, the adhesive member may include a first adhesive member that adheres a first bonding pad of the light source unit to a heat dissipation plate, and a second adhesive member that adheres a second bonding pad of the light source unit to a pad of the circuit board, and at least one of the first and second adhesive members may be made of an electrically conductive material.

[0010] According to an embodiment of the present invention, there is provided a light guide module coupled to the heat dissipation plate and covering the light source unit, the light guide module being coupled to the heat dissipation plate and including a support part spaced apart from the light source unit and a light guide part protruding from the support part, the light guide part overlaps the light source unit in a vertical direction, the light guide part has a columnar shape, and may have a top surface area larger than a top surface area of ​​the light source unit.

[0011] An illumination device according to one embodiment of the present invention includes a heat dissipation plate, a circuit board arranged on the heat dissipation plate and having a concave recessed portion on one side, a plurality of pads arranged on one side of the circuit board, a light source unit arranged on the heat dissipation plate and having a light emitting element and a plurality of bonding pads, and a plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads, wherein at least a portion of the light source unit can be inserted into the recessed portion.

[0012] According to one embodiment of the present invention, the light source unit has a light-emitting element on one side and first and second bonding pads on the other side, and the pads of the circuit board include first and second pads arranged outside the recessed portion, the first pad faces at least two sides of the first bonding pad, and the second pad faces at least two sides of the second bonding pad.

[0013] According to an embodiment of the present invention, the recessed portion may be concave from one side of the circuit board to the other side, and a depth of the recessed portion may be 30% or more of a length of the light source portion in a first direction.The circuit board may include an adhesive member disposed between the light source portion and the heat dissipation plate, at least a portion of the plurality of connecting members may be disposed on the recessed portion, a portion of the adhesive member may protrude into a gap between the light source portion and the heat dissipation plate, and a portion of each of the plurality of connecting members may protrude into the gap between the light source portion and the heat dissipation plate. Effect of the Invention

[0014] The embodiments of the present invention may prevent a problem of cracks in a ribbon-shaped connecting member connected to a light emitting element in a lighting device. The embodiments of the present invention may improve the luminance and color of a lighting device. The embodiments of the present invention may improve heat dissipation efficiency by flip bonding a light source unit. The embodiments of the present invention may improve the reliability of a lighting module and a lighting device including the same.

[0015] In an embodiment of the present invention, at least a portion of a light source unit having a light emitting element is disposed inside one side of a circuit board, thereby improving electrical reliability between the light source unit and the circuit board. In an embodiment of the present invention, at least a portion of a light source unit having a light emitting element is disposed inside the one side of a circuit board, thereby reducing a connection distance between the light source unit and the circuit board. In an embodiment of the present invention, the reliability of a lighting module and a lighting device including the same can be improved. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a perspective view of a lighting device according to a first embodiment. [Diagram 2] FIG. 2 is a partially enlarged view of the lighting device of FIG. [Diagram 3] FIG. 2 is a side cross-sectional view of the lighting device of FIG. [Figure 4] FIG. 4 is a partially enlarged view of the lighting device of FIG. [Diagram 5] 5A and 5B are diagrams showing an example of a tensile test of the wire of the lighting device of FIG. 3 and occurrence of cracks. [Figure 6] 6(A) and 6(B) are a front view and a rear view showing another example of the light source unit in FIG. [Figure 7] FIG. 11 is a perspective view of an illumination device according to a second embodiment. [Figure 8] 8 is another example of the lighting device of FIG. 7. [Figure 9] 9(A) and 9(B) are a front view and a rear view showing the light-emitting chip of the light source unit of FIG. [Figure 10] 10(A) and 10(B) are a front view and a rear view showing the light-emitting chip of the light source unit of FIG. [Figure 11] 1 is an example of a lighting device in which a light guide module is combined onto a lighting module disclosed in an embodiment of the present invention. [Figure 12] FIG. 12 is a side view of the lighting device of FIG. [Figure 13] FIG. 12 is a plan view of the lighting device of FIG. [Figure 14] FIG. 12 is a rear view of the lighting device of FIG. [Figure 15] FIG. 12 is a partial cross-sectional side view of the lighting device of FIG. [Figure 16] 12 is a diagram illustrating an example of an optical path of the illumination device of FIG. 11. FIG. [Figure 17] 14 is a cross-sectional view of the lighting device of FIG. 13 taken along line AA. [Figure 18] 14 is a BB side cross-sectional view of the lighting device of FIG. 13. [Figure 19] 1. FIG. 4 is a partially enlarged view showing another example of the lighting device of FIG. [Figure 20]FIG. 20 is a partial plan view of the lighting device of FIG. 19. [Figure 21] FIG. 20 is a side cross-sectional view of the lighting device of FIG. 19. [Figure 22] 21 is another example of the lighting device of FIG. 20. [Diagram 23] 22 is another example of the lighting device of FIG. 21. [Figure 24] 22 is another example of the lighting device of FIG. 21. [Diagram 25] 10 is a modified example of the lighting device according to the embodiment of the present invention. [Figure 26] 10 is a modified example of the lighting device according to the embodiment of the present invention. [Figure 27] 10 is a modified example of the lighting device according to the embodiment of the present invention. [Figure 28] FIG. 28 is a diagram of the lighting device of FIG. 27 before the connecting frames are joined together. [Figure 29] 20 is a modification of the lighting device of FIG. 19. [Diagram 30] 20 is another example of the lighting device of FIG. 19. [Diagram 31] 1 is a perspective view of a headlamp to which an illumination device according to an embodiment of the present invention is applied; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The technical concept of the present invention is not limited to some of the embodiments described, and may be realized in various different forms. One or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as meanings that may be generally understood by a person having ordinary skill in the art to which the present invention belongs, unless otherwise clearly defined and described, and commonly used terms such as terms defined in dictionaries may be interpreted in consideration of the contextual meaning of the related art. Furthermore, terms used in the embodiments of the present invention are intended to describe the embodiments, and are not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "A and (and) at least one (or more) of B and C," it may include one or more of all combinations that can be combined with A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of the embodiments of the present invention. Such terms are merely used to distinguish the component from other components, and do not determine the nature, order, or procedure of the components. When a component is described as being "linked," "coupled," or "connected" to another component, it can include not only the case where the component is directly linked, coupled, or connected to the other component, but also the case where the component is "linked," "coupled," or "connected" by another component between the other component. When a component is described as being formed or disposed "above or below" each component, "above" or "below" includes not only the case where the two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. When a term is used "above or below," it can include not only the upper direction based on one component, but also the lower direction.

[0018] The lighting device 1000 disclosed in the embodiment can be applied to various lamp devices requiring illumination, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to headlamps, side mirror lights, side marker lights, fog lamps, tail lamps, stop lamps, daytime running lights, vehicle interior lighting, door scarves, rear combination lamps, backup lamps, etc. The lighting device can also be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields.

[0019] <First Example>

[0020] FIG. 1 is a perspective view of a lighting device according to a first embodiment, FIG. 2 is a partially enlarged view of the lighting device of FIG. 1, FIG. 3 is a side cross-sectional view of the lighting device of FIG. 1, FIG. 4 is a partially enlarged view of the lighting device of FIG. 3, FIGS. 5(A) and (B) are diagrams showing an example of a tensile test of the wire of the lighting device of FIG. 3 and crack occurrence, and FIGS. 6(A) and (B) are front and rear views showing another example of the light source unit of FIG. 2.

[0021] 1 to 6, the lighting device 1000 may include a heat dissipation plate 101, a circuit board 110 disposed on a first region of the heat dissipation plate 101, a light source unit 130 disposed on a second region of the heat dissipation plate 101, and ribbon-shaped connecting members 141 and 142 connecting the light source unit 130 and the circuit board 110. The light source unit 130 may be a lighting module that emits light of a single color or multiple colors. The light source unit 130 may be a lighting module having a single LED chip or multiple LED chips and a wavelength conversion layer.

[0022] The heat dissipation plate 101 may be disposed under the circuit board 110. The heat dissipation plate 101 may be disposed under the circuit board 110 and the light source unit 130. The heat dissipation plate 101 may support the circuit board 110 and conduct heat generated in the circuit board 110. The heat dissipation plate 101 may be formed of a metal or may be formed of a laminated structure of a thermally conductive material and a metal layer. The heat dissipation plate 101 may be formed of a single layer or multiple layers. The thermally conductive material may include a ceramic material, AlN, and an aluminum material having an anodized surface layer. The metal may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, and Au.

[0023] The heat dissipation plate 101 includes a heat dissipation portion 102 and a side portion 103, and the heat dissipation portion 102 may include a board heat dissipation portion 102A having a recess portion 108 into which the circuit board 110 is inserted. The heat dissipation portion 102 may have an area larger than an area of ​​the circuit board 110, for example, an area two or ten times larger than an area of ​​the circuit board 110. The heat dissipation plate 101 may include coupling holes 105 and 106. The coupling holes 105 and 106 may be disposed on both sides of the light source unit 130. The coupling holes 105 and 106 may be coupled to a light guide module 500 (FIG. 11) described later.

[0024] The circuit board 110 is inserted into the concave recess 108 from the heat dissipation portion 102 and faces the board heat dissipation portion 102A. The lower surface of the circuit board 110 may be bonded to the board heat dissipation portion 102A with the adhesive film 155. The lower surface of the circuit board 110 may be disposed lower than the upper surface of the heat dissipation plate 101. The adhesive film 155 may include a thermally conductive adhesive. The adhesive film 155 may be bonded to the lower surface and side surfaces of the circuit board 110.

[0025] Since the circuit board 110 is inserted into the recess 108, the upper surface of the circuit board 110 may be adjacent to a horizontal line extending from the upper surface of the heat dissipation unit 102. Here, when the circuit board 110 is disposed on the upper surface of the heat dissipation unit 102, the high point position of the connection members 141 and 142 becomes higher, and in this case, the distance between the light source unit 130 and the light guide module 500 (see FIG. 11) further increases, so that the efficiency of light extracted to the light guide module 500 through the light source unit 130 may decrease. Therefore, the upper surface of the printed circuit board 110 may be disposed lower than the upper or lower surface of the light source unit 130.

[0026] The side portion 103 of the heat dissipation plate 101 may be bent vertically from each side of the heat dissipation part 102, and one or more side portions may be disposed along the outer side of the heat dissipation part 102. An empty space 109 may be provided on the inner side of the side portion 103 and the lower part of the heat dissipation part 102, or a plurality of heat dissipation fins may be disposed. The recess portion 108 is formed at a predetermined depth on the upper surface of the heat dissipation part 102 of the heat dissipation plate 101, and the depth may be the same as the sum of the thickness of the circuit board 110 and the thickness of the adhesive film 155, or may be 120% or less of the thickness of the circuit board 110. For example, the upper surface of the circuit board 110 may be disposed on the same plane as the upper surface of the heat dissipation plate 101, or may be higher than the upper surface of the heat dissipation plate 101, for example, 120% or less of the thickness of the circuit board 110. The top view shape of the recess portion 108 may be the same as the top view shape of the circuit board 110, and may include, for example, a polygonal shape.

[0027] The circuit board 110 may be made of a resin material or may include a metal material. The circuit board 110 may be formed of any one of a ceramic PCB, a metal core PCB (MCPCB), a flexible PCB (FPCB), and a resin PCB. The circuit board 110 may include a metal layer at a lower portion, a circuit layer having a pad at an upper portion, a protective layer made of an insulating material for protecting the circuit layer at an upper portion, and an insulating layer between the metal layer and the circuit layer. The circuit board 110 may be provided as an MCPCB having a metal layer at a lower portion, and may transfer heat to the heat dissipation plate 101.

[0028] Here, the circuit board 110 may be fastened to the heat dissipation part 102 by a fastening means 119, and the fastening means 119 may include a screw for fastening the circuit board 110 to the board heat dissipation part 102A, and may be one or more. When the circuit board 110 is closely fixed by the fastening means 119, the adhesive film 155 may be removed, and thus the circuit board 110 may be easily separated. The pads 111 and 112 of the circuit board 110 may include first and second pads 111 and 112 spaced apart from each other. The first and second pads 111 and 112 may be connected to a connector 115 disposed on the upper part of the circuit board 110 through a circuit layer of the circuit board 110. The connector 115 may receive a driving signal and power from the outside. The pads 111, 112 and connector 115 may be disposed on opposite ends of the circuit board 110, and the fastening means 119 may be disposed in an area between the pads 111, 112 and the connector 115. The first and second pads 111, 112 are disposed adjacent to one side of the circuit board 110, and may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au, and optional alloys thereof.

[0029] The light source unit 130 may be disposed on the heat dissipation unit 102. The light source unit 130 may be disposed adjacent to the recessed portion 108 of the heat dissipation unit 102 and the pads 111 and 112. The light source unit 130 may be disposed adjacent to one side of the circuit board 110. One side of the circuit board 110 may be disposed between the first and second pads 111 and 112 and the light source unit 130. The light source unit 130 may include a support member 133 and light emitting elements 131A and 131B on the support member 133. The light emitting elements 131A and 131B may be sealed by a resin member 132. A plurality of the light emitting elements 131A and 131B may be aligned in one direction. The light emitting elements 131A and 131B may emit the same color or different colors. The light emitting elements 131A and 131B may emit white light, or white and yellow or blue light. The light emitting elements 131A and 131B may have the same size or different sizes.

[0030] As shown in FIG. 6, the light emitting element 131A, 131B may include a plurality of light emitting chips 30, 32 that emit a first light, and wavelength conversion layers 31, 33 that convert a part of the first light into a second light and a third light, respectively. The first light may be blue, the second light may be yellow, and the third light may be amber. Alternatively, the third light may be green or red. The wavelength conversion layers 31, 33 may have different phosphors and may include a yellow phosphor and an amber phosphor. The first light emitting element 131A includes a first light emitting chip 30 and a first wavelength conversion layer 31, and may emit white light. As another example, each of the wavelength conversion layers 31, 33 may include at least one or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor.

[0031] The first light emitting element 131A may include a first light emitting chip 30 and a first wavelength conversion layer 31. The first light emitting element 131A may emit white light. The second light emitting element 131B may include a second light emitting chip 32 and a second wavelength conversion layer 33. The second light emitting element 131B may emit amber light. The light source unit 130 may selectively emit one or both of the white and amber light. The lower surface area of ​​the first wavelength conversion layer 31 may be larger than the upper surface area of ​​the first light emitting chip 30, and may be arranged in a range of 101% or more, for example, 101% to 130%, of the upper surface area of ​​the first light emitting chip 30. The lower surface area of ​​the second wavelength conversion layer 33 may be larger than the upper surface area of ​​the second light emitting chip 32, and may be arranged in a range of 101% or more, for example, 101% to 130%, of the upper surface area of ​​the second light emitting chip 32. Therefore, the wavelength conversion layers 31 and 33 cover the entire upper surfaces of the light emitting chips 30 and 32, thereby improving the wavelength conversion efficiency.

[0032] The first and second light emitting chips 30 and 32 may be connected in parallel to each other. The light emitting chips 30 and 32 may include at least one of blue, green, and red LED chips, for example, blue LED chips. The light emitting chips 30 and 32 may include a plurality of semiconductor layers made of compound semiconductors of group II and group VI elements and / or compound semiconductors of group III and group V elements, and at least one or all of the semiconductor layers may include compound semiconductors of the same series as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllGaP, InP, and InGaAs.

[0033] Here, the light source unit 130 may include a support member 133 and a resin member 132. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may support the light emitting chips 30 and 32 and may include electrode patterns 161, 162, 163, and 164 made of an electrically conductive material and electrically connected to the light emitting chips 30 and 32. The electrode patterns 161, 162, 163, and 164 may include first to third electrode patterns 161, 162, and 163 disposed on an upper surface of the support member 133 and a fourth electrode pattern 164 serving as a bottom pad disposed on a lower surface of the support member 133.

[0034] The first and third electrode patterns 161 and 163 may be electrically connected to the first light emitting chip 30, and the second and third electrode patterns 162 and 163 may be electrically connected to the second light emitting chip 32. The first light emitting chip 30 may be mounted on the first and third electrode patterns 161 and 163 in a flip chip type, and the second light emitting chip 32 may be mounted on the second and third electrode patterns 162 and 163 in a flip chip type. The third electrode pattern 163 may be disposed between the other side regions of the first and second electrode patterns 161 and 162.

[0035] The first and second electrode patterns 161 and 162 may function as anode terminals of the first and second light emitting chips 30 and 32, respectively. A first bonding pad 134 is disposed on one side region of the first electrode pattern 161, and a second bonding pad 135 is disposed on one side region of the second electrode pattern 162. The first and second bonding pads 134 and 135 may be electrically connected to the circuit board 110 via connecting members 141 and 142.

[0036] The third electrode pattern 163 may function as a cathode terminal that is a common electrode. The fourth electrode pattern 164 on the lower surface of the support member 133 may be connected to the third electrode pattern 163 through a conductive via 29. The fourth electrode pattern 164 may be attached to an adhesive member 138 and electrically connected to the heat dissipation plate 101. The adhesive member 138 may be an electrically conductive adhesive. The area of ​​the fourth electrode pattern 164 may be 80% or more of the area of ​​the lower surface of the support member 133, thereby improving electrical connection and heat dissipation efficiency. A protective element 38 for protecting the first light emitting chip 30 may be disposed on the other side of the first and third electrode patterns 161 and 163, and a protective element 39 for protecting the second light emitting chip 32 may be disposed on the other side of the second and third electrode patterns 162 and 163. The protection elements 38 and 39 may be implemented as a thyristor, a Zener diode, or a TVS (Transient voltage suppression) element, and protect the light emitting chips 30 and 32 from ESD (electro static discharge).

[0037] The first and second bonding pads 134, 135 may be exposed on an upper surface of the light source unit 130. A resin member 132 may be disposed around the upper periphery of the light source unit 130. The resin member 132 encases surfaces of the first to third electrode patterns 161, 162, 163 disposed on the upper surface of the support member 133, side surfaces of the first and second light emitting chips 30, 32, and side surfaces of the wavelength conversion layers 31, 33. The resin member 132 may be further disposed between the first and second light emitting chips 30, 32 and between the wavelength conversion layers 31, 33 to block interference between lights and reduce light loss.

[0038] The resin member 132 may be a reflective material. The resin member 132 may be formed of a material having silicone or epoxy in a single layer or multiple layers. The resin member 132 has a reflective property, and may include a reflective material (SiO2, TiO2) in the resin material. The resin member 132 or the light source unit 130 may further include a convex lens (not shown) on an upper portion.

[0039] The support member 133 may thermally conduct heat generated from the light emitting chips 30 and 32 through the heat dissipation plate 101. The support member 133 may be attached to the heat dissipation plate 101 using the adhesive member 138. The adhesive member 138 may include a thermally conductive adhesive having metal powder or inorganic powder in a resin material, for example, a thermal interface material (TIM). The adhesive member 138 may be disposed along the lower surface and lower portions of the side surfaces of the support member 133. The adhesive member 138 may be disposed outside the side surfaces of the support member 133 and may contact each side surface of the support member 133.

[0040] As shown in FIGS. 2 and 4, the first and second light emitting elements 131A and 131B may be disposed on the upper portion of the other side of the support member 133, and bonding pads 134 and 135 may be exposed on the upper portion of one side of the support member 133. The bonding pads 134 and 135 may be sealed by the resin member 132 so as to be exposed on the upper surface of the resin member 132. The bonding pads 134 and 135 may be disposed closer to the first and second pads 111 and 112 than the first and second light emitting elements 131A and 131B. The bonding pads 134 and 135 may be connected to the anode ends of the first and second light emitting elements 131A and 131B. The first and second bonding pads 134 and 135 may function as anode terminals. The first bond pad 134 and the second bond pad 135 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and select alloys thereof.

[0041] 4, the thickness of the bonding pads 134, 135 may be thicker than the thickness of the light emitting chips 30, 32. The upper surfaces of the bonding pads 134, 135 may be disposed on the same plane as the upper surface of the light source unit 130, or may be disposed higher than the upper surfaces of the light emitting chips 30, 32. The area of ​​the upper surfaces of the bonding pads 134, 135 is 30% or more, for example, in a range of 30% to 80%, of the area of ​​the upper surfaces of the wavelength conversion layers 31, 33, so that the bonding area of ​​the ribbon-shaped connecting members 141, 142 is increased and a decrease in bonding strength due to bonding can be prevented.

[0042] The first bonding pad 134 may be connected to the first pad 111 by a first connecting member 141, and the second bonding pad 135 may be connected to the second pad 112 by a second connecting member 142. The first connecting member 141 and the second connecting member 142 may be ribbon-shaped conductive wires, and the wires may include at least one of Au, Al, and Ag. The ribbon shape may have a width larger than the thickness of each of the connecting members 141 and 142 and a long length. The width of each of the connecting members 141 and 142 includes an upper surface width and a lower surface width, and each of the upper surface width and the lower surface width of each of the connecting members 141 and 142 may be larger than the thickness of each of the connecting members 141 and 142, and may be preferably more than twice the thickness of each of the connecting members 141 and 142, for example, more than twice.

[0043] The width W1 of each of the first connecting member 141 and the second connecting member 142 is a length in a direction perpendicular to the length direction of each of the connecting members 141 and 142, and may be greater than the thickness of each of the connecting members 141 and 142. The width W1 of each of the first connecting member 141 and the second connecting member 142 may be 0.4 mm or more, for example, in a range of 0.4 mm to 0.9 mm. The thickness of each of the first connecting member 141 and the second connecting member 142 may be 0.15 mm or less, for example, in a range of 0.07 mm to 0.15 mm. The width W1 of each of the first connecting member 141 and the second connecting member 142 may be more than twice the thickness. If the width W1 of each of the first and second connecting members 141 and 142 is smaller than the above range, wires such as the connecting members 141 and 142 may hang down, resulting in a decrease in bonding force, a decrease in allowable current, and a decrease in resistance to external forces. In addition, if the width W1 of the connecting members 141, 142 is larger than the above range, there is a problem that the size of the bonding pads 134, 135 or the pads 111, 112 increases or material is wasted. The length between one end 41 and the other end 43 of the connecting members 141, 142 may be equal to or greater than the width W1.

[0044] The light source unit 130 may be spaced apart from one side of the circuit board 110 by a predetermined distance. The distance between the light source unit 130 and one side of the circuit board 110 may improve the heat dissipation efficiency of the heat sink 102 located under the light source unit 130, but may cause the length of the connecting members 141 and 142 to increase. The distance between the light source unit 130 and the circuit board 110 may be 0.5 times or more, for example, in a range of 0.5 to 2 times, the length of one side of the light source unit 130. The length of one side of the light source unit 130 may be 2 mm or more, or in a range of 3 mm to 4 mm. Thus, the connecting members 141 and 142 are provided in a ribbon shape to prevent sagging of wires and improve the heat dissipation efficiency of the light source unit 130.

[0045] The length of one side of the first and second bonding pads 134, 135 may be 0.7 mm or more, for example, in the range of 0.7 mm to 1 mm. The width and length of the first and second pads 111, 112 may be arranged in the range of 80% to 200% of the length of the first and second bonding pads 134, 135, respectively. Since the length of one direction of the first and second bonding pads 134, 135 and the first and second pads 111, 112 is provided to be 1.5 times or more, for example, in the range of 1.5 times to 4 times, the width W1 of the connecting members 141, 142, bonding defects of the connecting members 141, 142 can be prevented.

[0046] The first connecting member 141 and the second connecting member 142 have one ends 41 bonded to the first bonding pad 134 and the second bonding pad 135, respectively, and the other ends 43 bonded to the first pad 111 and the second pad 112, respectively. The first connecting member 141 and the second connecting member 142 include a center portion 42 extending from one end 41 to the other end 43, and the center portion 42 may extend from the other side of the light source unit 130 to one side of the circuit board 110. The center portion 42 may extend onto the recess portion 108 between the circuit board 110 and the heat dissipation unit 102. The center portion 42 may be an intermediate wire located between one end 41 and the other end 43 of each connecting member 141, 142. The center portion 42 may have a convex shape between the one end 41 and the other end 43. The width of the center portion 42 may be equal to or smaller than the width of the one end 41 and the other end 43 to be bonded.

[0047] The height of one end 41 of the first connecting member 141 and the second connecting member 142 can be arranged higher than the height of the other end 43, and the height of the high point of the center portion 42 can be arranged higher than that of the one end 41. After one end 41 or the other end 43 of the connecting members 141 and 142 is bonded, the bonding force or the open defect is measured, and when a wire pull off test is performed, at this time, there is a problem that an open defect such as a heel crack occurs not at the center portion 42 but at one end 41 or the other end 43 instead of an open at the center portion 42.

[0048] In order to prevent such connecting members 141 and 142 from having an open defect, the minimum linear distance D1 between one end 41 and the other end 43 and a vertical line, the vertical height H1 from the other end 43 to the center portion 42, and the first extension angle R1 of the center portion 42 extending from one end 41 and the second extension angle R2 of the center portion 43 extending to the other end 43 can satisfy the following relationship.

[0049] H1 < D1 (Equation 1)

[0050] R2 ≤ R1 (Equation 2)

[0051] D1 is 1.1 times or more than H1, for example, in the range of 1.1 to 2 times, and in the range of 3 mm to 10 mm, and H1 may be 5 mm or less, for example, in the range of 0.4 mm to 5 mm. The extension angles R1 and R2 may be the same or have a difference of 15 degrees or less. Here, when H1 increases, the angles R1 and R2 increase proportionally and the wire pulling force may also increase, but if it exceeds the range, heel cracks or bound cracks may occur as shown in FIG. 5(B). Thus, the first and second extension angles R1 and R2 may be 45 degrees or less, for example, in the range of 15 degrees to 45 degrees or 20 degrees to 30 degrees. Here, the first extension angle R1 is the angle between a straight line horizontal to one end 41 and a tangent K1 passing through one side region of the center portion 42 adjacent to the one end 41, and the second extension angle R2 is the angle between a straight line horizontal to the other end 43 and a straight line K2 passing through a high point of the center portion 42. By setting the angles R1 and R2 extending from the center portion 42 to the one end 41 and the other end 43 within the above ranges, open defects due to cracks, i.e., heel cracks or bound cracks, at the bonding portions of the connecting members 141 and 142 can be prevented.

[0052] <Second Example>

[0053] Fig. 7 is a perspective view of an illumination device according to a second embodiment, Fig. 8 is another example of the illumination device of Fig. 7, Fig. 9 (A) and (B) are a front view and a rear view showing a light-emitting chip of the light source unit of Fig. 7, and Fig. 10 (A) and (B) are a front view and a rear view showing a light-emitting chip of the light source unit of Fig. 7. The second embodiment can be applied to the illumination device of the first embodiment, a modification of the first embodiment, or other examples of Figs. 19 to 20 described later. In the description of the second embodiment, the description of the first embodiment is referred to for the same configuration as the first embodiment.

[0054] 7 to 10, the lighting device may include a light source unit 130A disposed on a heat dissipation plate 101 and a circuit board 110. The light source unit 130A may be flip-type connected to the heat dissipation plate 101 and the circuit board 110. The light source unit 130A may emit white light or at least two colors, for example, white and amber light.

[0055] The light source unit 130A may include the first light emitting element 131A. As shown in FIG. 9, the first light emitting element 131A may include a plurality of light emitting chips 35 and a wavelength conversion layer 36 covering the plurality of light emitting chips 35. The first light emitting element 131A may emit white light. The plurality of light emitting chips 35 may be arranged in one direction, and the wavelength conversion layer 36 may extend long in one direction. The plurality of light emitting chips 35 may include first and second electrode patterns 165, 166 and sub-third electrode patterns 167, 168. The plurality of light emitting chips 35 may be connected in series between the first electrode pattern 165, the third electrode patterns 167, 168, and the second electrode pattern 166. The protective element 38A may be connected between the first and second electrode patterns 165, 166 to protect the light emitting chip 35.

[0056] The first electrode pattern 165 may be connected to a fourth electrode pattern 164A, which is an anode terminal, through a via 29A, and the fourth electrode pattern 164A may be connected to pads 113, 113A, and 113B of the circuit board 110 by adhering them to a conductive second adhesive member 139. Here, the pads may be arranged on the circuit board 110 as a single pad 113 or multiple pads 113A and 113B. The second electrode pattern 166 may be connected to a fifth electrode pattern 164B, which is a cathode terminal, through a via 29B, and the fifth electrode pattern 164B may be electrically connected to the heat dissipation plate 101 through a conductive first adhesive member 138. The fifth electrode pattern 164B may be twice or more larger than the area of ​​the fourth electrode pattern 164A, and thus the heat dissipation efficiency through the heat dissipation plate 101 may be improved. The number of vias 29A connected to the first electrode pattern 165 may be more than twice the number of vias 29B connected to the second electrode pattern 166. The fourth and fifth electrode patterns 164A and 164B may be lower first and second bonding pads. Here, the first light emitting element 131A may be disposed in an area that does not overlap the circuit board 110 in the vertical direction for heat dissipation, for example, may be disposed to overlap the heat dissipation plate 101 in the vertical direction.

[0057] 10, the first light emitting device 131A may be arranged in at least two rows by connecting four or five light emitting chips 35 in series. A wavelength conversion layer 36 is disposed on the light emitting chips 35 to convert the wavelength, so that the light source unit can emit white light.

[0058] The light source units 130 and 130A according to the first and second embodiments of the present invention may be connected to the circuit board 110 on the heat dissipation plate 101 by connecting members 141 and 142, or may be mounted in a flip type. The light source units 130 and 130A may be extracted through a light guide module 500 made of a transparent material as shown in FIG.

[0059] 11 to 18, the light guide module 500 includes a support 510 and a light guide 520. The support 510 may be made of a transparent plastic material, and the light guide 520 may protrude from the support 510 and be made of a transparent plastic material. The transparent plastic material may include PC and PMMA. The support 510 and the light guide 520 may be made of the same material. The support 510 and the light guide 520 may be integrally formed of a transparent material. The support 510 may be coupled to the heat dissipation plate 101 so as to align the positions between the light source units 130 and 130A and the light guide unit 520. The support 510 may cover the upper periphery of the light source units 130 and 130A so as to effectively receive the light emitted from the light source units 130 and 130A.

[0060] As shown in FIG. 11, FIG. 15, and FIG. 16, the lower surface or the upper surface of the support part 510 may be arranged parallel to the upper surface of the heat dissipation plate 101. The support part 510 may be spaced apart from the upper surface of the heat dissipation plate 101 by a predetermined distance G1. The distance G1 may be higher than the high point height of the connecting members 141, 142 of the light source part 130 of FIG. 1, and may be, for example, 2.5 mm or more, for example, in the range of 2.5 mm to 7 mm. If the distance G1 is smaller than the range, it may affect the connecting members 141, 142, and if it is larger than the range, the luminous intensity may be reduced. When the light source part 130A of FIG. 7 is arranged, the distance G1 may be smaller, for example, in the range of 1.5 mm to 5 mm.

[0061] The light guide unit 520 is provided in a columnar shape, and may include, for example, a cylindrical or polygonal columnar shape. The light guide unit 520 may have a shape with a narrow lower area and a wide upper area according to the directional distribution of the light source units 130 and 130A. The directional angle of the light source units 130 and 130A may be 70 degrees or more, for example, in the range of 70 degrees to 150 degrees. The light guide unit 520 may overlap the light source units 130 and 130A in a vertical direction. The light guide unit 520 emits the point light of the light source units 130 and 130A as surface light. The light guide unit 520 may have an upper surface area larger than that of the light source units 130 and 130A. The diameter of the light guide unit 520 may be larger than the length of one side of the light source unit 130, 130A, for example, 1.5 times or more the length of one side of the light source unit 130, 130A, and may be preferably 5 mm or more, for example, in the range of 5 mm to 10 mm. If the diameter of the light guide unit 520 is smaller than the above range, the amount of incident light may be reduced, and if the diameter is larger than the above range, the luminous intensity or luminous intensity distribution may be reduced. The support unit 510 includes a first support protrusion 531 and a second support protrusion 535 at a lower portion, and the first support protrusion 531 may be disposed on both sides of the outer lower portion of the support unit 510, and the second support protrusion 535 may be disposed on both sides of the inner lower portion. Here, the inner side may be a direction of the circuit board 110 disposed at the center of the heat dissipation plate 101. The support unit 510 may be coupled to the heat dissipation plate 101. The first and second coupling holes 105 and 106 of the heat dissipation plate 101 may be disposed on both outer sides of the light source unit 130 and may face the first and second supporting protrusions 531 and 535, respectively.

[0062] As shown in Figs. 13, 14 and 17, the first support protrusion 531 is seated on the upper surface of the heat dissipation plate 101. At this time, the insertion protrusion 531A of the first support protrusion 531 has a diameter smaller than that of the first support protrusion 531 at the lower part, and can be inserted through the first coupling hole 105. As shown in Figs. 13, 14 and 18, the second support protrusion 535 has a diameter larger than that of the second coupling hole 106, and can be seated on the heat dissipation plate 101 facing the second coupling hole 106. The second support protrusion 535 has a fastening hole 535B therein, and can fasten the heat dissipation plate 101 and the support part 510 through a fastening member 590. A step part 535A for fixing an end of the fastening member 590 may be disposed on the upper surface of the support part 510, or a washer or a nut may be attached thereto.

[0063] Fig. 19 to Fig. 30 are diagrams showing another example of the first embodiment. Fig. 19 is a partially enlarged view of the lighting device of another example of Fig. 2 of the present invention, Fig. 20 is a partial plan view of the lighting device of Fig. 19, and Fig. 21 is a side sectional view of the lighting device of Fig. 19. In the description of the other examples, the same configuration as in the first embodiment can be applied to the second embodiment by referring to the description of the first embodiment.

[0064] 19 to 22, the lighting device 1000 may include a heat dissipation plate 101, a circuit board 110 arranged on the heat dissipation plate 101, a light source unit 130 arranged on the heat dissipation plate 101 and having a light emitting element 131, connecting members 145, 146 connecting the light source unit 130 and the circuit board 110, and an adhesive member 138 adhering the light source unit 130 to the heat dissipation plate 101.

[0065] The heat dissipation plate 101 and the circuit board 110 refer to the description of the first embodiment. The heat dissipation plate 101 includes the heat dissipation part 102 and a side part 103, and the heat dissipation part 102 may be provided with an area larger than that of the circuit board 110, for example, an area larger than two or ten times. The side part 103 may be bent backward from an edge of the heat dissipation part 102, and one or more side parts may be arranged along the outer side of the heat dissipation part 102. An empty space 109 may be provided on the inner side of the side part 103 and the lower part of the heat dissipation part 102, or other structures such as heat dissipation fins may be coupled thereto. The heat dissipation plate 101 may include a recess (not shown) in which the circuit board 110 is seated, and the height of the upper surface of the circuit board 110 may be lowered depending on the depth of the recess. Coupling holes 105 and 106 may be arranged on both sides of the heat dissipation part 102, respectively, to be coupled to an external structure having a light guide part. The coupling holes 105 and 106 may be disposed on both sides of the light source unit 130 .

[0066] The circuit board 110 may be disposed on the heat dissipation plate 101 and may be attached to the heat dissipation plate 101 by an adhesive member 138. The adhesive member 138 may include a thermally conductive adhesive member and may be an electrically insulating material such as silicone or epoxy. The upper surface of the circuit board 110 may be disposed on the same plane as the upper surface of the heat dissipation plate 101 or may be disposed lower than the upper surface of the heat dissipation plate 101. The adhesive member 138 may attach the circuit board 110 to the heat dissipation part 102.

[0067] The adhesive member 138 may be disposed on the lower surface of the light source unit 130, protrude outward from the side surface of the light source unit 130, and be attached to the lower portion of the side surface of the light source unit 130. The adhesive member 138 may contact the inner surface of the circuit board 110. The inner surface of the circuit board 110 may include a surface facing at least three side surfaces of the light source unit 130. Here, the circuit board 110 may be fastened to the heat dissipation unit 102 by a fastening means 119, and the fastening means 119 may include one or more screws for fastening and closely attaching the circuit board 110 to the heat dissipation unit 102. As another example, the fastening means 119 may include a fastening structure or / and a coupling structure. The adhesive film 155 may closely attach the circuit board 110 to the heat dissipation unit 102, and may be a thermally conductive tape. When the circuit board 110 is fixed by the fastening means 119, the adhesive film 155 may be removed, thereby making it easier to separate the circuit board 110.

[0068] The pads 111 and 112 of the circuit board 110 may include first and second pads 111 and 112 spaced apart from each other. The first and second pads 111 and 112 may be connected to a connector 115 disposed on the upper part of the circuit board 110 through a circuit layer of the circuit board 110. The circuit board 110 includes a protective layer 110B on a metal layer 110A, and the protective layer 110B may protect the pads 111 and 112 and the surface of the circuit layer, and may open the bonding regions of the pads 111 and 112. The protective layer 110B may be an insulating material, for example, a solder resist material, that partially exposes the pads 111 and 112.

[0069] As shown in FIG. 20, the first pad 111 may include first and second regions B1 and B2 corresponding to two different sides of the first bonding pad 134. The first and second regions B1 and B2 may be disposed outside two different sides of the recessed portion 108 or outside two different sides of the other side of the light source unit 130. The first and second regions B1 and B2 may have shapes bent in a direction perpendicular to each other. For example, the first pad 111 may be disposed on the other side and a first outer side of the first bonding pad 134, and the second pad 112 may be disposed on the other side and a second outer side of the second bonding pad 135. The other side of the first and second bonding pads 134 and 135 is a region extending in a first direction with the first and second pads 111 and 112, and the first and second outer sides may be both sides of the light source unit 130 and the recessed portion 108 in a second direction. The second pad 112 may include third and fourth regions B3 and B4 corresponding to two different sides of the second bonding pad 135. The third and fourth regions B3 and B4 may be disposed outside two different sides of the recessed portion 108 or outside two different sides of the other side of the light source unit 130. The third and fourth regions B3 and B4 may have shapes bent in directions perpendicular to each other.

[0070] The circuit board 110 may include the recessed portion 108 that is recessed from one side of the circuit board 110. The bottom area of ​​the recessed portion 108 may be equal to or smaller than the bottom area of ​​the light source unit 130, for example, equal to or smaller than 50% of the bottom area of ​​the light source unit 130, for example, in the range of 10% to 50% or 10% to 40% of the bottom area of ​​the light source unit 130. When the bottom area of ​​the recessed portion 108 is within the above range, the adhesion efficiency between the light source unit 130 and the circuit board 110 may be improved, and the size or area of ​​the members 145 and 146 connecting the light source unit 130 and the circuit board 110 may be optimized. When the area of ​​the recessed portion 108 is larger than the above range, there is a problem that the area or size of the members 145 and 146 connecting the circuit board 110 and the light source unit 130 increases. If the area of ​​the recess portion 108 is smaller than the above range, it may be difficult to insert the light source unit 130 or the size or area of ​​the member connecting the light source unit 130 and the circuit board 110 may be reduced, thereby reducing electrical reliability.

[0071] The recessed portion 108 may be concave from one side surface of the circuit board 110 to the other side surface, and may have a polygonal shape in top view. The depth D2 of the recessed portion 108 may be 30% or more of the length D0 of the light source unit 130 in the first direction, and may be in the range of 30% to 50% of the length D0. The depth D2 of the recessed portion 108 may be a depth at which at least a part or the whole of the first and second bonding pads 134 and 135 are located within the region of the recessed portion 108.

[0072] 29, the depth D3 of the recess 108 may be deep enough to insert the entire light source unit 130. After at least a portion of the light source unit 130 is inserted into the recess 108, the light source unit 130 is bonded with an adhesive member 138, so that at least an inner corner portion of the light source unit 130 and an inner surface of the circuit board 110 may be bonded with the adhesive member 138. As a result, the adhesive force to the light source unit 130 may be increased, and may have an adhesive force of, for example, 5 kgf or more.

[0073] The light source unit 130 may be disposed on the heat dissipation unit 102. At least a portion of the light source unit 130 may be disposed in the recessed portion 108 on the heat dissipation unit 102. The light source unit 130 may be disposed on the inner side of one side of the circuit board 110. The one side of the circuit board 110 may be disposed on the outer side of the first and second pads 111 and 112 and on the outer side of the other side of the light source unit 130.

[0074] 21, the light source unit 130 may include a support member 133 and at least one light emitting element 131, for example, one or more light emitting elements, on the support member 133. The light emitting element 131 may be sealed by a resin member 132. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may support the light emitting element 131 and may include a conductive pattern to electrically connect the light emitting element 131. That is, the light source unit 130 may include a light emitting element 131 on one side and bonding pads 134 and 135 on the other side.

[0075] The pads 134 and 135 of the light source unit 130 may be disposed within the recessed portion 108, and the light emitting element 131 may be disposed outside the recessed portion 108. At least a portion of the connecting members 145 and 146 may be disposed on the recessed portion 108. A protection element (not shown) for protecting the light emitting element 131 may be disposed on the support member 133, and the protection element may be embodied as a thyristor, a Zener diode, or a TVS (Transient voltage suppression) to protect the light emitting element 131 from ESD (electro static discharge).

[0076] The support member 133 may be made of a ceramic material or an MCPCB material. The support member 133 may thermally conduct heat generated from the light emitting element 131 through the heat dissipation plate 101. The support member 133 may be attached to the heat dissipation plate 101 using an adhesive member 138. The adhesive member 138 may include a thermally conductive adhesive having metal powder or inorganic powder in a resin material, for example, a thermal interface material (TIM). The adhesive member 138 may be disposed along the lower surface and lower portions of the side surfaces of the support member 133. The adhesive member 138 may be disposed outside the side surfaces of the support member 133 and may contact each side surface of the support member 133.

[0077] The light emitting device 131 may include at least one of a blue, green, or red LED chip. The light emitting device 131 may be bonded by flip chip bonding. The resin member 132 may be formed of a material including silicone or epoxy in a single layer or multiple layers. The resin member 132 may further include a convex lens (not shown) on an upper portion. The light emitting device 131 may include a light emitting chip 30 disposed on the support member 133 and a wavelength conversion layer 31 disposed on the light emitting chip 30.

[0078] The wavelength conversion layer 31 is disposed on the light emitting chip 30 and may cover the entire upper surface of the light emitting chip 30. The wavelength conversion layer 31 converts the wavelength of a portion of light emitted from the light emitting chip 30. The wavelength conversion layer 31 may be in contact with the upper surface of the light emitting chip 30 and a portion of the resin member 132. The wavelength conversion layer 31 may include at least one or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor.

[0079] 19 to 21, the light emitting element 131 is disposed on an upper portion of one side of the support member 133, and bonding pads 134 and 135 may be exposed on an upper portion of the other side of the support member 133. The bonding pads 134 and 135 may include a first bonding pad 134 connected to a cathode of the light emitting element 131 and a second bonding pad 135 connected to an anode of the plurality of light emitting elements 131. The first bonding pad 134 may function as a cathode terminal, and the second bonding pad 135 may function as an anode terminal.

[0080] The first bonding pad 134 may be connected to the first pad 111 through a first connecting member 145, and the second bonding pad 135 may be connected to the second pad 112 through a second connecting member 146. The first connecting member 145 and the second connecting member 146 may include an electrically conductive member, for example, an electrically conductive adhesive material TIM (Terminal Interface Materials) or an electrically conductive paste. The electrically conductive adhesive material may be provided by adding a metal material to silicone or epoxy. The electrically conductive adhesive material may include a transparent conductive film or an opaque conductive film. The viscosity coefficient of the material of the first and second connecting members 145 and 146 may be 100,000 cP or more.

[0081] The first connecting member 145 may contact a surface of the first pad 111 from a surface of the first bonding pad 134 and extend along the upper surface of the light source unit 130 and the upper surface of the circuit board 110. The other end of the first connecting member 145 may be connected to a first region B1 or a second region B2 of the first pad 111. The second connecting member 146 may contact a surface of the second pad 112 from a surface of the second bonding pad 135 and extend along the upper surface of the light source unit 130 and the upper surface of the circuit board 110. The other end of the second connecting member 146 may be connected to a third region B3 or a fourth region B4 of the second pad 112. The regions where the other ends of the first and second connecting members 145 and 146 are located can be selected in various ways, so that the lengths and contact areas of the first and second connecting members 145 and 146 can be optimized. Furthermore, the size and shape of the first and second bonding pads 134 and 135 can be changed in various ways.

[0082] The first connecting member 145 and the second connecting member 146 may extend through the recess 108 between the light source unit 130 and the circuit board 110. The width or thickness of each of the first connecting member 145 and the second connecting member 146 may be smaller than the length extending in one direction. The width of each of the first connecting member 145 and the second connecting member 146 may be larger than the thickness of the first and second connecting members 145 and 146. Preferably, the width of each of the first and second connecting members 145 and 146 may be more than twice, for example, more than twice, the thickness of the first and second connecting members 145 and 146. Here, the thickness of the first and second connecting members 145 and 146 may be the maximum thickness in the vertical direction at one end 51 and / or the other end 52 of each of the connecting members 145 and 146. The width of each of the first and second connecting members 145, 146 may be a bottom width or a maximum width at one end 51 and / or the other end 52 of each of the connecting members 145, 146.

[0083] Each of the first connecting member 145 and the second connecting member 146 may include a straight line shape, a curved line shape, or an angular line shape. The first connecting member 145 and the second connecting member 146 may extend parallel to each other, be arranged on the same line, or be arranged not parallel to each other. Here, when the upper surface height H2 of the circuit board 110 is arranged higher than the upper surface height of the light source unit 130, the surfaces of the first and second connecting members 145 and 146 may have a stepped or curved shape according to the difference in the upper surface height between the circuit board 110 and the light source unit 130.

[0084] The first connecting member 145 and the second connecting member 146 have one ends 51 bonded to the first bonding pad 134 and the second bonding pad 135, respectively, and the other ends 52 bonded to the first pad 111 and the second pad 112, respectively. The first connecting member 145 and the second connecting member 146 include a center portion 53 extending from one end 51 to the other end 52, and the center portion 53 may extend from the other side of the light source unit 130 to the inside of the circuit board 110 through the region of the recessed portion 108. A part 53A of the center portion 53 may protrude into the recessed portion 108 between the circuit board 110 and the heat dissipation unit 102. The height of one end 51 of the first connecting member 145 and the second connecting member 146 may be disposed to be the same as or lower than the height of the other end 52, and the height of the center portion 53 may be a height between the heights of the one end 51 and the other end 52 or the same height. The width of the center portion 53 may be equal to or smaller than the width of one end 51 and the other end 52. The width of the center portion 53 may be the width of the bottom surface of the center of each of the connecting members 145, 146. The width of the one end 51 and the other end 52 may be the width of the portion to be bonded or the bottom surface width. The length of each of the connecting members 145, 146 may be greater than the width of each of the connecting members 145, 146.

[0085] The gap G2 between the light source unit 130 and the circuit board 110 is a part of the space of the recessed portion 108 and may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm. If the range of the gap G2 is smaller than the range, the buffer space due to the thermal expansion difference between the light source unit 130 and the circuit board 110 is reduced, and the electrical reliability of the first and second connecting members 145 and 146 may be reduced when the light source unit 130 moves. If the gap G2 between the light source unit 130 and the circuit board 110 is larger than the range, the length or material of the first and second connecting members 145 and 146 increases.

[0086] The portion 138A of the adhesive member 138 may be located in a gap G2 between the light source unit 130 and the circuit board 110. The portion 138A of the adhesive member 138 may overlap the first and second connecting members 145 and 146 in a vertical direction. The portion 138A of the adhesive member 138 may face or contact the portion 53A of the first and second connecting members 145 and 146. The portion 138A of the adhesive member 138 may protrude to a height of 0.4 mm or more, for example, in a range of 0.4 mm to 0.6 mm, based on the bottom of the light source unit 130, and this height can prevent contact between the light source unit 130 and the circuit board 110.

[0087] As shown in FIG. 22, when the adhesive member 138 or the circuit board 110 expands or contracts due to the generated heat, cracks may occur in the first and second connecting members 145 and 146. For this purpose, a resin part 149 may be further disposed in the gap of the recessed part 108 between the light source part 130 and the circuit board 110, so that the resin part 149 can reduce thermal deformation of the adhesive member 138 that is transmitted in the vertical direction. In addition, the resin part 149 can reduce thermal deformation of the circuit board 110 that is transmitted in the horizontal direction. The height of the resin part 149 may be 10% or more of the length between the lower surface and the upper surface of the light source part 130, for example, in the range of 10% to 50% or 10% to 100%, and if it is smaller than this range, the effect of suppressing thermal deformation may decrease, and if it is larger than this range, the adhesive force of the light source part 130 may decrease. By making the height of the connecting members 145, 146 connecting the light source unit 130 and the circuit board 110 lower than the height of the wire, it is possible to reduce interference and reflection of the light emitted from the light emitting element 131. In addition, by inserting at least a part of the light source unit 130 into the recessed portion 108 of the circuit board 110 and then attaching it, it is possible to prevent the light source unit 130 from moving, and it is possible to reduce the size of the lighting module having the light source unit 130 and the circuit board 110.

[0088] 23, the light source unit 130 may include first and second light emitting elements 131A and 131B, and the first and second light emitting elements 131A and 131B have a structure in which different wavelength conversion layers are arranged on the light emitting chip 30 disclosed above. The different wavelength conversion layers can emit wavelengths, for example, green and red wavelengths, different from the emission wavelength of the light emitting chip 30. The light emitting chip 30 can emit a blue wavelength.

[0089] 24, a heat dissipation plate 101 includes a heat dissipation part 102 having a protrusion 102B, and the protrusion 102B may be disposed under the light source part 130. Due to the protrusion 102B, the height of the upper surface of the light source part 130 may be the same as the height of the upper surface of the circuit board 110 or may be located in a range of 80% to 120% of the height of the upper surface of the circuit board 110. Thus, the first and second connecting members 145 and 146 can connect the bonding pads 134 and 135 and the pads 111 and 112 without having a stepped structure or a bent shape on the surface.

[0090] 25, the first connecting member 145 may connect the first bonding pad 134 to the second region B2 of the first pad 111, and the second connecting member 146 may connect the second bonding pad 135 to the fourth region B4 of the second pad 112. As another example, the first connecting member 145 may connect the first bonding pad 134 to the first region B1 of the first pad 111, and the second connecting member 146 may connect the second bonding pad 135 to the fourth region B4 of the second pad 112. As another example, the first connecting member 145 may connect the first bonding pad 134 to the second region B2 of the first pad 111, and the second connecting member 146 may connect the second bonding pad 135 to the third region B3 of the second pad 112.

[0091] As described above, the first and second connecting members 145 and 146 may be arranged in a straight bar shape or a curved bar shape. As another example, the first connecting member 145 may be bonded to both the first and second regions B1 and B2 of the first pad 111, and the second connecting member 146 may be bonded to both the third and fourth regions B3 and B4 of the second pad 112.

[0092] 26, the first connecting member 145 has a circular shape with a predetermined diameter, and is disposed on the first bonding pad 134 and the first pad 111 to connect between the first bonding pad 134 and the first pad 111. The first connecting member 145 has a circular shape with a predetermined diameter, and is disposed on the first bonding pad 134 and the first pad 111 to connect between the first bonding pad 134 and the first pad 111. One or more of the first and second connecting members 145 and 146 may be disposed in a circular or elliptical shape. The plurality of circular or elliptical shapes may be connected to each other.

[0093] As shown in FIGS. 27 and 28, the lighting device may include a first connection frame 151 and a second connection frame 152 disposed on the light source unit 130 and the circuit board 110. The first connection frame 151 may have a length longer than the minimum distance between the first bonding pad 134 and the first pad 111, and may connect the first bonding pad 134 and the first pad 111. The first connection frame 151 may be disposed on the first pad 111 and the first bonding pad 134, and the second connection frame 152 may be disposed on the second pad 112 and the second bonding pad 135. The first connection frame 151 and the first bonding pad 134 may be bonded to a first bonding member 145A, and the first connection frame 151 and the first pad 111 may be bonded to a second bonding member 145B. The second connection frame 152 and the second bonding pad 135 may be bonded to each other by a third bonding member 146A, and the second connection frame 152 and the first pad 111 may be bonded to each other by a fourth bonding member 146B. The first and second connection frames 151 and 152 may be frames made of a metal material and may include at least one of copper, gold, silver, aluminum, and nickel. The first to fourth bonding members 145A, 145B, 146A, and 146B may be made of a conductive bonding material, for example, a solder paste material.

[0094] The first connection frame 151 has a plurality of first through holes TH1, and the plurality of first through holes TH1 may vertically overlap the first bonding pad 134 and the first pad 111. The first bonding member 145A and the second bonding member 145B may be filled or protrude into the plurality of first through holes TH1. Thus, the first and second bonding members 145A and 145B may protrude or be filled inside the first through holes TH1, improving the bonding strength between the first connection frame 151 and the first and second bonding members 145A and 145B.

[0095] The second connection frame 152 may have a length longer than the minimum distance between the second bonding pad 135 and the second pad 112 and may connect the second bonding pad 135 and the second pad 112. The first connection frame 151 may extend linearly from the first pad 111 toward the first bonding pad 134, and the second connection frame 152 may extend linearly from the second pad 112 toward the second bonding pad 135.

[0096] The second connection frame 152 has a plurality of second through holes TH1, and the plurality of second through holes TH2 may vertically overlap the second bonding pad 135 and the second pad 112. The third bonding member 146A and the fourth bonding member 146B may be filled or protrude into the plurality of second through holes TH2. Thus, the third and fourth bonding members 146A and 146B may protrude or be filled inside the second through holes TH2, improving the bonding strength between the second connection frame 152 and the third and fourth bonding members 146A and 146B.

[0097] 29, a depth D3 of the recessed portion 108 of the circuit board 110 may be greater than one direction length of the light source unit 130. That is, since the light source unit 130 is embedded inside the recessed portion 108, at least three side surfaces of the light source unit 130 may be adhered to the circuit board 110 and the bottom of the recessed portion 108 by an adhesive member 138.

[0098] As shown in FIG. 30, the light emitting element 131 of the light source unit 130 may have a width in the first direction smaller than its length in the second direction. A portion of the first direction (i.e., a central region) may extend to a region between the first and second bonding pads 134 and 135. In this case, the length of the light source unit 130 in the second direction may be the same as or longer than the length in the first direction. That is, in order to increase the upper surface area of ​​the light emitting element 131, a portion of the region is further added to the region between the first and second bonding pads 134 and 135. In this case, the wavelength conversion layer may have a shape corresponding to the light emitting element 131 or may be separated into a plurality of regions to emit red, red, and blue light, respectively, and the light emitting chip may emit ultraviolet light.

[0099] 31, a vehicle headlamp 90 having a lighting device according to the embodiment includes a light source module 10 and a housing 92, and the light source module 10 is disposed inside the housing 92 to irradiate light in a lateral direction, and the irradiated light may be reflected in an outgoing direction via an inner surface 92A of the housing 92. The light source module 10 may include the lighting device according to the first embodiment or other examples disclosed above, and the light guide portion 520 of the light guide module may protrude.

[0100] The housing 92 may include a metal or non-metallic material, and the non-metallic material may include a plastic material. The housing 92 may be a reflector of a headlamp. An inner surface 92A of the housing 92 may be a surface coated with a highly reflective material or may include a reflective layer having anti-reflection (AR). For example, the highly reflective material may include at least one of metals, such as Al, Ag, and Au, and the non-reflective material may include MgF 2、 AlO 3、 SiO, SiO 2、 TiO2+ZrO 2、 TiO 2、The reflective layer on the inner surface 92A may be a single layer or multiple layers.

[0101] The headlamp 90 may include an inner lens and / or an outer lens that projects the light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module may be adjusted depending on the shape of the inner lens and the number of light source units. The light source module selectively emits light of a high beam light distribution pattern and a low beam light distribution pattern, and the high beam light distribution pattern or the low beam light distribution pattern may be automatically turned on or off depending on the driving mode or driving situation. The inner surface 92A of the housing 92 may include a partially dome-shaped or partially elliptical paraboloid. The inner surface 92A may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion, and / or a flat portion, and / or a curved portion (e.g., any combination thereof). In some examples, the facets (or at least the inwardly facing surfaces on the facets) may be at least approximated or otherwise defined by an algebraic equation. For example, the shape or inwardly facing surface of a facet may be represented by one or more fifth-order algebraic equations (of course, other equations of any order are possible). In at least one exemplary embodiment, the surface (or coating, for example) of the facet has a high reflectivity (e.g., a reflectivity of 80% or more). Non-limiting examples of facets and / or coatings on the facets include aluminum and silver, although other reflective materials may be used.

[0102] The inner surface 92A of the housing 92 is spaced apart from the light source module, and light emitted from the light source module may be reflected by the inner surface 92A and concentrated on the emission side of the housing 92, and may be irradiated with high beam or low beam. The exterior of the housing 92 may include various features and accessories for mounting or connecting the headlamp 90 inside the vehicle, and may have an electrical interface, such as a socket, for connecting power and / or signals. The housing 92 and cavity 95 described above are examples and may be changed to various shapes. The housing 92 according to the embodiment may function as a reflector for the left / right headlamp 90.

Claims

1. a heat dissipation plate having an upper surface and a recessed portion recessed from the upper surface; a circuit board having a plurality of pads and housed in a recess of the heat dissipation plate; a light source unit disposed on the heat dissipation plate adjacent to the circuit board and having a plurality of bonding pads; a plurality of connecting members respectively connecting the plurality of pads and the plurality of bonding pads; an adhesive member that adheres the light source unit to a heat dissipation plate, The light source unit includes a support member, a plurality of light-emitting elements having a plurality of light-emitting chips and a wavelength conversion layer on the plurality of light-emitting chips on the support member, and a resin member covering the periphery of the plurality of light-emitting elements, the plurality of bonding pads have a thickness greater than a thickness of the light emitting chip, and are sealed with the resin member so as to be exposed on an upper surface of the resin member; Each of the plurality of connecting members has a ribbon shape, a width of each of the plurality of connecting members is greater than or equal to two times a thickness of the connecting member; a first end bonded to a first bonding pad, a second end connected to a first pad, and a third end connected to the first pad; and a second end connected to the first pad, the second end being connected to the first pad.

2. a length between the one end and the other end of each of the plurality of connecting members is equal to or greater than a width of each of the connecting members; The width of each of the plurality of connecting members is in the range of 0.4 mm to 0.9 mm; The lighting device of claim 1 , wherein the length of one side of each of the plurality of bonding pads is in the range of 1.5 to 4 times the width.

3. an upper surface of the circuit board is disposed lower than upper surfaces of the light emitting chips; The lighting device according to claim 1 , wherein the height of each of the plurality of connecting members is smaller than a linear distance between one end and the other end of each of the connecting members.

4. 4. The lighting device according to claim 1 , wherein the support member includes an upper electrode pattern on which the plurality of light emitting chips are arranged, and a lower electrode pattern electrically connected to a portion of the plurality of electrode patterns and the heat dissipation plate.

5. the adhesive member includes a first adhesive member that adheres a first bonding pad of the light source unit to a heat dissipation plate, and a second adhesive member that adheres a second bonding pad of the light source unit to a pad of the circuit board, The lighting device according to claim 1 , wherein at least one of the first and second adhesive members is made of an electrically conductive material.

6. a light guide module coupled on the heat sink plate and covering the light source unit; the light guide module is coupled to the heat sink plate and includes a support part spaced apart from the light source part and a light guide part protruding from the support part, The light guide portion overlaps the light source portion in a vertical direction, The lighting device according to claim 1 , wherein the light guide portion has a columnar shape and an upper surface area larger than an upper surface area of ​​the light source portion.

7. A heat sink plate; a circuit board disposed on the heat sink plate and having a recess on one side; a plurality of pads disposed on one side of the circuit board; a light source unit disposed on the heat dissipation plate and having a light emitting element and a plurality of bonding pads; a plurality of connecting members respectively connecting the pads to the bonding pads; At least a portion of the light source unit is disposed within a recessed portion of the circuit board.

8. The light source unit has a light emitting element disposed on one side and first and second bonding pads disposed on the other side. the pads of the circuit board include first and second pads disposed outside the recessed portion; the first pad faces at least two sides of the first bonding pad; The lighting device of claim 7 , wherein the second pad faces at least two sides of the second bonding pad.

9. The recessed portion is concave from one side of the circuit board to the other side, The lighting device according to claim 7 , wherein a depth of the recessed portion is equal to or greater than 30% of a length of the light source portion in the first direction.

10. an adhesive member disposed between the light source unit and the heat dissipation plate; At least a portion of the plurality of connecting members is disposed on the recessed portion, a portion of the adhesive member protruding into a gap between the light source unit and the heat dissipation plate; The lighting device according to claim 7 , wherein a portion of each of the plurality of connecting members protrudes into a gap between the light source unit and the heat dissipation plate.

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