Two-component polyurethane adhesive composition

Abstract

A two-component polyurethane adhesive composition is provided herein.

Description

[Technical field]

[0001] The present invention relates to the field of two-component polyurethane adhesive compositions. [Background technology]

[0002] The demand for affordable, higher autonomy range electric vehicles has led to a rapid acceleration of innovation in electric vehicle (EV) battery concepts. Higher energy density, lighter weight, more durable and more economical EV battery concepts have been developed over the last decade.

[0003] Innovation efforts are mainly focused on two directions: 1. To increase the autonomy range by increasing the energy packing density, and 2. To reduce the price of the battery. To save weight and increase the battery autonomy range, several strategies exist on the market to achieve higher energy density of the cells, all of which include thermal management concepts to optimize the operating conditions and the life of the battery. A typical cell generates heat under standard operating conditions and during charging. The optimal operating temperature of the cell lies between 25 and 40°C. The heat generated by the cell during operation is dissipated to the cooling plate. The cells or modules are connected to the cooling plate by a thermally conductive material. To increase the mechanical stability of the battery, thermally conductive adhesives are required.

[0004] For purposes of bonding battery modules, it is desirable for the adhesive to have a fairly long work time, which is the time from mixing of the adhesive's components until the adhesive has cured sufficiently so that the parts of the bonded assembly can no longer be moved relative to one another. A longer work time allows flexibility in the assembly process and, in the case of thermally conductive adhesives, provides time for the adhesive to penetrate into relatively small cavities and completely surround the battery components. Summary of the Invention [Problem to be solved by the invention]

[0005] There remains a need for adhesives that are thermally conductive and exhibit a work time greater than 30 minutes. [Means for solving the problem]

[0006] In a first aspect, the present invention provides a method for producing a composition comprising the steps of: (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group A two-component thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Provide an adhesive.

[0007] In a second aspect, the present invention provides a method for producing a composition comprising the steps of: (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group A kit for producing a thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Provide a kit.

[0008] In a third aspect, the present invention provides a method for producing a method for the preparation of ... (1) (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group providing an adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Steps; (2) mixing component A with component B to produce an adhesive mixture; (3) applying the adhesive mixture to a first substrate; (4) placing the first substrate in adhesive contact with a second substrate; (5) Curing the adhesive mixture The present invention provides a method for bonding two or more substrates, comprising:

[0009] In a fourth aspect, the present invention provides a method for producing a composition comprising the steps of: (1) a first substrate; (2) A second substrate adhered to the first substrate. A bonded assembly comprising: The first substrate and the second substrate are each composed of the following components A and B: (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group The adhesive is made by mixing component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, A bonded assembly is provided. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present inventors have demonstrated that the molecular weight (M n It has been found that by using an isocyanate component comprising a prepolymer prepared by reacting at least one polyether monol of the formula (I) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI, and by using a mixture of ATH and alumina as a filler, it is possible to achieve extended working time and slow development of compressive force of a thermally conductive polyurethane adhesive.

[0011] Definitions and Abbreviations MDI Methylene-bis-(phenylisocyanate) HDI Hexamethylene Diisocyanate IPDI Isophorone Diisocyanate PU Polyurethane GPC Gel Permeation Chromatography RH Relative Humidity ATH Aluminum trihydroxide

[0012] The equivalent weight and molecular weight are measured by gel permeation chromatography (GPC) using a Malvern Viscothek GPC max instrument. Tetrahydrofuran (THF) was used as the eluent, PL GEL MIXED D (Agilent, 300*7.5mm, 5μm) was used as the column, and MALVERN Viscotek TDA (integrated refractive index viscometer and light scattering) was used as the detector.

[0013] The particle size of ATH was measured using laser diffraction using water containing 0.01 wt % sodium pyrophosphate as the suspending medium.

[0014] Component A (Isocyanate) Component A has a molecular weight of more than 800 Da (M n) with at least one polyisocyanate.

[0015] Polyether monool is poly(C 2~4 -alkylene oxide) diol monoethers, i.e., one of the terminal OH groups of the diol is C 1~6 Those substituted with ether groups, and poly(C 2~4 -alkylene oxide) diol monoester, i.e., one of the terminal OH groups of the diol is C 2~6 Preferably, they are selected from those substituted with ester groups.

[0016] In a preferred embodiment, the polyether monol is selected from monoethers of poly(ethylene oxide) diols, monoethers of poly(propylene oxide) diols, monoethers of poly(butylene oxide) diols, and mixtures thereof.

[0017] In a more preferred embodiment, the polyether monol is selected from monoethers of poly(propylene oxide) diols.

[0018] The methyl, ethyl and propyl monoethers are preferred, with the methyl ether being especially preferred.

[0019] In a preferred embodiment, the polyether monol is selected from the monomethyl ethers of poly(propylene oxide) diols.

[0020] The polyether monols have a molecular weight (Mn) of more than 800 Da and preferably less than 2,000 Da, more preferably less than 1,500 Da, more particularly preferably less than 1,000 Da.

[0021] In a preferred embodiment, the polyether monol is a poly(propylene oxide) diol, in particular a poly(propylene oxide) diol having a molecular weight (M) of 800 to 2,000 Da, more preferably 800 to 1,500 Da.n ) is the monomethyl ether of poly(propylene glycol).

[0022] In a particularly preferred embodiment, the polyether monol is a poly(propylene oxide) diol, in particular a poly(propylene oxide) diol having a molecular weight (M n ) is the monomethyl ether of poly(propylene glycol).

[0023] The polyisocyanate is selected from aliphatic polyisocyanates and mixtures of 2,4'-MDI and 4,4'-MDI.

[0024] In a preferred embodiment, the polyisocyanate is aliphatic, with isophorone diisocyanate (IPDI), dicyclohexylmethane diisocyanate (HMDI), and hexamethylene diisocyanate (HDI), and mixtures thereof being particularly preferred.

[0025] In another preferred embodiment, the polyisocyanate is a mixture of 2,4'-MDI and 4,4'-MDI. More preferably, the weight ratio of 2,4'-MDI to 4,4'-MDI is from 0.667 to 1.5, more particularly preferably from 0.8 to 1.5, and even more particularly preferably from 1 to 1.5.

[0026] Particularly preferred is a mixture of 2,4'-MDI and 4,4-MDI in a 1:1 weight ratio of 2,4'-MDI and 4,4-MDI.

[0027] The NCO-terminated prepolymers of component A are prepared by reacting at least one polyether monol with at least one polyisocyanate. The reaction is preferably carried out under dry and inert conditions, in particular under vacuum. In a preferred embodiment, the at least one polyether monol is first dried under vacuum and at elevated temperature (>100°C), cooled (e.g. to 80°C), and then at least one polyisocyanate is added under vacuum. The mixture is reacted under vacuum for 1 to 2 hours. The resulting reaction mixture is used without purification.

[0028] The at least one polyisocyanate is used in an amount such that there is an excess of NCO groups relative to the monol OH groups. In a preferred embodiment, the at least one polyisocyanate is used in a stoichiometric excess of 2 to 15 times the monol, more preferably 8 to 12 times the monol, particularly preferably 10 times the monol.

[0029] In a preferred embodiment, the prepolymer is made by reacting poly(propylene glycol) monomethyl ether with a mixture of 2,4'-MDI and 4,4'-MDI.

[0030] In another preferred embodiment, the prepolymer has a molecular weight (M n ) It is produced by reacting poly(propylene glycol) monomethyl ether of either 800 to 1,500 Da with a mixture of 2,4'-MDI and 4,4'-MDI.

[0031] At least one polyether monol is preferably used in component A in an amount of 5 to 20% by weight, more preferably 6 to 10% by weight, particularly preferably 8 to 9% by weight, based on the total weight of component A, it being understood that the polyether monol is in the form of a prepolymer.

[0032] The at least one polyisocyanate is preferably used in component A in an amount of 5 to 20% by weight, more preferably 6 to 15% by weight, more particularly preferably 10 to 11% by weight, based on the total weight of component A.

[0033] The NCO-terminated prepolymer is preferably prepared with 30 to 55% by weight, more preferably 35 to 50% by weight, and particularly preferably 42 to 45% by weight, of polyether monol, based on the total weight of the prepolymer.

[0034] The NCO-terminated prepolymer is preferably prepared with 40 to 65% by weight, more preferably 45 to 60% by weight, and especially preferably 50 to 58% by weight, of diisocyanate, based on the total weight of the prepolymer.

[0035] In a preferred embodiment, the prepolymer is produced from 30 to 55% by weight, more preferably 35 to 50% by weight, and particularly preferably 42 to 45% by weight, of a polyether monol, based on the total weight of the prepolymer, and 40 to 65% by weight, more preferably 45 to 60% by weight, and particularly preferably 50 to 58% by weight, of a diisocyanate, based on the total weight of the prepolymer.

[0036] The prepolymer is preferably used in component A in an amount of 15 to 30% by weight, more preferably 16 to 25% by weight, more particularly preferably 18 to 20% by weight, based on the total weight of component A.

[0037] Component A, moreover, C 8~20 Examples of such silanes include trialkoxy-C 8~20 Alkylsilanes, especially trimethoxy-C 8~20 Alkylsilane and Triethoxy-C 8~20 Alkylsilanes include trimethoxy-C 8~20 Alkylsilanes are particularly preferred. In a preferred embodiment, component A comprises hexadecyl-trimethoxysilane.

[0038] If used, the silane is preferably present in Component A at 0.25 to 3 wt. %, more preferably 0.5 to 2 wt. %, and especially preferably 0.75 to 1.2 wt. %, based on the total weight of Component A.

[0039] In a preferred embodiment, component A contains 0.25 to 3 wt. %, more preferably 0.5 to 2 wt. %, and particularly preferably 0.75 to 1.2 wt. % of hexadecyl-trimethoxysilane, based on the total weight of component A.

[0040] Component A may also include ATH and alumina, as described in more detail below.

[0041] Component A may further comprise a fibrous filler, such as wollastonite. If used, wollastonite is preferably present at 0.5 to 4% by weight, more preferably 1 to 3% by weight, more particularly preferably 1.7 to 2.2% by weight, based on the total weight of component A.

[0042] Component A may further comprise fumed silica. If used, the fumed silica is preferably present at 0.75 to 2 wt. %, more preferably 1 to 2 wt. %, based on the total weight of Component A.

[0043] Component A is typically formulated by drying solid raw materials such as ATH and alumina, wollastonite, fumed silica, etc., at elevated temperatures under vacuum. Preferably, drying is carried out until the moisture content is 300 ppm or less. Prepolymer and silane, if used, are added to the dry raw materials and mixed to homogeneity under reduced pressure, and Component A is then stored in a moisture-proof container.

[0044] Component B (Polyol) Component B comprises (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of OH groups with NCO groups.

[0045] The at least one polyol preferably comprises a polyol having a molecular weight of less than 1,500 Da, more preferably 1,000 Da or less.

[0046] The at least one polyol preferably comprises a diol, a triol and mixtures thereof. In a preferred embodiment, the at least one polyol comprises at least one diol, in particular a polyether-based diol. In a particularly preferred embodiment, the at least one polyol comprises a poly(propylene oxide)-based diol.

[0047] In a more preferred embodiment, the at least one polyol comprises a mixture of diols and triols.

[0048] In another preferred embodiment, the at least one polyol comprises diols, triols and mixtures thereof, all having a molecular weight less than 1,500 Da, more preferably less than 1,000 Da. In a preferred embodiment, the at least one polyol comprises a mixture of diols and triols, all having a molecular weight less than 1,500 Da, more preferably less than 1,000 Da.

[0049] In a preferred embodiment, the at least one polyol comprises a polyether polyol. A preferred polyether polyol is poly(C 2~4 In a particularly preferred embodiment, the polyether polyol is selected from poly(alkylene oxide)-based polyols, in particular poly(ethylene oxide)-based, poly(propylene oxide)-based, poly(butylene oxide)-based polyols, and mixtures thereof. In a particularly preferred embodiment, the polyether polyol is selected from poly(propylene oxide)-based polyols.

[0050] In another preferred embodiment, the at least one polyol comprises a triol. The triol may be, for example, poly(C 2~4In a particularly preferred embodiment, the triol is castor oil.

[0051] In a preferred embodiment, the at least one polyol comprises a mixture of polyether diol and castor oil.

[0052] In another preferred embodiment, the at least one polyol comprises a mixture of a polyether diol having a molecular weight of less than 600 Da and castor oil.

[0053] In another preferred embodiment, the at least one polyol comprises a mixture of poly(propylene oxide)-based diol and castor oil.

[0054] In another preferred embodiment, the at least one polyol comprises a mixture of a poly(propylene oxide)-based diol having a molecular weight less than 600 Da and castor oil.

[0055] In a preferred embodiment, component B comprises 2 to 15% by weight, more preferably 4 to 10% by weight, and more particularly preferably 5 to 7% by weight, of diol, based on the total weight of component B.

[0056] In another preferred embodiment, component B comprises, based on the total weight of component B, 5 to 20 wt. %, more preferably 7 to 15 wt. %, particularly preferably 8 to 11 wt. % of triol.

[0057] In another preferred embodiment, component B comprises 2 to 15% by weight, more preferably 4 to 10% by weight, more particularly preferably 5 to 7% by weight, of diol having a molecular weight of less than 600 Da, based on the total weight of component B.

[0058] In another preferred embodiment, component B comprises 5 to 20% by weight, more preferably 7 to 15% by weight, particularly preferably 8 to 11% by weight, of a triol having a molecular weight of less than 1,000 Da, based on the total weight of component B.

[0059] In another preferred embodiment, component B comprises 2 to 15% by weight, more preferably 4 to 10% by weight, and more particularly preferably 5 to 7% by weight, based on the total weight of component B, of a diol having a molecular weight of less than 600 Da, and 5 to 20% by weight, more preferably 7 to 15% by weight, and particularly preferably 8 to 11% by weight, based on the total weight of component B, of a triol having a molecular weight of less than 1,000 Da.

[0060] In another preferred embodiment, component B comprises 4 to 10% by weight, more particularly preferably 5 to 7% by weight, based on the total weight of component B, of poly(propylene oxide) diol having a molecular weight of less than 600 Da.

[0061] In another preferred embodiment, Component B comprises, based on the total weight of Component B, 5 to 20% by weight, more preferably 7 to 15% by weight, particularly preferably 8 to 11% by weight of castor oil.

[0062] In another preferred embodiment, component B comprises 4 to 10% by weight, more particularly preferably 5 to 7% by weight, of a poly(propylene oxide) diol having a molecular weight of less than 600 Da, based on the total weight of component B, and 5 to 20% by weight, more preferably 7 to 15% by weight, particularly preferably 8 to 11% by weight, of castor oil, based on the total weight of component B.

[0063] Component B further comprises a catalyst capable of catalyzing the reaction of isocyanate groups with OH groups.

[0064] Examples of such catalysts include tertiary amine catalysts, organometallic catalysts such as bismuth catalysts, alkyltin carboxylates, oxides and tin mercaptides.

[0065] Specific examples of tertiary amine catalysts include N-methylmorpholine, N-methylimidazole, triethylenediamine, bis-(2-dimethylaminoethyl)-ether, 1,4-diazabicyclo[2.2.2]octane (DABCO), dimethylcyclohexylamine, dimethylethanolamine, 2,2-dimorpholinyl-diethylether (DMDEE), N,N,N-dimethylaminopropylhexahydrotriazine, dimethyltetrahydropyrimidine, tetramethylethylenediamine, dimethylcyclohexylamine, 2,2-N,N-benzyldimethyla amine, dimethylethanolamine, dimethylaminopropylamine, pentadimethyldiethylenetriamine, N,N,N',N'-tetramethyl-1,6-hexanediamine, N,N',N'-trimethylaminoethylpiperazine, 1,1'-[[3-(dimethylamino)propyl]imino]bispropan-2-ol, 1,3,5-tris[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine, N-N-dimethyldipropylenetriamine, and N,N,N'-trimethylaminoethylethanolamine are particularly preferred.

[0066] When an organometallic catalyst is used, it is any organometallic catalyst that can catalyze the reaction between isocyanate and a functional group having at least one reactive hydrogen. Examples include bismuth catalysts, metal carboxylates, such as tin carboxylates and zinc carboxylates. Metal alkanoates include stannous octanoate, bismuth octanoate, or bismuth neodecanoate. Preferably, at least one organometallic catalyst is a bismuth catalyst or an organotin catalyst. Examples include dibutyltin dilaurate, dimethyltin dineodecanoate, dimethyltin mercaptide, dimethyltin carboxylate, dimethyltin dioleate, dimethyltin dithioglycolate, dibutyltin mercaptide, dibutyltin bis(2-ethylhexylthioglycolate), dibutyltin sulfide, dioctyltin dithioglycolate, dioctyltin mercaptide, dioctyltin dioctoate, dioctyltin dineodecanoate, dioctyltin dilaurate. In a preferred embodiment, the catalyst is a tin catalyst, particularly preferably dioctyltin mercaptide and / or dimethyltin dithioglycolate. In a particularly preferred embodiment, the catalyst is dioctyltin mercaptide.

[0067] The catalyst is preferably used in an amount of 0.0005 to 0.002% by weight, more preferably 0.00075 to 0.0015% by weight, based on the total weight of component B.

[0068] In a preferred embodiment, the catalyst is dioctyltin mercaptide, which is used at 0.0005 to 0.002% by weight, more preferably 0.00075 to 0.0015% by weight, based on the total weight of component B.

[0069] Component B, in addition, C 8~20 These silanes include those containing hydrolyzable silylalkoxy groups covalently bonded to an alkyl group. Examples of such silanes include trialkoxy-C 8~20 Alkylsilanes, especially trimethoxy-C 8~20 Alkylsilane and Triethoxy-C 8~20Alkylsilanes include trimethoxy-C 8~20 Alkylsilanes are particularly preferred. In a preferred embodiment, component B comprises hexadecyl-trimethoxysilane.

[0070] If used, the silane is preferably present in Component B at 0.25 to 3 wt. %, more preferably 0.5 to 2 wt. %, and especially preferably 0.75 to 1.2 wt. %, based on the total weight of Component B.

[0071] In a preferred embodiment, component B contains 0.25 to 3 wt. %, more preferably 0.5 to 2 wt. %, and particularly preferably 0.75 to 1.2 wt. % of hexadecyl-trimethoxysilane, based on the total weight of component B.

[0072] Component B may also include ATH and alumina, as described in more detail below.

[0073] Component B may further comprise a fibrous filler, such as wollastonite. If used, wollastonite is preferably present at 0.75 to 5% by weight, more preferably 1 to 4% by weight, more particularly preferably 2.8 to 3.2% by weight, based on the total weight of component B.

[0074] Component B may additionally comprise fumed silica. If used, the fumed silica is preferably present at 0.75 to 2 wt. %, more preferably 1 to 2 wt. %, based on the total weight of component A.

[0075] Component B may further comprise a polyester diol. Examples include polycaprolactone, in particular a polycaprolactone having a molecular weight (M) of 1,500 to 2,500 Da, more preferably 2,000 Da. n ) is an example of a polycaprolactone.

[0076] When used, the polyester diol is used in an amount of 0.1 to 0.4% by weight, more preferably 0.15 to 0.25% by weight, based on the total weight of component B.

[0077] Component B is typically formulated by drying solid raw materials such as ATH and alumina, wollastonite, fumed silica, etc., at elevated temperatures under vacuum. Preferably, drying is carried out until the moisture content is 300 ppm or less. At least one polyol, catalyst, and silane, if used, are added to the dry raw materials and mixed to homogeneity under reduced pressure, and Component B is then stored in a moisture-proof container.

[0078] filling material Component A and / or Component B may comprise the following fillers: Aluminum trihydroxide (ATH) and alumina Includes.

[0079] The ATH preferably has a multimodal particle size distribution. The expression multimodal particle size distribution means that at least two main peaks are observed when particle size is plotted with particle size on the x-axis and volume % on the y-axis.

[0080] In a preferred embodiment, the aluminum trihydroxide is bimodal.

[0081] The particle size distribution of aluminum trihydroxide is typically measured using laser diffraction, using water containing sodium pyrophosphate as the suspending agent.

[0082] In a preferred embodiment, the aluminum trihydroxide has the following particle size distribution: D 10 =0.5μm D 50 = 8 μm D 90 = 80μm has.

[0083] ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture. In a preferred embodiment, the concentration of ATH in the adhesive mixture is 40 to 65% by weight, more preferably 43 to 60% by weight, and especially preferred 44 to 57% by weight, based on the total weight of the adhesive mixture.

[0084] ATH may be present in component A, component B or both. Preferably, components A and B both contain ATH.

[0085] In a preferred embodiment, the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A.

[0086] In a preferred embodiment, the concentration of AHT in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B.

[0087] In a preferred embodiment, the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A, and the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B.

[0088] The alumina preferably has spherical particles. For the purposes of this description, "spherical" means particles having an aspect ratio of 0.8-1.2, more preferably 0.9-1.1.

[0089] The alumina preferably has a multimodal particle size distribution. The expression multimodal particle size distribution means that when the particle size is plotted with particle size on the x-axis and volume % on the y-axis, at least two main peaks are observed.

[0090] Preferably the alumina is bimodal.

[0091] The particle size distribution of the alumina is typically measured using laser diffraction, using water containing sodium pyrophosphate as the suspending agent.

[0092] In a preferred embodiment, the alumina has the following particle size distribution: D 10 = 1 to 5 μm, preferably 3 μm D 50 = 45 to 50 μm, preferably 46.5 μm D 90 = 80 to 100 μm, preferably 90 μm has.

[0093] In a preferred embodiment, the alumina has the following particle size distribution:

[0094] [Table 1]

[0095] In a preferred embodiment, the alumina has a D of 5.7 μm 50 Alumina having a D of 72 μm 50 It is a mixture of alumina having a D of 5.7 μm of 0.4:1 to 0.8:1, more preferably 0.5:1 to 0.7:1, and particularly preferably 0.6:1 (weight:weight). 50 Alumina having a D of 72 μm 50 Particularly preferred is a mixture with alumina having the formula:

[0096] The alumina is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of alumina in the adhesive mixture is at least 15 wt.-%, based on the total weight of the adhesive mixture. In a preferred embodiment, the concentration of alumina in the adhesive mixture is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, especially preferred 17 to 34 wt.-%, based on the total weight of the adhesive mixture.

[0097] Alumina may be present in component A, component B or both. Preferably, components A and B both contain alumina.

[0098] In a preferred embodiment, the concentration of alumina in Component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of Component A.

[0099] In a preferred embodiment, the concentration of alumina in Component B is, based on the total weight of Component B, 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight.

[0100] In a preferred embodiment, the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A, and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component B.

[0101] In a preferred embodiment, the ATH and alumina are multimodal.

[0102] In a preferred embodiment, the ATH and alumina are bimodal.

[0103] In a preferred embodiment, the ATH and alumina are multimodal and the alumina has a spherical particle shape.

[0104] In a preferred embodiment, the ATH and alumina are bimodal and the alumina has a spherical particle shape.

[0105] In a preferred embodiment, the ATH has the following particle size distribution: D 10 =0.5μm D 50 = 8 μm D 90 = 80μm and the alumina has the following particle size distribution: D 10 = 1 to 5 μm, preferably 3 μm D 50 = 45 to 50 μm, preferably 46.5 μm D 90 = 80 to 100 μm, preferably 90 μm has.

[0106] In a preferred embodiment, ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of the adhesive mixture, and the concentration of alumina in the adhesive mixture is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, particularly preferably 17 to 34 wt.-%, based on the total weight of the adhesive mixture.

[0107] In a preferred embodiment, ATH and alumina are both present in component A and component B.

[0108] In a preferred embodiment, the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A, and the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A.

[0109] In a preferred embodiment, the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B, and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component B.

[0110] In a preferred embodiment, the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A; the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B; the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A; and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component B.

[0111] Manufacturing method The adhesive composition of the present invention is manufactured by mixing the ingredients of each component separately, preferably under inert and dry conditions and / or under vacuum, until a homogenous mixture is obtained. Once the components are prepared, they are stored in separate containers until use.

[0112] How to use In one aspect, the present invention provides a method for producing a method for the treatment of a brain tumor comprising the steps of: (1) (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate. (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group providing an adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Steps; (2) mixing component A with component B to produce an adhesive mixture; (3) applying the adhesive mixture to a first substrate; (4) placing the first substrate in adhesive contact with a second substrate; (5) Curing the adhesive mixture The present invention provides a method for bonding two or more substrates, comprising:

[0113] The ingredients for components A and B useful in the method of the present invention are as described for the adhesive.

[0114] Mixing of components A and B is carried out by any method capable of achieving a homogeneous mixture fairly quickly. Typically, mixing is accomplished by dispensing both components simultaneously into a mixing vessel or passage. Mixing of components A and B can be in any desired proportion, but is typically carried out using a volume ratio A:B of 0.8 to 1.2, more preferably 1.

[0115] The application of the adhesive mixture to the substrate is typically carried out using a suitable application gun and a static mixer. The adhesive is filled into a cartridge that ensures a suitable mix ratio. The cartridge is placed in the application gun and a suitable static mixer is attached. The adhesive is then pressed onto the surfaces to be joined by the static mixer.

[0116] Curing is typically carried out at ambient temperature (eg, 23° C.) and humidity (eg, 50% relative humidity). Full cure for the adhesives of the present invention usually occurs in 7-10 days.

[0117] Substrates are not particularly limited and include metals and plastics. The adhesives of the present invention are particularly suitable for bonding e-coated steel, PET film, aluminized plastic film, and aluminum.

[0118] Preferred applications include thermally conductive materials for thermal management of EV batteries; especially major applications in the automotive industry for bonding of modules or cells to cold plates, but also for any application where a thermally conductive material is required.

[0119] Effect of the Invention The cured adhesive of the present invention (7 days, 23° C., 50% RH) preferably exhibits a thermal conductivity of 1.5 W / mK or more, more preferably 1.6 W / mK or more, and more particularly preferably 1.8 W / mK or more. Thermal conductivity is measured according to ASTM 5470, as described in the examples.

[0120] The cured adhesive of the present invention (7 days, 23°C, 50% RH) was applied to a 250mm bond area using e-coated steel for both substrates. 2 (10×25 mm), preferably exhibits a lap shear strength of ≧1.5 MPa, measured according to DIN EN 1465 at an adhesive layer thickness of 1 mm.

[0121] The adhesive mixture resulting from mixing of component A with component B (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) preferably has a working time of more than 35 minutes, more preferably more than 40 minutes, particularly preferably more than 50 minutes. The working time is the time to develop a compressive force of 150 KPa when pressed by parallel plates with a diameter of 50 mm into a 1 mm gap at a pressing speed of 62.5 mm / min.

[0122] The adhesive mixture resulting from mixing of component A and component B (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) preferably has an immediately after mixing compressive strength of less than 80 KPa, more preferably less than 78 KPa, when pressed by parallel plates having a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min.

[0123] The adhesive mixture resulting from mixing of component A and component B (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) preferably has a compression force 30 minutes after mixing of less than 130 KPa, more preferably less than 128 KPa, when pressed by parallel plates having a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min.

[0124] The adhesive mixture resulting from mixing of component A and component B (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) preferably has a compression force 60 minutes after mixing of less than 160 KPa, more preferably less than 155 KPa, when pressed by parallel plates having a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min.

[0125] Particularly preferred embodiments The following are particularly preferred embodiments of the adhesive composition of the present invention: 1. A kit for a two-component thermally conductive adhesive formulation, comprising: (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group A two-component thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, glue. 2. (A) Component A: (ai) Molecular weight of more than 800 Da (M n ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group A kit for producing a thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, kit. 3. A method for bonding two or more substrates, comprising: (1) (A) Component A: (ai) Molecular weight of more than 800 Da (M n) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group providing an adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Steps; (2) mixing component A with component B to produce an adhesive mixture; (3) applying the adhesive mixture to a first substrate; (4) placing the first substrate in adhesive contact with a second substrate; (5) Curing the adhesive mixture A method for bonding two or more substrates, comprising: 4. (1) a first substrate; (2) A second substrate adhered to the first substrate. A bonded assembly comprising: The first substrate and the second substrate are each composed of the following components A and B: (A) Component A: (ai) Molecular weight of more than 800 Da (M n) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of an OH group with an NCO group The adhesive is made by mixing component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce the adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Glued assembly. 5. Polyether monool is poly(C 2~4 -alkylene oxide)diol monoethers, and poly(C 2~4 The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 4, wherein the monoester of a cyclic alkylene oxide (ACO) is selected from the group consisting of monoesters of cyclic alkylene oxide (ACO) and cyclic alkylene oxide (CdO) diols. 6. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1-5, wherein the polyether monol is selected from monomonoethers of poly(ethylene oxide) diols, monoethers of poly(propylene oxide) diols, monoethers of poly(butylene oxide) diols, and mixtures thereof. 7. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1-6, wherein the polyether monol is selected from a monoether of poly(propylene oxide) diol. 8. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1-7, wherein the polyether monol is selected from terminal methyl, ethyl, and propyl monoethers. 9. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 8, wherein the polyether monol is selected from a terminal methyl monoether. 10. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1-9, wherein the polyether monol is selected from the monomethyl ether of a poly(propylene oxide) diol. 11. The adhesive of embodiment 1, the kit of embodiment 2, the method of bonding of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 10, wherein the polyether monol has a molecular weight (Mn) of more than 800 Da and less than 2,000 Da, more preferably less than 1,500 Da, more particularly preferably less than 1,000 Da. 12. Polyether monool is a poly(propylene oxide) diol, particularly a poly(propylene oxide) diol with a molecular weight (M n 12. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 11, wherein the monomer unit is a monomethyl ether of poly(propylene glycol) having the formula: 13. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1-12, wherein the polyisocyanate is aliphatic. 14. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 13, wherein the polyisocyanate is selected from isophorone diisocyanate (IPDI), dicyclohexylmethane diisocyanate (HMDI), hexamethylene diisocyanate (HDI), and mixtures thereof. 15. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 12, wherein the polyisocyanate is a mixture of 2,4'-MDI and 4,4'-MDI. 16. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 12, wherein the polyisocyanate is a mixture of 2,4'-MDI and 4,4'-MDI, the weight ratio of 2,4'-MDI to 4,4'-MDI being from 0.667 to 1.5, more preferably from 0.8 to 1.5, and more particularly preferably from 1 to 1.5. 17. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1-12, wherein the polyisocyanate used to prepare the prepolymer is a mixture of 4,4'-MDI and 2,4-MDI in a 1:1 weight ratio of 4,4'-MDI and 2,4-MDI. 18. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 17, wherein the at least one polyisocyanate is used in a stoichiometric excess of 2 to 15 times relative to the monol, more preferably 8 to 12 times relative to the monol, particularly preferably 10 times relative to the monol. 19. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1-18, wherein the prepolymer is made by reacting poly(propylene glycol) monomethyl ether with a mixture of 2,4'-MDI and 4,4'-MDI. 20. The prepolymer has a molecular weight (Mn 20. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 19, which is produced by reacting poly(propylene glycol) monomethyl ether of 800 to 1,500 Da with a mixture of 2,4'-MDI and 4,4'-MDI. 21. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 20, wherein at least one polyether monol is used in component A in an amount of 5 to 20 wt.-%, more preferably 6 to 10 wt.-%, particularly preferably 8 to 9 wt.-%, based on the total weight of component A. 22. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 21, wherein at least one polyisocyanate is used in component A in an amount of 5 to 20% by weight, more preferably 6 to 15% by weight, and more particularly preferably 10 to 11% by weight, based on the total weight of component A. 23. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 22, wherein the NCO-terminated prepolymer comprises 30 to 55 wt.-%, more preferably 35 to 50 wt.-%, particularly preferably 42 to 45 wt.-% of polyether monol, based on the total weight of the prepolymer. 24. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 23, wherein the NCO-terminated prepolymer comprises 40 to 65 wt. %, more preferably 45 to 60 wt. %, and particularly preferably 50 to 58 wt. % of diisocyanate, based on the total weight of the prepolymer. 25. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 24, wherein the prepolymer comprises 30 to 55% by weight, more preferably 35 to 50% by weight, and particularly preferably 42 to 45% by weight, of a polyether monol, based on the total weight of the prepolymer, and 40 to 65% by weight, more preferably 45 to 60% by weight, and particularly preferably 50 to 58% by weight, of a diisocyanate, based on the total weight of the prepolymer. 26. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 25, wherein the prepolymer is used in component A in an amount of 15 to 30% by weight, more preferably 16 to 25% by weight, and more particularly preferably 18 to 20% by weight, based on the total weight of the component A liquid. 27. Component A and / or component B further comprise C 8~20 27. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 26, comprising a silane comprising a hydrolyzable silylalkoxy group covalently bonded to an alkyl group. 28. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 27, wherein component A and / or component B comprises hexadecyl-trimethoxysilane. 29. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 28, wherein component A and / or component B contains 0.25 to 3 wt. %, more preferably 0.5 to 2 wt. %, and particularly preferably 0.75 to 1.2 wt. % silane, based on the total weight of component A or component B. 30. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 29, wherein component A and / or component B further comprises a fibrous filler, such as wollastonite. 31. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 30, wherein component A and / or component B contains 0.5 to 4 wt.-%, more preferably 1 to 3 wt.-%, and more particularly preferably 1.7 to 2.2 wt.-% wollastonite, based on the total weight of component A or component B. 32. The adhesive of embodiment 1, the kit of embodiment 2, the method of bonding of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 31, wherein at least one polyol comprises a polyol having a molecular weight of less than 1,500 Da, more preferably 1,000 Da or less. 33. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 32, wherein the at least one polyol comprises a diol, a triol, or a mixture thereof. 34. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 33, wherein the at least one polyol comprises at least one diol, in particular a polyether-based diol. 35. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 34, wherein at least one polyol comprises a poly(propylene oxide)-based diol. 36. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 35, wherein at least one polyol comprises a mixture of a diol and a triol. 37. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 36, wherein the at least one polyol comprises diols, triols, and mixtures thereof, all having a molecular weight of less than 1,500 Da, more preferably less than 1,000 Da. 38. The adhesive of embodiment 1, the kit of embodiment 2, the method of bonding of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 37, wherein at least one polyol comprises a mixture of diols and triols having a molecular weight of less than 1,500 Da, more preferably less than 1,000 Da. 39. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 38, wherein the at least one polyol comprises a polyether polyol. 40. At least one polyol is poly(C 2~4 40. The adhesive of embodiment 1, the kit of embodiment 2, the method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 39, comprising a polyether polyol selected from poly(alkylene oxide)-based polyols, in particular poly(ethylene oxide)-based, poly(propylene oxide)-based, poly(butylene oxide)-based polyols, and mixtures thereof. 41. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 40, wherein at least one polyol is selected from poly(propylene oxide)-based polyols. 42. The adhesive of embodiment 1, the kit of embodiment 2, the method of bonding of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 41, wherein at least one polyol comprises a triol. 43. At least one polyol is poly(C 2~4 43. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 42, comprising a triol selected from the group consisting of: 44. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 43, wherein at least one polyol comprises a poly(propylene oxide)-based triol. 45. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 44, wherein at least one polyol comprises castor oil. 46. ​​The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 45, wherein at least one polyol comprises a mixture of polyether diol and castor oil. 47. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 46, wherein at least one polyol comprises a mixture of a polyether diol having a molecular weight of less than 600 Da and castor oil. 48. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 47, wherein the at least one polyol comprises a mixture of a poly(propylene oxide)-based diol and castor oil. 49. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 48, wherein at least one polyol comprises a mixture of a poly(propylene oxide)-based diol having a molecular weight of less than 600 Da and castor oil. 50. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 49, wherein component B comprises 2 to 15 wt.-%, more preferably 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-% of diol, based on the total weight of component B. 51. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 50, wherein component B comprises 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-% of triol, based on the total weight of component B. 52. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 51, wherein component B comprises 2 to 15 wt.-%, more preferably 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-% of a diol having a molecular weight of less than 600 Da, based on the total weight of component B. 53. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 52, wherein component B comprises 5 to 20% by weight, more preferably 7 to 15% by weight, particularly preferably 8 to 11% by weight, of a triol having a molecular weight of less than 1,000 Da, based on the total weight of component B. 54. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 53, wherein component B comprises 2 to 15% by weight, more preferably 4 to 10% by weight, more particularly preferably 5 to 7% by weight, of a diol having a molecular weight of less than 600 Da, based on the total weight of component B, and 5 to 20% by weight, more preferably 7 to 15% by weight, more particularly preferably 8 to 11% by weight, of a triol having a molecular weight of less than 1,000 Da, based on the total weight of component B. 55. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 54, wherein component B comprises 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-%, of a poly(propylene oxide) diol having a molecular weight of less than 600 Da, based on the total weight of component B. 56. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 55, wherein component B comprises 5 to 20% by weight, more preferably 7 to 15% by weight, and particularly preferably 8 to 11% by weight, of castor oil, based on the total weight of component B. 57. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 56, wherein component B comprises 4 to 10% by weight, more preferably 5 to 7% by weight, of a poly(propylene oxide) diol having a molecular weight of less than 600 Da, based on the total weight of component B, and 5 to 20% by weight, more preferably 7 to 15% by weight, particularly preferably 8 to 11% by weight, of castor oil, based on the total weight of component B. 58. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 57, wherein the catalyst is selected from a tertiary amine catalyst and an organometallic catalyst. 59. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 58, wherein the catalyst is selected from alkyltin carboxylates, oxides, and tin mercaptides. 60. The adhesive of embodiment 1, the kit of embodiment 2, the method of bonding of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 59, wherein the catalyst is dioctyltin mercaptide. 61. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 60, wherein the catalyst is used in an amount of 0.0005 to 0.002 wt. %, more preferably 0.00075 to 0.0015 wt. %, based on the total weight of component B. 62. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 61, wherein the catalyst is dioctyltin mercaptide, used in an amount of 0.0005 to 0.002% by weight, more preferably 0.00075 to 0.0015% by weight, based on the total weight of component B. 63. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 62, wherein component B further comprises a polyester diol. 64. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 63, wherein component B further comprises polycaprolactone. 65. Component B further has a molecular weight (M) of 1,500 to 2,500 Da, more preferably 2,000 Da. n 65. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 64, comprising a polycaprolactone having a molecular weight of 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,26,27,28,29,30,31,26,29 66. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 65, wherein component B further comprises a polyester diol and is used in an amount of 0.1 to 0.4 wt. %, more preferably 0.15 to 0.25 wt. %, based on the total weight of component B. 67. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 66, wherein the AHT has a multimodal particle size distribution. 68. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 67, wherein the ATH has a bimodal particle size distribution. 69. Aluminum trihydroxide has the following particle size distribution: D 10 =0.5μm D 50 = 8 μm D 90 = 80μm 69. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 68, comprising: 70. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 69, wherein ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is 40 to 65% by weight, more preferably 43 to 60% by weight, particularly preferably 44 to 57% by weight, based on the total weight of the adhesive mixture. 71. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 70, wherein ATH is present in component A, component B or both. 72. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 71, wherein component A and component B both comprise ATH. 73. The concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 72. 74. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 73, wherein the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B. 75. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 74, wherein the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A, and the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B. 76. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 75, wherein the alumina has spherical particles. 77. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 described in any one of embodiments 1 to 76, wherein the alumina particles have an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.1. 78. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 77, wherein the alumina has a multimodal particle size distribution. 79. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 78, wherein the alumina is bimodal. 80. Alumina has the following particle size distribution: D 10 = 1 to 5 μm, preferably 3 μm D 50 = 45 to 50 μm, preferably 46.5 μm D 90 = 80 to 100 μm, preferably 90 μm The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 79, comprising: 81. Alumina has the following particle size distribution:

[0126] [Table 2] The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 80, comprising: 82. Alumina has a D of 5.7 μm 50 Alumina having a D of 72 μm 5082. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 81, wherein the adhesive is a mixture of alumina having a formula: 83. Alumina has a D of 5.7 μm of 0.4:1 to 0.8:1, more preferably 0.5:1 to 0.7:1, and particularly preferably 0.6:1 (weight:weight). 50 Alumina having a D of 72 μm 50 83. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 82, wherein the adhesive is a mixture of alumina having a formula: 84. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 83, wherein the alumina is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of alumina in the adhesive mixture is 15 to 40% by weight, more preferably 16 to 35% by weight, particularly preferably 17 to 34% by weight, based on the total weight of the adhesive mixture. 85. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 84, wherein alumina is present in component A, component B, or both. 86. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 85, wherein component A and component B both comprise alumina. 87. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 86, wherein the concentration of alumina in component A and / or B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A or B. 88. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 87, wherein ATH and alumina are multimodal. 89. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 88, wherein the ATH and alumina are bimodal. 90. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 described in any one of embodiments 1 to 89, wherein the ATH and alumina are multimodal and the alumina has a spherical particle shape. 91. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 90, wherein the ATH and alumina are multimodal and the alumina has an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.1. 92. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 described in any one of embodiments 1 to 91, wherein the ATH and alumina are bimodal and the alumina has a spherical particle shape. 93. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 92, wherein the ATH and alumina are bimodal and the alumina has an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.1. 94. ATH has the following particle size distribution: D 10 =0.5μm D 50 = 8 μm D 90 = 80μm and the alumina has the following particle size distribution: D 10 = 1 to 5 μm, preferably 3 μm D 50 = 45 to 50 μm, preferably 46.5 μm D 90 = 80 to 100 μm, preferably 90 μm The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 93, comprising: 95. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 94, wherein ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is 40 to 65% by weight, more preferably 43 to 60% by weight, particularly preferably 44 to 57% by weight, based on the total weight of the adhesive mixture, and the concentration of alumina in the adhesive mixture is 15 to 40% by weight, more preferably 16 to 35% by weight, particularly preferably 17 to 34% by weight, based on the total weight of the adhesive mixture. 96. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 95, wherein ATH and alumina are both present in component A and component B. 97. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 96, wherein the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A, and the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A. 98. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 97, wherein the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B, and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component B. 99. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 98, wherein the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component A; the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, and particularly preferably 44 to 57% by weight, based on the total weight of component B; the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component A; and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, and particularly preferably 17 to 34% by weight, based on the total weight of component B. 100. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 99, wherein component A and component B are mixed in a volume ratio A:B of 0.8 to 1.2. 101. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3, or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 100, wherein component A and component B are mixed in a volume ratio A:B of 1. 102. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 101, wherein the adhesive exhibits a thermal conductivity of 1.5 W / mK or more, more preferably 1.6 W / mK or more, and more particularly preferably 1.8 W / mK or more, when measured according to ASTM 5470 as described in the examples, after curing for 7 days at 23°C and 50% relative humidity. 103. The adhesive was cured for 7 days at 23°C and 50% relative humidity, after which it was tested using e-coated steel for both substrates, with a bond area of ​​250 mm 2The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 102, exhibiting a lap shear strength of ≥ 1.5 MPa, measured according to DIN EN 1465 at 1 mm adhesive layer thickness (10 x 25 mm). 104. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 103, wherein the adhesive mixture resulting from mixing of component A with component B has a working time of more than 35 minutes, more preferably more than 40 minutes, particularly preferably more than 50 minutes, which working time is the time for developing a compressive force of 150 KPa when pressed by parallel plates having a diameter of 50 mm at a pressing speed of 62.5 mm / min into a 1 mm gap. 105. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 104, wherein the adhesive mixture resulting from mixing of component A and component B has an immediately after mixing compressive strength of less than 80 KPa, more preferably less than 78 KPa, when pressed into a 1 mm gap by parallel plates having a diameter of 50 mm at a press speed of 62.5 mm / min. 106. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 105, wherein the adhesive mixture resulting from mixing of component A with component B has a compression force 30 minutes after mixing of less than 130 KPa, more preferably less than 128 KPa, when pressed by parallel plates having a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min. 107. The adhesive of embodiment 1, the kit of embodiment 2, the bonding method of embodiment 3 or the bonded assembly of embodiment 4 according to any one of embodiments 1 to 106, wherein the adhesive mixture resulting from mixing of component A with component B has a compression force 60 minutes after mixing of less than 160 KPa, more preferably less than 155 KPa, when pressed by parallel plates having a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min. EXAMPLES

[0127] [Table 3]

[0128] Adhesive Formulation Component A (Isocyanate) Prepolymer Preparation The prepolymers were prepared in a 2 liter, four-neck flask equipped with a mechanical stirrer and a thermometer. The isocyanate-terminated prepolymers were prepared by first mixing the monol or polyol raw materials of Component A (either DONOL 1000 or NJ-330) and stirring under vacuum at 120° C. for 1 hour. The polyol was allowed to cool to 80° C., MDI-50 was added, and the mixture was allowed to react under vacuum at 80° C. for 2 hours. The material was then cooled to below 30° C. The vacuum was broken under nitrogen and the prepolymers were sealed and stored until use.

[0129] A specific description of the prepolymer process is provided with respect to Inventive Example 5. 422 g of DONOL 1000 was added into a four-neck flask equipped with a mechanical stirrer and a thermometer at room temperature. The DONOL 1000 was dried under vacuum at 120° C. for 1 hour. The DONOL 1000 was allowed to cool to 80° C., 528 g of MDI-50 was added into the flask, and the mixture was reacted under vacuum at 80° C. for 2 hours. The material was cooled to below 30° C. The vacuum was broken under nitrogen, and the prepolymer was sealed and stored until use. The prepolymer is prepared with an excess of isocyanate, resulting in a predominantly NCO-terminated prepolymer.

[0130] To prepare Component A, Apyral 20X, SA0050, SA0700, WP2500 and CAB-O-SIL TS-720 were dried in an oven at 120°C for over 24 hours until the moisture content was less than 300 ppm, using the amounts listed in Table 2. The prepolymer, Dynasylan 9116, JSLD4529 and PTSI were added to a 2L planetary mixer and mixed for 10 minutes. Apyral 20X, CAB-O-SIL TS-720 and WP2500 were added and stirring was continued at room temperature for an additional 30 minutes. SA0050 and SA0700 were added and stirring was continued under reduced pressure for an additional 30 minutes. The vacuum was broken under nitrogen and Component A was packaged in a sealed cartridge for storage until use.

[0131] A specific description of the preparation of component A is provided with respect to Inventive Example 5. Solid Apyral 20X, SA0050, S0700, WP2500 and CAB-O-SIL TS-720 were dried in a 120°C oven for at least 24 hours until the moisture content was less than 300 ppm. 190g of prepolymer, 10g of Dynasylan 9116, 1g of JSLD4529 and 5g of PTSI were added into a 2L planetary mixer laboratory scale mixer. After 10 minutes of mixing, 561g of Apyral 20X, 13g of CAB-O-SIL TS-720 and 20g of WP2500 were added into the mixer. Stirring was continued for 30 minutes at room temperature, then 75g of SA0050, 125g of SA0700 were added. The mixture was continued to stir under vacuum at room temperature for another 30 minutes. Finally, the vacuum is broken with nitrogen and the adhesive composition can be filled into suitable packaging sizes.

[0132] Component B (Polyol) To prepare Component B (polyol), the solid raw materials Apyral 20X, SA0050, SA0700, WP2500 and CAB-O-SIL TS-720 were dried in an oven at 120°C for over 24 hours until the moisture content was less than 300 ppm, using the amounts listed in Table 2. The liquid polyols (NJ-204 and castor oil) were dried using molecular sieves until the moisture content was less than 300 ppm. CAPA 2201 and Dynasylan 9116 and the dry solid raw materials were added and stirring was continued for 30 minutes. Molecular sieves and Fomrez UL-29 were added and stirring was continued for another 30 minutes. The vacuum was broken under nitrogen and Component B was filled into a sealed cartridge until use.

[0133] Components A and B were stored separately until use. Immediately prior to use, the components were mixed in a 1:1 volume ratio and the following tests were performed.

[0134] Work time Time after mixing to develop a compressive force of 150 KPa. The results are listed in Table 2.

[0135] Compression force 10 g of adhesive resulting from mixing components A and B in a 1:1 volume ratio is pressed into a 1 mm gap by parallel plates with a diameter of 50 mm at a press speed of 62.5 mm / min. The force required is reported as compression force in KPa. Compression force was measured immediately after mixing ("initial") and after 15, 30 and 60 minutes had elapsed ("open time"). The results are listed in Table 2.

[0136] Lap Shear Strength Lap shear strength measured using e-coated steel for both substrates, joint area: 250mm 2 (10 x 25 mm), with an adhesive layer thickness of 1 mm, was measured using DIN EN 1465. All surfaces were prepared by cleaning with isopropanol before application of the adhesive. Cure conditions were 7 days at 23°C and 50% RH. Shear samples were pulled at 5 mm / min during the test.

[0137] Thermal Conductivity Thermal conductivity was measured according to ASTM D5470. A thermal interface material tester TIM D5470 manufactured by Linseis was used for the tests. Measurements were performed in Spaltplus mode between 1.5-3.0 mm thick adhesives after 7 days of curing at 23°C and 50% RH. The absolute thermal conductivity λ (W / mK) was recorded. The results are listed in Table 2.

[0138] [Table 4]

[0139] result Inventive Examples 5 and 6 both exhibit working times significantly greater than 35 minutes (60 minutes and over 60 minutes, respectively), while the comparative examples exhibit working times of 30 minutes or less.

[0140] Inventive Examples 5 and 6 exhibit significantly less initial compression force than the comparative example, and the same is true for the 15, 30 and 60 minute open times (time after mixing).

[0141] Inventive Examples 5 and 6 also exhibit better thermal conductivity (≧2 W / mK) than the comparative examples (≧1.8 W / mK).

Claims

1. (A) Component A: (ai) Molecular weight (M) of more than 800 Da ｎ ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of OH groups with NCO groups A two-component thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture. glue.

2. (A) Component A: (ai) Molecular weight (M) of more than 800 Da ｎ ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 4,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of OH groups with NCO groups A kit for producing a thermally conductive polyurethane adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture. kit.

3. （１） (A) Component A: (ai) Molecular weight (M) of more than 800 Da ｎ ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of OH groups with NCO groups providing an adhesive comprising: component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture. Steps: (2) mixing component A with component B to produce an adhesive mixture; (3) applying the adhesive mixture to a first substrate; (4) placing the first substrate in adhesive contact with a second substrate; (5) Curing the adhesive mixture. A method for bonding two or more substrates comprising:

4. (1) a first substrate; (2) A second substrate adhered to the first substrate. A bonded assembly comprising: The first substrate and the second substrate are each composed of the following components A and B: (A) Component A: (ai) Molecular weight (M) of more than 800 Da ｎ ) with at least one polyisocyanate selected from an aliphatic polyisocyanate and a mixture of 2,4'-methylene-bis-(phenylisocyanate) (MDI) and 4,4'-MDI; (B) Component B: (bi) at least one polyol; and (bii) a catalyst capable of catalyzing the reaction of OH groups with NCO groups The adhesive is made by mixing component A and / or component B comprises aluminum trihydroxide (ATH) in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of ATH in the adhesive mixture is at least 40% by weight, based on the total weight of the adhesive mixture, and component A and / or component B comprises alumina in an amount such that, when components A and B are mixed to produce an adhesive mixture, the content of alumina in the adhesive mixture is at least 15% by weight, based on the total weight of the adhesive mixture, Glued assembly.

5. The polyether monool is poly(C ２～４ -alkylene oxide) diol monoether, and poly(C) ２～４ 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the monoester of said alkylene oxide diol is selected from the group consisting of monoesters of alkylene oxide diols.

6. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the polyether monol is selected from a monoether of poly(ethylene oxide) diol, a monoether of poly(propylene oxide) diol, a monoether of poly(butylene oxide) diol, and mixtures thereof.

7. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said polyether monol is selected from a monoether of poly(propylene oxide) diol.

8. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4 according to any one of claims 1 to 7, wherein the polyether monol is selected from terminal methyl, ethyl and propyl monoethers.

9. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said polyether monol is selected from a terminated methyl monoether.

10. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the polyether monol is selected from the monomethyl ether of a poly(propylene oxide) diol.

11. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the polyether monol has a molecular weight (Mn) of more than 800 Da and less than 2,000 Da, more preferably less than 1,500 Da, more particularly preferably less than 1,000 Da.

12. The polyether monol is a poly(propylene oxide) diol, in particular a poly(propylene oxide) diol having a molecular weight (M ｎ 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the adhesive is a monomethyl ether of poly(propylene glycol) having the formula:

13. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said polyisocyanate is aliphatic.

14. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the polyisocyanate is selected from isophorone diisocyanate (IPDI), dicyclohexylmethane diisocyanate (HMDI), hexamethylene diisocyanate (HDI), and mixtures thereof.

15. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4 according to any one of claims 1 to 12, wherein the polyisocyanate is a mixture of 2,4'-MDI and 4,4'-MDI.

16. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4 according to any one of claims 1 to 12, wherein the polyisocyanate is a mixture of 2,4'-MDI and 4,4'-MDI in a weight ratio of 2,4'-MDI to 4,4'-MDI of 0.667 to 1.5, more preferably 0.8 to 1.5 and more particularly preferably 1 to 1.

5.

17. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4 according to any one of claims 1 to 12, wherein the polyisocyanate used to prepare the prepolymer is a mixture of 4,4'-MDI and 2,4-MDI in a weight ratio of 1:1 between 4,4'-MDI and 2,4-MDI.

18. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the at least one polyisocyanate is used in a stoichiometric excess of 2 to 15 times relative to the monol, more preferably 8 to 12 times relative to the monol, particularly preferably 10 times relative to the monol.

19. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the prepolymer is made by reacting poly(propylene glycol) monomethyl ether with a mixture of 2,4'-MDI and 4,4'-MDI.

20. The prepolymer has a molecular weight (M ｎ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, which is produced by reacting a poly(propylene glycol) monomethyl ether of 800 to 1,500 Da with a mixture of 2,4'-MDI and 4,4'-MDI.

21. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the at least one polyether monol is used in component A in an amount of 5 to 20% by weight, more preferably 6 to 10% by weight, particularly preferably 8 to 9% by weight, based on the total weight of component A.

22. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the at least one polyisocyanate is used in component A in an amount of 5 to 20% by weight, more preferably 6 to 15% by weight, more particularly preferably 10 to 11% by weight, based on the total weight of component A.

23. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the NCO-terminated prepolymer comprises 30 to 55 wt.-%, more preferably 35 to 50 wt.-%, especially preferably 42 to 45 wt.-% of polyether monol, based on the total weight of the prepolymer.

24. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the NCO-terminated prepolymer comprises 40 to 65 wt.-%, more preferably 45 to 60 wt.-%, especially preferably 50 to 58 wt.-% of diisocyanate, based on the total weight of the prepolymer.

25. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the prepolymer comprises 30 to 55 wt.-%, more preferably 35 to 50 wt.-%, particularly preferably 42 to 45 wt.-%, of polyether monol, based on the total weight of the prepolymer, and 40 to 65 wt.-%, more preferably 45 to 60 wt.-%, particularly preferably 50 to 58 wt.-%, of diisocyanate, based on the total weight of the prepolymer.

26. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the prepolymer is used in component A in an amount of 15 to 30 wt.-%, more preferably 16 to 25 wt.-%, more particularly preferably 18 to 20 wt.-%, based on the total weight of the component A liquid.

27. Component A and / or component B may further comprise C ８～２０ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising a silane containing a hydrolyzable silylalkoxy group covalently bonded to an alkyl group.

28. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein component A and / or component B comprises hexadecyl-trimethoxysilane.

29. 29. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4 according to any one of claims 1 to 28, wherein component A and / or component B comprises 0.25 to 3 wt.-%, more preferably 0.5 to 2 wt.-%, particularly preferably 0.75 to 1.2 wt.-% of silane, based on the total weight of component A or component B.

30. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component A and / or component B further comprises a fibrous filler, such as wollastonite.

31. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component A and / or component B comprises 0.5 to 4 wt.-%, more preferably 1 to 3 wt.-%, more particularly preferably 1.7 to 2.2 wt.-% wollastonite, based on the total weight of component A or component B.

32. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said at least one polyol comprises a polyol having a molecular weight of less than 1,500 Da, more preferably 1,000 Da or less.

33. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a diol, a triol, or mixtures thereof.

34. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said at least one polyol comprises at least one diol, in particular a polyether-based diol.

35. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a poly(propylene oxide)-based diol.

36. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a mixture of a diol and a triol.

37. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the at least one polyol comprises diols, triols and mixtures thereof, all having a molecular weight less than 1,500 Da, more preferably less than 1,000 Da.

38. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said at least one polyol comprises a mixture of diols and triols having a molecular weight of less than 1,500 Da, more preferably less than 1,000 Da.

39. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a polyether polyol.

40. The at least one polyol is poly(C ２～４ 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising a polyether polyol selected from poly(alkylene oxide)-based polyols, in particular poly(ethylene oxide)-based, poly(propylene oxide)-based, poly(butylene oxide)-based polyols and mixtures thereof.

41. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol is selected from poly(propylene oxide)-based polyols.

42. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a triol.

43. The at least one polyol is poly(C ２～４ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising a triol selected from the group consisting of aryl, aryloxy ...

44. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a poly(propylene oxide)-based triol.

45. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises castor oil.

46. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a mixture of a polyether diol and castor oil.

47. 47. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4 according to any one of the preceding claims, wherein said at least one polyol comprises a mixture of a polyether diol having a molecular weight of less than 600 Da and castor oil.

48. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said at least one polyol comprises a mixture of a poly(propylene oxide)-based diol and castor oil.

49. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the at least one polyol comprises a mixture of a poly(propylene oxide)-based diol having a molecular weight of less than 600 Da and castor oil.

50. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 2 to 15 wt.-%, more preferably 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-% of diol, based on the total weight of component B.

51. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-% of a triol, based on the total weight of component B.

52. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 2 to 15 wt.-%, more preferably 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-%, of a diol having a molecular weight of less than 600 Da, based on the total weight of component B.

53. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-%, of a triol having a molecular weight of less than 1.000 Da, based on the total weight of component B.

54. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 2 to 15 wt.-%, more preferably 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-%, of a diol having a molecular weight of less than 600 Da, based on the total weight of component B, and 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-%, of a triol having a molecular weight of less than 1,000 Da, based on the total weight of component B.

55. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-%, of a poly(propylene oxide) diol having a molecular weight of less than 600 Da, based on the total weight of component B.

56. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-% of castor oil, based on the total weight of component B.

57. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein component B comprises 4 to 10 wt.-%, more particularly preferably 5 to 7 wt.-%, of a poly(propylene oxide) diol having a molecular weight of less than 600 Da, based on the total weight of component B, and 5 to 20 wt.-%, more preferably 7 to 15 wt.-%, particularly preferably 8 to 11 wt.-%, of castor oil, based on the total weight of component B.

58. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the catalyst is selected from a tertiary amine catalyst and an organometallic catalyst.

59. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the catalyst is selected from alkyltin carboxylates, oxides and tin mercaptides.

60. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said catalyst is dioctyltin mercaptide.

61. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the catalyst is used in an amount of 0.0005 to 0.002 wt.%, more preferably 0.00075 to 0.0015 wt.%, based on the total weight of component B.

62. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the catalyst is dioctyltin mercaptide, used at 0.0005 to 0.002 wt.%, more preferably at 0.00075 to 0.0015 wt.%, based on the total weight of component B.

63. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein component B further comprises a polyester diol.

64. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein component B further comprises polycaprolactone.

65. Component B further has a molecular weight (M ｎ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, comprising a polycaprolactone having a molecular weight of 1,2,3-trimethylsilyl (Mn) and a molecular weight of 1,2,3-trimethylsilyl (MnO).

66. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component B further comprises a polyester diol and is used in an amount of 0.1 to 0.4 wt.%, more preferably 0.15 to 0.25 wt.%, based on the total weight of component B.

67. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the AHT has a multimodal particle size distribution.

68. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the ATH has a bimodal particle size distribution.

69. The aluminum trihydroxide has the following particle size distribution: D １０ =0.5μm D ５０ =8μm D ９０ =80μm 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising:

70. 5. The adhesive of claim 1, the kit of claim 2, the method of bonding of claim 3 or the bonded assembly of claim 4, wherein ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of the adhesive mixture.

71. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein ATH is present in component A, component B, or both.

72. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein component A and component B both comprise ATH.

73. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component A is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component A.

74. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component B is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component B.

75. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component A is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component A, and the concentration of ATH in component B is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component B.

76. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the alumina has spherical particles.

77. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein said alumina particles have an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.

1.

78. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the alumina has a multimodal particle size distribution.

79. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said alumina is bimodal.

80. The alumina has the following particle size distribution: D １０ = 1 to 5 μm, preferably 3 μm, D ５０ = 45 to 50 μm, preferably 46.5 μm, D ９０ = 80 to 100 μm, preferably 90 μm 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising:

81. The alumina has the following particle size distribution: 【Table 1】 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising:

82. The alumina has a D of 5.7 μm. ５０ and alumina having a D of 72 μm. ５０ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, which is a mixture of alumina having a formula:

83. The alumina has a D of 5.7 μm of 0.4:1 to 0.8:1, more preferably 0.5:1 to 0.7:1, and especially preferably 0.6:1 (wt:wt). ５０ Alumina having a D of 72 μm ５０ 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, which is a mixture of alumina having a formula:

84. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the alumina is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of alumina in the adhesive mixture is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, particularly preferably 17 to 34 wt.-%, based on the total weight of the adhesive mixture.

85. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the alumina is present in component A, component B, or both.

86. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein component A and component B both comprise alumina.

87. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the concentration of alumina in component A and / or B is from 15 to 40% by weight, more preferably from 16 to 35% by weight, particularly preferably from 17 to 34% by weight, based on the total weight of said component A or B.

88. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said ATH and said alumina are multimodal.

89. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein said ATH and said alumina are bimodal.

90. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the ATH and the alumina are multimodal and the alumina has a spherical particle shape.

91. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the ATH and the alumina are multimodal and the alumina has an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.

1.

92. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein the ATH and the alumina are bimodal and the alumina has a spherical particle shape.

93. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the ATH and the alumina are bimodal and the alumina has an aspect ratio of 0.8 to 1.2, more preferably 0.9 to 1.

1.

94. The ATH has the following particle size distribution: D １０ =0.5μm D ５０ =8μm D ９０ =80μm and the alumina has the following particle size distribution: D １０ = 1 to 5 μm, preferably 3 μm D ５０ = 45 to 50 μm, preferably 46.5 μm D ９０ = 80 to 100 μm, preferably 90 μm 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, comprising:

95. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the ATH is present in component A and / or component B such that when the two components are mixed (preferably in a volume ratio of 0.8:1 to 1.2:1, more preferably 1:1) to form the adhesive mixture, the concentration of ATH in the adhesive mixture is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of the adhesive mixture, and the concentration of alumina in the adhesive mixture is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, particularly preferably 17 to 34 wt.-%, based on the total weight of the adhesive mixture.

96. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3, or the bonded assembly of claim 4, wherein ATH and alumina are both present in component A and component B.

97. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component A is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component A, and the concentration of alumina in component A is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, particularly preferably 17 to 34 wt.-%, based on the total weight of component A.

98. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component B is 40 to 65 wt.-%, more preferably 43 to 60 wt.-%, particularly preferably 44 to 57 wt.-%, based on the total weight of component B, and the concentration of alumina in component B is 15 to 40 wt.-%, more preferably 16 to 35 wt.-%, particularly preferably 17 to 34 wt.-%, based on the total weight of component B.

99. 5. The adhesive of claim 1, the kit of claim 2, the method of claim 3 or the bonded assembly of claim 4, wherein the concentration of ATH in component A is 40 to 65% by weight, more preferably 43 to 60% by weight, particularly preferably 44 to 57% by weight, based on the total weight of component A; the concentration of ATH in component B is 40 to 65% by weight, more preferably 43 to 60% by weight, particularly preferably 44 to 57% by weight, based on the total weight of component B; the concentration of alumina in component A is 15 to 40% by weight, more preferably 16 to 35% by weight, particularly preferably 17 to 34% by weight, based on the total weight of component A; and the concentration of alumina in component B is 15 to 40% by weight, more preferably 16 to 35% by weight, particularly preferably 17 to 34% by weight, based on the total weight of component B.

100. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component A and component B are mixed in a volume ratio A:B of 0.8 to 1.

2.

101. 10. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein component A and component B are mixed in a volume ratio of A:B of 1.

102. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the adhesive exhibits a thermal conductivity of at least 1.5 W / mK, more preferably at least 1.6 W / mK, and more particularly preferably at least 1.8 W / mK, measured according to ASTM 5470 as described in the examples, after curing for 7 days at 23° C. and 50% relative humidity.

103. The adhesive was cured for 7 days at 23°C and 50% relative humidity, after which it was tested using e-coated steel for both substrates, with a bond area of ​​250 mm ２ 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, which exhibits a lap shear strength of 1.5 MPa or more, when measured according to DIN EN 1465 at a thickness of 1 mm (10 x 25 mm) and an adhesive layer thickness of 1 mm.

104. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the adhesive mixture resulting from mixing of component A with component B has a working time of more than 35 minutes, more preferably more than 40 minutes, particularly preferably more than 50 minutes, which working time is the time to develop a compressive force of 150 KPa when pressed by parallel plates with a diameter of 50 mm at a pressing speed of 62.5 mm / min into a 1 mm gap.

105. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the adhesive mixture resulting from mixing of component A and component B has an immediately after mixing compressive strength of less than 80 KPa, more preferably less than 78 KPa, when pressed by parallel plates with a diameter of 50 mm at a press speed of 62.5 mm / min into a 1 mm gap.

106. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the adhesive mixture resulting from mixing of component A and component B has a compression force 30 minutes after mixing of less than 130 KPa, more preferably less than 128 KPa, when pressed by parallel plates with a diameter of 50 mm into a 1 mm gap at a press speed of 62.5 mm / min.

107. 5. The adhesive of claim 1, the kit of claim 2, the bonding method of claim 3 or the bonded assembly of claim 4, wherein the adhesive mixture resulting from mixing of component A with component B has a compression force 60 minutes after mixing of less than 160 KPa, more preferably less than 155 KPa, when pressed by parallel plates having a diameter of 50 mm at a press speed of 62.5 mm / min into a 1 mm gap.

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