Surface acoustic wave device, wireless device, and method for fabricating a surface acoustic wave device

JP2025518170A5Pending Publication Date: 2026-06-08SKYWORKS SOLUTIONS INC +1
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SKYWORKS SOLUTIONS INC
Filing Date
2023-05-30
Publication Date
2026-06-08

AI Technical Summary

Technical Problem

Existing surface acoustic wave (SAW) resonators have limitations in size reduction due to their high phase velocity, which hinders their integration into compact radio frequency (RF) modules.

Method used

The development of elastic surface wave devices with a piezoelectric substrate and interdigital transducer electrodes, optimized to support surface acoustic waves with a phase velocity of less than 3,000 m/s and an electromechanical coupling coefficient of at least 9.0, utilizing LiNbO3 crystals with specific Euler angles and thicknesses, and incorporating silicon dioxide layers to improve frequency temperature coefficient characteristics.

Benefits of technology

This approach enables significant size reduction of SAW resonators by achieving lower phase velocities while maintaining high electromechanical coupling coefficients, thereby facilitating the integration of SAW devices into compact RF modules.

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Abstract

In some embodiments, an elastic surface wave device may include a piezoelectric substrate and interdigital transducer electrodes mounted on the surface of the piezoelectric substrate, and the elastic surface wave device supports an elastic surface wave having a wavelength λ and a phase velocity of less than 3,000 m / s with an electromechanical coupling coefficient of at least 9.0. In some embodiments, the phase velocity is less than 2,000 m / s, and the elastic surface wave may include a lowest asymmetric (A0) mode. In some embodiments, such an elastic surface wave device may be implemented in products such as radio frequency filters, radio frequency modules, and radio devices.
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